Electronic speed regulator capacitor installation structure and electronic speed regulator capacitor installation method
By using the capacitor pins of the transition circuit board vertically inserted into the electronic speed controller and combining the structure of multi-layer copper foil conductive layer and gold finger pad, the problem of easy breakage of the capacitor pins and excessive current density is solved, and the improvement of mechanical reliability and electrical performance and fully automated production are achieved.
Patent Information
- Application Number
- CN202510651504.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-20
- Publication Date
- 2025-08-22
AI Technical Summary
In existing electronic speed governors, capacitor pins are prone to breakage, excessive current density leads to overheating and fuse and production inconvenient problems.
The capacitor pins of the transition circuit board are inserted vertically and composite solder joints are formed by welding, combining multi-layer copper foil conductive layer and gold-finger pads to achieve fully automated production.
It improves mechanical reliability and electrical performance, reduces the probability of vibration and fracture, and improves welding efficiency and production automation.
Smart Images
Figure CN120529488A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electronic speed regulators, and in particular to an electronic speed regulator capacitor mounting structure and an electronic speed regulator capacitor mounting method. Background Art
[0002] In electronic speed controllers, the current standard practice is to bend the electrolytic capacitor pins 90° before inserting them into PCB vias for soldering. This bending process can easily produce microscopic metal cracks in the capacitor pins, which can lead to fatigue due to mechanical vibration or thermal stress. This can lead to the risk of pin breakage during transportation and use, and compromise mechanical reliability. A standard 0.5mm diameter pin has a cross-sectional area of only 0.196mm². When the electronic speed controller's operating current exceeds 1.5A, the current density reaches 7.65A / mm² (exceeding the safety threshold of 5A / mm² specified in IEC 60384-4). Sustained overcurrent can cause the pins to overheat and melt, creating an electrical performance bottleneck. The bent, irregular pin structure is incompatible with wave soldering tools, requiring manual soldering and hindering production. Summary of the Invention
[0003] The purpose of the present invention is to solve the above technical problems and provide an electronic speed regulator capacitor installation structure and an electronic speed regulator capacitor installation method with strong mechanical reliability, stable electrical performance and easy production.
[0004] To achieve the above objectives, the present invention provides the following technical solutions: As a first aspect, the present invention provides an electronic speed regulator capacitor mounting structure, comprising: a main circuit board, a transition circuit board and a capacitor; the main circuit board is provided with a first through hole, and a reinforcement pad is formed at the first through hole; the transition circuit board is provided with a second through hole, and a gold finger-type pad is provided at the lower end of the transition circuit board, the gold finger-type pad is electrically connected to the second through hole, and the gold finger-type pad of the transition circuit board passes through the first through hole and forms a composite solder joint by welding; multiple capacitors are arranged along the length direction of the transition circuit board, and the pins of the capacitors are vertically inserted into the second through hole and form a composite solder joint by welding.
[0005] In one embodiment, the transition circuit board includes a PCB substrate, on which multiple copper foil conductive layers are provided to form an integrated current distribution network.
[0006] In one embodiment, the integrated current distribution network includes a parallel current path with multiple layers of current paths, multiple vias, a heat diffusion copper foil area with multiple thermal conductive vias, and a mechanical reinforcement frame arranged around the edge of the PCB substrate.
[0007] In one embodiment, the multi-layer copper foil conductive layer defines a positive electrode setting area and a negative electrode setting area, the positive electrode pin of the capacitor is welded to the positive electrode setting area, and the negative electrode pin of the capacitor is welded to the negative electrode setting area, wherein the pin arrangement direction of at least one capacitor is perpendicular to the arrangement direction between multiple capacitors.
[0008] In one embodiment, a positioning hole is provided on the transition circuit board for inserting and positioning a positioning pin on a carrier that clamps the capacitor.
[0009] As a second aspect, the present invention also provides an electronic speed regulator capacitor installation method, which is used to assemble the above-mentioned electronic speed regulator capacitor installation structure, including the following steps: positioning and installing the transition circuit board on a carrier made of high-temperature resistant synthetic stone; clamping the capacitor with a vacuum nozzle clamp and vertically inserting the pins into the second through hole of the transition circuit board, and welding through a wave soldering machine to form a composite solder joint; plugging the workpiece in which the transition circuit board and the capacitor are welded to the main circuit board, and forming a composite solder joint at the gold finger pad of the transition circuit board and the reinforcement pad of the main circuit board through wave soldering.
[0010] Furthermore, it also includes a pin trimming step, which includes: after the capacitor is welded to the transition circuit board, using a laser ranging module to provide real-time feedback on the length of the capacitor pin passing through the transition circuit board; and using a CNC pin shearing machine to cut off the excess part of the pin.
[0011] Furthermore, the method further includes the following steps: after the capacitor is welded to the transition circuit board, the integrity of the solder joints and the verticality of the pins are detected by an automatic optical detection module.
[0012] Furthermore, the method further includes the following steps: plasma cleaning the capacitor pins before assembling the capacitor and the transition circuit board; and vacuum coating the pins to form a 30 μm thick parylene nanocoating after welding the capacitor and the transition circuit board.
[0013] Furthermore, the installation method also includes the following steps: before welding the capacitor and the transition circuit board, a three-stage heating method of "80°C → 120°C → 160°C" is used for preheating, and after preheating for 60 seconds, welding is performed through a solder bath temperature of 245±2°C.
[0014] The technical solution provided by the present invention offers the following beneficial effects: The electronic speed regulator capacitor mounting structure of the present invention vertically inserts the capacitor pins into a transition circuit board and solders them to the transition circuit board, which is then vertically inserted into the main circuit board. This eliminates the need to bend the capacitor pins, eliminating bending stress concentration, reducing the probability of fracture during vibration testing, and improving tensile strength. Furthermore, the in-line structure improves the wave soldering yield and welding efficiency, eliminates manual steps, and achieves fully automated production. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments of the present invention.
[0016] Figure 1 A schematic diagram of a capacitor installation structure for an electronic speed regulator according to an embodiment of the present invention; Figure 2 for Figure 1 The schematic diagram of the structure of the capacitor installation structure of the electronic speed regulator from another perspective is shown; Figure 3 A schematic structural diagram of a transition circuit board provided in one embodiment of the present invention. DETAILED DESCRIPTION
[0017] Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of protection of the present invention.
[0018] It should be understood that the various steps described in the method embodiments of the present invention may be performed in different orders and / or in parallel. In addition, the method embodiments may include additional steps and / or omit the steps shown. The scope of the present invention is not limited in this respect.
[0019] As used herein, the term "including" and its variations are open-ended, meaning "including but not limited to." The term "connected" may refer to a direct connection or an indirect connection via intermediate components (elements). The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; and the term "some embodiments" means "at least some embodiments." Other terms are defined below.
[0020] It should be noted that the concepts of "first" and "second" mentioned in the present invention are only used to distinguish devices, modules or units, and are not used to limit these devices, modules or units to be different devices, modules or units, nor are they used to limit the order or interdependence of the functions performed by these devices, modules or units.
[0021] See also Figures 1 to 3The present invention provides an electronic speed regulator capacitor mounting structure (hereinafter referred to as the "mounting structure") and an electronic speed regulator capacitor mounting method (hereinafter referred to as the "mounting method") that forms the mounting structure, which improves the tensile strength of the mounting structure, enhances stability, improves welding efficiency, and realizes fully automated production. The mounting structure includes a main circuit board 3, a transition circuit board 31 and a capacitor 1. The capacitor 1 is preferably an electrolytic capacitor 1, which is plugged into the transition circuit board 31. The transition circuit board 31 is vertically plugged into the main circuit board 3, and the capacitor 1 is electrically connected to the main circuit board 3 via the transition circuit board 31.
[0022] Specifically, the main circuit board 3 has a first through-hole formed therein, and a strengthening pad is formed therein. The transition circuit board 31 has a second through-hole formed therein, and a gold finger pad 311 is provided at the lower end of the transition circuit board 31. The gold finger pad 311 is electrically connected to the second through-hole. The gold finger pad 311 of the transition circuit board 31 passes through the first through-hole and is welded to form a composite solder joint 314. Multiple capacitors 1 are arranged along the length of the transition circuit board 31, and the pins 2 of the capacitors 1 are vertically inserted into the second through-holes and welded to form composite solder joints 314. The composite solder joints 314 provide both mechanical and electrical connection between the capacitors 1 and the transition circuit board 31, or between the transition circuit board 31 and the main circuit board 3.
[0023] In one embodiment, the transition circuit board 31 includes a PCB substrate, on which a multi-layer copper foil conductive layer 313 is provided, forming an integrated current distribution network. The PCB substrate utilizes a high-TG substrate material capable of withstanding temperatures exceeding 150°C. The substrate's bottom layer is configured with a gold finger pad structure, and an immersion gold surface treatment is employed to ensure contact reliability. A multi-layer copper foil stacking architecture and a high-density copper-filled via array are implemented on the substrate, increasing the effective conductive cross-sectional area and reducing the current density at the same operating current. This reduces the overall system temperature, prevents capacitor 1 pin 2 from melting, and improves system stability. Furthermore, the multi-layer copper foil conductive layer 313 forms a grid-like reinforcement rib structure on the substrate, enhancing the substrate's bending strength.
[0024] In one embodiment, the integrated current distribution network includes a parallel current path with multiple layers of current paths, multiple vias, a heat diffusion copper foil area with multiple thermal vias 312, and a mechanical reinforcement frame arranged around the edge of the PCB substrate, so as to reduce the probability of fracture during vibration testing and improve the tensile strength of the mounting structure.
[0025] In one embodiment, the multi-layer copper foil conductive layer 313 defines a positive electrode setting area and a negative electrode setting area, the positive electrode pin 2 of the capacitor 1 is welded to the positive electrode setting area, and the negative electrode pin 2 of the capacitor 1 is welded to the negative electrode setting area, wherein the arrangement direction of the pin 2 of at least one capacitor 1 is perpendicular to the arrangement direction between multiple capacitors 1, thereby rationally arranging the positions of the positive electrode setting area and the negative electrode setting area, and improving the space utilization rate of the transition circuit board 31.
[0026] In one embodiment, a positioning hole is provided on the transition circuit board 31 for inserting and positioning a positioning pin on a carrier that holds the capacitor 1 .
[0027] As a second aspect, the present invention further provides an electronic speed regulator capacitor installation method for assembling the above-mentioned electronic speed regulator capacitor installation structure, comprising the following steps: The transition circuit board 31 is positioned and installed on a carrier made of high-temperature resistant synthetic stone. The carrier is designed with positioning pins (tolerance ±0.02mm) that precisely match the positioning holes of the transition circuit board 31 base plate to achieve zero-deflection insertion.
[0028] Capacitor 1 is gripped with a vacuum nozzle fixture, and pin 2 is vertically inserted into the second through-hole of transition circuit board 31. A wave soldering machine is then used to form a composite solder joint 314. In this embodiment, an AV132 series high-precision automatic insertion machine is used to vertically assemble the straight pin 2 of capacitor 1 with transition circuit board 31. The automatic insertion machine's nozzle is a customized vacuum nozzle fixture (with an aperture adapted to the capacitor diameter of ±0.05mm) that grasps capacitor 1 and ensures stable gripping of pin 2. The insertion pressure is 50±5N to prevent deformation of pin 2, and the insertion speed is 200 pins 2 / minute, with real-time calibration using a visual positioning system (accuracy of ±0.01mm).
[0029] The workpiece, where the transition circuit board 31 and capacitor 1 are welded, is connected to the main circuit board 3. Wave soldering is then used to form composite solder joints 314 between the gold finger pads 311 of the transition circuit board 31 and the reinforced pads of the main circuit board 3. This process is performed using an RS-1R selective dual-wave soldering machine equipped with a nitrogen atmosphere (oxygen content <100 ppm) to reduce oxidation. The welding tool is made of titanium alloy and coated with Teflon to prevent slag adhesion.
[0030] Furthermore, it also includes a pin trimming step, which includes: after the capacitor 1 is welded to the transition circuit board 31, real-time feedback of the length of the pin 2 of the capacitor 1 passing through the transition circuit board 31 is obtained through a laser ranging module; and the excess part of the pin 2 is cut off by a CNC pin shearing machine with model BEX-113, so that the target value of the pin 2 is 2.0±0.1mm.
[0031] Furthermore, the method further includes the following steps: after the capacitor 1 is soldered to the transition circuit board 31, the integrity of the solder joint and the verticality of the pin 2 are inspected by an automatic optical inspection module, wherein the void rate of the solder joint is less than 5% and the deviation of the verticality of the pin 2 is less than 0.5°.
[0032] Furthermore, the following step is included: plasma cleaning the pins 2 of the capacitor before assembling the capacitor 1 with the transition circuit board 31 to remove the oxide layer and improve wettability, wherein the plasma cleaning power is 300W and the time is 30s.
[0033] After the capacitor 1 is welded to the transition circuit board 31 , the pin 2 is vacuum-coated to form a parylene nano-coating with a thickness of 30 μm, thereby enhancing the anti-vibration and corrosion resistance of the pin.
[0034] Furthermore, the following steps are included: Before soldering capacitor 1 to transition circuit board 31, a three-stage preheating process (80°C → 120°C → 160°C) is performed for 60 seconds. Soldering is performed in a solder bath at a temperature of 245±2°C, which helps reduce moisture absorption by the substrate and improve soldering quality. In other embodiments, other preheating temperatures may be used depending on soldering requirements, with the temperature difference between adjacent stages being the same, for example, 40°C.
[0035] The above description is merely a preferred embodiment of the present invention and an illustration of the technical principles employed. Those skilled in the art should understand that the scope of the present invention is not limited to technical solutions formed by specific combinations of the aforementioned technical features. It also encompasses other technical solutions formed by any combination of the aforementioned technical features or their equivalents, without departing from the aforementioned inventive concept. For example, a technical solution formed by replacing the aforementioned features with (but not limited to) technical features with similar functions in the present invention.
[0036] Although the subject matter has been described in language specific to structural features and / or methodological logical acts, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are merely example forms of implementing the claims.
Claims
1. An electronic speed regulator capacitor installation structure, characterized in that: include: Main circuit board, transition circuit board and capacitors; The main circuit board is provided with a first through hole, and a strengthening pad is formed at the first through hole; A second through hole is formed on the transition circuit board, and a gold finger pad is provided at the lower end of the transition circuit board, the gold finger pad is electrically connected to the second through hole, and the gold finger pad of the transition circuit board passes through the first through hole and forms a composite solder joint by welding; The capacitors are arranged in a plurality along the length direction of the transition circuit board, and the pins of the capacitors are vertically inserted into the second through holes and formed into composite solder joints by welding.
2. The capacitor mounting structure for an electronic speed regulator according to claim 1, wherein: The transition circuit board includes a PCB substrate, on which multiple copper foil conductive layers are provided to form an integrated current distribution network.
3. The capacitor mounting structure for an electronic speed regulator according to claim 2, wherein: The integrated current distribution network includes a parallel current path with multiple layers of current paths, multiple vias, a heat diffusion copper foil area with multiple thermal vias, and a mechanical reinforcement frame arranged around the edge of a PCB substrate.
4. The capacitor mounting structure for an electronic speed regulator according to claim 2, wherein: The multi-layer copper foil conductive layer defines a positive electrode setting area and a negative electrode setting area, the positive electrode pin of the capacitor is welded to the positive electrode setting area, and the negative electrode pin of the capacitor is welded to the negative electrode setting area, wherein the pin arrangement direction of at least one capacitor is perpendicular to the arrangement direction between multiple capacitors.
5. The capacitor mounting structure for an electronic speed regulator according to claim 1, wherein: The transition circuit board is provided with a positioning hole for inserting and positioning a positioning pin on a carrier for clamping the capacitor.
6. A method for installing a capacitor of an electronic speed regulator, characterized in that: The method for assembling the capacitor mounting structure of the electronic speed regulator according to any one of claims 1 to 5 comprises the following steps: Position and install the transition circuit board on a carrier made of high-temperature resistant synthetic stone; Grab the capacitor with a vacuum nozzle fixture and vertically insert the pin into the second through hole of the transition circuit board, and form a composite solder joint by using a wave soldering machine; The workpiece with the transition circuit board and the capacitor welded is plugged into the main circuit board, and composite solder joints are formed at the gold finger soldering pads of the transition circuit board and the reinforced soldering pads of the main circuit board by wave soldering.
7. The method for installing a capacitor of an electronic speed regulator according to claim 6, wherein: The pin trimming step further includes: After the capacitor is welded to the transition circuit board, the laser distance measurement module is used to provide real-time feedback on the length of the capacitor pin extending from the transition circuit board. The excess parts of the pins are cut off by a CNC shearing machine.
8. The method for installing a capacitor of an electronic speed regulator according to claim 6, wherein: The following steps are also included: After the capacitor is soldered to the transition circuit board, the integrity of the solder joints and the verticality of the pins are inspected using an automatic optical inspection module.
9. The method for installing a capacitor of an electronic speed regulator according to claim 6, wherein: The following steps are also included: Plasma cleaning of capacitor pins before assembly with transition circuit board; After the capacitor is welded to the transition circuit board, the pins are vacuum coated to form a parylene nano-coating with a thickness of 30 μm.
10. The method for installing a capacitor of an electronic speed regulator according to claim 6, wherein: The method also includes the following steps: before welding the capacitor and the transition circuit board, three-stage temperature rising preheating is adopted, the temperature difference between two adjacent stages is equal, and after preheating for 60 seconds, welding is performed through a solder bath temperature of 245±2°C.