Wafer bearing device and semiconductor equipment

Abstract

The embodiment of the invention provides a wafer bearing device and semiconductor equipment, relates to the technical field of semiconductors, and is used for improving the yield of wafers. The wafer bearing device comprises a bearing table, a driving piece, at least one reflecting piece and at least one receiving and transmitting piece corresponding to the reflecting piece. The driving piece is in transmission connection with the carrying table to drive the carrying table to move, one of the reflecting piece and the receiving and transmitting piece corresponding to the reflecting piece is arranged on the carrying table and synchronously moves along with the carrying table, and the other one is arranged relative to the carrying table and is fixed in position. The transceiver transmits a signal and receives a signal reflected by the reflector, and when the intensity of the signal received by the transceiver is within a preset interval, the carrier is located at a preset position. The semiconductor equipment comprises a wafer bearing device and a reaction chamber. Whether the carrying table is located at the preset position or not is determined through the receiving and transmitting piece and the reflecting piece, so that damage to the wafer caused by wafer taking and placing is reduced, and the yield of the wafer is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a wafer carrier and semiconductor equipment. Background Art

[0002] In the semiconductor manufacturing process, wafers need to be transferred between different reaction chambers to implement different processing techniques on the wafers, such as deposition, etching, ion implantation and other processes. A wafer carrier is provided in the reaction chamber to carry and fix the wafer. In the process of various processing techniques on the wafer, the wafer needs to be in a preset position to ensure the stable wafer transfer or wafer processing. For example, in the wafer transfer process, the tool used for wafer transfer is generally a robotic arm, which includes a vacuum transmission module robot (VTM robot) and an air transmission module robot (ATM robot). If the wafer carrier and the wafer thereon are not in the preset position, the robotic arm is likely to damage the wafer when taking and placing the wafer, resulting in a reduction in the wafer yield. Summary of the Invention

[0003] In view of the above problems, embodiments of the present application provide a wafer carrier device and a semiconductor device to reduce wafer damage and improve wafer yield.

[0004] In order to achieve the above-mentioned purpose, the first aspect of an embodiment of the present application provides a wafer carrying device, which includes: a carrier, a driving member transmission-connected to the carrier, at least one reflector and at least one transceiver corresponding to the reflector, the driving member drives the carrier to move, the reflector and one of the corresponding transceiver are arranged on the carrier and move synchronously with the carrier, and the other is arranged relative to the carrier and has a fixed position; the transceiver is used to transmit signals and receive signals reflected back by the reflector, and when the intensity of the signal received by the transceiver is in a preset range, the carrier is in a preset position.

[0005] In some possible embodiments, the reflective element is disposed on the carrier and moves synchronously with the carrier, and the transceiver elements are both disposed relative to the carrier.

[0006] In some possible embodiments, the transceiver includes a transmitting end and a receiving end, the transmitting end is used to transmit signals, and the receiving end is used to receive signals reflected by the reflecting element, and the relative positions of the transmitting end and the receiving end are fixed; the propagation path of the signal transmitted by the transmitting end and the propagation path of the signal reflected by the reflecting element and received by the receiving end are parallel to each other; or, the angle between the propagation paths is greater than 0 degrees and less than 180 degrees.

[0007] In some possible embodiments, the wafer carrying device includes at least two transceivers and at least two reflectors, and the transceivers and reflectors correspond one to one, and the angle between the line connecting two adjacent transceivers and / or two adjacent reflectors and the center of the carrier is greater than 0 degrees and less than 180 degrees.

[0008] In some possible embodiments, the carrier is an electrostatic chuck.

[0009] In some possible embodiments, the signal includes an optical signal, and the transceiver includes a photoelectric sensor.

[0010] In some possible embodiments, the reflector includes a first segment and a second segment, the first segment is provided with a housing cavity, a reflector is provided in the housing cavity, and the second segment is provided with a through hole connected to the housing cavity, and the light signals received and returned by the reflector can pass through the through hole.

[0011] The wafer carrying device provided in the embodiment of the present application includes a carrier, a driving member, a reflecting member and a transceiver. The driving member drives the carrier to move, and one of the reflecting member and the corresponding transceiver is arranged on the carrier and moves synchronously with the carrier, and the other is arranged relative to the carrier and has a fixed position. The transceiver transmits a signal and receives a signal reflected back by the reflecting member. When the intensity of the signal received by the transceiver is within a preset range, the carrier is in a preset position. The embodiment of the present application utilizes the transceiver and the reflecting member to confirm whether the carrier is in a preset position, thereby reducing the damage to the wafer supported on the carrier during the pick-and-place process of the semiconductor processing technology, thereby improving the yield of the wafer. In addition, the reflecting member is used to reflect the signal, which does not need to transmit the signal, does not need to set a signal line, and is not easily interfered with. When the reflecting member is arranged on the carrier and the corresponding transceiver is arranged relative to the carrier, the accuracy of the detection of whether the carrier is in a preset position can be further improved.

[0012] The second aspect of the embodiment of the present application also provides a semiconductor device, including a wafer carrier and a reaction chamber, the wafer carrier including a carrier, a driving member connected to the carrier, at least one reflector and at least one transceiver corresponding to the reflector; the driving member drives the carrier to move; one of the reflector and the corresponding transceiver is arranged on the carrier and moves synchronously with the carrier, and the other is arranged relative to the carrier and has a fixed position; the transceiver is used to transmit signals and receive signals reflected back by the reflector, and when the intensity of the signal received by the transceiver is in a preset range, the carrier is in a preset position; the reaction chamber is used to perform process reactions, and the wafer carrier is arranged in the reaction chamber.

[0013] In some possible embodiments, the reflective element is disposed on the carrier and moves synchronously with the carrier, and the transceiver is disposed relative to the carrier.

[0014] In some possible embodiments, the carrier and one or more reflective elements and / or the transceiver elements arranged on the carrier are all arranged in the reaction chamber, and the one or more reflective elements and / or the transceiver elements arranged relative to the carrier are all arranged outside the reaction chamber.

[0015] In some possible embodiments, the signal includes an optical signal, and the transceiver includes a photoelectric sensor; the reaction chamber is further provided with an observation window, which is located between the transceiver and the corresponding reflector, and the optical signal received and returned by the reflector can pass through the observation window.

[0016] The semiconductor device provided in the embodiment of the present application has the advantages that the wafer is not easily damaged and the wafer yield can be improved. Please refer to the above for details and will not be repeated here.

[0017] The embodiments of this application can be used as independent embodiments or combined with other embodiments in this application. That is, the specific features, structures, materials, or characteristics described in the embodiments of this application can be combined in any one or more embodiments in a suitable manner. Specifically, this application does not limit this.

[0018] In addition to the technical problems solved by the embodiments of the present application described above, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions, other technical problems that can be solved by the wafer carrier and semiconductor equipment provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are some embodiments or related technologies of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] Figure 1 Schematic diagram of a carrier in a preset position in the related art;

[0021] Figure 2 A schematic diagram of the rotation of a carrier in the related art;

[0022] Figure 3 is a schematic diagram of a wafer carrying device in an embodiment of the present application;

[0023] Figure 4 Schematic diagram of the positions of the transceiver and the carrier in the embodiment of the present application;

[0024] Figure 5 Schematic diagram of the reflector in an embodiment of the present application.

[0025] Description of reference numerals:

[0026] 10-wafer;

[0027] 20-carrier;

[0028] 30-high voltage line;

[0029] 40- low voltage line;

[0030] 50-Robotic arm;

[0031] 60-sending and receiving parts; 61-second bracket;

[0032] 70-reflective element;

[0033] 71- first segment;

[0034] 72-Second subsection;

[0035] 73-through hole;

[0036] 74-accommodation cavity;

[0037] 75-reflector;

[0038] 76-first bracket;

[0039] 77-first threaded hole;

[0040] 80-reaction chamber;

[0041] 81-side wall;

[0042] 82-Observation window. DETAILED DESCRIPTION

[0043] The related art has the problem that the wafer is easily damaged and the yield is low. The inventors have found that the reason is: Figure 1 and Figure 2 , a wafer carrier device of related art. When the carrier 20 is in a preset position, the robotic arm 50 places the wafer 10 onto the carrier 20. After the carrier 20 secures the wafer 10 by suction, the wafer 10 undergoes the processing. During the processing, the wafer 10 moves, rotates, or tilts with the carrier 20. After the processing is completed, the carrier 20 returns to the preset position, and the robotic arm 50 picks up the wafer 10.

[0044] The carrier 20 is connected to an alternating electric field via a high-voltage line 30. This line transmits a high-voltage signal, causing the static electricity generated on the surface of the carrier 20 to attract the wafer 10. The position of the carrier 20 is measured by a position sensor (not shown) positioned relative to the carrier 20. The position sensor transmits the position signal to a controller (not shown) via a low-voltage line 40. When the position sensor detects that the carrier 20 is in the preset position, the alternating electric field is turned off, allowing the robotic arm 50 to perform a pick-and-place operation, namely, the robotic arm 50 reaches out to the wafer on the carrier to exchange wafers.

[0045] The high-voltage line 30 and the low-voltage line 40 are relatively close, so a shielding layer needs to be installed outside the high-voltage line 30 to reduce its interference with the low-voltage line 40. Because the carrier 20 moves, rotates, or tilts frequently, the shielding layer of the high-voltage line 30 is easily worn and interferes with the position signal transmitted by the low-voltage line 40. When the controller receives the position signal, the actual position of the carrier 20 is not the preset position. At this time, the robot arm 50 is likely to collide with the carrier 20 when performing a pick-and-place operation, breaking or even knocking the wafer 10 off. The wafer 10 is easily damaged and the yield rate is low.

[0046] An embodiment of the present application provides a wafer carrier, comprising a carrier, a driving member connected to the carrier, at least one reflector, and at least one transceiver corresponding to the reflector. The driving member drives the carrier to move; one of the reflector and its corresponding transceiver is disposed on the carrier and moves synchronously with the carrier, while the other is disposed relative to the carrier and has a fixed position; the transceiver transmits a signal and receives a signal reflected by the reflector. When the intensity of the signal received by the transceiver is within a preset range, it can be confirmed that the carrier is in a preset position. At this time, the robotic arm can perform a pick-and-place operation, which can reduce damage to the wafer and thus improve the wafer yield.

[0047] In addition, since the reflector does not need to transmit signals and does not require signal lines to be set up, it is not easily interfered with. Therefore, when the reflector is set on the carrier and the corresponding transceiver is set relative to the carrier, the accuracy of detecting whether the carrier is in the preset position can be further improved.

[0048] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. In addition, the specific features, structures, materials or characteristics described in the embodiments of the present application can be combined in an appropriate manner in any one or more embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0049] Reference Figure 3 The present invention provides a wafer support device, which includes a carrier 20, a driving member (not shown), a reflector 70, and a transceiver 60. The carrier 20 is used to support and absorb the wafer 10. The carrier 20 can be cylindrical or frustum-shaped to match the shape of the wafer 10, thereby improving the stability and uniformity of the carrier 20 in supporting the wafer 10.

[0050] In some possible embodiments, reference Figure 1 The carrier 20 is an electrostatic chuck connected to a high-voltage line 30, which is then connected to a high-voltage power supply. The high-voltage power supply generates an alternating electric field, which generates static electricity on the surface of the electrostatic chuck to attract the wafer 10, securing the wafer 10 relative to the carrier 20 and preventing the wafer 10 from falling off the surface of the carrier 20. A shielding layer is provided outside the high-voltage line 30 to shield the high-voltage line 30 and reduce interference with the low-voltage line 40.

[0051] The carrier 20 can move. For example, the carrier 20 can move along the first direction, rotate around the first direction, rotate around the second direction, or rotate around the third direction. The first direction, the second direction, and the third direction are perpendicular to each other. Figure 1 and Figure 2 The Z direction is shown, and the second direction is as Figure 1 and Figure 2 The X direction is shown, and the third direction is as Figure 1 and Figure 2 The distance that the stage 20 moves in the first direction is represented by scan position, the angle of rotation around the first direction is represented by Z-twist, the angle of rotation around the second direction is represented by X-tilt, and the angle of rotation around the third direction is represented by Y-tilt.

[0052] The carrier 20 is driven by a driver to achieve the above-mentioned movement. The driver can be a drive motor, which includes a first motor, a second motor, a third motor, and a fourth motor. The first motor controls the movement of the carrier 20 in a first direction, the second motor controls the rotation of the carrier 20 around the first direction, the third motor controls the rotation of the carrier 20 around the second direction, and the fourth motor controls the rotation of the carrier 20 around the third direction. The wafer carrier device also includes a first controller (not shown), which controls the driver via electrical signals to drive the movement of the carrier 20.

[0053] The stage 20 has a preset position (load position). In some embodiments, the preset position of the stage 20 is configured as a pick-and-place position for the robot arm 50. When the stage 20 is in the preset position, the robot arm 50 performs a pick-and-place operation without damaging the wafer. For example, the robot arm 50 can move onto the stage 20 to pick up the wafer 10 on the stage 20 or place the wafer 10 on the stage 20. In some embodiments, when the stage 20 is in the preset position, scan position = 0, Z-twist = 0°, X-tilt = 90°, and Y-tilt = 0°.

[0054] The wafer carrier provided in the embodiment of the present application includes a reflector 70 and a transceiver 60 corresponding to the reflector 70. The transceiver 60 is used to transmit signals and receive signals reflected by the reflector 70. When the intensity of the signal received by the transceiver 60 is within a preset range, the carrier 20 is in a preset position. At least one transceiver 60 and at least one reflector 70 are provided, and the transceivers 60 and the reflectors 70 correspond to each other, that is, each transceiver 60 corresponds to one reflector 70.

[0055] In the wafer carrying device provided in the embodiment of the present application, one of the reflector 70 and the corresponding transceiver 60 is disposed on the carrier 20 and moves synchronously with the carrier 20 , and the other is disposed relative to the carrier 20 and has a fixed position.

[0056] For example, in some embodiments, one reflector 70 and one transceiver 60 can be provided. Furthermore, in some embodiments, the reflector 70 can be provided on the carrier 20 and move synchronously with the carrier 20. In this case, the transceiver 60 corresponding to the reflector 70 is provided relative to the carrier 20 and has a fixed position. In other embodiments, the transceiver 60 can be fixed to the carrier 20 and move synchronously with the carrier 20, while the corresponding reflector 70 is provided relative to the carrier 20.

[0057] See Figure 3In one embodiment of the present application, a reflector 70 is disposed on a carrier 20, and a transceiver 60 is positioned relative to the carrier 20. This configuration facilitates connecting the transceiver 60 to an external control circuit for control. Furthermore, the reflector 70 disposed on the carrier 20 serves only to reflect signals, eliminating the need for signal lines and making it less susceptible to interference. Even if the shielding layer of the high-voltage line 30 in the carrier 20 wears out, causing high-voltage leakage, this will not interfere with the reflector 70, thereby improving the accuracy of detecting whether the carrier 20 is in the preset position.

[0058] In other embodiments, the reflective element 70 and the transceiver 60 may each be provided in plurality, wherein the reflective element 70 and the transceiver 60 are provided in one-to-one correspondence, that is, one transceiver 60 corresponds to one reflective element 70. Furthermore, in some embodiments, each reflective element 70 may be provided on the carrier 20, and each transceiver 60 may be provided relative to the carrier 20. Such a provision may improve the accuracy of detecting whether the carrier 20 is in a preset position. For details, please refer to the above and will not be repeated here. In other embodiments, each transceiver 60 may be provided on the carrier 20, and each reflective element 70 may be provided relative to the carrier 20. In some other embodiments, some of the transceivers 60 may be provided on the carrier 20, and their corresponding reflective elements 70 may be provided relative to the carrier 20, while another part of the transceivers 60 may be provided relative to the carrier 20, and their corresponding reflective elements 70 may be provided on the carrier 20. The embodiments of the present application do not impose any further restrictions on this.

[0059] In some embodiments, see Figure 3 The transceiver 60 includes a transmitter (not shown) and a receiver (not shown). The transmitter is used to transmit signals, and the receiver is used to receive signals reflected by the reflector. The transmitter and receiver are fixed relative to each other, and the propagation path of the signal transmitted by the transmitter and the propagation path of the signal reflected by the reflector received by the receiver are parallel to each other; alternatively, the angle between the propagation paths is greater than 0 degrees and less than 180 degrees.

[0060] For example, in some embodiments, the transceiver 60 can be an integrated structure, and the relative distance between the transmitting and receiving ends of the transceiver 60 is relatively small. When the platform is in a preset position, the signal emitted by the transmitting end, after being reflected by the reflector 70, has a propagation path close to and parallel to the propagation path of the signal emitted by the transmitting end. In other embodiments, the relative distance between the transmitting and receiving ends of the transceiver 60 can also be set to be larger, so that when the platform is in the preset position, the propagation path of the signal emitted by the transmitting end and the propagation path of the signal reflected by the reflector 70 received by the receiving end form an angle greater than 0 degrees and less than 180 degrees. In this case, because the propagation paths of the signal transmission and return signals are set at a certain angle, when the platform deviates from the preset position, the signal emitted by the transmitting end of the transceiver 60 and reflected by the reflector 70 provided on the platform 20 will deviate further, making it more difficult for the receiving end to receive the signal reflected by the reflector 70, thereby further improving the accuracy of the positioning of the platform 20.

[0061] In other embodiments, the transceiver 60 may also be a non-integrated structure, meaning that the transmitter and receiver are separate components that are positioned relative to each other and fixed relative to each other. When the platform is in a preset position, the propagation path of the signal emitted by the transmitter and the propagation path of the signal reflected by the reflector 70 form an angle greater than 0 degrees and less than 180 degrees. In the embodiments of the present application, the specific configurations of the transceiver 60 and reflector 70 encompass a variety of situations, and the embodiments of the present application do not impose any further limitations thereon.

[0062] In this embodiment and the following embodiments, an integrated transceiver 60 is used as an example in which the relative distance between the transmitting end and the receiving end is small and the propagation path of the signal emitted by the transmitting end and the propagation path of the signal reflected by the reflector 70 received by the reflecting end are parallel to each other. Figure 3 Such a configuration first facilitates the external connection of the control circuit to the transceiver 60 to realize the control of the transceiver 60 ; secondly, when there are multiple transceivers 60 and multiple reflectors 70 on the wafer carrier, it helps to avoid the mutual intersection of the propagation paths of the various detection signals, thereby reducing the interference between the detection signals and improving the accuracy of the position detection of the carrier 20 .

[0063] Please continue reading Figure 3 In this embodiment, the transceiver 60 is positioned relative to the carrier 20 and does not move with the carrier 20. The transceiver 60 is an integrated design, comprising a transmitter and a receiver, which are relatively close to each other. When the carrier 20 is in a preset position, the signal transmitted by the transmitter and the signal reflected by the reflector 70 are close to and parallel to each other.

[0064] In the embodiment of the present application, the transceiver 60 can transmit signals through a transmitting end. For example, the transceiver 60 can transmit signals in all directions, or the transceiver 60 can transmit signals toward the location of the reflector 70. The transceiver 60 transmits signals in a direction toward the location of the reflector 70, which can reduce signal fluctuations, concentrate energy, and reduce interference signals from other directions. The transceiver 60 can also receive signals through a receiving end, for example, by directionally receiving signals reflected from the location of the reflector 70.

[0065] Before securing transceiver 60, the platform 20 is positioned in a preset position. The position and angle of transceiver 60 are adjusted so that the signal transmitted by transceiver 60, after being reflected by reflector 70, can be received by transceiver 60 with as high a signal strength as possible. In other words, the strength of the signal received by transceiver 60 is as high as possible. Transceiver 60 is then secured to reduce energy waste. Once secured, the position of transceiver 60 remains unchanged regardless of the movement of platform 20. Optionally, transceiver 60 is mounted on a second bracket 61, and the position and angle of transceiver 60 are adjusted using the second bracket 61.

[0066] Please continue reading Figure 3 In the embodiment of the present application, the reflector 70 is disposed on the carrier 20 and moves synchronously with the carrier 20. The reflector 70 moves synchronously with the carrier 20, that is, the reflector 70 moves, rotates, or tilts together with the carrier 20. In some embodiments, the reflector 70 can be fixedly connected to the bottom of the carrier 20.

[0067] The embodiment of the present application utilizes the transceiver 60 and the reflector 70 to determine whether the carrier 20 is located at the preset position. When the carrier 20 is at the preset position, after the transceiver 60 transmits a signal, the reflector 70 can reflect back the signal transmitted by the transceiver 60 to the maximum extent, and the intensity of the signal received by the transceiver 60 is the greatest. When the carrier 20 deviates from the preset position, after the transceiver 60 transmits a signal, the reflector 70 partially reflects back the signal transmitted by the transceiver 60, or does not reflect it back at all. The intensity of the signal received by the transceiver 60 decreases, or no signal is received (i.e., the intensity of the signal received by the transceiver 60 is zero), and as the carrier 20 deviates more from the preset position, the intensity of the signal received by the transceiver 60 decreases.

[0068] Thus, based on the intensity of the signal reflected by the reflector 70 and received by the transceiver 60, it can be determined whether the carrier 20 is in the preset position. When the intensity of the signal reflected by the reflector 70 and received by the transceiver 60 is within a preset range, for example, when the intensity of the signal reflected by the reflector 70 and received by the transceiver 60 is greater than or equal to a preset value, the carrier 20 is in the preset position. This arrangement allows the transceiver 60 and the reflector 70 to be used to confirm whether the carrier 20 is in the preset position, reducing damage to the wafer 10 and other components during placement by the robotic arm 50, thereby improving the yield of the wafer 10.

[0069] In some possible implementations, the wafer carrier further includes a second controller (not shown) that controls the actions of the transceiver 60 and the robotic arm 50 via electrical signals. For example, the second controller controls the actions of the robotic arm 50 based on the strength of the signal received by the transceiver 60. When the strength of the signal received by the transceiver 60 is within a preset range, the second controller controls the robotic arm 50 to perform a pick-and-place operation. For example, the second controller and the first controller may be the same controller or integrated into one.

[0070] In some possible embodiments, the signal is an optical signal, and the transceiver 60 is a photoelectric sensor. The photoelectric sensor can transmit and receive optical signals, and can convert changes in light intensity into changes in electrical signals. The photoelectric sensor includes a transmitter, a receiver, and a detection circuit. The transmitter aims a light beam at a target and emits a light beam. The transmitter includes a light emitting diode, a laser diode, or an infrared emitting diode. The receiver receives the light beam and may include a photodiode or a phototransistor. The detection circuit is connected to the receiver via an electrical signal, filters out the valid signal, and detects the intensity of the valid signal. In some embodiments, the optical signal may be a laser, which has a better focusing effect and concentrated energy. The transceiver 60 transmits the optical signal and receives the optical signal reflected by the reflector 70. When the intensity of the optical signal reflected by the reflector 70 received by the transceiver 60 is within a preset range or is greater than or equal to a preset value, the carrier 20 is in a preset position.

[0071] In some embodiments, to improve the accuracy of detecting whether the carrier 20 is in the preset position, at least two reflective elements 70 and at least two transceivers 60 are provided, and the at least two transceivers 60 correspond one-to-one to the at least two reflective elements 70. Specifically, one transceiver 60 can correspond to one reflective element 70, and the corresponding transceivers 60 and reflective elements 70 constitute a detection group. Providing at least two detection groups can improve the accuracy of detecting whether the carrier 20 is in the preset position and reduce errors.

[0072] In some embodiments, further, at least two transceivers 60 are disposed relative to the carrier 20 and arranged circumferentially around the carrier 20. This arrangement, on the one hand, facilitates connecting each transceiver 60 to an external circuit, thereby avoiding affecting the accuracy of detecting whether the carrier 20 is in a preset position. On the other hand, it can avoid interference between the transceivers 60 and between the transceivers 60 and the carrier 20. Correspondingly, at least two reflectors 70 are disposed on the carrier 20 and arranged circumferentially around the carrier 20. Furthermore, in a clockwise (counterclockwise) direction, the arrangement order of each reflector 70 is consistent with the arrangement order of the corresponding transceiver 60, that is, at least two detection groups are arranged circumferentially around the carrier 20. This arrangement can reduce the intersection of the signal propagation paths between the corresponding transceivers 60 and the reflectors 70, thereby reducing mutual interference between the signals emitted by the at least two detection groups.

[0073] See Figure 4 In a specific embodiment, taking the example of two transceivers 60 and two reflectors 70, when the number is greater than two, the case of two can be referred to. The two transceivers 60 are defined as a first transceiver 60-1 and a second transceiver 60-2, respectively, and the two reflectors 70 are defined as a first reflector 70-1 and a second reflector 70-2, respectively. The first transceiver 60-1 corresponds to the first reflector 70-1, and the second transceiver 60-2 corresponds to the second reflector 70-2. The first transceiver 60-1 is used to transmit a signal to the location of the first reflector 70-1 and receive a signal reflected by the first reflector 70-1. The second transceiver 60-2 is used to transmit a signal to the location of the second reflector 70-2 and receive a signal reflected by the second reflector 70-2. When the intensity of the signal received by the first transceiver 60-1 is within a preset range, and the intensity of the signal received by the second transceiver 60-2 is within a preset range, the carrier 20 is in a preset position.

[0074] like Figure 4 As shown, the first transceiver 60-1 and the second transceiver 60-2 are both arranged relative to the carrier 20 and arranged counterclockwise around the circumference of the carrier 20. The first reflector 70-1 and the second reflector 70-2 are both set on the carrier 20 and arranged counterclockwise around the circumference of the carrier 20. The propagation path of the signal between the first transceiver 60-1 and the first reflector 70-1 does not intersect with the propagation path of the signal between the second transceiver 60-2 and the second reflector 70-2.

[0075] In some possible embodiments, the angle between the line connecting two adjacent transceivers 60 and the center of the carrier 20 is greater than 0 degrees and less than 180 degrees. In relevant embodiments where the transceiver 60 is an integrated structure, the line connecting the transceiver 60 and the center of the carrier 20 may specifically refer to the line connecting the geometric center of the transceiver 60 and the center of the carrier 20. In relevant embodiments where the transceiver 60 is a non-integrated structure and includes a transmitter and a receiver, the line connecting the transceiver 60 and the center of the carrier 20 may specifically refer to the line connecting the centers of the transmitter and receiver of the transceiver 60 and the center of the carrier 20. The angle between the line connecting two adjacent transceivers 60 and the center of the carrier 20 being greater than 0 degrees and less than 180 degrees allows the transceiver 60 to position the carrier 20 in at least two directions using the corresponding reflector 70, thereby improving the accuracy of positioning the carrier 20.

[0076] In a further embodiment, the angle between the line connecting two adjacent transceivers 60 and the center of the carrier 20 can be set to be greater than or equal to 40 degrees and less than 50 degrees. In this way, the multiple transceivers 60 are arranged compactly, which is convenient for setting up other structures, devices or equipment.

[0077] Please continue reading Figure 4 In one specific embodiment, the first transceiver 60-1 and the second transceiver 60-2 are both disposed relative to the platform 20, and the first reflector 70-1 and the second reflector 70-2 are both disposed at the bottom of the platform 20. An angle α between a line connecting the transceiver 60-1 and the center of the platform 20 and a line connecting the transceiver 60-2 and the center of the platform 20 is greater than 0 degrees and less than 180 degrees, for example, the angle α is 45 degrees.

[0078] Optionally, in some embodiments, the line connecting each transceiver 60 and the center of the carrier 20 may be consistent with, for example, coincide with, the signal propagation path formed by the transceiver 60 and the corresponding reflector 70. Figure 4 As shown, the line connecting the first transceiver 60 - 1 and the center of the platform is consistent with the signal propagation path formed by the first transceiver 60 - 1 and the first reflector 70 - 1 .

[0079] In the embodiment of the present application, each transceiver 60 may correspond to a preset value or preset interval. At least two transceivers 60 may have at least two preset values / preset intervals. The preset values / preset intervals may be the same or at least partially different, and are determined based on the positions of the corresponding transceivers 60 and reflectors 70. In some embodiments, when the strength of the signals received by all transceivers 60 is greater than or equal to the corresponding preset values, the stage 20 is in the preset position.

[0080] In some embodiments, two reflectors 70 and two transceivers 60 are provided, each corresponding to a preset value. These two preset values ​​can be the same or different. When the strength of the signal received by each transceiver 60 is greater than or equal to the corresponding preset value, the platform 20 is in the preset position and the robotic arm 50 can operate. When the strength of the signal received by at least one transceiver 60 is less than or equal to the corresponding preset value, the platform 20 is not in the preset position and the robotic arm 50 cannot operate.

[0081] Furthermore, in some embodiments, when the signal is an optical signal and the transceiver 60 is a photoelectric sensor, each photoelectric sensor can correspond to a preset value respectively. If the carrier 20 is not in the preset position, the intensity of at least one reflected light is less than the preset value, that is, when the intensity of the optical signal received by at least one transceiver 60 is less than the corresponding preset value, the carrier 20 is not in the preset position; if the carrier 20 is in the preset position, the two reflected lights are greater than or equal to the corresponding preset value, that is, when the intensity of the optical signal received by each photoelectric sensor is greater than or equal to the corresponding preset value, the carrier 20 is in the preset position.

[0082] Furthermore, in some embodiments, the reflector 70 includes a first segment 71 and a second segment 72. The first segment 71 and the second segment 72 can be cylindrical, such as a cylinder or an elliptical cylinder. In some possible embodiments, the outer circumference of the first segment 71 is flush with the outer circumference of the second segment 72, so as to provide a smooth transition between the first segment 71 and the second segment 72. In some possible embodiments, the first segment 71 and the second segment 72 can be an integral structure.

[0083] See also Figure 5 In a specific embodiment, the first segment 71 is provided with a housing cavity 74. For example, the first segment 71 is cylindrical and hollow inside to form the housing cavity 74. A reflector 75 is provided in the housing cavity 74. The reflective surface of the reflector 75 is arranged toward the second segment 72 to reflect the optical signal. For example, the reflector 75 is provided at one end of the housing cavity 74 away from the second segment 72. Such a configuration can prevent signals from other directions in the test environment from being reflected by the reflector 75, thereby reducing signal interference.

[0084] Second segment 72 is provided with a through hole 73, which communicates with accommodating cavity 74. For example, through hole 73 extends to first segment 71. In some embodiments, one end of through hole 73 faces transceiver 60, and the other end faces reflector 75, thereby creating a pathway between transceiver 60 and reflector 75 for signal transmission. Furthermore, the provision of through hole 73 prevents signals from other directions from entering reflector 70 and being reflected by reflector 75, thereby reducing signal interference.

[0085] Furthermore, in some embodiments, a light-transmitting mirror (not shown) may be provided at the end of through hole 73 away from reflector 75 to block through hole 73. This light-transmitting mirror allows, on the one hand, the optical signal emitted by transceiver 60 when configured as a photoelectric sensor to pass through the light-transmitting mirror. On the other hand, it prevents contaminants from entering through hole 73, maintaining cleanliness within through hole 73 and accommodating cavity 74.

[0086] Continue reading Figure 5 In some embodiments, the reflector 70 may further include at least one first bracket 76. The first bracket 76 is disposed around the radially outer side wall of the reflector 70 to secure the reflector 70 relative to the reflector 70. In some embodiments, a first portion of the first bracket 76 protrudes relative to the outer circumference of the reflector 70 and is provided with a first threaded hole 77; a second portion of the first bracket 76 is in contact with the outer circumference of the reflector 70. Exemplarily, two first brackets 76 are provided, both located in the first segment 71 of the reflector 70 and spaced apart.

[0087] In some embodiments, the first bracket 76 is connected to the carrier 20 through threaded fasteners, and the bottom of the carrier 20 is provided with several second threaded holes (not shown) that cooperate with the first threaded holes 77. By using threaded fasteners (such as screws and bolts) to pass through the first threaded holes 77 and the second threaded holes, the reflector 70 is fixed relative to the carrier 20.

[0088] In summary, the wafer carrying device provided in the embodiment of the present application includes a carrier 20, a reflector 70 and a transceiver 60. The reflector 70 is arranged on the carrier 20 and moves synchronously with the carrier 20. The transceiver 60 is arranged relative to the carrier 20 and has a fixed position. The transceiver 60 transmits a signal and receives a signal reflected back by the reflector 70. When the intensity of the signal received by the transceiver 60 is within a preset range, the carrier 20 is in a preset position. The preset position is configured as the pick-up and placement position of the robot arm 50. By using the transceiver 60 and the reflector 70 to confirm whether the carrier 20 is in the preset position, damage to the wafer 10 and the like caused by the robot arm 50 during pick-up and placement can be reduced, thereby improving the yield of the wafer 10.

[0089] The present invention also provides a semiconductor device, which may be an ion implantation device (ion implantation device), a material vapor deposition device, a chemical vapor deposition device, etc. The semiconductor device includes the wafer carrier device and a reaction chamber 80 in the present invention, and the reaction chamber 80 is used to perform a process reaction.

[0090] Optionally, in some embodiments, the reflector 70 is disposed on the carrier 20 and moves synchronously with the carrier 20, and the transceiver 60 is disposed relative to the carrier 20. Such a configuration can improve the accuracy of detecting whether the carrier 20 is in a preset position. For details, please refer to the above and will not be repeated here.

[0091] Optionally, in some embodiments, the carrier 20 and one or more reflective members 70 and / or transceiver 60 disposed on the carrier 20 are all disposed in the reaction chamber 80, and the one or more reflective members 70 and / or transceiver 60 disposed relative to the carrier 20 are all fixedly disposed outside the reaction chamber.

[0092] Exemplarily, in some embodiments, there are multiple transceivers 60 and multiple reflectors 70, wherein each reflector 70 is fixedly mounted on the carrier 20 and moves synchronously with the carrier 20, each transceiver 60 is arranged relative to the carrier 20, the carrier 20 and the reflector 70 are both arranged in the reaction chamber 80, and the transceiver 60 is arranged outside the reaction chamber.

[0093] In other embodiments, there are multiple transceivers 60 and multiple reflectors 70, wherein some of the transceivers are disposed on the carrier 20 and move synchronously with the carrier 20, and corresponding portions of the reflectors 70 are disposed relative to the carrier. These portions of the transceivers 60 and the carrier 20 are located within the reaction chamber 80, while these portions of the reflectors 70 are located outside the reaction chamber 80. Another portion of the transceivers 60 is disposed relative to the carrier 20 and located outside the reaction chamber 80, while another portion of the reflectors 70 is disposed on the carrier 20 and located within the reaction chamber 80. The specific arrangement of the reflectors and transceivers is not limited in detail in the present embodiment.

[0094] In some embodiments, by arranging the transceiver 60 outside the reaction chamber 80, it is separated from the carrier 20 and is not easily affected by the carrier 20, thereby improving the accuracy of the position detection of the carrier 20. In particular, the signal line of the transceiver 60 is separated from the high-voltage line 30 of the carrier 20. Even if the shielding layer of the high-voltage line 30 is worn, it will basically not interfere with the signal transmission between the transceiver 60 and the reflector 70, thereby improving the accuracy of the signal transmission of the transceiver 60 (for example, transmitting a signal to the controller).

[0095] Optionally, the signal includes an optical signal, and the transceiver 60 includes a photoelectric sensor; the reaction chamber 80 is provided with an observation window 82, which is located between the transceiver 60 and the corresponding reflector 70, and the optical signals received and returned by the reflector 70 can pass through the observation window 82.

[0096] See Figure 3In a specific embodiment, the semiconductor device provided by the embodiment of the present application includes a wafer carrier and a reaction chamber 80, the wafer carrier includes a carrier 20, a driving member (not shown) transmission-connected to the carrier 20, a reflector 70 and a transceiver 60 corresponding to the reflector 70; the driving member drives the carrier 20 to move; the reflector 70 is arranged on the carrier and moves synchronously with the carrier 20, the transceiver 60 is arranged relative to the carrier 20 and is fixed in position, the transceiver 60 is used to transmit signals and receive signals reflected back by the reflector 70, when the intensity of the signal received by the transceiver 60 is within a preset range, the carrier 20 is in a preset position; in this embodiment, the transceiver 60 is a photoelectric sensor.

[0097] Reaction chamber 80 is used to perform process reactions. A wafer carrier is disposed within reaction chamber 80. Reaction chamber 80 includes a sidewall 81, which is provided with an observation window 82. Observation window 82 is located between transceiver 60 and a corresponding reflector 70. Optical signals received and returned by reflector 70 can pass through observation window 82. That is, observation window 82 is located on the signal propagation path between transceiver 60 and the corresponding reflector 70. At least when stage 20 is in a preset position, observation window 82 is located on the signal propagation path between transceiver 60 and the corresponding reflector 70, allowing signals emitted by transceiver 60 and signals reflected by reflector 70 to pass through. That is, signals emitted by transceiver 60 can pass through observation window 82 toward reflector 70, and signals reflected by reflector 70 can pass through observation window 82 and be received by transceiver 60, thereby ensuring that transceiver 60 and reflector 70 can detect the position of stage 20. In some possible implementations, observation window 82 may be a glass window.

[0098] The semiconductor equipment provided in the embodiment of the present application includes the wafer carrier and reaction chamber in the embodiment of the present application, and thus has at least the advantages of making the wafer less susceptible to damage and improving the wafer yield. Please refer to the above for details and will not repeat them here.

[0099] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0100] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with an embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0101] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0102] All directional indications (e.g., up, down, left, right, front, back, etc.) in the various embodiments of this specification are intended solely to explain the relative positional and motion relationships between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly. The meaning of "and / or" throughout this specification includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or solutions where both A and B are satisfied.

[0103] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer carrying device, characterized in that: The wafer carrying device includes: a carrier, a driving member connected to the carrier, at least one reflecting member, and at least one transceiver corresponding to the reflecting member; The driving member drives the carrier to move; the reflecting member and one of the corresponding transceiver are arranged on the carrier and move synchronously with the carrier, and the other is arranged relative to the carrier and has a fixed position; the transceiver is used to transmit signals and receive signals reflected back by the reflecting member. When the intensity of the signal received by the transceiver is within a preset range, the carrier is at a preset position.

2. The wafer carrier device according to claim 1, wherein: The reflector is arranged on the platform and moves synchronously with the platform, and the transceiver is arranged relative to the platform.

3. The wafer carrier device according to claim 1, wherein: The transceiver comprises a transmitting end and a receiving end, wherein the transmitting end is used to transmit signals and the receiving end is used to receive signals reflected by the reflecting element; The relative positions of the transmitting end and the receiving end are fixed; the propagation path of the signal transmitted by the transmitting end and the propagation path of the signal reflected back by the reflector and received by the receiving end are parallel to each other; or, the angle between the propagation paths is greater than 0 degrees and less than 180 degrees.

4. The wafer carrier device according to claim 1, wherein: The wafer carrying device comprises at least two transceivers and at least two reflectors, and the transceivers correspond to the reflectors in a one-to-one manner; The angle between a line connecting two adjacent transceivers and / or two adjacent reflectors and the center of the carrier is greater than 0 degree and less than 180 degrees.

5. The wafer carrying device according to claim 1, wherein: The carrier is an electrostatic chuck.

6. The wafer carrier device according to any one of claims 1 to 5, characterized in that: The signal includes an optical signal, and the transceiver includes a photoelectric sensor.

7. The wafer carrying device according to claim 6, characterized in that: The reflector includes a first segment and a second segment. The first segment is provided with a housing cavity, and a reflector is provided in the housing cavity. The second segment is provided with a through hole communicating with the housing cavity, and the optical signals received and returned by the reflector can pass through the through hole.

8. A semiconductor device, characterized in that: The invention comprises a wafer carrier and a reaction chamber; the wafer carrier comprises a carrier, a driving member connected to the carrier, at least one reflector, and at least one transceiver corresponding to the reflector; the driving member drives the carrier to move; one of the reflector and the corresponding transceiver is arranged on the carrier and moves synchronously with the carrier, and the other is arranged relative to the carrier and has a fixed position; the transceiver is used to transmit signals and receive signals reflected by the reflector, and when the intensity of the signal received by the transceiver is within a preset range, the carrier is in a preset position; The reaction chamber is used for performing process reactions, and the wafer carrying device is arranged in the reaction chamber.

9. The semiconductor device according to claim 8, wherein The reflector is arranged on the platform and moves synchronously with the platform, and the transceiver is arranged relative to the platform.

10. The semiconductor device according to claim 8, wherein The carrier and one or more reflective elements and / or transceivers disposed on the carrier are all disposed in the reaction chamber, and the one or more reflective elements and / or transceivers disposed relative to the carrier are all disposed outside the reaction chamber.

11. The semiconductor device according to claim 10, wherein: The signal includes an optical signal, and the transceiver includes a photoelectric sensor; the reaction chamber is further provided with an observation window, which is located between the transceiver and the corresponding reflector, and the optical signal received and returned by the reflector can pass through the observation window.

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