Clamping device for realizing potting and polishing of welding spots of flip-chip

Abstract

The invention discloses a clamping device for achieving flip-chip welding spot potting and polishing, and relates to the technical field of chip potting, the clamping device comprises a bottom plate, a frame is fixedly installed on the top surface of the bottom plate, a servo motor is fixedly installed on the top surface of the bottom plate, a control module is arranged in the servo motor, and the control module is connected with the frame and the servo motor. A control module of the servo motor controls a rotating shaft of the servo motor to rotate intermittently, a disc is fixed to the top face of the rotating shaft of the servo motor, the bottom face of the disc is rotationally connected with the top face of the frame, a plurality of PCB containing grooves are fixed to the top face of the disc, and a shell is fixedly installed on the top face of the bottom plate and located on the left side of the frame. A sliding groove is formed in the right side of the shell, and an electric telescopic rod I is fixedly installed at the bottom end in the shell. According to the invention, a semicircular rubber block tightly abuts against the PCB placement groove, so that the problem of welding and potting deviation caused by misalignment between a PCB and the lower part of a chip is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of chip potting, in particular to a clamping device for potting and polishing solder joints of a flip-chip chip. Background Art

[0002] The main function of the flip-chip chip solder joint potting and polishing clamping device is to place the chip face down and connect it to the PCB through the solder joints, so as to increase the signal transmission speed and bandwidth, reduce adverse effects such as resistance and inductance, and improve electrical performance. The potting of this equipment can ensure the sealing of the chip during the packaging process, and at the same time improve the flatness of the solder joints through polishing, thereby improving the efficiency and quality of the entire packaging process.

[0003] Patent number CN208521906U discloses a clamping device for potting and polishing the solder joints of flip-chip chips, including a micro-electric grinder XZ direction displacement and precise positioning mechanism, a clamped chip XY direction clamping self-locking mechanism and a support mechanism. The micro-electric grinder XZ direction displacement and precise positioning mechanism is fixed on one side of the support mechanism, and the clamped chip XY direction clamping self-locking mechanism is located in the center of the support mechanism. The micro-electric grinder of this patent accurately positions the clamping mechanism up and down and left and right, which can not only clamp the chip on the device, but also polish the chip solder joints to ensure the quality of the polishing.

[0004] However, the current clamping device for potting and polishing the solder joints of flip-chip chips has the following problems: when the clamping device is used, the PCB board is easily deviated from its position during the process of continuous soldering and potting the chips, resulting in misalignment between the PCB board and the bottom of the chip, causing the solder potting to shift. Therefore, we propose a clamping device for potting and polishing the solder joints of flip-chip chips. Summary of the Invention

[0005] In view of the deficiencies in the prior art, the present invention provides a clamping device for potting and polishing solder joints of flip-chip chips, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a clamping device for sealing and polishing the solder joints of flip-chip chips, comprising a base plate, a frame fixedly installed on the top surface of the base plate, a servo motor fixedly installed on the top surface of the base plate, a control module provided inside the servo motor, the control module of the servo motor controls the intermittent rotation of the servo motor shaft, a disc fixed on the top surface of the servo motor shaft, the bottom surface of the disc is rotatably connected to the top surface of the frame, a plurality of PCB placement slots are fixed on the top surface of the disc, a shell is fixedly installed on the top surface of the base plate, the shell is located on the left side of the frame, a slide groove is provided on the right side of the shell, an electric telescopic rod is fixedly installed on the bottom end of the shell, a cross plate is fixed on the top surface of the telescopic end of the electric telescopic rod, the outer wall of the cross plate is slidably connected to the inner wall of the slide groove of the shell, and the top surface of the shell is fixedly installed The left side of the bottom surface of the horizontal plate is provided with a grinding clamping device; The grinding and clamping device includes two vertical rings, two vertical rings are fixed on the left side of the bottom surface of the horizontal plate, and two electric telescopic rods are fixedly installed on the inner walls of the two vertical rings. An L-shaped grinding plate is fixed on the right side of the telescopic end of the electric telescopic rod, and two clamping columns are fixed on the right side of the L-shaped grinding plate. A scraper is embedded on the right side of the L-shaped grinding plate. The sandpaper on the L-shaped grinding plate grinds the tin beads under the chip, and the clamping column limits the chip. The scraper scrapes off the polished tin bead debris, so that the device can stably grind the tin beads under the chip; Heating devices are provided on the left and right sides of the two horizontal blocks, and fanning devices are provided on the outer walls of the heating devices.

[0007] According to the above technical solution, the servo motor is located in the middle of the frame, the semicircular rubber block is located on the right side of the horizontal plate, the PCB placement groove is on the movement trajectory of the semicircular rubber block, the bottom end of the L-shaped grinding plate is provided with sandpaper, the right side of the top surface of the scraper is provided with a chamfer, and the bottom of the chip adsorbed by the suction cup module is on the movement trajectory of the scraper.

[0008] According to the above technical solution, the heating device includes four L-shaped blocks, two circular plates and two resistance heaters. The four L-shaped blocks are respectively fixed on the left and right sides of the two horizontal blocks, the two circular plates are fixed on the bottom surface of each L-shaped block, and the two resistance heaters are respectively fixed on the left and right sides of the inner walls of the two circular plates. The resistance heaters transfer heat to the PCB placement slot, the tin beads on the chip melt and weld on the PCB board, and the glue on the PCB board quickly bonds to the chip, allowing the chip and the PCB board to be quickly potted together.

[0009] According to the above technical solution, the heating device also includes four blocks, two arc-shaped springs and two rubber pads. The four blocks are respectively fixed on the left and right sides of the two circular plates, the two arc-shaped springs are respectively embedded in the bottom surfaces of the four blocks, and the two rubber pads are fixed on the bottom surfaces of the two arc-shaped springs. Under the elastic force of the arc-shaped springs, the contact speed between the chip on the suction cup module and the PCB board in the PCB placement groove is slowed down.

[0010] According to the above technical solution, the two circular plates are respectively located on the front and back of the suction cup module, the two arc-shaped springs are located below the two circular plates, and the disc is on the movement trajectory of the two rubber pads.

[0011] According to the above technical solution, the fanning device includes two U-shaped plates, two vertical strips, two thin rods, two rollers and a number of fan plates. The two U-shaped plates are fixed on the outer walls of the four blocks, the two vertical strips are fixed on the right side of the shell, the two thin rods pass through and are rotatably installed in the middle of the inner walls of the two vertical strips, the two rollers are fixed on the left sides of the two thin rods, and the two rollers are located on the side of the two vertical strips away from each other. A number of fan plates are respectively fixed on the outer walls of the two thin rods, and a number of fan plates are located in the middle of the two U-shaped plates. The fan plates fan the waste heat in the circular plate, so that the waste heat in the circular plate is transferred to the encapsulated chip.

[0012] According to the above technical solution, the fanning device also includes two sliders, four short rods and four rectangular plates. The two sliders are slidably installed on the right side of the two vertical strips. The inner walls of the two sliders are rotatably connected to the outer walls of the two thin rods. The four short rods are respectively fixed on the top and bottom surfaces of the two sliders. The four rectangular plates are respectively fixed in the middle of the left sides of the four short rods. The rectangular plates scrape off foreign matter on the vertical strips to keep the surface of the vertical strips clean.

[0013] According to the above technical solution, the two U-shaped plates are located on the side of the two circular plates away from each other, and the four rectangular plates are slidably arranged on the side of the two circular plates away from each other.

[0014] The present invention provides a clamping device for potting and polishing the solder joints of flip-chip chips. It has the following beneficial effects: (1) The present invention comprises a shell, an electric telescopic rod 1, a horizontal plate, an air cylinder, a spiral hose, a suction cup module, a cylinder, an L-shaped slide plate, a semicircular rubber block, an arc-shaped elastic strip, a horizontal plate, a vertical ring, an electric telescopic rod 2, an L-shaped grinding plate and a clamping column in combination with a scraper. Under the elastic force of the arc-shaped elastic strip, the semicircular rubber block is tightly pressed against the PCB placement groove, so that the PCB placement groove is aligned with the bottom of the suction cup module, thereby preventing the PCB board from being misaligned with the bottom of the chip, causing the welding potting to shift. In addition, the sandpaper on the L-shaped grinding plate grinds the tin beads under the chip, the clamping column limits the chip, and the scraper scrapes off the grinded tin beads, so that the equipment can stably grind the tin beads under the chip, thereby preventing the chip from being attached with tin beads grinding debris, which causes the chip welding potting to have a poor effect.

[0015] (2) The present invention sets a heating device so that the L-shaped block, the circular plate, the resistance heater, the square and the arc-shaped spring piece cooperate with the rubber pad, the resistance heater transfers heat to the PCB placement slot, the tin beads on the chip melt and weld on the PCB board, the glue on the PCB board quickly adheres to the chip, and the chip and the PCB board are quickly potted together, preventing the glue on the PCB board from bonding the chip too slowly, resulting in poor continuous potting effect of the equipment, and under the elastic force of the arc-shaped spring piece, the contact speed between the chip on the suction cup module and the PCB board in the PCB placement slot is slowed down, preventing the chip from hitting the PCB board and causing damage to the workpiece.

[0016] (3) The present invention arranges a fanning device so that the U-shaped plate, vertical strip plate, thin rod, roller, strip fan plate, slider and short rod cooperate with the rectangular plate. The strip fan plate fans the residual heat in the circular plate, allowing the residual heat in the circular plate to be transferred to the encapsulated chip, preventing the adhesive between the chip and the PCB board from rapidly cooling and cracking, causing the chip and the PCB board to separate. In addition, the rectangular plate scrapes away foreign matter on the vertical strip plate, keeping the surface of the vertical strip plate clean, and preventing foreign matter on the vertical strip plate from causing the equipment to jam. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the present invention as a whole; Figure 2 A schematic cross-sectional view of the present invention as a whole; Figure 3 It is a cross-sectional schematic diagram of the housing of the present invention; Figure 4 For the present invention Figure 3 A partial enlarged schematic diagram of point A in the middle; Figure 5 For the present invention Figure 3 A partial enlarged schematic diagram of point B in the middle; Figure 6 is a schematic cross-sectional view of a heating device according to the present invention; Figure 7 For the present invention Figure 6 A partial enlarged schematic diagram of point C in the middle; Figure 8 is a schematic cross-sectional view of a fanning device of the present invention; Figure 9 For the present invention Figure 8 A local enlarged schematic diagram of point D in the middle.

[0018] In the figure: 1. Base plate; 2. Frame; 3. Servo motor; 4. Disc; 5. PCB placement slot; 6. Housing; 7. Heating device; 71. L-shaped block; 72. Circular plate; 73. Resistance heater; 74. Block; 75. Arc-shaped spring; 76. Rubber pad; 8. Fan device; 81. U-shaped plate; 82. Vertical strip plate; 83. Thin rod; 84. Roller; 85. Strip fan plate; 86. Slider; 87. Short rod; 88. Rectangular plate; 9. Electric telescopic rod 1; 10. Horizontal plate; 11. Cylinder; 12. Spiral hose; 13. Suction cup module; 14. Cylinder; 15. L-shaped slide plate; 16. Semicircular rubber block; 17. Arc-shaped spring strip; 18. Horizontal block; 19. Vertical ring; 20. Electric telescopic rod 2; 21. L-shaped grinding plate; 22. Clamp column; 23. Scraper. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] See also Figures 1-9 One embodiment of the present invention is: a clamping device for potting and polishing solder joints of flip-chip chips, comprising a base plate 1, a frame 2 fixedly mounted on the top surface of the base plate 1, a servo motor 3 fixedly mounted on the top surface of the base plate 1, a control module disposed inside the servo motor, the control module of the servo motor controlling the intermittent rotation of the servo motor shaft, a disk 4 fixed on the top surface of the servo motor 3 shaft, the bottom surface of the disk 4 being rotatably connected to the top surface of the frame 2, a plurality of PCB placement slots 5 fixed on the top surface of the disk 4, and the servo motor 3 being located in the middle of the frame 2; A shell 6 is fixedly installed on the top surface of the bottom plate 1. The shell 6 is located on the left side of the frame 2. A slide groove is provided on the right side of the shell 6. An electric telescopic rod 9 is fixedly installed on the bottom end of the shell 6. A horizontal plate 10 is fixed on the top surface of the telescopic end of the electric telescopic rod 9. The outer wall of the horizontal plate 10 is slidably connected to the inner wall of the slide groove of the shell 6. A cylinder 11 is fixedly installed on the top surface of the shell 6. One end of a spiral hose 12 is fixedly installed on the right side of the cylinder 11. A suction cup module 13 is fixedly installed on the right side of the bottom surface of the horizontal plate 10. The other end of the spiral hose 12 away from the cylinder 11 is fixedly connected to the top surface of the suction cup module 13. A cylinder 14 is fixed on the right side of the top surface of the horizontal plate 10. An L-shaped slide plate 15 is slidably installed on the right side of the top surface of the horizontal plate 10. A slide groove is provided on the top surface of the L-shaped slide plate 15. The inner wall of the slide groove of the slide plate 15 is in sliding contact with the outer wall of the cylinder 14. A semicircular rubber block 16 is fixed to the left side of the L-shaped slide plate 15. One end of two arc-shaped elastic bars 17 is fixed to the top surface of the L-shaped slide plate 15. Two cross blocks 18 are fixed to the top surface of the cross plate 10. The ends of the two arc-shaped elastic bars 17 away from the L-shaped slide plate 15 are embedded in the top surfaces of the two cross blocks 18. The semicircular rubber block 16 is located on the right side of the cross plate 10. The PCB placement slot 5 is on the movement trajectory of the semicircular rubber block 16. Under the elastic force of the arc-shaped elastic bar 17, the semicircular rubber block 16 is tightly against the PCB placement slot 5, so that the PCB placement slot 5 is aligned with the bottom of the suction cup module 13, so as to avoid the welding potting deviation caused by the PCB board and the bottom of the chip not being aligned when the clamping device is in use.

[0021] The left side of the bottom surface of the horizontal plate 10 is provided with a grinding clamping device, which includes two vertical rings 19. Two vertical rings 19 are fixed to the left side of the bottom surface of the horizontal plate 10. The inner walls of the two vertical rings 19 are fixedly installed with an electric telescopic rod 20. An L-shaped grinding plate 21 is fixed on the right side of the telescopic end of the electric telescopic rod 20. Two clamping columns 22 are fixed on the right side of the L-shaped grinding plate 21. A scraper 23 is embedded on the right side of the L-shaped grinding plate 21. A emery cloth is provided at the bottom end of the L-shaped grinding plate 21, and a chamfer is provided on the right side of the top surface of the scraper 23. The chip adsorbed by the suction cup module 13 is on the movement trajectory of the scraper 23. The emery cloth on the L-shaped grinding plate 21 grinds the tin beads under the chip, and the clamping column 22 limits the chip. In the process of the scraper 23 reciprocating left and right, the scraper 23 scrapes off the polished tin bead debris, allowing the equipment to stably polish the tin beads under the chip, avoiding the chip being attached with tin bead grinding chips when the clamping device is in use, resulting in poor chip welding and potting effect.

[0022] When in use, the bottom plate 1 supports the frame 2, the frame 2 supports the disc 4, the disc 4 supports the PCB placement slot 5, the PCB board with glue is placed in the PCB placement slot 5, the servo motor 3 on the bottom plate 1 is started, the shaft of the servo motor 3 starts the intermittent device, the shaft of the servo motor 3 drives the disc 4 to rotate intermittently forward, the disc 4 rotates intermittently forward on the frame 2, the disc 4 drives the PCB placement slot 5 to rotate intermittently forward, the PCB placement slot 5 drives the PCB board to rotate intermittently forward, so that the equipment can process continuously and uninterruptedly. During the process of continuous soldering and encapsulating chips on the PCB board, the PCB board is easy to deviate from its position. At this time, the bottom plate 1 supports the shell 6, and the shell 6 supports the cylinder 11. The cylinder 11 is started, and the cylinder 11 sucks air through the spiral hose 12, so that the suction cup under the suction cup module 13 adsorbs the chip. The electric telescopic rod 9 in the shell 6 is started, and the telescopic end of the electric telescopic rod 9 starts to move downward. The telescopic end of the electric telescopic rod 9 drives the horizontal plate 10 to move downward, and the horizontal plate 10 drives the suction cup module 13 to adsorb the chip. The disc module 13 moves downward, and the suction cup module 13 drives the chip downward. At the same time, the horizontal plate 10 drives the cylinder 14 downward, and the horizontal plate 10 drives the L-shaped slide 15 downward, and the L-shaped slide 15 drives the semicircular rubber block 16 downward, and the horizontal plate 10 drives the horizontal block 18 downward, and the horizontal block 18 drives the arc-shaped elastic bar 17 downward. In the process of the semicircular rubber block 16 moving downward, the semicircular rubber block 16 contacts the PCB placement slot 5. Under the action of the extrusion force, the L-shaped slide 15 slides to the right on the horizontal plate 10. The slide groove of the L-shaped slide plate 15 slides rightward on the cylinder 14, and the arc-shaped elastic bar 17 on the L-shaped slide plate 15 begins to deform. Under the elastic force of the arc-shaped elastic bar 17, the semicircular rubber block 16 is tightly pressed against the PCB placement groove 5, so that the PCB placement groove 5 is aligned with the bottom of the suction cup module 13, preventing the PCB board in the PCB placement groove 5 from being misaligned with the bottom of the chip during the chip soldering and potting process of the device, thereby avoiding the problem of soldering and potting deviation caused by the PCB board and the bottom of the chip being misaligned when the clamping device is in use.

[0023] When the suction cup below the suction cup module 13 absorbs the chip, the horizontal plate 10 supports the vertical ring 19, starts the electric telescopic rod 20 in the vertical ring 19, and the telescopic end of the electric telescopic rod 20 begins to reciprocate. The telescopic end of the electric telescopic rod 20 drives the L-shaped grinding plate 21 to move back and forth, and the L-shaped grinding plate 21 drives the clamping column 22 to move back and forth, and the L-shaped grinding plate 21 drives the scraper 23 to move back and forth. While the suction cup module 13 drives the chip downward, the telescopic end of the electric telescopic rod 20 is reset, so that the L-shaped grinding plate 21 moves back and forth. During the movement, the sandpaper on the L-shaped grinding plate 21 grinds the tin beads under the chip. During the reciprocating movement of the clamping column 22, the clamping column 22 limits the chip. During the reciprocating movement of the scraper 23, the scraper 23 scrapes off the polished tin bead debris, so that the equipment can stably grind the tin beads under the chip, preventing the chip from being attached to tin bead grinding debris during the process of grinding the chip tin beads, thereby avoiding the problem of poor chip welding and potting effect caused by tin bead grinding debris attached to the chip when the clamping device is in use.

[0024] See also Figures 1-9 On the basis of the above embodiment, in another embodiment of the present invention, a heating device 7 is provided on the left and right sides of the two horizontal blocks 18, and the heating device 7 includes four L-shaped blocks 71, two round-shaped plates 72 and two resistance heaters 73. The four L-shaped blocks 71 are respectively fixed on the left and right sides of the two horizontal blocks 18, and the two round-shaped plates 72 are fixed on the bottom surface of each L-shaped block 71. The two resistance heaters 73 are respectively fixed on the left and right sides of the inner walls of the two round-shaped plates 72. The two round-shaped plates 72 are respectively located on the front and back of the suction cup module 13. The resistance heater 73 transfers heat to the PCB placement groove 5, and the tin beads on the chip melt and weld on the PCB board. The glue on the PCB board quickly bonds to the chip, allowing the chip and the PCB board to be quickly potted together, avoiding the situation where the glue on the PCB board bonds the chip too slowly when the clamping device is in use, resulting in poor continuous potting effect of the equipment.

[0025] The heating device 7 also includes four blocks 74, two arc-shaped spring pieces 75 and two rubber pads 76. The four blocks 74 are respectively fixed on the left and right sides of the two circular plates 72, the two arc-shaped spring pieces 75 are respectively embedded in the bottom surfaces of the four blocks 74, and the two rubber pads 76 are fixed on the bottom surfaces of the two arc-shaped spring pieces 75. The two arc-shaped spring pieces 75 are located below the two circular plates 72, and the disc 4 is on the movement trajectory of the two rubber pads 76. Under the elastic force of the arc-shaped spring pieces 75, the contact speed between the chip on the suction cup module 13 and the PCB board in the PCB placement slot 5 is slowed down, thereby preventing the chip from hitting the PCB board and causing damage to the workpiece when the clamping device is in use.

[0026] A fanning device 8 is provided on the outer wall of the heating device 7. The fanning device 8 includes two U-shaped plates 81, two vertical strips 82, two thin rods 83, two rollers 84 and a plurality of fan plates 85. The two U-shaped plates 81 are fixed on the outer walls of the four blocks 74, the two vertical strips 82 are fixed on the right side of the shell 6, the two thin rods 83 pass through and are rotatably installed in the middle of the inner walls of the two vertical strips 82, the two rollers 84 are fixed on the left sides of the two thin rods 83, the two rollers 84 are located on the side where the two vertical strips 82 are away from each other, and a plurality of fan plates 85 are respectively fixed on the outer walls of the two thin rods 83, and a plurality of fan plates 85 are located in the middle of the two U-shaped plates 81. The two U-shaped plates 81 are located on the side where the two circular plates 72 are away from each other. The fan plates 85 fan the residual heat in the circular plates 72, so that the residual heat in the circular plates 72 is transferred to the potted chip, so as to avoid the chip and the PCB board from being separated due to the rapid cooling and cracking of the adhesive in the chip and the PCB board when the clamping device is in use.

[0027] The fanning device 8 also includes two sliders 86, four short rods 87 and four rectangular plates 88. The two sliders 86 are slidably installed on the right side of the two vertical strips 82. The inner walls of the two sliders 86 are rotatably connected to the outer walls of the two thin rods 83. The four short rods 87 are respectively fixed on the top and bottom surfaces of the two sliders 86. The four rectangular plates 88 are respectively fixed in the middle of the left side of the four short rods 87. The four rectangular plates 88 are slidably set on the side of the two circular plates 72 away from each other. In the process of sliding upward, the rectangular plates 88 scrape off foreign matter on the vertical strips 82, so that the surface of the vertical strips 82 remains clean, avoiding foreign matter on the vertical strips 82 when the clamping device is in use and causing the equipment to jam.

[0028] While the horizontal plate 10 drives the horizontal block 18 to move downward, the horizontal block 18 drives the L-shaped block 71 to move downward, the L-shaped block 71 drives the circular plate 72 to move downward, and the circular plate 72 drives the resistance heater 73 to move downward. When the chip on the suction cup module 13 contacts the PCB board in the PCB placement slot 5, the resistance heater 73 is started, the resistance heater 73 begins to heat up, and the resistance heater 73 transfers heat to the PCB placement slot 5, so that the tin beads on the chip melt and weld on the PCB board. At the same time, the glue on the PCB board quickly bonds to the chip, allowing the chip and the PCB board to be quickly potted together, preventing the glue on the PCB board from bonding the chip too slowly when the device is in use, thereby avoiding the problem of poor continuous potting effect of the device caused by the glue on the PCB board bonding the chip too slowly when the clamping device is in use.

[0029] When the L-shaped block 71 drives the circular plate 72 to move downward, the circular plate 72 drives the square block 74 to move downward, the square block 74 drives the arc-shaped spring piece 75 to move downward, and the arc-shaped spring piece 75 drives the rubber pad 76 to move downward. In the process of the rubber pad 76 moving downward, the rubber pad 76 contacts the disc 4. Under the action of the extrusion force, the arc-shaped spring piece 75 is deformed. Under the elastic force of the arc-shaped spring piece 75, the contact speed between the chip on the suction cup module 13 and the PCB board in the PCB placement groove 5 is slowed down, preventing the chip on the suction cup module 13 from hitting the PCB board when the device is in use, thereby avoiding the problem of the chip hitting the PCB board and causing damage to the workpiece when the clamping device is in use.

[0030] When the chip potting is completed, the telescopic end of the electric telescopic rod 9 is reset, and the circular plate 72 will drive the block 74 to move upward, and the block 74 will drive the U-shaped plate 81 to move upward, and the U-shaped plate 81 will drive the thin rod 83 to move upward, and the thin rod 83 will drive the roller 84 to move upward, and the roller 84 will move upward on the vertical strip plate 82. Under the action of friction, the roller 84 rolls on the vertical strip plate 82, and the roller 84 drives the thin rod 83 to rotate, and the thin rod 83 drives the fan plate 85 to rotate, and the fan plate 85 rotates in the U-shaped plate 81, so that the fan plate 85 fans the residual heat in the circular plate 72, and the residual heat in the circular plate 72 is transferred to the potted chip, preventing the adhesive in the chip and the PCB board from rapid cooling and cracking when the equipment completes the chip potting, thereby avoiding the problem of the chip and the PCB board being separated due to rapid cooling and cracking of the adhesive in the chip and the PCB board when the clamping device is in use.

[0031] When the U-shaped plate 81 drives the thin rod 83 to move upward, the thin rod 83 drives the slider 86 to move upward, and the slider 86 slides upward on the vertical strip plate 82. The slider 86 drives the short rod 87 to move upward, and the short rod 87 drives the rectangular plate 88 to move upward. The rectangular plate 88 slides upward on the vertical strip plate 82, so that in the process of the rectangular plate 88 sliding upward, the rectangular plate 88 scrapes off foreign matter on the vertical strip plate 82, so that the surface of the vertical strip plate 82 remains clean, preventing foreign matter from being on the vertical strip plate 82 when the equipment is in use, thereby avoiding the problem of equipment jamming caused by foreign matter on the vertical strip plate 82 when the clamping device is in use.

[0032] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A clamping device for potting and polishing flip-chip solder joints, comprising a base plate, a frame fixedly mounted on the top surface of the base plate, a servo motor fixedly mounted on the top surface of the base plate, a disk fixed on the top surface of the servo motor shaft, the bottom surface of the disk rotatably connected to the top surface of the frame, and a plurality of PCB placement slots fixed on the top surface of the disk, characterized in that: The top surface of the L-shaped slide is provided with a slide groove, and the inner wall of the slide groove of the L-shaped slide is in sliding contact with the outer wall of the cylinder. A semicircular rubber block is fixed on the left side of the interior of the L-shaped slide, and one end of two arc spring strips is fixed on the top surface of the L-shaped slide, and two cross blocks are fixed on the top surface of the cross plate, and one end of the two arc spring strips away from the L-shaped slide is embedded in the top surfaces of the two cross blocks. A grinding clamping device is provided on the left side of the bottom surface of the cross plate; The grinding and clamping device includes two vertical rings, two vertical rings are fixed to the left side of the bottom surface of the horizontal plate, and the inner walls of the two vertical rings are fixedly installed with two electric telescopic rods. An L-shaped grinding plate is fixed to the right side of the telescopic end of the second electric telescopic rod. Two clamping columns are fixed on the right side of the L-shaped grinding plate, and a scraper is embedded on the right side of the L-shaped grinding plate. Heating devices are provided on the left and right sides of the two horizontal blocks, and fanning devices are provided on the outer walls of the heating devices.

2. The clamping device for potting and polishing flip-chip solder joints according to claim 1, characterized in that: The servo motor is located in the middle of the frame, the semicircular rubber block is located on the right side of the horizontal plate, the PCB placement groove is on the movement trajectory of the semicircular rubber block, the bottom end of the L-shaped grinding plate is provided with sandpaper, the right side of the top surface of the scraper is provided with a chamfer, and the bottom of the chip adsorbed by the suction cup module is on the movement trajectory of the scraper.

3. The clamping device for potting and polishing flip-chip solder joints according to claim 2, characterized in that: The heating device includes four L-shaped blocks, two circular plates and two resistance heaters. The four L-shaped blocks are respectively fixed on the left and right sides of the two horizontal blocks, the two circular plates are fixed on the bottom surface of each L-shaped block, and the two resistance heaters are respectively fixed on the left and right sides of the inner walls of the two circular plates.

4. The clamping device for potting and polishing flip-chip solder joints according to claim 3, characterized in that: The heating device also includes four blocks, two arc-shaped springs and two rubber pads. The four blocks are respectively fixed on the left and right sides of the two circular plates, the two arc-shaped springs are respectively embedded in the bottom surfaces of the four blocks, and the two rubber pads are fixed on the bottom surfaces of the two arc-shaped springs.

5. The clamping device for potting and polishing flip-chip solder joints according to claim 4, characterized in that: The two circular plates are respectively located on the front and back of the suction cup module, the two arc-shaped spring sheets are located below the two circular plates, and the disc is located on the movement tracks of the two rubber pads.

6. The clamping device for potting and polishing flip-chip solder joints according to claim 5, characterized in that: The fanning device includes two U-shaped plates, two vertical strips, two thin rods, two rollers and a number of fan plates. The two U-shaped plates are fixed on the outer walls of the four blocks, the two vertical strips are fixed on the right side of the shell, the two thin rods pass through and are rotatably installed in the middle of the inner walls of the two vertical strips, the two rollers are fixed on the left sides of the two thin rods, and the two rollers are located on the side of the two vertical strips away from each other. The number of fan plates are respectively fixed on the outer walls of the two thin rods, and the number of fan plates are located in the middle of the two U-shaped plates.

7. The clamping device for potting and polishing flip-chip solder joints according to claim 6, characterized in that: The fanning device also includes two sliders, four short rods and four rectangular plates. The two sliders are slidably installed on the right side of the two vertical strips. The inner walls of the two sliders are rotatably connected to the outer walls of the two thin rods. The four short rods are respectively fixed on the top and bottom surfaces of the two sliders, and the four rectangular plates are respectively fixed in the middle of the left side of the four short rods.

8. The clamping device for potting and polishing flip-chip solder joints according to claim 7, characterized in that: The two U-shaped plates are located on a side of the two circular plates that are away from each other, and the four rectangular plates are slidably arranged on a side of the two circular plates that are away from each other.

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