Display device, electronic device, device for manufacturing display device, and method for manufacturing display device

Abstract

The invention relates to a display device, an electronic device, a device for manufacturing the display device, and a method for manufacturing the display device. The display device comprises a display panel. The display panel includes a substrate including a first region, a second region, and a bending region in a bent state. The bending region connects the first region to the second region. The first protective layer is disposed within the bending region of the substrate. The second protective layer is disposed on at least a portion of the edge of the substrate and at least one surface of the curved region of the substrate.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2024-0023660 filed on February 19, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] One or more embodiments relate to a device and a method, and more particularly, to a display device, an electronic device, a device for manufacturing a display device, and a method for manufacturing a display device. Background Art

[0004] Consumers are using a wide variety of mobile electronic devices, such as tablet personal computers (PCs) and miniaturized electronic devices such as mobile phones.

[0005] Mobile electronic devices may include display devices that support various functions, such as providing visual information to users by generating images. Recently, as components configured to drive display devices have been miniaturized, the proportion of display devices in electronic devices has gradually increased. Research has been conducted on display devices that can be bent to form a predetermined angle from a flat state. Summary of the Invention

[0006] A display device includes a display panel. The display panel can be inserted into a housing. Due to contact between the display panel and the housing, an impact may be applied to the edge of the display panel, thereby potentially damaging the display panel. Embodiments provide a display device, an electronic device, an apparatus for manufacturing a display device, and a method for manufacturing a display device. The display device is configured to not only prevent damage to the display panel received in the housing but also protect the curved portion of the display panel.

[0007] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0008] According to an embodiment of the present disclosure, a display device includes a display panel. The display panel includes a substrate, the substrate including a first region, a second region, and a curved region in a curved state. The curved region connects the first region to the second region. A first protective layer is disposed within the curved region of the substrate. A second protective layer is disposed on at least a portion of an edge of the substrate and on at least one surface of the curved region of the substrate.

[0009] In an embodiment, the first protective layer and the second protective layer may each include a photocurable resin.

[0010] In an embodiment, the photocurable resin may be cured by light having a wavelength peak in the range of about 450 nm to about 500 nm.

[0011] In an embodiment, the photocurable resin may include at least one of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (2,4,6-trimethylbenzoyldiphenylphosphine oxide), ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate (ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate), bisacylphosphine oxide, bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)-phenyl)titanium (bis(cyclopentadienyl)-bis[2,6-difluoro-3-(pyrrol-1-yl)-phenyl]titanium), and camphorquinone (CQ).

[0012] In an embodiment, the display device may further include a bracket, wherein the bracket is arranged to receive the display panel.

[0013] In an embodiment, the bracket may include an injection hole arranged to receive the photo-curable resin.

[0014] In an embodiment, the bracket may comprise a transparent material.

[0015] In an embodiment, the second protective layer may be connected to the first protective layer.

[0016] According to an embodiment of the present disclosure, an apparatus for manufacturing a display device includes a first jig. A second jig is arranged to receive a display panel thereon. The second jig faces the first jig. A mold is disposed between the first jig and the second jig. The mold is selectively coupled to the first jig. The mold and the second jig together form a space at an edge portion of the display panel. The first jig and the mold comprise a transparent material.

[0017] According to an embodiment, one of the first clamp and the second clamp may include a coupling portion.The other of the first clamp and the second clamp may include a first receiving portion arranged to receive the coupling portion.

[0018] In an embodiment, the mould may comprise a second receiving portion arranged to receive the coupling part.

[0019] In an embodiment, the first jig and the mold may include an injector arranged to receive the photo-curable resin into the space.

[0020] In an embodiment, the photocurable resin may be cured by light having a wavelength peak in the range of about 450 nm to about 500 nm.

[0021] In an embodiment, the photocurable resin may include at least one of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (2,4,6-trimethylbenzoyldiphenylphosphine oxide), ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate (ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate), bisacylphosphine oxide, bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)-phenyl)titanium (bis(cyclopentadienyl)-bis[2,6-difluoro-3-(pyrrol-1-yl)-phenyl]titanium), and camphorquinone (CQ).

[0022] In an embodiment, the apparatus may further include a light source that is provided on side surfaces of the first jig and the mold and irradiates light to the space.

[0023] In an embodiment, the light source may irradiate visible light toward the first jig and the mold.

[0024] According to an embodiment of the present disclosure, a method for manufacturing a display device includes: setting a display panel having a bent portion in a bent state on a second fixture; setting a first fixture and a mold on the display panel to form a first space at at least one edge of the display panel; supplying a photocurable resin into the first space; and curing the photocurable resin by irradiating light into the first space.

[0025] In an embodiment, the photocurable resin may be cured by light having a wavelength peak in the range of about 450 nm to about 500 nm.

[0026] In an embodiment, the photocurable resin may include at least one of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (2,4,6-trimethylbenzoyldiphenylphosphine oxide), ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate (ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate), bisacylphosphine oxide, bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)-phenyl)titanium (bis(cyclopentadienyl)-bis[2,6-difluoro-3-(pyrrol-1-yl)-phenyl]titanium), and camphorquinone (CQ).

[0027] In an embodiment, light may be irradiated from a side surface of the display panel.

[0028] In an embodiment, the method may further include injecting a photocurable resin into a second space between upper and lower surfaces of the curved portion of the display panel, the surfaces facing each other.

[0029] In an embodiment, the photo-curable resin supplied into the first space and the photo-curable resin injected into the second space may be cured and connected to each other.

[0030] According to an embodiment of the present disclosure, a method for manufacturing a display device includes: placing a display panel within a bracket to form a first space defined by at least one edge of the display panel, the bracket, and a cover member of the display panel; supplying a photocurable resin into the first space; and curing the photocurable resin by irradiating light into the first space.

[0031] In an embodiment, the photocurable resin may be cured by light having a wavelength peak in the range of about 450 nm to about 500 nm.

[0032] In an embodiment, the photocurable resin may include at least one of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (2,4,6-trimethylbenzoyldiphenylphosphine oxide), ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate (ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate), bisacylphosphine oxide, bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)-phenyl)titanium (bis(cyclopentadienyl)-bis[2,6-difluoro-3-(pyrrol-1-yl)-phenyl]titanium), and camphorquinone (CQ).

[0033] In an embodiment, light may be irradiated from a side surface of the display panel.

[0034] In an embodiment, the method may further include injecting a photocurable resin into a second space between opposing upper and lower surfaces of the bent portion of the display panel in the bent state.

[0035] In an embodiment, the photo-curable resin supplied into the first space and the photo-curable resin injected into the second space may be cured and connected to each other.

[0036] In an embodiment, the bracket may comprise a transparent material.

[0037] According to an embodiment of the present disclosure, an electronic device includes a display device and a main circuit board connected to a display panel.

[0038] In an embodiment, the electronic device further includes a lower cover disposed below the main circuit board.

[0039] These and / or other aspects will become apparent and more readily understood from the following detailed description of the embodiments, the accompanying drawings, and the claims.

[0040] These general and specific aspects may be implemented through the use of systems, methods, computer programs, or a combination of specific systems, methods, and computer programs. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0042] Figure 1 is a schematic perspective view of a display device according to an embodiment of the present disclosure;

[0043] Figure 2 According to the embodiment of the present disclosure Figure 1 A schematic exploded perspective view of the display device shown in ;

[0044] Figure 3A According to the embodiment of the present disclosure, Figure 2 A schematic cross-sectional view of the display panel taken along line III-III';

[0045] Figure 3B According to the embodiment of the present disclosure Figure 3A An enlarged cross-sectional view of region A shown in FIG;

[0046] Figure 4 According to the embodiment of the present disclosure Figure 2 A schematic plan view of a display panel shown in ;

[0047] Figure 5 According to the embodiment of the present disclosure Figure 4 A schematic perspective view of a bent state of at least a portion of a display panel shown in FIG.

[0048] Figure 6 According to the embodiment of the present disclosure, Figure 4 a cross-sectional view of the display panel taken along line VI-VI';

[0049] Figure 7A and Figure 7B According to the embodiment of the present disclosure Figure 6 A circuit diagram of a circuit of a display panel shown in ;

[0050] Figure 8 is a schematic perspective view of an apparatus for manufacturing a display device according to an embodiment of the present disclosure;

[0051] Figure 9 According to the embodiment of the present disclosure Figure 8 A schematic cross-sectional view of an apparatus for manufacturing a display device shown in ;

[0052] 10A to 10C is a schematic cross-sectional view illustrating a method of manufacturing a display device according to an embodiment of the present disclosure; and

[0053] Figure 11is a schematic cross-sectional view of a portion of a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0054] Reference will now be made in detail to embodiments of the present disclosure, examples of which are shown in the accompanying drawings, wherein like reference numerals represent like elements throughout. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Therefore, embodiments will be described below solely with reference to the accompanying drawings to explain aspects of this specification. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items. Throughout the disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0055] Since the present disclosure allows for various variations and multiple embodiments, specific embodiments will be shown in the drawings and described in the written description. The effects and features of the present disclosure and methods for achieving them will be explained with reference to the embodiments described in detail below with reference to the drawings. However, the present disclosure is not limited to the described embodiments and can be implemented in various forms.

[0056] Hereinafter, embodiments will be described with reference to the accompanying drawings, wherein like reference numerals refer to like elements throughout and repeated descriptions thereof will be omitted.

[0057] Although terms such as "first" and "second" may be used to describe various elements, such elements are not necessarily limited to the above terms. The above terms are used to distinguish one element from another.

[0058] As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0059] It will be understood that the terms “comprise,” “comprising,” “include” and / or “including” as used herein specify the presence of stated features or elements, but do not preclude the addition of one or more other features or elements.

[0060] It will be further understood that when a layer, region, or element is referred to as being "on" another layer, region, or element, it can be directly or indirectly on the other layer, region, or element. For example, intervening layers, regions, or elements may be present. When a layer, region, or element is referred to as being "directly on" another layer, region, or element, there may not be intervening layers, regions, or elements.

[0061] For the convenience of explanation, the size of the elements in the drawings may be exaggerated or reduced. As an example, for the convenience of description, the size and thickness of each element shown in the drawings may be arbitrarily presented, and therefore, the embodiments of the present disclosure are not necessarily limited thereto.

[0062] The X, Y, and Z directions are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the X, Y, and Z directions can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0063] In the case where a particular embodiment can be implemented differently, a particular process sequence can be performed in a different order than that described. As an example, two processes described in succession can be performed substantially simultaneously or in a reverse order.

[0064] Figure 1 is a schematic perspective view of a display device 1 according to an embodiment. Figure 2 yes Figure 1 Schematic exploded perspective view of the display device 1 shown in FIG. Figure 3A It is along Figure 2 Schematic cross-sectional view of the display panel taken along line III-III'. Figure 3B yes Figure 3A An enlarged cross-sectional view of region A is shown in FIG.

[0065] refer to Figures 1 to 3B In an embodiment, the electronic device may include a display device. The display device 1 may be a device for displaying at least one moving image and / or still image, and may be used as a display screen for various products including televisions, notebook computers, monitors, billboards, Internet of Things (IOT) devices, and portable electronic devices including mobile phones, smart phones, tablet personal computers (PCs), mobile communication terminals, electronic organizers, e-books, portable multimedia players (PMPs), navigation devices, or ultra-mobile personal computers (UMPCs). In addition, the display device 1 may be used in wearable devices including smart watches, watch phones, glasses-type displays, or head-mounted displays (HMDs). In addition, the display device 1 may be used in a display screen in a dashboard of a car, a central dashboard of a car, or a central information display (CID) arranged on the dashboard, an interior mirror display instead of a side mirror of a car, or a display screen of an entertainment system arranged on the back of the front seat for rear passengers in a car.

[0066] In an embodiment, the display device 1 may include a display panel DP, a display circuit board 51 , a cover member 50 , a bracket 60 , a main circuit board 70 , and a lower cover 90 .

[0067] The cover member 50 may be disposed on the display panel DP (eg, in the Z direction). In an embodiment, the cover member 50 may cover an upper portion of the display panel DP. Thus, the cover member 50 may be configured to protect the upper surface of the display panel DP.

[0068] In an embodiment, the cover member 50 may include a transmissive cover portion DA50 corresponding to the display panel DP (e.g., overlapping the display panel DP in the Z direction) and a light-blocking cover portion NDA50 corresponding to an area other than the display panel DP (e.g., overlapping the area other than the display panel DP in the Z direction). The light-blocking cover portion NDA50 may include an opaque material configured to block light. In an embodiment, the light-blocking cover portion NDA50 may include a pattern that may be visible to a user when an image is not displayed.

[0069] The display panel DP may be disposed under the cover member 50. The display panel DP may overlap the transmissive cover portion DA50 of the cover member 50 (eg, in the Z direction).

[0070] In an embodiment, the cover member 50 may include a cover window and a protective member. In an embodiment, the cover window may include a transparent material. In this embodiment, the cover window may include glass, a synthetic resin of a transparent material, etc. The cover window may include at least one layer.

[0071] In an embodiment, a protective member may be provided on the upper surface of the cover window to prevent or reduce scratches, etc. in the cover window. In an embodiment, an opaque layer 50-1 may be provided on at least one of the cover window and a portion of the protective member. In an embodiment, the opaque layer 50-1 may be provided on an edge of the cover window or an edge of the protective member. The opaque layer 50-1 may be configured to block light and be provided on the light-blocking cover portion NDA50 of the cover member 50.

[0072] The display panel DP may include a display area DA and a peripheral area PA around the display area DA (e.g., in the X direction and / or the Y direction). The image generated by the display panel DP is displayed in the display area DA. Sub-pixels P, each including a display element, may be arranged in the display area DA. In this embodiment, the sub-pixels P may be provided in plurality to be spaced apart from each other. Parts (e.g., groups) of the plurality of sub-pixels P may be configured to emit light of different colors from each other. The display device 1 may be configured to display an image using light emitted from the sub-pixels P arranged in the display area DA. In an embodiment, the peripheral area PA may be an area in which the sub-pixels P are not arranged. However, embodiments of the present disclosure are not necessarily limited thereto.

[0073] The display panel DP is configured to display (e.g., output) information processed by the display device 1. As an example, in an embodiment, the display panel DP may display execution screen information of an application driven in the display device 1 or user interface (UI) and graphical user interface (GUI) information corresponding to the execution screen information. In an embodiment, the display panel DP may include a display layer D and a touch sensor layer TSL. The display layer D displays an image, and the touch sensor layer TSL senses a user's touch input. Therefore, the display panel DP may be used as an input unit that provides an input interface between the display device 1 and the user, and at the same time as an output unit that provides an output interface between the display device 1 and the user.

[0074] Hereinafter, although an organic light-emitting display device is described as an example of the display device 1 according to an embodiment, the display device 1 according to an embodiment of the present disclosure is not necessarily limited thereto. In an embodiment, the display device 1 according to an embodiment of the present disclosure may be an inorganic light-emitting display device or a quantum dot light-emitting display device. As an example, the emission layer of the display element provided to the display device 1 may include an organic material, an inorganic material, quantum dots, an organic material and quantum dots, or an inorganic material and quantum dots.

[0075] In an embodiment, the display panel DP may be a flexible display panel. The flexible display panel has flexibility and is therefore easily bent, folded, or rolled. As examples, the display panel DP may include a foldable display panel that can be folded into a folded state and unfolded from the folded state to an unfolded state, a curved display panel having a curved display surface in which an area other than the display surface is curved, a rollable display panel that can be rolled and unfolded, and a stretchable display panel that can be stretched. However, embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, the display panel DP may be a rigid display panel that has rigidity and is not easily bent.

[0076] In an embodiment, the display panel DP may include a substrate 10, a display layer D disposed on the substrate 10 (e.g., directly disposed on the substrate 10), a touch sensor layer TSL disposed on the display layer D (e.g., directly disposed on the display layer D), and a protective layer 93 arranged to surround the side surfaces of the substrate 10 and the display layer D. In this embodiment, at least a portion of the substrate 10 may be bent (e.g., be flexible). Figure 3BAs shown, the substrate 10 may include a first region 1A, a second region 2A, and a curved region BA in a curved state, which may connect the first region 1A to the second region 2A. The protective layer 93 may include a first protective layer 93a and a second protective layer 93b. The first protective layer 93a is disposed on at least a portion of the edge of the substrate 10 and the display layer D, and the second protective layer 93b is disposed within the curved region BA of the substrate 10. For example, as shown in FIG. Figure 3B As shown in , the first protective layer 93a may be provided on at least a portion of the edge of the substrate 10 and at least one surface of the bending area BA. The second protective layer 93b may be provided in the bending area BA of the substrate 10 between the relative upper and lower sides of the substrate 10, and the substrate 10 is in a bending orientation (e.g., a bent state) in the bending area BA. In an embodiment, the first protective layer 93a and the second protective layer 93b may be connected to each other. The second protective layer 93b may be arranged between the first area 1A, the second area 2A and the bending area BA. Hereinafter, for ease of description, an embodiment in which the first protective layer 93a surrounds all (e.g., the entire edge) of the edge of the substrate 10 is mainly described in detail. In this embodiment, the first protective layer 93a may be arranged to surround not only the edge of the substrate 10, but also the outer surface of the bending protective layer BPL.

[0077] In an embodiment, the protective layer 93 may include a photocurable resin. In this embodiment, when light is irradiated to the photocurable resin, the photocurable resin may be cured. For example, in an embodiment, the photocurable resin may be cured by using light having a wavelength peak in the range of about 450 nm to about 500 nm. In a comparative embodiment in which light having a wavelength peak of less than about 450 nm is irradiated to the photocurable resin, since the light cannot pass through the substrate 10, the light cannot cure the first protective layer 93 a and the second protective layer 93 b. In addition, in a comparative embodiment in which light having a wavelength peak greater than about 500 nm is irradiated, since the light includes excessive heat, damage to the display panel DP, etc. may be caused by the heat.

[0078] In an embodiment, the photocurable resin may include a photoinitiator. In this embodiment, the photoinitiator of the photocurable resin may include at least one of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (2,4,6-trimethylbenzoyldiphenylphosphine oxide), ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate (ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate), bisacylphosphine oxide, bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)-phenyl)titanium (bis(cyclopentadienyl)-bis[2,6-difluoro-3-(pyrrol-1-yl)-phenyl]titanium), and camphorquinone (CQ).

[0079] The display panel DP may be disposed under the cover member 50. In an embodiment, the display panel DP may include a protective film 92 and an adhesive member 94 disposed under the substrate 10. In an embodiment, the protective film 92 may include a protective film base 92a and an adhesive layer 92b. In an embodiment, the protective film base 92a may include polyethylene terephthalate (PET) or polyimide (PI). In addition, the adhesive layer 92b may include various adhesive materials. In an embodiment, the adhesive layer 92b may be disposed on the entire surface of the substrate 10, and after the adhesive layer 92b is disposed on the substrate 10, a portion of the protective film base 92a may be removed to form the opening 92OP. However, embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, the opening 92OP may be formed by removing a portion of the protective film base 92a and a portion of the adhesive layer 92b. In this embodiment, both the protective film base 92a and the adhesive layer 92b may not be present in the opening 92OP.

[0080] In addition, when the display panel DP has a curved orientation (e.g., a curved state) in the curved area BA, the display panel DP may include a cushion layer 91 disposed between the protective film base 92a on the opposite upper and lower sides of the substrate 10. In this embodiment, the cushion layer 91 may be disposed in an area where the first area 1A and the second area 2A (e.g., in the Z direction) face each other. For example, in an embodiment, the cushion layer 91 may be disposed in direct contact with a portion of the protective film base 92a in the first area 1A and in indirect contact with a portion of the protective film base 92a in the second area 2A. The substrate 10, etc. is bent, and then the cushion layer 91 may be disposed in a space spaced apart from each other in the first area 1A and the second area 2A (e.g., in the Z direction), thereby supporting the display panel DP and absorbing impact. In an embodiment, the cushion layer 91 may include an elastic material. In an embodiment, the cushion layer 91 may be attached to the protective film base 92a before the bending operation. However, embodiments of the present disclosure are not necessarily limited to this.

[0081] In an embodiment, an adhesive member 94 may be provided between the cushion layer 91 and the protective film base 92 a in the second region 2A to fix the cushion layer 91 to the protective film base 92 a .

[0082] In an embodiment, the display panel DP may be connected to the display circuit board 51 using an anisotropic conductive film.

[0083] The touch sensor driver 53 may be provided on the display circuit board 51 (e.g., directly on the display circuit board 51). In an embodiment, the display driver 52 may be provided directly on the substrate 10 of the display panel DP. However, the embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, the display driver 52 may be provided on the display circuit board 51. Hereinafter, for ease of description, an embodiment in which the display driver 52 is provided on the display circuit board 51 will be mainly described in detail.

[0084] In an embodiment, the substrate 10 of the display panel DP may be at least partially curved. In this embodiment, a bending protection layer BPL may be provided on the bending area BA of the substrate 10 to prevent cracks, etc. of the substrate 10. In an embodiment, the bending protection layer BPL may include, for example, a polymer resin such as polyethylene terephthalate (PET), polyimide (PI), etc.

[0085] In an embodiment, the display device 1 may include a panel protection member disposed under (eg, directly under) the display panel DP.

[0086] In an embodiment, the touch sensor layer TSL may be formed in the form of a panel or a film. Alternatively, the touch sensor layer TSL may be formed integrally with the display panel DP. As an example, in an embodiment where the touch sensor layer TSL includes a film, the touch sensor layer TSL may be formed with a thin film encapsulation layer 30 (see FIG. 1 ) configured to encapsulate the display panel DP. Figure 6 However, the embodiments of the present disclosure are not necessarily limited thereto.

[0087] For example, in one embodiment, the touch sensor layer TSL may be a patterned electrode provided on the display panel DP. In this embodiment, wiring may be provided on the thin film encapsulation layer 30 to intersect with each other, and a change in capacitance variable according to a user's touch may be measured at the intersection of the wiring. The touch sensor layer TSL may be connected to the display circuit board 51.

[0088] In an embodiment, the touch sensor driver 53 may be configured to apply a touch drive signal to the touch sensor layer TSL, sense a first sensing signal sensed by the touch sensor layer TSL, and calculate the user's touch position by analyzing the first sensing signal. In addition, the touch sensor driver 53 may be configured to apply a touch drive signal to the sensor, sense a second sensing signal sensed by the sensor, and calculate the touch position of the signal input unit by analyzing the second sensing signal.

[0089] In an embodiment, the functional layer may be provided on the touch sensor layer TSL. The functional layer may include an anti-reflection layer. The anti-reflection layer may reduce the reflectivity of light (eg, external light) incident from the outside (eg, the external environment) through the display device 1.

[0090] In an embodiment, the anti-reflection layer may include a polarizing film. In an embodiment, the polarizing film may include a linear polarizing plate and a phase delay film such as a λ / 4 (quarter wave) plate. The phase delay film may be provided on the touch sensor layer TSL, and the linear polarizing film may be provided on the phase delay film.

[0091] In an embodiment, the anti-reflection layer may include a filter layer including a black matrix and a color filter. The color filter may be arranged by considering the color of light emitted from each sub-pixel P of the display panel DP. As an example, in an embodiment, the filter layer may include a red filter, a green filter, or a blue filter. In this embodiment, the filter layer may be provided on the touch sensor layer TSL of the display panel DP without requiring a separate adhesive layer.

[0092] In an embodiment, the anti-reflection layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer, each disposed on a different layer. The first reflected light and the second reflected light, respectively reflected by the first reflective layer and the second reflective layer, may destructively interfere with each other, thereby reducing the reflectivity of external light.

[0093] In an embodiment, the functional layer may further include an impact absorbing layer. In this embodiment, the impact absorbing layer may protect the display panel DP and the structures thereunder from external impact. In an embodiment, the impact absorbing layer may be a polymer film. The polymer film may include, for example, at least one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polyimide (PI), polyarylate (PAR), polycarbonate (PC), polymethyl methacrylate (PMMA), and cyclic olefin copolymer (COC).

[0094] In an embodiment, the functional layer may include an anti-reflection layer and an impact absorbing layer. In this embodiment, the anti-reflection layer and the impact absorbing layer may be sequentially stacked on the display panel DP or the touch sensor layer TSL.

[0095] The display circuit board 51 may be attached to one side of the display panel DP. For example, in an embodiment, the display circuit board 51 may be attached to a pad prepared on one side of the display panel DP using an isotropic conductive film.

[0096] In an embodiment, the display circuit board 51 may be bent from above to below the display panel DP. In some embodiments, the display circuit board 51 may be connected to the main circuit board 70 through a display connector.

[0097] A bracket 60 for supporting the display panel DP may be provided below the display panel DP (e.g., directly below the display panel DP). The bracket 60 may be arranged to accommodate the display panel DP. In an embodiment, the bracket 60 may include plastic, metal, or both plastic and metal. In this embodiment, the bracket 60 may include a connector hole 61 through which a connector passes. In addition, the bracket 60 may include a camera hole 62 into which the camera device 73 is inserted.

[0098] The housing space 64 for housing the protective layer 93 may be provided in the bracket 60. Furthermore, the bracket 60 may include a support member 63 to support the back surface of the display panel DP. In an embodiment, the support member 63 protrudes toward the display panel DP (e.g., in the Z direction). In this embodiment, the support member 63 may be tightly attached to the back surface of the display panel DP.

[0099] The main circuit board 70 may be provided separately from the display circuit board 51, or may be provided integrally with the display circuit board 51. In an embodiment in which the main circuit board 70 and the display circuit board 51 are provided separately from each other, the main circuit board 70 and the display circuit board 51 may be connected to each other using a cable or the like. Hereinafter, for ease of description, an embodiment in which the main circuit board 70 and the display circuit board 51 are provided separately will be mainly described in detail.

[0100] In an embodiment, the main circuit board 70 may include a main processor 71, a camera device 73, a main connector 75, and components. The main processor 71 may include an integrated circuit. In an embodiment, the camera device 73 may be provided on both the upper and lower surfaces of the main circuit board 70, and the main processor 71 and the main connector 75 may each be provided on one of the upper and lower surfaces of the main circuit board 70.

[0101] The main processor 71 can be configured to control all functions of the display device 1. As an example, in an embodiment, the main processor 71 can be configured to output digital video data to the display driver 52 through the display circuit board 51, so that the display panel DP displays an image. In addition, the main processor 71 can be configured to receive sensing data from the touch sensor driver 53. The main processor 71 can determine whether the user directly touches the touch screen based on the sensed data, and perform an operation corresponding to the user's direct touch or near touch. As an example, in an embodiment, the main processor 71 can analyze the sensed data and calculate the user's touch coordinates. The main processor 71 can then execute the application indicated by the icon touched by the user, or perform an operation. The main processor 71 can be an application processor including an integrated circuit, a central processing unit, or a system chip.

[0102] The camera device 73 can process image frames, such as at least one still image and / or moving image obtained by an image sensor in camera mode, and output the image frames to the main processor 71. The camera device 73 may include at least one of a camera sensor (e.g., a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS), etc.), a light sensor (e.g., an image sensor), and a laser sensor. The camera device 73 may be connected to an image sensor in a component overlapping with the component area and may process an image input to the image sensor.

[0103] In an embodiment, a connector passing through the connector hole 61 of the bracket 60 may be connected to the main connector 75 , and thus, the main circuit board 70 may be electrically connected to the display circuit board 51 .

[0104] In an embodiment, in addition to the main processor 71, the camera device 73 and the main connector 75, the main circuit board 70 may also include at least one wireless communication unit, at least one input unit, at least one sensor, at least one output unit, at least one interface, a memory and a power supply unit.

[0105] The wireless communication unit may include at least one of a broadcast receiving module, a mobile communication module, a wireless Internet module, a short-range communication module, and a location information module.

[0106] The broadcast receiving module may be configured to receive a broadcast signal and / or broadcast related information from an external broadcast management server via a broadcast channel. The broadcast channel may include a satellite channel and / or a ground wave channel.

[0107] The mobile communication module may be configured to transmit / receive radio signals to / from at least one of a base station, an external terminal, and a server on a mobile communication network established according to a technical standard for mobile communication or a communication scheme (e.g., Global System for Mobile Communications (GSM), Code Division Multiple Access (CDMA), Code Division Multiple Access 2000 (CDMA2000), Enhanced Voice Data Optimized or Enhanced Voice Data Only (EV-DO), Wideband CDMA (WCDMA), High Speed Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), Long Term Evolution (LTE), Long Term Evolution-Advanced (LTE-A), etc. The wireless signal may include a voice call signal, an image communication call signal, or various types of data corresponding to text / multimedia message transmission / reception.

[0108] The wireless Internet module may refer to a module for wireless Internet access. The wireless Internet module may be configured to transmit / receive radio signals on a communication network according to wireless Internet technology. Examples of wireless Internet technology include wireless local area network (WLAN), wireless fidelity (Wi-Fi), Wi-Fi Direct, and Digital Living Network Alliance (DLNA).

[0109] The short-range communication module is used for short-range communication and can be used to TM , Radio Frequency Identification (RFID), Infrared Data Association, IrDA, Ultra Wideband (UWB), ZigBee, Near Field Communication (NFC), Wi-Fi, Wi-Fi Direct, and Wireless Universal Serial Bus (Wireless USB) technologies to support short-range communication. The short-range communication module can be configured to support wireless communication between the display device 1 and a wireless communication system, between the display device 1 and another electronic device, or between the display device 1 and a network where another electronic device (e.g., an external server) is located through a short-range wireless area network. The short-range wireless area network can be a wireless personal area network. In an embodiment, the other electronic device can be a wearable device that can exchange data with the display device 1 or operate with the display device 1.

[0110] The position information module is a module for obtaining the position (e.g., current position) of the display device 1. Representative examples of the position information module include a global positioning system (GPS) module or a Wi-Fi module. As an example, in an embodiment utilizing a GPS module, the display device 1 can obtain the position of the display device 1 by using a signal transmitted by a GPS satellite. In addition, the display device 1 can obtain the position of the display device 1 by using the Wi-Fi module based on information of a wireless access point (AP) that transmits / receives radio signals to / from the Wi-Fi module. Although the position information module may be a module for obtaining the position (e.g., current position) of the display device 1, the position information module is not necessarily limited to a module for directly calculating or obtaining the position of the display device 1.

[0111] The input unit may include an image input unit such as the camera device 73 for inputting an image signal, a sound input unit such as a microphone for inputting a sound signal, and an input unit for receiving information from a user.

[0112] The camera device 73 processes image frames such as still images or moving images obtained by the image sensor in an image communication mode or a photographing mode. The processed image frames may be displayed on the display panel DP or stored in a memory.

[0113] The microphone processes the external sound signal into electrical voice data. Depending on the function executed in the display device 1 (e.g., the application being executed), the processed voice data can be used differently. Various noise cancellation algorithms can be implemented in the microphone. Various noise cancellation algorithms can eliminate noise that occurs during the process of receiving the external sound signal.

[0114] The main processor 71 may be configured to control the operation of the display device 1 in accordance with information input through the input unit. In an embodiment, the input unit may include a mechanical input device such as a button, a dome switch, a roller, a roller switch, etc., or a touch input device located on the lower surface or side surface of the display device 1. The touch input device may include a touch sensor layer TSL of the display panel DP.

[0115] The sensor may include at least one sensor that senses at least one of information within the display device 1, peripheral environment information around the display device 1, and user information, and generates a sensing signal corresponding thereto. The main processor 71 may control the driving or operation of the display device 1 based on the sensing signal, or perform data processing, functions, or operations related to an application installed in the display device 1. In an embodiment, the sensor may include at least one of a proximity sensor, an illumination sensor, an acceleration sensor, a magnetic sensor, a G-sensor, a gyroscope sensor, a motion sensor, an RGB sensor, an infrared sensor, a finger scan sensor, an ultrasonic sensor, an optical sensor, a battery gauge, an environmental sensor (e.g., a barometer, a hygrometer, a thermometer, a radiation detection sensor, a heat detection sensor, a gas detection sensor, etc.), a chemical sensor (e.g., an electronic nose, a healthcare sensor, a biometric sensor, etc.), and the like.

[0116] The proximity sensor refers to a sensor that detects whether there is an object close to (e.g., approaching) a preset detection surface or an object existing nearby by using electromagnetic force, infrared rays, etc. without mechanical contact. Examples of proximity sensors include a transmittance photoelectric sensor, a direct reflection photoelectric sensor, a mirror reflection photoelectric sensor, a high-frequency oscillation type proximity sensor, a capacitive proximity sensor, a magnetic proximity sensor, and an infrared proximity sensor. The proximity sensor can sense not only proximity touch, but also proximity touch mode, such as proximity touch distance, proximity touch direction, proximity touch speed, proximity touch time, proximity touch position, and proximity touch movement state. The main processor 71 can process data (e.g., information) corresponding to the proximity touch operation and proximity touch mode sensed by the proximity sensor, and control the display panel DP to display visual information corresponding to the processed data.

[0117] Ultrasonic sensors can identify the location of an object using ultrasonic waves. The main processor 71 can calculate the location of an object using information sensed by an optical sensor and multiple ultrasonic sensors. Because the speed of light differs from the speed of ultrasonic waves, the location of an object can be calculated by using the time it takes for light to reach the optical sensor and the time it takes for ultrasonic waves to reach the ultrasonic sensor.

[0118] The output unit generates output related to vision, hearing, or touch, and may include at least one of a sound output unit, a haptic module, and a light output unit. However, embodiments of the present disclosure are not necessarily limited thereto.

[0119] In an embodiment, the sound output unit may be configured to output sound data received by the wireless communication unit or stored in the memory in a call receiving mode, a communication mode or a recording mode, a voice recognition mode, a broadcast receiving mode, and the like. The sound output unit may output a sound signal related to a function performed by the display device 1 (e.g., a call signal reception tone, a message reception tone, etc.). The sound output unit may include a receiving portion and a speaker. At least one of the receiving portion and the speaker may be a sound generator that is attached under the display panel DP and vibrates the display panel DP to output sound. In an embodiment, the sound generator may be a piezoelectric element or a piezoelectric actuator that contracts and expands according to an electrical signal, or an exciter that generates a magnetic force by vibrating the display panel DP using a voice coil.

[0120] The haptic module is configured to generate various tactile effects that the user can feel. For example, the haptic module can provide vibration as a tactile effect to the user. The intensity, mode, etc. of the vibration generated by the haptic module can be controlled by the user's selection or the setting of the main processor 71. As an example, the haptic module can be configured to synthesize different vibrations to output the same vibration, or output different vibrations sequentially. The haptic module can be configured to generate various tactile effects in addition to vibration, such as the effect of the arrangement of needles moving perpendicular to the surface of the skin in direct contact, the blowing force or suction of air through a nozzle or an air intake port, the effect of stimulation of the skin surface, electrode contact, electrostatic force, and the effect of reproducing hot and cold sensations using an element that can absorb heat or generate heat. The haptic module can be configured to transmit tactile effects not only through direct contact, but also to achieve tactile effects so that the user can feel the tactile effects through muscle sensation in the fingers or arms.

[0121] The light output unit is configured to output a signal notifying the user of an event by using light from a light source. Examples of events generated by the display device 1 include message reception, call signal reception, missed call, alarm, schedule notification, email reception, and information received via an application. The signal output by the light output unit is achieved when the display device 1 emits light of a single color or multiple colors from the front or rear surface. Signal output may terminate when the display device 1 detects user confirmation of the event.

[0122] The interface serves as a path for connecting to various external devices connected to the display device 1. In embodiments, the interface may include at least one of a wired / wireless headphone port, an external charger port, a wired / wireless data port, a memory card portion, a port for connecting a device having an identification module, an audio input / output (I / O) port, a video I / O port, and a headphone port. When an external device is connected to the interface, the display device 1 may perform appropriate control related to the connected external device.

[0123] The memory stores data that supports various functions of the display device 1. The memory can store multiple applications driven by the display device 1, data used to operate the display device 1, and commands. At least some of the multiple applications can be downloaded from an external server via wireless communication. The memory can be configured to store applications used to operate the main processor 71 and temporarily store data input / output, for example, data such as a phone book, messages, still images, moving images, etc. In addition, the memory can be configured to store tactile data for various vibration patterns provided to the haptic module and various sound data regarding various sounds provided to the sound output unit. In embodiments, the memory can include at least one type of storage medium selected from the group consisting of a flash memory type, a hard disk type, a solid-state drive (SSD) type, a silicon disk drive (SDD) type, a multimedia card micro type, a card-type memory (e.g., secure digital (SD) or extreme digital (XD) memory), a random access memory (RAM), a static random access memory (SRAM), a read-only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), a programmable read-only memory (PROM), a magnetic memory, a magnetic disk, and an optical disk.

[0124] The power supply unit can be configured to receive external power and internal power under the control of the main processor 71, and provide power to the corresponding elements included in the display device 1. The power supply unit may include a battery. In addition, the power supply unit includes a connection port. The connection port may be configured as an example of an interface to which an external charger is electrically connected. The external charger provides power to charge the battery. Alternatively, the power supply unit may be configured to wirelessly charge the battery without using the connection port. The battery may receive power from an external wireless power transmission device by using at least one of inductive coupling and magnetic resonance coupling. Inductive coupling is based on magnetic induction, and magnetic resonance coupling is based on electromagnetic resonance. The battery may be arranged so as not to overlap with the main circuit board 70 in a third direction (e.g., the Z direction). The battery may overlap with the battery hole of the bracket 60.

[0125] The lower cover 90 may be disposed below the main circuit board 70 and the battery (e.g., directly below the main circuit board 70 and the battery). The lower cover 90 may be coupled and fixed to the bracket 60. The lower cover 90 may form the lower exterior of the display device 1. In an embodiment, the lower cover 90 may include plastic, metal, or both plastic and metal.

[0126] Figure 4 yes Figure 2 Schematic plan view of the display panel DP shown in FIG. Figure 5 yes Figure 4 Schematic perspective view of a curved form of at least a portion of the display panel DP shown in FIG.

[0127] refer to Figure 4 and Figure 5 The display panel DP may be a light-emitting display panel including a light-emitting element. As an example, in an embodiment, the display panel DP may be an organic light-emitting display panel using an organic light-emitting diode including an organic emission layer, an ultra-small light-emitting diode display panel using a micro light-emitting diode, a quantum dot light-emitting display panel using a quantum dot light-emitting diode including a quantum dot emission layer, or an inorganic light-emitting display panel using an inorganic light-emitting element including an inorganic semiconductor.

[0128] The display panel DP may be a flexible display panel that is flexible and thus easily bendable, foldable, or rollable. As examples, the display panel DP may include a foldable display panel that can be folded and unfolded, a curved display panel having a curved display surface in which an area other than the display surface is curved (e.g., in a bent state), a rollable display panel that can be rolled and unfolded, and a stretchable display panel that can be stretched.

[0129] The display panel DP may be a transparent display panel so that an object or background disposed below the display panel DP can be observed from the upper surface of the display panel DP. Alternatively, the display panel DP may be a reflective display panel that can reflect an object or background on the upper surface of the display panel DP.

[0130] The display panel DP may include a display area DA and a peripheral area PA arranged to surround the display area DA (eg, in the X direction and / or the Y direction). An image is displayed in the display area DA. Separate driving circuits, pads, etc. may be arranged in the peripheral area PA.

[0131] In addition, the display panel DP may include a first area 1A, a curved area BA, and a second area 2A corresponding to the first area 1A, the curved area BA, and the second area 2A of the substrate 10. The first area 1A is arranged in the display area DA, the curved area BA may be curved around a virtual bending axis BAX, and the second area 2A is connected to the curved area BA and to the display circuit board 51. For example, the curved area BA may connect the first area 1A and the second area 2A to each other (e.g., directly). In an embodiment, the second area 2A and the curved area BA may be included in the peripheral area PA, and the image may not be displayed in the second area 2A and the curved area BA. In an embodiment, in the display panel DP, a portion of the substrate 10 may be bent around a virtual bending axis BAX arranged in the curved area BA. In this embodiment, the first area 1A, the second area 2A, and the curved area BA may form a "U" shape to form a second space CV-2 in which the second protective layer 93b is arranged. In an embodiment, the first protective layer 93a may be arranged in the edge EA of the display panel DP and the outer surface of the curved area BA, and the first protective layer 93a may be arranged in the first space CV-1 ( Figure 10B )middle.

[0132] The display circuit board 51 may be attached to an edge of one side of the display panel DP. For example, in an embodiment, the display circuit board 51 may be attached to the lower edge (e.g., in the Y direction) of the display panel DP. However, embodiments of the present disclosure are not necessarily limited thereto. In an embodiment, one side of the display circuit board 51 may be attached to an edge of one side of the display panel DP using an anisotropic conductive film.

[0133] In an embodiment, the display driver 52 may be provided on the display circuit board 51. The display driver 52 may receive a control signal and a power voltage and generate and output a signal and a voltage for driving the display panel DP. The display driver 52 may include an integrated circuit (IC).

[0134] The display circuit board 51 may be attached to the display panel DP. In an embodiment, the display circuit board 51 and the display panel DP may be attached to each other using an isotropic conductive film. The display circuit board 51 may be a flexible printed circuit board (FPCB) that can be bent, or a composite printed circuit board including both a rigid printed circuit board (PCB) that is rigid and not easily bent and a flexible printed circuit board.

[0135] In an embodiment, the touch sensor driver 53 may be provided on the display circuit board 51. The touch sensor driver 53 may include an integrated circuit. The touch sensor driver 53 may be attached to the display circuit board 51. The touch sensor driver 53 may be electrically connected to the touch electrodes of the touch sensor layer TSL of the display panel DP through the display circuit board 51.

[0136] The touch sensor layer TSL of the display panel DP can sense a user's touch input using at least one of various touch methods, such as a resistive layer method and a capacitive method. As an example, in an embodiment in which the touch sensor layer TSL of the display panel DP senses a user's touch input using a capacitive method, the touch sensor driver 53 can determine whether the user has touched the touch screen layer by applying a drive signal to a drive electrode among the touch electrodes and sensing a voltage charged in the mutual capacitance between the drive electrode and the sensing electrode through the sensing electrode among the touch electrodes. The user's touch can include a contact touch and a proximity touch. A contact touch indicates that an object, such as a user's finger or a pen, is in direct contact with the cover member 50 disposed on the touch sensor layer TSL. A proximity touch, such as hovering, indicates that an object, such as a user's finger or a pen, is located near the cover member 50, away from the cover member 50. The touch sensor driver 53 can be configured to transmit sensor data to the main processor 71 based on the sensed voltage, and the main processor 71 can be configured to calculate the touch coordinates where the touch input occurred by analyzing the sensor data.

[0137] A power supply unit may be additionally provided on the display circuit board 51. The power supply unit is configured to provide driving voltages for driving the pixels of the display panel DP, the scan driver, and the display driver 52. Alternatively, the power supply unit may be integrated with the display driver 52. In this embodiment, the display driver 52 and the power supply unit may be implemented in one integrated circuit.

[0138] Figure 6 It is along Figure 4 1 is a cross-sectional view of the display panel DP taken along line VI-VI'.

[0139] refer to Figure 6 The display panel DP may include a substrate 10 and a display layer D. In an embodiment, the display layer D may include a buffer layer 11 , a circuit layer, a display element layer, and a thin film encapsulation layer 30 .

[0140] As described above, the substrate 10 may include an insulating material such as glass, quartz, polymer resin, etc. The substrate 10 may be a flexible substrate that is bendable, foldable, and rollable.

[0141] The buffer layer 11 may be disposed on the substrate 10 (e.g., directly on the substrate 10 in the Z direction). The buffer layer 11 may reduce or block the penetration of foreign matter, moisture, or external air from below the substrate 10, and provide a flat surface on the substrate 10. In an embodiment, the buffer layer 11 may include an inorganic material, an organic material, or an organic / inorganic composite material, and include a single layer or multiple layers including an inorganic material and an organic material, the inorganic material including an oxide or a nitride. In an embodiment, a barrier layer may be further disposed between the substrate 10 and the buffer layer 11, the barrier layer blocking the penetration of external air. In an embodiment, the buffer layer 11 may include silicon oxide (SiO2) or silicon nitride (SiN x In an embodiment, the buffer layer 11 may include a first buffer layer 11 a and a second buffer layer 11 b stacked (eg, in the Z direction).

[0142] In an embodiment, the circuit layer may be disposed on the buffer layer 11 and may include a pixel circuit PC, a first gate insulating layer 12, a second gate insulating layer 13, an interlayer insulating layer 15, and a planarization layer 17. The pixel circuit PC may include a thin film transistor TFT and a storage capacitor Cst.

[0143] The thin film transistor TFT may be disposed on the buffer layer 11 (e.g., directly on the buffer layer 11 in the Z direction). The thin film transistor TFT may include a first semiconductor layer A1, a first gate electrode G1, a first source electrode S1, and a first drain electrode D1. The thin film transistor TFT may be connected to (e.g., electrically connected to) the organic light emitting diode OLED to drive the organic light emitting diode OLED.

[0144] In an embodiment, the first semiconductor layer A1 may be disposed on the buffer layer 11 (e.g., directly on the buffer layer 11 in the Z direction) and may include polycrystalline silicon. However, embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, the first semiconductor layer A1 may include amorphous silicon. In an embodiment, the first semiconductor layer A1 may include an oxide of at least one of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The first semiconductor layer A1 may include a channel region, a source region, and a drain region, and the source region and the drain region may be doped with impurities.

[0145] The first gate insulating layer 12 may be provided to cover the first semiconductor layer A1. In an embodiment, the first gate insulating layer 12 may include an inorganic insulating material such as silicon oxide (SiO2), silicon nitride (SiN x), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO x ). ZnO x It may be ZnO or ZnO 2. The first gate insulating layer 12 may include a single layer or multiple layers including an inorganic insulating material.

[0146] The first gate electrode G1 is disposed on the first gate insulating layer 12 (e.g., directly on the first gate insulating layer 12) to overlap the first semiconductor layer A1 (e.g., in the Z direction). In an embodiment, the first gate electrode G1 may include at least one of molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may include a single layer or multiple layers. As an example, the first gate electrode G1 may include a single Mo layer.

[0147] The second gate insulating layer 13 may cover the first gate electrode G1. In an embodiment, the second gate insulating layer 13 may include an inorganic insulating material such as silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO x ). ZnO x It may be ZnO or ZnO 2. The second gate insulating layer 13 may include a single layer or multiple layers including an inorganic insulating material.

[0148] The first upper electrode CE2 of the storage capacitor Cst may be disposed on the second gate insulating layer 13 (eg, directly on the second gate insulating layer 13 in the Z direction).

[0149] The first upper electrode CE2 may overlap the first gate electrode G1 thereunder in the display area DA (e.g., in the Z direction). The first gate electrode G1 and the first upper electrode CE2 overlapping each other with the second gate insulating layer 13 therebetween may constitute a storage capacitor Cst. The first gate electrode G1 may function as a first lower electrode CE1 of the storage capacitor Cst.

[0150] In an embodiment, the first upper electrode CE2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and include a single layer or a multilayer containing the above materials.

[0151] The interlayer insulating layer 15 may be formed to cover the first upper electrode CE2. In an embodiment, the interlayer insulating layer 15 may include silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO x ). ZnO x It may be ZnO or ZnO 2. The interlayer insulating layer 15 may include a single layer or multiple layers including an inorganic insulating material.

[0152] The first source electrode S1 and the first drain electrode D1 are disposed on the interlayer insulating layer 15 (e.g., directly on the interlayer insulating layer 15 in the Z direction). In an embodiment, the first source electrode S1 and the first drain electrode D1 may each include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may include a single layer or multiple layers including the above materials. As an example, the first source electrode S1 and the first drain electrode D1 may have a multilayer structure of Ti / Al / Ti.

[0153] The planarization layer 17 may be provided to cover the first source electrode S1 and the first drain electrode D1. The planarization layer 17 may have a flat upper surface so that the pixel electrode 21 provided thereon is formed to be flat.

[0154] The planarization layer 17 may include an organic material or an inorganic material, and include a single-layer structure or a multi-layer structure. For example, in an embodiment, the planarization layer 17 may include a general polymer (such as benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), polymethyl methacrylate (PMMA), or polystyrene), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, or a vinyl alcohol polymer. The planarization layer 17 may include an inorganic insulating material such as silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO x ). ZnO x It may be ZnO or ZnO 2 . In an embodiment, although the planarization layer 17 is formed after the initial layer is formed to provide a flat upper surface, chemical mechanical polishing may be performed on the upper surface of the layer forming the planarization layer 17 .

[0155] In an embodiment, the planarization layer 17 may have a through hole exposing one of the first source electrode S1 and the first drain electrode D1 of the thin film transistor TFT. The pixel electrode 21 may be electrically connected to the thin film transistor TFT by directly contacting the first source electrode S1 or the first drain electrode D1 through the through hole.

[0156] In an embodiment, the pixel electrode 21 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO) or aluminum zinc oxide (AZO). The pixel electrode 21 may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) or a compound thereof. As an example, in an embodiment, the pixel electrode 21 may have a structure including a layer above / below the reflective layer, and the layer may include ITO, IZO, ZnO or In2O3. In this embodiment, the pixel electrode 21 may have a stacked structure of ITO / Ag / ITO.

[0157] In an embodiment, the pixel defining layer 19 may cover an edge of the pixel electrode 21 on the planarization layer 17 and may have a first opening OP1 exposing a central portion of the pixel electrode 21. An emission area of the organic light emitting diode OLED, such as the size and shape of the sub-pixel P, is defined by the first opening OP1.

[0158] The pixel defining layer 19 can prevent arcing, etc., from occurring at the edge of the pixel electrode 21 by increasing the distance between the edge of the pixel electrode 21 and the opposing electrode 23 above the pixel electrode 21. In an embodiment, the pixel defining layer 19 may include an organic insulating material such as polyamide, acrylic resin, benzocyclobutene, and hexamethyldisiloxane (HMDSO), and be formed by spin coating, etc.

[0159] The emission layer 22b is disposed in the first opening OP1 of the pixel defining layer 19. The emission layer 22b is formed to correspond to the pixel electrode 21. In an embodiment, the emission layer 22b may include a polymer material or a low molecular weight material and be configured to emit red light, green light, blue light, or white light. However, embodiments of the present disclosure are not necessarily limited thereto.

[0160] In an embodiment, the organic functional layer 22e may be disposed on and / or below the emission layer 22b. The organic functional layer 22e may include a first functional layer 22a and / or a second functional layer 22c. However, the first functional layer 22a and / or the second functional layer 22c may be omitted.

[0161] The first functional layer 22a may be disposed below the emission layer 22b. In an embodiment, the first functional layer 22a may include a single layer or multiple layers including an organic material. The first functional layer 22a may be a hole transport layer (HTL) having a single layer structure. Alternatively, the first functional layer 22a may include a hole injection layer (HIL) and the HTL. The first functional layer 22a may be integrally formed to correspond to the organic light emitting diode OLED included in the display area DA.

[0162] The second functional layer 22c may be disposed on the emission layer 22b. In an embodiment, the second functional layer 22c may include a single layer or multiple layers including an organic material. The second functional layer 22c may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The second functional layer 22c may be integrally formed to correspond to the organic light emitting diode OLED included in the display area DA.

[0163] The relative electrode 23 may be provided on the second functional layer 22c. The relative electrode 23 may include a conductive material having a low work function. As an example, in an embodiment, the relative electrode 23 may include a (semi) transparent layer, the (semi) transparent layer including silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) or an alloy thereof. Alternatively, the relative electrode 23 may also include a layer containing ITO, IZO, ZnO or In2O3 on the (semi) transparent layer. The relative electrode 23 may be formed integrally to correspond to the organic light emitting diode OLED included in the display area DA.

[0164] The layers formed from the pixel electrode 21 to the opposite electrode 23 in the display area DA may constitute an organic light emitting diode OLED.

[0165] An upper layer 25 including an organic material may be formed on the opposing electrode 23. The upper layer 25 may be a layer for protecting the opposing electrode 23 and at the same time improving light extraction efficiency. The upper layer 25 may include an organic material having a refractive index higher than that of the opposing electrode 23. Alternatively, the upper layer 25 may include layers of different refractive indices stacked (e.g., in the Z direction). As an example, in an embodiment, the upper layer 25 may include a high refractive index layer / low refractive index layer / high refractive index layer stacked (e.g., in the Z direction). In this embodiment, the refractive index of the high refractive index layer may be greater than or equal to about 1.7, and the refractive index of the low refractive index layer may be less than or equal to about 1.3.

[0166] In an embodiment, the upper layer 25 may further include lithium fluoride (LiF). Alternatively, the upper layer 25 may further include an inorganic insulating material such as silicon oxide (SiO2) and silicon nitride (SiN x). However, the embodiment of the present disclosure is not necessarily limited thereto, and the upper layer 25 may be omitted when necessary. However, an embodiment in which the upper layer 25 is provided on the opposite electrode 23 will be mainly described in detail.

[0167] In an embodiment, the display panel DP may include a thin film encapsulation layer 30 shielding the upper layer 25 .

[0168] In an embodiment, the thin film encapsulation layer 30 may be provided in direct contact with the opposing electrode 23 or the upper layer 25. In this embodiment, the thin film encapsulation layer 30 may cover a portion of the display area DA and the peripheral area PA to prevent penetration of external moisture and oxygen. The thin film encapsulation layer 30 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. Hereinafter, for ease of description, an embodiment in which the thin film encapsulation layer 30 includes a first inorganic encapsulation layer 31, an organic encapsulation layer 32, and a second inorganic encapsulation layer 33 sequentially stacked on the upper surface of the upper layer 25 (for example, in the Z direction) is mainly described in detail.

[0169] In this embodiment, the first inorganic encapsulation layer 31 may cover the upper layer 25 and may include silicon oxide, silicon nitride and / or silicon oxynitride. Since the first inorganic encapsulation layer 31 is formed along the structure below it, the upper surface of the first inorganic encapsulation layer 31 is not flat. The organic encapsulation layer 32 may cover the first inorganic encapsulation layer 31, and unlike the first inorganic encapsulation layer 31, the upper surface of the organic encapsulation layer 32 may be approximately flat. For example, the upper surface of the organic encapsulation layer 32 corresponding to a portion of the display area DA may be approximately flat. In an embodiment, the organic encapsulation layer 32 may include at least one material of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate and hexamethyldisiloxane. The second inorganic encapsulation layer 33 may cover the organic encapsulation layer 32 and may include silicon oxide, silicon nitride and / or silicon oxynitride.

[0170] The touch sensor layer TSL may be disposed on the thin film encapsulation layer 30 (eg, in the Z direction).

[0171] A protective film 92 including a protective film base 92 a and an adhesive layer 92 b may be disposed on the lower surface of the substrate 10 .

[0172] Figure 7A and Figure 7B yes Figure 6 . A circuit diagram of a circuit of the display panel DP shown in FIG.

[0173] refer to Figure 7A and Figure 7BPixel circuit PC can be connected to light-emitting element ED to enable subpixel P to emit light. In an embodiment, pixel circuit PC includes a driving thin-film transistor T1, a switching thin-film transistor T2, and a storage capacitor Cst. Switching thin-film transistor T2 is connected to scan line SL and data line DL and is configured to transmit data signal Dm to driving thin-film transistor T1 based on scan signal Sn. Data signal Dm is input via data line DL, and scan signal Sn is input via scan line SL.

[0174] The storage capacitor Cst may be connected to the switching thin film transistor T2 and the driving voltage line PL and configured to store a voltage corresponding to a difference between a voltage transferred from the switching thin film transistor T2 and a driving voltage ELVDD supplied to the driving voltage line PL.

[0175] The driving thin film transistor T1 can be connected to the driving voltage line PL and the storage capacitor Cst and configured to control the driving current according to the voltage stored in the storage capacitor Cst. The driving current flows from the driving voltage line PL to the light-emitting element ED. The light-emitting element ED can be configured to emit light with a preset brightness corresponding to the driving current.

[0176] Although the reference Figure 7A It is described that the pixel circuit PC includes two thin film transistors and one storage capacitor, but embodiments of the present disclosure are not necessarily limited thereto.

[0177] refer to Figure 7B In an embodiment, the pixel circuit PC may include a driving thin film transistor T1, a switching thin film transistor T2, a compensation thin film transistor T3, a first initialization thin film transistor T4, an operation control thin film transistor T5, an emission control thin film transistor T6 and a second initialization thin film transistor T7.

[0178] although Figure 7B Although an embodiment is shown in which each pixel circuit PC includes signal lines SL, SL-1, SL+1, EL, and DL, an initialization voltage line VL, and a drive voltage line PL, the embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, at least one of the signal lines SL, SL-1, SL+1, EL, and DL and / or the initialization voltage line VL may be shared by adjacent pixel circuits PC.

[0179] The drain electrode of the driving thin film transistor T1 may be electrically connected to the light emitting element ED through the emission control thin film transistor T6. In an embodiment, the driving thin film transistor T1 may be configured to receive the data signal Dm and provide a driving current to the light emitting element ED according to the switching operation of the switching thin film transistor T2.

[0180] The gate electrode of the switching thin film transistor T2 is connected to the scan line SL, and the source electrode is connected to the data line DL. The drain electrode of the switching thin film transistor T2 may be connected to the source electrode of the driving thin film transistor T1 and connected to the driving voltage line PL through the operation control thin film transistor T5.

[0181] In an embodiment, the switching thin film transistor T2 is turned on according to the scan signal Sn transmitted through the scan line SL and performs a switching operation of transmitting the data signal Dm to the source electrode of the driving thin film transistor T1. The data signal Dm is transmitted to the data line DL.

[0182] The gate electrode of the compensation thin-film transistor T3 may be connected to the scan line SL. The source electrode of the compensation thin-film transistor T3 is connected to the drain electrode of the drive thin-film transistor T1 and is connected to the pixel electrode of the light-emitting element ED via the emission control thin-film transistor T6. The drain electrode of the compensation thin-film transistor T3 may be connected to one of the electrodes of the storage capacitor Cst, the source electrode of the first initialization thin-film transistor T4, and the gate electrode of the drive thin-film transistor T1. In an embodiment, the compensation thin-film transistor T3 is turned on by the scan signal Sn received via the scan line SL and diode-connects the drive thin-film transistor T1 by connecting the gate electrode and drain electrode of the drive thin-film transistor T1 to each other.

[0183] The gate electrode of the first initialization thin film transistor T4 may be connected to the previous scan line SL-1. The drain electrode of the first initialization thin film transistor T4 may be connected to the initialization voltage line VL. The source electrode of the first initialization thin film transistor T4 may be connected to one of the electrodes of the storage capacitor Cst, the drain electrode of the compensation thin film transistor T3, and the gate electrode of the driving thin film transistor T1. For example, in an embodiment, the first initialization thin film transistor T4 may be turned on according to the previous scan signal Sn-1 received through the previous scan line SL-1, and may perform an initialization operation of initializing the voltage of the gate electrode of the driving thin film transistor T1 by transmitting the initialization voltage Vint to the gate electrode of the driving thin film transistor T1.

[0184] The gate electrode of the operation control thin film transistor T5 can be connected to the emission control line EL. The source electrode of the operation control thin film transistor T5 can be connected to the driving voltage line PL. The drain electrode of the operation control thin film transistor T5 is connected to the source electrode of the driving thin film transistor T1 and the drain electrode of the switching thin film transistor T2.

[0185] The gate electrode of the emission control thin film transistor T6 can be connected to the emission control line EL. The source electrode of the emission control thin film transistor T6 can be connected to the drain electrode of the drive thin film transistor T1 and the source electrode of the compensation thin film transistor T3. The drain electrode of the emission control thin film transistor T6 can be electrically connected to the pixel electrode of the light-emitting element ED. In an embodiment, the operation control thin film transistor T5 and the emission control thin film transistor T6 can be turned on simultaneously in response to the emission control signal En transmitted via the emission control line EL, the driving voltage ELVDD is transmitted to the light-emitting element ED, and a driving current flows through the light-emitting element ED.

[0186] The gate electrode of the second initialization thin film transistor T7 may be connected to the next scan line SL+1. The source electrode of the second initialization thin film transistor T7 may be connected to the pixel electrode of the light-emitting element ED. The drain electrode of the second initialization thin film transistor T7 may be connected to the initialization voltage line VL. In an embodiment, the second initialization thin film transistor T7 may be turned on in response to the next scan signal Sn+1 transmitted via the next scan line SL+1 to initialize the pixel electrode of the light-emitting element ED.

[0187] Despite Figure 7B , the first initialization thin film transistor T4 and the second initialization thin film transistor T7 are respectively connected to the previous scan line SL-1 and the next scan line SL+1, but the embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, both the first initialization thin film transistor T4 and the second initialization thin film transistor T7 may be connected to the previous scan line SL-1 and thus driven according to the previous scan signal Sn-1.

[0188] The other electrode of the storage capacitor Cst may be connected to the driving voltage line PL. One of the electrodes of the storage capacitor Cst may be connected together to the gate electrode of the driving thin film transistor T1, the drain electrode of the compensation thin film transistor T3, and the source electrode of the first initialization thin film transistor T4.

[0189] An opposite electrode (eg, cathode) of the light emitting element ED is configured to receive a common voltage ELVSS. The light emitting element ED may be configured to emit light by receiving a driving current from the driving thin film transistor T1.

[0190] However, the pixel circuit PC is not necessarily limited to the reference Figure 7A and Figure 7B The number of thin film transistors, the number of storage capacitors, and the circuit design are described, and the number of thin film transistors, the number of storage capacitors, and the circuit design may be variously changed.

[0191] Figure 8 is a schematic perspective view of an apparatus 100 for manufacturing a display device according to an embodiment. Figure 9 yes Figure 8 Schematic cross-sectional view of an apparatus 100 for manufacturing a display device shown in FIG.

[0192] refer to Figure 8 and Figure 9 In an embodiment, an apparatus 100 for manufacturing a display device may include a first jig 110 , a mold 120 , a second jig 130 , a driver, and a light source 160 .

[0193] The first jig 110 may include a first jig body 111, a pressing portion 112, a coupling portion 113, and a first injector 114. The pressing portion 112 may protrude from the first jig body 111 (e.g., protrude downward in the Z direction). In an embodiment, the pressing portion 112 may be in direct contact with a portion of the display panel DP to apply force to the portion of the display panel DP. The coupling portion 113 may protrude from the first jig body 111. In an embodiment, the coupling portion 113 may be formed in the form of a pin protruding from the first jig body 111. In an embodiment, the coupling portion 113 may be provided in plurality, and the plurality of coupling portions 113 may be arranged at the edge portion of the first jig body 111 to be spaced apart from each other. The first injector 114 may be provided on the first jig body 111. In an embodiment, at least one first injector 114 may be provided. In an embodiment in which a plurality of first injectors 114 are provided, the plurality of first injectors 114 may be arranged to be spaced apart from each other. The first injector 114 may be connected to a separate supply unit and pipe configured to supply the photo-curable resin from the outside, or include a nozzle configured to eject the photo-curable resin that may be inserted into the first jig body 111 .

[0194] The mold 120 can move together with the first jig 110 or be selectively coupled to the first jig 110. In an embodiment, the mold 120 may include a mold body 121, a protruding portion 122, a second injector 123, and a first receiver 124. In an embodiment, the mold body 121 may have a plate shape and be tightly attached to the second jig 130 and selectively be in direct contact with the second jig 130. The protruding portion 122 may protrude from the mold body 121 toward the first jig 110 (e.g., protruding upward in the Z direction). In an embodiment, the protruding portion 122 may include an opening area 122-1, and the opening area 122-1 may be inserted into the pressing portion 112. In this embodiment, the pressing portion 112 may pass through the opening area 122-1 and be in direct contact with the display panel DP. The second injector 123 may be arranged to correspond to the first injector 114. The second injector 123 may be disposed on the protruding portion 122 (e.g., directly on the protruding portion 122). The first receiving portion 124 may be arranged to correspond to the coupling portion 113. In an embodiment, the first receiving portion 124 may be formed in the form of a hole.

[0195] The second jig 130 may be arranged to receive the display panel DP. The second jig 130 may include a second jig body 131 having a plate shape and a second receiving portion 132 into which the coupling portion 113 is inserted. The second receiving portion 132 may be arranged in the second jig body 131 to correspond to the coupling portion 113 and the first receiving portion 124. In an embodiment, a portion of the coupling portion 113 protruding through the first receiving portion 124 may be inserted into the second receiving portion 132.

[0196] The driver may be connected to at least one of the first fixture 110 and the second fixture 130 and may linearly move at least one of the first fixture 110 and the second fixture 130. As an example, the driver may be connected to the first fixture 110 and may bring the first fixture 110 close to the second fixture 130, or separate the first fixture 110 from the second fixture 130. However, embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, the driver may be connected to the second fixture 130 and may bring the second fixture 130 close to the first fixture 110, or separate the second fixture 130 from the first fixture 110. In an embodiment, the driver may include a first driver 140 connected to the first fixture 110 and a second driver 150 connected to the second fixture 130. Hereinafter, for ease of description, an embodiment in which the driver includes the first driver 140 and the second driver 150 is mainly described in detail.

[0197] The driver may be formed in various forms. As an example, in an embodiment, the driver may include a cylinder. However, embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, the driver may include a linear motor. In an embodiment, the driver may include a motor and a ball screw connected to the motor. However, the driver is not necessarily limited thereto and may include all devices and structures connected to at least one of the first fixture 110 and the second fixture 130 to move at least one of the first fixture 110 and the second fixture 130.

[0198] The light source 160 may be disposed on the side surface of the display panel DP to irradiate light onto the side surface of the display panel DP. In an embodiment, the light source 160 may be configured to emit visible light to the outside (e.g., the external environment). In an embodiment, the light source 160 may be configured to provide light having a wavelength peak in a range from about 450 nm to about 500 nm. The light source 160 may have various forms. As an example, the light source 160 may be in the form of a point light source. However, embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, the light source 160 may be disposed on a portion of the side surface of the display panel DP and formed linearly. The light source 160 may be arranged to surround the entire side surface of the display panel DP.

[0199] The operation of the device 100 for manufacturing a display device is described. In an embodiment, the display panel DP may be set on the second jig 130, and then the first jig 110 and the mold 120 may be set on the display panel DP. In an embodiment, at least one of the first driver 140 and the second driver 150 may be configured to set the first jig 110 and the second jig 130 so that the first jig 110 and the second jig 130 are initially spaced apart from each other. In addition, the mold 120 may be in a state of being coupled to the first jig 110, or only the mold 120 may be set separately on the display panel DP. In this embodiment, the first receiving portion 124 and the second receiving portion 132 may be set in the mold 120 and the second jig 130 to correspond to each other.

[0200] At least one of the first driver 140 and the second driver 150 can be operated to subsequently bring the first jig 110 and the second jig 130 closer to each other. In this embodiment, the first jig 110 can be tightly attached to the second jig 130. The pressing portion 112 can be inserted into the opening area 122-1 to directly contact the display panel DP and is configured to prevent the display panel DP from moving by applying a force to the display panel DP. In addition, since the coupling portion 113 is inserted into the first receiving portion 124 and the second receiving portion 132, the coupling portion 113 can be configured to prevent the mold 120 from moving and prevent the first jig 110 and the second jig 130 from moving relative to each other.

[0201] When the above process is completed, the mold 120, the second fixture 130 and the display panel DP can form a first space CV-1. The photocurable resin can be injected into the first space CV-1 by the first injector 114 and the second injector 123 connected to the first space CV-1. In an embodiment, the light source 160 can be configured to then irradiate light to the entire side surface of the first fixture 110 and the mold 120 to cure the photocurable resin. In this embodiment, the first fixture 110 and the mold 120 can each include a transparent material. As an example, the first fixture 110 may include at least one of polymethyl methacrylate (PMMA), polycarbonate (PC), glass and quartz as a transparent material. In addition, the mold 120 may include at least one of elastic and transparent silicone rubber, plastic rubber and Teflon rubber.

[0202] When the curing of the photocurable resin is completed by the irradiation of light, at least one of the first driver 140 and the second driver 150 can be operated to separate the first jig 110 and the second jig 130 from each other. For example, in an embodiment, the mold 120 can be moved together with the first jig 110 and separated from the second jig 130, or the first jig 110 can be separated from the mold 120, and then the mold 120 can be removed alone.

[0203] Although the coupling portion 113 is described as being provided to the first jig 110, embodiments of the present disclosure are not necessarily limited thereto. For example, in an embodiment, the coupling portion 113 may be provided on the second jig 130, and the second receiving portion 132 may be provided in the first jig 110. In an embodiment, the coupling portion 113 may be provided on the mold 120, the first receiving portion 124 may be provided in the first jig 110, and the second receiving portion 132 may be provided in the second jig 130. In this embodiment, the coupling portion 113 of the mold 120 may include a first coupling portion protruding toward the first jig 110 and a second coupling portion protruding toward the second jig 130.

[0204] Hereinafter, a method of forming the first protective layer 93 a and the second protective layer 93 b is described in detail.

[0205] 10A to 10C is a schematic cross-sectional view illustrating a method of manufacturing a display device according to an embodiment of the present disclosure.

[0206] refer to 10A to 10C , preparing a display panel DP in which the substrate 10 having the bending protection layer BPL provided thereon is bent, and then, as in reference Figure 8 and Figure 9As described, the first jig 110 , the mold 120 , and the second jig 130 are coupled to each other, and then, the photocurable resin may be supplied to the first space CV- 1 and the second space CV- 2 .

[0207] For example, in an embodiment, a photocurable resin can enter the interior of the first space CV-1 through the first injector 114 of the first jig 110 and the second injector 123 of the mold 120. In an embodiment, the first space CV-1 is formed by the mold 120, the second jig 130, the bending protection layer BPL, the touch sensor layer TSL, the display layer D, and at least a portion of the substrate 10, or is formed by the second jig 130, the touch sensor layer TSL, the display layer D, and at least a portion of the substrate 10. In this embodiment, the photocurable resin can move from one side surface of the display panel DP to the other side surface of the display panel DP. In addition, the photocurable resin can be embedded in the second space CV-2 formed by the protective film 92 and the cushion layer 91. For example, the second space CV-2 may be between the upper and lower surfaces of the display panel DP facing each other in the bending area BA. In an embodiment, the protective film 92 includes a protective film base 92a and an adhesive layer 92b disposed in the bending area BA of the display panel DP.

[0208] In an embodiment, the light source 160 may be configured to subsequently irradiate light from outside the first jig 110 and the mold 120 onto the side surface of the display panel DP. The light may cure the photocurable resin disposed in the first space CV-1. The light irradiated onto the curved area BA of the display panel DP may cure not only the photocurable resin disposed in the first space CV-1 outside the curved area BA but also the photocurable resin disposed in the second space CV-2. In an embodiment, due to the substrate 10 disposed between the first space CV-1 and the second space CV-2, the light is hardly blocked but may pass through the substrate 10 and be transferred to the photocurable resin within the second space CV-2.

[0209] In this embodiment, the photocurable resin disposed in the second space CV-2 may form the second protective layer 93b, and the photocurable resin disposed in the first space CV-1 may form the first protective layer 93a. For example, in an embodiment, the first protective layer 93a may be disposed on the edge of the display panel DP and the curved protective layer BPL. In addition, the first protective layer 93a may be integrally formed with the second protective layer 93b by being connected to the second protective layer 93b. In an embodiment, the first protective layer 93a and the second protective layer 93b may be connected to each other on the side surface of the display panel DP.

[0210] Therefore, the apparatus and method for manufacturing a display device can be configured to simultaneously form the first and second spaces. Furthermore, the apparatus and method for manufacturing a display device can be configured to reduce the time required to form the protective layer by using light to form the protective layer. Because the apparatus and method for manufacturing a display device do not require excessive energy to form the protective layer, damage to various components of the display panel during the formation of the protective layer can be reduced.

[0211] Figure 11 is a schematic cross-sectional view of a portion of a display device according to an embodiment.

[0212] refer to Figure 11 In an embodiment, the display device may include a display panel DP (see Figure 2 ), display circuit board 51, cover member 50, bracket 60, main circuit board and lower cover. In this embodiment, since the display panel DP, display circuit board 51, cover member 50, main circuit board and lower cover are the same as those of reference Figures 1 to 3B Those described are similar, so their detailed descriptions are omitted for simplicity of description.

[0213] In an embodiment, the bracket 60 may include a third injector 65 (e.g., an injection hole) through which the photocurable resin is injected. In this embodiment, the third injector 65 may be formed to pass through the back side of the bracket 60 (e.g., the surface facing the lower cover). In an embodiment, the third injector 65 may be configured to communicate with a third space CV-3 formed by at least one edge of the display panel DP, the bracket 60, and the cover member 50. In this embodiment, the third space CV-3 may be defined by the substrate 10 on which the bending protection layer BPL and the display layer D are provided, the touch sensor layer TSL provided on the display layer D, and the bracket 60. At least one third injector 65 may be provided. In an embodiment in which a plurality of third injectors 65 are provided, the plurality of third injectors 65 may be spaced apart from each other.

[0214] In an embodiment, the display panel DP is manufactured, and then the cover member 50 may be attached to the display panel DP, the display panel DP may be inserted into the bracket 60, and the cover member 50 may be attached to the bracket 60. In an embodiment, the cover member 50 may be coupled to the bracket 60 by a separate resin or a separate adhesive layer. In addition, the display panel DP inserted into the bracket 60 may be as shown. Figure 5 The display circuit board 51 and the display driver 52 may be attached to or inserted into the bracket 60 .

[0215] The display panel DP is disposed within the bracket 60, and then the photocurable resin may be supplied through the third injector 65. In an embodiment, the photocurable resin may be injected into the third space CV-3 including the receiving space formed in the bracket 60, and the photocurable resin may be spread to the entire edge of the display panel DP. In an embodiment, a portion of the photocurable resin may move to the Figure 5 The second space CV-2 shown in FIG is filled with the interior of the second space CV-2. The second space CV-2 may be defined by a protective film 92 including a protective film base 92a and an adhesive layer 92b, and a cushion layer 91.

[0216] After the above process is completed, light may be irradiated from the outside of the bracket 60 by the light source 260. Figures 1 to 3B as well as Figure 8 Those described are the same or similar, so their detailed descriptions are omitted for ease of description.

[0217] In an embodiment, the bracket 60 may include a transparent material through which light can pass. As an example, the bracket 60 may include at least one of polymethyl methacrylate (PMMA), polycarbonate (PC), glass, quartz, and transparent silicone rubber as the transparent material.

[0218] In an embodiment where light is transmitted as described above, a first protective layer 93a may be formed between the display panel DP and the bracket 60, and a second protective layer 93b may be formed within the bending area BA of the display panel DP. In this embodiment, the first protective layer 93a and the second protective layer 93b may be connected to each other.

[0219] Therefore, since the display device includes the first and second protective layers 93a and 93b, damage to the display panel DP caused by impact applied not only to the bending area BA of the display panel DP but also to the edge of the display panel DP may be reduced.

[0220] Furthermore, according to the method of manufacturing the display device, the protective layer may be formed using a relatively quick and simple process.

[0221] The display device according to an embodiment of the present disclosure may be configured to protect an edge of a display panel and reduce damage to a bent portion of the display panel.

[0222] The apparatus for manufacturing a display device and the method for manufacturing a display device may be configured to simultaneously form a protective layer on a side surface and a bent portion of a display panel.

[0223] An apparatus for manufacturing a display device and a method for manufacturing a display device may be configured to manufacture a display device relatively quickly by using light.

[0224] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure.

Claims

1. A display device comprising a display panel, wherein: The display panel includes: a substrate comprising a first region, a second region, and a bent region in a bent state, the bent region connecting the first region to the second region; a first protective layer disposed in the curved region of the substrate; and A second protection layer is provided on at least a portion of the edge of the substrate and at least one surface of the curved region of the substrate.

2. The display device according to claim 1, wherein The first protective layer and the second protective layer each include a photocurable resin.

3. The display device according to claim 2, wherein: The photocurable resin is cured by light having a wavelength peak within a range of 450 nm to 500 nm.

4. The display device according to claim 2, wherein The photocurable resin includes at least one of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (2,4,6-trimethylbenzoyldiphenylphosphine oxide), ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate (ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate), bisacylphosphine oxide, bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)-phenyl)titanium (bis(cyclopentadienyl)-bis[2,6-difluoro-3-(pyrrol-1-yl)-phenyl]titanium), and camphorquinone.

5. The display device according to claim 2, further comprising a bracket, wherein The bracket is arranged to receive the display panel. The display device according to claim 5 , wherein: The bracket includes an injection hole arranged to receive the photocurable resin.

7. The display device according to claim 5, wherein: The bracket comprises a transparent material.

8. The display device according to claim 1, wherein The second protective layer is connected to the first protective layer.

9. An apparatus for manufacturing a display device, the apparatus comprising: First clamp; a second jig arranged to receive a display panel thereon, the second jig facing the first jig; as well as a mold disposed between the first jig and the second jig, the mold being selectively coupled to the first jig, the mold and the second jig together forming a space at an edge portion of the display panel, Wherein, the first fixture and the mold comprise transparent materials.

10. The apparatus according to claim 9, wherein: One of the first clamp and the second clamp includes a coupling portion; and The other of the first clamp and the second clamp includes a first receiving portion arranged to receive the coupling portion.

11. The device according to claim 10, wherein The mold comprises a second receiving portion arranged to receive the coupling part.

12. The device according to claim 9, wherein The first jig and the mold include an injector arranged to receive a light-curable resin into the space.

13. The device according to claim 12, wherein The photocurable resin is cured by light having a wavelength peak within a range of 450 nm to 500 nm.

14. The device according to claim 12, wherein The photocurable resin includes at least one of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (2,4,6-trimethylbenzoyldiphenylphosphine oxide), ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate (ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate), bisacylphosphine oxide, bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)-phenyl)titanium (bis(cyclopentadienyl)-bis[2,6-difluoro-3-(pyrrol-1-yl)-phenyl]titanium), and camphorquinone. 15 . The apparatus according to claim 9 , further comprising a light source provided on side surfaces of the first jig and the mold and irradiating light to the space.

16. The device according to claim 15, wherein The light source irradiates visible light toward the first jig and the mold.

17. A method for manufacturing a display device, the method comprising: disposing the display panel having the bent portion in a bent state on a second jig; placing a first jig and a mold on the display panel to form a first space at at least one edge of the display panel; supplying a light-curable resin into the first space; as well as The photocurable resin is cured by irradiating light into the first space.

18. The method according to claim 17, wherein The photocurable resin is cured by light having a wavelength peak within a range of 450 nm to 500 nm.

19. The method according to claim 17, wherein The photocurable resin includes at least one of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (2,4,6-trimethylbenzoyldiphenylphosphine oxide), ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate (ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate), bisacylphosphine oxide, bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)-phenyl)titanium (bis(cyclopentadienyl)-bis[2,6-difluoro-3-(pyrrol-1-yl)-phenyl]titanium), and camphorquinone.

20. The method according to claim 17, wherein The light is irradiated from a side surface of the display panel. 21 . The method of claim 17 , further comprising injecting the photocurable resin into a second space between upper and lower surfaces of the curved portion of the display panel that face each other.

22. The method according to claim 21, wherein The photo-curable resin supplied into the first space and the photo-curable resin injected into the second space are cured and connected to each other.

23. A method for manufacturing a display device, the method comprising: disposing a display panel within a bracket to form a first space defined by at least one edge of the display panel, the bracket, and a cover member of the display panel; supplying a light-curable resin into the first space; as well as The photocurable resin is cured by irradiating light into the first space.

24. The method according to claim 23, wherein The photocurable resin is cured by light having a wavelength peak within a range of 450 nm to 500 nm.

25. The method according to claim 23, wherein The photocurable resin includes at least one of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (2,4,6-trimethylbenzoyldiphenylphosphine oxide), ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate (ethyl(2,4,6-trimethylbenzoyl)phenylphosphinate), bisacylphosphine oxide, bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)-phenyl)titanium (bis(cyclopentadienyl)-bis[2,6-difluoro-3-(pyrrol-1-yl)-phenyl]titanium), and camphorquinone.

26. The method according to claim 23, wherein The light is irradiated from a side surface of the display panel. 27 . The method of claim 23 , further comprising injecting the photocurable resin into a second space between opposing upper and lower surfaces of a bent portion of the display panel in a bent state. 28 . The method according to claim 27 , further comprising curing the photo-curable resin supplied into the first space and the photo-curable resin injected into the second space and connecting them to each other.

29. The method according to claim 23, wherein The bracket comprises a transparent material.

30. Electronic devices, including: The display device according to any one of claims 1 to 8; as well as A main circuit board is connected to the display panel.

31. The electronic device according to claim 30, further comprising: The lower cover is arranged under the main circuit board.

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