Integrated human machine interface (HMI) chassis

Abstract

An integrated plastic human machine interface (HMI) chassis is provided that includes one or more input devices adjacent to an electromagnetic interference (EMI) shielding material, the one or more input devices and the electromagnetic interference (EMI) shielding material being thermofussed onto a printed circuit board (PCB) with a plurality of plastic hot pegs. An integrated plastic human machine interface (HMI) chassis can improve various electronic devices, such as laptops, tablets, laptops, desks, televisions, gaming devices, advertising displays, and the like.

Description

Field of the Invention

[0001] The present invention relates to a consolidated chassis for a human machine interface (HMI), such as a laptop computer, that is easily assembled and disassembled to recycle its thermoplastic components. Background of the Invention

[0003] Conventional laptop computers are constructed with materials and methods that are unsatisfactory in terms of sustainability and recycling. As those skilled in the art know, the "A" and "B" covers of a laptop are typically joined using one-way snap fits, tape, adhesives, and numerous screws and metal screw bosses. The joining methods vary based on the cost of the laptop. Before recycling can begin, these metal components, including metal threaded inserts, must be removed from the components in which they are embedded. The removal of these metal connectors and dissimilar materials poses a major disadvantage to the streamlined recycling of such assemblies.

[0004] WO / 2022 / 152560 in the name of Zhu et al. discloses a housing assembly based on a polycarbonate material, wherein at least the front cover and the back cover are easily recyclable due to their detachability into different parts of all components attached to the front cover or the back cover and which cannot be recycled together with the front cover or the back cover respectively. Snap fits, interference fits, predetermined breaking points and other means are used for easily removable but safe connection of the individual parts.

[0005] U.S. Patent No. 5,808,863 to Radloff et al. provides a computer system or other electronic device having two components that are easily attached and quickly detached. One of the components has a plurality of stakes projecting from one surface thereof, while the other component has a plurality of through-holes for receiving the stakes and a plurality of slots extending adjacent to the stakes. The stakes are formed adjacent to the holes on the other component to attach the second component to the first component, and a blade can be inserted into the slot to push the second component away from the first component and break the stakes for quick detachment of the components.

[0006] U.S. Patent No. 2011 / 199728 in the name of Reyes discloses a housing for an electronic device, the housing comprising a top wall operably connected to a bottom wall via side walls, a front wall operably connected to a rear wall via side walls, a locking mechanism operably connected to the side walls, and a mechanism for operably connecting an internal component to the housing, wherein the mechanism is operably connected to at least one wall of the housing.

[0007] Therefore, to reduce or eliminate the problem, there is a need in the art for laptop computer components containing a greater amount of homogenous plastic and fewer metal connectors so they can be removed and repaired or recycled more quickly than those manufactured according to the prior art. SUMMARY OF THE INVENTION

[0009] Therefore, the present invention reduces or eliminates the inherent problems in the art by removing metal components while maintaining the integrity of laptop components through intelligent design and the use of polycarbonate. As is known to those skilled in the art, polycarbonate excels in meeting this need given its robust property profile. The present invention minimizes the amount of metal components in laptop designs by using a more homogeneous plastic and incorporating "breakaway features" for those metal components that remain.

[0010] It is to be understood that the invention disclosed and described in this specification is not limited to the embodiments outlined in this "Summary". BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present invention will now be described for purposes of illustration and not limitation with reference to the accompanying drawings, in which:

[0013] Figure 1 An exploded view of the integrated laptop computer chassis of the present invention is provided;

[0014] Figure 2A Demonstrates electromagnetic interference (EMI) shielding heat staking methods;

[0015] Figure 2B Describes a molded-in wire channel.

[0016] Figure 3A Embedded electronics showing printed circuit boards connected directly to the chassis;

[0017] Figure 3B Showing the plastic insert ultrasonically welded to the main chassis frame;

[0018] Figure 3CDepicts the plastic tabs used to hold components in tension;

[0019] Figure 3D Shows embedded LEDs or other electronic sensors and traces co-molded into the chassis;

[0020] Figure 4 supply Figure 3A Magnified view of;

[0021] Figure 5A Components showing welding of "C" and "D" caps to provide a homogeneous structure;

[0022] Figure 5B Depict the cross section before ultrasonic welding;

[0023] Figure 6A Shows a push-button release molded into the chassis;

[0024] Figure 6B Shows a micro-textured exterior surface designed to hide scratches;

[0025] Figure 7 Depicts heat-soldered components (shown here are the keyboard and trackpad);

[0026] Figure 8 Graphic showing the film insert molded into the C-cap; and

[0027] Figure 9 A break-away feature is shown that allows recycling of a large portion of the polycarbonate. Detailed Description of the Invention

[0029] The invention will now be described for purposes of illustration and not limitation.Except in the operating examples, or unless otherwise indicated herein, all numbers expressing amounts, percentages, and so forth in this specification are to be understood as being modified in all instances by the term "about."

[0030] Any numerical range listed in this specification is intended to include all subranges of the same numerical precision within the listed range. For example, the range of "1.0 to 10.0" is intended to be included between the listed minimum value 1.0 and the listed maximum value 10.0 (and including the listed minimum value 1.0 and the listed maximum value 10.0), that is, all subranges with a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Any maximum numerical limit (limitation) listed in this specification is intended to include all lower numerical limits included therein, and any minimum numerical limit listed in this specification is intended to include all higher numerical limits included therein. Accordingly, the applicant reserves the right to revise this specification (including claims) to expressly list any subranges within the scope expressly listed herein. All such ranges are intended to be inherently described in this specification so that the revision of any such subranges expressly listed will meet the requirements of 35 U.S.C. § 112 (a) and 35 U.S.C. § 132 (a). The various embodiments disclosed and described in this specification can comprise, consist of, or consist essentially of the features and characteristics as variously described herein.

[0031] Unless otherwise indicated, any patent, publication, or other disclosure identified herein is incorporated by reference in its entirety into this specification, but only to the extent that the incorporated material does not conflict with existing definitions, statements, or other disclosures expressly set forth in this specification. Therefore, and to the extent necessary, the express disclosure as set forth in this specification supersedes any conflicting material incorporated herein by reference. Any material, or portion thereof, that is allegedly incorporated by reference into this specification but conflicts with existing definitions, statements, or other disclosures set forth herein is incorporated only to the extent that there is no conflict between the incorporated material and the existing disclosure. Applicants reserve the right to amend this specification to expressly set forth any subject matter, or portion thereof, incorporated herein by reference.

[0032] References throughout this specification to "various non-limiting embodiments," "certain embodiments," etc., mean that a particular feature or characteristic may be included in one embodiment. Thus, the use of the phrases "in various non-limiting embodiments," "certain embodiments," etc., in this specification does not necessarily refer to the same embodiment, and may refer to different embodiments. Furthermore, particular features or characteristics may be combined in any suitable manner in one or more embodiments. Thus, without limitation, particular features or characteristics illustrated or described in connection with various or certain embodiments may be combined in whole or in part with features or characteristics of one or more other embodiments. Such modifications and variations are intended to be included within the scope of this specification.

[0033] As used herein, the grammatical articles "a," "an," and "the" are intended to include "at least one" or "one or more," unless otherwise indicated, even though "at least one" or "one or more" are expressly used in some instances. Thus, these articles are used in this specification to indicate one or more than one (i.e., "at least one") of the grammatical object of the article. For example, and not limitation, "a component" refers to one or more components, and thus more than one component may be contemplated, employed, or used in the practice of the described embodiments. Furthermore, unless the context of the usage requires otherwise, the use of a singular noun includes the plural, and the use of a plural noun includes the singular.

[0034] In certain embodiments, the present invention can include a sliding clip in the form of a "C" shaped channel (i.e., a "C" shaped cross section) to hold components containing integrated flanges tightly together, similar to a clamp (e.g., allowing an LCD screen to be non-permanently clamped in a laptop). The assembly can take two different configurations: a clamshell with flange, or a vertical slide with a set screw.

[0035] Various embodiments may include disconnect features for in-mold metal parts, such as predetermined breaking points (designed fragile points that are destroyed when needed or under specific undefined tools). Other embodiments may include one or more plastic heat-stakes to replace metal versions. Selected embodiments may include one or more press-on grommets to replace screws and facilitate repeated assembly / disassembly. In other embodiments, thermoplastic parts of the same material can be connected via welding. In certain embodiments, intermittent welding (also known as "seam welding" or "jump welding") can be used between thermoplastic parts. In various embodiments, hot melt welding can be used instead of glue to fasten electromagnetic interference (EMI) shielding metal foil in place. Welded cover components that allow unique disassembly benefits to be achieved (i.e., the joined cover slides laterally on the circuit board instead of the flip-top) are included in various embodiments.

[0036] The present invention reduces the amount of hardware and inserts, and reduces the use of glues and adhesives in plastic enclosures designed for human machine interfaces (HMIs), which improves the speed and ease of routine service or de-manufacturing, reduces the amount of paint and coatings required, and relies on more homogeneous components.

[0037] In a first embodiment, the present invention is directed to an integrated plastic human-machine interface (HMI) chassis comprising: one or more input devices adjacent to an electromagnetic interference (EMI) shielding material, the one or more input devices and the electromagnetic interference (EMC) shielding material being heat-soldered to a printed circuit board (PCB) using a plurality of plastic heat-screws, wherein the printed circuit board is removably attached to the integrated plastic human-machine interface (HMI) chassis using a plurality of metal screws connected to a plurality of plastic threaded inserts, wherein the integrated plastic human-machine interface (HMI) chassis includes a plurality of plastic buttons molded into a first channel, wherein the plurality of plastic buttons are sized, shaped, and configured to snap into slots in a lower cover, The integrated plastic human-machine interface (HMI) chassis is securely locked into the lower cover when a first channel of the plastic chassis slides between the plastic component and the lower cover, wherein the plastic component and the lower cover are optionally ultrasonically welded together, wherein a power supply is held in place in a second channel of the integrated plastic human-machine interface (HMI) chassis, wherein the second channel has a plastic tab, wherein the plastic tab optionally has an injection-molded wire trough, wherein one or more optional audio output devices are removably mounted to the integrated plastic human-machine interface (HMI) chassis with one of a metal screw and a plastic insert, and wherein one or more optional seamless optical input devices are removably mounted directly to the integrated plastic human-machine interface (HMI) chassis by a snap fit.

[0038] In a second embodiment, the present invention is directed to a method for recycling an integrated plastic human-machine interface (HMI) chassis according to the preceding paragraph, comprising: (a) disassembling the chassis, (b) removing any non-plastic components, (c) mechanically shredding the chassis, (d) at least one of cleaning, disinfecting and sorting the chassis, (e) subjecting the chassis to at least one of pyrolysis and chemical decomposition to obtain monomers, (f) polymerizing the monomers to produce polymers, and (g) optionally pelletizing the polymers.

[0039] The integrated plastic human machine interface (HMI) chassis of the present invention can be retrofitted into laptops, tablets, notebooks, desktops, televisions, gaming devices, advertising displays, battery packs, monitors, cameras, servers, access controls, point-of-sale devices, e-readers, projectors, thermostats, home automation portals, kitchen appliances, automotive components, healthcare devices, surgical devices, smart hubs, mobile phones, GPS receivers, transceivers, remote controls, headlights, control electronics, routers - WLAN or LAN, wired or wireless access points, and power supplies.

[0040] In various embodiments, the present invention relates to plastic chassis for human-machine interfaces (HMIs), such as electrical and electronic devices and appliances, particularly laptop computer covers, that are made to the greatest extent possible from thermoplastic materials. The plastic chassis provides improved sustainability because it uses less metal hardware, inserts, glues, adhesives, lacquers, coatings, and comprises larger homogenous thermoplastic components to make end-of-life recycling easier. The plastic chassis of the present invention is also easier to disassemble for servicing or repair.

[0041] In certain embodiments, the plastic chassis of the present invention may include one or more sliding clips in the form of "C"-shaped channels (i.e., "C"-shaped cross-sections) to hold components including integrated flanges tightly together, similar to a clamp. (For example, to allow an LCD screen to be non-permanently clamped in a laptop computer). The one or more clips may be made of materials such as plastic (preferably the same plastic as the plastic chassis), metal, rubber, thermoplastic polyurethane (TPU), and combinations of these materials.

[0042] The molded components of the chassis of the present invention are made of molded plastic material, and are preferably made of substantially the same plastic material. Preferably, each of these components comprises 50-100% of the same material. In other preferred embodiments, these components comprise at least 60%, at least 70%, or at least 80% of the same material. In a preferred embodiment, the molded components comprise at least 90% of the same material, or even 100% of the same material.

[0043] In selected embodiments, the plastic chassis of the present invention comprises a thermoplastic composition comprising A) an aromatic polycarbonate, B) a polyether polyol, and optionally, C) at least one additive selected from flame retardants, anti-drip agents, impact modifiers, fillers, antistatic agents, colorants, pigments, heat stabilizers different from component B, lubricants, mold release agents, UV absorbers, IR absorbers, hydrolysis stabilizers, and compatibilizers.

[0044] Component A

[0045] According to the present invention, "polycarbonate" is understood to mean homopolycarbonates and copolycarbonates, in particular polycarbonates. These polycarbonates can be linear or branched in a known manner. According to the present invention, it is also possible to use mixtures of polycarbonates.

[0046] "Polycarbonate material" or "polycarbonate material" is a thermoplastic material that preferably comprises at least 50 wt% polycarbonate, more preferably at least 60 wt% polycarbonate, even more preferably at least 65 wt% polycarbonate.

[0047] According to the polycarbonate used in the present invention, a part (up to 80 mole %, preferably 20 mole % to 50 mole % at the most) of the carbonate groups can be substituted by aromatic dicarboxylic acid ester groups. This type of polycarbonate in which the acid groups from carbonic acid and from aromatic dicarboxylic acids are incorporated into the molecular chain is referred to as "aromatic polyester carbonate". In the context of the present invention, they are covered by the umbrella term "thermoplastic aromatic polycarbonate". The substitution of the aromatic dicarboxylic acid ester groups for the carbonate groups is carried out substantially with stoichiometry and quantitatively so that the molar ratio of reactants (reaction partners) can also be found in finished product (finished) polyester carbonate. The incorporation of dicarboxylic acid ester groups can be statistical and blocky.

[0048] In various embodiments, thermoplastic polycarbonates, including thermoplastic aromatic polyester carbonates, have a weight average molecular weight, M, as determined by gel permeation chromatography using CHCl as a diluent, of from 10,000 g / mol to 35,000 g / mol, in certain embodiments from 12,000 g / mol to 32,000 g / mol, in selected embodiments from 15,000 g / mol to 32,000 g / mol, and in specific embodiments from 20,000 g / mol to 31,500 g / mol. w Gel permeation chromatography was performed under the following conditions: calibration with linear polycarbonate (made from bisphenol A and phosgene) with known molecular weight distribution (standards from PSS Polymer Standards Service GmbH, Germany), calibration according to method 2301-0257502-09D from Currenta GmbH & Co. OHG, Leverkusen (German version from 2009). Diluent: dichloromethane. Column combination from crosslinked styrene-divinylbenzene resin. Diameter of the analytical column: 7.5 mm, length: 300 mm. Particle size of the column material: 3 μm to 20 μm. Concentration of the solution: 0.2 wt %. Flow rate: 1.0 ml / min, solution temperature: 30° C. Detection was by means of a refractive index (RI) detector.

[0049] Details regarding the preparation of polycarbonates have been disclosed in numerous patent documents over the past approximately 60 years. Reference may be made here to Schnell, "Chemistry and Physics of Polycarbonates", Polymer Reviews, Vol. 9, Interscience Publishers, New York, London, Sydney 1964, to D. Freitag, U. Grigo, P.R. Müller, H. Nouvertné, BAYER AG, "Polycarbonates" in Encyclopedia of Polymer Science and Engineering, Vol. 11, 2nd edition, 1988, pp. 648-718, and finally to U. Grigo, K. Kirchner and P.R. Müller "Polycarbonate" [Polycarbonates] in Becker / Braun, Kunststoff-Handbuch [Plastics Handbook], Vol. 3 / 1, Polycarbonate, Polyacetale, Polyester, Celluloseester [Polycarbonates, Polyacetals, Polyesters, CelluloseEsters], Carl Hanser Verlag Munich, Vienna 1992, pp. 117-299.

[0050] Various methods for preparing polycarbonates, including polyester carbonates, that can be used in the present invention are interfacial and melt transesterification (eg, US Pat. Nos. 5,097,002; 5,340,905; 5,717,057; 6,596,840; 6,740,730; and 7,071,284).

[0051] Aromatic polycarbonates are prepared, for example, by reacting dihydroxyaryl compounds with carbonyl halides, preferably phosgene, and / or with aromatic dicarbonyl dihalides, preferably phenylenedicarbonyl dihalides, by an interfacial process, optionally using chain terminators and optionally using trifunctional or more than trifunctional branching agents, wherein, to prepare polyester carbonates, a portion of the carbonic acid derivatives is replaced by aromatic dicarboxylic acids or dicarboxylic acid derivatives, i.e., by dicarboxylic acid ester structural units, corresponding to the carbonate structural units in the aromatic polycarbonate. It is likewise possible to prepare the polycarbonates by reacting dihydroxyaryl compounds with, for example, diphenyl carbonate via a melt polymerization process.

[0052] Suitable dihydroxyaryl compounds for preparing polycarbonates are those of formula (1)

[0053] HO-Z-OH(1),

[0054] in

[0055] Z is an aromatic group having 6 to 30 carbon atoms, which may contain one or more aromatic rings, may be substituted, and may contain aliphatic, alicyclic groups, alkylaryl groups or heteroatoms as bridging elements.

[0056] Preferably, Z in formula (1) is a group of formula (2)

[0057]

[0058] in

[0059] R 6 and R 7 Each independently represents H, C1-C 18 -alkyl-, C1-C 18 -alkoxy, halogen such as Cl or Br or in each case optionally substituted aryl or aralkyl, in some embodiments H or C1-C 12 -alkyl, in certain embodiments H or C1-C8-alkyl, and in selected embodiments H or methyl, and

[0060] X is a single bond, -SO2-, -CO-, -O-, -S-, C1-C6-alkylene, C2-C5-alkylidene or C5-C6-cycloalkylidene, which may be substituted by C1-C6-alkyl, preferably methyl or ethyl, or a C6-C6-alkylidene which may be optionally fused to another aromatic ring containing heteroatoms. 12 -arylene group.

[0061] In various embodiments, X is a single bond, C1-C5-alkylene, C2-C5-alkylidene, C5-C6-cycloalkylidene, -O-, -SO-, -CO-, -S-, -SO2-, or a group of formula (2a)

[0062]

[0063] Examples of dihydroxyaryl compounds suitable for preparing the polycarbonates used in accordance with the present invention include, but are not limited to, hydroquinone, resorcinol, dihydroxydiphenyl, bis(hydroxyphenyl)alkanes, bis(hydroxyphenyl)cycloalkanes, bis(hydroxyphenyl)sulfides, bis(hydroxyphenyl)ethers, bis(hydroxyphenyl)ketones, bis(hydroxyphenyl)sulfones, bis(hydroxyphenyl)sulfoxides, α,α′-bis(hydroxyphenyl)diisopropylbenzene, and alkylated, ring-alkylated, and ring-halogenated compounds thereof.

[0064] Useful dihydroxyaryl compounds are 4,4′-dihydroxydiphenyl, 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), 2,4-bis(4-hydroxyphenyl)-2-methylbutane, dimethylbisphenol A, 1,1-bis(4-hydroxyphenyl)-p-diisopropylbenzene, 2,2-bis(3-methyl-4-hydroxyphenyl)propane, 2,2-bis(3-methyl-4-hydroxyphenyl)propane, bis(3,5-dimethyl-4 -hydroxyphenyl)methane, 2,2-bis(3,5-dimethyl-4-hydroxyphenyl)propane, bis(3,5-dimethyl-4-hydroxyphenyl)sulfone, 2,4-bis(3,5-dimethyl-4-hydroxyphenyl)-2-methylbutane, 1,1-bis(3,5-dimethyl-4-hydroxyphenyl)-p-diisopropylbenzene and 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane as well as bisphenols (I) to (III)

[0065]

[0066] R' is in each case C1-C4-alkyl, aralkyl or aryl, in certain embodiments methyl or phenyl, in selected embodiments methyl.

[0067] In certain embodiments, the dihydroxyaryl compounds include 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), 2,2-bis(3,5-dimethyl-4-hydroxyphenyl)propane, 1,1-bis(4-hydroxyphenyl)cyclohexane and 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane (bisphenol TMC) and dimethyl bisphenol A as well as dihydroxyaryl compounds of formula (I), (II) and (III).

[0068] For example, in U.S. Patent Nos. 2,991,273; 2,999,835; 2,999,846; 3,148,172; 3,271,367; 4,982,014; DE 2036052 A and DE 3832396 A; in French Patent Application 1561518A1; GB1122003; GB1229482; GB1341318; GB1367790; in the monograph H. Schnell, Chemistry and Physics of Polycarbonates, Interscience Publishers, New York 1964, pages 28 et seq.; pages 102 et seq., and in DG Legrand, JT Bendler, Handbook of Polycarbonate Science and Technology, Marcel Dekker, New York These and other suitable dihydroxyaryl compounds are described in 2000, pages 72 et seq.

[0069] In the case of homopolycarbonates, only one dihydroxyaryl compound is used; in the case of copolycarbonates, two or more dihydroxyaryl compounds are used. The dihydroxyaryl compounds used, as well as the components of the compositions used according to the present invention, like all other chemicals and adjuvants added to the synthesis, may be contaminated by contaminants from their own synthesis, handling, and storage. However, it is desirable to use the purest possible raw materials.

[0070] Examples of suitable carbonic acid derivatives include phosgene and diphenyl carbonate.

[0071] Suitable chain terminators useful in the preparation of polycarbonates are monophenols. Suitable monophenols include, for example, phenol itself, alkylphenols such as cresol, p-tert-butylphenol, cumylphenol, and mixtures thereof.

[0072] In various embodiments, the chain terminator comprises a straight or branched C1-C 30 -alkyl mono- or polysubstituted phenols. In selected embodiments, the chain terminators are phenol, cumylphenol and p-tert-butylphenol. The amount of chain terminators used can be from 0.1 to 5 mol %, based on the moles of dihydroxyaryl compound used in each case. The chain terminators can be added before, during or after the reaction with the carbonic acid derivative.

[0073] Suitable branching agents include trifunctional or greater compounds familiar from polycarbonate chemistry, particularly those having three or more phenolic OH groups. Examples of suitable branching agents include, but are not limited to, 1,3,5-tris(4-hydroxyphenyl)benzene, 1,1,1-tris(4-hydroxyphenyl)ethane, tris(4-hydroxyphenyl)phenylmethane, 2,4-bis(4-hydroxyphenylisopropyl)phenol, 2,6-bis(2-hydroxy-5′-methylbenzyl)-4-methylphenol, 2-(4-hydroxyphenyl)-2-(2,4-dihydroxyphenyl)propane, tetrakis(4-hydroxyphenyl)methane, tetrakis(4-(4-hydroxyphenylisopropyl)phenoxy)methane, and 1,4-bis((4′,4″- (dihydroxytriphenyl)methyl)benzene and 3,3-bis(3-methyl-4-hydroxyphenyl)-2-oxo-2,3-dihydroindole. The amount of any branching agent to be used may be 0.05 mol% to 2.00 mol%, based on the number of moles of the dihydroxyaryl compound used in each case. The branching agent can be initially charged in a basic aqueous phase together with the dihydroxyaryl compound and the chain terminator before phosgenation, or dissolved in an organic solvent and added. In the case of the transesterification method, the branching agent is used together with the dihydroxyaryl compound.

[0074] In various embodiments, the polycarbonate is a homopolycarbonate based on bisphenol A, a homopolycarbonate based on 1,3-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, and a copolycarbonate based on the two monomers bisphenol A and 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, as well as a homo- or copolycarbonate derived from a dihydroxyaryl compound of formula (I) to (III)

[0075]

[0076] wherein R′ is in each case C1-C4-alkyl, aralkyl or aryl, in certain embodiments methyl or phenyl, in selected embodiments methyl, and in a specific embodiment bisphenol A is used as a comonomer.

[0077] To facilitate the incorporation of additives, component A may be used in the form of a powder, pellets or a mixture thereof.

[0078] In various embodiments, the polycarbonate has a 3 / (10 min), in certain embodiments 5.5 to 12 cm 3 / (10min), in the selected embodiment 6 to 10cm 3 MVR of 300° C. / (10 min) determined according to ISO 1133:2012-03 at a test temperature of 300° C. and a load of 1.2 kg.

[0079] Mixtures of different polycarbonates can be used as component A, for example a mixture of polycarbonates A1 and A2, where A2 is a polycarbonate in powder form. As used herein, the properties of the polycarbonates relate to the corresponding mixtures.

[0080] In various embodiments, the composition contains 50 to 98.5 weight percent, in some embodiments 69.85 to 98.0 weight percent, in certain embodiments 85 to 97.5 weight percent, in selected embodiments 90.0 to 97.5 weight percent, and in specific embodiments 93.0 to 97.5 weight percent aromatic polycarbonate.

[0081] Component B

[0082] Component B comprises one or more stabilizers in the form of polyether polyols. As known to those skilled in the art, polyether polyols are polymerization products of epoxides such as ethylene oxide (EO), propylene oxide (PO), butylene oxide, styrene oxide and epichlorohydrin with themselves or by adding such epoxides, optionally in admixture or sequentially, to starting components having reactive hydrogen atoms, such as water, alcohol, ammonia or amines. Such "starter molecules" generally have a functionality of 1 to 6. Depending on process control, such polyether polyols can be homopolymers, block copolymers, random copolymers, end-capped polymers or polymers tipped with a mixture of different epoxides.

[0083] To specify such polyether polyols, various characteristics have been established in the art:

[0084] i) the hydroxyl functionality, which depends on the starter molecule from which the polyether polyol synthesis begins,

[0085] ii) hydroxyl number or OH value, which is a measure of the hydroxyl content expressed in mg KOH / g, determined according to DIN 53240-3:2016-03,

[0086] iii) when epoxides are used in which the ring opening leads to the formation of different (i.e. primary or secondary) hydroxyl groups, specifying, on the one hand, the proportions of the individual epoxides in the polyether polyol and, on the other hand, the proportions of the primary or secondary hydroxyl groups, based on the total number of hydroxyl groups present in the polyether polyol, and

[0087] iv) Molecular weight (M n or M w ), which is a measure of the polyoxyalkylene chain length of the polyether polyol.

[0088] In various embodiments, the polyether polyols have a number average molecular weight, M, of 100 to 6200 g / mol, in certain embodiments 1500 to 4000 g / mol, and in selected embodiments 1800 to 3000 g / mol. n , where M n Calculated according to the following formula:

[0089] M n =56100*F / OHN.

[0090] The OH number (OHN) is determined according to DIN 53240-3:2016-03 via hydroxyl end group titration. The OHN in mg KOH / g is inserted into the given formula. F is the functionality, which in the context of the present invention relates to the hydroxyl end groups. Acid end groups, if any, are not taken into account. F is defined as the number of hydroxyl end groups divided by the number of molecules in the population, which means that F is the average number of hydroxyl end groups of the compound molecules. F is usually apparent from the recipe used to prepare the polyol, but can alternatively be determined by 1 H NMR determination.

[0091] In various embodiments, the polyether polyols can be formed from repeating ethylene oxide and propylene oxide units, for example having a share of 35 to 100 weight percent propylene oxide units, in certain embodiments 50 to 100 weight percent propylene oxide units. The copolymers can be statistical copolymers, gradient copolymers, alternating copolymers, or block copolymers formed from ethylene oxide and propylene oxide. In selected embodiments, the polyether polyols are linear polymers.

[0092] Useful polyether polyols are those formed from repeating propylene oxide units with 1,2-diol as the starter molecule, more preferably propylene glycol as the starter molecule. The polyether polyols may be end-capped. In selected embodiments, the polyether polyols are end-capped. A preferred agent for end-capping is dihydropyran (3,4-dihydro-2H-pyran).

[0093] Suitable polyether polyols formed from repeating propylene oxide and / or ethylene oxide units are, for example, DESMOPHEN, ACCLAIM, ARCOL, BAYCOLL, BAYFILL, BAYFLEX, BAYGAL, PET, polyether polyols from Covestro Deutschland AG (e.g. DESMOPHEN 3600Z, DESMOPHEN 1900U, ACCLAIM Polyol 2200, ACCLAIM Polyol 4000I, ARCOL Polyol 1004, ARCOL Polyol 1010, ARCOL Polyol 1030, ARCOL Polyol 1070, BAYCOLL BD 1110, BAYFILL VPPU 0789, BAYGAL K55, PET 1004, POLYETHERS 180). Further suitable homopolyethylene oxides are, for example, PLURIOL E polyols from BASF SE. Suitable homopolypropylene oxides are, for example, PLURIOL P polyols from BASF SE, or MULTRANOL polyols from Covestro Deutschland AG, SYNALOX polyols from The Dow Chemical Company and CARADOL polyols from Shell Chemicals. Suitable mixed copolymers of ethylene oxide and propylene oxide are, for example, PLURONIC PE or PLURIOL RPE polyols from BASF SE.

[0094] In certain embodiments, the polyether polyols may be those formed from repeating propylene oxide units with propylene glycol as a starter molecule, having an OH number in the range of 50 to 70 mg KOH / g, determined in accordance with DIN 53240-3:2016-03, and having a hydroxyl functionality of 2, a proportion of primary hydroxyl groups in the range of 0 to 3%, based on the sum of the primary and secondary hydroxyl groups, having a propylene oxide content of at least 95% by weight and an ethylene oxide content of at most 3% by weight, in selected embodiments, without any ethylene oxide units but only propylene oxide units.

[0095] The compositions useful in the present invention may contain a polyether polyol in an amount from 0.1 to 5 weight percent in various embodiments, from 0.1 to 2 weight percent in certain embodiments, from 0.5 to 1 weight percent in selected embodiments, and from 0.5 to 1.0 weight percent in specific embodiments, wherein all weight percents are based on the weight of the composition.

[0096] Component C

[0097] The compositions useful in the present invention optionally may contain additives known to those skilled in the art, including, but not limited to, flame retardants, anti-drip agents, impact modifiers, fillers, antistatic agents, colorants, pigments, heat stabilizers other than component B, lubricants, mold release agents, UV absorbers, IR absorbers, hydrolysis stabilizers, and compatibilizers.

[0098] Such additives, which are typically added in the case of polycarbonates, are described, for example, in US Pat. Nos. 5,288,778; 5,821,380; and 5,883,165 and in "Plastics Additives Handbook", Hans Zweifel, 5th edition, 2000, Hanser Verlag, Munich.

[0099] The amount of such additives is up to 30 weight percent in various embodiments, up to 10 weight percent in some embodiments, up to 6 weight percent in certain embodiments, 0.01 to 3 weight percent in selected embodiments, and 1 weight percent in specific embodiments, wherein all values are referenced to the composition and include the upper limit.

[0100] Useful release agents include, but are not limited to, pentaerythritol tetrastearate (PETS), glycerol monostearate (GMS), their carbonates, and mixtures of any of these.

[0101] In various embodiments, up to 0.1% by weight, in certain embodiments, 0.0001% to 0.001% by weight, and in selected embodiments, 0.0004% to 0.001% by weight of one or more colorants are used as additives. The amount of "one or more to 0.001% by weight" refers to a colorant comprising a total of up to 0.001% by weight (including endpoints). In a mixture of two or more colorants, the upper limit of the colorant mixture is 0.001% by weight. If it is intended to compensate for the minimum discoloration (if present) after irradiation, a colorant can be included to improve the visual impression. However, compositions that do not contain any colorant can also be used. Even more colorants can also be used.

[0102] Colorants or pigments that can be used in the context of the present invention include, for example, sulfur-containing pigments such as cadmium red or cadmium yellow, pigments based on iron cyanide such as Prussian blue, oxide pigments such as titanium dioxide, zinc oxide, red iron oxide, black iron oxide, chromium oxide, titanium yellow, zinc-iron-based brown, titanium-cobalt-based green, cobalt blue, copper-chromium-based black, copper-iron-based black, or chromium-based pigments such as chrome yellow, phthalocyanine-based colorants such as copper phthalocyanine blue or copper phthalocyanine green, condensed polycyclic colorants and pigments such as those of azo groups (e.g. nickel-azo yellow), sulfur-indigo colorants, perinone-based, perylene-based, quinacridone-based, dioxazinyl, isoindolinone-based and quinophthalone-based derivatives, anthraquinone-based heterocyclic systems.

[0103] Specific examples of colorants include, but are not limited to, commercial products such as MACROLEX Blue RR, MACROLEX Violet 3R, MACROLEX Red EG, MACROLEX Violet B (Lanxess AG, Germany), SUMIPLAST Violet RR, SUMIPLAST Violet B, SUMIPLAST Blue OR, (Sumitomo Chemical Co., Ltd.), DIARESINViolet D, DIARESIN Blue G, DIARESIN Blue N (Mitsubishi Chemical Corporation), HELIOGEN Blue, and HELIOGEN Green (BASF AG, Germany). Further suitable colorants are, for example, AMAPLAST Yellow GHS (CAS 13676-91-0; Solvent Yellow 163; CI 58840); KEYPLAST Blue KR (CAS 116-75-6; Solvent Blue 104; CI 61568), HELIOGEN BLUE types (e.g. HELIOGEN BLUE K 6911; CAS 147-14-8; Pigment Blue 15:1; CI 74160) and HELIOGEN GREEN types (e.g. HELIOGEN GREEN K 8730; CAS 1328-53-6; Pigment Green 7; CI 74260). Cyanine derivatives, quinoline derivatives, anthraquinone derivatives, phthalocyanine derivatives may be particularly useful.

[0104] Suitable pigments include, but are not limited to, titanium dioxide, talc, wollastonite, and mica. In various embodiments, carbon black may be a suitable pigment, although where carbon black is used, the amount is very low, i.e., only up to <0.1 wt %, to avoid any effect of coloration by the carbon black.

[0105] In certain embodiments, compositions containing blue and / or violet colorants can be used to partially compensate for the yellow visual impression caused by radiation damage. In combination with a stabilizer combination, this results in a minimally colored, ready-to-use preparation.

[0106] Optionally, the composition may include a UV absorber. UV absorbers are those that have the lowest possible transmittance below 400 nm and the highest possible transmittance above 400 nm. Such UV absorbers are known in the art and are described, for example, in U.S. Patent Nos. 5,288,778; 5,821,380; and 5,883,165. UV absorbers particularly suitable for use in compositions according to the present invention are selected from benzotriazoles, triazines, benzophenones, and arylated cyanoacrylates.

[0107] Particularly suitable UV absorbers are hydroxybenzotriazoles, such as 2-(3′,5′-bis(1,1-dimethylbenzyl)-2′-hydroxyphenyl)benzotriazole (TINUVIN 234, BASF), 2-(2′-hydroxy-5′-(tert-octyl)phenyl)benzotriazole (TINUVIN 329, BASF), bis(3-(2H-benzotriazolyl)-2-hydroxy-5-tert-octyl)methane (TINUVIN 360, BASF), 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-(hexyloxy)phenol (TINUVIN 1577, BASF), and benzophenones, such as 2,4-dihydroxybenzophenone (CHIMASSORB 22, BASF) and 2-hydroxy-4-(octyloxy)benzophenone (CHIMASSORB 81, BASF), 2,2-bis[[(2-cyano-1-oxo-3,3-diphenyl-2-propenyl)oxy]methyl]-1,3-propanediyl ester (9CI) (UVINUL 3030, BASF AG), 2-[2-hydroxy-4-(2-ethylhexyl)oxy]phenyl-4,6-bis(4-phenyl)phenyl-1,3,5-triazine (TINUVIN 1600, BASF), tetraethyl 2,2'-(1,4-phenylenedimethylene)bismalonate (HOSTAVIN B-Cap, Clariant), or N-(2-ethoxyphenyl)-N'-(2-ethylphenyl)ethanediamide (TINUVIN 312, CAS No. 23949-66-8, BASF). Particularly preferred specific UV absorbers are TINUVIN 360, TINUVIN 329 and / or TINUVIN 312, very particular preference being given to TINUVIN 329 and TINUVIN 312. It is also possible to use mixtures of these UV absorbers.

[0108] Suitable IR absorbers are described in various patents, including U.S. Patent Nos. 7,074,351; 7,169,834; 8,153,239; and U.S. Patent Publication No. 2005 / 0165148. Of those mentioned in the literature, IR absorbers based on borides and / or tungstates, particularly cesium tungstate or zinc-doped cesium tungstate, and IR absorbers based on ITO or ATO, and combinations thereof, are particularly useful.

[0109] Suitable impact modifiers are core-shell impact modifiers, including but not limited to acrylonitrile butadiene styrene (ABS), copolymers of methyl methacrylate, acrylonitrile, butadiene and styrene (MBS), acryl-based, silicone-acryl-based impact modifiers, and non-core-shell impact modifiers.

[0110] The polycarbonate compositions useful according to the present invention may contain conventional amounts of organic and inorganic fillers. Suitable fillers include, but are not limited to, chalk, quartz powder, titanium dioxide, silicates, aluminosilicates such as talc, wollastonite, montmorillonite (also modified by ion exchange), kaolin, zeolite, vermiculite, aluminum oxide, and silicon dioxide. Mixtures of these fillers, or mixtures of these and other fillers, may also be used.

[0111] Polytetrafluoroethylene can be used as an anti-drip agent.

[0112] Sulfur-containing stabilizers may be used, including but not limited to 3,3′-thiodipropionic acid, distearyl disulfide (HOSTANOX SE 10, Clariant), pentaerythritol tetrakis(3-laurylthiopropionate) (SOGNOX 4120, Songwon International AG), and bis(phenylsulfonyl)methane.

[0113] The polymer compositions useful in the present invention, comprising components A, B, and optionally C, are prepared by standard incorporation methods by combining, mixing, and homogenizing the individual ingredients, wherein homogenization is carried out, in particular, in the melt under the action of shear forces. If appropriate, powder premixes are used for combining and mixing before melt homogenization occurs. For all components used, it is desirable to use the purest possible compounds.

[0114] Various embodiments may use a granular premix, or a premix of granules and powders, with components B and optionally C. Other embodiments may use a premix prepared from a solution of the mixture components in a suitable solvent, in which case homogenization and removal of the solvent are optionally performed in solution.

[0115] Components B and optionally C can be introduced into the polycarbonate by known methods or as a masterbatch. In selected embodiments, a masterbatch is used for incorporating component C into the masterbatch.

[0116] In this context, the compositions useful in the present invention can be combined, mixed, homogenized, and subsequently extruded in conventional apparatuses such as screw extruders (e.g., TSE twin-screw extruders), kneaders, or BRABENDER or BANBURY mills. In these embodiments, the extrudate can be cooled and comminuted after extrusion. It is also possible to premix the individual components and add the remaining starting materials separately and / or in a mixed batch.

[0117] In various embodiments, the premixes can be combined and mixed in the melt in the plasticating unit of the injection molding machine. In these embodiments, the melt is converted directly into a molded body in a subsequent step.

[0118] The production of molded parts from the compositions according to the present invention may be achieved in various embodiments by injection molding, extrusion, or rapid thermal cycle molding.

[0119] Such compositions can be used to make injection molded parts or extrudates for human-machine interfaces (HMIs). Injection molded parts and extrudates are understood to be molded polycarbonates, such as the laptop computer chassis exemplified in this specification. The chassis of the present invention is preferably made of homogenous polycarbonate to promote efficient recycling. The present invention also includes plastic chassis for human-machine interfaces (HMIs), such as kitchen appliances, automotive applications, healthcare devices, surgical devices, smart home devices (e.g., smart hubs), computers (including laptop computers), mobile phones, receivers (e.g., GPS receivers), transceivers, remote controls, lighting devices (e.g., headlights), control electronics, routers-WLAN or LAN, wireless access points, power supplies. Such devices comprising plastic chassis according to the present invention, including preferred embodiments, are also the subject of the present invention.

[0120] As known to those skilled in the art, there are various methods for recycling plastic materials such as polycarbonate. Such methods may involve disassembling the chassis, removing any non-plastic components (such as display panels, electromagnetic interference (EMI) shielding materials, metal screws, etc.), mechanically shredding the chassis, at least one of cleaning, disinfecting, and sorting the chassis, followed by applying heat (pyrolysis) and / or applying chemical agents (chemical decomposition) to obtain monomers, polymerizing the monomers to produce polymers, and optionally, pelletizing the polymers.

[0121] Although described herein in the context of a plastic laptop computer chassis, the invention is not intended to be so limited. The invention is applicable to any plastic chassis for a human-machine interface (HMI), such as those listed herein, as well as others not listed herein.

[0122] Figure 1An exploded view of the integrated plastic laptop chassis of the present invention is provided. A keyboard 102 with a trackpad 103 sits atop electromagnetic interference (EMI) shielding material 104, all of which is heat-soldered to a printed circuit board (PCB) 108. The PCB 108 is attached to a plastic chassis 114 via one or more metal screws 106 connected to plastic threaded inserts 107. The plastic chassis 114 has a plastic button 116 molded into a first channel 118 that is configured to snap into a slot 134, securely locking the chassis 114 into the lower cover 132 when the first channel 118 slides between the plastic component 136 and the lower cover 132. The plastic component 136 and the lower cover 132 can optionally be ultrasonically welded together to eliminate adhesives. The plastic chassis 114 is optionally made of a thermally conductive polycarbonate, such as MAKROLON TC (Covestro), to provide heat dissipation and aid in EMI shielding. A power source 120, such as a laptop battery pack, is held in place in a second channel 117 of the plastic chassis 114 having plastic tabs 122. One or more speakers 110 are mounted to the plastic chassis 114 by attachment using one or more metal screws and one or more plastic inserts 109. A seamless camera 112 is mounted directly to the plastic chassis 114 by a snap fit.

[0123] Electromagnetic interference (EMI) shielding materials include metals, conductive plastics, and conductive polymers. Such materials are commercially available as films, foils, tapes, and sheets, and are described, for example, in U.S. Patent Nos. 9,167,735; 9,505,903; 8,722,186; 8,691,393; and 8,222,321.

[0124] Figure 2A Electromagnetic interference (EMI) shielding material 204 is shown heat-sunk to the underside of keyboard with trackpad 202, which reduces or eliminates the use of adhesives and allows for easy removal during recycling.

[0125] Figure 2B Depicted are injection molded wire channels in the plastic tabs 222 of the plastic chassis 214 to capture the Wi-Fi antenna wires 220, eliminating the need for tape.

[0126] Figure 3A Embedded electronics and heat sink 324 are shown connecting a printed circuit board (PCB) [not shown] to the plastic chassis 314 to operate components such as a seamless camera, one or more speakers (both in Figure 1 ) and one or more LEDs (shown in Figure 3DAlso shown are one or more plastic inserts 300 that can be ultrasonically welded to the plastic chassis 314.

[0127] Figure 3B A close-up view of the plastic insert 300 in the boss 301 is shown.

[0128] Figure 3C Plastic tabs 322 are depicted for holding the component in tension, eliminating the need for foam and adhesives.

[0129] Figure 3D Embedded LEDs and traces 334 are shown co-molded into the plastic chassis 314 to add functionality without adding parts or hardware.

[0130] Figure 4 Shows Figure 3A Magnified view of the display. Plastic tabs 407 provide additional support for the keyboard, trackpad, electromagnetic interference (EMI) shielding material, and printed circuit board (PCB) on channel 418 of plastic chassis 414. Attachment points 440 are molded into plastic chassis 414 to allow for easy attachment and removal of the display. Plastic chassis 414 has plastic buttons 416 and embedded electronics 424 molded into channel 418.

[0131] Figure 5A The "C" cover 536 and the "D" cover 532 are depicted welded together to provide a homogenous structural component that eliminates fasteners and adhesives.

[0132] Figure 5B Shown is a cross section of the joint design for the "C" and "D" covers, allowing welding and eliminating screws, as shown before ultrasonic welding.

[0133] Figure 6A A push button release 616 is shown molded into the chassis to allow the lower cover 632 to be easily released from the slot 634 without hardware and to facilitate disassembly and repair.

[0134] Figure 6B A micro-textured outer surface 642 designed to hide scratches is depicted.

[0135] Figure 7 The underside of the keyboard 710 and trackpad 702 are shown, which have been heat-soldered and can be removed with a small portion of non-recyclable polycarbonate, leaving the larger portion for reuse. Also shown are a trackpad connector 704 and a keyboard connector 706 for connecting to a printed circuit board (not shown).

[0136] Figure 8A membrane insert molded graphic 845 or other electronic function integrated into the "C" cover is shown.

[0137] Figure 9 A break feature 950 is depicted, which allows a majority of the polycarbonate to be recycled, with the remainder recycled in a different manner, such as pyrolysis of parts with embedded electronics.

[0138] This specification has been written with reference to various non-limiting and non-exhaustive embodiments. However, one of ordinary skill in the art will recognize that various substitutions, modifications, or combinations of any disclosed embodiment (or portion thereof) may be made within the scope of this specification. Therefore, it is to be considered and understood that this specification supports additional embodiments not expressly set forth herein. Such embodiments may be obtained, for example, by combining, modifying, or reorganizing any disclosed steps, components, elements, features, aspects, characteristics, limitations, etc., of the various non-limiting embodiments described in this specification. In this manner, the applicant reserves the right to amend the claims during prosecution to add features as variously described in this specification, and such amendments comply with the requirements of 35 U.S.C. § 112(a) and 35 U.S.C. § 132(a).

[0139] Various aspects of the subject matter described herein are listed in the following numbered clauses:

[0140] In a first aspect, the present invention relates to an integrated plastic human-machine interface (HMI) chassis 114 comprising: one or more input devices 102 adjacent to an electromagnetic interference (EMI) shielding material 104, the one or more input devices 102 and the electromagnetic interference (EMI) shielding material 104 being heat-soldered to a printed circuit board (PCB) 108 using a plurality of plastic heat nails, wherein the printed circuit board 108 is removably attached to the integrated plastic human-machine interface (HMI) chassis 114 using a plurality of metal screws 106 connected to a plurality of plastic threaded inserts 107, wherein the integrated plastic human-machine interface (HMI) chassis 114 includes a plurality of plastic buttons 116 molded into a first channel 118, wherein the plurality of plastic buttons 116 are sized, shaped, and configured to snap into slots 134 of a lower cover 132 so that when the first channel 118 of the plastic chassis 114 is engaged, the plurality of plastic buttons 116 are sized, shaped, and configured to snap into slots 134 of a lower cover 132. The integrated plastic human-machine interface (HMI) chassis 114 is securely locked into the lower cover 132 when slid between the plastic component 136 and the lower cover 132, wherein the plastic component 136 and the lower cover 132 are optionally ultrasonically welded together, wherein the power supply 120 is held in place in the second channel 117 of the integrated plastic human-machine interface (HMI) chassis 114, wherein the second channel 117 has a plastic tab 122, wherein the plastic tab 122 optionally has an injection-molded wire groove 220, wherein one or more optional audio output devices 110 are removably mounted to the integrated plastic human-machine interface (HMI) chassis 114 with one of a metal screw and a plastic insert 109, and wherein one or more optional seamless optical input devices 112 are removably mounted directly to the integrated plastic human-machine interface (HMI) chassis 114 by a snap fit.

[0141] In a second aspect, the present invention relates to an integrated plastic human machine interface (HMI) chassis 114 according to the previous paragraph, wherein the one or more input devices 102 are selected from the group consisting of a keyboard, a touchpad, an optical scanner, a camera, and a microphone.

[0142] In a third aspect, the present invention relates to an integrated plastic human machine interface (HMI) chassis 114 according to any of the two preceding paragraphs, wherein the power source 120 comprises a battery pack.

[0143] In a fourth aspect, the present invention relates to an integrated plastic human machine interface (HMI) chassis 114 according to any of the three preceding paragraphs, wherein the one or more optional audio output devices 110 comprise speakers.

[0144] In a fifth aspect, the present invention relates to an integrated plastic human machine interface (HMI) chassis 114 according to any of the preceding four paragraphs, wherein the one or more optional seamless optical input devices 112 include a camera.

[0145] In a sixth aspect, the present invention relates to an integrated plastic human machine interface (HMI) chassis 114 according to any of the five preceding paragraphs, wherein the plastic comprises a thermoplastic.

[0146] In a seventh aspect, the present invention relates to an integrated plastic human machine interface (HMI) chassis 114 according to the previous paragraph, wherein the plastic comprises polycarbonate.

[0147] In an eighth aspect, the present invention relates to an integrated plastic human machine interface (HMI) chassis 114 according to the previous paragraph, wherein the polycarbonate is a homopolycarbonate.

[0148] In a ninth aspect, the present invention relates to an integrated plastic human machine interface (HMI) chassis 114 according to any of the two preceding paragraphs, wherein the polycarbonate comprises a thermally conductive polycarbonate.

[0149] In a tenth aspect, the present invention relates to an integrated plastic human-machine interface (HMI) chassis 114 according to any of the previous three paragraphs, wherein the polycarbonate contains a filler selected from the group consisting of glass fiber, carbon fiber, cellulose, graphite, graphene, carbon nanotubes, chalk, quartz powder, titanium dioxide, silicates, talc, wollastonite, montmorillonite, kaolin, zeolite, vermiculite, alumina, silica and mixtures of these materials.

[0150] In an eleventh aspect, the present invention relates to an integrated plastic human machine interface (HMI) chassis 114 according to any of the preceding ten paragraphs, wherein the electromagnetic interference (EMI) shielding material 104 is selected from the group consisting of metal, conductive plastic, and conductive polymer.

[0151] In a twelfth aspect, the present invention relates to an integrated plastic human-machine interface (HMI) chassis 114 according to any of the previous eleven paragraphs, wherein the human-machine interface (HMI) is included in one selected from the group consisting of: a laptop computer, a tablet computer, a notebook computer, a desktop computer, a television, a gaming device, an advertising display, a battery pack, a monitor, a camera, a server, an access control, a point-of-sale device, an e-reader, a projector, a thermostat, a home automation portal, a kitchen appliance, an automotive component, a healthcare device, a surgical device, a smart hub, a mobile phone, a GPS receiver, a transceiver, a remote control, a headlamp, control electronics, a router - WLAN or LAN, a wired or wireless access point, and a power supply.

[0152] In a thirteenth aspect, the present invention relates to a method of recycling an integrated plastic human-machine interface (HMI) chassis 114 according to any of the preceding twelve paragraphs, the method comprising (a) disassembling the chassis, (b) removing any non-plastic components, (c) mechanically shredding the chassis, (d) at least one of cleaning, disinfecting and sorting the chassis, (e) subjecting the chassis to at least one of pyrolysis and chemical decomposition to obtain monomers, (f) polymerizing the monomers to produce polymers, and (g) optionally, pelletizing the polymer.

Claims

1. A consolidated plastic human-machine interface (HMI) chassis (114), comprising: One or more input devices (102) adjacent to an electromagnetic interference (EMI) shielding material (104), the one or more input devices (102) and the electromagnetic interference (EMI) shielding material (104) being heat staked to a printed circuit board (PCB) (108) using a plurality of plastic heat stakes, wherein the printed circuit board (PCB) (108) is removably attached to the integrated plastic human machine interface (HMI) chassis (114) using a plurality of metal screws (106) connected to a plurality of plastic threaded inserts (107), wherein the integrated plastic human-machine interface (HMI) chassis (114) includes a plurality of plastic buttons (116) molded onto a first channel (118), wherein the plurality of plastic buttons (116) are sized, shaped, and configured to snap into slots (134) of a lower cover (132) to securely lock the integrated plastic human-machine interface (HMI) chassis (114) into the lower cover (132) when the first channel (118) of the plastic chassis (114) slides between a plastic component (136) and the lower cover (130), wherein the plastic component (136) and the lower cover (132) are optionally ultrasonically welded together, wherein a power supply (120) is held in place in a second channel (117) of the integrated plastic human-machine interface (HMI) chassis (114), wherein the second channel (117) has a plastic tab (122), wherein the plastic tab (112) optionally has a molded-in wire channel (220), wherein one or more optional audio output devices (110) are removably mounted to the integrated plastic human-machine interface (HMI) chassis (114) using one of metal screws and plastic inserts (109), and One or more optional seamless optical input devices (112) are removably mounted directly to the integrated plastic human-machine interface (HMI) chassis (114) via a snap fit.

2. The integrated plastic human machine interface (HMI) chassis (114) of claim 1, wherein the one or more input devices (102) are selected from the group consisting of a keyboard, a touchpad, an optical scanner, a camera, and a microphone.

3. The integrated plastic human machine interface (HMI) chassis (114) according to any one of claims 1 and 2, wherein the power source (120) comprises a battery pack.

4. The integrated plastic human-machine interface (HMI) chassis (114) according to any one of claims 1 to 3, wherein the one or more optional audio output devices (110) include speakers.

5. The integrated plastic human machine interface (HMI) chassis (114) of any one of claims 1 to 4, wherein the one or more optional seamless optical input devices (112) include a camera.

6. The integrated plastic human machine interface (HMI) chassis (114) of any one of claims 1 to 5, wherein the plastic comprises a thermoplastic.

7. The integrated plastic human machine interface (HMI) chassis (114) of claim 6, wherein the thermoplastic comprises polycarbonate.

8. The integrated plastic human machine interface (HMI) chassis (114) of claim 7, wherein the polycarbonate is a homopolycarbonate.

9. The integrated plastic human machine interface (HMI) chassis (114) of any one of claims 7 and 8, wherein the polycarbonate comprises thermally conductive polycarbonate.

10. The integrated plastic human-machine interface (HMI) chassis (114) according to any one of claims 7 to 9, wherein the polycarbonate contains a filler selected from the group consisting of glass fiber, carbon fiber, cellulose, graphite, graphene, carbon nanotubes, chalk, quartz powder, titanium dioxide, silicates, talc, wollastonite, montmorillonite, kaolin, zeolite, vermiculite, alumina, silica and mixtures of these materials.

11. The integrated plastic human-machine interface (HMI) chassis (114) according to any one of claims 1 to 10, wherein the electromagnetic interference (EMI) shielding material is selected from the group consisting of metal, conductive plastic, and conductive polymer.

12. The integrated plastic human-machine interface (HMI) chassis (114) of any one of claims 1 to 11, wherein the human-machine interface (HMI) is included in one selected from the group consisting of a laptop computer, a tablet computer, a notebook computer, a desktop computer, a television, a gaming device, an advertising display, a battery pack, a monitor, a camera, a server, an access control, a point-of-sale device, an e-reader, a projector, a thermostat, a home automation portal, a kitchen appliance, an automotive component, a healthcare device, a surgical device, a smart hub, a mobile phone, a GPS receiver, a transceiver, a remote control, a headlamp, control electronics, a router - WLAN or LAN, a wired or wireless access point, and a power supply.

13. A method of recycling the integrated plastic human-machine interface (HMI) chassis (114) according to any one of claims 1 to 12, the method comprising: (a) disassembling the chassis; (b) remove any non-plastic parts; (c) mechanically crushing the chassis; (d) at least one of cleaning, disinfecting, and sorting the chassis; (e) subjecting the chassis to at least one of pyrolysis and chemical decomposition to obtain monomers; (f) polymerizing the monomer to produce a polymer, and (g) Optionally, pelletizing the polymer.

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