High-strength diamond wire bus and preparation method thereof
By plating nickel, iron, and then nickel again on the surface of tungsten wire and combining it with a cold drawing process, the problems of high energy consumption and performance inconsistency in the production of tungsten wire diamond wire were solved, and the preparation of high-strength diamond wire main wire was realized, reducing the wire breakage rate and energy consumption, and improving cutting efficiency.
Patent Information
- Application Number
- CN202511073701.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-01
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2045-08-01
AI Technical Summary
Existing tungsten wire diamond wire production suffers from high energy consumption, graphite dust pollution, inconsistent performance, and high wire breakage rate, affecting cutting efficiency and quality.
High-strength diamond wire busbars are prepared by combining surface nickel plating, iron plating, and re-nickel plating with cold drawing process, and by electrolysis, water washing, heating and soap immersion treatment of tungsten wires.
It improves the tensile strength and performance consistency of tungsten wire, reduces the wire breakage rate and energy consumption during cold drawing, and enhances cutting efficiency and product qualification rate.
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of diamond wire manufacturing, and particularly relates to a high-strength diamond wire bus and a preparation method thereof. BACKGROUND
[0002] Tungsten wire diamond wire has high-temperature resistance, corrosion resistance, high strength, low wire breakage rate and high-precision cutting capacity, and is the basis for ensuring the stable, reliable and efficient operation of cutting equipment. At present, the core link of tungsten wire diamond wire production is the tungsten wire base manufacturing process. In the conventional drawing process, the tungsten wire is drawn by heating and passing through a die step by step, so as to gradually reduce the diameter of the tungsten wire and finally reach the target diameter. However, the hot drawing process has some problems, including high energy consumption, graphite ash splashing to pollute the environment and low product qualification rate. In addition, the heating and drawing process of the tungsten wire is difficult to keep consistent, resulting in poor consistency of the diameter and performance of the target diameter tungsten wire, and low tensile strength, which causes the wire breakage rate to increase in the subsequent silicon wafer cutting process, thereby affecting the processing efficiency. In this process, the tungsten wire surface at high temperature is easy to react with oxygen in the air to form an oxide film, which further affects the adhesion of the subsequent diamond coating and the tungsten wire, causing the coating to fall off, thereby affecting the silicon wafer cutting efficiency and quality. SUMMARY
[0003] To solve the problems existing in the prior art, the application provides a high-strength diamond wire bus and a preparation method thereof. The preparation method uniformly covers nickel and iron on the surface of the tungsten wire by surface nickel plating, iron plating and then nickel plating, and combines a cold drawing process, effectively reduces the friction in the cold drawing process, and prepares a high-strength diamond wire bus with significantly improved tensile strength and performance consistency.
[0004] According to a first aspect of the application, the application provides a preparation method of a high-strength diamond wire bus, comprising the following steps:
[0005] S1, obtaining a tungsten wire, electrolyzing, washing and drying the tungsten wire;
[0006] S2, electrolyzing the dried tungsten wire three times, the three times of electrolyzing being first nickel plating, second iron plating and third nickel plating;
[0007] S3, heating the electrolyzed tungsten wire, the heating temperature being 450-500 DEG C;
[0008] S4, placing the heated tungsten wire in a saponification solution for saponification;
[0009] S5, drawing the saponified tungsten wire by a cold drawing method to obtain the high-strength diamond wire bus.
[0010] In the above technical solution, the oxidation layer and impurities on the surface of the tungsten wire are removed by electrolysis and water washing in step S1; in step S2, the nickel and iron are uniformly covered on the surface of the tungsten wire by three times of electroplating, so as to reduce the peeling of the plating layer; in step S3, the tungsten wire after electroplating is heated to 450-500 DEG C, so that the mutual diffusion of the plating layer metals on the surface of the tungsten wire is realized through the Kirkendall effect, the nickel and iron are further uniformly covered, the diameter consistency of the tungsten wire is improved, and the combination between the plating layers is more compact, thereby increasing the adhesion between the plating layer and the tungsten wire; in step S4, a uniform lubricating film is formed on the surface of the tungsten wire through soap dipping, so as to reduce the friction between the wire and the die in the subsequent drawing process; in step S5, the cold drawing process is adopted, so as to reduce the energy consumption and reduce the oxidation of the tungsten wire.
[0011] Further, in step S1, the diameter of the tungsten wire is R, R=0.06-0.08 mm.
[0012] In step S2, the following steps are included.
[0013] In S21, the dried tungsten wire is placed in a nickel plating solution for the first time of nickel plating, and the first plating layer has a thickness of 0.0018-0.0022 mm.
[0014] In S22, the tungsten wire after the first time of nickel plating is placed in an iron plating solution for the second time of iron plating, and the second plating layer has a thickness of 0.007-0.013 mm.
[0015] In S23, the tungsten wire after the second time of iron plating is placed in a nickel plating solution for the third time of nickel plating, and the third plating layer has a thickness of 0.0075-0.0085 mm.
[0016] After step S23, the following steps are included.
[0017] In S24, the tungsten wire after the third time of nickel plating is subjected to two times of ultrasonic cleaning, wherein the water temperature in the first time of ultrasonic cleaning is 70-75 DEG C, and the water temperature in the second time of ultrasonic cleaning is 20-35 DEG C.
[0018] In step S4, the saponification solution includes a sodium stearyl sulfate solution, and the pH of the saponification solution is 7.5-9.5.
[0019] In step S5, the diameter of the high-strength diamond wire bus is 26-35 μm.
[0020] In the above preferred technical solution, the impurity elements on the surface of the plating layer can be removed through ultrasonic cleaning.
[0021] Further, in step S1, the electrolyte used in electrolysis is a 25-35 wt% NaOH solution, the current is 30-40 A, and the speed of the tungsten wire through the electrolyte is 90-110 m / min.
[0022] Further, in the step S1, the water flow rate during water washing is 50-60 L / min, and the temperature during drying is 290-310℃.
[0023] Further, in the step S21, the tungsten wire is wound on two rollers for 10-12 turns, the interval between adjacent two turns of the tungsten wire is 4R+0.2 mm, and the linear speed of the roller rotation is 24.5-25.5 m / min.
[0024] In the step S22, the tungsten wire is wound on two rollers for 8-10 turns, the interval between adjacent two turns of the tungsten wire is 5R+0.2 mm, and the linear speed of the roller rotation is 19.5-20.5 m / min.
[0025] In the step S23, the tungsten wire is wound on two rollers for 20-24 turns, the interval between adjacent two turns of the tungsten wire is 4R+0.2 mm, and the linear speed of the roller rotation is 17.5-18.5 m / min.
[0026] In the above preferred technical solution, the tungsten wire is wound on two rollers for multiple turns, so that the tungsten wire can be in contact with the plating solution multiple times quickly during the winding and unwinding process, and the plating layer thickness can be distributed more uniformly.
[0027] Further, in the step S21, the tungsten wire is immersed in the nickel plating solution by 7-9 mm.
[0028] In the step S22, the tungsten wire is immersed in the iron plating solution by 7 mm.
[0029] In the step S23, the tungsten wire is immersed in the nickel plating solution by 7 mm.
[0030] Further, in the step S21, the nickel plating solution comprises a nickel sulfate solution, and the concentration of the nickel sulfate solution is 1000×(R+0.2) g / L.
[0031] In the step S22, the iron plating solution comprises ferrous chloride, sodium chloride and boric acid, and the concentration of ferrous ions in the iron plating solution is 500×(R+0.05) g / L.
[0032] In the step S23, the nickel plating solution comprises a nickel sulfate solution, and the concentration of the nickel sulfate solution is 1000×(R+0.3) g / L.
[0033] Further, in the step S3, the tungsten wire is heated in a heating furnace, the length of the heating furnace is 3.5-4 m, and the speed of the tungsten wire passing through the heating furnace is 19.5-20.5 m / min.
[0034] Further, in the step S4, the saponification solution includes sodium stearate solution, and the pH of the saponification solution is 7.5-9.5.
[0035] According to a second aspect of the present application, the present application provides a high-strength diamond wire bus, which is prepared by the above-mentioned preparation method of the high-strength diamond wire bus.
[0036] Further, the diameter of the high-strength diamond wire bus is not more than 35 mu m, and the average strength of 10 times of tensile strength test is greater than or equal to 6250 MPa.
[0037] Further, when the diameter of the high-strength diamond wire bus is greater than 30 mu m and less than or equal to 35 mu m, the average strength of 10 times of tensile strength test is greater than or equal to 6250 MPa.
[0038] Further, when the diameter of the high-strength diamond wire bus is greater than or equal to 26 mu m and less than or equal to 30 mu m, the average strength of 10 times of tensile strength test is greater than or equal to 6470 MPa.
[0039] The present application provides a high-strength diamond wire bus and a preparation method thereof, which has the following beneficial effects: by plating nickel and iron on the surface of the tungsten wire and heat diffusion, the resistance in the cold drawing process is reduced, and the wire breakage rate in the cold drawing process is reduced; by the cold drawing process, the fine tungsten wire is prepared, the energy consumption and environmental pollution are reduced, the diameter consistency and performance consistency are improved, the tensile strength and the qualified rate are significantly improved; by optimizing the parameters, the high-strength diamond wire bus with a strength of not less than 6250 MPa is obtained. DETAILED DESCRIPTION
[0040] The technical solutions in the embodiments will be described below in a clear and complete manner. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0041] According to a first aspect of the present application, the present application provides a preparation method of a high-strength diamond wire bus, which comprises the following steps:
[0042] S1, obtaining a tungsten wire, electrolyzing, washing and drying the tungsten wire;
[0043] Preferably, the diameter of the tungsten wire is R, R = 0.06-0.08 mm, the electrolyte used in electrolysis is a 25-35 wt% NaOH solution, the current is 30-40 A, the speed of the tungsten wire passing through the electrolyte is 90-110 m / min; the water flow rate in water washing is 50-60 L / min, and the temperature in drying is 290-310℃. Specifically, the concentration of the NaOH solution can be any one of 25 wt%, 27 wt%, 30 wt%, 32 wt%, 35 wt% or a range between any two of them, the current can be any one of 30 A, 32 A, 34 A, 36 A, 38 A, 40 A or a range between any two of them, the water flow rate can be any one of 50 L / min, 52 L / min, 54 L / min, 56 L / min, 58 L / min, 60 L / min or a range between any two of them, and the temperature in drying can be any one of 290℃, 295℃, 300℃, 305℃, 310℃ or a range between any two of them.
[0044] S2, the dried tungsten wire is electroplated three times, the three times of electroplating are first nickel plating, second iron plating, and third nickel plating;
[0045] Preferably, the dried tungsten wire is wound around two rollers for 10-12 turns and placed in a nickel plating solution for first nickel plating, the spacing between adjacent two turns of the tungsten wire is 4R+0.2 mm, the linear speed of the roller rotation is 24.5-25.5 m / min, the tungsten wire is immersed in the nickel plating solution by 7-9 mm, the nickel plating solution comprises a nickel sulfate solution, the concentration of the nickel sulfate solution is 1000x(R+0.2) g / L, and the first plating layer has a thickness of 0.0018-0.0022 mm. Specifically, the linear speed of the roller rotation can be any one of 24.5 m / min, 24.7 m / min, 24.9 m / min, 25.1 m / min, 25.3 m / min, 25.5 m / min or a range between any two of them; and the thickness of the first plating layer can be any one of 0.0018 mm, 0.0019 mm, 0.0020 mm, 0.0021 mm, 0.0022 mm or a range between any two of them.
[0046] Preferably, the tungsten wire after the first nickel plating is wound on two rollers for 8-10 turns and placed in the iron plating solution for the second iron plating, the distance between the adjacent two turns of the tungsten wire is 5R+0.2mm, the linear speed of the roller rotation is 19.5-20.5m / min, the tungsten wire is immersed in the iron plating solution by 7mm, the iron plating solution comprises ferrous chloride, sodium chloride and boric acid, the concentration of ferrous ions in the iron plating solution is 500x(R+0.05)g / L, and the second plating layer has a thickness of 0.007-0.013mm. Specifically, the linear speed of the roller rotation can be any one of 19.5m / min, 19.7m / min, 19.9m / min, 20.1m / min, 20.3m / min, 20.5m / min or a range between any two of them; the thickness of the second plating layer can be any one of 0.007mm, 0.008mm, 0.009mm, 0.010mm, 0.011mm, 0.012mm, 0.013mm or a range between any two of them.
[0047] Preferably, the tungsten wire after the second iron plating is wound on two rollers for 20-24 turns and placed in the nickel plating solution for the third nickel plating, the distance between the adjacent two turns of the tungsten wire is 4R+0.2mm, the linear speed of the roller rotation is 17.5-18.5m / min, the tungsten wire is immersed in the iron plating solution by 7mm, the nickel plating solution comprises a nickel sulfate solution, the concentration of the nickel sulfate solution is 1000x(R+0.3)g / L, and the third plating layer has a thickness of 0.0075-0.0085mm. Specifically, the linear speed of the roller rotation can be any one of 17.5m / min, 17.7m / min, 17.9m / min, 18.1m / min, 18.3m / min, 18.5m / min or a range between any two of them; the thickness of the third plating layer can be any one of 0.0075mm, 0.0077mm, 0.0079mm, 0.0081mm, 0.0083mm, 0.0085mm or a range between any two of them.
[0048] Preferably, the tungsten wire after the third nickel plating is subjected to two ultrasonic cleanings, wherein the water temperature in the first ultrasonic cleaning is 70-75℃, and the water temperature in the second ultrasonic cleaning is 20-35℃. Specifically, the water temperature in the first ultrasonic cleaning can be any one of 70℃, 71℃, 72℃, 73℃, 74℃, 75℃ or a range between any two of them; the water temperature in the second ultrasonic cleaning can be any one of 20℃, 25℃, 30℃, 35℃ or a range between any two of them.
[0049] S3, heating the electroplated tungsten wire, the heating temperature is 450-500℃; specifically, the heating temperature can be any one of 450℃, 460℃, 470℃, 480℃, 490℃, 500℃ or a range between any two of them.
[0050] Preferably, the tungsten wire is heated in a heating furnace, the length of the heating furnace is 3.5-4 m, and the speed of the tungsten wire passing through the heating furnace is 19.5-20.5 m / min. Specifically, the length of the heating furnace can be any one of 3.5 m, 3.6 m, 3.7 m, 3.8 m, 3.9 m, 4 m or a range between any two of them; the speed of the tungsten wire passing through the heating furnace can be any one of 19.5 m / min, 19.7 m / min, 19.9 m / min, 20.1 m / min, 20.3 m / min, 20.5 m / min or a range between any two of them.
[0051] S4, the heated tungsten wire is placed in a saponification solution for saponification;
[0052] Preferably, the saponification solution comprises a sodium stearate solution, and the pH is 7.5-9.5. Specifically, the pH can be any one of 7.5, 8.0, 8.5, 9.0, 9.5 or a range between any two of them.
[0053] S5, the saponified tungsten wire is drawn by cold drawing to obtain a high-strength diamond wire bus;
[0054] Preferably, the diameter of the high-strength diamond wire bus is 26-35 μm. Specifically, the diameter of the high-strength diamond wire bus can be any one of 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm or a range between any two of them.
[0055] According to a second aspect of the present application, the present application provides a high-strength diamond wire bus prepared by the above-mentioned method.
[0056] The diameter of the high-strength diamond wire bus is not more than 35 μm, and the average strength of 10 times of tensile strength test is ≥6250 MPa.
[0057] When the diameter of the high-strength diamond wire bus is greater than 30 μm and less than or equal to 35 μm, the average strength of 10 times of tensile strength test is ≥6250 MPa.
[0058] When the diameter of the high-strength diamond wire bus is greater than or equal to 26 μm and less than or equal to 30 μm, the average strength of 10 times of tensile strength test is ≥6470 MPa.
[0059] The technical solutions of the present application are further described below in combination with specific embodiments.
[0060] Embodiment 1
[0061] A method for preparing a high-strength diamond wire bus, comprising the following steps:
[0062] S1, obtaining tungsten wire, electrolyzing, washing and drying the tungsten wire, the diameter of the tungsten wire is 0.062 mm, the electrolyte used in electrolysis is 27wt% NaOH solution, the current is 30 A, the speed of the tungsten wire passing through the electrolyte is 110 m / min; the water flow rate during washing is 55 L / min, and the temperature during drying is 290℃;
[0063] S2, winding the dried tungsten wire on two rollers for 11 turns and placing it in a nickel plating solution for the first time, the distance between the adjacent two turns of tungsten wire is 0.448 mm, the linear speed of the roller rotation is 25.0 m / min, the tungsten wire is immersed in the nickel plating solution for 7 mm, the nickel plating solution is a nickel sulfate solution, the concentration of the nickel sulfate solution is 262 g / L, and the first plating layer thickness obtained is 0.0018 mm;
[0064] Winding the tungsten wire after the first nickel plating on two rollers for 9 turns and placing it in a iron plating solution for the second time, the distance between the adjacent two turns of tungsten wire is 0.51 mm, the linear speed of the roller rotation is 19.8 m / min, the tungsten wire is immersed in the iron plating solution for 7 mm, the iron plating solution includes ferrous chloride, sodium chloride and boric acid, the concentration of ferrous ions in the iron plating solution is 56 g / L, and the second plating layer thickness obtained is 0.007 mm;
[0065] Winding the tungsten wire after the second iron plating on two rollers for 20 turns and placing it in a nickel plating solution for the third time, the distance between the adjacent two turns of tungsten wire is 0.448 mm, the linear speed of the roller rotation is 18.5 m / min, the tungsten wire is immersed in the iron plating solution for 7 mm, the nickel plating solution includes a nickel sulfate solution, the concentration of the nickel sulfate solution is 362 g / L, and the third plating layer thickness obtained is 0.008 mm;
[0066] The tungsten wire after the third nickel plating is subjected to two ultrasonic cleanings, wherein the water temperature during the first ultrasonic cleaning is 73℃, and the water temperature during the second ultrasonic cleaning is 20℃;
[0067] S3, placing the electroplated tungsten wire in a heating furnace for heating, the heating temperature is 450℃, the length of the heating furnace is 3.5 m, and the speed of the tungsten wire passing through the heating furnace is 20.5 m / min;
[0068] S4, placing the heated tungsten wire in a saponification solution for saponification, the saponification solution is a sodium stearate solution, and the pH is 8.5;
[0069] S5, drawing the saponified tungsten wire by cold drawing to obtain a high-strength diamond wire bus with a diameter of 28 μm, and the average strength of the 10 times tensile strength test is 6530 MPa.
[0070] Example 2
[0071] A preparation method of a high-strength diamond wire bus, comprising the following steps:
[0072] S1, obtaining a tungsten wire, electrolyzing, washing and drying the tungsten wire, the diameter of the tungsten wire is 0.071 mm, the electrolyte used in electrolysis is a 25wt% NaOH solution, the current is 40 A, the speed of the tungsten wire passing through the electrolyte is 90 m / min; the water flow rate during washing is 60 L / min, and the temperature during drying is 300 DEG C;
[0073] S2, winding the dried tungsten wire on two rollers for 10 turns and placing it in a nickel plating solution for the first time, the spacing between adjacent two turns of tungsten wire is 0.484 mm, the linear speed of the roller rotation is 25.5 m / min, the tungsten wire is immersed in the nickel plating solution for 9 mm, the nickel plating solution is a nickel sulfate solution, the concentration of the nickel sulfate solution is 271 g / L, and the first plating layer thickness obtained is 0.0022 mm;
[0074] Winding the tungsten wire after the first time of nickel plating on two rollers for 8 turns and placing it in a iron plating solution for the second time of iron plating, the spacing between adjacent two turns of tungsten wire is 0.56 mm, the linear speed of the roller rotation is 20.5 m / min, the tungsten wire is immersed in the iron plating solution for 7 mm, the iron plating solution includes ferrous chloride, sodium chloride and boric acid, the concentration of ferrous ions in the iron plating solution is 60.5 g / L, and the second plating layer thickness obtained is 0.013 mm;
[0075] Winding the tungsten wire after the second time of iron plating on two rollers for 23 turns and placing it in a nickel plating solution for the third time of nickel plating, the spacing between adjacent two turns of tungsten wire is 0.484 mm, the linear speed of the roller rotation is 18 m / min, the tungsten wire is immersed in the iron plating solution for 7 mm, the nickel plating solution includes a nickel sulfate solution, the concentration of the nickel sulfate solution is 371 g / L, and the third plating layer thickness obtained is 0.0075 mm;
[0076] The tungsten wire after the third time of nickel plating is subjected to two times of ultrasonic cleaning, wherein the water temperature during the first time of ultrasonic cleaning is 75 DEG C, and the water temperature during the second time of ultrasonic cleaning is 35 DEG C;
[0077] S3, placing the electroplated tungsten wire in a heating furnace for heating, the heating temperature is 480 DEG C, the length of the heating furnace is 4 m, and the speed of the tungsten wire passing through the heating furnace is 19.5 m / min;
[0078] S4, placing the heated tungsten wire in a saponification solution for saponification, the saponification solution is a sodium stearate solution, and the pH is 7.5;
[0079] S5, drawing the saponified tungsten wire by cold drawing to obtain a high-strength diamond wire bus with a diameter of 33 μm, and the average strength of 10 times of tensile strength test is 6290 MPa.
[0080] Example 3
[0081] A preparation method of a high-strength diamond wire bus, comprising the following steps:
[0082] S1, obtaining a tungsten wire, electrolyzing, washing and drying the tungsten wire, the diameter of the tungsten wire is 0.08 mm, the electrolyte used in electrolysis is a 35wt% NaOH solution, the current is 35 A, and the speed of the tungsten wire passing through the electrolyte is 100 m / min; the water flow rate during washing is 50 L / min, and the temperature during drying is 310℃;
[0083] S2, winding the dried tungsten wire on two rollers for 12 turns and placing it in a nickel plating solution for the first time, the spacing between adjacent two turns of tungsten wire is 0.52 mm, the linear speed of the roller rotation is 24.5 m / min, the tungsten wire is immersed in the nickel plating solution for 8 mm, the nickel plating solution is a nickel sulfate solution, the concentration of the nickel sulfate solution is 280 g / L, and the first plating layer thickness obtained is 0.0020 mm;
[0084] Winding the tungsten wire after the first time of nickel plating on two rollers for 10 turns and placing it in a iron plating solution for the second time of iron plating, the spacing between adjacent two turns of tungsten wire is 0.6 mm, the linear speed of the roller rotation is 20.1 m / min, the tungsten wire is immersed in the iron plating solution for 7 mm, the iron plating solution includes ferrous chloride, sodium chloride and boric acid, the concentration of ferrous ions in the iron plating solution is 65 g / L, and the second plating layer thickness obtained is 0.010 mm;
[0085] Winding the tungsten wire after the second time of iron plating on two rollers for 24 turns and placing it in a nickel plating solution for the third time of nickel plating, the spacing between adjacent two turns of tungsten wire is 0.52 mm, the linear speed of the roller rotation is 17.5 m / min, the tungsten wire is immersed in the iron plating solution for 7 mm, the nickel plating solution includes a nickel sulfate solution, the concentration of the nickel sulfate solution is 380 g / L, and the third plating layer thickness obtained is 0.0085 mm;
[0086] The tungsten wire after the third time of nickel plating is subjected to two times of ultrasonic cleaning, wherein the water temperature during the first time of ultrasonic cleaning is 70℃, and the water temperature during the second time of ultrasonic cleaning is 24℃;
[0087] S3, placing the electroplated tungsten wire in a heating furnace for heating, the heating temperature is 500℃, the length of the heating furnace is 3.8 m, and the speed of the tungsten wire passing through the heating furnace is 20.0 m / min;
[0088] S4, placing the heated tungsten wire in a saponification solution for saponification, the saponification solution is a sodium stearate solution, and the pH is 9.5;
[0089] S5, drawing the saponified tungsten wire by cold drawing to obtain a high-strength diamond wire bus with a diameter of 35 μm, and the average strength of 10 times of tensile strength test is 6360 MPa.
[0090] Example 4
[0091] A preparation method of a high-strength diamond wire bus, comprising the following steps:
[0092] S1, obtaining a tungsten wire, electrolyzing, washing and drying the tungsten wire, the diameter of the tungsten wire is 0.068 mm, the electrolyte used in electrolysis is a 32wt% NaOH solution, the current is 38A, the speed of the tungsten wire passing through the electrolyte is 105m / min; the water flow rate during washing is 54L / min, and the temperature during drying is 295℃;
[0093] S2, winding the dried tungsten wire on two rollers for 10 turns and placing it in a nickel plating solution for the first time, the spacing between the adjacent two turns of tungsten wire is 0.472mm, the linear speed of the roller rotation is 25.0m / min, the tungsten wire is immersed in the nickel plating solution for 7mm, the nickel plating solution is a nickel sulfate solution, the concentration of the nickel sulfate solution is 268g / L, and the first plating layer thickness obtained is 0.0021mm;
[0094] Winding the tungsten wire after the first time of nickel plating on two rollers for 9 turns and placing it in a iron plating solution for the second time of iron plating, the spacing between the adjacent two turns of tungsten wire is 0.54mm, the linear speed of the roller rotation is 20.5m / min, the tungsten wire is immersed in the iron plating solution for 7mm, the iron plating solution includes ferrous chloride, sodium chloride and boric acid, the concentration of ferrous ions in the iron plating solution is 59g / L, and the second plating layer thickness obtained is 0.012mm;
[0095] Winding the tungsten wire after the second time of iron plating on two rollers for 23 turns and placing it in a nickel plating solution for the third time of nickel plating, the spacing between the adjacent two turns of tungsten wire is 0.472mm, the linear speed of the roller rotation is 18m / min, the tungsten wire is immersed in the iron plating solution for 7mm, the nickel plating solution includes a nickel sulfate solution, the concentration of the nickel sulfate solution is 368g / L, and the third plating layer thickness obtained is 0.0082mm;
[0096] The tungsten wire after the third time of nickel plating is subjected to two times of ultrasonic cleaning, wherein the water temperature during the first time of ultrasonic cleaning is 73℃, and the water temperature during the second time of ultrasonic cleaning is 32℃;
[0097] S3, placing the electroplated tungsten wire in a heating furnace for heating, the heating temperature is 470℃, the length of the heating furnace is 4m, and the speed of the tungsten wire passing through the heating furnace is 19.6m / min;
[0098] S4, placing the heated tungsten wire in a saponification solution for saponification, the saponification solution is a sodium stearate solution, and the pH is 8;
[0099] S5, drawing the saponified tungsten wire by cold drawing to obtain a high-strength diamond wire bus with a diameter of 26μm, and the average strength of 10 times of tensile strength test is 6570MPa.
[0100] Comparative Example 1
[0101] Except that the diameter of the tungsten wire in step S1 is 0.15 mm, the rest is consistent with Example 1, and a tungsten wire with a diameter of 28 μm is prepared. The wire is frequently broken during the cold drawing process, and it is impossible to draw a tungsten wire with a diameter of 28 μm.
[0102] Comparative Example 2
[0103] Except that the first nickel plating in step S2 is not performed, the rest is consistent with Example 1, and the plating layer is easy to fall off. The wire is frequently broken during the cold drawing process, and it is impossible to draw a tungsten wire with a diameter of 28 μm.
[0104] Comparative Example 3
[0105] Except that the second iron plating and the third nickel plating in step S2 are not performed, the rest is consistent with Example 1. The wire is frequently broken during the cold drawing process, and it is impossible to draw a tungsten wire with a diameter of 28 μm.
[0106] Comparative Example 4
[0107] Except that step S3 is not performed, the rest is consistent with Example 1, and the tungsten wire prepared by drawing has a large diameter deviation.
[0108] Comparative Example 5
[0109] Except that step S4 is not performed, the rest is consistent with Example 1. The frictional resistance is large during the cold drawing process, and it is impossible to prepare a tungsten wire with a diameter of 28 μm.
[0110] Comparative Example 6
[0111] Except that the linear speed of the roller is 32 m / min during the third nickel plating in step S2, and the thickness of the third layer is 0.0018 mm, the rest is consistent with Example 1. The wire is frequently broken during the cold drawing process, and it is impossible to draw a tungsten wire with a diameter of 28 μm.
[0112] As can be seen from the examples and comparative examples, in the technical scheme of the present application, the nickel and iron are uniformly covered on the surface of the tungsten wire by plating nickel, iron, and then nickel on the surface of the tungsten wire, reducing the falling off of the plating layer and the probability of wire breakage. Heating the tungsten wire to 450-500 ℃ can obtain a tungsten wire with high diameter consistency. The soap dipping of the tungsten wire can reduce the resistance during drawing, thereby further reducing the probability of wire breakage.
[0113] The application provides a high-strength diamond wire bus and a preparation method thereof, and has the following beneficial effects: nickel and iron are plated on the surface of the tungsten wire, and heat diffusion is performed, so that the resistance in the cold drawing process is reduced, and the wire breaking rate in the cold drawing process is reduced; the fine tungsten wire is prepared through the cold drawing process, so that the energy consumption and environmental pollution are reduced, the diameter consistency and performance consistency are improved, the tensile strength and the qualified rate are significantly improved; through optimization of parameters, the high-strength diamond wire bus with a strength not less than 6250 MPa is obtained.
[0114] The above only describes the preferred embodiments of the application, and does not limit the patent scope of the application. Any equivalent structural transformation, direct / indirect application in other related technical fields, or direct / indirect application in other related technical fields based on the inventive concept of the application and the content of the specification are included in the patent protection scope of the application.
Claims
1. A method for preparing a high-strength diamond wire bus, characterized by, The preparation method comprises the following steps: S1, obtaining tungsten wire, electrolyzing, washing and drying the tungsten wire; S2, the tungsten wire after drying is electroplated three times, which are first plated with nickel, second plated with iron and third plated with nickel respectively; S3, heating the electroplated tungsten wire, the heating temperature is 450~500℃; S4, placing the heated tungsten wire in a saponification solution for saponification; S5, drawing the saponified tungsten wire by cold drawing to obtain the high-strength diamond wire busbar; In the step S1, the diameter of the tungsten wire is R, R=0.06~0.08mm; In the step S2, it comprises, S21, placing the dried tungsten wire in a nickel plating solution for first nickel plating, and the obtained first plating layer thickness is 0.0018~0.0022mm; S22, placing the tungsten wire after first nickel plating in an iron plating solution for second iron plating, and the obtained second plating layer thickness is 0.007~0.013mm; S23, placing the tungsten wire after second iron plating in a nickel plating solution for third nickel plating, and the obtained third plating layer thickness is 0.0075~0.0085mm; In the step S5, the diameter of the high-strength diamond wire busbar is 26~35μm.
2. The preparation method of the high-strength diamond wire busbar according to claim 1, wherein, After the step S23, it further comprises, S24, ultrasonic cleaning the tungsten wire after third nickel plating twice, wherein the water temperature is 70~75℃ in the first ultrasonic cleaning and 20~35℃ in the second ultrasonic cleaning; In the step S4, the saponification solution comprises a sodium stearyl acid solution, and the pH of the saponification solution is 7.5~9.
5.
3. The method of claim 1, wherein the high-strength diamond wire busbar is prepared by the steps of: In the step S1, the electrolyte used in electrolysis is a 25~35wt% NaOH solution, the current is 30~40A, and the speed of the tungsten wire through the electrolyte is 90~110m / min. 4. The method of claim 1, wherein the high-strength diamond wire busbar is prepared by the steps of: In the step S1, the water flow rate during washing is 50~60L / min, and the drying temperature is 290~310℃. 5. The preparation method of the high-strength diamond wire busbar according to claim 2, wherein, In the step S21, the tungsten wire is wound on two rollers for 10~12 turns, the spacing between adjacent two turns of tungsten wire is 4R+0.2mm, and the linear speed of roller rotation is 24.5~25.5m / min; In the step S22, the tungsten wire is wound on two rollers for 8~10 turns, the spacing between adjacent two turns of tungsten wire is 5R+0.2mm, and the linear speed of roller rotation is 19.5~20.5m / min; In the step S23, the tungsten wire is wound on two rollers for 20~24 turns, the spacing between adjacent two turns of tungsten wire is 4R+0.2mm, and the linear speed of roller rotation is 17.5~18.5m / min.
6. The preparation method of the high-strength diamond wire busbar according to claim 2, wherein, In the step S21, the tungsten wire is immersed in the nickel plating solution for 7~9mm; In the step S22, the tungsten wire is immersed in the iron plating solution for 7mm; In the step S23, the tungsten wire is immersed in the nickel plating solution by 7mm.
7. The method of claim 2, wherein the high-strength diamond wire bus is prepared by the method of any one of claims 1-8. In the step S21, the nickel plating solution comprises a nickel sulfate solution, and the concentration of the nickel sulfate solution is 1000x(R+0.2)g / L. In the step S22, the iron plating solution comprises ferrous chloride, sodium chloride and boric acid, and the concentration of ferrous ions in the iron plating solution is 500x(R+0.05)g / L. In the step S23, the nickel plating solution comprises a nickel sulfate solution, and the concentration of the nickel sulfate solution is 1000x(R+0.3)g / L.
8. The method of claim 1, wherein the high-strength diamond wire busbar is prepared by the steps of: In the step S3, the tungsten wire is heated in a heating furnace, the length of the heating furnace is 3.5-4m, and the speed of the tungsten wire passing through the heating furnace is 19.5-20.5m / min. 9. A high-strength diamond wire bus, characterized by, The high-strength diamond wire bus is prepared by the method of any one of claims 1-8.
10. The high-strength diamond wire busbar according to claim 9, characterized in that, The diameter of the high-strength diamond wire bus is not more than 35μm, and the average strength of 10 times of tensile strength test is ≥6250MPa.
Citation Information
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