GIS internal guide rod connecting contact temperature self-energy-supply sensor and monitoring method

Abstract

The invention relates to a GIS internal guide rod connecting contact temperature self-energized sensor and a monitoring method, and belongs to the field of micro-nano sensing. The sensor comprises a collecting and sending part and a receiving and demodulating part. The collecting and transmitting part is arranged at a guide rod connecting contact inside the GIS equipment and is used for collecting vibration energy of the GIS equipment and converting the vibration energy into electric energy to realize self-energy supply, and meanwhile, the collecting and transmitting part is used for collecting the temperature at the guide rod connecting contact in real time and converting temperature data into an ultrasonic carrier signal for transmission; and the receiving and demodulating part is arranged outside the GIS equipment and is used for receiving the ultrasonic carrier signal and demodulating the ultrasonic carrier signal to obtain temperature data. According to the invention, the vibration energy of the GIS equipment is converted into the electric energy, the self energy supply of the sensor is realized, and the monitoring data of the sensor is wirelessly transmitted from the interior of the GIS equipment to the exterior by utilizing the characteristic that the ultrasonic communication technology is not limited by metal shielding, so that a power transmission network fault caused by the ablation of a guide rod contact due to continuous high temperature can be avoided.

Description

Technical Field

[0001] The present invention belongs to the field of micro-nano sensing, and relates to temperature monitoring of guide rod connection contacts inside GIS, and in particular to a self-powered sensor for the temperature of guide rod connection contacts inside GIS and a monitoring method thereof. Background Art

[0002] Gas-insulated metal-enclosed switchgear (GIS), a core component of ultra-high / ultra-high voltage (UHV) transmission networks, is widely used for controlling and protecting key nodes in power systems thanks to its all-metal sealed structure's high insulation and anti-interference capabilities. However, under long-term, high-load operation, poor contact between the internal guide rods and contacts of GIS equipment can cause abnormal vibration, generating high temperatures that can further lead to erosion of the connection mechanism. Therefore, proactively detecting and eliminating thermal failures in GIS equipment is crucial.

[0003] Conventional infrared thermal radiation temperature measurement technology only detects the outer casing temperature of GIS equipment through infrared radiation energy, and cannot accurately obtain the actual temperature of key internal locations. Fiber Bragg grating temperature measurement technology can be placed directly inside the equipment, but it relies on an external demodulation circuit to transmit the signal, which is difficult to deploy in real-world conditions due to complex wiring and insulation risks. Electronic temperature measurement technology, due to its high accuracy and small device size, is easy to develop wireless temperature sensors for internal installation. However, the problems of continuous sensor power supply and signal transmission in metal-shielded environments have not yet been effectively solved.

[0004] As a novel electromechanical conversion technology, triboelectric nanogenerators (TGNs), through proper design, can convert the mechanical vibration energy generated by GIS equipment into the required electrical energy to power sensors. This technology has the potential to be developed in the field of self-powered sensing technology. Ultrasonic communication technology can effectively transmit sensor measurement data even in metal-shielded environments, offering the advantage of enabling wireless transmission of measurement data from built-in sensors in GIS equipment. Summary of the Invention

[0005] In view of this, the purpose of the present invention is to provide a self-powered sensor and monitoring method for the temperature of the guide rod connection contacts inside the GIS. By integrating the friction nanogenerator and ultrasonic communication technology, the mechanical vibration energy generated inside the GIS equipment is converted into the working power of the sensor through the friction nanogenerator. At the same time, the physical property of ultrasound that can penetrate metal barriers is utilized to construct a wireless signal transmission channel in a closed environment, providing a solution for wireless monitoring of the temperature of the guide rod connection contacts inside the GIS equipment.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] A self-powered temperature sensor for GIS internal rod connection contacts. The sensor comprises a data acquisition and transmission unit and a receiving and demodulation unit. The data acquisition and transmission unit, located at the rod connection contacts within the GIS device, collects vibration energy from the GIS device and converts it into electrical energy for self-power supply. It also collects the temperature at the rod connection contacts in real time and converts the temperature data into an ultrasonic carrier signal for transmission. The receiving and demodulation unit, located outside the GIS device, receives the ultrasonic carrier signal and demodulates it to obtain temperature data.

[0008] Furthermore, the acquisition and sending part includes a packaging shell, which includes a first cavity and a second cavity; the acquisition and sending part also includes a vibration energy collection module, a temperature acquisition module, an MCU acquisition control module and an ultrasonic transducer; the MCU acquisition control module and the ultrasonic transducer are arranged in the first cavity, the vibration energy collection module is arranged in the second cavity, and the temperature acquisition module is arranged at the bottom of the packaging shell.

[0009] Furthermore, the acquisition and sending part also includes an energy management module and a fixing component; the energy management module is arranged in the first cavity of the packaging shell; the fixing component is arranged on both sides of the temperature acquisition module at the bottom of the packaging shell, and is used to fix the sensor on the guide rod connecting contact inside the GIS equipment.

[0010] Furthermore, in the collection and transmission part, the vibration energy collection module includes an elastic film layer and a metal electrode layer, the opposite ends of the elastic film layer are fixed on the inner wall of the second cavity of the packaging shell, and the metal electrode layer is distributed on the upper and lower sides of the elastic film layer, and is attached to the upper and lower surfaces of the inner cavity of the second cavity; the metal electrode layer is connected to the energy management module through a wire.

[0011] Furthermore, the top of the packaging shell is arc-shaped.

[0012] Furthermore, the receiving and demodulating part includes a signal receiving device and an MCU demodulation module; the signal receiving device is arranged outside the GIS device, for receiving the ultrasonic carrier signal and transmitting it to the MCU demodulation module after filtering; the MCU demodulation module demodulates the filtered ultrasonic carrier signal into temperature data.

[0013] On the other hand, the present invention provides a method for monitoring the temperature of the guide rod connection contacts inside GIS based on the above-mentioned sensor, the method comprising: using the temperature acquisition module of the sensor to collect the temperature of the guide rod connection contacts in real time, and using the MCU acquisition control module to read the temperature data and convert it into binary data; the MCU acquisition control module controls the ultrasonic transducer to generate a corresponding ultrasonic carrier signal according to the binary data, and at a fixed time interval, sends a sinusoidal wave signal when the binary logic is 1, and does not send a signal when the binary logic is 0; a signal receiving device receives the ultrasonic carrier signal and performs filtering processing, and the MCU demodulation module demodulates the filtered ultrasonic carrier signal into binary data according to the signal amplitude to obtain temperature data.

[0014] The beneficial effects of the present invention are: 1) Based on the fact that poor contact of the guide rod contacts inside the GIS equipment will cause abnormal vibration, the present invention proposes to use friction nanogenerator technology to convert the vibration energy of the abnormal vibration into electrical energy as a self-powered energy source. By integrating the friction nanogenerator inside the sensor, a self-powered sensor that can monitor the temperature of the guide rod contacts inside the GIS equipment in real time is realized, thereby solving the problem that built-in sensors need to rely on external power supply, have complex wiring, insufficient insulation risks, and cannot meet actual deployment and maintenance requirements.

[0015] 2) The present invention proposes the use of ultrasonic technology to complete the transmission of temperature monitoring data. By arranging ultrasonic transducers inside and outside the GIS device respectively, and taking advantage of the fact that ultrasonic carrier signals are not restricted by metal shielding, the temperature monitoring data collected inside the GIS device can be transmitted to the outside of the GIS device through ultrasonic carrier signals, thereby avoiding the problem that the electronic temperature measurement technology is difficult to apply due to the shielding effect of the all-metal enclosed environment of the GIS device on electromagnetic signals. In addition, ultrasonic communication technology can ensure the effective transmission of signals inside and outside the GIS device, thereby ensuring the authenticity and integrity of the temperature monitoring data.

[0016] The present invention realizes real-time monitoring of the temperature of key points inside the GIS equipment, meets the demand for early detection and elimination of thermal faults of the GIS equipment, and can avoid transmission network failures caused by the burning of the guide rod contacts due to continuous high temperature.

[0017] Other advantages, objects, and features of the present invention will be described in part in the following description and, in part, will be apparent to those skilled in the art upon examination of the following description or may be learned from practice of the present invention. The objects and other advantages of the present invention may be realized and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be described in detail below with reference to the accompanying drawings, in which:

[0019] Figure 1 This is a structural block diagram of the self-powered sensor provided in Example 1 of the present invention;

[0020] Figure 2 Schematic diagram of the sensor collection and transmission structure;

[0021] Figure 3 This is a schematic diagram of the working principle of the vibration energy harvesting module;

[0022] Figure 4 This is a schematic diagram of the deployment of self-powered sensors at the guide rod connection contacts inside the GIS equipment;

[0023] Figure 5 Schematic diagram of a method for monitoring the temperature of key points inside GIS equipment based on a self-powered sensor, provided in Example 2 of the present invention;

[0024] Figure 6 This is a schematic diagram of the temperature data conversion principle.

[0025] Reference numerals:

[0026] 1-acquisition and transmission part; 11-vibration energy collection module; 12-temperature acquisition module; 13-energy management module; 14-MCU acquisition control module; 15-ultrasonic transducer; 16-encapsulation shell; 17-fixing component; 111-elastic film layer; 112-metal electrode layer;

[0027] 2-receiving and demodulating part; 21-signal receiving device;

[0028] 3-Hollow aluminum guide rod; 4-Center conductor connection part; 5-Spring contact finger; 6-Metal cylinder; 7-Pot insulator; 8-Shielding cover. DETAILED DESCRIPTION

[0029] The following describes the embodiments of the present invention by means of specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and the following embodiments and features in the embodiments can be combined with each other without conflict.

[0030] Among them, the accompanying drawings are only for illustrative purposes and represent only schematic diagrams rather than actual pictures, and should not be understood as limiting the present invention. In order to better illustrate the embodiments of the present invention, some parts of the accompanying drawings may be omitted, enlarged or reduced, and do not represent the dimensions of actual products. For those skilled in the art, it is understandable that some well-known structures and their descriptions may be omitted in the accompanying drawings.

[0031] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right", "front", "back", etc. indicating directions or positional relationships, they are based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operate in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting the present invention. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0032] Conventional infrared thermal radiation temperature measurement technology cannot accurately obtain the true temperature of key locations inside GIS equipment, fiber Bragg grating temperature measurement technology has problems with complex wiring and insulation risks, and electronic temperature measurement technology has difficulty in continuous power supply and signal transmission problems in metal shielding environments. The present invention uses friction nanogenerator technology to convert the mechanical vibration energy generated by GIS equipment into the required electrical energy to continuously power the sensor, and uses ultrasonic communication technology to ensure effective signal transmission in a metal shielding environment, thereby achieving the purpose of arranging sensors at key points inside GIS equipment and transmitting measurement data to the outside.

[0033] like Figure 1 The figure shows a self-powered temperature sensor for connecting contacts to internal guide rods in a GIS, according to one embodiment of the present invention. This sensor integrates triboelectric generator technology and ultrasonic information transmission technology, enabling temperature monitoring within GIS equipment and effective signal transmission in a fully metal-shielded environment. The sensor comprises a data acquisition and transmission unit 1 and a receiver-demodulator unit 2. The data acquisition and transmission unit 1 is located at key points within the GIS equipment to collect temperature data and convert it into an ultrasonic carrier signal. The receiver-demodulator unit 2, located outside the GIS equipment, receives the ultrasonic carrier signal and demodulates it to obtain temperature data.

[0034] like Figure 2 As shown, the collection and transmission part 1 of the self-powered sensor includes a vibration energy collection module 11, a temperature collection module 12, an energy management module 13, an MCU collection and control module 14, an ultrasonic transducer 15, and a packaging shell 16.

[0035] The packaging shell 16 is a cube structure with an arc-shaped top, including a first cavity and a second cavity. Figure 2 In the upright position shown, the first cavity is located above the second cavity. The top of the encapsulation shell 16 adopts a hemispherical design to prevent the sensor from having a charged high point, which could cause corona discharge and damage the monitoring device. The shell is made of high-permeability shielding material and is resistant to SF6 gas, high temperature environments, and shock and vibration.

[0036] The vibration energy harvesting module 11 is disposed within the second cavity of the package housing 16. This module is a forced deformation triboelectric nanogenerator (TGN) comprised of an elastic film layer 111 and metal electrode layers 112 located on the upper and lower sides of the elastic film layer 111. In this embodiment, the elastic film layer 111 is made of polydimethylsiloxane, and the metal electrode layers 112 are made of copper foil. The elastic film layer 111 is a thin rectangular film, with its opposite ends fixed to the inner wall of the package housing 16. The two metal electrode layers 112 are square metal sheets of the same width as the elastic film layer 111, attached to the upper and lower surfaces of the second cavity of the package housing 16, respectively.

[0037] An energy management module 13 , an MCU acquisition control module 14 and an ultrasonic transducer 15 are arranged in the first cavity of the packaging shell 16 .

[0038] A temperature acquisition module 12 is fixed at the center of the bottom of the packaging shell 16 .

[0039] Fixing components 17 are provided on both sides of the temperature acquisition module 12 at the bottom of the packaging shell 16. The fixing components 17 are made of high-temperature resistant epoxy adhesive, which is used to ensure that the self-powered sensor fits tightly with the measured point inside the GIS equipment, so that the self-powered sensor is fixed at the measured point for temperature monitoring.

[0040] The receiving and demodulating part 2 includes a signal receiving device 21 and an MCU demodulation module. The signal receiving device 21 is used to receive the ultrasonic carrier signal emitted by the ultrasonic transducer 15 and transmit it to the MCU demodulation module for demodulation to obtain the temperature data collected by the temperature acquisition module 12.

[0041] In the vibration energy harvesting module 11, the working principle of the elastic film forced deformation type friction nanogenerator is as follows:

[0042] Based on the coupling of contact electrification and electrostatic induction effects, the elastic film layer is forced to deform under external vibration excitation, forming a periodic contact and separation movement between the upper and lower metal electrode layers, thereby converting vibration energy into electrical energy. Figure 2Specifically, in the initial state, after the elastic film layer 111 comes into contact and separates from the upper and lower metal electrode layers 112, the contact electrification effect causes the upper and lower metal electrode layers 112 to carry a charge of Q, respectively, while the elastic film layer 111 carries a charge of -2Q. When the elastic film layer 111 deforms upward due to vibration, the original electrostatic equilibrium is disrupted, establishing a potential difference between the electrodes. The electrostatic induction effect drives charge transfer between the metal electrode layers 112 through the external load until the elastic film layer 111 reaches maximum relative deformation. The charge transferred between the metal electrode layers 112 at this point is defined as Q. The negative charge on the surface of the elastic film layer 111 is completely shielded by the positive charge of the upper metal electrode layer 112, reestablishing electrostatic equilibrium. When the elastic film layer 111 deforms downward due to vibration, the charge is transferred to the original metal electrode layer 112. When the elastic film layer 111 recovers, the charge transferred between the metal electrode layers 112 is now -Q. Until the elastic film layer 111 forms its maximum relative deformation in the downward direction, the amount of charge transferred between the metal electrode layers 112 is -Q. When the elastic film layer 111 is again stimulated by vibration and returns to its initial state, the amount of charge transferred between the metal electrode layers 112 is Q. Therefore, the forced upward and downward deformation of the elastic film layer 111 constitutes the power generation process of a complete cycle of the triboelectric nanogenerator, generating continuous AC power through such periodic contact and separation.

[0043] like Figure 3 The figure shows the deployment of the self-powered sensor provided by this embodiment at the internal guide rod connection contact of the GIS equipment. The basic structure of the internal guide rod connection contact of the GIS equipment includes a hollow aluminum guide rod 3, a central conductor connection part 4, a spring contact finger 5, a metal cylinder 6, a pot insulator 7 and a shielding cover 8.

[0044] The contact of the hollow aluminum guide rod 3 is connected to the center conductor connection 4 via two spring contact fingers 5. The center conductor connection 4 is connected to the metal cylinder 6 via a pot-type insulator 7. The surface of the center conductor connection 4 is covered with a shielding cover 8. The data acquisition and transmission component 1 of the self-powered sensor provided in this embodiment is fixed to the center conductor connection 4 of the basic structure of the GIS equipment, while the receiving and demodulation component 2 is installed on the outside of the metal cylinder 6. After the temperature acquisition module 12 completes temperature data acquisition, the collected data is transmitted to the outside of the GIS equipment via ultrasound. This utilizes the physical property of ultrasound that can penetrate metal barriers to establish a wireless signal transmission channel in a closed environment, eliminating the need for complex wiring layout.

[0045] Another embodiment of the present invention provides a method for collecting temperature data of key points inside a GIS device through a self-powered sensor and performing signal demodulation to obtain temperature data. This method collects the temperature signal at the central conductor connection part 4 inside the GIS device through the self-powered sensor described in Example 1, and transmits the temperature signal to the outside of the GIS device through ultrasound, and demodulates the ultrasonic signal to obtain the corresponding temperature data.

[0046] Specifically, if Figure 4 As shown, during operation, the internal guide rods of the GIS equipment are subjected to electric forces, generating periodic vibrations at a frequency of 100 Hz. The vibration energy collection module 11 of the self-powered sensor begins operating when triggered by the GIS equipment's vibrations, storing the generated AC power in the energy management module 13. The energy management module 13 converts the AC power into DC power and provides energy to the MCU acquisition and control module 14. The MCU acquisition and control module 14 is responsible for reading the temperature of the GIS equipment's guide rod connection contacts measured by the temperature acquisition module 12, converting the decimal temperature data into binary, and further controlling the ultrasonic transducer 15 to generate a corresponding carrier signal using amplitude modulation. The carrier signal is a high-frequency sine wave with a fixed time interval. A high level of the sine wave represents a logical "1," and a low level represents a logical "0." The ultrasonic signal receiving device 21 (i.e., the ultrasonic transducer) responds to the carrier signal transmitted by the internal sensor of the GIS equipment and filters out the high-frequency components through a low-pass filter. The MCU demodulation module is responsible for demodulating the received carrier signal into the corresponding temperature data.

[0047] According to the above process, the self-powered wireless monitoring of the temperature data of the guide rod connection contacts inside the GIS equipment can be completed.

[0048] The modulation and demodulation process of the temperature data to be transmitted collected by the sensor is as follows:

[0049] Assume that the temperature data to be transmitted is AB (A and B represent two decimal numbers respectively). First, the MCU acquisition control module 14 in the sensor converts the two-digit decimal number into binary form. For example, if the current temperature data is 91°C, then A=1 and B=0, then the binary representation is A=1001 and B=0001 respectively; the binary temperature data are connected to form a continuous binary string 10010001. Secondly, the operation of the ultrasonic transducer 15 is controlled by amplitude modulation, and the corresponding ultrasonic carrier signal is generated according to the converted data to be transmitted. The conversion logic is that logic "1" represents a high level and logic "0" represents a low level; therefore, at a fixed time interval, a fixed-frequency sine wave signal is sent when logic "1" is set, and no signal is sent when logic "0". Figure 5 Finally, the MCU demodulation module demodulates the received ultrasonic carrier signal into binary data information according to the signal amplitude, completing the demodulation of the temperature data.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not limiting. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced by equivalents without departing from the purpose and scope of the technical solutions, which should all be included in the scope of the claims of the present invention.

Claims

1. A GIS internal guide rod connection contact temperature self-powered sensor, characterized in that: The sensor includes an acquisition and transmission part and a receiving and demodulation part; the acquisition and transmission part is arranged at the guide rod connection contact inside the GIS equipment, and is used to collect the vibration energy of the GIS equipment and convert it into electrical energy to achieve self-power supply. At the same time, it is used to collect the temperature at the guide rod connection contact in real time and convert the temperature data into an ultrasonic carrier signal for transmission; the receiving and demodulation part is arranged outside the GIS equipment, and is used to receive the ultrasonic carrier signal and demodulate it to obtain temperature data.

2. The sensor according to claim 1, characterized in that The acquisition and sending part includes a packaging shell, which includes a first cavity and a second cavity; the acquisition and sending part also includes a vibration energy collection module, a temperature acquisition module, an MCU acquisition control module and an ultrasonic transducer; the MCU acquisition control module and the ultrasonic transducer are arranged in the first cavity, the vibration energy collection module is arranged in the second cavity, and the temperature acquisition module is arranged at the bottom of the packaging shell.

3. The sensor according to claim 2, characterized in that The acquisition and sending part also includes an energy management module and a fixing component; the energy management module is arranged in the first cavity of the packaging shell; the fixing component is arranged on both sides of the temperature acquisition module at the bottom of the packaging shell, and is used to fix the sensor on the guide rod connection contact inside the GIS equipment.

4. The sensor according to claim 3, characterized in that In the collection and transmission part, the vibration energy collection module includes an elastic film layer and a metal electrode layer. The opposite ends of the elastic film layer are fixed on the inner wall of the second cavity of the packaging shell. The metal electrode layer is distributed on the upper and lower sides of the elastic film layer and is attached to the upper and lower surfaces of the inner cavity of the second cavity; the metal electrode layer is connected to the energy management module through a wire.

5. The sensor according to claim 4, characterized in that The top of the packaging shell is in an arc shape.

6. The sensor according to claim 1, characterized in that The receiving and demodulating part includes a signal receiving device and an MCU demodulation module; the signal receiving device is arranged outside the GIS device, and is used to receive the ultrasonic carrier signal and transmit it to the MCU demodulation module after filtering; the MCU demodulation module demodulates the filtered ultrasonic carrier signal into temperature data.

7. A method for monitoring the temperature of a guide rod connection contact inside a GIS based on the sensor according to any one of claims 1 to 6, characterized in that: The method includes: using a temperature acquisition module of the sensor to acquire the temperature of the guide rod connection contact in real time, and using an MCU acquisition control module to read the temperature data and convert it into binary data; the MCU acquisition control module controls an ultrasonic transducer to generate a corresponding ultrasonic carrier signal according to the binary data, and at a fixed time interval, sends a sine wave signal when the binary logic is 1, and does not send a signal when the binary logic is 0; a signal receiving device receives the ultrasonic carrier signal and performs filtering processing, and an MCU demodulation module demodulates the filtered ultrasonic carrier signal into binary data according to the signal amplitude to obtain temperature data.

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