IC carrier plate line scanning marking method and related equipment

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to an IC carrier plate line scanning marking method and related equipment, and the method comprises the steps: carrying out the defect detection of an IC carrier plate based on an initial detection point and a first detection rule if a mother board does not meet a preset detection requirement; if the defective IC support plate is detected, obtaining a target coordinate, and marking the defective IC support plate based on the target coordinate; if marking is completed, continuing to perform defect detection on the remaining IC carrier plates based on the first detection rule; if the mother board meets the preset detection requirement, performing defect detection on all the IC carrier boards one by one based on a second detection rule; if the defective IC carrier plate is detected, obtaining a target coordinate, and storing the target coordinate; if all the IC carrier plates are detected, all the target coordinates are sent to a marking laser head; and based on all the target coordinates, controlling a marking laser head to mark the defective IC carrier plate. According to the invention, the efficiency of carrying out line scanning detection on the mother board can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to an IC substrate line scanning marking method and related equipment. Background Art

[0002] In the semiconductor packaging industry, IC substrates serve as a critical connection between chips and printed circuit boards, and their quality directly impacts the performance and reliability of electronic products. Therefore, during the IC substrate manufacturing process, defect detection is essential. Defective IC substrates are locally irradiated with high-energy-density lasers to vaporize the surface material or induce a color-changing chemical reaction, leaving a permanent mark for subsequent screening and processing. Currently, as semiconductor manufacturing technology advances toward higher precision and smaller size, IC substrate defect detection and marking face numerous challenges.

[0003] Currently, the mainstream IC substrate inspection methods in the industry still generally use fixed inspection processes, which lack the ability to adapt to differences in substrate quality and cannot better select more suitable inspection methods based on the actual conditions of different IC substrates, thus easily leading to problems such as low inspection efficiency or insufficient inspection accuracy. Summary of the Invention

[0004] In order to help improve the adaptability of the detection method to the quality differences of IC substrates, a more suitable detection method is selected to perform line scan detection on the IC substrate, thereby helping to improve the detection efficiency. This application provides an IC substrate line scan marking method and related equipment.

[0005] In the first aspect, the present application provides an IC substrate line scanning marking method, which adopts the following technical solutions: A line scanning marking method for an IC substrate, comprising: Determine whether the motherboard meets the preset testing requirements; If the motherboard does not meet the preset inspection requirements, performing defect inspection on the IC carrier based on the initial inspection point and the first inspection rule; If a defective IC carrier is detected, obtaining the target coordinates of the defective IC carrier on the motherboard; Sending the target coordinates to a marking laser head, and marking the defective IC carrier based on the target coordinates; If marking is completed, continue to perform defect detection on the remaining IC substrates based on the first detection rule; If the motherboard meets the preset inspection requirements, then based on the second inspection rule, perform defect inspection on all the IC carriers one by one; If a defective IC carrier is detected, obtaining the target coordinates of the defective IC carrier on the motherboard and saving the target coordinates; Determining whether all IC carriers have been inspected; If all the IC carriers have been inspected, all the target coordinates are sent to the marking laser head; Based on all the target coordinates, the marking laser head is controlled to mark the defective IC carrier.

[0006] By adopting the above technical solution, when the motherboard does not meet the preset detection requirements, the IC carrier is inspected for defects according to the first detection rule, that is, whenever a defective IC carrier is detected, the target coordinates of the defective IC carrier are obtained, and the defective IC carrier is immediately marked according to the target coordinates. After the marking is completed, the defect detection of the next IC carrier is continued; when the motherboard meets the preset detection requirements, all IC carriers are inspected for defects one by one based on the second detection rule. When a defective IC carrier is detected, the target coordinates are sent to the marking laser head. The defective IC carrier is marked only after all IC carriers on the motherboard have been inspected.

[0007] By classifying motherboards according to preset inspection requirements, dynamic switching of inspection strategies based on the actual conditions of the IC substrates is achieved, which helps to improve the adaptability to the quality differences of IC substrates, and thus helps to improve inspection efficiency while maintaining high inspection accuracy.

[0008] Optionally, determining whether the motherboard meets preset detection requirements includes: Obtain the batch information of the target IC substrate; Based on the batch information, determining whether the target IC substrate is a substrate from a new batch; If the target IC carrier is not the carrier of the new batch, obtaining the average number of defects of a single motherboard corresponding to the IC carrier of the current batch based on the batch information; If the average number of defects exceeds a first number threshold, determining that the motherboard meets the preset inspection requirement; If the average defect quantity does not exceed the first quantity threshold, it is determined that the motherboard does not meet the preset inspection requirement.

[0009] Optionally, after determining whether the target IC substrate is a substrate from a new batch based on the batch information, the method further includes: Obtain a first rated quantity of IC carrier boards corresponding to a single motherboard; Based on the batch information, the number of motherboards in the current batch is obtained; Obtaining a target quantity of the IC substrates based on the first rated quantity and the quantity of the motherboards in the current batch; Obtaining the total number of defects and determining whether the total number of defects is equal to the target number; If the total number of defects is equal to the target number, obtaining the number of detected motherboards; If the detected number is less than a second number threshold, it is determined that the motherboard meets the preset detection requirement.

[0010] Optionally, controlling the marking laser head to mark the defective IC carrier based on all the target coordinates includes: Based on all the target coordinates, obtaining optional movement paths; Based on the optional moving paths, obtaining a target moving path; Based on the target moving path, the marking laser head is controlled to mark the defective IC carrier.

[0011] Optionally, acquiring a target moving path based on the optional moving path includes: Obtaining a distribution heat map corresponding to the motherboard; Dividing the thermal distribution map into a plurality of grid areas; Calculating the grid density of different grid areas respectively; constructing a density matrix based on the grid density; The density matrix is input into a preset target algorithm, and a target moving path is output.

[0012] Optionally, also include: Obtaining target defect quantities of defective IC carriers corresponding to different motherboards, and sending the target defect quantities to the unloading suction gripper; Classifying the different motherboards based on the target defect quantity and generating a classification result; Based on the classification result, the blanking suction and grasping are controlled to pack the motherboards.

[0013] Optionally, after obtaining the target defect counts of defective IC carriers corresponding to different motherboards and sending the target defect counts to the blanking suction gripper, the method further includes: If the target defect quantity is not obtained, obtaining the number of inspections of the motherboard; If the number of detections is greater than 1, the motherboard is marked as a motherboard to be manually reviewed; Get the number of master boards to be manually reviewed; Based on the number of motherboards to be reviewed and the number of motherboards in the current batch, a ratio of motherboards to be reviewed is obtained; If the proportion of the motherboards to be manually reviewed does not exceed a third threshold value, re-inspecting the motherboards to be manually reviewed based on the target inspection scheme and re-obtaining the target defect quantity; If the proportion to be reviewed exceeds the third quantity threshold, the current batch of motherboards is re-inspected based on the target detection scheme, and the target defect quantity is re-obtained.

[0014] In a second aspect, the present application also discloses an IC substrate line scanning marking system, which adopts the following technical solutions: An IC substrate line scanning marking system, comprising: The first judgment module is used to judge whether the motherboard meets the preset detection requirements; a first detection module, configured to perform defect detection on the IC carrier based on an initial detection point and a first detection rule if the motherboard does not meet the preset detection requirements; a first acquisition module, configured to acquire target coordinates of the defective IC carrier on the motherboard if a defective IC carrier is detected; a first marking module, configured to send the target coordinates to a marking laser head and mark the defective IC carrier based on the target coordinates; A first detection module, if marking is completed, the first detection module is used to continue to perform defect detection on the remaining IC substrates based on the first detection rule; a second detection module, configured to perform defect detection on all the IC carriers one by one based on a second detection rule if the motherboard meets the preset detection requirements; a second acquisition module, configured to acquire the target coordinates of the defective IC carrier on the motherboard if a defective IC carrier is detected, and to save the target coordinates; A second judgment module is used to judge whether the IC carrier has been fully inspected; A coordinate sending module, which is used to send all the target coordinates to the marking laser head if all the IC carriers have been detected; The second marking module is used to control the marking laser head to mark the defective IC carrier based on all the target coordinates.

[0015] By adopting the above technical solution, when the motherboard does not meet the preset detection requirements, the IC carrier is inspected for defects according to the first detection rule, that is, whenever a defective IC carrier is detected, the target coordinates of the defective IC carrier are obtained, and the defective IC carrier is immediately marked according to the target coordinates. After the marking is completed, the defect detection of the next IC carrier is continued; when the motherboard meets the preset detection requirements, all IC carriers are inspected for defects one by one based on the second detection rule. When a defective IC carrier is detected, the target coordinates are sent to the marking laser head. The defective IC carrier is marked only after all IC carriers on the motherboard have been inspected.

[0016] By classifying motherboards according to preset inspection requirements, dynamic switching of inspection strategies based on the actual conditions of the IC substrates is achieved, which helps to improve the adaptability to the quality differences of IC substrates, and thus helps to improve inspection efficiency while maintaining high inspection accuracy.

[0017] In a third aspect, the present application provides a computer device that adopts the following technical solution: An intelligent terminal comprises a memory and a processor, wherein the memory is used to store a computer program that can be run on the processor, and when the processor loads the computer program, the method of the first aspect is executed.

[0018] By adopting the above technical solution, a computer program is generated based on the method of the first aspect and stored in a memory to be loaded and executed by a processor, thereby making an intelligent terminal based on the memory and the processor, which is convenient for users to use.

[0019] In a fourth aspect, the present application provides a computer-readable storage medium, which adopts the following technical solution: A computer-readable storage medium stores a computer program, and when the computer program is loaded by a processor, the method of the first aspect is executed.

[0020] By adopting the above technical solution, a computer program is generated based on the method of the first aspect and stored in a computer-readable storage medium so as to be loaded and executed by a processor. The computer-readable storage medium facilitates the readability and storage of the computer program.

[0021] In summary, this application has the following beneficial technical effects: By classifying motherboards according to preset inspection requirements, dynamic switching of inspection strategies based on the actual conditions of the IC substrates is achieved, which helps to improve the adaptability to the quality differences of IC substrates, and thus helps to improve inspection efficiency while maintaining high inspection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1This is a main flow chart of a line scanning marking method for an IC substrate according to an embodiment of the present application; Figure 2 is a flowchart of steps S201 to S205; Figure 3 is a flowchart of steps S301 to S306; Figure 4 is a flowchart of steps S401 to S403; Figure 5 is a flowchart of steps S501 to S505; Figure 6 is a flowchart of steps S601 to S603; Figure 7 is a flowchart of steps S701 to S706; Figure 8 This is a module diagram of an IC substrate line scanning marking system according to an embodiment of the present application.

[0023] Description of reference numerals: 1. First judgment module; 2. First detection module; 3. First acquisition module; 4. First marking module; 5. Second detection module; 6. Second acquisition module; 7. Second judgment module; 8. Coordinate sending module; 9. Second marking module. DETAILED DESCRIPTION

[0024] In a first aspect, the present application discloses a line scanning marking method for an IC substrate.

[0025] Reference Figure 1 , a line scanning marking method for an IC substrate, comprising steps S101 to S110: Step S101: Determine whether the motherboard meets preset detection requirements.

[0026] Specifically, in this embodiment, the motherboard is a carrier board set consisting of all IC carrier boards. One motherboard includes several IC carrier boards of the same model. The preset detection requirements are pre-set standards for distinguishing detection methods.

[0027] Step S102: If the motherboard does not meet the preset inspection requirements, defect inspection is performed on the IC substrate based on the initial inspection point and the first inspection rule.

[0028] Specifically, the initial detection point is the point where detection starts first. In this embodiment, the IC carrier on the motherboard can be inspected for defects in a specified order, for example, from left to right or from right to left. If inspected from left to right, the first IC carrier on the left corresponding to the motherboard is used as the initial detection point; the first detection rule is the pre-set first type of detection rule, which indicates that when a defective IC carrier is detected, the defective IC carrier is immediately marked.

[0029] Step S103: If a defective IC carrier is detected, the target coordinates of the defective IC carrier on the motherboard are obtained.

[0030] Specifically, in this embodiment, the target coordinates refer to a set of coordinate values on the motherboard used to uniquely identify the specific location of the defective IC carrier, usually expressed in a two-dimensional coordinate system, including X-axis and Y-axis coordinates. In this embodiment, a fixed corner of the motherboard (such as the upper left corner or the lower left corner) is generally used as the reference point of the coordinate system.

[0031] Step S104: sending the target coordinates to a marking laser head, and marking the defective IC carrier based on the target coordinates.

[0032] Specifically, in this embodiment, after the target coordinates are sent to the marking laser head, the workstation is controlled to move so that the target coordinates move to the position of the marking laser head.

[0033] Step S105: If the marking is completed, continue to perform defect detection on the remaining IC substrates based on the first detection rule.

[0034] Specifically, in this embodiment, after the marking is completed, the line scan station is controlled to move to the bottom of the line scan camera to continue to detect whether the next IC substrate has defects.

[0035] Step S106: If the motherboard meets the preset inspection requirements, then defect inspection is performed on all IC carriers one by one based on the second inspection rule.

[0036] Specifically, in this embodiment, the second detection rule is a pre-set second type of detection rule, which indicates that when a defective IC carrier is detected, the target position of the defective IC carrier is first saved, and defect detection is continued on the next IC carrier until all IC carriers are inspected. The workstation is then controlled to move to the marking laser head position, and finally all defective IC carriers are marked in turn.

[0037] Step S107: If a defective IC carrier is detected, the target coordinates of the defective IC carrier on the motherboard are obtained and saved.

[0038] Step S108: Determine whether all IC substrates have been inspected.

[0039] Step S109: If all IC carriers have been inspected, all target coordinates are sent to the marking laser head.

[0040] Step S110: Based on all target coordinates, control the marking laser head to mark the defective IC substrate.

[0041] The IC carrier line scan marking method provided in this embodiment performs defect detection on the IC carrier according to the first detection rule when the motherboard does not meet the preset detection requirements. That is, whenever a defective IC carrier is detected, the target coordinates of the defective IC carrier are obtained, and the defective IC carrier is immediately marked according to the target coordinates. After the marking is completed, the defect detection of the next IC carrier is continued; when the motherboard meets the preset detection requirements, all IC carriers are detected one by one based on the second detection rule. When a defective IC carrier is detected, the target coordinates are sent to the marking laser head. The defective IC carrier is not marked until all IC carriers on the motherboard have been fully detected.

[0042] By classifying motherboards according to preset inspection requirements, dynamic switching of inspection strategies based on the actual conditions of the IC substrates is achieved, which helps to improve the adaptability to the quality differences of IC substrates, and thus helps to improve inspection efficiency while maintaining high inspection accuracy.

[0043] Reference Figure 2 In one implementation of this embodiment, step S101 of determining whether the motherboard meets the preset detection requirements includes steps S201 to S205: Step S201: Acquire batch information of a target IC substrate.

[0044] Specifically, in this embodiment, the target IC carrier is the IC carrier currently being inspected, and the batch information is information related to the batch corresponding to the target IC carrier, including the number of all IC carriers in this batch, the number of IC carriers contained in the current motherboard, and the model information of the IC carriers in this batch, etc.

[0045] Step S202: Based on the batch information, determine whether the target IC substrate is a substrate from a new batch.

[0046] Specifically, in this embodiment, the new batch of IC substrates may be products of a completely new type that is completely different from other IC substrates previously scanned, or may be products of a different type from the last IC substrate inspected.

[0047] Step S203: If the target IC substrate is not a substrate from a new batch, the average number of defects of a single motherboard corresponding to the IC substrates from the current batch is obtained based on the batch information.

[0048] Specifically, in this embodiment, the average number of defects is the average number of defective IC carriers corresponding to the motherboards corresponding to the current batch of IC carriers.

[0049] Step S204: If the average number of defects exceeds a first threshold, it is determined that the motherboard meets a preset inspection requirement.

[0050] Specifically, in this embodiment, the first quantity threshold is a preset criterion for determining whether the average defect quantity is too large.

[0051] Step S205: If the average defect quantity does not exceed the first quantity threshold, it is determined that the motherboard does not meet the preset inspection requirement.

[0052] The IC substrate line scanning marking method provided in this embodiment first obtains the batch information corresponding to the target IC substrate, and then determines whether the target IC substrate is a new batch substrate based on the batch information. If not, it means that the target IC substrate and the IC substrate included in the previous motherboard are from the same batch of substrates. Therefore, the average number of defects of a single motherboard corresponding to the batch of substrates is obtained, and it is determined whether the average number of defects exceeds a first number threshold. If it exceeds the threshold, it means that the average number of defects is too large. If the first detection rule is used to perform defect detection on the current batch of IC substrates, a lot of time will be wasted. It is more appropriate to use the second inspection rule to perform defect detection on them. Therefore, it is determined that the motherboard meets the preset detection requirements.

[0053] Reference Figure 3 In one implementation of this embodiment, after determining whether the target IC substrate is a substrate from a new batch based on the batch information in step S202, the process further includes steps S301 to S306: Step S301: Obtain a first rated quantity of IC carriers corresponding to a single motherboard.

[0054] Specifically, the first rated quantity is the rated quantity of IC carriers provided on each motherboard.

[0055] Step S302: Based on the batch information, the number of motherboards in the current batch is obtained.

[0056] Specifically, in this embodiment, the number of motherboards in the current batch is the total number of motherboards composed of the IC carriers in the current batch.

[0057] Step S303: obtaining a target quantity of IC substrates based on the first rated quantity and the quantity of motherboards in the current batch.

[0058] Specifically, in this embodiment, the target quantity is a criterion for determining whether the number of defective IC carriers is excessive. In this embodiment, the target quantity can be directly set to a certain value based on actual conditions and user needs, or it can be set based on the first rated quantity and the number of motherboards in the current batch. For example, the target quantity is the product of the first rated quantity and the number of motherboards in the current batch multiplied by a certain percentage, for example, the target quantity = the first rated quantity × the number of motherboards in the current batch × 5%.

[0059] Step S304: Obtain the total number of defects and determine whether the total number of defects is equal to the target number.

[0060] Specifically, in this embodiment, the total number of defects is the total number of all defective IC substrates detected in the current batch of IC substrates from the start of detection to the current time point.

[0061] Step S305: If the total number of defects is equal to the target number, the number of inspected motherboards is obtained.

[0062] Specifically, in this embodiment, the inspected quantity refers to the quantity of motherboards consisting of IC carriers of the current batch that have been inspected.

[0063] Step S306: If the number of detected motherboards is less than a second threshold, it is determined that the motherboard meets the preset detection requirement.

[0064] Specifically, in this embodiment, the second quantity threshold is a pre-set criterion for determining whether the detected quantity corresponding to the target quantity is excessive.

[0065] The IC substrate line scanning marking method provided in this embodiment calculates a target number based on a first rated number and the number of motherboards in the current batch, and when the target number is equal to the total number of defects, obtains the number of detected motherboards, and determines whether the detected number is less than a second number threshold. If it is less than, it means that the detected number is small, that is, the number of defective IC substrates corresponding to a single motherboard is large. Therefore, in order to improve detection efficiency, it is determined that the motherboard meets the preset detection requirements.

[0066] Reference Figure 4 In one implementation of this embodiment, step S110 controls the marking laser head to mark the defective IC substrate based on all target coordinates, including steps S401 to S403: Step S401: Based on all target coordinates, obtain optional moving paths.

[0067] Specifically, in this embodiment, the optional moving path is a selectable moving path.

[0068] Step S402: Based on the optional moving paths, a target moving path is obtained.

[0069] Specifically, the target moving path is the moving path finally selected. In this embodiment, the target moving path may be a moving path with the shortest moving distance.

[0070] Step S403: Based on the target moving path, control the marking laser head to mark the defective IC carrier.

[0071] Specifically, in this embodiment, the marking laser head is controlled to mark defective IC carriers one by one according to the target moving path.

[0072] The IC substrate line scanning marking method provided in this embodiment first obtains all optional movement paths, then selects the target movement path with the closest distance, and finally marks the defective IC substrates in sequence according to the target movement path, which helps to avoid unnecessary movement and thus helps to improve marking efficiency.

[0073] Reference Figure 5 In one implementation of this embodiment, step S402 acquires the target moving path based on the optional moving path, including steps S501 to S505: Step S501: Obtain a distribution heat map corresponding to the motherboard.

[0074] Specifically, a distribution heatmap is a visualization tool that uses color depth to intuitively display the density of data distribution in space or across regions. It is often used to demonstrate the concentration and distribution patterns of data points within a two-dimensional plane. In this embodiment, it primarily collects the target coordinates of each defective IC substrate on a motherboard, divides the motherboard plane into several grid regions, and uses different colors (such as red for high density and blue for low density) to represent the density of defective IC substrates in each region. This creates a heatmap effect, thereby visually demonstrating the spatial distribution characteristics of defective IC substrates on the substrate. In this embodiment, the darker the color of a region, the greater the number of defective IC substrates in that region, and the more concentrated the marking demand.

[0075] Step S502: Divide the thermal distribution map into several grid areas.

[0076] Step S503: Calculate the grid density of different grid areas respectively.

[0077] Specifically, in this embodiment, for each grid unit, relevant indicators such as the number of target coordinates falling therein may be counted, and the counted number may be used as the density value of the grid.

[0078] Step S504: constructing a density matrix based on the grid density.

[0079] Specifically, the density matrix is a tool that quantitatively expresses data density in matrix form, and is used to structurally describe the numerical distribution characteristics within a spatial region. In this embodiment, the density matrix is the key intermediate link connecting the defect distribution heat map and the marking path optimization. Its core function is to convert the visualized thermal distribution into a computable numerical model; each element in the matrix corresponds to an area in space (such as a grid in a heat map), and the element value represents the defect density of the area (such as the number of defective IC substrates per unit area).

[0080] Step S505: Input the density matrix into a preset target algorithm and output the target moving path.

[0081] Specifically, in this embodiment, the preset target algorithm is a pre-set algorithm, and a clustering algorithm such as DBSCAN+TSP can be selected. First, based on the density matrix, the DBSCAN algorithm is used to divide the high-density grid into several "defect clusters" (such as Cluster A and Cluster B), each corresponding to an area on the carrier where defects are concentrated. The distances between clusters are then calculated, and the order in which clusters are processed is determined according to the "proximity principle" (for example, processing the cluster closest to the current laser head first). Finally, for the defect coordinates within each cluster, the Traveling Salesman Problem (TSP) algorithm is used to calculate the shortest traversal path (such as a greedy algorithm or 2-opt optimization).

[0082] The IC substrate line scanning marking method provided in this embodiment first obtains a distribution heat map, then divides the distribution heat map into several grid areas, and calculates the grid density of different grid areas respectively, and then constructs a density matrix based on the grid density. Finally, the density matrix is input into a preset target algorithm and the target movement path is output.

[0083] Reference Figure 6 In one implementation of this embodiment, steps S601 to S603 are further included: Step S601: Obtain target defect quantities of defective IC carriers corresponding to different motherboards, and send the target defect quantities to the unloading suction gripper.

[0084] Specifically, in this embodiment, the target defect quantity is the quantity of defective IC carriers on different motherboards.

[0085] Step S602: classifying different motherboards based on the target defect quantity and generating classification results.

[0086] Specifically, in this embodiment, different motherboards are classified according to the target defect quantities corresponding to the defective IC carriers corresponding to different motherboards, that is, motherboards with the same target defect quantity are classified into one category.

[0087] Step S603: Based on the classification result, the blanking suction and grasping are controlled to pack the motherboards.

[0088] Specifically, in this embodiment, motherboards with the same classification results (the same target quantity) are placed in the same unloading bin by unloading suction and grabbing.

[0089] The IC substrate line scanning marking method provided in this embodiment obtains the target defect number of defective IC substrates on different motherboards, classifies the motherboards according to the target defect number, and finally controls the unloading suction and grasping to package the motherboards according to the classification results.

[0090] Reference Figure 7 In one implementation of this embodiment, after obtaining the target defect counts of defective IC carriers corresponding to different motherboards in step S601 and sending the target defect counts to the unloading suction gripper, steps S701 to S706 are also included: Step S701: If the target defect quantity is not obtained, the number of inspection times of the motherboard is obtained.

[0091] Specifically, the number of inspections refers to the number of times the motherboard is inspected. In this embodiment, even if there are multiple IC carriers on the motherboard and each IC carrier is inspected for defects, the number of inspections of the motherboard can only be counted as once.

[0092] Step S702: If the number of detections is greater than 1, the motherboard is marked as a motherboard to be manually reviewed.

[0093] Specifically, if the number of detections is greater than 1, it indicates that the motherboard is a faulty motherboard, for example, it needs to be rechecked or retested due to reasons such as failure to obtain the target defect number; in this embodiment, the motherboard to be manually reviewed is a motherboard waiting for manual review.

[0094] Step S703: Obtain the number of motherboards to be manually reviewed.

[0095] Specifically, in this embodiment, the number to be reviewed is the number of motherboards to be manually reviewed.

[0096] Step S704: Based on the number of motherboards to be reviewed and the number of the motherboards in the current batch, obtain the proportion of motherboards to be reviewed.

[0097] Specifically, in this embodiment, the ratio to be reviewed is the percentage of the number of motherboards to be manually reviewed corresponding to the number of motherboards to be manually reviewed to the number of motherboards in the current batch. Ratio to be reviewed = number to be reviewed / number of motherboards in the current batch × 100%.

[0098] Step S705: If the proportion to be reviewed does not exceed the third quantity threshold, the motherboard to be manually reviewed is re-inspected based on the target inspection solution, and the target defect quantity is re-obtained.

[0099] Specifically, in this embodiment, the third quantity threshold is a pre-set criterion for determining whether the proportion to be reviewed is too large; and the target detection scheme is the scheme of finally selecting line scanning of the IC substrate.

[0100] Step S706: If the proportion to be reviewed exceeds the third quantity threshold, re-inspect the current batch of motherboards based on the target inspection solution, and re-obtain the target defect quantity.

[0101] In the IC carrier line scanning marking method provided in this embodiment, if the target defect number is not obtained, the motherboard cannot be classified according to the target defect number. Therefore, the number of inspections of the motherboard is further obtained. When the number of inspections is greater than 1, it indicates that the motherboard is a faulty carrier and requires manual review. Therefore, it is directly marked as a motherboard to be manually reviewed. The number to be reviewed is further obtained, and the proportion to be reviewed is obtained based on the number to be reviewed and the number of motherboards in the current batch. If the proportion to be reviewed does not exceed the third number threshold, it means that the proportion to be reviewed is relatively low, that is, the proportion of motherboards to be manually reviewed in all motherboards is low, and the impact on the inspection data corresponding to the motherboards in the current batch is small. Therefore, it is only necessary to re-inspect the motherboards to be manually reviewed and re-obtain the target defect number corresponding to the motherboards to be manually reviewed. If the proportion to be reviewed exceeds the third number threshold, it means that the proportion to be reviewed is relatively high, that is, the proportion of motherboards to be manually reviewed in all motherboards is high, and the impact on the inspection data corresponding to the motherboards in the current batch is large. Therefore, it is necessary to re-inspect the motherboards in the current batch and re-obtain the target defect number corresponding to the motherboards in the current batch.

[0102] In a second aspect, the present application also discloses an IC substrate line scanning marking system.

[0103] Reference Figure 8 , an IC substrate line scanning marking system, comprising: The first judgment module is used to judge whether the motherboard meets the preset detection requirements; a first detection module, configured to perform defect detection on the IC carrier based on an initial detection point and a first detection rule if the motherboard does not meet the preset detection requirements; a first acquisition module, configured to acquire target coordinates of the defective IC carrier on the motherboard if a defective IC carrier is detected; a first marking module, configured to send the target coordinates to a marking laser head and mark the defective IC carrier based on the target coordinates; A first detection module, if marking is completed, the first detection module is used to continue to perform defect detection on the remaining IC substrates based on the first detection rule; a second detection module, configured to perform defect detection on all the IC carriers one by one based on a second detection rule if the motherboard meets the preset detection requirements; a second acquisition module, configured to acquire the target coordinates of the defective IC carrier on the motherboard if a defective IC carrier is detected, and to save the target coordinates; A second judgment module is used to judge whether the IC carrier has been fully inspected; A coordinate sending module, which is used to send all the target coordinates to the marking laser head if all the IC carriers have been detected; The second marking module is used to control the marking laser head to mark the defective IC carrier based on all the target coordinates.

[0104] On the third aspect, an embodiment of the present application discloses an intelligent terminal, including a memory and a processor, wherein the memory is used to store a computer program that can be run on the processor. When the processor loads the computer program, it executes an IC substrate line scanning marking method of the above embodiment.

[0105] In a fourth aspect, an embodiment of the present application discloses a computer-readable storage medium, and a computer program is stored in the computer-readable storage medium, wherein when the computer program is loaded by a processor, an IC substrate line scanning marking method of the above embodiment is executed.

[0106] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A line scanning marking method for IC substrates, characterized in that: include: Determine whether the motherboard meets the preset testing requirements; If the motherboard does not meet the preset inspection requirements, performing defect inspection on the IC carrier based on the initial inspection point and the first inspection rule; If a defective IC carrier is detected, obtaining the target coordinates of the defective IC carrier on the motherboard; Sending the target coordinates to a marking laser head, and marking the defective IC carrier based on the target coordinates; If marking is completed, continue to perform defect detection on the remaining IC substrates based on the first detection rule; If the motherboard meets the preset inspection requirements, then based on the second inspection rule, perform defect inspection on all the IC carriers one by one; If a defective IC carrier is detected, obtaining the target coordinates of the defective IC carrier on the motherboard and saving the target coordinates; Determining whether all IC carriers have been inspected; If all the IC carriers have been inspected, all the target coordinates are sent to the marking laser head; Based on all the target coordinates, the marking laser head is controlled to mark the defective IC carrier.

2. The IC substrate line scanning marking method according to claim 1, characterized in that: Determining whether the motherboard meets the preset detection requirements includes: Obtain the batch information of the target IC substrate; Based on the batch information, determining whether the target IC substrate is a substrate from a new batch; If the target IC carrier is not the carrier of the new batch, obtaining the average number of defects of a single motherboard corresponding to the IC carrier of the current batch based on the batch information; If the average number of defects exceeds a first number threshold, determining that the motherboard meets the preset inspection requirement; If the average defect quantity does not exceed the first quantity threshold, it is determined that the motherboard does not meet the preset inspection requirement.

3. The IC substrate line scanning marking method according to claim 2, characterized in that: After determining whether the target IC substrate is a substrate from a new batch based on the batch information, the method further includes: Obtain a first rated quantity of IC carrier boards corresponding to a single motherboard; Based on the batch information, the number of motherboards in the current batch is obtained; Obtaining a target quantity of the IC substrates based on the first rated quantity and the quantity of the motherboards in the current batch; Obtaining the total number of defects and determining whether the total number of defects is equal to the target number; If the total number of defects is equal to the target number, obtaining the number of detected motherboards; If the detected number is less than a second number threshold, it is determined that the motherboard meets the preset detection requirement.

4. The IC substrate line scanning marking method according to claim 1, characterized in that: The controlling the marking laser head to mark the defective IC substrate based on all the target coordinates includes: Based on all the target coordinates, obtaining optional movement paths; Based on the optional moving paths, obtaining a target moving path; Based on the target moving path, the marking laser head is controlled to mark the defective IC carrier.

5. The IC substrate line scanning marking method according to claim 4, characterized in that: The acquiring of a target moving path based on the optional moving path includes: Obtaining a distribution heat map corresponding to the motherboard; Dividing the thermal distribution map into a plurality of grid areas; Calculating the grid density of different grid areas respectively; constructing a density matrix based on the grid density; The density matrix is input into a preset target algorithm, and a target moving path is output.

6. The IC substrate line scanning marking method according to claim 1, characterized in that: Also includes: Obtaining target defect quantities of defective IC carriers corresponding to different motherboards, and sending the target defect quantities to the unloading suction gripper; Classifying the different motherboards based on the target defect quantity and generating a classification result; Based on the classification result, the blanking suction and grasping are controlled to pack the motherboards.

7. The IC substrate line scanning marking method according to claim 6, characterized in that: After obtaining the target defect quantity of the defective IC carriers corresponding to the different motherboards and sending the target defect quantity to the blanking suction gripper, the method further includes: If the target defect quantity is not obtained, obtaining the number of inspections of the motherboard; If the number of detections is greater than 1, the motherboard is marked as a motherboard to be manually reviewed; Get the number of master boards to be manually reviewed; Based on the number of motherboards to be reviewed and the number of motherboards in the current batch, a ratio of motherboards to be reviewed is obtained; If the proportion of the motherboards to be manually reviewed does not exceed a third threshold value, re-inspecting the motherboards to be manually reviewed based on the target inspection scheme and re-obtaining the target defect quantity; If the proportion to be reviewed exceeds the third quantity threshold, the current batch of motherboards is re-inspected based on the target detection scheme, and the target defect quantity is re-obtained.

8. An IC substrate line scanning marking system, characterized in that: include: The first judgment module is used to judge whether the motherboard meets the preset detection requirements; a first detection module, configured to perform defect detection on the IC carrier based on an initial detection point and a first detection rule if the motherboard does not meet the preset detection requirements; a first acquisition module, configured to acquire target coordinates of the defective IC carrier on the motherboard if a defective IC carrier is detected; a first marking module, configured to send the target coordinates to a marking laser head and mark the defective IC carrier based on the target coordinates; A first detection module, if marking is completed, the first detection module is used to continue to perform defect detection on the remaining IC substrates based on the first detection rule; a second detection module, configured to perform defect detection on all the IC carriers one by one based on a second detection rule if the motherboard meets the preset detection requirements; a second acquisition module, configured to acquire the target coordinates of the defective IC carrier on the motherboard if a defective IC carrier is detected, and to save the target coordinates; A second judgment module is used to judge whether the IC carrier has been fully inspected; A coordinate sending module, which is used to send all the target coordinates to the marking laser head if all the IC carriers have been detected; The second marking module is used to control the marking laser head to mark the defective IC carrier based on all the target coordinates.

9. An intelligent terminal, comprising a memory and a processor, characterized in that: The memory is used to store a computer program that can be run on the processor, and when the processor loads the computer program, it executes the method according to any one of claims 1 to 7.

10. A computer-readable storage medium storing a computer program, wherein: When the computer program is loaded into a processor, the method according to any one of claims 1 to 7 is executed.

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