Integrated cleaning and drying module for cleaning substrate

Abstract

In one embodiment, a cleaning and drying module includes a processing rotor having a gripping pin for holding a substrate. The process rotor rotates and moves between lowered and raised positions. The plurality of sweep arms each have a nozzle mechanism to apply a cleaning and / or drying fluid to the substrate. The collecting rotor and the processing rotor rotate synchronously. The collection rotor includes a collection weir defined by a bottom portion and an inner surface of the collection rotor. A collection weir collects fluids and particulates from the processing rotor and the substrate. A drain hole is located in the collection weir to drain fluid and particles from the collection weir. A rotor cover extends around and over a sidewall of the collection rotor to define an annular volume between the rotor cover and the collection rotor. The exhaust device draws air through the exhaust hole and receives the collected fluid and particles.

Description

Technical Field

[0001] Embodiments of the present disclosure relate generally to apparatus and methods for cleaning processed substrates, and more particularly, to integrated cleaning and drying modules that can be used to clean substrate surfaces. Background Art

[0002] The substrate processing unit can perform chemical mechanical polishing (CMP), which is commonly used in the manufacture of high-density integrated circuits to planarize or polish material layers deposited on a substrate. In a typical CMP process, a substrate is held in a carrier head, which presses the backside of the substrate against a rotating polishing pad in the presence of a polishing fluid. A combination of chemical and mechanical activity provided by the polishing fluid and the relative motion of the substrate and polishing pad removes material from the surface of the substrate's material layer in contact with the polishing pad. Typically, after completing one or more CMP processes, the polished substrate is further processed using one or more post-CMP substrate processing operations in the CMP processing system. For example, the polished substrate can be further processed using one or more cleaning operations in a cleaning unit. Various cleaning operations can be performed in a cleaning unit having multiple cleaning stations (i.e., cleaning modules). Once the post-CMP operations are completed, the substrate can be removed from the CMP processing system and then transported to the next device manufacturing system, such as a lithography, etching, or deposition system.

[0003] Typically, a substrate enters the cleaning unit of a CMP tool from a polisher and is inserted into and subjected to one or more cleaning modules. The substrate is then moved to a drying module. Because the substrate becomes increasingly "cleaner" as it moves through the process, the final transfer from the cleaning module to the drying module is the most critical, as the time and handling create the greatest opportunities for oxidation and contamination. In one example, particles may accumulate on the substrate as it is transferred from the cleaning module to the dryer module. Consequently, the post-CMP cleaning process may not provide optimal particle-free performance.

[0004] Furthermore, during the final rinse and drying operations performed in conventional dryer modules, nozzles typically flow a fluid (such as DI water) onto the substrate. The water flowing onto the substrate can splash and create a spray, which then splashes back onto the substrate surface. The spray splashing back onto the substrate can form water beads, especially on hydrophobic surfaces. During the subsequent drying phase, the water evaporates, leaving behind watermarks. The watermarks can be the result of water bead profiles, which can contain redeposition of particles originally removed by the rinsing operation. Alternatively, these watermarks can be the result of hydrolysis of the DI water, generating small amounts of hydroxide ions. In the presence of oxygen, the hydroxide ions allow the silicon substrate to oxidize, resulting in oxide deposits during final drying.

[0005] Accordingly, there is also a need for an improved final drying process in the final cleaning module. Summary of the Invention

[0006] In one exemplary embodiment, a cleaning and drying module includes: a processing rotor having a plurality of gripping pins configured to releasably hold a substrate. The processing rotor is configured to rotate and move between a lowered position and a raised position. A plurality of sweep arms each have a nozzle mechanism configured to apply a cleaning and / or drying fluid to the substrate. A collection rotor is configured to rotate synchronously with the processing rotor. The collection rotor defines a processing volume between the processing rotor and an interior volume of the collection rotor. The collection rotor includes a sidewall extending above the processing rotor in the lowered position, the inner surface of the sidewall being inclined inward from a lower portion to an upper portion. The collection rotor further includes a collection weir defined by a bottom portion and the inner surface of the collection rotor. The collection weir is configured to collect fluid and particles from the processing rotor and the substrate. A plurality of discharge holes are located in the collection weir proximate the inner surface of the sidewall. The discharge holes are configured to discharge the collected fluid and particles from the collection weir. A rotor cover surrounds and extends above the sidewall of the collection rotor to define an annular volume between the rotor cover and the collection rotor. The process rotor extends above the rotor cover in the raised position. An exhaust device is in communication with the exhaust aperture. The exhaust device is configured to draw air from the process volume and the annular volume through the exhaust aperture and receive collected fluid and particulates.

[0007] In another exemplary embodiment, a cleaning and drying module includes: a processing rotor having a plurality of gripping pins configured to releasably hold a substrate. The processing rotor is configured to rotate and move between a lowered position and a raised position. At least one sweep arm has a nozzle mechanism configured to apply a cleaning and / or drying fluid to the substrate. A collection rotor is configured to rotate synchronously with the processing rotor. The collection rotor defines a processing volume between the processing rotor and an interior volume of the collection rotor. The collection rotor includes a sidewall extending above the processing rotor in the lowered position, the inner surface of the sidewall being inclined inward from a lower portion to an upper portion. The collection rotor further includes a collection weir defined by a bottom portion and the inner surface of the collection rotor. The collection weir is configured to collect fluid and particles from the processing rotor and the substrate. A plurality of discharge holes are located in the collection weir proximate the inner surface of the sidewall. The discharge holes are configured to discharge the collected fluid and particles from the collection weir. A rotor cover surrounds and extends above the sidewall of the collection rotor to define an annular volume between the rotor cover and the collection rotor. The process rotor extends above the rotor cover in the raised position. An exhaust device is in communication with the discharge aperture. The exhaust device is configured to draw air from the process volume and the annular volume through the discharge aperture and to receive collected fluid and particulates. A housing covers the process rotor, the collection rotor, the rotor cover, and the sweep arm. The housing includes a first door on a first side of the housing and a second door on a second side of the housing that is different from the first side.

[0008] In another exemplary embodiment, a method for cleaning a substrate in a cleaning and drying module is provided. The method includes: placing the cleaning and drying module in a first substrate transfer position, wherein: a process rotor of the cleaning and drying module is in a raised position; a plurality of gripper pins on the process rotor are in a substrate release position; opening a first door on a first side of a housing; and closing a second door on a second side of the housing, different from the first side. The method further includes: receiving a substrate on a plurality of support pins on the process rotor through the first door. The method further includes: placing the cleaning and drying module in a substrate cleaning and drying position, wherein: the process rotor is in a lowered position; the plurality of gripper pins are in a substrate gripping position; and closing the first and second doors. The method further includes: performing a cleaning process on the substrate. The cleaning process includes rotating the process rotor and the substrate gripped by the gripper pins, and applying a cleaning fluid to the substrate using a first nozzle mechanism mounted on a first sweep arm. The method further includes: performing a final rinse and drying process on the substrate. The final rinse and dry process includes rotating the process rotor and the substrate gripped by the gripper pins, and applying at least one of a rinse fluid and a drying fluid to the substrate using a second nozzle mechanism mounted on a second sweep arm. The method further includes placing the cleaning and drying module in a second substrate transfer position, wherein: the process rotor is in the raised position; the plurality of gripper pins on the process rotor are in a substrate release position and support the substrate on the support pins; closing the first door; and opening the second door. The method further includes allowing the substrate to be removed through the second door.

[0009] Embodiments of the present disclosure include a cleaning and drying module comprising: a processing rotor having a plurality of gripping pins configured to releasably hold a substrate; the processing rotor configured to rotate and move between a lowered position and a raised position; a plurality of sweep arms, each sweep arm having a nozzle mechanism configured to apply a fluid to the substrate; a collection rotor configured to rotate synchronously with the processing rotor and define a processing volume between the processing rotor and an interior volume of the collection rotor, the collection rotor comprising: a side wall extending above the processing rotor in the lowered position, the inner surface of the side wall being inclined inwardly from a lower portion to an upper portion; a collection weir, the a collection weir defined by a bottom portion of the collection rotor and the inner surface, the collection weir being configured to collect the fluid applied to the substrate; a plurality of drain holes located in the collection weir proximate the inner surface of the side wall, the drain holes being configured to drain the collected fluid; a rotor cover surrounding and extending above the side wall of the collection rotor to define an annular volume between the rotor cover and the collection rotor, the plurality of grab pins of the processing rotor extending above the rotor cover when in the raised position; and an exhaust device in communication with the drain holes, the exhaust device being configured to draw air from the processing volume and the annular volume through the drain holes and to receive the collected fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order that the manner in which the above-described features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be given by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the drawings illustrate only typical embodiments of the disclosure and are therefore not to be considered limiting of its scope, as the disclosure may admit to other equally effective embodiments.

[0012] Figure 1 is a schematic top view of an exemplary chemical mechanical polishing (CMP) processing system according to one or more embodiments.

[0013] Figure 2A is a cross-sectional view of an example of an integrated clean and dry (ICD) module in a CMP processing system with its process rotor in a lowered position according to one or more embodiments.

[0014] Figure 2B is a detailed cross-sectional view of a portion of an ICD module with the process rotor in a lowered position according to one or more embodiments.

[0015] Figure 2C is similar according to one or more embodiments Figure 2B Another detailed cross-sectional view of FIG, with the process rotor in the raised position.

[0016] Figure 3 is similar according to one or more embodiments Figure 2A Another cross-sectional view of FIG. 1 with the process rotor in a raised position.

[0017] Figure 4A is a top perspective view of an ICD module with its housing omitted, according to one or more embodiments.

[0018] Figure 4B is a top view of a process rotor of an ICD module according to one or more embodiments.

[0019] Figure 5 is a bottom perspective view of an ICD module with the housing omitted, according to one or more embodiments.

[0020] Figure 6 is an example sequence of operations performed in an ICD module according to one or more embodiments.

[0021] Figure 7A is a top perspective view of an alternative embodiment of an ICD module with its rotor cover in a lowered position and its housing omitted, in accordance with one or more embodiments.

[0022] Figure 7B is similar according to one or more embodiments Figure 7A Another top perspective view of the rotor cover in the raised position.

[0023] Figure 8A According to one or more embodiments Figure 7A 、 Figure 7B Cross-sectional view of an ICD module with the rotor cover in the lowered position.

[0024] Figure 8B is similar according to one or more embodiments Figure 8A Another cross-sectional view of the rotor cover in the raised position.

[0025] Figure 9 is a top perspective view of another alternative embodiment of an ICD module having a splash bar and omitting its housing in accordance with one or more embodiments.

[0026] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements disclosed in one embodiment may be beneficially utilized on other embodiments without specific recitation thereof. DETAILED DESCRIPTION

[0027] Embodiments described herein generally relate to apparatus used in the manufacture of electronic devices, and more particularly, to an integrated clean and dry module that can be used to clean and dry the surface of a substrate in a semiconductor device manufacturing process.

[0028] Figure 1 FIG2 is a schematic plan view illustrating one embodiment of a chemical mechanical polishing (CMP) system 100 that utilizes an integrated clean and dry module (ICD) as described herein. The CMP system 100 includes a factory interface 102, a polishing unit 104, and a cleaning unit 106. The factory interface 102 may include one or more loading stations 102A. The loading stations 102A may be, for example, FOUPs or cassettes. Each loading station 102A may include one or more substrates 150 for CMP processing in the CMP processing system 100. A first substrate handler 110 is provided to transfer substrates 150 between the loading station 102A and the cleaning unit 106. The first substrate handler 110 may also transfer substrates 150 from the cleaning unit 106 to the loading station 102A. A second substrate handler 112 is also provided to transfer substrates 150 between the cleaning unit 106 and the polishing unit 104. For example, the first substrate manipulator 110 transfers the substrate 150 from the loading station 102A to the cleaning system 106 , such as to the cleaner alley 107 , where the substrate 150 can be picked up by the second substrate manipulator 112 .

[0029] like Figure 1 , the cleaning unit 106 may include two cleaning units 106A and 106B disposed parallel to each other on opposite sides of the second substrate manipulator 112. The cleaning unit 106A may include a plurality of modules, such as a first cleaning module 160, a second cleaning module 162, a third cleaning module 164, and a fourth cleaning module 166. The cleaning unit 106B may include a plurality of modules, such as a first module 161, a second module 163, a third module 165, and a fourth module 167.

[0030] The first cleaning module 160 may be, for example, a pre-cleaning module that performs a pre-cleaning process, such as a polishing process, on the substrate 150 using the second substrate manipulator 112 before transferring the substrate 150 therefrom. The second cleaning module 162 and the third cleaning module 164 may be, for example, any one or a combination of contact and non-contact cleaning systems for removing polishing byproducts from the surface of the substrate 150 using the second substrate manipulator 112 before transferring the substrate 150 therefrom, such as in cleaning systems commonly referred to as splatter boxes and / or scrubber brush boxes. The fourth cleaning module 166 may be, for example, a drying unit or a final cleaning and drying unit.

[0031] According to one embodiment, cleaning unit 106B may be a substantially mirror image replica of cleaning unit 106A. In this case, first module 161 is similar to first cleaning module 160, second module 163 is similar to second cleaning module 162, third module 165 is similar to third cleaning module 166, and fourth module 167 is similar to fourth cleaning module 166. Accordingly, the description herein and the depiction of cleaning unit 106A in the drawings should also be inferred to be the description and depiction of cleaning unit 106B.

[0032] Alternatively, one or more of the first module 161, the second module 163, the third module 165, and the fourth module 167 may be modules configured to perform processes other than cleaning processes. For example, one or more of the first module 161, the second module 163, the third module 165, and the fourth module 167 may be metrology stations for measuring the thickness of a material layer disposed on the substrate 150 before and / or after polishing, inspecting the substrate 150 after polishing to determine whether the material layer has been removed from its surface, and / or inspecting the substrate surface for defects before and / or after polishing. As another example, one or more of the first module 161, the second module 163, the third module 165, and the fourth module 167 may be site-specific (LSP) polishing modules configured to polish only a portion of the substrate surface after the substrate 150 has been polished using the polishing module to perform repairs, for example, by removing additional material from a relatively small portion of the substrate 150 based on measurements or surface inspection results obtained using the metrology station.

[0033] The cleaning units 106A and 106B may be separated by a cleaner alley 107 in which a second substrate manipulator 112 is positioned. The second substrate manipulator 112 may pick up a substrate 150 from the cleaner alley 107 and then transfer the substrate 150 to a transfer station 104A within the polishing unit 104. After the substrate is subjected to CMP processing in the polishing unit 104, the second substrate manipulator 112 may retrieve the substrate 150 from the transfer station 104A within the polishing unit 104 and then transfer the substrate 150 to a first module 160 in the cleaning unit 106.

[0034] According to some embodiments, the second substrate manipulator 112 may also transfer the substrate 150 between the various modules of the cleaning units 106A, 106B (as described above). According to alternative embodiments, a third substrate manipulator (not shown) may be provided to transfer the substrate 150 between the various modules of the cleaning unit 106A, and a fourth substrate manipulator (not shown) may be provided to transfer the substrate 150 between the various modules of the cleaning unit 106B.

[0035] A controller 190, such as a programmable computer, is connected to the elements of the cleaning unit 106 and is configured to operate the elements of the cleaning unit 106. For example, the controller 190 may control the loading, unloading, and cleaning of the substrate 150 by the cleaning unit 106.

[0036] The controller 190 may include a central processing unit (CPU) 192, a memory 194, and support circuits 196, such as input / output circuitry, a power supply, a clock circuit, a cache, and the like. The memory 194 and the support circuits 196 are connected to the CPU 192. The memory 194 may be a non-transitory computer-readable medium and may be one or more readily accessible memories, such as random access memory (RAM), read-only memory (ROM), a floppy disk, a hard disk, or other forms of digital storage. In addition, although illustrated as a single computer, the controller 190 may be a distributed system, for example, including multiple independently operating processors and memories. This architecture can be adapted to various cleaning situations based on the programming of the controller 190 to control the order and timing of the movement of the substrate 150 between the various modules of the cleaning unit 106 and to control the independent operation of each of the various modules of the cleaning unit 106.

[0037] Figure 2A and Figure 3 is a cross-sectional view of an exemplary integrated clean and dry (ICD) module 200 according to one or more embodiments. According to an embodiment, the fourth cleaning module 166 can be implemented as an ICD module 200 as described herein. As will be discussed further below, Figure 2A The ICD module is shown in a substrate processing configuration, and Figure 3 The ICD module 200 is shown in a substrate loading / unloading configuration. The ICD module 200 can receive a substrate, such as substrate 150, to undergo a final cleaning and drying process after the substrate 150 has been cleaned within one or more modules of the cleaning unit 106. The ICD module 200 can be used to remove contamination from the substrate 150 that, if not removed, could cause the substrate 150 to fail contamination and defect requirements. The ICD module 200 can also be used to remove residual moisture from the substrate 150 that, if not removed, could cause subsequent recontamination of the substrate 150 when the substrate 150 is subjected to further manipulation within and / or outside of the CMP system 100.

[0038] The ICD module 200 includes a process rotor 202, a collection rotor 204, a rotor cover 206, a first sweep arm 210, a housing 218, a first front nozzle mechanism 220, a second sweep arm 230, a second front nozzle mechanism 240, a plenum 250, a primary exhaust 260, a secondary exhaust 270, an air inlet 280, and a lower nozzle mechanism 290. In one or more embodiments, the controller 190 ( Figure 1) can control the functions of the ICD module 200.

[0039] The processing rotor 202 includes a plurality of standoff pins 208 extending from a top surface thereof. According to an embodiment, three standoff pins 208 are provided on the processing rotor 202. The standoff pins 208 are configured to support the substrate 150 that is transported to the ICD module 200 by a substrate manipulator (such as, for example, the second substrate manipulator 112). Accordingly, the standoff pins 208 can be evenly positioned around the circumference of the processing rotor 202. The standoff pins 208 can have an "L"-shaped upper profile to provide support for the substrate 150 and ensure that the substrate 150 is centrally positioned on the processing rotor 202. The standoff pins 208 can also have a minimal cross-section to minimize contact points with the supported substrate 150.

[0040] The processing rotor 202 also includes a plurality of grab pins 212 . Figure 2B and Figure 2C is a detailed cross-sectional view of a portion of the ICD module 200 illustrating an example configuration of one of the capture pins 212. Figure 2B and Figure 2C As shown in FIG, the grabbing pin 212 extends from a hole 213A in the top surface of the process rotor 202. A protruding element 212B extends from a lower portion of the grabbing pin 212 through a hole 213B in the side surface of the process rotor 202. According to an embodiment, the grabbing pin 212 can be in a grabbing position (e.g., Figure 2B ) and the release position (as shown in Figure 2C For example, the grab pin 212 can pivot about the grab pin axis 212D between a grab position and a release position. Figure 2B In the gripping position shown in , the upper portion of each gripping pin 212 is positioned to grip the outer circumference of the substrate 150. Figure 2C , the upper portion of each grab pin 212 is positioned beyond the outer circumference of the substrate 150 so that the substrate 150 can be received on the process rotor 202, i.e., on the standoff pins 208 (or removed from the process rotor 202). The grab pins 212 can be biased toward the gripping position by, for example, springs 212C. The grab pins 212 can also include a shaped area configured to receive the substrate 150. For example, each grab pin 212 can include a notch 212A shaped to receive an edge of the substrate 150.

[0041] The grab pins 212 may grab or hold the substrate 150 during the cleaning process. Figure 4BA top view of the process rotor 202 is shown with an example arrangement of grabber pins 212 and standoff pins 208. According to some embodiments, the grabber pins 212 can be evenly arranged around the top surface of the process rotor 202 at an angle α relative to one another (as measured in a plane generally parallel to the top surface of the process rotor 202 (e.g., the XY plane)). The angle α (i.e., the angular position of the grabber pins 212 relative to one another) can be approximately 120 degrees. Alternatively, the grabber pins 212 can be oriented less than 120 degrees from one another or more than 120 degrees from one another. Furthermore, the total number of grabber pins 212 can be three or more. Alternatively, the total number of grabber pins 212 can be four or more. The grabber pins 212 can have minimal contact with the substrate 150 along the edge of the substrate 150 so that the grabber pins 212 do not collect a significant amount of fluid at the contact interface and hinder the cleaning process of the substrate 150.

[0042] The process rotor 202 can be moved between a raised position and a lowered position using a lift assembly 227 comprising a second drive motor 228 and a shaft 224. Figure 2A and Figure 2B , the process rotor 202 is shown in a lowered position, and in Figure 2C and Figure 3 , the processing rotor 202 is shown in a raised position. In the raised position, the processing rotor 202 can receive the substrate 150 because the standoff pins 208 and the grabber pins 212 are above the top portion of the collection rotor 204 and the rotor cover 206. Figure 2C As can be seen in Figure 2, the protruding element 212B is configured to contact the annular inner surface 214 of the collection rotor 204 when the processing rotor 202 moves toward the raised position. As the processing rotor continues to move into the raised position, the annular inner surface 214 applies pressure to the protruding element 212B, which overcomes the biasing force of the spring 212C and applies an outward rotational motion to one or more grabbing pins 212, thereby moving the grabbing pins 212 into the release position. Similarly, when the processing rotor 202 moves into the lowered position, the protruding element 212B of each grabbing pin 212 no longer contacts the surface 214 of the collection rotor 204, and the grabbing pins 212 rotate into the grabbing position, which results in the substrate being held between the grabbing pins 212. The lowered position is also referred to herein as the processing position, where the cleaning and drying processes are performed.

[0043] As described above, the collection rotor 204 includes an annular inner surface 214. The annular inner surface 214 defines a processing volume 216 within the ICD module 200. For example, substrates 150 may be cleaned within the processing volume 216. Furthermore, the annular inner surface 214 has a sloped portion that is symmetrical about the rotational axis 226 of the processing rotor 202 and the collection rotor 204.

[0044] A first drive motor 222 can be coupled to the processing rotor 202 via a shaft 224. The first drive motor 222 rotates the processing rotor 202 and the collection rotor 204 about a rotation axis 226. That is, the controller 190 can control the first drive motor 222 to rotate the processing rotor 202 and the collection rotor 204 at various rotational speeds set by a process recipe contained in the memory 194 of the controller 190. The first drive motor 222 can be referred to as a rotation motor. The processing rotor 202 and the collection rotor 204 can be rotationally fixed relative to each other, that is, configured to rotate together.

[0045] Furthermore, a second drive motor 228 can also be coupled to the process rotor 202 via the shaft 224. The second drive motor 228 can impart linear motion along the rotational axis 226 to the process rotor 202 using a ball screw assembly configured to generate linear motion of the process rotor 202 due to the relative rotational motion generated by the second drive motor 228 rotating the shaft 224 relative to a portion of the collection rotor 204. That is, the controller 190 can control the second drive motor 228 to move the process rotor 202 in the Z direction between a raised position and a lowered position. Furthermore, the second drive motor 228 can be used to move the process rotor 202 in the Z direction in preparation for or during a cleaning, rinsing, and / or drying process to precisely position the substrate 150 at a desired distance from the first and second nozzle mechanisms 220, 240 or relative to the surface of the collection rotor 204. Thus, the second drive motor 228 can be configured to move the rotor 202 in the Z direction while the rotor 202 rotates and / or while the substrate 150 is being cleaned, rinsed, and / or dried. The second drive motor 228 can be referred to as a linear actuator. Furthermore, the second drive motor 228 can be one of a hydraulic, pneumatic, electromechanical, and magnetic motor. The linear motion of the processing rotor 202 can be independent of the motion of the collection rotor 204.

[0046] As described above, when the processing rotor 202 is in the lowered position, the grab pins 212 hold the substrate 150. When the processing rotor 202 is in the lowered position, the first drive motor 222 can rotate the processing rotor 202 while applying a cleaning fluid to the substrate 150 for cleaning. The cleaning fluid can be applied to the upper surface of the substrate 150 through the first nozzle mechanism 220 and the second nozzle mechanism 240, and to the lower surface of the substrate 150 via the lower nozzle mechanism 290 while rotating the processing rotor 202 and the collection rotor 204. Because the collection rotor 204 rotates with the processing rotor 202, backsplash of the cleaning fluid against the inner surface 214 can be reduced.

[0047] The cleaning and / or rinsing fluid can be delivered to the lower nozzle mechanism 290 via the shaft 224, which is coupled to the fluid source 223. In one or more embodiments, the cleaning and / or rinsing fluid can flow onto the back side of the substrate 150 through the lower nozzle mechanism 290. The cleaning and / or rinsing fluid can be a rinse agent (e.g., deionized water or ozone water) or a cleaning chemical. In addition, the cleaning and / or rinsing fluid can be provided from the fluid source to the lower nozzle mechanism 290 via the shaft 224.

[0048] The processing rotor 202 may include a drain port 291 adjacent to the lower nozzle mechanism 290 to allow for drainage of fluid applied to the back side of the substrate 150 (described below). According to an embodiment, the drain port 291 may be annular and circumferentially arranged around the lower nozzle mechanism 290. The drain port 291 is fed through the shaft 224 to a suction connection (not shown) that can apply negative pressure to the drain port 291 to ensure complete drainage of the fluid.

[0049] A first sweep arm drive motor 234 can be coupled to the first sweep arm 210. The first sweep arm drive motor 234 is configured to move the first sweep arm 210 in an arcuate path parallel to the surface of the wafer 150 during a cleaning process so that the cleaning fluid output by the first nozzle mechanism 220 is evenly distributed over the surface of the substrate 150. The first sweep arm drive motor 234 can also be configured to axially move the first sweep arm 210 to set the distance between the first nozzle mechanism 220 and the surface of the substrate 150. For example, the first sweep arm drive motor 234 can include a cylinder for raising and lowering the first nozzle mechanism 220.

[0050] Similarly, a second sweep arm drive motor 235 can be coupled to the second sweep arm 230. The second sweep arm drive motor 235 is configured to move the second sweep arm 230 in an arcuate path parallel to the surface of the wafer 150 during the cleaning process so that the cleaning fluid output by the second nozzle mechanism 240 is evenly distributed over the surface of the substrate 150. The second sweep arm drive motor 235 can also be configured to axially move the second sweep arm 230 to set the distance between the second nozzle mechanism 240 and the surface of the substrate 150. For example, the second sweep arm drive motor 235 can include a cylinder for raising and lowering the second nozzle mechanism 240.

[0051] The first and second sweep arms 210 and 230 may each include one or more tubes to deliver fluid to the first and second nozzle mechanisms 220 and 240, respectively. According to one embodiment, the first and second sweep arms 210 and 230 each include a connection 210A for delivering fluid and / or electrical signals (e.g., control signals) to the first and second nozzle mechanisms 220 and 240, respectively. For example, water and isopropyl alcohol (IPA) may be delivered to the first and second nozzle mechanisms 220 and 240, respectively, via the connection 210A. For example, the first and second sweep arms 210 and 230 may also each include a connection 210A for supplying control signals from the controller 190 to the first and second nozzle mechanisms 220 and 240, respectively.

[0052] The first and second nozzle mechanisms 220, 240 may each include one or more non-contact cleaning or drying technologies. Each of the first and second nozzle mechanisms 220, 240 may have one, two, three or more nozzles, each of which may output a medium of any combination of liquid or gas. One or more of the first and second nozzle mechanisms 220, 240 may be a megasonic nozzle, a fluid jet nozzle, a mist nozzle, a high-pressure nozzle or a kinetic nozzle. The megasonic nozzle includes one or more elements, such as a piezoelectric element, configured to alternately apply compression and rarefaction to the cleaning fluid in an alternating manner according to a sinusoidal or other pattern to produce a megasonic actuated fluid. For example, the megasonic nozzle may be configured to alternately apply compression and rarefaction to the cleaning fluid in a sinusoidal pattern at a rate of 950 kHz to produce a megasonic actuated fluid. Alternatively, other frequencies may be used.

[0053] According to one embodiment, where one of the first and second nozzle mechanisms 220, 240 is a megasonic nozzle, the other of the first and second nozzle mechanisms 220, 240 may be configured to apply a chemical cleaning agent, a rinse agent (e.g., DI water), and / or a drying agent (e.g., IPA vapor). Figure 4A , the first nozzle mechanism 220 may be a drying nozzle configured to apply a drying agent, such as isopropyl alcohol (IPA) and / or deionized water, and the second nozzle mechanism 240 may be a megasonic nozzle configured to provide deionized water and megasonic energy to the surface of the substrate during processing. In some configurations, the second nozzle mechanism 240 may also be configured to apply a cleaning chemical, a rinse agent, and / or a drying agent.

[0054] As described, cleaning, rinsing and / or drying fluids can be provided to the first and second nozzle mechanisms 220, 240 via connection 210A. The number of connections can be based on the number of nozzles in the nozzle mechanism being used and / or the number of different types of cleaning chemicals, rinsers and / or desiccants used by the first and second nozzle mechanisms 220, 240. For example, when the first and second nozzle mechanisms 220, 240 are each configured to output two different cleaning fluids, two different connections 210A can be used for each first and second nozzle mechanism 220, 240. In addition, the flow rates of the different cleaning chemicals and / or rinsers through different nozzles can be varied. For example, the flow rate of the cleaning chemicals, rinsers or desiccants from the first one in the nozzle can be different from the flow rate of the cleaning chemicals, rinsers or desiccants from the second one in the nozzle. Alternatively, the flow rate of the cleaning chemicals, rinsers or desiccants from at least one of the nozzles can change during the cleaning process, rinsing process and / or drying process.

[0055] The first and second sweep arms 210, 230 may include a coupling arrangement for securing the first and second nozzle mechanisms 220, 240 to the sweep arms, respectively. According to an embodiment, the coupling arrangement between the first and second nozzle mechanisms 220, 240 and the first and second sweep arms 210, 230 may be an industry standard coupling arrangement, and one or both of the first and second nozzle mechanisms 220, 240 may be commercially available nozzles. For example, the second nozzle mechanism 240 may be a Each nozzle mechanism 220, 240 can be easily replaced as needed depending on the desired application or for repair and / or routine maintenance.

[0056] During the cleaning process, the paths of the first and second sweep arms 210 and 230 can be arcuate paths parallel to the front surface of the substrate 105. Alternatively, paths of other shapes and / or lengths can be utilized. For example, the range of motion of the first and second sweep arms 210 and 230 can be varied. According to some embodiments, the first and second nozzle mechanisms 220 and 240, respectively coupled to the ends of the first and second sweep arms 210 and 230, can be arranged to pass through the center of the substrate 150 in an arcuate path. The positions of the first and second sweep arms 210 and 230 and / or the first and second nozzle mechanisms 220 and 240 can be adjusted to ensure that the first and second nozzle mechanisms 220 and 240 pass through the center of the rotating substrate 150 during processing. Furthermore, the nozzle mechanisms 220 and 240 can be moved relative to the corresponding first and second sweep arms 210 and 230 to vary their positions relative to the surface of the substrate 150. Furthermore, the axial distance between the first and second nozzle mechanisms 220 and 240 and the surface of the substrate 150 can be varied to facilitate the cleaning process.

[0057] The first and second nozzle mechanisms 220, 240 may include mass flow controllers to provide mass flow control of the fluid sprayed onto the substrate 150, depending on the desired cleaning, rinsing, and / or drying process. The nozzle mechanisms 220, 240 may also include an evaporator for evaporating IPA or water sprayed onto the substrate 150, depending on the desired cleaning, rinsing, and / or drying process. The nozzle mechanisms 220, 240 may also be configured to blow only air, depending on the desired cleaning process. For example, the cleaning, rinsing, and / or drying process may optionally include a cycle in which one or both of the nozzle mechanisms 220, 240 blow air to dry the support pins 208 and the grabber pins 212.

[0058] According to one embodiment, the housing 218 can cover the ICD module 200, i.e., define an interior volume 285 of the ICD module 200. Alternatively, the ICD module 200 can be "open" to the rest of the cleaning unit 106, i.e., the ICD module alternatively does not include the housing 218. In such an alternative embodiment, the face of the substrate 150 is exposed to the atmosphere (of the cleaning unit 106) while being processed within the ICD module 200.

[0059] According to embodiments having a housing 218 covering the ICD module 200, the doors 219A, 219B can be selectively opened to provide access to the interior volume 285 of the cleaning module 200 for inserting or removing the substrate 150 into or from the ICD module 200. In one or more embodiments, during cleaning processing, the doors 219A, 219B are closed to seal the ICD module 200 from the factory interface 102 and the cleaning unit 106. When both doors 219A, 219B are closed, the interior volume 285 of the ICD module 200 can be isolated from the rest of the cleaning unit 106 such that, for example, fumes, liquids, or particles generated and / or used elsewhere in the cleaning unit 106 or polishing unit 104 do not enter the ICD module 200 during the cleaning process. Similarly, any fumes or liquids used and / or generated during the cleaning process in the ICD module 200 are removed from the cleaning module 200 in a controlled manner via the primary exhaust 260 and / or the secondary exhaust 270 to prevent fumes, liquids, or particles generated and / or used during the cleaning process in the ICD module 200 from entering the factory interface 102 or elsewhere in the cleaning unit 106. The ICD module 200 is in a substrate processing configuration when both doors 219A, 219B are closed and the process rotor 202 is in the processing position with the gripper pins 212 holding the substrate 150.

[0060] The housing 218 may also include a substrate sensor 294 with which it communicates, for example, to confirm whether the substrate 150 is properly positioned within the ICD module 200. The housing may also include an ionization bar 298 or the like to prevent static charge from building up within the interior volume of the ICD module 200.

[0061] The primary exhaust 260 and / or the secondary exhaust 270 may be used to remove excess moisture and / or all fluids from the ICD module 200 during and / or after a cleaning cycle. In one embodiment, moisture flows through the drain holes 295B and into the primary exhaust 260. For example, when the baseplate 150 is rotated, the drain holes 295B are configured to ensure that moisture does not accumulate on the baseplate 150 and be removed via the primary exhaust 260. In one embodiment, one or more O-rings or other sealing members may be positioned where the primary exhaust 260 intersects the housing 218. Figure 5 In FIG. 2 , a primary exhaust 260 and a secondary exhaust 270 are shown on one side of the ICD module 200. According to an embodiment, the opposite side of the ICD module may also include a primary exhaust 260 and a secondary exhaust 270 arranged as shown in FIG. Figure 5 2. The ICD module 200 may include a second primary exhaust 260 and a second secondary exhaust 270 that are mirror images of the configuration shown in FIG. That is, the ICD module 200 may have two primary exhausts 260, one on each lateral side of the ICD module 200. Similarly, the ICD module 200 may have two secondary exhausts 270, one on each lateral side of the ICD module 200.

[0062] According to one embodiment, the door 219A may be located on the side of the housing 218 facing the factory interface 102 ( Figure 1 ), that is, at a position where the first substrate manipulator 110 can receive the substrate 150. Additionally, the door 219B can be located on a side of the housing 218 that faces the interior volume of the cleaning unit 106, that is, at a position where the second substrate manipulator 112 can insert the substrate 150 into the ICD module 200. During a substrate loading process, the door 219B is opened so that the substrate 150 can be inserted into the ICD module 200, while the door 219A is closed to isolate the factory interface 102 from the interior volume of the ICD module 200 and the cleaning unit 106. When the door 219A is closed, the door 219B is open, the process rotor 202 is in the raised position, and the grab pins 212 are in the released position, the ICD module 200 is in the substrate loading configuration.

[0063] Additionally, during the substrate unloading process, door 219A is opened so that the substrate 150 can be extracted from the ICD module 200, while door 219B is closed to continue isolating the factory interface 102 from the interior volume of the ICD module 200 and the cleaning unit 106. When door 219A is open, door 219B is closed, the processing rotor 202 is in the raised position, and the grab pins 212 are in the released position, the ICD module 200 is in the substrate unloading configuration.

[0064] Positive airflow through the interior volume 285 and the processing volume 216 can be provided by a fan / filter unit (FFU) 242. For example, the FFU 242 can be connected to the housing 218. The FFU 242 includes an air inlet 280 and a plenum 250. The air inlet 280 can include, for example, a HEPA filter and a fan. Air flows from the air inlet 280 through the plenum 250 into the interior volume 285 and the processing volume 216, and exits the primary exhaust 260 and the secondary exhaust 270.

[0065] An annular collection weir 295 may be formed beneath the outer portion of the collection rotor 204. The primary exhaust 260 is connected to the collection weir 295. An annular space 295A is defined between the outer surface of the collection rotor 204 and the inner surface of the rotor cover 206. Accordingly, air provided by the FFU 242 may also flow through the annular space 295A, into the collection weir 295, and out of the primary exhaust 260. According to embodiments, this configuration may allow for high-volume laminar air flow through the annular space 295A between the rotor cover 206 and the collection rotor 204, which may reduce the amount of residual vapor and liquid droplets generated and deposited in this area during processing, thereby reducing substrate contamination and improving the cleaning process. Additionally, any liquid that may be inadvertently introduced into the annular space 295A may be discharged from the primary exhaust 260 with the aid of the airflow through the annular space 295A.

[0066] A plurality of drain holes 295B may be formed in the base of the collection rotor 204. For example, according to an embodiment, the drain holes 295B may be formed near the inner surface 214 of the collection rotor 204. The drain holes allow fluid applied during the cleaning process of the substrate 150 to drain away from the collection rotor 204 and into the collection weir 295. According to one embodiment, the inner surface 214 of the collection rotor 204 includes a portion that is inclined inwardly from a lower portion to an upper portion relative to the vertical. This configuration can improve the drainage of fluid from the processing volume 216 due to the rotation of the collection rotor 204. According to some embodiments, the plurality of drain holes 295B are configured to enable laminar flow of air over the substrate surface and through the inner region of the collection rotor 204 and the drain holes 295B to reduce the amount of residual vapor and liquid droplets generated during processing and disposed in this region, thereby reducing substrate contamination and improving the cleaning process. Additionally, air provided by FFU 242 may also flow through processing volume 216, into discharge aperture 295B, into collection weir 295, and out of primary exhaust 260. According to embodiments, this configuration may provide a high volume of air flowing through processing volume 216, which may provide improved cleaning processes.

[0067] Additionally, according to some embodiments, the collection rotor 204 may include a rotor extension 215 extending diagonally downward and outward from a lower portion of the collection rotor 204. The rotor extension 215 ( Figure 2A ) can further improve fluid drainage from the processing volume as the collection rotor 204 rotates by drawing and directing fluid from the drainage aperture 295B. The rotor extension 215 is generally configured to extend past the outer edge of the drainage aperture 295B and past the outer diameter of the collection rotor at the level of the drainage aperture 295B.

[0068] The rotor cover 206 includes a plurality of ventilation openings 207 ( Figure 2A) and annular duct 207A for evacuating an area of the interior volume 285. Each of the plurality of vent openings 207 connects the interior volume 285 to the annular duct 207A. The secondary exhaust 270 is connected to the annular duct 207A via a channel (not shown) formed in the drain pan 296. Accordingly, air provided by the FFU 242 can flow through the vent openings 207, into the annular duct 207A of the rotor cover 206, and out of the secondary exhaust 270. According to embodiments, this configuration can provide a high volume of airflow through the perimeter of the rotor cover 206 and into the vent openings 207, which can reduce the amount of residual gases and vapors generated during processing and disposed in other areas of the ICD module 200. The residual vapors and gases may include IPA vapor, water vapor, and / or cleaning chemical vapors generated or dispensed into the interior volume 285 during processing. In some embodiments, the secondary exhaust 270 may be coupled to a purge exhaust adapted to remove residual gases and vapors, which may be important for removing vapors having airborne permissible exposure limits (PELs), lower explosion limits (LELs), and / or upper explosion limits (UELs), such as IPA. Additionally, any liquid that may be inadvertently introduced into the annular conduit 207A may be discharged from the secondary exhaust 270 with the aid of airflow through the annular conduit 207A.

[0069] The plenum 250 can be configured to control airflow within the ICD module 200 to minimize recirculation. For example, the plenum 250 can increase and / or decrease the amount of air flowing into the ICD module 200 to minimize recirculation. Recirculation of airflow can be minimized due to, for example, the configuration of the collection rotor 204, rotor cover 206, vent opening 207, annular duct 207A, collection weir 295, primary exhaust 260, secondary exhaust 270, and air inlet 280 disclosed herein.

[0070] In one embodiment, during the cleaning process, a uniform airflow across the surface of the substrate 150 is primarily generated by the primary exhaust 260 and the plenum 250. In various embodiments, the primary exhaust 260 is configured to provide a path for air to flow away from the ICD module 200 to prevent particles from reattaching to the surface of the substrate 150. As described above, air can be provided to the plenum 250 through the air inlet 280 and exhausted from the ICD module 200 through the primary exhaust 260 and the secondary exhaust 270. The plenum 250 can be a showerhead-type plenum. Furthermore, the geometry of the primary exhaust 260, the shape of the collection rotor 204, the shape of the rotor cover 206, and / or the shape of the collection weir 295 can be optimized to reduce recirculation within the ICD module 200. Reducing recirculation at least minimizes reattachment of particles and any evaporated cleaning fluid to the substrate. The geometry of the collection rotor 204, the rotor cover 206, and the collection weir 295 can define an annular volume 295, which can be optimized to minimize recirculation. Additionally, the primary exhaust 260 and the secondary exhaust 270 provide a path for cleaning fluid and flushing fluid removed from the ICD module 200, minimizing recirculation within the ICD module 200. The plenum 250 can be positioned proximate to the first and second nozzle mechanisms 220, 240, and the substrate 150 can be positioned between the plenum 250 and the primary exhaust 260.

[0071] The rotor cover 206 also includes two nozzle cups 225 ( Figure 4A ). Each of the nozzle cups 225 is configured and positioned to receive one of the nozzle mechanisms 220, 240. That is, when the nozzle mechanism 220 is not in use, such as, for example, when the ICD module is in a substrate loading or unloading configuration during transfer of substrates 150 to or from the ICD module 200, or when the current cleaning process step does not require the use of the nozzle mechanism 220, the first sweep arm motor 234 positions the first sweep arm 210 such that the corresponding first nozzle mechanism 220 is positioned in one of the nozzle cups 225. Similarly, when the nozzle mechanism 240 is not in use, such as, for example, when the ICD module is in a substrate loading or unloading configuration during transfer of substrates to or from the ICD module 200, or when the current cleaning process step does not require the use of the nozzle mechanism 240, the second sweep arm motor 235 positions the second sweep arm 230 such that the corresponding second nozzle mechanism 240 is positioned in the other of the nozzle cups 225.

[0072] Figure 4A A top perspective view of ICD module 200 is illustrated with housing 218 omitted. Figure 5The ICD module 200 is shown in a bottom perspective view, with the housing 218 also omitted. It is intended that all cleaning liquid applied during the cleaning process be contained within the collection rotor 204 and rotor cover 206 and exhausted through the primary exhaust 260 and / or secondary exhaust 270. However, due to, for example, a malfunction or defect in one or more components, cleaning liquid may inadvertently leak outside the collection rotor and rotor cover 206. Accordingly, to prevent contamination of the exterior of the ICD module 200 in the event of an inadvertent leak, a drain pan 296 is provided around the perimeter of the rotor cover 206. Figure 4A The interior surface of the drain pan 296 can be seen in FIG. Figure 5 The exterior surface of the drain pan is seen in FIG. A leak detection sensor 297 may also be positioned in the base of the drain pan 296. The leak detection sensor 297 may provide an alarm to an operator in the event that a leak is detected in the drain pan 296.

[0073] According to some embodiments, the ICD module 200 has a substantially square or rectangular footprint in the XY plane. In some embodiments, the ICD module 200 can be sized to perform cleaning processes on a 300 mm diameter substrate 150 while having a footprint of approximately 550 mm x 550 mm. In some embodiments, the longest side of the ICD module 200 can be less than approximately twice the diameter of the substrate 150. In some embodiments, the overall height of the ICD module 200 can be approximately 500 mm. In some embodiments, the overall height of the ICD module can be less than approximately one and two-thirds times the diameter of the substrate 150. Conventional cleaning modules may require a relatively large size to provide sufficient internal volume to properly ventilate the internal volume during cleaning processes. In contrast, the ICD module 200 according to embodiments disclosed herein can be relatively small to allow multiple ICD modules 200 to be stacked and / or to reduce the footprint of the cleaning unit 106. The relatively small size may be due, for example, to the high rate of airflow from the air source 280 through the ICD module 200 and out of the primary and secondary exhausts 260 and 270.

[0074] The ICD module 200 can include one or more inlet connections 292. The inlet connections 292 provide a path for providing a cleaning fluid to the ICD module 200 during a cleaning process. The cleaning fluid can be provided to, for example, the first nozzle mechanism 220, the second nozzle mechanism 240, the underside nozzle mechanism 290, and / or the fluid source 223. Additionally, the ICD module 200 can include an electrical connection 293 configured to couple to power and / or communication cables external to the ICD module 200.

[0075] Figure 6A method 600 for cleaning a substrate (e.g., substrate 150) in the ICD module 200 described above is illustrated, according to one or more embodiments. At operation 610, the ICD module 200 is placed in a first substrate transfer position. As described above, for example, the second drive motor 228 raises the process rotor 202 to a raised position and rotates the gripper pins 212 to a released position. Furthermore, for example and as described above, the door 219B (i.e., the door facing the interior volume of the cleaning unit 106) is opened, and the door 219A (i.e., the door facing the factory interface 102) remains closed. Furthermore, for example and as described above, the first and second sweep arm motors 234 and 235 control the first and second sweep arms 210 and 230, respectively, to position the first and second nozzle mechanisms 220 and 240 above the nozzle cup 225. The controller 190 can provide instructions to, for example, the second drive motor 228, the door 219A, and the first and second sweep arm motors 234 and 235 regarding placing the ICD module 200 in the first substrate loading position.

[0076] At operation 620 of method 600, a substrate 150 is received in the ICD module 200 for cleaning and drying. For example, according to embodiments such as those described above, the second substrate manipulator 112 inserts the substrate 150 through the opened door 219B, such that the substrate 150 rests on the support pins 208. After the substrate 150 has been fully inserted into the ICD module and loaded onto the support pins 208, the substrate manipulator 112 releases the substrate 150 and retracts from the ICD module 200. According to embodiments, for example, the controller 190 may provide instructions to the substrate manipulator 112 to place the substrate 150 on the support pins 208 and then retract. The controller 190 may also receive an indication, such as from the substrate sensor 294, that the substrate 150 has been properly received in the ICD module 200.

[0077] At operation 630 of method 600, the ICD module 200 and the substrate 150 held therein are placed in a substrate cleaning and drying position. For example, according to embodiments such as those described above, the door 219A is closed (and the door 219B remains closed). Additionally, for example and as described above, the second drive motor 228 lowers the process rotor 202 to a lowered position and rotates the gripping pins 212 to a gripping position to grip the substrate 150. According to embodiments, for example, the controller 190 may provide instructions to the second drive motor 228 and the door 219A regarding placing the ICD module and the substrate 150 in the substrate cleaning and drying position.

[0078] At operation 640 of method 600, the ICD module 200 performs a cleaning process on the substrate 150 held therein in the substrate cleaning and drying position. For example, according to embodiments such as those described above, the first drive motor 222 rotates the process rotor 202 and the collection rotor 204 at a predetermined rotational speed. Furthermore, as described above, the second sweep arm motor 235 rotates the second sweep arm 230 and the second nozzle mechanism 240 through a predetermined angle to sweep across the substrate 150 held on the process rotor 202 by the grab pins 212. Furthermore, as described above, the second drive motor 228 and / or the second sweep arm motor 235 can also adjust the distance in the Z direction between the second nozzle mechanism 240 and the upper surface of the substrate 150 to a predetermined distance. Furthermore, as described above, the second nozzle mechanism 240 applies a megasonic cleaning fluid to the upper surface of the substrate 150 while the substrate 150 is rotated by the process rotor 202 and while the second sweep arm 230 rotates through the predetermined angle. When the cleaning process is completed, the second sweep arm motor 235 rotates the second sweep arm 230 so that the second nozzle mechanism 240 is positioned in its corresponding nozzle cup 225. According to an embodiment, for example, the controller 190 may provide instructions related to performing a cleaning process on the substrate 150 to the first drive motor 222, the second drive motor 228, the second sweep arm motor 235, and / or the second nozzle mechanism 240.

[0079] Additionally, for example and as described above, the underside nozzle mechanism 290 applies a rinsing fluid, such as deionized water, to the underside surface of the substrate 150. According to some embodiments, the backside nozzle mechanism 290 applies the rinsing fluid to the underside surface of the substrate 150 as part of a cleaning process performed on the substrate 150 (i.e., operation 640). Alternatively, the backside nozzle mechanism 290 applies the rinsing fluid to the underside surface of the substrate 150 as part of a final rinsing and drying process performed on the substrate 150 (i.e., operation 650, described below).

[0080] At operation 650 of method 600, the ICD module 200 performs a final rinsing and drying process on the substrate 150 held therein in the substrate cleaning and drying position. For example, according to embodiments such as those described above, the first drive motor 222 continues to rotate the process rotor 202 and the collection rotor 204 at a predetermined rotational speed. Furthermore, as described above, the first sweep arm motor 234 rotates the first sweep arm 210 and the first nozzle mechanism 220 through a predetermined angle to sweep across the substrate 150 held on the process rotor 202 by the grab pins 212. Furthermore, as described above, the second drive motor 228 and / or the first sweep arm motor 234 can also adjust the distance in the Z direction between the first nozzle mechanism 220 and the upper surface of the substrate 150 to a predetermined distance. Furthermore, as described above, the first nozzle mechanism 220 applies rinsing and / or drying fluid to the upper surface of the substrate 150 while the substrate 150 is rotated by the process rotor 202 and while the first sweep arm 210 rotates through the predetermined angle. For example, applying the rinsing and / or drying fluid may include applying deionized water to the substrate 150. For example, applying the rinsing and / or drying fluid may also include applying evaporated IPA. According to some embodiments, applying the deionized water and evaporated IPA is provided simultaneously or sequentially. According to some embodiments, as the two nozzles move from the center to the edge of the substrate, the evaporated IPA is delivered to a location inboard of the location of the DI water (i.e., closer to the center of the substrate).

[0081] After a predetermined time and / or after a predetermined amount of rinsing and / or drying fluid has been applied to the substrate 150 by the first nozzle mechanism 220, the first nozzle mechanism 220 ceases applying the rinsing and / or drying fluid, and the process rotor 202 continues to rotate the substrate 150 at a predetermined rotational speed for a predetermined time. For example, when no additional fluid is applied to the substrate 150, the process rotor 202 rotates at approximately 2,000 RPM for a predetermined time. Due to the rotation of the process rotor 202 and the collection rotor 204, the fluid applied to the substrate 150 is pushed toward the inner surface 214 of the collection rotor 204 and then passes through the discharge holes 295B and into the collection weir 295. The collected fluid and air supplied from the fan / filter unit 242 are then drawn into the main exhaust 260 for exhaust processing. When the final rinsing and drying process is complete, the first sweep arm motor 234 rotates the first sweep arm 210 so that the first nozzle mechanism 220 is positioned in its corresponding nozzle cup 225. In addition, the first drive motor 222 stops rotating the processing rotor 202 and the collection rotor 204. According to an embodiment, for example, the controller 190 may provide instructions related to performing the final rinsing and drying process on the substrate 150 to the first drive motor 222, the second drive motor 228, the first sweep arm motor 234, and / or the first nozzle mechanism 220.

[0082] At operation 660, the ICD module 200 is placed in the second substrate transfer position. As described above (and similarly to the first substrate transfer position), for example, the second drive motor 228 raises the process rotor 202 to the raised position and rotates the grab pins 212 to the released position, releasing the substrate 150 from the grab pins and supporting it on the support pins 208. Furthermore, for example and as described above, door 219A (i.e., the door facing the factory interface 102) is opened, and door 219B (i.e., the door facing the interior volume of the cleaning unit 106) remains closed. This is in contrast to the first substrate transfer position, in which door 219B is open and door 219A remains closed. Furthermore, for example and as described above, the first and second sweep arm motors 234 and 235 control the first and second sweep arms 210 and 230, respectively, to position the first and second nozzle mechanisms 220 and 240 above the nozzle cup 225. The controller 190 may provide instructions to, for example, the second drive motor 228 , the door 219A, and the first and second sweep arm motors 234 , 235 regarding placement of the ICD module in the second substrate loading position.

[0083] At operation 670, the substrate 150 is transferred from the ICD module 200 to the factory interface 102. For example, according to an embodiment such as described above, the first substrate manipulator 110 grabs the substrate 150 and removes it through the opened door 219A. The controller 190 can receive sensor data from the sensing device 294 indicating that the substrate 150 has been removed from the ICD module 200 and initiate a new process in response to the sensor data.

[0084] Furthermore, the ICD module 200 can undergo additional processing during the method 600. For example, at operation 680, the ICD module can perform a post-cleaning and drying process after removing the substrate 150. For example, and as described above, at least one of the first and second sweep arm motors 234, 235 can move a corresponding one of the first and second sweep arms 210, 230 so that a corresponding one of the first and second nozzle mechanisms 220, 240 is positioned at a position corresponding to the circumferential position of the standoff pins 208 and the grabber pins 212. Furthermore, at least one of the corresponding first and second nozzle mechanisms 220, 240 can apply a drying fluid, such as air or other gas, while the first drive motor 222 rotates the process rotor 202 to dry the standoff pins 208 and the grabber pins 212.

[0085] Additionally or alternatively, an underside purge gas nozzle (not shown) may apply purge gas to the underside of the process rotor 202 to dry the process rotor 202 and push residual liquid from the underside of the process rotor 202 into the drain port 291 for discharge into the collection weir 295.

[0086] exist Figure 7A 、 Figure 7B 、 Figure 8A and Figure 8B 1 and 2 depict an alternative embodiment of an ICD module 700. When ICD module 700 has similar features to ICD module 200 described above, the same reference numerals are used in the drawings and redundant descriptions thereof are omitted. The primary difference between ICD module 700 and ICD module 200 is that ICD module 700 includes a rotor cover 706, which differs from rotor cover 206 of ICD module 200. For example, rotor cover 706 is configured to be positioned at different positions in the Z direction during, for example, cleaning, rinsing, and drying processes of substrate 150.

[0087] The rotor cover 706 includes flanges 701A, 701B, and 701C. The flanges 701A to 701C extend from the outer edge of the rotor cover 706 in the XY plane. Lifters 702A to 702C are positioned between the drip pan 296 and the respective flanges 701A to 701C. The lifters 702A to 702C support the rotor cover 706. The lifters 702A to 702C are configured to raise the rotor cover 706 to at least a lowered position (e.g., Figure 7A and Figure 8A ) and elevated positions (as shown in Figure 7B and Figure 8B ) between the moving and positioning.

[0088] One or more of the lifters 702A-702C include an actuator, such as a pneumatic cylinder, a ball screw assembly, or a linear motor, coupled to the rotor cover 706. According to one embodiment, a portion of each of the lifters 702A-702C extends below the drip pan 296. Alternatively, the lifters 702A-702C may utilize one or more other lifting mechanisms, such as, for example, a hydraulic cylinder or a direct drive lifter. Figure 8A and Figure 8B In particular, a cross section of lifter 702A is shown, which can be understood to illustrate an actuator comprising a pneumatic cylinder and to be representative of the other lifters 702B, 702C.

[0089] As shown, the lifter 702A includes a push rod 718 connected at its upper end to the flange 701A by a fastener 720. According to an embodiment, the fastener 720 (and all other fasteners and hardware exposed to the interior volume 285 and the processing volume 216) can be formed of a non-metallic material, for example, to minimize susceptibility to corrosion. The lower end of the push rod 718 can be connected to the lifter piston 710. The lifter piston 710 is slidingly positioned in the lifter cylinder 712. The lifter cylinder 712 includes a first pneumatic channel 714 below the lifter piston 710 that communicates with a portion of the lifter cylinder 712. The lifter cylinder 712 also includes a second pneumatic channel 716 above the lifter piston 710 that communicates with a portion of the lifter cylinder 712. The first and second pneumatic channels 714, 716 are connected to a pneumatic controller (not shown) that is controlled by, for example, the controller 190 to apply positive and / or negative air pressure to the first and second pneumatic channels 714, 716, thereby raising and lowering the lifter piston 710 and (via push rods 718 extending therethrough) the rotor cover 706 as needed. For example, according to an embodiment, the rotor cover 706 may be raised by approximately 50 mm in the Z direction and lowered by the same amount.

[0090] exist Figure 7A 、 Figure 7B 、 Figure 8A and Figure 8B In the embodiment of the present invention, the second sweep arm 230 includes an alternative nozzle mechanism 740. The alternative nozzle mechanism 740 can be, for example, a droplet ejection nozzle. However, the alternative nozzle mechanism 740 can be any suitable type of nozzle mechanism, such as described above in conjunction with the second nozzle mechanism 240. The alternative nozzle mechanism 740 can be connected to the second sweep arm 230 via a drip neck 750. Figure 7B and Figure 8B , the elevator supports the rotor cover 706 in a raised position while (as described above) the process rotor 202 is in a lowered position during cleaning, rinsing, and drying processes of the substrate 150. Accordingly, the drip neck 750 allows the alternative nozzle mechanism 740 to be positioned as close to the substrate 150 as desired for the cleaning and / or rinsing processes of the substrate 150 while maintaining sufficient clearance between the second sweep arm 230 and the top of the rotor cover 706.

[0091] As discussed above, the second sweep arm drive motor 235 is configured to move the second sweep arm 230 in an arcuate path parallel to the surface of the wafer 150 during the cleaning process so that the cleaning fluid output by the alternative nozzle mechanism 740 is evenly distributed over the surface of the substrate 150. The second sweep arm drive motor 235 can also be configured to move the second sweep arm 230 axially to set the distance between the alternative nozzle mechanism 740 and the surface of the substrate 150.

[0092] According to one or more embodiments, an alternative ICD module 700 (rather than ICD module 200) may be used in conjunction with the above-described method 600. For example, in addition to the above-described combination Figure 6 In addition to the specific operational steps described, the rotor cover 706 may be raised and lowered during the steps described.

[0093] For example, according to one embodiment, at operation 610 of method 600, placing the replacement ICD module 700 in the first substrate transfer position may further include controlling the elevators 702A-702C to lower the rotor cover 706 to the position indicated by the arrows. Figure 7A and Figure 8A . The controller 190 may provide instructions to, for example, the elevators 702A-702C regarding placing the replacement ICD module 700 in the first substrate loading position. In some embodiments, the controller 190 is configured to control the position of the rotor cover 706 relative to the collection rotor 204 using actuators within the elevators 702A-702C such that the rotor cover 706 is in a first position relative to the collection rotor 204 when the ICD module 700 is in the first substrate loading position ( Figure 8A ).

[0094] At operation 620 of method 600 , substrate 150 may be received in replacement ICD module 700 for cleaning and drying processes as described above.

[0095] At operation 630 of method 600, the replacement ICD module 700 and the substrate 150 held therein may be placed in the substrate cleaning and drying position. In one embodiment, placing the replacement ICD module 700 in the substrate cleaning and drying position may further include controlling the elevators 702A to 702C to raise the rotor cover 706 to the position where the rotor cover 706 is located. Figure 7B and Figure 8B . The controller 190 can provide instructions to, for example, the elevators 702A-702C regarding placing the replacement ICD module 700 in the substrate cleaning and drying position. In some embodiments, the controller 190 is configured to control the position of the rotor cover 706 relative to the collection rotor 204 using actuators within the elevators 702A-702C such that the rotor cover 706 is in a second position (e.g., a lowered position) relative to the collection rotor 204 when the process rotor 202 is positioned in the cleaning and drying position (e.g., a lowered position). Figure 8B ) for performing a substrate cleaning process on the substrate.

[0096] At operation 640 of method 600, the alternative ICD module 700 may perform a cleaning process in a substrate cleaning and drying position on the substrate 150 held therein. For example, and as described above, the second sweep arm motor 235 may rotate the second sweep arm 230 and the alternative nozzle mechanism 740 through a predetermined angle to sweep across the substrate 150 held by the grab pins 212 on the process rotor 202. Furthermore, for example, and as described above, the second drive motor 228 and / or the second sweep arm motor 235 may also adjust the distance in the Z direction between the alternative nozzle mechanism 740 and the upper surface of the substrate 150 to a predetermined distance. Furthermore, for example, as the substrate 150 is rotated by the process rotor 202 and as the second sweep arm 230 rotates through the predetermined angle, the alternative nozzle mechanism 740 may apply one or more fluids in a droplet jet stream to the upper surface of the substrate 150. When the cleaning process is complete, the second sweep arm motor 235 may rotate the second sweep arm 230 so that the alternative nozzle mechanism 740 is positioned in its corresponding nozzle cup 225. For example, according to an embodiment, the controller 190 may provide instructions to the first drive motor 222 , the second drive motor 228 , the second sweep arm motor 235 , the elevators 702A- 702C, and / or the alternative nozzle mechanism 740 regarding performing a cleaning process on the substrate 150 .

[0097] At operation 650 of method 600 , the surrogate ICD module 700 may perform a final rinse and dry process on the substrate 150 held therein in the substrate cleaning and drying position, as described above.

[0098] At operation 660, the replacement ICD module 700 may be placed in a second substrate transfer position, similar to the first substrate transfer position. For example, according to one embodiment, at operation 610 of method 600, placing the replacement ICD module 700 in the second substrate transfer position may further include controlling the elevators 702A to 702C to lower the rotor cover 706 to the position where the rotor cover 706 is located. Figure 7A and Figure 8A . The controller 190 may provide instructions to, for example, the elevators 702A-702C regarding placing the replacement ICD module 700 in the second substrate loading position. In some embodiments, the controller 190 is configured to control the position of the rotor cover 706 relative to the collection rotor 204 using actuators within the elevators 702A-702C such that the rotor cover 706 is in a first position ( ) relative to the collection rotor 204 when the ICD module 700 is in the second substrate loading position. Figure 8A ).

[0099] At operation 670, the substrate 150 can be transferred from the alternative ICD module 700 to the factory interface 102, as described above. Additionally, at operation 680, the alternative ICD module can perform a post-cleaning and drying process, as well as a drying process after removing the substrate 150. For example, the second sweep arm motor 235 can move the second sweep arm 230 so that the alternative nozzle mechanism 240 is positioned at a position corresponding to the circumferential position of the standoff pins 208 and the grabber pins 212. Furthermore, while the first drive motor 222 rotates the process rotor 202, the alternative nozzle mechanism 740 can apply a drying fluid, such as air or other gas, to dry the standoff pins 208 and the grabber pins 212.

[0100] Alternative ICD module 700 may include a splatter bar 800, such as Figure 9 . Although the splatter bar 800 is described herein in conjunction with the alternative ICD module 700, the splatter bar 800 may also be adapted for use with the above-described embodiments of the ICD module 200. According to one embodiment, the splatter bar 800 may be positioned proximate to the door 219A, i.e., proximate to the interior volume of the cleaning unit 106. Accordingly, the splatter bar 800 may apply a fluid (e.g., DI water) to the substrate 150 conveyed by the second substrate manipulator 112 into the alternative ICD module 700.

[0101] Splash bar 800 may include a vertical support 801 and a fluid applicator 802. The vertical support 801 may include one or more fluid supply lines to supply fluid to the fluid applicator 802. For example, the vertical support 801 may be in fluid communication with the inlet connection 292 to supply fluid to the fluid applicator 802. The fluid applicator 802 may be configured to apply fluid to the substrate 150 being conveyed into the replacement ICD module via a linear array of holes in its bottom. According to an embodiment, the fluid applicator 802 is configured to apply fluid to the substrate 150 using laminar flow (i.e., non-turbulent flow) to minimize splashing of the applied fluid. The fluid may be collected in the drip pan 296 and discharged via the drip pan drain port 804. Therefore, according to an embodiment, the splash bar 800 may provide improved final rinsing and drying of the substrate 150 by pre-applying a rinsing fluid to the substrate 150 before the substrate 150 is placed on the processing rotor 202.

[0102] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is to be determined by the following claims.

Claims

1. A cleaning and drying module, comprising: a processing rotor having a plurality of gripper pins configured to releasably hold a substrate, the processing rotor configured to rotate and move between a lowered position and a raised position; a plurality of sweep arms, each sweep arm having a nozzle mechanism configured to apply a fluid to the substrate; a collecting rotor configured to rotate synchronously with the processing rotor and defining a processing volume between the processing rotor and an interior volume of the collecting rotor, the collecting rotor comprising: a side wall extending above the process rotor in the lowered position, the inner surface of the side wall being inclined inwardly from a lower portion to an upper portion, a collection weir defined by a bottom portion of the collection rotor and the inner surface, the collection weir being configured to collect the fluid applied to the substrate, and a plurality of discharge holes located in the collecting weir proximate the inner surface of the sidewall, the discharge holes being configured to discharge the collected fluid; a rotor cover surrounding and extending above the sidewall of the collection rotor to define an annular volume between the rotor cover and the collection rotor, the plurality of grab pins of the process rotor extending above the rotor cover when in the raised position; and An exhaust is in communication with the exhaust aperture, the exhaust being configured to draw air from the processing volume and the annular volume through the exhaust aperture and receive the collected fluid. 2 . The cleaning and drying module of claim 1 , wherein the collecting rotor further comprises a rotor extension extending diagonally downward and outward from a lower end of the side wall, the rotor extension being located proximate to the discharge hole.

3. The cleaning and drying module of claim 1 , further comprising: a housing covering the processing rotor, the collection rotor, the rotor cover, and the sweep arm; and A fan filter unit is mounted to the housing and is configured to provide positive airflow through the processing volume, the annular volume, and the discharge aperture to the exhaust.

4. The cleaning and drying module of claim 1 , further comprising: Second exhaust device, wherein: The rotor cover includes an annular duct having a plurality of ventilation openings to provide fluid communication between an exterior surface of the rotor cover and the annular duct.

5. The cleaning and drying module of claim 1 , wherein each of the plurality of grab pins comprises a corresponding protruding element configured to contact the inner surface of the collection rotor when the processing rotor moves to the raised position, thereby moving the grab pin from a substrate grabbing position to a substrate releasing position.

6. The cleaning and drying module of claim 1, wherein: The plurality of sweep arms include a first sweep arm and a second sweep arm, The nozzle mechanism of the first sweep arm includes a megasonic nozzle configured to apply megasonic energy to the fluid applied to the substrate, and The nozzle mechanism of the second scanning arm includes a drying nozzle configured to apply isopropyl alcohol vapor to the substrate.

7. The cleaning and drying module of claim 1 , further comprising: A lower side nozzle mechanism is provided in the processing rotor and is configured to apply at least one of a cleaning fluid and a rinsing fluid to a back side of the substrate held by the grab pins.

8. The cleaning and drying module of claim 1 , further comprising: An actuator is coupled to the rotor cover and configured to position the rotor cover relative to the collection rotor.

9. A cleaning and drying module, comprising: a processing rotor having a plurality of gripper pins configured to releasably hold a substrate, the processing rotor configured to rotate and move between a lowered position and a raised position; at least one sweep arm having a nozzle mechanism configured to apply a fluid to the substrate; a collecting rotor configured to rotate synchronously with the processing rotor and defining a processing volume between the processing rotor and an interior volume of the collecting rotor, the collecting rotor comprising: a side wall extending above the process rotor in the lowered position, the inner surface of the side wall being inclined inwardly from a lower portion to an upper portion, a collection weir defined by a bottom portion of the collection rotor and the inner surface, the collection weir being configured to collect the fluid applied to the substrate, and a plurality of discharge holes located in the collection weir proximate the inner surface of the sidewall, the discharge holes being configured to discharge the collected fluid and particles from the collection weir; a rotor cover surrounding and extending above the sidewall of the collection rotor to define an annular volume between the rotor cover and the collection rotor, the plurality of grab pins of the process rotor extending above the rotor cover when in the raised position; an exhaust in communication with the exhaust aperture, the exhaust being configured to draw air from the processing volume and the annular volume through the exhaust aperture and to receive the collected fluid; and a housing covering the processing rotor, the collection rotor, the rotor cover, and the sweep arm, the housing comprising: a first door on a first side of the housing, and A second door is on a second side of the housing different from the first side.

10. The cleaning and drying module of claim 9, wherein: A controller, by using an actuator, is configured to control the position of the rotor cover relative to the collection rotor so that the rotor cover is in a first position relative to the collection rotor during a loading or unloading process and in a second position relative to the collection rotor when the processing rotor is in the lowered position for performing a substrate cleaning process on a substrate.

11. The cleaning and drying module of claim 10, further comprising: The controller is further configured to control the process rotor such that: During the loading and unloading process, the processing rotor is in the raised position, and During the substrate cleaning process, the process rotor is in at least one of the lowered position and an intermediate position between the raised position and the lowered position.

12. The cleaning and drying module of claim 11, wherein: The process rotor has a plurality of stand-off pins, During the loading and unloading process, the plurality of grab pins are located at a distance from an edge of the substrate and support the substrate on the plurality of standoff pins.

13. The cleaning and drying module of claim 9, further comprising: An actuator is coupled to the rotor cover and configured to position the rotor cover relative to the collection rotor.

14. The cleaning and drying module of claim 9, wherein the collecting rotor further comprises a rotor extension extending diagonally downward and outward from a lower end of the side wall, the rotor extension being located proximate to the discharge hole.

15. The cleaning and drying module of claim 9, further comprising: a housing covering the processing rotor, the collection rotor, the rotor cover, and the sweep arm; and A fan filter unit is mounted to the housing and is configured to provide positive airflow through the processing volume, the annular volume, and the discharge aperture to the exhaust.

16. The cleaning and drying module of claim 9, further comprising: Second exhaust device, wherein: The rotor cover includes an annular duct having a plurality of ventilation openings to provide fluid communication between an exterior surface of the rotor cover and the annular duct.

17. The cleaning and drying module of claim 9, wherein: The at least one sweep arm includes a first sweep arm and a second sweep arm, the nozzle mechanism of the first sweep arm includes a megasonic nozzle configured to apply megasonic energy to the fluid applied to the substrate, and The nozzle mechanism of the second scanning arm includes a drying nozzle configured to apply isopropyl alcohol vapor to the substrate.

18. A method for cleaning a substrate in a cleaning and drying module, the method comprising: Placing the cleaning and drying module in a first substrate transfer position, wherein: The process rotor of the cleaning and drying module is in the raised position, a plurality of gripper pins on the process rotor in a substrate release position, opening a first door on a first side of the housing, and closing a second door on a second side of the housing different from the first side; receiving a substrate on a plurality of standoff pins on the process rotor through the first door; Positioning the cleaning and drying module in a substrate cleaning and drying position, wherein: The process rotor is in a lowered position, the plurality of gripping pins are in a substrate gripping position, and closing the first and second doors; performing a cleaning process on the substrate including rotating the process rotor and the substrate gripped by the gripper pins, and applying a cleaning fluid to the substrate using a first nozzle mechanism mounted on a first sweep arm; performing a final rinsing and drying process on the substrate including rotating the process rotor and the substrate gripped by the gripper pins, and applying at least one of a rinsing fluid and a drying fluid to the substrate using a second nozzle mechanism mounted on a second sweep arm; and placing the cleaning and drying module in a second substrate transfer position, wherein: said process rotor being in said raised position, the plurality of grab pins on the process rotor are in a substrate release position and support the substrate on the standoff pins, Close the first door, and opening the second door; and Removal of the substrate is permitted through the second door.

19. The method of claim 18, wherein: The cleaning fluid comprises a megasonic actuated fluid, and The at least one flushing fluid and drying fluid comprises isopropyl alcohol vapor.

20. The method of claim 18, further comprising: After removing the substrate, a drying fluid is applied to the pick-up pins and the stand-off pins using one of the first and second nozzle mechanisms.

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