Display device and tiled display device including same

Abstract

Disclosed is a display device including: a substrate including a front panel region, a rear panel region, and a bending region disposed between the front panel region and the rear panel region; a display area in the front panel area, a plurality of light emitting elements being arranged on the display area; an integrated circuit chip disposed on the rear panel area; and a connection wiring extending from the front panel region to the rear panel region of the substrate through the bending region, and the rear panel region of the substrate may be fixed to a lower portion of the substrate corresponding to the front panel region.

Description

[0001] This application is a divisional application of the invention patent application with the application date of October 20, 2023, named "Display device and tiled display device including the display device", and application number 202311362466.1. Technical Field

[0002] The present disclosure relates to a display device, and more particularly, to a display device and a tiling apparatus including the display device. Background Art

[0003] Display devices are used in various electronic devices such as televisions, mobile phones, notebook computers, and tablet computers. To this end, research and development of thinner, lighter, and lower-power-consumption display devices is continuing.

[0004] Among display devices, light-emitting display devices have a light-emitting element or light source embedded therein and display information using light generated from the embedded light-emitting element or light source. Display devices including self-luminous (i.e., light-emitting) elements can have the advantage of realizing a thinner display device than display devices with embedded light sources, and another advantage of realizing a flexible display device that can be folded, bent, or rolled.

[0005] Display devices with embedded light-emitting elements can include OLEDs (organic light-emitting displays) with organic materials arranged as light-emitting layers or micro-LEDs (micro light-emitting diodes) with inorganic materials arranged as light-emitting layers. Organic light-emitting displays require a separate light source, but have the disadvantage of being susceptible to moisture and oxygen, which can easily lead to defective pixels. Because moisture-resistant and oxygen-resistant inorganic materials are used as light-emitting layers, micro-LED display devices are less affected by the external environment than organic light-emitting displays and have higher reliability and a longer lifespan. Summary of the Invention

[0006] Micro LED display devices are resistant to external environments, may require less or no protective structures such as sealing materials, and use a variety of materials as substrate materials, thereby realizing flexible display devices with thinner structures than organic light-emitting display devices. Therefore, the micro LED display device according to the present disclosure can easily realize a tiled display device by aligning multiple micro LED display devices in horizontal and vertical directions.

[0007] When a tiled display device is realized by aligning multiple micro LED display devices in the horizontal and vertical directions, an upper substrate on which light-emitting elements are arranged and a lower substrate on which film-on-chips are arranged are joined together, and side wiring for electrically connecting the upper and lower substrates to each other is formed through a separate process.

[0008] However, if the upper and lower substrates bonded to each other are bent, the side wirings may be disconnected, which may cause product defects, and defects may occur even in a process of forming the side wirings by a separate process.

[0009] Therefore, an object of the present disclosure is to solve the above-mentioned shortcomings of the prior art and provide a micro LED display device, which can realize a display area for displaying images and signal transmission to a peripheral area where the display area is located by using one substrate instead of using separate upper and lower substrates.

[0010] Another object of the present disclosure is to provide a display device that can realize a lightweight product by introducing a lightweight material into a substrate.

[0011] Another object of the present disclosure is to provide a display device which can optimize a process by omitting a process of separately manufacturing a lower substrate.

[0012] The purpose of the present disclosure is not limited to the above purpose, and other purposes and advantages of the present disclosure will be understood through the following description and will be more clearly understood through the embodiments of the present disclosure. It should also be easily understood that the purposes and advantages of the present disclosure can be achieved and obtained by the means described in the appended claims and their combinations.

[0013] A display device according to an embodiment of the present disclosure may include: a substrate including a front panel region, a rear panel region, and a curved region disposed between the front and rear panel regions; a display region located in the front panel region, with a plurality of light-emitting elements disposed on the display region; an integrated circuit chip disposed on the rear panel region; and connection wiring extending from the front panel region to the rear panel region of the substrate through the curved region. The rear panel region of the substrate may be fixed to a lower portion of the substrate corresponding to the front panel region.

[0014] The tiled display device according to an embodiment of the present disclosure may include a plurality of display devices, and the plurality of display devices may be arranged so that the curved regions of the substrate are positioned adjacent to each other.

[0015] In one embodiment, a display device includes: a substrate including a front panel area, a rear panel area, and a curved area between the front panel area and the rear panel area, the substrate having a first surface and a second surface, and wherein the substrate is curved so that the second surface of the rear panel area faces the second surface of the front panel area of the substrate. The display device also includes a group of light-emitting elements arranged on the display area of the front panel area of the substrate, wherein the group of light-emitting elements includes micro light-emitting diodes (LEDs). The display device also includes a first connecting wire on the front panel area of the substrate, the first connecting wire being electrically connected to the group of light-emitting elements. The display device also includes a side wire extending from the first connecting wire on the curved area of the substrate, wherein the width of the side wire is wider than the width of the first connecting wire or the width of the second connecting wire. The display device also includes a second connecting wire extending from the side wire on the rear panel area of the substrate, the second connecting wire being electrically connected to an integrated circuit chip.

[0016] In one embodiment, a display device includes a substrate including a front panel region, a rear panel region, and a curved region between the front panel region and the rear panel region. The display device includes a thin film transistor on the substrate, the thin film transistor including an active layer, a gate insulating layer, a gate electrode, a source electrode, and a drain electrode. The display device also includes an interlayer insulating film on the gate electrode of the thin film transistor. The display device also includes a connecting electrode on the interlayer insulating film, the connecting electrode electrically connected to the thin film transistor. An adhesive layer may be on the connecting electrode, the adhesive layer including an adhesive material. The display device also includes a planarizing layer on the adhesive layer, wherein the adhesive layer and the planarizing layer are formed with a contact hole exposing at least a portion of the connecting electrode. The display device also includes at least one micro light emitting diode (micro LED) disposed on at least a portion of the adhesive layer, the micro LED including a semiconductor layer and another semiconductor layer. The display device also includes a wiring electrode electrically connecting the semiconductor layer of the micro LED and the connecting electrode through the contact hole.

[0017] In one embodiment, a display device includes: a substrate including a front panel area, a rear panel area, and a curved area between the front panel area and the rear panel area. The display device also includes: one or more thin film transistors, a first insulating layer on an adhesive layer. The display device also includes: a connecting electrode on the first insulating layer, the connecting electrode electrically connected to the one or more thin film transistors. The display device also includes: at least one micro light emitting diode (micro LED) arranged on at least a portion of the adhesive layer, the micro LED including a semiconductor layer and another semiconductor layer. The display device also includes: a second insulating layer on the first insulating layer, wherein the second insulating layer is formed with a contact hole exposing at least a portion of the connecting electrode. The display device also includes: a wiring electrode electrically connecting the semiconductor layer of the micro LED and the connecting electrode through the contact hole; and a dam on the second insulating layer, wherein the dam fills at least a portion of the contact hole, wherein the dam includes a black material.

[0018] The display device according to the embodiment of the present disclosure may have an advantageous effect of optimizing the entire process by omitting a process of separately manufacturing a lower substrate.

[0019] In addition, the display device can form wiring for applying signals to light-emitting elements on the display area and side wiring from the front panel area to the rear panel area without being cut, thereby preventing the side wiring from being disconnected during bending, thereby improving product reliability.

[0020] In addition, the display device can prevent disconnection of side wirings, thereby realizing a display device having various shapes such as a curved display device.

[0021] In addition, the display device can form a light emitting element, a thin film transistor, and a chip on film including a circuit film embedded with an integrated circuit chip on one substrate, thereby omitting multiple processes, resulting in process optimization and cost reduction.

[0022] In addition, the display device can use one substrate by introducing a lightweight material, thereby realizing a lightweight product.

[0023] In addition to the above-described effects, specific effects of the present disclosure will be described in conjunction with the following detailed description for implementing the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic plan view of a tiled display device according to an embodiment of the present disclosure.

[0025] Figure 2 According to the embodiment of the present disclosure Figure 1 Schematic perspective view of line 2-2 in FIG.

[0026] Figure 3 is an embodiment according to the present disclosure Figure 2 The display device is shown in a plan view unfolded.

[0027] Figure 4 According to the embodiment of the present disclosure Figure 2 A cross-sectional view taken along line 4-4.

[0028] Figure 5 According to an embodiment of the present disclosure Figure 4 Magnified view of area 5 in FIG.

[0029] Figure 6 is a cross-sectional view of a display device according to another embodiment of the present disclosure.

[0030] Figure 7 is a cross-sectional view of a display device according to another embodiment of the present disclosure.

[0031] Figures 8 to 11 2 is a view illustrating a method of manufacturing a display device according to an embodiment of the present disclosure.

[0032] Figures 12 to 14 is a view illustrating a method of manufacturing a display device according to another embodiment of the present disclosure.

[0033] Figures 15 to 18 is a view illustrating a method of manufacturing a display device according to another embodiment of the present disclosure.

[0034] Figure 19 is a plan view showing that a display device according to another embodiment of the present disclosure is unfolded.

[0035] Figures 20 to 24 is a view describing a method of manufacturing a display device according to another embodiment of the present disclosure.

[0036] Figures 25 to 28 is a view describing a method of manufacturing a display device according to another embodiment of the present disclosure.

[0037] Figure 29 is a view showing a wearable device including a display device according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0038] The advantages and features of the present disclosure, as well as methods for achieving these advantages and features, will become apparent with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below, but can be implemented in a variety of different forms. Therefore, these embodiments are set forth only to complete the present disclosure and to fully inform those skilled in the art of the present disclosure of its scope.

[0039] For simplicity and clarity of explanation, the elements in the figures do not have to be drawn to scale. The same reference numerals in different figures represent the same or similar elements and therefore perform similar functions. In addition, for simplicity of description, descriptions and details of known steps and elements are omitted. In addition, in the following detailed description of the present disclosure, many specific details are set forth to provide a thorough understanding of the present disclosure. However, it should be understood that the present disclosure can be implemented without these specific details. In other examples, well-known methods, processes, components and circuits are not described in detail to avoid unnecessarily obscuring aspects of the present disclosure. Examples of various embodiments are further illustrated and described below. It should be understood that the description herein is not intended to limit the claims to the specific embodiments described. On the contrary, it is intended to cover substitutions, modifications and equivalents that may be included within the spirit and scope of the present disclosure as defined by the appended claims.

[0040] The shapes, sizes, ratios, angles, quantities, etc. disclosed in the drawings for describing the embodiments of the present disclosure are illustrative, and the present disclosure is not limited thereto. The same reference numerals represent the same elements herein. In addition, for simplicity of description, descriptions and details of known steps and elements are omitted. In addition, in the following detailed description of the present disclosure, many specific details are set forth to provide a thorough understanding of the present disclosure. However, it should be understood that the present disclosure can be implemented without these specific details. In other instances, well-known methods, processes, components, and circuits are not described in detail to avoid unnecessarily obscuring aspects of the present disclosure.

[0041] The terms used herein are for the purpose of describing specific embodiments only and are not intended to limit the present disclosure. As used herein, the singular constructions "a" and "an" are intended to include the plural constructions as well, unless the context clearly indicates otherwise. It should be further understood that when the terms "comprises," "comprising," "includes," and "comprising" are used in this specification, the presence of the features, integers, operations, elements, and / or components set forth are specified, but the presence or addition of one or more other features, integers, operations, elements, components, and / or portions thereof is not excluded. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one" preceding a list of elements may modify the entire list of elements without modifying the individual elements in the list. In the interpretation of numerical values, errors or tolerances may occur therein even if no explicit description is given.

[0042] Furthermore, it should be understood that when a first element or layer is referred to as being "on" a second element or layer, the first element can be directly disposed on the second element, or can be indirectly disposed on the second element with a third element or layer disposed between the first and second elements or layers. It should be understood that when an element or layer is referred to as being "coupled to" or "connected to" another element or layer, it can be directly located on, coupled to, or connected to the other element or layer, or one or more intervening elements or layers can be present. It should also be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intervening elements or layers can also be present.

[0043] Furthermore, as used herein, when a layer, film, region, plate, etc. is disposed “on” or “atop” another layer, film, region, plate, etc., the former may be in direct contact with the latter or another layer, film, region, plate, etc. may be disposed therebetween. As used herein, when a layer, film, region, plate, etc. is disposed directly “on” or “atop” another layer, film, region, plate, etc., the former is in direct contact with the latter and no layer, film, region, plate, etc. may be disposed therebetween. Furthermore, as used herein, when a layer, film, region, plate, etc. is disposed “below” or “under” another layer, film, region, plate, etc., the former may be in direct contact with the latter or another layer, film, region, plate, etc. may be disposed therebetween. As used herein, when a layer, film, region, plate, etc. is disposed directly “below” or “under” another layer, film, region, plate, etc., the former is in direct contact with the latter and again no layer, film, region, plate, etc. may be disposed therebetween.

[0044] In a description of a temporal relationship, for example, in a temporal precedent relationship between two events such as “after,” “after,” “before,” etc., unless “directly after,” “directly after,” or “directly before” is not indicated, another event can occur between them.

[0045] When the specific embodiment can be implemented differently, the functions or operations specified in a specific block may occur in an order different from the order specified in the flowchart. For example, two consecutive blocks may actually be executed substantially concurrently, or the two blocks may be executed in reverse order depending on the functions or operations involved.

[0046] It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, a first element, component, region, layer, or part described below may be referred to as a second element, component, region, layer, or part without departing from the spirit and scope of the present disclosure.

[0047] The features of the various embodiments of the present disclosure may be combined with each other in part or in whole, and may be technically associated with each other or operate with each other. These embodiments may be implemented independently of each other, and may be implemented together in an associated relationship.

[0048] When interpreting numerical values, unless expressly stated otherwise, the values are interpreted as including the error range.

[0049] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the meanings commonly understood by one of ordinary skill in the art to which the present disclosure pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0050] As used herein, "embodiment," "example," "aspect," etc. should not be construed as making any aspect or design described better or advantageous over other aspects or designs.

[0051] Furthermore, the term "or" means an inclusive or, not an exclusive or. That is, unless the context indicates otherwise or is clear from the context, the statement "x employs a or b" means any of the natural inclusive permutations.

[0052] The terms used in the following description have been selected as general and commonly used terms in the relevant technical fields. However, terms other than those used may exist due to developments and / or changes in technology, conventional practices, preferences of technicians, etc. Therefore, the terms used in the following description should not be understood as limiting the technical concepts, but rather as examples of terms used to describe the embodiments.

[0053] In addition, in certain cases, the applicant may arbitrarily select terms, and in such cases, their detailed meanings will be described in the corresponding description section. Therefore, it should be understood that the terms used in the following description are not based solely on the names of the terms, but should be understood based on the meanings of the terms and the content throughout the detailed description.

[0054] Hereinafter, a display device according to each embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0055] Figure 1 is a schematic plan view of a tiled display device according to an embodiment of the present disclosure. Figure 2 According to the embodiment of the present disclosure Figure 1 Schematic perspective view of line 2-2 in FIG. Figure 3 is an embodiment according to the present disclosure Figure 2 Here, for the convenience of description, Figure 2 Only the side wiring (SE) is shown.

[0056] refer to Figures 1 to 3 According to an embodiment of the present disclosure, a tiled display device (i.e., TD) may include a plurality of display devices 100-1, 100-2, 100-3 ... 100-M, and 100-N. In this case, M and N may be natural numbers. Each display device 100-1, 100-2, 100-3 ... 100-M, and 100-N is connected to an adjacent display device and contacts in a first direction X and a second direction Y intersecting the first direction X. In this case, the first direction X may be a horizontal direction, and the second direction Y may be a vertical direction.

[0057] A plurality of pixels PX may be provided in a plurality of display devices 100-1, 100-2, 100-3...100-M and 100-N. The plurality of pixels may include a plurality of sub-pixels SP1, SP2 and SP3. The plurality of sub-pixels SP1, SP2 and SP3 may include a first light-emitting element, a second light-emitting element and a third light-emitting element that emit red light R, green light G and blue light B, respectively. However, the present embodiment is not limited thereto, and the light-emitting element may also include a white light-emitting element. The light-emitting element according to an embodiment of the present disclosure may be a micro-LED. The micro-LED may be an LED made of an inorganic material or a growth substrate for growing an LED (the LED is removed from the substrate), and the inorganic material is understood to be a light-emitting element having a thickness of 100 μm or less.

[0058] At the same time, when a tiled display device TD is implemented by connecting multiple display devices 100-1, 100-2, 100-3, ..., 100-M, and 100-N, the distance between a PX arranged at the outermost position of one display device and a PX arranged at the outermost position of an adjacent display device can be equal to the distance between the PXs arranged in each display device. Therefore, a minimum bezel area or a zero bezel area with substantially no bezel area can be achieved. If the space occupied by the bezel is minimized, the display area can be increased, and the user can recognize that the image appears continuously without interruption, thereby increasing the user's screen immersion.

[0059] In this case, the quality of the displayed image can be improved by implementing a side structure of the display device, which is configured to hide the seam area S, which is a boundary area between two adjacent display devices that is not recognized by the user. Figure 2 and Figure 3 , each of the display devices 100 - 1 , 100 - 2 , 100 - 3 . . . , 100 -M, and 100 -N may have one substrate FSUB provided as one piece.

[0060] The substrate FSUB may include a display area AA and a non-display area NAA surrounding the display area AA. The substrate FSUB may include a front panel area FPN, a bending area BDA, and a rear panel area BPN, and may be a single substrate. The bending area BDA is a bendable portion that allows the rear panel area BPN to face the front panel area FPN. At least one bending area BDA may be arranged between the front panel area FPN and the rear panel area BPN.

[0061] In the front panel area FPN, multiple pixels PX including multiple sub-pixels SP1, SP2, and SP3, as well as connection wiring for transmitting signals to the pixels PX, may be arranged. Light-emitting elements emitting light toward the display area may be arranged on the multiple sub-pixels. In the back panel area BPN, a chip-on-film (COF) including a circuit film FM may be arranged. An integrated circuit chip for transmitting drive signals to the sub-pixels SP1, SP2, and SP3, as well as connection wiring LE, may be arranged on the COF. Side wiring SE extending from the connection wiring LE may be arranged on a curved area BDA connecting the front panel area FPN to the back panel area BPN. Adjacent side wiring SE may be spaced apart by a predetermined distance d.

[0062] The width of the side wiring SE arranged on the bending area BDA can be relatively larger than the width of the connection wiring LE arranged on the front panel area FPN and the back panel area BPN. Therefore, the side wiring SE can be prevented from being damaged during bending such as disconnection, which will be described again later.

[0063] Figure 4 According to the embodiment of the present disclosure Figure 2 A cross-sectional view taken along line 4-4. Figure 5 According to an embodiment of the present disclosure Figure 4 Here, for the convenience of description, the light emitting element ED arranged at the outermost position of the display device is shown in the figure.

[0064] refer to Figure 4 and Figure 5The display device 200 according to an embodiment of the present disclosure can be configured using a single substrate FSUB. The substrate FSUB can include a front panel area FPN, a rear panel area BPN, and a bending area BDA arranged between the front panel area FPN and the rear panel area BPN. The substrate FSUB can have a bending area BDA that is curved so that the rear panel area BPN and the front panel area FPN contact each other. The substrate FSUB can thus be curved so that the second surface Fb of the rear panel area BPN faces the second surface Fb of the front panel area FPN of the substrate FSUB.

[0065] The substrate FSUB may be made of a flexible, transparent insulating material. For example, the substrate FSUB may include polyimide (PI), and the material of the substrate may be changed in various instances within the properties of flexibility and transparency.

[0066] In the front panel area FPN of the substrate FSUB, light-emitting elements ED for emitting light into the display area AA and thin-film transistors TFT for driving the light-emitting elements ED can be arranged. In the back panel area BPN, a chip-on-film (COF) comprising a circuit film FM on which an integrated circuit chip IC is mounted, and connection wiring LE for transmitting drive signals to the light-emitting elements ED and thin-film transistors TFT can be arranged. In the bending area BPN, side wiring SE can be arranged. In one embodiment, at least one COF is arranged on at least a portion of the back panel area BPN of the substrate FSUB.

[0067] As an example, the light-emitting elements ED may be arranged on the front panel area FPN. As another example, the light-emitting elements ED may be arranged to extend from the front panel area FPN to a portion of the curved area BPN between the front panel area FPN and the back panel area BPN. In this case, since the light-emitting elements ED are arranged to extend even to a portion of the curved area BPN, the entire area occupied by the display area AA of the display device may be increased.

[0068] The support member BSU may be arranged on the rear surface of the substrate FSUB via a coupling member ADL. The support member BSU may include a first support unit BSU-1 arranged at a position corresponding to the front panel area FPN and a second support unit BSU-2 arranged at a position corresponding to the rear panel area BPN. Compared to the substrate FSUB, the support member BSU may be made of a material having a predetermined rigidity, and it may include, for example, glass or plastic. The first support unit BSU-1 may be coupled to the second surface Fb of the front panel area FPN of the substrate FSUB (for example, via a coupling member ADL), and the second support unit BSU-2 may be coupled to the second surface Fb of the rear panel area BPN of the substrate FSUB (for example, via a coupling member ADL).

[0069] The second supporting unit BSU-2 may be attached to the first supporting unit BSU-1 by using an adhesive member ADU to be fixed to a lower portion of the front panel region FPN.

[0070] The rear panel area BPN of the substrate FSUB may be a lower portion of the substrate FSUB corresponding to the front panel area FPN. One side surface of the first support unit BSU-1 and one side surface of the second support unit BSU-2 may be in contact with the exposed rear surface of the substrate FSUB by a configuration in which the portion of the substrate FSUB corresponding to the bending area BDA is folded.

[0071] The connecting wiring LE can be configured to send a driving signal to the light-emitting element ED and the thin film transistor TFT. The connecting wiring LE can extend from the front panel area FPN to the back panel area BPN without being cut off. The connecting wiring LE can extend from the front panel area FPN of the substrate to the back panel area BPN through the bending area BDA. The portion of the connecting wiring LE located on the bending area BDA can be referred to as a side wiring SE. In one embodiment, a first connecting wiring LE can be arranged on the front panel area FPN of the substrate FSUB, wherein the first connecting wiring LE is electrically connected to a group of light-emitting elements ED. The side wiring SE extending from the first connecting wiring LE can be arranged on the bending area BDA of the substrate FSUB. The second connecting wiring LE extending from the side wiring SE can be arranged on the back panel area BPN of the substrate FSUB, wherein the second connecting wiring LE is electrically connected to the integrated circuit chip.

[0072] On the substrate FSUB, light emitting elements ED, thin film transistors TFT for driving the light emitting elements ED, and various wirings can be arranged. Figure 5 (It is Figure 4 The present disclosure will be described with reference to the enlarged view of the region where the light emitting element ED is arranged. Figure 5 The thin film transistor TFT configured to drive the light-emitting element ED may be arranged on the first surface Fa of the substrate FSUB. The second surface Fb is the rear surface of the first surface Fa of the substrate FSUB. The support member BSU may be arranged on the lower portion of the second surface Fb. The first surface Fa may be referred to as the front surface, and the second surface Fb may be referred to as the rear surface.

[0073] The support member BSU may be arranged along the second surface Fb of the substrate FSUB and configured to support the substrate FSUB. The support member BSU may be arranged on the lower portion of the second surface Fb of the substrate FSUB via a coupling member ADL. For example, the coupling member ADL may include an adhesive or double-sided tape.

[0074] The thin film transistor TFT may include a semiconductor layer ACT formed on the first surface Fa of the substrate FSUB, a gate electrode GE disposed on the semiconductor layer ACT, and a gate insulating layer G1 disposed between the semiconductor layer ACT and the gate electrode GE.

[0075] The semiconductor layer ACT may include an active region that overlaps with the gate electrode GE to form a channel, and a source region and a drain region that are arranged on either side of the active region interposed therebetween. An interlayer insulating film ILD may be arranged on the gate electrode GE. The interlayer insulating film ILD may include source / drain electrodes that are electrically connected to the source / drain regions of the semiconductor layer ACT through the gate insulating layer GI. In one embodiment, the interlayer insulating film ILD may include an organic material.

[0076] The connection electrode BE, the connection wiring LE, and the reflective layer RF may be arranged on the interlayer insulating film ILD. The connection electrode BE, the connection wiring LE, and the reflective layer RF may be arranged on the same plane. As an example, the connection wiring LE may include a common voltage line. An adhesive layer AD for covering the connection electrode BE, the connection wiring LE, and the reflective layer RF may be arranged on the interlayer insulating film ILD. The adhesive layer AD may selectively expose the upper surfaces of the connection electrode BE and the connection wiring LE.

[0077] The light-emitting element ED may be arranged at a position on the adhesive layer AD corresponding to the position of the reflective layer RF. A horizontal micro-LED has been described as an example of a light-emitting element according to an embodiment of the present disclosure, but the present disclosure is not limited thereto. For example, a vertical micro-LED or a flip-chip micro-LED may be applied as the light-emitting element.

[0078] The light emitting element ED may include a nitride semiconductor structure NSS, a passivation layer PS, a first electrode E1, and a second electrode E2. The nitride semiconductor structure NSS may include a first semiconductor layer NS1, an active layer EL arranged on a predetermined region of the first semiconductor layer NS1, and a second semiconductor layer NS2. The passivation layer PS may be arranged outside the nitride semiconductor structure NSS. The first electrode E1 may be connectedly arranged on the first semiconductor layer NS1, and the second electrode may be connectedly arranged on the second semiconductor layer NS2. In one embodiment, the passivation layer PS may cover the side surfaces of the second semiconductor layer NS2 and / or the first semiconductor layer NS1.

[0079] The first semiconductor layer NS1 may be a layer for supplying electrons to the active layer EL and may include a nitride semiconductor containing a first conductivity type impurity. For example, the first conductivity type impurity may include an N-type impurity. The active layer EL arranged on a predetermined portion of the first semiconductor layer NW1 may have an MQW (multi-quantum well) structure. The second semiconductor layer NS2 may be a layer for injecting holes into the active layer EL. The second semiconductor layer NS2 may include a nitride semiconductor containing a second conductivity type impurity. For example, the second conductivity type impurity may include a P-type impurity.

[0080] The reflective layer RF can be configured to reflect the light emitted from the light-emitting element ED to the second surface Fb, which is the rear surface of the substrate FSUB, toward the light-emitting region of the first surface Fa, which is the front surface. In one embodiment, the reflective layer RF can be arranged below the light-emitting element ED (e.g., a micro LED), and in another embodiment, can be arranged below the adhesive layer.

[0081] The light emitting element ED may be covered by a planarization layer P. The planarization layer P may have a predetermined thickness sufficient to planarize the upper surface, which is stepped by the circuit element. The planarization layer P may include a structure in which a first planarization layer P1 and a second planarization layer P2 are layered. The planarization layer P may include a negative-type photoactive compound.

[0082] The planarization layer P may have a first contact hole CEH1 and a second contact hole CEH2 that penetrate the first and second planarization layers P1 and P2 to partially expose the surfaces of the first and second electrodes E1 and E2 of the light-emitting element ED. In one embodiment, the second contact hole CEH2 formed in the planarization layer P exposes at least a portion of the connection electrode BE, and / or the first contact hole CEH1 in the planarization layer exposes at least a portion of the connection wiring LE. In one embodiment, the planarization layer P may cover the side surfaces of the passivation layer PS.

[0083] The first wiring electrode CE1 and the second wiring electrode CE2 may be arranged on the exposed surfaces of the first contact hole CEH1 and the second contact hole CEH2, respectively, to be electrically connected to the connection wiring LE or the drain electrode of the semiconductor layer ACT of the thin film transistor TFT, respectively. The first wiring electrode CE1 may be electrically connected to the first electrode E1. The second wiring electrode CE2 may be electrically connected to the second electrode E2. The first wiring electrode CE1 and the second wiring electrode CE2 may be made of the same material. In an embodiment, the first wiring electrode CE1 or the second wiring electrode CE2 may include a transparent metal oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0084] A bank BNK having a bank hole BKH may be arranged on the planarization layer P. The bank BNK may be a boundary region defining the light-emitting area and may be configured to separate the sub-pixels in which the light-emitting elements ED are arranged from one another. In an embodiment, the material constituting the bank BNK may be filled in the first contact hole CEH1 and the second contact hole CEH2, and the first wiring electrode CE1 and the second wiring electrode CE2 may be formed in the first contact hole CEH1 and the second contact hole CEH2, respectively. The bank BNK may be configured by a black matrix. A sealing insulating layer PTL including the bank BNK may be arranged on the substrate FSUB. In one embodiment, the bank BNK may include a black material, such as carbon black or a black pigment. In one embodiment, the sealing insulating layer PTL may cover the bank BNK, the planarization layer P, and the wiring electrode CE1 or CE2. In one example, the planarization layer P is an insulating layer.

[0085] Reference again Figure 4 The bank BNK may extend from the outermost portion of the front panel area FPN to the rear panel area FPN. Here, the area extending from the outermost point of the front panel area FPN to the rear panel area BPN may be referred to as a side wiring protection layer SDP. The side wiring protection layer SDP may be formed to cover the exposed surface of the side wiring SE arranged on the bending area BDA. In one example, the bank BNK may extend to cover at least a portion of the front panel area FPN, the rear panel area BPN, and the bending area BDA.

[0086] The sealing insulating layer PTL may be formed by extending from the outermost point of the front panel area FPN to a predetermined area of the back panel area BPN. The sealing insulating layer PTL may be configured to cover all exposed surfaces of the side wiring protection layer SDP arranged on the bending area BDA. Therefore, the side wiring SE can be protected from external impact by the side wiring protection layer SDP and the sealing insulating layer PTL.

[0087] The cover member CU may be arranged on the sealing insulating layer PTL. The cover member CU may be arranged on the sealing insulating layer PTL at least on the front panel area. The cover member CU may include a functional optical film such as an anti-shatter film.

[0088] A side seal member SP may be disposed on at least one side surface of the substrate FSUB. The side seal member SL may be configured to protect the side wiring SE of the display device and prevent moisture, etc., from penetrating the side surface. The outer surface of the side seal member SL may be arranged on the same plane as the outermost surface of the cover member CU to form an alignment.

[0089] Since the connection wirings LE and the side wirings SE extend from the front panel area FPN to the back panel area BPN without being cut off, the display device according to an embodiment of the present disclosure can prevent disconnection of the side wirings SE in the bending area BDA and improve product reliability.

[0090] Instead of bonding upper and lower substrates made of relatively hard materials such as glass, the display device may incorporate flexible and lightweight materials such as polyimide into the substrates as a single substrate to achieve a lightweight product.

[0091] Figure 6 is a cross-sectional view of a display device according to another embodiment of the present disclosure.

[0092] refer to Figure 6 , except for the region of the substrate FSUB exposed to the second surface Fb by removing the support member BSU, the display device 300 according to another embodiment of the present disclosure is different from the display device according to the embodiment of the present disclosure. Figure 4 The display device 200 of the embodiment is the same as that of the embodiment, and repeated description of this embodiment is omitted below.

[0093] refer to Figure 6 The display device 300 according to this embodiment may include an adhesive member ADU disposed on the exposed area of the substrate FSUB to the second surface Fb. The curved area BDA and the rear panel area BPN of the substrate FSUB may be fixed to the lower portion of the front panel area FPN via the adhesive member ADU. In one embodiment, a single support member BSU may be coupled to the rear panel area BPN and the second surface Fb of the front panel area FPN of the substrate FSUB (e.g., via a coupling member ADL or an adhesive layer ADU).

[0094] Therefore, the distance between the front panel area FPN and the back panel area BPN of the substrate FSUB may be reduced, so that a thinner display device 300 may be implemented.

[0095] At the same time, heat generated from the display device can be discharged more easily, and the rigidity of the substrate FSUB can be further ensured by changing the material of the support member BSU.

[0096] Figure 7 is a cross-sectional view of a display device according to another embodiment of the present disclosure.

[0097] refer to Figure 7 The display device 400 according to another embodiment of the present disclosure may use different materials for the support member BSU and further include the display device 400 according to the embodiment of the present disclosure. Figure 6 The display device 300 of the embodiment has different reinforcing members SU.

[0098] The display device 400 according to an embodiment of the present disclosure is characterized in that the planarization layer P covering the light emitting element ED on the substrate FUB extends even to the back panel region BPN, which is different from the embodiment according to the present disclosure. Figure 6 Specifically, the multi-layer structure of the first planarization layer P1 and the second planarization layer P2 may extend some areas of the back panel area BPN while covering the bending area BDA.

[0099] Therefore, repeated description of the comparison between the display devices 200 and 300 according to the embodiments will be omitted.

[0100] like Figure 7 As shown, the support member BSU disposed below the second surface Fb of the substrate FSUB of the display device 400 according to the embodiment may include a metal material. In embodiments, the support member may be made of a material that can easily dissipate heat, such as aluminum (Al). Therefore, heat generated within the display device can be easily dissipated to the outside through the support member BSU.

[0101] The reinforcement member SU can be arranged on the lower and side surfaces of the support member BSU, located at a position corresponding to the front panel area FPN. The reinforcement member SU can be made of a material that is relatively harder than that of the substrate FSUB. In an embodiment, the reinforcement member SU can include a mandrel. An adhesive can be used to secure the reinforcement member SU to the support member BSU. This can improve the rigidity of the substrate FSUB.

[0102] Since the bending area BDA where the side wiring SE is arranged is covered by the planarization layer P, the side wiring protection layer SDP, and the sealing insulating layer PTL, the side wiring SE arranged on the side surface of the display device 400 can be prevented from being damaged by external impact.

[0103] Hereinafter, with reference to the accompanying drawings, a manufacturing method according to an embodiment of the present disclosure will be described.

[0104] Figures 8 to 11 is a view showing a method of manufacturing a display device according to an embodiment of the present disclosure. Here, Figure 8 It is along Figure 3 A cross-sectional view along line 8-8 is shown.

[0105] refer to Figure 8 , preparing a substrate FSUB. The substrate FSUB can be made of a transparent insulating material that is flexible enough to facilitate bending. The substrate FSUB can include polyimide (PI), but the present disclosure is not limited thereto. For example, any transparent material can be used without limitation. The substrate FSUB can include a first surface Fa and a second surface Fb that is a rear surface of the first surface Fa.

[0106] On the substrate FSUB, thin film transistors TFT for driving the light emitting elements ED and a support member BSU for reinforcing the rigidity of the substrate FSUB to form various wirings may be arranged.

[0107] The support member BSU may be disposed on the second surface Fb, which is a rear surface of the first surface Fa of the substrate FSUB. The support member BSU may be made of a material relatively harder than that of the substrate FSUB, such as glass or plastic.

[0108] The coupling member ADL may be disposed between the substrate FSUB and the support member BSU to fix the support member BSU to the substrate FSUB. The coupling member ADL may include an adhesive or a double-sided tape.

[0109] refer to Figure 9 , the light emitting element ED, the thin film transistor TFT for driving the light emitting element ED, and various wirings can be arranged on the substrate FSUB having a flat developed shape.

[0110] The embodiment of the present disclosure may suggest using side-type micro LEDs as the light emitting elements ED formed on the substrate FSUB, but is not limited thereto. For example, the light emitting elements ED may be configured as vertical micro LEDs.

[0111] When the light emitting element ED is a vertical micro LED, the thin film transistor TFT and the light emitting element ED have the same Figure 7 The micro LED and thin film transistor TFT have the same configuration as described in . Therefore, their detailed description will be omitted.

[0112] The substrate FSUB may include a display area AA and a non-display area NAA. It is understood that the display area AA may be an area where images are displayed, while the non-display area NAA is an area where images are not displayed. The non-display area NAA may include wiring for transmitting signals to the light-emitting elements ED and thin-film transistors TFT, as well as a chip-on-film (COF) including a circuit film FM on which an integrated circuit chip IC is mounted.

[0113] The substrate FSUB may include a front panel area FPN, a bending area BDA, and a back panel area BPN. Light-emitting elements ED for emitting light into the display area and thin-film transistors TFT for driving the light-emitting elements ED may be arranged on the front panel area FPN. A chip-on-film (COF) including a circuit film FM on which an integrated circuit chip IC is mounted, and wiring for transmitting drive signals to the light-emitting elements ED and thin-film transistors TFT may be arranged on the back panel area BPN.

[0114] The chip on film COF including the integrated circuit chip IC may be connected to a printed circuit board provided with a control unit including a gate driving unit for providing a scan signal, a data driving unit for providing a data signal, or a timing control unit for providing a timing control signal.

[0115] The bending area BDA may be disposed between the front panel area FPN and the rear panel area BPN. The bending area BDA may be a region that may be bent so that the rear panel area BPN and the front panel area FPN face in contact with each other.

[0116] At the same time, the light-emitting elements ED, thin-film transistors TFT for driving the light-emitting elements ED, and various wirings can be formed on the substrate FSUB. Therefore, the connection wiring LE for transmitting drive signals to the light-emitting elements ED and the thin-film transistors TFT can also extend from the front panel area FPN to the back panel area BPN without being cut off.

[0117] In this case, since the bending area BDA is formed to be bendable through a bending process, some of the connection wirings LE arranged on the bending area BDA may be damaged during the bending process.

[0118] Therefore, referring to the enlarged plan view of the connection wiring LE arranged on the bending area BDA in the embodiment of the present disclosure, the width W2 of the connection wiring LE arranged on the bending area BDA can be relatively wider than the width W1 of the connection wiring LE arranged on the front panel area FPN and the back panel area BPN. Here, the connection wiring arranged on the bending area BDA can be referred to as a side wiring SE.

[0119] The bank BNK arranged on the planarization layer P covering the light-emitting elements ED formed on the substrate FSUB can be formed by extending from the outermost area of the front panel area FPN to a predetermined area of the back panel area BPN. In addition to the bank BNK arranged on the front panel area FPN, the area extending from the outermost area of the front panel area FPN to the predetermined area of the back panel area BPN can be referred to as a side wiring protection layer SDP. The side wiring protection layer SDP can be formed to cover the exposed surface of the side wiring SE arranged on the bending area BDA.

[0120] The sealing insulating layer PTL disposed on the bank BNK may extend from the outermost area of the front panel area FPN to a predetermined area of the back panel area BPN. The sealing insulating layer PTL may cover all exposed surfaces of the side wiring protection layer SDP disposed on the bending area BDA and the back panel area BPN.

[0121] In the embodiment of the present disclosure, wiring for transmitting a driving signal to the light emitting element ED and the thin film transistor TFT, the planarization layer P, and the sealing insulating layer PTL may be formed in a state where the substrate FSUB is flatly folded.

[0122] refer to Figure 10 , some areas of the support member BSU arranged in the direction of the second surface Fb of the substrate FSUB can be removed. The support member BSU can be removed by using a laser such as LLO (laser lift-off). When the mask covers the rear surface of the support member BSU in the rear panel area BPN and the front panel area FPN (which is the portion other than the portion CW1 corresponding to the bending area BDA), the laser L can be irradiated only to the area CW1 corresponding to the bending area BDA. In this case, the laser L can be irradiated to the portion CW1 corresponding to the bending area BDA to selectively remove only the support member BSU on this portion. Therefore, the support member BSU may include a first support unit BSU-1 arranged at a position corresponding to the front panel area FPN and a second support unit BSU-2 arranged at a position corresponding to the rear panel area BPN.

[0123] The second surface Fb of the substrate FSUB may be exposed at a portion corresponding to the bending area BDA. One side surface S1 of the first support unit BSU-1 and one side surface S2 of the second support unit BSU-2 facing the surface S1 of the first support unit BSU-1 may be exposed.

[0124] refer to Figure 11 , the bending area BDA of the flatly unfolded substrate FSUB may be bent to be folded. Then, the substrate FSUB may be folded so that the rear panel area BPN and the front panel area FPN may face each other.

[0125] When a portion of the substrate FSUB corresponding to the bending area BDA is folded, one side surface S1 of the first support unit BSU- 1 and one side surface S2 of the second support unit BSU- 2 may contact the exposed second surface Fb of the substrate FSUB.

[0126] The supporting member BSU may include a first supporting unit BSU-1 and a second supporting unit BSU-2, the first supporting unit BSU-1 being arranged in the direction of the second surface Fb of the substrate FSUB on the front panel area FPN, and the second supporting unit BSU-2 being arranged in the direction of the second surface Fb of the substrate on the back panel area BPN.

[0127] The second support unit BSU-2 may be fixed to the first support unit BSU-1 by an adhesive member ADU fixed to the rear surface of the front panel area FPN. For example, the adhesive member ADU may include a pressure sensitive adhesive (PSA), an optically clear adhesive (OCA), or a transparent optically clear resin (OCR).

[0128] The side wiring SE may be bent together with the bending area BDA.The adhesive member ADU may include a pressure sensitive adhesive (PSA), an optically clear adhesive (OCA), or a transparent optically clear resin (OCR).

[0129] In the embodiment of the present disclosure, a plurality of processes for forming the side wiring SE, the side wiring protection layer SDP, and the sealing insulation layer PTL may be omitted only for the purpose of achieving process optimization.

[0130] For example, a display device including multiple display modules formed by bonding multiple lower substrates and multiple upper substrates and aligning the multiple display modules in horizontal and vertical directions may require side wiring for electrically connecting the multiple lower substrates and the multiple upper substrates to each other. To form the side wiring, it is necessary to provide an edge processing process by processing the edge area of the upper substrate using a grinding wheel, a process for forming the side wiring by extending the edge area of the upper substrate toward the edge area of the lower substrate, a process for forming a side protective layer for covering the side wiring for protection, and a process for forming a sealing insulating layer disposed on the side protective layer.

[0131] In an embodiment of the present disclosure, a connection wiring LE extending from the front panel area FPN of the substrate FSUB to the back panel area BPN can be formed through the bending area BDA. Here, the portion of the connection wiring LE arranged on the bending area BDA can be configured as a side wiring SE. Therefore, a separate process for forming the side wiring SE can be omitted. In addition, the embankment BNK can extend from the outermost point of the front panel area FPN to the back panel area BPN to form a side wiring protection layer SDP. In one embodiment, the side wiring protection layer SDP can cover at least the side wiring SE in the bending area BDA and be arranged to extend from the front panel area FPN of the substrate FSUB to the back panel area BPN. Therefore, another separate process for forming the side wiring protection layer SDP can be omitted. In addition, by extending the sealing insulating layer PTL from the outermost point of the front panel area FPN to a predetermined area of the back panel area BDA, a separate process for forming the sealing insulating layer PTL on the bending area BDA can be omitted.

[0132] Next, a cover member CU may be placed on the sealing insulating layer PTL. The cover member CU may protect the light-emitting element ED from external impact. The cover member CU may be made of glass or plastic, but the present embodiment is not limited thereto. For example, the cover member CU may also include a functional optical film. The cover member CU may be adhered to the sealing insulating layer PTL using an optically transparent adhesive, but the present embodiment is not limited thereto.

[0133] Continuing, side seal members SL may be formed on the side surfaces of the substrate FSUB to form the display device 200. The side seal members SL can protect the display device and the side wiring SE, and can also prevent moisture from penetrating through the side surfaces. The outer surface of the side seal member SL may be arranged on the same plane as the outermost surface of the cover member CU to form an alignment. In one embodiment, the side surface of the side seal member SL is flush with the side surface of the cover member CU.

[0134] If a separate process of forming side wiring for electrically connecting the upper and lower substrates to each other is performed after bonding the upper substrate on which the light emitting elements are arranged and the lower substrate on which the chip on film is arranged to each other, a process defect rate may increase.

[0135] If an upper substrate on which a light-emitting element is arranged and a lower substrate on which a chip-on-film is arranged are formed in separate processes and then fixedly bonded to each other, defects may occur during the process of implementing a curved display device that is bendable at the outermost portions of both sides. In embodiments, when the outermost portions of the bonded upper and lower substrates are bent, side wiring electrically connecting the upper and lower substrates may be disconnected during the bending process, which may cause defects.

[0136] In contrast, according to the embodiments of the present disclosure, light emitting elements ED, thin film transistors TFT, and a chip-on-film COF for mounting an integrated circuit chip IC are formed on one substrate FSUB, and multiple processes can be omitted, thereby optimizing the process and reducing costs.

[0137] In addition, according to an embodiment of the present disclosure, the connection wiring LE and the side wiring SE may be continuously extended from the front panel region FPN to the rear panel region BPN, thereby preventing the side wiring SE from being disconnected and improving product reliability.

[0138] The embodiments of the present disclosure may increase the area from which the support member is removed, thereby realizing a thinner display device.

[0139] Hereinafter, another embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0140] Figures 12 to 14 is a view illustrating a method of manufacturing a display device according to another embodiment of the present disclosure.

[0141] refer to Figure 12, a predetermined portion of the support member BSU, which is arranged in the direction of the second surface Fb of the substrate FSUB on which the light-emitting element ED, the thin film transistor TFT, and the chip-on-film including the circuit film FM on which the integrated circuit chip IC is mounted, can be removed. The support member BSU can be removed using laser L (such as laser lift-off (LLO)).

[0142] Here, the laser L may be irradiated to a portion CW2 corresponding to the bending area BDA and the back panel area BPN to selectively remove a corresponding portion of the support member BSU.

[0143] Therefore, the support member BSU may remain only a portion corresponding to the front panel area FPN.

[0144] Portions corresponding to the bending area BDA and the back panel area BPN may be removed together with the coupling member ADL to expose the second surface Fb of the substrate FSUB. Alternatively, one side surface of the support member BSU and the coupling member ADL may be exposed at the surface between the front panel area FPN and the bending area BDA.

[0145] refer to Figure 13 The adhesive member ADU can be arranged on the second surface FB of the substrate FSUB, which is exposed to the bending area BDA and the rear panel area BPN. Therefore, the bending area BDA of the flattened substrate FSUB can be bent to fold. The substrate FSUB can then be in a folded state with the rear panel area BPN and the front panel area FPN facing each other. For example, the adhesive member ADU may include a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR).

[0146] When the portion of the substrate FSUB corresponding to the bending area BDA bends, one surface of the support member BSU can come into contact with the adhesive member ADU. The rear panel area BPN of the substrate FSUB can be secured to the rear surface of the support member BSU via the adhesive member ADU. Since only the substrate FSUB is attached (with the support member BSU interposed therebetween), the display device can be relatively thin.

[0147] When the bending area BDA is bent, the side wiring SE can be bent along with the bending area. Here, the width of the side wiring SE can be formed to be relatively wider than the width of the connection wiring LE arranged on the front panel area FPN and the back panel area BPN, thereby preventing damage caused by the operation of bending the side wiring along the bending area BDA.

[0148] refer to Figure 14The cover member CU may be disposed on the sealing insulating layer PTL. The cover member CU may protect the light-emitting element ED from external impact. The cover member CU may include glass or plastic, but the present embodiment is not limited thereto. For example, the cover member CU may also include a functional optical film such as an anti-scattering film. The cover member CU may be adhered to the sealing insulating layer PTL using an optically transparent adhesive, but the present embodiment is not limited thereto.

[0149] Thus, the display device 300 can be formed by forming the side seal member SL. The side seal member SL can protect the side wiring SE of the display device and prevent moisture from penetrating from the side surface. The outer surface of the side seal member SP can be arranged on the same plane as the outermost surface of the cover member CU to form an alignment.

[0150] According to an embodiment of the present disclosure, a single structure of the substrate FSUB may be attached with the support member BSU interposed therebetween, so that the overall thickness of the display device may be thinned.

[0151] In addition, since the substrate FSUB including a lightweight material such as polyimide is applied to the display device, the embodiment of the present disclosure may have an advantage of realizing a lightweight product.

[0152] According to an embodiment of the present disclosure, a structure for dissipating heat from a display device to the outside may be introduced, which will be described with reference to the accompanying drawings.

[0153] Figures 15 to 18 is a view showing a method of manufacturing a display device 400 according to another embodiment of the present disclosure. Figure 8 and Figure 9 The steps of forming the light-emitting element ED, the thin film transistor TFT, and the chip-on-film COF including the circuit film FM on which the integrated circuit chip IC is mounted on the substrate FSUB shown may be the same as the process shown in this embodiment. Therefore, repeated descriptions will be omitted, and the different features will be described.

[0154] In addition, the light emitting element ED and the thin film transistor TFT of this embodiment are Figure 5 The light emitting element ED and the thin film transistor TFT in the embodiment shown are the same, so detailed description thereof is omitted. In the embodiment, the light emitting element ED may be a vertical micro LED.

[0155] refer to Figure 15 , a substrate FSUB can be prepared on which a light emitting element ED, a thin film transistor TFT and a chip on a film are formed, and the chip on the film has a circuit film on which an integrated circuit chip IC is mounted.

[0156] The display device 400 according to this embodiment of the present disclosure is characterized in that the light-emitting element ED is formed on the substrate FSUB and the planarization layer P extends to the back panel region BPN. Specifically, the structure configured with the first planarization layer P1 and the second planarization layer P2 can cover the bending area BDA from the front panel region FPN and extend to a predetermined area of the back panel region BPN.

[0157] Next, the side wiring protection layer SDP disposed on the planarization layer P may also extend from the outermost portion of the front panel region FPN to a predetermined region of the back panel region BPN. Therefore, the side wiring protection layer SDP may be disposed on the planarization layer P extending to the predetermined region of the back panel region BPN.

[0158] Therefore, the sealing insulating layer PTL arranged on the bank BNK formed on the front panel area FPN can extend from the outermost portion of the front panel area FPN to a certain area of the back panel area BPN. The sealing insulating layer PTL can cover all exposed surfaces of the side wiring protection layer SDP arranged on the bending area BDA and the back panel area BPN. The sealing insulating layer PTL can be arranged to extend from the front panel area FPN of the substrate FSUB to the back panel area BPN of the substrate FSUB, and cover the side wiring SE and the sealing insulating layer SDP.

[0159] Meanwhile, the support member BSU disposed on the second surface Fb of the substrate FSUB may include a metal material to dissipate heat generated from the inside of the display device to the outside. In an embodiment, the support member BSU may be made of a material capable of easily dissipating heat, such as aluminum Al.

[0160] refer to Figure 16 , a predetermined area of the support member BSU arranged in the direction of the second surface Fb of the substrate FSUB may be removed. The support member BSU may be removed using laser L such as LLO (Laser Lift Off).

[0161] Here, the laser L may be irradiated to the portion CW3 corresponding to the bent area BDA to selectively remove only the support member BSU on the portion.

[0162] Therefore, the support member BSU may remain on the portion corresponding to the front panel area FPN.

[0163] The coupling member ADL and the support member may be removed together from portions corresponding to the bending area BDA and the back panel area BPN to expose the surface of the second surface Fb of the substrate FSUB. One surface of the support member BSU and one surface of the coupling member ADL may be exposed at the boundary surface between the front panel area FPN and the bending area BDA.

[0164] refer to Figure 17 The reinforcing member SU may be arranged on the supporting member BSU arranged on a portion corresponding to the front panel area FPN. The reinforcing member SU may include a mandrel. The reinforcing member SU may be fixedly attached to positions corresponding to one side surface and the rear surface of the supporting member BSU.

[0165] In an embodiment, an adhesive member may be disposed on the second surface Fb of the substrate FSUB exposed to the bending area BDA and the back panel area BPN. For example, the adhesive material may be a pressure sensitive adhesive (PSA), an optically clear adhesive (OCA), or a transparent optically clear resin (OCR).

[0166] refer to Figure 18 , the bending area BDA of the substrate is in a flat unfolded state. Then, the substrate FSUB can be folded so that the rear panel area BPN and the front panel area FPN can face each other.

[0167] Here, when the base plate FSUB is folded, the portion of the base plate FSUB corresponding to the bending area BDA can be fixedly contacted with one side surface of the reinforcing member SU. Therefore, the rear panel area BPN of the base plate FSUB can be fixed to the rear surface of the support member BSU. Since the reinforcing member SU is arranged corresponding to the bending area BDA, the rigidity of the base plate FSUB can be increased.

[0168] The side wiring SE may be bent along the bending area BDA. The side wiring SE may be formed to be relatively wider than the connection wiring LE arranged on the front panel area FPN and the back panel area BPN, thereby preventing damage caused by bending the side wiring along the bending area BDA.

[0169] Next, a cover member CU may be placed on the sealing insulating layer PTL. The cover member CU protects the light-emitting element ED from external impact. The cover member CU may be made of glass or plastic, but the present embodiment is not limited thereto. For example, the cover member CU may also include a functional optical film. The cover member CU may be adhered to the sealing insulating layer PTL using an optically clear adhesive, but the present embodiment is not limited thereto.

[0170] Continuing with the side seal members SL, the display device 200 may be formed on the side surfaces of the substrate FSUB. The side seal members SL may protect the display device and the side wiring SE, and may also prevent moisture from penetrating the side surfaces. The outer surface of the side seal members SL may be aligned with the outermost surface of the cover member CU. For example, the side seal members SL may include a resin.

[0171] The display device 400 according to an embodiment of the present disclosure may include a support member made of a metal material, thereby easily dissipating heat generated from the inside of the display device to the outside.

[0172] The planarization layer, the side wiring protection layer, and the sealing insulating layer disposed on the light emitting element may extend from the outermost portion of the front panel region to a predetermined region, thereby preventing damage to the side wiring disposed on the side surface of the display device.

[0173] In addition, a reinforcing member may be disposed on the rear surface of the substrate, thereby improving the rigidity of the substrate.

[0174] Each of the plurality of display devices 100-1, 100-2, 100-3, ... 100-M, and 100-N according to other embodiments of the present disclosure may include a plurality of bending regions. The plurality of bending regions may be realized by selecting a region for a laser lift-off process and performing the laser lift-off process, as will be described below with reference to the accompanying drawings.

[0175] Figure 19 is a plan view showing that a display device according to still another embodiment of the present disclosure is unfolded. Figures 20 to 24 : is a diagram illustrating a method for manufacturing a display device according to another embodiment of the present disclosure. Figures 20 to 23 It is along Figure 19 A cross-sectional view taken along line 20-20. Figure 24 According to the embodiment of the present disclosure Figure 19 A cross-sectional view taken along line 24-24.

[0176] Steps of forming a chip-on-film including a circuit film on which a light emitting element ED, a thin film transistor TFT, and an integrated circuit chip IC are mounted Figure 5 、 8 The steps are the same as those shown in 9, so repeated description is omitted. In the following, different technical features will be described.

[0177] refer to Figure 19 and Figure 20 The display device 500 according to this embodiment may include a display area AA in which a plurality of pixels are arranged and a non-display area NAA surrounding the display area AA. Each of the plurality of pixels PX may include a plurality of sub-pixels. The plurality of sub-pixels may include light-emitting elements configured to emit red light R, green light G, and blue light B, respectively. However, this embodiment is not limited thereto, and the light-emitting elements may also include white light-emitting elements that emit white light.

[0178] The substrate FSUB may include a front panel area FPN, a bending area BDA, and a rear panel area BPN. The substrate FSUB may be configured as a single substrate. The front panel area FPN may include a display area AA. The bending area BDA may be flexible so that the rear panel area BPN and the front panel area FPN can face each other.

[0179] The display device 500 according to this embodiment may have bend lines BL arranged on the four side surfaces of the display area AA to define the boundary between the front panel area FPN and the bend line area BDA. For example, the bend lines BL may be arranged on the top, bottom, left, and right surfaces of the display area AA. When the display device 500 is bent along the bend lines BL, the bend areas BDA may be provided. In other words, the bend areas BDA may be arranged on the top, bottom, left, and right surfaces of the display area AA. The display device 500 may include two or more COFs on a portion of the back panel area BPN of the substrate FSUB. The substrate FSUB may include multiple bend areas BDA and multiple back panel areas BPN, each of which is arranged between the front panel area FPN and a corresponding back panel area BPN of the substrate FSUB. The substrate FSUB is bent so that the second surface Fb of each back panel area BPN faces the second surface Fb of the front panel area FPN of the substrate FSUB.

[0180] A chip on film COF including a circuit film FM and a printed circuit board PCB may be arranged in at least one region of the display device, with an integrated circuit chip IC mounted on the circuit film FM.

[0181] Reference again Figure 20 The support member BSU may be coupled to the second surface Fb of the substrate FSUB, on which the light-emitting element ED, the thin film transistor TFT, and the chip-on-film COF are formed on the coupling member ADL. As an example, the light-emitting element ED may be arranged on the front panel region FPN.

[0182] As another example, the light emitting element ED may extend to one region of the bending region BPN disposed between the front panel region FPN and the back panel region BPN. When the light emitting element ED is arranged by extending to one region of the bending region BPN, the display area AA occupied in the display device may increase the area (ΔA, see FIG. 1 ) of the one region extending to the bending region BPN. Figure 19 ). The extension area to one area of the bending area BPN on which the light emitting element ED is arranged may be at least one of the upper surface, the lower surface, the left surface, and the right surface of the display area AA.

[0183] The display device according to the present embodiment is characterized in that the coupling member ADL is a multi-layer structure including a sacrificial layer SCL and a protection layer PL, which is different from other embodiments.

[0184] The sacrificial layer SCL may include a front panel area FPN, a bending area BDA, and a back panel area BPN, and may be disposed on the entire surface of the support member BDA. As an example, the sacrificial layer SCL may include an amorphous silicon layer.

[0185] A protective layer PL can be disposed on the sacrificial layer SCL and extend from the front panel area FPN to the boundary surface of the bending area BDA. The protective layer PL can be disposed in an area corresponding to the area where the thin-film transistor (TFT) is disposed. The protective layer PL can prevent the thin-film transistor (TFT) from being damaged by laser light during the subsequent laser lift-off (LLO) process. To this end, the protective layer PL can comprise a material that can form a strong coupling energy with the material of the sacrificial layer SCL. For example, the protective layer can comprise silicon oxide (SiO2).

[0186] For example, the support member BSU disposed on the second surface Fb of the substrate FSUB may include glass or plastic.

[0187] refer to Figure 21 The support member BSU can be partially removed. The support member BSU can be removed using a laser lift-off process (LLO) using a laser. A multilayer structure including a sacrificial layer SCL and a protective layer PL can be arranged in the area of the front panel region FPN where the thin film transistor TFT is arranged. A single layer structure including the sacrificial layer SCL can be arranged in the area of the support member BSU corresponding to the bending area BDA and the back panel region BPN.

[0188] The laser lift-off process LLO can be performed on the entire surface of the substrate FSUB. The laser lift-off process LLO can transfer laser light from the rear surface of the support member BSU to the sacrificial layer SCL. Here, the region where the multilayer structure including the sacrificial layer SCL and the protective layer PL is arranged can have strong coupling energy between the protective layer PL and the sacrificial layer SCL. Therefore, the thin-film transistor TFT can be prevented from being damaged by the laser light L penetrating the region where the thin-film transistor TFT is arranged. Furthermore, due to the strong coupling energy between the protective layer PL and the sacrificial layer SCL, the sacrificial layer SCL can be retained without being removed.

[0189] The single-layer structure of the sacrificial layer SCL can be arranged in the region CW4 corresponding to the bending area BDA and the back panel area BPN. Therefore, the intermolecular bonding force of the sacrificial layer SCL can be released in the region CW4 corresponding to the bending area BDA and the back panel area BPN, and the sacrificial layer SCL can then be removed from the substrate FSUB. Simultaneously with the removal of the sacrificial layer SCL, the support member BSU in the region corresponding to the sacrificial layer SCL can also be removed. The support member BSU can then remain only in the region corresponding to the front panel area FPN.

[0190] The coupling member ADL may also be removed from the region corresponding to the bending area BDA and the back panel area BPN to expose the second surface Fb of the substrate FSUB. In addition, the side surfaces of the sacrificial layer SCL and the support member BSU may be exposed at the boundary surface between the front panel area FPN and the bending area BDA.

[0191] refer to Figure 22 , a sealing material SG may be disposed on the exposed side surfaces of the support member BSU and the sacrificial layer SCL. The sealing material SG may serve as a buffer for buffering damage to the substrate FSUB caused during bending and folding of the bending area BDA of the flatly unfolded substrate FSUB. Figure 19 In a plan view, the sealing material SG may be arranged to surround four side surfaces of the display area AA.

[0192] refer to Figure 23 The bending area BDA of the flattened substrate FSUB can be bent to fold. The substrate FSUB can then be folded so that the rear panel area BPN and the front panel area FPN face each other. A chip-on-film (COF) including a circuit film FM with an integrated circuit IC mounted thereon can be placed on the rear panel area BPN.

[0193] refer to Figure 24 , a region of the display device 500 in which the chip on film COF is not arranged may be folded so that the rear panel region BPN of the substrate FSUB may face the rear surface of the front panel region FPN.

[0194] Meanwhile, by selectively performing the laser lift-off process, only the support member of a region desired to be removed may be selectively removed, which will be described with reference to the accompanying drawings.

[0195] Figures 25 to 28 is a diagram illustrating a method for manufacturing a display device according to another embodiment of the present disclosure. Figure 5 、 Figure 8 and Figure 9The steps of forming the light-emitting element ED, the thin film transistor TFT, and the chip-on-film COF including the circuit film FM on which the integrated circuit chip IC is mounted on the substrate FSUB shown can be the same as the process shown in this embodiment. Therefore, repeated descriptions will be omitted, and the different features will be described.

[0196] refer to Figure 25 The support member BSU can be coupled to the second surface Fb of the substrate FSUB via a coupling member ADL. A chip-on-film (COF) including a circuit film FM is formed on the second surface. The light-emitting elements ED, thin-film transistors TFT, and integrated circuit chip IC are mounted on the circuit film FM. The display device according to this embodiment is characterized in that the sacrificial layer SCL is disposed only in the region where the laser lift-off process is performed, unlike other embodiments.

[0197] As an example, the light-emitting elements ED may be arranged on the front panel area FPN. As another example, the light-emitting elements ED may even be arranged in an area extending to a portion of the curved area BPN between the front panel area FPN and the back panel area BPN. In this case, the light-emitting elements ED may even be arranged in an area extending to portions of the curved area BPN, thereby increasing the total area of the display area AA occupied by the display device.

[0198] The sacrificial layer SCL may be disposed on the bending area BDA and the back panel area BPN, except for the front panel area FPN. As an example, the sacrificial layer SCL may include an amorphous silicon layer.

[0199] The coupling member ADL may extend from the front panel area FPN to a boundary surface of the bending area BDA. The coupling member ADL may be, for example, an adhesive or a double-sided tape, but the embodiment is not limited thereto.

[0200] For example, the support member BSU disposed on the second surface Fb of the substrate FSUB may include glass or plastic.

[0201] refer to Figure 26 , the support member BSU may be partially removed. A region of the support member BSU may be removed by performing a laser lift-off process LLO using a laser. The laser may be transferred from the rear surface of the support member BSU to the sacrificial layer SCL (see FIG. Figure 25 ). Then, the sacrificial layer SCL can be released (see Figure 25 ) molecular binding energy, and the sacrificial layer can be removed from the substrate FSUB. At this time, the support member BSU can also be removed together.

[0202] Since the sacrificial layer SCL is disposed in the region CW5 corresponding to the bending area BDA and the back panel area BPN, a region where the laser lift-off process LLO is to be performed may be designated.

[0203] The support member BSU may remain only in the area corresponding to the front panel area FPN. By removing the coupling member ADL along with the support member, the second surface Fb of the substrate FSUB may be exposed in the area corresponding to the bending area BDA and the back panel area BPN. Furthermore, the side surfaces of the support member BSU and the coupling member ADL may be exposed on the boundary surface between the bending area BDA and the front panel area FPN.

[0204] refer to Figure 27 , the sealing material SG may be disposed on the exposed side surfaces of the support member BSU and the coupling member ADL. Figure 19 The sealing material SH may be arranged to surround four side surfaces of the display area AA when viewed from a plane.

[0205] refer to Figure 28 , the flat, extended bending area BDA of the substrate FSUB can be bent and folded. Then, the substrate FSUB can be folded so that the rear panel area BPN can face the rear surface of the front panel area FPN. A chip-on-film (COF) including a circuit film FM on which an integrated circuit chip IC is mounted can be arranged on the rear panel area BPN. Other areas of the display device 600 where the chip-on-film (COF) is not arranged can be folded so that the rear panel area BPN of the substrate FSUB can face the rear surface of the front panel area FPN.

[0206] The display devices 500 and 600 including a plurality of bending regions according to the present embodiment may operate as a single display device, which will be described with reference to the accompanying drawings.

[0207] Figure 29 is a view showing a wearable device including a display device according to still another embodiment of the present disclosure.

[0208] refer to Figure 29 , the wearable device 700 may include a display unit DU, a frame FR, and a band unit STU. As an example, the wearable device 700 may include a smart watch. The frame FR may be a structure assembled to define the external design of the wearable device 700. The display unit DU may be arranged in a space defined by the frame FR. The display unit DU may include a display area AA and a plurality of sub-display areas AA-a and AA-b. The display area AA may be visible on the front surface of the wearable device 700. The plurality of sub-display areas AA-a and AA-b may be visible on the front surface or side surface of the wearable device 700. The band unit STU may facilitate wearing and fixing of the wearable device 700. The band unit STU may be coupled to the display unit or physically connected to the display unit.

[0209] The display unit DU may include a display area AA of the display devices 500 and 600. The display area AA includes Figure 19 In this case, the light emitting element ED can be arranged even in an extended area of the bending area BPN between the front panel area FPN and the back panel area BPN. When the light emitting element ED is arranged so as to be extended even in an area of the bending area BPN, the area of the display area AA occupied in the display device can be increased by the extended area (ΔA, see Figure 19 ). The extended area extending to an area of the bending area BPN may be a plurality of sub display areas AA-a and AA-b.

[0210] The display area AA and the multiple sub-display areas AA-a and AA-b of the display unit DU of the wearable device 700 can transmit different images to the outside. In addition, the multiple sub-display areas AA-a and AA-b can transmit different images to the outside.

[0211] A display device according to an embodiment of the present disclosure will be described below.

[0212] A display device according to an embodiment of the present disclosure may include: a substrate including a front panel region, a rear panel region, and a curved region disposed between the front panel region and the rear panel region; a display region located in the front panel region, with a plurality of light-emitting elements disposed on the display region; an integrated circuit chip disposed on the rear panel region; and connection wiring extending from the front panel region of the substrate to the rear panel region through the curved region. The rear panel region of the substrate may be fixed to a lower portion of the substrate corresponding to the front panel region.

[0213] The tiled display device according to an embodiment of the present disclosure may include a plurality of the display devices, wherein the plurality of the display devices are arranged such that the curved regions of the substrate are positioned adjacent to each other.

[0214] The substrate may include a transparent insulating material having flexibility.

[0215] The connection wiring may include a side wiring arranged on the bent region of the substrate, and a width of the side wiring may be wider than a width of the connection wiring arranged on the front panel region and the rear panel region.

[0216] The substrate may include a first surface and a second surface that is a rear surface of the first surface, and the substrate may further include a supporting member that supports the substrate in a direction of the second surface of the substrate.

[0217] The supporting member may include: a first supporting unit arranged on the front panel area in a direction of the second surface of the substrate; and a second supporting unit arranged on the rear panel area in a direction of the second surface of the substrate, spaced apart from the first supporting unit.

[0218] The display device may further include: an adhesive member fixing the first supporting unit and the second supporting unit. The adhesive member may include a transparent optical adhesive or a transparent optical resin.

[0219] The substrate may expose the second surface of the substrate corresponding to the bending area, and side surfaces of the first and second support units may come into contact with the exposed second surface of the substrate.

[0220] The support member may be arranged on the front panel area along a direction of the second surface of the substrate, and may fix the second surface of the substrate corresponding to the bending area and the rear panel area corresponding to side and rear surfaces of the support member.

[0221] The display device may further include a reinforcement member attached to positions corresponding to the side surfaces and the rear surface of the support member. The reinforcement member may come into contact with the second surface of the substrate corresponding to the bending area and the rear panel area.

[0222] The support member may include a metal material including aluminum (Al), and the reinforcement member may include a material harder than the substrate.

[0223] The substrate may include: a planarization layer covering the light emitting element; a side wiring protection layer arranged on the planarization layer and covering the side wiring by extending from the outermost part of the front panel area to the rear panel area; a sealing insulating layer arranged on the side wiring protection layer and covering the side wiring protection layer by extending from the front panel area to the rear panel area; a cover member arranged on the sealing insulating layer at least on the front panel area; and a side sealing member covering the side surface of the substrate.

[0224] Ends of the side sealing members may be arranged on the same plane as an outermost surface of the cover member to form an alignment.

[0225] The side sealing member may include resin.

[0226] The substrate includes a front panel region, a rear panel region, and a bending region disposed between the front panel region and the rear panel region, and the substrate provided in a single one of the plurality of display devices may be one substrate.

[0227] The light-emitting element may include: a nitride semiconductor structure including a first semiconductor layer, an active layer arranged on the first semiconductor layer, and a second semiconductor layer; a passivation pattern arranged outside the nitride semiconductor structure; a first electrode linked to the first semiconductor layer; and a micro-LED including a second electrode linked to the second semiconductor layer.

[0228] Although the embodiments of the present disclosure have been described in more detail with reference to the accompanying drawings, the present disclosure is not necessarily limited to these embodiments, and these embodiments can be modified in various ways within the scope of the technical spirit of the present disclosure. Therefore, the embodiments disclosed in the present disclosure are intended to describe rather than limit the technical ideas of the present disclosure, and the scope of the technical ideas of the present disclosure is not limited by these embodiments. Therefore, it should be understood that the above-mentioned embodiments are not restrictive in all aspects, but illustrative.

Claims

1. A display device comprising: A substrate including a display area and a non-display area; a thin film transistor on the substrate; a connecting electrode electrically connected to the thin film transistor; as well as A connecting wiring extends in the display area and the non-display area and is electrically connected to a first wiring electrode through a first contact hole, wherein the first wiring electrode is connected to a light-emitting element, wherein a thickness of the connecting wiring in the display area is different from a thickness of the connecting wiring in the non-display area.

2. The display device according to claim 1, wherein The connection wiring extends at least in a bending region in the non-display region.

3. The display device according to claim 1, further comprising a reflective layer below the light emitting element, wherein The connection wiring is provided in the same layer as the connection electrode and the reflective layer.

4. The display device according to claim 1, 2 or 3, further comprising a planarization layer on the connection electrode, wherein: The first contact hole is formed in the planarization layer. The display device according to claim 4 , further comprising a bank on the planarization layer. The display device according to claim 5 , wherein: The bank includes a black material.

7. The display device according to claim 5, wherein: The bank fills the first contact hole.

8. The display device according to claim 2, wherein: The thickness of the connection wiring varies in the bending region.

9. The display device according to claim 8, wherein The connection wiring includes a thicker portion and a thinner portion in the bending region.

10. The display device according to claim 4, wherein The planarization layer is disposed in the display area.

11. The display device according to claim 4, wherein The planarization layer includes a first planarization layer and a second planarization layer on the first planarization layer.

12. The display device according to claim 11, further comprising a wiring protection layer on the second planarization layer and a sealing insulating layer on the wiring protection layer, wherein The connection wiring is provided between the substrate and the first planarization layer.

13. The display device according to claim 12, wherein: A portion of the sealing insulating layer is directly connected to the second planarization layer.

14. The display device according to claim 11, wherein The second planarization layer is provided between the first electrode and the second electrode of the light emitting element.

15. The display device according to claim 4, wherein The planarization layer surrounds at least a portion of the light emitting element.

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