Compensation method of multi-head engraving and milling machine and related equipment

Abstract

The invention provides a multi-head engraving and milling machine compensation method which comprises the following steps: selecting a reference processing unit from a plurality of processing units, and determining a calibration coordinate of a rotary table rotation center of the reference processing unit as a reference coordinate; detecting the rotation center of each rotary table through a probe to obtain the current coordinate of each rotation center; on the basis of the reference coordinates and the current coordinates of all the rotating centers, compensation values of all the tool bit assemblies or all the rotary table assemblies in the moving direction are determined; on the basis of the compensation value, each tool bit assembly or turntable assembly is controlled to perform position adjustment in the moving direction of the moving mechanism; and after the positions of all the tool bit assemblies or the rotary table assemblies are adjusted, machining is started. The method can solve the problems that in the application process of a multi-head multi-rotating-shaft engraving and milling machine in an existing method, multiple products cannot be machined at the same time at a time, and the working efficiency of product machining is reduced.

Description

Technical Field

[0001] The present invention relates to the field of detection technology, and in particular to a compensation method for a multi-head precision engraving machine and related equipment. Background Art

[0002] In actual product processing applications, existing technologies experience certain errors between heads due to machine assembly errors, component errors, and turntable rotation errors. Consequently, errors exist between multiple heads during a single process, making them unable to meet the requirements for high product consistency. Therefore, a task scheduling method is urgently needed to address the problem that existing methods, such as multi-head, multi-spindle precision engraving machines, cannot process multiple products simultaneously, thus reducing product processing efficiency. Summary of the Invention

[0003] The embodiment of the present invention provides a compensation method for a multi-head precision engraving machine, which aims to solve the problem that the existing method cannot process multiple products at the same time during the application of the multi-head multi-rotating axis precision engraving machine, thereby reducing the work efficiency of product processing. The present invention detects the rotation center of each turntable by a probe to obtain the current coordinates of each rotation center, and determines the compensation value of each cutter head assembly or turntable assembly along the moving direction based on the reference coordinates and the current coordinates of each rotation center, and uses the compensation value to control the position adjustment of each cutter head assembly or turntable assembly along the moving direction of the moving mechanism. After the position adjustment of all cutter head assemblies or turntable assemblies is completed, processing is started, which can solve the problem that the existing method cannot process multiple products at the same time during the application of the multi-head multi-rotating axis precision engraving machine, thereby reducing the work efficiency of product processing.

[0004] In a first aspect, an embodiment of the present invention provides a compensation method for a multi-head precision engraving machine, wherein the multi-head precision engraving machine includes a plurality of processing units, each of the processing units includes a cutter head assembly and a turntable assembly corresponding to the cutter head assembly, the turntable assembly is used to clamp and rotate a product to be processed, the cutter head assembly is used to process the product to be processed clamped on the turntable assembly, the cutter head assembly or the turntable assembly is correspondingly provided with a moving mechanism, the cutter head assembly or the turntable assembly is position-adjusted along the moving direction corresponding to the moving mechanism, and a probe is further provided on the cutter head assembly, the probe is used to detect the rotation center of the turntable assembly; the method comprises the following steps:

[0005] Selecting a reference processing unit from the plurality of processing units, and determining the calibrated coordinates of the rotation center of the turntable of the reference processing unit as the reference coordinates;

[0006] Detecting the rotation center of each of the turntables using a probe to obtain the current coordinates of each of the rotation centers;

[0007] Determining a compensation value of each of the tool head assemblies or the turntable assemblies along the moving direction based on the reference coordinates and the current coordinates of each of the rotation centers;

[0008] Controlling each of the tool head assemblies or the turntable assemblies to adjust their positions along the moving direction of the moving mechanism based on the compensation value;

[0009] After the position adjustment of all the tool head assemblies or the turntable assemblies is completed, processing begins.

[0010] Optionally, selecting a reference processing unit from the plurality of processing units includes:

[0011] Obtaining current processing task parameters of the product to be processed;

[0012] If a similar processed product of the product to be processed has been processed, first historical processing data corresponding to the similar processed product of the product to be processed is obtained; if a similar processed product of the product to be processed has not been processed, second historical processing data corresponding to other types of processed products is obtained, wherein the first historical processing data includes processing data of each processing unit on the similar processed product, and the second historical processing data includes processing data of each processing unit on the other types of processed products;

[0013] A reference processing unit is selected from the plurality of processing units based on the current processing task parameters, the first historical processing data and / or the second historical processing data.

[0014] Optionally, selecting a reference processing unit from the plurality of processing units based on the current processing task parameters, the first historical processing data, and / or the second historical processing data includes:

[0015] constructing a yield prediction model based on the first historical processing data and / or the second historical processing data;

[0016] Predicting the expected yield of each of the processing units based on the yield prediction model and the current processing task parameters;

[0017] Among the multiple processing units, the processing unit with the highest expected yield is selected as the reference processing unit.

[0018] Optionally, constructing a yield prediction model based on the first historical processing data and / or the second historical processing data includes:

[0019] Based on the first historical processing data, determine the first product material M of the similar processed product k1 , first target accuracy level Pk1 , first ambient temperature T k1 , the first historical processing stability index H of each of the processing units i,k1 And the first actual yield Y of each processing unit real,i,k1 ;

[0020] Based on the second historical processing data, the second product material M of the other type of processed product is determined k2 , Second target accuracy level P k2 , the second ambient temperature T k2 , the second historical processing stability index H of each of the processing units i,k2 And the second actual yield Y of each processing unit real,i,k2 ;

[0021] When the amount of the first historical processing data is greater than the preset amount, based on the first product material M k1 , the first target accuracy level P k1 , the first ambient temperature T k1 , the first historical processing stability index H of each of the processing units i,k1 And the first actual yield Y of each processing unit real,i,k1 , build the first yield prediction model;

[0022] When the same type of processed product as the product to be processed has not been processed, based on the material M of the second product k2 The second target accuracy level P k2 , the second ambient temperature T k2 , the second historical processing stability index H of each of the processing units i,k2 And the second actual yield Y of each processing unit real,i,k2 , construct a second yield prediction model;

[0023] When the amount of the first historical processing data is less than the preset amount, the weight value of the first historical processing data is determined according to the amount of the first historical processing data, and the weight value of the first historical processing data is determined based on the first product material M k1 , the first target accuracy level P k1 , the first ambient temperature T k1 , the first historical processing stability index H of each of the processing units i,k1 , the first actual yield Y of each of the processing units real,i,k1 , the second product material M k2 The second target accuracy level P k2 , the second ambient temperature T k2 , the second historical processing stability index H of each of the processing unitsi,k2 And the second actual yield Y of each processing unit real,i,k2 , construct the third yield prediction model.

[0024] Optionally, the first historical processing stability index H of the processing unit is determined i,k1 ,include:

[0025] In the first historical processing data, the actual size deviation ΔD of the i-th processing unit when processing the same type of processed products in n1 rounds is extracted. i,k1 ;

[0026] Based on the actual size deviation △D i,k1 And the tolerance width △D corresponding to the similar processed products tol , determine the first historical processing stability index H of the i-th processing unit i,k1 ;

[0027] The second historical processing stability index H of the processing unit is determined i,k2 ,include:

[0028] In the second historical processing data, the actual size deviation ΔD of the i-th processing unit when processing the j-th type of other processed products in n2 rounds is extracted. i,j,k2 ;

[0029] Based on the actual size deviation △D i,j,k2 And the tolerance width △D corresponding to other types of processed products mentioned in category j tol,j , determine the second historical processing stability index H of the i-th processing unit i,k2 .

[0030] Optionally, detecting the rotation center of each of the turntables by a probe to obtain the current coordinates of each of the rotation centers includes:

[0031] After the turntable rotates the angle, the probe is moved to the X coordinate value and the Z coordinate value corresponding to the reference coordinate, and detection is performed by touching the probe;

[0032] If the probe is set on the X-axis side, the rotation center of each turntable is detected by the probe to obtain a detection value, and the detection value is corrected according to the offset value between the probe and the X-axis to obtain the current coordinate of the rotation center;

[0033] If the probe is set on the Y-axis side, the rotation center of each turntable is detected by the probe to obtain a detection value, and the detection value is determined as the current coordinate of the rotation center.

[0034] Optionally, determining the compensation value of each of the tool head assemblies or the turntable assemblies along the moving direction based on the reference coordinates and the current coordinates of each of the rotation centers includes:

[0035] If the turntable assembly is provided with the moving mechanism, determining a compensation value of each turntable assembly along the moving direction based on the reference coordinates and the current coordinates of each rotation center;

[0036] If the tool head assembly is provided with the moving mechanism, the compensation value of each tool head assembly along the moving direction is determined based on the reference coordinates and the current coordinates of each rotation center.

[0037] Optionally, determining the compensation value of each turntable assembly along the moving direction based on the reference coordinates and the current coordinates of each rotation center includes:

[0038] For each of the processing units, calculating a numerical difference between the current coordinate and the reference coordinate along the moving direction, and determining the numerical difference as a compensation value of the turntable assembly along the moving direction;

[0039] Determining the compensation value of each of the tool head assemblies along the moving direction based on the reference coordinates and the current coordinates of each of the rotation centers includes:

[0040] For each of the machining units, a numerical difference between the current coordinate and the reference coordinate along the moving direction is calculated, and the numerical difference is determined as a compensation value of the tool head assembly along the moving direction.

[0041] In a second aspect, an embodiment of the present invention further provides a compensation device for a multi-head precision engraving machine, wherein the multi-head precision engraving machine includes a plurality of processing units, each of the processing units includes a cutter head assembly and a turntable assembly corresponding to the cutter head assembly, the turntable assembly is used to clamp and rotate the product to be processed, the cutter head assembly is used to process the product to be processed clamped on the turntable assembly, the cutter head assembly or the turntable assembly is correspondingly provided with a moving mechanism, the cutter head assembly or the turntable assembly is position-adjusted along the moving direction corresponding to the moving mechanism, the cutter head assembly is further provided with a probe, the probe is used to detect the rotation center of the turntable assembly; the compensation device for the multi-head precision engraving machine includes:

[0042] A first determining module is configured to select a reference processing unit from the plurality of processing units, and determine the calibrated coordinates of the rotation center of the turntable of the reference processing unit as the reference coordinates;

[0043] A detection module, configured to detect the rotation center of each of the turntables using a probe to obtain the current coordinates of each of the rotation centers;

[0044] a second determining module, configured to determine a compensation value of each of the tool head assemblies or the turntable assembly along the moving direction based on the reference coordinates and the current coordinates of each of the rotation centers;

[0045] a position adjustment module, configured to control the position of each of the tool head assemblies or the turntable assemblies along the moving direction of the moving mechanism based on the compensation value;

[0046] The processing module is used to start processing after the position adjustment of all the tool head assemblies or the turntable assemblies is completed.

[0047] In the third aspect, an embodiment of the present invention also provides a multi-head precision engraving machine compensation system, comprising a multi-head precision engraving machine and the multi-head precision engraving machine compensation device described in the embodiment of the present invention, the multi-head precision engraving machine comprising a plurality of processing units, each of the processing units comprising a tool head assembly and a turntable assembly corresponding to the tool head assembly, the turntable assembly being used to clamp and rotate the product to be processed, the tool head assembly being used to process the product to be processed clamped on the turntable assembly, the tool head assembly or the turntable assembly being correspondingly provided with a moving mechanism, the tool head assembly or the turntable assembly being position-adjusted along the moving direction corresponding to the moving mechanism, a probe being further provided on the tool head assembly, the probe being used to detect the rotation center of the turntable assembly.

[0048] In an embodiment of the present invention, a reference processing unit is selected from multiple processing units, and the calibrated coordinates of the rotation center of the turntable of the reference processing unit are determined as the reference coordinates; the rotation center of each turntable is detected by a probe to obtain the current coordinates of each rotation center; based on the reference coordinates and the current coordinates of each rotation center, a compensation value of each cutter head assembly or turntable assembly along the moving direction is determined; based on the compensation value, each cutter head assembly or turntable assembly is controlled to adjust its position along the moving direction of the moving mechanism; and after the position adjustment of all cutter head assemblies or turntable assemblies is completed, processing is started. The present invention detects the rotation center of each turntable by a probe to obtain the current coordinates of each rotation center, and determines the compensation value of each cutter head assembly or turntable assembly along the moving direction based on the reference coordinates and the current coordinates of each rotation center, and uses the compensation value to control the position adjustment of each cutter head assembly or turntable assembly along the moving direction of the moving mechanism, and after the position adjustment of all cutter head assemblies or turntable assemblies is completed, processing is started. This can solve the problem that the existing method cannot process multiple products at the same time during the application of multi-head and multi-rotating axis precision engraving machines, thereby reducing the work efficiency of product processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0050] Figure 1 This is a flow chart of a compensation method for a multi-head engraving machine provided by an embodiment of the present invention;

[0051] Figure 2 This is a coordinate diagram of a compensation method for a multi-head engraving machine provided by an embodiment of the present invention;

[0052] Figure 3 The present invention is a schematic structural diagram of a compensation device for a multi-head precision engraving machine provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0053] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0054] An embodiment of the present invention provides a multi-head precision engraving machine, which includes multiple processing units, each processing unit including a cutter head assembly and a turntable assembly corresponding to the cutter head assembly, the turntable assembly is used to clamp and rotate the product to be processed, the cutter head assembly is used to process the product to be processed clamped on the turntable assembly, the cutter head assembly or the turntable assembly is correspondingly provided with a moving mechanism, the cutter head assembly or the turntable assembly is position-adjusted along the moving direction of the corresponding moving mechanism, and a probe is also provided on the cutter head assembly, the probe is used to detect the rotation center of the turntable assembly.

[0055] In an embodiment of the present invention, the multi-head engraving machine is a device for precision machining, comprising multiple machining units, each of which includes a cutter head assembly and a turntable assembly corresponding to the cutter head assembly. The turntable assembly is used to secure and rotate the product to be machined, and the cutter head assembly is used to machine the product. A movable mechanism is provided corresponding to the cutter head assembly or the turntable assembly, and the position of the cutter head assembly or the turntable assembly can be adjusted by the movable mechanism.

[0056] The above-mentioned processing unit can be understood as a working device used for processing or transforming the product to be processed, including a cutter head assembly and a turntable assembly corresponding to the cutter head assembly.

[0057] The above-mentioned cutter head assembly can be understood as an assembly for installing a cutting tool, which is used to process products.

[0058] The above-mentioned turntable assembly can be understood as an assembly for mounting a product and rotating the product, and is used to fix and rotate the product.

[0059] The above-mentioned moving mechanism can be understood as a mechanism that enables an object to move, for example, a wheeled moving mechanism.

[0060] The above-mentioned probe can be understood as a small sensor installed on the tool head assembly, which is used to detect the rotation center of the turntable assembly, helping to ensure that the tool head is always accurately aligned with the center of the product during the processing, thereby improving the processing accuracy.

[0061] It should be noted that the product to be processed can be fixed on the turntable assembly, and the position of the cutter head assembly or the turntable assembly can be adjusted by the moving mechanism to process the product to be processed. During the processing, a probe can be used to detect the rotation center of the turntable assembly to ensure processing accuracy.

[0062] like Figure 1 As shown, Figure 1 Flowchart of a multi-head engraving machine compensation method provided by an embodiment of the present invention, the multi-head engraving machine compensation method comprising the steps of:

[0063] 101. Among multiple machining units, select a reference machining unit and determine the calibrated coordinates of the rotation center of the turntable of the reference machining unit as the reference coordinates.

[0064] In an embodiment of the present invention, the above-mentioned multi-head precision engraving machine compensation method can be applied to a server, and the server is communicatively connected to the multi-head precision engraving machine. The above-mentioned multi-head precision engraving machine includes multiple processing units, each processing unit includes a tool head assembly and a turntable assembly corresponding to the tool head assembly, the turntable assembly is used to clamp and rotate the product to be processed, the tool head assembly is used to process the product to be processed clamped on the turntable assembly, the tool head assembly or the turntable assembly is correspondingly provided with a moving mechanism, the tool head assembly or the turntable assembly is position-adjusted along the moving direction of the corresponding moving mechanism, and a probe is also provided on the tool head assembly, the probe is used to detect the rotation center of the turntable assembly.

[0065] The multi-head engraving machine is a device for precision machining, comprising a plurality of machining units.

[0066] The above-mentioned processing unit is a working device used for processing or transforming the product to be processed, including a cutter head assembly and a turntable assembly corresponding to the cutter head assembly. The above-mentioned cutter head assembly is a component for mounting a cutting tool, which is used to process the product. The above-mentioned turntable assembly is a component for mounting a product and rotating the product, and is used to fix and rotate the product. The above-mentioned moving mechanism is a mechanism for moving an object, such as a wheeled moving mechanism. The above-mentioned probe is a small sensor installed on the cutter head assembly, which is used to detect the rotation center of the turntable assembly, which helps to ensure that the cutter head is always accurately aligned with the center of the product during the processing, thereby improving the processing accuracy.

[0067] The above-mentioned reference processing unit can be understood as a reference processing unit used for positioning, detection and assembly during the processing process.

[0068] The above-mentioned reference coordinates can be understood as reference coordinate positions used to locate the position of the product to be processed.

[0069] Specifically, among the multiple processing units, one of the processing units is selected as the reference processing unit, and the calibrated coordinates of the rotation center of the processing unit turntable are used as the reference coordinates.

[0070] 102. Use a probe to detect the rotation center of each turntable to obtain the current coordinates of each rotation center.

[0071] In an embodiment of the present invention, the probe is a small sensor mounted on the cutter head assembly, which is used to detect the rotation center of the turntable assembly, helping to ensure that the cutter head is always accurately aligned with the center of the product during the processing, thereby improving the processing accuracy.

[0072] The above detection can be understood as a process in which the probe detects the current coordinates of the rotation center of each turntable.

[0073] The current coordinates of the aforementioned rotation centers may be coordinates obtained by detecting the rotation centers of the respective turntables using probes.

[0074] 103. Based on the reference coordinates and the current coordinates of each rotation center, determine the compensation value of each tool head assembly or turntable assembly along the moving direction.

[0075] In an embodiment of the present invention, the current coordinates of each rotation center may be compared with the reference coordinates to obtain a coordinate deviation, and the compensation value of each tool head assembly or turntable assembly along the moving direction may be determined based on the coordinate deviation.

[0076] The above compensation value can be understood as a value used to correct the coordinate deviation, which can be obtained by measurement or calculation. For example, the tool head assembly compensation value can be used to correct the deviation between the current coordinate and the reference coordinate.

[0077] In one possible embodiment, for example, assume that a tool head assembly needs to move along the X-axis direction, the reference coordinates of the tool head assembly are (x0, y0, z0), and the current coordinates of the tool head assembly are (x1, y1, z1). By calculating the deviation between the current coordinates and the reference coordinates, the compensation value of the tool head assembly in the X-axis direction can be obtained as: x1-x0.

[0078] 104. Based on the compensation value, control each tool head assembly or turntable assembly to adjust its position along the moving direction of the moving mechanism.

[0079] In an embodiment of the present invention, the position of each tool head or turntable assembly in the direction of the moving mechanism can be adjusted according to the compensation value, so that each tool head assembly or turntable assembly moves to a coordinate position corresponding to the reference coordinate, thereby improving the processing quality.

[0080] 105. After the position adjustment of all the cutter head assemblies or turntable assemblies is completed, processing begins.

[0081] In an embodiment of the present invention, processing can be started after the position adjustment of all the cutter head assemblies or the turntable assemblies is completed. Sensors can be used to detect whether all the assemblies have been adjusted to the correct position, and processing can be started after confirming that all the assemblies are in the correct position.

[0082] The above-mentioned processing can be understood as processing the product to be processed.

[0083] In one possible embodiment, for example, assume there are processing units A, B, and C. The turntable rotation center of processing unit A is O1, the turntable rotation center of processing unit B is O2, and the turntable rotation center of processing unit C is O3. The turntable rotation center O1 of processing unit A can be selected as the reference. The coordinates of O1 are set to (x, y, z). Processing units B and C can then adjust their positions and postures by comparing the differences between their own turntable rotation centers and the reference coordinates.

[0084] In an embodiment of the present invention, a reference processing unit is selected from multiple processing units, and the calibrated coordinates of the rotation center of the turntable of the reference processing unit are determined as the reference coordinates; the rotation center of each turntable is detected by a probe to obtain the current coordinates of each rotation center; based on the reference coordinates and the current coordinates of each rotation center, a compensation value of each cutter head assembly or turntable assembly along the moving direction is determined; based on the compensation value, each cutter head assembly or turntable assembly is controlled to adjust its position along the moving direction of the moving mechanism; and after the position adjustment of all cutter head assemblies or turntable assemblies is completed, processing is started. The present invention detects the rotation center of each turntable by a probe to obtain the current coordinates of each rotation center, and determines the compensation value of each cutter head assembly or turntable assembly along the moving direction based on the reference coordinates and the current coordinates of each rotation center, and uses the compensation value to control the position adjustment of each cutter head assembly or turntable assembly along the moving direction of the moving mechanism, and after the position adjustment of all cutter head assemblies or turntable assemblies is completed, processing is started. This can solve the problem that the existing method cannot process multiple products at the same time during the application of multi-head and multi-rotating axis precision engraving machines, thereby reducing the work efficiency of product processing.

[0085] It is understandable that in the specific implementation of this application, when data related to product coordinate information, detection information, processing information, etc. is involved, when the embodiments in this application are applied to specific products or technologies, user permission or consent is required, and the collection, use and processing of relevant data, as well as the training, deployment and calling of algorithm models, must comply with relevant laws, regulations and standards of relevant countries and regions.

[0086] Optionally, in the step of selecting a reference processing unit from multiple processing units, the current processing task parameters of the product to be processed can be obtained; if similar processed products to the product to be processed have been processed, the first historical processing data corresponding to the similar processed products to the product to be processed are obtained; if similar processed products to the product to be processed have not been processed, the second historical processing data corresponding to other types of processed products are obtained; based on the current processing task parameters, the first historical processing data and / or the second historical processing data, a reference processing unit is selected from multiple processing units.

[0087] In an embodiment of the present invention, the first historical processing data includes processing data of the same type of processed products by each processing unit, and the second historical processing data includes processing data of other types of processed products by each processing unit.

[0088] The above-mentioned processing task parameters may be parameters such as size, shape, and material.

[0089] The above-mentioned current processing task parameters may be parameters such as the current processing size, shape, material, etc. of the product to be processed.

[0090] The above-mentioned reference processing unit can be a reference coordinate position used to locate the position of the product to be processed.

[0091] In one possible embodiment, the current processing task parameters of the product to be processed can be obtained. If similar products to the product to be processed have been processed, first historical processing data corresponding to similar products of the product to be processed can be obtained. The first historical processing data includes processing data of each processing unit on similar products of the product to be processed. If similar products to the product to be processed have not been processed, second historical processing data corresponding to other types of products can be obtained. The second historical processing data includes processing data of each processing unit on other types of products of the product to be processed. Based on the current processing task parameters and the first historical processing data, a statistical analysis algorithm is used to analyze the first historical processing data among multiple processing units to determine the processing unit with the best performance as the benchmark plus unit.

[0092] In another possible embodiment, the current processing task parameters of the product to be processed can be obtained. If similar products to the product to be processed have been processed, first historical processing data corresponding to similar products of the product to be processed can be obtained. The first historical processing data includes processing data of each processing unit on similar products of the product to be processed. If similar products to the product to be processed have not been processed, second historical processing data corresponding to other types of products can be obtained. The second historical processing data includes processing data of each processing unit on other types of products of the product to be processed. Based on the current processing task parameters and the second historical processing data, a statistical analysis algorithm is used to analyze the second historical processing data among multiple processing units to determine the processing unit with the best performance as the benchmark processing unit.

[0093] In another possible embodiment, the current processing task parameters of the product to be processed can be obtained. If similar products to the product to be processed have been processed, first historical processing data corresponding to similar products of the product to be processed can be obtained. The first historical processing data includes processing data of each processing unit on similar products of the product to be processed. If similar products to the product to be processed have not been processed, second historical processing data corresponding to other types of products can be obtained. The second historical processing data includes processing data of each processing unit on other types of products of the product to be processed. Based on the current processing task parameters, the first historical processing data, and the second historical processing data, a statistical analysis algorithm is used to analyze the first and second historical processing data among multiple processing units to determine the processing unit with the best performance as the benchmark processing unit.

[0094] Optionally, in the step of selecting a benchmark processing unit from multiple processing units based on the current processing task parameters, the first historical processing data and / or the second historical processing data, a yield prediction model can be constructed based on the first historical processing data and / or the second historical processing data; based on the yield prediction model and the current processing task parameters, the expected yield of each processing unit can be predicted; and among multiple processing units, the processing unit with the highest expected yield can be selected as the benchmark processing unit.

[0095] In an embodiment of the present invention, the yield prediction model may be a yield prediction model constructed based on machine learning or deep learning. The yield prediction model can predict the yield of a processing task.

[0096] The above yield rate can be understood as the qualified rate of processed products during the product processing process. The yield rate reflects the stability and reliability of the processing technology.

[0097] The first historical processing data includes processing data of the same type of processed products by each processing unit, and the second historical processing data includes processing data of other types of processed products by each processing unit.

[0098] The above-mentioned current processing task parameters can be understood as parameters such as the current processing size, shape, material, etc. of the product to be processed.

[0099] The above-mentioned expected yield rate can be understood as the expected processing qualification rate during the product processing.

[0100] Specifically, the yield of each processing unit is predicted through the yield prediction model to obtain the expected yield of each processing unit. After obtaining the expected yield of each processing unit, the expected yield of each processing unit can be compared, and the processing unit with the highest expected yield can be selected as the benchmark unit.

[0101] Optionally, in the step of constructing a yield prediction model based on the first historical processing data and / or the second historical processing data, the first product material M of the same type of processed products can be determined based on the first historical processing data. k1 , first target accuracy level P k1 , first ambient temperature T k1 , the first historical processing stability index H of each processing unit i,k1 And the first actual yield Y of each processing unit real,i,k1 Based on the second historical processing data, determine the second product material M of other types of processed products k2 , Second target accuracy level P k2 , the second ambient temperature T k2 , the second historical processing stability index H of each processing unit i,k2 And the second actual yield Y of each processing unitreal,i,k2 When the amount of the first historical processing data is greater than the preset amount of data, based on the first product material M k1 , first target accuracy level P k1 , first ambient temperature T k1 , the first historical processing stability index H of each processing unit i,k1 And the first actual yield Y of each processing unit real,k1 , build the first yield prediction model; when the same type of processed products have not been processed before, based on the second product material M k2 , Second target accuracy level P k2 , the second ambient temperature T k2 , the second historical processing stability index H of each processing unit i,k2 And the second actual yield Y of each processing unit real,i,k2 , construct a second yield prediction model; when the data volume of the first historical processing data is less than the preset data volume, determine the weight value of the first historical processing data according to the data volume of the first historical processing data, and k1 , first target accuracy level P k1 , first ambient temperature T k1 , the first historical processing stability index H of each processing unit i,k1 , the first actual yield Y of each processing unit real,i,k1 , Second product material M k2 , Second target accuracy level P k2 , the second ambient temperature T k2 , the second historical processing stability index H of each processing unit i,k2 And the second actual yield Y of each processing unit real,i,k2 , construct the third yield prediction model.

[0102] In an embodiment of the present invention, the first historical processing data includes processing data of similar processed products by various processing units.

[0103] The first product material M k1 It can be understood as the type of original material used to manufacture or process products in the same product.

[0104] The first target accuracy level P k1 It can be understood as the minimum allowable error or dimensional deviation accuracy level expected to be achieved during the processing or manufacturing of the same product.

[0105] The first ambient temperature T k1 It can be understood as the ambient temperature during the processing or manufacturing of the same product.

[0106] The first historical processing stability index Hi,k1 It can be understood as a key indicator to measure the stability and consistency of the same product in the production or processing process, and is used to evaluate the ability of the process to produce qualified products within the specification limits.

[0107] The first actual yield Y real,i,k1 It can be understood as the processing qualification rate of each processing unit during the processing of the same product.

[0108] The first yield prediction model is based on the first product material M when the data volume of the first historical processing data is greater than the preset data volume. k1 , first target accuracy level P k1 , first ambient temperature T k1 , the first historical processing stability index H of each processing unit i,k1 And the first actual yield Y of each processing unit real,i,k1 The yield prediction model constructed,the first yield prediction model is used to predict the yield of the same,product, thereby helping to better control the production process and,improve product quality.

[0109] Specifically, construct the first data set {(M k1 , P k1 , T k1 , H i,k1 , Y real,i,k1 )}, the gradient boosting decision tree (GBDT) is used to train the predictor, and the input of the predictor is (M k1 , P k1 , T k1 , H i,k1 ), the output is Y pre,I,k1 Specifically, the above predictor model includes an objective function and constraints. The objective function is:

[0110]

[0111] Θ is the GBDT model parameter set, including hyperparameters such as tree structure and leaf weight. N is the historical processing times of similar processed products. l1 is the loss function, which is as follows:

[0112]

[0113] Ω(Θ) is the complexity penalty term, which is shown in the following formula:

[0114]

[0115] Among them, T is the number of leaf nodes, w j is the leaf weight of the j-th leaf node, and the θ and λ hyper parameters.

[0116] The constraints include physical reliability constraints, material characteristic monotonicity constraints, equipment state boundary constraints, and process stability constraints.

[0117] Among them, the physical feasibility constraint is: 0≤Y pre,i,k1 ≤1, It represents the predicted yield Y of each processing unit in the historical processing rounds for any similar product. pre,i,k1 Between 0 and 1.

[0118] The material characteristic monotonicity constraint is: Indicates material hardness H v The higher the expected yield Y pre The lower.

[0119] The device state boundary constraints are: It indicates that the marginal loss of yield due to the rotation center drift δ increases.

[0120] The process stability constraint is: It means that the yield fluctuation does not exceed the threshold ξ when the speed s changes.

[0121] The second historical processing data includes processing data of other types of processed products by each processing unit.

[0122] The second product material M k2 It can be understood as the type of raw material used to manufacture or process products of other categories.

[0123] The second target accuracy level P k2 It can be understood as the minimum allowable error or dimensional deviation accuracy level expected to be achieved during the processing or manufacturing of other types of products.

[0124] The second ambient temperature T k2 It can be understood as the ambient temperature during the processing or manufacturing of other types of products.

[0125] The second historical processing stability index H i,k2 It can be understood as a key indicator to measure the stability and consistency of products in the production or processing process among other categories of products, and is used to evaluate the ability of the process to produce qualified products within the specification limits.

[0126] The second actual yield Y real,i,k2 It can be understood as the processing qualification rate of each processing unit in the processing of other categories of products.

[0127] The above second yield prediction model is based on the material M of the second product when the same type of processed product has not been processed before. k2 , Second target accuracy level P k2 , the second ambient temperature Tk2 , the second historical processing stability index H of each processing unit i,k2 And the second actual yield Y of each processing unit real,i,k2 ,The yield prediction model constructed is used to predict the yield of similar ,processed products that have not been processed before.

[0128] Specifically, construct the second data set {(M k2 , P k2 , T k2 , H i,k2 , Y real,i,k2 )}, the gradient boosting decision tree (GBDT) is used to train the predictor, and the input of the predictor is (M k2 , P k2 , T k2 , H i,k2 ), the output is Y pre,I,k1 Specifically, the above predictor model includes an objective function and constraints. The objective function is:

[0129]

[0130] Θ is the GBDT model parameter set, including hyperparameters such as tree structure and leaf weight. M is the historical processing times of other types of processed products. l is the loss function, which is shown as follows:

[0131]

[0132] Ω(Θ) is the complexity penalty term, which is shown in the following formula:

[0133]

[0134] Among them, T is the number of leaf nodes, w j is the leaf weight of the j-th leaf node, and the θ and λ hyper parameters.

[0135] The constraints include physical reliability constraints, material characteristic monotonicity constraints, equipment state boundary constraints, and process stability constraints.

[0136] Among them, the physical feasibility constraint is: 0≤Y pre,i,k2 ≤1, It represents the predicted yield Y of each processing unit in the historical processing rounds for any similar product. pre,i,k2 Between 0 and 1.

[0137] The material characteristic monotonicity constraint is: Indicates material hardness H v The higher the expected yield Y pre The lower.

[0138] The device state boundary constraints are: It indicates that the marginal loss of yield due to the rotation center drift δ increases.

[0139] The process stability constraint is: It means that the yield fluctuation does not exceed the threshold ξ when the speed s changes.

[0140] The above-mentioned preset data volume can be understood as the data volume of the processed products pre-set by the system. The larger the data volume, the more accurate the construction of the yield prediction model.

[0141] Furthermore, when the amount of the first historical processing data is less than the preset amount, the weight value of the first historical processing data is determined according to the amount of the first historical processing data, and the weight value of the first historical processing data is determined according to the material M of the first product. k1 , first target accuracy level P k1 , first ambient temperature T k1 , the first historical processing stability index H of each processing unit i,k1 , the first actual yield Y of each processing unit real,i,k1 , Second product material M k2 , Second target accuracy level P k2 , the second ambient temperature T k2 , the second historical processing stability index H of each processing unit i,k2 And the second actual yield Y of each processing unit real,i,k2 , construct the third yield prediction model.

[0142] The third yield prediction model is to determine the weight value of the first historical processing data according to the data volume of the first historical processing data when the data volume of the first historical processing data is less than the preset data volume, and to determine the weight value of the first historical processing data according to the data volume of the first product material M k1 , first target accuracy level P k1 , first ambient temperature T k1 , the first historical processing stability index H of each processing unit i,k1 , the first actual yield Y of each processing unit real,i,k1 , Second product material M k2 , Second target accuracy level P k2 , the second ambient temperature T k2 , the second historical processing stability index H of each processing unit i,k2 And the second actual yield Y of each processing unit real,i,k2 The third yield prediction model can predict the yield of the product to be processed.

[0143] Construct the third dataset {(M k1 , P k1 , T k1 , Hi,k1 , Y real,i,k1 , M k2 , P k2 , T k2 , H i,k2 , Y real,i,k2 )}, the gradient boosting decision tree (GBDT) is used to train the predictor, and the input of the predictor is (M k , P k , T k , H i,k ), the output is Y pre,I,k Specifically, the above predictor model includes an objective function and constraints. The objective function is:

[0144]

[0145] Θ is the GBDT model parameter set, including hyperparameters such as tree structure and leaf weights. M is the historical processing times of other types of processed products. l1 is the first loss function and l2 is the second loss function. The loss functions are the same as the formulas for l1 and l2 above.

[0146] The constraints include physical reliability constraints, material characteristic monotonicity constraints, equipment state boundary constraints, and process stability constraints.

[0147] Among them, the physical feasibility constraint is: 0≤Y pre,i,k1 ≤1, and 0≤Y pre,i,k2 ≤1, It represents the predicted yield Y of each processing unit in the historical processing rounds for any similar product. pre,i,k2 Between 0 and 1.

[0148] The material characteristic monotonicity constraint is: Indicates material hardness H v The higher the expected yield Y pre The lower.

[0149] The device state boundary constraints are: It indicates that the marginal loss of yield due to the rotation center drift δ increases.

[0150] The process stability constraint is: It means that the yield fluctuation does not exceed the threshold ξ when the speed s changes.

[0151] Optionally, after determining the first historical processing stability index H of the processing unit i,k1 In the step of , the actual size deviation △D of the i-th processing unit when processing the same type of processed products in n1 rounds can be extracted from the first historical processing data. i,k1 ; Based on actual size deviation △D i,k1And the corresponding tolerance width △D of similar processed products tol , determine the first historical processing stability index H of the i-th processing unit i,k1 ;

[0152] Determine the second historical processing stability index H of the processing unit i,k2 , including: extracting the actual size deviation △D of the i-th processing unit when processing the j-th type of other processing products in the second historical processing data i,j,k2 ; Based on actual size deviation △D i,j,k2 And the tolerance band width △D corresponding to other types of processed products of category j tol,j , determine the second historical processing stability index H of the i-th processing unit i,k2 .

[0153] In an embodiment of the present invention, the first historical processing data includes processing data of similar processed products by various processing units.

[0154] The above actual size deviation △D i,k1 It can be understood as the actual size deviation △D when the i-th processing unit extracts the first historical processing data and processes the same type of processed products in n1 rounds i,k1 The above-mentioned actual dimensional deviation can be understood as the difference between the product size processed during the processing and the design size. Specifically, during the production process, due to various reasons (such as tool wear, operating errors, etc.), the processed product size may not meet the design specifications, resulting in dimensional deviation.

[0155] The above tolerance band width △D tol It can be understood as the allowable dimensional variation range for similar processed products during the raw processing process.

[0156] The first historical processing stability index H i,k1 According to the actual size deviation △D i,k1 And the corresponding tolerance width △D of similar processed products tol , determine the historical processing stability index of the i-th processing unit.

[0157]

[0158] The second historical processing data includes processing data of other types of processed products by each processing unit.

[0159] The above actual size deviation △D i,j,k2 It can be understood that in the second historical processing data, the actual size deviation of the i-th processing unit when processing the j-th type of other type of processed products in n2 rounds is extracted.

[0160] The above tolerance band width △D tol,j It can be understood as the width of the tolerance zone corresponding to other types of processed products of category j during the processing.

[0161] The second historical processing stability index H i,k2 According to the actual size deviation △D i,j,k2 And the tolerance band width △D corresponding to other types of processed products of category j tol,j , determine the second historical processing stability index of the i-th processing unit.

[0162]

[0163] Where c is the number of categories of other processed products.

[0164] Optionally, in the step of detecting the rotation center of each turntable by a probe to obtain the current coordinates of each rotation center, after the turntable rotates an angle, the probe can be moved to the X-coordinate value and Z-coordinate value corresponding to the reference coordinate, and detection is performed by touching the probe; if the probe is set on the X-axis side, the rotation center of each turntable is detected by the probe to obtain the detection value, and the detection value is corrected according to the offset value between the probe and the X-axis to obtain the current coordinates of the rotation center; if the probe is set on the Y-axis side, the rotation center of each turntable is detected by the probe to obtain the detection value, and the detection value is determined as the current coordinates of the rotation center.

[0165] In an embodiment of the present invention, the probe is a small sensor mounted on the cutter head assembly, which is used to detect the rotation center of the turntable assembly, helping to ensure that the cutter head is always accurately aligned with the center of the product during the processing, thereby improving the processing accuracy.

[0166] The above-mentioned reference coordinates can be understood as reference coordinate positions.

[0167] The above detection can be understood as a process in which the probe is moved to the X coordinate value and the Z coordinate value corresponding to the reference coordinate after the turntable rotates an angle to perform detection.

[0168] The above detection values can be understood as the values obtained by detecting the rotation center of each turntable through a probe.

[0169] The above offset value can be understood as the deviation distance between the probe and the X-axis. It is understandable that since the position of the probe deviates from the X-axis, the detected coordinates can be corrected according to the offset value to obtain the current coordinates of the rotation center.

[0170] The above-mentioned correction process can be understood as a process of correcting the coordinates of the detection value by using the offset value between the probe and the X-axis. The correction process is used to eliminate the deviation of the probe position.

[0171] Specifically, after the turntable rotates to the desired angle, move the probe to the X and Z coordinates corresponding to the reference coordinates. Then, touch the probe to detect the turntable's center of rotation. If the probe is positioned on the X-axis, the probe value must be corrected based on the offset between the probe and the X-axis to determine the current coordinates of the rotation center. If the probe is positioned on the Y-axis, the probe value can be used directly as the current coordinates of the rotation center.

[0172] In one possible embodiment, assume that the rotation center of a turntable is located at the coordinates (x0, y0, z0) and the probe is positioned on the X-axis. First, the probe is moved to the (x0, z0) position and then touched to obtain the detection value. If the probe is positioned on the X-axis, since there is a certain offset between the probe and the X-axis, the offset value between the probe and the X-axis can be calculated and used to correct the detection value. For example, if the detection value is (x1, y1, z1) and the offset between the probe and the X-axis is dx, then the corrected rotation center coordinates can be (x1 + dx, y1, z1).

[0173] Optionally, in the step of determining the compensation value of each tool head assembly or turntable assembly along the moving direction based on the reference coordinates and the current coordinates of each rotation center, if the turntable assembly is provided with a moving mechanism, the compensation value of each turntable assembly along the moving direction is determined based on the reference coordinates and the current coordinates of each rotation center; if the tool head assembly is provided with a moving mechanism, the compensation value of each tool head assembly along the moving direction is determined based on the reference coordinates and the current coordinates of each rotation center.

[0174] In the embodiment of the present invention, the above-mentioned moving mechanism can be understood as a mechanism that enables an object to move, for example, a wheeled moving mechanism.

[0175] The above-mentioned cutter head assembly is used to process the product to be processed clamped on the turntable assembly.

[0176] The turntable assembly is used to clamp and rotate the product to be processed.

[0177] The above-mentioned reference coordinates may be reference coordinate positions.

[0178] The current coordinates of each of the above-mentioned rotation centers are coordinates obtained by detecting the rotation center of each turntable through a probe.

[0179] The above compensation value is used to correct the coordinate deviation and can be obtained by measurement or calculation. For example, the tool head component compensation value can be used to correct the deviation between the current coordinate and the reference coordinate.

[0180] Specifically, if the turntable assembly is provided with a moving mechanism, the compensation value of each turntable assembly in the moving direction can be calculated based on the reference coordinates and the current coordinates of each rotation center. If the tool head assembly is provided with a moving mechanism, the compensation value of each tool head assembly in the moving direction can be calculated based on the reference coordinates and the current coordinates of each rotation center.

[0181] Optionally, in the step of determining the compensation value of each turntable assembly along the moving direction based on the reference coordinates and the current coordinates of each center, a numerical difference between the current coordinate and the reference coordinate along the moving direction may be calculated for each processing unit, and the numerical difference may be determined as the compensation value of the turntable assembly along the moving direction;

[0182] Based on the reference coordinates and the current coordinates of each rotation center, the compensation value of each tool head assembly along the moving direction is determined, including: for each processing unit, calculating the numerical difference between the current coordinates and the reference coordinates along the moving direction, and determining the numerical difference as the compensation value of the tool head assembly along the moving direction.

[0183] In an embodiment of the present invention, each processing unit includes a cutter head assembly and a turntable assembly corresponding to the cutter head assembly. The turntable assembly is used to clamp and rotate the product to be processed, and the cutter head assembly is used to process the product to be processed clamped on the turntable assembly.

[0184] The above numerical difference can be understood as the difference between the current coordinate and the reference coordinate in the moving direction, and the numerical difference reflects the offset of the current position relative to the reference position.

[0185] Specifically, for each processing unit, the numerical difference between the current coordinate and the reference coordinate along the moving direction can be calculated, and the numerical difference can be determined as the compensation value of the turntable assembly along the moving direction; for each processing unit, the numerical difference between the current coordinate and the reference coordinate along the moving direction can be calculated, and the numerical difference can be determined as the compensation value of the tool head assembly along the moving direction.

[0186] Specifically, the compensation value of each turntable assembly along the moving direction can be accurately calculated based on the difference between the current coordinates and the reference coordinates. The coordinate position of the turntable assembly and the tool head assembly can be adjusted through the compensation value, making the processing more accurate, thereby improving the processing precision and efficiency.

[0187] In one possible embodiment, Figure 2As shown, the present invention is provided with the horizontal axis as the X axis, the right direction is the positive direction, the vertical axis as the Z axis, the upward direction is the positive direction, the coordinates of the rotation center O are (X0, Z0), after the rotation angle, the rotation angle is β (counterclockwise is positive), and the point A (X1, Z1) is rotated around the rotation center O (X0, Z0) by an angle β to obtain the new coordinates B (X2, Z2). Specifically, step 1: translate the coordinate system to the rotation center, convert the coordinates of point A and the rotation center O into a relative coordinate system (with O as the origin), and the formula for calculating the relative coordinate system is: △X=X1-X0, △Z=Z1-Z0; step 2: polar coordinate representation, the length of the original position vector OA is The angle between the original vector and the X-axis is α, and the angle between the original vector and the X-axis satisfies cosα=△X / r, sinα=△Z / r; Step 3: The angle after rotation becomes α+β, and the new coordinates can be expressed as △X=rcos(α+β), △Z=rsin(α+β); Step 4: Expand cos(α+β) and sin(α+β) to obtain:

[0188] △X=r(cosαcosβ-sinαsinβ)=ΔXcosβ-ΔZsinβ

[0189] △Z=r(sinαcosβ+cosθsinβ)=ΔZcosβ+ΔZsinβ

[0190] Step 5: The formula for converting the relative coordinates back to the original coordinate system is:

[0191] X2=X0△X=X0+(X1-X0)cosβ-(Z1-Z0)sinβ

[0192] Z2=Z0+△Z=Z0+(Z1-Z0)cosβ+(X1-X0)sinβ

[0193] It should be noted that if the rotation angle is 90°, the formula can be used:

[0194] X2=X0+(X1-X0)cosβ-(Z1-Z0)sinβ

[0195] Z2=Z0+(Z1-Z0)cosβ+(X1-X0)sinβ

[0196] The new coordinates are derived as (X2, Z2).

[0197] In another possible embodiment, the present invention can be applied to software, and the following steps are included: Step 1: Enter the X and Y coordinates in the m coordinate system; Step 2: Place the product to be processed on the turntable, measure the center of the product to be processed, and enter the X, Y, and Z coordinates in the n coordinate system; Step 3: Call the P9000 macro program before each turntable rotation to perform coordinate transformation and obtain the l coordinate system; Step 4: Probe - Set Parameters; Step 5: Probe - Call. Specifically, after the turntable rotates by an angle, the X axis can have four values. The probe detection method can be: select #xxx as the reference value, X movement value #xxx, Z descend to the nZ1 position, and touch the probe with a small X movement. If the probe is installed on the X side, the probe needs to be offset from the main axis. If the probe is installed on the Y axis, no movement is required. The present invention can improve the accuracy and quality of the product to be processed, reduce errors and scrap rates, and improve production efficiency.

[0198] like Figure 3 As shown, an embodiment of the present invention provides a compensation device for a multi-head precision engraving machine, the multi-head precision engraving machine includes a plurality of processing units, each of the processing units includes a cutter head assembly and a turntable assembly corresponding to the cutter head assembly, the turntable assembly is used to clamp and rotate the product to be processed, the cutter head assembly is used to process the product to be processed clamped on the turntable assembly, the cutter head assembly or the turntable assembly is correspondingly provided with a moving mechanism, the cutter head assembly or the turntable assembly is positionally adjusted along the moving direction corresponding to the moving mechanism, the cutter head assembly is further provided with a probe, the probe is used to detect the rotation center of the turntable assembly; the method comprises the following steps:

[0199] A first determining module 301 is configured to select a reference processing unit from the plurality of processing units, and determine the calibrated coordinates of the rotation center of the turntable of the reference processing unit as reference coordinates;

[0200] A detection module 302 is configured to detect the rotation center of each of the turntables using a probe to obtain the current coordinates of each of the rotation centers;

[0201] A second determining module 303 is configured to determine a compensation value of each of the tool head assemblies or the turntable assembly along the moving direction based on the reference coordinates and the current coordinates of each of the rotation centers;

[0202] A position adjustment module 304 is configured to control the position of each of the tool head assemblies or the turntable assemblies along the moving direction of the moving mechanism based on the compensation value;

[0203] The processing module 305 is used to start processing after the position adjustment of all the tool head assemblies or the turntable assemblies is completed.

[0204] Optionally, the first determination module 301 is also used to obtain the current processing task parameters of the product to be processed; if similar processed products of the product to be processed have been processed, the first historical processing data corresponding to the similar processed products of the product to be processed are obtained; if similar processed products of the product to be processed have not been processed, the second historical processing data corresponding to other types of processed products are obtained, the first historical processing data including the processing data of each processing unit on the similar processed products, the second historical processing data including the processing data of each processing unit on the other types of processed products; based on the current processing task parameters, the first historical processing data and / or the second historical processing data, a reference processing unit is selected from the multiple processing units.

[0205] Optionally, the first determination module 301 is also used to construct a yield prediction model based on the first historical processing data and / or the second historical processing data; predict the expected yield of each of the processing units based on the yield prediction model and the current processing task parameters; and select the processing unit with the highest expected yield among the multiple processing units as the benchmark processing unit.

[0206] Optionally, the first determining module 301 is further configured to determine the first product material M of the similar processed product based on the first historical processing data. k1 , first target accuracy level P k1 , first ambient temperature T k1 , the first historical processing stability index H of each of the processing units i,k1 And the first actual yield Y of each processing unit real,i,k1 Based on the second historical processing data, determine the second product material M of the other type of processed products k2 , Second target accuracy level P k2 , the second ambient temperature T k2 , the second historical processing stability index H of each of the processing units i,k2 And the second actual yield Y of each processing unit real,i,k2 When the amount of the first historical processing data is greater than the preset amount of data, based on the first product material M k1 , the first target accuracy level P k1 , the first ambient temperature T k1 , the first historical processing stability index H of each of the processing units i,k1 And the first actual yield Y of each processing unit real,i,k1 , construct a first yield prediction model; when the same type of processed products as the product to be processed have not been processed, based on the material M of the second product k2 The second target accuracy level Pk2 , the second ambient temperature T k2 , the second historical processing stability index H of each of the processing units i,k2 And the second actual yield Y of each processing unit real,i,k2 , construct a second yield prediction model; when the data volume of the first historical processing data is less than the preset data volume, determine the weight value of the first historical processing data according to the data volume of the first historical processing data, based on the first product material M k1 , the first target accuracy level P k1 , the first ambient temperature T k1 , the first historical processing stability index H of each of the processing units i,k1 , the first actual yield Y of each of the processing units real,i,k1 , the second product material M k2 The second target accuracy level P k2 , the second ambient temperature T k2 , the second historical processing stability index H of each of the processing units i,k2 And the second actual yield Y of each processing unit real,i,k2 , construct the third yield prediction model.

[0207] Optionally, the first determining module 301 is further configured to extract from the first historical processing data the actual size deviation ΔD of the i-th processing unit when processing the same type of processed products in n1 rounds. i,k1 ; Based on the actual size deviation △D i,k1 And the tolerance width △D corresponding to the similar processed products tol , determine the first historical processing stability index H of the i-th processing unit i,k1 ;

[0208] The second historical processing stability index H of the processing unit is determined i,k2 , including: extracting the actual size deviation △D of the i-th processing unit when processing the j-th type of other type processed products in n2 rounds from the second historical processing data i,j,k2 ; Based on the actual size deviation △D i,j,k2 And the tolerance width △D corresponding to other types of processed products mentioned in category j tol,j , determine the second historical processing stability index H of the i-th processing unit i,k2 .

[0209] Optionally, the detection 302 is also used to move the probe to the X-coordinate value and Z-coordinate value corresponding to the reference coordinate after the turntable is rotated by an angle, and perform detection by touching the probe; if the probe is set on the X-axis side, the detection value of the rotation center of each turntable is detected by the probe, and the detection value is corrected according to the offset value between the probe and the X-axis to obtain the current coordinate of the rotation center; if the probe is set on the Y-axis side, the detection value of the rotation center of each turntable is detected by the probe, and the detection value is determined as the current coordinate of the rotation center.

[0210] Optionally, the second determination module 303 is also used to determine the compensation value of each turntable assembly along the moving direction based on the reference coordinates and the current coordinates of each rotation center if the turntable assembly is provided with the moving mechanism; if the tool head assembly is provided with the moving mechanism, the compensation value of each tool head assembly along the moving direction is determined based on the reference coordinates and the current coordinates of each rotation center.

[0211] Optionally, the second determining module 303 is further configured to calculate, for each of the processing units, a numerical difference between the current coordinate and the reference coordinate along the moving direction, and determine the numerical difference as a compensation value of the turntable assembly along the moving direction;

[0212] The compensation value of each tool head assembly along the moving direction is determined based on the reference coordinates and the current coordinates of each rotation center, including: for each processing unit, calculating the numerical difference between the current coordinates and the reference coordinates along the moving direction, and determining the numerical difference as the compensation value of the tool head assembly along the moving direction.

[0213] An embodiment of the present invention also provides a compensation system for a multi-head precision engraving machine, comprising a multi-head precision engraving machine and a compensation device for a multi-head precision engraving machine provided by an embodiment of the present invention. The multi-head precision engraving machine includes multiple processing units, each of which includes a cutter head assembly and a turntable assembly corresponding to the cutter head assembly. The turntable assembly is used to clamp and rotate the product to be processed, and the cutter head assembly is used to process the product to be processed clamped on the turntable assembly. The cutter head assembly or the turntable assembly is correspondingly provided with a moving mechanism, and the cutter head assembly or the turntable assembly is positionally adjusted along the moving direction of the corresponding moving mechanism. A probe is also provided on the cutter head assembly, and the probe is used to detect the rotation center of the turntable assembly. The compensation device for a multi-head precision engraving machine is used to execute the steps of the compensation method for a multi-head precision engraving machine provided by an embodiment of the present invention.

[0214] Those skilled in the art will appreciate that all or part of the processes in the above-described method embodiments can be implemented by instructing the relevant hardware through a computer program. The program can be stored in a computer-readable storage medium, and when executed, the program can include the processes in the above-described method embodiments. The storage medium can be a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

[0215] The above disclosure is merely a preferred embodiment of the present invention and certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope of the present invention.

Claims

1. A compensation method for a multi-head engraving machine, characterized in that: The multi-head engraving machine includes a plurality of processing units, each of which includes a cutter head assembly and a turntable assembly corresponding to the cutter head assembly, the turntable assembly is used to clamp and rotate the product to be processed, the cutter head assembly is used to process the product to be processed clamped on the turntable assembly, the cutter head assembly or the turntable assembly is correspondingly provided with a moving mechanism, the cutter head assembly or the turntable assembly is position-adjusted along the moving direction of the corresponding moving mechanism, and the cutter head assembly is also provided with a probe, and the probe is used to detect the rotation center of the turntable assembly; the method includes the following steps: Selecting a reference processing unit from the plurality of processing units, and determining the calibrated coordinates of the rotation center of the turntable of the reference processing unit as the reference coordinates; Detecting the rotation center of each of the turntables using a probe to obtain the current coordinates of each of the rotation centers; Determining a compensation value of each of the tool head assemblies or the turntable assemblies along the moving direction based on the reference coordinates and the current coordinates of each of the rotation centers; Controlling each of the tool head assemblies or the turntable assemblies to adjust their positions along the moving direction of the moving mechanism based on the compensation value; After the position adjustment of all the tool head assemblies or the turntable assemblies is completed, processing begins.

2. The compensation method for a multi-head engraving machine according to claim 1, characterized in that: The step of selecting a reference processing unit from among the plurality of processing units comprises: Obtaining current processing task parameters of the product to be processed; If a similar processed product of the product to be processed has been processed, first historical processing data corresponding to the similar processed product of the product to be processed is obtained; if a similar processed product of the product to be processed has not been processed, second historical processing data corresponding to other types of processed products is obtained, wherein the first historical processing data includes processing data of each processing unit on the similar processed product, and the second historical processing data includes processing data of each processing unit on the other types of processed products; A reference processing unit is selected from the plurality of processing units based on the current processing task parameters, the first historical processing data and / or the second historical processing data.

3. The compensation method for a multi-head engraving machine according to claim 2, characterized in that: The selecting a reference processing unit from the plurality of processing units based on the current processing task parameters, the first historical processing data and / or the second historical processing data includes: constructing a yield prediction model based on the first historical processing data and / or the second historical processing data; Predicting the expected yield of each of the processing units based on the yield prediction model and the current processing task parameters; Among the plurality of processing units, the processing unit with the highest expected yield is selected as a reference processing unit.

4. The compensation method for a multi-head engraving machine according to claim 3, characterized in that: The constructing of a yield prediction model based on the first historical processing data and / or the second historical processing data includes: Based on the first historical processing data, determine the first product material M of the similar processed product k1 , first target accuracy level P k1 , first ambient temperature T k1 , the first historical processing stability index H of each of the processing units i,k1 And the first actual yield Y of each processing unit real,i,k1 ; Based on the second historical processing data, the second product material M of the other type of processed product is determined k2 , Second target accuracy level P k2 , the second ambient temperature T k2 , the second historical processing stability index H of each of the processing units i,k2 And the second actual yield Y of each processing unit real,i,k2 ; When the amount of the first historical processing data is greater than the preset amount, based on the first product material M k1 , the first target accuracy level P k1 , the first ambient temperature T k1 , the first historical processing stability index H of each of the processing units i,k1 And the first actual yield Y of each processing unit real,i,k1 , build the first yield prediction model; When the same type of processed product as the product to be processed has not been processed, based on the material M of the second product k2 The second target accuracy level P k2 The second ambient temperature T k2 , the second historical processing stability index H of each of the processing units i,k2 And the second actual yield Y of each processing unit real,i,k2 , construct a second yield prediction model; When the amount of the first historical processing data is less than the preset amount, the weight value of the first historical processing data is determined according to the amount of the first historical processing data, and the weight value of the first historical processing data is determined based on the first product material M k1 , the first target accuracy level P k1 , the first ambient temperature T k1 , the first historical processing stability index H of each of the processing units i,k1 , the first actual yield Y of each of the processing units real,i,k1 , the second product material M k2 The second target accuracy level P k2 The second ambient temperature T k2 , the second historical processing stability index H of each of the processing units i,k2 And the second actual yield Y of each processing unit real,i,k2 , construct the third yield prediction model.

5. The compensation method for a multi-head engraving machine according to claim 4, characterized in that: The first historical processing stability index H of the processing unit is determined i,k1 ,include: In the first historical processing data, the actual size deviation ΔD of the i-th processing unit when processing the same type of processed products in n1 rounds is extracted. i,k1 ; Based on the actual size deviation △D i,k1 And the tolerance width △D corresponding to the similar processed products tol , determine the first historical processing stability index H of the i-th processing unit i,k1 ; The second historical processing stability index H of the processing unit is determined i,k2 ,include: In the second historical processing data, the actual size deviation ΔD of the i-th processing unit when processing the j-th type of other processed products in n2 rounds is extracted. i,j,k2 ; Based on the actual size deviation △D i,j,k2 And the tolerance width △D corresponding to other types of processed products mentioned in category j tol,j , determine the second historical processing stability index H of the i-th processing unit i,k2 .

6. The compensation method for a multi-head engraving machine according to any one of claims 1 to 5, characterized in that: The detecting the rotation center of each of the turntables by a probe to obtain the current coordinates of each of the rotation centers includes: After the turntable rotates the angle, the probe is moved to the X coordinate value and the Z coordinate value corresponding to the reference coordinate, and detection is performed by touching the probe; If the probe is set on the X-axis side, the detection value of the rotation center of each turntable is detected by the probe, and the detection value is corrected according to the offset value between the probe and the X-axis to obtain the current coordinate of the rotation center; If the probe is arranged on the Y-axis side, the detection value of the rotation center of each of the turntables is detected by the probe, and the detection value is determined as the current coordinate of the rotation center.

7. The compensation method for a multi-head engraving machine according to any one of claims 1 to 5, characterized in that: The step of determining the compensation value of each tool head assembly or each turntable assembly along the moving direction based on the reference coordinates and the current coordinates of each rotation center includes: If the turntable assembly is provided with the moving mechanism, determining a compensation value of each turntable assembly along the moving direction based on the reference coordinates and the current coordinates of each rotation center; If the tool head assembly is provided with the moving mechanism, the compensation value of each tool head assembly along the moving direction is determined based on the reference coordinates and the current coordinates of each rotation center.

8. The compensation method for a multi-head engraving machine according to claim 7, characterized in that: The step of determining the compensation value of each turntable component along the moving direction based on the reference coordinates and the current coordinates of each rotation center includes: For each of the processing units, calculating a numerical difference between the current coordinate and the reference coordinate along the moving direction, and determining the numerical difference as a compensation value of the turntable assembly along the moving direction; Determining the compensation value of each of the tool head assemblies along the moving direction based on the reference coordinates and the current coordinates of each of the rotation centers includes: For each of the machining units, a numerical difference between the current coordinate and the reference coordinate along the moving direction is calculated, and the numerical difference is determined as a compensation value of the tool head assembly along the moving direction.

9. A compensation device for a multi-head engraving machine, characterized in that: The multi-head engraving machine includes a plurality of processing units, each of which includes a cutter head assembly and a turntable assembly corresponding to the cutter head assembly, the turntable assembly is used to clamp and rotate the product to be processed, the cutter head assembly is used to process the product to be processed clamped on the turntable assembly, the cutter head assembly or the turntable assembly is correspondingly provided with a moving mechanism, the cutter head assembly or the turntable assembly is positionally adjusted along the moving direction of the corresponding moving mechanism, and the cutter head assembly is also provided with a probe, and the probe is used to detect the rotation center of the turntable assembly; The multi-head engraving machine compensation device includes: A first determining module is configured to select a reference processing unit from the plurality of processing units, and determine the calibrated coordinates of the rotation center of the turntable of the reference processing unit as the reference coordinates; A detection module, configured to detect the rotation center of each of the turntables using a probe to obtain the current coordinates of each of the rotation centers; a second determining module, configured to determine a compensation value of each of the tool head assemblies or the turntable assembly along the moving direction based on the reference coordinates and the current coordinates of each of the rotation centers; a position adjustment module, configured to control the position of each of the tool head assemblies or the turntable assemblies along the moving direction of the moving mechanism based on the compensation value; The processing module is used to start processing after the position adjustment of all the tool head assemblies or the turntable assemblies is completed.

10. A compensation system for a multi-head engraving machine, characterized in that: It includes a multi-head precision engraving machine and a multi-head precision engraving machine compensation device as described in claim 9, the multi-head precision engraving machine includes multiple processing units, each of the processing units includes a tool head assembly and a turntable assembly corresponding to the tool head assembly, the turntable assembly is used to clamp and rotate the product to be processed, the tool head assembly is used to process the product to be processed clamped on the turntable assembly, the tool head assembly or the turntable assembly is correspondingly provided with a moving mechanism, the tool head assembly or the turntable assembly is position-adjusted along the moving direction corresponding to the moving mechanism, and a probe is also provided on the tool head assembly, and the probe is used to detect the rotation center of the turntable assembly.

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