Light-emitting panel, preparation method thereof and display device

Abstract

The invention discloses a light-emitting panel, a preparation method thereof and a display device. The light-emitting panel comprises a plurality of glass substrates, the plurality of glass substrates are adjacently arranged, and each glass substrate comprises a substrate, a driving circuit layer and a plurality of light-emitting units which are arranged at intervals; the driving circuit layer is arranged on one surface of the substrate, and the multiple light-emitting units are arranged on the side, away from the substrate, of the driving circuit layer and electrically connected with the driving circuit layer; wherein the driving circuit layer of each glass substrate comprises at least two circuit conduction areas which are arranged at intervals, and the circuit conduction areas and the light emitting units are arranged at intervals; each line conduction area comprises a first electrode port and a second electrode port, in the two adjacent glass substrates, the first electrode ports of the adjacent line conduction areas are electrically connected with each other, and the second electrode ports of the adjacent line conduction areas are electrically connected with each other. Through the arrangement, the problems of insufficient utilization rate of the large glass plate and high cost of interface devices and manual plugging and unplugging in the prior art are solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting panel, a preparation method thereof, and a display device. Background Art

[0002] With the continuous advancement of LCD (Liquid Crystal Display) technology, the manufacturing process of glass-based light strips has become increasingly mature. However, it is currently mainly limited to the application of single light strips and cannot meet the application of large-size, multi-row MiniLED or MicroLED direct-lit light panels. It can only be achieved through splicing.

[0003] Currently, it is usually necessary to set an external interface on each light bar to facilitate plugging and unplugging operations through an interface device (such as a connector), so that the light bar can be connected to an external power source through the interface device such as the connector.

[0004] In the related art, there are problems such as insufficient utilization of large glass panels and high costs for interface devices and manual plugging and unplugging. Summary of the Invention

[0005] The present application mainly provides a light-emitting panel and a preparation method thereof, and a display device to solve the problems in the related art of insufficient utilization of large glass panels, high costs of interface devices and manual plugging and unplugging.

[0006] To solve the above technical problems, a technical solution adopted in this application is to provide a light-emitting panel, comprising:

[0007] A plurality of glass substrates are arranged adjacent to each other; each of the glass substrates comprises a substrate, a driving circuit layer, and a plurality of light-emitting units spaced apart from each other; the driving circuit layer is arranged on a surface of the substrate, and the plurality of light-emitting units are arranged on a side of the driving circuit layer away from the substrate and electrically connected to the driving circuit layer;

[0008] The driving circuit layer of each glass substrate includes at least two circuit conduction areas spaced apart from each other, and the circuit conduction areas are spaced apart from the light-emitting units; each of the circuit conduction areas includes a first electrode port and a second electrode port; in two adjacent glass substrates, the first electrode ports of the circuit conduction areas adjacent to each other are electrically connected to each other, and the second electrode ports are electrically connected to each other.

[0009] In some embodiments, the light emitting panel further includes an adhesive member and a chassis, and the plurality of glass substrates are disposed on one side of the chassis;

[0010] The substrate includes a first surface and a second surface opposite to each other. The driving circuit layer is arranged on the first surface, and the adhesive is arranged on the second surface. Two ends of the adhesive are respectively connected to the substrate and the chassis.

[0011] In some embodiments, the chassis includes a bottom plate and an annular side plate connected to each other, the annular side plate is arranged to form a receiving space, and the plurality of glass substrates are arranged in the receiving space; the two ends of the adhesive member are respectively connected to the substrate and the bottom plate;

[0012] In the third direction, the surface of the annular side plate away from the bottom plate is flush with the first surface; the light-emitting panel further comprises a reflective layer and a transparent colloid layer, the reflective layer covers the surface of the annular side plate away from the bottom plate and the first surface, and exposes the light-emitting unit and the circuit conductive area; the transparent colloid layer covers the reflective layer;

[0013] Or, in the third direction, the annular side plate is away from the surface of the base plate and is located on the side of the first surface away from the adhesive; the light-emitting panel also includes a reflective packaging colloid layer, which covers the first surface and exposes the light-emitting unit and the circuit conduction area, and the surface of the reflective packaging colloid layer away from the substrate is flush with the surface of the annular side plate away from the base plate.

[0014] In some embodiments, the reflective layer is a white coating, the transparent colloid layer is made of a transparent resin colloid, and the reflective encapsulation colloid layer is made of a transparent resin colloid containing a white coating.

[0015] And / or, the chassis is made of any one of plastic, electro-galvanized steel, hot-dip galvanized steel or aluminum alloy;

[0016] And / or, the light-emitting unit is a light-emitting diode or a micro light-emitting diode; the driving circuit layer further includes a solder pin provided corresponding to the light-emitting unit, the light-emitting unit being electrically connected to the solder pin; the height of the solder pin is 0.05-0.2 mm; and / or the height of the circuit conductive area is 0.05-0.2 mm;

[0017] and / or, the thickness of the adhesive member is 0.1-1 mm;

[0018] And / or, the first electrode ports or the second electrode ports of the circuit conductive areas adjacent to each other on two adjacent glass substrates are electrically connected by a conductive wire through a welding process; the conductive wire includes any one or more of a copper wire, a silver wire, and a gold wire.

[0019] In some embodiments, the plurality of glass substrates include a first glass substrate and a second glass substrate; the first glass substrate includes a first substrate, and the second glass substrate includes a second substrate;

[0020] In a first direction, the length of the first substrate is a first size, and the length of the second substrate is a second size;

[0021] The first size is equal to the second size; or

[0022] The first size is smaller than the second size, and the second size is equal to N times the first size; wherein N is a positive integer greater than 1; and one second substrate is provided corresponding to N first substrates;

[0023] The first substrate and the second substrate are formed by cutting glass remnants.

[0024] In some embodiments, the first dimension is smaller than the second dimension; along the first direction, the first substrate and the second substrate each have a first end and a second end opposite to each other;

[0025] The surface of each first substrate is provided with four mutually spaced circuit conduction areas, wherein the first end and the second end of the first substrate are respectively provided with two circuit conduction areas; the surface of each second substrate is provided with two mutually spaced circuit conduction areas;

[0026] In the first direction, a plurality of the first glass substrates are closely arranged, and among two adjacent first glass substrates, the two circuit conductive areas at the second end of one of the first glass substrates are electrically connected to the two circuit conductive areas at the first end of the other first glass substrate in a one-to-one correspondence;

[0027] In the second direction, the two circuit conductive areas at the first end of the first glass substrate are electrically connected one-to-one with the circuit conductive areas at the first end of the first glass substrate located on both sides thereof, or are electrically connected one-to-one with the circuit conductive areas at the first end of the second glass substrate located on both sides thereof.

[0028] In some embodiments, a distance between centers of two adjacent light-emitting units is equal to a width of the substrate in the second direction.

[0029] To solve the above technical problems, another technical solution adopted in this application is to provide a method for preparing a light-emitting panel, comprising:

[0030] Providing a glass scrap, and cutting the glass scrap to form a plurality of substrates; wherein a driving circuit layer is provided on one surface of the substrate, the driving circuit layer of each substrate includes at least two circuit conductive areas spaced apart from each other, and each circuit conductive area includes a first electrode port and a second electrode port;

[0031] A plurality of light-emitting units are bonded to a side of the driving circuit layer away from the substrate to form a plurality of glass substrates; wherein the plurality of light-emitting units are electrically connected to the driving circuit layer, and the circuit conductive area is spaced apart from the light-emitting units;

[0032] The plurality of glass substrates are spliced closely together, and the first electrode ports of the adjacent circuit conductive areas in two adjacent glass substrates are electrically connected to each other, and the second electrode ports are electrically connected to each other.

[0033] In some embodiments, the substrate includes a first surface and a second surface opposite to each other, and the driving circuit layer is disposed on the first surface;

[0034] The step of closely splicing the plurality of glass substrates comprises:

[0035] attaching an adhesive member to the second surface of each of the substrates;

[0036] A chassis is provided, and a plurality of substrates are sequentially attached to the chassis through the adhesive.

[0037] In some embodiments, the chassis includes a bottom plate and an annular side plate connected to each other, and the annular side plate is arranged to form an accommodating space;

[0038] The step of sequentially attaching the plurality of substrates to the chassis via the adhesive comprises:

[0039] The plurality of substrates are sequentially attached to the bottom plate through the adhesive; wherein the plurality of glass substrates are located in the accommodating space;

[0040] Wherein, in the third direction, the surface of the annular side plate away from the bottom plate is flush with the first surface, and the method for preparing the light-emitting panel further includes:

[0041] A reflective layer is formed on a side of the light-emitting unit away from the substrate; wherein the reflective layer covers the surface of the annular side plate away from the bottom plate and the first surface, and exposes the light-emitting unit and the circuit conductive area;

[0042] forming a transparent colloid layer on a side of the reflective layer away from the substrate; wherein the transparent colloid layer covers the reflective layer;

[0043] Alternatively, in the third direction, the annular side plate is away from the surface of the bottom plate and is located on a side of the first surface away from the adhesive member, and the method for preparing the light-emitting panel further includes:

[0044] A reflective packaging colloid layer is formed on a side of the light-emitting unit away from the substrate; wherein the reflective packaging colloid layer covers the first surface and exposes the light-emitting unit and the circuit conduction area, and the surface of the reflective packaging colloid layer away from the substrate is flush with the surface of the annular side plate away from the bottom plate.

[0045] To solve the above technical problems, another technical solution adopted by the present application is to provide a display device, comprising:

[0046] Any of the above-mentioned light-emitting panels, or a light-emitting panel manufactured using any of the above-mentioned methods for manufacturing a light-emitting panel;

[0047] The light emitting panel is configured to provide the light source required for the display device to display images.

[0048] The beneficial effects of the present application are as follows: Different from the prior art, the present application discloses a light-emitting panel, a method for manufacturing the same, and a display device. The light-emitting panel includes multiple glass substrates, which are arranged adjacent to each other. Each glass substrate includes a substrate, a drive circuit layer, and multiple light-emitting units spaced apart from each other. The drive circuit layer is arranged on one surface of the substrate, and the multiple light-emitting units are arranged on a side of the drive circuit layer away from the substrate and electrically connected to the drive circuit layer. The drive circuit layer of each glass substrate includes at least two spaced-apart circuit conduction areas, which are spaced apart from the light-emitting units. Each circuit conduction area includes a first electrode port and a second electrode port. In two adjacent glass substrates, the first electrode ports of the adjacent circuit conduction areas are electrically connected to each other, and the second electrode ports are electrically connected to each other. By configuring the light-emitting panel to include multiple adjacent glass substrates, the light-emitting panel is formed by splicing the multiple glass substrates together, thereby improving the utilization rate of large glass panels; and the driving circuit layer of each glass substrate includes at least two mutually spaced circuit conduction areas. By electrically connecting the first electrode ports of the mutually adjacent circuit conduction areas of two adjacent glass substrates to each other, and electrically connecting the second electrode ports to each other, the adjacent glass substrates can be electrically connected directly through the circuit conduction areas, thereby achieving electrical connection between the first and last glass substrates, and achieving circuit conduction between the multiple glass substrates. There is no need to provide an external interface on each glass substrate, nor is there a need to use interface devices such as connectors to perform manual plugging and unplugging operations at the external interface position to achieve electrical connection between each glass substrate and an external power supply. This effectively saves the cost of interface devices and manual plugging and unplugging, and solves the problems of insufficient utilization rate of large glass panels and high cost of interface devices and manual plugging and unplugging in related technologies. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0050] Figure 1 This is a structural diagram of an implementation scheme of a light-emitting panel provided in the first embodiment of the present application;

[0051] Figure 2 yes Figure 1 A schematic structural diagram of a glass substrate of a light-emitting panel is provided;

[0052] Figure 3 yes Figure 2 A schematic cross-sectional view of a provided glass substrate;

[0053] Figure 4 yes Figure 2 A schematic diagram of a cutting method for a glass substrate according to an embodiment of the present invention is provided;

[0054] Figure 5 is a structural diagram of a light-emitting panel provided in a second embodiment of the present application;

[0055] Figure 6 yes Figure 5 A schematic structural diagram of an embodiment of a first glass substrate of a light-emitting panel is provided;

[0056] Figure 7 yes Figure 6 A schematic cross-sectional view of a first glass substrate is provided;

[0057] Figure 8 yes Figure 5 A schematic diagram of a cutting method for an embodiment of a substrate of a light-emitting panel is provided;

[0058] Figure 9 This is a schematic structural diagram of an implementation scheme of a light-emitting panel provided in the third embodiment of the present application;

[0059] Figure 10 yes Figure 9 A schematic cross-sectional view of a light emitting panel is provided;

[0060] Figure 11 yes Figure 9 A schematic cross-sectional view of another embodiment of the light-emitting panel is provided;

[0061] Figure 12 yes Figure 9A schematic cross-sectional view of another embodiment of a light-emitting panel is provided;

[0062] Figure 13 1 is a flow chart of a method for preparing a light-emitting panel provided in a fourth embodiment of the present application;

[0063] Figure 14 yes Figure 13 A schematic flow chart of step S3 of an embodiment of a method for preparing a light-emitting panel is provided;

[0064] Figure 15 1 is a flow chart of a method for preparing a light-emitting panel according to a fifth embodiment of the present application;

[0065] Figure 16 1 is a flow chart of a method for preparing a light-emitting panel provided in a sixth embodiment of the present application;

[0066] Figure 17 is a structural diagram of an implementation of a display device provided in the seventh embodiment of the present application;

[0067] Figure 18 It is a structural diagram of another embodiment of the display device provided in the seventh embodiment of the present application.

[0068] Figure Number:

[0069] 400, display device; 300, housing; 200, display panel; 100, light-emitting panel; 1, glass substrate; 11, first glass substrate; 12, second glass substrate; 2, substrate; 21, first substrate; 22, second substrate; 3, driving circuit layer; 31, solder foot; 32, circuit conduction area; 33, first electrode port; 34, second electrode port; 35, conduction line; 4, light-emitting unit; 5, chassis; 51, bottom plate; 52, annular side plate; 6, adhesive; 7, reflective layer; 8, transparent colloid layer; 9, reflective encapsulation colloid layer. DETAILED DESCRIPTION

[0070] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0071] The terms "first", "second" and "third" in the embodiments of the present application are only used for descriptive purposes and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second" and "third" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally also include steps or units that are not listed, or may optionally also include other steps or units inherent to these processes, methods, products or devices.

[0072] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0073] See Figures 1 to 12 , Figure 1 This is a structural diagram of an embodiment of a light-emitting panel provided in the first embodiment of the present application. Figure 2 yes Figure 1 A schematic structural diagram of a glass substrate of a light-emitting panel is provided. Figure 3 yes Figure 2 A schematic cross-sectional view of a glass substrate is provided, Figure 4 yes Figure 2 A schematic diagram of a cutting method for a glass substrate according to an embodiment of the present invention is provided. Figure 5 is a structural diagram of a light-emitting panel provided in the second embodiment of the present application, Figure 6 yes Figure 5 A schematic structural diagram of an embodiment of a first glass substrate of a light-emitting panel is provided. Figure 7 yes Figure 6 A schematic cross-sectional view of a first glass substrate is provided, Figure 8 yes Figure 5 A schematic diagram of a cutting method for an embodiment of a substrate of a light-emitting panel is provided. Figure 9 : is a structural diagram of an embodiment of a light-emitting panel provided in the third embodiment of the present application. Figure 10 yes Figure 9 A schematic cross-sectional view of a light-emitting panel is provided, Figure 11 yes Figure 9 A schematic cross-sectional view of another embodiment of the light-emitting panel is provided. Figure 12 yes Figure 9 A schematic cross-sectional view of another embodiment of a light-emitting panel is provided.

[0074] See also Figures 1 to 4 The first embodiment of the present application provides a light emitting panel 100, such as Figure 1 As shown, the light-emitting panel 100 includes multiple glass substrates 1, which are arranged in close proximity. Each glass substrate 1 includes a substrate 2, a drive circuit layer 3, and multiple mutually spaced light-emitting units 4. The drive circuit layer 3 is arranged on a surface of the substrate 2, and the multiple light-emitting units 4 are arranged on a side of the drive circuit layer 3 away from the substrate 2 and are electrically connected to the drive circuit layer 3. Specifically, the drive circuit layer 3 of each glass substrate 1 includes at least two mutually spaced circuit conduction areas 32. The circuit conduction areas 32 and the multiple light-emitting units 4 are spaced apart. Each circuit conduction area 32 includes a first electrode port 33 and a second electrode port 34. In two adjacent glass substrates 1, the first electrode ports 33 of the mutually adjacent circuit conduction areas 32 are electrically connected to each other, and the second electrode ports 34 are electrically connected to each other. The substrate 2 is formed by cutting glass scrap.

[0075] It can be understood that by configuring the light-emitting panel 100 to include multiple adjacent glass substrates 1, the light-emitting panel 100 is formed by splicing multiple glass substrates 1 together, thereby improving the utilization rate of large glass panels. The driving circuit layer 3 of each glass substrate 1 includes at least two circuit conduction areas 32 spaced apart from each other. By electrically connecting the first electrode ports 33 of the adjacent circuit conduction areas 32 in two adjacent glass substrates 1 to each other, and electrically connecting the second electrode ports 34 to each other, the adjacent glass substrates 1 can be directly electrically connected through the circuit conduction areas 32, thereby achieving electrical connection between the first and last glass substrates 1, and achieving circuit conduction between the multiple glass substrates 1. There is no need to provide an external interface on each glass substrate 1, nor is there any need to use interface devices such as connectors to perform manual plugging and unplugging operations at the external interface position to achieve electrical connection between each glass substrate 1 and an external power supply. This effectively saves the cost of interface devices and manual plugging and unplugging, and solves the problems of insufficient utilization of large glass panels and high cost of interface devices and manual plugging and unplugging in the related art.

[0076] In some embodiments, the plurality of glass substrates 1 include a first glass substrate 11 and a second glass substrate 12. The first glass substrate 11 includes a first substrate 21, and the second glass substrate 12 includes a second substrate 22. The first substrate 21 and the second substrate 22 are both formed by cutting glass scraps. That is, the substrate 2 of the glass substrate 1 is cut from glass scraps from a large glass plate, which can effectively utilize the glass scraps from the large glass plate and improve the utilization rate of the large glass plate.

[0077] In some embodiments, the first substrate 21 and the second substrate 22 are both rectangular, with the widths of the first substrate 21 and the second substrate 22 being equal, which facilitates cutting and splicing. In other embodiments, the first substrate 21 and the second substrate 22 may also be in other shapes that facilitate splicing, such as rhombuses, squares, regular polygons, etc. Specifically, in the first direction, the length of the first substrate 21 is a first dimension, and the length of the second substrate 22 is a second dimension.

[0078] Specifically, such as Figures 1 to 4 As shown, in some embodiments, the first size is equal to the second size, wherein the first size may be L1 and the second size may be L2, that is, L1=L2. Figure 4 As shown, the residual material area of a large glass plate (such as a large plate used to make a color film (CF) substrate or an array (TFT) substrate) can be used to cut the residual material area of the large glass plate into multiple first substrates 21 with a first length (L1) and multiple second substrates 22 with a second length (L2), so as to improve the utilization rate of the large glass plate. At the same time, the lengths of the first substrates 21 and the second substrates 22 can also be shortened, which facilitates the splicing and assembly of the multiple first substrates 21 and the second substrates 22, thereby improving the application range of the first substrates 21 and the second substrates 22.

[0079] That is, in this embodiment, the structures of the first substrate 21 and the second substrate 22 can be identical, and the structures of the first glass substrate 11 and the second glass substrate 12 can also be identical. Each first glass substrate 11 and each second glass substrate 12 are bonded with multiple light-emitting units 4, which are spaced apart from each other. Specifically, the light-emitting units 4 can be light-emitting diodes or micro-light-emitting diodes, such as MiniLEDs or MicroLEDs.

[0080] Specifically, the driving circuit layer 3 also includes solder pins 31 corresponding to the light-emitting units 4. Each light-emitting unit 4 has a corresponding solder pin 31, and the light-emitting unit 4 is electrically connected to the solder pin 31. Specifically, the light-emitting unit 4 and the solder pin 31 can be electrically connected by welding or other methods, thereby achieving an electrical connection between the light-emitting unit 4 and the driving circuit layer 3 and bonding the light-emitting unit 4 to the glass substrate 1. In one specific embodiment, the height of the solder pin 31 is 0.05-0.2 mm, which facilitates electrical connection between the solder pin 31 and the light-emitting unit 4 by welding or other methods.

[0081] In some embodiments, the driving circuit layer 3 can be directly formed on the residual material area of the large glass plate. For example, the driving circuit layer 3 can be formed by printing in the same way as the circuit forming method of the color film substrate or the array substrate. After the driving circuit layer 3 is formed on the residual material area of the large glass plate, the residual material area can be cut to form multiple glass substrates 1 that do not include the light-emitting unit 4, and then multiple light-emitting units 4 are bonded to the driving circuit layers 3 of the multiple glass substrates 1. This can save processes, save costs, and improve production efficiency.

[0082] In other embodiments, after the residual material area of the large glass plate is cut to form multiple substrates 2, a driving circuit layer 3 is formed on the surface of each of the multiple substrates 2, and multiple light-emitting units 4 are bonded to form multiple glass substrates 1, which can be designed as needed.

[0083] In a specific embodiment, the second direction is perpendicular to the first direction. The first direction is the length direction of the substrate 2 , and the second direction is the width direction of the substrate 2 , or may be the direction in which multiple glass substrates 1 are spliced together.

[0084] In some embodiments, as Figure 1 As shown, the distance between the centers of two adjacent light-emitting units 4 is equal to the width of the substrate 2 in the second direction. Specifically, the width of the substrate 2 can be a third dimension, which can be W, and the distance between the centers of two adjacent light-emitting units 4 can be a fourth dimension, which can be P, that is, W = P. Through the above arrangement, after multiple glass substrates 1 are spliced together to form the light-emitting panel 100, the multiple light-emitting units 4 of the glass substrates 1 can be evenly spaced in the first and second directions, thereby improving the light uniformity of the light-emitting panel 100 and enhancing the performance of the light-emitting panel 100.

[0085] In other embodiments, the plurality of light emitting units 4 may not be distributed at equal intervals, and the widths of the first substrate 21 and the second substrate 22 in the second direction may not be equal, which can be designed as needed.

[0086] In one embodiment, if Figures 1 to 4 As shown, the lengths of the multiple substrates 2 are equal, and the multiple glass substrates 1 are spliced together along the second direction. Specifically, since the first glass substrate 11 and the second glass substrate 12 have the same structure, the multiple glass substrates 1 can all be the first glass substrate 11, or all be the second glass substrate 12, or part can be the first glass substrate 11 and the other part can be the second glass substrate 12. Two circuit conductive areas 32 are provided on each glass substrate 1. The two circuit conductive areas 32 can be provided at the same end of the glass substrate 1, or at opposite ends of the glass substrate 1. Specifically, as shown in FIG. Figures 1 to 3As shown, the two circuit conducting areas 32 of each glass substrate 1 are both arranged at the same end of the glass substrate 1 , which makes it easier to electrically connect the circuit conducting areas 32 of two adjacent glass substrates 1 .

[0087] In one embodiment, the height of the conductive area 32 is 0.05-0.2 mm, which facilitates corresponding electrical connection between the first electrode ports 33 or the second electrode ports 34 of the conductive areas 32 of two adjacent glass substrates 1. In one embodiment, the height of the conductive area 32 is equal to the height of the solder pins 31 of the driving circuit layer 3 used to bond the light-emitting units 4. This facilitates ensuring the height consistency of the glass substrates 1, improving the uniformity of the glass substrates 1, and thereby enhancing the performance of the light-emitting panel 100.

[0088] In some embodiments, the first electrode ports 33 or second electrode ports 34 of adjacent circuit conductive areas 32 of two adjacent glass substrates 1 are electrically connected using conductive wires 35 and a welding process. Specifically, one of the first electrode port 33 or the second electrode port 34 can be a positive electrode port, and the other can be a negative electrode port. The conductive wires 35 can include any one or more of copper wire, silver wire, and gold wire. A welding process can be used to weld the first electrode ports 33 and the second electrode ports 34 of the corresponding circuit conductive areas 32 of the two adjacent glass substrates 1 to each other via the conductive wires 35, and to weld the second electrode ports 34 to each other via the conductive wires 35. Specifically, one end of a conductive wire 35 is welded to the first electrode port 33 of the circuit conductive area 32 of one of the two adjacent glass substrates 1, and the other end is welded to the first electrode port 33 of the corresponding circuit conductive area 32 of the other glass substrate 1. Another conductive wire 35 has one end welded to the second electrode port 34 of the circuit conductive area 32 of one of the two adjacent glass substrates 1, and the other end welded to the second electrode port 34 of the corresponding circuit conductive area 32 of the other glass substrate 1, thereby achieving corresponding electrical connections between the circuit conductive areas 32 of the two adjacent glass substrates 1. Specifically, the welding between the conductive wire 35 and the first and second electrode ports 33, 34 of the circuit conductive area 32 can be achieved through an automated welding process, which can improve processing efficiency and increase production capacity.

[0089] In other embodiments, other methods may be adopted to achieve one-to-one electrical connection between the first electrode ports 33 or the second electrode ports 34 of the corresponding circuit conductive areas 32 of two adjacent glass substrates 1 , and the design may be performed as needed.

[0090] In other embodiments, the multiple glass substrates 1 of the light-emitting panel 100 may be spliced together along the first direction, or simultaneously spliced along the first direction and the second direction, to obtain the desired shape and size of the light-emitting panel 100. This design can be based on actual needs and is not limited in this application. Specifically, when the multiple glass substrates 1 are spliced together along the first direction and the second direction, each glass substrate 1 may have another number of circuit conductive areas 32. For example, four circuit conductive areas 32 may be provided to achieve electrical connection between the multiple glass substrates 1 in both the first direction and the second direction.

[0091] In another embodiment, specifically, Figures 5 to 8 As shown, the light-emitting panel 100 includes multiple first glass substrates 11 and multiple second glass substrates 12. The first dimension of the first substrate 21 is smaller than the second dimension of the second substrate 22, and the second dimension is equal to N times the first dimension. That is, in the first direction, the length of the second substrate 22 is equal to N times the length of the first substrate 21, L2 = N * L1. Where N is a positive integer greater than 1, for example, N can be any number such as 2, 3, 4, 5, 6, etc., and one second substrate 22 can be provided corresponding to N first substrates 21.

[0092] In one embodiment, Figure 5 As shown, the second size is equal to twice the first size, and one second substrate 22 can be provided corresponding to two first substrates 21. In this embodiment, the lengths of the first glass substrate 11 and the second glass substrate 12 are different, which is also conducive to expanding the application range of the glass substrate 1 and meeting the size requirements of more light-emitting panels 100.

[0093] Specifically, such as Figure 8 As shown, the residual material area of a large glass plate (such as a large plate used to make a color film substrate or an array substrate) can be used to cut the residual material area of the large glass plate into a plurality of first substrates 21 with a first length (L1) and a plurality of second substrates 22 with a second length (L2). The first size is smaller than the second size. The cutting method can be adjusted to define the sizes of the first substrates 21 and the second substrates 22 according to the size of the residual material area. The first substrates 21 and the second substrates 22 are then spliced and combined to obtain a light-emitting panel 100 of a target size. This can maximize the use of the residual material area of the large glass plate and maximize the utilization rate of the large glass plate.

[0094] In some embodiments, as Figures 5 to 8As shown, along the first direction, the first substrate 21 and the second substrate 22 each have a first end and a second end opposite each other. Four mutually spaced wiring conductive areas 32 are provided on the surface of each first substrate 21. In one specific embodiment, two wiring conductive areas 32 are provided on the first and second ends of the first substrate 21, respectively. That is, two mutually spaced wiring conductive areas 32 are provided on the first end of the first substrate 21, and two mutually spaced wiring conductive areas 32 are provided on the second end of the first substrate 21. Two mutually spaced wiring conductive areas 32 are provided on the surface of each second substrate 22. The two wiring conductive areas 32 can be provided at both the first and second ends of the second substrate 22, or separately at the first and second ends of the second substrate 22.

[0095] In other embodiments, the four circuit conduction areas 32 on the surface of the first substrate 21 and the two circuit conduction areas 32 on the surface of the second substrate 22 may also be arranged at other positions, as long as electrical connection between the circuit conduction areas 32 on the surfaces of adjacent first substrates 21 and / or second substrates 22 can be achieved in both the first direction and the second direction.

[0096] Specifically, in some embodiments, Figures 5 to 8 As shown, in the first direction, multiple first glass substrates 11 are arranged closely together, and in two adjacent first glass substrates 11, the two circuit conductive areas 32 at the second end of one first glass substrate 11 are electrically connected to the first electrode ports 33 and the second electrode ports 34 of the two circuit conductive areas 32 at the first end of the other first glass substrate 11 in a one-to-one correspondence, thereby achieving circuit conductivity between the multiple first glass substrates 11 in the first direction, eliminating interface devices such as connectors, and also saving the cost of manually plugging and unplugging interface devices. In other embodiments, in the first direction, the first glass substrates 11 and the second glass substrates 12 can also be arranged arbitrarily to obtain a light-emitting panel 100 of a target size and shape. The specific design can be based on needs and is not limited to this embodiment of the present application.

[0097] In some embodiments, in the second direction, both sides of a portion of the first glass substrate 11 may be the first glass substrate 11, and the two circuit conducting areas 32 at the first end of the first glass substrate 11 are electrically connected in a one-to-one correspondence with the first electrode ports 33 and the second electrode ports 34 of the circuit conducting areas 32 adjacent to the first end of the first glass substrate 11 located on both sides thereof; and / or, both sides of a portion of the first glass substrate 11 may be the first glass substrate 11 and the second glass substrate 12, and the two circuit conducting areas 32 at the first end of the first glass substrate 11 are electrically connected in a one-to-one correspondence with the first electrode ports 33 and the second electrode ports 34 of the circuit conducting areas 32 adjacent to the first glass substrate 11 and the second glass substrate 12 located on both sides thereof, thereby achieving circuit conduction between multiple glass substrates in the second direction, saving the cost of interface devices such as connectors and manual plugging and unplugging of interface devices. In some embodiments, both sides of a portion of the first glass substrate 11 may be formed by the second glass substrate 12. The two circuit conductive areas 32 at the first end of the first glass substrate 11 are electrically connected to the first electrode ports 33 and the second electrode ports 34 of the adjacent circuit conductive areas 32 on the second glass substrate 12 located on either side thereof. That is, in the second direction, the first glass substrate 11 and the second glass substrate 12 can be arranged arbitrarily and can be specifically designed as needed.

[0098] Specifically, in one embodiment, Figures 5 to 7 As shown, in the second direction, there are multiple columns of first glass substrates 11 and multiple columns of second glass substrates 12 spliced together, each row of second glass substrates 12 is arranged corresponding to two rows of first glass substrates 11, and the two rows of first glass substrates 11 are spliced together. Figure 5 As shown, in a specific embodiment, in the second direction, there are three columns of first glass substrates 11 and three columns of second glass substrates 12 spliced together. In the first direction, each column of second glass substrates 12 includes one second glass substrate 12, and each column of first glass substrates 11 includes two first glass substrates 11 spliced together to correspond to the length of the second glass substrate 12, forming a rectangular light-emitting panel 100.

[0099] In other embodiments, the light-emitting panel 100 may also include another number of columns of second glass substrates 12 in the second direction. For example, it may include any number of columns of second glass substrates 12, such as two, four, or five. Each row of second glass substrates 12 may correspond to any number of rows of first glass substrates 11. For example, each row of second glass substrates 12 may correspond to any number of rows of first glass substrates 11, such as three, four, or five. That is, N may be any number, such as 3, 4, or 5. In the first direction, each column of second glass substrates 12 may also include multiple second glass substrates 12. For example, each column of second glass substrates 12 may include any number of second glass substrates 12, such as two, three, four, or five. Each column of first glass substrates 11 may include any number of first glass substrates 11, such as 2N, 3N, 4N, or 5N. By splicing multiple first glass substrates 11 and multiple second glass substrates 12 in the first and second directions, a light-emitting panel 100 of a desired size and shape is obtained. The specific shape, size, and arrangement of the light-emitting panel 100 can be designed as needed and are not limited in this embodiment of the present application.

[0100] Specifically, in some embodiments, the first electrode ports 33 or the second electrode ports 34 of the circuit conductive areas 32 adjacent to each other on two adjacent first glass substrates 11 and / or second glass substrates 12 are electrically connected using a conductive wire 35 and a welding process. The conductive wire 35 includes any one or more of a copper wire, a silver wire, and a gold wire.

[0101] See also Figure 9 and Figure 10 In one embodiment, the light-emitting panel 100 further includes an adhesive 6 and a chassis 5 , and a plurality of glass substrates 1 are arranged on one side of the chassis 5 . Specifically, the plurality of glass substrates 1 can be arranged in the chassis 5 , and the chassis 5 is used to realize the assembly connection between the plurality of glass substrates 1 .

[0102] Specifically, such as Figure 10 As shown, the substrate 2 includes a first surface and a second surface relative to each other, the driving circuit layer 3 is arranged on the first surface of the substrate 2, and the adhesive 6 is arranged on the second surface of the substrate 2, and the two ends of the adhesive 6 are respectively connected to the substrate 2 and the chassis 5 to connect the multiple glass substrates 1 with the chassis 5, thereby realizing the assembly connection between the multiple glass substrates 1.

[0103] Specifically, in some embodiments, Figure 9 and Figure 10As shown, the chassis 5 includes a bottom plate 51 and an annular side plate 52 that are interconnected. The annular side plate 52 encloses a housing space within which multiple glass substrates 1 are disposed. The adhesive 6 on the second surface of each substrate 2 is connected to the bottom plate 51 of the chassis 5, such that the two ends of the adhesive 6 are respectively connected to the substrate 2 and the bottom plate 51. The adhesive 6 secures the multiple glass substrates 1 to the bottom plate 51 of the chassis 51. Specifically, the side surface of the outermost glass substrate 1 abuts the inner surface of the annular side plate 52, thereby allowing the annular side plate 52 to limit and secure the multiple glass substrates 1 in the first and second directions, further improving the splicing stability of the glass substrates 1.

[0104] In some embodiments, the chassis 5 is made of any one of plastic, electrogalvanized cold-rolled coil (SECC), commercial quality hot-dip galvanized steel (SGCC), or aluminum alloy. For example, the plastic may include ABS (Acrylonitrile Butadiene Styrene), PC (Polycarbonate), or other plastics. These materials have excellent physical properties and chemical stability, thereby improving the structural stability of the light-emitting panel 100.

[0105] In some embodiments, the adhesive member 6 can be a heat dissipation tape, for example, a heat dissipation silicone tape or a tape filled with high thermal conductivity ceramic particles, to improve the stability of the connection between the chassis 5 and the glass substrate 1. Specifically, one surface of the adhesive member 6 is attached to the second surface of the substrate 2, and a release paper (not shown) is provided on the surface of the adhesive member 6 away from the substrate 2. The thickness of the adhesive member 6 can be 0.1-1 mm, and the thickness of the release paper is 0.05-0.15 mm. By removing the release paper from the surface of the adhesive member 6, the surface of the adhesive member 6 away from the substrate 2 is attached to the bottom plate 51, thereby achieving a fixed connection between the glass substrate 1 and the chassis 5.

[0106] It can be understood that by setting the thickness of the adhesive 6 within the above range, it can be ensured that the adhesive 6 can be well connected and fixed to the glass substrate 1 and the chassis 5, and the adhesive 6 can have good heat dissipation performance and connection stability. At the same time, it can also meet the design requirements of a lighter and thinner light-emitting panel 100, which is conducive to reducing the thickness of the light-emitting panel 100 and broadening the application range of the light-emitting panel 100. In other embodiments, the specific thickness of the adhesive 6 can also be designed according to the thickness requirements of the overall structure of the light-emitting panel 100, and this embodiment of the present application is not limited to this.

[0107] See also Figure 11 In some embodiments, after the multiple glass substrates 1 are fixedly connected to the bottom plate 51 via the adhesive 6, in the third direction, the surface of the annular side plate 52 away from the bottom plate 51 is flush with the first surface of the substrate 2 of the glass substrate 1. The third direction is perpendicular to both the first and second directions and is the thickness direction of the light-emitting panel 100. In this embodiment, the light-emitting panel 100 further includes a reflective layer 7 and a transparent colloid layer 8. The reflective layer 7 covers the surface of the annular side plate 52 away from the bottom plate 51 and the first surfaces of the multiple substrates 2, exposing the light-emitting units 4 and the circuit conductive area 32. The transparent colloid layer 8 covers the reflective layer 7.

[0108] It can be understood that by providing a reflective layer 7 on the first surface of the substrate 2, specifically, the reflective layer 7 can be a white coating, and the reflective layer 7 can reflect the light emitted by the light-emitting unit 4 to one side of the substrate 2, which can effectively improve the luminous efficiency and light utilization rate of the light-emitting unit 4; at the same time, a transparent colloid layer 8 is provided on one side of the reflective layer 7, and the transparent colloid layer 8 can protect the driving circuit layer 3 and the like on the surface of the glass substrate 1, thereby improving the stability and reliability of the driving circuit layer 3, and the transparent colloid layer 8 can fix the multiple glass substrates 1 and the chassis 5 to prevent the glass substrates 1 from detaching from the chassis 5, thereby improving the splicing stability of the multiple glass substrates 1, and thereby improving the performance of the light-emitting panel 100.

[0109] Specifically, the reflective layer 7 can be formed by physical vapor deposition, chemical vapor deposition or spraying. It can be understood that in this embodiment, by setting the surface of the annular side plate 52 away from the bottom plate 51 flush with the first surface of the substrate 2 of the glass substrate 1, the reflective layer 7 can be formed by spraying a white coating, which is more convenient for saving costs.

[0110] In one embodiment, the transparent colloid layer 8 is formed by thermal spraying, drying, curing, and removing excess burrs. Specifically, the material of the transparent colloid layer 8 can be a transparent resin colloid, which can not only encapsulate and protect the glass substrate 1, but also will not affect the light extraction efficiency of the light emitting unit 4. In one specific embodiment, Figure 11 As shown, the surface of the transparent colloid away from the substrate 2 is located between the surface of the light emitting unit 4 away from the substrate 2 and the surface of the light emitting unit 4 close to the substrate 2, so as to improve the utilization rate of the light emitted by the light emitting unit 4.

[0111] See also Figure 12In other embodiments, after the multiple glass substrates 1 are fixedly connected to the bottom plate 51 through the adhesive 6, in the third direction, the surface of the annular side plate 52 away from the bottom plate 51 is located on the side of the first surface of the substrate 2 of the glass substrate 1 away from the adhesive 6, that is, the first surface of the substrate 2 is lower than the surface of the annular side plate 52 away from the bottom plate 51, and the substrate 2 is located inside the accommodating space enclosed by the annular side plate 52. In this embodiment, the light-emitting panel 100 includes a reflective encapsulation colloid layer 9, and does not include a reflective layer 7 and a transparent colloid layer 8. Specifically, the reflective encapsulation colloid layer 9 covers the first surface of the substrate 2 and exposes the light-emitting unit 4 and the circuit conductive area 32, and the surface of the reflective encapsulation colloid layer 9 away from the substrate 2 is flush with the surface of the annular side plate 52 away from the bottom plate 51. Specifically, the material of the reflective encapsulation colloid layer 9 is a transparent resin colloid containing white paint.

[0112] It can be understood that in this embodiment, by setting the first surface of the substrate 2 to be lower than the surface of the annular side plate 52 away from the bottom plate 51, a transparent resin colloid containing white paint can be injected into the accommodating space of the chassis 5 until it is flush with the surface of the annular side plate 52 away from the bottom plate 51. After drying and curing, a reflective encapsulation colloid layer 9 is formed. The reflective encapsulation colloid layer 9 can reflect the light emitted by the light-emitting unit 4 to improve the utilization rate of the light, and can also simultaneously encapsulate, protect and fix multiple glass substrates 1, thereby improving the splicing stability of the multiple glass substrates 1. In this embodiment, by directly setting the reflective encapsulation colloid layer 9, the above-mentioned processes of setting the reflective layer 7 and the transparent colloid layer 8 can be combined into one, which is conducive to simplifying the process flow, saving costs, and improving production efficiency.

[0113] See Figures 13 to 16 , Figure 13 : is a schematic flow chart of a method for preparing a light-emitting panel provided in the fourth embodiment of the present application. Figure 14 yes Figure 13 A schematic flow chart of step S3 of an embodiment of a method for preparing a light-emitting panel is provided. Figure 15 is a flow chart of a method for preparing a light-emitting panel provided in the fifth embodiment of the present application. Figure 16 It is a flow chart of a method for preparing a light-emitting panel provided in the sixth embodiment of the present application.

[0114] See also Figures 13 and 14 The fourth embodiment of the present application provides a method for preparing a light-emitting panel 100, which is used to prepare and form the light-emitting panel 100. Specifically, the method for preparing the light-emitting panel 100 includes:

[0115] S1: providing glass scraps, and cutting the glass scraps to form a plurality of substrates 2; wherein a driving circuit layer 3 is provided on one surface of the substrate 2, and the driving circuit layer 3 of each substrate 2 includes at least two circuit conduction areas 32 spaced apart from each other, and each circuit conduction area 32 includes a first electrode port 33 and a second electrode port 34.

[0116] For details, see Figures 1 to 12 First, a glass residue is provided and cut into a plurality of substrates 2. Specifically, the glass residue can be a residue area of a large glass plate used to make a color filter substrate or an array substrate (eg Figure 4 and Figure 8 ). A driving circuit layer 3 is provided on one surface of the substrate 2. The driving circuit layer 3 on the surface of each substrate 2 includes at least two mutually spaced circuit conductive areas 32. Each circuit conductive area 32 includes a first electrode port 33 and a second electrode port 34, which facilitates splicing of multiple substrates 2 in subsequent processes.

[0117] Specifically, the driving circuit layer 3 of the substrate 2 can be directly formed in the residual material area of the large glass plate. For example, the driving circuit layer 3 can be formed by printing in the same way as the circuit forming method of the color film substrate or the array substrate. After the driving circuit layer 3 is formed in the residual material area of the large glass plate, the residual material area can be cut to form multiple substrates 2 that do not include the light-emitting unit 4, so as to save process, save cost and improve production efficiency.

[0118] In other embodiments, after the residual material area of the large glass plate is cut to form a plurality of substrates 2, the driving circuit layer 3 may be formed on the surfaces of the plurality of substrates 2 respectively. The design may be performed as needed.

[0119] In some embodiments, the glass remnant may be cut to form a plurality of first substrates 21 and a plurality of second substrates 22 . In a first direction, the length of the first substrate 21 is a first dimension, and the length of the second substrate 22 is a second dimension.

[0120] In some embodiments, the first size can be equal to the second size, that is, the length of the first substrate 21 is equal to the length of the second substrate 22, L1=L2, and the residual material area of the large glass plate is cut into multiple first substrates 21 with a length of the first size (L1) and multiple second substrates 22 with a length of the second size (L2) to improve the utilization rate of the large glass plate. At the same time, the lengths of the first substrate 21 and the second substrate 22 can also be converged, which facilitates the splicing and assembly of multiple first substrates 21 and second substrates 22 in subsequent processes, thereby improving the application rate of the first substrate 21 and the second substrate 22.

[0121] Specifically, when the first size is equal to the second size, in some embodiments, the driving circuit layer 3 on the surface of each substrate 2 includes two circuit conductive areas 32 spaced apart from each other. The specific arrangement of the circuit conductive areas 32 can refer to the first embodiment described above. Figures 1 to 4 The structure and related description shown are not repeated here.

[0122] In other embodiments, the first size is smaller than the second size, and the second size is equal to N times the first size. In the first direction, the length of the second substrate 22 is equal to N times the length of the first substrate 21, where L2 = N*L1. The residual material area of the large glass sheet is cut into multiple first substrates 21 having a length of the first size (L1) and multiple second substrates 22 having a length of the second size (L2). The first size is smaller than the second size. The cutting method can be adjusted to define the sizes of the first substrates 21 and the second substrates 22 based on the size of the glass residual material, thereby maximizing the utilization of the residual material area of the large glass sheet and maximizing the utilization rate of the glass residual material.

[0123] Specifically, when the first size is smaller than the second size, in some embodiments, the driving circuit layer 3 on the surface of each second substrate 22 includes two mutually spaced circuit conduction areas 32, and the driving circuit layer 3 on the surface of each first substrate 21 includes four mutually spaced circuit conduction areas 32. The specific arrangement of the circuit conduction areas 32 on the surfaces of the first substrate 21 and the second substrate 22 can refer to the above-mentioned second embodiment. Figures 5 to 8 The structure and related description shown are not repeated here.

[0124] S2: bonding multiple light-emitting units 4 on the side of the driving circuit layer 3 away from the substrate 2 to form multiple glass substrates 1; wherein the multiple light-emitting units 4 are electrically connected to the driving circuit layer 3, and the circuit conductive area 32 is spaced apart from the light-emitting units 4.

[0125] Specifically, after cutting to form multiple substrates 2, multiple light-emitting units 4 are bonded to the side of the driving circuit layer 3 of each substrate 2 away from the substrate 2 to form multiple glass substrates 1. Specifically, the multiple light-emitting units 4 are electrically connected to the driving circuit layer 3, and the circuit conduction area 32 is spaced apart from the light-emitting units 4.

[0126] The specific structure of the glass substrate 1 may refer to the relevant description of the light-emitting panel 100 provided in the above embodiment, and will not be repeated here.

[0127] S3: splicing a plurality of glass substrates 1 adjacent to each other, and electrically connecting the first electrode ports 33 of adjacent circuit conductive areas 32 of two adjacent glass substrates 1 to each other, and electrically connecting the second electrode ports 34 to each other.

[0128] Specifically, multiple glass substrates 1 are spliced together to form the light emitting panel 100. Specifically, the first electrode ports 33 of adjacent circuit conductive areas 32 in two adjacent glass substrates 1 are electrically connected to each other, and the second electrode ports 34 are electrically connected to each other.

[0129] Specifically, the splicing method of multiple glass substrates 1, the arrangement method of the circuit conductive areas 32 of two adjacent glass substrates 1 and the specific connection method can refer to the relevant description of the light-emitting panel 100 provided in the above embodiment, and will not be repeated here.

[0130] In some embodiments, the substrate 2 includes a first surface and a second surface opposite to each other, and the driving circuit layer 3 is disposed on the first surface. Figure 9 and Figure 10 In some embodiments, the step of closely splicing the plurality of glass substrates 1 in step S3 includes:

[0131] S31 : attaching an adhesive 6 to the second surface of each substrate 2 .

[0132] Specifically, after bonding the plurality of light-emitting units 4 on the side of the driving circuit layer 3 away from the substrate 2 in step S2 , the substrate 2 may be turned over, and an adhesive 6 may be attached to the second surface of each substrate 2 .

[0133] In some embodiments, the adhesive member 6 may be a heat dissipation tape, for example, a heat dissipation silicone tape or a tape filled with high thermal conductivity ceramic particles, to improve the connection stability between the adhesive member 6 and the glass substrate 1. The thickness of the adhesive member 6 may be 0.1-1 mm.

[0134] S32: providing a chassis 5, and sequentially attaching a plurality of substrates 2 to the chassis 5 via adhesives 6.

[0135] Specifically, a chassis 5 is provided, and multiple substrates 2 are sequentially attached to the chassis 5 through adhesives 6 , with both ends of the adhesives 6 connected to the substrates 2 and the chassis 5 respectively, thereby achieving mutual splicing of multiple glass substrates 1 .

[0136] Specifically, in some embodiments, the chassis 5 includes a bottom plate 51 and an annular side plate 52 connected to each other, and the annular side plate 52 is arranged to form a receiving space. The step of sequentially attaching the plurality of substrates 2 to the chassis 5 via the adhesive 6 in step S32 includes:

[0137] The plurality of substrates 2 are sequentially attached to the base plate 51 through the adhesive 6 .

[0138] Specifically, multiple substrates 2 are sequentially attached to the bottom plate 51 via adhesive 6. Multiple glass substrates 1 are positioned within the accommodating space. The bottom plate 5 securely connects the multiple glass substrates 1, improving the stability of the assembly. Specifically, the surface of the adhesive 6 facing away from the substrates 2 is provided with release paper, with a thickness of 0.05-0.15 mm. By removing the release paper from the adhesive 6 and attaching the surface of the adhesive 6 facing away from the substrates 2 to the bottom plate 51, a secure connection between the glass substrates 1 and the bottom plate 5 is achieved.

[0139] See also Figure 15 The fifth embodiment of the present application provides another method for preparing the light emitting panel 100. Specifically, as shown in FIG. Figure 15 As shown, in this embodiment, steps S1 to S3 of the method for preparing the light-emitting panel 100 are the same as those of steps S1 to S3 of the method for preparing the light-emitting panel 100 provided in the fourth embodiment of the present application, and are not repeated here.

[0140] In this embodiment, refer to Figure 11 In the third direction, the surface of the annular side plate 52 away from the bottom plate 51 is flush with the first surface, which is different from the preparation method of the light-emitting panel 100 provided in the fourth embodiment, see Figure 15 In this embodiment, the method for preparing the light emitting panel 100 further includes:

[0141] S41 : forming a reflective layer 7 on the side of the light emitting unit 4 away from the substrate 2 ; wherein the reflective layer 7 covers the surface of the annular side plate 52 away from the bottom plate 51 and the first surface, and exposes the light emitting unit 4 and the circuit conductive area 32 .

[0142] Specifically, in this embodiment, in the third direction, the surface of the annular side plate 52 away from the bottom plate 51 is flush with the first surface, and a reflective layer 7 is formed on the side of the light-emitting unit 4 away from the substrate 2. The reflective layer 7 covers the surface of the annular side plate 52 away from the bottom plate 51 and the first surface of the substrate 2, and exposes the light-emitting unit 4 and the circuit conduction area 32.

[0143] Specifically, the reflective layer 7 can be formed by physical vapor deposition, chemical vapor deposition or spraying. It can be understood that in this embodiment, by setting the surface of the annular side plate 52 away from the bottom plate 51 flush with the first surface of the substrate 2 of the glass substrate 1, the reflective layer 7 can be formed by spraying a white coating, which is more convenient for saving costs.

[0144] It can be understood that by forming a reflective layer 7 on the first surface of the substrate 2, specifically, the reflective layer 7 can be a white coating, and the reflective layer 7 can reflect the light emitted by the light-emitting unit 4 to one side of the substrate 2, which can effectively improve the luminous efficiency and light utilization of the light-emitting unit 4.

[0145] S51 : forming a transparent colloid layer 8 on a side of the reflective layer 7 away from the substrate 2 ; wherein the transparent colloid layer 8 covers the reflective layer 7 .

[0146] Specifically, a transparent colloid layer 8 is formed on the side of the reflective layer 7 away from the substrate 2, and the transparent colloid layer 8 covers the reflective layer 7. Specifically, the transparent colloid layer 8 can be formed by thermal spraying, drying, curing, and removing excess burrs. Specifically, the material of the transparent colloid layer 8 can be a transparent resin colloid, which can not only encapsulate and protect the glass substrate 1, but also will not affect the light extraction efficiency of the light emitting unit 4. In a specific embodiment, Figure 11 As shown, the surface of the transparent colloid away from the substrate 2 is located between the surface of the light emitting unit 4 away from the substrate 2 and the surface of the light emitting unit 4 close to the substrate 2, so as to improve the utilization rate of the light emitted by the light emitting unit 4.

[0147] It can be understood that by forming the transparent colloid layer 8 on one side of the reflective layer 7, the transparent colloid layer 8 can protect the driving circuit layer 3 and the like on the surface of the glass substrate 1, thereby improving the stability and reliability of the driving circuit layer 3. The transparent colloid layer 8 can also be used to fix the multiple glass substrates 1 and the chassis 5 to prevent the glass substrates 1 from detaching from the chassis 5, thereby improving the splicing stability of the multiple glass substrates 1 and thereby improving the performance of the light-emitting panel 100.

[0148] See also Figure 16 The sixth embodiment of the present application provides another method for preparing the light emitting panel 100. Specifically, as shown in FIG. Figure 16 As shown, in this embodiment, steps S1 to S3 of the method for preparing the light-emitting panel 100 are the same as those of steps S1 to S3 of the method for preparing the light-emitting panel 100 provided in the fourth embodiment of the present application, and are not repeated here.

[0149] In this embodiment, refer to Figure 12 In the third direction, the annular side plate 52 is away from the surface of the bottom plate 51 and is located on the side of the first surface away from the adhesive member 6, which is different from the preparation method of the light-emitting panel 100 provided in the fourth embodiment, see Figure 16 In this embodiment, the method for preparing the light emitting panel 100 further includes:

[0150] S42: A reflective encapsulation colloid layer 9 is formed on the side of the light-emitting unit 4 away from the substrate 2; wherein the reflective encapsulation colloid layer 9 covers the first surface and exposes the light-emitting unit 4 and the circuit conductive area 32, and the surface of the reflective encapsulation colloid layer 9 away from the substrate 2 is flush with the surface of the annular side plate 52 away from the bottom plate 51.

[0151] Specifically, in this embodiment, in the third direction, the annular side plate 52 is located away from the surface of the bottom plate 51 and on the side of the first surface away from the adhesive 6. That is, the height of the first surface of the substrate 2 is lower than the surface of the annular side plate 52 away from the bottom plate 51. A reflective encapsulation colloid layer 9 is formed on the side of the light-emitting unit 4 away from the substrate 2. The reflective encapsulation colloid layer 9 covers the first surface of the substrate 2 and exposes the light-emitting unit 4 and the circuit conductive area 32. The surface of the reflective encapsulation colloid layer 9 away from the substrate 2 is flush with the surface of the annular side plate 52 away from the bottom plate 51.

[0152] In this embodiment, the light emitting panel 100 includes a reflective encapsulating colloid layer 9, but does not include a reflective layer 7 and a transparent colloid layer 8. In some embodiments, the reflective encapsulating colloid layer 9 may be made of a transparent resin colloid containing a white coating.

[0153] It can be understood that in this embodiment, by setting the first surface of the substrate 2 to be lower than the surface of the annular side plate 52 away from the bottom plate 51, a transparent resin colloid containing white paint can be injected into the accommodating space of the chassis 5 until it is flush with the surface of the annular side plate 52 away from the bottom plate 51. After drying and curing, a reflective encapsulation colloid layer 9 is formed. The reflective encapsulation colloid layer 9 can reflect the light emitted by the light-emitting unit 4 to improve the utilization rate of the light, and can also simultaneously encapsulate, protect and fix multiple glass substrates 1, thereby improving the splicing stability of the multiple glass substrates 1. In this embodiment, by directly forming the reflective encapsulation colloid layer 9, the process flow of forming the reflective layer 7 in step S41 and forming the transparent colloid layer 8 in step S51 in the fourth embodiment can be combined into one, which is conducive to simplifying the process flow, saving costs, and improving production efficiency.

[0154] See Figures 17 and 18 , Figure 17 is a structural diagram of an embodiment of a display device provided in the seventh embodiment of the present application. Figure 18 It is a structural schematic diagram of another implementation of the display device provided in the seventh embodiment of the present application.

[0155] See also Figure 17 and Figure 18 The seventh embodiment of the present application further provides a display device 400, which includes a light-emitting panel 100. Specifically, the light-emitting panel 100 can be any one of the light-emitting panels 100 described above, or it can be a light-emitting panel 100 manufactured using any one of the light-emitting panel 100 manufacturing methods described above.

[0156] The light-emitting panel 100 is configured to provide the light source required for the display device 400 to realize image display. Specifically, the light-emitting panel 100 can be used in a backlight module to provide a backlight source for other display panels that cannot emit light on their own. Alternatively, the light-emitting panel 100 can also be used for direct display, to directly use the light-emitting panel 100 as a display panel to realize image display function through self-luminescence.

[0157] In one embodiment, the light emitting panel 100 is used for backlighting, such as Figure 17 As shown, the display device 400 includes a display panel 200 and a light-emitting panel 100. The light-emitting panel 100 is electrically connected to the display panel 200 and is used to provide a backlight source for the display panel 200. The light-emitting panel 100 can serve as a backlight module. Specifically, the display panel 200 can be a liquid crystal display panel, or other display panels that cannot emit light independently.

[0158] In another embodiment, the light emitting panel 100 is used for direct display, such as Figure 18 As shown, specifically, the display device 400 includes a light emitting panel 100 and a housing 300 . The housing 300 forms a first space. The light emitting panel 100 is disposed in the first space of the housing 300 . The light emitting panel 100 is used as a self-luminous display panel.

[0159] Specifically, the multiple light-emitting units 4 of the light-emitting panel 100 can be light-emitting units of different colors to emit light of different colors, or can be light-emitting units of a single color. For example, the multiple light-emitting units 4 of the light-emitting panel 100 can include light-emitting units of any one or more colors, such as red, green, blue, yellow, and white, to directly emit light of one or more colors. By controlling the light emission of the multiple light-emitting units 4 of the light-emitting panel 100, an image display function can be directly achieved.

[0160] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A light-emitting panel, characterized in that: include: A plurality of glass substrates, wherein the plurality of glass substrates are arranged adjacent to each other; each of the glass substrates comprises a substrate, a driving circuit layer, and a plurality of light-emitting units spaced apart from each other; The driving circuit layer is disposed on a surface of the substrate, and the plurality of light-emitting units are disposed on a side of the driving circuit layer away from the substrate and are electrically connected to the driving circuit layer; The driving circuit layer of each glass substrate includes at least two circuit conduction areas spaced apart from each other, and the circuit conduction areas are spaced apart from the light-emitting units; each of the circuit conduction areas includes a first electrode port and a second electrode port; in two adjacent glass substrates, the first electrode ports of the circuit conduction areas adjacent to each other are electrically connected to each other, and the second electrode ports are electrically connected to each other.

2. The light emitting panel according to claim 1, wherein: The light emitting panel further comprises an adhesive member and a chassis, and the plurality of glass substrates are arranged on one side of the chassis; The substrate includes a first surface and a second surface opposite to each other. The driving circuit layer is arranged on the first surface, and the adhesive is arranged on the second surface. Two ends of the adhesive are respectively connected to the substrate and the chassis.

3. The light emitting panel according to claim 2, wherein: The chassis comprises a bottom plate and an annular side plate connected to each other, wherein the annular side plate is arranged to form an accommodating space, and the plurality of glass substrates are arranged in the accommodating space; the two ends of the adhesive member are respectively connected to the substrate and the bottom plate; In the third direction, the surface of the annular side plate away from the bottom plate is flush with the first surface; the light-emitting panel further comprises a reflective layer and a transparent colloid layer, the reflective layer covers the surface of the annular side plate away from the bottom plate and the first surface, and exposes the light-emitting unit and the circuit conductive area; the transparent colloid layer covers the reflective layer; Or, in the third direction, the annular side plate is away from the surface of the base plate and is located on the side of the first surface away from the adhesive; the light-emitting panel also includes a reflective packaging colloid layer, which covers the first surface and exposes the light-emitting unit and the circuit conduction area, and the surface of the reflective packaging colloid layer away from the substrate is flush with the surface of the annular side plate away from the base plate.

4. The light emitting panel according to claim 3, wherein: The reflective layer is a white coating, the transparent colloid layer is made of a transparent resin colloid, and the reflective encapsulation colloid layer is made of a transparent resin colloid containing a white coating. And / or, the chassis is made of any one of plastic, electro-galvanized steel, hot-dip galvanized steel or aluminum alloy; And / or, the light-emitting unit is a light-emitting diode or a micro light-emitting diode; the driving circuit layer further includes a solder pin provided corresponding to the light-emitting unit, the light-emitting unit being electrically connected to the solder pin; the height of the solder pin is 0.05-0.2 mm; and / or the height of the circuit conductive area is 0.05-0.2 mm; and / or, the thickness of the adhesive member is 0.1-1 mm; And / or, the first electrode ports or the second electrode ports of the circuit conductive areas adjacent to each other on two adjacent glass substrates are electrically connected by a conductive wire through a welding process; the conductive wire includes any one or more of a copper wire, a silver wire, and a gold wire.

5. The light emitting panel according to claim 1, wherein: The plurality of glass substrates include a first glass substrate and a second glass substrate; the first glass substrate includes a first substrate, and the second glass substrate includes a second substrate; In a first direction, the length of the first substrate is a first size, and the length of the second substrate is a second size; The first size is equal to the second size; or The first size is smaller than the second size, and the second size is equal to N times the first size; wherein N is a positive integer greater than 1; and one second substrate is provided corresponding to N first substrates; The first substrate and the second substrate are formed by cutting glass remnants.

6. The light emitting panel according to claim 5, characterized in that: The first dimension is smaller than the second dimension; along the first direction, the first substrate and the second substrate each have a first end and a second end opposite to each other; The surface of each first substrate is provided with four mutually spaced circuit conduction areas, wherein the first end and the second end of the first substrate are respectively provided with two circuit conduction areas; the surface of each second substrate is provided with two mutually spaced circuit conduction areas; In the first direction, a plurality of the first glass substrates are closely arranged, and among two adjacent first glass substrates, the two circuit conductive areas at the second end of one of the first glass substrates are electrically connected to the two circuit conductive areas at the first end of the other first glass substrate in a one-to-one correspondence; In the second direction, the two circuit conductive areas at the first end of the first glass substrate are electrically connected one-to-one with the circuit conductive areas at the first end of the first glass substrate located on both sides thereof, or are electrically connected one-to-one with the circuit conductive areas at the first end of the second glass substrate located on both sides thereof.

7. The light emitting panel according to claim 1, wherein: The distance between the centers of two adjacent light emitting units is equal to the width of the substrate in the second direction.

8. A method for preparing a light-emitting panel, characterized in that: include: Providing a glass scrap, and cutting the glass scrap to form a plurality of substrates; wherein a driving circuit layer is provided on one surface of the substrate, the driving circuit layer of each substrate includes at least two circuit conductive areas spaced apart from each other, and each circuit conductive area includes a first electrode port and a second electrode port; A plurality of light-emitting units are bonded to a side of the driving circuit layer away from the substrate to form a plurality of glass substrates; wherein the plurality of light-emitting units are electrically connected to the driving circuit layer, and the circuit conductive area is spaced apart from the light-emitting units; The plurality of glass substrates are spliced closely together, and the first electrode ports of the adjacent circuit conductive areas in two adjacent glass substrates are electrically connected to each other, and the second electrode ports are electrically connected to each other.

9. The method for preparing a light-emitting panel according to claim 8, wherein: The substrate comprises a first surface and a second surface opposite to each other, and the driving circuit layer is arranged on the first surface; The step of closely splicing the plurality of glass substrates comprises: attaching an adhesive member to the second surface of each of the substrates; A chassis is provided, and a plurality of substrates are sequentially attached to the chassis through the adhesive.

10. The method for preparing a light-emitting panel according to claim 9, wherein: The chassis includes a bottom plate and an annular side plate connected to each other, and the annular side plate is arranged to form an accommodating space; The step of sequentially attaching the plurality of substrates to the chassis via the adhesive comprises: The plurality of substrates are sequentially attached to the bottom plate through the adhesive; wherein the plurality of glass substrates are located in the accommodating space; Wherein, in the third direction, the surface of the annular side plate away from the bottom plate is flush with the first surface, and the method for preparing the light-emitting panel further includes: A reflective layer is formed on a side of the light-emitting unit away from the substrate; wherein the reflective layer covers the surface of the annular side plate away from the bottom plate and the first surface, and exposes the light-emitting unit and the circuit conductive area; forming a transparent colloid layer on a side of the reflective layer away from the substrate; wherein the transparent colloid layer covers the reflective layer; Alternatively, in the third direction, the annular side plate is away from the surface of the bottom plate and is located on a side of the first surface away from the adhesive member, and the method for preparing the light-emitting panel further includes: A reflective packaging colloid layer is formed on a side of the light-emitting unit away from the substrate; wherein the reflective packaging colloid layer covers the first surface and exposes the light-emitting unit and the circuit conduction area, and the surface of the reflective packaging colloid layer away from the substrate is flush with the surface of the annular side plate away from the bottom plate.

11. A display device, characterized in that: include: The light-emitting panel according to any one of claims 1 to 7, or a light-emitting panel manufactured by the method for manufacturing a light-emitting panel according to any one of claims 8 to 10; The light emitting panel is configured to provide the light source required for the display device to display images.

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