Laser processing device and processing method

Abstract

The laser machining device comprises a laser machine base, a cutting laser machine head, an operation panel, a numerical control moving track and a clamp assembly, and is characterized by further comprising a cross beam piece, and a plurality of sets of positioning holes are formed in the cross beam piece; a preset coordinate mapping relation exists between the center coordinate of the reference positioning hole and the zero point reference coordinate of the cutting laser machine head, and after the cutting laser machine head returns to zero, the zero point reference and the center coordinate of the reference positioning hole keep the preset coordinate mapping relation. According to the invention, a plurality of groups of positioning holes and reference positioning holes are additionally formed in the cross beam piece, and a preset coordinate mapping relation is established between the reference positioning holes and the zero point of the cutting laser head, so that high-precision reference positioning can be carried out on a product to be cut within a short time; the products needing to be cut are rapidly connected through the clamp assembly, and the overall machining efficiency of the products is greatly improved.

Description

Technical field:

[0001] The present invention belongs to the field of laser cutting equipment, and in particular relates to a laser processing device and a processing method. Background technology:

[0002] With the growing demand for power batteries for new energy vehicles, the processing efficiency and precision requirements for runner plates, as heat-conducting components, are increasing. When using traditional lasers to cut runner plates, there is excess material because the product needs to reserve anti-deformation ribs, and the irregular shape makes positioning difficult, making it difficult to ensure the position accuracy of holes, shapes, and runners. The existing solutions include: first, laser scanning positioning method, but this method has low overall efficiency. The product needs to be scanned every time it is placed, especially when facing large-sized runner plates. The scanning takes longer and the data is prone to errors; second, the temporary fixture method. This method requires on-site laser cutting of the substrate and bonding of positioning pins. The overall positioning accuracy is poor, and the fixture cannot be reused. It needs to be remade when changing production, which is costly and inefficient. Summary of the invention:

[0003] In order to solve the above-mentioned problems of low overall effect and poor positioning accuracy of the laser cutting flow channel plate, the present invention proposes a laser processing device and a processing method.

[0004] The laser processing device provided by the present invention includes a laser machine base, a cutting laser head, an operation panel, a CNC movable track and a clamp assembly, and is characterized in that it also includes a crossbeam, on which are provided a plurality of groups of positioning holes and at least one reference positioning hole. There is a preset coordinate mapping relationship between the center coordinates of the reference positioning hole and the zero point reference coordinate of the cutting laser head. After the cutting laser head returns to zero, the zero point reference and the center coordinates of the reference positioning hole maintain the preset coordinate mapping relationship.

[0005] As a further improvement of the present invention, the center of the cross beam is a cross-shaped structure, and the reference positioning hole is located at the center of the cross-shaped structure of the cross beam.

[0006] As a further improvement of the present invention, the crossbeam is fixedly connected to the laser machine base.

[0007] As a further improvement of the present invention, the positioning holes are arranged at equal intervals.

[0008] As a further improvement of the present invention, the fixture assembly includes a base plate, a guide pin, a suction cup, a rotating gas rod pressure plate and an alignment hole, and the position of the alignment hole corresponds to the positioning hole.

[0009] As a further improvement of the present invention, the number of the guide needles is four, and the four guide needles are respectively located at the four corners of the bottom plate.

[0010] As a further improvement of the present invention, the clamp assembly further includes a positioning pin, which passes through the alignment hole and the positioning hole and is connected to the crossbeam.

[0011] The laser processing device processing method provided by the present invention comprises the following steps:

[0012] Step 1: Fix the product to be cut on the fixture assembly through the guide pins on the base plate;

[0013] Step 2: Place the clamp assembly flat on the crossbeam and fix it by passing the positioning pin through the alignment hole and the positioning hole.

[0014] As a further improvement of the present invention, the following steps are also included:

[0015] Step 3: Control the cutting laser head by operating the operation panel, and use the visual positioning function of the cutting laser head to determine the preset coordinate mapping relationship between the zero point reference coordinate and the center coordinate of the reference positioning hole on the beam, determine the precise cutting range, and perform corresponding cutting on the product to be cut;

[0016] Step 4: After the cutting is completed, the cutting laser head returns to zero according to the preset coordinate mapping relationship between the zero point reference and the center coordinate of the reference positioning hole.

[0017] The beneficial effects of the present invention are: by adding multiple groups of positioning holes and reference positioning holes on the crossbeam, and establishing a preset coordinate mapping relationship between the reference positioning holes and the zero point of the cutting laser head, high-precision reference positioning of the product to be cut can be performed in a short time; the product to be cut can be quickly connected through the fixture assembly, which greatly improves the overall processing efficiency of the product. Description of the drawings:

[0018] Figure 1 This is an overall exploded schematic diagram of the laser processing device of the present invention;

[0019] Figure 2 It is a partially enlarged schematic diagram of the laser processing device of the present invention.

[0020] The corresponding relationship between the reference numerals and component names is as follows:

[0021] Laser machine base—1; cutting laser head—2; crossbeam—3; operation panel—4; CNC moving track—5;

[0022] Positioning hole—7; reference positioning hole—8; base plate—10; guide pin—12; suction cup—14; rotary cylinder pressure plate—16;

[0023] Alignment holes—18; positioning pins—20; cutting products—25. Specific implementation method:

[0024] The technical solutions in the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiments are exemplary and are only used to explain the present invention, and should not be understood as limiting the present invention.

[0025] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship and movement status of the various components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0026] like Figure 1 、 Figure 2 As shown, an embodiment of a laser processing device provided by the present invention includes a laser machine base 1, a cutting laser head 2, a crossbeam 3, an operation panel 4, a CNC moving track 5, a positioning hole 7, a reference positioning hole 8, a base plate 10, a guide pin 12, a suction cup 14, a rotating cylinder pressure plate 16, an alignment hole 18 and a positioning pin 20.

[0027] The crossbeam 3 is fixedly connected to the laser machine base 1. The crossbeam 3 is provided with multiple groups of positioning holes 7 and a reference positioning hole 8. The positioning holes 7 are arranged at equal intervals. The center of the crossbeam 3 is a cross-shaped structure. The reference positioning hole 8 is located at the center position of the cross-shaped structure of the crossbeam 3. There is a preset coordinate mapping relationship between the center coordinates of the reference positioning hole 8 and the zero point reference coordinates of the cutting laser head 2. After the cutting laser head 2 returns to zero, the zero point reference and the center coordinates of the reference positioning hole 8 maintain the preset coordinate mapping relationship, so that the zero point distance between the positioning hole 7 and the cutting laser head 2 remains fixed.

[0028] like Figure 1 、 Figure 2 As shown, the base plate 10 is provided with the guide pin 12, the suction cup 14, the rotary cylinder pressure plate 16, the alignment hole 18 and the positioning pin 20. The number of the guide pins 12 is four, and the four guide pins 12 are respectively located at the four corners of the base plate 10. The number of the suction cup 14 and the rotary cylinder pressure plate 16 is at least four. The setting position of the alignment hole 18 corresponds to the positioning hole 7. The positioning pin 20 passes through the alignment hole 18 and the positioning hole 7 and is connected to the crossbeam 3.

[0029] The following combination Figure 1 and Figure 2 , further illustrating the laser processing device processing method of the present invention,

[0030] Step 1: Fix the product 25 to be cut on the fixture assembly through the guide pins 12 on the base plate 10;

[0031] Step 2: Place the clamp assembly flat on the crossbeam 3 and fix it by passing the positioning pin 20 through the alignment hole 18 and the positioning hole 7;

[0032] Step 3: Control the cutting laser head 2 by operating the operation panel 4, and use the visual positioning function of the cutting laser head 2 to determine the preset coordinate mapping relationship between the zero point reference coordinate and the center coordinate of the reference positioning hole 8 on the crossbeam 3, determine the precise cutting range, and cut the product 25 to be cut accordingly;

[0033] Step 4: After the cutting is completed, the cutting laser head 2 returns to zero according to the preset coordinate mapping relationship between the zero point reference and the center coordinate of the reference positioning hole 8.

[0034] After the product cutting is completed, take out the corresponding product and repeat the above steps for the product that needs to be cut. The cutting laser head 2 will regularly calibrate the coordinate mapping relationship between it and the reference positioning hole 8 through the visual positioning function to prevent large deviations during the use of the laser processing device.

[0035] In this embodiment, there is one reference positioning hole 8 and it is set at the center position of the cross-shaped structure of the cross beam 3. The positioning holes 7 are arranged at equal intervals. In other embodiments, the number and position of the reference positioning holes 8 can be adjusted accordingly according to needs, and the positioning holes 7 can be arranged at equal intervals or non-equal intervals according to needs. The preset coordinate mapping relationship between the center coordinates of the reference positioning holes 8 on the cross beam 3 can also be adjusted accordingly according to the actual needs of the specific cutting product.

[0036] The present invention provides multiple groups of positioning holes 7 and reference positioning holes 8 on the crossbeam 3, and establishes a preset coordinate mapping relationship between the reference positioning holes 8 and the zero point of the cutting laser head 2, so that high-precision reference positioning of the product to be cut can be performed in a short time; the product to be cut can be quickly connected through the clamp assembly, which greatly improves the overall processing efficiency of the product.

[0037] The above is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as part of the present invention.

Claims

1. A laser processing device, comprising a laser machine base (1), a cutting laser head (2), an operation panel (4), a CNC moving track (5) and a fixture assembly, characterized in that: The invention also includes a crossbeam (3), on which a plurality of positioning holes (7) and at least one reference positioning hole (8) are provided. A preset coordinate mapping relationship exists between the center coordinates of the reference positioning hole (8) and the zero-point reference coordinates of the cutting laser head (2). After the cutting laser head (2) returns to zero, the zero-point reference and the center coordinates of the reference positioning hole (8) maintain the preset coordinate mapping relationship.

2. The laser processing device according to claim 1, wherein: The center of the cross beam (3) is a cross-shaped structure, and the reference positioning hole (8) is located at the center of the cross-shaped structure of the cross beam (3).

3. The laser processing device according to claim 1, wherein: The crossbeam (3) is fixedly connected to the laser machine base (1).

4. The laser processing device according to claim 1, wherein: The positioning holes (7) are arranged at equal intervals.

5. The laser processing device according to claim 1, wherein: The clamp assembly comprises a base plate (10), a guide pin (12), a suction cup (14), a rotating air rod pressure plate (16) and an alignment hole (18), wherein the position of the alignment hole (18) corresponds to the positioning hole (7).

6. The laser processing device according to claim 5, characterized in that: There are four guide needles (12), and the four guide needles (12) are respectively located at the four corners of the base plate (10).

7. The laser processing device according to claim 6, characterized in that: The clamp assembly further comprises a positioning pin (20), which passes through the alignment hole (18) and the positioning hole (7) and is connected to the crossbeam (3).

8. A processing method of the laser processing device according to claim 7, characterized in that: The following steps are involved: Step 1: Fix the product (25) to be cut on the fixture assembly through the guide pins (12) on the base plate (10); Step 2: Place the clamp assembly flat on the crossbeam (3), and fix it by passing the positioning pin (20) through the alignment hole (18) and the positioning hole (7).

9. The processing method of the laser processing device according to claim 8, characterized in that: The following steps are also included: Step 3: Control the cutting laser head (2) by operating the operation panel (4), and determine the preset coordinate mapping relationship between the zero point reference coordinate and the center coordinate of the reference positioning hole (8) on the crossbeam (3) through the visual positioning function of the cutting laser head (2), determine the precise cutting range, and perform corresponding cutting on the product (25) to be cut; Step 4: After the cutting is completed, the cutting laser head (2) returns to zero according to the preset coordinate mapping relationship between the zero point reference and the center coordinate of the reference positioning hole (8).

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