Acoustic sensor and electronic device

Abstract

The embodiment of the invention discloses an acoustic sensor and electronic equipment, the acoustic sensor comprises a substrate, a microphone chip, a first ASIC chip, a shell and a waterproof piece, and the substrate is provided with an opening; the microphone chip is arranged on the substrate, the microphone chip is provided with a back cavity, the back cavity is opposite to the opening, and the first ASIC chip is electrically connected with the microphone chip; the shell is connected to the first side of the substrate and at least wraps the microphone chip; the waterproof part is connected to the second side of the base, and a first cavity is defined by the waterproof part and the second side of the base and communicated with the back cavity through the opening. Therefore, the waterproof piece is arranged on the second side of the substrate, the waterproof piece and the substrate define the first cavity, the first cavity is communicated with the back cavity of the microphone chip through the opening in the substrate, and water can be effectively prevented from entering a core area in the acoustic sensor through the waterproof piece.

Description

Technical Field

[0001] The present invention relates to the field of micro-electromechanical technology, and more particularly, to an acoustic sensor and electronic equipment. Background Art

[0002] With the continuous development of electronic technology, acoustic sensors have been widely used in various fields. However, in many practical scenarios, acoustic sensors need to have a certain degree of waterproof performance to prevent moisture from entering the sensor and causing performance degradation or damage. Existing acoustic sensors have shortcomings in waterproof design, making them difficult to meet the requirements of use in complex environments. Summary of the Invention

[0003] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a new technical solution for an acoustic sensor and an electronic device.

[0004] According to one aspect of the present invention, an acoustic sensor is provided.

[0005] The acoustic sensor comprises:

[0006] a base, wherein the base has an opening;

[0007] a microphone chip and a first ASIC chip, wherein the microphone chip is disposed on the substrate, the microphone chip has a back cavity, the back cavity is opposite to the opening, and the first ASIC chip is electrically connected to the microphone chip;

[0008] a housing connected to the first side of the substrate and covering at least the microphone chip;

[0009] A waterproof member is connected to the second side of the base and forms a first cavity with the second side of the base. The first cavity is communicated with the back cavity through the opening.

[0010] Optionally, the height of the first chamber ranges from 10 microns to 50 microns.

[0011] Optionally, a connecting member is further included, and the waterproof member is a waterproof breathable membrane. One side of the connecting member is connected to the second side of the base, and the other side of the connecting member is connected to the waterproof breathable membrane, so that the connecting member, the waterproof breathable membrane and the second side of the base together form the first chamber.

[0012] Optionally, the thickness of the waterproof and breathable membrane is smaller than the height of the first chamber.

[0013] Optionally, the substrate is a flat plate structure, and the second side and the first side are two opposite sides of the substrate;

[0014] Alternatively, the base is in an L-shaped structure, and the second side and the first side are two opposite sides of a long side of the L-shaped structure;

[0015] Alternatively, the base is in a U-shaped structure, and the second side is an open side of the U-shaped structure.

[0016] Optionally, a protective member is further included, wherein the protective member is connected to at least one side of the waterproof member away from the shell, and at least the protective member and the waterproof member form a second chamber.

[0017] Optionally, the protective member is connected to the waterproof member and the base, so that the protective member, the waterproof member and the base together enclose the second chamber.

[0018] Optionally, along the height direction of the acoustic sensor, the protective member is not lower than the lowest end of the base.

[0019] Optionally, the protective member is flush with the lowest end of the base.

[0020] Optionally, a pad is further included, and the pad is arranged on the substrate.

[0021] Optionally, it further includes a pressure sensing chip and a second ASIC chip, the pressure sensing chip is arranged on the substrate, and the second ASIC chip is electrically connected to the pressure sensing chip.

[0022] Optionally, the first ASIC chip and / or the second ASIC chip are arranged in the substrate.

[0023] According to another aspect of the present invention, an electronic device is provided, comprising the above-mentioned acoustic sensor.

[0024] One technical effect of the embodiments of the present disclosure is:

[0025] The acoustic sensor includes a base, a microphone chip, a first ASIC chip, a shell and a waterproof component, wherein the base has an opening; the microphone chip is arranged on the base, the microphone chip has a back cavity, the back cavity is opposite to the opening, and the first ASIC chip is electrically connected to the microphone chip; the shell is connected to the first side of the base and at least covers the microphone chip; the waterproof component is connected to the second side of the base and forms a first cavity with the second side of the base, and the first cavity is connected to the back cavity through the opening.

[0026] Thus, by providing a waterproof component on the second side of the substrate and enclosing a first chamber with the substrate, the first chamber is connected to the back cavity of the microphone chip through an opening in the substrate. The waterproof component can effectively prevent moisture from entering the core area inside the acoustic sensor. Moreover, the connection between the waterproof component, the opening of the substrate, and the back cavity of the microphone chip can form a closed acoustic channel. While ensuring sound conduction efficiency, it also gives the acoustic sensor better waterproof capabilities, significantly improving the reliability of the acoustic sensor in humid, rainy, or underwater environments. In addition, the acoustic sensor assembly process is simple, making it easy to ensure consistency in mass production.

[0027] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0029] Figure 1 is a schematic diagram of an acoustic sensor according to an embodiment of the present disclosure;

[0030] Figure 2 is a schematic diagram of another acoustic sensor according to an embodiment of the present disclosure;

[0031] Figure 3 is a schematic diagram of yet another acoustic sensor according to an embodiment of the present disclosure.

[0032] Description of reference numerals:

[0033] 1. Base; 11. Opening; 2. Microphone chip; 21. Back cavity; 3. First ASIC chip; 4. Shell; 5. Waterproof part; 51. First chamber; 6. Connector; 7. Protective part; 71. Second chamber; 8. Pressure sensor chip; 9. Second ASIC chip; 10. Pad. DETAILED DESCRIPTION

[0034] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0035] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0036] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0037] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0038] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0039] An embodiment of the present invention provides an acoustic sensor, which may be a MEMS microphone or a combined sensor.

[0040] like Figures 1 to 3 As shown, the acoustic sensor provided by the embodiment of the present invention includes:

[0041] A base 1, wherein the base 1 is provided with an opening 11;

[0042] a microphone chip 2 and a first ASIC chip 3, wherein the microphone chip 2 is disposed on the substrate 1 and has a back cavity 21, the back cavity 21 being opposite to the opening 11, and the first ASIC chip 3 is electrically connected to the microphone chip 2;

[0043] a housing 4 connected to the first side of the substrate 1 and covering at least the microphone chip 2;

[0044] The waterproof member 5 is connected to the second side of the base 1 and forms a first cavity 51 with the second side of the base 1 . The first cavity 51 is connected to the back cavity 21 through the opening 11 .

[0045] Specifically, the substrate 1 can be an FPC board (Flexible Printed Circuit board) or a PCB board (Printed Circuit Board). The substrate 1 can be made of silicon material or other materials suitable for MEMS (Micro-Electro-Mechanical Systems) technology. The substrate 1 has sufficient mechanical strength so that the substrate 1 can provide reliable support for the electronic components thereon. On the substrate 1, an opening 11 can be opened by precision processing techniques such as laser drilling or wet etching. The opening 11 is used to subsequently establish communication between the back cavity 21 of the microphone chip 2 and the first chamber 51. According to the actual design, the cross-section of the opening 11 can be circular, elliptical, rectangular or other shapes.

[0046] like Figures 1 to 3As shown, the microphone chip 2 can be fixed on the substrate 1 by bonding, welding or other means to ensure that the back cavity 21 of the microphone chip 2 is aligned with and connected to the opening 11, thereby ensuring the acoustic performance of the microphone chip 2.

[0047] In addition, opening an opening 11 on the base 1 and directly connecting it with the back cavity 21 of the microphone chip 2 can also improve the gas exchange and pressure balance in the back cavity 21, reducing the impact of gas damping or pressure fluctuations on the performance of the microphone chip 2, so that the acoustic sensor can still maintain high stability and reliability under complex environmental conditions.

[0048] Among them, a first ASIC chip 3 (Application Specific Integrated Circuit) can be set on the substrate 1, or a groove can be dug in the substrate 1 and the first ASIC chip 3 can be buried, and the first ASIC chip 3 and the microphone chip 2 can be connected to form a signal connection through gold wires, solder balls, etc., so that the first ASIC chip 3 can process and amplify the electrical signal output by the microphone chip 2, thereby facilitating subsequent circuit identification and analysis.

[0049] like Figures 1 to 3 As shown, housing 4 can be made of materials such as metal, ceramic, or plastic, and has good sealing and mechanical strength. Housing 4 and the first side of substrate 1 form a sealed chamber, and microphone chip 2 is located within the sealed chamber. Housing 4 protects microphone chip 2 and other components, ensuring the normal operation of microphone chip 2.

[0050] like Figures 1 to 3 As shown, the waterproof component 5 is connected to the second side of the substrate 1 and forms a first cavity 51 with the second side of the substrate 1. The first cavity 51 is connected to the back cavity 21 of the microphone chip 2 through the opening 11 on the substrate 1. The waterproof component 5 can be made of a waterproof and breathable material, such as a waterproof breathable membrane, a waterproof breathable shell, etc., to ensure that only sound can pass through and enter the first cavity 51 while moisture cannot enter the first cavity 51, thereby protecting the microphone chip 2 from moisture while ensuring the acoustic performance of the microphone chip 2, and preventing water stains from entering the acoustic sensor, thereby ensuring the reliability of the acoustic sensor and extending the service life of the acoustic sensor.

[0051] Thus, by providing a waterproof member 5 on the second side of the base 1 and enclosing a first chamber 51 with the base 1, the first chamber 51 is connected to the back cavity 21 of the microphone chip 2 through the opening 11 in the base 1. The waterproof member 5 can effectively prevent moisture from entering the core area of ​​the acoustic sensor. Furthermore, the connection between the waterproof member 5, the opening 11 in the base 1, and the back cavity 21 of the microphone chip 2 forms a closed acoustic channel. This ensures sound conduction efficiency while providing the acoustic sensor with improved waterproof capabilities, significantly improving its reliability in humid, rainy, or underwater environments. Furthermore, the acoustic sensor assembly process is simple, facilitating consistent mass production.

[0052] When a sound signal reaches the acoustic sensor, it first passes through the waterproof member 5 and enters the first chamber 51. Then, it passes through the opening 11 in the base 1 and enters the back cavity 21 of the microphone chip 2, where it acts on the microphone chip 2. Microphone chip 2 senses and converts the sound signal into an electrical signal, which is then output to the electrically connected first ASIC chip 3 for processing and amplification. Ultimately, the processed electrical signal is output to subsequent circuitry for identification and analysis.

[0053] Among them, the back cavity 21 of the microphone chip 2 is directly opposite to the opening 11 on the substrate 1, and can form an unobstructed acoustic path in conjunction with the first cavity 51, while also avoiding the acoustic impedance changes that may be caused by traditional waterproof structures, effectively ensuring the fidelity of audio collection.

[0054] In addition, the connection between the shell 4 and the first side of the base 1 can also adopt a waterproof sealing design, such as providing a waterproof sealing ring or applying waterproof glue, etc., which can also prevent moisture from entering the interior of the acoustic sensor through the connection between the two.

[0055] In the process of assembling the acoustic sensor in an electronic device, the waterproof component 5 needs to be embedded in the sound inlet hole of the electronic device casing, so that the casing of the electronic device can be used to cover a part of the waterproof component 5 to close the corresponding sound inlet channel, ensuring that the sound can only pass through the waterproof component 5 and the first chamber 51 from the sound inlet hole and enter the back cavity 21 of the microphone chip 2, thereby ensuring the uniqueness and certainty of the sound input direction.

[0056] like Figures 1 to 3 As shown, the first chamber 51 is connected to the back chamber 21 through the opening 11, so that the first chamber 51, the opening 11 and the back chamber 21 together form the front chamber of the microphone chip 2. The housing 4 is sealed to the first side of the base 1 and forms the back chamber of the microphone chip 2. The size of the housing 4 can be adjusted as needed, thereby adjusting the size of the back chamber of the microphone chip 2, thereby adjusting the signal-to-noise ratio of the microphone chip 2 and its ability to pick up external signals, and thus adjusting the acoustic performance of the acoustic sensor.

[0057] Optionally, the height of the first chamber 51 ranges from 10 microns to 50 microns.

[0058] like Figures 1 to 3 As shown, a first gap is defined between the waterproof member 5 and the base 1, the height of which is also the height of the first chamber 51. Controlling the height of the first gap, i.e., the height of the first chamber 51, ensures that, under the action of sound, i.e., sound waves, the waterproof member 5 can mobilize the air nearby and generate vibrations. This vibration creates a sound pressure difference between the inside and outside of the waterproof member 5, thereby driving the diaphragm of the microphone chip 2 to vibrate through the first chamber 51, the opening 11, and the back cavity 21 of the microphone chip 2, thereby achieving reliable transmission and perception of sound signals. Furthermore, the height of the first chamber 51 can also affect the size of the front cavity of the microphone chip 2 formed by the first chamber 51, the opening 11, and the back cavity 21, thereby optimizing the acoustic performance of the acoustic sensor.

[0059] Optionally, a connecting member 6 is further included, and the waterproof member 5 is a waterproof breathable membrane. One side of the connecting member 6 is connected to the second side of the base 1, and the other side of the connecting member 6 is connected to the waterproof breathable membrane, so that the connecting member 6, the waterproof breathable membrane and the second side of the base 1 together form the first chamber 51.

[0060] like Figures 1 to 3 As shown, the waterproof member 5 can be configured as a waterproof breathable membrane, allowing external sound signals or sound waves to pass through the waterproof breathable membrane into the first chamber 51 and act on the microphone chip 2 through the opening 11. In this case, the connector 6 is used to connect the waterproof member 5 and the base 1 to ensure that the waterproof member 5 is fixed.

[0061] The connecting member 6 may be an adhesive having a sufficient thickness to attach the waterproof member 5 to the second side of the substrate 1 , thereby reducing the difficulty of assembling the acoustic sensor.

[0062] The waterproof and breathable membrane can be made of polytetrafluoroethylene material, and the waterproof and breathable properties of the waterproof and breathable membrane can be ensured by utilizing the waterproof and breathable properties of the polytetrafluoroethylene material.

[0063] Optionally, the thickness of the waterproof breathable membrane is less than the height of the first chamber 51. In other words, by preventing the waterproof breathable membrane from being too thick, this can, on the one hand, prevent the difficulty in mobilizing the surrounding air to form a sound pressure differential, thereby ensuring the acoustic performance of the acoustic sensor. It can also prevent the overall thickness of the acoustic sensor from increasing due to an excessively thick waterproof breathable membrane, thereby facilitating the development of a lighter and thinner acoustic sensor.

[0064] Alternatively, the waterproof member 5 may be configured as a waterproof and breathable shell, which may be bonded or welded to the second side of the base 1 so that the waterproof and breathable shell and the second side of the base 1 enclose a first chamber 51. In this case, the connector 6 is no longer required, thereby reducing assembly cost and difficulty.

[0065] In one embodiment, the waterproof and breathable shell can be made of polytetrafluoroethylene material, and the waterproof and breathable properties of the waterproof and breathable shell can be ensured by utilizing the waterproof and breathable properties of the polytetrafluoroethylene material.

[0066] In another embodiment, a waterproof and breathable shell may be provided that includes a base layer and a conductive reinforcement layer embedded in the base layer, wherein the base layer is a polytetrafluoroethylene layer, and the conductive reinforcement layer includes a conductive metal layer and / or a conductive material filling layer, so that while the conductive reinforcement layer is used to support the base layer to improve the overall strength of the waterproof and breathable shell, the conductive material in the conductive reinforcement layer can also be used to ensure the conductive performance of the waterproof and breathable shell, thereby avoiding abnormalities such as electrostatic damage.

[0067] The conductive metal layer can be made of other conductive metals such as stainless steel and iron. The conductive material filling layer includes a base material and a conductive filler filled in the base material. Adding a certain proportion of conductive filler to a non-conductive base material can make the conductive material filling layer conductive, thereby imparting conductive properties. The base material can be made of silicone, plastic, etc., and the conductive filler can be metal flakes, metal powder, metal fibers, etc.

[0068] Optionally, the base 1 is a flat plate structure, and the second side and the first side are two opposite sides of the base 1;

[0069] Alternatively, the base 1 is in an L-shaped structure, and the second side and the first side are two opposite sides of the long side of the L-shaped structure;

[0070] Alternatively, the base 1 is in a U-shaped structure, and the second side is an open side of the U-shaped structure.

[0071] like Figure 1 As shown, the substrate 1 can be a flat plate structure, and its molding process is simple and convenient. In this case, the second side and the first side are two opposite sides of the substrate 1, for example Figure 1 On the upper and lower sides, the shell 4 is sealed to the first side of the base 1, and the waterproof member 5 is sealed to the second side of the base 1, thereby forming a sealed acoustic sensor to ensure its perception sensitivity.

[0072] like Figure 2 As shown, the base 1 can also be in an L-shaped structure, with the second side and the first side being two opposite sides of the long side of the L-shaped structure. Figure 2 The upper side of the long side of the middle substrate 1, and the second side is Figure 2The lower side of the long side of the middle base 1 can be used to conveniently connect the waterproof component 5, while also utilizing the short side of the L-shaped structure to protect and strengthen the connection between the waterproof component 5 and one side of the base 1, thereby ensuring the structural reliability of the acoustic sensor.

[0073] like Figure 3 As shown, the base 1 can also be in a U-shaped structure, with the second side being the open side of the U-shaped structure, i.e. Figure 3 The first side is the sealing side of the U-shaped structure, i.e. Figure 3 On the upper middle side, the open side wall of the U-shaped structure can be used to position and protect the connection of the waterproof part 5, thereby simplifying the assembly process while improving the connection reliability of the connection between the waterproof part 5 and the base 1, thereby ensuring the structural reliability of the acoustic sensor.

[0074] Optionally, a protective member 7 is further included, wherein the protective member 7 is connected to at least one side of the waterproof member 5 away from the housing 4 , and at least the protective member 7 and the waterproof member 5 enclose a second chamber 71 .

[0075] like Figures 1 to 3 As shown, the shell 4 is connected to the first side of the base 1 and forms a sealed chamber with the first side of the base 1, and the protective member 7 is connected to the side of the waterproof member 5 away from the shell 4 and forms a second chamber 71 with the waterproof member 5, so that the acoustic sensor can be sealed from both sides, providing a stable internal environment, preventing water stains, dust and other foreign matter from entering the acoustic sensor, and forming reliable protection for the electronic components in the acoustic sensor, thereby extending the service life of the acoustic sensor and protecting the microphone chip 2 from damage such as mechanical impact or chemical corrosion.

[0076] Among them, the protective part 7 and the waterproof part 5 are arranged to form a second chamber 71, that is, there is a second gap between the protective part 7 and the waterproof part 5. The protective part 7 will not be directly attached to the waterproof part 5, which can avoid the attachment of the protective part 7 affecting the vibration of the waterproof part 5, thereby causing the microphone chip 2 to be difficult to perceive the sound signal.

[0077] The height of the second chamber 71 can be set to be the same as that of the first chamber 51 to form the same vibration space on both sides of the waterproof member 5, which can also simplify the production difficulty of the acoustic sensor.

[0078] Optionally, the protective member 7 is a protective net, which can prevent water stains, dust and other foreign objects from entering the acoustic sensor while also protecting the inner waterproof member 5, so as to reduce the risk of damage to the waterproof member 5, thereby ensuring the reliability of the waterproof performance of the acoustic sensor.

[0079] Optionally, the protective member 7 is connected to the waterproof member 5 and the base 1 , so that the protective member 7 , the waterproof member 5 and the base 1 together enclose the second chamber 71 .

[0080] like Figure 1 As shown, the base 1 is a flat plate structure, and the protective member 7 can be connected to the side of the waterproof member 5 away from the base 1 through a connecting structure, so as to form a sealed protection for the acoustic sensor from the bottom side.

[0081] like Figure 2 As shown, the base 1 has an L-shaped structure, and one side of the protective member 7 can be connected to the waterproof member 5 and the short side of the base 1 through a connecting structure, and the other side of the protective member 7 can be connected to the waterproof member 5 through a connecting structure. In this way, the protective member 7 can be used to form a sealing protection for the acoustic sensor from the bottom side, and the short side of the base 1 can also be used to form a seal and protection for the connection between the protective member 7, thereby ensuring the structural reliability of the acoustic sensor.

[0082] The protective member 7 may be arranged flush with the lowest end of the short side of the base 1 of the L-shaped structure, which can ensure the sealing effect while improving the flatness of the acoustic sensor.

[0083] like Figure 3 As shown, the base 1 has a U-shaped structure, and one side of the protective member 7 can be connected to the waterproof member 5 and the inner side of the vertical section of the base 1 through a connecting structure, and the other side of the protective member 7 can be connected to the waterproof member 5 and the inner side of the vertical section of the base 1 through a connecting structure. In this way, the protective member 7 can be used to form a sealing protection for the acoustic sensor from the bottom side, and the two vertical sections of the U-shaped base 1 can also be used to form a seal and protection for the connection between the protective member 7, thereby ensuring the structural reliability of the acoustic sensor.

[0084] The protective member 7 may be arranged flush with the lowest end of the vertical section of the base 1 of the U-shaped structure, thereby ensuring a sealing effect while also improving the flatness of the acoustic sensor.

[0085] Optionally, along the height direction of the acoustic sensor, the protective member 7 is not lower than the lowest end of the base 1. That is, the protective member 7 is flush with or higher than the lowest end of the base 1, which can avoid increasing the thickness of the acoustic sensor due to the provision of the protective member 7.

[0086] Optionally, the protective member 7 is flush with the lowest end of the base 1 , which can ensure the sealing effect while improving the flatness of the acoustic sensor.

[0087] Optionally, a pad 10 is further included, and the pad 10 is provided on the substrate 1 .

[0088] Specifically, pads 10 are provided on substrate 1 and electrically connected to substrate 1 by welding, crimping, conductive adhesive bonding, or the like, thereby forming connection points between the electronic component and substrate 1. When substrate 1 is formed of an FPC board, substrate 1 can be wound around the bottom and attached to the housing of an electronic device, thereby saving internal space in the electronic device and facilitating the installation and fixation of the acoustic sensor, thereby increasing assembly flexibility.

[0089] like Figure 1 As shown, the substrate 1 is a flat plate structure, and the pad 10 can be set on the first side of the substrate 1; Figure 2 As shown, the substrate 1 is an L-shaped structure, and the pad 10 can be arranged on the first side of the substrate 1 or the lower side of the short side of the L-shaped structure; Figure 3 As shown, the substrate 1 has a U-shaped structure, and the pad 10 can be set on the first side of the substrate 1 or on the lower side of the vertical section of the U-shaped structure. The position of the pad 10 can be reasonably arranged according to actual needs, which facilitates the conduction between the pad 10 and the external circuit, shortens the wiring length, and expands the adaptability of the acoustic sensor.

[0090] Optionally, it further includes a pressure sensing chip 8 and a second ASIC chip 9 , wherein the pressure sensing chip 8 is disposed on the substrate 1 , and the second ASIC chip 9 is electrically connected to the pressure sensing chip 8 .

[0091] like Figures 1 to 3 As shown, a second ASIC chip 9 (Application Specific Integrated Circuit) can be set on the substrate 1, or a groove can be dug in the substrate 1 and the second ASIC chip 9 can be buried, and the second ASIC chip 9 and the pressure sensor chip 8 can be connected to each other by gold wires, solder balls, etc., so that the second ASIC chip 9 can process and amplify the electrical signal output by the pressure sensor chip 8, thereby facilitating identification and analysis by subsequent circuits.

[0092] Optionally, the first ASIC chip 3 and / or the second ASIC chip 9 are disposed within the substrate 1. That is, a groove may be dug within the substrate 1 and the first ASIC chip 3 and the second ASIC chip 9 embedded therein, thereby reducing the overall thickness of the acoustic sensor and the space occupied by the surface of the substrate 1, thereby facilitating its lightweight, thin, and miniaturized development.

[0093] The present invention also provides an electronic device comprising the above-mentioned acoustic sensor, wherein the electronic device includes but is not limited to a mobile phone, a tablet computer, and a computer.

[0094] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0095] Although some specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It should be understood by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. An acoustic sensor, characterized in that: include: A base (1), wherein the base (1) is provided with an opening (11); A microphone chip (2) and a first ASIC chip (3), wherein the microphone chip (2) is provided on the substrate (1), the microphone chip (2) has a back cavity (21), the back cavity (21) is opposite to the opening (11), and the first ASIC chip (3) is electrically connected to the microphone chip (2); a housing (4), the housing (4) being connected to the first side of the substrate (1) and covering at least the microphone chip (2); A waterproof member (5), the waterproof member (5) is connected to the second side of the base (1) and forms a first chamber (51) with the second side of the base (1), and the first chamber (51) is communicated with the back chamber (21) through the opening (11).

2. The acoustic sensor according to claim 1, wherein The height of the first chamber (51) ranges from 10 microns to 50 microns.

3. The acoustic sensor according to claim 1, wherein The invention also includes a connecting member (6), wherein the waterproof member (5) is a waterproof breathable membrane, one side of the connecting member (6) is connected to the second side of the base (1), and the other side of the connecting member (6) is connected to the waterproof breathable membrane, so that the connecting member (6), the waterproof breathable membrane and the second side of the base (1) together form the first chamber (51).

4. The acoustic sensor according to claim 3, characterized in that The thickness of the waterproof and breathable membrane is smaller than the height of the first chamber (51).

5. The acoustic sensor according to claim 1, wherein The base (1) is a flat plate structure, and the second side and the first side are two opposite sides of the base (1); Alternatively, the base (1) is in an L-shaped structure, and the second side and the first side are two opposite sides of the long side of the L-shaped structure; Alternatively, the base (1) is in a U-shaped structure, and the second side is an open side of the U-shaped structure.

6. The acoustic sensor according to claim 5, characterized in that It also includes a protective member (7), which is connected to at least one side of the waterproof member (5) away from the housing (4), and at least the protective member (7) and the waterproof member (5) enclose a second chamber (71).

7. The acoustic sensor according to claim 6, characterized in that The protective member (7) is connected to the waterproof member (5) and the base (1), so that the protective member (7), the waterproof member (5) and the base (1) together enclose the second chamber (71).

8. The acoustic sensor according to claim 7, characterized in that Along the height direction of the acoustic sensor, the protective member (7) is not lower than the lowest end of the base (1).

9. The acoustic sensor according to claim 8, characterized in that The protective member (7) is flush with the lowest end of the base (1).

10. The acoustic sensor according to claim 1, wherein It also includes a soldering pad (10), which is arranged on the substrate (1).

11. The acoustic sensor according to claim 1, wherein It also includes a pressure sensing chip (8) and a second ASIC chip (9), wherein the pressure sensing chip (8) is arranged on the substrate (1), and the second ASIC chip (9) is electrically connected to the pressure sensing chip (8).

12. The acoustic sensor according to claim 11, characterized in that The first ASIC chip (3) and / or the second ASIC chip (9) are arranged in the substrate (1).

13. An electronic device, characterized in that: The acoustic sensor comprises the acoustic sensor according to any one of claims 1 to 12.

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