Semiconductor chip appearance detection device

Abstract

The invention discloses a semiconductor chip appearance detection device, and belongs to the technical field of semiconductor appearance optical detection equipment. According to the semiconductor chip appearance detection device, the feeding mechanism is in communication connection with the bottom surface detection mechanism, so that the feeding mechanism can carry the to-be-detected piece according to the detection result of the bottom surface detection mechanism, the pose of the to-be-detected piece can be adjusted more accurately, and the to-be-detected piece is placed on the second carrying table; not only is the detection precision of the to-be-detected piece improved, but also the machine damage problems of scratches and the like of the to-be-detected piece in the carrying process can be avoided; meanwhile, the second driving module is in communication connection with the detection unit, so that the second driving module can drive the second carrying table to move according to the detection result of the detection unit, and the pose of the to-be-detected piece placed on the second carrying table can be further adjusted, so that the detection precision of the to-be-detected piece is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor appearance optical inspection equipment, and in particular to a semiconductor chip appearance inspection device. Background Art

[0002] In the power laser and optical communication chip manufacturing industry, after the wafer is dissociated into single tubes / bars or laser chips through COS packaging (COS packaging is a semiconductor packaging technology, namely chip on substrate / chip on submount), a strict appearance inspection is required, mainly to check for damage and contamination on the top and bottom surfaces and sides of the chip.

[0003] Currently, visual inspection is primarily performed manually during production. This labor-intensive process can easily cause visual fatigue, resulting in low inspection efficiency, making large-scale production difficult and prone to contact contamination. Some manufacturers also use automated optical inspection equipment to perform visual inspections on chips. However, the loading mechanism of this automated optical inspection equipment has low control precision, making it difficult to precisely align the chip with the inspection mechanism. This results in a low recognition rate for minor scratches and uneven coatings, and can easily lead to scratches and other mechanical damage to the chip during inspection, making it difficult to meet user needs. Summary of the Invention

[0004] The object of the present invention is to provide a semiconductor chip appearance inspection device, which can not only improve the inspection accuracy, but also avoid mechanical damage such as scratches on the test piece during transportation.

[0005] To achieve the above objectives, the following technical solutions are provided:

[0006] A semiconductor chip appearance inspection device, comprising:

[0007] A first loading mechanism, comprising a first loading platform and a first driving module, wherein the first loading platform is capable of placing a loading piece containing a workpiece to be tested, and the first driving module is capable of driving the first loading platform to move so as to adjust the posture of the workpiece to be tested on the first loading platform;

[0008] a second loading mechanism, the second loading mechanism comprising a second loading platform and a second driving module, the second loading platform being capable of placing the workpiece to be tested, and the second driving module being capable of driving the second loading platform to move so as to adjust the posture of the workpiece to be tested on the second loading platform;

[0009] A loading mechanism and a bottom surface detection mechanism, wherein the loading mechanism is capable of transporting the workpiece to be tested between the first carrier, the bottom surface detection mechanism, and the second carrier; the bottom surface detection mechanism is capable of photographing the bottom surface of the workpiece to be tested transported by the loading mechanism; and the loading mechanism is communicatively connected to the bottom surface detection mechanism;

[0010] A detection unit is provided, wherein the detection unit is capable of photographing the top surface and / or side surface of the test piece on the second stage; and the second driving module is communicatively connected to the detection unit.

[0011] As a preferred technical solution of the above-mentioned semiconductor chip appearance inspection device, the semiconductor chip appearance inspection device further includes a loading inspection mechanism, which is capable of photographing the test piece on the first stage;

[0012] The first driving module is communicatively connected to the feeding detection mechanism; and / or the feeding mechanism is communicatively connected to the feeding detection mechanism.

[0013] As an optimal technical solution for the above-mentioned semiconductor chip appearance inspection device, the loading detection mechanism includes a loading detection component 1; the loading mechanism includes a loading nozzle, a loading seat, a loading drive module 1 and a loading drive module 2, the loading drive module 1 can drive the loading seat to move, the loading drive module 2 and the loading detection component 1 are both arranged on the loading seat, and the loading drive module 2 can drive the loading nozzle to move.

[0014] As an optimal technical solution for the above-mentioned semiconductor chip appearance inspection device, the loading detection mechanism also includes a loading detection component 2 fixedly mounted above the first carrier, and the loading detection component 2 includes a loading vision module 2, a first light source and a second light source. The first light source is arranged between the loading vision module 2 and the first carrier, and the second light source is arranged on the first carrier and located below the carrier.

[0015] As a preferred technical solution of the above-mentioned semiconductor chip appearance inspection device, the clarity of the picture taken by the first loading inspection component is higher than the clarity of the picture taken by the second loading inspection component;

[0016] The first feeding drive module and the second feeding drive module are both communicatively connected to the first feeding detection component;

[0017] The first driving module and the first feeding driving module are both communicatively connected to the second feeding detection component.

[0018] As an optimal technical solution for the above-mentioned semiconductor chip appearance inspection device, the semiconductor chip appearance inspection device also includes a unloading mechanism and an unloading detection mechanism. The unloading mechanism is capable of transporting the test piece to unload the test piece on the second carrier. The unloading detection mechanism is capable of photographing the test piece on the second carrier. The unloading mechanism is communicatively connected to the unloading detection mechanism.

[0019] As an optimal technical solution of the above-mentioned semiconductor chip appearance inspection device, the semiconductor chip appearance inspection device also includes a blanking carrier capable of placing the test piece, and the blanking inspection mechanism can also photograph the blanking carrier; the blanking mechanism can transport the test piece between the second carrier and the blanking carrier.

[0020] As an optimal technical solution for the above-mentioned semiconductor chip appearance inspection device, the unloading mechanism includes a unloading nozzle, a unloading seat, an unloading drive module 1 and an unloading drive module 2. The unloading drive module 1 can drive the unloading seat to move, the unloading drive module 2 and the unloading detection mechanism are both arranged on the unloading seat, and the unloading drive module 2 can drive the unloading nozzle to move.

[0021] As a preferred technical solution of the above-mentioned semiconductor chip appearance inspection device, the inspection unit includes:

[0022] a top surface detection mechanism capable of photographing the top surface of the workpiece to be tested on the second stage;

[0023] A side detection mechanism is configured to capture a side surface of the workpiece on the second stage.

[0024] As a preferred technical solution of the above-mentioned semiconductor chip appearance inspection device, two side inspection mechanisms are provided, and the two side inspection mechanisms are respectively arranged on both sides of the second carrier, and the inspection ends of the two side inspection mechanisms are arranged opposite to each other.

[0025] As a preferred technical solution of the above-mentioned semiconductor chip appearance inspection device, the second carrier is provided with at least two loading positions for placing the test pieces.

[0026] As a preferred technical solution of the above-mentioned semiconductor chip appearance inspection device, the first carrier includes at least two connecting parts, and the at least two connecting parts are respectively used to connect with different types of carriers.

[0027] As a preferred technical solution of the above-mentioned semiconductor chip appearance inspection device, the first carrier is a ring structure; the first driving module includes:

[0028] a first translation driving module, wherein the first translation driving module is capable of driving the first stage to move along the Y direction;

[0029] a first rotation driving module, wherein the first rotation driving module is capable of driving the first stage to rotate around the Z direction;

[0030] A lifting member and a lifting drive module, wherein the lifting member is arranged in the central hole of the annular structure, and the lifting drive module can drive the lifting member to rise and fall along the Z direction;

[0031] The second translation driving module is capable of driving the ejecting member to move along the X direction.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] The semiconductor chip appearance inspection device of the present invention, by communicating with the loading mechanism and the bottom surface detection mechanism, can enable the loading mechanism to transport the workpiece to be tested according to the detection results of the bottom surface detection mechanism, and then can more accurately adjust the posture of the workpiece to be tested and place the workpiece to be tested on the second carrier, which is not only conducive to improving the detection accuracy of the workpiece to be tested, but also can avoid scratches and other mechanical damage problems on the workpiece to be tested during the transportation process; at the same time, the second driving module is communicated with the detection unit, which can enable the second driving module to drive the second carrier to move according to the detection results of the detection unit, and then can further adjust the posture of the workpiece to be tested placed on the second carrier to further improve the detection accuracy of the workpiece to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 Schematic diagram of the structure of a semiconductor chip appearance inspection device according to an embodiment of the present invention;

[0035] Figure 2 Schematic diagram of the structure of the feeding mechanism and the feeding detection component 1 in an embodiment of the present invention;

[0036] Figure 3 This is a structural diagram of the second feeding detection component in an embodiment of the present invention;

[0037] Figure 4 This is a schematic structural diagram of the first loading mechanism in an embodiment of the present invention;

[0038] Figure 5 Schematic diagram of the structure of the blanking mechanism and the blanking detection mechanism in the embodiment of the present invention;

[0039] Figure 6 Schematic diagram of the structure of the blanking carrier in an embodiment of the present invention;

[0040] Figure 7 Schematic diagram of the structure of the second loading mechanism in an embodiment of the present invention;

[0041] Figure 8 Schematic diagram of the structure of the bottom surface detection mechanism in an embodiment of the present invention;

[0042] Figure 9 Schematic diagram of the structure of the top surface detection mechanism in an embodiment of the present invention;

[0043] Figure 10 This is a schematic structural diagram of a side detection mechanism in an embodiment of the present invention;

[0044] Figure 11 Schematic diagram of the structure of another side detection mechanism in an embodiment of the present invention.

[0045] Reference numerals:

[0046] 1. Frame; 2. First loading mechanism; 21. First carrier; 22. First drive module; 221. First translation drive assembly; 222. First rotation drive assembly; 223. Ejector; 224. Ejector drive assembly; 225. Second translation drive assembly; 226. Film expansion assembly; 227. Adapter; 3. Second loading mechanism; 31. Second carrier; 311. Loading position; 3111. Loading nozzle; 32. Second drive module; 321. Second rotation drive assembly Rotation drive assembly; 322, third translation drive assembly; 33, carrier thread adjustment member 1; 34, carrier thread adjustment member 2; 4, loading mechanism; 41, loading nozzle; 42, loading seat; 431, loading translation drive assembly 1; 432, loading lifting drive assembly 1; 44, loading drive module 2; 51, bottom surface detection mechanism; 511, bottom surface camera; 512, bottom surface lens; 513, bottom surface light source; 514, bottom surface thread adjustment member; 52, top surface detection Detection mechanism; 521, top camera; 522, top lens; 523, top light source; 524, first thread adjustment member; 525, second thread adjustment member; 526, third thread adjustment member; 53, side detection mechanism; 531, side camera; 532, side lens; 533, side light source; 534, side detection drive assembly; 61, feeding detection assembly 1; 611, feeding camera 1; 612, feeding lens 1; 613, feeding light source; 62 , loading detection component 2; 621, first light source; 622, second light source; 623, loading camera 2; 624, loading lens 2; 7, unloading mechanism; 71, unloading nozzle; 72, unloading seat; 731, unloading translation drive component 1; 732, unloading lifting drive component 1; 74, unloading drive module 2; 8, unloading detection mechanism; 81, unloading camera; 82, unloading lens; 83, unloading light source; 91, unloading carrier; 92, carrier drive module. DETAILED DESCRIPTION

[0047] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0048] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0049] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0050] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0051] In the description of the present invention, it should be noted that, unless otherwise specified or limited, the terms "disposed" and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0052] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0053] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0054] like Figure 1-11 As shown, this embodiment provides a semiconductor chip appearance inspection device, including a frame 1, and a first loading mechanism 2, a second loading mechanism 3, a loading mechanism 4, a bottom surface inspection mechanism 51 and a detection unit all arranged on the frame 1. The first loading mechanism 2 includes a first carrier 21 and a first driving module 22. The first carrier 21 can place a carrier containing a test piece, and the first driving module 22 can drive the first carrier 21 to move to adjust the posture of the test piece on the first carrier 21; the second loading mechanism 3 includes a second carrier 31 and a second driving module 32. The second carrier 31 can place the workpiece to be tested, and the second driving module 32 can drive the second carrier 31 to move to adjust the posture of the workpiece to be tested on the second carrier 31; the loading mechanism 4 can transport the workpiece to be tested between the first carrier 21, the bottom surface detection mechanism 51 and the second carrier 31; the bottom surface detection mechanism 51 can photograph the bottom surface of the workpiece to be tested transported by the loading mechanism 4; the loading mechanism 4 is communicatively connected to the bottom surface detection mechanism 51; the detection unit can photograph the top surface and / or side surface of the workpiece to be tested on the second carrier 31; the second driving module 32 is communicatively connected to the detection unit.

[0055] The semiconductor chip appearance inspection device of this embodiment, by communicating with the loading mechanism 4 and the bottom surface detection mechanism 51, can enable the loading mechanism 4 to transport the workpiece to be tested according to the detection results of the bottom surface detection mechanism 51, and then can more accurately adjust the posture of the workpiece to be tested and place the workpiece to be tested on the second carrier 31, which is not only conducive to improving the detection accuracy of the workpiece to be tested, but also can avoid scratches and other mechanical damage problems on the workpiece to be tested during the transportation process; at the same time, the second driving module 32 is communicated with the detection unit, so that the second driving module 32 can drive the second carrier 31 to move according to the detection results of the detection unit, and then can further adjust the posture of the workpiece to be tested placed on the second carrier 31 to further improve the detection accuracy of the workpiece to be tested.

[0056] In this embodiment, the device under test is a bar / single tube, COS packaged power laser chip or optical chip. Exemplarily, the material carrier is a blue film tray or waffle box.

[0057] Optionally, the semiconductor chip appearance inspection apparatus further includes a loading detection mechanism capable of photographing the DUT on the first carrier 21; a first drive module 22 is communicatively connected to the loading detection mechanism. The loading detection mechanism photographs the DUT on the first carrier 21 to locate the DUT on the first carrier 21. The first drive module 22 then drives the first carrier 21 in motion based on the positioning result of the loading detection mechanism. This facilitates the loading mechanism 4 to more accurately pick up the DUT from the first carrier 21, reducing the risk of damage to the DUT, such as scratches, on the DUT.

[0058] Optionally, the loading mechanism 4 is communicatively connected to the loading detection mechanism, so that the loading mechanism 4 can move according to the positioning result of the loading detection mechanism, thereby picking up the test piece from the first carrier 21 more accurately, reducing the risk of mechanical damage such as scratches on the test piece.

[0059] Optionally, the feeding detection mechanism includes a feeding detection component 61; the feeding mechanism 4 includes a feeding nozzle 41, a feeding seat 42, a feeding drive module 1 and a feeding drive module 2 44, the feeding drive module 1 can drive the feeding seat 42 to move, the feeding drive module 2 44 and the feeding detection component 61 are both arranged on the feeding seat 42, and the feeding drive module 2 44 can drive the feeding nozzle 41 to move. By driving the loading seat 42 to move through the loading drive module 1, the position of the loading detection component 1 61 and the loading suction nozzle 41 can be adjusted synchronously; then the loading drive module 2 44 drives the loading suction nozzle 41 to move to further adjust the position of the loading suction nozzle 41, which not only enables the loading detection component 1 61 to take a clearer picture of the workpiece to be tested and improve the positioning accuracy of the workpiece to be tested, but also enables the loading suction nozzle 41 to align with the workpiece to be tested and pick up the workpiece to be tested more quickly and accurately, thereby reducing the risk of mechanical damage such as scratches on the workpiece to be tested and improving detection accuracy and efficiency.

[0060] Exemplarily, the loading nozzle 41 picks up the workpiece by vacuum adsorption.

[0061] Specifically, the loading drive module 1 includes a loading translation drive assembly 1 431 and a loading lift drive assembly 1 432. The driving end of the loading translation drive assembly 1 431 is connected to the fixed end of the loading lift drive assembly 1 432, and the driving end of the loading lift drive assembly 1 432 is connected to the loading base 42. The loading translation drive assembly 1 431 drives the loading base 42 to move in the X direction, thereby driving the loading nozzle 41 and the loading detection assembly 1 61 to move in the X direction. The loading lift drive assembly 1 432 drives the loading base 42 to rise and fall in the Z direction, thereby driving the loading nozzle 41 and the loading detection assembly 1 61 to rise and fall in the Z direction. For example, the loading lift drive assembly 1 432 uses a linear motor.

[0062] Furthermore, the second loading drive module 44 includes a second loading lift drive assembly and a first loading rotation drive assembly. The driving end of the second loading lift drive assembly is connected to the fixed end of the first loading rotation drive assembly, and the driving end of the first loading rotation drive assembly is connected to the loading nozzle 41. The second loading lift drive assembly drives the loading nozzle 41 to rise and fall in the Z direction, while the first loading rotation drive assembly drives the loading nozzle 41 to rotate about the Z direction. For example, the second loading lift drive assembly uses a linear motor, while the first loading rotation drive assembly uses a rotary motor.

[0063] Exemplarily, the loading detection component 61 includes a loading camera 611, a loading lens 612 and a loading light source 613 installed on the loading camera 611. The loading light source 613 illuminates the workpiece to be tested, which can improve the clarity of the picture taken by the loading camera 611.

[0064] Optionally, the feeding detection mechanism also includes a feeding detection component 2 62 fixedly mounted above the first carrier 21. The feeding detection component 2 62 includes a feeding vision module 2, a first light source 621, and a second light source 622. The first light source 621 is arranged between the feeding vision module 2 and the first carrier 21, and the second light source 622 is arranged on the first carrier 21 and is located below the carrier. By lighting the carrier with the first light source 621 and the second light source 622, the lighting requirements of different types of carriers can be met. For example, when the carrier is a blue film tray, the second light source 622 is used for lighting; when the carrier is a waffle box, the first light source 621 is used for lighting, so that the feeding vision module 2 can more clearly photograph the test piece on the blue film tray. Exemplarily, the feeding vision module 2 includes a feeding camera 2 623, and a feeding lens 2 624 installed on the feeding camera 2 623.

[0065] Optionally, the clarity of the picture taken by the loading detection component 1 61 is higher than the clarity of the picture taken by the loading detection component 2 62; the loading drive module 1 and the loading drive module 2 44 are both communicatively connected to the loading detection component 1 61; the first drive module 22 and the loading drive module 1 are both communicatively connected to the loading detection component 2 62. The workpiece to be tested on the first carrier 21 is pre-positioned by the loading detection component 2 62, and the first drive module 22 drives the first carrier 21 to move according to the positioning result of the loading detection component 2 62, and the loading drive module 1 drives the loading detection component 1 61 to move according to the positioning result of the loading detection component 2 62, so that the loading detection component 1 61 can be quickly and accurately aligned with the workpiece to be tested on the first carrier 21; then, the workpiece to be tested on the first carrier 21 is precisely positioned by the loading detection component 1 61, and the loading drive module 2 44 drives the loading nozzle 41 to move according to the positioning result of the loading detection component 1 61, so that the loading nozzle 41 can be quickly and accurately aligned with the workpiece to be tested on the first carrier 21, thereby improving the picking efficiency and accuracy.

[0066] Optionally, the first carrier 21 includes at least two connecting parts, and the at least two connecting parts are respectively used to connect with different types of carriers, thereby improving the versatility of the first carrier 21 and the convenience of connecting the first carrier 21 with different types of carriers.

[0067] Optionally, the connecting portion is detachably connected to the first carrier 21 , and then by replacing connecting portions of different sizes, the connecting portion can be matched with carriers of different sizes, thereby achieving greater versatility.

[0068] Specifically, the at least two connecting portions include a blue film connecting portion capable of connecting to a blue film tray. The at least two connecting portions also include a waffle box connecting portion capable of connecting to a waffle box. The semiconductor chip appearance inspection device of this embodiment is compatible with two commonly used loading methods in the industry: blue film loading and waffle box loading, providing greater versatility.

[0069] For example, by replacing the blue film connecting parts of different sizes, the first carrier 21 can be made compatible with 6-inch blue film iron rings, 8-inch blue film iron rings, 12-inch blue film iron rings, 6-inch blue film mother-and-child rings, and 8-inch blue film mother-and-child rings. By replacing the waffle box connecting parts of different sizes, the first carrier 21 can be made compatible with 2-inch waffle boxes and 4-inch waffle boxes.

[0070] Optionally, the first carrier 21 is a ring-shaped structure; the first driving module 22 includes a first translation driving component 221, a first rotation driving component 222, a lifting piece 223, a lifting piece driving component 224 and a second translation driving component 225. The first translation driving component 221 can drive the first carrier 21 to move along the Y direction; the first rotation driving component 222 can drive the first carrier 21 to rotate around the Z direction; the lifting piece 223 is arranged in the center hole of the ring structure, and the lifting piece driving component 224 can drive the lifting piece 223 to rise and fall along the Z direction; the second translation driving component 225 can drive the lifting piece 223 to move along the X direction, thereby not only being able to adjust the posture of the workpiece to be tested, but also enabling the lifting piece 223 to align with and lift each workpiece to be tested on the carrier, thereby improving the convenience and accuracy of the loading mechanism 4 in taking materials, and reducing the risk of mechanical damage problems such as scratches on the workpiece to be tested. It should be noted that the first platform 21 is driven to move in the Y direction by the first translation drive component 221, and the lifting member 223 is driven to move in the X direction by the second translation drive component 225, so that the first platform 21 and the lifting member 223 can move synchronously, which is conducive to improving detection efficiency.

[0071] Specifically, the driving end of the second translation driving assembly 225 is connected to the fixed end of the ejecting driving assembly 224 , and the driving end of the ejecting driving assembly 224 is connected to the ejecting member 223 .

[0072] For example, the first translation drive assembly 221, the ejection drive assembly 224, and the second translation drive assembly 225 are all linear motors. The first rotation drive assembly 222 includes a rotation motor, a drive gear, and a transmission gear. The motor shaft of the rotation motor is connected to the drive gear, which is engaged with the transmission gear. The transmission gear is sleeved on the outer side of the first carrier 21 and fixedly connected to the first carrier 21. The rotation motor drives the drive gear to rotate, which can drive the first carrier 21 to rotate through the transmission gear. Of course, the first rotation drive assembly 222 can also include a rotation motor, a drive sprocket, a transmission chain, and multiple transmission sprockets. The drive sprocket is connected to the motor shaft of the rotation motor. The multiple transmission sprockets are arranged on the first carrier 21 at intervals along the circumference of the first carrier 21. The multiple transmission sprockets are rotatably arranged on the first carrier 21. The chain is wound around the outer sides of the drive sprocket and the multiple transmission sprockets. The rotation motor drives the drive sprocket to rotate, which can drive the first carrier 21 to rotate through the transmission chain and the multiple transmission sprockets.

[0073] Optionally, the ejecting member 223 is provided with an ejecting nozzle, which absorbs the workpiece to be tested by vacuum to prevent the workpiece from shifting during the loading process.

[0074] Optionally, the first carrier 21 further includes a film expansion assembly 226, which can tighten the blue film on the blue film tray, thereby facilitating faster and more accurate material removal by the loading mechanism 4. The structure and working principle of the film expansion assembly 226 are prior art and will not be further described here.

[0075] Specifically, the first driving module 22 also includes an adapter seat 227, which is slidably arranged on the frame 1 along the Y direction, the driving end of the first translation driving component 221 is connected to the adapter seat 227, the first carrier 21 is rotatably arranged on the adapter seat 227 around the Z direction, the driving end of the first rotation driving component 222 is connected to the first carrier 21, and the adapter seat 227 is provided with a through hole, which is arranged opposite to the center hole of the first carrier 21 of the annular structure.

[0076] Furthermore, the second light source 622 is fixed to the frame 1, and the first translation drive component 221 can drive the adapter 227 to move along the Y direction, so that the second light source 622 can be aligned with the center hole of the first carrier 21, and then the blue film material tray placed on the second carrier 31 is illuminated by the second light source 622.

[0077] Furthermore, along the Y direction, the second light source 622 is located on one side of the lifting piece 223; the lifting drive assembly 224 can drive the lifting piece 223 to descend along the Z direction, and make the top of the lifting piece 223 lower than the bottom surface of the adapter 227, so that when the adapter 227 moves along the Y direction, the lifting piece 223 can be located on the outside of the through hole of the adapter 227, so that the lifting piece 223 will not block the second light source 622 from illuminating the blue film material tray.

[0078] Optionally, the semiconductor chip appearance inspection apparatus further includes a blanking mechanism 7 and a blanking detection mechanism 8. The blanking mechanism 7 is capable of transporting the test piece to be tested to unload the test piece from the second carrier 31. The blanking detection mechanism 8 is capable of photographing the test piece on the second carrier 31. The blanking mechanism 7 is communicatively connected to the blanking detection mechanism 8. By having the blanking detection mechanism 8 photograph the test piece on the second carrier 31 to position the test piece on the second carrier 31, the blanking mechanism 7 can more quickly and accurately pick up the test piece on the second carrier 31 based on the positioning result of the blanking detection mechanism 8, thereby reducing the risk of mechanical damage such as scratches on the test piece.

[0079] It should be noted that the blanking detection mechanism 8 can not only obtain the position and angle information of the test piece by photographing the test piece on the second carrier 31, but also detect the appearance of the test piece to determine whether the test piece has mechanical damage problems.

[0080] Exemplarily, the blanking detection mechanism 8 includes a blanking camera 81, a blanking lens 82 and a blanking light source 83 installed on the blanking camera 81. The blanking light source 83 illuminates the workpiece to be tested, which can improve the clarity of the picture taken by the blanking camera 81.

[0081] Optionally, the semiconductor chip appearance inspection device also includes a blanking carrier 91 on which the test piece can be placed, and the blanking inspection mechanism 8 can also photograph the blanking carrier 91; the blanking mechanism 7 can transport the test piece between the second carrier 31 and the blanking carrier 91, thereby enabling the blanking mechanism 7 to place the test piece on the blanking carrier 91 more accurately, thereby reducing the risk of mechanical damage such as scratches on the test piece.

[0082] Specifically, the unloading carrier 91 is used to place the blue film material tray or waffle box, and then the inspected parts to be tested can be directly placed on the blue film material tray or waffle box for unloading. The semiconductor chip appearance inspection device of this embodiment is compatible with two commonly used loading methods in the industry, namely blue film unloading and waffle box unloading, and has greater versatility.

[0083] It should be noted that the blanking detection mechanism 8 can also photograph the blanking carrier 91 by photographing the blanking carrier 91, so that after the blanking mechanism 7 places the blanking part on the blanking carrier 91, the blanking detection mechanism 8 photographs the blanking part on the blanking carrier 91, and then monitors the mechanical damage of the blanking part after it has gone through all the processes, thereby ensuring the qualification of the blanking part when it is blanked.

[0084] Optionally, the semiconductor chip appearance inspection device further includes a carrier drive module 92, which drives the unloading carrier 91 to move along the Y direction to achieve automatic unloading. Exemplarily, the carrier drive module 92 uses a linear motor.

[0085] Optionally, the unloading mechanism 7 includes an unloading nozzle 71, an unloading seat 72, an unloading drive module 1, and an unloading drive module 2 74. The unloading drive module 1 can drive the unloading seat 72 to move. The unloading drive module 2 74 and the unloading detection mechanism 8 are both arranged on the unloading seat 72. The unloading drive module 2 74 can drive the unloading nozzle 71 to move. By driving the unloading seat 72 to move by the unloading drive module 1, the posture of the unloading detection mechanism 8 and the unloading nozzle 71 can be synchronously adjusted; then, the unloading drive module 2 74 drives the unloading nozzle 71 to move, so as to further adjust the posture of the unloading nozzle 71. This not only enables the unloading detection mechanism 8 to more clearly photograph the workpiece to be tested, thereby improving the positioning accuracy of the workpiece to be tested, but also enables the unloading nozzle 71 to align with the workpiece to be tested and pick up the workpiece to be tested more quickly and accurately, thereby reducing the risk of mechanical damage such as scratches on the workpiece to be tested, and improving detection accuracy and detection efficiency.

[0086] Exemplarily, the unloading nozzle 71 takes the workpiece to be tested by vacuum suction.

[0087] Specifically, the unloading drive module 1 includes an unloading translation drive assembly 1 731 and an unloading lift drive assembly 1 732. The driving end of the unloading translation drive assembly 1 731 is connected to the fixed end of the unloading lift drive assembly 1 732, while the driving end of the unloading lift drive assembly 1 732 is connected to the unloading base 72. The unloading translation drive assembly 1 731 drives the unloading base 72 in the X direction, while the unloading lift drive assembly 1 732 drives the unloading base 72 in the Z direction. For example, both the unloading lift drive assembly 1 732 and the unloading translation drive assembly 1 731 utilize linear motors. The unloading translation drive assembly 1 731 and the loading translation drive assembly 1 731 utilize a single X-direction gantry, and control logic is used to achieve avoidance in loading and unloading movements.

[0088] Furthermore, the second unloading drive module 74 includes a second unloading lift drive assembly and a first unloading rotation drive assembly. The driving end of the second unloading lift drive assembly is connected to the fixed end of the first unloading rotation drive assembly, and the driving end of the first unloading rotation drive assembly is connected to the unloading nozzle 71. The second unloading lift drive assembly drives the unloading nozzle 71 to rise and fall in the Z direction, while the first unloading rotation drive assembly drives the unloading nozzle 71 to rotate in the Z direction. For example, the second unloading lift drive assembly uses a linear motor, while the first unloading rotation drive assembly uses a rotary motor.

[0089] Optionally, the unloading drive module 1 is communicatively connected with the detection unit, so that the unloading drive module 1 can drive the unloading detection mechanism 8 to move according to the shooting results of the detection unit, so that the unloading detection mechanism 8 can be aligned with the test piece on the second carrier 31 more quickly and accurately, thereby improving the detection efficiency.

[0090] Optionally, the second carrier 31 is provided with at least two loading positions 311 for placing the test pieces, so that each loading position 311 can alternately load, unload and test the test pieces, thereby improving the testing efficiency.

[0091] Optionally, the loading position 311 is provided with a loading nozzle 3111 , and the loading nozzle 3111 absorbs the test piece through vacuum to prevent the test piece from shifting during the detection process.

[0092] Optionally, the second drive module 32 includes a second rotation drive assembly 321 and a third translation drive assembly 322. The driving end of the second rotation drive assembly 321 can drive the second carrier 31 to rotate in the Z direction, and the third translation drive assembly 322 can drive the second carrier 31 to move in the X direction. Exemplarily, the second rotation drive assembly 321 is a rotary motor, and the third translation drive assembly 322 is a linear motor.

[0093] Optionally, the second carrier 31 is adjustable in position along the Y direction on the frame 1, so that the position of the second carrier 31 along the Y direction can be adjusted during assembly and debugging of the external light detection device to improve the alignment accuracy between the second carrier 31 and the top surface detection mechanism 52 and the side detection mechanism 53, thereby improving the detection accuracy.

[0094] Optionally, the second carrier 31 is adjustable in position along the Z direction on the frame 1, so that when the external light detection device is assembled and debugged, the position of the second carrier 31 along the Z direction can be adjusted to improve the alignment accuracy of the second carrier 31 and the top surface detection mechanism 52 and the side detection mechanism 53, thereby improving the detection accuracy.

[0095] Exemplarily, the second driving module 32 also includes a first connecting seat and a second connecting seat, the first connecting seat is movably provided on the driving end of the third translation driving component 322 along the Y direction, the second connecting seat is movably provided on the first connecting seat along the Z direction, the second carrier 31 is rotatably provided on the second connecting seat, the second rotation driving component 321 is fixed on the second connecting seat, and the driving end of the second rotation driving component 321 is connected to the second carrier 31.

[0096] Furthermore, the second loading mechanism 3 also includes a carrier thread adjustment member 33, the axial direction of the carrier thread adjustment member 33 is parallel to the Y direction, the carrier thread adjustment member 33 is threadedly connected to the first connecting seat, and one end of the carrier thread adjustment member 33 is rotatably connected to the driving end of the third translation drive assembly 322. By rotating the carrier thread adjustment member 33, the position of the first connecting seat along the Y direction can be adjusted with high adjustment accuracy, and the position of the second carrier 31 along the Y direction can be accurately adjusted.

[0097] Furthermore, the second loading mechanism 3 also includes a carrier thread adjustment part 2 34, the axial direction of the carrier thread adjustment part 2 34 is parallel to the Z direction, the carrier thread adjustment part 2 34 is threadedly connected to the second connecting seat, and one end of the carrier thread adjustment part 2 34 is rotatably connected to the first connecting seat. By rotating the carrier thread adjustment part 2 34, the position of the second connecting seat along the Z direction can be adjusted with high adjustment accuracy, thereby accurately adjusting the position of the second carrier 31 along the Z direction.

[0098] It should be noted that in order to improve the stability of the second carrier 31, after adjusting the positions of the first connecting seat and the second connecting seat, the first connecting seat and the driving end of the third translation drive assembly 322, the first connecting seat and the second connecting seat can be locked respectively through multiple locking components such as bolts.

[0099] Optionally, the bottom surface detection mechanism 51 includes a bottom surface vision module, which includes a bottom surface camera 511, and a bottom surface lens 512 and a bottom surface light source 513 installed on the bottom surface camera 511. By illuminating the workpiece to be tested on the loading nozzle 41 with the bottom surface light source 513, the clarity of the picture taken by the bottom surface camera 511 can be improved, thereby improving the detection accuracy.

[0100] Optionally, the bottom camera 511 is adjustable in position along the Y direction on the frame 1. By adjusting the position of the bottom camera 511 along the Y direction during installation and debugging of the external light detection device, it is beneficial to improve the alignment accuracy between the bottom camera 511 and the workpiece to be tested on the loading nozzle 41, thereby improving the detection accuracy.

[0101] Exemplarily, the bottom detection mechanism 51 also includes a bottom thread adjustment member 514, the axial direction of the bottom thread adjustment member 514 is parallel to the Y direction, the bottom thread adjustment member 514 is threadedly connected to the bottom camera 511, and one end of the bottom thread adjustment member 514 is rotatably connected to the frame 1. By rotating the bottom thread adjustment member 514, the position of the bottom camera 511 along the Y direction can be accurately adjusted.

[0102] Optionally, the inspection unit includes a top surface inspection mechanism 52 and a side surface inspection mechanism 53. The top surface inspection mechanism 52 can photograph the top surface of the workpiece under test on the second stage 31, and the side surface inspection mechanism 53 can photograph the side surface of the workpiece under test on the second stage 31. By inspecting the top surface and side surfaces of the workpiece under test by the top surface inspection mechanism 52 and the side surface inspection mechanism 53, respectively, not only can the appearance of the workpiece under test be inspected more comprehensively, but also it is conducive to improving inspection efficiency.

[0103] Optionally, the top surface detection mechanism 52 includes a top surface vision module, which includes a top surface camera 521, and a top surface lens 522 and a top surface light source 523 installed on the top surface camera 521. By illuminating the test piece on the second carrier 31 with the top surface light source 523, the clarity of the picture taken by the top surface camera 521 can be improved, thereby improving the detection accuracy.

[0104] Optionally, the top camera 521 is mounted on the frame 1 so that its position can be adjusted along the X direction. Optionally, the top camera 521 is mounted on the frame 1 so that its position can be adjusted along the Y direction. Optionally, the top camera 521 is mounted on the frame 1 so that its position can be adjusted along the Z direction. Adjusting the position of the top camera 521 along the X, Y, and Z directions during installation and commissioning of the external light detection device helps improve the alignment accuracy between the bottom camera 511 and the workpiece under test on the loading nozzle 41, thereby improving detection accuracy.

[0105] Exemplarily, the top surface detection mechanism 52 also includes a first support, a second support and a third support. The first support is movably provided on the frame 1 along the X direction, the second support is movably provided on the first support along the Y direction, and the third support is movably provided on the second support along the Z direction.

[0106] Furthermore, the top surface detection mechanism 52 also includes a first threaded adjustment member 524, which is threadedly connected to the first support. One end of the first threaded adjustment member 524 is rotatably connected to the frame 1. By rotating the first threaded adjustment member 524, the position of the first support along the X direction can be precisely adjusted. Furthermore, the top surface detection mechanism 52 also includes a second threaded adjustment member 525, which is threadedly connected to the second support. One end of the second threaded adjustment member 525 is rotatably connected to the first support. By rotating the second threaded adjustment member 525, the position of the second support along the Y direction can be precisely adjusted. Furthermore, the top surface detection mechanism 52 also includes a third threaded adjustment member 526, which is threadedly connected to the third support. One end of the third threaded adjustment member 526 is rotatably connected to the second support. By rotating the third threaded adjustment member 526, the position of the third support along the Z direction can be precisely adjusted. The position of the top camera 521 along the X, Y, and Z directions can be precisely adjusted by rotating the first, second, and third threaded adjustment members 524, 525, and 526. It should be noted that to improve the stability of the top camera 521, after adjusting the positions of the first, second, and third supports, the first support and the frame 1, the first support and the second support, and the second support and the third support can be locked using a plurality of locking assemblies such as bolts.

[0107] Optionally, the side detection mechanism 53 includes a side vision module, which includes a side camera 531, and a side lens 532 and a side light source 533 installed on the side camera 531. By illuminating the test piece on the second carrier 31 with the side light source 533, the clarity of the picture taken by the side camera 531 can be improved, thereby improving the detection accuracy.

[0108] Optionally, the side detection mechanism 53 further includes a side detection drive assembly 534 connected to the side camera 531. The side detection drive assembly 534 drives the side vision detection assembly to move along the Y direction, thereby facilitating improved alignment accuracy between the side camera 531 and the test object on the second stage 31, thereby improving detection accuracy. Exemplarily, the side detection drive assembly 534 is a linear motor.

[0109] Optionally, two side detection mechanisms 53 are provided, and the two side detection mechanisms 53 are respectively arranged on both sides of the second carrier 31, and the detection ends of the two side detection mechanisms 53 are arranged opposite to each other, so that the two sides of the workpiece to be tested can be detected simultaneously by the two side detection mechanisms 53, thereby improving the detection efficiency.

[0110] Exemplarily, the working steps of the semiconductor chip appearance inspection device of this embodiment are:

[0111] 1. Place the carrier on the first blue film carrier 21.

[0112] 2. The second loading camera 623 captures images of the material carrier on the first carrier 21 to analyze the position information of each piece to be tested on the material carrier and to number each piece to be tested.

[0113] 3. The first driving module 22 drives the first carrier 21 to move according to the position information of each test piece obtained by the loading camera 2 623 to adjust the position of the first carrier 21 along the Y direction and the angle around the Z direction, so that the loading camera 1 611 can take pictures of the test pieces on the first carrier 21 and the loading nozzle 41 can pick up the materials.

[0114] 4. The loading camera 611 takes a high-precision picture of the workpiece to be picked up on the first carrier 21 to analyze the position and angle information of the workpiece relative to the loading nozzle 41.

[0115] 5. The first driving module 22 drives the first carrier 21 to move according to the position and angle information of the workpiece to be tested obtained by the loading camera 611, so as to fine-tune the position of the first carrier 21 along the Y direction and the angle around the Z direction; at the same time, the loading translation driving component 431 drives the loading nozzle 41 to move along the X direction according to the position and angle information of the workpiece to be tested obtained by the loading camera 611, so as to fine-tune the position of the loading nozzle 41 along the X direction.

[0116] 6. The loading lifting drive component 432 drives the loading nozzle 41 to descend along the Z direction to suck the workpiece to be tested for material removal; it should be noted that after the loading nozzle 41 sucks the workpiece to be tested, the loading lifting drive component 432 can drive the loading nozzle 41 to rise along the Z direction, or the lifting drive component 224 can drive the lifting part 223 to descend, thereby avoiding interference between the workpiece to be tested and the carrier.

[0117] 7. The loading translation drive component 431 drives the loading nozzle 41 to translate along the X direction to the bottom camera, and the loading lifting drive component 432 drives the loading nozzle 41 to descend along the Z direction to the photo taking position of the bottom camera for image acquisition to analyze the position and angle information of the workpiece to be tested, as well as various appearance defects on the bottom surface of the workpiece to be tested.

[0118] 8. The loading translation drive assembly 1 431 and the loading rotation drive assembly 1 respectively drive the loading nozzle 41 to move according to the position and angle information of the workpiece to be tested obtained by the bottom camera, so as to adjust the position of the loading nozzle 41 along the X direction and the angle around the Z direction, thereby placing the workpiece to be tested on the second carrier 31. It should be noted that, in this embodiment, the second carrier 31 is provided with two loading positions 311, namely the first loading position 311 and the second loading position 311. After the loading nozzle 41 places the workpiece to be tested on the first loading position 311, the loading nozzle 41 returns to the first carrier 21 and picks up the next workpiece to be tested, and then places the next workpiece to be tested on the second loading position 311. In other words, by repeating the above steps 3 to 8, the loading of the second loading position 311 is completed.

[0119] 9. The second driving module 32 drives the second carrier 31 to rotate so that the DUT on the second carrier 31 is aligned with the top camera. The top camera captures an image of the DUT to determine the position and angle information of the DUT, as well as various appearance defects on the top surface of the DUT.

[0120] 10. The second driving module 32 drives the second stage 31 to move according to the position and angle information of the test piece obtained by the top camera, so as to adjust the position of the second stage 31 along the X direction and the angle around the Z direction, so as to facilitate the subsequent two side cameras 531 to collect and analyze the test piece.

[0121] 11. The side detection drive assembly 534 drives the side camera 531 to move along the Y direction to fine-tune the position of the side camera 531 along the Y direction. The two side cameras 531 take pictures of the test piece to analyze the various appearance defects on the side of the test piece.

[0122] 12. The second driving module 32 drives the second carrier 31 to move along the X direction to the unloading mechanism 7.

[0123] 13. The unloading camera 81 captures images of the DUT on the second carrier 31 to analyze the position and angle information of the DUT, as well as the appearance defects of the DUT, so that the semiconductor chip appearance inspection device can determine whether the DUT is damaged by the machine.

[0124] 14. The unloading drive module 1 and the unloading drive module 2 74 respectively drive the unloading nozzle 71 to move according to the position and angle information of the workpiece to be tested obtained by the unloading camera 81, so as to fine-tune the position of the unloading nozzle 71 along the X direction and the angle around the Z direction and pick up the workpiece to be tested.

[0125] 15. The unloading drive module 1 and the unloading drive module 2 74 drive the unloading nozzle 71 to move to the unloading carrier 91 , and the unloading camera 81 takes a picture of the unloading carrier 91 to confirm the accuracy of the unloading position.

[0126] 16. The unloading lifting drive assembly 732 drives the unloading nozzle 71 to descend and place the workpiece to be tested on the blue film material tray or waffle box on the unloading carrier 91. Then the unloading camera 81 takes an image of the workpiece to be tested placed in the blue film material tray or waffle box on the unloading carrier 91 to re-inspect the workpiece to be tested and confirm that the workpiece to be tested is not damaged during placement and removal.

[0127] The semiconductor chip appearance inspection device of this embodiment can not only perform high-efficiency, high-precision, and large-scale appearance defect inspection on bars, power laser chips, or optical chips to be tested, but also reduce the problem of mechanical damage to the tested parts. It is also compatible with the loading and unloading of blue film trays or waffle boxes, and is more versatile.

[0128] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A semiconductor chip appearance inspection device, characterized in that: include: A first loading mechanism, comprising a first loading platform and a first driving module, wherein the first loading platform is capable of placing a loading piece containing a workpiece to be tested, and the first driving module is capable of driving the first loading platform to move so as to adjust the posture of the workpiece to be tested on the first loading platform; a second loading mechanism, the second loading mechanism comprising a second loading platform and a second driving module, the second loading platform being capable of placing the workpiece to be tested, and the second driving module being capable of driving the second loading platform to move so as to adjust the posture of the workpiece to be tested on the second loading platform; A loading mechanism and a bottom surface detection mechanism, wherein the loading mechanism is capable of transporting the workpiece to be tested between the first carrier, the bottom surface detection mechanism, and the second carrier; the bottom surface detection mechanism is capable of photographing the bottom surface of the workpiece to be tested transported by the loading mechanism; and the loading mechanism is communicatively connected to the bottom surface detection mechanism; A detection unit is provided, wherein the detection unit is capable of photographing the top surface and / or side surface of the test piece on the second stage; and the second driving module is communicatively connected to the detection unit.

2. The semiconductor chip appearance inspection device according to claim 1, wherein: The semiconductor chip appearance inspection device further includes a loading inspection mechanism, which is capable of photographing the test piece on the first stage; The first driving module is communicatively connected to the feeding detection mechanism; and / or the feeding mechanism is communicatively connected to the feeding detection mechanism.

3. The semiconductor chip appearance inspection device according to claim 2, characterized in that: The feeding detection mechanism includes a feeding detection component 1; the feeding mechanism includes a feeding nozzle, a feeding seat, a feeding drive module 1 and a feeding drive module 2, the feeding drive module 1 can drive the feeding seat to move, the feeding drive module 2 and the feeding detection component 1 are both arranged on the feeding seat, and the feeding drive module 2 can drive the feeding nozzle to move.

4. The semiconductor chip appearance inspection device according to claim 3, characterized in that: The loading detection mechanism also includes a loading detection component 2 fixed above the first carrier, and the loading detection component 2 includes a loading vision module 2, a first light source and a second light source. The first light source is arranged between the loading vision module 2 and the first carrier, and the second light source is arranged on the first carrier and located below the carrier.

5. The semiconductor chip appearance inspection device according to claim 4, characterized in that: The clarity of the picture taken by the first loading detection component is higher than the clarity of the picture taken by the second loading detection component; The first feeding drive module and the second feeding drive module are both communicatively connected to the first feeding detection component; The first driving module and the first feeding driving module are both communicatively connected to the second feeding detection component.

6. The semiconductor chip appearance inspection device according to claim 1, wherein: The semiconductor chip appearance inspection device also includes a blanking mechanism and a blanking detection mechanism. The blanking mechanism can carry the test piece to blank the test piece on the second carrier, and the blanking detection mechanism can photograph the test piece on the second carrier. The blanking mechanism is communicatively connected to the blanking detection mechanism.

7. The semiconductor chip appearance inspection device according to claim 6, wherein: The semiconductor chip appearance inspection device further includes a blanking carrier capable of placing the test piece, and the blanking inspection mechanism is further capable of photographing the blanking carrier; the blanking mechanism is capable of transporting the test piece between the second carrier and the blanking carrier.

8. The semiconductor chip appearance inspection device according to claim 6, wherein: The unloading mechanism includes an unloading nozzle, an unloading seat, an unloading drive module 1 and an unloading drive module 2. The unloading drive module 1 can drive the unloading seat to move. The unloading drive module 2 and the unloading detection mechanism are both arranged on the unloading seat. The unloading drive module 2 can drive the unloading nozzle to move.

9. The semiconductor chip appearance inspection device according to claim 1, wherein: The detection unit comprises: a top surface detection mechanism capable of photographing the top surface of the workpiece to be tested on the second stage; A side detection mechanism is configured to capture a side surface of the workpiece on the second stage.

10. The semiconductor chip appearance inspection device according to claim 9, wherein: There are two side detection mechanisms, which are respectively arranged on both sides of the second carrier, and the detection ends of the two side detection mechanisms are arranged opposite to each other.

11. The semiconductor chip appearance inspection device according to any one of claims 1 to 10, characterized in that: The second carrier is provided with at least two loading positions for placing the test pieces.

12. The semiconductor chip appearance inspection device according to any one of claims 1 to 10, characterized in that: The first carrier includes at least two connecting parts, and the at least two connecting parts are respectively used to connect with different types of the material carriers.

13. The semiconductor chip appearance inspection device according to any one of claims 1 to 10, characterized in that: The first carrier is a ring-shaped structure; the first driving module includes: a first translation driving module, wherein the first translation driving module is capable of driving the first stage to move along the Y direction; a first rotation driving module, wherein the first rotation driving module is capable of driving the first stage to rotate around the Z direction; A lifting member and a lifting drive module, wherein the lifting member is arranged in the central hole of the annular structure, and the lifting drive module can drive the lifting member to rise and fall along the Z direction; The second translation driving module is capable of driving the ejecting member to move along the X direction.

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