Electrocoppering tank device for circuit board
Through the design of horizontal spray head and fixture components, the problems of insufficient exchange of Chinese medicine for copper plating in the circuit board and the shaking of thin plates are solved, and uniform electroplating of thick plates and stable spraying of thin plates are achieved, improving the plating quality.
Patent Information
- Application Number
- CN202510799629.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-16
- Publication Date
- 2025-08-15
AI Technical Summary
During the copper tank electroplating process of existing circuit boards, poor liquidity of the potion leads to insufficient exchange of potion at the orifice of the thick plate, affecting the plating quality of the copper tank. The thin plate is prone to shake during the spraying process, affecting the quality.
The horizontal spray head and fixture assembly design is adopted, including a paper frame and a pressing plate piece, to ensure the peripheral fixation of the circuit board, and the movement of the pick-and-place assembly and the motor-driven spray pipe to achieve sufficient potion exchange and stable spraying of thin plates.
It achieves sufficient exchange of thick plate potions, uniform electroplating of copper tanks, avoiding shaking of thin plates, and improving the plating quality.
Smart Images
Figure CN120485924A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of circuit board preparation equipment, and in particular relates to a copper electroplating tank device for a circuit board. Background Art
[0002] In order to ensure the electrical connection between the upper and lower layers of the circuit board, a copper layer needs to be deposited on the hole wall after drilling. This process is called electroplating copper tank.
[0003] In the process of electroplating copper tanks for existing circuit boards, the following two methods are adopted: the first method is to set a spray head that sprays vertically upward at the bottom of the electroplating tank, and set spray heads that spray obliquely upward on both sides of the bottom, and then use a clamp to clamp the width direction of the upper end of the circuit board, and connect the upper end of the clamp to a movable structure so that the circuit board moves with the movable structure over the spray head set at the bottom, so that the spray heads set at the bottom and on both sides of the bottom spray the circuit board, thereby realizing copper tank electroplating; the second method is to set spray heads perpendicular to the circuit board on both sides of the electroplating tank, so that the spray heads spray both sides of the circuit board, thereby achieving the purpose of copper tank electroplating.
[0004] However, the above two methods have the following problems: in the first method, the fluidity of the liquid is poor, resulting in insufficient exchange of the sprayed liquid, affecting the quality of copper tank electroplating; in the second method, the spray head sprays horizontally towards the circuit board. Although it can increase the liquid exchange volume and improve the copper plating effect of the orifice for thick boards, it is easy to shake during the spraying process for thin boards, affecting the quality of the thin boards. Summary of the Invention
[0005] In order to solve the above-mentioned deficiencies in the prior art, the present invention provides a circuit board copper plating tank device, which can not only ensure sufficient exchange of liquid medicine at the orifice of thick plates and improve the copper plating effect, but also prevent the thin plates from shaking during copper plating.
[0006] In order to achieve the purpose of the present invention, the following scheme is proposed: A circuit board copper electroplating tank device, comprising: The spraying part includes an electroplating tank and a spray pipe assembly symmetrically arranged therein, wherein the spray pipe assembly includes a horizontally arranged liquid spray head; The fixture assembly is arranged between the two spray pipe assemblies and includes a circular frame with an annular groove recessed on its inner periphery. The upper side of the annular groove passes through the upper side of the circular frame and is used to accommodate the circuit board. A pressing plate is provided on one side of the circular frame to press the outer periphery of the circuit board. The outer ends of the circular frame are respectively connected to the electroplating tank; The pick-and-place components are arranged in two groups in parallel and at intervals, and are slidably connected to the same beam. Each group of pick-and-place components includes a slide seat that is movable along the length direction of the bottom of the beam. A clamping member is vertically telescopically provided at the center of the bottom of the slide seat. Vertically movable guide members are symmetrically provided on both sides of the clamping member. The guide members are used to be close to both sides of the circuit board when placing or taking out the circuit board. A paddle member is provided at both ends of the guide member on one side, which is used to push the pressure plate member away from the circuit board to release the limit of the pressure plate member on the circuit board.
[0007] Furthermore, a first slide groove is provided on both sides of the inner wall of the electroplating tank, a second slide groove is provided at the bottom of the electroplating tank, and the spray pipe assembly also includes a symmetrically arranged rectangular mounting frame, a first slider is provided on one side of each end of the rectangular mounting frame, the first slider is slidably connected to the first slide groove, a second slider is provided on the bottom surface of the lower side of the rectangular mounting frame, the second slider is slidably connected to the second slide groove, and vertically arranged spray pipes are arranged in an array along the length direction of the rectangular mounting frame, and the spray heads are arranged in an array along the length direction of the spray pipes, a connecting plate is provided at one end of the two rectangular mounting frames, a connecting rod is rotatably provided in the middle of the connecting plate, and one end of the connecting rod is rotatably connected to a cam, and the large end axis of the cam is coaxially connected to the output shaft of the motor, and the motor is vertically installed on the outer wall of one end of the electroplating tank.
[0008] Furthermore, the pressure plate includes a first annular plate and a second annular plate which are parallel and spaced apart. The first annular plate is located outside the circular frame, and the second annular plate is arranged in the annular groove. The size of the second annular plate is adapted to the size of the annular groove. A circular array is provided between the first annular plate and the second annular plate, and the round rods are passed through one side of the circular frame. A first spring is provided on the outer sleeve of each round rod, and one end of the first spring abuts against one side of the second annular plate, and the other end abuts against the side of the annular groove.
[0009] Furthermore, the clamping member includes a strip plate, the bottom surface of the strip plate is provided with a clamping claw array, the top surface of the strip plate is vertically provided with a first telescopic rod, and the upper end of the first telescopic rod is connected to the slide seat.
[0010] Furthermore, the guide plate member includes a T-shaped guide plate, one side of which is vertically provided with a third telescopic rod, one end of the third telescopic rod is provided with a joint motor, the joint motor housing is vertically provided with a second telescopic rod, and the upper end of the second telescopic rod is connected to the slide.
[0011] Furthermore, support ears are symmetrically provided at both ends of one side of the circular frame, and a guide groove is provided on the opposite side of the support ears. T-shaped rods are symmetrically provided on both sides of the first annular plate, and the T-shaped rods are located directly in front of the support ears. The shift plate component includes a first vertical rod arranged for vertical movement, the upper end of the first vertical rod is connected to the telescopic end of the fourth telescopic rod vertically arranged on the slide, and the lower end of the first vertical rod is provided with a vertically arranged second vertical rod, and the second vertical rod is movable in the direction of the vertical part of the T-shaped rod, and the lower end of the second vertical rod is provided with a U-shaped groove with an opening facing downward, and the opening size of the U-shaped groove matches the outer diameter size of the vertical part of the T-shaped rod. A support rod is provided at the lower end of the outer side of the U-shaped groove, and a roller is provided on the outer side of the support rod. When the third telescopic rod is vertically downward, the roller rolls and cooperates with the guide groove to make the pressure plate component move away from the circuit board, so as to release the limit of the pressure plate component on the circuit board.
[0012] Furthermore, the guide groove includes a straight groove section, the upper end of the straight groove section is connected to the top surface of the support ear, and the lower end of the straight groove section is provided with an inclined groove section, and the lower end of the inclined groove section is inclined outward.
[0013] Furthermore, a square hole is provided at the lower end of the first vertical rod, and a square rod is vertically provided at the upper end of the second vertical rod. The square rod is passed through the square hole, and a second spring is provided on the outer sleeve of the square rod. One end of the second spring abuts against one side of the second vertical rod, and the other end abuts against the inner side of the lower end of the first vertical rod.
[0014] Furthermore, L-shaped connecting seats are provided at both ends of the outer side of the circular frame, and a support plate is vertically provided at the upper end of the vertical part of the L-shaped connecting seat. A door-shaped frame is provided at one end of the support plate, and the middle section of the horizontal part of the door-shaped frame is connected to the support plate. The lower end of the vertical part of the door-shaped frame is connected to the electroplating tank.
[0015] The beneficial effects of the present invention are: During electroplating, the long side of the circuit board is placed horizontally, and the outer peripheral process edge of the circuit board is pressed into the annular groove of the circular frame using a pressure plate, thereby fixing the periphery of the circuit board. For thick plates, this not only ensures sufficient exchange of the molten metal in the tank to avoid the presence of bubbles, but also shortens the downstream path of the molten metal during spraying, making the copper tank electroplating more uniform. For thin plates, it can avoid shaking during the spraying process and avoid deformation. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.
[0017] Figure 1 A schematic diagram of the application scenario of this application is shown.
[0018] Figure 2 A schematic diagram of the installation structure of the electroplating tank and the rectangular installation frame of the present application is shown.
[0019] Figure 3 A schematic structural diagram of the electroplating tank of the present application is shown.
[0020] Figure 4 Shown is a schematic structural diagram of the spray assembly of the present application.
[0021] Figure 5 A schematic diagram of the connection structure between the circular frame and the pressure plate of the present application is shown.
[0022] Figure 6 A schematic diagram of the circular frame structure of the present application is shown.
[0023] Figure 7 A schematic diagram of the pressure plate structure of the present application is shown.
[0024] Figure 8 A schematic diagram shows the state of the lower middle portion of the circuit board of the present application when inserted into the annular groove.
[0025] Figure 9 Shown Figure 8 A local enlarged schematic diagram of point A.
[0026] Figure 10 Shown Figure 8 A partial enlarged schematic diagram of point B.
[0027] Figure 11 The schematic diagram shows the state in which the guide plate and the clamping claw move to the upper side of the circular frame after the circuit board of the present application enters the annular groove.
[0028] Figure 12 A structural schematic diagram of the pick-and-place assembly of the present application is shown.
[0029] Figure 13 A structural schematic diagram of the paddle component of the present application is shown.
[0030] Markings in the figure: circuit board 1, spray part 10, plating tank 11, first slide 111, second slide 112, spray pipe assembly 12, spray head 121, rectangular mounting frame 122, first slider 123, second slider 124, spray pipe 125, connecting plate 126, connecting rod 13, cam 14, motor 15, clamp assembly 20, circular frame 21, annular groove 211, L-shaped connecting seat 212, support plate 213, door frame 214, pressure plate 22, first annular plate 221, second annular plate 222, round rod 223, first spring 22 4. T-bar 225, support ear 23, straight slot section 231, oblique slot section 232, pick-and-place assembly 30, crossbeam 31, slide 32, clamping member 33, strip plate 331, clamping claw 332, first telescopic rod 333, guide plate 34, second telescopic rod 341, joint motor 342, third telescopic rod 343, guide plate 344, paddle member 35, first vertical rod 351, square hole 3511, second spring 3512, fourth telescopic rod 352, second vertical rod 353, square rod 3531, U-shaped slot 354, support rod 355, roller 356. DETAILED DESCRIPTION
[0031] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the embodiments of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.
[0032] like Figures 1-13 As shown, the present application provides a circuit board copper electroplating tank device, including a spray portion 10, a clamping component 20, and a pick-and-place component 30.
[0033] Specifically, such as Figure 1-Figure 7 As shown, the spraying part 10 includes an electroplating tank 11, a spray pipe assembly 12, a connecting rod 13, a cam 14, and a motor 15. Figure 2-Figure 3 As shown, the electroplating tank 11 is a rectangular structure with an opening at the top. First slide grooves 111 are respectively provided on both side walls of the electroplating tank 11. The first slide grooves 111 are arranged along the length direction of the electroplating tank 11. A group of second slide grooves 112 are symmetrically provided at the bottom. The second slide grooves 112 are arranged along the length direction of the electroplating tank 11. A mounting plate is provided on the outer wall of one side of the electroplating tank 11.
[0034] like Figure 1-Figure 2 、 Figure 4As shown, the spray pipe assembly 12 includes a liquid spray head 121 , a rectangular mounting frame 122 , a first slider 123 , a second slider 124 , a spray pipe 125 , and a connecting plate 126 . A group of rectangular mounting frames 122 are symmetrically provided and vertically arranged in the electroplating tank 11, the first slider 123 is arranged on the opposite side of the two rectangular mounting frames 122, and the first slider 123 is slidably connected to the first slide groove 111, the second slider 124 is arranged on the bottom surface of the rectangular mounting frame 122, and the second slider 124 is slidably connected to the second slide groove 112, the spray pipe 125 is vertically arranged in the corresponding rectangular mounting frame 122, and the upper and lower ends of the spray pipe 125 are respectively spliced with the upper and lower sides of the rectangular mounting frame 122, and the spray pipe 125 is arranged in an array along the length direction of the rectangular mounting frame 122; the spray heads 121 are arranged in an array along the length direction of the spray pipe 125, and the spray heads 121 on the adjacent two spray pipes 125 are staggered; the connecting plate 126 is U-shaped and arranged horizontally, and the front ends of the arms on both sides of the connecting plate 126 are respectively connected to one end of the top surface of the corresponding rectangular mounting frame 122.
[0035] The connecting rod 13 is rotatably connected to the center of the horizontal part of the connecting plate 126, the small end of the cam 14 is rotatably connected to the connecting rod 13, the motor 15 is vertically installed on the bottom surface of the mounting plate, and the output end vertically passes through the mounting plate upward and is connected to the center of the large end of the cam 14.
[0036] During use, the cam 14 is driven to rotate by the motor 15, so that the cam 14 drives the connecting rod 13 to move back and forth, so that the connecting rod 13 pushes the rectangular mounting frame 122 to move back and forth along the length direction of the electroplating tank 11, so that the spray head 121 sprays both sides of the circuit board 1 synchronously, so that the spray liquid is sprayed horizontally toward the circuit board 1.
[0037] like Figure 1 、 Figure 5-Figure 6 As shown, the circuit board fixture assembly 20 includes a circular frame 21, a pressure plate 22, and a support ear 23. The circular frame 21 has a circular structure, and its inner wall is recessed with an annular groove 211 for accommodating the process edge of the circuit board 1. The upper side of the annular groove 211 passes through the upper side of the circular frame 21, providing a vertical downward or vertical upward channel for inserting or removing the circuit board 1. The outer walls of the circular frame 21 are provided with L-shaped connecting seats 212 at both ends. The outer ends of the horizontal portions of the L-shaped connecting seats 212 are correspondingly connected to the outer walls of the two ends of the circular frame 21. The vertical portions of the L-shaped connecting seats 212 are vertically upward, and the upper ends of the vertical portions of the L-shaped connecting seats 212 are vertically provided with support plates 213. One end of the support plate 213 extends toward the outer walls of the two ends of the electroplating tank 11. A door-shaped frame 214 is provided on the top surface of the two ends of the electroplating tank 11. One end of the support plate 213 is connected to the center of the horizontal portion of the door-shaped frame 214, thereby achieving the installation and fixation of the circular frame 21.
[0038] like Figure 5 、 Figure 6-Figure 7As shown, the pressure plate member 22 includes a first annular plate 221, a second annular plate 222, a round rod 223, a first spring 224, and a T-shaped rod 225. The first annular plate 221 is arranged on the outer wall of one side of the circular frame 21, the second annular plate 222 is arranged in the circular frame 21, and the outer dimensions of the second annular plate 222 are adapted to the shape of the annular groove 221. The round rods 223 are evenly distributed between the first annular plate 221 and the second annular plate 222, and the middle part of the round rods 223 is passed through one side of the circular frame 21. The first spring 224 corresponds to each round rod 223 and is sleeved on the outside of the corresponding round rod 223. One end of the first spring 224 abuts against the second annular plate 222, and the other end abuts against a side wall of the annular groove 221; the T-shaped rod 225 is arranged on both sides of the first annular plate 221 away from the side of the circular frame 21.
[0039] The support ears 23 are vertically arranged on both sides of the side of the circular frame 21 facing the first annular plate 221 and corresponding to the T-shaped rod 225. A guide groove is provided on the opposite side of the support ears 23. The guide groove includes a vertical groove section 231 and an oblique groove section 232 provided at the lower end of the vertical groove section 231. The lower end of the oblique groove section 232 is inclined downward toward the side away from the circular frame 21.
[0040] like Figure 1 、 Figure 12 As shown, there are two groups of pick-and-place components 30, which are installed in parallel and at intervals on the bottom surface of the same beam 31. Each group of pick-and-place components 30 includes a slide 32, a clamping member 33, a guide member 34, and a paddle member 35. The beam 31 spans above the electroplating tank 11 along the width direction of the electroplating tank 11. The upper end of the slide 32 is slidably connected to the bottom of the beam 31 and can move along the length direction of the beam 31; the clamping member 33 is vertically arranged at the center of the bottom surface of the slide 32, and the guide members 34 are symmetrically distributed at both ends of the bottom surface of the slide 32, and are respectively located on both sides of the clamping member 33; supports are vertically provided on both sides of one end of the slide 32, and there are two paddle members 35, which are respectively provided at one end of the corresponding support and are located on both sides of one of the guide members 34. The movement of the slide 32 on the beam 31 can be achieved by installing an annular chain inside the beam 31, fixing the slide 32 to one side of the annular chain, and providing meshing sprockets at both ends of the annular chain, so that one of the sprockets is connected to the drive motor; the drive motor can also be provided at one end of the beam 31, and a lead screw can be provided along the length direction of the beam 31, so that the upper end of the slide 32 is slidably connected to the beam 31, and the middle part of the upper end of the slide 32 is threadedly connected to the lead screw; of course, linear cylinders with opposite output ends can also be provided at both ends of the beam 31, and the corresponding slides 32 can be pushed respectively by the linear cylinders.
[0041] Specifically, the clamping member 33 includes a strip plate 331, a clamping claw 332, and a first telescopic rod 333. The strip plate 331 is arranged in a length direction perpendicular to the beam 31, and a plurality of clamping claws 332 are arranged in an array along the bottom surface of the strip plate 331. The first telescopic rod 333 is vertically arranged at the center of the top surface of the strip plate 331, and the upper end of the first telescopic rod 333 is connected to the bottom surface center of the slide 32.
[0042] The guide plate member 34 includes a second telescopic rod 341, a joint motor 342, a third telescopic rod 343, and a guide plate 344. The second telescopic rod 341 is arranged vertically, with its upper end connected to one end of the bottom surface of the slide 32 and its lower end connected to the outer shell of the joint motor 342. One end of the third telescopic rod 343 is connected to the output end of the joint motor 342, and the other end is vertically connected to one side of the guide plate 344. The guide plate 344 has a T-shaped structure, and the middle part of one side is connected to the other end of the third telescopic rod 343.
[0043] like Figure 13 As shown, the paddle member 35 includes a first vertical rod 351, a fourth telescopic rod 352, a second vertical rod 353, a support rod 355, and a roller 356. The fourth telescopic rod 352 is vertically arranged, and its upper end is connected to the bottom surface of the support away from the end of the slide 32. The upper end of the first vertical rod 351 is connected to the lower end of the fourth telescopic rod 352. The lower end of the first vertical rod 351 is penetrated by a square hole 3511; the second vertical rod 353 is arranged on the side of the lower end of the first vertical rod 351 facing the clamping member 33, and the upper end of the second vertical rod 353 is vertically provided with a square rod 3531, and one end of the square rod 3531 passes through the square hole 3511. , and is slidably connected to the square hole 3511, a second spring 3512 is provided on the outer sleeve of the square rod 3531, one end of the second spring 3512 abuts against one side of the lower end of the first vertical rod 351, and the other end abuts against one side of the upper end of the second vertical rod 353; a U-shaped groove 354 with an opening facing downward is formed in an upward depression at the lower end of the second vertical rod 353; the support rod 355 is provided on the outer side of the second vertical rod 353 and corresponds to one side of the outer wall of the vertical part of the U-shaped groove 354, the roller 356 is sleeved on the outer wall of the support rod 355, and is rotatably connected to the support rod 355, and the outer diameter of the roller 356 is adapted to the width of the guide groove.
[0044] Specific usage process: Combine Figure 1 、 Figure 12As shown, the clamping claw 332 clamps the process edge on one side of the length direction of the circuit board 1, and the second telescopic rod 341 is started. The second telescopic rod 341 extends vertically downward, and the joint motor 342 is started, so that the joint motor 342 adjusts the third telescopic rod 343 to a horizontal state, thereby ensuring that the guide plate 344 remains vertical, and then the third telescopic rod 343 is started, so that the third telescopic rod 343 pushes the guide plate 344 to fit both sides of the circuit board 1 to prevent the circuit board 1 from shaking during the transfer process, especially for thin circuit boards with smaller thicknesses, which can effectively prevent the circuit board from bending due to shaking during the transfer process, thereby affecting the quality of the circuit board.
[0045] Start the slide 32, so that the slide 32 moves along the length direction of the beam 31 to the top of the electroplating tank 11, start the fourth telescopic rod 352 vertically downward, so that the second vertical rod 353 moves vertically downward along the outer side of the first annular plate 221, and as the second vertical rod 353 moves vertically downward, the second vertical rod 353 moves vertically downward. Figure 8-Figure 9 、 Figure 13 As shown, the U-shaped groove 354 extends vertically downward along the vertical portion of the T-shaped rod 225, and at the same time, the roller 356 moves along the straight groove section 231 of the guide groove toward the lower end of the oblique groove section 232, and under the action of the guide groove, the second vertical rod 353 moves toward the first vertical rod 351, so that the U-shaped groove 354 pushes the horizontal portion of the T-shaped rod 225, so that the round rod 223 extends out of the circular frame 21, thereby pulling the second annular plate 222 to one side of the annular groove 211 to prevent the circuit board 1 from vertically downwardly entering the annular groove 211.
[0046] Combine Figure 7-10 、 Figure 12 As shown, the first telescopic rod 333 is started vertically downward, thereby moving the strip plate 331 vertically downward, so that the lower process edge of the circuit board 1 enters the annular groove 211 vertically downward along the area between the other side of the annular groove 211 and the second annular plate 222. When the lower process edge of the circuit board 1 enters the upper side of the area between the other side of the annular groove 211 and the second annular plate 222, the third telescopic rod 343 is retracted, and the second telescopic rod 341 is moved vertically downward to move the guide plate 344 to the empty position in the middle of the circular frame 21, so as to guide the lower process edge of the circuit board 1 during the vertical downward movement, so that the lower process edge of the circuit board 1 is vertically inserted into the bottom of the annular groove 211.
[0047] When the strip plate 331 abuts the upper side of the circular frame 21, the clamping claw 332 releases the circuit board 1. The circuit board 1 automatically slides down a certain distance under the action of gravity, and the lower process edge of the circuit board 1 falls into the bottom of the annular groove 211. During the falling process of the circuit board 1, the guide plates 344 on both sides guide the middle and lower part of the circuit board 1 so that the lower process edge of the circuit board 1 falls smoothly into the bottom of the annular groove 211 to avoid bending during the falling process.
[0048] like Figure 11 As shown, after the circuit board 1 has fully entered the annular groove 211 within the circular frame 21, the fourth telescopic rod 352 retracts upward, causing the second vertical rod 353 to move upward, thereby driving the roller 356 to move upward along the oblique groove end 232 toward the straight groove section 231. Simultaneously, the U-shaped groove 354 moves toward the upper side of the T-shaped rod 225, thereby freeing the transverse portion of the T-shaped rod 225 from the push of the U-shaped groove 354. Under the action of the restoring force of the first spring 224, the second annular plate 222 acts on the process edge of the outer periphery of the circuit board 1, pressing the outer periphery of the circuit board 1 into the annular groove 211. Simultaneously with the upward retraction of the fourth telescopic rod 352, the third telescopic rod 343 retracts away from the circuit board 1, and then the second telescopic rod 341 retracts vertically upward, to a retraction height that places the lowermost side of the guide plate 344 above the upper side of the circular frame 21. When the second telescopic rod 341 is retracted vertically upward, the first telescopic rod 333 is also retracted vertically upward, so as to drive the clamping claw 332 to move to a certain distance above the circular frame 21 .
[0049] Combine Figure 1 、 Figure 2 As shown, start the motor 15, so that the motor 15 drives the cam 14 to rotate, so that the cam 14 drives the connecting rod 13 to push the connecting plate 126 to move back and forth, so that the rectangular mounting frames 122 on both sides of the electroplating tank 11 move back and forth along the length direction of the electroplating tank 11, so that the spray head 121 of the spray pipe 125 sprays the circuit board 1 in the width direction back and forth along the length direction of the circuit board 1.
[0050] After the spraying is completed, Figure 11 、 Figure 8 、 Figure 12 As shown, the second telescopic rod 341 is started to move vertically downward, and pauses when the horizontal portion of the guide plate 344 corresponds to the middle portion of the circuit board 1. Then, the fourth telescopic rod 352 is started to move vertically downward, so that the second vertical rod 353 drives the roller 356 to move along the straight groove section 231 to the oblique groove section 232, so that the U-shaped groove 354 pushes the horizontal portion of the T-shaped rod 225, thereby pulling open the second annular plate 222 to release the limit on the circuit board 1.
[0051] The first telescopic rod 333 is started to move vertically downward so that the clamping claw 332 clamps the process edge of the upper side of the circuit board 1. The third telescopic rod 343 is then retracted to move the guide plates 344 away from the sides of the circular frame 21. The second telescopic rod 341 and the first telescopic rod 333 are then moved upward synchronously. When the lower side of the guide plates 344 is higher than the upper side of the circular frame 21, the third telescopic rod 343 pushes the guide plates 344 to move toward the sides of the circuit board 1 and makes the guide plates 344 close to the circuit board 1 facing the side of the circuit board 1, thereby realizing automatic unloading of the circuit board 1.
[0052] The above description is only a preferred embodiment of the present invention and is not intended to be the only one or to limit the present invention. It should be understood by those skilled in the art that various changes or equivalent replacements made to the present invention without departing from the scope of the present invention are within the scope of protection of the present invention.
Claims
1. A copper electroplating tank device for a circuit board, characterized in that: include: The spraying portion (10) includes an electroplating tank (11) and a spray pipe assembly (12) symmetrically arranged therein, wherein the spray pipe assembly (12) includes a horizontally arranged liquid spray head (121); A clamp assembly (20) is provided between the two spray pipe assemblies (12), comprising a circular frame (21), the inner periphery of which is recessed and provided with an annular groove (211), the upper side of the annular groove (211) passing through the upper side of the circular frame (21) for accommodating the circuit board (1), a pressing plate (22) is provided on one side of the circular frame (21) for pressing the outer periphery of the circuit board (1), and both ends of the outer side of the circular frame (21) are respectively connected to the electroplating tank (11); The pick-and-place components (30) are provided in two groups in parallel and at intervals, and are slidably connected to the same crossbeam (31). Each group of the pick-and-place components (30) includes a slide (32) that is movable along the length direction of the bottom of the crossbeam (31). A clamping member (33) is provided at the center of the bottom of the slide (32) for vertical extension. Guide members (34) that can move vertically are symmetrically provided on both sides of the clamping member (33). The guide members (34) are used to be close to both sides of the circuit board (1) when the circuit board (1) is placed in or taken out. A shifting member (35) is provided at both ends of the guide member (34) on one side for pushing the pressure member (22) away from the circuit board (1) to release the limit of the pressure member (22) on the circuit board (1).
2. The circuit board copper electroplating tank device according to claim 1, characterized in that: The inner wall of the electroplating tank (11) is provided with a first chute (111) on both sides, and the bottom of the electroplating tank (11) is provided with a second chute (112). The spray pipe assembly (12) further includes a symmetrically arranged rectangular mounting frame (122). The first slider (123) is provided on one side of each end of the rectangular mounting frame (122). The first slider (123) is slidably connected to the first chute (111). The bottom surface of the lower side of the rectangular mounting frame (122) is provided with a second slider (124). The second slider (124) is slidably connected to the second chute (112). A vertically arranged spray pipe (125) is arrayed along the length direction of the rectangular mounting frame (122), and the liquid spray head (121) is arrayed along the length direction of the spray pipe (125). A connecting plate (126) is provided at one end of the two rectangular mounting frames (122), and a connecting rod (13) is rotatably provided in the middle of the connecting plate (126). One end of the connecting rod (13) is rotatably connected to a cam (14), and the large end of the cam (14) is coaxially connected to the output shaft of the motor (15). The motor (15) is vertically installed on the outer wall of one end of the electroplating tank (11).
3. The circuit board copper electroplating tank device according to claim 1, characterized in that: The pressure plate member (22) includes a first annular plate (221) and a second annular plate (222) which are arranged in parallel and at intervals. The first annular plate (221) is located outside the circular frame (21), and the second annular plate (222) is arranged in the annular groove (211). The size of the second annular plate (222) is adapted to the size of the annular groove (211). A circular array is provided between the first annular plate (221) and the second annular plate (222). The circular rods (223) are passed through one side of the circular frame (21). Each circular rod (223) is provided with a first spring (224) on its outer sleeve. One end of the first spring (224) abuts against one side of the second annular plate (222), and the other end abuts against the side of the annular groove (211).
4. The circuit board copper electroplating tank device according to claim 1, characterized in that: The clamping member (33) comprises a strip plate (331), the bottom surface of the strip plate (331) is provided with a clamping claw (332) in an array, the top surface of the strip plate (331) is vertically provided with a first telescopic rod (333), and the upper end of the first telescopic rod (333) is connected to the slide seat (32).
5. The circuit board copper electroplating tank device according to claim 1, characterized in that: The guide plate member (34) includes a guide plate (344) in a T-shaped structure, a third telescopic rod (343) being vertically provided on one side of the guide plate, a joint motor (342) being provided at one end of the third telescopic rod (343), a second telescopic rod (341) being vertically provided on the housing of the joint motor (342), and an upper end of the second telescopic rod (341) being connected to the slide seat (32).
6. The circuit board copper electroplating tank device according to claim 1, characterized in that: The two ends of one side of the circular frame (21) are symmetrically provided with support ears (23), and the opposite side of the support ears (23) is provided with a guide groove. The two sides of the first annular plate (221) are symmetrically provided with T-shaped rods (225), and the T-shaped rods (225) are located just in front of the support ears (23). The plate member (35) includes a first vertical rod (351) arranged to move vertically, the upper end of the first vertical rod (351) is connected to the telescopic end of the fourth telescopic rod (352) vertically arranged on the slide (32), the lower end of the first vertical rod (351) is provided with a vertically arranged second vertical rod (353), and the second vertical rod (353) is arranged horizontally. The second vertical rod (353) is provided with a U-shaped groove (354) with an opening facing downwards at the lower end thereof, and the opening size of the U-shaped groove (354) matches the outer diameter size of the vertical portion of the T-shaped rod (225). A support rod (355) is provided at the lower end of the outer side of the U-shaped groove (354), and a roller (356) is provided on the outer side of the support rod (355). When the third telescopic rod (352) is vertically downwards, the roller (356) and the guide groove are rolled to move the pressure plate (22) away from the circuit board (1), thereby releasing the limit of the pressure plate (22) on the circuit board (1).
7. The circuit board copper electroplating tank device according to claim 6, characterized in that: The guide groove comprises a straight groove section (231), the upper end of the straight groove section (231) is connected to the top surface of the support ear (23), and the lower end of the straight groove section (231) is provided with an inclined groove section (232), and the lower end of the inclined groove section (232) is inclined outward.
8. The circuit board copper electroplating tank device according to claim 6, characterized in that: A square hole (3511) is provided at the lower end of the first vertical rod (351), a square rod (3531) is vertically provided at the upper end of the second vertical rod (353), the square rod (3531) is inserted into the square hole (3511), and a second spring (3512) is provided on the outer sleeve of the square rod (3531), one end of the second spring (3512) abuts against one surface of the second vertical rod (353), and the other end abuts against the inner side of the lower end of the first vertical rod (351).
9. The circuit board copper electroplating tank device according to claim 1, characterized in that: L-shaped connecting seats (212) are respectively provided at both ends of the outer side of the circular frame (21), a support plate (213) is vertically provided at the upper end of the vertical portion of the L-shaped connecting seat (212), a door frame (214) is provided at one end of the support plate (213), a middle section of the horizontal portion of the door frame (214) is connected to the support plate (213), and the lower end of the vertical portion of the door frame (214) is connected to the electroplating tank (11).