Display panel, preparation method and display device

Abstract

The invention relates to a display panel, a preparation method and a display device.The display panel comprises a substrate and an isolation structure, the isolation structure is arranged on one side of the substrate, a plurality of isolation openings are defined by the isolation structure, and the isolation structure comprises a conductive part and a blocking part which are sequentially arranged in a stacked mode in the direction away from the substrate; the orthographic projection of the conductive part on the substrate is located in the orthographic projection of the blocking part on the substrate; the protection layer is arranged on the side, away from the substrate, of the blocking part. The orthographic projection of the protection layer on the substrate is located in the orthographic projection of the blocking part on the substrate. According to the display panel provided by the invention, the protection layer is arranged on the side, deviating from the substrate, of the blocking part, so that the impact of a subsequent manufacturing process on the blocking part can be reduced, the blocking part is prevented from deforming, pixel failure caused by deformation of the blocking part can be improved, and the display effect of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a preparation method, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display technology is considered the most promising new flat-panel display technology for the next generation. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-luminescence, wide viewing angle, and fast response speed.

[0003] In the traditional display panel manufacturing process, pixel patterning is typically achieved through a fine metal mask (FMM). FMM technology is mature and has extensive mass production experience. However, FMM technology also has issues such as limited precision, high development costs, and long development cycles. Fine metal mask-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance, offering the advantages of high performance, full-area sizing, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe the fine metal mask-free technology for reference.

[0004] However, current OLED display panels still have the problem of poor display. Summary of the Invention

[0005] Based on this, it is necessary to provide a display panel, a preparation method, and a display device that can improve the display effect of the display panel in order to address the above technical problems.

[0006] In a first aspect, an embodiment of the present application provides a display panel, including:

[0007] substrate;

[0008] an isolation structure disposed on one side of the substrate, the isolation structure enclosing a plurality of isolation openings, the isolation structure comprising a conductive portion and a blocking portion stacked sequentially in a direction away from the substrate, the orthographic projection of the conductive portion on the substrate being within the orthographic projection of the blocking portion on the substrate;

[0009] The protective layer is arranged on a side of the blocking portion facing away from the substrate, and the orthographic projection of the protective layer on the substrate is located within the orthographic projection of the blocking portion on the substrate.

[0010] In one embodiment, the orthographic projection of the protective layer on the substrate covers the orthographic projection of the conductive portion on the substrate;

[0011] Optionally, the blocking portion includes a first surface close to the protective layer, and an orthographic projection of the first surface on the substrate covers an orthographic projection of the protective layer on the substrate;

[0012] Optionally, the conductive portion includes a second surface close to the protective layer and a third surface away from the protective layer, the orthographic projection of the protective layer on the substrate covers the orthographic projection of the second surface on the substrate, and the orthographic projection of the protective layer on the substrate covers the orthographic projection of the third surface on the substrate;

[0013] Optionally, along the arrangement direction of adjacent isolation openings, an area of ​​an orthographic projection of the second surface on the substrate is smaller than or equal to an area of ​​an orthographic projection of the protective layer on the substrate, and an area of ​​an orthographic projection of the protective layer on the substrate is smaller than or equal to an area of ​​an orthographic projection of the blocking portion on the substrate;

[0014] Optionally, along the arrangement direction of adjacent isolation openings, the area of ​​the orthographic projection of the third surface on the substrate is less than or equal to the area of ​​the orthographic projection of the protective layer on the substrate, and the area of ​​the orthographic projection of the protective layer on the substrate is less than or equal to the area of ​​the orthographic projection of the first surface on the substrate.

[0015] In one embodiment, a protective layer is provided around the isolation opening;

[0016] Optionally, the orthographic projection of the protective layer on the substrate is in a grid shape;

[0017] Optionally, the deformation amount of the protective layer is smaller than the deformation amount of the blocking portion;

[0018] Optionally, the material of the protective layer includes metal oxide;

[0019] Optionally, the material of the protective layer includes at least one of indium tin oxide, indium zinc oxide, and indium tin zinc oxide.

[0020] In one embodiment, along the thickness direction of the substrate, the thickness of the protective layer is less than the thickness of the blocking portion;

[0021] Optionally, along the thickness direction of the substrate, the thickness of the protective layer is greater than or equal to 50 angstroms and less than or equal to 1000 angstroms.

[0022] In one embodiment, the isolation structure further includes a support portion provided on a side of the conductive portion close to the substrate, and an orthographic projection of the conductive portion on the substrate is located within an orthographic projection of the support portion on the substrate;

[0023] Optionally, the material of the supporting portion includes molybdenum, the material of the conductive portion includes aluminum, and the material of the blocking portion includes titanium.

[0024] In one embodiment, the display panel further includes:

[0025] A pixel defining layer is provided on a side of the substrate close to the isolation structure, the pixel defining layer comprising a plurality of pixel openings, each pixel opening being correspondingly connected to each isolation opening;

[0026] A plurality of light-emitting devices, at least some of which are arranged corresponding to the isolation openings, and at least some of which are arranged in the corresponding isolation openings; the light-emitting devices include a first electrode, a light-emitting portion and a second electrode which are sequentially stacked in a direction away from the substrate.

[0027] In a second aspect, an embodiment of the present application provides a method for manufacturing a display panel, the method comprising:

[0028] forming a first electrode material layer on one side of the substrate, and performing a first patterning process on the first electrode material layer to form a first electrode;

[0029] A pixel-defining material layer is formed on a side of the substrate close to the first electrode and on a side of the first electrode facing away from the substrate, and an isolation material layer and a protective material layer are sequentially stacked on a side of the pixel-defining material layer facing away from the substrate; the isolation material layer includes a conductive material layer close to the pixel-defining material layer and a barrier material layer away from the pixel-defining material layer;

[0030] Performing a second patterning process on the protective material layer and the isolation material layer to form a protective layer and an isolation structure, wherein the isolation structure encloses a plurality of isolation openings; the isolation structure includes a conductive portion and a blocking portion stacked in sequence in a direction away from the substrate, wherein the orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the blocking portion on the substrate; and the orthographic projection of the protective layer on the substrate is located within the orthographic projection of the blocking portion on the substrate;

[0031] The pixel defining material layer is subjected to a third patterning process to form a pixel defining layer; the pixel defining layer includes a plurality of pixel openings, and each pixel opening is correspondingly connected to each isolation opening.

[0032] In one embodiment, performing a second patterning process on the protective material layer and the isolation material layer to form the protective layer and the isolation structure includes:

[0033] forming a first photoresist layer on a side of the protective material layer facing away from the substrate, and performing a first sub-patterning process on the protective material layer based on the first photoresist layer to form a protective layer;

[0034] A second sub-patterning process is performed on the barrier material layer and the conductive material layer to form a barrier portion and a conductive portion.

[0035] In one embodiment, the isolation material layer further includes a support material layer provided on a side of the pixel defining material layer facing away from the substrate, and the isolation structure further includes a support portion provided on a side of the conductive portion close to the substrate. The barrier material layer and the conductive material layer are subjected to a second sub-patterning process to form the conductive portion and the barrier portion, including:

[0036] Performing a second sub-patterning process on the blocking material layer, the conductive material layer, and the supporting material layer based on the first photoresist layer to form a supporting portion, a conductive portion, and a blocking portion;

[0037] Optionally, performing a second sub-patterning process on the blocking material layer, the conductive material layer, and the supporting material layer based on the first photoresist layer to form the supporting portion, the conductive portion, and the blocking portion includes:

[0038] Performing a second sub-patterning process on the blocking material layer and the conductive material layer based on the first photoresist layer to form a blocking portion and an initial conductive portion;

[0039] stripping the first photoresist layer and performing crystallization treatment on the protective layer;

[0040] A second sub-patterning process is performed on the initial conductive portion and the support material layer to form a conductive portion and a support portion.

[0041] In one embodiment, performing a first sub-patterning process on the protective material layer based on the first photoresist layer to form the protective layer includes:

[0042] performing a first sub-patterning process on the protective material layer based on the first photoresist layer to form an initial protective layer;

[0043] The first photoresist layer is stripped off, and the initial protective layer is crystallized to form a protective layer.

[0044] In one embodiment, performing a second sub-patterning process on the barrier material layer and the conductive material layer to form a barrier portion and a conductive portion includes:

[0045] forming a second photoresist layer on a side of the protective layer facing away from the substrate;

[0046] A second sub-patterning process is performed on the blocking material layer and the conductive material layer based on the second photoresist layer to form a blocking portion and a conductive portion.

[0047] In one embodiment, the isolation material layer further includes a support material layer provided on a side of the pixel defining material layer facing away from the substrate, the isolation structure further includes a support portion provided on a side of the conductive portion close to the substrate, and a second sub-patterning process is performed on the barrier material layer and the conductive material layer based on the second photoresist layer to form the barrier portion and the conductive portion, including:

[0048] A second sub-patterning process is performed on the blocking material layer, the conductive material layer and the supporting material layer based on the second photoresist layer to form a blocking portion, a conductive portion and a supporting portion.

[0049] In one embodiment, performing a second sub-patterning process on the barrier material layer and the conductive material layer to form a barrier portion and a conductive portion includes:

[0050] A second sub-patterning process is performed on the barrier material layer and the conductive material layer based on the protective layer to form a barrier portion and a conductive portion.

[0051] In one embodiment, the isolation material layer further includes a support material layer provided on a side of the pixel defining material layer facing away from the substrate, and the isolation structure further includes a support portion provided on a side of the conductive portion close to the substrate. The barrier material layer and the conductive material layer are subjected to a second sub-patterning process based on the protective layer to form the barrier portion and the conductive portion, including:

[0052] Performing a second sub-patterning process on the barrier material layer and the conductive material layer based on the protective layer to form a barrier portion and an initial conductive portion;

[0053] A second sub-patterning process is performed on the initial conductive portion and the support material layer to form a conductive portion and a support portion.

[0054] In a third aspect, an embodiment of the present application further provides a display device, comprising the display panel provided in the first aspect, or a display panel prepared using the preparation method provided in the second aspect.

[0055] The embodiments of the present application provide a display panel, a preparation method, and a display device, wherein the display panel includes a substrate, an isolation structure, and a protective layer. The isolation structure is provided on one side of the substrate, and the isolation structure encloses and forms a plurality of isolation openings. The isolation structure includes a conductive portion and a blocking portion stacked in sequence in a direction away from the substrate, and the orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the blocking portion on the substrate; the protective layer is provided on the side of the blocking portion away from the substrate, and the orthographic projection of the protective layer on the substrate is located within the orthographic projection of the blocking portion on the substrate. In the display panel provided by the present application, by providing a protective layer on the side of the blocking portion away from the substrate, the "impact" of subsequent process technology on the blocking portion can be reduced, deformation of the blocking portion can be avoided, and pixel failure caused by deformation of the blocking portion can be improved, thereby improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For different technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0057] Figure 1 A schematic diagram of a cross-sectional structure of a display panel provided in one embodiment;

[0058] Figure 2 A schematic diagram of a planar structure of a display panel provided by an embodiment;

[0059] Figure 3 A schematic diagram of an isolation structure provided in accordance with an embodiment;

[0060] Figure 4 A schematic cross-sectional structure diagram of a display panel provided in another embodiment;

[0061] Figure 5 A schematic cross-sectional structure diagram of a display panel provided in another embodiment;

[0062] Figure 6 A schematic flow chart of the steps of a method for manufacturing a display panel provided in one embodiment;

[0063] Figure 7 A schematic flow chart of steps of a method for manufacturing a display panel provided in another embodiment;

[0064] Figure 8 A schematic flow chart of steps of a method for manufacturing a display panel provided in another embodiment;

[0065] Figure 9 A schematic flow chart of steps of a method for manufacturing a display panel provided in another embodiment;

[0066] Figure 10 A schematic flow chart of steps of a method for manufacturing a display panel provided in another embodiment;

[0067] Figure 11 A schematic flow chart of steps of a method for manufacturing a display panel provided in another embodiment;

[0068] Figure 12 A schematic flow chart of steps of a method for manufacturing a display panel provided in another embodiment;

[0069] Figure 13 for Figure 12 A schematic flow chart of a method for manufacturing a display panel is shown;

[0070] Figure 14 A schematic flow chart of steps of a method for manufacturing a display panel provided in another embodiment;

[0071] Figure 15 for Figure 14 A schematic flow chart of a method for manufacturing a display panel is shown;

[0072] Figure 16 A schematic flow chart of steps of a method for manufacturing a display panel provided in another embodiment;

[0073] Figure 17 for Figure 16 A schematic flow chart of a method for manufacturing a display panel is shown;

[0074] Figure 18 A schematic flow chart of steps of a method for manufacturing a display panel provided in another embodiment;

[0075] Figure 19 for Figure 18 Schematic diagram of the process of manufacturing a display panel shown.

[0076] Description of reference numerals:

[0077] 10. Display panel; 100. Substrate; 200. Isolation layer; 210. Isolation structure; 211. Conductive portion; 211a. Second surface; 211b. Third surface; 211c. Initial conductive portion; 211c-1. First conductive portion; 211c-2. Second conductive portion; 212. Blocking portion; 212a. First surface; 213. Supporting portion; 220. Isolation opening; 300. Protective layer; 400. Pixel defining layer; 410. Pixel opening; 500. Light-emitting device; 510. First electrode; 520. Light-emitting portion; 530. Second electrode; 540. Encapsulation portion; 600. Encapsulation layer; 1. Pixel defining material layer; 2. Supporting material layer; 3. Conductive material layer; 4. Blocking material layer; 5. Protective material layer; 6. First photoresist layer; 7. Second photoresist layer. DETAILED DESCRIPTION

[0078] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0079] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, they do not indicate any order, quantity or importance, but are simply used to distinguish different components. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. "Include" or "comprising" and similar words mean that the elements or objects that appear before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0080] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0081] In addition, in the specification, the phrase "planar distribution schematic diagram" refers to an illustration when the target part is observed from above, and the phrase "cross-sectional schematic diagram" or "cross-sectional structure schematic diagram" refers to an illustration when a cross section taken by vertically cutting the target part is observed from the side.

[0082] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0083] Before specifically introducing the technical solutions of the embodiments of the present application, the technical background or technical evolution context on which the embodiments of the present application are based is first introduced. Organic Light Emitting Diode (OLED) has an increasing number of application areas and its influence is gradually increasing due to its excellent color and image quality. In the related art, the preparation of the isolation layer of the display panel and the pixel etching and patterning process require multiple process flows and a certain amount of pressure, which will cause the blocking portion in the isolation layer to deform, that is, the edge position of the blocking portion is prone to warping, which can easily cause pixel failure and lead to poor display effect of the display panel.

[0084] In view of the above-mentioned problems, the embodiments of the present application provide a display panel, manufacturing method, and display device that can improve the problem of the barrier portion's edge warping. By providing a protective layer on the side of the isolation structure facing away from the substrate, deformation of the isolation structure during later manufacturing processes, i.e., warping of the barrier portion's edge within the isolation structure, can be effectively prevented. This can alleviate the problem of pixel failure caused by deformation of the isolation layer, thereby improving the display quality of the display panel.

[0085] Combine Figure 1-Figure 5 An embodiment of the present application provides a display panel 10, which may be an organic light emitting diode display panel (Organic Light Emitting Diode, referred to as OLED) or a quantum dot electroluminescent display panel (Quantum Dot Light Emitting Diodes, referred to as QLED).

[0086] Specifically, see Figure 1The display panel 10 includes a substrate 100, an isolation layer 200, and a protective layer 300. The isolation layer 200 is disposed on one side of the substrate 100 and includes an isolation structure 210 and a plurality of isolation openings 220 formed by the isolation structure 210. The isolation structure 210 includes a conductive portion 211 and a blocking portion 212 stacked in a direction away from the substrate 100. It will be understood that the conductive portion 211 is disposed on one side of the substrate 100, and the blocking portion 212 is disposed on the side of the conductive portion 211 facing away from the substrate 100.

[0087] The orthographic projection of the conductive portion 211 on the substrate 100 is located within the orthographic projection of the blocking portion 212 on the substrate 100. It is understood that, along the arrangement direction of adjacent isolation openings 220, the orthographic projection area of ​​the conductive portion 211 on the substrate 100 is smaller than the orthographic projection area of ​​the blocking portion 212 on the substrate 100.

[0088] In an optional embodiment, the conductive portion 211 includes at least one metal layer. In one example, the conductive portion 211 includes a metal layer. Furthermore, the material of the conductive portion 211 includes at least one of a metal and a metal oxide. Similarly, the barrier portion 212 includes at least one metal layer, and the material of the barrier portion 212 includes a metal. Exemplarily, the metal may be silver, copper, titanium, aluminum, molybdenum, etc. The metal oxide may be tin oxide, zinc oxide, cadmium oxide, indium oxide, indium tin oxide, zinc indium oxide, zinc gallium oxide, zinc aluminum oxide, titanium tantalum oxide, etc. Preferably, the material of the conductive portion 211 includes aluminum, and the material of the barrier portion 212 includes titanium.

[0089] The protective layer 300 is disposed on the side of the barrier portion 212 facing away from the substrate 100. It will be appreciated that the barrier portion 212 includes a first surface 212a proximal to the protective layer 300 and another surface 212b distal to the protective layer 300. The protective layer 300 is disposed on the first surface 212a of the protective layer 300, meaning that the protective layer 300 can be pressed against the side of the barrier portion 212 facing away from the substrate 100. The orthographic projection of the protective layer 300 on the substrate 100 lies within the orthographic projection of the barrier portion 212 on the substrate 100. The protective layer 300 protects the barrier portion 212 to prevent the edges of the barrier portion 212 from warping.

[0090] In an optional embodiment, the material of the protective layer 300 includes a metal oxide. Exemplarily, the metal oxide includes indium tin oxide, indium zinc oxide, or indium tin zinc oxide. The material of the protective layer 300 can include any one of indium tin oxide, indium zinc oxide, or indium tin zinc oxide, or any combination thereof.

[0091] The display panel 10 provided in this embodiment includes a substrate 100, an isolation layer 200, and a protective layer 300. The isolation layer 200 is disposed on one side of the substrate 100 and includes an isolation structure 210 and a plurality of isolation openings 220 enclosed by the isolation structure 210. The isolation structure 210 includes a conductive portion 211 and a blocking portion 212 stacked sequentially in a direction away from the substrate 100, with the orthographic projection of the conductive portion 211 on the substrate 100 located within the orthographic projection of the blocking portion 212 on the substrate 100. The protective layer 300 is disposed on the side of the blocking portion 212 facing away from the substrate 100, with the orthographic projection of the protective layer 300 on the substrate 100 located within the orthographic projection of the blocking portion 212 on the substrate 100. In this way, the protective layer 300 protects the blocking portion 212, reduces the "impact" of the blocking portion 212 caused by subsequent process steps, and prevents deformation of the blocking portion 212, thereby improving the problem of pixel failure caused by deformation of the blocking portion 212 and enhancing the display quality of the display panel 10.

[0092] In one embodiment, see Figure 1 , the orthographic projection of the protection layer 300 on the substrate 100 covers the orthographic projection of the conductive portion 211 on the substrate 100 .

[0093] It is understood that the orthographic projection of the conductive portion 211 on the substrate 100 may overlap with the orthographic projection of the protective layer 300 on the substrate 100; the orthographic projection of the conductive portion 211 on the substrate 100 may also be within the orthographic projection of the protective layer 300 on the substrate 100. In other words, in adjacent isolation openings 220, along the arrangement direction of the adjacent isolation openings 220, the area of ​​the orthographic projection of the conductive portion 211 on the substrate 100 may be less than or equal to the area of ​​the orthographic projection of the protective layer 300 on the substrate 100.

[0094] In this embodiment, the relationship between the orthographic projection of the protective layer 300 on the substrate 100 and the orthographic projection of the conductive portion 211 on the substrate 100 can be such that the orthographic projection of the protective layer 300 on the substrate 100 coincides with the orthographic projection of the conductive portion 211 on the substrate 100, or such that the orthographic projection of the conductive portion 211 on the substrate 100 is within the orthographic projection of the protective layer 300 on the substrate 100, as long as deformation of the blocking portion 212 is avoided. This can be set by the operator according to the actual production environment and production requirements, thereby improving the practicality of the display panel 10.

[0095] In one embodiment, see Figure 1 The blocking portion 212 includes a first surface 212 a close to the protective layer 300 and another surface 212 b away from the protective layer 300 . The orthographic projection of the first surface 212 a on the substrate 100 covers the orthographic projection of the protective layer 300 on the substrate 100 .

[0096] It is understood that the orthographic projection of the protective layer 300 on the substrate 100 may overlap with the orthographic projection of the first surface 212a of the blocking portion 212 on the substrate 100; the orthographic projection of the protective layer 300 on the substrate 100 may also be within the orthographic projection of the first surface 212a of the blocking portion 212 on the substrate 100. In other words, along the arrangement direction of adjacent isolation openings 220, the area of ​​the orthographic projection of the protective layer 300 on the substrate 100 may be less than or equal to the area of ​​the orthographic projection of the first surface 212a of the blocking portion 212 on the substrate 100. The orthographic projection of the protective layer 300 on the substrate 100 is within the orthographic projection of the other surface 212b of the blocking portion 212 on the substrate 100.

[0097] In one embodiment, see Figure 1 The conductive portion 211 includes a second surface 211a close to the protective layer 300 and a third surface 211b away from the protective layer 300. The orthographic projection of the protective layer 300 on the substrate 100 covers the orthographic projection of the second surface 211a on the substrate 100, and the orthographic projection of the protective layer 300 on the substrate 100 covers the orthographic projection of the third surface 211b on the substrate 100.

[0098] It is understood that the orthographic projection of the second surface 211a of the conductive portion 211 on the substrate 100 may overlap with the orthographic projection of the protective layer 300 on the substrate 100, and the orthographic projection of the second surface 211a of the conductive portion 211 on the substrate 100 may also be within the orthographic projection of the protective layer 300 on the substrate 100. The orthographic projection of the third surface 211b of the conductive portion 211 on the substrate 100 may overlap with the orthographic projection of the protective layer 300 on the substrate 100, and the orthographic projection of the third surface 211b of the conductive portion 211 on the substrate 100 may also be within the orthographic projection of the protective layer 300 on the substrate 100. In other words, along the arrangement direction of adjacent isolation openings 220, the area of ​​the orthographic projection of the second surface 211a of the conductive portion 211 on the substrate 100 is less than or equal to the area of ​​the orthographic projection of the protective layer 300 on the substrate 100. Along the arrangement direction of adjacent isolation openings 220 , the orthographic projection area of ​​the third surface 211 b of the conductive portion 211 on the substrate 100 is smaller than or equal to the orthographic projection area of ​​the protection layer 300 on the substrate 100 .

[0099] In one embodiment, see Figure 1In two adjacent isolation openings 220, along the arrangement direction of the adjacent isolation openings 220, the area of ​​the orthographic projection of the second surface 211a on the substrate 100 is less than or equal to the area of ​​the orthographic projection of the protective layer 300 on the substrate 100, and the area of ​​the orthographic projection of the protective layer 300 on the substrate 100 is less than or equal to the area of ​​the orthographic projection of the blocking portion 212 on the substrate 100. Specifically, the area of ​​the orthographic projection of the protective layer 300 on the substrate 100 is less than or equal to the area of ​​the orthographic projection of the first surface 212a of the blocking portion 212 on the substrate 100; and the area of ​​the orthographic projection of the protective layer 300 on the substrate 100 is less than or equal to the area of ​​the orthographic projection of the other surface 212b of the blocking portion 212 on the substrate 100.

[0100] Along the arrangement direction of adjacent isolation openings 220, the area of ​​the orthographic projection of the third surface 211b on the substrate 100 is less than or equal to the area of ​​the orthographic projection of the protective layer 300 on the substrate 100, and the area of ​​the orthographic projection of the protective layer 300 on the substrate 100 is less than or equal to the area of ​​the orthographic projection of the blocking portion 212 on the substrate 100.

[0101] Along the arrangement direction of adjacent isolation openings 220, the area of ​​the orthographic projection of the third surface 211b on the substrate 100 is less than or equal to the area of ​​the orthographic projection of the protective layer 300 on the substrate 100, and the area of ​​the orthographic projection of the protective layer 300 on the substrate 100 is less than or equal to the area of ​​the orthographic projection of the first surface 212a on the substrate 100; the area of ​​the orthographic projection of the protective layer 300 on the substrate 100 is less than or equal to the area of ​​the orthographic projection of the other surface 212b of the blocking portion 212 on the substrate 100.

[0102] In the above embodiment, the protective layer 300 pressed onto the side of the blocking portion 212 facing away from the substrate 100 can reduce the "impact" of subsequent process technology on the blocking portion 212, avoid deformation of the blocking portion 212, thereby improving pixel failure caused by deformation of the blocking portion 212, and further improving the display effect of the display panel 10.

[0103] In one embodiment, see Figure 2 The protection layer 300 is disposed around the isolation openings 220 . In other words, the protection layer 300 is formed around each isolation opening 220 .

[0104] In one embodiment, see Figure 2 The orthographic projection of the protective layer 300 on the substrate 100 is in a network shape.

[0105] In one embodiment, the deformation of the protective layer 300 is smaller than that of the barrier portion 212. That is, after a subsequent manufacturing process generates an "impact," the shape change of the protective layer 300 is smaller than the shape change of the barrier portion 212. Thus, when subsequent manufacturing processes generate an "impact" on the protective layer 300 and the barrier portion 212, the protective layer 300 with a smaller deformation can protect the barrier portion 212, preventing deformation of the barrier portion 212. This can mitigate pixel failure caused by deformation of the barrier portion 212, thereby improving the display quality of the display panel 10.

[0106] In one embodiment, see Figure 1 , along the thickness direction of the substrate 100 , the thickness of the protection layer 300 is smaller than the thickness of the blocking portion 212 .

[0107] In other words, along the thickness direction of the substrate 100, the maximum distance between the side of the protective layer 300 close to the blocking portion 212 and the side of the protective layer 300 away from the blocking portion 212 is smaller than the maximum distance between the side of the blocking portion 212 close to the protective layer 300 and the side of the blocking portion 212 away from the protective layer 300.

[0108] Preferably, the thickness of the protective layer 300 along the thickness direction of the substrate 100, i.e., along the second direction, is greater than or equal to 50 angstroms and less than or equal to 1000 angstroms. The thickness of the protective layer 300 can be any value among 50 angstroms, 100 angstroms, 340 angstroms, 550 angstroms, 750 angstroms, 880 angstroms, and 1000 angstroms.

[0109] In one embodiment, see Figure 3 The isolation structure 210 further includes a support portion 213 disposed on the side of the conductive portion 211 closer to the substrate 100. The orthographic projection of the conductive portion 211 on the substrate 100 is located within the orthographic projection of the support portion 213 on the substrate 100. In other words, the isolation structure 210 includes the support portion 213, the conductive portion 211, and the blocking portion 212, which are stacked in sequence in a direction away from the substrate 100.

[0110] Specifically, the orthographic projection of the supporting portion 213 on the substrate 100 may be located within the orthographic projection of the blocking portion 212 on the substrate 100 , and the orthographic projection of the blocking portion 212 on the substrate 100 may also be located within the orthographic projection of the supporting portion 213 on the substrate 100 .

[0111] The material of the support portion 213 may be any one of metal and metal oxide. Preferably, the material of the support portion 213 includes molybdenum.

[0112] In one embodiment, see Figure 4The display panel 10 further includes a pixel defining layer 400 and a plurality of light-emitting devices 500. The pixel defining layer 400 is disposed on a side of the substrate 100 close to the isolation layer 200, that is, the pixel defining layer 400 is disposed between the substrate 100 and the isolation layer 200. The pixel defining layer 400 includes a plurality of pixel openings 410, each of which is in communication with a corresponding isolation opening 220.

[0113] At least some of the plurality of light-emitting devices 500 are disposed corresponding to the isolation openings 220, and at least a portion of the light-emitting devices 500 is disposed within the corresponding isolation openings 220. The light-emitting devices 500 include a first electrode 510, a light-emitting portion 520, and a second electrode 530, which are sequentially stacked in a direction away from the substrate 100. The plurality of pixel openings 410 correspond one-to-one to the plurality of light-emitting devices 500.

[0114] The light emitting device 500 includes at least one first light emitting device, at least one second light emitting device, and at least one third light emitting device, wherein the first light emitting device, the second light emitting device, and the third light emitting device are configured to emit light of different colors. The first electrode 510 may be an anode, and the second electrode 530 may be a cathode.

[0115] In an alternative embodiment, see Figure 4 The display panel 10 further includes a plurality of encapsulation parts 540 corresponding to the plurality of light emitting devices 500. Each encapsulation part 540 is provided on a side of the corresponding light emitting device 500 away from the substrate 100. Exemplarily, the encapsulation part 540 is an inorganic film layer.

[0116] Optionally, the packaging portion 540 corresponding to at least one light-emitting device 500 covers the side of the second electrode 530 in the light-emitting device 500 that is away from the substrate 100, and the side wall of the isolation structure 210 adjacent to the light-emitting device 500, and extends to a partial area of ​​the side of the protective layer 300 adjacent to the light-emitting device 500 that is away from the substrate 100.

[0117] In an alternative embodiment, see Figure 5 The display panel 10 further includes an encapsulation layer 600 disposed on a side of the encapsulation portion 540 facing away from the substrate 100. The encapsulation layer 600 is made of an inorganic material.

[0118] Optionally, the material of the protection layer 300 may be the same as that of the encapsulation layer 600 .

[0119] In this embodiment, the encapsulation layer 600 is provided to protect the various layers of the encapsulation structure, thereby improving the practicality and service life of the display panel 10 .

[0120] See also Figure 6 One embodiment of the present application provides a method for manufacturing a display panel, and the steps of the manufacturing method may include:

[0121] Step 600 : forming a first electrode material layer on one side of a substrate, and performing a first patterning process on the first electrode material layer to form a first electrode.

[0122] A first electrode material layer is laid on a substrate, a corresponding mask is placed on the first electrode material layer, and a first patterning process is performed on the first electrode material layer based on the mask to form a first electrode in a light emitting device. The first electrode may be an anode.

[0123] Step 610: forming a pixel defining material layer on a side of the substrate close to the first electrode and on a side of the first electrode facing away from the substrate, and forming an isolation material layer and a protective material layer stacked in sequence on a side of the pixel defining material layer facing away from the substrate; the isolation material layer includes a conductive material layer close to the pixel defining material layer and a blocking material layer away from the pixel defining material layer.

[0124] After forming a first electrode on one side of the substrate, a pixel-defining material layer is laid on the side of the substrate closest to the first electrode and on the side of the substrate facing away from the first electrode. A conductive material layer, a barrier material layer, and a protective material layer are then laid sequentially on the side of the laid pixel-defining material layer facing away from the substrate. In other words, the pixel-defining material layer, the conductive material layer, the barrier material layer, and the protective material layer are stacked in sequence along the thickness direction away from the substrate.

[0125] Step 620: Perform a second patterning process on the protective material layer and the isolation material layer to form a protective layer and an isolation structure, wherein the isolation structure encloses a plurality of isolation openings; the isolation structure includes a conductive portion and a blocking portion stacked in sequence in a direction away from the substrate, wherein the orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the blocking portion on the substrate; and the orthographic projection of the protective layer on the substrate is located within the orthographic projection of the blocking portion on the substrate.

[0126] After forming the pixel defining layer, the isolation material layer, and the protective material layer, a corresponding mask is placed on the side of the protective material layer facing away from the substrate, and a second patterning process is performed on the protective material layer, the barrier material layer, and the conductive material layer to form the protective layer and the isolation structure. For a description of the isolation structure and the protective layer, reference can be made to the detailed description of the above embodiment and will not be repeated here.

[0127] Step 630 : performing a third patterning process on the pixel defining material layer to form a pixel defining layer; the pixel defining layer includes a plurality of pixel openings, and each pixel opening is correspondingly connected to the isolation opening.

[0128] After forming the isolation layer, a corresponding mask is placed on the side of the pixel-defining material layer facing away from the substrate. A dry etching process is performed on the pixel-defining material layer to form a pixel-defining layer. The pixel-defining material layer includes a plurality of pixel openings. The description of the pixel openings can be referred to the detailed description of the above embodiment and will not be repeated here.

[0129] In an optional embodiment, after forming the pixel defining layer, the method for preparing a display panel further includes:

[0130] A light emitting portion, a second electrode and an encapsulation portion in the light emitting device are formed at the at least one isolation opening.

[0131] A light-emitting device material layer, namely, a light-emitting material layer, a second electrode material layer, and an encapsulation material layer, is formed at at least one isolation opening. A corresponding mask is placed on the light-emitting device material layer, and the light-emitting device material layer is patterned based on the mask to form a corresponding light-emitting device at the isolation opening. For a description of the light-emitting device, reference can be made to the detailed description of the above embodiment and will not be repeated here.

[0132] In an optional embodiment, the prepared display panel may include at least one first light emitting device, at least one second light emitting device, and at least one third light emitting device. The first light emitting device, the second light emitting device, and the third light emitting device may be prepared in sequence.

[0133] The present invention provides a method for manufacturing a display panel. The method comprises forming a first electrode material layer on one side of a substrate, performing a first patterning process on the first electrode material layer to form a second electrode, forming a pixel-defining material layer on a side of the substrate proximal to the first electrode and on a side of the substrate opposite the first electrode, and forming an isolation material layer and a protective material layer stacked in sequence on a side of the pixel-defining material layer opposite the substrate. The isolation material layer comprises a conductive material layer proximal to the pixel-defining material layer and a barrier material layer distal to the pixel-defining material layer. The protective material layer and the isolation material layer undergo a second patterning process to form a protective layer and an isolation structure, wherein the isolation structure encloses a plurality of isolation openings. The isolation structure comprises a conductive portion and a barrier portion stacked in sequence away from the substrate, wherein the orthographic projection of the conductive portion on the substrate is within the orthographic projection of the barrier portion on the substrate, and the orthographic projection of the protective layer on the substrate is within the orthographic projection of the barrier portion on the substrate. In this way, the protective layer protects the barrier portion, reduces the "impact" of subsequent manufacturing processes on the barrier portion, and prevents deformation of the barrier portion, thereby improving pixel failure caused by barrier portion deformation and thereby enhancing the display quality of the fabricated display panel.

[0134] In one embodiment, see Figure 7, involving performing a second patterning process on the protective material layer and the isolation material layer to form a protective layer and an isolation structure, the steps of the implementation method comprising:

[0135] Step 700 : forming a first photoresist layer on a side of the protective material layer facing away from the substrate, and performing a first sub-patterning process on the protective material layer based on the first photoresist layer to form a protective layer.

[0136] A photoresist is applied to the side of the protective material layer facing away from the substrate and patterned using a corresponding mask to form a first photoresist layer on the side of the protective material layer facing away from the substrate. The first photoresist layer serves as a mask and a wet etching process is performed on the protective material layer to form the protective layer.

[0137] Step 710 : Perform a second sub-patterning process on the barrier material layer and the conductive material layer to form a barrier portion and a conductive portion.

[0138] After forming the protection layer, the barrier material layer and the conductive material layer are subjected to sub-patterning processing to form a barrier portion and a conductive portion.

[0139] In this embodiment, a first photoresist layer is formed on the side of the protective material layer facing away from the substrate through a photolithography process. A first sub-patterning process is then performed on the protective material layer based on the formed first photoresist layer to form a protective layer. A second sub-patterning process is then performed on the barrier material layer and the conductive material layer to form conductive portions and barrier portions. Thus, by forming the first photoresist on the side of the protective material layer facing away from the substrate, not only is a protective layer formed based on the first photoresist, but the first photoresist also protects the various film layers covered by the first photoresist, thereby improving the display quality of the resulting display panel.

[0140] In one embodiment, the isolation material layer further includes a support material layer disposed on the side of the pixel defining material layer facing away from the substrate. That is, after the pixel defining material layer is formed on one side of the substrate, a support material layer, a conductive material layer, a barrier material layer, and a protective material layer are sequentially formed on the side of the pixel defining material layer facing away from the substrate. The isolation structure further includes a support portion disposed on the side of the conductive portion close to the substrate. In this case, a second sub-patterning process is performed on the conductive material layer and the barrier material layer to form a conductive portion and a barrier portion, and the implementation method includes:

[0141] A second sub-patterning process is performed on the blocking material layer, the conductive material layer and the supporting material layer based on the first photoresist layer to form a supporting portion, a conductive portion and a blocking portion.

[0142] The first photoresist layer is used as a mask to form the support portion, conductive portion and barrier portion of the isolation structure by dry etching or wet etching process on the barrier material layer, conductive material layer and support material layer. The support portion can be described with reference to the specific description of the above embodiment and will not be repeated here.

[0143] In one embodiment, see Figure 8 , involving performing a second sub-patterning process on a blocking material layer, a conductive material layer, and a supporting material layer based on a first photoresist layer to form a supporting portion, a conductive portion, and a blocking portion, the steps of the implementation method comprising:

[0144] Step 800 : performing a second sub-patterning process on the blocking material layer and the conductive material layer based on the first photoresist layer to form a blocking portion and an initial conductive portion.

[0145] The first photoresist layer and the formed protection layer are used as masks to form a blocking portion and an initial conductive portion by adopting a dry etching process on the blocking material layer and the conductive material layer.

[0146] Optionally, the orthographic projection of the blocking portion on the substrate is located within the orthographic projection of the initial conductive portion on the substrate; and along the thickness direction of the substrate, the initial conductive portion has a trapezoidal structure.

[0147] Optionally, the initial conductive portion includes a first conductive portion on a side of the barrier portion close to the substrate, and a second conductive portion located between adjacent barrier portions, the second conductive portion being connected to the first conductive portion. Along the thickness direction of the substrate, the second conductive portion is thinner than the first conductive portion.

[0148] Step 810: stripping the first photoresist layer and performing crystallization on the protective layer.

[0149] The first photoresist on the side of the protective layer facing away from the substrate is stripped to expose the protective layer, and the exposed protective layer is crystallized to form a crystallized protective layer.

[0150] Step 820 : Perform a second sub-patterning process on the initial conductive portion and the support material layer to form a conductive portion and a support portion.

[0151] After the protective layer is crystallized, a corresponding mask is set to perform a wet etching process on the initial conductive portion and the support material layer to form the conductive portion and the support portion.

[0152] In this embodiment, the protective layer is crystallized during the process of forming the blocking portion, the conductive portion, and the supporting portion of the isolation structure. In addition, during the formation process, photoresist only needs to be applied once, which can improve the practicality of the method for manufacturing the display panel.

[0153] In one embodiment, see Figure 9, involving performing a first sub-patterning process on a protective material layer based on a first photoresist layer to form a protective layer, the steps of the implementation method comprising:

[0154] Step 900 : performing a first sub-patterning process on the protective material layer based on the first photoresist layer to form an initial protective layer.

[0155] After performing a first sub-patterning process on the protective material layer using the first photoresist layer as a mask, an initial protective layer is formed. The initial protective layer is a portion of the protective material layer covered by the first photoresist layer.

[0156] Step 910: stripping the first photoresist layer and performing crystallization processing on the initial protective layer to form a protective layer.

[0157] After the initial protection layer is formed, the first photoresist layer is stripped to expose the initial protection layer, and the exposed initial protection layer is crystallized to form a protection layer.

[0158] In this embodiment, after the initial protective layer is formed based on the first photoresist, the first photoresist layer is stripped and the initial protective layer is directly crystallized to form a crystallized protective layer, which can improve the practicality of the method for manufacturing the display panel.

[0159] In one embodiment, see Figure 10 , involving performing a second sub-patterning process on the barrier material layer and the conductive material layer to form a barrier portion and a conductive portion, the steps of the implementation method comprising:

[0160] Step 1001: forming a second photoresist layer on a side of the protection layer facing away from the substrate.

[0161] After stripping the first photoresist layer and crystallizing the initial protective layer to form a protective layer, a second photoresist is applied to the side of the protective layer facing away from the substrate. The second photoresist is patterned using a corresponding mask to form a second photoresist layer on the side of the protective layer facing away from the substrate. The orthographic projection of the second photoresist layer on the substrate overlaps the orthographic projection of the protective layer on the substrate. It is understood that the orthographic projection of the second photoresist layer on the substrate can overlap with the orthographic projection of the protective layer on the substrate, and the orthographic projection of the protective layer on the substrate can be located within the orthographic projection of the second photoresist layer on the substrate.

[0162] Step 1002 : performing a second sub-patterning process on the blocking material layer and the conductive material layer based on the second photoresist layer to form a blocking portion and a conductive portion.

[0163] After forming a second photoresist layer on the side of the protective layer facing away from the substrate, the second photoresist layer is used as a mask to perform dry and wet etching on the barrier material layer and the conductive material layer to form the barrier portion and the conductive portion. The description of performing the second sub-patterning process on the barrier material layer and the conductive material layer based on the second photoresist layer to form the barrier portion and the conductive portion can refer to the detailed description of performing the second sub-patterning process on the barrier material layer and the conductive material layer based on the first photoresist layer to form the barrier portion and the conductive portion in the above embodiment, and will not be repeated here.

[0164] In this embodiment, the first photoresist layer is stripped off during the process of forming the crystallized protective layer, and the second photoresist layer is re-formed on the side of the protective layer away from the substrate when forming the blocking portion and the conductive portion in the isolation structure. In this way, the protective layer can be formed, and can also be used as a mask to perform a second sub-patterning process on the blocking material layer and the conductive material layer. This can improve the practicality and reliability of the display panel preparation method, thereby improving the display effect of the prepared display panel.

[0165] In one embodiment, the isolation material layer further includes a support material layer disposed on a side of the pixel-defining material layer facing away from the substrate, and the isolation structure further includes a support portion disposed on a side of the conductive portion closer to the substrate. For a description of the support material layer and the support portion, reference can be made to the detailed description of the above embodiment and will not be repeated here.

[0166] In this case, a second sub-patterning process is performed on the blocking material layer and the conductive material layer based on the second photoresist layer to form a blocking portion and a conductive portion. The implementation method includes:

[0167] A second sub-patterning process is performed on the blocking material layer, the conductive material layer and the supporting material layer based on the second photoresist layer to form a blocking portion, a conductive portion and a supporting portion.

[0168] The second photoresist layer is used as a mask to perform dry etching and wet etching on the blocking material layer, the conductive material layer and the supporting material layer, thereby forming the supporting portion, the conductive portion and the blocking portion in the isolation structure.

[0169] In one embodiment, a second sub-patterning process is performed on the barrier material layer and the conductive material layer to form a barrier portion and a conductive portion, and the implementation method includes:

[0170] A second sub-patterning process is performed on the barrier material layer and the conductive material layer based on the protective layer to form a barrier portion and a conductive portion.

[0171] After stripping the first photoresist layer and performing an etching process on the initial protective layer to form a protective layer, the protective layer can be used as a mask to perform dry and wet etching processes on the barrier material layer and the conductive material layer to form the barrier portion and the conductive portion. The description of performing a second sub-patterning process on the barrier material layer and the conductive material layer based on the protective layer to form the barrier portion and the conductive portion can refer to the detailed description of performing a second sub-patterning process on the barrier material layer and the conductive material layer based on the second photoresist layer to form the barrier portion and the conductive portion in the above embodiment, and will not be repeated here.

[0172] In this embodiment, the crystallized protective layer is directly used as a mask to pattern the blocking material layer and the conductive material layer. This can reduce the use of mask templates, thereby improving the production efficiency of the display panel production method, reducing the production cost of the display panel, and thus improving the practicality of the display panel production method.

[0173] In one embodiment, the isolation material layer further includes a support material layer disposed on a side of the pixel-defining material layer facing away from the substrate, and the isolation structure further includes a support portion disposed on a side of the conductive portion closer to the substrate. For a description of the support material layer and the support portion, reference can be made to the detailed description of the above embodiment and will not be repeated here.

[0174] In this case, see Figure 11 , involving performing a second sub-patterning process on the barrier material layer and the conductive material layer based on the protective layer to form a barrier portion and a conductive portion, the steps of the implementation method comprising:

[0175] Step 1101: Perform a second sub-patterning process on the barrier material layer and the conductive material layer based on the protective layer to form a barrier portion and an initial conductive portion.

[0176] The barrier portion and the initial conductive portion can be formed by using the protective layer as a mask and performing a dry etching process on the barrier material layer and the conductive material layer.

[0177] Optionally, the orthographic projection of the blocking portion on the substrate is located within the orthographic projection of the initial conductive portion on the substrate; and along the thickness direction of the substrate, the initial conductive portion has a trapezoidal structure.

[0178] Optionally, the initial conductive portion includes a first conductive portion on a side of the barrier portion close to the substrate, and a second conductive portion located between adjacent barrier portions, the second conductive portion being connected to the first conductive portion. Along the thickness direction of the substrate, the second conductive portion is thinner than the first conductive portion.

[0179] Step 1102 : performing a second sub-patterning process on the initial conductive portion and the support material layer to form a conductive portion and a support portion.

[0180] The conductive portion and the supporting portion can be formed by setting a corresponding mask plate and performing a wet etching process on the initial conductive portion and the supporting material layer.

[0181] In this embodiment, the formed protective layer is directly used as a mask to pattern the blocking material layer, the conductive material layer and the supporting material layer, which can improve the preparation efficiency of the display panel preparation method, reduce the preparation cost of the display panel, and thus improve the practicality of the display panel preparation method.

[0182] In one embodiment, see Figure 12 Flowchart, combined with Figure 13 , an embodiment of the present application provides a method for manufacturing a display panel, the steps of the manufacturing method comprising:

[0183] Step 1201 : forming a first electrode material layer on one side of the substrate 100 , and patterning the first electrode material layer to form a first electrode 510 .

[0184] Step 1202: forming a pixel defining material layer 1 on a side of the substrate 100 close to the first electrode 510 and on a side of the first electrode 510 facing away from the substrate 100, and sequentially forming a supporting material layer 2, a conductive material layer 3, a barrier material layer 4 and a protective material layer 5 on a side of the pixel defining material layer 1 facing away from the substrate.

[0185] Step 1203 : forming a first photoresist layer 6 on the side of the protective material layer 5 facing away from the substrate 100 .

[0186] Step 1204 : Patterning the protective material layer 5 based on the first photoresist layer 6 to form a protective layer 300 .

[0187] Step 1205: Pattern the blocking material layer 4 and the conductive material layer 3 based on the first photoresist layer 6 to form a blocking portion 212 and an initial conductive portion 211c; the initial conductive portion 211c includes a first conductive portion 211c-1 on the side of the blocking portion 212 close to the substrate 100, and a second conductive portion 211c-2 located between adjacent blocking portions 212, and the second conductive portion 211c-2 is connected to the first conductive portion 211c-1; along the thickness direction of the substrate 100, the thickness of the second conductive portion 211c-2 is less than the thickness of the first conductive portion 211c-1.

[0188] Step 1206, patterning the initial conductive portion 211c and the supporting material layer 2 to form a conductive portion 211 and a supporting portion 213; in this way, an isolation layer 200 is formed, the isolation layer 200 includes an isolation structure 210, and a plurality of isolation openings 220 formed by the isolation structure 210, the isolation structure 210 includes a supporting portion 213, a conductive portion 211 and a blocking portion 212 stacked in sequence in a direction away from the substrate 100.

[0189] Step 1207 , stripping the first photoresist layer 6 and patterning the pixel defining material layer 1 to form a pixel defining layer 400 ; the pixel defining layer 400 includes a plurality of pixel openings 410 , each pixel opening 410 correspondingly communicating with each isolation opening 220 .

[0190] Step 1208 : forming a light-emitting portion 520 , a second electrode 530 and an encapsulation portion 540 in the light-emitting device 500 at at least one isolation opening 220 , and forming an encapsulation layer 600 on a side of the light-emitting device 500 facing away from the substrate 100 .

[0191] In an optional embodiment, the protective layer 300 is crystallized in a subsequent preparation process.

[0192] In one embodiment, see Figure 14 Flowchart, combined with Figure 15 , an embodiment of the present application provides a method for manufacturing a display panel, the steps of the manufacturing method comprising:

[0193] Step 1401 : forming a first electrode material layer on one side of the substrate 100 , and patterning the first electrode material layer to form a first electrode 510 .

[0194] Step 1402: forming a pixel defining material layer 1 on a side of the substrate 100 close to the first electrode 510 and on a side of the first electrode 510 facing away from the substrate 100, and sequentially forming a supporting material layer 2, a conductive material layer 3, a barrier material layer 4 and a protective material layer 5 on a side of the pixel defining material layer 1 facing away from the substrate.

[0195] Step 1403 : forming a first photoresist layer 6 on the side of the protective material layer 5 facing away from the substrate 100 .

[0196] Step 1404 : Patterning the protective material layer 5 based on the first photoresist layer 6 to form a protective layer 300 .

[0197] Step 1405 , stripping the first photoresist layer 6 and performing crystallization treatment on the protective layer 300 .

[0198] Step 1406 : forming a second photoresist layer 7 on the side of the crystallized protection layer 300 facing away from the substrate 100 .

[0199] Step 1407: Pattern the blocking material layer 4 and the conductive material layer 3 based on the second photoresist layer 7 to form a blocking portion 212 and an initial conductive portion 211c; the initial conductive portion 211c includes a first conductive portion 211c-1 on the side of the blocking portion 212 close to the substrate 100, and a second conductive portion 211c-2 located between adjacent blocking portions 212, and the second conductive portion 211c-2 is connected to the first conductive portion 211c-1; along the thickness direction of the substrate 100, the thickness of the second conductive portion 211c-2 is less than the thickness of the first conductive portion 211c-1.

[0200] Step 1408, pattern the initial conductive portion 211c and the supporting material layer 2 to form a conductive portion 211 and a supporting portion 213; in this way, an isolation layer 200 is formed, the isolation layer 200 includes an isolation structure 210, and a plurality of isolation openings 220 formed by the isolation structure 210, the isolation structure 210 includes a supporting portion 213, a conductive portion 211 and a blocking portion 212 stacked in sequence in a direction away from the substrate 100.

[0201] Step 1409 , stripping the second photoresist layer 7 and patterning the pixel defining material layer 1 to form a pixel defining layer 400 ; the pixel defining layer 400 includes a plurality of pixel openings 410 , each pixel opening 410 correspondingly communicating with each isolation opening 220 .

[0202] Step 1410 , forming a light emitting portion 520 , a second electrode 530 and an encapsulation portion 540 in the light emitting device 500 at at least one isolation opening 220 , and forming an encapsulation layer 600 on a side of the light emitting device 500 facing away from the substrate 100 .

[0203] In one embodiment, see Figure 16 Flowchart, combined with Figure 17 , an embodiment of the present application provides a method for manufacturing a display panel, the steps of the manufacturing method comprising:

[0204] Step 1601 : forming a first electrode material layer on one side of the substrate 100 , and patterning the first electrode material layer to form a first electrode 510 .

[0205] Step 1602: forming a pixel defining material layer 1 on a side of the substrate 100 close to the first electrode 510 and on a side of the first electrode 510 facing away from the substrate 100, and sequentially forming a supporting material layer 2, a conductive material layer 3, a barrier material layer 4 and a protective material layer 5 on a side of the pixel defining material layer 1 facing away from the substrate.

[0206] Step 1603 : forming a first photoresist layer 6 on the side of the protective material layer 5 facing away from the substrate 100 .

[0207] Step 1604 : Patterning the protective material layer 5 based on the first photoresist layer 6 to form a protective layer 300 .

[0208] Step 1605: Pattern the blocking material layer 4 and the conductive material layer 3 based on the first photoresist layer 6 to form a blocking portion 212 and an initial conductive portion 211c; the initial conductive portion 211c includes a first conductive portion 211c-1 on the side of the blocking portion 212 close to the substrate 100, and a second conductive portion 211c-2 located between adjacent blocking portions 212, and the second conductive portion 211c-2 is connected to the first conductive portion 211c-1; along the thickness direction of the substrate 100, the thickness of the second conductive portion 211c-2 is less than the thickness of the first conductive portion 211c-1.

[0209] Step 1606 , stripping the first photoresist layer 6 and performing crystallization treatment on the protective layer 300 .

[0210] Step 1607 , patterning the initial conductive portion 211 c and the support material layer 2 to form a conductive portion 211 and a support portion 213 ; thus, forming an isolation layer 200 , which includes an isolation structure 210 and a plurality of isolation openings 220 enclosed by the isolation structure 210 .

[0211] Step 1608 : patterning the pixel defining material layer 1 to form a pixel defining layer 400 ; the pixel defining layer 400 includes a plurality of pixel openings 410 , each pixel opening 410 correspondingly communicating with each isolation opening 220 .

[0212] Step 1609 : forming a light emitting portion 520 , a second electrode 530 and an encapsulation portion 540 in the light emitting device 500 at at least one isolation opening 220 , and forming an encapsulation layer 600 on a side of the light emitting device 500 facing away from the substrate 100 .

[0213] In one embodiment, see Figure 18 Flowchart, combined with Figure 19 , an embodiment of the present application provides a method for manufacturing a display panel, the steps of the manufacturing method comprising:

[0214] Step 1801 : forming a first electrode material layer on one side of the substrate 100 , and patterning the first electrode material layer to form a first electrode 510 .

[0215] Step 1802: Form a pixel defining material layer 1 on the side of the substrate 100 close to the first electrode 510 and on the side of the first electrode 510 away from the substrate 100, and sequentially form a supporting material layer 2, a conductive material layer 3, a blocking material layer 4 and a protective material layer 5 on the side of the pixel defining material layer 1 away from the substrate.

[0216] Step 1803 : forming a first photoresist layer 6 on the side of the protective material layer 5 facing away from the substrate 100 .

[0217] Step 1804 : Patterning the protective material layer 5 based on the first photoresist layer 6 to form a protective layer 300 .

[0218] Step 1805 , stripping the first photoresist layer 6 and performing crystallization treatment on the protective layer 300 .

[0219] Step 1806: Pattern the blocking material layer 4 and the conductive material layer 3 based on the crystallized protective layer 300 to form a blocking portion 212 and an initial conductive portion 211c; the initial conductive portion 211c includes a first conductive portion 211c-1 on the side of the blocking portion 212 close to the substrate 100, and a second conductive portion 211c-2 located between adjacent blocking portions 212, and the second conductive portion 211c-2 is connected to the first conductive portion 211c-1; along the thickness direction of the substrate 100, the thickness of the second conductive portion 211c-2 is less than the thickness of the first conductive portion 211c-1.

[0220] Step 1807, pattern the initial conductive portion 211c and the supporting material layer 2 to form a conductive portion 211 and a supporting portion 213; in this way, an isolation layer 200 is formed, and the isolation layer 200 includes an isolation structure 210, and a plurality of isolation openings 220 formed by the isolation structure 210; the isolation structure 210 includes a supporting portion 213, a conductive portion 211 and a blocking portion 212 that are layered away from the substrate 100.

[0221] Step 1808 : patterning the pixel defining material layer 1 to form a pixel defining layer 400 ; the pixel defining layer 400 includes a plurality of pixel openings 410 , each pixel opening 410 correspondingly communicating with each isolation opening 220 .

[0222] Step 1809 : forming a light emitting portion 520 , a second electrode 530 and an encapsulation portion 540 in the light emitting device 500 at at least one isolation opening 220 , and forming an encapsulation layer 600 on a side of the light emitting device 500 facing away from the substrate 100 .

[0223] An embodiment of the present application provides a display device, including the display panel 10 provided in the above embodiment; or a display panel prepared by the method for preparing a display panel provided in the above embodiment.

[0224] The display device can be a laptop computer, a mobile phone, a wireless device, a personal digital assistant (PDA), a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a camcorder, a game console, a watch, a clock, a calculator, a television monitor, a flat-panel display, a computer monitor, a car display (e.g., an odometer display, etc.), a navigator, a cockpit controller and / or display, a display of a camera view (e.g., a display of a rearview camera in a vehicle), an electronic photo, an electronic billboard or sign, a projector, etc.

[0225] It should be understood that, although the various steps in the flowchart in the figure are shown in sequence as indicated by the arrows, these steps are not necessarily performed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be performed in other orders. Moreover, at least a portion of the steps in the figure may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily performed at the same time, but can be performed at different times, and the execution order of these sub-steps or stages is not necessarily performed in sequence, but can be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0226] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0227] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: include: substrate; an isolation structure disposed on one side of the substrate, the isolation structure enclosing a plurality of isolation openings, the isolation structure comprising a conductive portion and a blocking portion stacked in sequence in a direction away from the substrate, the orthographic projection of the conductive portion on the substrate being within the orthographic projection of the blocking portion on the substrate; The protective layer is provided on a side of the blocking portion facing away from the substrate, and the orthographic projection of the protective layer on the substrate is located within the orthographic projection of the blocking portion on the substrate.

2. The display panel according to claim 1, wherein: The orthographic projection of the protective layer on the substrate covers the orthographic projection of the conductive portion on the substrate; Optionally, the blocking portion includes a first surface close to the protective layer, and an orthographic projection of the first surface on the substrate covers an orthographic projection of the protective layer on the substrate; Optionally, the conductive portion includes a second surface close to the protective layer and a third surface away from the protective layer, the orthographic projection of the protective layer on the substrate covers the orthographic projection of the second surface on the substrate, and the orthographic projection of the protective layer on the substrate covers the orthographic projection of the third surface on the substrate; Optionally, along the arrangement direction of adjacent isolation openings, an area of ​​an orthographic projection of the second surface on the substrate is smaller than or equal to an area of ​​an orthographic projection of the protective layer on the substrate, and an area of ​​an orthographic projection of the protective layer on the substrate is smaller than or equal to an area of ​​an orthographic projection of the blocking portion on the substrate; Optionally, along the arrangement direction of adjacent isolation openings, the area of ​​the orthographic projection of the third surface on the substrate is less than or equal to the area of ​​the orthographic projection of the protective layer on the substrate, and the area of ​​the orthographic projection of the protective layer on the substrate is less than or equal to the area of ​​the orthographic projection of the first surface on the substrate.

3. The display panel according to claim 1, wherein: The protective layer is arranged around the isolation opening; Optionally, the orthographic projection of the protective layer on the substrate is in a grid shape; Optionally, the deformation amount of the protective layer is smaller than the deformation amount of the blocking portion; Optionally, the material of the protective layer includes metal oxide; Optionally, the material of the protective layer includes at least one of indium tin oxide, indium zinc oxide, and indium tin zinc oxide.

4. The display panel according to claim 1, wherein: Along the thickness direction of the substrate, the thickness of the protective layer is smaller than the thickness of the blocking portion; Optionally, along the thickness direction of the substrate, the thickness of the protective layer is greater than or equal to 50 angstroms and less than or equal to 1000 angstroms.

5. The display panel according to claim 1, wherein: The isolation structure further includes a support portion provided on a side of the conductive portion close to the substrate, wherein the orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the support portion on the substrate; Optionally, the material of the supporting portion includes molybdenum, the material of the conductive portion includes aluminum, and the material of the blocking portion includes titanium.

6. The display panel according to claim 1, wherein: The display panel further includes: a pixel defining layer, disposed on a side of the substrate close to the isolation structure, the pixel defining layer comprising a plurality of pixel openings, each of the pixel openings correspondingly communicating with each of the isolation openings; A plurality of light-emitting devices, at least some of which are arranged corresponding to the isolation openings, and at least some of which are arranged in the corresponding isolation openings; the light-emitting devices include a first electrode, a light-emitting portion, and a second electrode which are stacked in sequence along a thickness direction away from the substrate.

7. A method for preparing a display panel, characterized in that: The preparation method comprises: forming a first electrode material layer on one side of the substrate, and performing a first patterning process on the first electrode material layer to form a first electrode; forming a pixel-defining material layer on a side of the substrate close to the first electrode and on a side of the first electrode away from the substrate, and forming an isolation material layer and a protective material layer stacked in sequence on a side of the pixel-defining material layer away from the substrate; the isolation material layer includes a conductive material layer close to the pixel-defining material layer and a blocking material layer away from the pixel-defining material layer; Performing a second patterning process on the protective material layer and the isolation material layer to form a protective layer and an isolation structure, wherein the isolation structure encloses a plurality of isolation openings; the isolation structure includes a conductive portion and a blocking portion stacked in sequence in a direction away from the substrate, wherein the orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the blocking portion on the substrate; and the orthographic projection of the protective layer on the substrate is located within the orthographic projection of the blocking portion on the substrate; The pixel defining material layer is subjected to a third patterning process to form a pixel defining layer; the pixel defining layer includes a plurality of pixel openings, and each of the pixel openings is correspondingly connected to each of the isolation openings.

8. The preparation method according to claim 7, characterized in that The performing a second patterning process on the protective material layer and the isolation material layer to form a protective layer and an isolation structure includes: forming a first photoresist layer on a side of the protective material layer facing away from the substrate, and performing a first sub-patterning process on the protective material layer based on the first photoresist layer to form the protective layer; A second sub-patterning process is performed on the barrier material layer and the conductive material layer to form the barrier portion and the conductive portion.

9. The preparation method according to claim 8, characterized in that The isolation material layer further includes a support material layer provided on a side of the pixel defining material layer facing away from the substrate, the isolation structure further includes a support portion provided on a side of the conductive portion close to the substrate, and the second sub-patterning process is performed on the barrier material layer and the conductive material layer to form the conductive portion and the barrier portion, comprising: performing the second sub-patterning process on the blocking material layer, the conductive material layer, and the supporting material layer based on the first photoresist layer to form the supporting portion, the conductive portion, and the blocking portion; Optionally, performing the second sub-patterning process on the blocking material layer, the conductive material layer, and the supporting material layer based on the first photoresist layer to form the supporting portion, the conductive portion, and the blocking portion includes: performing the second sub-patterning process on the blocking material layer and the conductive material layer based on the first photoresist layer to form a blocking portion and an initial conductive portion; stripping the first photoresist layer and performing a crystallization process on the protective layer; The second sub-patterning process is performed on the initial conductive portion and the support material layer to form the conductive portion and the support portion.

10. The preparation method according to claim 8, characterized in that The step of performing a first sub-patterning process on the protective material layer based on the first photoresist layer to form the protective layer includes: performing the first sub-patterning process on the protective material layer based on the first photoresist layer to form an initial protective layer; The first photoresist layer is stripped off, and the initial protective layer is crystallized to form the protective layer.

11. The preparation method according to claim 10, characterized in that: The performing a second sub-patterning process on the barrier material layer and the conductive material layer to form the barrier portion and the conductive portion includes: forming a second photoresist layer on a side of the protective layer facing away from the substrate; The second sub-patterning process is performed on the blocking material layer and the conductive material layer based on the second photoresist layer to form the blocking portion and the conductive portion.

12. The preparation method according to claim 11, characterized in that The isolation material layer further includes a support material layer provided on a side of the pixel defining material layer facing away from the substrate, the isolation structure further includes a support portion provided on a side of the conductive portion close to the substrate, and the second sub-patterning process is performed on the barrier material layer and the conductive material layer based on the second photoresist layer to form the barrier portion and the conductive portion, comprising: The second sub-patterning process is performed on the blocking material layer, the conductive material layer, and the supporting material layer based on the second photoresist layer to form the blocking portion, the conductive portion, and the supporting portion.

13. The preparation method according to claim 10, characterized in that The performing a second sub-patterning process on the barrier material layer and the conductive material layer to form the barrier portion and the conductive portion includes: The second sub-patterning process is performed on the barrier material layer and the conductive material layer based on the protection layer to form the barrier portion and the conductive portion.

14. The preparation method according to claim 13, characterized in that The isolation material layer further includes a support material layer provided on a side of the pixel defining material layer facing away from the substrate, the isolation structure further includes a support portion provided on a side of the conductive portion close to the substrate, and the second sub-patterning process is performed on the barrier material layer and the conductive material layer based on the protective layer to form the barrier portion and the conductive portion, comprising: performing the second sub-patterning process on the barrier material layer and the conductive material layer based on the protective layer to form the barrier portion and the initial conductive portion; The second sub-patterning process is performed on the initial conductive portion and the support material layer to form the conductive portion and the support portion.

15. A display device, characterized in that: A display panel comprising any one of claims 1-6, or a display panel prepared using the preparation method according to any one of claims 7-14.

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