Probe resistance monitoring device, monitoring machine and monitoring method

Through the probe resistance monitoring device and method, the test unit and push-pull unit are used to quickly identify and deal with abnormal probes, which solves the problem of low probe monitoring efficiency and improves the accuracy of wafer electrical properties detection.

CN120490608APending Publication Date: 2025-08-15ZHEJIANG ICSPROUT SEMICONDUCTOR CO LTD
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Patent Information

Application Number
CN202510772251.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-10
Publication Date
2025-08-15

AI Technical Summary

Technical Problem

In the prior art, probe monitoring efficiency is low, especially in the process of miniaturizing semiconductor devices, it is difficult to locate and clean defective probes, which affects the accuracy of wafer electrical properties detection.

Method used

A probe resistance monitoring device is provided, including a testing unit, a needle card, a first and a second test block, and a test signal is provided through the first and second test ends to determine whether the probe resistance exceeds a preset threshold. Combined with a push-pull unit and a detection unit, abnormal probes are quickly identified and processed.

Benefits of technology

It improves probe monitoring efficiency, quickly locates and handles abnormal probes, and improves the accuracy of wafer electrical properties detection.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a probe resistance monitoring device, a monitoring machine and a monitoring method, and the probe resistance monitoring device is used for monitoring the resistance of a probe, and comprises a test unit which comprises a first test end and a second test end; the probe card is used for bearing the probe; the first test block is coupled with the first test end; the second test block is arranged opposite to the first test block and is coupled with the second test end; the tip of the probe is coupled with the second test block, and the tail end opposite to the tip of the probe is coupled with the first test block; and the test unit provides test signals for the tip end and the tail end of the probe through the first test end and the second test end so as to test the resistance of the probe. By adopting the scheme of the invention, the probe monitoring efficiency can be improved.
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Description

Technical Field

[0001] The present invention relates to the field of semiconductor testing technology, and in particular to a probe resistance monitoring device, a monitoring machine, and a monitoring method. Background Art

[0002] After semiconductor wafer fabrication and before packaging, wafer acceptance testing (WAT) is required in the semiconductor manufacturing process to ensure wafer yield and avoid packaging waste. During layout design, multiple sets of test terminals are typically arranged on the wafer. Probes are used to electrically contact the test terminals to test the wafer's electrical performance. Before and after testing, the probes themselves need to be inspected, also known as probe monitoring, to improve the accuracy of wafer electrical testing.

[0003] However, in the existing probe monitoring process, there is a problem of low probe monitoring efficiency. Summary of the Invention

[0004] The technical problem solved by the present invention is to detect the probe by providing a probe resistance monitoring device, a monitoring machine and a monitoring method, so as to improve the probe monitoring efficiency.

[0005] In order to solve the above problems, an embodiment of the present invention provides a probe resistance monitoring device for monitoring the resistance of a probe, comprising: a test unit, comprising a first test end and a second test end; a needle card, for carrying the probe; a first test block, coupled to the first test end; a second test block, arranged opposite to the first test block, and coupled to the second test end; the tip of the probe is coupled to the second test block, and the end opposite to the tip of the probe is coupled to the first test block; the test unit provides a test signal to the tip and end of the probe via the first test end and the second test end to test the resistance of the probe.

[0006] Optionally, the number of the first test ends, the second test ends, the first test blocks, and the second test blocks are respectively equal to the number of the probes; the probes include any one of the following items: the number of the probes is equal to 1; the number of the probes is greater than or equal to 2, and the first test end corresponds one-to-one to the first test block, the first test block corresponds one-to-one to the end of the probe, and the second test end corresponds one-to-one to the second test block, and the second test block corresponds one-to-one to the tip of the probe; multiple first test ends are disconnected; multiple second test ends are disconnected; multiple first test blocks are disconnected; multiple second test blocks are disconnected.

[0007] Optionally, the test unit includes: a resistance tester, a signal test unit, a display subunit, and an alarm subunit; the resistance tester is coupled to the first test end and the second test end; the signal test unit is coupled to the resistance tester, and is used to control the resistance tester to test the resistance of at least one probe at a time; the alarm subunit is used to issue an alarm when the resistance of the probe exceeds a preset resistance threshold; the display subunit is connected to the resistance tester, and is used to display the resistance value of the probe tested by the resistance tester.

[0008] Optionally, the probe resistance monitoring device further includes: a data storage unit for storing the resistance of the probe tested by the test unit.

[0009] Optionally, a protrusion is provided at the end of the probe; the shape of the protrusion includes: one or more of a cylinder, an elliptical cylinder, a square cylinder, and a prism.

[0010] Optionally, the first test block is coupled to a protrusion at the end of the probe.

[0011] Optionally, the probe resistance monitoring device includes: a push-pull unit for advancing the probe that exceeds a preset resistance threshold so that the tip of the probe protrudes in a direction parallel to the axial direction of the probe, and the push-pull unit is also used to pull back the protruding probe.

[0012] Optionally, the probe resistance monitoring device further includes: a detection unit for detecting whether the probe pulled back by the push-pull unit is returned to its position; the detection unit includes: a coplanarity measuring instrument to detect whether the raised portion of the returned probe and the raised portions of the remaining probes are located in the same horizontal plane; the coplanarity measuring instrument includes: one or more of a laser coplanarity measuring instrument, an optical coplanarity measuring instrument, a contact probe coplanarity measuring instrument, a white light interferometer coplanarity measuring instrument and a 3D optical structure coplanarity measuring instrument.

[0013] Optionally, the probe resistance monitoring device further includes: a first insulating plate, a second insulating plate; the first test block is positioned on the first insulating plate; the second test block is positioned on the second insulating plate, and the second test block is arranged opposite to the first test block.

[0014] Correspondingly, a monitoring machine comprises: the probe resistance monitoring device described in any one of the above items; wherein the probe card is located on the monitoring machine and is detachably connected to the monitoring machine.

[0015] Correspondingly, a probe resistance monitoring method is applied to the probe resistance monitoring device described in any of the above items, including: the probe is placed on the needle card; the needle card is moved so that the tip of the probe is coupled to the second test block, and the end opposite to the tip of the probe is coupled to the first test block; the test unit provides a test signal to the probe via the first test end and the second test end to test the resistance of the probe.

[0016] Optionally, the probe resistance monitoring method further includes: in response to the probe resistance exceeding a preset resistance threshold, the alarm subunit issues a warning message.

[0017] Optionally, the probe resistance monitoring method further includes: the push-pull unit pushes the probe that exceeds the preset resistance threshold so that the tip of the probe that exceeds the preset resistance threshold protrudes in a direction parallel to the axial direction of the probe; inspecting and / or cleaning the protruding tip; and the push-pull unit pulls back the protruding probe.

[0018] Optionally, the probe resistance monitoring method further includes: the detection unit detecting whether the protruding probe is returned to its original position after being pulled back by the push-pull unit.

[0019] Compared with the prior art, the technical solution of the embodiment of the present invention has the following advantages:

[0020] The probe resistance monitoring device provided in an embodiment of the present application includes: a test unit, a first test end, a second test end, a needle card, a first test block, and a second test block; the first test block is coupled to the first test end; the second test block is arranged opposite to the first test block and coupled to the second test end; the tip of the probe is coupled to the second test block, and the end opposite to the tip of the probe is coupled to the first test block; the test unit provides a test signal to the tip and end of the probe via the first test end and the second test end to test the measured resistance of the probe. By judging whether the measured resistance of the probe exceeds the preset resistance threshold, it is possible to quickly determine whether there is an abnormal probe, thereby improving the efficiency of probe monitoring. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0022] Figures 1 to 7 Schematic diagram of the structure of the probe resistance monitoring device according to an embodiment of the present application.

[0023] Figure 8 Schematic diagram of a flow chart of a probe resistance monitoring method in an embodiment of the present application. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0025] In the existing technology, there is a problem of low probe monitoring efficiency during the probe monitoring process. The following specifically analyzes the main reasons leading to the low probe monitoring efficiency.

[0026] As semiconductor devices tend to be miniaturized and the density of semiconductor devices per unit area on the substrate increases, wafer electrical testing becomes particularly important. During layout design, the number of test terminals is increased and the distance between test terminals is reduced. Accordingly, the number of probes on the probe station is also increased and the distance between the probes is also reduced. During the probe monitoring process, the following problems exist:

[0027] First, the difficulty of locating the defect probe increases.

[0028] As the number of probes increases, the spacing between the probes decreases, and all probes have the same shape. Therefore, locating the defective probe during the detection and monitoring process is very time-consuming and labor-intensive, which reduces the efficiency of probe monitoring.

[0029] Second, cleaning the defect probe becomes more difficult.

[0030] As the number of probes increases, the spacing between the probes decreases, which increases the difficulty of cleaning defective probes, for example, resulting in incomplete cleaning and reduced probe monitoring efficiency.

[0031] It should be noted that the probe monitoring is to inspect the probe before and after the wafer test. The main inspection items include: probe foreign matter, needle tip wear, probe bending and probe contamination; the detection monitoring is done manually combined with a microscope; the defective probe is a probe that has foreign matter, needle tip wear, bending and contamination, etc. on the probe and does not meet the requirements of wafer electrical testing.

[0032] In summary, the existing probe monitoring method reduces the efficiency of probe monitoring.

[0033] In order to solve the technical problem, an embodiment of the present invention provides a probe resistance monitoring device for monitoring the resistance of a probe, comprising: a test unit, comprising a first test end and a second test end; a needle card, for carrying the probe; a first test block, coupled to the first test end; a second test block, arranged opposite to the first test block, and coupled to the second test end; the tip of the probe is coupled to the second test block, and the end opposite to the tip of the probe is coupled to the first test block; the test unit provides a test signal to the tip and end of the probe via the first test end and the second test end to test the resistance of the probe.

[0034] Using the probe resistance monitoring device provided in the embodiment of the present application, the test unit provides a test signal to the tip and end of the probe via the first test end and the second test end to test the measured resistance of the probe. By determining whether the measured resistance of the probe exceeds a preset resistance threshold, it is possible to quickly determine whether there is an abnormal probe, thereby improving the efficiency of probe monitoring.

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Unless there is a conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0036] refer to Figure 1 and Figure 2 In this embodiment, the probe resistance monitoring device includes: a probe card 100.

[0037] The needle card 100 is used to carry the probe.

[0038] In this embodiment, the probe has a tip and a tail opposite to the tip.

[0039] Along the axial direction F perpendicular to the probe, the cross-sectional shape of the probe includes: one or more of a circle, an ellipse, and a polygon. In this embodiment, along the axial direction F perpendicular to the probe, the cross-sectional shape of the probe is a circle.

[0040] In some embodiments, the number of the probes is equal to 1, in other embodiments, the number of the probes is greater than or equal to 2, and in this embodiment, the number of the probes is 4, and these 4 probes are arranged in a row with equal spacing; it should be noted that the spacing between the probes can be set according to actual circumstances and is not intended to limit this application.

[0041] The probe is located on the needle card 100. In this embodiment, four needle card holes are evenly spaced on the needle card 100. Each needle card hole corresponds to a probe, and the four needle card holes are arranged in 1 row and 4 columns or 1 column and 4 rows or 2 rows and 2 columns.

[0042] In this embodiment, a buffer pad 101 is provided on the inner wall of each needle cartoon hole, and the side wall of the probe inserted into each needle cartoon hole contacts the buffer pad 101. The buffer pad 101 facilitates the subsequent advancement and retraction of the probe, which can reduce the wear on the probe.

[0043] A protrusion 200 is provided at the end of the probe. In this embodiment, a protrusion 200 is provided at the end of each probe. Each protrusion 200 corresponds to the end of each probe one by one and is electrically connected. Each protrusion 200 and each probe are a whole, that is, integrally formed. In other embodiments, the protrusion 200 can be welded to the corresponding probe by welding.

[0044] The shape of the protrusion 200 includes one or more of a cylinder, an elliptical cylinder, a square cylinder, and a prism. In this embodiment, the shape of the protrusion 200 is a cylinder.

[0045] The protrusion 200 has the following beneficial effects:

[0046] First: the protrusion 200 is used to increase the contact area between the first test block 301 and the end of the probe, thereby improving the monitoring efficiency of the probe.

[0047] Second: the protrusion 200 facilitates the alignment of the second test block 302 and the corresponding probe, thereby improving the accuracy of probe monitoring.

[0048] Third: The protrusion 200 is conducive to the push-pull unit 400 (such as Figure 5 ) pull back the probe.

[0049] In other embodiments, the needle card 100 may be provided with multiple rows and columns of through holes, and those skilled in the art may make a selection based on actual needs.

[0050] The shape of the needle card 100 includes one or more of a cube, a cylinder, an elliptical cylinder and a pyramid. In this embodiment, the shape of the needle card 100 is a cube.

[0051] The material of the needle card 100 includes one or more of acrylic, polycarbonate, polypropylene and polyethylene. In this embodiment, the material of the needle card 100 is acrylic, and it is transparent.

[0052] refer to Figures 1 to 4 ,in Figure 3 a is a schematic diagram of the first test block 301 being installed on the first insulating plate 305, Figure 3 b is a schematic top view of the first insulating plate 305, Figure 4 a is a schematic diagram of the second test block 302 being installed on the second insulating plate 306, Figure 4 b is a schematic top view of the second insulating plate 306 .

[0053] In this embodiment, the probe resistance monitoring device includes: a test unit, a first test block 301 , a second test block 302 , a first insulating plate 305 , and a second insulating plate 306 .

[0054] The test unit includes a first test end 303 and a second test end 304 .

[0055] The first test block 301 is coupled to the first test terminal 303 .

[0056] The second test block 302 is disposed opposite to the first test block 301 and is coupled to the second test block 302 .

[0057] The test unit provides a test signal to the tip and the end of the probe via the first test terminal 303 and the second test terminal 304 to test the resistance of the probe.

[0058] The first test block 301 is used to increase the contact area between the first test end 303 and the end of the probe, and facilitates the alignment of the first test end 303 with the end of the probe, thereby improving the probe monitoring efficiency; the second test block 302 is used to increase the contact area between the second test end 304 and the tip of the probe, and facilitates the alignment of the second test end 304 with the tip of the probe, thereby improving the probe monitoring efficiency.

[0059] In this embodiment, the tip of the probe is coupled to the second test block 302, and the end opposite to the tip of the probe is coupled to the first test block 301, that is, the tip of the probe is electrically connected to the second test block 302, and the end opposite to the tip of the probe is electrically connected to the first test block 301.

[0060] The first test block 301 is coupled to the first test end 303, that is, the first test block 301 is electrically connected to the first test end 303; the second test block 302 is arranged opposite to the first test block 301 and coupled to the second test block 302, that is, the second test block 302 is electrically connected to the second test end 304 of the second test block 302.

[0061] In addition, the first test block 301 is further used to reduce damage to the end of the probe caused by the first test end 303 , and the second test block 302 is further used to reduce damage to the tip of the probe caused by the second test end 304 .

[0062] The shape of the first insulating plate 305 includes one or more of a cube, a cylinder, an elliptical cylinder and a pyramid. The shape of the second insulating plate 306 includes one or more of a cube, a cylinder, an elliptical cylinder and a pyramid. In this embodiment, the shape of the first insulating plate 305 and the second insulating plate 306 are both cubes.

[0063] In this embodiment, the first insulating plate 305 is provided with equally spaced through holes, and the second insulating plate 306 is provided with equally spaced through holes. The spacing between the through holes on the first insulating plate 305 and the through holes on the second insulating plate 306 is equal to the spacing between the needle card holes on the needle card 100. The spacing between the through holes and the spacing between the probes can be set according to actual needs.

[0064] In this embodiment, the distance between the first insulating plate 305 and the second insulating plate 306 can be adjusted to accommodate probes of different lengths.

[0065] The number of the first test ends 303, the second test ends 304, the first test blocks 301 and the second test blocks 302 are respectively equal to the number of the probes; the probes include any one of the following items: the number of the probes is equal to 1; the number of the probes is greater than or equal to 2, and the first test ends 303 correspond to the first test blocks 301 one-to-one, the first test blocks 301 correspond to the ends of the probes one-to-one, and the second test ends 304 correspond to the second test blocks 302 one-to-one, and the second test blocks 302 correspond to the tips of the probes one-to-one; multiple first test ends 303 are disconnected; multiple second test ends 304 are disconnected; multiple first test blocks 301 are disconnected; multiple second test blocks 302 are disconnected; the first test block 301 is coupled to the protrusion 200 at the end of the probe; and the second test block 302 is coupled to the tip of the probe.

[0066] In this embodiment, the number of the first test terminals 303 is 4, namely the first test terminal 303a, the first test terminal 303b, the first test terminal 303c and the first test terminal 303d; the number of the second test terminals 304 is 4, namely the second test terminal 304a, the second test terminal 304b, the second test terminal 304c and the second test terminal 304d; the number of the first test blocks 301 is 4, namely the first test block 301a, the first test block 301b, the first test block 301c and the first test block 301d; the number of the protrusions 200 is 4, namely the protrusion 200a, the protrusion 200b, the protrusion 200c and the protrusion 200d; the number of the second test blocks 302 is 4, namely the second test block 302a, the second test block 302b and the second test block 302c. 02b, a second test block 302c and a second test block 302d; the number of the probes is 4, namely probe 307a, probe 307b, probe 307c and probe 307d; the number of the needle cartoon holes on the needle card 100 is 4, namely needle cartoon hole 100a, needle cartoon hole 100b, needle cartoon hole 100c and needle cartoon hole 100d; the number of through holes on the first insulating plate 305 is 4, namely first insulating plate through hole 305a, first insulating plate through hole 305b, first insulating plate through hole 305c and first insulating plate through hole 305d; the number of through holes on the second insulating plate 306 is 4, namely second insulating plate through hole 306a, second insulating plate through hole 306b, second insulating plate through hole 306c and second insulating plate through hole 306d.

[0067] The first test block 301a corresponds to the first insulating plate through hole 305a, the first test block 301b corresponds to the first insulating plate through hole 305b, the first test block 301c corresponds to the first insulating plate through hole 305c, and the first test block 301d corresponds to the first insulating plate through hole 305d; the second test block 302a corresponds to the second insulating plate through hole 306a, the second test block 302b corresponds to the second insulating plate through hole 306b, the second test block 302c corresponds to the second insulating plate through hole 306c, and the second test block 302d corresponds to the second insulating plate through hole 306d.

[0068] The first test end 303a corresponds to the first test block 301a, the first test block 301a corresponds to the protrusion 200a, the protrusion 200a corresponds to the end of the probe 307a, the probe 307a corresponds to the needle card hole 100a, the tip of the probe 307a corresponds to the second test block 302a, and the second test block 302a corresponds to the second test end 304a; the first test end 303b corresponds to the first test block 301b, the first test block 301b corresponds to the protrusion 200b, the protrusion 200b corresponds to the end of the probe 307b, the probe 307b corresponds to the needle card hole 100b, the tip of the probe 307b corresponds to the second test block 302b, and the second test block 302b corresponds to the second test end 304b; The first test end 303c corresponds to the first test block 301c, the first test block 301c corresponds to the protrusion 200c, the protrusion 200c corresponds to the end of the probe 307c, the probe 307c corresponds to the needle cartoon hole 100c, the tip of the probe 307c corresponds to the second test block 302c, and the second test block 302c corresponds to the second test end 304c; the first test end 303d corresponds to the first test block 301d, the first test block 301d corresponds to the protrusion 200d, the protrusion 200d corresponds to the end of the probe 307d, the probe 307d corresponds to the needle cartoon hole 100d, the tip of the probe 307d corresponds to the second test block 302d, and the second test block 302d corresponds to the second test end 304d.

[0069] The first test terminals 303a, 303b, 303c and 303d are disconnected from each other; the first test blocks 301a, 301b, 301c and 301d are disconnected from each other; the second test terminals 304a, 304b, 304c and 304d are disconnected from each other; and the second test blocks 302a, 302b, 302c and 302d are disconnected from each other. The disconnected connections are, in other words, insulated connections.

[0070] The first test block 301 is positioned on the first insulating plate 305, and the second test block 302 is positioned on the second insulating plate 306. In this embodiment, each through hole on the first insulating plate 305 corresponds to the installation of one of the first test blocks 301, and each through hole on the second insulating plate 306 corresponds to the installation of one of the second test blocks 302.

[0071] In this embodiment, the first test block 301 is installed in the through hole on the first insulating plate 305 by screws and / or bolts, and the second test block 302 is installed in the through hole on the first insulating plate 305 by screws and / or bolts. The screws and / or bolts are preferably made of non-conductive plastic material. In other embodiments, the first test block 301 is fixedly installed in the through hole on the first insulating plate 305 by glue, and the second test block 302 is fixedly installed in the through hole on the second insulating plate 306 by glue, but this does not limit the present application.

[0072] In this embodiment, the shapes of the first test block 301 , the second test block 302 , the through holes on the first insulating plate 305 , and the through holes on the second insulating plate 306 are all cylindrical, but this is not intended to limit the present application.

[0073] Continue to refer Figure 3 and Figure 4 In this embodiment, the first test block 301 is a cylinder, the upper base of the cylinder protrudes from the upper surface of the first insulating plate 305, and the lower base of the cylinder protrudes from the lower surface of the first insulating plate 305; the second test block 302 is a cylinder, the upper base of the cylinder protrudes from the upper surface of the second insulating plate 306, and the lower base of the cylinder protrudes from the lower surface of the second insulating plate 306.

[0074] In this embodiment, the second insulating plate 306 is disposed opposite to the first insulating plate 305 , so that the second testing block 302 is disposed opposite to the first testing block 301 .

[0075] In this embodiment, along the axial direction F parallel to the probe, the centers of the first test block 301a, the protrusion 200a, and the second test block 304a are on a straight line; the centers of the first test block 301b, the protrusion 200b, and the second test block 304b are on a straight line; the centers of the first test block 301c, the protrusion 200c, and the second test block 304c are on a straight line; the centers of the first test block 301d, the protrusion 200d, and the second test block 304d are on a straight line; this is not intended to limit the present application.

[0076] The test unit includes: a resistance tester 308, a signal test unit 309, a display subunit 310, and an alarm subunit (not shown).

[0077] The resistance tester 308 is coupled to the first test terminal 303 and the second test terminal 304. In this embodiment, there are four resistance testers 308, namely resistance tester 308a, resistance tester 308b, resistance tester 308c and resistance tester 308d. The resistance tester 308 is coupled to the first test terminal 303a, the first test terminal 303b, the first test terminal 303a, the first test terminal 303b, the second test terminal 304a, the second test terminal 304b, the second test terminal 304a and the second test terminal 304b through independent wires. One probe corresponds to one of the resistance testers 308, that is, probe 307a corresponds to resistance tester 308a, probe 307b corresponds to resistance tester 308b, probe 307c corresponds to resistance tester 308c, and probe 307d corresponds to resistance tester 308d.

[0078] The resistance tester 308 includes one or more of a multimeter, an ohmmeter, and a four-probe tester. In this embodiment, the resistance tester 308 is a multimeter.

[0079] In this embodiment, the first test end 303 can be the positive test lead end of a multimeter, and the second test end 304 can be the negative test lead end of a multimeter, but this is not intended to limit the present application. In some embodiments, both the first test end 303 and the second test end 304 can be metal probes, but this is not intended to limit the present application.

[0080] It should be noted that the protrusion 200, the first test block 301 and the second test block 302 are used to provide redundant space for alignment of the first test end 303 with the tip and end of the probe, thereby improving the alignment speed of the first test end 303 and the second test end 304 with the probe, thereby improving the probe monitoring efficiency.

[0081] The signal testing unit 309 is coupled to the resistance tester 308 and is used to control the resistance tester 308 to test the resistance of at least one probe at a time; in this embodiment, the signal testing unit 309 can control the resistance tester 308 to synchronously test the resistance of all probes on the needle card 100; in some embodiments, the signal testing unit 309 controls the resistance tester 308 to test the resistance of each probe individually. For example, when testing the resistance of probe 307a, the signal testing unit 309 controls the resistance tester 308 not to test the resistance of probe 307b, probe 307c and probe 307d, that is, the signal testing unit 309 can control the resistance tester 308 to select the number of probes to be tested.

[0082] In this embodiment, the signal testing unit 309 at least includes: a signal source 309a and a multiplexer 309b.

[0083] The signal source 309 a is coupled to the multiplexer 309 b to provide a control signal.

[0084] The multiplexer 309 b is coupled to the resistance tester 308 and is configured to output a control signal to determine whether the resistance tester 308 selects to test the resistance of one or more probes.

[0085] Continue to refer Figure 1 In this embodiment, a switch 311, such as a transistor, is provided between each resistance tester and each corresponding first test terminal, and / or between each resistance tester and each corresponding second test terminal. The multiplexer 309b is used to control the opening and closing of the switch 311 to control the formation of a circuit or a disconnection between each resistance tester and each corresponding probe.

[0086] The alarm sub-unit is used to issue an alarm when the resistance of the probe exceeds a preset resistance threshold. That is, before testing the resistance of the probe, the preset resistance threshold of the probe is set in the alarm sub-unit. When the actual resistance of the probe measured by the resistance tester 308 exceeds the preset resistance threshold, the alarm sub-unit issues an alarm sound and / or alarm text.

[0087] It should be noted that a probe whose resistance exceeds a preset resistance threshold is called an abnormal probe.

[0088] The alarm subunit at least includes: a speaker (not shown) and a resistance value comparator (not shown).

[0089] The resistance value comparator is used to compare the resistance value difference between the actual resistance measured by the probe and the preset resistance threshold.

[0090] In this embodiment, the alarm subunit is coupled to the resistance tester 308 .

[0091] The display subunit 310 is connected to the resistance tester 308 and is used to display the resistance value of the probe tested by the resistance tester 308, that is, the display subunit 310 displays the actual resistance of the probe tested by the resistance tester 308. The display subunit 310 includes at least: a display and a connecting line. The display is connected to the resistance tester 308 via the connecting line.

[0092] It should be noted that the display subunit 310 can display the actual resistance value of each probe on the display, and the position of the resistance value of each probe displayed on the display is arranged according to the position distribution of each probe on the needle card 100, and the resistance values exceeding the preset resistance threshold and the resistance values meeting the preset resistance threshold are displayed in different colors on the display, which facilitates the positioning of abnormal probes and improves the efficiency of probe monitoring.

[0093] In this embodiment, the probe resistance monitoring device includes: a data storage unit (not shown).

[0094] The data storage unit is used to store the resistance of the probe tested by the testing unit.

[0095] The data storage unit may include a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk. The storage medium may also include a non-volatile memory or a non-transitory memory. For a detailed description of the memory, please refer to the description of the automatic control system in the subsequent section.

[0096] In this embodiment, the data storage unit is coupled to the test unit to store the actual resistance of the probes tested by the test unit, so as to facilitate comparative analysis of the actual resistance of each probe.

[0097] refer to Figure 5 and Figure 6 In this embodiment, the probe resistance monitoring device includes: a push-pull unit 400.

[0098] The push-pull unit 400 is used to push the probe beyond the preset resistance threshold so that the tip of the probe protrudes along the axial direction F parallel to the probe, and the push-pull unit 400 is also used to pull the protruding probe back to its original position.

[0099] The push-pull unit 400 at least includes: multiple motors 401 and multiple manipulators 402 .

[0100] Each probe corresponds to a manipulator, and each manipulator corresponds to a motor. That is, each motor drives the manipulator corresponding thereto to move along an axial direction F parallel to the probe, and to advance and retract the probe corresponding to the motor.

[0101] In this embodiment, there are four motors 401 , namely motor 401 a , motor 401 b , motor 401 c and motor 401 d ; there are four manipulators 402 , namely manipulator 402 a , manipulator 402 b , manipulator 402 c and manipulator 402 d .

[0102] The probe 307a corresponds to the manipulator 402a, the manipulator 402a corresponds to the motor 401a, the probe 307b corresponds to the manipulator 402b, the manipulator 402b corresponds to the motor 401b, the probe 307c corresponds to the manipulator 402c, the manipulator 402c corresponds to the motor 401c, the probe 307d corresponds to the manipulator 402d, the manipulator 402d corresponds to the motor 401d.

[0103] When the actual resistance of the probe tested by the test unit exceeds the preset resistance threshold, for example, the resistance of the probe 307a exceeds the preset resistance threshold, the motor 401a drives the manipulator 402a downward along the axial direction F parallel to the probe 307a, and the manipulator 402a pushes the probe 307a so that the tip of the probe 307a protrudes along the axial direction F parallel to the probe 307a, so as to separately clean and / or inspect the protruding probe 307a.

[0104] After the protruding probe 307a is cleaned and / or inspected separately, the push-pull unit is further used to pull the protruding probe 307a back to its original position, so that the probe 307a returns to its original position.

[0105] The push-pull unit 400 has the following beneficial effects:

[0106] First, when one or more probes are tested and the actual resistance exceeds the preset resistance threshold (abnormal probes), these abnormal probes are pushed through the push-pull unit 400 to make their tips protrude, which is convenient for inspection and cleaning, thereby improving the efficiency of probe monitoring.

[0107] Second, when one or more probes are tested and the actual resistance exceeds the preset resistance threshold (abnormal probes), these abnormal probes are pushed and pulled through the unit 400 to make their tips protrude, which can accurately locate the abnormal probes without the need to manually search for the abnormal probes among all the probes, thereby improving the efficiency of probe monitoring.

[0108] Third, when the actual resistance of one or more probes is found to exceed the preset resistance threshold (abnormal probes), these abnormal probes are pulled out from the card pins through the push-pull unit 400 to facilitate replacement with new probes.

[0109] It should be noted that, in this embodiment, when the push-pull unit 400 pushes or pulls back the probe, the manipulator 402 grasps the protrusion 200 of the probe; in other embodiments, such as Figure 6 As shown, when the push-pull unit 400 pushes the probe, the manipulator 402 contacts the top end surface of the protrusion 200 , and when the push-pull unit 400 pulls back the probe, the manipulator 402 contacts the lower end surface of the protrusion 200 .

[0110] It should be noted that, in this embodiment, when the resistance tester tests that one or more of the probes 302a to 302d are abnormal probes, after the probe resistance monitoring device completes the resistance test of the probes 302a to 302d, the automatic control system (described below) automatically controls the push-pull unit 400 to push the abnormal probes among the probes 302a to 302d in a direction parallel to the probe axial direction F so that the needle tips of the abnormal probes protrude.

[0111] It should be noted that, in this embodiment, after the probe resistance monitoring device completes the resistance test of probes 302a to probes 302d, the automatic control system controls the robotic arm to separate the needle card 100 from the first test block 301 and the second test block 302, and the robotic arm will move the needle card 100 to the propulsion unit 400 to push the abnormal probe on the needle card 100.

[0112] It should be noted that the manipulators 402a to 402d can clamp and release the protrusion.

[0113] refer to Figure 7 In this embodiment, the probe resistance monitoring device includes: a detection unit 500.

[0114] The detection unit 500 is used to detect whether the probe pulled back by the push-pull unit 400 has returned to its original position.

[0115] The detection unit 500 includes: a coplanar measuring instrument 500a to detect whether the raised portion of the probe after being reset and the raised portions of the remaining probes are located in the same horizontal plane, that is, to detect whether the top end surface of the raised portion of the probe after being reset and the top end surface of the raised portions of the remaining probes are located in the same horizontal plane. In this embodiment, the detection unit detects whether the top end surface of the raised portion 200a of the probe 307a and the top end surfaces of probes 200b, probe 200b, and probe 200d are located in the same horizontal plane.

[0116] The coplanarity measuring instrument 500a includes one or more of a laser coplanarity measuring instrument, an optical coplanarity measuring instrument, a contact probe coplanarity measuring instrument, a white light interferometer coplanarity measuring instrument, and a 3D optical structure coplanarity measuring instrument. In this embodiment, the coplanarity measuring instrument 500a is a white light interferometer coplanarity measuring instrument.

[0117] It should be noted that, regarding the working principle of the coplanarity measuring instrument 500 a , reference may be made to relevant public technologies.

[0118] The detection unit 500 further includes: an out-of-plane alarm subunit 500b, which issues an alarm message when the coplanar measuring instrument 500a detects that the top end surface of the raised portion of the reset probe and the raised portion of the remaining probes are not in the same horizontal plane; in other embodiments, the out-of-plane alarm subunit 500b may not be included.

[0119] Accordingly, the present application provides a monitoring machine, which applies the probe resistance monitoring device described in the aforementioned embodiment; wherein the probe card 100 is located on the monitoring machine and is detachably connected to the monitoring machine.

[0120] Other components of the probe resistance monitoring device, such as the testing unit, the push-pull unit 400 , the detection unit 500 and other components are all detachably connected to the monitoring machine.

[0121] In this embodiment, the monitoring machine at least includes: a base (not shown), a bracket connected to the base, the needle card 100, the test unit, the push-pull unit 400, the detection unit 500 and other components are all detachably connected to the bracket, and the needle card 100, the test unit, the push-pull unit 400, the detection unit 500 and other components are adjustable in position on the bracket.

[0122] The probe resistance monitoring device includes: an automatic control system.

[0123] How the above-mentioned test unit, push-pull unit 400, detection unit 500 and other components work can be automatically controlled by an automatic control system.

[0124] The automatic control system at least includes: a computer-readable storage medium, a terminal, and a computer program product.

[0125] It should be noted that the test unit will transmit the position of the abnormal resistor to the automatic control system. The automatic control system controls the push-pull unit 400 through the position of the abnormal resistor to push the abnormal probe forward so that the needle tip of the abnormal probe protrudes from the needle tips of the remaining probes, thereby improving the probe monitoring efficiency.

[0126] The computer-readable storage medium stores a computer program, which, when executed by a computer, controls the operation of the test unit, push-pull unit 400, detection unit 500, and other components. The storage medium may include a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk. The storage medium may also include a non-volatile memory or a non-transitory memory.

[0127] The terminal includes a memory and a processor. The memory stores a computer program that can be run on the processor. When the processor runs the computer program, it controls the operation of components such as the test unit, the push-pull unit 400, and the detection unit 500.

[0128] The memory in the embodiments of the present application may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a ROM, a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct rambus RAM (DR RAM).

[0129] The computer program product includes a computer program / instruction, which is used to implement resistance testing and monitoring of the probe when executed by a processor.

[0130] In the embodiments of the present application, the processor may be a central processing unit (CPU), and may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc.

[0131] The above embodiments can be implemented in whole or in part by software, hardware, firmware or any other combination. When implemented using software, the above embodiments can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer program are loaded or executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer program can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer program can be transmitted from one website, computer, server or data center to another website, computer, server or data center by wired or wireless means.

[0132] In order to facilitate understanding of the probe resistance monitoring device described in the present application, a probe resistance monitoring method is provided accordingly.

[0133] refer to Figure 8 , is a flow chart of a probe resistance monitoring method in an embodiment of the present application.

[0134] Reference Image Figure 8In this embodiment, the number of the first test terminals 303 is 4, namely the first test terminal 303a, the first test terminal 303b, the first test terminal 303c and the first test terminal 303d; the number of the second test terminals 304 is 4, namely the second test terminal 304a, the second test terminal 304b, the second test terminal 304c and the second test terminal 304d; the number of the first test blocks 301 is 4, namely the first test block 301a, the first test block 301b, the first test block 301c and the first test block 301d; the number of the protrusions 200 is 4, namely the protrusion 200a, the protrusion 200b, the protrusion 200c and the protrusion 200d; the number of the second test blocks 302 is 4, namely the second test block 302a, the second test block 302b and the second test block 302c. 302b, a second test block 302c and a second test block 302d; the number of the probes is 4, namely probe 307a, probe 307b, probe 307c and probe 307d; the number of through holes on the needle card 100 is 4, namely needle cartoon hole 100a, needle cartoon hole 100b, needle cartoon hole 100c and needle cartoon hole 100d; the number of through holes on the first insulating plate 305 is 4, namely first insulating plate through hole 305a, first insulating plate through hole 305b, first insulating plate through hole 305c and first insulating plate through hole 305d; the number of through holes on the second insulating plate 306 is 4, namely second insulating plate through hole 306a, second insulating plate through hole 306b, second insulating plate through hole 306c and second insulating plate through hole 306d.

[0135] The first test end 303a corresponds to the first test block 301a, the first test block 301a corresponds to the protrusion 200a, the protrusion 200a corresponds to the end of the probe 307a, the probe 307a corresponds to the needle card hole 100a, the tip of the probe 307a corresponds to the second test block 302a, and the second test block 302a corresponds to the second test end 304a; the first test end 303b corresponds to the first test block 301b, the first test block 301b corresponds to the protrusion 200b, the protrusion 200b corresponds to the end of the probe 307b, the probe 307b corresponds to the needle card hole 100b, the tip of the probe 307b corresponds to the second test block 302b, and the second test block 302b corresponds to the second test end 304b; The first test end 303c corresponds to the first test block 301c, the first test block 301c corresponds to the protrusion 200c, the protrusion 200c corresponds to the end of the probe 307c, the probe 307c corresponds to the needle cartoon hole 100c, the tip of the probe 307c corresponds to the second test block 302c, and the second test block 302c corresponds to the second test end 304c; the first test end 303d corresponds to the first test block 301d, the first test block 301d corresponds to the protrusion 200d, the protrusion 200d corresponds to the end of the probe 307d, the probe 307d corresponds to the needle cartoon hole 100d, the tip of the probe 307d corresponds to the second test block 302d, and the second test block 302d corresponds to the second test end 304d.

[0136] refer to Figure 8 , combined with Figures 1 to 7 , describing the probe resistance monitoring method in an embodiment of the present application, comprising the following steps:

[0137] Step S11: The probe is placed on the needle card.

[0138] In this embodiment, the probe 307a is inserted into the needle cartoon hole 100a, the probe 307b is inserted into the needle cartoon hole 100b, the probe 307c is inserted into the needle cartoon hole 100c, and the probe 307d is inserted into the needle cartoon hole 100d by manual placement, automatic placement, or semi-automatic placement, for example, through the push-pull unit 400.

[0139] The coplanarity measuring instrument 500a of the detection unit 500 detects whether the top end surfaces of the protrusions 200 of the probes 307a to 307d are located in the same horizontal plane.

[0140] In this embodiment, the relative position between the first insulating plate 305 and the second insulating plate 306 is adjusted so that the distance between the first test block 301 and the second test block 302 is greater than or equal to the probe length (the probe length is the length along the axial direction F parallel to the probe), so that the probe can be placed between the first test block 301 and the second test block 302. Figure 1 shown.

[0141] For a detailed description of the needle card 100 and the probes, reference may be made to the description of the probe resistance monitoring device described above, which will not be repeated here.

[0142] In this embodiment, after the probe is installed on the needle card 100 , the needle card 100 is fixedly installed on the bracket.

[0143] Step S12: moving the needle card so that the tip of the probe is coupled to the second test block, and the end opposite to the tip of the probe is coupled to the first test block.

[0144] In this embodiment, the probe card 100 is placed between the first insulating plate 305 and the second insulating plate 306 along an axial direction F parallel to the probe, by a robotic arm, so that the tip of the probe 307a is aligned with the center of the second test block 302a, the center of the raised portion 200a of the probe 307a is aligned with the center of the first test block 301a, the tip of the probe 307b is aligned with the center of the second test block 302b, the center of the raised portion 200b of the probe 307b is aligned with the center of the first test block 301b, the tip of the probe 307c is aligned with the center of the second test block 302c, the center of the raised portion 200c of the probe 307c is aligned with the center of the first test block 301c, the tip of the probe 307d is aligned with the center of the second test block 302d, and the center of the raised portion 200d of the probe 307d is aligned with the center of the first test block 301d. In some embodiments, it is sufficient that the tip of the probe contacts the corresponding second test block 302 and the end of the probe contacts the corresponding first test block 301 .

[0145] The automatic control system controls the robotic arm to move the first insulating plate 305 and / or the second insulating plate 306 along the axial direction F parallel to the probe, so that the first test block 301 is electrically connected to the protrusion 200, and the second test block 302 is electrically connected to the tip of the probe.

[0146] In this embodiment, the first test block 301a is electrically connected to the protrusion 200a, the first test block 301b is electrically connected to the protrusion 200b, the first test block 301c is electrically connected to the protrusion 200c, the first test block 301d is electrically connected to the protrusion 200d, the second test block 302a is electrically connected to the tip of the probe 307a, the second test block 302b is electrically connected to the tip of the probe 307b, the second test block 302c is electrically connected to the tip of the probe 307c, and the second test block 302d is electrically connected to the tip of the probe 307d.

[0147] It should be noted that the robotic arms involved in this embodiment can be the same robotic arm or different robotic arms, and those skilled in the art can choose according to actual needs.

[0148] In some embodiments, the first insulating plate 305 and the second insulating plate 306 are adjusted and fixed, and the relative positions of the needle card 100 and the first insulating plate 305 and the second insulating plate 306 are moved and adjusted so that the tip of the probe is coupled to the second test block 302, and the end opposite to the tip of the probe is coupled to the first test block 301.

[0149] For a detailed description of the bracket, please refer to the description of the probe resistance monitoring device mentioned above, which will not be repeated here.

[0150] In this embodiment, the first insulating plate 305 , the second insulating plate 306 and the needle card 100 are all movable, and the movement of the first insulating plate 305 , the second insulating plate 306 and the needle card 100 is selected according to actual needs.

[0151] Step S13: The testing unit provides a test signal to the probe via the first test terminal and the second test terminal to test the resistance of the probe.

[0152] In this embodiment, step S13 includes the following sub-steps:

[0153] Sub-step S131: In this embodiment, the signal testing unit 309 controls the resistance tester 308 to provide test signals to the probes 307a, 307b, 307c, and 307d on the needle card 100 via the first test end 303 and the second test end 304, and synchronously tests the resistances of the probes 307a, 307b, 307c, and 307d on the needle card 100. That is, the signal testing unit 309 controls the resistance tester 308a to test the resistance of the probe 307a, the resistance tester 308b to test the resistance of the probe 307b, the resistance tester 308c to test the resistance of the probe 307c, and the resistance tester 308d to test the resistance of the probe 307d.

[0154] Sub-step S132: In response to the probe resistance exceeding the preset resistance threshold, the alarm sub-unit issues a warning message. In this embodiment, for example, when the measured resistance of the probe 307a exceeds the preset resistance threshold, the alarm sub-unit issues a warning message. That is, the preset resistance threshold of the probe is set before the test. When the actual resistance of the probe 307a measured by the resistance tester 308 exceeds the preset resistance threshold, the alarm sub-unit issues an alarm sound and / or alarm text.

[0155] Sub-step S133: the push-pull unit pushes the probe that exceeds the preset resistance threshold so that the tip of the probe that exceeds the preset resistance threshold protrudes along the axial direction F parallel to the probe; the protruding tip is inspected and / or cleaned; the push-pull unit pulls back the protruding probe.

[0156] like Figure 6 As shown, in this embodiment, when the actual resistance of the probe tested by the test unit exceeds the preset resistance threshold, for example, the resistance of the probe 307a exceeds the preset resistance threshold, the motor 401a drives the manipulator 402a downward along the axial direction F parallel to the probe, and the manipulator 402a pushes the probe 307a so that the tip of the probe 307a protrudes along the axial direction F parallel to the probe 307a, so as to separately clean and / or inspect the protruding probe 307a.

[0157] After the protruding probe 307a is cleaned and / or inspected separately, the push-pull unit 400 is further used to pull the protruding probe 307a back to its original position.

[0158] Sub-step S134: The detection unit 500 detects whether the protruding probe is returned to its original position after being pulled back by the push-pull unit 400.

[0159] In this embodiment, the detection unit 500 detects whether the protruding probe 307a pulled back by the push-pull unit 400 is returned to its original position, that is, it detects that the raised portion 200 of the probe 307a after returning to its original position and the top end surfaces of the raised portions 200 of the remaining probes 307b to probe 307d are not in the same horizontal plane, and the out-of-plane alarm sub-unit 500b issues an alarm message, and the push-pull unit 400 continues to adjust the position of the probe 307a until the raised portion 200 of the probe 307a after returning to its original position and the top end surfaces of the raised portions 200 of the remaining probes 307b to probe 307d are in the same horizontal plane.

[0160] For detailed descriptions of the test unit, the push-pull unit 400 and the detection unit 500 , reference may be made to the description of the aforementioned probe resistance monitoring device, which will not be repeated here.

[0161] It should be noted that, for other relevant information related to the probe resistance monitoring method, reference may be made to the description of the aforementioned probe resistance monitoring device, which will not be elaborated here.

[0162] It should be noted that the present application uses a probe resistance monitoring device, a monitoring machine and a monitoring method to monitor the probe by testing the resistance of the probe, namely, probe monitoring. That is, before and after testing the wafer, the probe is inspected by testing the probe resistance. The main inspection items include: probe foreign matter, needle tip wear, probe bending and probe contamination, which improves the efficiency of probe monitoring.

[0163] Although the present invention has been disclosed above in terms of preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solutions of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the scope of protection of the technical solutions of the present invention.

Claims

1. A probe resistance monitoring device for monitoring the resistance of a probe, characterized in that: include: A testing unit comprising a first testing end and a second testing end; A needle card, used for carrying the probe; a first test block coupled to the first test terminal; a second test block, disposed opposite to the first test block and coupled to the second test end; The tip of the probe is coupled to the second test block, and the end opposite to the tip of the probe is coupled to the first test block; The testing unit provides a test signal to the tip and the end of the probe via the first test terminal and the second test terminal to test the resistance of the probe.

2. The probe resistance monitoring device according to claim 1, wherein: The number of the first test end, the second test end, the first test block, and the second test block is respectively equal to the number of the probes; the probes include any one of the following: The number of the probes is equal to 1; The number of the probes is greater than or equal to 2, and the first test ends correspond to the first test blocks in a one-to-one manner, the first test blocks correspond to the ends of the probes in a one-to-one manner, and the second test ends correspond to the second test blocks in a one-to-one manner, and the second test blocks correspond to the tips of the probes in a one-to-one manner; Disconnecting the first test terminals from each other; Disconnecting the plurality of second test terminals; Disconnecting the first test blocks from each other; The plurality of second test blocks are disconnected from each other.

3. The probe resistance monitoring device according to claim 1, wherein: The test unit includes: a resistance tester, a signal test unit, a display subunit, and an alarm subunit; The resistance tester is coupled to the first test terminal and the second test terminal; The signal testing unit is coupled to the resistance tester and is used to control the resistance tester to test the resistance of at least one probe at a time; The alarm subunit is used to issue an alarm when the resistance of the probe exceeds a preset resistance threshold; The display subunit is connected to the resistance tester and is used to display the resistance value of the probe tested by the resistance tester.

4. The probe resistance monitoring device according to claim 1, wherein: Also includes: The data storage unit is used to store the resistance of the probe tested by the test unit.

5. The probe resistance monitoring device according to claim 1, wherein: The end of the probe is provided with a protrusion; The shape of the protrusion includes one or more of a cylinder, an elliptical cylinder, a square cylinder, and a prism.

6. The probe resistance monitoring device according to claim 5, wherein: The first test block is coupled to the protrusion of the probe tip.

7. The probe resistance monitoring device according to claim 5, wherein: include: The push-pull unit is used to push the probe beyond a preset resistance threshold so that the tip of the probe protrudes in a direction parallel to the axial direction of the probe, and the push-pull unit is also used to pull the protruding probe back to its original position.

8. The probe resistance monitoring device according to claim 7, wherein: Also includes: a detection unit, configured to detect whether the probe pulled back by the push-pull unit has returned to its original position; The detection unit includes: a coplanarity measuring instrument to detect whether the raised portion of the reset probe and the raised portions of the remaining probes are located in the same horizontal plane; The coplanarity measuring instrument includes one or more of a laser coplanarity measuring instrument, an optical coplanarity measuring instrument, a contact probe coplanarity measuring instrument, a white light interferometer coplanarity measuring instrument and a 3D optical structure coplanarity measuring instrument.

9. The probe resistance monitoring device according to claim 1, wherein: Also includes: a first insulating plate and a second insulating plate; The first test block is positioned on the first insulating plate; The second testing block is positioned on the second insulating plate, and the second testing block is arranged opposite to the first testing block.

10. A monitoring machine, characterized in that: include: The probe resistance monitoring device according to any one of claims 1 to 9; Wherein, the needle card is located on the monitoring machine and is detachably connected to the monitoring machine.

11. A probe resistance monitoring method, applied to the probe resistance monitoring device according to any one of claims 1 to 9, characterized in that: include: The probe is placed on the needle card; Moving the needle card so that the tip of the probe is coupled to the second test block and the end opposite to the tip of the probe is coupled to the first test block; The testing unit provides a test signal to the probe via the first test terminal and the second test terminal to test the resistance of the probe.

12. The probe resistance monitoring method according to claim 11, wherein: Also includes: In response to the probe resistance exceeding a preset resistance threshold, the alarm subunit issues an alarm message.

13. The probe resistance monitoring method according to claim 12, wherein: Also includes: The push-pull unit pushes the probe that exceeds the preset resistance threshold so that the tip of the probe that exceeds the preset resistance threshold protrudes in a direction parallel to the axial direction of the probe; inspecting and / or cleaning the protruding tip; The push-pull unit pulls back the protruding probe.

14. The probe resistance monitoring method according to claim 13, wherein: Also includes: The detection unit detects whether the protruding probe pulled back by the push-pull unit has returned to its original position.