Atomic sensor temperature field compensation control system and method

Abstract

The invention provides an atomic sensor temperature field compensation control system and method, and belongs to the technical field of atomic sensors, and the system comprises a temperature collection unit, a temperature control unit and a heating unit, when an atomic gas chamber temperature control system works, an atomic sensor temperature field compensation system is started, and the compensation adjustment of an atomic sensor temperature field is realized; the multi-channel high-precision temperature measurement system is used for accurately measuring the external environment temperature and the internal temperature field of the atom sensor, and then the heating unit is driven to heat the magnetic shielding barrel shell in a compensation manner, so that the stable control of the internal temperature field is realized; the method can inhibit the influence of the ambient temperature on the temperature field of the atomic gas chamber, improves the stability and uniformity of the temperature field of the atomic gas chamber, has higher capability of resisting ambient temperature interference, and is suitable for popularization.

Description

Technical Field

[0001] The present invention belongs to the technical field of atomic sensors, and in particular to an atomic sensor temperature field compensation control system and method, which is mainly used in compensating for ambient temperature interference in an atomic gas chamber. The present invention realizes a miniaturized temperature control system. Background Art

[0002] When a miniaturized atomic sensor is working normally, it is necessary to heat the atomic gas chamber to increase the number density of alkali metal atoms, so that the gas chamber is filled with alkali metal vapor to the maximum extent, thereby obtaining greater signal strength and improving the signal-to-noise ratio; but when the temperature is too high, the collision rate between atoms increases, resulting in an increase in pressure broadening, which is not conducive to signal extraction.

[0003] Therefore, there is an optimal operating temperature for the hot atom ensemble inertial measurement system with fixed gas chamber composition. The current research on gas chamber temperature control is mainly divided into two parts:

[0004] On the one hand, there is research on current heating coils, which aims to improve heating efficiency and suppress the magnetic field generated during operation by changing the coil configuration and material.

[0005] On the other hand, there is research on high-precision atomic gas temperature control schemes, which can reduce temperature gradients and improve temperature stability through circuit optimization design or control scheme improvements.

[0006] The current design scheme lacks a direct means of measuring the temperature field of the atomic gas chamber. The existing architecture usually adopts a closed-loop control method for the temperature of the heating plate to perform open-loop control of the temperature field of the atomic gas chamber. The control system mainly stabilizes the temperature of the heating plates on both sides of the heating ceramic. The temperature control technology of the heating plates is quite mature, and the temperature fluctuation amplitude of the heating plates under stable control is about 10mK.

[0007] However, for the thermodynamic system involving the atomic gas chamber, the heating plate on the heating ceramic is its heat source, and the external environment is its cold source. Simply controlling the temperature stability of the heating source cannot guarantee the stability of the entire thermodynamic system. It is also necessary to pay attention to the influence of the external environment temperature, such as:

[0008] On the one hand, under the condition of stable heater temperature, the lower the external ambient temperature, the greater the heat transfer in the convection heat transfer process on the surface of the atomic gas chamber, the greater the maximum temperature difference inside, and the greater the temperature gradient;

[0009] On the other hand, under the condition that the heater temperature is stable, the greater the fluctuation of the external environment temperature, the worse the stability of the atomic gas chamber temperature field.

[0010] Therefore, real-time compensation for ambient temperature interference is required to ensure that the atomic gas chamber is always at the optimal operating temperature.

[0011] In order to solve the above problems, the prior art has designed the following solutions, for example:

[0012] ① Vacuum the working environment of the atomic sensor;

[0013] It can avoid the convection heat transfer process with the air, thereby suppressing the influence of ambient temperature fluctuations on the temperature field of the atomic gas chamber of the sensitive device of the miniaturized atomic sensor.

[0014] The above scheme requires the design of vacuum tooling for the atomic sensor. On the one hand, it places very high requirements on the vacuum performance indicators of the vacuum tooling, which is very difficult to implement and the system complexity is very high. On the other hand, it will greatly increase the volume of the atomic sensor, which is not conducive to the miniaturization of the atomic sensor.

[0015] ② Temperature control system and temperature control method for atomic gas chamber;

[0016] The invention provides a temperature control system for an atomic gas chamber, comprising: a heating wire wound around the outer surface of the atomic gas chamber; a heating drive circuit connected to both ends of the heating wire; a controller connected to the heating drive circuit, for controlling the operation of the heating drive circuit to achieve temperature control of the heating wire; an ammeter arranged on a connecting branch between the heating drive circuit and the heating wire, for measuring the current value flowing through the heating wire; and a voltmeter, both ends of which are respectively connected to the two ends of the heating wire, for measuring the voltage value at both ends of the heating wire; the present disclosure also provides an optically pumped magnetometer, a nuclear magnetic resonance gyroscope, and a temperature control method implemented by a temperature control system.

[0017] The above solution for miniaturized atomic sensors uses a heater attached to the outside of the gas cell glass. This is heated by current control, and the heater's temperature is controlled by natural heat dissipation and PID control. However, ambient temperature may fluctuate, resulting in the atomic gas cell temperature not being the one that maximizes the gas cell signal. This atomic gas cell temperature control solution still fails to account for the impact of ambient temperature fluctuations. Summary of the Invention

[0018] In order to solve the above technical problems, the present invention provides an atomic sensor temperature field compensation control system and method. The invention can suppress the interference of ambient temperature on the temperature field of the atomic gas chamber. With the purpose of compensating the ambient temperature interference of the atomic gas chamber, the temperature field control system of the miniaturized atomic sensor is improved, thereby improving the stability of the temperature field and the temperature stability and uniformity of the sensitive elements of the atomic sensor.

[0019] In a first aspect, an atomic sensor temperature field compensation control system comprises:

[0020] Temperature acquisition unit, temperature control unit and heating unit;

[0021] The temperature acquisition unit includes: a pair of external environment temperature sensors, a pair of shell temperature sensors and a pair of oven temperature sensors, wherein:

[0022] The pair of external environment temperature sensors is used to collect the temperature of the external environment of the atomic sensor;

[0023] The pair of shell temperature sensors is used to collect the temperature of the magnetic shielding barrel;

[0024] The pair of oven temperature sensors is used to collect the temperature of the oven;

[0025] As an example, the pair of external environment temperature sensors are arranged on both sides of the outside of the magnetic shielding barrel and keep a certain distance from the magnetic shielding barrel.

[0026] As an example, the certain distance is preferably 5-10 cm.

[0027] As an example, the pair of housing temperature sensors are arranged on both sides of the interior of the magnetic shielding barrel and are installed in contact with the magnetic shielding barrel.

[0028] As an example, the pair of oven temperature sensors are arranged on both sides of the outside of the oven and are installed in contact with the oven.

[0029] As an example, the pair of ambient temperature sensors may also be one or three or more ambient temperature sensors;

[0030] The pair of housing temperature sensors may also be one or three or more housing temperature sensors;

[0031] The pair of oven temperature sensors may also be one or three or more oven temperature sensors.

[0032] As an example, the pair of external environment temperature sensors, the pair of housing temperature sensors and the pair of oven temperature sensors are on the same horizontal line as the atomic gas chamber of the atomic sensor, which can make the collected temperature changes more accurate.

[0033] As an example, the pair of external environment temperature sensors, the pair of housing temperature sensors and the pair of oven temperature sensors all adopt a temperature measuring resistor structure.

[0034] The temperature control unit includes: a temperature measurement module, a multi-channel temperature acquisition module, a control module, a drive signal generation module and a power amplifier, wherein:

[0035] One end of the temperature measurement module is electrically connected to the temperature acquisition unit for realizing temperature measurement;

[0036] One end of the multi-channel temperature acquisition module is electrically connected to the other end of the temperature measurement module, so as to realize simultaneous acquisition and transmission of multi-channel temperature data.

[0037] One end of the control module is electrically connected to the other end of the multi-channel temperature acquisition module, and is used to output a temperature control signal after calculating according to the collected temperature signal;

[0038] One end of the driving signal generating module is electrically connected to the other end of the control module, and is used to output a driving signal of corresponding amplitude according to the temperature control signal.

[0039] One end of the power amplifier is electrically connected to the other end of the driving signal generating module, and provides power gain and current gain for the heating unit according to the driving signal;

[0040] As an example, the temperature measurement module adopts: a proportional temperature measurement circuit.

[0041] As an example, the multi-channel temperature acquisition module includes: a multi-channel A\D acquisition conversion circuit.

[0042] As an example, the control module is: an ARM controller.

[0043] As an example, the driving signal generating module adopts: a sine wave signal generating circuit.

[0044] As an example, the power amplifier includes: an active filter amplifier circuit, a voltage buffer amplifier circuit and a D / A control signal conversion circuit.

[0045] The heating unit is electrically connected to the other end of the power amplifier, and is disposed on the outside of the magnetic shielding barrel and is in close contact with the outside of the magnetic shielding barrel, so as to provide real-time temperature compensation for the inside of the magnetic shielding barrel.

[0046] As an example, the heating unit is placed close to the outside of the magnetic shielding barrel. When the heating unit is working, the delay time for the magnetic shielding barrel to produce corresponding temperature changes can be minimized. In addition, the magnetic shielding barrel is in direct contact with the external environment. When the ambient temperature changes, its temperature response speed is the fastest. Therefore, the magnetic shielding barrel is selected as the temperature control compensation point of the atomic sensor temperature field.

[0047] In a second aspect, a method for compensating the temperature field of an atomic sensor is provided. When the atomic gas chamber temperature control system is operating, the atomic sensor temperature field compensation system is activated to implement compensation adjustment of the atomic sensor temperature field, thereby suppressing the influence of ambient temperature changes on the atomic gas chamber temperature field. The specific operations include:

[0048] Step 1: The temperature acquisition unit collects the temperature of the external environment of the atomic sensor, the temperature of the magnetic shielding barrel, and the temperature of the oven, and transmits the collected temperature data to the temperature measurement module in real time;

[0049] Specifically: When the ambient temperature changes, the external ambient temperature sensor first senses the temperature change of the external environment. As the heat transfer balance between the magnetic shielding barrel and the external environment is broken, the shell temperature sensor then senses the temperature change of the magnetic shielding barrel, and finally the oven temperature sensor senses the temperature change of the oven.

[0050] Step 2: The temperature measurement module converts the temperature data into voltage data and transmits it to the multi-channel temperature acquisition module;

[0051] Step 3: The multi-channel temperature acquisition module converts the voltage data into a digital signal and transmits it to the control module;

[0052] Step 4: The control module has a built-in control algorithm, which outputs a temperature control signal to the drive signal generating module according to the digital signal;

[0053] As an example, since both the change and measurement of temperature have hysteresis, the control algorithm adopts PID control algorithm to achieve higher control accuracy and stability.

[0054] Since the control module can only process discrete digital signals, the PID control algorithm needs to be discretized. Ultimately, the relationship between the output temperature control signal and the input digital signal is shown in the following formula:

[0055]

[0056] Where k is the number of steps in the discretized time series; Δt is the sampling time of the multi-channel temperature acquisition module; u(k) is the temperature control signal output by the control module at time k, which is a voltage signal; e(k) is the temperature difference between the temperature set value and the feedback temperature measurement value at time k; is the accumulation of temperature differences before time k; e(k)-e(k-1) is the change in the temperature difference at time k compared to the temperature at time k-1; Kp is the proportional coefficient, Ki is the integral coefficient, and Kd is the differential coefficient.

[0057] As an example, the lower limit of the temperature control interval in which the control module executes the PID control algorithm is set to hc1, and the upper limit is hc2: if the temperature measurement value h2(k) is higher than the upper limit hc2 of the set temperature control interval, the temperature control signal output u(k) is zero; if the temperature measurement value h2(k) is lower than the lower limit hc1 of the set temperature control interval, the temperature control signal output u(k) is the maximum value Vom; if the temperature measurement value h2(k) is within the set temperature control interval, u(k) is calculated and output using the PID control algorithm.

[0058] Step 5: The driving signal generating module outputs a driving signal of corresponding amplitude to the power amplifier according to the temperature control signal;

[0059] Step 6: The power amplifier drives the heating unit according to the driving signal, and the heating unit performs temperature compensation on the magnetic shielding barrel to achieve stable control of the temperature field of the atomic sensor.

[0060] Beneficial effects of the present invention:

[0061] The present invention uses a multi-channel high-precision temperature measurement system to accurately measure the external ambient temperature and the internal temperature field of the atomic sensor, and then drives the heating unit to compensate for the heating of the magnetic shielding barrel shell, thereby achieving stable control of the internal temperature field and suppressing the influence of the ambient temperature on the temperature field of the atomic gas chamber.

[0062] The atomic gas chamber is located at the center of the atomic sensor. Before the external ambient temperature affects the temperature field of the atomic gas chamber, it will first affect the temperature field inside the atomic sensor. The internal temperature field can not only achieve real-time and accurate measurement, but also perform effective and stable control. Therefore, stable control of the internal temperature field of the atomic sensor is an effective method to compensate for the ambient temperature interference of the atomic gas chamber temperature field, which helps to further improve the signal-to-noise ratio of the nuclear magnetic gyroscope and achieve higher accuracy of miniaturized atomic sensors.

[0063] The present invention realizes closed-loop control of the internal temperature field of the atomic sensor, can effectively suppress the interference of the ambient temperature on the temperature field of the atomic gas chamber, can improve the uniformity and stability of the temperature field of the atomic gas chamber, and can effectively suppress the influence of ambient temperature fluctuations on the performance of the miniaturized atomic sensor.

[0064] The present invention avoids the influence of external ambient temperature changes on the temperature field of the atomic gas chamber. By performing heating compensation on the atomic sensor, the influence of the ambient temperature on the temperature field of the miniaturized atomic sensor is suppressed, thereby suppressing the influence of the ambient temperature on the temperature field of the atomic gas chamber, improving the stability and uniformity of the temperature field of the atomic gas chamber, and improving the ability to resist ambient temperature interference. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] Figure 1This is a schematic diagram of the overall structure of an atomic sensor temperature field compensation control system of the present invention.

[0066] Figure 2 This is a schematic diagram of the process design of an atomic sensor temperature field compensation method of the present invention.

[0067] Figure 3 This is a schematic diagram of the principle of Example 1 of an atomic sensor temperature field compensation control system of the present invention.

[0068] Figure 4 This is a schematic diagram of the control algorithm for the temperature field compensation method of an atomic sensor according to the present invention. (Here, hc1 is the lower limit temperature of the PID control range, and hc2 is the upper limit temperature of the PID control range.) DETAILED DESCRIPTION

[0069] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work shall fall within the scope of protection of the present application. Figures 1 to 4 As shown:

[0070] Reference Figure 1 As shown, an atomic sensor temperature field compensation control system includes:

[0071] Temperature acquisition unit, temperature control unit and heating unit 2;

[0072] The temperature acquisition unit includes: a pair of external environment temperature sensors (5 and 10), a pair of shell temperature sensors (6 and 9) and a pair of oven temperature sensors (7 and 8), wherein:

[0073] The pair of external environment temperature sensors is used to collect the temperature of the external environment of the atomic sensor;

[0074] The pair of shell temperature sensors is used to collect the temperature of the magnetic shielding barrel 1;

[0075] The pair of oven temperature sensors is used to collect the temperature of the oven 3;

[0076] As an example, the pair of external environment temperature sensors are arranged on both sides of the outside of the magnetic shielding barrel 1 and keep a certain distance from the magnetic shielding barrel 1 .

[0077] As an example, the certain distance is preferably 5-10 cm.

[0078] As an example, the pair of housing temperature sensors are arranged on both sides of the interior of the magnetic shielding barrel 1 and are installed in contact with the magnetic shielding barrel 1 .

[0079] As an example, the pair of oven temperature sensors are arranged on both sides of the outside of the oven 3 and are installed in contact with the oven 3.

[0080] As an example, the pair of ambient temperature sensors may also be one or three or more ambient temperature sensors;

[0081] The pair of housing temperature sensors may also be one or three or more housing temperature sensors;

[0082] The pair of oven temperature sensors may also be one or three or more oven temperature sensors.

[0083] As an example, the pair of external environment temperature sensors, the pair of housing temperature sensors and the pair of oven temperature sensors are on the same horizontal line as the atomic gas chamber 4 of the atomic sensor, which can make the collected temperature changes more accurate.

[0084] As an example, the pair of external environment temperature sensors, the pair of housing temperature sensors and the pair of oven temperature sensors all adopt a temperature measuring resistor structure.

[0085] The temperature control unit includes: a temperature measurement module 11, a multi-channel temperature acquisition module 12, a control module 13, a drive signal generation module 14 and a power amplifier 15, wherein:

[0086] One end of the temperature measurement module 11 is electrically connected to one end of the temperature acquisition unit to achieve temperature measurement;

[0087] One end of the multi-channel temperature acquisition module 12 is electrically connected to the other end of the temperature measurement module 11 to achieve simultaneous acquisition and transmission of multi-channel temperature data.

[0088] One end of the control module 13 is electrically connected to the other end of the multi-channel temperature acquisition module 12, and is used to calculate and output a temperature control signal based on the collected temperature signal;

[0089] One end of the driving signal generating module 14 is electrically connected to the other end of the control module 13 , and is configured to output a driving signal of corresponding amplitude according to the temperature control signal.

[0090] One end of the power amplifier 15 is electrically connected to the other end of the driving signal generating module 14, and provides power gain and current gain for the heating unit according to the driving signal;

[0091] As an example, the temperature measurement module 11 adopts: a proportional temperature measurement circuit.

[0092] As an example, the multi-channel temperature acquisition module 12 includes: a multi-channel A\D acquisition conversion circuit.

[0093] As an example, the control module 13 is an ARM controller.

[0094] As an example, the driving signal generating module 14 adopts: a sine wave signal generating circuit.

[0095] As an example, the power amplifier 15 includes: an active filter amplifier circuit, a voltage buffer amplifier circuit and a D / A control signal conversion circuit.

[0096] The heating unit 2 is electrically connected to the other end of the power amplifier 15 , and is disposed outside the magnetic shielding barrel 1 and in close contact therewith, so as to provide real-time temperature compensation for the interior of the magnetic shielding barrel 1 .

[0097] As an example, the heating unit 2 is placed close to the outside of the magnetic shielding barrel 1. When the heating unit is working, the delay time for the magnetic shielding barrel 1 to produce the corresponding temperature change can be minimized. In addition, the magnetic shielding barrel 1 is in direct contact with the external environment. When the ambient temperature changes, its temperature response speed is the fastest. Therefore, the magnetic shielding barrel 1 is selected as the temperature control compensation point of the atomic sensor temperature field.

[0098] Reference Figure 2 As shown, a method for compensating the temperature field of an atomic sensor is provided. When the atomic gas chamber temperature control system is working, the atomic sensor temperature field compensation system is started to implement compensation adjustment of the atomic sensor temperature field, thereby suppressing the influence of ambient temperature changes on the atomic gas chamber temperature field. The specific operations include:

[0099] Step 1: The temperature acquisition unit collects the temperature of the external environment of the atomic sensor, the temperature of the magnetic shielding barrel, and the temperature of the oven, and transmits the collected temperature data to the temperature measurement module in real time;

[0100] Specifically: when the ambient temperature changes, the external ambient temperature sensor first senses the temperature change of the external environment. As the heat transfer balance between the magnetic shielding barrel 1 and the external environment is broken, the shell temperature sensor then senses the temperature change of the magnetic shielding barrel, and finally the oven temperature sensor senses the temperature change of the oven.

[0101] Step 2: The temperature measurement module 11 converts the temperature data into voltage data and transmits it to the multi-channel temperature acquisition module 12;

[0102] Step 3: The multi-channel temperature acquisition module 12 converts the voltage data into a digital signal and transmits it to the control module 13;

[0103] Step 4: The control module 13 has a built-in control algorithm, and outputs a temperature control signal to the drive signal generating module 14 according to the digital signal;

[0104] As an example, since both the change and measurement of temperature have hysteresis, the control algorithm adopts PID control algorithm to achieve higher control accuracy and stability.

[0105] Since the control module can only process discrete digital signals, the PID control algorithm needs to be discretized. Ultimately, the relationship between the output temperature control signal and the input digital signal is shown in the following formula:

[0106]

[0107] Where k is the number of steps in the discretized time series; Δt is the sampling time of the multi-channel temperature acquisition module; u(k) is the temperature control signal output by the control module at time k, which is a voltage signal; e(k) is the temperature difference between the temperature set value and the feedback temperature measurement value at time k; is the accumulation of temperature differences before time k; e(k)-e(k-1) is the change in the temperature difference at time k compared to the temperature at time k-1; Kp is the proportional coefficient, Ki is the integral coefficient, and Kd is the differential coefficient.

[0108] As an example, the lower limit of the temperature control interval in which the control module executes the PID control algorithm is set to hc1, and the upper limit is hc2: if the temperature measurement value h2(k) is higher than the upper limit hc2 of the set temperature control interval, the temperature control signal output u(k) is zero; if the temperature measurement value h2(k) is lower than the lower limit hc1 of the set temperature control interval, the temperature control signal output u(k) is the maximum value Vom; if the temperature measurement value h2(k) is within the set temperature control interval, u(k) is calculated and output using the PID control algorithm.

[0109] Step 5: The driving signal generating module 14 outputs a driving signal of corresponding amplitude to the power amplifier 15 according to the temperature control signal;

[0110] Step 6: The power amplifier 15 drives the heating unit 2 according to the driving signal, and the heating unit performs temperature compensation on the magnetic shielding barrel 1 to achieve stable control of the temperature field of the atomic sensor.

[0111] In order to better illustrate the design principle of the present invention, the actual working state is described again by way of drawing:

[0112] Example 1:

[0113] Take the NMR gyro temperature field control system to realize the compensation of the atomic gas chamber ambient temperature interference as an example, see Figure 3 shown.

[0114] Figure 3 It is clearly expressed in the specification that the atomic sensor temperature field compensation control system of the present invention implements a specific structural example of atomic gas chamber ambient temperature interference compensation in the nuclear magnetic resonance gyroscope temperature field control system. It should be noted that for Example 1, in order to simply describe and simplify the specific structural design, only the principle structure is expressed. Those skilled in the art should know that this application is not limited by the described simplification; those skilled in the art should also know that the embodiments described in the specification are all optional embodiments, and the actions involved are not necessarily required for this application.

[0115] As an example, if a special water-cooled box or constant temperature box is used, a stable external ambient temperature can be provided for the miniaturized atomic sensor, thereby reducing the impact of external environmental fluctuations on the temperature field of the atomic gas chamber. However, this method only exists in theory. In actual operation, it is large in size, expensive, and cannot be installed.

[0116] As an example, if the light absorption method is used to measure temperature, the temperature field of the atomic gas chamber can be measured and closed-loop controlled, reducing the impact of the external environment on the temperature field of the atomic gas chamber. However, the measurement accuracy of the light absorption method is insufficient, and the existing technology is not mature enough to achieve this.

[0117] The above are only preferred embodiments of the present invention. It should be understood that the description of the above embodiments is only used to help understand the method and core ideas of the present invention, and is not used to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, etc. made within the ideas and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An atomic sensor temperature field compensation control system, characterized in that: include: Temperature acquisition unit, temperature control unit and heating unit; The temperature acquisition unit includes: a pair of external environment temperature sensors, a pair of shell temperature sensors and a pair of oven temperature sensors, wherein: the pair of external environment temperature sensors are used to collect the temperature of the external environment of the atomic sensor; the pair of shell temperature sensors are used to collect the temperature of the magnetic shielding barrel; the pair of oven temperature sensors are used to collect the temperature of the oven; The temperature control unit includes: a temperature measurement module, a multi-channel temperature acquisition module, a control module, a drive signal generation module and a power amplifier, wherein: one end of the temperature measurement module is electrically connected to the temperature acquisition unit for measuring temperature; one end of the multi-channel temperature acquisition module is electrically connected to the other end of the temperature measurement module for simultaneously acquiring and transmitting multi-channel temperature data; one end of the control module is electrically connected to the other end of the multi-channel temperature acquisition module for calculating and outputting a temperature control signal based on the collected temperature signal; one end of the drive signal generation module is electrically connected to the other end of the control module for outputting a drive signal of corresponding amplitude based on the temperature control signal; one end of the power amplifier is electrically connected to the other end of the drive signal generation module for providing power gain and current gain for the heating unit based on the drive signal; The heating unit is electrically connected to the other end of the power amplifier, and is disposed on the outside of the magnetic shielding barrel and is in close contact with the outside of the magnetic shielding barrel, so as to provide real-time temperature compensation for the inside of the magnetic shielding barrel.

2. The atomic sensor temperature field compensation control system according to claim 1, characterized in that: The pair of external environment temperature sensors are arranged on both sides of the outside of the magnetic shielding barrel and maintain a certain distance from the magnetic shielding barrel; the pair of shell temperature sensors are arranged on both sides of the inside of the magnetic shielding barrel and are installed in contact with the magnetic shielding barrel; the pair of oven temperature sensors are arranged on both sides of the outside of the oven and are installed in contact with the oven.

3. The atomic sensor temperature field compensation control system according to claim 1, characterized in that: The pair of external environment temperature sensors are replaced by one or three or more external environment temperature sensors; the pair of shell temperature sensors are replaced by one or three or more shell temperature sensors; the pair of oven temperature sensors are replaced by one or three or more oven temperature sensors.

4. The atomic sensor temperature field compensation control system according to claim 1, characterized in that: The pair of external environment temperature sensors, the pair of shell temperature sensors and the pair of oven temperature sensors are located on the same horizontal line as the atomic gas chamber of the atomic sensor.

5. The atomic sensor temperature field compensation control system according to claim 1, characterized in that: The pair of external environment temperature sensors, the pair of shell temperature sensors and the pair of oven temperature sensors all adopt temperature measuring resistor structures.

6. The atomic sensor temperature field compensation control system according to claim 1, characterized in that: The temperature measurement module adopts: a proportional temperature measurement circuit.

7. The atomic sensor temperature field compensation control system according to claim 1, characterized in that: The multi-channel temperature acquisition module includes: a multi-channel A\D acquisition conversion circuit, and the control module is: an ARM controller.

8. The atomic sensor temperature field compensation control system according to claim 1, characterized in that: The driving signal generating module adopts: a sine wave signal generating circuit.

9. The atomic sensor temperature field compensation control system according to claim 1, characterized in that: The power amplifier includes an active filter amplifier circuit, a voltage buffer amplifier circuit and a D / A control signal conversion circuit.

10. A method for compensating temperature field of an atomic sensor, characterized in that: include: Step 1: The temperature acquisition unit collects the temperature of the external environment of the atomic sensor, the temperature of the magnetic shielding barrel, and the temperature of the oven, and transmits the collected temperature data to the temperature measurement module in real time; Step 2: The temperature measurement module converts the temperature data into voltage data and transmits it to the multi-channel temperature acquisition module; Step 3: The multi-channel temperature acquisition module converts the voltage data into a digital signal and transmits it to the control module; Step 4: The control module has a built-in control algorithm, which outputs a temperature control signal to the drive signal generating module according to the digital signal; The control algorithm adopts PID control algorithm to achieve higher control accuracy and stability. Since the control module can only process discrete digital signals, the PID control algorithm needs to be discretized. Finally, the relationship between the output temperature control signal and the input digital signal is shown in the following formula: Where k is the number of steps in the discretized time series; Δt is the sampling time of the multi-channel temperature acquisition module; u(k) is the temperature control signal output by the control module at time k, which is a voltage signal; e(k) is the temperature difference between the temperature set value and the feedback temperature measurement value at time k; is the accumulation of temperature differences before time k; e(k)-e(k-1) is the change in the temperature difference at time k compared to time k-1; Kp is the proportional coefficient, Ki is the integral coefficient, and Kd is the differential coefficient; Step 5: The driving signal generating module outputs a driving signal of corresponding amplitude to the power amplifier according to the temperature control signal; Step 6: The power amplifier drives the heating unit according to the driving signal, and the heating unit performs temperature compensation on the magnetic shielding barrel to achieve stable control of the temperature field of the atomic sensor.

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