Display panel and display device

Abstract

The invention provides a display panel and a display device. The display panel comprises a substrate, a driving electrode and a diversion layer, wherein the driving electrode and the diversion layer are located on one side of the substrate. The diversion layer is located on the side, away from the substrate, of the film layer where the driving electrode is located and comprises a first opening and a diversion part at least surrounding the first opening. In the direction perpendicular to the plane where the substrate is located, the flow guide parts are overlapped with the driving electrodes. The display panel further comprises a light-emitting element and a connecting structure. The light-emitting element is located on the side, away from the substrate, of the diversion layer. The light-emitting element comprises a light-emitting body and a plurality of binding electrodes. The connecting structure is located between the driving electrode and the binding electrode, and at least part of the connecting structure is located in the first opening. According to the invention, the arrangement of the first opening and the diversion part helps to limit the connection structure in a certain area and inhibit the phenomenon that the connection structure overflows from the first opening, so that short circuit between semiconductor layers in the light-emitting main body can be avoided, and short circuit between different binding electrodes can be avoided.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] In the prior art, the preparation process of some display panels usually includes a bonding step of the light-emitting element. In this bonding step, it is often necessary to set a bonding metal (such as metal tin) between the binding electrode of the light-emitting element and the driving electrode on the driving substrate, and heat the bonding metal to a molten state. After being cooled and solidified, the bonding metal can serve to fix the light-emitting element on the array substrate.

[0003] It should be noted that when the above-mentioned bonding metal is in a molten state, the binding electrode of the light-emitting element usually squeezes the bonding metal, causing the molten bonding metal to overflow to an area far away from the bonding position, which can easily lead to short circuits between some structures and cause short circuits. Summary of the Invention

[0004] In view of this, the present application provides a display panel and a display device to solve the above-mentioned short circuit phenomenon caused by the overflow of bonding metal.

[0005] In a first aspect, the present application provides a display panel comprising a substrate, a drive electrode located on one side of the substrate, and a flow-guiding layer. The flow-guiding layer is located on a side of a film layer containing the drive electrode, away from the substrate. The flow-guiding layer comprises a first opening and a flow-guiding portion surrounding at least the first opening. The flow-guiding portion overlaps the drive electrode in a direction perpendicular to the plane of the substrate.

[0006] The display panel also includes a light-emitting element and a connecting structure. The light-emitting element is located on a side of the guide layer away from the substrate and includes a light-emitting body and a plurality of binding electrodes. The connecting structure is located between the drive electrode and the binding electrode, with at least a portion of the connecting structure located within the first opening.

[0007] In a second aspect, the present application provides a display device, comprising the display panel provided in the first aspect.

[0008] In the present application, the provision of the first opening and the guide portion helps confine the connection structure to a certain area, making it difficult for the molten connection structure to climb to the side portions of the light-emitting body after being deformed by force, thereby preventing short circuits between semiconductor layers within the light-emitting body. In addition, when the connection structure is prevented from overflowing the first opening, the risk of contact between connection structures corresponding to different binding electrodes is also reduced, which helps prevent short circuits between different binding electrodes. Furthermore, the risk of short circuits between different drive electrodes is also reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] Figure 1 is a schematic diagram of a partial structure of a display panel related to the present application; Figure 2 is a schematic diagram of a partial structure of a display panel related to the present application; Figure 3 is a schematic diagram of a partial structure of a display panel related to the present application; Figure 4 A schematic diagram of a partial structure of a display panel provided in this application; Figure 5 A schematic diagram of a partial structure of a display panel provided in this application; Figure 6 A schematic diagram of a partial structure of a display panel provided in this application; Figure 7 A schematic diagram of a partial structure of a display panel provided in this application; Figure 8 A schematic diagram of a partial structure of a display panel provided in this application; Figure 9 A schematic diagram of a partial structure of a display panel provided in this application; Figure 10 A schematic diagram of a partial structure of a display panel provided in this application; Figure 11 A schematic diagram of a partial structure of a display panel provided in this application; Figure 12 A schematic diagram of a partial structure of a display panel provided in this application; Figure 13 A schematic diagram of a partial structure of a display panel provided in this application; Figure 14 A schematic top view of a partial structure of a display panel provided in this application; Figure 15 for Figure 14 A schematic cross-sectional view of a portion of the structure shown along section line AA'; Figure 16 A schematic top view of a partial structure of a display panel provided in this application; Figure 17 for Figure 16 A schematic cross-sectional view of a portion of the display panel structure along section line BB' is shown; Figure 18 A schematic diagram of a partial structure of a display panel provided in this application; Figure 19 A schematic top view of a partial structure of a display panel provided in this application; Figure 20 for Figure 19 A schematic cross-sectional view of a portion of the display panel structure along section line CC' is shown; Figure 21 A schematic top view of a partial structure of a display panel provided in this application; Figure 22 for Figure 21 A schematic cross-sectional view of a portion of the display panel structure along section line DD' is shown; Figure 23 A schematic diagram of a partial structure of a display panel provided in this application; Figure 24 A schematic top view of a partial structure of a display panel provided in this application; Figure 25 for Figure 24 A schematic cross-sectional view of a portion of the display panel structure along section line EE' is shown; Figure 26 A schematic top view of a partial structure of a display panel provided in this application; Figure 27 for Figure 26 A schematic cross-sectional view of a portion of the display panel structure along section line FF' is shown; Figure 28 A schematic diagram of a partial structure of a display panel provided in this application; Figure 29 A schematic top view of a partial structure of a display panel provided in this application; Figure 30 A schematic top view of a partial structure of a display panel provided in this application; Figure 31 for Figure 30 A schematic cross-sectional view of a portion of the display panel structure along section line GG' is shown; Figure 32 A schematic diagram of a display device provided in this application. DETAILED DESCRIPTION

[0011] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0012] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0013] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0014] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0015] It will be apparent to those skilled in the art that various modifications and variations can be made to this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and variations of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the embodiments provided in the examples of this application may be combined with each other unless there is any inconsistency.

[0016] Figure 1 is a schematic diagram of a partial structure of a display panel related to the present application, Figure 2 This is a schematic diagram of a partial structure of a display panel related to this application. It should be noted that Figure 1 and Figure 2 They are schematic diagrams of the structures corresponding to different stages of the existing display panel during the lamination process. Figure 2 The corresponding display panel structure appears later than Figure 1 The moment when the corresponding display panel structure appears.

[0017] In the prior art, when preparing a display panel including a light emitting device of a relatively small size, it is usually necessary to bond the light emitting device to the array substrate by means of a transfer bonding process. Figure 1 and Figure 2A drive electrode 011 is provided on one side of substrate 01. A light-emitting element 02 (e.g., a micro-LED) includes a light-emitting body 021 and a bonding electrode 022 for bonding to drive electrode 011. A connecting structure 03 is typically located between drive electrode 011 and bonding electrode 022. During transfer bonding of light-emitting element 02, connecting structure 03 is typically heated to a molten state, and then pressed toward substrate 01. After cooling and solidifying, connecting structure 03 secures light-emitting element 02 to one side of substrate 01.

[0018] During the process of laminating the light-emitting element 02 to the array substrate 01, the molten connecting structure 03 is fluid and easily squeezed and deformed by the combined action of the binding electrode 022 and the driving electrode 011. At this point, the molten connecting structure 03, due to the combined action of surface tension and its dependence on the binding electrode 022, easily climbs up to the light-emitting body 021 of the light-emitting element 02.

[0019] Figure 3 is a schematic diagram of a partial structure of a display panel related to the present application, Figure 3 The three-dimensional structure of the light-emitting element is shown in FIG.

[0020] In particular, combined Figure 2 and Figure 3 Because the side portion 021a of the light-emitting body 021 often protrudes beyond the binding electrode 022, the connecting structure 03 can easily climb to the side surface Sa of the side portion 021a during the pressing process, causing a short circuit in the light-emitting body 021 and hindering the light emission of the light-emitting element 02. This short circuit occurs because the light-emitting body 021 typically includes multiple semiconductor layers. When the connecting structure 03 climbs to the side surface Sa, some of the semiconductor layers in the light-emitting body 021 are short-circuited to each other through the connecting structure 03.

[0021] In addition, during the pressing process of the light-emitting element 02, the molten connection structure 03 is also likely to diffuse into the area between the two binding electrodes 022. When the connection structure 03 diffuses to a certain extent, the connection structures 03 corresponding to the two binding electrodes 022 may contact each other, forming a conductive path 03a, which in turn causes a short circuit between the two binding electrodes 022, hindering the normal operation of the light-emitting element 02. Furthermore, the existence of the conductive path 03a can also cause a short circuit between the driving electrodes 011 corresponding to the two binding electrodes. It should be noted that if Figure 1 As shown, in the direction perpendicular to the plane of the substrate 04, the portion of the connection structure 03 that does not overlap with the binding electrode 022 (herein referred to as the redundant portion, corresponding to Figure 1 The redundant portion 03b is relatively large, and in the lateral direction X, the redundant portion 03b can be located on the side of the binding electrode 022 close to the side portion 021a. Therefore, in this case, during the process of pressing the light-emitting element 02 to the array substrate 01, the tendency of the connecting structure 03 to climb toward the side surface Sa after being squeezed can be stronger than the tendency of the connecting structure 03 to spread toward the area between the two binding electrodes 022. Therefore, the risk of a short circuit between different semiconductor layers in the light-emitting body 021 is higher than the risk of a short circuit between the two binding electrodes 022.

[0022] Figure 4 A schematic diagram of a partial structure of a display panel provided in this application.

[0023] In response to the above problems, Figure 4 As shown, the present application provides a display panel 10, which includes a substrate 1, a drive electrode 2 located on one side of the substrate 1, and a guide layer 3. The guide layer 3 is located on the side of the film layer where the drive electrode 2 is located, away from the substrate 1; the guide layer 3 includes a first opening 31 and a guide portion 32 surrounding at least the first opening 31, wherein the first opening 31 can accommodate a portion of the structure of the display panel 10, and the guide portion 32 can prevent the structure accommodated in the first opening 31 from overflowing the first opening 31.

[0024] The display panel 10 also includes a light-emitting element 4, which is located on the side of the guide layer 3 away from the substrate 1. The light-emitting element 4 includes a light-emitting body 41 and multiple binding electrodes 42. The light-emitting element 4 can be a micro light-emitting diode (MLD). The light-emitting body 41 can include a P-type semiconductor layer and an N-type semiconductor layer. Some carriers in the P-type semiconductor layer can combine with some carriers in the N-type semiconductor layer to achieve light emission from the light-emitting element 4.

[0025] The display panel 10 further includes a connecting structure 5, which is located between the driving electrode 2 and the binding electrode 42, and at least a portion of the connecting structure 5 is located in the first opening 31. The connecting structure 5 can be electrically connected to both the driving electrode 2 and the binding electrode 42 to transmit the electrical signal transmitted by the driving electrode 2 to the binding electrode 42. The connecting structure 5 can include metal tin.

[0026] During the transfer bonding process of the light-emitting element 4, the connecting structure 5 is typically heated to a molten state, after which the light-emitting element 4 can be pressed against the side of the substrate 01 near the drive electrode 2. During this process, the molten connecting structure 5 can have strong fluidity. Therefore, when the light-emitting element 4 is pressed, the bonding electrode 42 can compress the connecting structure 5, causing the connecting structure 5 to deform under stress. Because the connecting structure 5 can be located within the first opening 31, the deformation of the connecting structure 5 after being squeezed by the bonding electrode 42 can be suppressed by the guide portion 32, hindering the diffusion of the connecting structure 5 in certain directions. Furthermore, the heating method for the connecting structure 5 can include irradiating the connecting structure 5 with a laser.

[0027] In the embodiment of the present application, the provision of the first opening 31 and the guide portion 32 helps confine the connection structure 5 to a certain area (for example, it can prevent the connection structure 5 from overflowing the first opening 31). This makes it difficult for the molten connection structure 5 to climb to the side portion 41a of the light-emitting body 41 after being deformed by force, thereby preventing short circuits between semiconductor layers within the light-emitting body 41. In addition, when the connection structure 5 is prevented from overflowing the first opening 31, the risk of contact between the connection structures 5 corresponding to different binding electrodes 42 is also reduced, helping to prevent short circuits between different binding electrodes 42. Furthermore, the risk of short circuits between different drive electrodes 2 is also reduced.

[0028] In addition, if Figure 4 As shown, the display panel 10 may further include multiple circuit structures P, each of which may include multiple transistors. The film layer containing the multiple transistors may be located between the film layer containing the drive electrodes 2 and the substrate 1. The multiple circuit structures P may include pixel circuits; some of the drive electrodes 2 may be electrically connected to the circuit structures P, and some of the drive electrodes 2 may be electrically connected to the wiring structures M. Both the circuit structures P and the wiring structures M may be used to transmit electrical signals to the drive electrodes 2.

[0029] In one embodiment of the present application, Figure 4 As shown, in a direction perpendicular to the plane of the substrate 1 , the binding electrode 42 overlaps with the first opening 31 .

[0030] During the transfer bonding process of the light-emitting element 4, the bonding electrode 42 can squeeze the molten connection structure 5 in a direction perpendicular to the plane of the substrate 1. When the bonding electrode 42 overlaps the first opening 31, the molten connection structure 5, after being subjected to force, tends to diffuse into the interior of the first opening 31 more than to diffuse out of the first opening 31. Therefore, the arrangement of the embodiment of the present application helps to increase the proportion of the connection structure 5 remaining in the first opening 31, reducing the aforementioned short circuit phenomenon caused by overflow of the connection structure 5.

[0031] In one possible implementation, Figure 4 As shown, in the first direction X, the width of the first opening 31 can be greater than the width of the binding electrode 42. In this implementation, the smaller width of the binding electrode 42 and the overlapping arrangement of the binding electrode 42 and the first opening 31 help ensure that the portion of the molten connection structure 5 that contacts the binding electrode 42 (which can be called the force-bearing portion) overlaps with the first opening 31. Furthermore, this force-bearing portion can be located within the first opening 31, helping to reduce the risk of the molten connection structure 5 overflowing the first opening 31 due to deformation caused by the force.

[0032] Figure 5 A schematic diagram of a partial structure of a display panel provided in this application.

[0033] In one embodiment of the present application, Figure 5 As shown, the light-emitting element 4 includes a first binding electrode 42 a and a second binding electrode 42 b arranged along a first direction X. During the bonding transfer process of the light-emitting element 4 , the first binding electrode 42 a and the second binding electrode 42 b can squeeze the molten connection structure 5 , and the connection structure 5 can diffuse in multiple directions (e.g., the first direction X, the second direction Y, etc.) after being subjected to force.

[0034] It should be noted that if the connection structure 5 corresponding to the first binding electrode 42 a (which may be referred to as the first connection structure) overflows the first opening 31 and continues to spread in the first direction X, while the connection structure 5 corresponding to the second binding electrode 42 b (which may be referred to as the second connection structure) overflows the first opening 31 and continues to spread in the opposite direction of the first direction X, there is a risk that the first connection structure and the second connection structure may contact each other and cause a short circuit. To prevent a short circuit between the first binding electrode 42 a and the second binding electrode 42 b, it is necessary to prevent the first connection structure from spreading toward the second binding electrode 42 b and / or to prevent the second connection structure from spreading toward the first binding electrode 42 a.

[0035] A length L2 of the first opening 31 in the second direction Y is greater than a length L1 of the first opening 31 in the first direction X, and the second direction Y intersects the first direction X.

[0036] In the embodiment of the present application, when the molten connecting structure 5 is squeezed and diffuses, due to the obstruction of the guide portion 32 and considering that L2>L1, the first connecting structure is more likely to diffuse along the second direction Y (and / or the direction opposite to the second direction Y) than along the first direction X. In other words, the arrangement of this embodiment facilitates the diffusion of the first connecting structure in a direction parallel to the second direction Y, hindering the diffusion of the first connecting structure toward the second binding electrode 42b. Conversely, the arrangement of this embodiment also facilitates the diffusion of the second connecting structure toward the first binding electrode 42a, thereby effectively reducing the risk of contact between the first and second connecting structures.

[0037] Figure 6 This is a schematic diagram of a partial structure of a display panel provided in this application. Figure 7 This is a schematic diagram of a partial structure of a display panel provided in this application. Figure 8 This is a schematic diagram of a partial structure of a display panel provided in this application. Figure 9 A schematic diagram of a partial structure of a display panel provided in this application.

[0038] In one embodiment of the present application, Figure 6 、 Figure 7 、 Figure 8 and Figure 9 The light emitting element 4 includes a first binding electrode 42 a and a second binding electrode 42 b arranged along the first direction X.

[0039] The guide portion 32 includes a first guide portion 321 and a second guide portion 322 opposite to each other along the first direction X. The first guide portion 321 is located between the first binding electrode 42 a and the second binding electrode 42 b . The second guide portion 322 may be located on a side of the binding electrode 42 away from the first guide portion 321 .

[0040] The first guide portion 321 includes a first bottom surface 321a and a first side surface 321b close to the second guide portion 322 . The angle between the first side surface 321b and the first bottom surface 321a is a first angle θ1 . The opening corresponding to the first angle θ1 can face the second guide portion 322 .

[0041] The second guide portion 322 includes a second bottom surface 322a and a second side surface 322b close to the first guide portion 321 . The angle between the second side surface 322b and the second bottom surface 322a is a second angle θ2 . The opening corresponding to the second angle θ2 can face the first guide portion 321 .

[0042] The second angle θ2 is smaller than the first angle θ1.

[0043] like Figure 6As shown, the first angle θ1 and the second angle θ2 can satisfy the following: θ2 < θ1 < 90°. In this case, the second side surface 322b is more inclined than the first side surface 321b. During the bonding process of the light-emitting element 4, the connecting structure 5 encounters greater resistance when spreading and contacting the second side surface 322b. This means that the second guide portion 322 provides a better barrier to the connecting structure 5. Considering the high risk of the connecting structure 5 climbing to the side portion 41a in the prior art, the arrangement of this embodiment can specifically suppress the tendency of the connecting structure 5 to spread to the side portion 41a, reducing the risk of short circuits between the semiconductor layers of the light-emitting element 4.

[0044] like Figure 7 As shown, the first angle θ1 and the second angle θ2 can satisfy: 90°=θ2<θ1. Similarly, under this arrangement, the risk of the connection structure 5 overflowing toward the side portion 41a can be reduced.

[0045] like Figure 8 As shown, the first angle θ1 and the second angle θ2 can satisfy the following: 90° < θ2 < θ1. In this case, when the connecting structure 5 is squeezed, the connecting structure 5 in the first opening 31 diffuses toward the first side surface 321b and the second side surface 322b on either side. After contacting the first side surface 321b and the second side surface 322b, the connecting structure 5 continues to diffuse along these two side surfaces. The diffusion direction includes upward along the side surface and downward along the side surface. When the first angle θ1 and the second angle θ2 are both acute angles, the connecting structure 5 primarily diffuses downward along the first side surface 321b (second side surface 322b). It should be noted that the smaller the acute angles (the first angle θ1 and the second angle θ2), the more difficult it is for the connecting structure 5 to diffuse upward along the first side surface 321b (second side surface 322b), and the less likely the connecting structure 5 is to overflow the first opening 31. Therefore, the arrangement of 90°<θ2<θ1 can reduce the risk of the connection structure 5 overflowing toward the side portion 41 a and avoid short circuits between the semiconductor layers included in the light emitting element 4 .

[0046] like Figure 9 As shown, the first angle θ1 and the second angle θ2 can satisfy: θ2<θ1=90°. This arrangement can specifically suppress the tendency of the connection structure 5 to spread toward the side portion 41a, reducing the risk of short circuit between the semiconductor layers of the light emitting element 4.

[0047] Figure 10 This is a schematic diagram of a partial structure of a display panel provided in this application. Figure 11 This is a schematic diagram of a partial structure of a display panel provided in this application. Figure 12 A schematic diagram of a partial structure of a display panel provided in this application.

[0048] In one embodiment of the present application, Figure 10 、 Figure 11 and Figure 12 The light emitting element 4 includes a first binding electrode 42 a and a second binding electrode 42 b arranged along the first direction X.

[0049] The guide portion 32 includes a first guide portion 321 and a second guide portion 322 opposite to each other along the first direction X. The first guide portion 321 is located between the first binding electrode 42 a and the second binding electrode 42 b . The second guide portion 322 may be located on a side of the binding electrode 42 away from the first guide portion 321 .

[0050] The first guide portion 321 includes a first bottom surface 321a and a third side surface 321c facing away from the second guide portion 322 . The angle between the third side surface 321c and the first bottom surface 321a is a third angle θ3 . The opening corresponding to the third angle θ3 can face away from the second guide portion 322 .

[0051] The second guide portion 322 includes a second bottom surface 322a and a fourth side surface 322c facing away from the first guide portion 321 . The angle between the fourth side surface 322c and the second bottom surface 322a is a fourth angle θ4 . The opening corresponding to the fourth angle θ4 can face away from the first guide portion 321 .

[0052] The third angle θ3 is an obtuse angle and is greater than the fourth angle θ4.

[0053] In one possible implementation, combining Figure 10 and Figure 11 , the third angle θ3 and the fourth angle θ4 can satisfy: θ3>θ4≥90°.

[0054] In one possible implementation, Figure 12 As shown, the third angle θ3 and the fourth angle θ4 may satisfy: θ3>θ4 and θ4<90°.

[0055] If the molten connecting structure 5 overflows the first opening 31, it can slide down along the third side surface 321c and the fourth side surface 322c. The greater the inclination of these two side surfaces (the third side surface 321c and the fourth side surface 322c), the less likely the connecting structure 5 is to slide down. In this embodiment, the inclination of the third side surface 321c is less than that of the fourth side surface 322c. This reduces the risk of the connecting structure 5 (after overflowing the first opening 31) sliding down along the third side surface 321c to the bottom of the first guide portion 321. This helps reduce the risk of the connecting structures 5 corresponding to the first and second binding electrodes 42a, 42b, respectively, contacting each other after overflow, thereby reducing the probability of a short circuit between the two binding electrodes 42. Furthermore, due to the greater inclination of the fourth side surface 322c, the overflowing connecting structure 5 has a greater tendency to slide down along the fourth side surface 322c, helping to reduce the probability of the overflowing connecting structure 5 climbing up to the side portion 41a.

[0056] Figure 13 A schematic diagram of a partial structure of a display panel provided in this application.

[0057] In one embodiment of the present application, Figure 13 As shown, the guide layer 3 further includes a support layer 3 a and a conductive connection layer 3 b . The conductive connection layer 3 b is located on a side of the support layer 3 a away from the substrate 1 .

[0058] The conductive connection layer 3b can transmit electrical signals. If the conductive connection layer 3b contacts the drive electrode 2, the electrical signal transmitted on the drive electrode 2 can be transmitted to the conductive connection layer 3b. The conductive connection layer 3b can be made of at least one of metal titanium, metal aluminum, etc.

[0059] The support layer 3a may be an insulating layer. If an array layer including pixel circuits is provided between the guide layer 3 and the substrate 1 , the support layer 3a may also prevent external water and oxygen from corroding the array layer.

[0060] The first opening 31 includes a first sub-opening 3 a 0 , which penetrates the supporting layer 3 a and exposes at least a portion of the driving electrode 2 .

[0061] The connection structure 5 is connected to the driving electrode 2 at the first sub-opening 3 a 0 .

[0062] In the embodiment of the present application, the provision of the first sub-opening 3a0 helps to provide an accommodation space, thereby accommodating the connection structure 5 and helping to reduce the risk of the connection structure 5 overflowing from the first opening 31 .

[0063] In one embodiment of the present application, Figure 13As shown, the conductive connection layer 3 b includes a first portion 3 b 1 located in the first sub-opening 3 a 0 , and the first portion 3 b 1 is connected between the connection structure 5 and the driving electrode 2 .

[0064] In the embodiment of the present application, the first portion 3b1 is connected between the connection structure 5 and the drive electrode 2, which helps achieve contact between the connection structure 5 and the first portion 3b1. Since the conductive connection layer 3b may include a metal material, and considering the good adhesion between the molten connection structure 5 and the metal material, this arrangement helps improve the electrical connection between the connection structure 5 and the first portion 3b1, and thus improve the electrical connection between the connection structure 5 and the drive electrode 2. The reason for the good adhesion between the molten connection structure 5 and the metal material is that when the connection structure 5 includes tin and the conductive connection layer 3b includes a titanium-aluminum alloy, the adhesion between the molten tin and the metal material (such as the titanium-aluminum alloy) is often strong.

[0065] In one embodiment of the present application, Figure 13 As shown, the first portion 3 b 1 fills the first sub-opening 3 a 0 and the connection structure 5 is electrically connected to the driving electrode 2 through the first portion 3 b 1 .

[0066] In this embodiment, the first portion 3b1 fills the first sub-opening 3a0, meaning that the first portion 3b1 covers the first sub-opening 3a0. Without considering the bonding electrode 42, the connection structure 5 can only contact the conductive connection layer 3b, resulting in a larger contact area between the connection structure 5 and the conductive connection layer 3b. Because the molten connection structure 5 has good adhesion to the metal material, the arrangement of this embodiment helps improve the adhesion of the connection structure 5 to the conductive connection layer 3b, thereby improving the bonding stability of the light-emitting element 4.

[0067] Figure 14 This is a schematic top view of a partial structure of a display panel provided in this application. Figure 15 for Figure 14 The schematic cross-sectional view of a portion of the structure shown is along the section line AA'. For ease of understanding, the dotted boxes in the figure are used to mark the portion of the opening structure.

[0068] In one embodiment of the present application, Figure 14 and Figure 15 The first opening 31 includes a second sub-opening 3b0, and the second sub-opening 3b0 penetrates the conductive connection layer 3b; the first portion 3b1 surrounds the second sub-opening 3b0, and the connection structure 5 contacts the driving electrode 2 at the second sub-opening 3b0.

[0069] In the embodiment of the present application, the provision of the second sub-opening 3b0 can provide additional accommodation space, and part of the connection structure 5 can be located within the second sub-opening 3b0, which helps to further reduce the risk of the connection structure 5 overflowing.

[0070] Figure 16 This is a schematic top view of a partial structure of a display panel provided in this application. Figure 17 for Figure 16 The cross-sectional view of a portion of the display panel structure along the section line BB' is shown. For easier understanding, the dotted boxes in the figure are used to mark a portion of the opening structure.

[0071] In one embodiment of the present application, Figure 16 and Figure 17 The first opening 31 includes a second sub-opening 3b0, which penetrates the conductive connection layer 3b; the outer edge of the orthographic projection of the second sub-opening 3b0 on the substrate 1 surrounds the orthographic projection of the first sub-opening 3a0 on the substrate 1.

[0072] The connecting structure 5 is in direct contact with the driving electrode 2 .

[0073] In this embodiment of the present application, the orthographic projection area of ​​the second sub-opening 3b0 can be larger than the orthographic projection area of ​​the first sub-opening 3a0. Therefore, the conductive portion of the conductive connection layer 3b may not be provided in the first region a of the guide portion 32 (the portion of the conductive connection layer 3b other than the second sub-opening 3b0 may be provided). In this case, the space in the first region a that would otherwise be used to provide the conductive portion can be used to accommodate the connection structure 5, further increasing the space within the first opening 31 that can accommodate the connection structure 5.

[0074] Figure 18 A schematic diagram of a partial structure of a display panel provided in this application.

[0075] In one embodiment of the present application, Figure 18 As shown, the conductive connection layer 3b includes a second portion 3b2 located in the first opening 31, and the second portion 3b2 surrounds the second sub-opening 3b0.

[0076] The connecting structure 5 is in contact with the second portion 3b2.

[0077] Taking into account the good adhesion between the connection structure 5 and the conductive connection layer 3b, the embodiment of the present application sets the connection structure 5 in contact with the second part 3b2 of the conductive connection layer 3b, which helps to further increase the space within the first opening 31 that can be used to accommodate the connection structure 5 while enhancing the adhesion between the connection structure 5 and the guide layer 3 as much as possible, thereby helping to improve the bonding stability of the light-emitting element 4.

[0078] Figure 19This is a schematic top view of a partial structure of a display panel provided in this application. Figure 20 for Figure 19 The cross-sectional view of a portion of the display panel structure along the section line CC' is shown. For easier understanding, the dotted boxes in the figure are used to mark a portion of the opening structure.

[0079] In one possible implementation, combining Figure 19 and Figure 20 , the orthographic projection of the second sub-opening 3b0 of the conductive connection layer 3b on the substrate 1 coincides with the orthographic projection of the first sub-opening 3a0 on the substrate 1. In this implementation, the coincidence of the second sub-opening 3b0 and the first sub-opening 3a0 means that the complexity of preparing the guide layer 3 can be reduced, saving costs. For example, if the first sub-opening 3a0 and the second sub-opening 3b0 are prepared using a mask etching method, considering that the second sub-opening 3b0 coincides with the first sub-opening 3a0, the same mask can be used to implement the etching process when preparing the support layer 3a and the conductive connection layer 3b separately.

[0080] Figure 21 This is a schematic top view of a partial structure of a display panel provided in this application. Figure 22 for Figure 21 FIG. 1 is a schematic cross-sectional view of a portion of the display panel structure along section line DD′.

[0081] In one embodiment of the present application, Figure 21 and Figure 22 The driving electrode 2 includes a first connecting portion 21 and a second connecting portion 22 arranged along the first direction X, and a first hollow portion 23 is provided between the first connecting portion 21 and the second connecting portion 22 .

[0082] The orthographic projection of the first hollow portion 23 on the substrate 1 overlaps with the orthographic projection of the first opening 31 on the substrate 1. In this case, the first hollow portion 23 and the first opening 31 can overlap in a direction perpendicular to the plane of the substrate 1. This allows the portion of the first hollow portion 23 that overlaps with the first opening 31 to increase the space available for accommodating the connection structure 5. This is because, when preparing a portion of the membrane structure (e.g., the guide layer 3) located on the side of the membrane layer where the drive electrode 2 is located away from the substrate 1, the presence of the first hollow portion 23 allows a portion of this membrane structure (herein referred to as the filling portion) to be disposed within the first hollow portion 23. This allows the space originally reserved for the filling portion to be used to accommodate the connection structure 5.

[0083] In one embodiment of the present application, Figure 21 and Figure 22 In the first direction X, the width w1 of the first hollow portion 23 is smaller than the width L1 of the first opening 31 .

[0084] When w1 < L1, the width of the portion of the first hollow portion 23 that overlaps the first opening 31 (herein referred to as the hollow overlapping portion) is also less than L1. Since the first hollow portion 23 can overlap the first opening 31, the hollow overlapping portion can be considered as additional space at the bottom of the first opening 31 (for storing the connecting structure 5). It should be noted that the hollow overlapping portion and the first opening 31 can form a funnel-shaped storage space. When the bonding electrode 42 squeezes the molten connecting structure 5, the connecting structure 5 has a high tendency to diffuse toward the bottom of the funnel-shaped storage space, helping to reduce the risk of the connecting structure 5 overflowing the first opening 31.

[0085] Figure 23 A schematic diagram of a partial structure of a display panel provided in this application.

[0086] In one embodiment of the present application, Figure 23 As shown, the guide layer 3 further includes a support layer 3 a and a conductive connection layer 3 b . The conductive connection layer 3 b is located on a side of the support layer 3 a away from the substrate 1 .

[0087] The first opening 31 includes a first sub-opening 3 a 0 , which penetrates the supporting layer 3 a and exposes at least a portion of the driving electrode 2 .

[0088] In a direction perpendicular to the plane of the substrate 1, the first sub-opening 3a0 overlaps with the first hollow portion 23. At this time, the portion of the first hollow portion 23 that overlaps with the first sub-opening 3a0 can communicate with the first sub-opening 3a0.

[0089] The conductive connection layer 3b includes a first portion 3b1, which fills the first sub-opening 3a0 and the first hollow portion 23. The connection structure 5 is electrically connected to the drive electrode 2 through the first portion 3b1. Part of the first portion 3b1 can be located in the opposing area between the first connection portion 21 and the second connection portion 22. The first portion 3b1 can contact both the connection structure 5 and the drive electrode 2, thereby achieving electrical connection between the connection structure 5 and the drive electrode 2.

[0090] In the embodiment of the present application, the first portion 3b1 fills the first sub-opening 3a0 and the first hollow portion 23, which can be regarded as the first portion 3b1 covering the surface of the first sub-opening 3a0 facing away from the substrate 1 and the surface of the first hollow portion 23 facing away from the substrate 1. At this time, the connection structure 5 and the first portion 3b1 can be in contact and the contact area between the two can be large. This arrangement helps to improve the adhesion of the connection structure 5 on the conductive connection layer 3b. In addition, part of the first portion 3b1 is located in the first hollow portion 23, which means that the first hollow portion 23 provides part of the space for the arrangement of the first portion 3b1, so that more space can be saved in the first opening 31 to accommodate the connection structure 5, thereby helping to reduce the risk of the connection structure 5 overflowing the first opening 31. In particular, part of the connection structure 5 can also be located in the first hollow portion 23, that is, part of the first hollow portion 23 can also be used to accommodate the connection structure 5.

[0091] Figure 24 This is a schematic top view of a partial structure of a display panel provided in this application. Figure 25 for Figure 24 The diagram shows a cross-sectional view of a portion of the display panel structure along the section line EE'.

[0092] In one embodiment of the present application, Figure 24 and Figure 25 The guide layer 3 further includes a support layer 3 a and a conductive connection layer 3 b . The conductive connection layer 3 b is located on a side of the support layer 3 a away from the substrate 1 .

[0093] The first opening 31 includes a first sub-opening 3a0 and a second sub-opening 3b0 ; the first sub-opening 3a0 penetrates the supporting layer 3a and exposes at least a portion of the driving electrode 2 ; the second sub-opening 3b0 penetrates the conductive connection layer 3b .

[0094] In a direction perpendicular to the plane of the substrate 1 , the first hollow portion 23 overlaps with both the first sub-opening 3 a 0 and the second sub-opening 3 b 0 .

[0095] The conductive connection layer 3 b includes a third portion 3 b 3 . At least a portion of the third portion 3 b 3 is located in the first hollow portion 23 and surrounds the second sub-opening 3 b 0 .

[0096] In the embodiment of the present application, since the first hollow portion 23 overlaps with the first sub-opening 3a0 and the second sub-opening 3b0, and the third portion 3b3 surrounds the second sub-opening 3b0, it means that the second sub-opening 3b0 and the portion of the first hollow portion 23 that overlaps with the second sub-opening 3b0 can both be used to accommodate the connecting structure 5. This arrangement helps to further increase the size of the space that can accommodate the connecting structure 5.

[0097] Figure 26This is a schematic top view of a partial structure of a display panel provided in this application. Figure 27 for Figure 26 The diagram shows a cross-sectional view of a portion of the display panel structure along the section line FF'.

[0098] In one embodiment of the present application, Figure 26 and Figure 27 The display panel 10 further includes a planar layer 6 , which is located on a side of the film layer where the driving electrodes 2 are located that is close to the substrate 1 .

[0099] The flat layer 6 is provided with a second opening 60 , and the orthographic projection of the second opening 60 on the substrate 1 overlaps with the orthographic projection of the first hollow portion 23 on the substrate 1 . At this time, the second opening 60 can communicate with the first hollow portion 23 .

[0100] In the embodiment of the present application, the second opening 60 can also be used to increase the space available for accommodating the connection structure 5. During the manufacturing process of the display panel 10, a portion of the connection structure 5 in a molten state can enter the second opening 60 through the first hollow portion 23. In this case, compared to the case where only the first hollow portion 23 is provided, the provision of the second opening 60 can further increase the space available for accommodating the connection structure 5, thereby reducing the risk of the connection structure 5 overflowing the first opening 31.

[0101] Figure 28 A schematic diagram of a partial structure of a display panel provided in this application.

[0102] In one possible implementation, combining Figure 27 and Figure 28 In the first direction X, the width w2 of the second opening 60 is less than or equal to the width w1 of the first hollow portion 23 .

[0103] Combine Figure 27 and Figure 28 For the two driving electrodes 2 corresponding to the two binding electrodes 42 on the same light-emitting element 4, one can be electrically connected to the wiring structure M, and the other can be electrically connected to the output end of the circuit structure P. It should be noted that the first connecting portion 21 and the second connecting portion 22 included in the same driving electrode 2 can be electrically connected to the same structure (the same wiring structure M or the same circuit structure P).

[0104] Figure 29 This is a schematic top view of a partial structure of a display panel provided in this application.

[0105] In one embodiment of the present application, Figure 29As shown, the driving electrode 2 includes a connecting portion 2a and a first hollow portion 23, wherein the orthographic projection of at least part of the connecting portion 2a on the substrate 1 surrounds the orthographic projection of the first hollow portion 23 on the substrate 1. The orthographic projection 2a0 of the connecting portion 2a may be annular.

[0106] The orthographic projection of the first hollow portion 23 on the substrate 1 overlaps with the orthographic projection 310 of the first opening 31 on the substrate 1 .

[0107] During the manufacturing process of the display panel 10, part of the film structure (e.g., part of the guide layer 3) may be located in the first hollow portion 23. Since the orthographic projection of the connecting portion 2a can surround the orthographic projection of the first hollow portion 23, the first opening 31 can be considered a funnel-shaped structure, and the bottom of the funnel-shaped structure overlaps with the first hollow portion 23. Therefore, when the connecting structure 5 in the first opening 31 is squeezed, the connecting structure 5 tends to diffuse into the first hollow portion 23 at the bottom of the funnel.

[0108] Figure 30 This is a schematic top view of a partial structure of a display panel provided in this application. Figure 31 for Figure 30 FIG. 1 is a schematic cross-sectional view of a portion of the display panel structure along section line GG′.

[0109] In one embodiment of the present application, Figure 30 and Figure 31 The guide layer 3 further includes a support layer 3 a and a conductive connection layer 3 b . The conductive connection layer 3 b is located on a side of the support layer 3 a away from the substrate 1 .

[0110] The first opening 31 includes a first sub-opening 3a0 and a second sub-opening 3b0 ; the first sub-opening 3a0 penetrates the supporting layer 3a and exposes at least a portion of the driving electrode 2 ; the second sub-opening 3b0 penetrates the conductive connection layer 3b .

[0111] In a direction perpendicular to the plane of the substrate 1 , the first hollow portion 23 overlaps with both the first sub-opening 3 a 0 and the second sub-opening 3 b 0 .

[0112] The connecting portion 2a includes a first sub-connecting portion 2a1 and a second sub-connecting portion 2a2. The orthographic projection of the first sub-connecting portion 2a1 on the substrate 1 surrounds the orthographic projection of the first hollow portion 23 on the substrate 1, and the orthographic projection of the first hollow portion 23 on the substrate 1 surrounds the orthographic projection of the second sub-connecting portion 2a2 on the substrate 1. The orthographic projection of the first hollow portion 23 can be annular.

[0113] In the embodiment of the present application, the first hollow portion 23 overlaps with both the first sub-opening 3a0 and the second sub-opening 3b0, thereby further increasing the space available for accommodating the connection structure 5. The annular projection of the first hollow portion 23 contributes to the diversity of the structural design of the display panel 10.

[0114] Figure 32 A schematic diagram of a display device provided in this application.

[0115] The present application provides a display device 20, such as Figure 32 As shown, the display device 20 includes the display panel 10 provided in the above embodiment. The display device 20 can be a mobile phone. In addition, the display device 20 can also be an electronic device such as a computer or a television.

[0116] The short circuit phenomenon caused by overflow of bonding metal in the display panel 10 of the display device 20 provided in the embodiment of the present application is greatly improved.

[0117] In this specification, reference can be made to the same or similar parts between the various embodiments. In particular, for the device embodiment and the terminal embodiment, since they are basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the description in the method embodiment.

Claims

1. A display panel, characterized in that: include: substrate; A driving electrode and a guide layer are located on one side of the substrate; the guide layer is located on a side of the film layer where the driving electrode is located away from the substrate; the guide layer includes a first opening and a guide portion at least surrounding the first opening; In a direction perpendicular to the plane where the substrate is located, the guide portion overlaps with the driving electrode; A light-emitting element is located on a side of the guide layer away from the substrate; the light-emitting element includes a light-emitting body and a plurality of binding electrodes; A connecting structure is located between the driving electrode and the binding electrode, and at least a portion of the connecting structure is located in the first opening.

2. The display panel according to claim 1, wherein: In a direction perpendicular to the plane where the substrate is located, the binding electrode overlaps with the first opening.

3. The display panel according to claim 2, wherein: The light emitting element includes a first binding electrode and a second binding electrode arranged along a first direction; The length of the first opening in the second direction is greater than the length of the first opening in the first direction, and the second direction intersects the first direction.

4. The display panel according to claim 2, wherein: The light emitting element includes a first binding electrode and a second binding electrode arranged along a first direction; The guide portion includes a first guide portion and a second guide portion that are opposite to each other along the first direction, and the first guide portion is located between the first binding electrode and the second binding electrode; The first guide portion includes a first bottom surface and a first side surface close to the second guide portion, and the angle between the first side surface and the first bottom surface is a first angle; the second guide portion includes a second bottom surface and a second side surface close to the first guide portion, and the angle between the second side surface and the second bottom surface is a second angle; Wherein, the second angle is smaller than the first angle.

5. The display panel according to claim 2, wherein: The light emitting element includes a first binding electrode and a second binding electrode arranged along a first direction; The guide portion includes a first guide portion and a second guide portion that are opposite to each other along the first direction, and the first guide portion is located between the first binding electrode and the second binding electrode; The first guide portion includes a first bottom surface and a third side surface facing away from the second guide portion, and the angle between the third side surface and the first bottom surface is a third angle; the second guide portion includes a second bottom surface and a fourth side surface facing away from the first guide portion, and the angle between the fourth side surface and the second bottom surface is a fourth angle; Wherein, the third angle is an obtuse angle and the third angle is greater than the fourth angle.

6. The display panel according to claim 1, wherein: The guide layer further comprises a support layer and a conductive connection layer, wherein the conductive connection layer is located on a side of the support layer away from the substrate; The first opening includes a first sub-opening, wherein the first sub-opening passes through the supporting layer and exposes at least a portion of the driving electrode; Wherein, the connection structure is connected to the driving electrode at the first sub-opening.

7. The display panel according to claim 6, wherein: The conductive connection layer includes a first portion located in the first sub-opening, and the first portion is connected between the connection structure and the driving electrode.

8. The display panel according to claim 7, wherein: The first portion fills the first sub-opening and the connection structure is connected to the driving electrode through the first portion.

9. The display panel according to claim 7, wherein: The first opening further includes a second sub-opening, and the second sub-opening penetrates the conductive connection layer; The first portion surrounds the second sub-opening, and the connection structure contacts the driving electrode at the second sub-opening.

10. The display panel according to claim 6, wherein: The first opening further includes a second sub-opening, the second sub-opening passing through the conductive connection layer; an outer edge of an orthographic projection of the second sub-opening on the substrate surrounds the orthographic projection of the first sub-opening on the substrate; Wherein, the connection structure is in direct contact with the driving electrode.

11. The display panel according to claim 10, wherein: The conductive connection layer includes a second portion located in the first opening, and the second portion surrounds the second sub-opening; Wherein, the connecting structure contacts the second portion.

12. The display panel according to claim 1, wherein The driving electrode includes a first connecting portion and a second connecting portion arranged along a first direction, and a first hollow portion is provided between the first connecting portion and the second connecting portion; An orthographic projection of the first hollow portion on the substrate overlaps with an orthographic projection of the first opening on the substrate.

13. The display panel according to claim 12, wherein: In the first direction, the width of the first hollow portion is smaller than the width of the first opening.

14. The display panel according to claim 12, wherein: The guide layer further comprises a support layer and a conductive connection layer, wherein the conductive connection layer is located on a side of the support layer away from the substrate; The first opening includes a first sub-opening, the first sub-opening passes through the support layer and exposes at least a portion of the driving electrode; in a direction perpendicular to the plane where the substrate is located, the first sub-opening overlaps with the first hollow portion; The conductive connection layer includes a first portion, the first portion fills the first sub-opening and the first hollow portion, and the connection structure is connected to the driving electrode through the first portion.

15. The display panel according to claim 12, wherein: The guide layer further comprises a support layer and a conductive connection layer, wherein the conductive connection layer is located on a side of the support layer away from the substrate; The first opening includes a first sub-opening and a second sub-opening; the first sub-opening passes through the supporting layer and exposes at least a portion of the driving electrode; the second sub-opening passes through the conductive connection layer; In a direction perpendicular to the plane of the substrate, the first hollow portion overlaps with the first sub-opening and the second sub-opening; The conductive connection layer further includes a third portion, at least a portion of the third portion is located in the first hollow portion and the third portion surrounds the second sub-opening.

16. The display panel according to claim 12, wherein: The display panel further includes a flat layer, which is located on a side of the film layer where the driving electrodes are located that is close to the substrate; A second opening is provided on the flat layer, and an orthographic projection of the second opening on the substrate overlaps with an orthographic projection of the first hollow portion on the substrate.

17. The display panel according to claim 1, wherein: The driving electrode includes a connecting portion and a first hollow portion, wherein an orthographic projection of at least a portion of the connecting portion on the substrate surrounds an orthographic projection of the first hollow portion on the substrate; An orthographic projection of the first hollow portion on the substrate overlaps with an orthographic projection of the first opening on the substrate.

18. The display panel according to claim 17, wherein: The guide layer further comprises a support layer and a conductive connection layer, wherein the conductive connection layer is located on a side of the support layer away from the substrate; The first opening includes a first sub-opening and a second sub-opening; the first sub-opening passes through the supporting layer and exposes at least a portion of the driving electrode; the second sub-opening passes through the conductive connection layer; In a direction perpendicular to the plane of the substrate, the first hollow portion overlaps with the first sub-opening and the second sub-opening; The connecting portion includes a first sub-connecting portion and a second sub-connecting portion, wherein the orthographic projection of the first sub-connecting portion on the substrate surrounds the orthographic projection of the first hollow portion on the substrate, and the orthographic projection of the first hollow portion on the substrate surrounds the orthographic projection of the second sub-connecting portion on the substrate.

19. A display device, characterized in that: Comprising the display panel according to any one of claims 1-18.

Images