Deelectroplating reaction device and method

Abstract

The invention provides an electroplating stripping reaction device and method, and the device comprises a reaction mechanism which comprises a reaction furnace with a reaction cavity and a first screening device with a first filtering cavity, the first screening device is accommodated in the reaction cavity, and the first filtering cavity is used for accommodating a waste electroplating part; the liquid collecting mechanism is used for being communicated with the reaction cavity and collecting waste liquid in the reaction cavity, the liquid collecting mechanism comprises a liquid collector with a liquid collecting cavity and a second screening device with a second filtering cavity, the size of screen holes of the second screening device is smaller than that of screen holes of the first screening device, the second screening device is arranged in the liquid collecting cavity, and the second filtering cavity is used for recycling the deplating metal; the gas collecting mechanism is communicated with the reaction cavity and is used for collecting waste gas in the reaction cavity. The electroplating material on the surface of the waste electroplating part is removed through the deplating liquid in the reaction furnace, higher recycling value can be given to the waste-removed electroplating part, flexible and efficient recycling can be achieved, and treatment and recycling of waste generated in the deplating treatment process can be achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electroplating, and in particular relates to a stripping reaction device and method. Background Art

[0002] With the continuous advancement of the automotive manufacturing industry and the rapid development of the electronics industry, the global electroplated plastics market is expanding. The electroplated plastics market is expected to exceed US$600 million in 2022 and exceed US$1.2 billion in 2032. Acrylonitrile butadiene styrene (ABS) plastic, renowned for its excellent properties such as thermal stability, mechanical toughness, and high gloss, accounts for approximately 75% of the plastic electroplating market. However, with growing market demand, an increasing amount of ABS electroplated plastic is becoming obsolete each year. Therefore, the proper disposal of this discarded ABS electroplated plastic has become a critical issue.

[0003] The existing waste electroplated plastic treatment process generates waste, and there is currently no sustainable solution to achieve an environmentally friendly treatment of waste electroplated plastics. Summary of the Invention

[0004] The main purpose of the present invention is to provide a deplating reaction device and method, aiming to solve the technical problems in the prior art that the treatment of waste electroplated parts is not environmentally friendly and cannot achieve resource recycling.

[0005] In order to achieve the above-mentioned objectives, the present invention provides a stripping reaction device, which includes: a reaction mechanism, including a reaction furnace with a reaction chamber and a first screener with a first filter chamber, the first screener is accommodated in the reaction chamber, and the first filter chamber is used to accommodate waste electroplating parts; a liquid collecting mechanism, which is used to connect the reaction chamber and collect waste liquid in the reaction chamber, the liquid collecting mechanism includes a liquid collector with a liquid collecting chamber and a second screener with a second filter chamber, the sieve size of the second screener is smaller than the sieve size of the first screener, the second screener is arranged in the liquid collecting chamber, and the second filter chamber is used to recover the stripped metal; and a gas collecting mechanism, which is connected to the reaction chamber and is used to collect waste gas in the reaction chamber.

[0006] In an embodiment of the present invention, the reaction mechanism further includes: a shell, which is arranged outside the reaction furnace, and a vacuum protection chamber is provided between the shell and the reaction furnace; a heater, which is installed on the outer wall of the reaction furnace and is located in the vacuum protection chamber, and the heater is used to heat the reaction chamber.

[0007] In an embodiment of the present invention, the outer shell includes a bottom shell and a top cover arranged on the top of the bottom shell, the bottom shell, the reaction furnace and the top of the first screener are all open, the reaction furnace and the bottom shell are all sealedly connected to the top cover, and the reaction furnace, the bottom shell and the top cover form the vacuum protection chamber; and / or, the heater is a multi-layer heating tube surrounding the outer wall of the reaction furnace.

[0008] In an embodiment of the present invention, the top cover includes: an inner ring portion, which is sealed to the reactor; an outer ring portion, which is arranged outside the inner ring portion, the outer ring portion is sealed to the bottom shell, and the length of the inner ring portion is greater than the length of the outer ring portion.

[0009] In an embodiment of the present invention, the stripping reaction device further comprises a spray mechanism disposed on the top of the first sifter, and the spray mechanism is used for spraying and cleaning the waste electroplating parts.

[0010] In an embodiment of the present invention, the spray mechanism includes a spray pipe and a spray head. The top of the spray pipe is used to connect to a spray source, and the spray head is installed at the bottom of the spray pipe with an adjustable angle.

[0011] In an embodiment of the present invention, the stripping reaction device also includes a stirring mechanism extending into the first filter cavity, the blades of the stirring mechanism are arranged near the bottom of the first filter cavity, and the stirring mechanism is used to stir the stripping liquid, the waste electroplating parts and the stripped metal in the first filter cavity.

[0012] In an embodiment of the present invention, a guide slope and an inverted conical liquid collecting trough are provided at the bottom of the reactor. The liquid collecting trough is connected to the liquid collecting cavity through a liquid collecting pipe with a liquid collecting switch. The liquid collecting switch is used to open or close the liquid collecting pipe.

[0013] The present invention further provides a deplating reaction method, which is applied to the deplating reaction device described above, and comprises:

[0014] Placing the waste electroplating parts into the first filter cavity to perform a stripping reaction;

[0015] Starting the gas collecting mechanism to collect the waste gas in the reaction chamber;

[0016] It is determined that the waste electroplated parts in the reaction chamber have completed stripping, the liquid collecting mechanism and the reaction chamber are connected, the waste liquid is collected through the liquid collecting chamber, and the stripped metal in the waste liquid is recovered through the second sifter.

[0017] In an embodiment of the present invention, the stripping reaction method further comprises:

[0018] When it is determined that the waste liquid level in the reaction chamber is lower than a preset level, the spraying mechanism and the stirring mechanism are started until the stripped metal on the surface of the waste electroplating parts is completely removed.

[0019] Through the above technical solution, the stripping reaction device provided by the embodiment of the present invention has the following beneficial effects:

[0020] The electroplating reaction device is used for de-electroplating. The first screener of the reaction mechanism is accommodated in the reaction chamber of the reactor, the second screener of the liquid collecting mechanism is accommodated in the liquid collecting chamber of the liquid collecting mechanism, and the gas collecting mechanism is connected to the reaction chamber. The reaction mechanism and the liquid collecting mechanism can be relatively isolated first, so that the solution in the reaction mechanism cannot enter the liquid collecting mechanism, and the de-electroplating liquid is added to the reaction chamber of the reactor, and the waste electroplating parts can be added to the first screener. The waste electroplating parts are de-electroplated by the de-electroplating liquid until the reaction is complete and the de-electroplated metal on the waste electroplating parts falls off. During the reaction, the gas collecting mechanism collects and processes the waste gas in the reaction chamber to avoid the waste gas overflowing and polluting the environment. The reaction chamber and the liquid collecting mechanism can be connected so that the waste liquid after the reaction and containing the de-electroplated metal enters the liquid collecting chamber through the second screener of the liquid collecting mechanism. The second screener can collect the de-electroplated metal, which can realize the recycling and reuse of the de-electroplated metal. The liquid collecting chamber of the liquid collecting mechanism can collect the waste liquid, so that the de-electroplating reaction device can continuously de-electroplating the waste electroplating parts. The present invention removes the electroplating material from the surface of the waste electroplated parts through the stripping liquid in the reaction furnace, and separates the waste electroplated parts and the stripped metal through the sieve holes of the first and second screeners, which can give the waste electroplated parts a higher reuse value and enable flexible and efficient recycling. In addition, the gas collection mechanism can concentrate the waste gas during the reaction process, and the liquid collector can collect the waste liquid, which not only improves the physical properties of the waste electroplated parts, but also realizes the treatment and reuse of the waste generated during the stripping process. This comprehensive method helps to minimize the adverse effects on the environment and at the same time achieve a more sustainable and environmentally friendly stripping process.

[0021] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are used to provide an understanding of the present invention and constitute a part of the specification. Together with the following detailed description, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings:

[0023] Figure 1 is a schematic cross-sectional structural diagram of a stripping reaction device according to one embodiment of the present invention;

[0024] Figure 2 is a schematic cross-sectional view of a portion of the structure of a stripping reaction device according to one embodiment of the present invention;

[0025] Figure 32 is a schematic structural diagram of a first screener of a stripping reaction device according to an embodiment of the present invention;

[0026] Figure 4 2 is a schematic structural diagram of a second screener of a stripping reaction device according to an embodiment of the present invention;

[0027] Figure 5 2. It is a schematic structural diagram of a spray mechanism of a stripping reaction device according to one embodiment of the present invention;

[0028] Figure 6 Schematic diagram of the stirring mechanism structure of a stripping reaction device according to one embodiment of the present invention.

[0029] Description of Reference Numerals

[0030] Label Name Label Name

[0031] 100 Stripping plating reaction device 6 shell

[0032] 1 Reactor 61 bottom shell

[0033] 11 Reaction chamber 62 top cover

[0034] 12 Inner ring of guide slope 621

[0035] 13 Outer ring of liquid collecting tank 622

[0036] 2 First sifter 7 Vacuum protection chamber

[0037] 21 First filter chamber 8 heater

[0038] 22 First clamping claw 9 Spray mechanism

[0039] 3 Liquid collector 91 Spray pipe

[0040] 31 Liquid collecting chamber 92 Nozzle

[0041] 32 Liquid collecting pipe 10 Stirring mechanism

[0042] 4 Second sifter 101 stirring rod

[0043] 41 Second filter chamber 102 blade

[0044] 42 Second claw 20 Base

[0045] 5 Gas gathering mechanism DETAILED DESCRIPTION

[0046] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention and are not intended to limit the present invention.

[0047] The stripping reaction device according to the present invention will be described below with reference to the accompanying drawings.

[0048] like Figures 1 to 6 As shown, in an embodiment of the present invention, the stripping reaction device 100 includes a reaction mechanism, a liquid collecting mechanism and a gas collecting mechanism 5. The reaction mechanism includes a reactor 1 with a reaction chamber 11 and a first sifter 2 with a first filter chamber 21. The first sifter 2 is accommodated in the reaction chamber 11. The first filter chamber 21 is used to accommodate waste electroplating parts; the liquid collecting mechanism is used to connect the reaction chamber 11 and collect waste liquid in the reaction chamber 11. The liquid collecting mechanism includes a liquid collecting chamber 3 with a liquid collecting chamber 31 and a second sifter 4 with a second filter chamber 41. The sieve size of the second sieve 4 is smaller than the sieve size of the first sieve 2. The second sieve 4 is arranged in the liquid collecting chamber 31. The second filter chamber 41 is used to recover the stripped metal; the gas collecting mechanism 5 is located at the top of the reactor 1. The gas collecting mechanism 5 is connected to the reaction chamber 11 and is used to collect waste gas in the reaction chamber 11.

[0049] As can be understood, the stripping reaction device 100 is primarily used for stripping plating waste plastics and is primarily used to recover stripped metals, such as chromium, from the waste electroplated parts, thereby facilitating the recycling and reuse of the stripped metals. The gas collection mechanism 5 in this embodiment may include an exhaust duct and a negative pressure gas collection member connected to the exhaust duct. The negative pressure gas collection member can generate negative pressure to cause the exhaust duct to collect exhaust gas within the reaction chamber 11. A first claw 22 may be provided on the top of the first screener 2. The first claw 22 is L-shaped as a whole. A stepped groove may be provided at the cross bar of the first claw 22. The stepped groove may be positioned and connected with the reactor 1 to facilitate the installation of the first screener 2. The first screener 2 is columnar as a whole. The two first claws 22 may be arranged opposite to each other along the radial direction of the first screener 2. In other embodiments, the number of first claws 22 may be set according to actual usage requirements, and the side walls and bottom walls of the first screener 2 are provided with sieve holes. To ensure that the stripped metal flows out of the first screener 2, the sieve holes completely cover the side walls and bottom walls of the first screener 2.

[0050] It should be noted that if Figure 3 and Figure 4As shown, a second claw 42 may be provided on the top of the second sifter 4, and the second claw 42 is an L-shaped claw, which can be overlapped on the side wall of the liquid collector 3 through the second claw 42 to connect the liquid collector 3 and the second sifter 4. The second sifter 4 is columnar as a whole, and the two second claws 42 can be arranged radially opposite to each other in the second sifter 4; in other embodiments, the number of second claws 42 can be set according to actual use requirements. To ensure that the second sifter 4 can recover the stripped metal, the side wall of the second sifter 4 is a closed side wall, the sieve hole of the second sifter 4 is not opened in the closed side wall, and there are no holes on the closed side wall, and a screening area and a recovery area are provided on the bottom wall of the second sifter 4, the sieve hole of the second sifter 4 is provided in the screening area, and the recovery area is a completely closed flat plate, and the recovery area is not provided with sieve holes, which can facilitate the recovery of the stripped metal. In one embodiment, the screening area is cross-shaped as a whole, and multiple recovery areas are spaced apart on the bottom wall of the second screener 4 to ensure the recovery rate of the stripped metal and prevent the stripped metal from flowing out of the screen holes of the second screener 4.

[0051] In one embodiment, the bottom wall of the reactor 1 may be provided with a base 20, and the base 20 may be provided with a plurality of legs. The bottom of the reactor 1 is raised by the base 20, and the bottom of the reaction chamber 11 may be connected to the liquid collecting mechanism. The top height of the liquid collecting mechanism is lower than the height of the base 20, which can facilitate the layout and installation of the de-plating reaction device 100 and improve the collection efficiency of the waste liquid by the liquid collecting mechanism.

[0052] In the electroplating reaction device of this embodiment, the first screener 2 of the reaction mechanism is accommodated in the reaction chamber 11 of the reactor 1, the second screener 4 of the liquid collecting mechanism is accommodated in the liquid collecting chamber 31 of the liquid collecting mechanism 3, and the gas collecting mechanism 5 is connected to the reaction chamber 11. The reaction mechanism and the liquid collecting mechanism can be relatively isolated first, so that the solution in the reaction mechanism cannot enter the liquid collecting mechanism, and the deplating liquid is added to the reaction chamber 11 in the reactor 1. The waste electroplated parts can be added to the first screener 2, and the waste electroplated parts are deplated by the deplating liquid until the reaction is complete and the deplated metal on the waste electroplated parts falls off. The deplated metal can be removed. The waste electroplating parts enter the reaction chamber 11 through the sieve holes of the first sieve 2. The waste electroplating parts cannot pass through the sieve holes of the first sieve 2. During the reaction, the gas collecting mechanism 5 collects and processes the waste gas in the reaction chamber 11 to prevent the waste gas from overflowing and polluting the environment. The reaction chamber 11 and the liquid collecting mechanism can be connected so that the waste liquid after the reaction and containing the stripped metal enters the liquid collecting chamber 31 through the second sieve 4 of the liquid collecting mechanism. The second sieve 4 can collect the stripped metal, which can realize the recycling and reuse of the stripped metal. The liquid collecting chamber 31 of the liquid collecting mechanism 3 can collect the waste liquid, so that the de-electroplating reaction device 100 can continuously de-electroplating the waste electroplating parts. This embodiment removes the electroplating material on the surface of the waste electroplating parts through the de-electroplating liquid in the reactor 1, separates the waste electroplating parts and the stripped metal through the sieve holes of the first sieve 2 and the second sieve 4, and can give the waste electroplating parts a higher reuse value, and can be recycled flexibly and efficiently. Furthermore, the gas collection mechanism 5 can concentrate the waste gases from the reaction process, and the liquid collector 3 can collect the waste liquid, thereby not only improving the physical properties of the waste electroplated parts, but also allowing for the treatment and reuse of waste generated during the stripping process. This comprehensive approach helps minimize adverse environmental impacts while achieving a more sustainable and environmentally friendly stripping process.

[0053] like Figure 1 and Figure 2As shown, the reaction mechanism also includes a housing 6 and a heater 8. The housing 6 is disposed outside the reaction furnace 1, and a vacuum protective chamber 7 is disposed between the housing 6 and the reaction furnace 1. The heater 8 is mounted on the outer wall of the reaction furnace 1 and located within the vacuum protective chamber 7. The heater 8 is used to heat the reaction chamber 11. In this embodiment, the reaction furnace 1 is a heat conductor. The heater 8, mounted on the outer wall of the reaction furnace 1, can heat the deplating liquid in the reaction chamber 11 through the reaction furnace 1. After the deplating liquid is added to the reaction furnace 1, the heater 8 can heat the reaction furnace 1 until the deplating liquid reaches a specified temperature, at which time the cleaned waste electroplated parts can be added to the reaction furnace 1. This ensures that the deplating liquid strips the waste electroplated parts at a specified temperature with high stripping efficiency. The vacuum protective chamber 7 disposed between the housing 6 and the reaction furnace 1 not only reduces heat loss in the reaction chamber 11 and maintains a constant temperature within the reaction furnace 1, but also prevents operators from being burned by contact with the housing 6. This improves the deplating efficiency of the deplating reaction device 100 while ensuring the safety of the deplating reaction device 100.

[0054] It should be noted that a convex surface may be provided on the outer side of the bottom wall of the reactor 1 in this embodiment, thereby reducing the contact area between the reactor 1 and the bottom of the outer shell 6 and increasing the area of the vacuum protection chamber 7, thereby preventing the temperature from being transmitted outward through the outer shell 6 and improving the protection effect of the vacuum protection chamber 7. The convex surface may be arc-shaped and provided in the middle of the bottom wall of the reactor 1. The specific proportion of the convex surface relative to the bottom wall of the reactor 1 may be set according to actual usage.

[0055] like Figure 2 As shown, the housing 6 includes a bottom shell 61 and a top cover 62 disposed on top of the bottom shell 61. The tops of the bottom shell 61, the reactor 1, and the first sifter 2 are all open. The reactor 1, the bottom shell 61, and the top cover 62 are all sealed together, and the reactor 1, the bottom shell 61, and the top cover 62 enclose a vacuum protection chamber 7. The heater 8 is a multi-layer heating pipe surrounding the outer wall of the reactor 1. The housing 6 in this embodiment is designed to be split into upper and lower parts, which facilitates the assembly of the stripping reaction device 100. After the reactor 1 is placed in the bottom shell 61, the first sifter 2 can be placed in the reaction chamber 11. Finally, the top cover 62 can be used to seal the vacuum protection chamber 7 between the reactor 1 and the bottom shell 61. The heater 8 is a multi-layer heating pipe surrounding the outer wall of the reactor 1. The multi-layer heating pipe surrounds the outer wall of the reactor 1 in sequence along the height direction of the reactor 1. The projected surface of the heater 8 can completely cover the sieve surface of the first sifter 2, ensuring uniform heating of the stripping reaction and greatly improving the stripping efficiency.

[0056] Specifically, the top cover 62 includes an inner ring portion 621 and an outer ring portion 622. The inner ring portion 621 is sealed to the reactor 1. The outer ring portion 622 is disposed outside the inner ring portion 621 and is sealed to the bottom shell 61. The length of the inner ring portion 621 is greater than that of the outer ring portion 622. In this embodiment, the outer ring portion 622 is disposed outside the inner ring portion 621, while the inner ring portion 621 is disposed outside the reactor 1. The top portion of the reactor 1 extends into the inner ring portion 621, ensuring the sealing of the vacuum protection chamber 7. The outer ring portion 622 is sealed to the bottom shell 61 via a sealing ring. In this embodiment, the top cover 62 is sealed to the reactor 1 via the inner ring portion 621, and the outer ring portion 622 is sealed to the bottom shell 61. This results in a simple structure and facilitates assembly.

[0057] In one embodiment, the stripping reaction device 100 further includes a spray mechanism 9 disposed on top of the first sifter 2. The spray mechanism 9 is used to spray and clean the waste electroplated parts. The spray mechanism 9 in this embodiment can perform high-pressure spraying to remove chromium remaining on the waste electroplated parts and ensure the collection of the stripped metal.

[0058] like Figure 5 As shown, the spray mechanism 9 includes a spray pipe 91 and a nozzle 92. The top of the spray pipe 91 is connected to a spray source, and the nozzle 92 is mounted at the bottom of the spray pipe 91 at an adjustable angle. In this embodiment, the nozzle 92 can rotate relative to the spray pipe 91 under the action of high-pressure water. When the spray mechanism 9 sprays the waste electroplated parts, the nozzle 92 rotates relative to the spray pipe 91 under the action of high-pressure water. Simultaneously, the stirring mechanism 10 stirs the multiple waste electroplated parts within the first filter chamber 21, which can quickly remove the stripped metal from the surface of the waste electroplated parts and improve the efficiency of the stripping process.

[0059] It should be noted that the stripping reaction device 100 also includes a stirring mechanism 10 extending into the first filter cavity 21. The blades 102 of the stirring mechanism 10 are arranged near the bottom of the first filter cavity 21. The blades 102 are arranged in a position close to the middle and lower part of the first filter cavity 21, which can ensure that the blades 102 fully stir the multiple waste electroplating parts. The stirring mechanism 10 is used to stir the stripping solution, waste electroplating parts and stripped metal in the first filter cavity 21. The stirring mechanism 10 in this embodiment can be driven by a driving member such as a motor. The stirring mechanism 10 may include a vertically arranged stirring rod 101 and a blade 102 arranged at the bottom of the stirring rod 101. The three blades 102 are arranged at intervals along the circumference of the stirring rod 101, and the three blades 102 are relatively inclined and angled with each other, which has a better stirring effect and can ensure uniform stirring. During the stripping reaction, the stirring mechanism 10 is used to stir, which can ensure that the waste electroplated parts and the stripping liquid are mixed evenly, and at the same time, the stripped metal on the surface of the waste electroplated parts can be crushed, which facilitates the stripped metal to separate from the first sifter 2. When the spraying mechanism 9 sprays the waste electroplated parts, the stirring mechanism 10 stirs the waste electroplated parts, which can enable the spraying mechanism 9 to fully spray the waste electroplated parts, thereby avoiding the situation where the stripped metal remains on the waste electroplated parts.

[0060] In one embodiment, the top cover 62 can be provided as a separate body. A charging door can be provided in the middle of the top cover 62 corresponding to the position of the first sifter 2. The inner ring portion 621 is provided outside the charging door. The charging door can be opened to add materials. Opening the charging door does not affect the vacuum level of the vacuum protection chamber 7. This facilitates the charging and unloading of materials in the stripping reaction device 100 and improves the ease of use of the stripping reaction device 100. The gas collection mechanism 5, the spray mechanism 9, and the stirring mechanism 10 are all installed on the charging door.

[0061] In an embodiment of the present invention, a guide slope 12 and an inverted conical liquid collecting trough 13 are provided at the bottom of the reactor 1. The liquid collecting trough 13 is connected to the liquid collecting chamber 31 via a liquid collecting pipe 32 with a liquid collecting switch. The liquid collecting switch is used to open or close the liquid collecting pipe 32. The liquid collecting switch in this embodiment can be a solenoid valve. After the stripping reaction in the reaction chamber 11 is complete, the liquid collecting switch can be opened to connect the liquid collecting pipe 32 with the liquid collecting chamber 31. The guide slope 12 is inclined downward from the side wall toward the liquid collecting chamber 31, which can prevent the solution in the reactor 1 from being unable to fully flow out, thereby facilitating the subsequent stripping operation of the waste electroplated parts.

[0062] The present invention further provides a deplating reaction method, which is applied to the deplating reaction device 100 described above. The deplating reaction method includes:

[0063] The waste electroplating parts are placed in the first filter cavity 21 to undergo a stripping reaction;

[0064] Start the gas collecting mechanism 5 to collect the waste gas in the reaction chamber 11;

[0065] After confirming that the waste electroplated parts in the reaction chamber 11 have completed stripping, the liquid collecting mechanism and the reaction chamber 11 are connected, the waste liquid is collected through the liquid collecting chamber 31 , and the stripped metal in the waste liquid is recovered through the second sifter 4 .

[0066] In the present embodiment, during the stripping process of the waste electroplating parts, the reaction mechanism and the liquid collecting mechanism are isolated, and the waste gas in the reaction chamber 11 is collected by the gas collecting mechanism 5, which can ensure the environmental friendliness of the stripping reaction process and determine the preset reaction time of the waste electroplating parts. When the stripping is completed, the reaction mechanism and the liquid collecting mechanism can be connected, and the waste liquid can be collected by the liquid collecting chamber 31. The stripped metal in the waste liquid is recovered by the second sifter 4, the stripped metal is screened out by the first sifter 2, and the stripped metal is collected by the second sifter 4. The stripped metal can be effectively recovered, and the recycling and reuse of the stripped metal can be realized. The waste liquid is collected by the liquid collecting chamber 31, which can facilitate the subsequent stripping operation of the reaction mechanism.

[0067] In one embodiment, the stripping reaction method further comprises:

[0068] When it is determined that the waste liquid level in the reaction chamber 11 is lower than the preset level, the spraying mechanism 9 and the stirring mechanism 10 are started until the stripped metal on the surface of the waste electroplated parts is completely removed.

[0069] In this embodiment, the liquid collecting mechanism and the reaction chamber 11 are connected, the waste liquid is collected through the liquid collecting chamber 31, and the stripped metal in the waste liquid is recovered by the second screener 4. The waste liquid level in the reaction chamber 11 is obtained in real time. When it is determined that the waste liquid level in the reaction chamber 11 is lower than the preset level, the spraying mechanism 9 and the stirring mechanism 10 are started. The spraying mechanism 9 and the stirring mechanism 10 cooperate with each other to clean the surface of the reaction chamber 11 and the waste electroplated parts. At the same time, the liquid collecting mechanism and the reaction chamber 11 are kept connected, and the spray liquid is collected by the liquid collecting mechanism to ensure that no stripped metal remains on the surface of the reaction chamber 11 and the waste electroplated parts.

[0070] It should be noted that waste electroplating parts can be cleaned to remove dirt;

[0071] Adding a deplating solution into the reaction furnace 1 and heating the reaction furnace 1 by the heater 8;

[0072] When the temperature of the stripping solution in the reaction chamber 11 reaches the specified temperature, the cleaned waste electroplating parts can be added to the reaction furnace 1;

[0073] The stripping solution and the waste electroplating parts are stirred using a stirring mechanism 10 to ensure that the stripping solution and the waste electroplating parts are fully mixed;

[0074] After the stripping liquid and the waste electroplated parts have fully reacted, the reaction mechanism and the liquid collecting mechanism can be connected, and the stirring mechanism 10 can be turned off. The stripping liquid, the stripped metal and the waste electroplated parts are screened by the first screener 2 and the second screener 4. The waste electroplated parts after stripping remain in the first screener 2, while the stripped metal is collected by the second screener 4 of the liquid collecting mechanism.

[0075] During the stripping reaction, the spray mechanism is kept closed and the stirring mechanism is started. After the stripping reaction is completed, the stirring mechanism is turned off. When it is determined that the waste liquid level in the reaction chamber 11 is lower than the preset level, spraying treatment is carried out, and the spray mechanism 9 and the stirring mechanism 10 are started until the stripped metal on the surface of the waste electroplating parts and the reactor 1 is completely removed. During the spraying process, the stripping waste liquid is collected by the liquid collecting mechanism. During the stripping reaction, waste liquid collection and spraying process, the gas collecting mechanism 5 absorbs the waste gas generated in the reaction process through negative pressure, and the waste gas is transmitted to the negative pressure gas collecting part through the exhaust pipe, ensuring effective gas treatment, which can achieve environmental protection while also achieving high-efficiency stripping.

[0076] In one embodiment, the stripping reaction device 100 further includes a controller. A temperature sensor and a liquid level sensor are provided in the reaction furnace 1. The gas collecting mechanism 5, the temperature sensor, the spraying mechanism 9, the stirring mechanism 10, and the current collecting switch are all electrically connected to the controller. The waste electroplating parts are cleaned until the dirt on the surface of the waste electroplating parts is removed. The stripping liquid is added to the reaction furnace 1. The controller detects through the temperature sensor that the heater 8 heats the reaction furnace 1 to a specified temperature (45°C). The controller can control the feeding component to put the cleaned waste electroplating parts into the reaction furnace 1 and control the stirring mechanism 10 to stir at a preset speed (500r / min). The controller When it is detected that the waste electroplating parts have fully reacted for a preset time (0.5h), the collecting switch can be controlled to open, and the stripping liquid after the reaction is collected by the liquid collecting mechanism. When it is determined that the waste liquid level in the reaction chamber 11 is lower than the preset level, the controller can control the spraying mechanism 9 to rinse the inner wall of the reactor 1 and the waste electroplating parts. The rinsing liquid also flows into the liquid collecting mechanism until the stripping metal on the surface of the waste electroplating parts is completely removed. The spraying mechanism 9 and the stirring mechanism 10 are closed. When it is detected that the heater 8 heats the reactor 1 to a specified temperature (45°C), the controller can open the gas collecting mechanism 5 to recover and subsequently treat the waste gas generated during the reaction process.

[0077] In another embodiment, the waste electroplating parts are cleaned until the dirt on the surface of the waste electroplating parts is removed, the deplating liquid is added to the reactor 1, the reactor 1 is heated to 45°C using the heater 8, the cleaned waste electroplating parts are put into the reactor 1, and the stirring mechanism 10 stirs at a speed of 500r / min. After sufficient reaction for 1 hour, the deplated metal is collected, and the deplating liquid is recovered through the liquid collecting mechanism until the waste liquid level in the reaction chamber 11 is lower than the preset liquid level. The surface of the waste electroplating parts and the reactor 1 is rinsed by the spraying mechanism 9 and the stirring mechanism 10, and the rinsing liquid also flows into the liquid collecting mechanism. The waste gas generated during the reaction process is recovered by the gas collecting mechanism 5 for subsequent treatment.

[0078] In another embodiment, the waste electroplating parts are cleaned until the dirt on the surface of the waste electroplating parts is removed, the deplating liquid is added to the reactor 1, the reactor 1 is heated to 65°C using the heater 8, the cleaned waste electroplating parts are put into the reactor 1, and the stirring mechanism 10 stirs at a speed of 500r / min. After sufficient reaction for 0.5h, the deplated metal is collected, and the deplating liquid is recovered through the liquid collecting mechanism until the waste liquid level in the reaction chamber 11 is lower than the preset level. The surface of the waste electroplating parts and the reactor 1 is rinsed by the spraying mechanism 9 and the stirring mechanism 10, and the rinsing liquid also flows into the liquid collecting mechanism. The waste gas generated during the reaction process is recovered by the gas collecting mechanism 5 for subsequent treatment.

[0079] In other embodiments, the waste electroplating parts are cleaned until the dirt on the surface of the waste electroplating parts is removed, the deplating liquid is added to the reactor 1, the reactor 1 is heated to 65°C using the heater 8, the cleaned waste electroplating parts are put into the reactor 1, and the stirring mechanism 10 stirs at a speed of 500r / min. After sufficient reaction for 1 hour, the deplated metal is collected, and the deplating liquid is recovered through the liquid collecting mechanism until the waste liquid level in the reaction chamber 11 is lower than the preset liquid level. The surface of the waste electroplating parts and the reactor 1 is rinsed by the spraying mechanism 9 and the stirring mechanism 10, and the rinsing liquid also flows into the liquid collecting mechanism. The waste gas generated during the reaction process is recovered by the gas collecting mechanism 5 for subsequent treatment.

[0080] In one embodiment, the waste electroplating parts are cleaned until the dirt on the surface of the waste electroplating parts is removed, a stripping liquid is added to the reactor 1, the reactor 1 is heated to 65°C using a heater 8, the cleaned waste electroplating parts are put into the reactor 1, and the stirring mechanism 10 stirs at a speed of 500r / min. After sufficient reaction for 0.25h, the stripped metal is collected, and the stripping liquid is recovered through a liquid collecting mechanism until the waste liquid level in the reaction chamber 11 is lower than a preset level. The surface of the waste electroplating parts and the reactor 1 is rinsed by the spraying mechanism 9 and the stirring mechanism 10, and the rinsing liquid also flows into the liquid collecting mechanism. The waste gas generated during the reaction process is recovered by the gas collecting mechanism 5 for subsequent treatment.

[0081] In another embodiment, the waste electroplating parts are cleaned until the dirt on the surface of the waste electroplating parts is removed, the deplating liquid is added to the reactor 1, the reactor 1 is heated to 45°C using the heater 8, the cleaned waste electroplating parts are put into the reactor 1, and the stirring mechanism 10 stirs at a speed of 500r / min. After sufficient reaction for 0.25h, the deplated metal is collected, and the deplating liquid is recovered through the liquid collecting mechanism until the waste liquid level in the reaction chamber 11 is lower than the preset liquid level. The surface of the waste electroplating parts and the reactor 1 is rinsed by the spraying mechanism 9 and the stirring mechanism 10, and the rinsing liquid also flows into the liquid collecting mechanism. The waste gas generated during the reaction process is recovered by the gas collecting mechanism 5 for subsequent treatment.

[0082] In the description of the present invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0083] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0084] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0085] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A stripping reaction device, characterized in that: The stripping reaction device (100) comprises: A reaction mechanism comprises a reaction furnace (1) with a reaction chamber (11) and a first sifter (2) with a first filter chamber (21), wherein the first sifter (2) is accommodated in the reaction chamber (11), and the first filter chamber (21) is used for accommodating waste electroplating parts; A liquid collecting mechanism, used for communicating with the reaction chamber (11) and collecting waste liquid in the reaction chamber (11), the liquid collecting mechanism comprising a liquid collecting device (3) with a liquid collecting chamber (31) and a second sieve (4) with a second filter chamber (41), the sieve hole size of the second sieve (4) being smaller than the sieve hole size of the first sieve (2), the second sieve (4) being arranged in the liquid collecting chamber (31), and the second filter chamber (41) being used for recovering stripped metal; The gas collecting mechanism (5) is connected to the reaction chamber (11) and is used to collect waste gas in the reaction chamber (11).

2. The stripping reaction device according to claim 1, characterized in that: The reaction mechanism further comprises: A housing (6) is arranged outside the reaction furnace (1), and a vacuum protection chamber (7) is provided between the housing (6) and the reaction furnace (1); A heater (8) is installed on the outer wall of the reaction furnace (1) and is located in the vacuum protection chamber (7). The heater (8) is used to heat the reaction chamber (11).

3. The stripping reaction device according to claim 2, characterized in that: The housing (6) comprises a bottom shell (61) and a top cover (62) arranged on the top of the bottom shell (61); the bottom shell (61), the reaction furnace (1) and the top of the first sifter (2) are all open; the reaction furnace (1), the bottom shell (61) and the top cover (62) are all sealed and connected to each other; and the reaction furnace (1), the bottom shell (61) and the top cover (62) enclose the vacuum protection chamber (7); and / or, The heater (8) is a multi-layer heating tube surrounding the outer wall of the reaction furnace (1).

4. The stripping reaction device according to claim 3, characterized in that: The top cover (62) comprises: The inner ring portion (621) is sealed and connected to the reaction furnace (1); The outer ring portion (622) is arranged outside the inner ring portion (621), the outer ring portion (622) and the bottom shell (61) are sealed, and the length of the inner ring portion (621) is greater than the length of the outer ring portion (622).

5. The stripping reaction device according to any one of claims 1 to 4, characterized in that: The stripping reaction device (100) further comprises a spray mechanism (9) arranged on the top of the first sifter (2), and the spray mechanism (9) is used for spraying and cleaning the waste electroplating parts.

6. The stripping reaction device according to claim 5, characterized in that: The spray mechanism (9) comprises a spray pipe (91) and a spray head (92); the top of the spray pipe (91) is used to connect to a spray source; the spray head (92) is installed at the bottom of the spray pipe (91) in an angle-adjustable manner.

7. The stripping reaction device according to any one of claims 1 to 4, characterized in that: The deplating reaction device (100) further comprises a stirring mechanism (10) extending into the first filter cavity (21), wherein the blades (102) of the stirring mechanism (10) are arranged close to the bottom of the first filter cavity (21), and the stirring mechanism (10) is used to stir the deplating liquid, the waste electroplating parts and the deplated metal in the first filter cavity (21).

8. The stripping reaction device according to any one of claims 1 to 4, characterized in that: The bottom of the reaction furnace (1) is provided with a flow guide slope (12) and an inverted conical liquid collecting trough (13); the liquid collecting trough (13) is connected to the liquid collecting cavity (31) via a liquid collecting pipe (32) with a liquid collecting switch; the liquid collecting switch is used to open or close the liquid collecting pipe (32).

9. A method for stripping a plating reaction, characterized in that: The stripping reaction method is applied to the stripping reaction device (100) according to any one of claims 1 to 8, and the stripping reaction method comprises: Placing the waste electroplating parts into a first filter cavity (21) to perform a stripping reaction; Starting the gas collecting mechanism (5) to collect the waste gas in the reaction chamber (11) through the gas collecting mechanism (5); Determining that the waste electroplated parts in the reaction chamber (11) have completed stripping, connecting the liquid collecting mechanism and the reaction chamber (11), collecting the waste liquid through the liquid collecting chamber (31), and recovering the stripped metal in the waste liquid through the second sifter (4).

10. The stripping reaction method according to claim 9, characterized in that: The stripping reaction method further comprises: When it is determined that the waste liquid level in the reaction chamber (11) is lower than a preset level, the spraying mechanism (9) and the stirring mechanism (10) are started until the stripped metal on the surface of the waste electroplated parts is completely removed.

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