Display device

Abstract

A display device according to an exemplary embodiment of the present disclosure includes: a substrate including a first sub-pixel and a second sub-pixel; a first electrode disposed in each of the first sub-pixel and the second sub-pixel; and a bank disposed to cover an end point of the first electrode and to separate the light emitting region and a non-light emitting region surrounding the light emitting region, in which the bank includes a first bank disposed on the first electrode and a second bank disposed on the first bank and including a trench.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2024-0029694 filed on February 29, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device, and more particularly, to a display device having a structure for suppressing leakage current between adjacent sub-pixels. Background Art

[0004] The latest display devices capable of displaying various information and interacting with a user who sees the information are required to have various sizes, various shapes, and various functions.

[0005] Examples of the display apparatus include a liquid crystal display (LCD) device, an electrophoretic display device (FPD), a light emitting diode display (LED) device, and the like.

[0006] The display device is a self-luminous display device, so it does not require a separate light source, which is different from LCD. Therefore, the display device can be manufactured to have a light weight and reduced thickness. Since the display device is driven by a low voltage, it is not only advantageous in terms of power consumption, but also in terms of color realization, response speed, viewing angle, and contrast ratio (CR). Therefore, it is being studied as a next-generation display.

[0007] Hereinafter, although description will be made assuming that the display apparatus is an organic light emitting diode display apparatus, the type of the light emitting diode layer is not limited thereto.

[0008] A display device displays information on a screen by emitting light from a plurality of pixels including a light emitting diode layer having a light emitting layer. Display devices can be classified as active matrix light emitting diode display devices or passive matrix light emitting diode display devices according to a method of driving pixels.

[0009] An active matrix type light emitting diode display device controls current flowing in light emitting diodes using thin film transistors (TFTs) to display images.

[0010] A display device includes an anode, a light-emitting layer, and a cathode. When voltage is applied to each of the anode and cathode, holes from the anode and electrons from the cathode are respectively transferred to the light-emitting layer. When the holes and electrons recombine in the light-emitting layer, excitons are generated, and light is emitted using the energy from the excitons.

[0011] Such display devices are being developed to increase their resolution in order to provide high-quality image information. As resolution increases, the separation distance between sub-pixels decreases. In this case, the image information may be distorted due to lateral leakage current between adjacent pixels.

[0012] Therefore, various studies have been conducted to suppress lateral leakage current (LLC) and thus realize high-resolution display devices. However, this is still insufficient, and thus development of display devices is urgently needed. Summary of the Invention

[0013] The present disclosure aims to provide a display device comprising a first bank and a second bank disposed on the first bank and comprising a groove, in order to block lateral leakage current that increases as the distance between adjacent sub-pixels decreases, thereby improving color reproduction.

[0014] Another object of the present disclosure is to provide a light-emitting diode display device in which a light-emitting diode layer is disposed on a bank and includes a curved line. This is to increase the transmission distance of electrons to adjacent sub-pixels and thereby suppress the transmission of electrons generated in the light-emitting diode layer to adjacent pixels when the display device is driven.

[0015] Another object of the present disclosure is to provide a light emitting diode display device including a plurality of bank structures in order to suppress deterioration caused by ion penetration caused by particles or foreign matter generated from the display device including banks containing black pigment.

[0016] The objects of the exemplary embodiments of the present disclosure are not limited to the above-mentioned objects, and other objects not mentioned above can be clearly understood by those skilled in the art from the following description.

[0017] A display device according to an exemplary embodiment of the present disclosure includes: a substrate including a first sub-pixel and a second sub-pixel; a first electrode arranged in each of the first sub-pixel and the second sub-pixel; and a dam arranged to cover an end point of the first electrode and separate a light-emitting area from a non-light-emitting area surrounding the light-emitting area, wherein the dam includes a first dam arranged on the first electrode and a second dam arranged on the first dam and including a groove.

[0018] The display device according to the exemplary embodiment of the present disclosure includes a first bank and a second bank disposed on the first bank and including a groove. Therefore, it is possible to block lateral leakage current that increases as the distance between adjacent sub-pixels decreases, thereby improving color reproduction rate.

[0019] In a display device according to an exemplary embodiment of the present disclosure, the light-emitting diode layer is arranged along a curved line formed on the bank. Therefore, when the display device is driven, the transmission distance of electrons to adjacent sub-pixels can be increased, thereby suppressing the transmission of electrons generated in the light-emitting diode layer to adjacent pixels.

[0020] The display device according to the exemplary embodiment of the present disclosure includes a plurality of bank structures. Therefore, it is possible to suppress deterioration caused by ion penetration caused by particles or foreign matter generated from the display device including the bank containing the black pigment.

[0021] The effects of the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned above will be apparently understood by those having ordinary skill in the art from the following description.

[0022] The object to be achieved by the present disclosure, means for achieving the object, and the effects of the present disclosure described above do not specify essential features of the claims, and therefore, the scope of the claims is not limited to the disclosed contents of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0024] Figure 1 is a plan view of a display device according to an exemplary embodiment of the present disclosure;

[0025] Figure 2 shows the arrangement of a light emitting area and a non-light emitting area of ​​a display device according to an exemplary embodiment of the present disclosure;

[0026] Figure 3 It is along Figure 2 A cross-sectional view taken along line II';

[0027] Figure 4 is a cross-sectional view of a light emitting unit of a display device according to an exemplary embodiment of the present disclosure;

[0028] Figure 5 shows an arrangement of a light emitting area and a non-light emitting area of ​​a display device according to another exemplary embodiment of the present disclosure; and

[0029] Figure 6 It is along Figure 5 A cross-sectional view taken along line II-II'. DETAILED DESCRIPTION

[0030] The advantages and features of the present disclosure and the methods for achieving these advantages and features will be more clearly understood from the exemplary embodiments described below with reference to the accompanying drawings. However, the present disclosure is not limited to the following exemplary embodiments and can be implemented in various forms. The exemplary embodiments are provided only to complete the disclosure and fully provide the scope of the present disclosure to those skilled in the art to which the present disclosure belongs, and the present disclosure is defined by the appended claims.

[0031] The shapes, sizes, ratios, angles, quantities, etc. used to describe the exemplary embodiments of the present disclosure shown in the accompanying drawings are merely examples, and the present disclosure is not limited thereto. Throughout the specification, similar reference numerals generally represent similar elements. In addition, in the following description of the present disclosure, detailed descriptions of known related arts may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "comprising," "having," and "consisting of..." used in this article are generally intended to allow the addition of other components, unless these terms are used together with the term "only." Unless otherwise expressly stated, any reference to the singular may include the plural.

[0032] Even if not explicitly stated, the components are interpreted as including the ordinary error range.

[0033] When terms such as "on," "over," "under," and "near" are used to describe the positional relationship of two parts, one or more other parts may be present between the two parts unless these terms are used together with the term "immediately" or "directly."

[0034] When terms such as "after," "continuing to," "next," and "before" are used to describe a temporal sequence relationship, the sequence may not be sequential unless these terms are used with the terms "immediately" or "directly."

[0035] Although the terms "first," "second," and the like are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component mentioned below may be the second component in the technical concept of the present disclosure.

[0036] When describing components of exemplary embodiments of the present disclosure, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are used to distinguish a component from other components, but the nature, order, number, etc. of the components are not limited by these terms. When a component is "linked," "coupled," or "connected" to another component, the component can be directly linked or connected to the other component. However, unless otherwise specifically stated, it should be understood that a third component may be interposed between components that can be directly linked or connected.

[0037] It should be understood that “at least one” includes all combinations of one or more of the associated components. For example, “at least one of a first component, a second component, and a third component” means not only including the first component, the second component, or the third component, but also including all combinations of two or more of the first component, the second component, and the third component.

[0038] In the present disclosure, "device" may include a display device including a display panel and a driver for driving the display panel, and in a narrow sense, the display device may be, for example, a liquid crystal module (LCM) or an organic light emitting module (OLED module). In addition, "device" may also include a complete electronic device or a complete set of equipment (or a complete set of devices), which is a complete product or final product including an LCM, an OLED module, etc., such as a laptop computer, a television, or a computer monitor, an automotive device or an equipment device including another type of vehicle, and a mobile electronic device including a smartphone, an electronic pad, etc.

[0039] Therefore, the display device of the present disclosure may include not only the display device itself in a narrow sense, such as LCM, OLED module, etc., but also an application product or complete set of equipment that is a final consumer device including LCD, OLED module, etc.

[0040] Furthermore, in some exemplary embodiments, an LCM, an OLED module, and the like configured by a display panel, a driver, and the like may be referred to as a "display device" in a narrow sense, and an electronic device may be referred to as a complete product including the LCM, and an OLED module may be referred to as a "set." For example, a display device in a narrow sense may include a liquid crystal (LCD) display panel, an OLED display panel, and a source PCB serving as a controller for driving the display panel. In contrast, a set may also include a set PCB, which is a set controller electrically connected to the source PCB to control the entire set.

[0041] As the display panel used in the exemplary embodiment of the present disclosure, any type of display panel such as a liquid crystal display panel, an organic light emitting diode (OLED) display panel, and an electroluminescent display panel can be used. The display panel of the exemplary embodiment of the present disclosure is not limited thereto. For example, the display panel can be a specific display panel that is vibrated by the vibration device according to the exemplary embodiment of the present disclosure to output sound. In addition, the display panel used for the display device according to the exemplary embodiment of the present disclosure is not limited to the shape or size of the display panel.

[0042] The features of the various exemplary embodiments of the present disclosure may be partially or completely coupled or combined with each other and may be technically interlocked and operated in various ways, and the exemplary embodiments may be performed independently or in association with each other.

[0043] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the following exemplary embodiments and accompanying drawings. For descriptive purposes, the scales of components shown in the drawings are different from the actual scales, and thus the scales are not limited to those shown in the drawings.

[0044] Hereinafter, various exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0045] Figure 1 is a plan view of a display device according to an exemplary embodiment of the present disclosure.

[0046] Reference Figure 1 The substrate 110 may include an active area (or display area) AA and a non-active area (or non-display area) NA surrounding the active area AA. The non-active area NA of the substrate 110 is adjacent to the active area AA and may be disposed further outward than the active area AA.

[0047] The active area AA may refer to a region in which the pixels P are disposed and an image is displayed.

[0048] The pixel P disposed in the active area AA may further include a plurality of sub-pixels SP1, SP2, and SP3. Each of the plurality of sub-pixels SP1, SP2, and SP3 is a single unit that emits light and may emit red light, green light, blue light, and / or white light. However, exemplary embodiments of the present disclosure are not limited thereto.

[0049] The active area AA may include a light emitting diode. In each of the plurality of sub-pixels SP1, SP2, and SP3, a light emitting diode layer for displaying an image and a thin film transistor for driving the light emitting diode layer may be provided.

[0050] Each sub-pixel SP may include multiple thin film transistors, capacitors, and multiple lines. For example, each sub-pixel SP may have a 2T1C structure including two thin film transistors and a capacitor, but is not limited thereto. Depending on the structure and type of the thin film transistors, each sub-pixel SP may be configured in various forms, such as 3T1C, 4T1C, 5T1C, 6T1C, 7T1C, 3T2C, 4T2C, 5T2C, 6T2C, 7T2C, and 8T2C.

[0051] Figure 1 The non-active area NA is shown to surround the active area AA having a rectangular shape. However, the shape of the active area AA and the shape and arrangement of the non-active area NA adjacent to the active area AA are not limited to Figure 1The example shown. The active area AA and the non-active area NA may have any shape suitable for the design of an electronic device that employs the display device 100. When the display device is employed in a wearable device worn by a user, the display device may have a circular shape similar to a watch. In addition, the concept of the exemplary embodiments of the present disclosure may be employed by a free-form display device that can be applied to an instrument cluster of a vehicle or the like. Examples of the shape of the active area AA may include a pentagonal shape, a hexagonal shape, a circular shape, or an elliptical shape, but the present disclosure is not limited thereto.

[0052] The non-active area NA is an area in which various wirings and driver circuits for driving the plurality of sub-pixels SP1, SP2, and SP3 arranged in the active area AA are disposed. For example, various integrated circuits such as a gate driver and a data driver, as well as the driver circuits, may be disposed in the non-active area NA. The non-active area NA may be a border area, but is not limited to this term.

[0053] The display device 100 of the present disclosure may include various additional components for generating various signals or otherwise driving the multiple sub-pixels SP1, SP2, and SP3 in the active area AA. For example, the driving circuit for controlling (or driving) the multiple sub-pixels SP1, SP2, and SP3 may include a gate driver 112, a data signal line, a multiplexer (MUX), an electrostatic discharge (ESD) circuit, a power line, an inverter circuit, a connection line 116, and the like. The power line may be a high-potential voltage line and / or a low-potential voltage line, but the exemplary embodiments of the present disclosure are not limited thereto. The display device 100 may also include additional components in addition to the functions for driving the multiple sub-pixels SP1, SP2, and SP3. For example, the display device 100 may include additional components that provide touch sensing functions, user authentication functions (e.g., fingerprint recognition), multi-level pressure sensing functions, and tactile feedback functions. However, the exemplary embodiments of the present disclosure are not limited thereto. The above-mentioned additional components may be located in the non-active area NA or in an external circuit connected to the connection interface. However, the exemplary embodiments of the present disclosure are not limited thereto.

[0054] A pad unit 114 may be provided on one side of the non-active area NA. The pad unit 114 may be a metal pattern to which an external module such as a flexible printed circuit board (FPCB), a chip on film (COF), etc. is bonded. Although the pad unit 114 is shown as being provided on one side of the substrate 110, the shape and arrangement of the pad unit 114 are not limited thereto.

[0055] A gate driver 112 may be provided on one side of the non-active area NA and on the other side opposite thereto. The gate driver 112 may supply a gate signal to the thin film transistor. The gate driver 112 may include various gate driving circuits, and the gate driving circuits may be directly formed on the substrate 110. In this case, the gate driver 112 may be a gate in panel (GIP), but is not limited to this term.

[0056] The gate driver 112 may be provided between the active area AA and the dam 117. A high potential voltage line VDD, a low potential voltage line VSS, a multiplexer (MUX), an electrostatic discharge (ESD) circuit, and a connection line 116 may be provided between the active area AA and the pad unit 114 of the non-active area NA. However, exemplary embodiments of the present disclosure are not limited thereto.

[0057] The high-potential voltage line VDD, the low-potential voltage line VSS, the multiplexer (MUX), and the connection line 116 may be disposed between the active area AA and the bending area BA, but is not limited thereto. For example, the high-potential voltage line VDD, the low-potential voltage line VSS, the multiplexer (MUX), and the connection line 116 may be disposed between the active area AA and a non-bending area adjacent to the active area AA.

[0058] The connection line 116 may be disposed in a portion of the non-active area NA. The connection line 116 may be disposed in the bending area BA of the display device 100 and a non-bending area adjacent to the bending area BA.

[0059] The connection line 116 may be a component that transmits a signal (e.g., a voltage) from an external module bonded to the pad unit 114 to the active area AA or a circuit unit such as the gate driver 112. For example, various signals and voltages such as a gate signal, a data signal, a high potential voltage, and a low potential voltage may be transmitted through the connection line 116.

[0060] The connection line 116 may be classified as a power connection line and / or a signal connection line, depending on the voltage and / or image signal to be transmitted.

[0061] The power connection line may transmit a voltage supplied from an external module to the active area AA. The power connection line may be connected to a gate low voltage line and / or a gate high voltage line, a low potential voltage line VSS, and a high potential voltage line VDD included in the gate driver 112, but is not limited thereto.

[0062] The signal connection line may transmit a signal supplied from an external module to the active area AA. The signal connection line may be connected to a scan line and / or a data line, but is not limited thereto.

[0063] The dam 117 may be disposed in the first non-active area NA1 to surround all or a portion of the active area AA. The dam 117 is adjacent to the active area AA and may be disposed further outward than the active area AA.

[0064] The dam 117 may be provided along the perimeter of the active area AA to control the flow of the layer containing the organic material in the encapsulation unit provided on the light emitting diode layer. There may be one or more dams 117. However, exemplary embodiments of the present disclosure are not limited thereto.

[0065] A panel crack detector 118 may be further provided in a portion of the non-active area NA of the substrate 110 .

[0066] The panel crack detector 118 may be disposed between an end point of the substrate 110 and the dam 117. The panel crack detector 118 may also be disposed below the dam 117 to overlap with at least a portion of the dam 117.

[0067] The panel crack detector 118 may be provided at the periphery of the display device 100 to detect defects such as cracks that may occur in the peripheral portion.

[0068] The active area AA may further include a hole H. The hole H may be located between the plurality of sub-pixels SP disposed in the active area AA. The hole H may be an area in which an optical component, such as a camera or an optical sensor, is disposed. The optical sensor may include a proximity sensor, an infrared sensor, an ultraviolet sensor, etc. However, exemplary embodiments of the present disclosure are not limited thereto. The display device 100 may include a space in which an optical component is disposed by means of the hole H that passes through some components of the display device 100.

[0069] Figure 2 The arrangement of the light emitting area and the non-light emitting area of ​​the display device according to the exemplary embodiment of the present disclosure is shown.

[0070] Reference Figure 2 The light-emitting area EA refers to the area in the light-emitting diode layer of a sub-pixel from which light is emitted, and each sub-pixel may include a light-emitting area. Multiple light-emitting areas EA are provided on the substrate and are spaced apart from each other. A non-light-emitting area NEA may be provided to surround the light-emitting area.

[0071] The emission area EA refers to an area in the emission layer from which light is emitted to the outside and in which the first and second banks 320 and 330 are not provided. The non-emission area NEA refers to an area in the emission layer from which light is not emitted to the outside and in which the first and second banks 320 and 330 are provided.

[0072] The light-emitting area EA may include a plurality of light-emitting areas that emit light of different colors. For example, the light-emitting area EA may include a first light-emitting area EA1 that emits red light, a second light-emitting area EA2 that emits green light, and a third light-emitting area EA3 that emits blue light. Alternatively, the light-emitting area EA may include a white light-emitting area, etc., but is not limited thereto.

[0073] The bank may include a first bank 320 and a second bank 330 .

[0074] The first bank 320 may be arranged to surround all or part of each emission area EA. For example, the first bank 320 may include a first pattern 321, a second pattern 322, and a third pattern 323. The first pattern 321 surrounds the first sub-pixel SP1 or the first emission area EA1. The second pattern 322 surrounds the second sub-pixel SP2 or the second emission area EA2. The third pattern 323 surrounds the third sub-pixel SP3 or the third emission area EA3. The first pattern 321, the second pattern 322, and the third pattern 323 are not connected to each other and may be spaced apart from each other.

[0075] The second bank 330 may be provided in the non-emission area NEA. For example, the second bank 330 may be continuously provided in the non-emission area to overlap at least a portion of the first bank 320 or cover the entirety of the first bank 320.

[0076] Will refer to Figure 3 Describe the dike in more detail.

[0077] like Figure 2 As shown, each light-emitting area EA is formed to have a specific shape and to be aligned in a specific form, but is not limited thereto. The light-emitting area EA of the display device 100 according to the present disclosure may have various shapes or be arranged in various forms. Examples of the shape of the light-emitting area EA may include a rectangular shape, a pentagonal shape, a hexagonal shape, an octagonal shape, a circular shape, or an elliptical shape, but the present disclosure is not limited thereto. For example, the first light-emitting area EA1 and the third light-emitting area EA3 may have the same shape. The second light-emitting area EA2 may have a different shape from the first light-emitting area EA1. The second light-emitting area EA2 may have a different shape from the third light-emitting area EA3. For example, the second light-emitting area EA2 may have a different shape from the first light-emitting area EA1 and the third light-emitting area EA3.

[0078] Each pixel P may be composed of a plurality of sub-pixels or light-emitting areas that emit light of the same color. For example, at least two second sub-pixels SP2 or second light-emitting areas EA2 may be provided in the pixel P. At least two second light-emitting areas EA2 that emit green light may be provided in the pixel P. However, exemplary embodiments of the present disclosure are not limited thereto.

[0079] Figure 3 It is along Figure 2 A cross-sectional view taken along line II'. Figure 3 Shown by Figure 2 An example of a cross-sectional structure of a region indicated by line II'.

[0080] Reference Figure 3 The substrate 110 can be used to support various components of the display device. The substrate 110 can be made of glass or a flexible plastic material.

[0081] For example, the substrate 110 may be made of at least one of polyimide (PI), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polyethersulfone, and polycarbonate, but is not limited thereto.

[0082] When the substrate 110 is made of polyimide, it may be composed of two polyimide layers. In addition, an inorganic film may be provided between the two polyimide layers.

[0083] The substrate 110 may refer to the substrate itself and components and functional layers formed thereon, such as a switching thin film transistor, a driving thin film transistor connected to the switching thin film transistor, an organic light emitting diode connected to the driving thin film transistor, a protective layer, etc. However, the present disclosure is not limited thereto.

[0084] A buffer layer 120 may be disposed on the entire surface of the substrate 110 .

[0085] The buffer layer 120 is disposed on the substrate 110 and may serve to block the flow of materials in the substrate 110 toward the thin film transistor or the semiconductor layer during a deposition process.

[0086] The buffer layer 120 may be made of an inorganic insulating material such as silicon nitride SiNx or silicon oxide SiOx, or may be made of an organic insulating material, but is not limited thereto.

[0087] The buffer layer 120 may be composed of a single layer of silicon nitride SiNx or silicon oxide SiOx, or a multilayer of silicon nitride SiNx and silicon oxide SiOx. When the buffer layer 120 is composed of multiple layers, layers of silicon oxide SiOx and layers of silicon nitride SiNx are alternately stacked. However, exemplary embodiments of the present disclosure are not limited thereto. However, depending on the type and material of the substrate 110, the structure and type of the thin film transistor 200, etc., the buffer layer 120 may also be omitted.

[0088] A thin film transistor 200 may be disposed on the buffer layer 120. The thin film transistor 200 may include a semiconductor pattern, a gate electrode, a source electrode, and a drain electrode.

[0089] For ease of description, only one thin film transistor 200 among various thin film transistors is shown. However, other thin film transistors may also be included in the display device 100. In addition, for ease of description, the thin film transistor 200 has been described as having a top-gate structure in which the gate electrode constituting the thin film transistor is located on the semiconductor layer. However, the thin film transistor 200 is not limited to this. The thin film transistor 200 can be implemented as having a bottom-gate structure in which the gate electrode is located below the semiconductor layer or a dual-gate structure in which the gate electrodes are located above and below the semiconductor layer.

[0090] A semiconductor pattern 210 of the thin film transistor 200 may be disposed on the buffer layer 120 .

[0091] The semiconductor pattern 210 may be made of a polycrystalline semiconductor. For example, the polycrystalline semiconductor may include low-temperature polysilicon (LTPS) having high mobility, but is not limited thereto. When the semiconductor pattern is made of a polycrystalline semiconductor, energy consumption is low and reliability is excellent.

[0092] In addition, the semiconductor pattern 210 can be made of an oxide semiconductor. For example, the semiconductor pattern 210 can be made of any one of indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), indium gallium tin oxide (IGTO), and indium gallium oxide (IGO), but is not limited thereto. When the semiconductor pattern 210 is made of an oxide semiconductor, the effect of blocking leakage current is excellent. Therefore, when the thin film transistor is driven at a low speed, the brightness variation of the sub-pixel can be minimized.

[0093] When the semiconductor pattern 210 is made of a polycrystalline semiconductor or an oxide semiconductor, a portion of the semiconductor pattern 210 may be conductive.

[0094] The semiconductor pattern 210 may also be made of amorphous silicon (a-Si), or may be made of various organic semiconductor materials such as pentacene, but is not limited thereto.

[0095] A first insulating layer 130 may be disposed on the semiconductor pattern 210 throughout the entire substrate 110 .

[0096] The first insulating layer 130 is disposed between the semiconductor pattern 210 and the gate electrode 230 to insulate the semiconductor pattern 210 from the gate electrode 230 .

[0097] The first insulating layer 130 may be made of an inorganic insulating material such as silicon nitride SiNx or silicon oxide SiOx, or may be made of an organic insulating material, but is not limited thereto.

[0098] The first insulating layer 130 may include holes for electrically connecting the source electrode 250 and the drain electrode 270 to the semiconductor pattern 210 , respectively.

[0099] A gate electrode 230 of the thin film transistor 200 may be disposed on the first insulating layer 130 . The gate electrode 230 may be disposed to overlap the semiconductor pattern 210 .

[0100] The gate electrode 230 may be formed of a single layer or a multilayer of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W), and a transparent conductive oxide (TCO), or an alloy thereof, but is not limited thereto.

[0101] A second insulating layer 140 may be disposed on the gate electrode 230 throughout the entire substrate 110 .

[0102] The second insulating layer 140 is provided between the gate electrode 230 and the source and drain electrodes 250 and 270 to insulate the gate electrode 230 from the source and drain electrodes 250 and 270 .

[0103] The second insulating layer 140 may include holes for electrically connecting the source electrode 250 and the drain electrode 270 to the semiconductor pattern 210 , respectively.

[0104] The second insulating layer 140 may be made of an inorganic insulating material such as silicon nitride SiNx or silicon oxide SiOx, or may be made of an organic insulating material, but is not limited thereto.

[0105] The source electrode 250 and the drain electrode 270 may be disposed on the second insulating layer 140 .

[0106] The second insulating layer 140 is provided between the gate electrode 230 and the source and drain electrodes 250 and 270 to insulate the gate electrode 230 from the source and drain electrodes 250 and 270 .

[0107] The second insulating layer 140 may be made of an inorganic insulating material such as silicon nitride SiNx or silicon oxide SiOx, or may be made of an organic insulating material, but is not limited thereto.

[0108] The second insulating layer 140 may include holes for electrically connecting the source electrode 250 and the drain electrode 270 to the semiconductor pattern 210 , respectively.

[0109] The source electrode 250 and the drain electrode 270 may be disposed on the second insulating layer 140 .

[0110] The source electrode 250 and the drain electrode 270 may be electrically connected to the semiconductor pattern 210 through holes formed in the first insulating layer 130 and the second insulating layer 140 , respectively.

[0111] Each of the source electrode 250 and the drain electrode 270 may be formed of a single layer or a multilayer of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W), and a transparent conductive oxide (TCO), or an alloy thereof, but is not limited thereto. For example, each of the source electrode 250, the drain electrode 270, and the power line VDD may be made of a conductive metal material and may have a three-layer structure of titanium (Ti), aluminum (Al), and titanium (Ti), but is not limited thereto.

[0112] A third insulating layer 150 may be provided on the source electrode 250 and the drain electrode 270 over the entire substrate 110. The third insulating layer 150 may be provided on the thin film transistor 200 to protect the thin film transistor 200. The third insulating layer 150 may be made of an inorganic insulating material such as silicon nitride SiNx or silicon oxide SiOx, or may be made of an organic insulating material, but is not limited thereto.

[0113] The third insulating layer 150 may include a hole for electrically connecting the thin film transistor 200 to the connection electrode 170 or the first electrode 310. The third insulating layer 150 may serve as a protective layer and may be omitted depending on the structure and type of the thin film transistor 200.

[0114] A planarization layer 160 may be disposed on the third insulating layer 150 .

[0115] The planarization layer 160 may protect the thin film transistor 200 disposed below the planarization layer 160 and may reduce or planarize steps caused by various patterns.

[0116] The planarization layer 160 may be provided as a single layer, but may also be provided as two or more layers in consideration of the arrangement of various electrodes.

[0117] This is because as display devices 100 develop higher resolutions, the number of various signal lines increases. Therefore, it is difficult to arrange all wiring on a single layer while ensuring minimum spacing, necessitating the provision of an additional layer. Providing such an additional layer allows for margin in the arrangement of wiring, making it easier to arrange and design wires / electrodes. Furthermore, when a dielectric material is used for the multi-layered planarization layer 160, the planarization layer 160 can be used to form capacitance between metal layers.

[0118] When the planarization layer 160 is provided as two layers, it may include a first planarization layer 161 and a second planarization layer 162 .

[0119] The first and second planarization layers 161 and 162 may be made of at least one of organic insulating materials such as benzocyclobutene (BCB), acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin, but are not limited thereto.

[0120] When planarization layer 160 is composed of two layers, a hole may be formed in first planarization layer 161, and connection electrode 170 may be disposed in the hole. Second planarization layer 162 including a hole may be disposed on first planarization layer 161 and connection electrode 170. First electrode 310 may be disposed in the hole of second planarization layer 162. Thus, thin film transistor 200 may be electrically connected to first electrode 310 via connection electrode 170.

[0121] For example, the connection electrode 170 may be disposed on the first planarization layer 161 . One end (or a portion) of the connection electrode 170 may be connected to the thin film transistor 200 , and the other end (or another portion) of the connection electrode 170 may be connected to the first electrode 310 .

[0122] The connection electrode 170 may be formed of a single layer or multiple layers of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W), and transparent conductive oxide (TCO), or alloys thereof, but is not limited thereto.

[0123] However, depending on the structure and type of the display device, the connection electrode 170 may be omitted.

[0124] The first electrode 310 may be disposed on the planarization layer 160. The first electrode 310 may function as an anode.

[0125] When the display device 100 is a top emission type, the first electrode 310 can be set as a reflective electrode that reflects light and is made of an opaque conductive material. The first electrode 310 can be made of at least one of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof. For example, the first electrode 310 can be configured to have a three-layer structure of silver (Ag), lead (Pb), and copper (Cu), but is not limited thereto. Alternatively, the first electrode 310 can also include a transparent conductive material with a high work function, such as indium tin oxide (ITO).

[0126] When the display device 100 is a bottom emission type, the first electrode 310 may be made of a transparent conductive material through which light passes. For example, the first electrode 310 may be made of at least one of indium tin oxide (ITO) and indium zinc oxide (IZO).

[0127] A bank may be disposed on the first electrode 310 and the planarization layer 160 .

[0128] The bank can be used to divide the plurality of sub-pixels SP, minimize glare, and suppress color mixing at various viewing angles. The bank can separate (or partition) a light-emitting area from which light is emitted and a non-light-emitting area from which light is not emitted, and the bank can be provided in the non-light-emitting area.

[0129] The bank may include a first bank 320 and a second bank 330 .

[0130] The first bank 320 may be provided on the planarization layer 160 and the first electrode 310. For example, the first bank 320 may be provided to cover an end point of the first electrode 310 and may cover an upper surface and a side surface of the first electrode 310.

[0131] The first embankment 320 may be arranged to surround each emission area EA. For example, the first embankment 320 may include a first pattern 321, a second pattern 322, and a third pattern 323. The first pattern 321 surrounds the first sub-pixel SP1 or the first emission area EA1. The second pattern 322 surrounds the second sub-pixel SP2 or the second emission area EA2. The third pattern 323 surrounds the third sub-pixel SP3 or the third emission area EA3. The first pattern 321, the second pattern 322, and the third pattern 323 are not connected to each other and may be spaced apart from each other. The upper surface of the planarization layer 160 may be exposed by the first pattern 321, the second pattern 322, and the third pattern 323. The upper surface of the planarization layer 160 exposed by the first pattern 321, the second pattern 322, and the third pattern 323 may contact the second embankment 330.

[0132] The first bank 320 may be made of at least one of an inorganic insulating material, an organic insulating material, and a photosensitizer. The inorganic insulating material may be silicon nitride SiNx or silicon oxide SiOx. The organic insulating material may be benzocyclobutene (BCB), acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. The photosensitizer may be a black pigment. However, the present disclosure is not limited thereto.

[0133] The first bank 320 may include a light shielding material. In addition, the first bank 320 may include an initiator composed of an oligomer monomer.

[0134] Because the first bank 320 contains a black pigment, it also contains a dispersant for suppressing aggregation of the black pigment. The dispersant contained in the first bank 320 is composed of monomers and oligomers and is therefore likely to pyrolyze. Therefore, during processes performed at high temperatures, foreign matter or particles may be generated, potentially causing degradation of the display device. As in the display device 100 according to the exemplary embodiment of the present disclosure, the first bank 320 is provided in a portion of the non-emission area NEA, thereby reducing the generation of foreign matter or particles and suppressing degradation of the display device.

[0135] The second bank 330 may be disposed on the first bank 320 and the planarization layer 160 in the non-emission area NEA. The second bank 330 may be continuously disposed in the non-emission area NEA to overlap at least a portion of the first bank 320 or cover the entirety of the first bank 320. Figure 3 The second bank 330 is shown to cover the entirety of the first bank 320, but the second bank 330 may expose a portion of the upper surface of the first bank 320 and may be continuously disposed in the non-emission area NEA. In this case, the upper and side surfaces of the first bank 320 may be exposed by the second bank 330 so as to contact a portion of the light-emitting diode layer 340. That is, the second bank 330 may cover at least a portion of the outer surface of the first bank 320. For example, the second bank 330 may cover the entire outer surface of the first bank 320. Alternatively, the second bank 330 may expose an edge portion of the outer surface of the first bank 320, and the projection of the edge portion of the outer surface of the first bank 320 on the substrate 110 may overlap half of the projection of the endpoint of the first electrode 310 on the substrate 110.

[0136] For example, in Figure 3 In the cross-sectional view shown, the end point of the first electrode 310 is 2.5 μm long, and the projection of the edge portion of the first bank 320 (exposed by the second bank 330) on the substrate 110 is approximately 1.78 μm long. When the second bank 330 covers the entire outer surface of the first bank 320, the side surface of the first bank 320 can form an angle of 58.4° with the first electrode. When the second bank 330 exposes the edge portion of the outer surface of the first bank 320, the side surface of the first bank 320 can form an angle of 17.9° with the first electrode.

[0137] The second bank 330 may include a trench T formed between the first pattern 321 and the second pattern 322 of the first bank 320 , which are spaced apart from each other.

[0138] The trench T of the second bank 330 may be formed by removing a portion of the first bank 320. The trench T may be obliquely dug from the upper surface, but is not limited thereto. The trench T may be formed in various shapes.

[0139] The presence of the groove T formed in the second bank 330 can increase the placement length of the light-emitting diode layer 340 disposed on the second bank 330. For example, the light-emitting diode layer 340 formed after the second bank 330 is disposed along the groove T of the second bank 330. Therefore, the transmission distance of electrons in the light-emitting diode layer 340 to adjacent sub-pixels can be increased. Therefore, when the display device is driven, the transmission of electrons generated in the light-emitting diode layer 340 to adjacent sub-pixels can be suppressed.

[0140] The second bank 330 may include two spacers and a connecting portion. The two spacers are respectively on the first pattern 321 and the second pattern 322, and the two spacers protrude in a direction opposite to the substrate 110. In other words, the two spacers protrude toward the package unit 400 described below. The connecting portion connects the two spacers to form a trench T.

[0141] The second bank 330 may be made of an inorganic insulating material, an organic insulating material, or a transparent material. The inorganic insulating material may be silicon nitride SiNx or silicon oxide SiOx. The organic insulating material may be benzocyclobutene (BCB), acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. However, the present disclosure is not limited thereto. The second bank 330 may also include a light-transmitting material.

[0142] Since the first bank 320 includes a black pigment, foreign matter or particles may be generated. Since the second bank 330 covers the first bank 320, the flow of foreign matter or particles generated in the first bank 320 within the display device 100 may be blocked.

[0143] Figure 3 Only the first pattern 321 and the second pattern 322 are shown, but the same applies to the third pattern 323 .

[0144] The light-emitting diode layer 340 may be disposed on the first electrode 310 and the first and / or second banks 320 and 330. The light-emitting diode layer 340 may include a light-emitting layer (EML) configured to emit light of a specific color for each of the plurality of sub-pixels SP1, SP2, and SP3. The light-emitting layer may be configured to emit light. For example, holes generated in the first electrode 310 and electrons generated in the second electrode 350 may be injected into the light-emitting layer. The holes and electrons injected into the light-emitting layer may recombine to generate excitons. When the generated excitons transition from an excited state to a ground state, light may be emitted.

[0145] For example, the light-emitting layer may include a red light-emitting layer that emits red light, a green light-emitting layer that emits green light, a blue light-emitting layer that emits blue light, and a white light-emitting layer that emits white light. When the light-emitting diode layer 340 includes a white light-emitting layer, a color filter may be provided on the light-emitting diode layer 340, the color filter being configured to convert the white light emitted from the white light-emitting layer into light of other colors. In addition to the light-emitting layer, the light-emitting diode layer 340 may further include a hole injection layer (HIL), a hole transport layer (HTL), an electron blocking layer (EBL), a hole blocking layer (HBL), an electron transport layer (ETL), and an electron injection layer (EIL), but is not limited thereto.

[0146] The light emitting layer of the light emitting diode layer 340 may be provided in each of the plurality of sub-pixels SP1, SP2, and SP3. In addition, the hole injection layer (HIL), the hole transport layer (HTL), the electron blocking layer (EBL), the hole blocking layer (HBL), the electron transport layer (ETL), and the electron injection layer (EIL) of the light emitting diode layer 340 may be provided in the entire active area AA.

[0147] The light emitting diode layer 340 of the display device 100 according to the exemplary embodiment of the present disclosure may be a light emitting unit. The light emitting unit may be provided as at least one light emitting diode layer. For example, the light emitting unit may have a stacked structure formed by stacking a plurality of light emitting diode layers between the first electrode 310 and the second electrode 350. In this case, the charge generation layer may be further provided between the plurality of light emitting diode layers. A plurality of light emitting units may be provided in each sub-pixel SP. Figure 4 The light emitting unit is described in detail.

[0148] The second electrode 350 may be provided on the light emitting diode layer 340. The second electrode 350 may function as a cathode. The second electrode 350 may provide electrons to the light emitting diode layer 340 and may be made of a conductive material having a low work function.

[0149] When the display device 100 is a top emission type, the second electrode 350 may be made of a transparent conductive material through which light passes. For example, the second electrode 350 may be made of at least one of indium tin oxide (ITO) and indium zinc oxide (IZO), but is not limited thereto.

[0150] In addition, the second electrode 350 may be made of a translucent conductive material through which light passes. For example, the second electrode 350 may be made of at least one of an alloy such as LiF / Al, CsF / Al, Mg:Ag, Ca / Ag, Ca:Ag, LiF / Mg:Ag, LiF / Ca / Ag, and LiF / Ca:Ag, but is not limited thereto.

[0151] When the display device 100 is a bottom emission type, the second electrode 350 can be provided as a reflective electrode that reflects light and is made of an opaque conductive material. For example, the second electrode 350 can be made of at least one of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof.

[0152] The encapsulation unit 400 may be disposed on the second electrode 350. The encapsulation unit 400 may protect the light-emitting diode layer 340 from external moisture, oxygen, or foreign matter. For example, the encapsulation unit 400 may inhibit oxygen and moisture from penetrating from the outside, thereby inhibiting oxidation of the light-emitting material and the electrode material.

[0153] The encapsulation unit 400 may be made of a transparent material so that light emitted from the light emitting diode layer 340 may be transmitted to the encapsulation unit 400 .

[0154] The encapsulation unit 400 may include a first encapsulation layer 410, a second encapsulation layer 420, and a third encapsulation layer 430 to block the penetration of moisture or oxygen. Herein, the encapsulation unit 400 may have a structure in which the first encapsulation layer 410, the second encapsulation layer 420, and the third encapsulation layer 430 are alternately stacked.

[0155] The first encapsulation layer 410 and the third encapsulation layer 430 may be made of at least one inorganic material selected from silicon nitride SiNx, silicon oxide SiOx, or aluminum oxide AlyOz, but are not limited thereto. The first encapsulation layer 410 and the third encapsulation layer 430 may be formed using a vacuum deposition method such as chemical vapor deposition (CVD), atomic layer deposition (ALD), etc., but are not limited thereto.

[0156] The first encapsulation layer 410 and the third encapsulation layer 430 may be composed of at least two layers. For example, the first encapsulation layer 410 may have a three-layer structure of silicon oxide SiOx, silicon nitride SiNx, and silicon oxide SiOx, but is not limited thereto. Alternatively, the first encapsulation layer 410 may have a four-layer structure of silicon oxide SiOx, silicon nitride SiNx, silicon oxide SiOx, and silicon oxide SiOx, but is not limited thereto.

[0157] The second encapsulation layer 420 can cover foreign matter or particles that may be generated during the manufacturing process. In addition, the second encapsulation layer 420 can also flatten the surface of the first encapsulation layer 410. For example, the second encapsulation layer 420 can serve as a particle covering layer, but is not limited thereto.

[0158] The second encapsulation layer 420 may be made of, for example, an organic material such as a polymer such as silicon oxycarbon SiOCz, epoxy, polyimide, polyethylene, or acrylate, but is not limited thereto.

[0159] The second encapsulation layer 420 may be made of a thermosetting material or a photocuring material that is hardened by heat or light.

[0160] The first encapsulation layer 410 may extend to the non-active area NA. For example, the first encapsulation layer 410 may be provided to cover the dam 117. The third encapsulation layer 430 may extend to the non-active area NA. For example, the third encapsulation layer 430 may be provided on the first encapsulation layer 410 to cover the dam 117.

[0161] The touch unit 500 may be provided on the encapsulation unit 400 .

[0162] The touch unit 500 may include a first touch electrode 540_R, a first touch connection electrode 520 , a second touch electrode, and a second touch connection electrode 540_C.

[0163] Portions of the first touch electrode 540_R, the first touch connection electrode 520 , the second touch electrode, and the second touch connection electrode 540_C may be disposed to overlap the bank 420 .

[0164] The first touch electrode 540_R, the second touch electrode, the first touch connection electrode 520, and the second touch connection electrode 540_C may be formed with a grid pattern in which metal lines each having a small line width intersect with each other. The grid pattern may have a diamond shape. The grid pattern may also have a rectangular shape, a pentagonal shape, a hexagonal shape, a circular shape, an elliptical shape, etc., but is not limited thereto.

[0165] The first touch electrode 540_R, the second touch electrode, the first touch connection electrode 520, and the second touch connection electrode 540_C may be made of an opaque conductive material having low resistance. For example, each of the electrodes may be constructed of a single layer or multiple layers of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W), and a transparent conductive oxide (TCO), or an alloy thereof, but is not limited thereto.

[0166] For example, each of the first touch electrode 540_R, the second touch electrode, the first touch connection electrode 520, and the second touch connection electrode 540_C may be made of a conductive metal material and may have a three-layer structure of titanium (Ti), aluminum (Al), and titanium (Ti), but is not limited thereto.

[0167] The first touch electrode 540_R, the second touch electrode, the first touch connection electrode 520 , and the second touch connection electrode 540_C may be made of the same material as the source electrode 250 and the drain electrode 270 .

[0168] A touch buffer layer 510 may be provided on the encapsulation unit 400. The touch buffer layer 510 can prevent chemicals used in the manufacturing process of the touch unit 500 (e.g., developers, etchants, etc.) or external moisture from penetrating into the light-emitting diode layer 340, which includes organic materials. Furthermore, the touch buffer layer 510 can prevent short circuits among the various touch sensor metals on the touch buffer layer 510 due to external impacts. Furthermore, the touch buffer layer 510 can block interference signals that may be generated when the touch unit is driven.

[0169] The touch buffer layer 510 may be made of at least one of an inorganic insulating material and an organic insulating material. The inorganic insulating material may be silicon nitride (SiNx) or silicon oxide (SiOx). The organic insulating material may be benzocyclobutene (BCB), acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. The touch buffer layer 510 may be constructed of multiple layers, but is not limited thereto.

[0170] The first touch connection electrode 520 may be disposed on the touch buffer layer 510 .

[0171] For example, the first touch connection electrode 520 may be disposed between first touch electrodes 540_R adjacent to each other in the first direction (or X-axis direction). The first touch connection electrode 520 may electrically connect a plurality of first touch electrodes 540_R spaced apart and adjacent to each other in the first direction (or X-axis direction), but is not limited thereto.

[0172] The first touch connection electrode 520 may be disposed to overlap with the second touch connection electrode 540_C, which is connected to the second touch electrodes adjacent to each other in the second direction (or Y-axis direction). The first touch connection electrode 520 and the second touch connection electrode 540_C are disposed on different layers and thus may be electrically insulated from each other.

[0173] The touch insulation layer 530 may be disposed on the touch buffer layer 510 and the first touch connection electrode 520 .

[0174] The touch insulation layer 530 may include a hole for electrically connecting the first touch electrode 540_R to the first touch connection electrode 520 .

[0175] The touch insulation layer 530 may be used to electrically insulate the second touch electrode from the second touch connection electrode 540_C.

[0176] The touch insulating layer 530 may be configured of a single layer of silicon nitride SiNx or silicon oxide SiOx or a multi-layer thereof, but is not limited thereto.

[0177] The first touch electrode 540_R, the second touch electrode, and the second touch connection electrode 540_C may be disposed on the touch insulation layer 530 .

[0178] The first touch electrode 540_R and the second touch electrode may be arranged to be spaced apart from each other by a predetermined distance. At least one first touch electrode 540_R adjacent to each other in the first direction (or the X-axis direction) may be spaced apart from each other. At least one first touch electrode 540_R adjacent to each other in the first direction (or the X-axis direction) may be connected to the first touch connection electrode 520 between the plurality of first touch electrodes 540_R. For example, the plurality of first touch electrodes 540_R adjacent to each other may be connected to the first touch connection electrode 520 through a hole formed in the touch insulation layer 530.

[0179] Second touch electrodes adjacent to each other in the second direction (or Y-axis direction) may be connected by a second touch connection electrode 540_C. The second touch electrodes and the second touch connection electrode 540_C may be provided on the same layer. For example, the second touch connection electrode 540_C may be provided between a plurality of second touch electrodes on the same layer as the second touch electrode. The second touch connection electrode 540_C may extend from the second touch electrode.

[0180] The first touch electrode 540_R, the second touch electrode, and the second touch connection electrode 540_C may be formed through the same process.

[0181] The touch planarization layer 550 may be disposed on the first touch electrode 540_R, the second touch electrode, and the second touch connection electrode 540_C.

[0182] The touch drive circuit can receive touch sensing signals from the first touch electrodes 540_R. Furthermore, the touch drive circuit can transmit touch drive signals from the second touch electrodes. The touch drive circuit can sense a user's touch by utilizing the mutual capacitance between the plurality of first touch electrodes 540_R and the second touch electrodes. For example, when the display device 100 is touched, the capacitance between the first touch electrodes 540_R and the second touch electrodes may change. The touch drive circuit can sense this change in capacitance and detect the coordinates of the touch.

[0183] Figure 4 is a cross-sectional view of a light emitting unit of a display device according to an exemplary embodiment of the present disclosure.

[0184] For ease of explanation, Figure 4 Only two light emitting diode layers are shown. However, the light emitting unit may include two or more light emitting diode layers and may further include one or more charge generation layers between the two or more light emitting diode layers.

[0185] The light-emitting diode layer 340 of the display device 100 according to the present disclosure may be a light-emitting unit. The light-emitting unit may include at least one light-emitting diode layer 340. For example, the light-emitting unit may have a stacked structure formed by stacking multiple light-emitting diode layers between the first electrode 310 and the second electrode 350. In this case, a charge generation layer may be further provided between the multiple light-emitting diode layers. Multiple light-emitting units may be provided in each sub-pixel SP.

[0186] When the light emitting diode layer 340 is configured as a light emitting unit, the light emitting unit may include a first light emitting diode layer 341 , a second light emitting diode layer 343 , and a charge generation layer 342 between the first light emitting diode layer 341 and the second light emitting diode layer 343 .

[0187] The presence of the trench T formed in the second bank 330 may increase the placement length of the light emitting unit disposed on the second bank 330. For example, the light emitting unit is disposed along the curve of the trench T formed in the second bank 330. Therefore, the transmission distance of electrons of the layer constituting the light emitting unit to the adjacent sub-pixel can be increased, thereby suppressing the transmission of electrons generated in the light emitting unit to the adjacent sub-pixel when the display device is driven.

[0188] The first electrode 310 , the first light emitting diode layer 341 , the charge generation layer 342 , the second light emitting diode layer 343 , and the second electrode 350 may be sequentially disposed on the substrate 110 including the first subpixel SP1 , the second subpixel SP2 , and the third subpixel SP3 .

[0189] The first light emitting diode layer 341 may include a hole injection layer 341 -A, a first hole transport layer 341 -B, a first light emitting layer 341 -C, and a first electron transport layer 341 -D.

[0190] The second light emitting diode layer 343 may include a second hole transport layer 343 -A, a second light emitting layer 343 -B, a second electron transport layer 343 -C, and an electron injection layer 343 -D.

[0191] The charge generation layer 342 may further include an n-type charge generation layer (n-CGL) 342-n and a p-type charge generation layer (p-CGL) 342-p. The n-type charge generation layer 342-n helps inject electrons into the first light emitting diode layer 341, and the p-type charge generation layer 342-p helps inject holes into the second light emitting diode layer 343.

[0192] The first light emitting layer 341-c and the second light emitting layer 343-B may be disposed in a pattern spaced apart from each other to correspond to respective sub-pixels. For example, the first light emitting layer 341-c and the second light emitting layer 343-B may be disposed on at least a portion of an end point of the bank.

[0193] The hole injection layer 341-A can be used to promote hole injection. The hole injection layer 341-A can be made of any one or more selected from the group consisting of, but not limited to, HATCN (1,4,5,8,9,11-hexaazatriphenylene-capronitrile), CuPc (copper phthalocyanine), PEDOT (poly(3,4)-ethylenedioxythiophene), PANI (polyaniline), and NPD (N,N-dinaphthyl-N,N'-diphenylbenzidine).

[0194] The first hole transport layer 341-B and the second hole transport layer 343-A may be used to promote hole transport. The first hole transport layer 341-B and the second hole transport layer 343-A may be made of any one or more selected from the group including, but not limited to, NPD (N,N-dinaphthyl-N,N,N'-diphenylbenzidine), TPD (N,N'-bis-(3-methylphenyl)-N,N'-bis-(phenyl)-benzidine), s-TAD, and MTDATA (4,4',4"-tris(N-3-methylphenyl-N-phenyl-amino)-triphenylamine).

[0195] The first electron transport layer 341-D and the second electron transport layer 343-C may be used to facilitate electron transport. The first electron transport layer 341-D and the second electron transport layer 343-C may be made of any one or more selected from the group consisting of, but not limited to, Alq3 (tris(8-hydroxyquinoline)aluminum), PBD (2-(4-biphenyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole), TAZ, spiro-PBD, BAlq, and SAlq.

[0196] The electron injection layer 343-D can be used to facilitate electron injection. The electron injection layer 343-D can be made of, but is not limited to, Alq3 (tris(8-hydroxyquinoline)aluminum), PBD (2-(4-biphenyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole), TAZ, spiro-PBD, BAlq, or SAlq.

[0197] The first light-emitting layer 341-C and the second light-emitting layer 343-B may be disposed in the light-emitting area EA and on the first bank 320 or the second bank 330. Furthermore, the first light-emitting layer 341-C and the second light-emitting layer 343-B may be spaced apart from each other between adjacent sub-pixels. For example, the first light-emitting layer 341-C and the second light-emitting layer 343-B may be deposited on each sub-pixel using a fine metal mask (FMM).

[0198] The first light-emitting layer 341-C may overlap with the second light-emitting layer 343-B. The first light-emitting layer 341-C and the second light-emitting layer 343-B may contain light-emitting materials that emit red, green, and blue light, respectively. The light-emitting materials may be phosphorescent or fluorescent.

[0199] For example, the first red light-emitting layer 341-C1 and the second red light-emitting layer 343-B1 provided in the first sub-pixel SP1 may be made of a phosphorescent material including a main material and a dopant material. The main material may include CBP (carbazole biphenyl) or mCP (1,3-di(carbazole-9-yl)). The dopant material may include any one or more selected from the group consisting of PIQIr(acac) (bis(1-phenylisoquinoline) iridium acetylacetonate), PQIr(acac) (bis(1-phenylquinoline) iridium acetylacetonate), PQIr(tris(1-phenylquinoline)iridium) and PtOEP (octaethylporphyrin platinum). Alternatively, the first red light-emitting layer 341-C1 and the second red light-emitting layer 343-B1 may be made of a fluorescent material including PBD:Eu(DBM)3 (o-phenanthroline) or perylene, but is not limited thereto.

[0200] The first green light-emitting layer 341-C2 and the second green light-emitting layer 343-B2 provided in the second sub-pixel SP2 may be made of a phosphorescent material including a main material and a dopant material. The main material may include CBP or mCP. The dopant material may be an iridium complex including Ir(PY)3 (facial tris(2-phenylpyridine)iridium). Alternatively, the first green light-emitting layer 341-C2 and the second green light-emitting layer 343-B2 may be made of a fluorescent material including Alq3 (tris(8-hydroxyquinoline)aluminum), but is not limited thereto.

[0201] The first blue light-emitting layer 341-C3 and the second blue light-emitting layer 343-B3 provided in the third sub-pixel SP3 may be made of a phosphorescent material including a main material and a dopant material. The main material may include CBP or mCP, and the dopant material may include (4,6-F2ppy)2Irpic. Alternatively, the first blue light-emitting layer 341-C3 and the second blue light-emitting layer 343-B3 may be made of a fluorescent material including, but not limited to, any one selected from the group consisting of spiro-DPVBi, spiro-6P, distyrylbenzene (DSB), distyrylarylene (DSA), PFO-based polymers, and PPV-based polymers.

[0202] The first light-emitting layer 341-C and the second light-emitting layer 343-B may each further include an auxiliary light-emitting layer. For example, the auxiliary light-emitting layer may be disposed above or below each of the first light-emitting layer 341-C and the second light-emitting layer 343-B. The auxiliary light-emitting layer may emit light of the same color as or a different color than the light emitted by the first light-emitting layer 341-C and the second light-emitting layer 343-B.

[0203] The n-type charge generation layer 342-n may be made of an alkali metal, an alkali metal compound, an electron-injecting organic material, or a compound thereof. For example, the n-type charge generation layer 342-n may be constructed of a mixed layer of an n-type material such as an anthracene derivative doped with cesium (Cs) and lithium (Li), but is not limited thereto.

[0204] The p-type charge generation layer 342-p may be made of an organic material used as a hole injection layer. For example, the p-type charge generation layer 342-p may be constructed of a single layer of a p-type material such as HATCN and F4-TCNQ, but is not limited thereto.

[0205] Some components of the light-emitting unit can be arranged throughout the active area AA. For example, the charge generation layer 342, the hole injection layer 341-A, the hole transport layers 341-B and 343-A, the electron transport layers 341-D and 343-C, and the electron injection layer 343-D are continuously arranged in multiple sub-pixels SP1, SP2, and SP3. Therefore, the spacing between the sub-pixels is reduced, and thus image information may be distorted due to lateral leakage current between adjacent pixels. However, the light-emitting unit is arranged along the curve formed on the bank, and thus the transmission distance of electrons to adjacent sub-pixels is increased. Therefore, when the display device is driven, the transmission of electrons generated in the light-emitting diode layer to adjacent pixels can be suppressed. Figure 5 The arrangement of a light emitting area and a non-light emitting area of ​​a display device according to another exemplary embodiment of the present disclosure is shown. Figure 6 It is along Figure 5 In addition to the arrangement of the color filters and sub-pixels, Figure 5 and Figure 6 The display device 100' is shown with Figures 1 to 4 The display devices 100 shown are substantially identical, and therefore, for the sake of brevity, repeated descriptions of identical components are omitted.

[0206] Reference Figure 5 The emission area EA may have a circular shape, an elliptical shape, or a polygonal shape in a plan view. The emission areas EA of the sub-pixels may have different sizes from each other.

[0207] Multiple light-emitting areas emitting light of different colors may be located in the light-emitting area EA. For example, the light-emitting area EA may include a first light-emitting area EA1 emitting red light, a second light-emitting area EA2 emitting green light, and a third light-emitting area EA3 emitting blue light. Alternatively, the light-emitting area EA may include a white light-emitting area, but is not limited thereto.

[0208] The bank may include a first bank 320 and a second bank 330 .

[0209] The first bank 320 may be arranged to surround all or part of each emission area EA. For example, the first bank 320 may include a first pattern 321, a second pattern 322, and a third pattern 323. The first pattern 321 surrounds the first sub-pixel SP1 or the first emission area EA1. The second pattern 322 surrounds the second sub-pixel SP2 or the second emission area EA2. The third pattern 323 surrounds the third sub-pixel SP3 or the third emission area EA3. The first pattern 321, the second pattern 322, and the third pattern 323 are not connected to each other and may be spaced apart from each other.

[0210] The second bank 330 may be provided in the non-emission area NEA. For example, the second bank 330 may be continuously provided in the non-emission area to overlap at least a portion of the first bank 320 or cover the entirety of the first bank 320.

[0211] Reference Figure 6 A color filter unit 600 may be further provided on the touch unit 500. The color filter unit 600 may include a plurality of color filters and a black matrix.

[0212] The fourth insulating layer 610 may be disposed on the touch unit 500. The fourth insulating layer 610 may be made of an inorganic insulating material such as silicon nitride SiNx or silicon oxide SiOx, or may be made of an organic insulating material, but is not limited thereto.

[0213] Depending on the structure and type of the thin film transistor 200 , the fourth insulating layer 610 may also be omitted.

[0214] The black matrix 620 may be disposed on the fourth insulating layer 610 in the non-emission area NEA.

[0215] The black matrix 620 may be disposed between the plurality of color filters to suppress color mixing.

[0216] The black matrix 620 may be made of at least one of an inorganic insulating material, an organic insulating material, and a photosensitizer. The inorganic insulating material may be silicon nitride SiNx or silicon oxide SiOx. The organic insulating material may be benzocyclobutene (BCB), acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. The photosensitizer may be a black pigment. However, the present disclosure is not limited thereto.

[0217] The black matrix 620 may overlap at least with the first bank 320. The black matrix 620 may overlap with the trench T of the second bank 330. Alternatively, a portion of the first bank 320 may overlap with the black matrix 620. A portion of the first bank 320 may overlap with the black matrix 620, and another portion of the first bank 320 may be closer to the light emitting region than the portion of the first bank 320 and may overlap with the color filter. Another portion of the first bank 320 may not overlap with the black matrix 620.

[0218] In the display device 100' according to another exemplary embodiment of the present disclosure, the gap in the first bank 320 overlaps the black matrix 620. Therefore, even if light incident from the outside of the display device 100' is reflected, there is almost no effect.

[0219] The color filter 630 may be disposed on the fourth insulating layer in the emission area EA.

[0220] The color filter 630 may be composed of a plurality of color filters. For example, the color filter 630 may include a first color filter 631 , a second color filter 632 , and a third color filter 633 .

[0221] The first color filter 631 is provided to correspond to the first sub-pixel SP1 and may include a red color filter material. The second color filter 632 is provided to correspond to the second sub-pixel SP2 and may include a green color filter material. The third color filter 633 is provided to correspond to the third sub-pixel SP3 and may include a red color filter material.

[0222] End points of the first color filter 631 , the second color filter 632 , and the third color filter 633 may be disposed on the black matrix 620 and may cover the end points of the black matrix 620 .

[0223] Figure 6 The first, second, and third color filters 631, 632, and 633 are shown to be spaced apart from each other. However, the first, second, and third color filters 631, 632, and 633 may contact each other, or at least portions thereof may overlap each other.

[0224] An overcoat 640 may be disposed on the color filter 630 .

[0225] The overcoat 640 may protect the color filter 630 and the black matrix 620 disposed under the overcoat 640 , and may reduce or planarize steps.

[0226] The adhesive layer 700 may be disposed on the outer cover 640 .

[0227] The color filter unit 600 may be bonded to the front member 800 by using the adhesive layer 700 .

[0228] The adhesive layer 700 may be made of a material having adhesive properties. The adhesive layer 700 may be made of, for example, an optically clear adhesive (OCA), a pressure sensitive adhesive (PSA), etc., but is not limited thereto.

[0229] The front member 800 may be disposed on the adhesive layer 700 .

[0230] The front member 800 can protect the display driver DISP, the touch unit 500, and the like disposed below the front member 800 from external impact, moisture, heat, and the like. The front member 800 can be made of a material having impact resistance and light transmittance. For example, the front member 800 can be a substrate made of glass. In addition, the front member 800 can be a film made of a plastic material, such as, but not limited to, polymethyl methacrylate (PMMA), polyimide (PI), and polyethylene terephthalate (PET). In addition, the front member 800 can also have various names, such as, but not limited to, a cover window, a window cover, or a cover glass.

[0231] After the manufacturing process of the components provided on the substrate 110 is completed, the front member 800 may be bonded to the substrate 110 through a bonding process.

[0232] If a color filter unit 600 is also provided on the touch unit 500 as in another exemplary embodiment, the polarizing plate for reducing reflectivity can be removed. For example, when light is incident on the display device 100 from the outside, the light may be reflected by the wiring or pattern made of metal in the display device 100 and then sent to the outside. In this case, when the power is off, the wiring or pattern made of metal in the display device 100 can be recognized by the user of the display device 100. However, since the color filter unit 600 is also provided, even when the light is reflected by the wiring or pattern made of metal in the display device 100, the black matrix of the color filter unit 600 can block the light. Therefore, a polarizing plate may not be provided.

[0233] The foregoing exemplary embodiments are briefly described below.

[0234] A display device according to an exemplary embodiment of the present disclosure includes: a substrate including a first sub-pixel and a second sub-pixel; a first electrode disposed in each of the first sub-pixel and the second sub-pixel; and a bank disposed to cover an end point of the first electrode and separate a light-emitting region from a non-light-emitting region surrounding the light-emitting region. In this context, the bank may include a first bank disposed on the first electrode and a second bank disposed on the first bank and including a groove.

[0235] In the display device according to the exemplary embodiment of the present disclosure, the first bank may include a material including a black pigment, and the second bank may include a transparent material.

[0236] In the display device according to the exemplary embodiment of the present disclosure, the first bank may include an initiator of the oligomer monomer.

[0237] In the display device according to the exemplary embodiment of the present disclosure, the first bank may include a first pattern surrounding the first electrode of the first subpixel and a second pattern surrounding the first electrode of the second subpixel and spaced apart from the first pattern.

[0238] In the display device according to the exemplary embodiment of the present disclosure, the second bank may surround the entirety of the upper surface and the side surface of the first bank and may be continuously provided in the non-emission region.

[0239] In the display device according to the exemplary embodiment of the present disclosure, the second bank may expose a portion of the upper surface of the first bank and may be continuously provided in the non-emission region.

[0240] The display device according to the exemplary embodiment of the present disclosure may further include a planarization layer provided between the substrate and the first electrode. An upper surface of the planarization layer may be exposed by the first pattern and the second pattern.

[0241] In the display device according to the exemplary embodiment of the present disclosure, the upper surface of the planarization layer exposed by the first and second patterns may be in contact with the second bank.

[0242] The display device according to the exemplary embodiment of the present disclosure may further include a light emitting unit including a plurality of light emitting layers disposed on the first electrode and the second bank, and a charge generation layer disposed between the plurality of light emitting layers.

[0243] In the display device according to the exemplary embodiment of the present disclosure, the light emitting unit may be disposed on the second bank and include a curved line.

[0244] The display device according to the exemplary embodiment of the present disclosure may further include an encapsulation unit disposed on the light emitting unit, a touch unit disposed on the encapsulation unit, and a color filter unit disposed on the touch unit.

[0245] In a display device according to an exemplary embodiment of the present disclosure, the color filter unit may include: an insulating layer disposed on the touch unit; a black matrix disposed on the insulating layer in a non-luminous area; and a color filter disposed on the black matrix to correspond to the first sub-pixel and the second sub-pixel.

[0246] In the display device according to the exemplary embodiment of the present disclosure, the first bank may include: a first portion overlapping the black matrix and the color filter; and a second portion overlapping the color filter.

[0247] A display device according to an exemplary embodiment of the present disclosure includes: a substrate including an active area and an inactive area, the active area including a plurality of sub-pixels; a plurality of light-emitting diodes, which are respectively arranged in the plurality of sub-pixels and include a first electrode, a light-emitting unit, and a second electrode; a plurality of first dams, which are arranged to cover end points of the first electrodes of the plurality of light-emitting diodes and are spaced apart from each other; and a second dam, which is arranged on the end points of the first electrodes of the plurality of light-emitting diodes and the plurality of first dams and includes a groove.

[0248] In the display device according to the exemplary embodiment of the present disclosure, the first bank may include a light-shielding material, and the second bank may include a light-transmitting material.

[0249] In the display device according to the exemplary embodiment of the present disclosure, the first bank may include a first pattern surrounding the first electrode of the first subpixel and a second pattern surrounding the first electrode of the second subpixel and spaced apart from the first pattern.

[0250] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure.

Claims

1. A display device, comprising: a substrate comprising a first sub-pixel and a second sub-pixel; a first electrode disposed in each of the first sub-pixel and the second sub-pixel; as well as a bank provided to cover an end point of the first electrode and to separate a light emitting area from a non-light emitting area surrounding the light emitting area, The bank includes a first bank disposed on the first electrode and a second bank disposed on the first bank and including a groove.

2. The display device according to claim 1, wherein The first bank includes a material including a black pigment, and the second bank includes a transparent material.

3. The display device according to claim 2, wherein The first bank comprises an initiator of oligomeric monomers. The display device according to claim 1 , wherein: The first embankment comprises: a first pattern surrounding the first electrode of the first sub-pixel; and a second pattern surrounding the first electrode of the second sub-pixel and spaced apart from the first pattern.

5. The display device according to claim 4, wherein The second bank surrounds the entire upper surface and side surfaces of the first bank and is continuously provided in the non-light emitting region. The display device according to claim 4 , wherein: The second bank exposes a portion of an upper surface of the first bank and is continuously provided in the non-light emitting region.

7. The display device according to claim 4, further comprising: a planarization layer, the planarization layer being disposed between the substrate and the first electrode, The upper surface of the planarization layer is exposed by the first pattern and the second pattern.

8. The display device according to claim 7, wherein An upper surface of the planarization layer exposed by the first and second patterns contacts the second bank.

9. The display device according to claim 1, further comprising: A light emitting unit includes a plurality of light emitting layers provided on the first electrode and the second bank, and a charge generation layer provided between the plurality of light emitting layers.

10. The display device according to claim 9, wherein The light emitting unit is disposed on the second bank and includes a curved line.

11. The display device according to claim 9, further comprising: an encapsulation unit, the encapsulation unit being arranged on the light-emitting unit; a touch unit, the touch unit being arranged on the packaging unit; as well as A color filter unit is provided on the touch unit.

12. The display device according to claim 11, wherein The color filter unit includes: an insulating layer, the insulating layer being disposed on the touch unit; a black matrix disposed on the insulating layer in the non-light emitting area; and A color filter is disposed on the black matrix to correspond to the first sub-pixel and the second sub-pixel.

13. The display device according to claim 12, wherein The first embankment comprises: a first portion overlapping the black matrix and the color filter; and A second portion overlaps the color filter.

14. A display device comprising: a substrate comprising a first sub-pixel and a second sub-pixel; a first electrode disposed in each of the first sub-pixel and the second sub-pixel; as well as a bank provided to cover an end point of the first electrode and to separate a light emitting region from a non-light emitting region surrounding the light emitting region, Wherein, the embankment comprises: a first bank provided on the first electrode and including a material including a black pigment; and The second bank is provided on the first bank and covers at least a portion of an outer surface of the first bank, and the second bank includes a transparent material.

15. The display device according to claim 14, wherein The second bank covers the entire outer surface of the first bank.

16. The display device according to claim 14, wherein The second bank exposes an edge portion of an outer surface of the first bank, and a projection of the edge portion of the outer surface on the substrate overlaps a half of a projection of an end point of the first electrode on the substrate.

17. The display device according to claim 14, wherein: The second bank includes a groove.

18. The display device according to claim 14, further comprising: a light emitting diode layer, the light emitting diode layer being disposed on the second bank and the first electrode; as well as A second electrode is provided on the light emitting diode layer.

19. The display device according to claim 14, wherein The second bank is continuously provided in the non-light emitting region.

20. The display device according to claim 17, wherein The second embankment comprises: two spacers protruding in a direction opposite to the substrate; and a connecting portion connecting the two spacers, Wherein, the connecting portion forms the groove.

21. The display device according to claim 14, further comprising: a light-emitting unit including a plurality of light-emitting layers disposed on the first electrode and the second bank; an encapsulation unit, the encapsulation unit being arranged on the light-emitting unit; a touch unit, the touch unit being arranged on the packaging unit; as well as A color filter unit is provided on the touch unit.

22. The display device according to claim 21, wherein The color filter unit includes: an insulating layer, the insulating layer being disposed on the touch unit; a black matrix disposed on the insulating layer in the non-light emitting area; and A color filter is disposed on the black matrix to correspond to the first sub-pixel and the second sub-pixel.

23. The display device according to claim 14, wherein The first embankment comprises: a first pattern surrounding the first electrode of the first sub-pixel; and a second pattern surrounding the first electrode of the second sub-pixel and spaced apart from the first pattern; Wherein, the display device further includes: A planarization layer is provided between the substrate and the first electrode, wherein: An upper surface of the planarization layer is exposed by the first pattern and the second pattern.

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