Optical signal transmission device and active optical cable

Abstract

The application relates to an optical signal transmission device and an active optical cable. The optical signal transmission device comprises a first optical module assembly, a second optical module assembly, an electrical interface and an optical interface; the first optical module assembly and the second optical module assembly are connected with an external device through the electrical interface; wherein the first optical module assembly comprises a first sending assembly and a first receiving assembly, the input end of the first sending assembly and the output end of the first receiving assembly are connected with the external device through the electrical interface; the output end of the first sending assembly and the input end of the first receiving assembly are connected with the optical interface; the second optical module assembly comprises a second sending assembly, a second receiving assembly and a digital signal processor, the input end of the second sending assembly and the output end of the second receiving assembly are connected with one end of the digital signal processor, the other end of the digital signal processor is connected with the external device through the electrical interface; the output end of the second sending assembly and the input end of the second receiving assembly are connected with the optical interface.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication, in particular to an optical signal transmission device and an active optical cable. BACKGROUND

[0002] With the development of communication technology, optical communication technology is widely used in various fields due to its characteristics of large communication capacity and low loss. When information is transmitted through optical fiber, various types of optical signal transmission devices are generated, such as optical transceiver modules. The optical transceiver module includes a sending end and a receiving end. The sending end is used to convert electrical signals into optical signals, and the receiving end is used to convert optical signals into electrical signals.

[0003] However, the current optical transceiver module has the problem of high power consumption. SUMMARY

[0004] Therefore, it is necessary to provide an optical signal transmission device and an active optical cable capable of reducing the power consumption of the optical transceiver module.

[0005] In a first aspect, the present application provides an optical signal transmission device, comprising: a first optical module assembly, a second optical module assembly, an electrical interface and an optical interface; the first optical module assembly and the second optical module assembly are connected with an external device through the electrical interface; the first optical module assembly and the second optical module assembly are connected with the optical interface;

[0006] The first optical module assembly includes a first sending assembly and a first receiving assembly, and the input end of the first sending assembly and the output end of the first receiving assembly are connected with the external device through the electrical interface; the output end of the first sending assembly and the input end of the first receiving assembly are connected with the optical interface.

[0007] The second optical module assembly includes a second sending assembly, a second receiving assembly and a digital signal processor, the input end of the second sending assembly and the output end of the second receiving assembly are connected with one end of the digital signal processor, and the other end of the digital signal processor is connected with the external device through the electrical interface; the output end of the second sending assembly and the input end of the second receiving assembly are connected with the optical interface.

[0008] In one of the embodiments, the optical signal transmission device further comprises a circuit board, the first optical module assembly and the second optical module assembly are arranged in series along a preset direction on one side surface of the circuit board, the electrical interface is arranged at one end of the circuit board, the optical interface is arranged at a distance from the other end of the circuit board in the preset direction, and the first optical module assembly is arranged on the circuit board close to the electrical interface, and the second optical module assembly is arranged on the circuit board close to the optical interface.

[0009] In one of the embodiments, the first sending assembly is any one of a 4-channel sending assembly, an 8-channel sending assembly, and a 16-channel sending assembly, the first receiving assembly is any one of a 4-channel receiving assembly, an 8-channel receiving assembly, and a 16-channel receiving assembly, and the number of channels of the first receiving assembly is consistent with that of the first sending assembly.

[0010] The second sending assembly is any one of a 4-channel sending assembly, an 8-channel sending assembly, and a 16-channel sending assembly, the second receiving assembly is any one of a 4-channel receiving assembly, an 8-channel receiving assembly, and a 16-channel receiving assembly, and the number of channels of the second receiving assembly is consistent with that of the second sending assembly.

[0011] In one of the embodiments, the first sending assembly comprises a driver, a first silicon optical chip, a first lens, a first laser, and a first fiber array assembly, the driver, one end of the first lens, and the first fiber array assembly are connected with the first silicon optical chip, and the other end of the first lens is connected with the first laser.

[0012] In one of the embodiments, the second sending assembly comprises a second silicon optical chip, a second lens, a second laser, and a second fiber array assembly, one end of the second lens and the second fiber array assembly are connected with the second silicon optical chip, and the other end of the second lens is connected with the second laser.

[0013] In one of the embodiments, the first sending assembly further comprises a polarization maintaining optical fiber, one end of the first lens is connected with the first silicon optical chip through the polarization maintaining optical fiber, and the first lens and the first laser are arranged on a circuit board close to the optical interface.

[0014] In one of the embodiments, the first receiving assembly comprises a first photodiode, a third fiber array assembly, and a first transimpedance amplifier, one end of the first photodiode is connected with the third fiber array assembly, and the other end of the first photodiode is connected with the first transimpedance amplifier.

[0015] In one of the embodiments, the second receiving assembly comprises a second photodiode, a fourth optical fiber array assembly and a second trans-impedance amplifier; one end of the second photodiode is connected with the fourth optical fiber array assembly, and the other end of the second photodiode is connected with the second trans-impedance amplifier.

[0016] In a second aspect, the present application further provides an active optical cable, comprising a first optical signal transmission device, a second optical signal transmission device and a transmission optical fiber, the first optical signal transmission device and the second optical signal transmission device being connected through the transmission optical fiber.

[0017] In one of the embodiments, the first optical signal transmission device comprises a third optical module assembly, a fourth optical module assembly, a first electrical interface and a first optical interface; the third optical module assembly and the fourth optical module assembly are both connected with a first external device through the first electrical interface; the third optical module assembly and the fourth optical module assembly are both connected with the first optical interface;

[0018] The second optical signal transmission device comprises a fifth optical module assembly, a sixth optical module assembly, a second electrical interface and a second optical interface; the fifth optical module assembly and the sixth optical module assembly are both connected with a second external device through the second electrical interface; the fifth optical module assembly and the sixth optical module assembly are both connected with the second optical interface;

[0019] In one of the embodiments, the fourth optical module assembly and the sixth optical module assembly comprise a digital signal processor; the third optical module assembly is connected with the sixth optical module assembly through the first optical interface, the transmission optical fiber and the second optical interface, and the fourth optical module assembly is connected with the fifth optical module assembly through the first optical interface, the transmission optical fiber and the second optical interface.

[0020] The optical signal transmission device and the active optical cable, the optical signal transmission device comprises: a first optical module assembly, a second optical module assembly, an electrical interface and an optical interface; the first optical module assembly and the second optical module assembly are connected with external equipment through the electrical interface; the first optical module assembly and the second optical module assembly are connected with the optical interface; wherein, the first optical module assembly comprises a first sending assembly and a first receiving assembly, the input end of the first sending assembly and the output end of the first receiving assembly are connected with external equipment through the electrical interface; the output end of the first sending assembly and the input end of the first receiving assembly are connected with the optical interface; the second optical module assembly comprises a second sending assembly, a second receiving assembly and a digital signal processor, the input end of the second sending assembly and the output end of the second receiving assembly are connected with one end of the digital signal processor, the other end of the digital signal processor is connected with external equipment through the electrical interface; the output end of the second sending assembly and the input end of the second receiving assembly are connected with the optical interface. Since the first optical module assembly does not include a digital signal processor, and the second optical module assembly includes a digital signal processor, the optical signal transmission device of the half DSP and half non-DSP hybrid architecture can be formed, thereby the use scenario and time of the digital signal processor in the optical signal transmission device can be reduced as much as possible under the premise of ensuring the effectiveness of optical signal transmission, and then the use power consumption of the optical transceiver module can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the present application or the related art. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other related drawings can also be obtained without creative labor.

[0022] Figure 1 It is a structural schematic diagram of the optical signal transmission device in an embodiment;

[0023] Figure 2A It is a first structural schematic diagram of the optical signal transmission device comprising a circuit board in an embodiment;

[0024] Figure 2B It is a second structural schematic diagram of the optical signal transmission device comprising a circuit board in an embodiment;

[0025] Figure 2C It is Figure 2B It is an enlarged schematic diagram of the area A in the figure;

[0026] Figure 3 It is a structural schematic diagram of the optical signal transmission device of 8 channels in an embodiment;

[0027] Figure 4Figure 1 is a schematic diagram of the structure of a 16-channel optical signal transmission device in one embodiment;

[0028] Figure 5A Figure 2 is a schematic diagram of the structure of an 8-channel optical signal transmission device DR8 in one embodiment;

[0029] Figure 5B Figure 3 is a top view of the overall structure of an 8-channel optical signal transmission device DR8 in one embodiment;

[0030] Figure 5C Figure 4 is a top view of the fiber array assembly in an 8-channel optical signal transmission device DR8 in one embodiment;

[0031] Figure 6A Figure 5 is a schematic diagram of the structure of a 16-channel optical signal transmission device DR16 in one embodiment;

[0032] Figure 6B Figure 6 is a top view of a 16-channel optical signal transmission device DR16 in one embodiment;

[0033] Figure 6C Figure 7 is a schematic diagram of the fiber array assembly in a 16-channel optical signal transmission device DR16 in one embodiment;

[0034] Figure 7A Figure 8 is a schematic diagram of a packaged optical signal transmission device in one embodiment;

[0035] Figure 7B Figure 9 is a schematic diagram of an unpackaged optical signal transmission device in one embodiment;

[0036] Figure 8 Figure 10 is a schematic diagram of the structure of an active optical cable in one embodiment;

[0037] Figure 9 Figure 11 is a schematic diagram of a signal link in one embodiment;

[0038] Figure 10 Figure 12 is a schematic diagram of a 16-channel active optical cable in one embodiment;

[0039] Figure 11 Figure 13 is a schematic diagram of a 32-channel active optical cable in one embodiment.

[0040] The reference signs are as follows:

[0041] First optical module assembly 1; second optical module assembly 2; electrical interface 3; optical interface 4; first transmitting assembly 11; first receiving assembly 12; second transmitting assembly 21; second receiving assembly 22; digital signal processor 23; circuit board 5;

[0042] 8 channels corresponding driver 111a; 8 channels corresponding first silicon optical chip 112a; 8 channels corresponding first fiber array assembly 113a; 8 channels corresponding first lens 114a; 8 channels corresponding first laser 115a; 8 channels corresponding first photodiode 121a; 8 channels corresponding third fiber array assembly 122a; 8 channels corresponding first transimpedance amplifier 123a; 8 channels corresponding second silicon optical chip 211a; 8 channels corresponding second fiber array assembly 212a; 8 channels corresponding second lens 213a; 8 channels corresponding second laser 214a; 8 channels corresponding second photodiode 221a; 8 channels corresponding fourth fiber array assembly 222a; 8 channels corresponding second transimpedance amplifier 223a; 8 channels corresponding first tungsten copper base 6a; 8 channels corresponding second tungsten copper base 7a;

[0043] 16 channels corresponding driver 111b; 16 channels corresponding first silicon optical chip 112b; 16 channels corresponding first fiber array assembly 113b; 16 channels corresponding first lens 114b; 16 channels corresponding first laser 115b; polarization maintaining fiber 116; 16 channels corresponding first photodiode 121b; 16 channels corresponding third fiber array assembly 122b; 16 channels corresponding first transimpedance amplifier 123b; 16 channels corresponding second silicon optical chip 211b; 16 channels corresponding second fiber array assembly 212b; 16 channels corresponding second lens 213b; 16 channels corresponding second laser 214b; 16 channels corresponding second photodiode 221b; 16 channels corresponding fourth fiber array assembly 222b; 16 channels corresponding second transimpedance amplifier 223b; 16 channels corresponding first tungsten copper base 6b; 16 channels corresponding second tungsten copper base 7b; ceramic 8; heat sink 9;

[0044] First optical signal transmission device A; second optical signal transmission device B; transmission fiber C; third optical module assembly A1; fourth optical module assembly A2; first electrical interface A3; first optical interface A4; fifth optical module assembly B1; sixth optical module assembly B2; second electrical interface B3; second optical interface B4; third transmitting component A11; third receiving component A12; fourth transmitting component A21; fourth receiving component A22; first digital signal processor A23; fifth transmitting component B11; fifth receiving component B12; sixth transmitting component B21; sixth receiving component B22; second digital signal processor B23. DETAILED DESCRIPTION

[0045] In order to make the purposes, technical solutions and advantages of the present application more clear, the present application is further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application; the use of the terms "including," "comprising," "having" and "with" in the specification and claims herein are used to mean "including but not limited to"; the use of the terms "a" and "an" herein do not denote a limitation of quantity and are used to convey a particular embodiment example of the previously recited item, and the use of the term "or" herein is meant to encompass both a exclusive or and an inclusive or unless otherwise noted.

[0047] In the description of the present application, it is to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of facilitating the description of the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0048] In addition, the terms "first", "second", "third", etc. are only used for the purpose of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0049] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0050] In the present disclosure, unless specifically noted otherwise, a first feature "on" or "under" a second feature can be directly in contact with the second feature, or indirectly in contact with the second feature through an intervening medium. Also, a first feature "over", "above" and "on top of" a second feature can mean the first feature is directly above or obliquely above the second feature, or simply means the first feature is horizontally higher than the second feature. A first feature "under", "below" and "underneath" a second feature can mean the first feature is directly below or obliquely below the second feature, or simply means the first feature is horizontally lower than the second feature.

[0051] It is to be understood that when an element as a precursor to "be fixed on" or "be disposed on" another element, it can be directly on the other element or an intervening element can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or an intervening element can also be present. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and do not indicate the only orientation of the embodiments.

[0052] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment. The appearances of the phrase "in an embodiment" in various places in the specification are not necessarily referring to the same embodiment nor are separate or alternative embodiments mutually exclusive of other embodiments. It is expressly understood that the embodiments described herein are merely example embodiments and that a substantial number of other embodiments can be made and utilized.

[0053] With the development of communication technology, optical communication technology is widely used in various fields due to its large communication capacity and low loss. When information is transmitted through optical fiber, various types of optical signal transmission devices are generated, such as optical transceiver modules (referred to as optical modules). The optical transceiver module includes a transmitting end and a receiving end. The transmitting end is used to convert electrical signals into optical signals, and the receiving end is used to convert optical signals into electrical signals.

[0054] However, the rise of the rate in the optical transceiver module brings the problem of high power consumption. The power consumption of the conventional high-speed optical module, such as an 800G DR8 optical module, a 1.6T DR8 optical module, a 1.6T DR16 optical module, etc., is very high when running on a switch with a throughput of 51.6Tb / s, 115.2Tb / s and above, which is a great challenge to the use of cluster optical modules and also has a not small challenge to the reliability life of the pluggable optical module. In the high-speed optical module, the two main high-temperature points are the DSP (Digital Signal Processor) and the laser, especially the DSP. In the working of the optical module, the over-temperature working environment of the components is an important factor that is easy to cause the failure of the optical module. Therefore, in order to achieve good heat dissipation effect of the DSP in high-intensity data processing and transmission, it is necessary to further reduce the power consumption of the high-density optical module. Therefore, the power consumption and heat dissipation of the high-density optical module are also a great challenge. Therefore, the current high-speed optical transceiver module has the problem of high power consumption.

[0055] In one embodiment, as shown in Figure 1 , Figure 1 is a structural schematic diagram of an optical signal transmission device in an embodiment, an optical signal transmission device is provided, which comprises: a first optical module assembly 1, a second optical module assembly 2, an electrical interface 3 and an optical interface 4; the first optical module assembly 1 and the second optical module assembly 2 are connected with an external device through the electrical interface 3; the first optical module assembly 1 and the second optical module assembly 2 are connected with the optical interface 4;

[0056] Among them, the first optical module assembly 1 comprises a first sending assembly 11 and a first receiving assembly 12, the input end of the first sending assembly 11 and the output end of the first receiving assembly 12 are connected with the external device through the electrical interface 3; the output end of the first sending assembly 11 and the input end of the first receiving assembly 12 are connected with the optical interface 4;

[0057] The second optical module assembly 2 comprises a second sending assembly 21, a second receiving assembly 22 and a digital signal processor 23, the input end of the second sending assembly 21 and the output end of the second receiving assembly 22 are connected with one end of the digital signal processor 23, the other end of the digital signal processor 23 is connected with the external device through the electrical interface 3; the output end of the second sending assembly 21 and the input end of the second receiving assembly 22 are connected with the optical interface 4.

[0058] The first optical module assembly 1 is used for optical signal transmission and photoelectric conversion without DSP, and the second optical module assembly 2 is used for optical signal transmission and photoelectric conversion with DSP. The first optical module assembly 1 includes a first sending assembly 11 and a first receiving assembly 12. The first sending assembly 11 can include, but is not limited to, a silicon optical chip, a laser, etc. The first receiving assembly 12 can include, but is not limited to, a photodiode and a transimpedance amplifier, etc. It should be noted that the first optical module assembly 1 does not include a digital signal processor DSP. The second optical module assembly 2 includes a second sending assembly 21, a second receiving assembly 22 and a digital signal processor 23. The second sending assembly 21 can include, but is not limited to, a silicon optical chip, a laser, etc. The second receiving assembly 22 can include, but is not limited to, a photodiode and a transimpedance amplifier, etc. It should be noted that the second optical module assembly 2 includes a digital signal processor DSP. Based on this, a hybrid architecture optical signal transmission device with half DSP and half without DSP can be formed.

[0059] It should be noted that the feature of the hybrid architecture of the embodiment of the present application is that a complete DSP supporting bidirectional signal processing is used inside the optical module. The DSP only participates in the signal processing of half of the transmission link and half of the receiving link inside the optical module. The other half of the transmission and receiving link adopts a linear LPO (Linear-drive Pluggable Optics) mode. Therefore, for optical module transmission, only one end of the transmission or receiving link has DSP processing signal. For example, the second sending assembly 21 with DSP processing at the transmitting end can be referred to as LRO (Linear Receive Optics), and the second receiving assembly 22 with DSP processing at the receiving end can be referred to as LTO (Linear Transmit Optics). The advantage of the hybrid architecture optical signal transmission device is that, compared with the traditional optical module with DSP, half of the power consumption, time delay and cost are saved; compared with the pure LPO optical module, the link performance and stability are improved, and the interoperation between devices is also improved.

[0060] The electrical interface 3 can include, but is not limited to, a gold finger and other components. The electrical interface 3 is electrically connected with the digital signal processor 23. The electrical interface 3 is used to provide a driving signal to drive the silicon optical chip to work. Optionally, the driving signal received by the electrical interface 3 can be used to directly drive the silicon optical chip to work. Alternatively, the electrical interface 3 and the digital signal processor can be used together to drive the silicon optical chip to work.

[0061] The external device can include, but is not limited to, any device such as a switch. The optical interface 4 is a pluggable optical port, through which other devices (such as any of the other optical signal transmission devices, optical fibers, etc.) can be plugged in or disconnected from the optical signal transmission device. Optionally, the optical port can be an MPO (Multi-fiber Push On, a high-density optical fiber connector), or the optical port can be other parallel optical ports, or the optical port can be an interface designed in the form of a pigtail (pigtail). Of course, the present application does not limit the optical port.

[0062] In addition, the optical module in the present application can not only be a 1.6T OSFP-XD DR8 (Octal Small Form-factor Pluggable - Extra Dense Dual-Rate 8, super dense, octal small form-factor pluggable, dual-rate eight-channel) optical module, or the optical module in the present application can also be a 1.6T OSFP-XD DR16 optical module, or the optical module in the present application can also be a 1.6T OSFP DR8 (Octal Small Form-factor Pluggable Dual-Rate 8, octal small form-factor pluggable, dual-rate eight-channel) optical module, or the optical module in the present application can also be an 800G OSFP DR8 optical module, or the optical module in the present application can also be an 800G QDD DR8 (Quad Small Form Factor Pluggable-Double Density Dual-Rate 8, high-density, octal small form-factor pluggable, and supports dual-wavelength eight-channel transmission) optical module.

[0063] In the present application, the electrical interface 3 can provide a driving signal for the first transmitting component 11, and the first transmitting component 11 can output at least one optical signal to the optical interface 4 according to the driving signal. In addition, when the optical interface 4 receives at least one optical signal, the optical interface 4 can transmit the at least one optical signal to the first receiving component 12, the first receiving component 12 can perform photoelectric conversion on the at least one optical signal, generate an electrical signal corresponding to the at least one optical signal, and transmit the electrical signal corresponding to the at least one optical signal to the electrical interface 3. In turn, the electrical interface 3 can transmit the electrical signal corresponding to the at least one optical signal to the external device.

[0064] The electrical interface 3 can provide a drive signal for the second transmitting component 21 and transmit the drive signal to the digital signal processor 23, so that the digital signal processor 23 can perform at least one of signal amplification, equalization, etc. on the drive signal and transmit the processed drive signal to the second transmitting component 21. Subsequently, the second transmitting component 21 can output at least one optical signal to the optical interface 4 according to the processed drive signal. In addition, in the case that the optical interface 4 receives at least one optical signal, the optical interface 4 can transmit the at least one optical signal to the second receiving component 22, the second receiving component 22 can perform photoelectric conversion on the at least one optical signal, generate an electrical signal corresponding to the at least one optical signal, and transmit the electrical signal corresponding to the at least one optical signal to the digital signal processor 23. Subsequently, the digital signal processor 23 can perform at least one of signal amplification, equalization, etc. on the electrical signal and transmit the processed electrical signal to the electrical interface 3. In turn, the electrical interface 3 can transmit the processed electrical signal to an external device.

[0065] In the above optical signal transmission device, the optical signal transmission device comprises: a first optical module component, a second optical module component, an electrical interface, and an optical interface; the first optical module component and the second optical module component are both connected with an external device through the electrical interface; the first optical module component and the second optical module component are both connected with the optical interface; wherein the first optical module component comprises a first transmitting component and a first receiving component, the input end of the first transmitting component and the output end of the first receiving component are both connected with the external device through the electrical interface; the output end of the first transmitting component and the input end of the first receiving component are both connected with the optical interface; the second optical module component comprises a second transmitting component, a second receiving component, and a digital signal processor, the input end of the second transmitting component and the output end of the second receiving component are both connected with one end of the digital signal processor, the other end of the digital signal processor is connected with the external device through the electrical interface; the output end of the second transmitting component and the input end of the second receiving component are both connected with the optical interface. Since the first optical module component does not comprise a digital signal processor and the second optical module component comprises a digital signal processor, the embodiment of the present application can form an optical signal transmission device with a half-DSP and a half-non-DSP hybrid architecture, so as to reduce the use scenarios and duration of the digital signal processor in the optical signal transmission device as much as possible under the premise of ensuring the effectiveness of optical signal transmission, and further reduce the use power consumption of the optical transceiver module and optimize the work of the cluster optical module.

[0066] In one embodiment, as shown in Figure 2A 、 Figure 2B 、 Figure 2C , Figure 2A is a first structural schematic diagram of an optical signal transmission device comprising a circuit board in one embodiment, Figure 2BFIG. 2 is a second structural schematic diagram of an optical signal transmission device including a circuit board in an embodiment, Figure 2C For Figure 2B FIG. 3 is an enlarged schematic diagram of region A in FIG. 2. The optical signal transmission device further includes a printed circuit board 5 (PCB), the first optical module assembly 1 and the second optical module assembly 2 are arranged in series along a preset direction on one side surface of the printed circuit board 5, the electrical interface 3 is arranged at one end of the printed circuit board 5, the optical interface 4 is arranged at a distance from the other end of the printed circuit board 5 in the preset direction, and the first optical module assembly 1 is arranged on the printed circuit board 5 close to the electrical interface 3, and the second optical module assembly 2 is arranged on the printed circuit board 5 close to the optical interface 4.

[0067] In the embodiment, the driver (Driver), the transimpedance amplifier (TIA), the laser, the photo diode (PD) and other components in the first optical module assembly 1 and the driver (Driver), the transimpedance amplifier (TIA), the laser, the photo diode (PD) and other components in the second optical module assembly 2 are attached to the printed circuit board 5 through silver paste, and then the light is coupled into the corresponding fiber array assembly (FA) through the lens (LENS). It should be noted that the TX / RX (Transmit / Receive) of the first optical module assembly 1 is arranged at the electrical interface 3 end, and the TX / RX of the second optical module assembly 2 is arranged close to the optical interface 4 end.

[0068] The principle of the above design is: considering the SI (Signal Integrity) in the optical transceiver module, for example, for an 8-channel optical transceiver module:

[0069] For the first channel to the fourth channel (CH1-CH4), the TX1-TX4 high-speed links of the second sending assembly 21 are longer, so that, first, the DSP is as close as possible to the gold finger to reduce the link loss under the premise of meeting the space of optical devices; second, the Driver is as close as possible to the DSP to reduce the loss. The RX1-RX4 high-speed links of the first receiving assembly 12 are shorter, so that the DSP signal compensation processing is lacking, and the TIA needs to be as close as possible to the gold finger to reduce the loss as much as possible.

[0070] For the 5th channel to the 8th channel (i.e. CH5-CH8), the TX5-TX8 high-speed links of the first sending assembly 11 are short, thus lacking DSP signal compensation processing, and the Driver needs to be as close as possible to the gold finger to reduce the loss as much as possible. The RX5-RX8 high-speed links of the second receiving assembly 22 are long, thus, first, the DSP needs to be as close as possible to the gold finger to reduce the link loss under the premise of meeting the space of optical devices; second, the TIA needs to be as close as possible to the DSP to reduce the loss.

[0071] In the embodiment, by setting the first optical module assembly on the circuit board close to the electrical interface and setting the second optical module assembly on the circuit board close to the optical interface, the signal integrity and the use power consumption of the optical signal transmission device can be balanced as much as possible.

[0072] In one embodiment, the first sending assembly is any one of a 4-channel sending assembly, an 8-channel sending assembly, and a 16-channel sending assembly, and the first receiving assembly is any one of a 4-channel receiving assembly, an 8-channel receiving assembly, and a 16-channel receiving assembly; the number of channels of the first receiving assembly and the first sending assembly is consistent.

[0073] The second sending assembly is any one of a 4-channel sending assembly, an 8-channel sending assembly, and a 16-channel sending assembly, and the second receiving assembly is any one of a 4-channel receiving assembly, an 8-channel receiving assembly, and a 16-channel receiving assembly; the number of channels of the second receiving assembly and the second sending assembly is consistent.

[0074] For example, as shown in FIG. 1, which is a structural schematic diagram of an 8-channel optical signal transmission device in one embodiment; as shown in FIG. 2, which is a structural schematic diagram of a 16-channel optical signal transmission device in one embodiment. Figure 3 Figure 3 For example, as shown in FIG. 1, which is a structural schematic diagram of an 8-channel optical signal transmission device in one embodiment; as shown in FIG. 2, which is a structural schematic diagram of a 16-channel optical signal transmission device in one embodiment. Figure 4 Figure 4 For example, as shown in FIG. 1, which is a structural schematic diagram of an 8-channel optical signal transmission device in one embodiment; as shown in FIG. 2, which is a structural schematic diagram of a 16-channel optical signal transmission device in one embodiment.

[0075] In one embodiment, the first sending assembly includes a driver, a first silicon optical chip, a first lens, a first laser, and a first optical fiber array assembly, the driver, one end of the first lens, and the first optical fiber array assembly are connected with the first silicon optical chip, and the other end of the first lens is connected with the first laser.

[0076] ​​Optionally, one end of the first lens can be directly connected with the first silicon optical chip, or one end of the first lens can be indirectly connected with the first silicon optical chip through an optical fiber. Of course, the embodiments of the present application do not limit this. It should be noted that in the silicon optical technology, when the number of channels is small and the PCB layout space is allowed, the light source (i.e., the laser) at the LPO end can be placed in front, that is, one end of the first lens can be directly connected with the first silicon optical chip, so as to save the polarization maintaining optical fiber and other optical elements.

[0077] In one of the embodiments, the second sending assembly includes a second silicon optical chip, a second lens, a second laser, and a second optical fiber array assembly. One end of the second lens and the second optical fiber array assembly are connected with the second silicon optical chip, and the other end of the second lens is connected with the second laser.

[0078] In one of the embodiments, the first receiving assembly includes a first photodiode, a third optical fiber array assembly, and a first transimpedance amplifier. One end of the first photodiode is connected with the third optical fiber array assembly, and the other end of the first photodiode is connected with the first transimpedance amplifier.

[0079] In one of the embodiments, the second receiving assembly includes a second photodiode, a fourth optical fiber array assembly, and a second transimpedance amplifier. One end of the second photodiode is connected with the fourth optical fiber array assembly, and the other end of the second photodiode is connected with the second transimpedance amplifier.

[0080] The first silicon optical chip is connected with the optical interface through the first optical fiber array assembly, and the second silicon optical chip is connected with the optical interface through the second optical fiber array assembly. The PIC (Photonics Integrated Circuit) is arranged in the silicon optical chip, and the PIC and other materials can be processed by the FC chip (Flip Chip). The silicon optical chip includes a plurality of modulators, and is used for amplitude modulation of at least one optical signal to obtain an amplitude-modulated optical signal. The amplitude-modulated optical signal is transmitted to the optical interface 4 through the corresponding optical fiber array assembly (TX FA, Transmit Fiber Array, optical fiber array assembly at the sending end). The first laser and the second laser can be VCSEL (‌Vertical-Cavity Surface-Emitting Laser, vertical-cavity surface-emitting laser)‌.

[0081] One end of the first photodiode is connected to the optical interface via a third fiber array assembly, and one end of the second photodiode is connected to the optical interface via a fourth fiber array assembly. The photodiode (PD) is used to receive an optical signal through a corresponding fiber array assembly (RX FA, Receive Fiber Array, the fiber array assembly at the receiving end), perform photoelectric conversion on the optical signal to obtain an electrical signal after photoelectric conversion, and transmit the electrical signal after photoelectric conversion to a transimpedance amplifier (TIA). A linear transimpedance amplifier (TIA) is used to amplify the electrical signal after photoelectric conversion to generate an electrical signal corresponding to the at least one optical signal.

[0082] In one embodiment, one end of the first lens may be directly connected to the first silicon photonic chip.

[0083] In an exemplary embodiment, Figure 5A As shown, Figure 5A FIG. 8 is a schematic structural diagram of an 8-channel optical signal transmission device DR8 in one embodiment; Figure 5B As shown, Figure 5B FIG. 8 is a top view of an overall 8-channel optical signal transmission device DR8 in one embodiment; FIG. Figure 5C As shown, Figure 5C This is a top view of the fiber array assembly in an 8-channel optical signal transmission device DR8 in one embodiment. The optical signal transmission device DR8 includes a first optical module assembly 1, a second optical module assembly 2, an electrical interface 3, an optical interface 4, and a circuit board 5. The first optical module assembly 1 includes a first transmitting assembly 11 and a first receiving assembly 12. The second optical module assembly 2 includes a second transmitting assembly 21, a second receiving assembly 22, and a digital signal processor 23. The first transmitting assembly 11 includes a driver 111a corresponding to the 8 channels, a first silicon photonic chip 112a corresponding to the 8 channels, a first fiber array assembly 113a corresponding to the 8 channels, a first lens 114a corresponding to the 8 channels, and a first laser 111 corresponding to the 8 channels. 5a, the first receiving component 12 includes a first photodiode 121a corresponding to the 8 channels, a third optical fiber array component 122a corresponding to the 8 channels, and a first transimpedance amplifier 123a corresponding to the 8 channels. The second sending component 21 includes a second silicon photonic chip 211a corresponding to the 8 channels, a second optical fiber array component 212a corresponding to the 8 channels, a second lens 213a corresponding to the 8 channels, and a second laser 214a corresponding to the 8 channels. The second receiving component 22 includes a second photodiode 221a corresponding to the 8 channels, a fourth optical fiber array component 222a corresponding to the 8 channels, and a second transimpedance amplifier 223a corresponding to the 8 channels.

[0084] Combine Figure 5BAs shown, the optical signal transmission device DR8 also includes 8-channel corresponding first tungsten copper base 6a and 8-channel corresponding second tungsten copper base 7a and other materials, wherein the first tungsten copper base 6a and the second tungsten copper base 7a are bonded on the PCB slot by epoxy, the driver (Driver) 111a, the 8-channel corresponding first silicon optical chip 112a, the first photodiode 121a and the first transimpedance amplifier 123a are fixed on the first tungsten copper base 6a and the circuit board 5 by silver paste patch, and the 8-channel corresponding second silicon optical chip 211a, the second photodiode 221a and the second transimpedance amplifier 223a are fixed on the second tungsten copper base 7a and the circuit board 5 by silver paste patch.

[0085] For signal wiring, an 8*100G PAM4 (4-Level Pulse Amplitude Modulation) electrical signal is input through the electrical interface 3, wherein the 4*100G PAM4 electrical signal is directly transmitted to the driver (Driver) 111a of the LPO to drive the first silicon optical chip 112a through the 8-channel corresponding driver 111a, and the signal is processed through the CTLE (Continuous-Time Linear Equalizer) of the driver 111a, in addition, the optical signal is generated through the first laser 115a, and the optical signal is transmitted into the first silicon optical chip 112a through the first lens 114a. Thus, the first silicon optical chip 112a can modulate the optical signal by silicon light, and the modulated optical signal is coupled into the first fiber array assembly 113a, and then the modulated optical signal is transmitted to the optical interface 4 through the first fiber array assembly 113a. In the case that the optical signal is input to the optical interface 4 through the optical fiber cable, the optical signal can be coupled into the second photodiode 221a through the fourth fiber array assembly 222a, that is, the optical signal can be optoelectronically converted through the second photodiode 221a to obtain the converted electrical signal, and then the converted electrical signal is amplified through the second transimpedance amplifier 223a, and the amplified electrical signal is signal-processed through the digital signal processor 23. After that, the signal-processed electrical signal can be output to the external device through the electrical interface 3.

[0086] In the embodiment, the 4*100G PAM4 electrical signals are transmitted to the digital signal processor 23, and the 4*100G PAM4 electrical signals are processed by the digital signal processor 23, and the processed 4*100G PAM4 electrical signals are input into the second silicon optical chip 211a. The second silicon optical chip 211a is internally provided with a driver. The second laser 214a generates an optical signal, and the second lens 213a transmits the optical signal to the second silicon optical chip 211a. Thus, the second silicon optical chip 211a can modulate the optical signal according to the processed 4*100G PAM4 electrical signals, and couple the modulated optical signal into the second optical fiber array assembly 212a. The modulated optical signal is transmitted to the optical interface 4 through the second optical fiber array assembly 212a. In the case that the optical signal is input into the optical interface 4 through the optical fiber cable, the optical signal can be coupled into the first photodiode 121a through the third optical fiber array assembly 122a. The optical signal is photoelectrically converted by the first photodiode 121a to obtain converted electrical signals. The converted electrical signals are amplified and EQ processed by the first transimpedance amplifier 123a. Then, the amplified and EQ processed electrical signals are output to the external device through the electrical interface 3.

[0087] In one of the embodiments, the first transmitting assembly further comprises a polarization maintaining optical fiber, one end of the first lens is connected to the first silicon optical chip through the polarization maintaining optical fiber, and the first lens and the first laser are arranged on the circuit board close to the optical interface.

[0088] In one of the embodiments, the first transmitting assembly further comprises a polarization maintaining optical fiber, one end of the first lens is connected to the first silicon optical chip through the polarization maintaining optical fiber, and the first lens and the first laser are arranged on the circuit board close to the optical interface. Figure 6A Figure 6A FIG. 1 shows a structure schematic diagram of a 16-channel optical signal transmission device DR16 in one of the embodiments; and Figure 6B Figure 6B FIG. 2 shows a top view of the 16-channel optical signal transmission device DR16 in one of the embodiments; and Figure 6C Figure 6C ​​​Figure 1 is a schematic diagram of an optical fiber array assembly in a 16-channel optical signal transmission device DR16 according to an embodiment. The optical signal transmission device DR16 includes a first optical module assembly 1 and a second optical module assembly 2, an electrical interface 3, an optical interface 4, and a circuit board 5. The first optical module assembly 1 includes a first transmitting assembly 11 and a first receiving assembly 12. The second optical module assembly 2 includes a second transmitting assembly 21, a second receiving assembly 22, and a digital signal processor 23. The first transmitting assembly 11 includes 16-channel corresponding drivers 111b, 16-channel corresponding first silicon optical chips 112b, 16-channel corresponding first optical fiber array assemblies 113b, 16-channel corresponding first lenses 114b, 16-channel corresponding first lasers 115b, and a polarization maintaining optical fiber 116. The first receiving assembly 12 includes 16-channel corresponding first photodiodes 121b, 16-channel corresponding third optical fiber array assemblies 122b, and 16-channel corresponding first transimpedance amplifiers 123b. The second transmitting assembly 21 includes 16-channel corresponding second silicon optical chips 211b, 16-channel corresponding second optical fiber array assemblies 212b, 16-channel corresponding second lenses 213b, and 16-channel corresponding second lasers 214b. The second receiving assembly 22 includes 16-channel corresponding second photodiodes 221b, 16-channel corresponding fourth optical fiber array assemblies 222b, and 16-channel corresponding second transimpedance amplifiers 223b.

[0089] In combination Figure 6A and Figure 6BAs shown, the optical signal transmission device DR16 further includes a first tungsten copper base 6b corresponding to 16 channels, a second tungsten copper base 7b corresponding to 16 channels, a ceramic 8, a heat sink 9 and the like. The first tungsten copper base 6b and the second tungsten copper base 7b are bonded on the PCB slot by high-temperature glue, and then the ceramic 8 is bonded on the PCB half slot by the front surface. The digital signal processor 23 is flip-chip mounted on the circuit board 5. The 16-channel corresponding driver 111b, the 16-channel corresponding first silicon optical chip 112b, the first laser 115b, the first photodiode 121b and the first transimpedance amplifier 123b are fixed on the first tungsten copper base 6b, the ceramic 8 and the circuit board 5 and the like by silver glue patch. The 16-channel corresponding second silicon optical chip 211b, the second laser 214b, the second photodiode 221b and the second transimpedance amplifier 223b are fixed on the second tungsten copper base 7b, the ceramic 8 and the circuit board 5 and the like by silver glue patch. In addition, the laser can be co-crystallized into COC (Chip on Carrier, directly fixed on the carrier by packaging process), and then bonded on the TEC (‌Thermo Electric Cooler, Thermo Electric Cooler) by silver glue or directly bonded on the heat sink. It should be noted that the reason why the DR16 cannot move or place the laser in front is that if the laser is placed in front, the PCB SI wiring layout cannot meet the requirements.

[0090] For signal wiring, 16*100G PAM4‌(‌4-Level Pulse Amplitude Modulation, four-level pulse amplitude modulation) electrical signals are input through the electrical interface 3, wherein the electrical signals of 8*100G PAM4 are directly transmitted to the driver 111b of the LPO, so as to drive the first silicon optical chip 112b through the 16-channel corresponding driver 111b. In addition, since the channels of the LPO link are arranged close to the gold finger in the embodiment of the present application, the light source of the LPO short silicon light is in the COC at the optical port end, that is, the optical signal can be generated through the first laser 115b, and the optical signal is coupled to at least one polarization maintaining optical fiber 116 in the polarization maintaining optical fiber array through the first lens 114b. The polarization maintaining optical fiber 116 is connected with the first optical fiber array assembly 113b, so that the optical signal can be transmitted to the first silicon optical chip 112b through the polarization maintaining optical fiber 116 and the first optical fiber array assembly 113b. Further, the first silicon optical chip 112b can modulate the optical signal into silicon light, and couple the modulated optical signal into the first optical fiber array assembly 113b, and then transmit the modulated optical signal to the optical interface 4 through the ordinary optical fiber in the first optical fiber array assembly 113b. The optical fibers in each of the above optical fiber array assemblies are ordinary optical fibers.

[0091] When the optical signal is input to the optical interface 4 through the optical fiber cable, the optical signal can be coupled to the second photodiode 221b through the fourth optical fiber array component 222b, and the optical signal can be photoelectrically converted by the second photodiode 221b to obtain a converted electrical signal, and then the converted electrical signal is amplified by the second transimpedance amplifier 223b, and the amplified electrical signal is signal-processed by the digital signal processor 23. After that, the signal-processed electrical signal can be output to the external device through the electrical interface 3.

[0092] The other 8*100G PAM4 electrical signals are transmitted to the digital signal processor 23, which processes the 8*100G PAM4 electrical signals and inputs the processed 8*100G PAM4 electrical signals into the second silicon photonic chip 211b, wherein the second silicon photonic chip 211b has a built-in driver. Furthermore, an optical signal is generated by the second laser 214b, and the optical signal is transmitted to the second silicon photonic chip 211b through the second lens 213b. Thus, the second silicon photonic chip 211b can perform silicon photonic modulation on the optical signal based on the processed 8*100G PAM4 electrical signals, couple the modulated optical signal to the second optical fiber array assembly 212b, and then transmit the modulated optical signal to the optical interface 4 through the second optical fiber array assembly 212b. When an optical signal is input to the optical interface 4 through an optical fiber cable, the optical signal can be coupled to the first photodiode 121b through the third optical fiber array component 122b, and the optical signal can be photoelectrically converted by the first photodiode 121b to obtain a converted electrical signal. The converted electrical signal is then amplified and EQ (equalization) processed by the first transimpedance amplifier 123b. Thereafter, the amplified and EQ-processed electrical signal can be output to an external device through the electrical interface 3.

[0093] In an exemplary embodiment, Figure 7A As shown, Figure 7A FIG. 1 is a schematic diagram of a packaged optical signal transmission device in one embodiment; FIG. Figure 7B As shown, Figure 7B FIG2 is a schematic diagram of an optical signal transmission device before packaging in an embodiment. The present embodiment does not limit the packaging method of the optical signal transmission device. The components of the optical signal transmission device have been introduced in the above embodiments and will not be described again here.

[0094] In one embodiment, Figure 8 As shown, Figure 8As shown in a structural schematic diagram of an active optical cable in one embodiment, an active optical cable is provided, which includes a first optical signal transmission device A, a second optical signal transmission device B and a transmission optical fiber C, and the first optical signal transmission device A and the second optical signal transmission device B are connected through the transmission optical fiber C.

[0095] Among them, the first optical signal transmission device A and the second optical signal transmission device B can be the optical signal transmission device introduced in any one of the above embodiments, and here the specific components in the first optical signal transmission device A and the second optical signal transmission device B will not be described.

[0096] In the above active optical cable, the active optical cable includes a first optical signal transmission device, a second optical signal transmission device and a transmission optical fiber, and the first optical signal transmission device and the second optical signal transmission device are connected through the transmission optical fiber. Since the first optical signal transmission device and the second optical signal transmission device can both form a half DSP and half non-DSP hybrid architecture optical signal transmission device, the active optical cable can minimize the use of digital signal processors in the first optical signal transmission device and the second optical signal transmission device and the time length under the premise of ensuring the effectiveness of optical signal transmission, thereby reducing the power consumption of the optical transceiver module and optimizing the work of the cluster optical module.

[0097] In one embodiment, in combination with Figure 8 As shown, the first optical signal transmission device A includes a third optical module component A1, a fourth optical module component A2, a first electrical interface A3 and a first optical interface A4; the third optical module component A1 and the fourth optical module component A2 are both connected with a first external device through the first electrical interface A3; the third optical module component A1 and the fourth optical module component A2 are both connected with the first optical interface A4;

[0098] The second optical signal transmission device B includes a fifth optical module component B1, a sixth optical module component B2, a second electrical interface B3 and a second optical interface B4; the fifth optical module component B1 and the sixth optical module component B2 are both connected with a second external device through the second electrical interface B3; the fifth optical module component B1 and the sixth optical module component B2 are both connected with the second optical interface B4;

[0099] Among them, the fourth optical module component A2 and the sixth optical module component B2 include a digital signal processor; the third optical module component A1 is connected with the sixth optical module component B2 through the first optical interface A4, the transmission optical fiber C and the second optical interface B4, and the fourth optical module component A2 is connected with the fifth optical module component B1 through the first optical interface A4, the transmission optical fiber C and the second optical interface B4.

[0100] In the embodiment of the application, the third optical module assembly A1 includes a third sending assembly A11 and a third receiving assembly A12, the input end of the third sending assembly A11 and the output end of the third receiving assembly A12 are connected with an external device through a first electrical interface A3; the output end of the third sending assembly A11 and the input end of the third receiving assembly A12 are connected with a first optical interface A4. The fourth optical module assembly A2 includes a fourth sending assembly A21, a fourth receiving assembly A22 and a first digital signal processor A23, the input end of the fourth sending assembly A21 and the output end of the fourth receiving assembly A22 are connected with one end of the first digital signal processor A23, the other end of the first digital signal processor A23 is connected with an external device through the first electrical interface A3; the output end of the fourth sending assembly A21 and the input end of the fourth receiving assembly A22 are connected with the first optical interface A4.

[0101] The fifth optical module assembly B1 includes a fifth sending assembly B11 and a fifth receiving assembly B12, the input end of the fifth sending assembly B11 and the output end of the fifth receiving assembly B12 are connected with an external device through a second electrical interface B3; the output end of the fifth sending assembly B11 and the input end of the fifth receiving assembly B12 are connected with a second optical interface B4. The sixth optical module assembly B2 includes a sixth sending assembly B21, a sixth receiving assembly B22 and a second digital signal processor B23, the input end of the sixth sending assembly B21 and the output end of the sixth receiving assembly B22 are connected with one end of the second digital signal processor B23, the other end of the second digital signal processor B23 is connected with an external device through the second electrical interface B3; the output end of the sixth sending assembly B21 and the input end of the sixth receiving assembly B22 are connected with the second optical interface B4.

[0102] It should be noted that the fourth optical module assembly A2 and the sixth optical module assembly B2 both include a digital signal processor, and the third optical module assembly A1 and the fifth optical module assembly B1 both do not include a digital signal processor. The first optical interface A4 and the second optical interface B4 can be a pluggable optical port, and the transmission optical fiber C in the active optical cable AOC can be pluggably connected with the first optical interface A4 in the first optical signal transmission device A and the second optical interface B4 in the second optical signal transmission device B. In addition, when extended to a link of multiple optical modules, the embodiment of the application can also increase the link interoperability of the hybrid architecture and the LPO / LRO / LTO / DSP optical module to increase the diversification of the switching link.

[0103] In an exemplary embodiment, as shown in Figure 9 Figure 9 ​Fig. 1 is a schematic diagram of a signal link in one embodiment. In Fig. 1, 4*100G PAM4 electrical signals of 8*100G PAM4 electrical signals of an ASIC (‌Application-Specific Integrated Circuit‌) are partially processed by a DSP. The 4*100G PAM4 electrical signals can be amplified by a VGA (Variable Gain Amplifier) of the DSP, equalized by a DFE (Decision Feedback Equalizer) of the DSP, decoded and encoded by the DSP, and so on. After the signal optimization, the 4*100G PAM4 electrical signals are given to a fourth transmitting component A21 for driving and electro-optical conversion, to obtain 4*100G PAM4 optical signals. The 4*100G PAM4 optical signals are transmitted through a transmission fiber C to a fifth receiving component B12. The fifth receiving component B12 can perform photoelectric conversion and amplification on the received 4*100G PAM4 optical signals, and then directly give the amplified electrical signals to the ASIC for processing.

[0104] Another 4*100G PAM4 electrical signals of the 8*100G PAM4 electrical signals of the ASIC are directly given to a third transmitting component A11 for driving and electro-optical conversion, to obtain 4*100G PAM4 optical signals. The 4*100G PAM4 optical signals are transmitted through the transmission fiber C to a sixth receiving component B22. The sixth receiving component B22 can perform photoelectric conversion and amplification on the received 4*100G PAM4 optical signals, and then give the amplified electrical signals to the DSP for signal amplification, equalization, decoding, encoding, and so on. The DSP obtains 4*100G PAM4 electrical signals after the signal optimization, and then gives the 4*100G PAM4 electrical signals to the ASIC.

[0105] In one exemplary embodiment, as shown in Fig. 2, the 4*100G PAM4 electrical signals of the 8*100G PAM4 electrical signals of the ASIC are partially processed by the DSP. The 4*100G PAM4 electrical signals can be amplified by the VGA of the DSP, equalized by the DFE of the DSP, decoded and encoded by the DSP, and so on. After the signal optimization, the 4*100G PAM4 electrical signals are given to the fourth transmitting component A21 for driving and electro-optical conversion, to obtain 4*100G PAM4 optical signals. The 4*100G PAM4 optical signals are transmitted through the transmission fiber C to the fifth receiving component B12. The fifth receiving component B12 can perform photoelectric conversion and amplification on the received 4*100G PAM4 optical signals, and then directly give the amplified electrical signals to the ASIC for processing. Figure 10 Figure 10 ​Figure 6 shows a schematic diagram of a 16-channel active optical cable in an embodiment, wherein the 16-channel active optical cable comprises 4-channel A11, 4-channel A12, 4-channel A21, 4-channel A22, 4-channel B11, 4-channel B12, 4-channel B21, and 4-channel B22, and a half-channel link uses DSP function to reduce power consumption of the optical module, i.e., each link has half DSP, for example, if TX uses DSP processing, the corresponding RX uses LPO processing; if RX uses DSP processing, TX uses LPO processing. For example, A11 of channels 5 to 8 (i.e., TX5~TX8), A12 of channels 1 to 4 (i.e., RX1~RX4), B11 of channels 5 to 8 (i.e., TX5~TX8), and B12 of channels 1 to 4 (i.e., RX1~RX4) all use LPO processing, A21 of channels 1 to 4 (i.e., TX1~TX4), A22 of channels 5 to 8 (i.e., RX5~RX8), B21 of channels 1 to 4 (i.e., TX1~TX4), and B22 of channels 5 to 8 (i.e., RX5~RX8) all use DSP processing. In this way, since part of the DSP function is reduced in the entire link, the power consumption and latency are reduced.

[0106] In an exemplary embodiment, as shown in Figure 7, Figure 11 Figure 11 Figure 8 shows a schematic diagram of a 32-channel active optical cable in an embodiment, wherein the 32-channel active optical cable comprises 8-channel A11, 8-channel A12, 8-channel A21, 8-channel A22, 8-channel B11, 8-channel B12, 8-channel B21, and 8-channel B22, and a half-channel link uses DSP function to reduce power consumption of the optical module, for example, A11 of channels 1 to 8 (i.e., TX1~TX8), A12 of channels 9 to 16 (i.e., RX9~RX16), B11 of channels 1 to 8 (i.e., TX1~TX8), and B12 of channels 9 to 16 (i.e., RX9~RX16) all use LPO processing, A21 of channels 9 to 16 (i.e., TX9~TX16), A22 of channels 1 to 8 (i.e., RX1~RX8), B21 of channels 9 to 16 (i.e., TX9~TX16), and B22 of channels 1 to 8 (i.e., RX1~RX8) all use DSP processing.

[0107] ​Any technical features in the above embodiments can be combined, and for the sake of brevity, not all possible combinations are described above, however, any combination of these technical features is deemed to be within the scope of the present application.

[0108] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that, for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. An optical signal transmission device, characterized by comprising: The optical signal transmission device comprises a first optical module assembly, a second optical module assembly, an electrical interface and an optical interface; the first optical module assembly and the second optical module assembly are connected with external equipment through the electrical interface; the first optical module assembly and the second optical module assembly are connected with the optical interface; half of the transmitting links and half of the receiving links in the optical signal transmission device adopt a digital signal processing mode for signal processing, and the other half of the transmitting links and the other half of the receiving links do not adopt a digital signal processing mode for signal processing; The first optical module assembly comprises a first transmitting assembly and a first receiving assembly, and the input end of the first transmitting assembly and the output end of the first receiving assembly are connected with the external equipment through the electrical interface; the output end of the first transmitting assembly and the input end of the first receiving assembly are connected with the optical interface. The second optical module assembly comprises a second transmitting assembly, a second receiving assembly and a digital signal processor, the input end of the second transmitting assembly and the output end of the second receiving assembly are connected with one end of the digital signal processor, and the other end of the digital signal processor is connected with the external equipment through the electrical interface; the output end of the second transmitting assembly and the input end of the second receiving assembly are connected with the optical interface. The optical signal transmission device further comprises a circuit board, the first optical module assembly and the second optical module assembly are arranged in series along a preset direction on one side surface of the circuit board, the electrical interface is arranged at one end of the circuit board, and the optical interface is arranged at a distance from the other end of the circuit board in the preset direction; the first optical module assembly is arranged at a position close to the electrical interface on the circuit board, and the second optical module assembly is arranged at a position close to the optical interface on the circuit board. The first transmitting assembly comprises a driver, a first silicon optical chip, a first lens, a first laser and a first optical fiber array assembly; the driver, one end of the first lens and the first optical fiber array assembly are connected with the first silicon optical chip, and the other end of the first lens is connected with the first laser.

2. The apparatus of claim 1, wherein, The first transmitting assembly is any one of a 4-channel transmitting assembly, an 8-channel transmitting assembly and a 16-channel transmitting assembly, the first receiving assembly is any one of a 4-channel receiving assembly, an 8-channel receiving assembly and a 16-channel receiving assembly; the number of channels of the first receiving assembly is consistent with that of the first transmitting assembly. The second transmitting assembly is any one of a 4-channel transmitting assembly, an 8-channel transmitting assembly and a 16-channel transmitting assembly, the second receiving assembly is any one of a 4-channel receiving assembly, an 8-channel receiving assembly and a 16-channel receiving assembly; the number of channels of the second receiving assembly is consistent with that of the second transmitting assembly.

3. The apparatus of claim 1, wherein, The second transmitting assembly comprises a second silicon optical chip, a second lens, a second laser and a second optical fiber array assembly; one end of the second lens and the second optical fiber array assembly are connected with the second silicon optical chip, and the other end of the second lens is connected with the second laser.

4. The device according to claim 3, characterized in that The first sending component further comprises a polarization maintaining optical fiber, one end of the first lens is connected with the first silicon optical chip through the polarization maintaining optical fiber, and the first lens and the first laser are arranged on a circuit board close to the optical interface.

5. The device according to claim 1, characterized in that The first receiving component comprises a first photodiode, a third optical fiber array component and a first transimpedance amplifier; one end of the first photodiode is connected with the third optical fiber array component, and the other end of the first photodiode is connected with the first transimpedance amplifier.

6. The apparatus of claim 1, wherein, The second receiving component comprises a second photodiode, a fourth optical fiber array component and a second transimpedance amplifier; one end of the second photodiode is connected with the fourth optical fiber array component, and the other end of the second photodiode is connected with the second transimpedance amplifier.

7. An active optical cable, comprising: The active optical cable comprises a first optical signal transmission device, a second optical signal transmission device and a transmission optical fiber, the first optical signal transmission device and the second optical signal transmission device are connected through the transmission optical fiber; the first optical signal transmission device and the second optical signal transmission device are the optical signal transmission device as claimed in any one of claims 1-6.

8. The optical cable of claim 7, wherein, The first optical signal transmission device comprises a third optical module component, a fourth optical module component, a first electrical interface and a first optical interface; the third optical module component and the fourth optical module component are connected with a first external device through the first electrical interface; the third optical module component and the fourth optical module component are connected with the first optical interface; The second optical signal transmission device comprises a fifth optical module component, a sixth optical module component, a second electrical interface and a second optical interface; the fifth optical module component and the sixth optical module component are connected with a second external device through the second electrical interface; the fifth optical module component and the sixth optical module component are connected with the second optical interface; Among the fourth optical module component and the sixth optical module component, a digital signal processor is included; the third optical module component is connected with the sixth optical module component through the first optical interface, the transmission optical fiber and the second optical interface, and the fourth optical module component is connected with the fifth optical module component through the first optical interface, the transmission optical fiber and the second optical interface.

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