High-density microwave plasma cleaning equipment and control method

Abstract

The invention discloses high-density microwave plasma cleaning equipment and a control method, and relates to the technical field of plasma cleaning, the high-density microwave plasma cleaning equipment comprises an industrial personal computer cabinet main body, and further comprises an array microwave cleaning module and a jacking cleaning platform which are vertically arranged in the industrial personal computer cabinet main body at intervals, and the array microwave cleaning module is located above the jacking cleaning platform; the array microwave cleaning module at least comprises a magnetron array, and the magnetron array comprises a vacuum cavity cover and at least two groups of magnetron microwave sources; according to the invention, the to-be-cleaned material is placed in the vacuum cavity, the microwave excites the process gas to form the plasma to realize cleaning, the combination of the two groups of magnetrons can expand the plasma range and improve the cleaning efficiency, the area of the cavity is adaptive to the plasma coverage area synergistically expanded by the two groups of magnetrons, and the energy of a single magnetron exceeds half of the cavity cover. The energy of the two magnetrons is overlapped in the middle of the cavity, so that an energy weakening area is compensated, and the plasma cleaning nonuniformity is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of plasma cleaning, and in particular to high-density microwave plasma cleaning equipment and a control method thereof. Background Art

[0002] Plasma cleaning is a dry cleaning and activation technology that uses plasma to treat the surface of materials. Compared with wet cleaning processes, it has the advantages of simplifying the process, reducing the drying process and wastewater treatment steps, and is more environmentally friendly and economical. It reduces the drying process and wastewater treatment steps. With the increasing degree of integration of electronic circuits, the smaller chip feature size, and the development and use of new materials, plasma surface cleaning technology has become an important means to improve product reliability and yield.

[0003] Currently, conventional plasma cleaning machines use a single microwave source. The microwave source excites gas in a vacuum chamber to generate plasma, and then evenly diffuses the energy throughout the processing area through a waveguide. However, the distribution of microwave energy is limited. The microwave source introduces energy into the vacuum chamber through the waveguide, but the waveguide attenuates during transmission, resulting in high power density in areas close to the waveguide inlet and low power density in areas farther away. Therefore, the microwave energy in the edge area is difficult to effectively excite the gas. In addition, the density gradient during the plasma diffusion process leads to uneven distribution, which ultimately causes the plasma density in local areas to be low due to insufficient energy, affecting the cleaning efficiency and uniformity. The energy is difficult to cover the entire chamber, and the plasma is dispersed. The cleaning efficiency and cleaning uniformity in local areas will be affected due to insufficient plasma density. Summary of the Invention

[0004] The object of the present invention is to provide a high-density microwave plasma cleaning device to solve the problems raised in the above background technology.

[0005] Another object of the present invention is to provide a control method.

[0006] To solve the above technical problems, the present invention provides a high-density microwave plasma cleaning equipment, comprising an industrial computer cabinet body, and also comprising an array microwave cleaning module and a lifting cleaning platform vertically spaced apart and arranged in the industrial computer cabinet body, wherein the array microwave cleaning module is located above the lifting cleaning platform; The array microwave cleaning module comprises at least a magnetron array, the magnetron array comprising a vacuum cavity cover and at least two groups of magnetron microwave sources, a vacuum cavity is provided in the vacuum cavity cover, and a waveguide antenna connected between the two groups of magnetron microwave sources is laid on the inner top wall of the vacuum cavity cover; The two groups of magnetron microwave sources are symmetrically arranged on both sides of the vacuum cavity cover about the geometric center point of the vacuum cavity cover. The microwave range emitted by the two groups of magnetron microwave sources at least covers the inner space of the vacuum cavity cover.

[0007] Furthermore, the magnetron microwave source further comprises: An excitation waveguide is fixedly connected to a magnetron microwave generator on one side of the excitation waveguide, and a three-pin tuner is also fixedly connected to the excitation waveguide.

[0008] Furthermore, the array microwave cleaning module further comprises an upper cavity fixing bracket mounted on the top of the jacking cleaning platform, the upper cavity fixing bracket being close to the edge of the jacking cleaning platform, and the magnetron array being mounted on the outer wall of the upper cavity fixing bracket; Two cooling air ducts, one end of which is connected to the outer wall of the vacuum chamber cover, and the other end is connected to the upper chamber fixing bracket; The process gas control unit is installed on the outer wall of the upper cavity fixing bracket and is located between the two magnetron microwave sources above the vacuum cavity cover. The process gas control unit is connected to the vacuum cavity inside the vacuum cavity cover through a sealed pipeline.

[0009] Furthermore, an opening is provided at the bottom of the vacuum chamber cover, and the lifting cleaning platform includes at least a pull-out workbench slidably arranged on the main body of the industrial computer cabinet and a lifting mechanism located below the pull-out workbench. The driving end of the lifting mechanism is connected to the pull-out workbench, and is used to drive the pull-out workbench to rise to the opening at the bottom of the vacuum chamber cover to seal the vacuum chamber cover and form a vacuum chamber for diffused plasma.

[0010] Furthermore, the lifting cleaning platform also includes a table board installed on the main body of the industrial computer cabinet, a lower cavity plate is provided on the top of the table board, the pull-out workbench is slidably connected to the top of the lower cavity plate, the lifting mechanism is located below the table board, the driving end of the lifting mechanism passes through the table board and is connected to the bottom of the lower cavity plate, and a photoelectric sensor is fixedly installed on the outer wall of the lower cavity plate; The orthographic projection area of ​​the lower cavity plate is larger than the pull-out workbench, and is used to lift the lower cavity plate and the pull-out workbench together until the top of the lower cavity plate contacts the opening at the bottom of the vacuum chamber cover; The lifting mechanism includes a lifting cylinder, which is installed and fixed in the main body of the industrial computer cabinet, and the telescopic end of the lifting cylinder is fixedly connected to the bottom of the lower cavity plate.

[0011] Furthermore, gratings are symmetrically arranged above the left and right sides of the pulling workbench, and the height between the pulling workbench and the gratings is lower than the height of the vacuum chamber; Grating fixing brackets are provided at both ends of the grating, the bottom ends of the grating fixing brackets are fixedly connected to the top of the table top, and the two ends of the grating are respectively fixedly connected to the outer walls of the two grating fixing brackets.

[0012] Furthermore, a plurality of guide shafts are provided below the lower cavity plate, and the plurality of guide shafts are distributed at the four corners of the lower cavity plate. The top end of the guide shaft is fixedly connected to the bottom of the lower cavity plate. A plurality of linear bearings slidingly engaged with the guide shafts are inlaid on the table plate. The linear bearings are fixedly connected to the table plate. One end of the guide shaft away from the lower cavity plate passes through the guide shaft and extends to the bottom of the table plate, so that the guide shaft slides along the linear bearings when the lower cavity plate rises and falls.

[0013] Furthermore, a plurality of hydraulic buffers are fixedly mounted on the inner wall of the table top, and the bottom ends of the hydraulic buffers extend below the table top. When the lower cavity plate is not raised, the telescopic ends of the hydraulic buffers contact the bottom of the lower cavity plate. A blocking screw is also fixedly installed on the inner wall of the table top, the top of the blocking screw extends to the top of the table top, and the distance between the top of the blocking screw and the table top is slightly lower than the distance between the telescopic end of the oil pressure buffer and the table top.

[0014] Furthermore, a guide rail assembly is provided between the lower cavity plate and the pull-out workbench, the guide rail assembly including two guide rails opened on the top of the lower cavity plate, the two guide rails being arranged horizontally and spaced apart, two sliders slidably connected to the guide rails are fixedly installed on the bottom of the pull-out workbench, the two sliders support the pull-out workbench so that a gap is left between the bottom of the pull-out workbench and the top of the lower cavity plate, and the orthographic projection area of ​​the pull-out workbench is smaller than the area of ​​the bottom opening of the vacuum chamber cover; A vacuum pump group is also provided in the main body of the industrial computer cabinet, and a bellows is fixedly connected to the vacuum pump group. The end of the bellows away from the vacuum pump group is fixedly connected to a vacuum joint. A through-hole is opened through the table top for the vacuum joint to be inserted. The end of the vacuum joint away from the bellows passes through the through-hole and is fixedly connected to the bottom of the lower cavity plate. A through-hole is opened through the lower cavity plate, one end of the through-hole is connected to the vacuum joint, and the other end is connected to the gap between the lower cavity plate and the pull-out workbench. The length of the vacuum joint is longer than the lifting height of the lower cavity plate.

[0015] A control method is applied to any of the above-mentioned high-density microwave plasma cleaning equipment, and the specific steps include: One of the magnetron microwave sources and / or the other magnetron microwave source is turned on according to the distribution of the product.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, the material to be cleaned is placed in a vacuum chamber, and microwaves excite the process gas to form plasma to achieve cleaning. The combination of two sets of magnetrons can expand the plasma range and improve cleaning efficiency. The cavity area is adapted to the plasma coverage area expanded by the two sets of magnetrons. The energy of a single magnetron exceeds half of the cavity cover, and the energy of the two magnetrons overlaps in the middle of the cavity, compensating for the energy attenuation area and improving the unevenness of plasma cleaning.

[0017] 2. In the present invention, when the lifting cylinder pushes the lower cavity plate upward, the pulling workbench moves upward together until the top of the lower cavity plate collides with the bottom of the vacuum cavity cover. At this time, the pulling workbench is in the vacuum cavity, forming a sealed cavity in the vacuum cavity cover. The photoelectric sensor is used to detect whether the pulling workbench is pushed back into the vacuum cavity when it is raised or lowered, to ensure that it is facing the bottom of the vacuum cavity cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a side view of the present invention; Figure 2 It is a front view of the present invention; Figure 3 Schematic diagram of the internal structure of the present invention; Figure 4 This is a schematic diagram of the connection structure between the upper cavity fixing bracket and the table top in the present invention; Figure 5 Schematic diagram of the connection structure between the magnetron microwave source and the vacuum cavity cover in the present invention; Figure 6 Schematic diagram of the connection structure between the vacuum cavity cover and the waveguide antenna in the present invention; Figure 7 Schematic diagram of the connection structure between the grating and the grating fixing bracket in the present invention; Figure 8 Schematic diagram of the connection structure between the lower cavity plate and the lifting cylinder in the present invention; Figure 9 Flowchart of the control method of the present invention.

[0019] In the figure: 1. Main body of the industrial computer cabinet; 101. Upper cabinet; 102. Lower cabinet; 103. Operation door; 104. Industrial computer; 2. Three-color light; 3. Power transfer switch; 4. Emergency stop button; 5. Array microwave cleaning module; 501, magnetron array; 5011, magnetron microwave source; 50111, excitation waveguide; 50112, magnetron microwave generator; 50113, three-pin tuner; 5012, vacuum chamber cover; 5013, waveguide antenna; 502, cooling air duct; 503, process gas control unit; 504, upper cavity fixing bracket; 6. Lifting cleaning platform; 601. Table plate; 602. Lower cavity plate; 603. Pull-out workbench; 604. Photoelectric sensor; 605. Lifting cylinder; 606, guide rail assembly; 6061, slider; 6062, guide rail; 607, guide shaft; 608, linear bearing; 609, grating; 610, grating fixing bracket; 611, blocking screw; 612, hydraulic buffer; 7. Vacuum pump assembly; 8. Observation window; 9. Vacuum connector; 10. Electrical components. DETAILED DESCRIPTION

[0020] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, those skilled in the art who do not make original embodiments shall fall within the scope of protection of the present invention.

[0021] The present invention provides a technical solution: See Figures 1-9 As shown, a high-density microwave plasma cleaning equipment includes an industrial computer cabinet body 1, and also includes an array microwave cleaning module 5 and a lifting cleaning platform 6 vertically spaced apart and arranged in the industrial computer cabinet body 1, wherein the array microwave cleaning module 5 is located above the lifting cleaning platform 6; The array microwave cleaning module 5 includes at least a magnetron array 501, which includes a vacuum cavity cover 5012 and at least two groups of magnetron microwave sources 5011. A vacuum cavity is provided in the vacuum cavity cover 5012, and a waveguide antenna 5013 connected between the two groups of magnetron microwave sources 5011 is laid on the inner top wall of the vacuum cavity cover 5012. The two groups of magnetron microwave sources 5011 are symmetrically arranged on both sides of the vacuum cavity cover 5012 about the geometric center point of the vacuum cavity cover 5012 . The microwave range emitted by the two groups of magnetron microwave sources 5011 at least covers the internal space of the vacuum cavity cover 5012 .

[0022] The main body 1 of the industrial computer cabinet also includes an upper cabinet 101 and a lower cabinet 102. The upper cabinet 101 is fixedly equipped with a three-color light 2. The outer wall of the upper cabinet 101 is equipped with a power conversion switch 3, an emergency stop button 4 and an industrial computer 104. The lower cabinet 102 is internally equipped with electrical components 10. The power conversion switch 3 is used to control the on-off power supply of the equipment and switch between different power modes, and the emergency stop button 4 is used to quickly cut off the operation of the equipment in an emergency. The jacking cleaning platform 6 is installed on the lower cabinet 102. The products or materials to be cleaned are placed on the jacking cleaning platform 6. The jacking cleaning platform 6 is responsible for delivering the products or materials into the vacuum chamber. The industrial computer 104 serves as the control center of the equipment, integrating the operation interface and control system for running the cleaning program, setting parameters and monitoring the entire treatment process. The three-color light 2 uses three different colors such as green, yellow and red to intuitively display the working status of the equipment, including normal operation, early warning prompts or fault alarms. The electrical components 10 are responsible for building the electrical control network of the equipment, power distribution, circuit on-off control, motor speed regulation and the coordinated operation of various functional modules; The vacuum chamber is located within a vacuum chamber cover 5012. A magnetron microwave source 5011 is used to emit high-frequency microwave energy and transmit it to a waveguide antenna 5013. The waveguide antenna 5013 is used to couple the microwave energy into the vacuum chamber. Prior to this, the material or product to be cleaned is placed in the vacuum chamber in advance. After the microwave energy is coupled into the vacuum chamber, it excites the process gas in the vacuum chamber to form a plasma, which can then be used to clean the material or product. The combination of two sets of magnetron microwave sources 5011 excites a larger range of plasma, increasing the plasma density by at least two orders of magnitude. At the same time, it improves the uniformity of the plasma distribution to a certain extent, thereby improving the cleaning efficiency. The area of ​​the vacuum cavity here is just suitable for the plasma coverage area expanded by the two sets of magnetron microwave sources 5011 in coordination. The area of ​​the vacuum cavity close to the magnetron microwave source 5011 receives the highest microwave energy, and the closer to the middle of the vacuum cavity, the farther away from the magnetron microwave source 5011, and the weaker the microwave energy. The area of ​​the vacuum cavity here just makes the energy emitted by a single magnetron microwave source 5011 exceed half of the vacuum cavity cover 5012. In this way, when the two magnetron microwave sources 5011 emit microwave energy together, the two energies will overlap near the middle area of ​​the vacuum cavity. The overlapping of the two energies compensates for the microwave energy attenuation area that appears far away from the magnetron microwave source 5011, thereby improving the cleaning unevenness caused by insufficient plasma density.

[0023] See Figure 5-Figure 6 , the magnetron microwave source 5011 also includes, An excitation waveguide 50111 is fixedly connected to a magnetron microwave generator 50112 on one side of the excitation waveguide 50111. A three-pin tuner 50113 is also fixedly connected to the outer wall of the excitation waveguide 50111. A connecting frame is fixedly installed on the bottom of the excitation waveguide 50111, and the connecting frame is fixedly connected to the outer wall of the vacuum chamber cover 5012.

[0024] The three-pin tuner 50113 is connected to the end of the excitation waveguide 50111 away from the magnetron microwave generator 50112 through a standard waveguide flange. The magnetron microwave generator 50112 is used to generate high-frequency microwave energy, providing an energy source for plasma excitation, while the excitation waveguide 50111 is used to transmit the energy transmitted by the magnetron microwave generator 50112 to the waveguide antenna 5013. The three-pin tuner 50113 dynamically matches the impedance of the microwave source and the vacuum cavity by adjusting the insertion depth of the pins, reducing reflected waves and improving energy utilization. An observation window 8 is also fixedly installed on one side of the vacuum chamber cover 5012. The observation window 8 is mainly used to observe the process status inside the vacuum chamber in real time and check the cleaning effect.

[0025] See Figure 3-Figure 5 The array microwave cleaning module 5 further includes an upper cavity fixing bracket 504 mounted on the top of the jacking cleaning platform 6. The upper cavity fixing bracket 504 is close to the edge of the jacking cleaning platform 6, and the magnetron array 501 is mounted on the outer wall of the upper cavity fixing bracket 504; Two cooling air ducts 502, one end of which is connected to the outer wall of the vacuum chamber cover 5012, and the other end is fixedly connected to the upper chamber fixing bracket 504; The process gas control unit 503 is installed on the outer wall of the upper cavity fixing bracket 504 and is located between the two magnetron microwave sources 5011 above the vacuum cavity cover 5012. The process gas control unit 503 is connected to the vacuum cavity in the vacuum cavity cover 5012 through a sealed pipeline.

[0026] The upper cavity fixing bracket 504 is fixed on the lower cabinet 102, the magnetron array 501 is fixedly installed on the outer wall of the upper cavity fixing bracket 504, one end of the cooling air duct 502 is fixedly connected to the connector fixed on the outer wall of the vacuum cavity cover 5012, and the cooling air duct 502 carries away the heat generated by the excitation waveguide 50111 and the vacuum cavity cover 5012 due to microwave loss through cold air. A cold air manufacturing device is installed in the upper cavity fixing bracket 504, and the cold air manufacturing device is connected to the connecting frame through the cooling air duct 502. The process gas control unit 503 is used to regulate the type, flow rate and pressure of the gas introduced into the vacuum cavity, providing a suitable gas environment for plasma excitation and meeting the requirements of different cleaning processes for gas composition and air pressure.

[0027] See Figure 3-Figure 8 An opening is provided at the bottom of the vacuum chamber cover 5012. The lifting cleaning platform 6 includes at least a pull-out workbench 603 slidably arranged on the industrial computer cabinet body 1 and a lifting mechanism located below the pull-out workbench 603. The driving end of the lifting mechanism is connected to the pull-out workbench 603, and is used to drive the pull-out workbench 603 to rise to the opening at the bottom of the vacuum chamber cover 5012 to block the vacuum chamber cover 5012, thereby forming a vacuum chamber for diffused plasma.

[0028] The lifting mechanism is used to drive the pull-out workbench 603 to rise and fall. The pull-out workbench 603 can be manually pulled to move, and the product or material can be placed on the top of the pull-out workbench 603, and then pushed back to its original position. The lifting mechanism then drives the pull-out workbench 603 to rise until the pull-out workbench 603 enters the vacuum chamber cover 5012. The pull-out workbench 603 is blocked in the opening at the bottom of the vacuum chamber cover 5012, so that the interior of the vacuum chamber cover 5012 forms a closed space, which is convenient for exciting plasma.

[0029] See Figure 3-Figure 8 The lifting cleaning platform 6 also includes a table top 601 installed on the industrial computer cabinet body 1. A lower cavity plate 602 is provided on the top of the table top 601. The pull-out workbench 603 is slidably connected to the top of the lower cavity plate 602. The lifting mechanism is located below the table top 601. The driving end of the lifting mechanism passes through the table top 601 and is connected to the bottom of the lower cavity plate 602. A photoelectric sensor 604 is also fixedly installed on the outer wall of the lower cavity plate 602. The orthographic projection area of ​​the lower cavity plate 602 is larger than the pull-out workbench 603, so that the lower cavity plate 602 and the pull-out workbench 603 are lifted together until the top of the lower cavity plate 602 contacts the opening at the bottom of the vacuum chamber cover 5012; The lifting mechanism includes a lifting cylinder 605 , which is installed and fixed in the industrial computer cabinet body 1 , and a telescopic end of the lifting cylinder 605 is fixedly connected to the bottom of the lower cavity plate 602 .

[0030] Look first Figure 3 The table top 601 is fixedly installed on the top of the lower cabinet 102, and the lifting cylinder 605 is fixedly installed inside the lower cabinet 102. The table top 601 is separated between the upper cabinet 101 and the lower cabinet 102, and then focus on Figure 7 and Figure 8 The lifting cylinder 605 is used to drive the lower cavity plate 602 to move up or down, and then combined with Figure 3 As can be seen, when the lifting cylinder 605 pushes the lower cavity plate 602 upward, the pulling workbench 603 moves upward together until the top of the lower cavity plate 602 contacts the bottom of the vacuum cavity cover 5012. At this time, the pulling workbench 603 is in the vacuum cavity. After the top of the lower chamber plate 602 contacts the bottom of the vacuum chamber cover 5012, the opening at the bottom of the vacuum chamber cover 5012 is blocked, thereby forming a sealed vacuum chamber in the vacuum chamber cover 5012. The materials or products to be cleaned are placed on the top of the pull-out workbench 603, so the pull-out workbench 603 needs to be completely immersed in the vacuum chamber. The photoelectric sensor 604 is mainly used to detect whether the pull-out workbench 603 is pushed back into the vacuum chamber when the lifting cylinder 605 is raised or lowered, so as to prevent damage to the product due to the pull-out workbench 603 not being pushed back to the correct position during mold closing. In other words, it ensures that the pull-out workbench 603 is directly under the vacuum chamber cover 5012 to prevent the product from hitting the edge of the vacuum chamber cover 5012 after the pull-out workbench 603 is raised, and ensures that the pull-out workbench 603 rises directly into the chamber. The upper cavity fixing bracket 504 is fixedly installed on the top of the table top 601 .

[0031] See Figure 7-Figure 8 Gratings 609 are symmetrically arranged above the left and right sides of the pulling workbench 603, and the height between the pulling workbench 603 and the gratings 609 is lower than the height of the vacuum chamber; Grating fixing brackets 610 are provided at both ends of the grating 609 , the bottom ends of the grating fixing brackets 610 are fixedly connected to the top of the table 601 , and the two ends of the grating 609 are fixedly connected to the outer walls of the two grating fixing brackets 610 respectively.

[0032] The grating fixing bracket 610 is used to fix the grating 609 horizontally on the top of the table 601. The grating 609 is used to detect whether the products to be cleaned on the top of the pull-out workbench 603 are stacked too high, to prevent the lower cavity plate 602 from colliding with the vacuum cavity cover 5012 due to the cleaning products being stacked too high and hitting the waveguide antenna 5013, so as to avoid damage to the waveguide antenna 5013.

[0033] See Figure 8 A plurality of guide shafts 607 are provided below the lower cavity plate 602, and the plurality of guide shafts 607 are distributed at the four corners of the lower cavity plate 602. The top of the guide shaft 607 is fixedly connected to the bottom of the lower cavity plate 602, and the table plate 601 is inlaid with a plurality of linear bearings 608 that slide with the guide shaft 607. The linear bearings 608 are fixedly connected to the table plate 601. One end of the guide shaft 607 away from the lower cavity plate 602 passes through the guide shaft 607 and extends to the bottom of the table plate 601, so that the guide shaft 607 slides along the linear bearing 608 when the lower cavity plate 602 rises and falls.

[0034] The linear bearing 608 is fixedly installed on the table top 601. The upper and lower ends of the linear bearing 608 are connected. When the lower cavity plate 602 is raised or lowered, the guide shaft 607 will slide in the linear bearing 608, providing a guide for the raising and lowering of the lower cavity plate 602, so that the lower cavity plate 602 can maintain vertical lifting, and at the same time, it can also reduce the offset and shaking of the lower cavity plate 602 when it is raised or lowered.

[0035] See Figure 8A plurality of hydraulic buffers 612 are fixedly mounted on the inner wall of the table top 601. The bottom ends of the hydraulic buffers 612 extend below the table top 601. When the lower cavity plate 602 is not raised, the telescopic ends of the hydraulic buffers 612 contact the bottom of the lower cavity plate 602. A blocking screw 611 is also fixedly installed on the inner wall of the table top 601, and the top of the blocking screw 611 extends to the top of the table top 601. The distance between the top of the blocking screw 611 and the table top 601 is slightly lower than the distance between the telescopic end of the oil pressure buffer 612 and the table top 601.

[0036] After the lifting cylinder 605 drives the lower cavity plate 602 to move downward, the bottom of the lower cavity plate 602 will first hit the telescopic end of the oil pressure buffer 612. The oil pressure buffer 612 reduces the impact vibration generated by the lower cavity plate 602 through the damping effect of the hydraulic oil in the piston movement. Then the blocking screw 611 cooperates with the oil pressure buffer 612 to support the lower cavity plate 602. After the bottom of the lower cavity plate 602 hits the telescopic end of the oil pressure buffer 612, it will squeeze the telescopic end of the oil pressure buffer 612 to retract a certain distance until it conflicts with the top of the blocking screw 611. The top height of the blocking screw 611 is lower than the telescopic end height of the oil pressure buffer 612 to ensure that the lower cavity plate 602 will first hit the telescopic end of the oil pressure buffer 612 after moving downward, so as to facilitate the reduction of impact vibration in advance.

[0037] See Figure 3-Figure 8 A guide rail assembly 606 is provided between the lower cavity plate 602 and the pull-out workbench 603. The guide rail assembly 606 includes two guide rails 6062 opened on the top of the lower cavity plate 602. The two guide rails 6062 are arranged horizontally at intervals. Two sliders 6061 slidably connected to the guide rails 6062 are fixedly installed on the bottom of the pull-out workbench 603. The two sliders 6061 support the pull-out workbench 603, so that a gap is left between the bottom of the pull-out workbench 603 and the top of the lower cavity plate 602. The orthographic projection area of ​​the pull-out workbench 603 is smaller than the area of ​​the bottom opening of the vacuum chamber cover 5012. A vacuum pump group 7 is also provided in the main body 1 of the industrial computer cabinet. A bellows is fixedly connected to the vacuum pump group 7. The end of the bellows away from the vacuum pump group 7 is fixedly connected to a vacuum connector 9. A through-hole is opened through the table top 601 for the vacuum connector 9 to pass through. The end of the vacuum connector 9 away from the bellows passes through the through-hole and is fixedly connected to the bottom of the lower cavity plate 602. A through-hole is opened through the lower cavity plate 602. One end of the through-hole is connected to the vacuum connector 9, and the other end is connected to the gap between the lower cavity plate 602 and the pull-out workbench 603. The length of the vacuum connector 9 is longer than the lifting height of the lower cavity plate 602.

[0038] Look first Figure 8A groove is provided on the top of one side of the pull-out workbench 603 for hooking fingers on the groove, and then the pull-out workbench 603 can be pulled to move. When the pull-out workbench 603 moves, the slider 6061 will slide along the guide rail 6062. Figure 7 In the embodiment, the drawer workbench 603 has been moved to the rearmost position. At this time, the drawer workbench 603 can only be pulled forward. When the drawer workbench 603 is pushed backward until it can no longer be moved, the drawer workbench 603 is just below the vacuum chamber. exist Figure 7 As can be seen in the figure, there is a gap between the pulling workbench 603 and the lower cavity plate 602. After the top of the lower cavity plate 602 contacts the bottom of the vacuum cavity cover 5012, the pulling workbench 603 is now inside the vacuum cavity. There is also a gap between the outer wall of the pulling workbench 603 and the inner wall of the vacuum cavity. The outer wall of the pulling workbench 603 does not contact the inner wall of the vacuum cavity. Then the vacuum pump group 7 starts to pump air, and extracts the air between the vacuum cavity cover 5012 and the lower cavity plate 602 through the bellows and the vacuum connector 9, thereby providing a high vacuum environment for plasma processing. When the lower cavity plate 602 moves upward, the vacuum connector 9 will move upward with the lower cavity plate 602. At the same time, the vacuum connector 9 will also move along the through-hole. After the top of the lower cavity plate 602 collides with the bottom of the vacuum cavity cover 5012, the bottom end of the vacuum connector 9 is still below the table top 601, and the bottom end of the vacuum connector 9 will not cross the table top 601.

[0039] See Figures 1-9 The present invention also provides a control method, which is applied to a high-density microwave plasma cleaning device in any of the above embodiments, and the specific steps include: Step 1: Set the cleaning process recipe on the industrial computer cabinet body 1 according to the cleaning material or product, and then open the operation cabin door 103 on the industrial computer cabinet body 1; Step 2: Pull out the lifting cleaning platform 6, place the material or product to be cleaned on the lifting cleaning platform 6, and then push it back. The photoelectric sensor 604 then detects whether it has completely returned to the correct area, and the grating 609 detects whether the material or product to be cleaned exceeds the height, and then closes the operation cabin door 103; Step 3: Start the process on the industrial computer cabinet body 1, lift the cleaning platform 6 and close the mold with the vacuum chamber cover 5012, and then the vacuum pump group 7 starts working; Step 4: When the vacuum degree in the vacuum chamber reaches the process requirement, plasma cleaning starts automatically; Step 5: After cleaning is completed, the process breaks the vacuum, the cleaning platform 6 is lifted and lowered to the initial position, and then the operating cabin door 103 is opened to take out the material or product; Step 6: wherein, one magnetron microwave source 5011 and / or another magnetron microwave source 5011 may be turned on according to the distribution of the products; Step 7: According to Figure 5 From the perspective of , if the amount of materials or products does not reach the point where the pull-out workbench 603 is fully stacked, the materials or products can be concentrated on any one of the left and right sides of the top of the pull-out workbench 603, that is, on the side close to the magnetron microwave source 5011. In this way, one of the magnetron microwave sources 5011 close to the material or product can be individually controlled to turn on. In this way, the microwaves emitted by a single magnetron microwave source 5011 are sufficient to cover the materials or products. When necessary, two magnetron microwave sources 5011 can be turned on.

Claims

1. A high-density microwave plasma cleaning device, comprising an industrial computer cabinet body (1), characterized in that: It also includes an array microwave cleaning module (5) and a lifting cleaning platform (6) vertically spaced apart and arranged in the main body of the industrial control computer cabinet (1), wherein the array microwave cleaning module (5) is located above the lifting cleaning platform (6); The array microwave cleaning module (5) comprises at least a magnetron array (501), the magnetron array (501) comprising a vacuum cavity cover (5012) and at least two groups of magnetron microwave sources (5011), a vacuum cavity is provided in the vacuum cavity cover (5012), and a waveguide antenna (5013) connected between the two groups of magnetron microwave sources (5011) is laid on the inner top wall of the vacuum cavity cover (5012); The two groups of magnetron microwave sources (5011) are symmetrically arranged on both sides of the vacuum cavity cover (5012) about the geometric center point of the vacuum cavity cover (5012), and the microwave range emitted by the combination of the two groups of magnetron microwave sources (5011) at least covers the internal space of the vacuum cavity cover (5012).

2. The high-density microwave plasma cleaning equipment according to claim 1, characterized in that: The magnetron microwave source (5011) further comprises: An excitation waveguide (50111), wherein a magnetron microwave generator (50112) is fixedly connected to one side of the excitation waveguide (50111), and a three-pin tuner (50113) is also fixedly connected to the excitation waveguide (50111).

3. The high-density microwave plasma cleaning equipment according to claim 2, characterized in that: The array microwave cleaning module (5) further comprises an upper cavity fixing bracket (504) mounted on the top of the lifting cleaning platform (6), wherein the upper cavity fixing bracket (504) is close to the edge of the lifting cleaning platform (6), and the magnetron array (501) is mounted on the outer wall of the upper cavity fixing bracket (504); Two cooling air ducts (502), one end of which is connected to the outer wall of the vacuum chamber cover (5012), and the other end of which is connected to the upper chamber fixing bracket (504); The process gas control unit (503) is installed on the outer wall of the upper cavity fixing bracket (504) and is located between the two magnetron microwave sources (5011) above the vacuum cavity cover (5012). The process gas control unit (503) is connected to the vacuum cavity in the vacuum cavity cover (5012) through a sealed pipeline.

4. The high-density microwave plasma cleaning equipment according to claim 3, characterized in that: An opening is provided at the bottom of the vacuum chamber cover (5012), and the lifting cleaning platform (6) comprises at least a pull-out workbench (603) slidably arranged on the industrial computer cabinet body (1) and a lifting mechanism located below the pull-out workbench (603), wherein a driving end of the lifting mechanism is connected to the pull-out workbench (603) and is used to drive the pull-out workbench (603) to rise to the opening at the bottom of the vacuum chamber cover (5012) to seal the vacuum chamber, thereby forming a vacuum chamber for diffused plasma.

5. The high-density microwave plasma cleaning equipment according to claim 4, characterized in that: The lifting cleaning platform (6) further comprises a table top (601) mounted on the main body (1) of the industrial computer cabinet, wherein a lower cavity plate (602) is provided on the top of the table top (601), a pull-out workbench (603) is slidably connected to the top of the lower cavity plate (602), a lifting mechanism is located below the table top (601), a driving end of the lifting mechanism passes through the table top (601) and is connected to the bottom of the lower cavity plate (602), and a photoelectric sensor (604) is fixedly mounted on the outer wall of the lower cavity plate (602); The orthographic projection area of ​​the lower cavity plate (602) is larger than the pull-out workbench (603), and is used to lift the lower cavity plate (602) and the pull-out workbench (603) together until the top of the lower cavity plate (602) contacts the opening at the bottom of the vacuum cavity cover (5012); The lifting mechanism comprises a lifting cylinder (605), which is fixedly installed in the industrial computer cabinet body (1), and the telescopic end of the lifting cylinder (605) is fixedly connected to the bottom of the lower cavity plate (602).

6. The high-density microwave plasma cleaning equipment according to claim 5, characterized in that: Gratings (609) are symmetrically arranged above the left and right sides of the pulling workbench (603), and the height between the pulling workbench (603) and the gratings (609) is lower than the height of the vacuum cavity; Grating fixing brackets (610) are provided at both ends of the grating (609), the bottom ends of the grating fixing brackets (610) are fixedly connected to the top of the table top (601), and the two ends of the grating (609) are respectively fixedly connected to the outer walls of the two grating fixing brackets (610).

7. The high-density microwave plasma cleaning equipment according to claim 6, characterized in that: A plurality of guide shafts (607) are provided below the lower cavity plate (602), and the plurality of guide shafts (607) are distributed at the four corners of the lower cavity plate (602). The top ends of the guide shafts (607) are fixedly connected to the bottom of the lower cavity plate (602). The table plate (601) is inlaid with a plurality of linear bearings (608) that slide with the guide shafts (607). The linear bearings (608) are fixedly connected to the table plate (601). One end of the guide shaft (607) away from the lower cavity plate (602) passes through the guide shaft (607) and extends to the bottom of the table plate (601), so that the guide shaft (607) slides along the linear bearings (608) when the lower cavity plate (602) rises and falls.

8. The high-density microwave plasma cleaning equipment according to claim 7, characterized in that: A plurality of oil pressure buffers (612) are fixedly mounted on the inner wall of the table top (601), the bottom ends of the oil pressure buffers (612) extending to the bottom of the table top (601), and when the lower cavity plate (602) is not lifted, the telescopic ends of the oil pressure buffers (612) contact the bottom of the lower cavity plate (602); A blocking screw (611) is also fixedly mounted on the inner wall of the table top (601), the top end of the blocking screw (611) extending above the table top (601), and the distance between the top end of the blocking screw (611) and the table top (601) is slightly lower than the distance between the telescopic end of the oil pressure buffer (612) and the table top (601).

9. The high-density microwave plasma cleaning equipment according to claim 8, characterized in that: A guide rail assembly (606) is provided between the lower cavity plate (602) and the pull-out workbench (603), and the guide rail assembly (606) includes two guide rails (6062) opened on the top of the lower cavity plate (602), and the two guide rails (6062) are arranged horizontally at intervals. Two sliders (6061) slidably connected to the guide rails (6062) are fixedly installed on the bottom of the pull-out workbench (603), and the two sliders (6061) support the pull-out workbench (603) so that a gap is left between the bottom of the pull-out workbench (603) and the top of the lower cavity plate (602), and the orthographic projection area of ​​the pull-out workbench (603) is smaller than the area of ​​the bottom opening of the vacuum cavity cover (5012); A vacuum pump group (7) is also provided in the main body (1) of the industrial control computer cabinet. A bellows is fixedly connected to the vacuum pump group (7). One end of the bellows away from the vacuum pump group (7) is fixedly connected to a vacuum connector (9). A through-hole is provided through the table top (601) for the vacuum connector (9) to pass through. The end of the vacuum connector (9) away from the bellows passes through the through-hole and is fixedly connected to the bottom of the lower cavity plate (602). A through-hole is provided through the lower cavity plate (602). One end of the through-hole is connected to the inside of the vacuum connector (9), and the other end is connected to the gap between the lower cavity plate (602) and the pull-out workbench (603). The length of the vacuum connector (9) is longer than the lifting height of the lower cavity plate (602).

10. A control method, characterized in that: A high-density microwave plasma cleaning device applied to any one of claims 1 to 9, wherein the specific steps include turning on one magnetron microwave source (5011) and / or another magnetron microwave source (5011) according to the distribution of products.

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