Integration for radio frequency front ends with reduced size and improved performance

Abstract

A radio frequency package for an electronic device with reduced size and improved performance is presented herein. The radio frequency package includes a front end package, a transceiver die, and at least one antenna array providing wireless communication functionality for the radio frequency package. The front-end package includes a radio frequency front-end die and at least one power control die connected to an insulating film substrate via a first connector. Each of the transceiver dies is connected to the at least one antenna array using a second connector.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. patent application No. 18 / 092,683, filed on January 3, 2023, which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to packaging technology, and more particularly to the integration of radio frequency front ends for size reduction and performance improvement. Background Art

[0004] Generally speaking, RF devices may include packages, such as system-level packages. A system-level package combines a substrate, a die, multiple integrated circuits, and / or passive devices into a single package. The system-level package may be made of a semiconductor material, such as silicon. For example, the substrate and the die may include silicon on which the integrated circuit is manufactured. The substrate, the die, and the device may be coupled by bonding to leads of the package or by solder joints (e.g., solder balls or pads). By way of example, the die may be stacked (e.g., in a two and a half dimensional (2.5D) or three dimensional (3D) stacked structure) to combine the die into the same package rather than placing it on a printed circuit board. In some cases, the system-level package may also include multiple packages that are stacked (e.g., using stacked packaging technology) or have a die embedded in a substrate.

[0005] By way of example, an RF device that supports communications over frequencies in the millimeter wave (mmWave) range typically provides support at frequencies at or near 30 GHz. In some cases, an RF device may also support mmWave communications over additional mmWave bands for wider frequency coverage (such as for 30 GHz-300 GHz). Multiple antennas (e.g., antenna arrays) of an RF device may transmit signals that are combined to form beams (e.g., beamformed signals) for communicating over mmWave. In order to achieve consistent coverage (e.g., from a base station associated with mmWave communications), the RF device may include multiple antenna arrays positioned in different parts of the RF device. However, assembling these multiple antenna arrays in a system-in-package of the RF device may take up space and undesirably increase the size of the RF device. Summary of the Invention

[0006] Embodiments of the present disclosure relate to a radio frequency package for an electronic device with reduced size and improved performance. The radio frequency package includes a front-end package, an antenna array, and multiple transceiver dies. The antenna array and the multiple transceiver dies provide wireless communication functionality for the electronic device. The front-end package includes a radio frequency front-end die and a power control die connected to an insulating film substrate via a first connector. Each of the transceiver dies is connected to the antenna array using a second connector.

[0007] Embodiments of the present disclosure further relate to a radio frequency package comprising a front-end package, a plurality of antenna arrays, and a plurality of transceiver dies. The front-end package comprises a radio frequency front-end die and a power control die connected to an insulating film substrate via a first connector. The antenna arrays and the transceiver dies provide wireless communication functionality for the electronic device. Each of the transceiver dies is connected to a corresponding antenna array using a second connector.

[0008] Embodiments of the present disclosure further relate to a radio frequency package comprising an antenna array and a plurality of transceiver dies configured to provide wireless communication functionality to an electronic device in which the radio frequency package is integrated. Each of the transceiver dies is connected to the antenna array using a first connector. The radio frequency package may also include an RF front-end die, at least one power control die, and a mold (e.g., a stepped mold with portions of different heights). The mold may be placed onto the antenna array, and each of the transceiver dies may be integrated into the mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1A is a high-level diagram of an electronic device according to one embodiment.

[0010] Figure 1B Yes Figure 1A A perspective view of a notebook computer as an embodiment of the electronic device.

[0011] Figure 1C is a representation according to one embodiment Figure 1A A front view of a handheld device of another embodiment of an electronic device.

[0012] Figure 1D is a representation according to one embodiment Figure 1A A front view of another handheld device of another embodiment of the electronic device.

[0013] Figure 1E is a representation according to one embodiment Figure 1A Another embodiment of the electronic device is a front view of a desktop computer.

[0014] Figure 1F is a representation according to one embodiment Figure 1A Front and side views of a wearable electronic device of another embodiment of the electronic device.

[0015] Figure 2 According to an embodiment Figure 1A Schematic diagram of a system package of electronic devices.

[0016] Figure 3 is a schematic diagram of a first RF package according to one embodiment.

[0017] Figure 4A is a schematic diagram of a second RF package according to one embodiment.

[0018] Figure 4B is a schematic diagram of a third RF package according to one embodiment.

[0019] Figure 5A is a schematic diagram of a fourth RF package according to one embodiment.

[0020] Figure 5B is a schematic diagram of a fifth RF package according to one embodiment.

[0021] Figure 6 is a schematic diagram of a sixth RF package according to one embodiment.

[0022] The drawings depict, and the detailed description describes, various non-limiting embodiments for purposes of illustration only. DETAILED DESCRIPTION

[0023] Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the various described embodiments. However, the described embodiments may be practiced without these specific details. In other instances, well-known methods, procedures, components, circuits, and networks have not been described in detail so as not to unnecessarily obscure aspects of the embodiments.

[0024] Embodiments of the present disclosure relate to a radio frequency package for an electronic device having a component of a front-end die integrated with one or more antenna arrays to achieve size reduction and improved performance. The radio frequency package may include a front-end package, a multilayer board, a plurality of transceiver dies, and an antenna array module. The front-end package may include a front-end die of reduced size and at least one power management unit die connected to an insulating film substrate (e.g., an Ajinomoto laminate film) via a first array of connectors (e.g., solder ball connectors). The insulating film substrate may be connected to the top side of the multilayer board using a second array of connectors (e.g., solder ball connectors). The transceiver die may be placed on top of the antenna array module and integrated into the antenna substrate (e.g., a mold). The front-end package may include a front-end die of reduced size because the specific functionality of the front-end die is offloaded to the transceiver die directly coupled to the antenna array module. The antenna array module may be coupled to the multilayer board using a via connector. In some embodiments, the antenna array module is divided into a plurality of antenna array submodules, and the antenna substrate is divided into a plurality of antenna substrate portions (e.g., a plurality of mold portions), with space between each two adjacent antenna substrate portions. Each transceiver die may be connected to a respective antenna array submodule using a third array of connectors (eg, solder ball connectors).Each transceiver die may also be integrated into a respective antenna substrate portion (eg, a respective mold).

[0025] Exemplary electronic devices

[0026] Embodiments of electronic devices, user interfaces for such devices, and associated processes for using such devices are described herein. In some embodiments, the device is a portable communication device, such as a mobile phone, that also includes other functionality, such as a personal digital assistant (PDA) and / or music player functionality. Exemplary embodiments of portable multifunction devices include, but are not limited to, the Apple Watch from Apple Inc. (Cupertino, California). Devices, iPod devices, Apple Equipment and device. Other portable electronic devices, such as wearable devices, laptops, or tablet computers, may optionally be used. In some embodiments, the device is not a portable communication device, but rather a desktop computer or other computing device that is not designed for portable use. In some embodiments, the disclosed electronic device may include a touch-sensitive surface (e.g., a touch screen display and / or a touchpad). The example electronic device (e.g., electronic device 100) described below in conjunction with FIG1 may include a touch-sensitive surface for receiving user input. The electronic device may also include one or more other physical user interface devices, such as a physical keyboard, mouse, and / or joystick.

[0027] Figure 1A is a high-level diagram of an electronic device 100 according to one embodiment. The electronic device 100 may include one or more processors 102, memory 104, non-volatile storage 106, a display 108, input structures 112, input / output (I / O) interfaces 114, a network interface 116, a power supply 118, and a transceiver 110, among other components. Figure 1A The various functional blocks shown in the may include hardware elements (including circuits), software elements (including computer code stored on a computer-readable medium), or a combination of both hardware elements and software elements. It should be noted that Figure 1A This is merely one example of a particular implementation and is intended to illustrate the types of components that may be present in electronic device 100 .

[0028] By way of example, the electronic device 100 may represent Figure 1B The notebook computer depicted in Figure 1C The handheld device depicted in Figure 1D The handheld device depicted in Figure 1E The desktop computer depicted in Figure 1F It should be noted that the block diagram of the wearable electronic device or similar device depicted in Figure 1A The processor 102 and other related items in the system may be generally referred to herein as "data processing circuitry". Such data processing circuitry may be embodied in whole or in part as software, hardware, or any combination thereof. Figure 1A The processor 102 and other related items in the electronic device 100 may be a single contained processing module, or may be fully or partially incorporated into any of the other elements within the electronic device 100.

[0029] exist Figure 1AIn the electronic device 100, the processor 102 may be operably coupled to the memory 104 and the non-volatile storage 106 to execute various algorithms. For example, an algorithm for adjusting the input / output power of an antenna may be stored in the memory 104 and / or the non-volatile storage 106. Such algorithms or instructions executed by the processor 102 may be stored in any suitable article of manufacture including one or more tangible computer-readable media. In addition, antenna gain lookup tables for determining total transmit gain and / or total receive gain may be stored in the memory 104 and / or the non-volatile storage 106. Specifically, one or more codebooks may be stored in the memory 104 and / or the non-volatile storage 106. Tangible computer-readable media may include the memory 104 and / or the non-volatile storage 106, individually or collectively, to store algorithms or instructions. The memory 104 and the non-volatile storage 106 may include any suitable article of manufacture for storing data and executable instructions, such as random access memory, read-only memory, rewritable flash memory, a hard drive, and an optical disk. Additionally, programs encoded on such computer program products (eg, an operating system) may also include instructions executable by the processor 102 to enable the electronic device 100 to provide various functions.

[0030] In some embodiments, the display 108 can be a liquid crystal display (LCD) that can facilitate a user viewing images generated on the electronic device 100. In some embodiments, the display 108 can include a touch screen that can facilitate user interaction with a user interface of the electronic device 100. Furthermore, it should be understood that in some embodiments, the display 108 can include one or more light emitting diode (LED) displays, organic light emitting diode (OLED) displays, active matrix organic light emitting diode (AMOLED) displays, or some combination of these and / or other display technologies.

[0031] The input structures 112 of the electronic device 100 may enable a user to interact with the electronic device 100 (e.g., pressing a button to increase or decrease the volume level). As with the network interface 116, the I / O interface 114 may enable the electronic device 100 to interact with various other electronic devices. The network interface 116 may include, for example, one or more interfaces for a personal area network (PAN) such as a Network, Local Area Network (LAN) or Wireless Local Area Network (WLAN) such as 802.11x networks, and / or wide area networks (WANs) such as 3rd generation (3G) cellular networks, Universal Mobile Telecommunications System (UMTS), 4th generation (4G) cellular networks, Long Term Evolution (LTE) cellular network, Long Term Evolution Licensed Assisted Access (LTE-LAA) cellular network, 5th Generation (5G) cellular network, and / or New Radio (NR) cellular network. Specifically, the network interface 116 may include, for example, one or more interfaces for using the Release-15 cellular communication standard of the 5G specification including the millimeter wave (mmWave) frequency range (e.g., 30 GHz-300 GHz). The transceiver 110 of the electronic device 100, including a transmitter and a receiver, may allow communication through the aforementioned networks (e.g., 5G, Wi-Fi, LTE-LAA, etc.).

[0032] The network interface 116 may also include, for example, one or more interfaces for broadband fixed wireless access networks (eg, ), mobile broadband wireless network (mobile ), asynchronous digital subscriber lines (e.g., ADSL, VDSL), terrestrial digital video broadcasting Network and its extension DVB handheld devices Networks, ultra-wideband (UWB) networks, alternating current (AC) power lines, etc.

[0033] In some embodiments, the electronic device 100 uses the transceiver 110 to communicate with the user via the aforementioned wireless network (e.g., move 4G, 5G, etc.) to communicate. The transceiver 110 may include circuitry for both wirelessly receiving a receive signal at a receiver and wirelessly transmitting a transmit signal (e.g., a data signal, a wireless data signal, a wireless carrier signal, a radio frequency signal) from a transmitter. In some embodiments, the transceiver 110 may include a transmitter and a receiver combined into a single unit, or in other embodiments, the transceiver 110 may include a transmitter separate from a receiver. The transceiver 110 may transmit and receive radio frequency signals to support wireless applications such as, for example, a PAN network (e.g., ), WLAN networks (e.g., 802.11x ), WAN networks (e.g., 3G, 4G, 5G, NR, and and LTE-LAA cellular networks), Web, mobile Network, ADSL and VDSL network, and As further illustrated, the electronic device 100 may include a power supply 118. The power supply 118 may include any suitable power source, such as a rechargeable lithium polymer (Li-poly) battery and / or an alternating current (AC) power converter.

[0034] In some embodiments, the electronic device 100 can take the form of a computer, a portable electronic device, a wearable electronic device, or other types of electronic devices. Such computers can be computers that are generally portable (such as laptop computers, notebook computers, and tablet computers), or computers that are generally used in one location (such as desktop computers, workstations, and / or servers). In some embodiments, the electronic device 100 in the form of a computer can be a computer available from Apple Inc. (Cupertino, California). Pro, MacBook mini or Mac Model. By way of example, according to one embodiment of the present disclosure, Figure 1B 1 , the electronic device 100 is illustrated in the form of a notebook computer 120. The notebook computer 120 may include a housing or casing 122, a display 108, input structures 112, and ports for an I / O interface 114. In one embodiment, the input structures 112 (such as a keyboard and / or touchpad) may be used to interact with the computer 120, such as to launch, control, or operate a graphical user interface (GUI) or an application running on the computer 120. For example, the keyboard and / or touchpad may allow a user to navigate a user interface and / or application interface displayed on the display 108.

[0035] Figure 1C A front view of a handheld device 130 is depicted, which represents one embodiment of the electronic device 100. The handheld device 130 may represent, for example, a portable phone, a media player, a personal data organizer, a handheld gaming platform, or any combination of such devices. By way of example, the handheld device 130 may be a device available from Apple Inc. (Cupertino, California). Model. The handheld device 130 may include a housing 122 to protect internal components from physical damage and / or shield these internal components from electromagnetic interference. The housing 122 may surround the display 108. The I / O interface 114 may be opened through the housing 122 and may include, for example, an I / O port for hard-wired connection for charging and / or content manipulation using standard connectors and protocols such as the Lightning connector provided by Apple Inc. (Cupertino, California), a universal serial bus (USB), or other similar connectors and protocols. The interface 114 may be associated with wiring and connectors within the radio frequency package of the electronic device 100. The wiring and connectors may allow specific areas within the system package of the electronic device 100 to be used for placing components that facilitate supporting multiple wireless communication protocols and capabilities. By way of example, if the handheld device 130 is positioned upward along the positive portion of the z-axis and facing the positive portion of the y-axis, the antenna array of the right panel of the handheld device 130 may be set and transmit signals in the positive portion of the x-axis. Similarly, the antenna array of the left side panel can be set and transmit signals in the negative part of the x-axis, the antenna array of the front glass panel (e.g., the front surface panel) can be set and transmit signals in the positive part of the y-axis, and the antenna array of the rear glass panel (e.g., the rear surface panel) can be set and transmit signals in the negative part of the y-axis.

[0036] The input structures 112, in conjunction with the display 108, can allow a user to control the handheld device 130. For example, the input structures 112 can activate or deactivate the handheld device 130, navigate the user interface to a home screen, a user-configurable application screen, and / or activate a voice recognition feature of the handheld device 130. Other input structures 112 can provide volume control or switch between a vibrate mode and a ring mode. The input structures 112 can also include a microphone that can capture the user's voice for various voice-related features, and a speaker that can enable audio playback and / or certain phone capabilities. The input structures 112 can also include a headphone input that can provide a connection to an external speaker and / or headphones.

[0037] Figure 1D A front view of another handheld device 140 is depicted, which represents another embodiment of the electronic device 100. The handheld device 140 may represent, for example, a tablet computer, or one of various portable computing devices. By way of example, the handheld device 140 may be a tablet-sized embodiment of the electronic device 100, such as the one available from Apple Inc. (Cupertino, California). model.

[0038] Go to Figure 1E , the computer 150 may represent Figure 1AAnother embodiment of the electronic device 100 is shown. The computer 150 may be any computer, such as a desktop computer, a server, or a notebook computer, but may also be a stand-alone media player or video game console. By way of example, the computer 150 may be a computer from Apple Inc. (Cupertino, California). or other similar devices. It should be noted that computer 150 may also represent a personal computer (PC) from another manufacturer. A similar housing 122 may be provided to protect and enclose the internal components of computer 150, such as display 108. In some embodiments, a user of computer 150 may interact with computer 150 using various peripheral input structures 112 such as keyboard 152 or mouse 154 (e.g., input structures 112) that may be connected to computer 150.

[0039] Similarly, Figure 1F A wearable electronic device 160 is depicted as another embodiment of the electronic device 100 that can be configured to operate using the techniques described herein. By way of example, the wearable electronic device 160, which can include a wristband 162, can be an Apple However, in other embodiments, the wearable electronic device 160 may include any wearable electronic device, such as, for example, a wearable motion monitoring device (e.g., a pedometer, an accelerometer, a heart rate monitor), or other devices from another manufacturer. The display 108 of the wearable electronic device 160 enclosed by the housing 122 may include a touch screen display 108 (e.g., an LCD, an LED display, an OLED display, an AMOLED display, etc.) and an input structure 112 that allows a user to interact with the user interface of the wearable electronic device 160.

[0040] Figure 2 yes Figure 1A FIG2 is a schematic diagram of a system-in-package 200 for an electronic device 100. Although the depicted embodiment shows multiple panels on different sides and on the same layer of the electronic device 100, the system described herein is also applicable to stacked panels, such as a three-dimensional (3D) stack of printed circuit boards. That is, one or more of the panels can be positioned on top of or below one or more other panels. In addition, at least one of the panels can include a redistribution printed circuit board that provides connections between the panels coupled to the redistribution printed circuit board.

[0041] In the depicted embodiment, the system-in-package 200 includes packaging for a front glass panel 232 (e.g., a front surface panel or cover glass panel), a main logic board 233 having a back glass panel 234, a left side panel 236, and a right side panel 238. Although the following description describes panels 232, 234, 236, and 238 as being disposed on the front, back, left, and right sides of the electronic device 100, respectively, which represents a particular embodiment, the system-in-package 200 described herein may additionally or alternatively include panels disposed at other areas of the electronic device 100 that may include one or more antennas. For example, the system-in-package 200 may also include a top-side panel or a bottom-side panel disposed on the top or bottom of the electronic device 100, respectively, adjacent to the left side panel 236 and the right side panel 238. Furthermore, although the following description describes one antenna array, which represents a particular embodiment, the system-in-package 200 described herein may additionally or alternatively include multiple antenna arrays.

[0042] The main logic board 233 may include a rear glass panel 234, a power management circuit 239, a transceiver 110, an antenna array selector 237, an application processor 235, and a first antenna array 250A. The application processor 235 may be coupled to the power management circuit 239 to control power functions, including power functions related to wireless communication. The power management circuit 239 may include one or more integrated circuits and control the power provided to the main logic board 233 and / or components of the electronic device 100 (including, for example, the transceiver 110 and / or the antenna array selector 237) (e.g., via the processor 102). By way of example, the power management circuit 239 may control the following processes: supplying power to the main logic board 233, providing power to components on or coupled to the main logic board 233, panels 232, 234, 236, and / or 238; selecting power; power sequencing; converting direct current (DC) for specific power-related functions; charging the battery of the electronic device 100, etc.

[0043] As shown, the transceiver 110 may be coupled to an antenna array selector 237, a first antenna array 250A of the rear glass panel 234, and components of the front glass panel 232. The antenna array 250A includes a plurality of antennas that transmit and / or receive wireless signals and may form a directional beam using the signals transmitted by each of the antennas. Figure 1AAs discussed, the transceiver 110 is a device that includes a transmitter and a receiver in a single package and can use the antennas in the first antenna array 250A to send and receive data via wireless signals conveyed at a specific radio frequency. Specifically, the transceiver 110 may include a transmitter and a receiver that include components that facilitate the transmission and reception of wireless signals, such as those components that transmit and receive between electronic devices 100 using mmWave communication technology or any other suitable communication protocol. When communicating on mmWave frequencies, the electronic device 100 may utilize beamforming technology to form a directional beam, as previously mentioned. The transmitter of the transceiver 110 may include one or more phase shifters, a transmitter power detector, and a power amplifier. The transmitter phase shifter can modulate (e.g., shift the phase of) the transmit signal (e.g., the wireless signal transmitted from the antennas in the first antenna array 250A) and can form a beam that can be steered in a specific direction (e.g., a directional beam), such as toward another electronic device (e.g., another electronic device 100 or a base station). The power amplifier can amplify the power level of the transmit signal. Specifically, a power amplifier supply voltage may be supplied to the power amplifier to control the amount of amplification provided by the power amplifier (e.g., to increase or decrease amplification, which may affect the antenna gain at the corresponding antenna). The transmitter power detector may measure the power of transmit signals transmitted from the antennas in the first antenna array 250A.

[0044] The receiver of the transceiver 110 may include one or more receiver phase shifters, a low-noise amplifier, and a receiver power detector. The receiver phase shifter and receiver power detector may operate similarly to the transmitter phase shifter and transmitter power detector. The low-noise amplifier may amplify the power level of a received signal (e.g., a wireless signal received at an antenna in the first antenna array 250A). Additional components in the transmitter and / or receiver may include, but are not limited to, filters, mixers, and / or attenuators.

[0045] The antenna array selector 237, which may be coupled to the transceiver 110, may activate or enable communications from one or more of the antennas in the antenna array 250 (such as the first antenna array 250A). For example, based on data throughput, the antenna array selector 237 may selectively enable multiple antennas to accommodate data throughput. As shown, the first antenna array 250A is disposed at the rear glass panel 234. The rear glass panel 234 may include one or more printed circuit boards coupled to the rear surface (e.g., rear glass) of the electronic device 100. As shown, the first antenna array 250A may include an M×N array of first frequency band antennas 251 (Band 1), second frequency band antennas 253 (Band 2), and third frequency band antennas 255 (Band 3). The M×N array may refer to M rows (e.g., one or more rows) and N columns (e.g., one or more columns) of antennas, where the number of rows, columns, and / or antennas in a row and column may include any number of antennas suitable for a particular application (e.g., communication via mmWave). Additionally, although the following description describes an antenna array 250 having a specific number of first frequency band antennas 251, second frequency band antennas 253, and third frequency band antennas 255, which represents a specific embodiment, the antenna array 250 may include any one or more of the first frequency band antennas 251, second frequency band antennas 253, and / or third frequency band antennas 255. The first frequency band antennas 251 may enable communication in a first frequency band or frequency range, the second frequency band antennas 253 may enable communication in a second frequency band or frequency range, and the third frequency band antennas 255 may enable communication in a third frequency band or frequency range. In some embodiments, the first frequency band, the second frequency band, and the third frequency band may include different frequency ranges. By way of example, the first frequency band may include low-band frequencies such as 700 MHz to 1.0 GHz, the second frequency band antennas 253 may enable communication in mid-band frequencies (such as 1.8 GHz to 2.2 GHz), and the third frequency band antennas 255 may enable communication in high-band frequencies (such as 20 GHz to 80 GHz).

[0046] Additionally, the transceiver 110 may be coupled to a power management module (PMM) 241 and an amplifier radio frequency integrated circuit (RFIC) 242 of the front glass panel 232. The power management module 241 may provide power to a power amplifier of the transceiver 110 to amplify the power of a transmit signal. The amplifier RFIC 242 may provide a mixing circuit to demodulate a radio frequency signal received by the transceiver 110 and modulate an intermediate frequency signal into a radio frequency signal for use in transmitting the transmit signal from the transceiver 110.

[0047] In some embodiments, the application processor 235 can control the antenna array selector 237 and / or the transceiver 110 (e.g., via the antenna array selector 237), and by extension, the antenna arrays 250 of the front glass panel 232, the back glass panel 234, the left side panel 236, and / or the right side panel 238. That is, the antenna array selector 237 can enable one or more of the antennas in one or more antenna arrays 250 (e.g., antenna arrays 250A, 250B, 250C, 250D) to transmit or receive wireless signals via the transceiver 110. In some embodiments, the antenna array selector 237 can enable the antennas of the right side panel 238 to transmit signals that contribute to a beamforming signal that is pointed right relative to the electronic device 100. By way of example, if Figure 1C If the electronic device 130 is positioned upward in the positive portion of the z-axis and facing the positive portion of the y-axis, the right side panel 238 can be positioned and transmit signals in the positive portion of the x-axis. The application processor 235 can also be communicatively coupled to the power management circuit 239 of each of the front glass panel 232, the main logic board 233, the back glass panel 234, the left side panel 236, and the right side panel 238 to control power-related functions for each of the panels.

[0048] The application processor 235 may include one or more microprocessors, one or more "general purpose" microprocessors, one or more special-purpose microprocessors, and / or one or more application-specific integrated circuits (ASICs), or some combination thereof. For example, the application processor 235 may include one or more reduced instruction set computing (RISC) processors. In some cases, the application processor 235 may perform processing (e.g., execute software programs and / or instructions) for specific functions, such as specific wireless communication-related functions. The specific functions may include receiving or generating wireless signals, selecting a specific antenna for transmitting or receiving signals using the antenna array selector 237, selecting an amplification level to amplify a transmit signal using the power management circuit 239, determining the gain of wireless signals transmitted and / or received from a specific transmitter and / or receiver associated with a specific antenna of the antenna array 250, and the like. In some cases, the application processor 235 may be integrated with the processor 102 and perform additional functions related to wireless communication, such as functions related to the display 108, adjusting bandwidth consumption, and the like.

[0049] In some embodiments, the application processor 235 may communicate with one or more memory devices ( Figure 2 Not shown) (such as Figure 1AThe memory device may communicate with the application processor 235 (e.g., memory 104) for processing instructions to perform functions related to wireless communication. The memory device may store information such as control software, configuration information, etc. In some embodiments, the application processor 235 and the memory device may be external to the main logic board 233 and / or the system package 230. The memory device may include tangible, non-transitory machine-readable media, such as volatile memory (e.g., random access memory (RAM)) and / or non-volatile memory (e.g., read-only memory (ROM)). The memory device may store a variety of information and may be used for a variety of purposes. For example, the memory device may store machine-readable and / or processor-executable instructions (e.g., in the form of software or a computer program) for execution by the application processor 235, such as instructions for enabling communication from a specific antenna that transmits or receives a signal that contributes to a beamformed signal transmitted or received at a specific frequency in a specific beam direction. The memory device may include one or more storage devices (e.g., non-volatile storage devices), which may include ROM, flash memory, a hard drive, or any other suitable optical, magnetic, or solid-state storage medium, or a combination thereof.

[0050] As shown, the system package 230 also includes a front glass panel 232, which may include one or more printed circuit boards coupled to a cover glass associated with the display 108. The front glass panel 232 may include a second antenna array 250B having M×N first frequency band antennas 251, M×N second frequency band antennas 253, and / or M×N third frequency band antennas 255. The antennas in the second antenna array 250B operate similarly to the antennas in the first antenna array 250A of the main logic board 233. That is, by way of example, the first frequency band antennas 251 may communicate wireless signals at low-band frequencies (e.g., 700 MHz to 1.0 GHz), the second frequency band antennas 253 may communicate wireless signals at mid-band frequencies (e.g., 1.8 GHz to 2.2 GHz), and the third frequency band antennas 255 may communicate wireless signals at high-band frequencies (e.g., 20 GHz to 80 GHz).

[0051] The front glass panel 232 may also include an amplifier RFIC 242 (e.g., a low noise amplifier (LNA) and a power amplifier (PA) radio frequency integrated circuit (RFIC)) and a power management module 241. The amplifier RFIC 242 may include circuitry between the antenna and the mixing circuitry that processes, for example, a signal at an incoming radio frequency (RF) before it is converted or demodulated to a lower intermediate frequency (IF) for processing (e.g., from RF to IF). By way of example, the amplifier RFIC 242 may include a processor 102 that processes instructions for functions performed by the amplifier RFIC 242 (e.g., instructions related to frequency conversion, transmitting a signal from a specific antenna with specific amplification, receiving a signal at a specific antenna, etc.) and / or a memory 104 that stores instructions related to the functions performed by the amplifier RFIC 242. In some embodiments, the amplifier RFIC 242 may include a bandpass filter that passes frequencies within a specific range and / or a bandstop filter that filters out frequencies from the specific range, a low noise amplifier that increases the signal strength of an incoming signal, a local oscillator that generates a radio frequency signal offset from the incoming signal to mix with the incoming signal, and / or a mixer that mixes the incoming signal with a signal from a local oscillator to convert the incoming signal to an intermediate frequency. The power converter (e.g., a direct current (DC) to DC converter (DC-DC converter)) of the power management module 241 can supply power to a power amplifier of the electronic device 100, for example, for amplifying a transmit signal. Therefore, dynamically changing the supply voltage from the power converter can correspondingly change the amount of amplification of the transmit signal from the power amplifier. In addition, the average power tracking (APT) of the power management module 241 can change the DC supply voltage based on the output power level to maintain the linearity of the power amplifier, while improving efficiency (e.g., reducing unnecessary power consumption of the power amplifier).

[0052] As illustrated, the system-in-package 200 also includes a left side panel 236, which may include one or more printed circuit boards connected to the left side of the electronic device 100. The left side panel 236 may also include a power management circuit 239, a transceiver 110, and a third antenna array 250C. Similarly, the system-in-package 200 includes a right side panel 238. The right side panel 238 may also include a power management circuit 239, a transceiver 110, and a fourth antenna array 250D. The power management circuit 239, transceiver 110, and antenna arrays 250C and 250D may operate and function similarly to the power management circuit 239, transceiver 110, and first antenna array 250A discussed with respect to the main logic board 233. As shown, the third antenna array 250C and the fourth antenna array 250D include M×N first frequency band antennas 251, second frequency band antennas 253, and third frequency band antennas 255. As previously mentioned, by way of example, the first band antenna 251 may communicate wireless signals at low-band frequencies, the second band antenna 253 may communicate wireless signals at mid-band frequencies, and the third band antenna 255 may communicate wireless signals at high-band frequencies.

[0053] As previously discussed, it can be difficult to integrate the antennas in antenna array 250, transceiver 110, and power management circuitry 239 within the same specific area within the package of the panel of system-in-package 200. Specifically, transceiver 110 and antenna array 250 can be co-located (e.g., near each other in the same or substantially the same area) within the package so that transceiver 110 can effectively control amplification, phase, gain, etc. of wireless signals while minimizing signal loss and noise that might otherwise result from a longer communication path (e.g., not co-located) between transceiver 110 and antenna array 250. Similarly, power management circuitry 239 can be co-located with transceiver 110 and antenna array 250 so that transceiver 110 can effectively control power-related functions of wireless signals from the antennas of antenna array 250 while also minimizing signal loss and noise. Furthermore, electronic device 100 can include additional antennas to achieve higher data throughput via the antennas and / or provide higher gain for wireless signals from the antennas. In some embodiments, the electronic device 100 includes additional components and / or additional antennas to accommodate carrier aggregation that is unique to a particular wireless carrier. The system in package 200 can efficiently accommodate co-located components, an additional number of antennas, other components, and / or packaging specifications while reducing the footprint (or maintaining the initial system package 200 size after the additional components and antennas are added). Although the following description describes space reduction packaging techniques applied to a particular panel of the system package 200, these techniques can also be applied to other panels of the system package 200. By way of example, the description of space reduction packaging techniques applied to the front glass panel 232 can also be applied to the main logic board 233, the back glass panel 234, the left side panel 236, and / or the right side panel 238. About Figures 3 to 6 Provides details on various space-reduction packaging technologies for integration of RF packages.

[0054] Example RF Package

[0055] Figure 3FIG2 is a schematic diagram of an RF package 300 that can be integrated into the electronic device 100 according to one embodiment. The RF package 300 can be a system-in-package integrated into the front glass panel 232, the main logic board 233, the back glass panel 234, the left side panel 236, or the right side panel 238. The RF package 300 can include a front-end package 302, a multilayer board 320 (e.g., a printed circuit board), an antenna array 324, and a transceiver die 330. The front-end package 302 can include an RF front-end die 304 and a power control die 306 connected to an insulating film substrate 316 via connectors 314. The connectors 314 can be, for example, solder ball connectors, microbumps, some other type of connector, or some combination thereof. The insulating film substrate 316 can be implemented, for example, as an insulating build-up material. Alternatively, the insulating film substrate 316 can be replaced with an interposer. The power control die 306 can provide power control for the RF front-end die 304, for example. The power control die 306 can be stacked onto the insulating film substrate 316 via the connectors 314. The power control die 306 may be an embodiment of the power management circuit 239 and / or the power management module 241. The front-end package 302 may also include at least one passive component 308 (e.g., a capacitor) stacked onto the insulating film substrate 316. The RF package 300 may also include a passive component 310 (e.g., a capacitor, an inductor, or a resistor) and / or a passive component 312 (e.g., a capacitor, an inductor, or a resistor) placed on the top side of the multilayer board 320.

[0056] The antenna array 324 and transceiver die 330 may provide wireless communication functionality for the RF package 300 and the electronic device 100 incorporating the RF package 300. Each transceiver die 330 may be connected to the antenna array 324 using a connector 326. The connector 326 may be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof. Passive elements 328 (e.g., capacitors) may be stacked onto the antenna array 324, and each passive element 328 may be positioned adjacent to a corresponding transceiver die 330. In one or more embodiments, at least one additional tuning component ( Figure 3 ) is stacked onto the antenna array 324.

[0057] The multilayer board 320 can be placed between the front-end package 302 and the antenna array 324. The insulating film substrate 316 can be connected to the multilayer board 320 using a connector 318. The connector 318 can be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof. The multilayer board 320 can be replaced with a flexible board 320. Alternatively, the multilayer board 320 can be replaced with a board 320 having at least one embedded component. The antenna array 324 can be connected to the multilayer board 320 using a via connector 332. The via connector 332 can carry signals between the transceiver die 330 / antenna array 324 and one or more components of the front-end package 302. The via connector 332 can be, for example, a plated via, a copper-filled via, some other type of via, or some combination thereof. The RF package 300 can also include a mold 322 (e.g., an antenna substrate) placed on the antenna array 324. The transceiver die 330 and the connector 326 can be integrated into the mold 322. When the mold 322 is included in the RF package 300 , the multilayer board 320 may be placed between the front-end package 302 and the mold 322 .

[0058] Figure 4A FIG2 is a schematic diagram of an RF package 400 that can be integrated into an electronic device 100 according to one embodiment. The RF package 400 can be a system-in-package that is integrated into the front glass panel 232, the main logic board 233, the back glass panel 234, the left side panel 236, or the right side panel 238. The RF package 400 can include an antenna array 412 and a plurality of transceiver dies 420 that together provide wireless communication functionality for the RF package 400 and the electronic device 100 in which the RF package 400 is integrated. Each transceiver die 420 can be connected to the antenna array 412 using a connector 424. The connector 424 can be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof.

[0059] RF package 400 may also include a stepped mold 414 (e.g., a stepped antenna substrate) having portions of varying heights positioned over antenna array 412. Each transceiver die 420 may be integrated into stepped mold 414. RF package 400 may also include an RF front-end die 416 integrated into stepped mold 414, and at least one power control die 428. The at least one power control die 428 may provide power control for, for example, RF front-end die 416 and / or transceiver die 420. The at least one power control die 428 may be integrated into stepped mold 414 and mounted to multilayer board 410 via connector 432. Connector 432 may be, for example, a land grid array connector, a ball grid array connector, a microbump, some other type of connector, or some combination thereof. The at least one power control die 428 may be an embodiment of power management circuit 239 and / or power management module 241. The stepped mold 414 can be used to include at least one shielding layer into the RF package 400. Additionally or alternatively, the stepped mold 414 can be used to include at least one heat dissipation material into the RF package 400. The RF package 400 can also include passive elements 426 (e.g., capacitors, inductors, and / or resistors) integrated into the stepped mold 414 and stacked onto the antenna array 412. Each passive element 426 can be positioned adjacent to a corresponding transceiver die 420. In one or more embodiments, at least one additional tuning component ( Figure 4A ) is stacked onto the antenna array 412.

[0060] The RF package 400 may also include a multilayer board 410 (e.g., a printed circuit board). The first (e.g., bottom) surface of the multilayer board 410 may be connected to the RF front-end die 416 and at least one power control die 428 using connectors 418. The connectors 418 may be, for example, land grid array connectors, ball grid array connectors, microbumps, some other type of connector, or some combination thereof. The antenna array 412 may be connected to the multilayer board 410 using via connectors 430. The via connectors 430 may carry signals between components at a first surface (e.g., top surface) of the multilayer board 410 and components at a second surface (e.g., bottom surface) of the multilayer board 410 opposite the first surface. The via connectors 430 may be, for example, plated vias, copper-filled vias, some other type of via, or some combination thereof. The RF package 400 may also include passive components 402, 404, 406, 408 (e.g., capacitors, inductors, and / or resistors) stacked at the same height or different heights onto the second (e.g., top) surface of the multilayer board 410. The multilayer board 410 may be replaced with a flexible board 410. Alternatively, the multilayer board 410 may be replaced with a board 410 having at least one embedded component.

[0061] Figure 4B is a schematic diagram of a radio frequency package 450 that can be integrated into the electronic device 100 according to one embodiment. The radio frequency package 450 can be a system package integrated into the front glass panel 232, the main logic board 233, the back glass panel 234, the left side panel 236, or the right side panel 238. The radio frequency package 450 can include a multi-layer board 410 (e.g., a printed circuit board), an radio frequency front-end die 416, at least one power control die 428, a transceiver die 420, an antenna array 412, and a pair of passive components 452, 454.

[0062] The transceiver die 420 and the antenna array 412 together can provide wireless communication functionality for the RF package 450 and the electronic device 100 incorporating the RF package 450. Each transceiver die 420 can be connected to the antenna array 412 using a connector 424. The antenna array 412 can be connected to the multilayer board 410 using a via connector 430. The via connector 430 can carry signals between components at a first surface (e.g., a top surface) of the multilayer board 410 and components at a second surface (e.g., a bottom surface) of the multilayer board 410 opposite the first surface. The first surface of the multilayer board 410 can be connected to the RF front end die 416 and at least one power control die 428 using connectors 418 and 432, respectively. The multilayer board 410 can be replaced with a flexible board 410. Alternatively, the multilayer board 410 can be replaced with a board 410 having at least one embedded component.

[0063] The RF package 450 may also include a mold 458 placed onto at least a portion of the antenna array 412. Each transceiver die 420 may be integrated into the mold 458. The RF package 450 may also include passive components 426 (e.g., capacitors, inductors, and / or resistors) integrated into the mold 458 and stacked onto the antenna array 412. Each passive component 426 may be positioned adjacent to a corresponding transceiver die 420. In one or more embodiments, at least one additional tuning component ( Figure 4B ) is stacked onto the antenna array 412.

[0064] The RF package 450 may further include a passive component 452 (e.g., a capacitor, an inductor, or a resistor) and / or a passive component 454 (e.g., a capacitor, an inductor, or a resistor) coupled to the first (e.g., bottom) surface of the multilayer board 410. The passive components 452, 454 may be isolated from other components of the RF package 450 using a shielding layer 456, for example, to mitigate signal interference. The shielding layer 456 may at least partially surround the passive components 452, 454. Each passive component 452, 454 may be Figure 4ABy placing some or all of the passive components 402, 404, 406, 408 at the bottom surface of the multilayer board 410, the thickness of the RF package 450 can be reduced relative to the thickness of the RF package 400.

[0065] Figure 5A FIG2 is a schematic diagram of an RF package 500 that can be integrated into the electronic device 100 according to one embodiment. The RF package 500 can be a system-in-package integrated into the front glass panel 232, the main logic board 233, the back glass panel 234, the left side panel 236, or the right side panel 238. The RF package 500 can include a front-end package 502, a multilayer board 520 (e.g., a printed circuit board), an antenna array 524, and a transceiver die 530. The front-end package 502 can include an RF front-end die 504 and a power control die 506 connected to an insulating film substrate 516 via a connector 514. The connector 514 can be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof. The insulating film substrate 516 can be implemented, for example, as an insulating build-up material. Alternatively, the insulating film substrate 516 can be replaced with an interposer. The power control die 506 can provide power control for the RF front-end die 504, for example. The power control die 506 can be stacked onto the insulating film substrate 516 via the connector 514. The power control die 506 may be an embodiment of the power management circuit 239 and / or the power management module 241. The front-end package 502 may also include at least one passive component 508 (e.g., a capacitor) stacked onto the insulating film substrate 516. The RF package 500 may also include a passive component 510 (e.g., a capacitor, an inductor, or a resistor) and / or a passive component 512 (e.g., a capacitor, an inductor, or a resistor) placed on the top side of the multilayer board 520.

[0066] The antenna array 524 and the transceiver die 530 together can provide wireless communication functionality for the RF package 500 and the electronic device 100 in which the RF package 500 is integrated. Each transceiver die 530 can be connected to a corresponding antenna array 524 using a connector 526. The connector 526 can be, for example, a pad grid array connector, a ball grid array connector, a microbump, some other type of connector, or some combination thereof. Corresponding passive elements 528 (e.g., capacitors) can be stacked onto the corresponding antenna array 524. Each passive element 528 can be positioned adjacent to the corresponding transceiver die 530. There can be an available space 534 between each two adjacent antenna arrays 524. Each available space 534 can be used to integrate one or more additional components into the RF package 500, for example, to provide improved performance.

[0067] The multilayer board 520 can be placed between the front-end package 502 and the antenna array 524. The insulating film substrate 516 can be connected to the multilayer board 520 using a connector 518. The connector 518 can be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof. The corresponding antenna array 524 can be connected to the multilayer board 520 using a via connector 532. The via connector 532 can carry signals between the transceiver die 530 / antenna array 524 and one or more components of the front-end package 502. The via connector 532 can be, for example, a plated via, a copper-filled via, some other type of via, or some combination thereof. The multilayer board 520 can be replaced with a flexible board 520. Alternatively, the multilayer board 520 can be replaced with a board 520 having at least one embedded component. The RF package 500 can also include a mold 522 (e.g., an antenna substrate), and each mold 522 can be placed on a corresponding antenna array 524. Each transceiver die 530 and each passive component 528 can be integrated into a corresponding mold 522. When the mold 522 is included in the RF package 500, the multilayer board 520 can be placed between the front-end package 502 and the mold 522. Each mold 522 (together with the integrated corresponding transceiver die 530) and the corresponding antenna array 524 can use a shielding layer 536 to protect from one or more adjacent components (for example, to reduce interference with wireless signals). The shielding layer 536 can be placed on the side edges of the mold 522 and the corresponding antenna array 524.

[0068] Figure 5B is a schematic diagram of an RF package 550 that can be integrated into the electronic device 100 according to one embodiment. The RF package 550 can be a system package integrated into the front glass panel 232, the main logic board 233, the back glass panel 234, the left side panel 236, or the right side panel 238. The RF package 550 may include a front-end package 502, a multi-layer board 520 (e.g., a printed circuit board), an antenna array 524, and a transceiver die 530. The front-end package 502 may include an RF front-end die 504 and a power control die 506 connected to an insulating film substrate 516 via a connector 514. The front-end package 502 may also include at least one passive component 508 (e.g., a capacitor) stacked on the insulating film substrate 516. The RF package 550 may also include a passive component 510 (e.g., a capacitor, an inductor, or a resistor) and / or a passive component 512 (e.g., a capacitor, an inductor, or a resistor) placed on the top side of the multi-layer board 520.

[0069] The antenna array 524 and the transceiver die 530 together can provide wireless communication functionality for the RF package 550 and the electronic device 100 incorporating the RF package 550. Each transceiver die 530 can be connected to a corresponding antenna array 524 using a connector 526. A corresponding passive element 528 (e.g., a capacitor) can be stacked onto the corresponding antenna array 524. Each passive element 528 can be positioned adjacent to a corresponding transceiver die 530. There can be an available space 552 between each two adjacent antenna arrays 524. Each available space 552 can be used to integrate one or more additional components into the RF package 550, for example, to provide improved performance.

[0070] The multilayer board 520 can be placed between the front-end package 502 and the antenna array 524. The insulating film substrate 516 can be connected to the multilayer board 520 using a connector 518. The corresponding antenna array 524 can be connected to the multilayer board 520 using a via connector 532. The via connector 532 can carry signals between the transceiver die 530 / antenna array 524 and one or more components of the front-end package 502. The multilayer board 520 can be replaced with a flexible board 520. Alternatively, the multilayer board 520 can be replaced with a board 520 having at least one embedded component. The RF package 550 can also include a mold 522 (e.g., an antenna substrate), and each mold 522 can be placed on a corresponding antenna array 524. Each transceiver die 530 and each passive component 528 can be integrated into a corresponding mold 522. When the mold 522 is included in the RF package 550, the multilayer board 520 can be placed between the front-end package 502 and the mold 522.

[0071] The pair of transceiver dies 530 and the corresponding pair of antenna arrays 524 can be rotated by a defined angle around the vertical axis (e.g., z-axis) of the RF package 550, for example, to improve the coverage of the transmitted / received wireless signals. By rotating the pair of antenna arrays 524 around the vertical axis of the RF package 550, the directionality and spatial coverage of the transmitted / received communication signals can be improved relative to the vertical axis of the RF package 550. Figure 5AThe RF package 500 is improved (for example, omnidirectionality can be achieved). When the mold 522 is included in the RF package 550, the corresponding pair of molds 522 can also rotate together with the pair of transceiver tube cores 530 and the corresponding pair of antenna arrays 524. The corresponding substrate 554 can be placed between each rotating structure (for example, the mold 522 and the transceiver tube core 530 and the antenna array 524) and the multilayer board 520. In addition, the corresponding rotating antenna array 524 can be coupled to the front-end package 502 using a via connector 532, which is connected to the multilayer board 520 using a corresponding inner connector 556 and a corresponding outer connector 558. The inner connector 556 can be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof. Similarly, the outer connector 558 can be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof. Each rotating structure including the mold 522, the transceiver tube core 530 and the antenna array 524 can be assembled first. Each assembly structure can then be mounted to a corresponding inner connector 556 and outer connector 558 of a specific length (e.g., height) such that the assembly structure can be tilted at a defined angle relative to the vertical axis of the RF package 550. Each rotating structure can be securely mounted to the inner connector 556 and outer connector 558 using a corresponding via connector 532. The substrate 554 can be an injection molded part that is shaped as needed and plated with, for example, conductive posts. In one embodiment, the substrate 554 is implemented as a three-dimensional printed plastic with metal inserts or connector-type components (e.g., inner connector 556 and outer connector 558). In another embodiment, the substrate 554 is implemented as a stamped plastic with laser direct imaging to define vias (e.g., via 532) and conductors (e.g., inner connector 556 and outer connector 558).

[0072] Figure 6FIG2 is a schematic diagram of an RF package 600 that can be integrated into the electronic device 100 according to one embodiment. The RF package 600 can be a system-in-package integrated into the front glass panel 232, the main logic board 233, the back glass panel 234, the left side panel 236, or the right side panel 238. The RF package 600 can include a front-end package 602, a multilayer board 620 (e.g., a printed circuit board), an antenna array 624, and a transceiver die 630. The front-end package 602 can include an RF front-end die 604 and a power control die 606 connected to an insulating film substrate 616 via a connector 614. The connector 614 can be, for example, a solder ball connector, a microbump, some other type of connector, or some combination thereof. The insulating film substrate 616 can be implemented, for example, as an insulating build-up material. Alternatively, the insulating film substrate 616 can be replaced with an interposer. The power control die 606 can provide power control for the RF front-end die 604, for example. The power control die 606 can be stacked onto the insulating film substrate 616 via the connector 614. The power control die 606 may be an embodiment of the power management circuit 239 and / or the power management module 241. The front-end package 602 may also include at least one passive component 608 (e.g., a capacitor) stacked onto the insulating film substrate 616. The RF package 600 may also include a passive component 610 (e.g., a capacitor, an inductor, or a resistor) and / or a passive component 612 (e.g., a capacitor, an inductor, or a resistor) placed on the top side of the multilayer board 620.

[0073] The antenna array 624 and the transceiver die 630 together can provide wireless communication functionality for the RF package 600 and the electronic device 100 in which the RF package 600 is integrated. Each transceiver die 630 can be connected to a corresponding antenna array 624 using a connector 626. The connector 626 can be, for example, a pad grid array connector, a ball grid array connector, a microbump, some other type of connector, or some combination thereof. Corresponding passive components 628 (e.g., capacitors) can be stacked onto the corresponding antenna array 624. Each passive component 628 can be positioned adjacent to the corresponding transceiver die 630. There may be available space 634 between some adjacent antenna arrays 624. Each available space 634 can be used to integrate one or more additional components into the RF package 600, for example, to provide improved performance.

[0074] The multilayer board 620 can be placed between the front-end package 602 and some antenna arrays 624. The insulating film substrate 616 can be connected to the multilayer board 620 using connectors 618. The connectors 618 can be, for example, solder ball connectors, microbumps, some other type of connector, or some combination thereof. The corresponding antenna arrays 624 can be connected to the multilayer board 620 using via connectors 632. The via connectors 632 can carry signals between the transceiver die 630 / antenna array 624 and one or more components of the front-end package 602. The via connectors 632 can be, for example, plated vias, copper-filled vias, some other type of vias, or some combination thereof. The multilayer board 620 can be replaced with a flexible board 620. Alternatively, the multilayer board 620 can be replaced with a board 620 having at least one embedded component. The RF package 600 can also include a mold 622 (e.g., an antenna substrate), and each mold 622 can be placed on a corresponding antenna array 624. Each transceiver die 630 and each passive component 628 can be integrated into a corresponding mold 622 . When the molds 622 are included in the RF package 600 , the multilayer board 620 can be placed between the front-end package 602 and some of the molds 622 .

[0075] The RF package 600 may also include an adhesive 640 (e.g., a flexible adhesive or a rigid-flexible adhesive) coupled to the multilayer board 620 using a pair of connectors 638. The connectors 638 may be, for example, solder ball connectors, microbumps, some other type of connector, or some combination thereof. Instead of or in addition to being located at the top surface and / or the bottom surface of the multilayer board 620, at least one connector 638 may be positioned between the adhesive 640 and a side surface of the multilayer board 620. At least one antenna array 642 and at least one transceiver die 648 (which may optionally be integrated into the mold 636 along with passive components 646) may be connected to the multilayer board 620 using via connectors 650 connected to the adhesive 640. The via connectors 650, along with the connectors 638, may carry signals between the transceiver die 648 / antenna array 642 and one or more components of the front-end package 602. The via connectors 650 may be, for example, plated vias, copper-filled vias, some other type of via, or some combination thereof. Each structure including mold 636, transceiver die 648, and antenna array 642 can be assembled first. Afterwards, each assembled structure can be mounted on adhesive 640, which is then mounted on a pair of connectors 638. In this way, the wireless communication performance of RF package 600 can be improved as wireless signals can be sent / received in more directions.

[0076] While specific embodiments and applications have been illustrated and described, it should be understood that the invention is not limited to the precise construction and components disclosed herein, and that various modifications, changes and variations that will be apparent to those skilled in the art may be made in the arrangement, operation and details of the methods and apparatus disclosed herein without departing from the spirit and scope of the present disclosure.

Claims

1. A radio frequency package, comprising: a front-end package comprising a radio frequency (RF) front-end die and a power control die connected to an insulating film substrate via a first plurality of connectors; an antenna array configured to provide wireless communication functionality; and A plurality of transceiver dies, each transceiver die of the plurality of transceiver dies connected to the antenna array using a second plurality of connectors. 2 . The radio frequency package of claim 1 , further comprising a mold, the mold being placed on the antenna array, the plurality of transceiver dies and each of the second plurality of connectors being integrated into the mold. 3 . The radio frequency package according to claim 2 , further comprising a multilayer board placed between the front-end package and the die, and the insulating film substrate is connected to the multilayer board using a third plurality of connectors.

4. The radio frequency package of claim 3, wherein the antenna array is connected to the multilayer board using a plurality of via connectors. 5 . The radio frequency package according to claim 1 , wherein the front-end package further comprises at least one passive component, and the at least one passive component is stacked on the insulating film substrate. 6 . The radio frequency package of claim 1 , wherein the first plurality of connectors comprises a first plurality of solder ball connectors, and the second plurality of connectors comprises a second plurality of solder ball connectors. The radio frequency package according to claim 1 , wherein the insulating film substrate comprises an insulating build-up layer material. 8 . The RF package of claim 1 , wherein a plurality of passive elements are stacked on the antenna array, each of the plurality of passive elements being positioned adjacent to a corresponding transceiver die of the plurality of transceiver dies.

9. A radio frequency package, comprising: a front-end package comprising a radio frequency (RF) front-end die and a power control die connected to an insulating film substrate via a first plurality of connectors; a plurality of antenna arrays, each antenna array of the plurality of antenna arrays being configured to provide wireless communication functionality; and A plurality of transceiver dies, each transceiver die of the plurality of transceiver dies connected to a corresponding antenna array of the plurality of antenna arrays using a second plurality of connectors.

10. The RF package of claim 9, further comprising a plurality of dies, each of the plurality of dies being placed onto the corresponding antenna array of the plurality of antenna arrays, and each of the plurality of transceiver dies being integrated into a corresponding die of the plurality of dies. 11 . The radio frequency package according to claim 10 , further comprising a multilayer board placed between the front-end package and the plurality of dies, and the insulating film substrate is connected to the multilayer board using a third plurality of connectors. 12 . The radio frequency package of claim 10 , wherein a shielding layer is placed on side edges of the corresponding mold and the corresponding antenna array.

13. The radio frequency package of claim 11, wherein the respective antenna arrays are connected to the multilayer board using a plurality of via connectors. The radio frequency package according to claim 9 , wherein there is a space between every two adjacent antenna arrays in the plurality of antenna arrays.

15. The RF package of claim 9, wherein a pair of the transceiver dies and a corresponding pair of the antenna arrays are rotated about a vertical axis of the RF package.

16. The radio frequency package according to claim 9, further comprising: a multilayer board connected to the insulating film substrate using a third plurality of connectors; and An adhesive is coupled to a multilayer board using a pair of connectors, and at least one antenna array of the plurality of antenna arrays and at least one transceiver die of the plurality of transceiver dies are connected to the multilayer board using via connectors connected to the adhesive.

17. A radio frequency package, comprising: an antenna array configured to provide wireless communication functionality; A plurality of transceiver dies, each transceiver die of the plurality of transceiver dies connected to the antenna array using a first plurality of connectors.

18. The radio frequency package according to claim 17, further comprising: a mold, the mold being placed on the antenna array, each transceiver die of the plurality of transceiver dies being integrated into the mold; Radio frequency (RF) front-end die; and At least one power control die.

19. The RF package of claim 18, further comprising a multilayer board, wherein a bottom surface of the multilayer board is connected to the RF front end die and the at least one power control die using a second plurality of connectors, and the antenna array is connected to the multilayer board using a plurality of via connectors. 20 . The radio frequency package of claim 19 , further comprising at least one passive component, the at least one passive component being disposed on the bottom surface of the multilayer board, the at least one passive component being at least partially surrounded by a shielding layer.

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