Front window module and server

Abstract

The present application discloses a front window module and server, relating to the field of server technology. The front window module includes a base, a mainboard, and two groups of hard disk modules, two groups of half-height PCIE modules, and a full-height PCIE module disposed in an accommodating cavity. The base has an accommodating cavity; the mainboard is disposed at the front bottom of the accommodating cavity, with notches at both ends of the mainboard's front side in a first direction; the two groups of hard disk modules are disposed in a one-to-one correspondence at the two notches; the two groups of half-height PCIE modules and the full-height PCIE module are both disposed on the top of the mainboard, and in the first direction, the two groups of half-height PCIE modules are spaced apart and disposed between the two groups of hard disk modules, and the full-height PCIE module is disposed between the two half-height PCIE modules; multiple hard disks are stacked in sequence in a second direction; multiple half-height PCIE cards are disposed in sequence along the first direction; and multiple full-height PCIE cards are stacked in sequence along the second direction. The present invention has a compact structure and is conducive to improving space utilization.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a front window module and a server. Background Art

[0002] With the development of Internet technology, servers are increasingly required to accommodate more PCIe cards for higher-precision computing. However, due to the limited space within the chassis and the motherboard structure, if the space cannot be properly utilized, it is impossible to install the required PCIe cards and hard drives in the limited space. Summary of the Invention

[0003] The present application aims to solve one of the technical problems in the related art at least to a certain extent.

[0004] To this end, an embodiment of the present application proposes a front window module with a compact structure, which is conducive to improving space utilization.

[0005] This application also provides a server.

[0006] The front window module in the embodiment of the present application includes a base, a mainboard, and two groups of hard disk modules, two groups of half-height PCIE modules, and a full-height PCIE module arranged in the accommodating cavity, wherein the base has an accommodating cavity; the mainboard is arranged at the front bottom of the accommodating cavity, and both ends of the front side of the mainboard have notches in a first direction; the two groups of hard disk modules are arranged in a one-to-one correspondence at the two notches, the two groups of half-height PCIE modules and the full-height PCIE module are both arranged on the top of the mainboard, and in the first direction, the two groups of half-height PCIE modules are arranged between the two groups of hard disk modules at intervals, and the full-height PCIE module is arranged between the two half-height PCIE modules; the hard disk module includes multiple hard disks, and in the second direction, the multiple hard disks are stacked in sequence, and the second direction is arranged orthogonally to the first direction; the half-height PCIE module includes multiple half-height PCIE cards, and the multiple half-height PCIE cards are arranged in sequence along the first direction; the full-height PCIE module includes multiple full-height PCIE cards, and the multiple full-height PCIE cards are stacked in sequence along the second direction.

[0007] The front window module in this embodiment is provided with hard disk modules at the notches at both ends of the mainboard according to the structure of the mainboard itself. The multiple hard disks of each hard disk module are stacked in sequence along the second direction, and a maximum number of hard disks can be arranged at the notches; a full-height PCIE module is provided in the middle of the accommodating cavity, and the multiple full-height PCIE cards of the full-height PCIE module are stacked in sequence along the second direction. A corresponding number of full-height PCIE cards can be set according to the height of the accommodating cavity in the second direction, and a half-height PCIE module is provided between each hard disk module and the full-height PCIE module. The multiple half-height PCIE cards of each half-height PCIE module are arranged in sequence along the first direction. A reasonable layout is made according to the size and quantity requirements of the full-height PCIE cards and the half-height PCIE cards themselves. The structure is compact and the space utilization is improved. While meeting the installation space requirements, a maximum number of half-height PCIE cards and full-height PCIE cards can be set in the limited space on the front side of the accommodating cavity, thereby meeting the functional requirements of the front window module.

[0008] In this embodiment, the front window module further includes a supporting assembly, a supporting portion of the supporting assembly is located between the mainboard and the full-height PCIE module, and a cavity for accommodating a heat sink is formed between the supporting portion and the mainboard.

[0009] In this embodiment, the support assembly includes a support plate and a first connecting member, the first connecting member passes through the mainboard and is connected to the base, the support plate is arranged on the first connecting member, and the support plate is located between the mainboard and the full-height PCIE module.

[0010] In this embodiment, the front side of the support plate has a positioning portion, the front side of the base is provided with a front window, and the support plate is positioned at the front window through the positioning portion.

[0011] In this embodiment, the full-height PCIE module also includes a first module bracket, which is arranged on the base. The first module bracket has multiple installation slots distributed along the second direction, and multiple full-height PCIE cards are arranged in the installation slots one by one.

[0012] In this embodiment, the full-height PCIE module also includes a riser card and an adapter card that are plugged into each other. There are multiple riser cards, and the multiple riser cards are connected to the multiple full-height PCIE cards in a one-to-one correspondence. The riser card and the adapter card are arranged in sequence on the first module bracket along a third direction and are located on one side of the multiple full-height PCIE cards. The third direction is orthogonal to the first direction and the second direction.

[0013] In this embodiment, the full-height PCIE module also includes a first board bracket and a second board bracket, the riser card is arranged on the first board bracket, and the first board bracket is arranged on the first module bracket; the adapter card is arranged on the second board bracket, and the second board is arranged on the first module bracket.

[0014] In this embodiment, the first module bracket includes a first frame and a second frame, the first frame is arranged on the base, the first frame has a bottom plate and a side plate, the first board bracket and the second board bracket are both arranged on the side plate of the first frame; the second frame is arranged on the bottom plate of the first frame, and the second frame has a plurality of the mounting slots.

[0015] In this embodiment, the front window module further includes an FIO module, and the FIO module is disposed between the full-height PCIE module and the half-height PCIE module.

[0016] In this embodiment, the FIO module includes an FIO board and an FIO bracket. The FIO board is arranged on the FIO bracket, and the FIO bracket is arranged on the full-height PCIE module.

[0017] In this embodiment, the hard disk module includes a hard disk bracket and a hard disk backplane, and the hard disk bracket is arranged on the base; multiple hard disks and the hard disk backplane are distributed on the hard disk bracket in sequence along the third direction, and the hard disk backplane includes a backplane body and multiple plug-in connectors, and the backplane body is located on one side of the multiple hard disks along the first direction, and the multiple plug-in connectors are arranged on the hard disk backplane in sequence along the second direction and are connected one-to-one with the multiple hard disks along the third direction.

[0018] In this embodiment, the front window module further includes an upper cover, which is detachably disposed on the top of the base.

[0019] The server in the embodiment of the present application includes a chassis and the above-mentioned front window module, and the front window module is arranged in the chassis.

[0020] In this embodiment, a slide rail is provided on the outer side of the base, and a track matching and connected to the slide rail is provided in the chassis, so that the base is slidably connected to the chassis.

[0021] In this embodiment, the server also includes a power-assisting handle, a stop pin is provided on the chassis, the power-assisting handle is provided on the front side of the base, and is rotatable relative to the base in an open position and a closed position, and the power-assisting handle has a stop portion, in the open position, the stop portion is separated from the chassis, and in the closed position, the stop portion stops at the stop pin. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] Figure 1 A schematic diagram of the structure of the server provided in the embodiment of the present application;

[0024] Figure 2 A schematic diagram of a portion of the structure of a server provided in an embodiment of the present application;

[0025] Figure 3 A schematic diagram of the structure of the front window module provided in an embodiment of the present application with the upper cover removed;

[0026] Figure 4 An exploded view of the base, support assembly, and half-height PCIE module of the front window module provided in an embodiment of the present application;

[0027] Figure 5 A schematic diagram of the structure of the front window module provided in an embodiment of the present application after removing the upper cover and the full-height PCIE module;

[0028] Figure 6 A schematic structural diagram of the base, mainboard, and support assembly of the front window module provided in an embodiment of the present application;

[0029] Figure 7 An exploded view of a full-height PCIE module provided in an embodiment of the present application;

[0030] Figure 8 An exploded view of the first board bracket, the second board bracket, the riser card, and the adapter card provided in an embodiment of the present application;

[0031] Figure 9 An exploded view of the first frame, the first board bracket, and the second board bracket provided in an embodiment of the present application;

[0032] Figure 10 A schematic structural diagram of a first board bracket and a second board bracket provided in an embodiment of the present application;

[0033] Figure 11 A schematic diagram of the structure of a full-height PCIE module provided in an embodiment of the present application;

[0034] Figure 12 A schematic diagram of the structure of a full-height PCIE module and an FIO module provided in an embodiment of the present application;

[0035] Figure 13A schematic diagram of the structure of the FIO module provided in an embodiment of the present application;

[0036] Figure 14 A schematic diagram of the structure of a hard disk module provided in an embodiment of the present application;

[0037] Figure 15 A schematic structural diagram of the power-assist handle provided in an embodiment of the present application.

[0038] The above drawings include the following reference numerals:

[0039] 100. Front window module;

[0040] 200, chassis; 201, bearing;

[0041] 300, power handle; 301, stopper; 302, limit hole; 303, locking screw;

[0042] 1. Base; 11. Accommodation cavity; 12. Front window; 13. Slide rail;

[0043] 2. Motherboard; 21. Notch;

[0044] 3. Hard disk module; 31. Hard disk; 32. Hard disk bracket; 322. Fourth slide; 33. Hard disk backplane; 331. Backplane body; 332. Plug connector;

[0045] 4. Half-height PCIE module; 41. Half-height PCIE card;

[0046] 5. Full-height PCIE module; 51. Full-height PCIE card; 52. First module bracket; 521. Mounting slot; 522. First guide pin; 523. Second guide pin; 524. First frame; 5241. Third guide pin; 5242. Third screw hole; 525. Second frame; 53. Riser card; 54. Adapter card; 55. First board bracket; 551. Second locating pin; 552. First screw hole; 553. First guide slot; 56. Second board bracket; 561. Second guide slot.

[0047] 6. Support assembly; 61. Support plate; 611. Positioning portion; 62. First connecting member;

[0048] 7. FIO module; 71. FIO board; 72. FIO bracket; 721. Third slide; 722. Thumb screw; 723. Connecting plate;

[0049] 8. Cover. DETAILED DESCRIPTION

[0050] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0051] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0052] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0053] The embodiment of the present application provides a front window module 100, such as Figure 1 and Figures 3 to 6As shown in the figure, the X direction is the first direction, the Z direction is the second direction, and the Y direction is the third direction. The front window module 100 includes a base 1, a motherboard 2, and two groups of hard disk modules 3, two groups of half-height PCIE modules 4, and a full-height PCIE module 5 arranged in the accommodating cavity 11. The base 1 has an accommodating cavity 11; the motherboard 2 is arranged at the front bottom of the accommodating cavity 11. In the first direction, both ends of the front side of the motherboard 2 have notches 21; the two groups of hard disk modules 3 are arranged in a one-to-one correspondence at the two notches 21, the two groups of half-height PCIE modules 4 and the full-height PCIE module 5 are both arranged on the top of the motherboard 2, and in the first direction, the two groups of half-height PCIE modules 4 are arranged between the two groups of hard disk modules 3, and the full-height PCIE module 5 is arranged between the two half-height PCIE modules 4. The hard disk module 3 includes multiple hard disks 31, which are stacked in sequence in the second direction, and the second direction is arranged orthogonal to the first direction. The half-height PCIE module 4 includes multiple half-height PCIE cards 41, which are arranged in sequence along the first direction. The full-height PCIE module 5 includes multiple full-height PCIE cards 51, which are stacked in sequence along the second direction.

[0054] Specifically, the base 1 includes a bottom plate and side plates arranged around the base 1 , a receiving cavity 11 is formed between the bottom plate and the side plates, and an opening is formed at the top to facilitate the installation and removal of each module inside the receiving cavity 11 .

[0055] In this embodiment, the front window module 100 is described using a 2U computing node in a 5U chassis as an example. Each hard disk module 3 includes four hard disks 31, each half-height PCIE module 4 includes four half-height PCIE cards 41, and each full-height PCIE module 5 includes two full-height PCIE cards 51. The half-height PCIE cards 41 are smaller than the full-height PCIE cards 51. The connections and operating principles among the motherboard 2, half-height PCIE cards 41, full-height PCIE cards 51, and hard disks 31 are conventional and will not be described in detail here.

[0056] The front window module 100 in this embodiment is provided with hard disk modules 3 at the notches 21 at both ends of the motherboard 2 according to the structure of the motherboard 2 itself. The multiple hard disks 31 of each hard disk module 3 are stacked in sequence along the second direction. The maximum number of hard disks 31 can be set at the notch 21; a full-height PCIE module 5 is provided in the middle of the accommodating cavity 11, and the multiple full-height PCIE cards 51 of the full-height PCIE module 5 are stacked in sequence along the second direction. A corresponding number of full-height PCIE cards 51 can be provided according to the height of the accommodating cavity 11 in the second direction. A half-height PCIE module 4 is arranged between the module 3 and the full-height PCIE module 5. Multiple half-height PCIE cards 41 of each half-height PCIE module 4 are arranged in sequence along the first direction, and are reasonably arranged according to the size and quantity requirements of the full-height PCIE card 51 and the half-height PCIE card 41. The structure is compact and the space utilization is improved. While meeting the installation space requirements, a maximum number of half-height PCIE cards 41 and full-height PCIE cards 51 can be arranged in the limited space on the front side of the accommodating cavity 11, thereby meeting the functional requirements of the front window module 100.

[0057] In this embodiment, if Figures 4 to 6 As shown, the front window module 100 further includes a supporting component 6 , the supporting portion of the supporting component 6 is located between the mainboard 2 and the full-height PCIE module 5 , and a cavity for accommodating a radiator is formed between the supporting portion and the mainboard 2 .

[0058] It should be noted that setting a radiator on the motherboard 2 can meet the heat dissipation requirements of the motherboard 2. By setting a support component 6, and the supporting part of the support component 6 is between the motherboard 2 and the full-height PCIE module 5, the full-height PCEI module can be supported by the support part, and the cavity formed between the support part and the motherboard 2 is used to accommodate the radiator, which can meet the installation requirements of the radiator and the installation of the full-height PCIE module 5.

[0059] In this embodiment, if Figure 4 As shown, the support assembly 6 includes a support plate 61 and a first connecting member 62. The first connecting member 62 passes through the motherboard 2 and is connected to the base 1. The support plate 61 is arranged on the first connecting member 62, and the support plate 61 is located between the motherboard 2 and the full-height PCIE module 5.

[0060] For example, the first connector 62 includes a lower stud, an upper stud, and a locking nut. The mainboard 2 is provided with an opening for the lower stud to pass through, and the support plate 61 is provided with an opening for the upper stud to pass through. The bottom end of the lower stud is connected to the base 1, and the lower stud passes through the opening in the mainboard 2. The support plate 61 is arranged on top of the lower stud. The upper stud passes through the opening in the support plate 61 and is threadedly connected to the lower stud. The locking nut is provided on the upper stud and is threadedly connected to the upper stud to lock the support plate 61 to the first connector 62. In this embodiment, multiple first connectors 62 are provided, and the multiple first connectors 62 are arranged at intervals to improve the stability of the support of the support plate 61.

[0061] It should be noted that by setting up the support plate 61 and the first connecting member 62, the support plate 61 can be supported by the first connecting member 62, and a cavity can be formed between the support plate 61 and the mainboard 2. The support plate 61 can form a larger support surface to support the full-height PCIE module 5.

[0062] In this embodiment, if Figure 4 and Figure 5 As shown, the front side of the support plate 61 has a positioning portion 611, and the front side of the base 1 is provided with a front window 12. The support plate 61 is positioned on the front window 12 through the positioning portion 611. For example, the front window 12 can be a casting, which has high strength and is easy to process.

[0063] Specifically, in the first direction, the two opposite sides of the middle part of the front window 12 are recessed downward to form a groove, and the positioning portion 611 is positioned in the groove. A first positioning hole is provided on the bottom surface of the groove, and a second positioning hole is provided on the positioning portion 611. When the positioning portion 611 is located in the groove, the positions of the first positioning hole and the second positioning hole along the second direction correspond to each other, and the positioning portion 611 is positioned in the groove by a first positioning pin that passes through the first positioning hole and the second positioning hole.

[0064] In this embodiment, by providing a positioning portion 611 to position the support plate 61, the installation of the first connector 62 can be facilitated. At the same time, by precisely defining the position of the support plate 61, it is beneficial to the subsequent accurate installation of the full-height PCIE module 5.

[0065] In this embodiment, if Figure 7 As shown, the full-height PCIE module 5 also includes a first module bracket 52, which is arranged on the base 1. The first module bracket 52 has a plurality of mounting slots 521 distributed along the second direction, and a plurality of full-height PCIE cards 51 are arranged in the mounting slots 521 in a one-to-one correspondence.

[0066] It is understandable that by providing the first module bracket 52 and providing a plurality of mounting slots 521 on the first module bracket 52 , the full-height PCIE card 51 can be supported and the installation of the full-height PCIE card 51 can be facilitated.

[0067] In this embodiment, if Figure 7 As shown, the full-height PCIE module 5 also includes a riser card 53 and an adapter card 54 that are plugged into each other. There are multiple riser cards 53, and the multiple riser cards 53 are connected to the multiple full-height PCIE cards 51 in a one-to-one correspondence. The riser cards 53 and the adapter cards 54 are arranged in sequence on the first module bracket 52 along the third direction and are located on one side of the multiple full-height PCIE cards 51. The third direction is orthogonal to the first direction and the second direction.

[0068] Specifically, the number of riser cards 53 can be set according to the number of full-height PCIE cards 51 , and each full-height PCIE card 51 is provided with a riser card 53 on one side along the first direction.

[0069] It can be understood that arranging the riser card 53 and the adapter card 54 in sequence along the third direction on the first module bracket 52 can save space along the second direction in the accommodating cavity 11, and arranging the riser card 53 on one side of the full-height PCIE card 51 can facilitate the connection between the riser card 53 and the full-height PCIE card 51, and can be compatible with multiple full-height PCIE cards 51 at the same time in a limited space.

[0070] In this embodiment, if Figure 7 As shown, the full-height PCIE module 5 also includes a first board bracket 55 and a second board bracket 56. The riser card 53 is arranged on the first board bracket 55, and the first board bracket 55 is arranged on the first module bracket 52; the adapter card 54 is arranged on the second board bracket 56, and the second board is arranged on the first module bracket 52.

[0071] Specifically, if Figures 8 to 10 As shown, the first board bracket 55 is provided with a first screw hole 552 and a second locating pin 551. The riser card 53 is provided with a third locating hole that matches the second locating pin 551, and is also provided with a first mounting hole that matches the first screw hole 552. The second locating pin 551 is inserted into the third locating hole. The first board bracket 55 is fixed by a screw that passes through the first screw hole 552 and the first mounting hole. The positions of the first screw hole 552 and the second locating pin 551 can be set as needed and are not limited here. The second board bracket 56 is provided with a nut. The riser card 54 is provided with a second screw hole that matches the nut. The riser card 54 and the second board bracket 56 are connected by a screw that passes through the second screw hole and is threaded into the nut.

[0072] Furthermore, if Figures 8 to 10 As shown, the first board bracket 55 is provided with a first slide groove 553 extending along the distribution direction of the riser card 53 and the adapter card 54, and the second board bracket 56 is provided with a second slide groove 561 extending along the distribution direction of the riser card 53 and the adapter card 54. The first module bracket 52 is provided with a first guide pin 522 corresponding to the first slide groove 553, and a second guide pin 523 corresponding to the second slide groove 561. The first slide groove 553 of the first board bracket 55 is attached to the first module bracket 52 corresponding to the first guide pin 522, and then the second slide groove 561 of the second board bracket 56 is attached to the first module bracket 52 corresponding to the second guide pin 523. The first board bracket 55 and the second board bracket 56 are slid relative to each other, so that the riser card 53 and the adapter card 54 are plugged into each other, and finally the first board bracket 55 and the second board bracket 56 are respectively fixed to the first module bracket 52 by screws.

[0073] The first board bracket 55 can be formed by two sheet metal parts being spliced ​​together relative to each other, that is, one of the two sheet metal parts faces the riser card 53 and the adapter card 54, and the other faces the first module bracket 52, so that it is convenient to set a structure connecting with the riser card 53 and the adapter card 54 on the sheet metal part facing the riser card 53 and the adapter card 54, and to set a connection structure with the first module bracket 52 on the sheet metal part facing the first module bracket 52.

[0074] When installing the riser card 53 and the adapter card 54, install the riser card 53 on the first board card bracket 55, then connect the first board card bracket 55 to the first module bracket 52, install the adapter card 54 on the second board card bracket 56, then install the second board card bracket 56 on the first module bracket 52, and connect the adapter card 54 to the riser card 53 at the same time, and then connect the first board card bracket 55 and the second board card bracket 56 to the first module bracket 52 respectively, and install the riser card 53 and the adapter card 54 respectively through the first board card bracket 55 and the second board card bracket 56. By pre-connecting the riser card 53 to the first board card bracket 55 and the adapter card 54 to the second board card bracket 56, the installation of the riser card 53 and the adapter card 54 can be quickly realized, and the structure of the first module bracket 52 is simplified.

[0075] In this embodiment, if Figure 9 As shown, the first module bracket 52 includes a first frame 524 and a second frame 525. The first frame 524 is arranged on the base 1. The first frame 524 has a bottom plate and a side plate. The first board bracket 55 and the second board bracket 56 are both arranged on the side plate of the first frame 524; the second frame 525 is arranged on the bottom plate of the first frame 524, and the second frame 525 has a plurality of mounting slots 521.

[0076] Specifically, the first frame 524 is fixed to the base 1 through the support assembly 6. The first frame 524 is arranged on the top of the support part. Interconnected positioning structures can be set on the support plate 61 and the first frame 524 to facilitate the accurate installation of the first frame 524 to a preset position. The specific form of the positioning structure can be selected by technicians in this field according to actual needs and will not be described in detail here.

[0077] By setting up the first frame 524, the first frame 524 includes a bottom plate and a side plate. The setting of the side plate can facilitate the installation of the riser card 53 and the adapter card 54. The bottom plate can facilitate the positioning of the first frame 524 and the installation of the second frame 525. By setting the installation slot 521 on the second frame 525, the installation of the full-height PCIE card 51 can be facilitated.

[0078] In this embodiment, if Figure 3 As shown, the front window module 100 further includes an FIO module 7 , which is disposed between the full-height PCIE module 5 and the half-height PCIE module 4 .

[0079] Specifically, the FIO module 7 is disposed on a side of the side panel away from the first board bracket 55 and the second board bracket 56 .

[0080] It should be noted that the FIO module 7 is disposed between the full-height PCIE module 5 and the half-height PCIE module 4 . The FIO module 7 can share the first module bracket 52 of the full-height PCIE module 5 , thereby saving space.

[0081] In this embodiment, if Figure 12 and Figure 13 As shown, the FIO module 7 includes an FIO board 71 and an FIO bracket 72 . The FIO board 71 is arranged on the FIO bracket 72 , and the FIO bracket 72 is arranged on the full-height PCIE module 5 .

[0082] Specifically, if Figures 11 to 13 As shown, the FIO bracket 72 is connected to the side panel of the first frame 524. A third guide pin 5241 is provided on the side of the first frame 524 facing the FIO bracket 72. The FIO bracket 72 is provided with a third guide slot 721 that matches the third guide pin 5241 and extends along the third direction. A third screw hole 5242 is also provided on the side panel of the first frame 524. A hand screw 722 is provided on the FIO bracket 72 and threadedly engages with the third screw hole 5242. To attach the FIO bracket 72 to the side panel of the first frame 524, the third guide pin 5241 is inserted into the third guide slot 721, and the position of the FIO bracket 72 is adjusted. After the adjustment is completed, the hand screw 722 is tightened into the third screw hole 5242 to secure the FIO bracket 72.

[0083] In order to further improve the accuracy of the installation position of the FIO module 7, a connecting plate 723 is provided on the side of the FIO bracket 72 facing away from the first module bracket 52. A fourth screw hole is provided on the connecting plate 723, and the support plate 61 and the connecting plate 723 are connected by screws passing through the support plate 61 and the fourth screw hole.

[0084] It can be understood that by pre-connecting the FIO board 71 to the FIO bracket 72, and then connecting the FIO bracket 72 to the full-height PCIE module 5, and connecting the full-height PCIE module 5 through the pre-processed connection structure on the FIO bracket 72, it is beneficial to improve the installation efficiency.

[0085] In this embodiment, if Figure 14 As shown, the hard disk module 3 includes a hard disk bracket 32 ​​and a backplane body 331, and the hard disk bracket 32 ​​is arranged on the base 1; multiple hard disks 31 and the backplane body 331 are distributed on the hard disk bracket 32 ​​in sequence along the third direction, and the backplane body 331 includes a backplane body 331 and multiple plug-in connectors 332, the backplane body 331 is located on one side of the multiple hard disks 31 along the first direction, and the multiple plug-in connectors 332 are arranged on the backplane body 331 in sequence along the second direction and are connected one-to-one with the multiple hard disks 31 along the third direction.

[0086] Specifically, the hard disk bracket 32 ​​has a plurality of cavities distributed along the second direction, and each hard disk 31 is installed in a cavity respectively. The provision of the cavities can facilitate the installation of the hard disks 31 .

[0087] The hard disk 31 can be connected to the hard disk bracket 32 ​​by screws. A fourth slide groove 322 is provided at the bottom of the hard disk bracket 32. The fourth slide groove 322 extends along the third direction. A fourth guide pin matching the fourth slide groove 322 is provided at the bottom of the base 1. The fourth slide groove 322 corresponds to the fourth guide pin to place the hard disk bracket 32 ​​in the base 1. The mobile hard disk bracket 32 ​​can adjust the position of the hard disk bracket 32. After the position of the hard disk bracket 32 ​​is adjusted, the hard disk bracket 32 ​​is fixed to the base 1 by screws.

[0088] It can be understood that multiple hard disks 31 and the backplane body 331 are distributed in sequence on the hard disk bracket 32 ​​along the third direction, and the backplane body 331 of the backplane body 331 is located on one side of the multiple hard disks 31 along the first direction, and the multiple plug-in connectors 332 of the backplane body 331 are plugged one by one with the multiple hard disks 31 along the third direction, so that the backplane body 331 will not block the heat dissipation of the hard disks 31 along the third direction, and there is no need to open holes in the backplane body 331 for heat dissipation, which saves processing steps, helps to reduce costs, and has a better heat dissipation effect.

[0089] In this embodiment, if Figure 8As shown, the front window module 100 further includes an upper cover 8 , which is detachably disposed on the top of the base 1 .

[0090] The upper cover 8 can be provided to block the opening at the top of the base 1, making the overall appearance more beautiful.

[0091] The server in the embodiment of the present application, such as Figure 1 As shown, it includes a chassis 200 and a front window module 100 , and the front window module 100 is disposed in the chassis 200 .

[0092] The server in this embodiment is provided with the front window module 100 described above, and a maximum number of half-height PCIE cards 41 and full-height PCIE cards 51 can be provided in a limited space, thereby meeting the functional requirements of the server.

[0093] In this embodiment, if Figure 2 As shown, a slide rail 13 is provided on the outer side of the base 1 , and a track matching and connected with the slide rail 13 is provided in the chassis 200 so that the base 1 can be slidably connected to the chassis 200 .

[0094] Specifically, the base 1 is provided with slide rails 13 on opposite sides, and a row of bearings 201 is provided in the chassis 200 corresponding to each slide rail 13. The slide rails 13 are overlapped on the bearings 201, that is, one row of slide rails 13 is overlapped on one row of bearings 201. When the base 1 is extended or pulled out, the base 1 can slide through the slide rails 13 and the bearings 201.

[0095] It is understandable that the base 1 can slide relative to the chassis 200 through the cooperation between the slide rail 13 and the bearing 201 , which can facilitate the installation and removal of the front window module 100 .

[0096] In this embodiment, if Figure 1 and Figure 15 As shown, the server also includes a power-assisting handle 300, and a stop pin is provided on the chassis 200. The power-assisting handle 300 is provided on the front side of the base 1 and can be rotated relative to the base 1 in the open position and the closed position. The power-assisting handle 300 has a stop portion 301. In the open position, the stop portion 301 is separated from the chassis 200, and in the closed position, the stop portion 301 stops at the stop pin.

[0097] Specifically, a limit hole 302 is provided in the center of the power-assist handle 300. A rotating shaft is provided on the base 1 to match the limit hole 302 and is inserted into the limit hole 302. A locking screw 303 is provided on the end of the power-assist handle 300 away from the stop portion 301. In the closed position, the locking screw 303 is locked onto the base 1, and the stop portion 301 abuts against the stop pin, thereby securing the base 1. To open the power-assist handle 300, loosen the locking screw 303, rotate the power-assist handle 300, and move the stop portion 301 away from the stop pin, thereby removing the window module from the chassis 200.

[0098] It should be noted that, because a high-density connector is provided on the rear side of the front window module 100 for precise insertion with the connector on the middle back panel in the middle of the chassis 200, a large insertion force is required for insertion, and therefore power-assisting handles 300 are provided on both sides of the front window module 100. By applying force with the help of the power-assisting handles 300, operation can be facilitated. Specifically, in the process of pushing the front window module 100 as a whole into the chassis 200, the slide rail 13 on the side of the base 1 is first placed on the bearing 201, and the roller is rotated so that the base 1 can be easily pushed in. After sliding to a certain position, the entire front window module 100 is installed in place with the help of the power-assisting handles 300. After installation, the power-assisting handles 300 are placed in the closed position to stably fix the front window module 100.

[0099] The above describes in detail the front window module and server provided by this application. This document uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is intended only to help understand the method and core concept of this application. It should be noted that those skilled in the art may make various improvements and modifications to this application without departing from the principles of this application, and such improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. A front window module, characterized in that: include: A base having a receiving cavity; A main board, which is arranged at the front bottom of the accommodating cavity, and has notches at both ends of the front side of the main board in a first direction; Two groups of hard disk modules, two groups of half-height PCIE modules, and a full-height PCIE module are arranged in the accommodating cavity, the two groups of hard disk modules are arranged in a one-to-one correspondence at the two notches, the two groups of half-height PCIE modules and the full-height PCIE module are both arranged on the top of the motherboard, and in the first direction, the two groups of half-height PCIE modules are arranged between the two groups of hard disk modules, and the full-height PCIE module is arranged between the two half-height PCIE modules; The hard disk module includes a plurality of hard disks, and the plurality of hard disks are stacked in sequence in a second direction, and the second direction is arranged orthogonally to the first direction; The half-height PCIE module includes a plurality of half-height PCIE cards, and the plurality of half-height PCIE cards are arranged in sequence along the first direction; The full-height PCIE module includes a plurality of full-height PCIE cards, and the plurality of full-height PCIE cards are stacked in sequence along the second direction.

2. The front window module according to claim 1, characterized in that: It also includes a supporting component, the supporting portion of the supporting component is located between the mainboard and the full-height PCIE module, and a cavity for accommodating a radiator is formed between the supporting portion and the mainboard.

3. The front window module according to claim 2, characterized in that: The support assembly comprises: A support plate and a first connecting member, wherein the first connecting member passes through the mainboard and is connected to the base, the support plate is arranged on the first connecting member, and the support plate is located between the mainboard and the full-height PCIE module.

4. The front window module according to claim 3, characterized in that: The front side of the support plate is provided with a positioning portion, the front side of the base is provided with a front window, and the support plate is positioned on the front window through the positioning portion.

5. The front window module according to claim 1, characterized in that: The full-height PCIE module further includes a first module bracket, which is arranged on the base. The first module bracket has a plurality of mounting slots distributed along the second direction, and a plurality of the full-height PCIE cards are arranged in the mounting slots in a one-to-one correspondence.

6. The front window module according to claim 5, characterized in that: The full-height PCIE module also includes a riser card and an adapter card that are plugged into each other. There are multiple riser cards, and the multiple riser cards are connected to the multiple full-height PCIE cards in a one-to-one correspondence. The riser cards and the adapter cards are sequentially arranged on the first module bracket along a third direction and are located on one side of the multiple full-height PCIE cards. The third direction is orthogonal to the first direction and the second direction.

7. The front window module according to claim 6, characterized in that: The full-height PCIE module also includes: a first board bracket, the riser card is arranged on the first board bracket, and the first board bracket is arranged on the first module bracket; A second board bracket, the adapter card is arranged on the second board bracket, and the second board is arranged between the first module bracket.

8. The front window module according to claim 7, characterized in that: The first module bracket includes: a first frame, the first frame being arranged on the base, the first frame having a bottom plate and side plates, the first board bracket and the second board bracket both being arranged on the side plates of the first frame; The second frame is arranged on the bottom plate of the first frame, and the second frame has a plurality of the installation slots.

9. The front window module according to claim 1, characterized in that: It also includes an FIO module, which is arranged between the full-height PCIE module and the half-height PCIE module.

10. The front window module according to claim 9, characterized in that: The FIO module includes an FIO board and an FIO bracket. The FIO board is arranged on the FIO bracket, and the FIO bracket is arranged on the full-height PCIE module.

11. The front window module according to claim 1, characterized in that: The hard disk module includes: A hard disk bracket, the hard disk bracket is arranged on the base; A hard disk backplane, wherein the multiple hard disks and the hard disk backplane are distributed on the hard disk bracket in sequence along a third direction, the hard disk backplane comprises a backplane body and multiple plug-in connectors, the backplane body is located on one side of the multiple hard disks along the first direction, and the multiple plug-in connectors are arranged on the hard disk backplane in sequence along the second direction and are connected one-to-one with the multiple hard disks along the third direction.

12. The front window module according to any one of claims 1 to 11, characterized in that: It also includes an upper cover, which is detachably arranged on the top of the base.

13. A server, characterized in that: The utility model comprises a chassis and the front window module according to any one of claims 1 to 12, wherein the front window module is arranged in the chassis.

14. The server according to claim 13, wherein: A slide rail is provided on the outer side of the base, and a track matching and connected to the slide rail is provided in the chassis, so that the base is slidably connected to the chassis.

15. The server according to claim 13, wherein: It also includes a power-assisting handle, a stop pin is provided on the chassis, the power-assisting handle is provided on the front side of the base, and is rotatable relative to the base in an open position and a closed position, the power-assisting handle has a stop portion, in the open position, the stop portion is separated from the chassis, and in the closed position, the stop portion stops at the stop pin.

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