Vibration sensor and electronic device

Abstract

The invention discloses a vibration sensor and electronic equipment, the vibration sensor comprises a substrate, a shell, a pole plate and a vibration part, and the substrate and the shell are connected and define a containing cavity; the polar plate is arranged in the containing cavity, the vibration part is arranged in the containing cavity and is opposite to the polar plate in position, the vibration part comprises a vibrating diaphragm and a mass block, and the mass block is connected to the side, close to the polar plate, of the vibrating diaphragm. And the mass block, the polar plate and the first gap between the mass block and the polar plate jointly form a parallel plate capacitor. Thus, in the process that the vibrating diaphragm drives the mass block to move, the mass block and the polar plate can be always kept parallel, and then the consistency and uniformity of the capacitance value variation of the vibration sensor are ensured. Therefore, the consistency of the first gap formed between the vibration part and the polar plate in the vibration process can be ensured, and the detection sensitivity and the detection precision of the vibration sensor can be ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and more particularly, to a vibration sensor and an electronic device. Background Art

[0002] A vibration sensor uses the air flow generated by the vibration of a pickup diaphragm to detect vibration signals. Existing vibration sensors typically consist of a vibrating unit, a support assembly, and a microphone assembly. The vibrating unit is used to pick up external vibration signals, while the support assembly serves as a supporting structure for the microphone assembly. The microphone assembly converts the airflow changes generated by the vibrating unit into electrical signals, thereby sensing the vibration signals.

[0003] The vibrating element consists of a diaphragm, a mass, and a vibrating ring. When the diaphragm drives the mass up and down, the diaphragm inside the vibrating ring does not vibrate uniformly. Specifically, the diaphragm portion closer to the vibrating ring has a smaller amplitude, while the diaphragm portion closer to the mass has a larger amplitude. This difference in diaphragm amplitude directly leads to non-uniform capacitance variation. In particular, the diaphragm portion closer to the vibrating ring experiences a smaller amplitude, resulting in a smaller capacitance change. This, in turn, reduces the sensitivity and measurement accuracy of the vibration sensor, limiting its application in high-precision vibration detection. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a new technical solution for a vibration sensor and an electronic device.

[0005] According to one aspect of the present invention, a vibration sensor is provided. The vibration sensor comprises:

[0006] A substrate and a shell, wherein the substrate and the shell are connected to form a receiving chamber;

[0007] a plate, the plate being disposed in the accommodation chamber;

[0008] A vibration part is arranged in the accommodating chamber and is opposite to the electrode. The vibration part includes a diaphragm and a mass block. The mass block is connected to the side of the diaphragm close to the electrode, so that the mass block, the electrode and the first gap between the two together form a parallel plate capacitor.

[0009] Optionally, a side of the mass block facing the electrode plate is a first surface, a side of the electrode plate facing the mass block is a second surface, and the first surface is parallel to the second surface.

[0010] Optionally, the circumferential dimension of the mass block varies along a direction from the pole plate to the vibration portion.

[0011] Optionally, the circumferential size of the mass block gradually decreases along the direction from the pole plate to the vibration part.

[0012] Optionally, the vibration part has a pressure equalizing hole, and the pressure equalizing hole passes through the vibration membrane and the mass block.

[0013] Optionally, a support ring is further included, which is arranged in the accommodating chamber. Along the height direction of the vibration sensor, the cross-section of the support ring is L-shaped, and the diaphragm or the electrode plate is connected to the bottom wall of the support ring.

[0014] Optionally, the pole plate is connected to the bottom wall of the support ring, and the vibration part further includes a vibration ring, one side of the vibration ring is connected to the shell, and the other side of the vibration ring is connected to the vibration membrane.

[0015] Optionally, the diaphragm is connected to the bottom wall of the support ring, and the electrode plate is provided on a side of the shell close to the mass block.

[0016] Optionally, a connecting ring is further included, one side of the connecting ring is connected to the substrate, and the other side of the connecting ring is connected to the diaphragm or the electrode plate, so that the substrate and the parallel plate capacitor are electrically connected.

[0017] Optionally, along the height direction of the vibration sensor, there is a second gap between the support ring and the substrate.

[0018] Optionally, it further includes a device portion and a lead-out portion, wherein the device portion is provided on the substrate and located in the accommodating chamber, and the lead-out portion is provided on the substrate and extends out of the accommodating chamber.

[0019] According to another aspect of the present invention, an electronic device is provided, comprising the above-mentioned vibration sensor.

[0020] One technical effect of the present invention is that the vibration sensor includes a substrate, a shell, a pole plate and a vibration part, the substrate is connected to the shell and forms a accommodating chamber; the pole plate is arranged in the accommodating chamber, the vibration part is arranged in the accommodating chamber and is opposite to the pole plate, the vibration part includes a diaphragm and a mass block, the mass block is connected to the side of the diaphragm close to the pole plate, so that the mass block, the pole plate and the first gap between the two together form a parallel plate capacitor.

[0021] As a result, when the diaphragm drives the mass, the mass and the electrode plate remain parallel, ensuring the consistency and uniformity of the capacitance change of the vibration sensor. This ensures the consistency of the first gap formed between the vibrating part and the electrode plate during vibration, avoiding the impact of inconsistent diaphragm amplitude on capacitance change during conventional vibration, thereby maintaining the detection sensitivity and accuracy of the vibration sensor.

[0022] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0024] Figure 1 is a cross-sectional view of a vibration sensor according to an embodiment of the present invention;

[0025] Figure 2 is a cross-sectional view of another vibration sensor according to an embodiment of the present invention;

[0026] Figure 3 is a cross-sectional view of yet another vibration sensor according to an embodiment of the present invention;

[0027] Figure 4 is a cross-sectional view of another vibration sensor according to an embodiment of the present invention;

[0028] Figure 5 is a motion schematic diagram of a mass block according to an embodiment of the present invention;

[0029] Figure 6 is another motion schematic diagram of a mass block according to an embodiment of the present invention;

[0030] Figure 7 is a top view of a vibration sensor according to an embodiment of the present invention;

[0031] Figure 8 is a top view of another vibration sensor according to an embodiment of the present invention;

[0032] Figure 9 FIG. 4 is a top view of another vibration sensor according to an embodiment of the present invention.

[0033] Description of reference numerals:

[0034] 1. Substrate; 2. Shell; 3. Plate; 4. Vibration part; 41. Diaphragm; 42. Mass block; 43. Vibration ring; 44. Pressure equalizing hole; 5. Support ring; 6. Connecting ring; 7. Device part; 8. Lead-out part. DETAILED DESCRIPTION

[0035] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0036] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0037] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0038] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0039] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0040] According to one aspect of the present invention, a vibration sensor is provided, such as a bone voiceprint sensor. The bone voiceprint sensor can utilize the slight vibrations of the bones of the head and neck caused by speaking to collect sound signals and convert them into electrical signals.

[0041] like Figures 1 to 4 As shown, the vibration sensor provided by the present invention includes:

[0042] A substrate 1 and a shell 2, wherein the substrate 1 is connected to the shell 2 and encloses a receiving chamber;

[0043] A plate 3, the plate 3 being arranged in the accommodation chamber;

[0044] The vibration part 4 is arranged in the accommodating chamber and is opposite to the electrode 3. The vibration part 4 includes a diaphragm 41 and a mass block 42. The mass block 42 is connected to the side of the diaphragm 41 close to the electrode 3, so that the mass block 42, the electrode 3 and the first gap between the two together form a parallel plate capacitor.

[0045] like Figures 1 to 4As shown, the substrate 1 and the shell 2 together constitute the outer shell structure of the vibration sensor. The two can be connected together by welding, bonding and other processes to form a closed accommodating chamber. Other structures such as the vibration part 4, the electrode plate 3, the device part 7 can be set inside the accommodating chamber. The closed accommodating chamber structure can isolate the influence of the external environment such as humidity, temperature, dust, etc. on the core components of the vibration sensor. Among them, the material of the substrate 1 and the shell 2 can be selected from metal, ceramic or plastic, etc., and the specific selection is made according to actual needs.

[0046] The substrate 1 may be a PCB (Printed Circuit Board), the device portion 7 and the lead portion 8 are formed on the substrate 1, and the substrate 1, the device portion 7 and the lead portion 8 together form a PCB assembly.

[0047] The electrode plate 3 is disposed within the housing chamber. For example, the electrode plate 3 can be disposed at the bottom, middle, or other locations of the housing 2 to accommodate different locations of the vibrating portion 4. The electrode plate 3 can be made of a metal material, such as copper or aluminum, that exhibits good electrical conductivity. The shape and size of the electrode plate 3 can be designed based on actual needs and is typically flat to form an effective parallel plate capacitor structure with the vibrating portion 4.

[0048] The vibration part 4 is also disposed in the receiving chamber and is opposite to the electrode plate 3. The vibration part 4 mainly includes a diaphragm 41 and a mass block 42.

[0049] The diaphragm 41, as the supporting structure of the vibration part 4, has a certain elasticity and flexibility, and can be deformed when subjected to external vibration. The material of the diaphragm 41 can be selected from materials such as silicon and polyimide, which have good mechanical properties and stability.

[0050] Connecting mass block 42 to diaphragm 41 increases the mass of vibrating portion 4, thereby improving the detection sensitivity of the vibration sensor and enhancing its responsiveness to small vibrations. Mass block 42 can be made of a metal material, such as tungsten or molybdenum, which has high density and good electrical conductivity. Mass block 42 and diaphragm 41 can be connected by bonding, welding, or other processes.

[0051] like Figures 1 to 4 As shown, the mass block 42 is connected to the side of the diaphragm 41 close to the plate 3, that is, the mass block 42 is opposite to the plate 3, so that the mass block 42, the plate 3 and the first gap therebetween can form a parallel plate capacitor.

[0052] In the initial state, a certain first gap is maintained between the mass block 42 and the electrode plate 3, and the parallel plate capacitor has a certain initial capacitance. When external vibration acts on the vibration sensor, the diaphragm 41 can deform and drive the mass block 42 to move, thereby changing the first gap between the mass block 42 and the electrode plate 3, and thus causing the capacitance of the parallel plate capacitor to change. By detecting the change in the capacitance of the parallel plate capacitor, information about the external vibration can be indirectly obtained. For example, the parallel plate capacitor can be connected to a detection circuit. When the capacitance changes, the detection circuit will output a corresponding electrical signal, which can reflect the characteristics of the external vibration.

[0053] like Figure 5 and Figure 6 As shown, the mass 42 is connected to the side of the diaphragm 41 near the electrode 3, so that when the diaphragm 41 drives the mass 42 to move, the mass 42 and the electrode 3 can always remain parallel, thereby ensuring the consistency and uniformity of the change in the capacitance value of the vibration sensor. In this way, the consistency of the first gap formed between the vibrating part 4 and the electrode 3 during vibration is guaranteed, avoiding the influence of the inconsistent amplitude of the diaphragm 41 on the change in capacitance value when the vibrating part 4 vibrates in the conventional way, thereby ensuring the detection sensitivity and detection accuracy of the vibration sensor.

[0054] The diaphragm 41 and the mass block 42 can be formed by an integrated molding process. The integrated design of the diaphragm 41 and the mass block 42 reduces mechanical connection points and reduces mechanical noise caused by vibration.

[0055] The mass block 42 may be arranged to be symmetrically distributed relative to the diaphragm 41 . The symmetrical distribution design makes the stress distribution of the diaphragm 41 more uniform during the vibration process, thereby avoiding fatigue failure caused by local stress concentration.

[0056] Optionally, the side of the mass block 42 facing the electrode plate 3 is a first surface, and the side of the electrode plate 3 facing the mass block 42 is a second surface, and the first surface is parallel to the second surface.

[0057] like Figure 5 and Figure 6 As shown, when the first surface of mass block 42 remains parallel to the second surface of electrode plate 3, when external vibration acts on the vibration sensor, the displacement of mass block 42 and the change in capacitance exhibit a more ideal linear relationship. This linear relationship enables the vibration sensor to more accurately convert vibration signals into capacitance change signals, thereby improving the detection sensitivity of the vibration sensor. Furthermore, by ensuring the parallelism of the opposing surfaces of mass block 42 and electrode plate 3, the non-uniformity of capacitance change can be eliminated, reducing measurement errors and improving the detection accuracy of the vibration sensor.

[0058] Furthermore, the parallel facing surfaces of mass block 42 and plate 3 provide a more stable environment for mass block 42's movement. Under acceleration, mass block 42 can move smoothly in a predetermined direction, reducing motion deviations and instabilities caused by non-parallel facing surfaces. This stable motion characteristic enables the vibration sensor to better track rapidly changing acceleration signals, improving its dynamic response capabilities.

[0059] Optionally, along the direction from the pole plate 3 to the vibration part 4 , the circumferential dimension of the mass block 42 varies.

[0060] Specifically, the circumferential size of the mass block 42 can be set to gradually decrease, first decrease and then increase, or first increase and then decrease in the direction from the electrode plate 3 to the vibration part 4, so as to adapt to different detection requirements.

[0061] Optionally, the circumferential dimension of the mass block 42 gradually decreases along the direction from the pole plate 3 to the vibration part 4 .

[0062] like Figures 1 to 6 As shown, the circumferential size of the side of the mass block 42 close to the electrode 3 is the largest, and the circumferential size of the side of the mass block 42 close to the diaphragm 41 is the smallest, which can facilitate the connection process of the mass block 42 and the diaphragm 41 while ensuring the effective size of the mass block 42 opposite to the electrode 3.

[0063] Optionally, the vibration part 4 has a pressure equalizing hole 44 , and the pressure equalizing hole 44 passes through the vibration membrane 41 and the mass block 42 .

[0064] like Figure 1 and Figure 3 As shown, a pressure equalizing hole 44 can be opened in the middle or edge of the vibration part 4. The pressure equalizing hole 44 can balance the air pressure on both sides of the vibration part 4, avoiding damage to the diaphragm 41 caused by severe external vibration, so that the vibration sensor can work stably in different air pressure environments.

[0065] Optionally, a support ring 5 is further included, which is arranged in the accommodating chamber. Along the height direction of the vibration sensor, the cross-section of the support ring 5 is L-shaped, and the diaphragm 41 or the electrode plate 3 is connected to the bottom wall of the support ring 5.

[0066] like Figures 1 to 4 As shown, the cross-section of the support ring 5 is L-shaped, that is, the inner wall of the support ring 5 is not always vertical, but has a step, so that the bottom wall of the support ring 5, that is, the step, can be used to support and connect the diaphragm 41 or the pole plate 3, saving the setting of the gasket.

[0067] The support ring 5 is usually made of insulating material, and can separate the housing 2 and the diaphragm 41 or the housing 2 and the electrode plate 3 to ensure the structural reliability of the vibration sensor.

[0068] Optionally, the electrode plate 3 is connected to the bottom wall of the support ring 5 , and the vibration part 4 further includes a vibration ring 43 , one side of the vibration ring 43 is connected to the housing 2 , and the other side of the vibration ring 43 is connected to the vibration membrane 41 .

[0069] like Figure 1 and Figure 2 As shown, the vibration ring 43 can be connected to the housing 2, and the diaphragm 41 can be connected to the vibration ring 43 to achieve the fixation of the vibrating portion 4. The mass 42 is connected to the side of the diaphragm 41 away from the vibration ring 43, so that the mass 42 can face the electrode plate 3 connected to the bottom wall of the support ring 5 and form a parallel plate capacitor. In this case, the thickness of the bottom wall of the support ring 5 (i.e., the step thickness) and the thickness of the vibration ring 43 can jointly provide a vibration space for the mass 42 and the diaphragm 41.

[0070] Optionally, the diaphragm 41 is connected to the bottom wall of the support ring 5 , and the electrode plate 3 is provided on a side of the housing 2 close to the mass block 42 .

[0071] like Figure 3 and Figure 4 As shown, the diaphragm 41 can be connected to the bottom wall of the support ring 5, that is, the step, and the mass 42 can be connected to the side of the diaphragm 41 close to the electrode plate 3, so that the mass 42 can face the electrode plate 3 connected to the side of the housing 2 close to the mass 42 and form a parallel plate capacitor. In this case, the thickness of the support ring 5 provides vibration space for the mass 42 and the diaphragm 41.

[0072] In addition, the diaphragm 41 is directly connected to the bottom wall of the support ring 5, that is, the step, so as to fix the vibration part 4. There is no need to provide a vibration ring 43 separately, which also reduces the processing difficulty and processing cost.

[0073] Optionally, a connecting ring 6 is further included, one side of which is connected to the substrate 1 , and the other side of which is connected to the diaphragm 41 or the electrode plate 3 , so that the substrate 1 is electrically connected to the parallel plate capacitor.

[0074] like Figures 1 to 4As shown, the connecting ring 6 is connected between the substrate 1 and the diaphragm 41, or the substrate 1 and the electrode 3. On the one hand, the connecting ring 6 can be used in conjunction with the supporting ring 5 to fix the diaphragm 41 or the electrode 3, thereby ensuring the structural reliability of the vibration sensor; on the other hand, the connecting ring 6 is an electrical connector, which can conduct the substrate 1 and the diaphragm 41, or the substrate 1 and the electrode 3, so that signals can be transmitted between the substrate 1 and the parallel plate capacitor, thereby realizing the detection of changes in the capacitance of the parallel plate capacitor, and then identifying external vibration information.

[0075] In addition, the connecting ring 6 can also enclose a storage space with the substrate 1, and the storage space can be used to set the device parts 7 such as capacitors and resistors, which also facilitates the full utilization of the internal space of the vibration sensor and contributes to the miniaturization and integration development of the vibration sensor.

[0076] Optionally, along the height direction of the vibration sensor, there is a second gap between the support ring 5 and the substrate 1. Figures 1 to 6 As shown, a second gap is provided between the support ring 5 and the substrate 1 , that is, the support ring 5 and the substrate 1 do not abut against each other, which can simplify the assembly process while facilitating contact and conduction between the inner connecting ring 6 and the substrate 1 .

[0077] Optionally, it further includes a device portion 7 and a lead-out portion 8, wherein the device portion 7 is provided on the substrate 1 and is located in the accommodating chamber, and the lead-out portion 8 is provided on the substrate 1 and extends out of the accommodating chamber.

[0078] like Figures 1 to 4 As shown, the capacitor, resistor, amplifier and other device parts 7 are arranged in the accommodating chamber, which can facilitate full utilization of the internal space of the vibration sensor and contribute to the miniaturization and integration development of the vibration sensor.

[0079] like Figures 7 to 9 As shown, according to different design requirements, lead-out parts 8 with different structures can be designed or substrates 1 with different lead-out parts 8 can be selected through incoming materials to adapt to different installation requirements of the electronic equipment used. For example, the lead-out part 8 can be connected to the main board of the electronic equipment by plugging, lead connection, etc., thereby realizing the electrical connection between the vibration sensor and the main board of the electronic equipment.

[0080] According to another aspect of the present invention, an electronic device is provided, which includes any one of the vibration sensors described above and has the technical effects possessed by the vibration sensors described above.

[0081] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0082] Although some specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It should be understood by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A vibration sensor, characterized in that: include: A substrate (1) and a shell (2), wherein the substrate (1) and the shell (2) are connected to form a receiving chamber; A pole plate (3), the pole plate (3) being arranged in the accommodating chamber; A vibration part (4), the vibration part (4) is arranged in the accommodating chamber and is opposite to the pole plate (3), the vibration part (4) comprises a vibration membrane (41) and a mass block (42), the mass block (42) is connected to a side of the vibration membrane (41) close to the pole plate (3), so that the mass block (42), the pole plate (3) and a first gap therebetween jointly form a parallel plate capacitor.

2. A vibration sensor according to claim 1, characterized in that: The side of the mass block (42) facing the electrode plate (3) is a first surface, and the side of the electrode plate (3) facing the mass block (42) is a second surface. The first surface is parallel to the second surface.

3. A vibration sensor according to claim 2, characterized in that: Along the direction from the pole plate (3) to the vibration part (4), the circumferential dimension of the mass block (42) varies.

4. A vibration sensor according to claim 3, characterized in that: Along the direction from the pole plate (3) to the vibration part (4), the circumferential dimension of the mass block (42) gradually decreases.

5. A vibration sensor according to claim 2, characterized in that: The vibration part (4) has a pressure equalizing hole (44), and the pressure equalizing hole (44) passes through the vibration membrane (41) and the mass block (42).

6. A vibration sensor according to claim 1, characterized in that: The invention also includes a support ring (5), which is arranged in the accommodating chamber. Along the height direction of the vibration sensor, the cross section of the support ring (5) is L-shaped, and the diaphragm (41) or the electrode plate (3) is connected to the bottom wall of the support ring (5).

7. A vibration sensor according to claim 6, characterized in that: The pole plate (3) is connected to the bottom wall of the support ring (5), and the vibration part (4) further includes a vibration ring (43), one side of the vibration ring (43) is connected to the shell (2), and the other side of the vibration ring (43) is connected to the vibration membrane (41).

8. A vibration sensor according to claim 6, characterized in that: The diaphragm (41) is connected to the bottom wall of the support ring (5), and the pole plate (3) is arranged on a side of the housing (2) close to the mass block (42).

9. A vibration sensor according to claim 6, characterized in that: It also includes a connecting ring (6), one side of which is connected to the substrate (1), and the other side of which is connected to the diaphragm (41) or the electrode plate (3), so that the substrate (1) and the parallel plate capacitor are electrically connected.

10. The vibration sensor according to claim 6, characterized in that: Along the height direction of the vibration sensor, there is a second gap between the support ring (5) and the base plate (1).

11. The vibration sensor according to claim 1, characterized in that: It also includes a device portion (7) and a lead-out portion (8), wherein the device portion (7) is provided on the substrate (1) and is located within the accommodating chamber, and the lead-out portion (8) is provided on the substrate (1) and extends outside the accommodating chamber.

12. An electronic device, characterized in that: The vibration sensor comprises the vibration sensor according to any one of claims 1 to 11.

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