Temperature control methods, devices, readable media, and electronic equipment for machine tool heating systems

Abstract

This application relates to the field of semiconductor technology and discloses a temperature control method, apparatus, readable medium, and electronic device for a machine tool heating system. The temperature control method for the machine tool heating system of this application includes: acquiring relevant data of the heater; determining a feedforward gain and a disturbance amount based on the relevant data of the heater, wherein the feedforward gain is used to determine the feedforward compensation power of the heater in conjunction with the disturbance amount when a sudden increase in the disturbance amount is detected; determining a dissipation model of the heater based on the relevant data of the heater, and determining the dissipation compensation power of the heater based on the dissipation model; determining the process compensation power of the heater if the set process compensation conditions are met under the machine tool liquid spraying condition; and determining the target heating power of the heater based on the feedforward compensation power, the dissipation compensation power, and the process compensation power. This application has the advantages of improving temperature control response speed, realizing multi-dimensional power compensation synergy, and improving temperature stability in semiconductor manufacturing processes.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a temperature control method, apparatus, readable medium, and electronic device for a machine tool heating system. Background Technology

[0002] The rapid development of semiconductor technology has transformed every aspect of people's lives. From smartphones and computers to new energy vehicles and artificial intelligence, the increased computing power and energy efficiency of semiconductor chips have driven the comprehensive penetration of digitalization and intelligence. For example, 5G communication base stations rely on high-frequency, low-power radio frequency semiconductors for signal transmission, autonomous driving systems rely on high-performance computing chips to process massive amounts of data, and third-generation semiconductor materials (such as silicon carbide and gallium nitride) have demonstrated their advantages in high temperature resistance and high power in new energy vehicles and photovoltaic inverters. Furthermore, cutting-edge technologies such as quantum computing and biochips are constantly pushing physical limits thanks to the micro-nano fabrication capabilities of semiconductor processes. This continuous expansion of application areas places higher demands on semiconductor manufacturing processes.

[0003] Semiconductor manufacturing processes require high precision and stability in temperature control, especially in the wafer etching stage, where temperature fluctuations directly affect etching rate, uniformity, and chip yield. Existing semiconductor equipment heaters suffer from slow response times and weak anti-interference capabilities, making precise temperature control impossible and compromising wafer etching rates, thus increasing the cost of semiconductor materials. Summary of the Invention

[0004] In view of this, embodiments of this application provide a temperature control method, apparatus, readable medium, and electronic device for a machine heating system. The technical solution of this application has the advantages of improving temperature control response speed, achieving multi-dimensional power compensation coordination, and improving the stability of semiconductor manufacturing processes, while also offering high wafer etching rates and low costs.

[0005] In a first aspect, this application provides a temperature control method for a machine tool heating system, used in a controller for the machine tool heating system, wherein the machine tool heating system further includes a heater, and the method includes:

[0006] Obtain relevant data about the heater;

[0007] Based on the relevant data of the heater, the feedforward gain and disturbance amount corresponding to the heater are determined. The feedforward gain is used to determine the feedforward compensation power of the heater in combination with the disturbance amount when a sudden increase in the disturbance amount is detected.

[0008] Based on the relevant data of the heater, the dissipation model of the heater is determined, and the dissipation compensation power of the heater is determined based on the dissipation model;

[0009] Under the liquid spraying condition of the machine, if the set process compensation conditions are met, the process compensation power of the heater is determined.

[0010] The target heating power of the heater is determined based on the feedforward compensation power, the dissipation compensation power, and the process compensation power.

[0011] In one possible implementation of the first aspect, the disturbance includes the heater inlet flow rate, and the feedforward compensation power of the heater is determined by combining the disturbance in the event of a detected sudden increase in the disturbance of the machine heating system in the following manner:

[0012] Determine the flow increment corresponding to the inlet flow rate of the heater;

[0013] The feedforward compensation power is determined based on the product of the feedforward gain and the flow increment.

[0014] In one possible implementation of the first aspect, the dissipation model of the heater is determined based on relevant data of the heater in the following manner:

[0015] The temperature dissipation characteristics of the heater are obtained by analyzing the relevant data of the heater.

[0016] Based on the temperature dissipation characteristics of the heater, a dissipation polynomial is established regarding the inlet flow rate and outlet temperature of the heater;

[0017] The coefficients of the variables and the values ​​of the constants in the dissipation polynomial are solved to obtain the solved dissipation polynomial, and the solved dissipation polynomial is determined as the dissipation model.

[0018] In one possible implementation of the first aspect, the dissipation compensation power of the heater is determined based on the dissipation model in the following manner:

[0019] The heater inlet flow rate and the target outlet temperature of the heater are determined;

[0020] The dissipation value of the heater is obtained by substituting the heater inlet flow rate and the heater target outlet temperature into the dissipation model.

[0021] The dissipation compensation power of the heater is obtained based on the dissipation value of the heater.

[0022] In one possible implementation of the first aspect, the set process compensation condition includes: the temperature difference between the actual outlet temperature of the heater and the target outlet temperature of the heater is greater than a set threshold.

[0023] Under the liquid spraying condition of the machine, if the set process compensation conditions are met, the process compensation power of the heater is determined, including:

[0024] The process compensation power is determined based on the temperature difference between the actual outlet temperature of the heater and the target outlet temperature of the heater.

[0025] In one possible implementation of the first aspect, determining the target heating power of the heater based on the feedforward compensation power, the dissipation compensation power, and the process compensation power includes:

[0026] The target heating power of the heater is obtained by summing the feedforward compensation power, the dissipation compensation power, and the process compensation power.

[0027] In one possible implementation of the first aspect, the relevant data of the heater includes the heater's heating power, heater body temperature, heater outlet temperature, heater inlet liquid temperature, and heater inlet flow rate.

[0028] Secondly, this application provides a temperature control device for a machine tool heating system, comprising:

[0029] The data acquisition module is used to acquire relevant data about the heater.

[0030] The first determining module is used to determine the feedforward gain and disturbance amount corresponding to the heater based on the relevant data of the heater. The feedforward gain is used to determine the feedforward compensation power of the heater in combination with the disturbance amount when a sudden increase in the disturbance amount is detected.

[0031] The second determining module is used to determine the dissipation model of the heater based on relevant data of the heater, and then determine the dissipation compensation power of the heater based on the dissipation model.

[0032] The third determining module is used to determine the process compensation power of the heater if the set process compensation conditions are met under the liquid spraying condition of the machine.

[0033] The fourth determining module is used to determine the target heating power of the heater based on the feedforward compensation power, the dissipation compensation power, and the process compensation power.

[0034] Thirdly, this application provides a computer-readable storage medium storing instructions that, when executed on an electronic device, cause the electronic device to perform a temperature control method for a machine heating system as described in the first aspect and any possible implementation thereof.

[0035] Fourthly, this application provides an electronic device, comprising:

[0036] Memory, used to store instructions, and

[0037] One or more processors, when the instructions are executed by the one or more processors, perform the temperature control method of the machine tool heating system as described in the first aspect above and any possible implementation of the first aspect.

[0038] Compared with the prior art, the beneficial effects of this application are as follows:

[0039] This application's technical solution determines the feedforward gain corresponding to the heater based on relevant heater data, thereby determining the heater's feedforward compensation power. This allows for compensation of heater outlet temperature fluctuations caused by significant fluctuations in heater inlet flow, resulting in a more stable heater outlet temperature. Based on the heater's data, a dissipation model is determined, and the dissipation compensation power is calculated to compensate for heater outlet temperature fluctuations caused by heat dissipation. Furthermore, during liquid spraying, if the set process compensation conditions are met, the heater's process compensation power is determined, which can supplement the liquid temperature fluctuations during spraying. Based on the aforementioned feedforward compensation power, dissipation compensation power, and process compensation power, the target heating power of the heater is determined. This allows for real-time adjustment of the heater's power based on the target heating power. Through the dynamic superposition of feedforward compensation power, dissipation compensation power, and process compensation power, precise temperature control is achieved, effectively improving the stability and yield of semiconductor manufacturing processes. This results in fast temperature control response, high wafer etching rate, and low cost. Attached Figure Description

[0040] Figure 1 According to some embodiments of this application, a wafer fabrication process flow is shown;

[0041] Figure 2 According to some embodiments of this application, a structural block diagram of a machine tool heating system is shown;

[0042] Figure 3 According to some embodiments of this application, a flowchart of a temperature control method for a machine tool heating system is shown;

[0043] Figure 4 According to some embodiments of this application, a structural block diagram of a temperature control device for a machine tool heating system is shown;

[0044] Figure 5 According to some embodiments of this application, a structural block diagram of an electronic device is shown. Detailed Implementation

[0045] The illustrative embodiments of this application include, but are not limited to, a temperature control method, apparatus, readable medium, and electronic device for a machine tool heating system.

[0046] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0047] To facilitate understanding of the technical solution of this application, an application scenario of the technical solution of this application will be introduced first below. For example... Figure 1 The diagram shows a wafer fabrication process flow. Figure 1 The process flow diagram shown includes a chemical cabinet 12, a machine heating system 10, a needle valve 14, a chamber 13, and a liquid spraying device 15.

[0048] The chemical cabinet 12 stores and manages the chemical solutions required for etching, such as hydrofluoric acid (HF), buffered oxide etchant (BOE), and phosphoric acid (H3PO4). Depending on process requirements, in some embodiments, liquid is drawn from the chemical cabinet 12 and impurities are removed through a filtration device to improve liquid purity and meet the requirements of nanoscale etching precision. The liquid flowing out of the chemical cabinet 12 enters the machine heating system 10 for heating, raising the liquid temperature to a set temperature, for example, 70–80°C or higher. The heated liquid is contained in the chamber 13. A needle valve 14 is used to adjust the liquid flow rate. The heated liquid is then uniformly sprayed onto the wafer surface through a spraying device 15, such as a nozzle, in a specific pattern, such as laminar flow or spiral spray. The liquid etches the wafer through a chemical reaction with it.

[0049] It should be understood that the above process flow is only a brief process to illustrate the application scenario of the technical solution of this application. In actual application, other processes may also be included. For example, in order to clean the etched wafer, the wafer may be rinsed with a diluted solution after etching to remove by-products and residues and avoid contaminating the wafer surface. Combined with high-temperature nitrogen purging or rotary drying technology, the liquid is quickly evaporated and the wafer is cooled to prepare a clean surface for the next process such as deposition or photolithography.

[0050] The aforementioned machine heating system 10 includes Figure 2The diagram shows a controller 17, a solid-state relay 16, and a heater 11. The controller 17 acquires relevant data from the heater 11, determines the feedforward gain and disturbance amount corresponding to the heater 11 based on this data, and uses the feedforward gain to determine the feedforward compensation power of the heater 11 in the event of a sudden increase in disturbance amount. Based on the relevant data, the controller 17 determines the dissipation model of the heater 11, and then determines the dissipation compensation power of the heater 11 based on the dissipation model. Under liquid spraying conditions, if the set process compensation conditions are met, the controller determines the process compensation power of the heater 11. Based on the feedforward compensation power, dissipation compensation power, and process compensation power, the target heating power of the heater 11 is determined. This allows for real-time adjustment of the heater 11's power according to the target heating power. Through the dynamic superposition of feedforward compensation power, dissipation compensation power, and process compensation power, a multi-dimensional compensation mechanism is used to achieve precise temperature control, effectively improving the stability and yield of semiconductor manufacturing processes. This approach offers advantages such as improved temperature control response speed, multi-dimensional power compensation synergy, and enhanced semiconductor manufacturing process stability, while also achieving high wafer etching rates and low costs.

[0051] The solid-state relay 16 is used to drive the heater 11 to heat in response to the control signal of the controller 17. The heater 11 heats the liquid to a set temperature for subsequent wafer etching.

[0052] In some embodiments, the controller 17 is a programmable logic controller (PLC). In other embodiments, the controller 17 may also be a programmable automation controller (PAC) or a distributed control system (DCS).

[0053] In some embodiments, the heater 11 is a unit heater 11. In practical applications, the specific type of heater 11 can also be selected according to process requirements. For example, the heater 11 includes, but is not limited to, electromagnetic induction heater 11, infrared heater 11, and ceramic heater 11.

[0054] The temperature control method of the machine tool heating system 10 provided in this application will be described in detail below.

[0055] Figure 3 According to some embodiments of this application, a temperature control method for a machine tool heating system 10 is provided, for use in the controller 17 of the machine tool heating system 10, such as... Figure 3 As shown, the temperature control method of the machine tool heating system 10 provided in this application includes the following steps:

[0056] S11: Obtain relevant data for heater 11.

[0057] The relevant data of heater 11 include the heating power of heater 11, the body temperature of heater 11, the outlet temperature of heater 11, the inlet liquid temperature of heater 11, and the inlet flow rate of heater 11.

[0058] The heating power of heater 11 is fixedly output by controller 17. For example, in some embodiments, controller 17 is a PLC, which outputs pulse width modulation (PWM) with a 20% duty cycle. Controller 17 can record the power output in real time. The body temperature, outlet temperature, and inlet liquid temperature of heater 11 can be obtained by temperature sensors. The inlet flow rate of heater 11 refers to the volume of liquid passing through the inlet of heater 11 per unit time, which can be monitored in real time using electromagnetic flow meters or ultrasonic flow meters.

[0059] S12: Based on the relevant data of heater 11, determine the feedforward gain and disturbance amount corresponding to heater 11. The feedforward gain is used to determine the feedforward compensation power of heater 11 in combination with the disturbance amount when a sudden increase in the disturbance amount is detected. Among them, the feedforward gain characterizes the proportional relationship between the disturbance change and the power compensation amount, which can be obtained by linear fitting by analyzing the power adjustment amount corresponding to different flow increments.

[0060] In some embodiments, the feedforward gain K can be calculated in the following manner. ff For example, first fix the heating power P0, wait for the machine heating system 10 to stabilize, and record the steady-state flow rate F0 and steady-state temperature T0 of the heater 11; then adjust the step flow rate based on the steady-state flow rate F0. After the heating system 10 of the machine stabilizes, record the steady-state flow rate F1 and steady-state temperature T1; then gradually increase the heating power to P1 so that the outlet temperature of heater 11 returns to T0, and calculate the power change. In summary, the above feedforward gain can be obtained. .

[0061] In some embodiments, the aforementioned disturbance includes the inlet flow rate of heater 11. When a sudden increase in the disturbance of the machine heating system 10 is detected, the feedforward compensation power of heater 11 is determined by combining the disturbance in the following manner: determining the flow increment corresponding to the inlet flow rate of heater 11, and determining the feedforward compensation power based on the product of the feedforward gain and the flow increment, thereby generating compensation power in advance when the inlet flow rate of heater 11 suddenly increases, reducing temperature fluctuations caused by the sudden increase in the inlet flow rate of heater 11.

[0062] This application establishes a direct feedforward relationship between flow disturbance and power compensation, generating compensation power at the initial stage of flow change, thereby improving the response speed of the heating system and effectively eliminating temperature overshoot caused by thermal inertia.

[0063] S13: Determine the dissipation model of heater 11 based on the relevant data of heater 11, and determine the dissipation compensation power of heater 11 based on the dissipation model.

[0064] In some embodiments, the dissipation model of heater 11 is determined based on relevant data of heater 11 by: analyzing relevant data of heater 11 to obtain temperature dissipation characteristics of heater 11; establishing a dissipation polynomial for inlet flow rate and outlet temperature of heater 11 based on temperature dissipation characteristics of heater 11; solving for the coefficients of variables and the values ​​of constants in the dissipation polynomial to obtain the solved dissipation polynomial, and determining the solved dissipation polynomial as the dissipation model.

[0065] Temperature dissipation characteristics refer to the physical laws governing heat loss from heater 11, used to characterize the heat exchange characteristics between heater 11 and the environment. The dissipation polynomial is a mathematical expression with the inlet flow rate and outlet temperature of heater 11 as variables. By substituting multiple sets of measured flow-temperature data into this mathematical expression, the coefficients of each variable are solved, ultimately forming a mathematical model that accurately reflects the heat dissipation law of heater 11.

[0066] This application retains the nonlinear relationship between the inlet flow rate and outlet temperature of heater 11, and ensures the accuracy of the dissipation model through experimental data calibration, effectively solving the problem of large prediction deviations in some empirically constructed models under complex working conditions.

[0067] In some embodiments, the dissipation compensation power of heater 11 is determined based on a dissipation model by: determining the inlet flow rate and target outlet temperature of heater 11; substituting the inlet flow rate and target outlet temperature of heater 11 into the dissipation model for calculation to obtain the dissipation value of heater 11; and obtaining the dissipation compensation power of heater 11 based on the dissipation value of heater 11. By calculating the dissipation compensation power corresponding to steady-state heat loss using the above dissipation model based on the inlet flow rate and outlet temperature of heater 11, the steady-state temperature control accuracy is improved and the steady-state error is reduced.

[0068] S14: Under the liquid spraying condition of the machine, if the set process compensation conditions are met, the process compensation power of heater 11 is determined.

[0069] The process compensation conditions include: the temperature difference between the actual outlet temperature of heater 11 and the target outlet temperature of heater 11 is greater than a set threshold. The temperature difference refers to the instantaneous deviation between the actual outlet temperature of heater 11 and the target outlet temperature of heater 11. The process compensation power refers to the additional power used to correct the temperature deviation. Thus, when the actual outlet temperature of heater 11 is too high relative to the target outlet temperature of heater 11, the heating power of heater 11 can be reduced, and vice versa.

[0070] In some embodiments, under the liquid spraying condition of the machine, if the set process compensation conditions are met, the process compensation power of the heater 11 is determined, including: determining the process compensation power based on the temperature difference between the actual outlet temperature of the heater 11 and the target outlet temperature of the heater 11. In some embodiments, the aforementioned temperature difference is converted into a power adjustment amount, i.e., the process compensation power, through a proportional-integral algorithm. After the process compensation power is superimposed on the base heating power, the temperature fluctuation caused by liquid spraying can be quickly offset.

[0071] The process compensation power obtained under liquid spraying conditions can effectively solve the problem of temperature control inaccuracy caused by excessive temperature deviation during liquid spraying. By setting process compensation conditions to trigger the compensation mechanism, it can intervene in time at the initial stage of abnormal temperature fluctuations and quickly generate the corresponding compensation power. This can improve the response speed and adjustment accuracy of temperature control during the liquid spraying stage, reduce the uneven wafer etching caused by temperature overshoot, thereby reducing semiconductor material loss and lowering costs.

[0072] S15: Based on the feedforward compensation power, dissipation compensation power and process compensation power, determine the target heating power of heater 11.

[0073] In some embodiments, the target heating power of heater 11 is determined based on feedforward compensation power, dissipation compensation power, and process compensation power, including summing the feedforward compensation power, dissipation compensation power, and process compensation power to obtain the target heating power of heater 11. This achieves multi-dimensional compensation for the power demand of heater 11. During sudden changes in inlet flow, power output is rapidly adjusted through feedforward compensation; during steady-state operation, precise temperature control is maintained through dissipation compensation; and during the liquid spraying stage, transient deviations are eliminated through process compensation. This composite control strategy effectively reduces the temperature fluctuation amplitude of heater 11, which is beneficial for improving temperature stability during wafer etching, improving etching rate uniformity, thereby increasing the manufacturing yield of semiconductor devices and reducing manufacturing costs.

[0074] It is understood that the execution order of steps S11 to S15 above is only an illustration. In other embodiments, other execution orders may be used, and some steps may be split or combined. This is not limited here.

[0075] In some embodiments, the proportional-integral-derivative (PID) control algorithm built into the controller 17 can be adjusted based on relevant data from the heater 11. For example, in some embodiments, the frequency of change of the outlet temperature of the heater 11 is determined, and the discrete step size in the PID algorithm built into the controller 17 is adjusted to match the frequency of change of the outlet temperature of the heater 11. This allows the controller 17 to capture temperature fluctuations more promptly and reduce steady-state errors. Furthermore, integral separation is introduced. Specifically, for example, the participation of the integral term in the PID algorithm is adjusted based on the temperature difference between the actual outlet temperature and the target outlet temperature of the heater 11. When this temperature difference is greater than a set temperature difference threshold, the integral action is turned off; otherwise, the integral action is turned on, avoiding integral saturation and significantly reducing overshoot, thereby improving temperature stability. In addition, the derivative term can be improved, for example, by performing weighted differentiation on the collected historical data of the heater 11. This reduces data noise and allows for earlier adjustment of the control quantity to reduce overshoot. Reducing abrupt jumps in the derivative term reduces drastic changes in the power of the heater 11 and extends the lifespan of the heater 11. This improved PID control can greatly enhance control stability and anti-interference ability while maintaining the simplicity and practicality of PID control.

[0076] This application also provides a temperature control device 400 for a machine tool heating system, such as... Figure 4 As shown, the temperature control device 400 of the machine tool heating system provided in this application includes:

[0077] Data acquisition module 401 is used to acquire relevant data of heater 11;

[0078] The first determining module 402 is used to determine the feedforward gain and disturbance amount corresponding to the heater 11 based on the relevant data of the heater 11. The feedforward gain is used to determine the feedforward compensation power of the heater 11 in combination with the disturbance amount when a sudden increase in the disturbance amount is detected.

[0079] The second determining module 403 is used to determine the dissipation model of the heater 11 based on relevant data of the heater 11, and to determine the dissipation compensation power of the heater 11 based on the dissipation model.

[0080] The third determining module 404 is used to determine the process compensation power of the heater 11 if the set process compensation conditions are met under the liquid spraying condition of the machine.

[0081] The fourth determining module 405 is used to determine the target heating power of the heater 11 based on the feedforward compensation power, dissipation compensation power and process compensation power.

[0082] Regarding the apparatus in the above embodiments, the specific manner in which the processor performs the operation has been described in detail in the embodiments related to the method, and will not be elaborated upon here.

[0083] Embodiments of the present invention also provide an electronic device 500, such as... Figure 5 As shown, the electronic device 500 includes a memory 501 and a processor 502. The memory 501 is used to store computer programs executable by the processor 502; the processor 502 is used to execute the computer programs in the memory 501 to implement the temperature control method of the machine heating system provided in any of the above embodiments.

[0084] Figure 5 The electronic device 500 shown also includes a communication interface 503. The processor 502, memory 501, and communication interface 503 are connected via a communication bus and communicate with each other.

[0085] Processor 502 may be a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits used to control the execution of programs in the above scheme.

[0086] Communication interface 503 is used to communicate with other devices or communication networks, such as Ethernet, Radio Access Network (RAN), Wireless Local Area Networks (WLAN), etc.

[0087] Memory 501 may be a read-only memory (ROM) or other type of static storage device capable of storing static information and instructions, random access memory (RAM) or other type of dynamic storage device capable of storing information and instructions, or electrically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital versatile optical discs, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but not limited thereto. Memory may exist independently and be connected to the processor via a bus. Memory may also be integrated with the processor.

[0088] Embodiments of the present invention also provide a computer-readable storage medium storing instructions that, when executed on an electronic device, cause the electronic device to perform the temperature control method of the machine tool heating system provided in any of the above embodiments.

[0089] Embodiments of the present invention also provide a computer program product, the computer program product including instructions, which, when executed by one or more processors, are used to implement the temperature control method of the machine tool heating system provided in any of the above embodiments.

[0090] Various embodiments of the mechanisms disclosed in this invention can be implemented in hardware, software, firmware, or combinations of these implementations. Embodiments of this invention can be implemented as computer programs or program code executable on a programmable system, the programmable system including at least one processor, a storage system (including volatile and non-volatile memories and / or storage elements), at least one input device, and at least one output device.

[0091] It should be noted that the units / modules mentioned in the various device embodiments of the present invention are all logical units / modules. Physically, a logical unit / module can be a physical unit / module, a part of a physical unit / module, or a combination of multiple physical units / modules. The physical implementation of these logical units / modules themselves is not the most important factor; the combination of functions implemented by these logical units / modules is the key to solving the technical problem proposed by the present invention. Furthermore, to highlight the innovative aspects of the present invention, the above-described device embodiments of the present invention have not introduced units / modules that are not closely related to solving the technical problem proposed by the present invention. This does not mean that the above-described device embodiments do not contain other units / modules.

[0092] It should be noted that in the examples and description of this patent, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one" does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0093] Although the invention has been illustrated and described with reference to certain preferred embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.

Claims

1. A temperature control method for a machine tool heating system, characterized in that, A controller for a machine tool heating system, the machine tool heating system further including a heater, the method comprising: Obtain relevant data about the heater; Based on the relevant data of the heater, the feedforward gain and disturbance amount corresponding to the heater are determined. The feedforward gain is used to determine the feedforward compensation power of the heater in combination with the disturbance amount when a sudden increase in the disturbance amount is detected. Based on the relevant data of the heater, the dissipation model of the heater is determined, and the dissipation compensation power of the heater is determined based on the dissipation model; The dissipation model of the heater was determined based on relevant data of the heater in the following manner: The temperature dissipation characteristics of the heater are obtained by analyzing the relevant data of the heater. Based on the temperature dissipation characteristics of the heater, a dissipation polynomial is established regarding the inlet flow rate and outlet temperature of the heater; Solve for the coefficients of the variables and the values ​​of the constants in the dissipation polynomial to obtain the solved dissipation polynomial, and determine the solved dissipation polynomial as the dissipation model. Under the liquid spraying condition of the machine, if the set process compensation conditions are met, the process compensation power of the heater is determined. The target heating power of the heater is determined based on the feedforward compensation power, the dissipation compensation power, and the process compensation power.

2. The temperature control method for the machine tool heating system according to claim 1, characterized in that, The disturbance includes the heater inlet flow rate. In the event of a sudden increase in the disturbance of the machine heating system, the feedforward compensation power of the heater is determined by combining the disturbance in the following manner: Determine the flow increment corresponding to the inlet flow rate of the heater; The feedforward compensation power is determined based on the product of the feedforward gain and the flow increment.

3. The temperature control method for the machine tool heating system according to claim 1, characterized in that, The dissipation compensation power of the heater is determined based on the dissipation model in the following manner: The heater inlet flow rate and the target outlet temperature of the heater are determined; The dissipation value of the heater is obtained by substituting the heater inlet flow rate and the heater target outlet temperature into the dissipation model. The dissipation compensation power of the heater is obtained based on the dissipation value of the heater.

4. The temperature control method for the machine tool heating system according to claim 1, characterized in that, The set process compensation conditions include: the temperature difference between the actual outlet temperature of the heater and the target outlet temperature of the heater is greater than a set threshold. Under the liquid spraying condition of the machine, if the set process compensation conditions are met, the process compensation power of the heater is determined, including: The process compensation power is determined based on the temperature difference between the actual outlet temperature of the heater and the target outlet temperature of the heater.

5. The temperature control method for the machine tool heating system according to claim 1, characterized in that, Determining the target heating power of the heater based on the feedforward compensation power, the dissipation compensation power, and the process compensation power includes: The target heating power of the heater is obtained by summing the feedforward compensation power, the dissipation compensation power, and the process compensation power.

6. The temperature control method for the machine tool heating system according to any one of claims 1 to 5, characterized in that, The relevant data for the heater include the heater's heating power, heater body temperature, heater outlet temperature, heater inlet liquid temperature, and heater inlet flow rate.

7. A temperature control device for a machine tool heating system, characterized in that, include: The data acquisition module is used to acquire relevant data about the heater. The first determining module is used to determine the feedforward gain and disturbance amount corresponding to the heater based on the relevant data of the heater. The feedforward gain is used to determine the feedforward compensation power of the heater in combination with the disturbance amount when a sudden increase in the disturbance amount is detected. The second determining module is used to determine the dissipation model of the heater based on relevant data of the heater, and then determine the dissipation compensation power of the heater based on the dissipation model. The dissipation model of the heater was determined based on relevant data of the heater in the following manner: The temperature dissipation characteristics of the heater are obtained by analyzing the relevant data of the heater. Based on the temperature dissipation characteristics of the heater, a dissipation polynomial is established regarding the inlet flow rate and outlet temperature of the heater; Solve for the coefficients of the variables and the values ​​of the constants in the dissipation polynomial to obtain the solved dissipation polynomial, and determine the solved dissipation polynomial as the dissipation model. The third determining module is used to determine the process compensation power of the heater if the set process compensation conditions are met under the liquid spraying condition of the machine. The fourth determining module is used to determine the target heating power of the heater based on the feedforward compensation power, the dissipation compensation power, and the process compensation power.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores instructions that, when executed on an electronic device, cause the electronic device to perform the temperature control method of the machine heating system according to any one of claims 1 to 6.

9. An electronic device, characterized in that, include: Memory, used to store instructions, and One or more processors, when the instructions are executed by the one or more processors, the processors perform the temperature control method of the machine heating system as described in any one of claims 1 to 6.

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