Infrared image non-uniformity correction equipment and method thereof

Abstract

The invention is applicable to the technical field of infrared imaging, and provides infrared image non-uniformity correction equipment, which comprises an infrared imaging shell, a base arranged at the bottom of the infrared imaging shell, an n-shaped frame arranged on the lower surface of the infrared imaging shell, an imaging device arranged in the infrared imaging shell, a heat absorbing plate arranged in the infrared imaging shell, and an infrared imaging device arranged in the heat absorbing plate, the infrared imaging device comprises an infrared imaging shell, an absorber plate is arranged in the infrared imaging shell, all electronic elements, located in the infrared imaging shell, of the imaging device are integrally installed on the absorber plate, a supporting column used for fixing is arranged between the lower surface of the absorber plate and the infrared imaging shell, and a heat insulation and heat preservation material is arranged on the outer surface of the infrared imaging shell. The influence of external temperature fluctuation on electronic elements of the imaging device is isolated, and meanwhile, the electronic elements are integrally mounted on the heat absorption plate, so that the temperature uniformity of the electronic elements of the imaging device is kept, and pixel response curve offset caused by temperature abnormity is avoided as much as possible.

Description

Technical Field

[0001] The present invention relates to the field of infrared imaging technology, and more particularly to an infrared image non-uniformity correction device and method thereof. Background Art

[0002] All objects in nature, whether it is Arctic glaciers, flames, human bodies, or even the extremely cold deep space of the universe, will emit infrared radiation as long as their temperature is higher than absolute zero -273℃. This is the result of the thermal motion of molecules inside the object. Its radiation energy is proportional to the fourth power of its own temperature, and the wavelength of the radiation is inversely proportional to its temperature. Infrared imaging technology is based on the level of radiation energy detected by the object, which is converted into a thermal image of the target object through system processing and displayed in grayscale or pseudo-color, that is, the temperature distribution of the measured target is obtained to determine the state of the object.

[0003] When existing infrared thermal imaging instruments are used in high-temperature environments, the high-temperature radiation may cause temperature abnormalities in the optical components inside the instrument, resulting in pixel response curve offsets and non-uniformity drift over time. This affects the consistency of the response of different pixels in the infrared focal plane array to the same radiation intensity, making it impossible to accurately identify objects. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the present invention aims to provide an infrared image non-uniformity correction device and method thereof, which avoids the pixel response curve offset caused by temperature anomaly and the non-uniformity drift over time.

[0005] To achieve the above object, the present invention provides the following technical solutions: An infrared image non-uniformity correction device includes an infrared imaging shell, a base is provided at the bottom of the infrared imaging shell, an n-shaped frame is provided on the lower surface of the infrared imaging shell, an imaging device is provided in the infrared imaging shell, a heat absorbing plate is provided in the infrared imaging shell, all electronic components of the imaging device located in the infrared imaging shell are integrated and mounted on the heat absorbing plate, a support for fixing is provided between the lower surface of the heat absorbing plate and the infrared imaging shell, a heat insulating material is provided on the outer surface of the infrared imaging shell, the heat absorbing plate is made of a material with high thermal conductivity, and a heat absorbing plate is provided at the bottom of the infrared imaging shell to conduct heat from the heat absorbing plate to the infrared imaging shell. The external heat-conducting component includes a heat-conducting plate, which is also made of a high thermal conductivity material. The heat-conducting plate is arranged between the heat absorbing plate and the bottom wall of the infrared imaging shell. The lower surface of the heat-conducting plate is provided with multiple first heat-conducting columns. The bottom wall of the infrared imaging shell is provided with multiple heat-conducting grooves extending from its lower surface. The lower end of the first heat-conducting column extends into the heat-conducting groove. The lower surface of the first heat-conducting column is provided with a second heat-conducting column that can extend downward from the infrared imaging shell. The first heat-conducting column and the second heat-conducting column are also made of a high thermal conductivity material. The lower surface of the infrared imaging shell is provided with a sealing component for sealing the heat-conducting groove.

[0006] The present invention is further configured as follows: an electric push rod is provided on the bottom wall of the infrared imaging shell, a temperature sensor for monitoring the temperature change of the imaging device is installed inside the infrared imaging shell, a controller for controlling the electric push rod is provided inside the infrared imaging shell, the controller is electrically connected to the temperature sensor, a rotating plate is hinged between one end of the telescopic rod of the electric push rod and the lower surface of the heat conduction plate, an active cooling fan is provided on the lower surface of the N-shaped frame cross plate, and the controller is electrically connected to the active cooling fan.

[0007] The present invention is further configured as follows: a fixed plate located between the first heat-conducting column and the second heat-conducting column is provided in the heat-conducting groove, the upper surface of the fixed plate is rotatably connected to the rotating column, the lower surface of the first heat-conducting column is provided with a rotating groove movably sleeved on the outer surface of the rotating column, the top wall of the rotating groove is provided with a twisted rod, the upper surface of the rotating column is provided with a twisted groove spirally sleeved on the outer surface of the twisted rod, the lower surface of the fixed plate is rotatably connected to the screw, the upper end of the screw rotates to pass through the fixed plate and is connected to the lower surface of the rotating column, the upper surface of the second heat-conducting column is provided with a threaded groove threadedly sleeved on the outer surface of the screw, the outer surface of the second heat-conducting column is fitted with the inner wall of the heat-conducting groove and slides in the heat-conducting groove, the rotating column, the twisted rod and the screw are all made of a material with high thermal conductivity.

[0008] The present invention is further configured as follows: a plurality of auxiliary heat-conducting components are provided on the upper surface of the second heat-conducting column, and the auxiliary heat-conducting components include an auxiliary heat-conducting plate, which is also made of a material with high thermal conductivity. The upper side of the auxiliary heat-conducting plate slides through the upper surface of the fixed plate, and a plurality of sliding grooves are provided on the lower surface of the first heat-conducting column. The upper side of the auxiliary heat-conducting plate extends into the sliding groove and slides in the sliding groove.

[0009] The present invention is further configured as follows: a plurality of first shrinkage grooves are provided on the outer surface of the auxiliary heat conducting plate, a first contact plate is slidably connected in the first shrinkage groove, the first contact plate is also configured to be made of high thermal conductivity material, an active cavity is provided in the auxiliary heat conducting plate, a first push rod is provided on the surface of the first contact plate close to the active cavity, the other end of the first push rod slides through the active cavity, a contact head is provided at one end of the first push rod located in the active cavity, a spring movably sleeved on the outer surface of the first push rod is provided between the contact head and the inner wall of the active cavity, the first push rod pulls the first contact plate to shrink into the first shrinkage groove and matches the first shrinkage groove, a pulling rod is provided on the top wall of the sliding groove, the lower end of the pulling rod slides through the active cavity, a truncated cone-shaped extrusion block is provided at the lower end of the pulling rod, and the outer surface of the extrusion block contacts the contact head.

[0010] The present invention is further configured as follows: a second contraction groove is provided on the inner wall of the rotating groove close to the sliding groove, a second contact plate for heat conduction is slidably connected in the second contraction groove, the second contact plate is made of the same material as the first contact plate, a second push rod is provided on the surface of the second contact plate facing the sliding groove, the other end of the second push rod slides through the sliding groove and can contact the first contact plate, and a first tension spring movably sleeved on the outer surface of the second push rod is provided between the second contact plate and the inner wall of the second contraction groove.

[0011] The present invention is further configured as follows: the sealing assembly includes a rotating seat, which is arranged on a side of the lower surface of the infrared imaging housing close to the heat conduction groove, and a sealing plate is rotatably connected to the rotating seat. A rubber sealing block for sealing the heat conduction groove is arranged on the surface of the sealing plate facing the heat conduction groove. The rubber sealing block is made of rubber with high thermal insulation rate. A connecting shaft with one end rotating through the rotating seat is provided on the sealing plate. A worm gear is provided at one end of the connecting shaft located outside the rotating seat. A worm is meshed and connected to the outer side of the worm gear. A transmission rod is provided at the upper end of the worm. A transmission rod is provided inside the infrared imaging housing close to the heat conduction groove. The upper end of the transmission rod rotates and passes through the transmission cavity. A bevel gear is provided at the upper end of the transmission rod. A rotating shaft is rotatably connected on the top inner wall of the transmission cavity. The outer surface of the rotating shaft is also sleeved with a bevel gear. The two bevel gears are meshed with each other. A gear is provided at one end of the rotating shaft close to the heat conduction groove. A connecting groove that is interconnected with the transmission cavity is provided on the inner wall of the heat conduction groove. A connecting plate is provided on the outer surface of the top of the second heat conduction column. The other side of the connecting plate extends into the transmission cavity through the connecting groove and slides in the connecting groove. A toothed plate meshing with the gear is provided on one side of the connecting plate located in the transmission cavity.

[0012] The present invention is further configured as follows: an inner cavity is opened in the sealing plate, a plurality of foot-operated air pumps are provided on the inner wall of the inner cavity away from the rubber sealing block, a plurality of nozzles are inlaid on the surface of the sealing plate close to the outer surface of the rubber sealing block, one end of the nozzle passes through the inner cavity, a connecting hose for conveying gas is provided between the nozzle and the foot-operated air pump, a push plate is provided on the surface of the foot-operated air pump away from the installation point, a third push rod is provided on the surface of the push plate facing the foot air pump, the other end of the third push rod slides through the outer surface of the sealing plate, and a second tension spring movably sleeved on the outer surface of the third push rod is provided between the push plate and the inner wall of the inner cavity.

[0013] A method for correcting non-uniformity of infrared images includes the following specific steps: S1, obtaining an original image output by an imaging device and processed in advance; S2, averaging the values ​​of the pixels in each correction frame in the original image to obtain an average image; S3. For each pixel, calculate the deviation between it and the average image to obtain a correction coefficient; S4, applying the correction coefficient to the original thermal infrared image to correct the value of each pixel; S5. After the correction process, the obtained image should show a more uniform grayscale distribution, reducing the impact of unevenness.

[0014] The advantages of the present invention are: First, the present invention isolates the electronic components of the imaging device from the effects of external temperature fluctuations by placing them in a sealed space. At the same time, all the electronic components are integrated and mounted on a heat-absorbing plate. The heat-absorbing plate reduces the standard deviation of the surface temperature distribution of the electronic components through lateral heat diffusion, thereby avoiding thermal stress failure of semiconductor devices and maintaining the temperature uniformity of the electronic components of the imaging device. It minimizes the deviation of the pixel response curve caused by temperature anomalies and the drift of non-uniformity over time, thus ensuring the consistency of the response of different pixels in the infrared focal plane array (IRFPA) to the same radiation intensity.

[0015] Secondly, the present invention increases the heat conduction path between the first heat conduction column and the second heat conduction column by setting an auxiliary heat conduction component, thereby improving the heat conduction efficiency between the first heat conduction column and the second heat conduction column, and adopts an extrusion contact method to increase the contact pressure between the two, thereby further improving the heat conduction efficiency between the first heat conduction column and the second heat conduction column.

[0016] Third, the present invention can automatically blow gas toward the outer surface of the rubber sealing block during the closing process of the sealing plate, so as to blow off the dust attached to the outer surface of the rubber sealing block, thereby preventing dust or particles attached to the surface of the rubber sealing block from entering the heat conduction groove, resulting in a certain gap between the rubber sealing block and the inner wall of the heat conduction groove, thereby affecting the insulation effect against the external temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a structural schematic diagram of an infrared image non-uniformity correction device according to the present invention; Figure 2 This is a schematic diagram of the connection structure of the n-type frame of the present invention; Figure 3 It is a side plan view of the internal structure of the infrared imaging housing of the present invention; Figure 4 for Figure 3 Enlarged view of point A in the middle; Figure 5 for Figure 3 Enlarged view of point B in the middle; Figure 6 for Figure 4 Enlarged view of point C in the middle; Figure 7 for Figure 5 Enlarged view of point D in the middle; Figure 8 for Figure 3 Enlarged view of point E in the middle.

[0018] In the figure: 1. Infrared imaging housing; 2. Base; 3. N-type frame; 4. Imaging device; 5. Heat absorbing plate; 6. Support; 7. Temperature sensor; 8. Active cooling fan; 9. Heat-conducting assembly; 91. Heat-conducting plate; 92. Electric push rod; 93. Rotating plate; 94. First heat-conducting column; 95. Second heat-conducting column; 96. Heat-conducting groove; 97. Fixed plate; 98. Rotating column; 99. Rotating groove; 910. Twist rod; 911. Screw; 912. Auxiliary heat-conducting plate; 913. Sliding groove; 914. First contraction groove; 915. First contact plate; 916. Movable cavity; 917. First push rod; 918. Contact head; 919. Spring; 920. Pull rod; 921. Extrusion block; 922. First tension spring; 923. Second contraction groove; 924. Second contact plate; 925. Second push rod; 10. Sealing assembly; 101. Rotating seat; 102. Sealing plate; 103. Rubber sealing block; 104. Worm gear; 105. Transmission chamber; 106. Transmission rod; 107. Bevel gear; 108. Second tension spring; 109. Rotating shaft; 110. Gear; 111. Connecting slide; 112. Connecting plate; 113. Tooth plate; 114. Connecting shaft; 115. Inner chamber; 116. Foot-operated air pump; 117. Injection head; 118. Push plate; 119. Third push rod; 120. Connecting hose; 121. Worm. DETAILED DESCRIPTION

[0019] The present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the relevant invention and are not intended to limit the invention. It should also be noted that, for ease of description, only portions relevant to the invention are shown in the accompanying drawings.

[0020] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0021] See also Figure 1-8 , the present invention provides the following technical solutions: Specifically, it refers to an infrared image non-uniformity correction device, including an infrared imaging shell 1, a base 2 is provided at the bottom of the infrared imaging shell 1, an n-type frame 3 is provided on the lower surface of the infrared imaging shell 1, and two vertical plates of the n-type frame 3 are respectively installed on the left and right side surfaces of the base 2.

[0022] An imaging device 4 is provided in the infrared imaging shell 1. The imaging device 4 is the disclosed technology in the existing patent: CN112763074B and will not be described in detail here. The lens part of the imaging device 4 extends out of the outside of the infrared imaging shell 1. A heat absorbing plate 5 is provided in the infrared imaging shell 1. All the electronic components of the imaging device 4 located in the infrared imaging shell 1 are integrated and mounted on the heat absorbing plate 5. A support 6 for fixing is provided between the lower surface of the heat absorbing plate 5 and the infrared imaging shell 1. The outer surface of the infrared imaging shell 1 is provided with heat insulation material, and the heat absorbing plate 5 is made of a material with high thermal conductivity (such as brass, graphene, etc.).

[0023] During use, the electronic components of the imaging device 4 are placed in a sealed space to isolate them from the influence of external temperature fluctuations. At the same time, all the electronic components are integrated and mounted on the heat absorbing plate 5. The heat absorbing plate 5 reduces the standard deviation of the surface temperature distribution of the electronic components through lateral heat diffusion, thereby avoiding thermal stress failure of the semiconductor devices and maintaining the temperature uniformity of the electronic components of the imaging device 4.

[0024] The bottom of the infrared imaging housing 1 is provided with a heat conducting component 9 for conducting the heat of the heat absorbing plate 5 to the outside. The heat conducting component 9 includes a heat conducting plate 91. The heat conducting plate 91 is also made of a material with high thermal conductivity. The heat conducting plate 91 is arranged between the heat absorbing plate 5 and the bottom wall of the infrared imaging housing 1. An electric push rod 92 is arranged on the bottom wall of the infrared imaging housing 1. A temperature sensor 7 for monitoring the temperature change of the imaging device 4 is installed inside the infrared imaging housing 1. A controller for controlling the electric push rod 92 is provided in the infrared imaging housing 1. The controller is electrically connected to the temperature sensor 7. One end of the telescopic rod of the electric push rod 92 is electrically connected to the temperature sensor 7. A rotating plate 93 is hinged between the lower surfaces of the heat conducting plate 91, and a plurality of first heat conducting columns 94 are provided on the lower surface of the heat conducting plate 91. The bottom wall of the infrared imaging housing 1 is provided with a plurality of heat conducting grooves 96 extending from its lower surface. The lower end of the first heat conducting column 94 extends into the heat conducting groove 96. A second heat conducting column 95 is provided on the lower surface of the first heat conducting column 94. The outer surface of the second heat conducting column 95 is in contact with the inner wall of the heat conducting groove 96. The first heat conducting column 94 and the second heat conducting column 95 are also made of a material with high thermal conductivity. A sealing component 10 is provided on the lower surface of the infrared imaging housing 1 to seal the heat conducting groove 96.

[0025] During use, when the temperature sensor 7 detects that the temperature of the electronic components of the imaging device 4 is greater than 50 degrees, the controller transmits a signal to the electric push rod 92, and the telescopic rod of the electric push rod 92 moves outward. At this time, the rotating plate 93 forms a thrust on the heat conducting plate 91, causing the heat conducting plate 91 to move upward and contact and squeeze the bottom of the heat absorbing plate 5. At the same time, the first heat conducting column 94 moves upward, and the second heat conducting column 95 moves downward. The sealing component 10 no longer seals the heat conducting groove 96, and the second heat conducting column 95 can move out of the lower side of the infrared imaging housing 1. Since the first heat conducting column 94 and the second heat conducting column 95 are also made of high conductivity The heat generated by the imaging device 4 during operation can be quickly conducted to the outside of the infrared imaging housing 1. The closed environment blocks the heat dissipation by air convection, forcing the heat to be concentratedly transferred to the outside of the infrared imaging housing 1 through a solid conduction path. Since the temperature difference between the inside and outside of the imaging device 4 is large when the temperature is abnormal, the heat flow driven by the high temperature difference can improve the heat dissipation efficiency by more than 30%, thereby avoiding the pixel response curve offset caused by temperature abnormality and the drift of non-uniformity over time, thereby ensuring the consistency of the response of different pixels in the infrared focal plane array (IRFPA) to the same radiation intensity.

[0026] A fixed plate 97 is provided in the heat-conducting groove 96, which is located between the first heat-conducting column 94 and the second heat-conducting column 95. The upper surface of the fixed plate 97 is rotatably connected to a rotating column 98. The lower surface of the first heat-conducting column 94 is provided with a rotating groove 99 that is movably sleeved on the outer surface of the rotating column 98. The top wall of the rotating groove 99 is provided with a twisted rod 910. The upper surface of the rotating column 98 is provided with a twisted groove that is spirally sleeved on the outer surface of the twisted rod 910. The lower surface of the fixed plate 97 is rotatably connected to a screw rod 911. The upper end of the screw rod 911 rotates through the fixed plate 97 and is connected to the lower surface of the rotating column 98. The upper surface of the second heat-conducting column 95 is provided with a threaded groove that is threadedly sleeved on the outer surface of the screw rod 911. At the same time, the second heat-conducting column 95 slides in the heat-conducting groove 96. The rotating column 98, the twisted rod 910 and the screw 911 are also made of a material with high thermal conductivity.

[0027] During use, the first heat-conducting column 94 moves upward with the heat-conducting plate 91, and the twisted rod 910 moves upward synchronously with the first heat-conducting column 94. At this time, the rotating column 98 rotates under the drive of the twisted rod 910 spiral, and the screw 911 rotates synchronously with the rotating column 98. At this time, the second heat-conducting column 95 moves downward out of the heat-conducting groove 96 under the drive of the screw 911 thread teeth, so that the heat conducted to the first heat-conducting column 94 can be conducted to the screw 911 through the rotating column 98, and finally conducted to the second heat-conducting column 95, and finally dissipated by the second heat-conducting column 95.

[0028] An active cooling fan 8 is provided on the lower surface of the horizontal plate of the n-shaped frame 3. When the second heat-conducting column 95 extends out of the bottom of the infrared imaging housing 1, the active cooling fan 8 is started, so that convection is formed at the second heat-conducting column 95, further improving the heat dissipation efficiency of the infrared imaging equipment and minimizing the impact of heat changes on the non-uniformity of infrared imaging.

[0029] The upper surface of the second heat-conducting column 95 is provided with multiple auxiliary heat-conducting components, and the auxiliary heat-conducting components include an auxiliary heat-conducting plate 912. The auxiliary heat-conducting plate 912 is also made of a material with high thermal conductivity. The upper side of the auxiliary heat-conducting plate 912 slides through the upper surface of the fixed plate 97. The lower surface of the first heat-conducting column 94 is provided with multiple sliding grooves 913. The upper side of the auxiliary heat-conducting plate 912 extends into the sliding groove 913 and slides in the sliding groove 913. When the first heat-conducting column 94 and the second heat-conducting column 95 are displaced, the auxiliary heat-conducting plate 912 slides in the sliding groove 913. The setting of the auxiliary heat-conducting plate 912 increases the contact area between the first heat-conducting column 94 and the second heat-conducting column 95, thereby improving the heat conduction efficiency between the first heat-conducting column 94 and the second heat-conducting column 95.

[0030] In addition, since the rotating column 98 rotates and slides in the rotating groove 99 and the auxiliary heat conducting plate 912 slides in the sliding groove 913, considering that the rotating column 98 directly contacts the inner wall of the rotating groove 99 and the auxiliary heat conducting plate 912 contacts the inner wall of the sliding groove 913, which will cause wear between the two, the contact area and heat conduction resistance between the first heat conducting column 94 are reduced, affecting the heat conduction efficiency between the first heat conducting column 94 and the second heat conducting column 95, the rotating column 98 does not contact the inner wall of the rotating groove 99, and the auxiliary heat conducting plate 912 does not contact the inner wall of the sliding groove 913.

[0031] In response to the above problem, a plurality of first contraction grooves 914 are provided on the outer surface of the auxiliary heat conducting plate 912, and a first contact plate 915 is slidably connected in the first contraction groove 914. The first contact plate 915 is also set to a high thermal conductivity material. An active cavity 916 is provided in the auxiliary heat conducting plate 912, and a first push rod 917 is provided on the surface of the first contact plate 915 close to the active cavity 916. The other end of the first push rod 917 slides through the active cavity 916, and a contact head 918 is provided at one end of the first push rod 917 located in the active cavity 916. A movable sleeve is provided between the contact head 918 and the inner wall of the active cavity 916. A spring 919 is provided on the outer surface of the first push rod 917. When the spring 919 is not squeezed, the spring 919 will form a thrust on the contact head 918, so that the contact head 918 is on the side away from the first contraction groove 914. At the same time, the first push rod 917 pulls the first contact plate 915 to shrink into the first contraction groove 914 and coincide with the first contraction groove 914. A pulling rod 920 is provided on the top wall of the sliding groove 913. The lower end of the pulling rod 920 slides into the active cavity 916. A truncated cone-shaped extrusion block 921 is provided at the lower end of the pulling rod 920. The outer surface of the extrusion block 921 contacts the contact head 918.

[0032] During use, the first heat-conducting column 94 moves upward, while the second heat-conducting column 95 moves downward, and the extrusion block 921 moves upward in the active cavity 916. When the heat-conducting plate 91 moves upward to contact the heat-absorbing plate 5, the lower end of the second heat-conducting column 95 moves out of the bottom of the infrared imaging housing 1, and the inclined surface of the extrusion block 921 contacts and squeezes the contact head 918, so that the first push rod 917 pushes the first contact plate 915 to move out of the first shrinkage groove 914 and contact the inner wall of the sliding groove 913. According to the above structure, after the heat-conducting plate 91 contacts the heat-absorbing plate 5, the first contact plate 915 can be automatically controlled to contact the inner wall of the first shrinkage groove 914, so that the heat of the first heat-conducting column 94 can be transferred to the second heat-conducting column 95 through the auxiliary heat-conducting plate 912.

[0033] A second contraction groove 923 is provided on the inner wall of the rotating groove 99 near the sliding groove 913, and a second contact plate 924 for heat conduction is slidably connected in the second contraction groove 923. The second contact plate 924 is made of the same material as the first contact plate 915. A second push rod 925 is provided on the surface of the second contact plate 924 facing the sliding groove 913. The other end of the second push rod 925 slides into the sliding groove 913 and can contact the first contact plate 915. A first tension spring 922 that is movably sleeved on the outer surface of the second push rod 925 is provided between the second contact plate 924 and the inner wall of the second contraction groove 923.

[0034] When in use, the first contact plate 915 moves out of the first shrinkage groove 914, and the first contact plate 915 contacts the second push rod 925. At this time, the second push rod 925 forms a thrust on the second contact plate 924, so that the second contact plate 924 moves out of the second shrinkage groove 923. At the same time, the first tension spring 922 is stretched until the second contact plate 924 contacts the outer surface of the rotating column 98. The above structure can ensure the heat conduction path between the first heat conducting column 94 and the second heat conducting column 95. At the same time, the extrusion contact method is adopted to increase the contact pressure between the two, thereby further improving the heat conduction efficiency between the first heat conducting column 94 and the second heat conducting column 95.

[0035] The sealing assembly 10 includes a rotating seat 101, which is arranged on a side of the lower surface of the infrared imaging housing 1 near the heat-conducting groove 96. A sealing plate 102 is rotatably connected to the rotating seat 101. A rubber sealing block 103 is provided on the surface of the sealing plate 102 facing the heat-conducting groove 96 to seal the heat-conducting groove 96. The rubber sealing block 103 is made of a rubber material with a high thermal insulation rate (such as sponge rubber, etc.). When the sealing plate 102 rotates to the lower side of the heat-conducting groove 96, the rubber sealing block 103 extends into the heat-conducting groove 96 and seals the heat-conducting groove 96, thereby isolating external heat from entering the infrared imaging housing 1 through the heat-conducting groove 96.

[0036] The sealing plate 102 is provided with a connecting shaft 114 with one end rotating through the rotating seat 101. The end of the connecting shaft 114 outside the rotating seat 101 is sleeved with a worm gear 104. The outer side of the worm gear 104 is meshed with a worm 121. The upper end of the worm 121 is provided with a transmission rod 106. A transmission cavity 105 is opened inside the infrared imaging housing 1 on one side close to the heat conduction groove 96. The upper end of the transmission rod 106 rotates and penetrates into the transmission cavity 105. The upper end of the transmission rod 106 is provided with a bevel gear 107. The top inner wall of the transmission cavity 105 is rotatably connected with a rotating shaft 109. The rotating shaft The outer surface of 109 is also provided with a bevel gear 107, and the two bevel gears 107 are meshed with each other. A gear 110 is provided at one end of the rotating shaft 109 close to the heat conducting groove 96. A connecting groove 111 that is interconnected with the transmission chamber 105 is provided on the inner wall of the heat conducting groove 96. A connecting plate 112 is provided on the outer surface of the top of the second heat conducting column 95. The other side of the connecting plate 112 extends into the transmission chamber 105 through the connecting groove 111 and slides in the connecting groove 111. A tooth plate 113 that meshes with the gear 110 is provided on one side of the connecting plate 112 located in the transmission chamber 105.

[0037] When in use, during the downward displacement of the second heat-conducting column 95, the connecting plate 112 drives the tooth plate 113 to move downward synchronously, the tooth plate 113 synchronously meshes with the transmission gear 110 to rotate, and the transmission rod 106 rotates synchronously under the meshing transmission of the two bevel gears 107. At this time, the worm 121 rotates synchronously with the transmission rod 106, and the worm wheel 104 rotates under the drive of the worm 121, so that the connecting shaft 114 drives the sealing plate 102 to rotate 180 degrees in the counterclockwise direction, and no longer seals the heat-conducting groove 96, and does not cause obstruction to the second heat-conducting column 95. At the same time, due to the sealing plate 10 2 The transmission adopts a worm gear. Since the worm gear has a self-locking effect, there is no need to worry about the sealing plate 102 rotating after rotation, ensuring the stability of the sealing plate 102 after opening. When the second heat-conducting column 95 moves upward and shrinks into the heat-conducting groove 96, the tooth plate 113 moves upward synchronously. When the bottom of the second heat-conducting column 95 moves to be flush with the lower surface of the infrared imaging housing 1, the tooth plate 113 engages with the gear 110 and drives the gear 110 to rotate in the opposite direction, thereby causing the sealing plate 102 to rotate clockwise and block the heat-conducting groove 96 again.

[0038] An inner cavity 115 is provided in the sealing plate 102, and a plurality of foot-operated air pumps 116 are provided on the inner wall of the inner cavity 115 away from the rubber sealing block 103. A plurality of nozzles 117 are inlaid on the surface of the sealing plate 102 close to the outer surface of the rubber sealing block 103. One end of the nozzle 117 passes through the inner cavity 115, and a connecting hose 120 for conveying gas is provided between the nozzle 117 and the foot-operated air pump 116. A push plate 118 is provided on the surface of the foot-operated air pump 116 away from the installation point, and a third push rod 119 is provided on the surface of the push plate 118 facing the foot-operated air pump 116. The other end of the third push rod 119 slides through the outer surface of the sealing plate 102, and a second tension spring 108 movably sleeved on the outer surface of the third push rod 119 is provided between the push plate 118 and the inner wall of the inner cavity 115.

[0039] When the sealing plate 102 rotates almost to 180 degrees, one end of the third push rod 119 passes through the sealing plate 102 and contacts the bottom of the infrared imaging housing 1, so that the third push rod 119 is displaced to one side of the inner cavity 115, so that the push plate 118 stretches the foot-operated air pump 116. During the stretching process of the foot-operated air pump 116, external air is sucked into the foot-operated air pump 116 through the nozzle 117. At the same time, the second tension spring 108 is stressed and stretched. When the sealing plate 102 rotates clockwise, the third push rod 119 loses its extrusion, and the second tension spring 108 pulls the foot-operated air pump 116 to move to In the initial position, the gas in the foot-operated air pump 116 is squeezed and ejected through the nozzle 117. Since the nozzle 117 is arranged on the side close to the outer surface of the rubber sealing block 103, the gas ejected by the nozzle 117 can be blown to the outer surface of the rubber sealing block 103, and the dust attached to the outer surface of the rubber sealing block 103 can be blown away, thereby avoiding dust or particles attached to the surface of the rubber sealing block 103 from entering the heat-conducting groove 96, resulting in a certain gap between the rubber sealing block 103 and the inner wall of the heat-conducting groove 96, thereby affecting the insulation effect against the external temperature.

[0040] According to the above solution, the present invention provides a new technical solution: a method for correcting non-uniformity of infrared images, the specific operation steps are as follows: S1, obtaining the original image output by the imaging device 4 and processed in advance; S2, averaging the values ​​of the pixels in each correction frame in the original image to obtain an average image; S3. For each pixel, calculate the deviation between it and the average image to obtain a correction coefficient; S4, applying the correction coefficient to the original thermal infrared image to correct the value of each pixel; S5. After the correction process, the obtained image should show a more uniform grayscale distribution, reducing the impact of unevenness.

[0041] The above description is merely a preferred embodiment of the present application and an illustration of the technical principles employed. Those skilled in the art should understand that the scope of the invention herein is not limited to technical solutions formed by a specific combination of the aforementioned technical features, but also encompasses other technical solutions formed by any combination of the aforementioned technical features or their equivalents without departing from the inventive concept. For example, a technical solution formed by replacing the aforementioned features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. An infrared image non-uniformity correction device, comprising an infrared imaging housing (1), a base (2) provided at the bottom of the infrared imaging housing (1), an n-shaped frame (3) provided on the lower surface of the infrared imaging housing (1), and an imaging device (4) provided in the infrared imaging housing (1), characterized in that: A heat absorbing plate (5) is provided in the infrared imaging housing (1), and all electronic components of the imaging device (4) located in the infrared imaging housing (1) are integrated and mounted on the heat absorbing plate (5). A support (6) for fixing is provided between the lower surface of the heat absorbing plate (5) and the infrared imaging housing (1). The outer surface of the infrared imaging housing (1) is provided with a heat insulating material, and the heat absorbing plate (5) is made of a material with high thermal conductivity. The bottom of the infrared imaging housing (1) is provided with a heat conducting component (9) for conducting heat from the heat absorbing plate (5) to the outside. The heat conducting component (9) includes a heat conducting plate (91). The heat conducting plate (91) is also made of a material with high thermal conductivity. The heat conducting plate (91) is arranged between the heat absorbing plate (5) and the bottom wall of the infrared imaging housing (1). A plurality of first heat conducting columns (94) are provided on the lower surface of the heat conducting plate (91). The bottom wall of the infrared imaging housing (1) is provided with a plurality of heat conducting grooves (96) extending from its lower surface. The lower end of the first heat conducting column (94) extends into the heat conducting groove (96). The lower surface of the first heat conducting column (94) is provided with a second heat conducting column (95) that can extend downward from the infrared imaging housing (1). The first heat conducting column (94) and the second heat conducting column (95) are also made of a material with high thermal conductivity. The lower surface of the infrared imaging housing (1) is provided with a sealing component (10) for sealing the heat conducting groove (96).

2. The infrared image non-uniformity correction device according to claim 1, characterized in that: An electric push rod (92) is provided on the bottom wall of the infrared imaging housing (1), a temperature sensor (7) for monitoring the temperature change of the imaging device (4) is installed inside the infrared imaging housing (1), a controller for controlling the electric push rod (92) is provided inside the infrared imaging housing (1), the controller is electrically connected to the temperature sensor (7), a rotating plate (93) is hinged between one end of the telescopic rod of the electric push rod (92) and the lower surface of the heat conducting plate (91), an active cooling fan (8) is provided on the lower surface of the horizontal plate of the n-shaped frame (3), and the controller is electrically connected to the active cooling fan (8).

3. The infrared image non-uniformity correction device according to claim 2, characterized in that: The heat conducting groove (96) is provided with a fixed plate (97) located between the first heat conducting column (94) and the second heat conducting column (95), the upper surface of the fixed plate (97) is rotatably connected to the rotating column (98), the lower surface of the first heat conducting column (94) is provided with a rotating groove (99) that is movably sleeved on the outer surface of the rotating column (98), the top wall of the rotating groove (99) is provided with a twisted rod (910), the upper surface of the rotating column (98) is provided with a twisted groove that is spirally sleeved on the outer surface of the twisted rod (910), the fixed plate (97) is provided with a fixed plate (98 ...9), the fixed plate (99) is provided with a fixed plate (99) 7) is rotatably connected to the lower surface of the screw (911), the upper end of the screw (911) rotates through the fixed plate (97) and is connected to the lower surface of the rotating column (98), the upper surface of the second heat-conducting column (95) is provided with a threaded groove that is threadedly sleeved on the outer surface of the screw (911), the outer surface of the second heat-conducting column (95) is fitted with the inner wall of the heat-conducting groove (96), and slides in the heat-conducting groove (96), the rotating column (98), the twisted rod (910) and the screw (911) are all made of a material with high thermal conductivity.

4. The infrared image non-uniformity correction device according to claim 3, characterized in that: The upper surface of the second heat-conducting column (95) is provided with a plurality of auxiliary heat-conducting components, and the auxiliary heat-conducting components include an auxiliary heat-conducting plate (912). The auxiliary heat-conducting plate (912) is also made of a material with high thermal conductivity. The upper side of the auxiliary heat-conducting plate (912) slides through the upper surface of the fixed plate (97). The lower surface of the first heat-conducting column (94) is provided with a plurality of sliding grooves (913). The upper side of the auxiliary heat-conducting plate (912) extends into the sliding groove (913) and slides in the sliding groove (913).

5. The infrared image non-uniformity correction device according to claim 4, characterized in that: The outer surface of the auxiliary heat conducting plate (912) is provided with a plurality of first shrinkage grooves (914), a first contact plate (915) is slidably connected in the first shrinkage grooves (914), and the first contact plate (915) is also set to a material with high thermal conductivity. An active cavity (916) is provided in the auxiliary heat conducting plate (912), and a first push rod (917) is provided on the surface of the first contact plate (915) close to the active cavity (916). The other end of the first push rod (917) slides through the active cavity (916), and a contact head (918) is provided at one end of the first push rod (917) located in the active cavity (916). A spring (919) movably sleeved on the outer surface of the first push rod (917) is provided between the contact head (918) and the inner wall of the movable cavity (916). The first push rod (917) pulls the first contact plate (915) to shrink into the first shrinkage groove (914) and matches the first shrinkage groove (914). A pulling rod (920) is provided on the top wall of the sliding groove (913). The lower end of the pulling rod (920) slides through the movable cavity (916). A truncated cone-shaped extrusion block (921) is provided at the lower end of the pulling rod (920). The outer surface of the extrusion block (921) contacts the contact head (918).

6. The infrared image non-uniformity correction device according to claim 5, characterized in that: A second contraction groove (923) is provided on the inner wall of the rotating groove (99) close to the sliding groove (913), and a second contact plate (924) for heat conduction is slidably connected in the second contraction groove (923). The second contact plate (924) is made of the same material as the first contact plate (915). A second push rod (925) is provided on the surface of the second contact plate (924) facing the sliding groove (913). The other end of the second push rod (925) slides through the sliding groove (913) and can contact the first contact plate (915). A first tension spring (922) movably sleeved on the outer surface of the second push rod (925) is provided between the second contact plate (924) and the inner wall of the second contraction groove (923).

7. The infrared image non-uniformity correction device according to claim 1 or 6, characterized in that: The sealing assembly (10) includes a rotating seat (101), which is arranged on a side of the lower surface of the infrared imaging housing (1) close to the heat-conducting groove (96), and a sealing plate (102) is rotatably connected to the rotating seat (101). A rubber sealing block (103) for sealing the heat-conducting groove (96) is arranged on the surface of the sealing plate (102) facing the heat-conducting groove (96), and the rubber sealing block (103) is made of a rubber material with a high heat insulation rate.

8. The infrared image non-uniformity correction device according to claim 7, characterized in that: The sealing plate (102) is provided with a connecting shaft (114) having one end that rotates and passes through the rotating seat (101), and a worm gear (104) is sleeved on one end of the connecting shaft (114) located outside the rotating seat (101), and a worm (121) is meshedly connected to the outer side of the worm gear (104), and a transmission rod (106) is provided on the upper end of the worm gear (121). A transmission cavity (105) is provided inside the infrared imaging housing (1) on a side close to the heat conduction groove (96), and the upper end of the transmission rod (106) rotates and passes through the transmission cavity (105). A bevel gear (107) is provided on the upper end of the transmission rod (106), and a rotating shaft (109) is rotatably connected to the top inner wall of the transmission cavity (105). The outer surface of the shaft (109) is also provided with a bevel gear (107), and the two bevel gears (107) are meshed with each other. A gear (110) is provided at one end of the rotating shaft (109) close to the heat conduction groove (96), and a connecting groove (111) that is interconnected with the transmission chamber (105) is provided on the inner wall of the heat conduction groove (96). A connecting plate (112) is provided on the outer surface of the top of the second heat conduction column (95), and the other side of the connecting plate (112) extends into the transmission chamber (105) through the connecting groove (111) and slides in the connecting groove (111). A tooth plate (113) that meshes with the gear (110) is provided on one side of the connecting plate (112) located in the transmission chamber (105).

9. The infrared image non-uniformity correction device according to claim 8, characterized in that: The sealing plate (102) is provided with an inner cavity (115), and a plurality of foot-operated air pumps (116) are provided on the inner wall of the inner cavity (115) away from the rubber sealing block (103). A plurality of nozzles (117) are inlaid on the surface of the sealing plate (102) close to the outer surface of the rubber sealing block (103), one end of the nozzle (117) passes through the inner cavity (115), and a connecting hose (120) for conveying gas is provided between the nozzle (117) and the foot-operated air pump (116). A push plate (118) is provided on the surface of the foot-operated air pump (116) away from the installation point, and a third push rod (119) is provided on the surface of the push plate (118) facing the foot-operated air pump (116). The other end of the third push rod (119) slides through the outer surface of the sealing plate (102), and a second tension spring (108) movably sleeved on the outer surface of the third push rod (119) is provided between the push plate (118) and the inner wall of the inner cavity (115).

10. A method for correcting infrared image non-uniformity, based on the infrared image non-uniformity correction device according to any one of claims 1 to 9, characterized in that: Including specific steps: S1, obtaining the original image output by the imaging device (4) and processed in advance; S2, averaging the values ​​of the pixels in each correction frame in the original image to obtain an average image; S3. For each pixel, calculate the deviation between it and the average image to obtain a correction coefficient; S4, applying the correction coefficient to the original thermal infrared image to correct the value of each pixel; S5. After the correction process, the obtained image should show a more uniform grayscale distribution, reducing the impact of unevenness.

Images