High-density frame structure and manufacturing method thereof

Abstract

The invention provides a high-density frame structure and a manufacturing method thereof, and relates to the technical field of semiconductors, the high-density frame structure comprises at least two thin frames, two adjacent thin frames are combined to form a frame finished product, a gap is arranged in the frame finished product, and the width of the gap is smaller than 0.8 time of the thickness of the frame finished product. The frame finished product is formed by combining at least two thin frames, the gap width of the frame finished product is smaller than 0.8 time of the thickness of the frame finished product, and the effective bearing area of the surface of the frame finished product is increased, so that more design structures can be integrated on the surface of the frame finished product, and the surface integration density of the frame finished product is improved; high-density wiring on the surface of the frame finished product is realized, and the utilization rate of the frame finished product is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a high-density frame structure and a manufacturing method thereof. Background Art

[0002] The frame structure in semiconductor packaging is made of a metal substrate, used to secure the chip, connect pins, and provide electrical conductivity and heat dissipation. Semiconductor frame processing often involves etching and stamping. During the etching process, the chemical etching solution performs the main etching in the vertical direction, which is inevitably accompanied by horizontal side etching. This bidirectional etching characteristic results in a strong correlation between lead spacing and frame thickness. In actual production, the pin spacing within the frame must be controlled to at least 0.8 times the frame thickness to meet the process window requirements.

[0003] However, when the frame is thicker, the gaps within the frame will become larger, reducing the effective bearing area of ​​the frame surface, reducing the integration density of the frame surface, and limiting the design freedom of high-density wiring and miniaturized structures. Summary of the Invention

[0004] The present invention provides a high-density frame structure and a manufacturing method thereof, which are used to solve the technical problem that when the thickness of the frame is relatively thick, the gap inside the frame becomes larger, which reduces the effective bearing area of ​​the frame surface and reduces the integration density of the frame surface.

[0005] To solve the above technical problems, the present invention discloses a high-density frame structure, comprising: at least two thin frames, two adjacent thin frames are combined to form a frame product, a gap is set in the frame product, and the gap width is less than 0.8 times the thickness of the frame product.

[0006] Preferably, two adjacent thin frames have the same thickness.

[0007] Preferably, two adjacent thin frames have different thicknesses.

[0008] The present invention also discloses a method for manufacturing a high-density frame structure, comprising the following steps: Prepare at least two pieces of copper and clean the copper surface; Attach photosensitive adhesive to the surface of the copper material; Print the frame etching shape on the surface of the photosensitive resin to form the area to be etched; Expose the copper material to form the area to be etched, develop it after exposure, clean the photosensitive resin, and expose the area to be etched on the surface of the copper material; Performing etching on the area to be etched; Debonding the photosensitive adhesive on the surface of the copper material to produce a thin frame; The finished frame is obtained by combining two adjacent thin frames.

[0009] Preferably, the attached photosensitive adhesive comprises: Apply the photosensitive adhesive on the copper surface for the first time based on the preset coating route; Apply photosensitive adhesive a second time on the copper surface based on the optimal coating compensation route; After the photosensitive adhesive dries, the photosensitive adhesive is attached.

[0010] Preferably, applying the photosensitive adhesive for the second time on the copper surface based on the optimal coating compensation route includes: Obtaining a first photoresist smearing image, comparing the first photoresist smearing image with a target smearing image, and determining an unsmeared area; An optimal coating compensation route is generated based on the uncoated area, and a second coating of photosensitive adhesive is completed on the copper surface based on the optimal coating compensation route.

[0011] Preferably, generating an optimal smear compensation route based on the unsmeared area includes: The unpainted area is divided into a number of smear compensation sub-areas, and the smear compensation starting point and the smear compensation end point are set according to the smear compensation sub-areas; Starting from the smear compensation starting point, passing through the remaining smear compensation sub-areas in sequence until the smear compensation end point, a smear compensation route set is generated; The shortest route is obtained from the smear compensation route set to generate the optimal smear compensation route.

[0012] Preferably, drying the photosensitive adhesive comprises: Place the copper material after the second application of photosensitive adhesive into the drying equipment; Adjust the temperature of the drying airflow entering the drying equipment; Monitor the temperature of the photosensitive adhesive in real time and determine the degree of drying based on the temperature rise and fall of the photosensitive adhesive.

[0013] Preferably, determining the degree of drying based on the temperature rise and fall of the photosensitive resin includes: The temperature rise and fall rate of the photosensitive adhesive is determined according to the temperature rise and fall of the photosensitive adhesive, and the degree of drying is determined by the temperature rise and fall rate of the photosensitive adhesive.

[0014] Preferably, adjusting the temperature of the drying airflow entering the drying device includes: Heating stage: adjust the drying air flow temperature from the initial temperature to the maximum temperature; Cooling stage: The temperature of the drying air flow is adjusted from the maximum temperature to the protection temperature, wherein the maximum temperature is greater than the initial temperature and the protection temperature.

[0015] The technical solution of the present invention has the following advantages: The present invention provides a high-density frame structure and a method for manufacturing the same, relating to the field of semiconductor technology. The high-density frame structure includes at least two thin frames, which are combined to form a finished frame. A gap is provided within the finished frame, and the gap width is less than 0.8 times the thickness of the finished frame. In the present invention, the finished frame is formed by combining at least two thin frames, and the gap width within the finished frame is less than 0.8 times the thickness of the finished frame. This increases the effective load-bearing area of ​​the finished frame surface, thereby enabling the integration of more design structures on the finished frame surface, improving the integration density of the finished frame surface, achieving high-density wiring on the finished frame surface, and improving the utilization rate of the finished frame.

[0016] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the devices particularly pointed out in the written description and the accompanying drawings.

[0017] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 This is a schematic diagram of the existing frame structure; Figure 2 This is a schematic diagram of a high-density frame structure of the present invention; Figure 3 A schematic diagram of copper material in a method for manufacturing a high-density frame structure according to the present invention; Figure 4 A schematic diagram of attaching photosensitive adhesive in a method for manufacturing a high-density frame structure according to the present invention; Figure 5 Schematic diagram of exposure processing in a method for manufacturing a high-density frame structure according to the present invention; Figure 6 A schematic diagram of development in a method for manufacturing a high-density frame structure according to the present invention; Figure 7 This is a schematic diagram of etching processing in a method for manufacturing a high-density frame structure according to the present invention; Figure 8 This is a schematic diagram of the completion of the production of the first thin frame in a method for producing a high-density frame structure according to the present invention.

[0019] In the figure: 1. Copper material; 2. Frame body; 3. First thin frame; 4. Second thin frame; 5. Finished frame; 6. Photosensitive adhesive. DETAILED DESCRIPTION

[0020] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0021] In addition, in the present invention, descriptions such as "first" and "second" are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions and technical features between the various embodiments can be combined with each other, but this must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0022] Example 1 The embodiment of the present invention provides a high-density frame structure, such as Figure 1 、 Figure 2 As shown, it includes: at least two thin frames, two adjacent thin frames are combined to form a frame product 5, a gap is set in the frame product 5, and the gap width is less than 0.8 times the thickness of the frame product 5.

[0023] The working principle and beneficial effects of the above technical solution are as follows: Figure 1As shown, a gap is set on the existing frame body 2, and the size of the gap determines the lead spacing. The thickness of the existing frame body 2 is relatively large, and the gap G of the frame body 2 is 0.8 times the thickness C of the frame body 2. In the present application, the frame finished product 5 includes at least two thin frames, and the two adjacent thin frames are combined by ultrasonic co-gold welding or tin, conductive adhesive bonding, etc., wherein the thickness of the two adjacent thin frames can be the same or different. The gap width of a single thin frame is 0.8 times the thickness of the thin frame, and the thickness of the thin frame is less than the thickness of the frame finished product 5. Therefore, the gap width of a single thin frame is less than 0.8 times the thickness of the frame cost. Taking two thin frames as an example, the frame finished product 5 includes a first thin frame 3 with a thickness of X and a second thin frame 4 with a thickness of Y. The first thin frame 3 and the second thin frame 4 are combined to form the frame finished product 5. The thickness of the first thin frame 3 is X and the thickness of the second thin frame is Y. The sum of the thickness Y of the frame 4 is the thickness C of the frame body 2, the gap of the first thin frame 3 is 0.8 times X, and the gap of the second thin frame 4 is 0.8 times Y. It can be seen that the gap between the first thin frame 3 and the second thin frame 4 is less than 0.8 times the thickness C of the frame body 2. Therefore, by combining at least two thin frames to make the frame product 5, it is possible to reduce the space occupied by the gap area in the chip mounting area, increase the effective bearing area of ​​the surface of the frame product 5, so that more design structures can be integrated on the surface of the frame product 5, improve the surface integration density of the frame product 5, realize high-density wiring on the surface of the frame product 5, and improve utilization. In addition, since the frame product 5 is composed of multiple thin frames, the thickness of the thin frame is relatively small. When the stamping process is used, the tool is not prone to breakage, which extends the service life of the tool and reduces the production cost of the frame structure.

[0024] Example 2 On the basis of the above embodiment 1, Figure 3-Figure 8 As shown, the present invention also discloses a method for manufacturing a high-density frame structure, comprising the following steps: Prepare at least two pieces of copper material 1 and clean the surface of the copper material 1; Attach photosensitive adhesive 6 to the surface of the copper material 1; Print the frame etching shape on the surface of the photosensitive resin 6 to form the area to be etched; Expose the copper material 1 to form the area to be etched, perform development after exposure, and clean the photoresist 6 to expose the area to be etched on the surface of the copper material 1; Performing etching treatment on the area to be etched; Debonding the photosensitive adhesive 6 on the surface of the copper material 1 to obtain a thin frame; The frame product 5 is manufactured by combining two adjacent thin frames.

[0025] The working principle and beneficial effects of the above technical solution are as follows: taking two thin frames as an example, when making a high-density frame structure, first prepare two copper materials 1, then clean the surfaces of the two copper materials 1 respectively to ensure the bonding strength between the copper material 1 and the photosensitive adhesive 6, then attach the photosensitive adhesive 6 to the surfaces of the two copper materials 1, then print the frame etching shape on the surface of the photosensitive adhesive 6 to form an area to be etched, so that the copper material 1 can etch the corresponding required shape, then expose the copper material 1 forming the area to be etched, develop after exposure, clean the photosensitive adhesive 6, expose the area to be etched on the surface of the copper material 1, etch the area to be etched, and then remove the photosensitive adhesive 6 on the surfaces of the two copper materials 1 to obtain the first The thin frame 3 and the second thin frame 4 are combined by ultrasonic co-welding or tin, conductive adhesive bonding or any other method to obtain a frame finished product 5. The gap in the frame finished product 5 is less than 0.8 times the thickness of the frame finished product 5. Therefore, by combining at least two thin frames to obtain the frame finished product 5, the effective bearing area of ​​the surface of the frame finished product 5 can be increased, so that more design structures can be integrated on the surface of the frame finished product 5, thereby improving the utilization rate. Moreover, since the frame finished product 5 is composed of multiple thin frames, the thickness of the thin frame is relatively small. When the stamping process is used, the tool is not prone to breakage, which extends the service life of the tool and reduces the production cost of the frame structure.

[0026] Example 3 On the basis of Example 2, attaching the photosensitive adhesive 6 includes: Applying the photosensitive adhesive 6 on the surface of the copper material 1 for the first time based on the preset coating route; Applying a second photosensitive adhesive 6 on the surface of the copper material 1 based on the optimal coating compensation route; After the photosensitive adhesive 6 is dried, the attachment of the photosensitive adhesive 6 is completed.

[0027] The working principle and beneficial effects of the above technical solution are as follows: when the photosensitive adhesive 6 is attached to the surface of the copper material 1, the photosensitive adhesive 6 is first applied to the surface of the copper material 1 based on a preset application route. The preset application route is set by the user. The first application head can be used to apply the photosensitive adhesive 6 to the surface of the copper material 1 according to an S-shaped route, and then the photosensitive adhesive 6 is applied to the surface of the copper material 1 for the second time based on the optimal application compensation route. The second application head is used to apply the photosensitive adhesive 6 for the second time. The outlet diameter of the second application head is much smaller than the outlet diameter of the first application head, so that the second application of the photosensitive adhesive 6 is more delicate. After the application is completed, the copper material 1 with the photosensitive adhesive 6 is placed in a drying device for drying. After the photosensitive adhesive 6 is completely dry, the attachment of the photosensitive adhesive 6 is completed. Through two applications of the photosensitive adhesive 6, the photosensitive adhesive 6 can be spread all over the surface of the copper material 1 to avoid omissions, thereby improving the application accuracy and application quality of the photosensitive adhesive 6.

[0028] Example 4 On the basis of Example 3, applying the photosensitive adhesive 6 on the surface of the copper material 1 for the second time based on the optimal coating compensation route includes: Obtaining a first smear image of the photosensitive resin 6, comparing the first smear image of the photosensitive resin 6 with a target smear image, and determining an unsmeared area; Generate an optimal coating compensation route based on the uncoated area, and complete a second coating of the photosensitive adhesive 6 on the surface of the copper material 1 based on the optimal coating compensation route; Generating the optimal smear compensation route based on the unsmeared area includes: The unpainted area is divided into a number of smear compensation sub-areas, and the smear compensation starting point and the smear compensation end point are set according to the smear compensation sub-areas; Starting from the smear compensation starting point, passing through the remaining smear compensation sub-areas in sequence until the smear compensation end point, a smear compensation route set is generated; The shortest route is obtained from the smear compensation route set to generate the optimal smear compensation route.

[0029] The working principle and beneficial effects of the above technical solution are as follows: when applying the photosensitive adhesive 6 to the surface of the copper material 1 for the second time based on the optimal smearing compensation route, the first photosensitive adhesive 6 smearing image of the copper material 1 is first obtained by the image acquisition device, and the first photosensitive adhesive 6 smearing image is compared with the target smearing image, and the unsmeared area is determined according to the difference area between the first photosensitive adhesive 6 smearing image and the target smearing image; then, the optimal smearing compensation route is generated based on the unsmeared area, the unsmeared area is evenly divided into a number of smearing compensation sub-areas, and the smearing compensation starting point and the smearing compensation end point are set according to the smearing compensation sub-areas; starting from the smearing compensation starting point, the remaining smearing compensation sub-areas are passed through in sequence until the smearing compensation end point, and a smearing compensation route set is generated; finally, the shortest route is obtained from the smearing compensation route set to generate the optimal smearing compensation route, so that the second photosensitive adhesive 6 smearing can be completed on the surface of the copper material 1 based on the optimal smearing compensation route; When applying the photosensitive adhesive 6, if the thickness of the photosensitive adhesive 6 is uneven, it will cause the gap size deviation of the thin frame. Through the above scheme, the unapplied area after the first application of the photosensitive adhesive 6 can be eliminated, thereby improving the application quality of the photosensitive adhesive 6 on the surface of the copper material 1. The outlet diameter of the second coating head is much smaller than the outlet diameter of the first coating head, which can accurately control the range and thickness of the second application of the photosensitive adhesive 6, further improving the application quality of the photosensitive adhesive 6, making the thickness of the photosensitive adhesive 6 uniform. After the photosensitive adhesive 6 dries, a photosensitive adhesive 6 film is formed. The photosensitive adhesive 6 film with uniform thickness ensures uniform light action during exposure, thereby forming a clear graphic outline, meeting high-precision manufacturing requirements, and the uniform photosensitive adhesive 6 film can also form a complete and dense protective layer, effectively resisting mechanical friction or chemical corrosion, and ensuring the applicability of process parameters such as each exposure time and developer concentration, ensuring the consistency of the quality of the thin frame, and facilitating the precise forming of the thin frame, reducing gap edge defects or deformation problems, and ensuring that the gap of the finished frame product 5 is less than 0.8 times the thickness of the finished frame product 5.

[0030] Example 5 Based on embodiment 2 or 3, drying the photosensitive resin 6 includes: The copper material 1 after the second application of the photosensitive adhesive 6 is placed in a drying device; Adjust the temperature of the drying airflow entering the drying equipment; Monitor the temperature of the photosensitive adhesive 6 in real time and determine the degree of drying based on the temperature rise and fall of the photosensitive adhesive 6; Determining the degree of drying based on the temperature rise and fall of the photosensitive adhesive 6 includes: Determine the temperature rise and fall rate of the photosensitive adhesive 6 according to the temperature rise and fall of the photosensitive adhesive 6, and determine the degree of drying by the temperature rise and fall rate of the photosensitive adhesive 6; Adjusting the temperature of the drying airflow entering the drying equipment includes: Heating stage: adjust the drying air flow temperature from the initial temperature to the maximum temperature; Cooling stage: The temperature of the drying air flow is adjusted from the maximum temperature to the protection temperature, where the maximum temperature is greater than the initial temperature and the protection temperature.

[0031] The working principle and beneficial effects of the above technical solution are as follows: when the photosensitive adhesive 6 is drying, if the photosensitive adhesive 6 is not completely dried, it will affect the exposure and development process, making the light scattering in the exposure link more severe and the image distorted in the development stage, which will affect the size of the gap in the thin frame and reduce the yield rate of the thin frame production. Therefore, when drying the photosensitive adhesive 6, the copper material 1 after the second application of the photosensitive adhesive 6 is first placed in the drying equipment; then the temperature of the drying air flow entering the drying equipment is adjusted, including a heating stage and a cooling stage. First, the temperature of the drying air flow is adjusted from the initial temperature to the maximum temperature, and a heating stage is performed. Then, the temperature of the drying air flow is adjusted from the maximum temperature to the protection temperature. The heating stage lasts for a first preset time. The first preset time and the second preset time are both set by the user. The initial temperature range is 15℃-20℃, the maximum temperature range is 35℃-40℃, and the protection temperature range is 25℃-30℃. Preferably, the initial temperature is 20℃, the maximum temperature is 40℃, and the protection temperature is 30℃, which can improve the drying efficiency of the photosensitive glue 6 and prevent the photosensitive glue 6 from being damaged by excessive temperature. During the drying process, the temperature of the photosensitive glue 6 is monitored in real time, and the degree of drying is determined based on the temperature rise and fall of the photosensitive glue 6, that is, the temperature rise and fall rate of the photosensitive glue 6 is determined according to the temperature rise and fall of the photosensitive glue 6, and the degree of drying is determined by the temperature rise and fall rate of the photosensitive glue 6.

[0032] Example 6 On the basis of Example 5, determining the temperature rise and fall rate of the photosensitive adhesive 6 according to the temperature rise and fall of the photosensitive adhesive 6, and determining the degree of drying by the temperature rise and fall rate of the photosensitive adhesive 6 includes: Determine the heating rate of the photosensitive adhesive 6 according to the temperature rise and fall of the photosensitive adhesive 6 during the heating stage; Determine the cooling rate of the photosensitive adhesive 6 according to the temperature rise and fall of the photosensitive adhesive 6 during the cooling stage; Calculate the absolute value of the difference between the temperature rise rate of the photosensitive adhesive 6 and the temperature fall rate of the photosensitive adhesive 6 to obtain the temperature rise and fall rate of the photosensitive adhesive 6; If the temperature rise and fall rate of the photosensitive adhesive 6 exceeds the preset rate threshold, it is determined that the photosensitive adhesive 6 has not been completely dried, and the copper material 1 is put back into the drying equipment for drying; If the temperature rise and fall rate of the photosensitive resin 6 does not exceed the preset rate threshold, it is determined that the photosensitive resin 6 has completed drying.

[0033] The working principle and beneficial effects of the above technical solution are as follows: when determining the temperature rise and fall rate of the photosensitive adhesive 6, the temperature rise rate of the photosensitive adhesive 6 is determined according to the temperature rise and fall of the photosensitive adhesive 6 in the temperature rise stage; the temperature drop rate of the photosensitive adhesive 6 is determined according to the temperature rise and fall of the photosensitive adhesive 6 in the temperature drop stage; the absolute value of the difference between the temperature rise rate of the photosensitive adhesive 6 and the temperature drop rate of the photosensitive adhesive 6 is calculated to obtain the temperature rise and fall rate of the photosensitive adhesive 6; if the temperature rise and fall rate of the photosensitive adhesive 6 exceeds the preset rate threshold, it means that the temperature change value of the photosensitive adhesive 6 is too large, and there is still a certain amount of moisture in the photosensitive adhesive 6, and further drying is required. It is determined that the photosensitive adhesive 6 has not been dried, and the copper material 1 is put back into the drying equipment for drying; if the temperature rise and fall rate of the photosensitive adhesive 6 does not exceed the preset rate threshold, it means that the temperature change value of the photosensitive adhesive 6 is not large, and the photosensitive adhesive 6 does not contain water. If the photosensitive adhesive 6 is less than 0.8 times the thickness of the frame product 5, the reduction in the gap can reduce the space occupied by the gap area in the chip mounting area, increase the effective bearing area of ​​the surface of the frame product 5, so that more design structures can be integrated on the surface of the frame product 5, thereby improving the integration density of the surface of the frame product 5, realizing high-density wiring on the surface of the frame product 5, and improving the utilization rate of the frame product 5.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0035] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0036] Although the embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the description and implementation methods. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.

Claims

1. A high-density frame structure, characterized in that: include: At least two thin frames are provided, and two adjacent thin frames are combined to form a finished frame. A gap is provided in the finished frame, and the width of the gap is less than 0.8 times the thickness of the finished frame.

2. A high-density frame structure according to claim 1, characterized in that: The thickness of two adjacent thin frames is the same.

3. A high-density frame structure according to claim 1, characterized in that: The thicknesses of two adjacent thin frames are different.

4. A method for manufacturing a high-density frame structure, characterized in that: The following steps are involved: Prepare at least two pieces of copper and clean the copper surface; Attach photosensitive adhesive to the surface of the copper material; Print the frame etching shape on the surface of the photosensitive resin to form the area to be etched; Expose the copper material to form the area to be etched, develop it after exposure, clean the photosensitive resin, and expose the area to be etched on the surface of the copper material; Performing etching on the area to be etched; Debonding the photosensitive adhesive on the surface of the copper material to produce a thin frame; The finished frame is obtained by combining two adjacent thin frames.

5. The method for manufacturing a high-density frame structure according to claim 4, characterized in that: Adhesive photosensitive adhesive includes: Apply the photosensitive adhesive on the copper surface for the first time based on the preset coating route; Apply photosensitive adhesive a second time on the copper surface based on the optimal coating compensation route; After the photosensitive adhesive dries, the photosensitive adhesive is attached.

6. The method for manufacturing a high-density frame structure according to claim 5, characterized in that: The second application of photosensitive adhesive on the copper surface based on the optimal coating compensation route includes: Obtaining a first photoresist smearing image, comparing the first photoresist smearing image with a target smearing image, and determining an unsmeared area; An optimal coating compensation route is generated based on the uncoated area, and a second coating of photosensitive adhesive is completed on the copper surface based on the optimal coating compensation route.

7. The method for manufacturing a high-density frame structure according to claim 6, characterized in that: Generating the optimal smear compensation route based on the unsmeared area includes: The unpainted area is divided into a number of smear compensation sub-areas, and the smear compensation starting point and the smear compensation end point are set according to the smear compensation sub-areas; Starting from the smear compensation starting point, passing through the remaining smear compensation sub-areas in sequence until the smear compensation end point, a smear compensation route set is generated; The shortest route is obtained from the smear compensation route set to generate the optimal smear compensation route.

8. The method for manufacturing a high-density frame structure according to claim 5, characterized in that: Photosensitive adhesive drying includes: Place the copper material after the second application of photosensitive adhesive into the drying equipment; Adjust the temperature of the drying airflow entering the drying equipment; Monitor the temperature of the photosensitive adhesive in real time and determine the degree of drying based on the temperature rise and fall of the photosensitive adhesive.

9. The method for manufacturing a high-density frame structure according to claim 8, characterized in that: Determining the degree of drying based on the temperature rise and fall of the photosensitive adhesive includes: The temperature rise and fall rate of the photosensitive adhesive is determined according to the temperature rise and fall of the photosensitive adhesive, and the degree of drying is determined by the temperature rise and fall rate of the photosensitive adhesive.

10. The method for manufacturing a high-density frame structure according to claim 9, characterized in that: Adjusting the temperature of the drying airflow entering the drying equipment includes: Heating stage: adjust the drying air flow temperature from the initial temperature to the maximum temperature; Cooling stage: The temperature of the drying air flow is adjusted from the maximum temperature to the protection temperature, where the maximum temperature is greater than the initial temperature and the protection temperature.

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