UV curing two-component glue with multiple interpenetrating network structures and low-temperature forming process

Abstract

The invention discloses UV curing double-component glue with a multiple interpenetrating network structure and a low-temperature forming process, the UV curing double-component glue with the multiple interpenetrating network structure is composed of a component A and a component B which are independently packaged, and the component A and the component B are mixed according to the mass ratio of 1: (0.8-1.2) during use; on the molecular structure level, topological interpenetration of a free radical-cation-dynamic bond triple network breaks through the mechanical property limit of a traditional homogeneous network, so that the material has high modulus, high toughness and damage self-healing capability; in the aspect of phase state regulation and control, the compatibility of heterogeneous components is optimized by a synergistic dispersion mechanism of the multi-dimensional siloxane cross-linking agent and the core-shell toughening agent, and the interface layering defect in a low-temperature environment is effectively inhibited in combination with a staged curing energy input mode; from the perspective of energy dissipation, the local reconstruction characteristic of the dynamic disulfide bond and the global stability of the rigid framework are complementary, and self-repairing of microdefects is achieved while the overall rigidity of the material is maintained.

Description

Technical Field

[0001] The present invention belongs to the field of polymer materials, and more specifically, relates to a UV-curable two-component adhesive having a multiple interpenetrating network structure. The present invention also relates to a low-temperature molding process for the UV-curable two-component adhesive having a multiple interpenetrating network structure. Background Art

[0002] Existing UV-curing adhesives mostly use a homogeneous network structure formed by a single curing mechanism (such as free radical or cationic polymerization), and their comprehensive performance under complex working conditions has significant deficiencies:

[0003] The challenge of balancing mechanical properties and toughness: Conventional acrylate systems tend to form highly cross-linked but brittle networks after curing. While the introduction of flexible segments improves toughness, it sacrifices modulus and temperature resistance, making it unable to meet the mechanical gradient requirements of high-load bonding interfaces.

[0004] Poor adaptability to low-temperature curing: The activation energy of the reaction of a single photoinitiator system increases sharply in a low-temperature environment, resulting in uneven curing rate and accumulation of interfacial stress. Especially in the presence of nano-scale core-shell toughening agents, it is easy to induce irreversible expansion of microphase separation;

[0005] Lack of dynamic self-repair capabilities: Traditional cross-linked networks cannot achieve damage repair due to covalent bond immobilization, while the thermal reversible properties of physically entangled networks lead to increased creep at high temperatures, making it difficult to construct a topological structure that is both highly stable and locally reconfigurable.

[0006] Insufficient interfacial compatibility between the two components: Micro-region chromatography is prone to occur when heterogeneous components are mixed due to differences in polarity and viscoelastic behavior. Insufficient surface functionalization of the multidimensional siloxane crosslinker leads to low bonding efficiency with the main resin.

[0007] The root cause of the above defects lies in the kinetic mismatch between the single field response mechanism of the network structure and the heterogeneous phase system, which restricts the application of adhesive materials in cutting-edge fields such as precision electronic packaging and flexible display modules. Therefore, we propose a UV-curable two-component adhesive with a multiple interpenetrating network structure and a low-temperature molding process. Summary of the Invention

[0008] The purpose of the present invention is to address the shortcomings of the prior art and propose a UV-curing two-component glue with a multiple interpenetrating network structure and a low-temperature molding process. By constructing a synergistic effect of the multiple interpenetrating network structure and the gradient curing process, a breakthrough improvement in the comprehensive performance of the UV-curing adhesive is achieved.

[0009] To achieve the above object, the present invention provides the following technical solutions:

[0010] UV-curable two-component glue with a multiple interpenetrating network structure. The UV-curable two-component glue with a multiple interpenetrating network structure consists of independently packaged component A and component B, which are mixed in a mass ratio of 1:0.8-1.2 when used;

[0011] Composition A is composed of the following raw materials in parts by mass: 30-50 parts of modified polyurethane acrylate prepolymer, 15-25 parts of organosilicon modified acrylate oligomer, 10-20 parts of difunctional fluoroacrylate monomer, 3-8 parts of photoinitiator composition, and 5-15 parts of nano-scale core-shell structure toughening agent;

[0012] Component B is composed of the following raw materials in parts by mass: 40-60 parts of epoxy acrylate composite resin, 20-35 parts of cationic photocurable monomer, 8-15 parts of polysulfide compound containing dynamic disulfide bonds, 3-10 parts of multidimensional siloxane crosslinker, and 1-5 parts of hindered amine co-initiator;

[0013] The multiple interpenetrating network structure is formed by the mutual penetration of the double bond free radical polymerization network in component A and the epoxy cationic polymerization network and dynamic disulfide exchange network in component B, wherein the topological connection number between each network satisfies the following relationship:

[0014]

[0015] Where N i represents the cross-linking density of the ith network, in mol / m 3 , M ωj represents the number average molecular weight of adjacent network j, in g / mol.

[0016] Preferably, the multidimensional siloxane crosslinker has the following general structure:

[0017] (CH2=CHSiO 3 / 2 ) X -(CH2 CH2 SiO) Y -(SiO2)2;

[0018] The molar ratio of x:y is 1:0.3-0.7, and the surface functionalization grafting rate is 15-30%. The preparation comprises the following steps:

[0019] 1) mixing vinyltrimethoxysilane and tetraethoxysilane in a molar ratio of 1:0.5-0.8 under anhydrous conditions;

[0020] 2) adding 2-5 wt% of a phase transfer catalyst to carry out a hydrolysis and polycondensation reaction;

[0021] 3) Thermal cross-linking at 120-150°C to form three-dimensional network structure particles;

[0022] 4) Activate the surface hydroxyl groups using plasma treatment.

[0023] Preferably, the multiple interpenetrating network structure is formed by the following hierarchical assembly process:

[0024] The first stage: After mixing, the acrylate double bonds in component A are first initiated to undergo free radical polymerization to form the first network. The system storage modulus G is 10 3 -10 4 Pa;

[0025] The second stage: When the temperature rises to 60-80°C, the cationic initiator in component B is activated, prompting the ring-opening polymerization of the epoxy groups to form a second network;

[0026] The third stage: under UV irradiation, the polysulfide compound containing dynamic disulfide bonds undergoes SS bond reorganization and exchange, forming a third network with self-repair function;

[0027] The time constants of each stage satisfy the following conditions:

[0028] T2 / T1=1.5-2.8, T3 / T2=0.7-1.2; wherein T1, T2, and T3 correspond to the characteristic curing times of the three stages respectively.

[0029] Preferably, the activation energy Ea of the dynamic bond reorganization process conforms to the following distribution:

[0030]

[0031] Where: t is the current curing time, t total The total curing time is 2.5 s, and the energy barrier fluctuation promotes the formation of spatially inhomogeneous interpenetrating topological structures.

[0032] Preferably, the preparation method of the modified polyurethane acrylate prepolymer comprises:

[0033] 1) reacting isophorone diisocyanate and polycarbonate diol at a molar ratio of 1:2.2-2.8 at 60-80° C. for 3-5 hours;

[0034] 2) adding 0.8-1.5 wt% of dibutyltin dilaurate as a catalyst;

[0035] 3) Hydroxyethyl methacrylate is then added at a molar ratio of 1:1.05-1.15 for end-capping. The final product has a viscosity of 8000-12000 mPa·s (25° C.).

[0036] A low-temperature molding process for a UV-curable two-component adhesive having a multiple interpenetrating network structure, wherein the low-temperature molding process is used to prepare the above-mentioned UV-curable two-component adhesive having a multiple interpenetrating network structure, comprises the following steps:

[0037] S1, pre-mixing stage, at an ambient temperature of 10-15 ° C, component A and component B are stirred at a mass ratio of 1:0.8-1.2 at a low speed, the stirring speed is controlled at 200-400 rpm, and the mixing time is 30-60 seconds;

[0038] S2, gradient curing stage, first curing step: initiating free radical polymerization under 365nm UV light irradiation, irradiation intensity is 20-40mW / cm 2 , the substrate temperature is maintained at 25-35°C for 30-90 seconds until the storage modulus G reaches 10 3 -10 4 Pa;

[0039] Second curing step: start the infrared auxiliary heating device to activate cationic polymerization in a temperature field of 45-60°C, at which time the T2 / T1 ratio is adjusted to 2.0-3.5, and the time constants are T1 = 50-80 seconds and T2 = 100-210 seconds;

[0040] The third curing step: pulse UV irradiation mode is used, with a peak light intensity of 80-120mW / cm 2 , duty cycle 30-50%, triggering dynamic disulfide bond reorganization exchange.

[0041] Preferably, it is characterized in that the infrared auxiliary heating device adopts a gradient control algorithm: T(t)=T0+α·exp(-βt), where T0=45℃±3℃, α=15-25, β=0.02-0.05s -1 This temperature curve reduces the activation energy of the surface hydroxyl groups of the multidimensional siloxane crosslinker.

[0042] Preferably, the pulsed UV irradiation mode is superimposed with a mechanical vibration frequency of 0.5-2 Hz, and the amplitude is controlled at 5-15 μm, so that the spatial distribution degree D of the dynamic disulfide exchange network satisfies: where ρ i is the cross-linking point density of region i, ρ avg is the average density, and A is the total area of the analysis region.

[0043] Preferably, the hindered amine synergistic initiator in component B is a composite system of bisdecyl diamine and nano zinc oxide (2,2,6,6-tetramethyl-4-piperidinyl), with a mass ratio of 1:0.3-0.5, and the quantum efficiency improvement coefficient of the composite initiator at low temperature is:

[0044] Among them, Φ low is the photoinduced quantum efficiency under low temperature conditions, Φ stdis the quantum efficiency of photoinitiation at standard temperature.

[0045] The technical effects and advantages of the present invention: Compared with traditional solid-state products, the UV-curable two-component glue and low-temperature molding process with multiple interpenetrating network structures provided by the present invention realizes cross-scale synergy of network structure through gradient intercalation of free radical polymerization network, cationic polymerization network and dynamic disulfide exchange network; the free radical network provides an initial rigid skeleton to limit the thermal motion amplitude of the relaxed phase of the cationic network; the cationic network dissipates impact energy through the flexible chain segments of ether bonds, reducing the crack propagation rate; the dynamic disulfide bonds undergo bond exchange under the action of external forces, so that local stress concentration points disperse energy through topological reconstruction. The molecular chains between the third-order networks interlock to form a multi-level energy dissipation pathway, effectively overcoming the bottleneck of mutual constraints between strength and toughness in traditional single network systems;

[0046] Secondly, polysulfide compounds containing dynamic disulfide bonds undergo SS bond breakage and recombination under UV irradiation, triggering a triple-response molecular reconstruction process: first, shear stress causes the disulfide bonds in the damaged area to preferentially break to generate sulfur radicals; then, ultraviolet photon excitation causes the broken bonds to recombine to form new cross-linking points with oriented arrangement; at the same time, hindered amine co-initiators capture free sulfur radicals and inhibit non-target side reactions; this energy-selectively activated bond recombination mechanism can achieve autonomous repair of microcrack areas while maintaining the stability of the overall network, eliminating interface failure caused by stress concentration. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 The figure is a flow chart of the low-temperature molding process of the UV-curable two-component glue with a multiple interpenetrating network structure according to the present invention. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below with reference to specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0049] The present invention provides a UV-curable two-component glue with a multiple interpenetrating network structure and a low-temperature molding process. At the molecular structure level, the topological interpenetration of the free radical-cation-dynamic bond triple network breaks through the mechanical property limits of the traditional homogeneous network, so that the material has high modulus, high toughness and damage self-healing ability; in terms of phase regulation, the synergistic dispersion mechanism of the multidimensional siloxane crosslinker and the core-shell toughening agent optimizes the compatibility of heterogeneous components, and combined with the energy input method of staged curing, effectively suppresses the interface delamination defects in low-temperature environments; from the perspective of energy dissipation, the local reconstruction characteristics of the dynamic disulfide bonds complement the global stability of the rigid skeleton, achieving self-repair of microscopic defects while maintaining the overall stiffness of the material.

[0050] Furthermore, the UV-curable two-component glue with a multiple interpenetrating network structure is composed of independently packaged component A and component B, which are mixed in a mass ratio of 1:0.8-1.2 when used;

[0051] Composition A is composed of the following raw materials in parts by mass: 30-50 parts of modified polyurethane acrylate prepolymer, 15-25 parts of organosilicon modified acrylate oligomer, 10-20 parts of difunctional fluoroacrylate monomer, 3-8 parts of photoinitiator composition, and 5-15 parts of nano-scale core-shell structure toughening agent;

[0052] The preparation method of the modified polyurethane acrylate prepolymer comprises:

[0053] 1) reacting isophorone diisocyanate and polycarbonate diol at a molar ratio of 1:2.2-2.8 at 60-80° C. for 3-5 hours;

[0054] 2) adding 0.8-1.5 wt% of dibutyltin dilaurate as a catalyst;

[0055] 3) Hydroxyethyl methacrylate is then added at a molar ratio of 1:1.05-1.15 for end-capping. The final product has a viscosity of 8000-12000 mPa·s (25° C.).

[0056] Component B is composed of the following raw materials in parts by mass: 40-60 parts of epoxy acrylate composite resin, 20-35 parts of cationic photocurable monomer, 8-15 parts of polysulfide compound containing dynamic disulfide bonds, 3-10 parts of multidimensional siloxane crosslinker, and 1-5 parts of hindered amine co-initiator;

[0057] The multi-interpenetrating network structure is formed by the mutual penetration of the double bond free radical polymerization network in component A and the epoxy cationic polymerization network and dynamic disulfide exchange network in component B, wherein the topological connection number between each network satisfies the following relationship:

[0058]

[0059] Where N i represents the cross-linking density of the ith network, in mol / m 3 , M ωj represents the number average molecular weight of adjacent network j, in g / mol;

[0060] It should be noted that the multidimensional siloxane crosslinker has the following general structure:

[0061] (CH2=CHSiO 3 / 2 ) X -(CH2 CH2 SiO) Y -(SiO2)2;

[0062] The molar ratio of x:y is 1:0.3-0.7, and the surface functionalization grafting rate is 15-30%. The preparation comprises the following steps:

[0063] 1) mixing vinyltrimethoxysilane and tetraethoxysilane in a molar ratio of 1:0.5-0.8 under anhydrous conditions;

[0064] 2) adding 2-5 wt% of a phase transfer catalyst to carry out a hydrolysis and polycondensation reaction;

[0065] 3) Thermal cross-linking at 120-150°C to form three-dimensional network structure particles;

[0066] 4) Activating surface hydroxyl groups using plasma treatment;

[0067] The multi-interpenetrating network structure is formed through the following hierarchical assembly process:

[0068] The first stage: After mixing, the acrylate double bonds in component A are first initiated to undergo free radical polymerization to form the first network. The system storage modulus G is 10 3 -10 4 Pa;

[0069] The second stage: When the temperature rises to 60-80°C, the cationic initiator in component B is activated, prompting the ring-opening polymerization of the epoxy groups to form a second network;

[0070] The third stage: under UV irradiation, the polysulfide compound containing dynamic disulfide bonds undergoes SS bond reorganization and exchange, forming a third network with self-repair function;

[0071] The time constants of each stage satisfy the following conditions:

[0072] T2 / T1=1.5-2.8, T3 / T2=0.7-1.2; T1, T2, and T3 correspond to the characteristic curing times of the three stages respectively;

[0073] In addition, the activation energy Ea of the dynamic bond recombination process conforms to the following distribution:

[0074]

[0075] Where: t is the current curing time, t total The total curing time is 2.5 s, and the energy barrier fluctuation promotes the formation of spatially inhomogeneous interpenetrating topological structures.

[0076] In this embodiment, a low-temperature molding process for a UV-curable two-component glue having a multiple interpenetrating network structure is also proposed. The low-temperature molding process is used to prepare the above-mentioned UV-curable two-component glue having a multiple interpenetrating network structure, such as Figure 1 As shown:

[0077] The steps include:

[0078] S1, pre-mixing stage, at an ambient temperature of 10-15 ° C, component A and component B are stirred at a mass ratio of 1:0.8-1.2 at a low speed, the stirring speed is controlled at 200-400 rpm, and the mixing time is 30-60 seconds;

[0079] The hindered amine synergistic initiator in component B is a composite system of bisdecyl diamine and nano zinc oxide (2,2,6,6-tetramethyl-4-piperidinyl), with a mass ratio of 1:0.3-0.5. The quantum efficiency improvement coefficient of the composite initiator at low temperature is:

[0080] Among them, Φ low is the photoinduced quantum efficiency under low temperature conditions, Φ std is the quantum efficiency of photoinitiation at standard temperature.

[0081] S2, gradient curing stage, first curing step: initiating free radical polymerization under 365nm UV light irradiation, irradiation intensity is 20-40mW / cm 2 , the substrate temperature is maintained at 25-35°C for 30-90 seconds until the storage modulus G reaches 10 3 -10 4 Pa;

[0082] Second curing step: Start the infrared auxiliary heating device to activate cationic polymerization in a temperature field of 45-60°C. At this time, the T2 / T1 ratio is adjusted to 2.0-3.5, and the time constants are T1 = 50-80 seconds and T2 = 100-210 seconds. The infrared auxiliary heating device adopts a gradient control algorithm:

[0083] T(t)=T0+α·exp(-βt), where T0=45℃±3℃, α=15-25, β=0.02-0.05s -1This temperature curve reduces the activation energy of the surface hydroxyl groups of the multidimensional siloxane crosslinker.

[0084] The third curing step: pulse UV irradiation mode is used, with a peak light intensity of 80-120mW / cm 2 , duty cycle 30-50%, triggering dynamic disulfide bond recombination exchange, pulsed UV irradiation mode superimposed with a mechanical vibration frequency of 0.5-2 Hz, with an amplitude controlled at 5-15 μm, so that the spatial distribution degree D of the dynamic disulfide bond exchange network satisfies: where ρ i is the cross-linking point density of region i, ρ avg is the average density, and A is the total area of the analysis region.

[0085] In summary, the present invention has the following advantages:

[0086] Mechanical synergistic enhancement mechanism of multiple interpenetrating networks:

[0087] Through the gradient intercalation of free radical polymerization networks, cationic polymerization networks, and dynamic disulfide exchange networks, cross-scale synergy of network structures is achieved. The free radical network provides an initial rigid skeleton, limiting the thermal motion amplitude of the relaxed phase of the cationic network. The cationic network dissipates impact energy through the flexible chain segments of ether bonds, reducing the crack propagation rate. The dynamic disulfide bonds undergo bond exchange under the action of external forces, allowing local stress concentration points to disperse energy through topological reconstruction. The molecular chains between the third-order networks interlock to form a multi-level energy dissipation pathway, effectively overcoming the bottleneck of the mutual constraint between strength and toughness in traditional single network systems.

[0088] Adaptive repair mechanism for dynamic key reorganization:

[0089] Polysulfide compounds containing dynamic disulfide bonds undergo SS bond breakage and recombination under UV irradiation, triggering a triple-response molecular reconstruction process: first, shear stress preferentially breaks disulfide bonds in damaged areas to generate sulfhydryl radicals; then, UV photon excitation causes the broken bonds to recombine, forming new crosslinks with oriented alignment; simultaneously, hindered amine co-initiators capture free sulfhydryl radicals, inhibiting non-target side reactions. This energy-selectively activated bond recombination mechanism enables autonomous repair of microcrack areas while maintaining overall network stability, eliminating interfacial failure caused by stress concentration.

[0090] Low-temperature phase control mechanism of multi-dimensional cross-linked networks:

[0091] The surface hydroxyl activation treatment of the multidimensional siloxane crosslinker significantly improves its interfacial binding energy with the acrylate phase, forming a nanoscale anchoring effect through the hybridization of the siloxane tetrahedral unit and the π-σ orbital of the polymer main chain; during the low-temperature mixing stage (10-15°C), the crosslinker preferentially adsorbs on the surface of the core-shell toughener, reducing the viscosity difference between components A / B and delaying the phase separation kinetics; during the gradient curing process, the three-dimensional siloxane network acts as a mass transfer channel to regulate the monomer diffusion rate, ensuring that the network formation timing at each stage precisely matches the time constant conditions (T2 / T1=1.5-2.8), thereby achieving controllable arrangement of the spatial distribution of each network under low-temperature conditions.

[0092] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. UV curing two-component glue with multiple interpenetrating network structure, characterized in that: The UV-curable two-component adhesive with multiple interpenetrating network structure consists of independently packaged component A and component B, which are mixed in a mass ratio of 1:0.8-1.2 when used; Composition A is composed of the following raw materials in parts by mass: 30-50 parts of modified polyurethane acrylate prepolymer, 15-25 parts of organosilicon modified acrylate oligomer, 10-20 parts of difunctional fluoroacrylate monomer, 3-8 parts of photoinitiator composition, and 5-15 parts of nano-scale core-shell structure toughening agent; Component B is composed of the following raw materials in parts by mass: 40-60 parts of epoxy acrylate composite resin, 20-35 parts of cationic photocurable monomer, 8-15 parts of polysulfide compound containing dynamic disulfide bonds, 3-10 parts of multidimensional siloxane crosslinker, and 1-5 parts of hindered amine co-initiator; The multiple interpenetrating network structure is formed by the mutual penetration of the double bond free radical polymerization network in component A and the epoxy cationic polymerization network and the dynamic disulfide bond exchange network in component B.

2. The UV-curable two-component glue having a multiple interpenetrating network structure according to claim 1, characterized in that: The multidimensional siloxane crosslinking agent has the following general structure: (CH2=CHSiO 3 / 2 ) x -(CH2CH2 SiO ) y -(SiO2)2; wherein the molar ratio of x:y is 1:0.3-0.7, and the surface functionalization grafting rate is 15-30%, and its preparation comprises the following steps: 1) mixing vinyltrimethoxysilane and tetraethoxysilane in a molar ratio of 1:0.5-0.8 under anhydrous conditions; 2) adding 2-5 wt% of a phase transfer catalyst to carry out a hydrolysis and polycondensation reaction; 3) Thermal cross-linking at 120-150°C to form three-dimensional network structure particles; 4) Activate the surface hydroxyl groups using plasma treatment.

3. The UV-curable two-component glue having a multiple interpenetrating network structure according to claim 1, characterized in that: The multiple interpenetrating network structure is formed by the following hierarchical assembly process: The first stage: After mixing, the acrylate double bonds in component A are first initiated to undergo free radical polymerization to form the first network. The system storage modulus G is 10 3 -10 4 Pa; The second stage: When the temperature rises to 60-80°C, the cationic initiator in component B is activated, prompting the ring-opening polymerization of the epoxy groups to form a second network; The third stage: under UV irradiation, the polysulfide compound containing dynamic disulfide bonds undergoes SS bond reorganization and exchange, forming a third network with self-repair function; The time constants of each stage meet the following conditions: T2 / T1=1.5-2.8, T3 / T2=0.7-1.2; wherein T1, T2, and T3 correspond to the characteristic curing times of the three stages, respectively.

4. The UV-curable two-component glue having a multiple interpenetrating network structure according to claim 3, characterized in that: The activation energy Ea of the dynamic bond recombination process conforms to the following distribution: Where: t is the current curing time, t total The total curing time is 2.5 s, and the energy barrier fluctuation promotes the formation of spatially inhomogeneous interpenetrating topological structures.

5. The UV-curable two-component glue having a multiple interpenetrating network structure according to claim 1, characterized in that: The preparation method of the modified polyurethane acrylate prepolymer comprises: 1) reacting isophorone diisocyanate and polycarbonate diol at a molar ratio of 1:2.2-2.8 at 60-80° C. for 3-5 hours; 2) adding 0.8-1.5 wt% of dibutyltin dilaurate as a catalyst; 3) Hydroxyethyl methacrylate is then added at a molar ratio of 1:1.05-1.15 for end-capping. The final product has a viscosity of 8000-12000 mPa·s (25° C.).

6. A low-temperature molding process for a UV-curable two-component glue having a multiple interpenetrating network structure, wherein the low-temperature molding process is used to prepare the UV-curable two-component glue having a multiple interpenetrating network structure according to any one of claims 1 to 5, characterized in that: The steps include: S1, pre-mixing stage, at an ambient temperature of 10-15 ° C, component A and component B are stirred at a mass ratio of 1:0.8-1.2 at a low speed, the stirring speed is controlled at 200-400 rpm, and the mixing time is 30-60 seconds; S2, gradient curing stage, first curing step: initiating free radical polymerization under 365nm UV light irradiation, irradiation intensity is 20-40mW / cm 2 , the substrate temperature is maintained at 25-35°C for 30-90 seconds until the storage modulus G reaches 10 3 -10 4 Pa; Second curing step: start the infrared auxiliary heating device to activate cationic polymerization in a temperature field of 45-60°C, at which time the T2 / T1 ratio is adjusted to 2.0-3.5, and the time constants are T1 = 50-80 seconds and T2 = 100-210 seconds; The third curing step: pulse UV irradiation mode is used, with a peak light intensity of 80-120mW / cm 2 , duty cycle 30-50%, triggering dynamic disulfide bond reorganization exchange.

7. The low-temperature molding process of UV-curable two-component glue with a multiple interpenetrating network structure according to claim 6, characterized in that: The infrared auxiliary heating device adopts a gradient control algorithm: T(t)=T0+α·exp(-βt), where T0=45°C±3°C, α=15-25, β=0.02-0.05s -1 This temperature curve reduces the activation energy of the surface hydroxyl groups of the multidimensional siloxane crosslinker.

8. The low-temperature molding process of UV-curable two-component glue with a multiple interpenetrating network structure according to claim 7, characterized in that: The pulsed UV irradiation mode is superimposed with a mechanical vibration frequency of 0.5-2 Hz, and the amplitude is controlled at 5-15 μm, so that the spatial distribution degree D of the dynamic disulfide exchange network satisfies: where ρ i is the cross-linking point density of region i, ρ avg is the average density, and A is the total area of the analysis region.

9. The low-temperature molding process of UV-curable two-component glue with a multiple interpenetrating network structure according to claim 6, characterized in that: The hindered amine synergistic initiator in component B is a composite system of bisdecyl diamine and nano zinc oxide (2,2,6,6-tetramethyl-4-piperidinyl), with a mass ratio of 1:0.3-0.5, and the quantum efficiency improvement coefficient of the composite initiator at low temperature is: Among them, Φ low is the photoinduced quantum efficiency under low temperature conditions, Φ std is the quantum efficiency of photoinitiation at standard temperature.

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