Circuit board and electronic device

Abstract

The invention discloses a circuit board and an electronic device. The electronic device comprises the circuit board, and the circuit board comprises a substrate; the bonding pad is arranged on the surface of the substrate, the bonding pad is used for welding a sensor pin, a net-shaped structure is formed on the surface of the bonding pad, the net-shaped structure is composed of a plurality of grid strips which are connected in a staggered mode, and the grid strips intersect at a preset angle to form a grid array; the metal cap is arranged on the bonding pad; the metal cap is fixedly connected with the bonding pad through an adhesive, and the adhesive is filled in gaps among the plurality of grid strips. According to the technical scheme, the firmness of connection is improved, and the heat conduction performance is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of sensor equipment, and in particular to a circuit board and an electronic device. Background Art

[0002] Soldering sensor pins on traditional circuit boards often results in unstable connections or poor heat dissipation due to small soldering areas and loose contact. Existing technologies lack effective structural improvements to enhance the mechanical strength and thermal conductivity of solder joints. Summary of the Invention

[0003] The main purpose of the present invention is to provide a circuit board, aiming to improve the firmness of connection and the heat conduction performance.

[0004] To achieve the above-mentioned object, the present invention provides a circuit board, comprising:

[0005] substrate;

[0006] A soldering pad is provided on the surface of the substrate, the soldering pad is used for soldering the sensor pin, and a mesh structure is formed on the surface of the soldering pad. The mesh structure is composed of a plurality of mesh bars connected to each other in an interlaced manner, and the plurality of mesh bars intersect at a predetermined angle to form a grid array;

[0007] a metal cap, the metal cap being disposed on the pad;

[0008] The metal cap is fixedly connected to the pad via adhesive, and the adhesive is filled in the gaps between the plurality of grid bars.

[0009] In one embodiment, the bottom surface of the metal cap is a smooth plane, and the metal cap is fixed to the pad by the adhesive. The adhesive fills the gaps between the plurality of grid bars and is in close contact with the smooth bottom surface of the metal cap.

[0010] In one embodiment, the cross section of the mesh bars is at least one of rectangular and trapezoidal.

[0011] In one embodiment, the grid layout of the mesh structure is any one of an orthogonal grid, a diamond grid or a honeycomb grid.

[0012] In one embodiment, a chamfered structure is provided on the top of the mesh structure.

[0013] In one embodiment, a connecting portion is extended outward from the edge of the metal cap, and the connecting portion cooperates with a limiting member provided on the edge of the pad to limit and fix the metal cap on the pad.

[0014] In one embodiment, the connecting portion is configured as a flange.

[0015] In one embodiment, the mesh structure is formed on the surface of the pad by etching, laser drilling, electrochemical treatment or mechanical processing.

[0016] In one embodiment, the adhesive is one of epoxy resin glue, UV curing glue or conductive glue.

[0017] The present invention also provides an electronic device, including the above-mentioned circuit board, the circuit board including a substrate; a soldering pad, provided on the surface of the substrate, the soldering pad being used to solder sensor pins, a mesh structure formed on the surface of the soldering pad, the mesh structure being composed of a plurality of grid bars interconnected with each other, the plurality of grid bars intersecting at a predetermined angle to form a grid array; a metal cap, the metal cap being provided on the soldering pad; the metal cap being fixedly connected to the soldering pad by an adhesive, the adhesive filling the gaps between the plurality of grid bars.

[0018] The technical solution of the present invention achieves a secure connection by introducing a "mesh structure" on the surface of the pad, placing a metal cap on it, and filling the gaps with adhesive. The circuit board mainly includes the following components: a substrate, which serves as the basic support layer of the entire circuit board and is usually made of an insulating material (such as FR-4, ceramic, polyimide, etc.), used to carry electronic components and lay out the circuits; a pad located on the surface of the substrate, which is a key component for achieving electrical connection and mechanical fixation. The pad is specifically used for soldering sensor pins and performs electrical and thermal conductivity and fixation functions; a mesh structure is provided on the surface of the pad. This structure is composed of multiple mesh bars, which are staggered and connected at a certain angle to form a grid-like array structure. This design not only increases the contact area between the pad and the metal cap, but also provides physical space for subsequent adhesive filling; a metal cap covers the pad and is usually made of a metal material with good thermal or electrical conductivity (such as copper, aluminum, etc.) to protect the solder joint, assist in heat dissipation, or provide shielding; an adhesive is used to securely connect the metal cap to the pad. Unlike traditional methods that rely solely on flat bonding, this approach employs a mesh structure on the pad surface, allowing the adhesive to flow and solidify in the gaps between the mesh bars, creating a similar "anchoring" effect and significantly enhancing the bond between the metal cap and the pad. Compared to traditional flat structures, this concave-convex design effectively prevents the metal cap from falling off or shifting. This solution specifically emphasizes that the adhesive fully fills the gaps between the mesh bars, forming an "embedded" bonding structure, significantly enhancing the connection's robustness and thermal conductivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0020] Figure 1 A schematic structural diagram of an embodiment of a circuit board provided by the present invention;

[0021] Figure 2 for Figure 1 Schematic diagram of the decomposition.

[0022] Description of Figure Numbers:

[0023] 10. Solder pad; 11. Mesh structure; 12. Mesh bar; 20. Metal cap; 21. Connecting part.

[0024] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0026] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0027] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0028] The present invention provides a circuit board and an electronic device.

[0029] Reference Figures 1 to 2 In an embodiment of the present invention, a circuit board includes:

[0030] substrate;

[0031] A soldering pad 10 is provided on the surface of the substrate. The soldering pad 10 is used to solder sensor pins. A mesh structure 11 is formed on the surface of the soldering pad 10. The mesh structure 11 is composed of a plurality of mesh bars 12 that are interconnected. The plurality of mesh bars 12 intersect at a predetermined angle to form a grid array.

[0032] A metal cap 20 is provided on the pad 10;

[0033] The metal cap 20 is fixedly connected to the pad 10 by adhesive, and the adhesive is filled in the gaps between the plurality of mesh bars 12 .

[0034] The technical solution of the present invention provides a circuit board, comprising: a substrate, serving as the basic support structure for the entire circuit board, typically constructed from insulating materials (such as FR-4, ceramic, polyimide, etc.), used to carry electronic components and lay out circuitry. A soldering pad 10, located on the surface of the substrate, is a key component for achieving electrical connection and mechanical fixation. This soldering pad is specifically used for soldering sensor pins, fulfilling the functions of electrical and thermal conductivity, as well as fixation. A mesh structure 11, one of the core innovations of this solution, is provided on the surface of the soldering pad 10. It is composed of multiple mesh bars 12 interlaced and arranged at a certain angle to form a grid-like array structure. This structure not only increases the contact area between the soldering pad and the metal cap, but also provides physical space for subsequent adhesive filling. A metal cap 20 is disposed above the soldering pad 10, covering the mesh structure 11. The primary functions of the metal cap are to protect the solder joint, enhance heat dissipation, provide shielding, or assist in positioning. Depending on actual needs, the metal cap can be made of copper, aluminum, or other metal materials with good thermal conductivity and mechanical strength. Adhesive is used to securely connect the metal cap 20 to the soldering pad 10. Unlike the traditional bonding method that relies solely on external coating, this solution specifically emphasizes that the adhesive will fill the gaps between the mesh bars 12, thereby forming an "embedded" bonding structure. By providing a mesh structure on the surface of the pad 10, the adhesive can flow and solidify in the gaps between the mesh bars 12, forming an effect similar to "anchoring", which greatly enhances the bonding force between the metal cap 20 and the pad 10. Compared with the traditional planar structure, this concave-convex design can effectively prevent the metal cap 20 from falling off or displacing. Since the adhesive fills the gaps between the mesh bars 12, and the metal cap 20 itself has good thermal conductivity, the overall structure has excellent thermal conductivity. It helps to promptly remove heat from the solder joint and avoid failure due to local overheating. Furthermore, the mesh structure 11 can buffer and disperse stress when subjected to external force, reducing the internal stress concentration problem caused by the mismatch of thermal expansion coefficients in the solder joint area, thereby improving the long-term reliability of the soldering structure. Therefore, this method can significantly improve the firmness of the connection and help transfer heat through the adhesive layer, which can improve the mechanical connection strength, thermal conductivity and overall structural stability of the sensor pin welding part.

[0035] Reference Figures 1 to 2 In an embodiment of the present invention, the bottom surface of the metal cap 20 is a smooth plane, and the metal cap 20 is fixed to the pad 10 by the adhesive. The adhesive fills the gaps between the plurality of grid bars and is in close contact with the smooth bottom surface of the metal cap 20.

[0036] Furthermore, the bottom surface of the metal cap 20 is smooth, but the gaps between the mesh structures 11 on the surface of the pad are filled with adhesive, forming a multi-point support and embedded bonding effect. This design not only increases the bonding area, but also improves the shear resistance and peeling resistance, making the connection between the metal cap 20 and the pad 10 more firm and reliable. The adhesive fills the gaps between the mesh structures 11 and is in close contact with the bottom surface of the metal cap 20, forming a continuous heat conduction path. Since the metal cap 20 generally has good thermal conductivity, heat can be quickly transferred from the solder point area to the metal cap through the adhesive, and then dissipated through convection or radiation, thereby effectively improving the heat dissipation efficiency. Since the contact between the metal cap 20 and the pad 10 is closer, and the filling path of the adhesive is more reasonable, heat can be more efficiently transferred from the solder point area to the metal cap 20, and then dissipated through convection or radiation. Therefore, this structure is also conducive to improving heat dissipation efficiency.

[0037] Reference Figures 1 to 2 In an embodiment of the present invention, the cross section of the grid bar 12 is at least one of a rectangle or a trapezoid.

[0038] Different shapes of mesh bars 12 create different gaps between them. The gaps between rectangular structures are more regular, facilitating the uniform flow of adhesive; the gaps formed by trapezoidal structures are wedge-shaped, guiding the adhesive inward during assembly and enhancing the filling effect. This technical solution is a specific improvement to the shape of the "mesh bars" based on the original circuit board structure. By introducing rectangular or trapezoidal cross-sectional forms, the mesh structure 11 on the pad has greater functionality and adaptability in terms of manufacturing, assembly, bonding, and thermal conductivity.

[0039] Reference Figures 1 to 2 In the embodiment of the present invention, the grid layout of the mesh structure 11 is any one of an orthogonal grid, a diamond grid or a honeycomb grid.

[0040] Different types of grid layouts correspond to different physical performance characteristics. Orthogonal grids (such as the horizontal and vertical intersecting "well" shape) have good symmetry and regularity, which is convenient for processing and manufacturing. The rectangular gaps formed by the orthogonal grid are conducive to the uniform distribution of adhesives. Diamond grids (such as the parallelogram structure with oblique intersections) can disperse stress more evenly when subjected to force and improve deformation resistance. The oblique gaps formed by the diamond grid help guide the flow of adhesives during assembly. Honeycomb grids (hexagonal units are closely arranged) have extremely high structural stability and space utilization, and are widely used in high-strength lightweight structures. The dense structure of the honeycomb grid can provide a larger surface area, thereby improving the bonding strength between the adhesive and the structure. By introducing orthogonal, diamond or honeycomb grid layouts, the mesh structure on the surface of the pad has stronger functionality and adaptability in manufacturing, assembly, bonding, thermal conductivity and other aspects.

[0041] Reference Figures 1 to 2 In the embodiment of the present invention, a chamfered structure is provided on the top of the mesh structure 11.

[0042] The chamfered structure can play a guiding role, helping the metal cap 20 and the pad 10 to be aligned and fitted more easily when they are assembled, thereby reducing installation problems caused by position deviation.

[0043] Reference Figures 1 to 2 In an embodiment of the present invention, a connecting portion 21 is extended outward from the edge of the metal cap 20 , and the connecting portion 21 cooperates with a limiting member provided on the edge of the pad 10 to limit and fix the metal cap 20 on the pad 20 .

[0044] By providing the connection portion 21 and cooperating with the stopper at the edge of the pad 10, the metal cap 20 can be precisely aligned with the pad 10 during installation, preventing misalignment or offset. The cooperation of the stopper and the connection portion 21 also provides additional restraint for the metal cap, preventing it from loosening or falling off due to external vibration or impact, thereby improving the mechanical stability and long-term reliability of the overall structure. The tight fit between the stopper and the connection portion 21 also provides a certain sealing effect, preventing external factors such as dust and moisture from invading the solder joint area, protecting the internal electronic components from environmental influences.

[0045] Reference Figures 1 to 2 In the embodiment of the present invention, the connecting portion 21 is configured as a flange.

[0046] The flange structure has good guiding and self-alignment properties. During the installation process of the metal cap 20, it can guide it to fit accurately into the pad 10 area, reduce the risk of misalignment, and improve the consistency and efficiency of assembly. The flange structure extends outward to form a "frame" or "flange", which can form a tighter physical fit with the limiter located at the edge of the pad 10, providing additional restraint force to prevent the metal cap 20 from offsetting, sliding or falling off due to external force.

[0047] Reference Figures 1 to 2 In the embodiment of the present invention, the mesh structure 11 is formed on the surface of the pad 10 by etching, laser drilling, electrochemical treatment or mechanical processing.

[0048] This technical solution specifically defines the method for forming the mesh structure 11 on the surface of the pad 10, clarifying that it can be achieved through etching, laser drilling, electrochemical treatment, or mechanical processing. This not only provides multiple feasible technical paths for actual production, but also allows the selection of the most suitable processing method based on different needs, thereby improving manufacturing flexibility and product performance.

[0049] Reference Figures 1 to 2In an embodiment of the present invention, the adhesive is one of epoxy resin glue, UV curing glue or conductive glue.

[0050] This technical solution further improves the functional adaptability and process feasibility of the circuit board structure by clearly defining the adhesive type. It not only improves the connection strength and thermal conductivity between the metal cap and the pad, but also provides flexible material selection for different application scenarios.

[0051] The present invention further provides an electronic device including the aforementioned circuit board. The specific structure of the circuit board is similar to that of the aforementioned embodiments. Because the circuit board utilizes all of the technical solutions of all of the aforementioned embodiments, it possesses at least all of the beneficial effects of the technical solutions of the aforementioned embodiments, and therefore will not be further elaborated upon herein.

[0052] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformation made by utilizing the contents of the present invention's description and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A circuit board, characterized in that: include: substrate; A soldering pad is provided on the surface of the substrate, the soldering pad is used for soldering the sensor pin, and a mesh structure is formed on the surface of the soldering pad. The mesh structure is composed of a plurality of mesh bars connected to each other in an interlaced manner, and the plurality of mesh bars intersect at a predetermined angle to form a grid array; a metal cap, the metal cap being disposed on the pad; The metal cap is fixedly connected to the pad via adhesive, and the adhesive is filled in the gaps between the plurality of grid bars.

2. The circuit board according to claim 1, wherein: The bottom surface of the metal cap is a smooth plane. The metal cap is fixed to the pad by the adhesive. The adhesive fills the gaps between the plurality of grid bars and is in close contact with the smooth bottom surface of the metal cap.

3. The circuit board according to claim 1, wherein: The cross section of the grid bars is at least one of rectangular and trapezoidal.

4. The circuit board according to claim 1, wherein: The grid layout of the mesh structure is any one of an orthogonal grid, a diamond grid or a honeycomb grid.

5. The circuit board according to claim 1, wherein: The top of the mesh structure is provided with a chamfered structure.

6. The circuit board according to claim 1, wherein: A connecting portion is provided on the edge of the metal cap extending outwards, and the connecting portion cooperates with a limiting member provided on the edge of the pad to limit and fix the metal cap on the pad.

7. The circuit board according to claim 1, wherein: The connecting portion is arranged in the form of a flange.

8. The circuit board according to claim 1, wherein: The mesh structure is formed on the surface of the pad by etching, laser drilling, electrochemical treatment or mechanical processing.

9. The circuit board according to claim 1, wherein: The adhesive is one of epoxy resin glue, UV curing glue or conductive glue.

10. An electronic device, characterized in that: A circuit board comprising the circuit board according to any one of claims 1 to 9.

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