Black liquid crystal polymer composition with low dissipation factor

Abstract

A polymer composition comprising a liquid crystalline polymer matrix and carbon black particles dispersed within the polymer matrix is provided. The carbon black particles comprise from about 0.1 wt.% to about 3 wt.% of the composition. The composition exhibits a dissipation factor of less than 0.002 and a brightness (L *) of less than about 60 when measured at a frequency of 10 GHz.

Description

Background Art

[0001] Electrical components typically include molded parts formed from liquid crystal thermoplastic resins. Recent demands on the electronics industry have prompted a reduction in the size of such components to achieve the required performance and space savings. For example, in 5G applications, it is desired to form parts (e.g., circuit boards, filters, antenna covers, connectors, etc.) from polymers with low dielectric loss to limit signal attenuation during high-speed transmission. In addition, it is generally desirable to reduce the light reflectivity of polymer resins, for example, to better observe metal circuit components formed on liquid crystal polymer films. Therefore, carbon black is typically used as a colorant. However, the use of carbon black increases the dielectric loss of liquid crystal polymer compositions. Therefore, there is a need for black liquid crystal polymer compositions with low dielectric loss. Summary of the Invention

[0002] According to one embodiment of the present invention, a polymer composition is disclosed, comprising a liquid crystal polymer matrix and carbon black particles dispersed within the polymer matrix. The carbon black particles comprise from about 0.1 wt.% to about 3 wt.% of the composition. When measured at a frequency of 10 GHz, the composition exhibits a brightness (L / min) of less than about 60. * ) and a dissipation factor of about 0.002 or less.

[0003] Other features and aspects of the present invention are described in more detail below. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] A full and enabling disclosure of the invention, including the best mode of carrying out the invention as known to those skilled in the art, is more particularly set forth in the remainder of the specification, including reference to the accompanying drawings, in which:

[0005] Figure 1 One embodiment of a 5G antenna system that may employ a circuit board or connector formed according to the present invention is depicted;

[0006] Figure 2A shows a top view of an example user computing device including a 5G antenna;

[0007] Figure 2B Shown Figure 2A a side view of an example user computing device;

[0008] Figure 3 Shown Figure 2A an enlarged view of a portion of a user computing device;

[0009] Figure 4 shows a side view of a coplanar waveguide antenna array configuration that may be employed in a 5G antenna system;

[0010] Figure 5AAn antenna array for a massive multiple-input multiple-output configuration for a 5G antenna system is shown;

[0011] Figure 5B The resulting antenna array is shown to be employable in a 5G antenna system;

[0012] Figure 5C shows an example antenna configuration that may be employed in a 5G antenna system;

[0013] Figure 6 is a schematic diagram of one embodiment of a laminate that can be formed according to the present invention;

[0014] Figure 7 is a schematic diagram of another embodiment of a laminate that can be formed according to the present invention;

[0015] Figure 8 is a schematic diagram of yet another embodiment of a laminate that can be formed according to the present invention; and

[0016] Figure 9 FIG. 1 is a schematic diagram of an embodiment of an electronic device that can employ the circuit board of the present invention.

[0017] Figure 10A A thin-walled electrical connector according to aspects of the present invention is depicted;

[0018] Figure 10B Depicts Figure 1 an enlarged view of a portion of the thin-wall connector of A; and

[0019] Figure 11 is an exploded perspective view of another embodiment of a thin wall connector and connector receptacle that may be formed according to the present invention. DETAILED DESCRIPTION

[0020] Those skilled in the art will appreciate that this discussion is merely a description of exemplary embodiments and is not intended to limit the broader aspects of the invention.

[0021] In general, the present invention relates to a polymer composition comprising a liquid crystal polymer matrix and carbon black particles dispersed in the matrix. By selectively controlling the specific properties and concentration of each component of the polymer composition, the inventors surprisingly found that the resulting composition can show dark color and ultra-low dissipation factor in a wide range of frequencies, making it particularly suitable for forming components of 5G systems, such as circuit boards in antennas and high-speed connectors. That is, at typical 5G frequencies (e.g., 10 GHz), the dissipation factor (which is a measure of energy loss rate) of the polymer composition can be about 0.002 or lower, about 0.001 or lower in some embodiments, about 0.0001 to about 0.001 in some embodiments, and about 0.0005 to about 0.0009 in some embodiments. At typical 5G frequencies (e.g., 10 GHz), the polymer composition can also show about 6 or lower, about 5 or lower in some embodiments, about 1 to about 4.5 in some embodiments, and a low dielectric constant of about 2 to about 4 in some embodiments.

[0022] The use of carbon black in selectively controlled concentrations can provide a relatively dark color to the composition. Darkness can be quantified by measuring absorbance with an optical reader according to a standard test method known as "CIELAB," described in F. Cost's Pocket Guide to Digital Printing, Delmar Publishers, Albany, NY ISBN 0-8273-7592-1, pages 144 and 145, and "Photoelectric color difference meter," Journal of Optical Society of America, Vol. 48, pp. 985-995, S. Hunter, (1958), both of which are incorporated herein by reference in their entirety. More specifically, the CIELAB test method defines three "Hunter" scale values, L * 、a * and b * , which corresponds to the three characteristics of perceived color based on the competing theory of color perception. * = Brightness (or luminosity), ranging from 0 to 100, where 0 = dark and 100 = bright.

[0023] The brightness value (L * ) may be less than about 60, in some embodiments from about 30 to about 57, in some embodiments from about 40 to about 54, in some embodiments from about 45 to about 50, and in some embodiments from about 46 to about 48.

[0024] Generally, it is believed that the polymer composition showing a low dissipation factor will not also have good enough thermal properties and mechanical properties and be easy to process (that is, low viscosity) so that it can be used in specific types of applications (such as molded connectors). However, contrary to conventional thinking, it has been found that the polymer composition has excellent thermal properties and mechanical properties and processability simultaneously. For example, the melting temperature of the polymer composition can be, for example, about 200°C to about 400°C, about 250°C to about 380°C in some embodiments, about 270°C to about 360°C in some embodiments, and about 300°C to about 350°C in some embodiments. Even at such a melting temperature, the ratio of deflection temperature under load ("DTUL") (a measure of short-term heat resistance) to the melting temperature can still remain relatively high. For example, the ratio can be about 0.5 to about 1.00, about 0.6 to about 0.95 in some embodiments, and in the range of about 0.65 to about 0.85 in some embodiments. Specific DTUL values can be, for example, about 200° C. or higher, in some embodiments, about 200° C. to about 350° C., in some embodiments, about 210° C. to about 320° C., and in some embodiments, about 230° C. to about 290° C. Such high DTUL values can, among other things, allow for the use of high-speed and reliable surface mount processes to mate structures formed from the composition with other components in an electrical assembly.

[0025] The polymer composition can also have excellent mechanical properties, which are useful when forming a substrate. For example, the polymer composition can exhibit a tensile strength of about 10 MPa or greater, in some embodiments about 50 MPa or greater, in some embodiments about 70 MPa to about 300 MPa, and in some embodiments about 80 MPa to about 200 MPa. The polymer composition can exhibit a tensile elongation of about 0.3% or greater, in some embodiments about 0.4% or greater, in some embodiments about 0.5% to about 4%, and in some embodiments about 0.5% to about 2%. The polymer composition can exhibit a tensile modulus of about 5,000 MPa or greater, in some embodiments about 6,000 MPa or greater, in some embodiments about 7,000 MPa to about 25,000 MPa, and in some embodiments about 10,000 MPa to about 20,000 MPa. Tensile properties can be measured according to ISO test number 527:2019 at a temperature of 23 ° C. In addition, the polymer composition can exhibit a flexural strength of about 20 MPa or greater, in some embodiments about 10 MPa or greater, in some embodiments about 50 MPa or greater, in some embodiments about 70 MPa to about 300 MPa, and in some embodiments about 80 MPa to about 200 MPa. The polymer composition can exhibit a flexural elongation of about 0.4% or greater, in some embodiments about 0.5% to about 4%, and in some embodiments about 0.5% to about 2%. The polymer composition can exhibit a flexural modulus of about 5,000 MPa or greater, in some embodiments about 6,000 MPa or greater, in some embodiments about 7,000 MPa to about 25,000 MPa, and in some embodiments about 10,000 MPa to about 20,000 MPa. The flexural properties can be measured according to 178:2010 at a temperature of 23°C. In addition, the polymer composition can also have a high impact strength, which can be useful when forming thin substrates. For example, the polymer composition can have a flexural modulus of about 3 kJ / m 2 or greater, in some embodiments about 5 kJ / m 2 or greater, in some embodiments about 7 kJ / m 2 or greater, in some embodiments about 8 kJ / m 2 to about 40 kJ / m 2 , and in some embodiments about 10 kJ / m 2 About 25 kJ / m 2 The impact strength can be determined according to ISO test number ISO 179-1:2010 at a temperature of 23°C.

[0026] Various embodiments of the present invention will now be described in greater detail.

[0027] I. polymer composition

[0028] A. Liquid crystal polymer matrix

[0029] The polymer composition comprises one or more liquid crystal polymers, typically in an amount of about 40 wt.% to about 99.9 wt.%, in some embodiments about 50 wt.% to about 90 wt.%, in some embodiments about 60 wt.% to about 80 wt.%, and in some embodiments about 65 wt.% to about 70 wt.% of the total polymer composition. Liquid crystal polymers are generally classified as "thermotropic" because they can have a rod-like structure and exhibit crystalline behavior in their molten state (e.g., a thermotropic nematic state). The liquid crystal polymers employed in the polymer composition typically have a melting temperature of about 200°C to about 400°C, in some embodiments about 250°C to about 380°C, in some embodiments about 300°C to about 370°C, in some embodiments about 330°C to about 360°C, and in some embodiments about 345°C to about 355°C. As is well known in the art, the melting temperature can be determined using differential scanning calorimetry ("DSC"), for example, as determined by ISO test number 11357-3:2011. As is known in the art, such polymers may be formed from one or more types of repeating units. For example, a liquid crystal polymer may contain one or more aromatic ester repeating units, which are generally represented by the following formula (I):

[0030]

[0031] in,

[0032] Ring B is a substituted or unsubstituted 6-membered aryl group (e.g., 1,4-phenylene or 1,3-phenylene), a substituted or unsubstituted 6-membered aryl group fused to a substituted or unsubstituted 5-membered or 6-membered aryl group (e.g., 2,6-naphthalene), or a substituted or unsubstituted 6-membered aryl group bonded to a substituted or unsubstituted 5-membered or 6-membered aryl group (e.g., 4,4-biphenylene); and Y1 and Y2 are independently O, C(O), NH, C(O)HN, or NHC(O).

[0033] Typically, at least one of Y1 and Y2 is C(O). Examples of such aromatic ester repeating units may include, for example, aromatic dicarboxyl repeating units (Y1 and Y2 in Formula 1 are C(O)), aromatic hydroxycarboxyl repeating units (Y1 in Formula 1 is O and Y2 is C(O)), and various combinations thereof.

[0034] For example, aromatic hydroxycarboxyl repeating units derived from aromatic hydroxycarboxylic acids such as 4-hydroxybenzoic acid, 4-hydroxy-4'-biphenylcarboxylic acid, 2-hydroxy-6-naphthoic acid, 2-hydroxy-5-naphthoic acid, 3-hydroxy-2-naphthoic acid, 2-hydroxy-3-naphthoic acid, 4'-hydroxyphenyl-4-benzoic acid, 3'-hydroxyphenyl-4-benzoic acid, 4'-hydroxyphenyl-3-benzoic acid, and the like, and alkyl, alkoxy, aryl, and halogen substituents thereof, and combinations thereof, can be employed. Particularly suitable aromatic hydroxycarboxylic acids are 4-hydroxybenzoic acid ("HBA") and 6-hydroxy-2-naphthoic acid ("HNA"). When employed, repeating units derived from hydroxycarboxylic acids (e.g., HBA and / or HNA) typically comprise from about 30 mol.% to about 100 mol.%, in some embodiments from about 40 mol.% to about 80 mol.%, in some embodiments from about 45 mol.% to about 65 mol.%, and in some embodiments from about 50 mol.% to about 60 mol.% of the polymer.

[0035] Aromatic dicarboxyl repeating units derived from aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, 2,6-naphthalene dicarboxylic acid, diphenyl ether-4,4'-dicarboxylic acid, 1,6-naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid, 4,4'-dicarboxybiphenyl, bis(4-hydroxybiphenyl) ether, bis(4-carboxyphenyl) butane, bis(4-carboxyphenyl) ethane, bis(3-carboxyphenyl) ether, bis(3-carboxyphenyl) ethane, and the like, as well as alkyl, alkoxy, aryl, and halogen substituents thereof, and combinations thereof, may also be employed. Particularly suitable aromatic dicarboxylic acids may include, for example, terephthalic acid ("TA"), isophthalic acid ("IA"), and 2,6-naphthalene dicarboxylic acid ("NDA"). When employed, repeat units derived from aromatic dicarboxylic acids (e.g., IA, TA, and / or NDA) typically comprise from about 1 mol.% to about 40 mol.%, in some embodiments from about 10 mol.% to about 35 mol.%, and in some embodiments from about 20 mol.% to about 30 mol.% of the polymer.

[0036] Other repeating units can also be used in polymers. In certain embodiments, for example, repeating units derived from the following can be used: aromatic diols, such as hydroquinone, resorcinol, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 4,4'-dihydroxybiphenyl (or 4,4'-biphenol), 3,3'-dihydroxybiphenyl, 3,4'-dihydroxybiphenyl, 4,4'-dihydroxybiphenyl ether, bis(4-hydroxyphenyl)ethane, and the like, and alkyl, alkoxy, aryl and halogen substituents thereof, and combinations thereof. Particularly suitable aromatic diols can include, for example, hydroquinone ("HQ") and 4,4'-biphenol ("BP"). When used, repeating units derived from aromatic diols (e.g., HQ and / or BP) typically account for about 1 mol.% to about 40 mol.%, in some embodiments about 10 mol.% to about 35 mol.%, and in some embodiments about 20 mol.% to about 30 mol.%. Repeating units derived from, for example, aromatic amides (e.g., acetaminophen (“APAP”)) and / or aromatic amines (e.g., 4-aminophenol (“AP”), 3-aminophenol, 1,4-phenylenediamine, 1,3-phenylenediamine, etc.) may also be employed. When employed, repeating units derived from aromatic amides (e.g., APAP) and / or aromatic amines (e.g., AP) typically comprise from about 0.1 mol.% to about 20 mol.%, in some embodiments from about 0.5 mol.% to about 15 mol.%, and in some embodiments from about 1 mol.% to about 10 mol.% of the polymer. It will also be understood that various other monomeric repeating units may be incorporated into the polymer. For example, in certain embodiments, the polymer may include one or more repeating units derived from non-aromatic monomers (e.g., aliphatic or alicyclic hydroxycarboxylic acids, dicarboxylic acids, diols, amides, amines, etc.). Of course, in other embodiments, the polymer may be “fully aromatic” due to the lack of repeating units derived from non-aromatic (e.g., aliphatic or alicyclic) monomers.

[0037] Although not necessarily required, the liquid crystal polymer can be a "high naphthalene" polymer in that it contains relatively high levels of repeating units derived from naphthalene hydroxycarboxylic acids and naphthalene dicarboxylic acids (e.g., NDA, HNA), or a combination thereof. That is, the total amount of repeating units derived from naphthalene hydroxycarboxylic acids and / or dicarboxylic acids (e.g., NDA, HNA, or a combination of HNA and NDA) typically accounts for about 20 mol.% or more of the polymer, in some embodiments about 30 mol.% to about 95 mol.%, in some embodiments about 35 mol.% to about 80 mol.%, in some embodiments about 40 mol.% to about 60 mol.%, and in some embodiments about 45 mol.% to about 50 mol.%. Unlike many conventional "low naphthalene" polymers, it is believed that the resulting "high naphthalene" polymers can exhibit good thermal and mechanical properties. In addition, the present inventors have discovered that using liquid crystal polymers containing relatively high HNA contents can produce compositions with extremely low dissipation factors. For example, repeat units derived from HNA may comprise about 20 mol.% or more, in some embodiments about 20 mol.% or more, in some embodiments about 30 mol.% to about 85 mol.%, in some embodiments about 35 mol.% to about 75 mol.%, in some embodiments about 40 mol.% to about 60 mol.%, and in some embodiments about 45 mol.% to about 50 mol.% of the polymer. In such embodiments, the liquid crystal polymer may comprise the above-specified amounts of naphthalene monomers (e.g., HNA and / or NDA) in combination with various other monomers, such as aromatic hydroxycarboxylic acids (e.g., HBA) in an amount of about 70 mol.% or less, in some embodiments about 60 mol.% or less, in some embodiments about 40 mol.% or less, in some embodiments about 20 mol.% or less, in some embodiments from about 1 mol.% to about 10 mol.%, and in some embodiments from about 2 mol.% to about 5 mol.%; aromatic dicarboxylic acids (e.g., IA and / or TA) in an amount of about 1 mol.% to about 40 mol.%, in some embodiments from about 10 mol.% to about 35 mol.%, and in some embodiments from about 20 mol.% to about 30 mol.%; and / or aromatic diols (e.g., BP and / or HQ) in an amount of about 1 mol.% to about 40 mol.%, in some embodiments from about 10 mol.% to about 35 mol.%, and in some embodiments from about 20 mol.% to about 30 mol.%.

[0038] Regardless of the specific composition and properties of the polymer, liquid crystal polymers can be prepared by first introducing aromatic monomers (e.g., aromatic hydroxycarboxylic acids, aromatic dicarboxylic acids, etc.) for forming ester repeating units and / or aromatic monomers (e.g., aromatic diols, aromatic amides, aromatic amines, etc.) for forming other repeating units into a reactor vessel to initiate a polycondensation reaction. The specific conditions and steps employed in such reactions are well known and can be described in more detail below: Calundann U.S. Patent No. 4,161,470; Linstid, III et al. U.S. Patent No. 5,616,680; Linstid, III, etc. people U.S. Patent No. 6,114,492; Shepherd et al. U.S. Patent No. 6,514,611; and Wagoner WO 2004 / 058851 of WO 2004 / 058851. The container for reaction is not particularly limited, although it is usually desirable to use a container generally used for high viscosity fluid reactions. The example of such reaction vessel can include a stirred tank type device, which has an agitator with a stirring blade having a variable shape (such as anchor type, multi-stage type, spiral ribbon type, screw shaft type, or its improved shape). Other examples of such reaction vessel can include a mixing device generally used for resin kneading, such as a kneader, a roller mill, a Banbury (Banbury) mixer, etc.

[0039] If desired, the reaction can be carried out by acetylation of the monomers known in the art. This can be accomplished by adding an acetylating agent (e.g., acetic anhydride) to the monomers. Acetylation typically begins at a temperature of about 90°C. During the initial stages of acetylation, reflux can be used to keep the vapor phase temperature below the temperature at which the acetic acid byproduct and anhydride begin to distill. The temperature during the acetylation process is typically 90°C to 150°C, and in some embodiments, about 110°C to about 150°C. If reflux is used, the vapor phase temperature typically exceeds the boiling point of acetic acid, but remains low enough to retain residual acetic anhydride. For example, acetic anhydride evaporates at a temperature of about 140°C. Therefore, it is particularly desirable to provide a vapor phase reflux with a temperature of about 110°C to about 130°C for the reactor. In order to ensure that the reaction is substantially complete, an excess of acetic anhydride can be used. The amount of excess anhydride will vary depending on the specific acetylation conditions employed (including the presence or absence of reflux). It is not uncommon to use an excess of acetic anhydride of about 1 mol.% to about 10 mol.%, based on the total moles of reactant hydroxyl groups present.

[0040] Acetylation can occur in a separate reactor vessel or can occur in situ within the polymerization reactor vessel. When a separate reactor vessel is used, the monomer(s) can be introduced into the acetylation reactor and subsequently transferred to the polymerization reactor. Likewise, the monomer(s) can be introduced directly into the reactor vessel without undergoing pre-acetylation.

[0041] In addition to monomer and optional acetylating agent, other components can also be included in the reaction mixture to help promote polymerization. For example, catalysts such as metal salt catalysts (for example, magnesium acetate, tin acetate (I), tetrabutyl titanate, lead acetate, sodium acetate, potassium acetate, etc.) and organic compound catalysts (for example, N-methylimidazole) can be used alternatively. Based on the gross weight of the repeating unit precursor, this type of catalyst is usually used in an amount of about 50ppm to about 500ppm. When using a separate reactor, it is usually desirable that the catalyst be applied to an acetylation reactor rather than a polymerization reactor, although this is by no means required.

[0042] Typically, the reaction mixture is heated to a high temperature in a polymerization reactor vessel to initiate melt polycondensation of the reactants. Polycondensation can occur, for example, in a temperature range of about 250°C to about 380°C, and in some embodiments, in a temperature range of about 280°C to about 380°C. For example, a suitable technique for forming an aromatic polyester can include: a precursor monomer and acetic anhydride are loaded into a reactor, the mixture is heated to a temperature of about 90°C to about 150°C to acetylate the hydroxyl groups of the monomer (e.g., to form acetoxy groups), and then the temperature is raised to about 280°C to about 380°C for melt polycondensation. As the final polymerization temperature approaches, the volatile by-products of the reaction (e.g., acetic acid) can be removed, thereby easily achieving the desired molecular weight. During polymerization, the reaction mixture is typically stirred to ensure good heat and mass transfer, thereby ensuring good material uniformity. The rotational speed of the agitator can vary during the reaction, but is typically in the range of about 10 revolutions per minute ("rpm") to about 100rpm, and in some embodiments, about 20rpm to about 80rpm. To increase the molecular weight of the melt, the polymerization reaction can also be carried out under vacuum, which is advantageous for removing volatiles formed in the final stages of the polycondensation. The vacuum can be generated by applying a suction pressure, for example, in the range of about 5 pounds per square inch ("psi") to about 30 psi, and in some embodiments, about 10 psi to about 20 psi.

[0043] After melt polymerization, the molten polymer can typically be discharged from the reactor through an extrusion orifice equipped with a die of the desired configuration, cooled, and collected. Typically, the melt is discharged through a perforated die to form a strand, which is placed in a water bath, granulated, and dried. In some embodiments, the melt-polymerized polymer can also undergo a subsequent solid-state polymerization process to further increase its molecular weight. Solid-state polymerization can be carried out in the presence of a gas (e.g., air, an inert gas, etc.). Suitable inert gases can include, for example, nitrogen, helium, argon, neon, krypton, xenon, etc., and combinations thereof. The solid-state polymerization reactor vessel can be virtually any design that allows the polymer to maintain the desired residence time at the desired solid-state polymerization temperature. Examples of such vessels can include vessels with fixed beds, static beds, moving beds, fluidized beds, etc. The temperature at which solid-state polymerization is carried out can vary, but is typically in the range of about 250°C to about 350°C. The polymerization time will of course vary based on the temperature and the target molecular weight. However, in most cases, the solid-state polymerization time will be about 2 hours to about 12 hours, and in some embodiments, about 4 hours to about 10 hours.

[0044] B. carbon black

[0045] As described above, carbon black particles are also used in the polymer composition and are distributed throughout the polymer matrix. The carbon black particles may comprise from about 0.1 wt.% to about 3 wt.%, in some embodiments from about 0.2 wt.% to about 2 wt.%, in some embodiments from about 0.4 wt.% to about 1.5 wt.%, in some embodiments from about 0.6 wt.% to about 1 wt.%, and in some embodiments from about 1 wt.% to about 2 wt.% of the total polymer composition.

[0046] Carbon black particles having relatively low electrical conductivity are particularly suitable. Without wishing to be bound by theory, it is believed that the use of carbon black particles having lower electrical conductivity produces a composition having a lower dissipation factor. For example, the carbon black particles may have a conductivity of about 1×10 2 Ohms or greater, in some embodiments about 1×10 12 Ohms or greater, in some embodiments about 1×10 15 Ohm to about 1×10 18 Ohms, and in some embodiments, about 1×10 16 Ohm to about 1×10 17 In some embodiments, when carbon particles are included in a liquid crystal polymer masterbatch in an amount of 20 wt.%, the masterbatch may have a surface resistivity of about 1×10 8 Ohms or greater, in some embodiments about 1×10 12 Ohms or greater, in some embodiments about 1×10 15Ohm to about 1×10 18 Ohms, and in some embodiments, about 1×10 16 Ohm to about 1×10 17 Similarly, when included in a liquid crystal polymer masterbatch in an amount of 50 wt.%, the masterbatch may have a surface resistivity of about 1×10 2 Ohms or greater, in some embodiments about 1×10 3 Ohms or greater, in some embodiments about 1×10 4 Ohm to about 1×10 8 Ohms, and in some embodiments about 1×10 5 Ohm to about 1×10 6 Surface resistivity in ohms. Such a masterbatch is described in more detail below.

[0047] Carbon black particles are typically present in the form of agglomerates of primary particles. In this regard, carbon black particles have a primary particle size and a secondary particle size, wherein the primary particle size represents the smallest visible different particles when observed at a 20,000-fold magnification level, and the secondary particle size represents the particle size of the carbon black agglomerates dispersed in the polymer matrix. In some embodiments, the carbon black particles have a number average primary particle size of about 5 nm to about 100 nm, in some embodiments about 20 nm to about 70 nm, in some embodiments about 30 nm to about 60 nm, and in some embodiments about 35 nm to about 45 nm. In some embodiments, the number average secondary particle size of the carbon black particles can be about 1 μm to about 100 μm, in some embodiments about 5 μm to about 50 μm, and in some embodiments about 10 μm to about 30 μm. The number average primary particle size and the number average secondary particle size can be determined according to ASTM D3849-22.

[0048] The specific surface area of the carbon black particles is not particularly limited, but in some embodiments is about 50 m 2 / g to about 1500m 2 / g, and in some embodiments about 100m 2 / g to about 1250m 2 The surface area can be determined by BET analysis, for example according to ASTM D6556-21.

[0049] The pH of the aqueous dispersion of carbon black particles at 25° C. may be, in some embodiments, from about 2.0 to about 8.5, in some embodiments, from about 2.5 to about 7.5, and in some embodiments, from about 3.5 to about 6. The pH of a carbon black dispersion of a predetermined concentration may be measured using any appropriately calibrated pH meter apparatus, for example, according to ISO 787-9.

[0050] In some embodiments, the carbon black particles are selected from channel black, furnace black, lamp black, and thermal black. Preferably, the carbon black particles are uncoated. Additionally, the carbon black particles preferably do not contain carbon nanotubes.

[0051] C. Other additives

[0052] Various additional additives may also be included in the polymer composition, such as lubricants, fibrous fillers, thermally conductive fillers, pigments, antioxidants, stabilizers, surfactants, waxes, flame retardants, anti-drip additives, nucleating agents (e.g., boron nitride), flow modifiers, coupling agents, biocides, pigments or other colorants, impact modifiers, and other materials added to enhance performance and processability.

[0053] In one embodiment, for example, fibrous fillers may be used in the polymer composition, for example, in an amount of from about 1 wt.% to about 40 wt.%, in some embodiments from about 3 wt.% to about 30 wt.%, in some embodiments from about 5 wt.% to about 20 wt.%, and in some embodiments from about 7 wt.% to about 15 wt.%. The fibrous fillers typically include fibers having a high tensile strength relative to their mass. For example, the ultimate tensile strength of the fibers (as determined in accordance with ASTM D2101) is typically from about 1,000 megapascals ("MPa") to about 15,000 MPa, in some embodiments from about 2,000 MPa to about 10,000 MPa, and in some embodiments from about 3,000 MPa to about 6,000 MPa. To help maintain the desired dielectric properties, such high strength fibers may be formed from materials that typically have insulating properties, such as glass, ceramics or minerals (e.g., alumina or silica), aramids (e.g., polyamides sold by EI duPont de Nemours of Wilmington, Delaware), and polyamides. ), minerals, polyolefins, polyesters, and the like. The fibrous filler may comprise glass fibers, mineral fibers, or mixtures thereof. For example, in one embodiment, the fibrous filler may comprise glass fibers. Particularly suitable glass fibers may include E-glass, A-glass, C-glass, D-glass, AR-glass, R-glass, S1-glass, S2-glass, and the like. In another embodiment, the fibrous filler may comprise mineral fibers. The mineral fibers may include mineral fibers derived from the following compounds: silicates, such as neosilicates, eumorphosilicates, inosilicates (e.g., inosilicates, such as wollastonite; calcium magnesium inosilicates, such as tremolite; calcium magnesium iron inosilicates, such as actinolite; magnesium iron inosilicates, such as anthophyllite; and the like), phyllosilicates (e.g., phyllosilicates, such as palygorskite), reticular silicates, and the like; sulfates, such as calcium sulfate (e.g., dehydrated or anhydrous gypsum); mineral wool (e.g., rock wool or slag wool); and the like. Particularly suitable are inosilicates, such as those available from NycoMinerals under the trade name (For example, 4W or 8) wollastonite fiber.

[0054] In addition, although fibrous filler can have various sizes, the fiber with certain aspect ratio can contribute to improving the mechanical property of polymer composition.That is to say, aspect ratio (average length divided by nominal diameter) is about 2 or larger, in some embodiments about 4 to about 50, in some embodiments about 5 to about 20, and in some embodiments about 6 to about 10 fibrous filler may be particularly beneficial.For example, this type of fibrous filler can have about 10 microns to about 800 microns, in some embodiments about 25 microns to about 500 microns, in some embodiments about 50 microns to about 300 microns, and in some embodiments about 60 microns to about 100 microns weight average length.In addition, this type of fibrous filler can have for example about 10 microns to about 800 microns, in some embodiments about 25 microns to about 500 microns, in some embodiments about 50 microns to about 300 microns, and in some embodiments about 60 microns to about 100 microns volume average length.Fiberfill can have about 5 microns or larger equally, in some embodiments about 6 microns to about 40 microns, in some embodiments about 8 microns to about 20 microns, and in some embodiments about 9 microns to about 12 microns nominal diameter. The relative amount of the fibrous filler can also be selectively controlled to help achieve the desired mechanical and thermal properties without adversely affecting other properties of the polymer composition, such as its flowability and dielectric properties. In this regard, the fibrous filler can have a dielectric constant of about 6 or less, in some embodiments about 5.5 or less, in some embodiments from about 1.1 to about 5, and in some embodiments from about 2 to about 4.8 at a frequency of 1 GHz.

[0055] The fiber filler can be in a modified or unmodified form, for example, in order to improve the adhesion to plastics, a sizing agent is provided or chemically treated. In some examples, the glass fiber can be provided with a sizing agent to protect the glass fiber, make the fiber smooth, and improve the adhesion between the fiber and the matrix material. If present, the sizing agent can include silane, a film former, a lubricant, a wetting agent, an adhesive, an optional antistatic agent and a plasticizer, an emulsifier and optional other additives. In a specific embodiment, the sizing agent can include silane. The specific example of silane is aminosilane, such as 3-trimethoxysilylpropylamine, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, N-(3-trimethoxysilylpropyl)ethane-1,2-diamine, 3-(2-aminoethyl-amino)propyltrimethoxysilane, N-[3-(trimethoxysilyl)propyl]-1,2-ethane-diamine.

[0056] If desired, the composition may also include a particulate filler. Particulate fillers may also be used as dielectric fillers in polymer compositions to help achieve desired properties and / or color. Particulate clay minerals may be particularly suitable for use in the present invention. For example, examples of such clay minerals include talc (Mg3Si4O 10 (OH2)), halloysite (Al2Si2O5(OH)4), kaolinite (Al2Si2O5(OH)4), illite ((K,H3O)(Al,Mg,Fe)2(Si,Al)4O 10 [(OH)2,(H2O)]), montmorillonite (Na,Ca) 0.33 (Al,Mg)2Si4O 10 (OH)2.nH2O), vermiculite ((MgFe,Al)3(Al,Si)4O 10 (OH)2.4H2O), palygorskite (Mg,Al)2Si4O 10 (OH).4(H2O)), pyrophyllite (Al2Si4O 10 (OH)2), etc. and combinations thereof. Other particulate fillers may be used instead of or in addition to clay minerals. For example, other suitable particulate silicate fillers such as mica, diatomaceous earth, etc. may also be used. For example, mica may be a mineral particularly suitable for the present application. As used herein, the term "mica" is intended to generally include any of these species, such as muscovite (KAl2(AlSi3)O 10 (OH)2), biotite (K(Mg,Fe)3(AlSi3)O 10 (OH)2), phlogopite (KMg3(AlSi3)O 10 (OH)2), lepidolite (K(Li,Al) 2-3 (AlSi3)O10 (OH)2), glauconite (K,Na)(Al,Mg,Fe)2(Si,Al)4O 10 (OH) 2) and the like and combinations thereof. Other types of mineral particulate fillers, such as silica, alumina, and the like, may also be used.

[0057] In some embodiments, it may also be desirable to use plate-like mineral particles, such as mica particles, having a relatively high aspect ratio (e.g., average diameter divided by average thickness), for example, about 4 or greater, in some embodiments, about 10 to about 500, in some embodiments, about 30 to about 300, in some embodiments, about 50 to about 200, and in some embodiments, about 70 to about 100. In such embodiments, the average diameter of the particles can be, for example, about 5 microns to about 200 microns, in some embodiments, about 10 microns to about 100 microns, in some embodiments, about 15 microns to about 50 microns, and in some embodiments, about 20 microns to about 30 microns. The average thickness can also be about 2 microns or less, in some embodiments, about 5 nanometers to about 1 micron, in some embodiments, about 10 nanometers to about 500 nanometers, in some embodiments, about 15 nanometers to about 100 nanometers, and in some embodiments, about 20 nanometers to about 50 nanometers, as measured, for example, according to ISO 13320:2020 using laser diffraction techniques (e.g., using a Horiba LA-960 particle size distribution analyzer). The plate-like particles may also have a narrow size distribution. That is, at least about 70 vol% of the particles, in some embodiments at least about 80 vol% of the particles, and in some embodiments at least about 90 vol% of the particles may have a size within the above range.

[0058] In some embodiments, the polymer composition includes glass flakes. For example, glass flakes are flaky glass particles typically having an average diameter of about 10 microns to about 4 millimeters and an average thickness of about 1 micron to about 7 microns. In some embodiments, the glass flakes are made of E-glass. The use of such glass flakes can provide the composition with good dimensional stability while maintaining a low dissipation factor.

[0059] To help achieve the desired dielectric properties, the polymer composition may also include hollow inorganic fillers. For example, the dielectric constant of these fillers at 100 MHz may be about 3.0 or less, in some embodiments about 2.5 or less, in some embodiments about 1.1 to about 2.3, and in some embodiments about 1.2 to about 2.0. In addition, the hollow inorganic fillers may be of a certain size and contribute to the strength of the polymer composition while also allowing the polymer composition to have a reduced weight and / or density due to its hollow nature.

[0060] Typically, the hollow inorganic filler has an internal hollow space or cavity and can be synthesized using techniques known in the art. The hollow inorganic filler can be made of conventional materials. For example, the hollow inorganic filler can include aluminum oxide, silicon dioxide, zirconium oxide, magnesium oxide, glass, fly ash, borate, phosphate, ceramics, etc. In one embodiment, the hollow inorganic filler can include hollow glass filler, hollow ceramic filler, and mixtures thereof. In one embodiment, the hollow inorganic filler includes a hollow glass filler.

[0061] The insulating glass filler can be made of soda-lime borosilicate glass, soda-lime glass, borosilicate glass, sodium borosilicate glass, sodium silicate glass, or aluminosilicate glass. In this regard, in one embodiment, the composition of the glass, while not limited, can be: at least about 65 wt.% SiO2, 3 wt.%-15 wt.% Na2O, 8 wt.%-15 wt.% CaO, 0.1 wt.%-5 wt.% MgO, 0.01 wt.%-3 wt.% Al2O3, 0.01 wt.%-1 wt.% K2O, and optionally other oxides (e.g., Li2O, Fe2O3, TiO2, B2O3). In another embodiment, the composition can be approximately 50-58 wt.% SiO2, 25-30 wt.% Al2O3, 6-10 wt.% CaO, 1-4 wt.% Na2O / KO, and 1-5 wt.% of other oxides. Furthermore, in one embodiment, the insulating glass filler can include more alkaline earth metal oxides than alkali metal oxides. For example, the weight ratio of alkaline earth metal oxides to alkali metal oxides can be greater than 1, in some embodiments, about 1.1 or greater, in some embodiments, about 1.2 to about 4, and in some embodiments, about 1.5 to about 3. Regardless of the foregoing, it should be understood that the glass composition can vary depending on the type of glass used and still provide the desired benefits of the present invention.

[0062] The hollow inorganic filler may have at least one dimension having an average value of about 1 micron or greater, in some embodiments about 5 microns or greater, in some embodiments about 8 microns or greater, in some embodiments about 1 micron to about 150 microns, in some embodiments about 10 microns to about 150 microns, and in some embodiments about 12 microns to about 50 microns. In one embodiment, such an average value may be referred to as d 50 value.

[0063] In addition, the hollow inorganic filler may have a D of about 3 microns or greater, in some embodiments about 4 microns or greater, in some embodiments about 5 microns to about 20 microns, and in some embodiments about 6 microns to about 15 microns.10 The hollow inorganic filler may have a D of about 10 microns or greater, in some embodiments about 15 microns or greater, in some embodiments about 20 microns to about 150 microns, and in some embodiments about 22 microns to about 50 microns. 90 .

[0064] In this respect, hollow inorganic filler can exist by size distribution, and described size distribution can be Gaussian size distribution, normal size distribution or non-normal size distribution.In one embodiment, hollow inorganic filler can have Gaussian size distribution.In another embodiment, hollow inorganic filler can have normal size distribution.In another embodiment, hollow inorganic filler can have non-normal size distribution.The example of non-normal size distribution can comprise unimodal and multimodal (for example, bimodal) size distribution.

[0065] When referring to the above-mentioned size, such size can be any size. However, in one embodiment, such size refers to diameter. For example, such value of size refers to the average diameter of spheres. Size, such as average diameter, can be measured according to 3MQCM 193.0. In this respect, in one embodiment, hollow inorganic filler can refer to hollow spheres, such as hollow glass spheres. For example, hollow inorganic filler can have an average aspect ratio of about 1. Typically, average aspect ratio can be about 0.8 or greater, about 0.85 or greater in some embodiments, about 0.9 to about 1.3 in some embodiments, and about 0.95 to about 1.05 in some embodiments.

[0066] In addition, the hollow inorganic filler can have relatively thin walls to help improve the dielectric properties of the polymer composition and reduce weight. The wall thickness can be about 50% or less of the average size (e.g., average diameter) of the hollow inorganic filler, in some embodiments about 40% or less, in some embodiments about 1% to about 30%, and in some embodiments about 2% to about 25%.

[0067] In addition, the hollow inorganic filler can have a certain true density, which can allow for easy handling and provide a polymer composition with reduced weight. Generally, true density refers to the quotient obtained by dividing the mass of a hollow filler sample by the true volume of the hollow filler mass, where the true volume refers to the total volume of the hollow filler. In this regard, the true density of the hollow inorganic filler can be about 0.1 g / cm 3 or greater, in some embodiments about 0.2 g / cm 3 or greater, in some embodiments about 0.3 g / cm 3 or greater to about 1.2 g / cm 3 , and in some embodiments, about 0.4 g / cm 3or greater to about 0.9 g / cm 3 The true density can be determined according to 3M QCM 14.24.1.

[0068] Even if the fillers are hollow, they can have mechanical strength that allows the structural integrity of the fillers to be maintained, thereby making the fillers less likely to break during processing and / or use. In this regard, the isotactic crush resistance of the hollow inorganic filler (i.e., wherein at least 80 vol.%, such as at least 90 vol.% of the hollow filler survives) can be about 20 MPa or more, in some embodiments about 100 MPa or more, in some embodiments about 150 MPa to about 500 MPa, and in some embodiments about 200 MPa to about 350 MPa. The isotactic crush resistance can be determined according to 3M QCM 14.1.8.

[0069] The basicity of the hollow inorganic filler can be about 1.0 meq / g or less, in some embodiments about 0.9 meq / g or less, in some embodiments about 0.1 meq / g to about 0.8 meq / g, and in some embodiments about 0.2 meq / g to about 0.7 meq / g. The basicity can be measured according to 3M QCM 55.19. To provide a relatively low basicity, the hollow inorganic filler can be treated with a suitable acid (e.g., phosphoric acid).

[0070] In addition, the hollow inorganic filler can also include a surface treatment to help provide better compatibility with the polymer and / or other components in the polymer composition. As an example, the surface treatment can be silanization. In particular, the surface treatment agent can include but is not limited to aminosilane, epoxysilane, etc.

[0071] For example, when used, the hollow inorganic filler may comprise about 1 wt.% or more, in some embodiments about 4 wt.% or more, in some embodiments about 5 wt.% to about 40 wt.%, and in some embodiments about 10 wt.% to about 30 wt.% of the polymer composition. In addition, to provide beneficial properties, the weight ratio of the polymer to the hollow inorganic filler may be about 0.1 or greater, in some embodiments about 1 or greater, in some embodiments about 1.5 or greater, in some embodiments about 0.1 to about 10, in some embodiments about 1 to about 10, in some embodiments about 2 to about 10, in some embodiments about 2 to about 6, and in some embodiments about 2 to about 5. However, in other embodiments, the composition achieves the desired dielectric properties without using any hollow filler.

[0072] In some embodiments, the composition may include a combination of a fibrous filler and a lamellar mineral filler. For example, in some embodiments, the composition includes a filler comprising a combination of ground glass fiber and mica. In such embodiments, the ratio of the lamellar mineral filler to the fibrous filler may be from about 0.1 to about 20, from about 0.5 to about 10 in some embodiments, from about 1 to about 5 in some embodiments, and from about 2 to about 3 in some embodiments.

[0073] II. form

[0074] The components for forming the polymer composition can be combined using any of a variety of different techniques known in the art. In a specific embodiment, for example, a liquid crystal polymer, carbon black and other optional additives are melt-processed as a mixture in an extruder to form a polymer composition. The mixture can be melt-kneaded at a temperature of about 200°C to about 450°C in a single-screw or multi-screw extruder. In one embodiment, the mixture can be melt-processed in an extruder comprising multiple temperature zones. The temperature of each zone is typically set at about -60°C to about 25°C relative to the melt temperature of the polymer. For example, a twin-screw extruder (e.g., a Leistritz 18-mm co-rotating fully intermeshing twin-screw extruder) can be used to melt-process the mixture. A universal screw design can be used to melt-process the mixture. In one embodiment, a mixture comprising all components can be fed to the feed throat in the first barrel by a volumetric feeder. In another embodiment, different components can be added at different addition points in the extruder, as is known. For example, the polymer can be applied at the feed throat, and certain additives (e.g., carbon black particles and / or other additives) can be supplied in the same or different temperature zones downstream thereof. In any case, the resulting mixture can be melted and mixed and then extruded through a die. The extruded polymer composition can then be quenched and solidified in a water bath and pelletized in a pelletizer and then dried.

[0075] In some embodiments, carbon black particles are added to the composition in the form of a masterbatch. For example, the masterbatch can include a relatively high concentration of carbon black in a thermoplastic carrier. In some embodiments, the carbon black particles comprise from about 5 wt.% to about 70 wt.%, in some embodiments from about 15 wt.% to about 60 wt.%, and in some embodiments from about 20 wt.% to about 50 wt.% of the masterbatch. Preferably, the thermoplastic carrier comprises a liquid crystal polymer, which may be the same as or different from the liquid crystal polymer matrix. The masterbatch can be blended with the polymer matrix and any optional fillers in an extruder as described above.

[0076] Regardless of the manner in which the components are incorporated into the composition, the resulting melt viscosity is generally low enough so that it can flow easily into the cavity of a mold to form a small-sized circuit substrate. For example, in one embodiment, the polymer composition may have a viscosity of 1,000 s. -1 The melt viscosity is about 5 Pa·s or greater, in some embodiments about 10 Pa·s or greater, in some embodiments from about 10 Pa·s to about 500 Pa·s, in some embodiments from about 5 Pa·s to about 150 Pa·s, in some embodiments from about 5 Pa·s to about 100 Pa·s, in some embodiments from about 10 Pa·s to about 100 Pa·s, and in some embodiments from about 15 Pa·s to about 90 Pa·s, as measured at a shear rate of 1.5 %.

[0077] III. application

[0078] In some embodiments, polymer composition can be formed into film. Generally, any one of various different technologies can be used to form polymer composition into film. Suitable technology can include, for example, solvent casting, melt extrusion (for example, die casting, blown film casting, extrusion coating, etc.) or the like. In a specific embodiment, a blown film process is adopted, wherein the composition is fed into an extruder, melt-processed in the extruder, and then supplied to form molten bubbles by a blown film die. Typically, the die comprises a mandrel positioned inside the outer die body, thereby defining a space between them. The polymer composition is blown through the space to form bubbles, which can then be pulled out, inflated with air, and rapidly cooled, thereby allowing the polymer composition to solidify rapidly. If desired, the bubbles can then be crushed between rollers, and optionally wound onto a reel. The thickness of the resulting film can vary, but is typically about 500 microns or less, about 1 micron to about 250 microns in some embodiments, about 2 microns to about 100 microns in some embodiments, and about 5 microns to about 50 microns in some embodiments.

[0079] In some embodiments, the film can be used as a layer in a laminate. For example, the film can be positioned adjacent to at least one conductive layer to form a laminate. The conductive layer can be provided in various forms, such as a film, a film, a mold, a wafer, a tube, etc. For example, the layer can have a foil structure, because it is relatively thin, for example, with approximately 500 microns or less, approximately 200 microns or less in some embodiments, and a thickness of approximately 1 micron to approximately 100 microns in some embodiments. Of course, higher thickness can also be adopted. The conductive layer can also include various conductive materials, such as metals, such as gold, silver, nickel, aluminum, copper and mixtures or alloys thereof. In one embodiment, for example, the conductive layer can include copper (for example, pure copper and copper alloys).

[0080] The film can be applied to the conductive layer using techniques such as those described above (e.g., casting), or the conductive layer can be applied to the film using techniques such as ion beam sputtering, high frequency sputtering, DC magnetron sputtering, glow discharge, etc. If necessary, the film can be surface treated on the side facing the conductive layer to improve the adhesion between the film and the conductive layer. Examples of such surface treatments include, for example, corona discharge treatment, UV irradiation treatment, plasma treatment, etc. When applied to the conductive layer, the film can be optionally annealed to improve its performance. For example, annealing can be performed at a temperature of about 250°C to about 400°C, in some embodiments about 260°C to about 350°C, and in some embodiments about 280°C to about 330°C, for a period of about 15 minutes to about 300 minutes, in some embodiments about 20 minutes to about 200 minutes, and in some embodiments for a period of about 30 minutes to about 120 minutes. During the annealing process, it is sometimes desirable to confine the film to one or more positions (e.g., edges) so that it generally cannot physically move. This can be achieved in various ways, such as by clamping, gluing or otherwise adhering the film to the conductive layer.

[0081] The laminate may have a two-layer structure comprising only a film and a conductive layer. Figure 6 , shows one embodiment of such a two-layer structure 10 comprising a film 11 disposed adjacent to a conductive layer 12 (e.g., copper foil). Alternatively, a multilayer laminate comprising two or more conductive layers and / or two or more films may be formed. Figure 7 , for example, shows one embodiment of a three-layer laminate structure 100 comprising a film 110 positioned between two conductive layers 112 . Figure 8 Yet another embodiment is shown. In this embodiment, a seven-layer laminate structure 200 is shown, comprising a core 201 formed by a film 210 positioned between two conductive layers 212. Film 220 similarly covers each conductive layer 212, and an outer conductive layer 222 covers film 220. In the above embodiments, the film of the present invention can be used to form any or even all of the film layers. Various conventional processing steps can be used to provide sufficient strength to the laminate. For example, the laminate can be pressed and / or heat-treated as known in the art.

[0082] The laminates of the present invention can be used in a variety of different applications. For example, as described above, the laminates can be used in circuit boards (e.g., printed circuit boards) of electronic devices that are provided with antenna elements. The antenna elements can be applied (e.g., printed) directly to the circuit board, or alternatively, can be provided in an antenna module that is supported by and connected to the circuit board. For example, referring to Figure 9, shows one embodiment of an electronic device 140 that includes a substrate 154 supporting various electronic components 142, such as integrated circuits (e.g., transceiver circuitry, control circuitry, etc.), discrete components (e.g., capacitors, inductors, resistors), switches, and the like. An encapsulation material 156 can be applied to the components 142 and a printed circuit board 154, as described herein, which includes conductive traces 152 and contact pads 150 for forming electrical signal paths. A semiconductor die 144 bonded to the printed circuit board and embedded within a package can also be used to form each respective component 142. More specifically, the components 142 can have contacts 146 (e.g., pads) and can be mounted to the contacts 150 on the printed circuit board 154 using a conductive material 148 (e.g., solder) coupled between the contacts 146 and the contacts 150. In the illustrated embodiment, an antenna element 160 is formed on the exposed surface of the encapsulation material 156. Antenna element 156 may be electrically connected to printed circuit board 154 via a transmission line 158 (eg, a metal post).

[0083] In some embodiments, the printed circuit board is specifically configured for a 5G antenna system. As used herein, "5G" generally refers to high-speed data communications via radio frequency signals. 5G networks and systems are capable of transmitting data at rates much faster than previous generations of data communication standards (e.g., "4G," "LTE"). Various standards and specifications have been released that quantify the requirements for 5G communications. As an example, the International Telecommunications Union (ITU) released the International Mobile Telecommunications-2020 ("IMT-2020") standard in 2015. The IMT-2020 standard specifies various data transmission standards for 5G (e.g., downlink and uplink data rates, latency, etc.). The IMT-2020 standard defines uplink and downlink peak data rates as the minimum data rates that a 5G system must support for uploading and downloading data. The IMT-2020 standard sets the downlink peak data rate requirement at 20 Gbit / s and the uplink peak data rate requirement at 10 Gbit / s. As another example, the Third Generation Partnership Project (3GPP) has set a 5G standard for the 3rd Generation Partnership Project (3GPP). rdThe 3GPP (3rd Generation Partnership Project) recently released a new standard for 5G, called "5G NR". 3GPP released "Release 15" in 2018, defining the "first phase" of 5G NR standardization. 3GPP generally defines 5G frequency bands as: "Frequency Range 1" (FR1), which includes frequencies below 6 GHz; and "Frequency Range 2" (FR2), which has a frequency band range of 20 GHz to 60 GHz. However, as used herein, "5G frequencies" may refer to systems that use frequencies greater than 60 GHz (e.g., ranging up to 80 GHz, up to 150 GHz, and up to 300 GHz). As used herein, "5G frequencies" may refer to frequencies of about 2.5 GHz or higher, in some embodiments about 3.0 GHz or higher, in some embodiments about 3 GHz to about 300 GHz or higher, in some embodiments about 4 GHz to about 80 GHz, in some embodiments about 5 GHz to about 80 GHz, in some embodiments about 20 GHz to about 80 GHz, and in some embodiments about 28 GHz to about 60 GHz.

[0084] 5G antenna systems generally employ high frequency antennas and antenna arrays for base stations, repeaters (e.g., “femtocells”), relay stations, terminals, user equipment, and / or other suitable components of 5G systems. The antenna elements / arrays and systems may meet or comply with standards published by 3GPP (e.g., Release 15 (2018) and / or the IMT-2020 standard for “5G”. To enable such high-speed data communications at high frequencies, antenna elements and arrays generally employ small feature sizes / spacing (e.g., fine pitch technology) and / or advanced materials that may improve antenna performance. For example, the feature size (spacing between antenna elements, width of antenna elements), etc., generally depends on the wavelength (λ) of the desired transmitted and / or received radio frequency that propagates through the circuit board on which the antenna elements are formed (e.g., nλ / 4, where n is an integer). Additionally, beamforming and / or beam steering may be employed to facilitate communication across multiple frequency ranges or channels. Reception and transmission (e.g., multiple-input, multiple-output (MIMO), massive MIMO). High-frequency 5G antenna elements can have various configurations. For example, the 5G antenna elements can be or include coplanar waveguide elements, patch arrays (e.g., grid patch arrays), other suitable 5G antenna configurations. The antenna elements can be configured to provide MIMO, massive MIMO functionality, beam steering, etc. As used herein, "massive" MIMO functionality generally refers to providing a large number of transmit and receive channels with an antenna array, such as 8 transmit (T×) and 8 receive (R×) channels (abbreviated as 8×8). Massive MIMO functionality can be provided in 8×8, 12×12, 16×16, 32×32, 64×64 or larger.

[0085] Various manufacturing techniques can be used to manufacture antenna elements. As an example, antenna elements and / or associated elements (e.g., ground elements, feed lines, etc.) can be manufactured using fine pitch technology. Fine pitch technology generally refers to small or dense spacing between their components or leads. For example, the characteristic size and / or spacing between antenna elements (or between antenna elements and the ground plane) can be approximately 1,500 microns or less, in some embodiments, 1,250 microns or less, in some embodiments, 750 microns or less (e.g., center-to-center spacing of 1.5 mm or less), 650 microns or less, in some embodiments, 550 microns or less, in some embodiments, 450 microns or less, in some embodiments, 350 microns or less, in some embodiments, 250 microns or less, in some embodiments, 150 microns or less, in some embodiments, 100 microns or less, and in some embodiments, 50 microns or less. However, it should be understood that smaller and / or larger characteristic sizes and / or spacings can also be used. Due to such small characteristic sizes, antenna configurations and / or arrays can be implemented with a large number of antenna elements in a small footprint. For example, the antenna array can have an average antenna element concentration of greater than 1,000 antenna elements per square centimeter, in some embodiments greater than 2,000 antenna elements per square centimeter, in some embodiments greater than 3,000 antenna elements per square centimeter, in some embodiments greater than 4,000 antenna elements per square centimeter, in some embodiments greater than 6,000 antenna elements per square centimeter, and in some embodiments greater than approximately 8,000 antenna elements per square centimeter. This compact arrangement of antenna elements can provide a greater number of channels for MIMO functionality per unit area of antenna area. For example, the number of channels can correspond to (e.g., be equal to or proportional to) the number of antenna elements.

[0086] refer to Figure 1For example, the 5G antenna system 100 may include a base station 102, one or more relay stations 104, one or more user computing devices 106, one or more Wi-Fi repeaters 108 (e.g., "femtocells"), and / or other suitable antenna components for the 5G antenna system 100. The relay station 104 may be configured to facilitate communication between the user computing device 106 and / or other relay stations 104 and the base station 102 by relaying or "repeating" signals between the base station 102 and the user computing device 106 and / or the relay station 104. The base station 102 may include a MIMO antenna array 110 configured to receive and / or transmit radio frequency signals 112 with the relay station 104, the Wi-Fi repeater 108, and / or directly with the user computing device 106. The user computing device 306 is not necessarily limited by the present invention and may include a device such as a 5G smartphone.

[0087] The MIMO antenna array 110 may employ beam steering to focus or direct radio frequency signals 112 relative to the relay station 104. For example, the MIMO antenna array 110 may be configured to adjust an elevation angle 114 relative to the XY plane and / or a heading angle 116 defined in the ZY plane and relative to the Z direction. Similarly, one or more of the relay station 104, the user computing device 106, and the Wi-Fi repeater 108 may employ beam steering to improve reception and / or transmission capabilities with respect to the MIMO antenna array 110 by directionally tuning the sensitivity and / or power transmission of the devices 104, 106, 108 relative to the MIMO antenna array 110 of the base station 102 (e.g., by adjusting one or both of the relative elevation angle and / or relative azimuth angle of each device).

[0088] Figures 2A to 2B Similarly, a top view and a side elevation view, respectively, of an example user computing device 106 are shown. The user computing device 106 may include one or more antenna elements 200, 202 (eg, arranged as respective antenna arrays). Figure 2A , the antenna elements 200, 202 can be configured to perform beam steering in the XY plane (as indicated by arrows 204, 206 and corresponding to relative azimuth angles). Figure 2B , the antenna elements 200 , 202 may be configured to perform beam steering in the ZY plane (as indicated by arrows 204 , 206 ).

[0089] Figure 3 A simplified schematic diagram of multiple antenna arrays 302 connected using corresponding feed lines 304 (e.g., to a front-end module) is depicted. The antenna arrays 302 can be mounted to a side surface 306 of a substrate 308, for example, as described with respect to FIG. Figures 5A to 5C30. As described and illustrated. For example, the substrate 308 can be a circuit board such as described herein. The antenna array 302 can include a plurality of vertically connected elements (e.g., as a grid array). Thus, the antenna array 302 can generally extend parallel to the side surface 306 of the substrate 308. A shield can optionally be provided on the side surface 306 of the substrate 308 such that the antenna array 302 is located outside the shield can relative to the substrate 308. The vertical spacing distances between the vertically connected elements of the antenna array 302 can correspond to a "characteristic size" of the antenna array 320. Thus, in some embodiments, these spacing distances can be relatively small (e.g., less than about 750 microns) such that the antenna array 302 is a "fine pitch" antenna array 302.

[0090] Figure 4 The figure shows a side view of a coplanar waveguide antenna 400 configuration. One or more coplanar ground layers 402 can be arranged parallel to antenna elements 404 (e.g., patch antenna elements). Another ground layer 406 can be separated from the antenna elements by a substrate 408, which can be, for example, a circuit board as described herein. One or more additional antenna elements 410 can be separated from the antenna elements 404 by a second layer or substrate 412, which can be, for example, a circuit board as described herein. Dimensions "G" and "W" can correspond to "characteristic dimensions" of the antenna 400. The "G" dimension can correspond to the distance between the antenna element 404 and the coplanar ground layer 406. The "W" dimension can correspond to the width (e.g., line width) of the antenna element 404. Therefore, in some embodiments, dimensions "G" and "W" can be relatively small (e.g., less than approximately 750 microns), such that the antenna 400 is a "fine pitch" antenna 400.

[0091] Figure 5A The figure shows one embodiment of an antenna array 500. The antenna array 500 may include a substrate 510 and a plurality of antenna elements 520 formed thereon. For example, the substrate 510 may be a circuit board such as described herein. The plurality of antenna elements 520 may be approximately equal in size in the X direction and / or the Y direction (e.g., square or rectangular). The plurality of antenna elements 520 may be approximately equally spaced apart in the X direction and / or the Y direction. The size of the antenna elements 520 and / or the spacing therebetween may correspond to a "characteristic size" of the antenna array 500. Thus, in some embodiments, the size and / or spacing may be relatively small (e.g., less than about 750 microns) such that the antenna array 500 is a "fine pitch" antenna array 500. As indicated by ellipsis 522, Figure 5A The number of columns of antenna elements 520 shown is provided as an example only. Similarly, the number of rows of antenna elements 520 is provided as an example only.

[0092] The tuned antenna array 500 may be used to provide massive MIMO functionality, such as in a base station (e.g., as described above with respect to Figure 1 More specifically, the radio frequency interactions between the various elements can be controlled or tuned to provide multiple transmit and / or receive channels. Transmit power and / or receive sensitivity can be directionally controlled to focus or direct the radio frequency signal, for example, Figure 1 RF signal 112 is described. Tuned antenna array 500 can provide a large number of antenna elements 522 in a small footprint. For example, tuned antenna 500 can have an average antenna element concentration of 1,000 antenna elements per square centimeter or greater. This compact arrangement of antenna elements can provide a greater number of channels per unit area for MIMO functionality. For example, the number of channels can correspond to (e.g., be equal to or proportional to) the number of antenna elements.

[0093] Figure 5B The figure shows an embodiment of an antenna array 540. The antenna array 540 may include a plurality of antenna elements 542 and a plurality of feed lines 544 connecting the antenna elements 542 (e.g., to other antenna elements 542, front-end modules, or other suitable components). The antenna elements 542 may have respective widths "w" and spacing distances "S1" and "S2" between them (e.g., in the X and Y directions, respectively). These dimensions may be selected to enable 5G radio frequency communications at the desired 5G frequencies. More specifically, the dimensions may be selected to tune the antenna array 540 to transmit and / or receive data using radio frequency signals within the 5G spectrum (e.g., greater than 2.5 GHz and / or greater than 3 GHz and / or greater than 28 GHz). The dimensions may be selected based on the material properties of the substrate. For example, one or more of "w," "S1," or "S2" may correspond to a multiple (e.g., nλ / 4, where n is an integer) of the propagation wavelength ("λ") of the desired frequency passing through the substrate material.

[0094] As an example, λ can be calculated as follows:

[0095]

[0096] where c is the speed of light in vacuum, ∈ R is the dielectric constant of the substrate (or surrounding material), and f is the desired frequency.

[0097] Figure 5CThe figure shows an example antenna configuration 560 according to aspects of the present invention. The antenna configuration 560 may include a plurality of antenna elements 562 arranged in parallel long edges of a substrate 564. The individual antenna elements 562 may have respective lengths "L" (and spacing distances therebetween) that tune the antenna configuration 560 to receive and / or transmit at a desired frequency and / or frequency range. More specifically, such dimensions may be selected based on the propagation wavelength λ at the desired frequency of the substrate material, for example, as described above with reference to Figure 5B described.

[0098] As mentioned above, a wireless communication tower component may be an RF filter. RF filters are key components in remote radio heads. RF filters are used to eliminate signals of certain frequencies and are often used as building blocks for duplexers and multiplexers to combine or separate multiple frequency bands. RF filters play a key role in minimizing interference between systems operating in different frequency bands. RF cavity filters are a commonly used RF filter. A common practice for making these filters have various designs and physical geometries is to cast aluminum molds into the desired structure or machine the final geometry from preforms. RF filters, their characteristics, their use, their manufacture, their machining, and their overall production are described, for example, in U.S. Patents Nos. 7,847,658 and 8,072,298.

[0099] In various embodiments, at least a portion of the polymer composite material can be metal-plated (i.e., metalized), as is commonly done for RF cavity filters. For example, a metal layer such as copper, silver, or gold can be deposited on the polymer composite material using various plating techniques. Examples of suitable plating techniques can be found, for example, in U.S. Provisional Patent Application No. 61 / 577,918.

[0100] In other embodiments, the polymer composition can be molded into a desired shape for a specific application. Typically, the molded part is molded using a single-component injection molding process in which dried and preheated plastic pellets are injected into a mold. In one embodiment, the molded part or shape can be an electrical connector as described above. The electrical connector can find specific applications in 5G radio frequency systems. For example, the electrical connector can communicatively couple any of the devices described in the above-mentioned 5G systems (e.g., antennas and / or antenna arrays) to one or more integrated circuits, processors, memories, etc.

[0101] According to aspects of the present invention, Figure 10A A particularly suitable electrical connector 100 is shown in FIG. Figure 10B Depicts Figure 10A2 shows an enlarged view of the electrical connector 100. As shown, an insertion channel or space 225 is defined between opposing walls 224, which can accommodate contact pins to facilitate a variety of electrical connections. The electrical connector 100 can be very compact. More specifically, the walls 224 can have a relatively thin corresponding width "w," such as within the above-mentioned ranges.

[0102] Figure 11 Another embodiment of an electrical connector 200 is depicted in FIG. A board-side portion C2 is mountable on the surface of a circuit board P. Connector 200 may further include a wiring material-side portion C1 configured to connect discrete wires 3 to circuit board P by coupling with board-side connector C2. Board-side portion C2 may include a first housing 10 having a fitting recess 10a and a configuration elongated along the width of housing 10, with wiring material-side connector C1 fitting into fitting recess 10a. Wiring material-side portion C1 may also include a second housing 20 elongated along the width of housing 20. Within second housing 20, a plurality of terminal accommodating cavities 22 may be arranged parallel to each other in the width direction, thereby forming a two-layer array including upper and lower terminal accommodating cavities 22. Terminals 5 mounted to the distal ends of discrete wires 3 may be accommodated within each terminal accommodating cavity 22. If desired, a locking portion 28 (engaging portion) may also be provided on housing 20, corresponding to a connecting member (not shown) on board-side connector C2.

[0103] As described above, the inner wall of the first housing 10 and / or the second housing 20 may be relatively thin (eg, may have a relatively small width dimension) and may be formed from the polymer composition of the present invention.

[0104] The electrical connector may also reduce or prevent interference (eg, "crosstalk") between signals transmitted on adjacent or nearby pins due to the dielectric properties of the polymer composition from which the electrical connector is formed.

[0105] The present invention may be better understood with reference to the following examples.

[0106] Test Method

[0107] Melt viscosity: can be tested according to ISO test number 11443:20021 at 1,000s -1 Melt viscosity (Pa·s) was measured using a Dynisco LCR 7001 capillary rheometer at a shear rate of 1000 rpm and a temperature 15°C above the melt temperature (e.g., approximately 350°C). The rheometer orifice (die) had a diameter of 1 mm, a length of 20 mm, an L / D ratio of 20.1, and an inlet angle of 180°. The barrel diameter was 9.55 mm ± 0.005 mm, and the rod length was 233.4 mm.

[0108] Melting Temperature: The melting temperature ("Tm") can be determined by differential scanning calorimetry ("DSC") as known in the art. The melting temperature is the differential scanning calorimetry (DSC) peak melting temperature as determined by ISO test number 11357-2:2020. The sample is heated and cooled at 20°C per minute using DSC measurements performed on a TA Q2000 instrument under the DSC procedure as described in ISO standard 10350.

[0109] Deflection Temperature Under Load ("DTUL"): Deflection Temperature Under Load can be determined according to ISO Test No. 75-2:2013 (technically equivalent to ASTM D648-18). More specifically, a three-point bend test along an edge can be performed on a test strip specimen having a length of 80 mm, a thickness of 10 mm, and a width of 4 mm, with a specified load (maximum external fiber stress) of 1.8 MPa. The specimen can be placed in a silicone oil bath, where the temperature is increased at 2°C per minute until it deflects 0.25 mm (0.32 mm for ISO Test No. 75-2:2013).

[0110] Tensile modulus, tensile stress, and tensile elongation: Tensile properties can be tested according to ISO test number 527:2019 (technically equivalent to ASTM D 638-14). Modulus and strength measurements can be performed on identical test strip samples with a length of 80 mm, a thickness of 10 mm, and a width of 4 mm. The test temperature can be 23°C, and the test speed can be 1 mm / min or 5 mm / min.

[0111] Flexural modulus, flexural stress, and flexural elongation: Flexural properties can be tested according to ISO test number 178:2019 (technically equivalent to ASTM D 790-17). This test can be performed on a 64 mm support span. The test can be performed on the center section of an uncut ISO 3167 multipurpose bar. The test temperature can be 23°C and the test speed can be 2 mm / min.

[0112] Unnotched and Notched Charpy Impact Strength: Charpy properties can be tested according to ISO test number ISO 179-1:2010 (technically equivalent to ASTM D6110-10, Method B). This test can be performed using Type 1 specimen dimensions (80 mm length, 10 mm width, 4 mm thickness). When testing notched impact strength, the notch can be a Type A notch (0.25 mm base radius). Specimens can be cut from the center of a multi-purpose bar using a single-tooth milling machine. The testing temperature can be 23°C.

[0113] Dielectric constant ("Dk") and dissipation factor ("Df"): The dielectric constant (or relative electrostatic permittivity) and dissipation factor are determined using the known split-pillar dielectric resonator technique, for example as described in Baker-Jarvis et al., IEEE Trans. on Dielectric and Electric Insulation, 5(4), p. 571 (1998) and Krupka et al., Proc. th The method is described in the International Conference on Dielectric Materials: Measurements and Applications, IEEE Conference Publication No. 430 (Sept. 1996). More specifically, a plate sample measuring 80 mm x 80 mm x 1 mm was inserted between two fixed dielectric resonators. The resonators measured the permittivity component in the plane of the specimen. Five samples were tested and the average value was recorded. Split-column resonators can be used to make dielectric measurements in the low-gigahertz region, such as from 1 GHz to 2 GHz.

[0114] Surface / Volume Resistivity: Surface and volume resistivity values are typically determined according to IEC 60093 (similar to ASTM D257-14). According to this procedure, a standard specimen (e.g., a 1-meter cube) is placed between two electrodes. A voltage is applied for 60 seconds and the resistance is measured. Surface resistivity is the quotient of the potential gradient (in V / m) and the current per unit of electrode length (in A / m), and generally represents the resistance to leakage current along the surface of an insulating material. Because the four ends of the electrodes define a square, the lengths in the quotient cancel out, and the surface resistivity is reported in ohms, although the more descriptive unit ohm / square is also common. Volume resistivity is also measured as the ratio of the potential gradient parallel to the current in the material to the current density. In SI units, volume resistivity is numerically equal to the DC resistance (ohm-m) between opposing faces of a one-meter cube.

[0115] CIELAB brightness test (L * Color measurements were made using a DataColor 600 spectrophotometer with an integrating sphere in specular reflectance mode. Color coordinates were calculated according to ASTM D2244-11 using CIELAB units under illuminants D65 / 10°, A / 10°, or F2 / 10° observers.

[0116] Example 1

[0117] Sample 1 was prepared by blending 40 parts of a carbon black masterbatch comprising 50 wt.% carbon black particles in a liquid crystal polymer vehicle with 60 parts of a neat liquid crystal polymer resin (LCP 1) using a cubic blending method. Thus, the carbon black content of the blended resin was 20 wt.%. The measured surface resistivity of the 50 wt.% carbon black masterbatch was 7.7 × 10 5 ohm. The carbon black particles in the masterbatch were measured to have a number average primary particle size of 41 nm and a number average secondary particle size of 22 μm. Sample 2 is a carbon black masterbatch comprising 20 wt.% carbon black particles and 80 wt.% LCP 2. LCP 1 is formed from 43.86 mol.% HBA, 8.57 mol.% TA, 28.57 mol.% HQ, and 20 mol.% NDA. LCP 2 is formed from 2 mol.% HBA, 48 mol.% HNA, 25 mol.% BP, and 25 mol.% TA. The melting temperature of LCP2 is 350°C. The surface refractive indices of Samples 1 and 2 were measured and are provided in Table 1.

[0118] Table 1

[0119] sample forming Surface resistivity (ohm) CB masterbatch (50wt.% carbon black) 4-inch disc, 3mm thickness <![CDATA[7.7×10 5 ]]> Sample 1 4-inch disc, 3mm thickness <![CDATA[3.0×10 16 ]]> Sample 2 4-inch disc, 3mm thickness <![CDATA[1.3×10 6 ]]>

[0120] Example 2

[0121] Samples 3 to 10 are formed from liquid crystal polymer (LCP 1 or LCP 2), mica, glass powder, glass fiber, lubricant, and carbon black in the amounts shown in Table 2. The glass powder consists of milled fibers having a weight-average fiber length of 70 μm and a nominal diameter of 10 μm. The mica consists of flaky particles having an average particle size of 24 μm and an average aspect ratio of 80. In addition, the initial length of the glass fiber employed is 3 mm or 4 mm. The carbon black (CB MB 1) used in Samples 3 to 9 comes from the 50 wt.% masterbatch used in Sample 1. The carbon black (CB MB 2) used in Sample 10 comes from Sample 2 containing 20 wt.% carbon black. The dielectric properties of Samples 3 to 10 are measured and are shown in Table 2.

[0122] Table 2

[0123]

[0124]

[0125] Without departing from the spirit and scope of the present invention, those skilled in the art may make these and other modifications and variations to the present invention. In addition, it should be understood that the various aspects of the various embodiments may be interchangeable in whole or in part. Furthermore, those skilled in the art will understand that the foregoing description is by way of example only and is not intended to limit the present invention as further described in the appended claims.

Claims

1. A polymer composition comprising a liquid crystal polymer matrix and carbon black particles dispersed within the polymer matrix, the carbon black particles comprising from about 0.1 wt.% to about 3 wt.% of the composition, the composition exhibiting a dissipation factor less than 0.002 and a brightness (L) of about 60 or less when measured at a frequency of 10 GHz. * ).

2. The polymer composition according to claim 1, wherein The carbon black particles have a number average primary particle size of about 20 nm to about 60 nm as measured according to ASTM D3849-22.

3. The polymer composition according to claim 1, wherein The carbon black particles have a number average agglomerate particle size of about 5 μm to about 50 μm as measured according to ASTM D3849-22.

4. The polymer composition of claim 1 further comprising a filler in an amount from about 5 wt.% to about 50 wt.% of the composition.

5. The polymer composition according to claim 4, wherein The filler includes a fibrous filler.

6. The polymer composition according to claim 5, wherein The fibrous filler includes glass fibers.

7. The polymer composition according to claim 6, wherein The glass fibers have an average length of about 30 μm to about 150 μm.

8. The polymer composition according to claim 6, wherein The glass fibers have an aspect ratio of about 3 to about 15.

9. The polymer composition according to claim 4, wherein The filler includes a plate-like filler.

10. The polymer composition according to claim 9, wherein The plate-like filler includes mica.

11. The polymer composition according to claim 10, wherein The mica has an average particle size of about 10 μm to about 50 μm.

12. The polymer composition according to claim 10, wherein The mica has an average thickness of about 0.1 μm to about 1 μm.

13. The polymer composition according to claim 1, wherein The masterbatch composed of 20 wt.% of the carbon particles and 80 wt.% of the liquid crystal polymer resin exhibited a relative humidity of greater than 1×10 15 ohm surface resistivity.

14. The polymer composition according to claim 1, wherein The composition exhibits a lightness (L * ).

15. The polymer composition according to claim 1, wherein The composition exhibits a lightness (L * ).

16. The polymer composition according to claim 1, wherein The composition exhibits a lightness (L * ).

17. The polymer composition according to claim 1, wherein The composition exhibits a dissipation factor of less than 0.001 when measured at a frequency of 10 GHz.

18. The polymer composition according to claim 1, wherein The liquid crystal polymer comprises repeating units derived from one or more aromatic dicarboxylic acids, one or more aromatic hydroxycarboxylic acids, or a combination thereof.

19. The polymer composition according to claim 18, wherein The aromatic hydroxycarboxylic acid includes 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, or a combination thereof.

20. The polymer composition according to claim 18, wherein The aromatic hydroxycarboxylic acid includes terephthalic acid, isophthalic acid, 2,6-naphthalene dicarboxylic acid or a combination thereof.

21. The polymer composition according to claim 18, wherein The liquid crystal polymer further comprises repeating units derived from one or more aromatic diols.

22. The polymer composition according to claim 21, wherein The aromatic diol includes hydroquinone, 4,4'-biphenol or a combination thereof.

23. The polymer composition according to claim 1, wherein The liquid crystal polymer is wholly aromatic.

24. The polymer composition according to claim 1, wherein The liquid crystal polymer includes a repeating unit derived from 6-hydroxy-2-naphthoic acid in an amount of about 30 mol. % or more.

25. The polymer composition according to claim 1, wherein The liquid crystal polymer includes a repeating unit derived from 6-hydroxy-2-naphthoic acid in an amount of about 40 mol. % or more.

26. The polymer composition according to claim 1, wherein The liquid crystal polymer includes repeating units derived from 6-hydroxy-2-naphthoic acid and 4-hydroxybenzoic acid in a molar ratio of about 15 to about 40.

27. The polymer composition according to claim 1, wherein The liquid crystal polymer includes structural units represented by corresponding formulae (I), (II), (III) and (IV), wherein the amount of the structural unit (I) is 40 mol.% to 75 mol.%, the amount of the structural unit (II) is 8.5 mol.% to 30 mol.%, and the amount of the structural unit (IV) is 0.1 mol.% to 8 mol.% relative to all structural units: wherein Ar1 is 2,6-naphthalene, Ar2 is at least one group selected from 1,2-phenylene, 1,3-phenylene and 1,4-phenylene, Ar3 is at least one group selected from 1,3-phenylene, 1,4-phenylene and residues of compounds in which two or more phenylene groups are bonded to each other at corresponding para positions, and Ar4 is 1,4-phenylene.

28. The polymer composition according to claim 1, wherein The thermally conductive filler comprises less than 40 wt. % of the composition.

29. The polymer composition according to claim 1, wherein The polymer composition exhibits a -1 The melt viscosity is from about 10 Pa-s to about 200 Pa-s as measured at a shear rate of 100 Pa-s.

30. The polymer composition according to claim 1, wherein The polymer composition exhibits a dielectric constant of about 2 to about 4 when measured at a frequency of 10 GHz.

31. The polymer composition according to claim 1, wherein The composition is formed by melt blending a carbon black masterbatch containing the carbon black particles with the liquid crystal polymer.

32. The polymer composition according to claim 31, wherein The carbon black masterbatch includes about 15 wt.% to about 60 wt.% of the carbon black particles and about 40 wt.% to about 85 wt.% of a liquid crystal polymer.

33. The polymer composition according to claim 31, wherein The carbon black masterbatch has a mass of about 1×10 2 ohm or greater surface resistivity.

34. A film comprising the composition of claim 1.

35. A laminate comprising the film of claim 34 and a conductive layer adjacent to the film.

36. An antenna comprising a circuit board and an antenna element, wherein the circuit board comprises the laminate according to claim 35.

37. A connector comprising a molded part formed from the composition of claim 1.

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