Thermal stress distribution testing equipment for chip packaging material
By designing the thermal stress distribution test equipment for chip packaging materials, using bidirectional airflow and reversible heat control plate to adjust the heat flow, the accuracy and comprehensiveness of thermal stress distribution test in a closed environment is solved, and efficient thermal stress testing is achieved.
Patent Information
- Application Number
- CN202510825916.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-19
- Publication Date
- 2025-09-02
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
When conducting thermal stress distribution tests for chip packaging materials in a closed environment, there are problems with local heat accumulation and excessive temperature gradients, resulting in inaccurate testing and the prior art cannot fully cover thermal stress distribution at double limit temperatures.
A thermal stress distribution testing equipment for chip packaging materials is designed, including a testing mechanism, a heat control mechanism and a regulating mechanism. By precisely controlling the inlet and out of heat, the heat flow inside and outside the air hood is adjusted by using bidirectional airflow and a reversible heat control plate to achieve convection enhancement and temperature control.
Effectively avoid contact between chip packaging materials and external air, prevent oxidation, isolate high-temperature damage, enhance heat exchange, ensure the accuracy and universality of the test, and is suitable for testing under multiple temperature conditions.
Smart Images
Figure CN120577346A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of thermal stress distribution testing, in particular to a thermal stress distribution testing device for chip packaging materials. Background Art
[0002] Chip packaging materials are key materials that protect chips, provide electrical connections, and assist in heat dissipation. Their performance directly affects the reliability, lifespan, and stability of the chip. Therefore, thermal stress distribution tests are required on chip packaging materials to detect their compliance.
[0003] When conducting thermal stress distribution tests on chip packaging materials inside household appliances like computers and televisions, the chip's full-load temperature is approximately 60°C to 90°C. In extreme cases (such as equipment overload, poor heat dissipation, or high-temperature environments), it can briefly reach 100°C to 110°C. Therefore, to simulate and test the thermal management conditions that chip packaging materials may encounter in actual operating and usage environments, thermal stress distribution testing is necessary in a sealed environment. However, conducting thermal insulation tests in a confined space can result in high heat levels in some areas early on, followed by uneven heating later on, leading to localized heat accumulation and excessive temperature gradients.
[0004] In addition, the full load temperature alone cannot accurately determine the entire thermal stress distribution range of the chip packaging material. Therefore, it is necessary to test the material at dual extreme temperatures. Summary of the Invention
[0005] The present invention provides a thermal stress distribution testing device for chip packaging materials to solve the problems raised in the above background technology.
[0006] To achieve the above-mentioned object, the present invention provides the following technical solutions: a thermal stress distribution testing device for chip packaging materials, comprising a testing mechanism for placing and testing chip packaging materials; A heat control mechanism for precisely controlling incoming and outgoing heat, the heat control mechanism being disposed on top of the testing mechanism; An adjusting mechanism for adjusting the position of some components inside the heat control mechanism, wherein there are two heat control mechanisms, one for air intake and one for air outlet; The regulating mechanism is arranged between the two heat control mechanisms; The testing mechanism includes a testing platform, wherein the interior of the testing platform is a place for heat flow management, a through hole is opened at the center of the testing platform, and a notch groove is opened at the bottom of the inner cavity of the testing platform.
[0007] Preferably, a collar plate is inserted into the center of the test platform, and the bottom of the collar plate is fixedly connected to a chassis, wherein the bottom of the chassis is fitted into the notch groove.
[0008] Preferably, the inner portion of the collar plate is slidably adapted to be fitted with an embedded ring plate, the top of the embedded ring plate is connected to a top plate via fasteners, and a placement net is fixedly installed on the bottom of the top plate; The top plate drives the embedded ring plate to deflect counterclockwise, so that the embedded ring plate extends outward from the sleeve ring plate, and the embedded ring plate and the sleeve ring plate provide a sealed space for the chip packaging material.
[0009] Preferably, the adjustment mechanism includes a connecting rod, a center rod is fixedly installed on the top of the connecting rod, a No. 1 driver is fixedly installed on the top of the center rod, the output end of the No. 1 driver is fixedly connected to a No. 1 gear, and the top of the No. 1 gear is fixedly connected to a No. 1 rotating plate.
[0010] Preferably, the outer side of the No. 1 gear is meshed with a No. 2 gear, the No. 2 gear is rotatably mounted on the top of the No. 1 driver, and a No. 2 rotating plate is fixedly mounted on the top of the No. 2 gear; A No. 2 driver is fixedly mounted on the top of the No. 1 driver, and a transition plate is provided on the top of the No. 2 driver housing.
[0011] Preferably, the bottoms of the first rotating plate and the second rotating plate are fixedly mounted with compensation bars, and the bottom ends of the compensation bars are fixedly connected with tough connecting blocks; The first rotating plate and the second rotating plate are located on a horizontal plane at the same height.
[0012] Preferably, the heat control mechanism includes an air hood, the bottom of the air hood is fixedly connected to the top of the test platform, and the outer side of the air hood is fixedly connected to the connecting rod; An inner connecting frame is fixedly connected to the interior of the air hood, a motor is provided at the center of the inner connecting frame, and a fan is fixedly connected to the output end of the motor.
[0013] Preferably, heat control plates are inserted on both sides of the gas hood, wherein a semicircular hole is opened at one end of the heat control plate inside the gas hood, and an inclined plate is fixedly connected to the end of the heat control plate without the semicircular hole; The outer side of the heat control plate is fixedly connected to the tough connecting block; In addition, the semicircular hole is used to provide a certain flow space in the inner cavity of the gas mask.
[0014] Preferably, a telescopic rod is fixedly installed on the outside of the gas hood, a No. 1 sleeve rod is fixedly connected to the outside of the output end of the telescopic rod, a return spring is fixedly connected to the outside of the No. 1 sleeve rod, the bottom end of the return spring is fixedly connected to the fixed end of the telescopic rod, and a compensation block is fixedly connected to the end of the No. 1 sleeve rod away from the telescopic rod; The compensation block is fitted into the semicircular hole, and the bottom of the compensation block is extruded and fitted into the inclined surface of the inclined panel.
[0015] Preferably, the outer side of the output end of the telescopic rod is fixedly connected to a No. 2 sleeve rod, and the upper and lower sides of the No. 2 sleeve rod are fixedly connected to a heat insulating tough sheet, and the end of the heat insulating tough sheet away from the No. 2 sleeve rod is fixedly connected to the gas hood, and a filter is provided on the top of the inner cavity of the gas hood; The top end of the second sleeve rod is fixedly connected to a toughness bar, the outer side of the toughness bar is fixedly connected to a multi-link rod, and the top end of the toughness bar is fixedly connected to a blocking plate; A fixed shaft is fixedly connected inside the filter holes of the filter screen, and the outer side of the fixed shaft is rotatably connected to the baffle plate. Circular tubes are symmetrically connected to both sides of the top of the baffle plate.
[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. By quickly placing the chip packaging material and preventing it from excessive contact with the outside air and causing oxidation, which would affect the thermal stress test results; it also serves to isolate the high temperature in the test platform from the chip packaging material by rotating the top plate counterclockwise when the chip packaging material is overheated or damaged, thus preventing secondary damage; in addition, the test mechanism is easy to install and disassemble and has strong mobility.
[0017] 2. One fan is used for suction and the other for blowing. Thus, the suction and blowing fans form a directional airflow to enhance heat exchange through forced convection and eliminate dead corners to cover the entire space of the test platform.
[0018] 3. As the heat control plates extend outward, the heat entering the air hood will increase significantly. Conversely, the other set of heat control plates will extend inward, causing the air outlet of the other air hood to shrink, thereby increasing the air intake and reducing the air outlet, thereby indirectly increasing the internal temperature of the test platform, and vice versa.
[0019] 4. By reversely controlling the heat inlet and outlet ports, that is, when the heat inlet is large, the heat outlet will be small, thereby performing multiple tests on chip packaging materials at full load temperature and extreme temperature, making the test more illustrative and universal. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 This is a schematic diagram of the external structure of a thermal stress distribution testing device for chip packaging materials according to the present invention.
[0021] Figure 2 It is a schematic diagram of the overall cross-sectional structure of the present invention.
[0022] Figure 3 It is a structural schematic diagram of the testing mechanism of the present invention.
[0023] Figure 4 It is a schematic diagram of the full cross-section structure of the testing mechanism of the present invention.
[0024] Figure 5 Schematic diagram of the internal structure of the testing mechanism of the present invention.
[0025] Figure 6 It is a structural schematic diagram of the adjustment mechanism of the present invention.
[0026] Figure 7 It is an enlarged structural schematic diagram of the adjustment mechanism of the present invention.
[0027] Figure 8 It is an enlarged structural diagram of the central component of the adjustment mechanism of the present invention.
[0028] Figure 9 It is a structural schematic diagram of the heat control mechanism of the present invention.
[0029] Figure 10 It is a schematic cross-sectional structural diagram of the heat control mechanism of the present invention.
[0030] Figure 11 It is a schematic diagram of the full cross-section structure of the gas hood of the present invention.
[0031] Figure 12 It is an enlarged structural diagram of some components of the heat control mechanism of the present invention.
[0032] Figure 13 It is a cross-sectional enlarged structural schematic diagram of some components of the heat control mechanism of the present invention.
[0033] In the figure: 1. Test mechanism; 2. Heat control mechanism; 3. Adjustment mechanism; 11. Test platform; 12. Notch; 13. Ring plate; 14. Base plate; 15. Ring plate; 16. Top plate; 17. Placement net; 31. Connecting rod; 32. Center rod; 33. Driver No. 1; 34. Gear No. 1; 35. Turntable No. 1; 36. Gear No. 2; 37. Turntable No. 2; 38. Driver No. 2; 39. Transition plate; 3 0. Compensation strip; 301. Tough connecting block; 21. Air hood; 22. Inner connecting frame; 23. Motor; 24. Fan; 25. Heat control plate; 26. Inclined panel; 27. Telescopic rod; 28. No. 1 sleeve rod; 29. Return spring; 20. Compensation block; 41. No. 2 sleeve rod; 42. Insulation tough sheet; 43. Tough strip; 44. Multi-link; 45. Filter; 46. Fixed shaft; 47. Blocking plate; 48. Round tube. DETAILED DESCRIPTION
[0034] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments. It should be noted that the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0035] See also Figures 1 to 13 , the present invention provides a technical solution: Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 As shown, it includes a testing mechanism 1 for placing and testing chip packaging materials; A heat control mechanism 2 for precisely controlling incoming and outgoing heat, the heat control mechanism 2 being disposed on top of the testing mechanism 1; An adjusting mechanism 3 for adjusting the position of some components inside the heat control mechanism 2, wherein there are two heat control mechanisms 2, one for air intake and one for air outlet; The regulating mechanism 3 is arranged between the two heat control mechanisms 2; The testing mechanism 1 includes a testing platform 11 , wherein the interior of the testing platform 11 is a place for heat flow management. A through hole is opened in the center of the testing platform 11 , and a notch groove 12 is opened at the bottom of the inner cavity of the testing platform 11 .
[0036] A collar plate 13 is inserted into the center of the test platform 11, and a chassis 14 is fixedly connected to the bottom of the collar plate 13, wherein the bottom of the chassis 14 is fitted into the notch 12; The inner part of the ring plate 13 is slidably adapted to be fitted with an inserting ring plate 15. The top of the inserting ring plate 15 is connected to a top plate 16 via fasteners. A placement net 17 is fixedly installed at the bottom of the top plate 16. By lifting the top plate 16 upward, the entire test mechanism 1 is exposed upward from the test platform 11. Then, the fasteners that fasten the inserting ring plate 15 and the top plate 16 are loosened, so that the top plate 16 with the placement net 17 extends upward from the space enclosed by the inserting ring plate 15 and the ring plate 13. Then, the chip package to be tested is placed. The material is placed on the placement net 17, and the placement net 17 is placed back into the space enclosed by the embedded ring plate 15 and the collar plate 13. At the same time, the top plate 16 is re-locked with the embedded ring plate 15 using fasteners. Then, the top plate 16 is deflected clockwise so that the embedded ring plate 15 is received in the collar plate 13. At the same time, the top plate 16 will coincide with the shape of the top of the collar plate 13. Finally, the test mechanism 1 is placed into the test platform 11, and the bottom plate 14 is engaged with the notch groove 12, and the top plate 16 is engaged with the hole at the top center of the test platform 11.
[0037] The above steps serve to quickly place the chip packaging material and prevent it from being oxidized due to excessive contact with the outside air, which may affect the thermal stress test results. At the same time, when the chip packaging material is overheated or damaged, the top plate 16 is rotated counterclockwise to isolate the high temperature heat in the test platform 11 from the chip packaging material to avoid secondary damage. In addition, the test mechanism 1 is easy to install and disassemble and has strong mobility.
[0038] The top plate 16 drives the embedded ring plate 15 to deflect counterclockwise, so that the embedded ring plate 15 extends outward from the sleeve ring plate 13, and the embedded ring plate 15 and the sleeve ring plate 13 provide a sealed space for the chip packaging material.
[0039] like Figure 6 、 Figure 7 and Figure 8 As shown, the adjustment mechanism 3 includes a connecting rod 31, a center rod 32 is fixedly mounted on the top of the connecting rod 31, a first driver 33 is fixedly mounted on the top of the center rod 32, an output end of the first driver 33 is fixedly connected to a first gear 34, and a top of the first gear 34 is fixedly connected to a first rotating plate 35; The outer side of the No. 1 gear 34 is meshed with the No. 2 gear 36 , which is rotatably mounted on the top of the No. 1 driver 33 , and a No. 2 rotating plate 37 is fixedly mounted on the top of the No. 2 gear 36 ; A second driver 38 is fixedly mounted on top of the first driver 33, and a transition plate 39 is provided on the top of the housing of the second driver 38. When the chip packaging material placed in the test platform 11 is subjected to a thermal stress test using a balanced temperature, a filter 45 provided on the top of the inner cavity of the air hood 21 will filter out impurities. In addition, most chip packaging materials are used in a sealed environment, and the full load temperature is between 60°C and 90°C, while the extreme temperature is between 100°C and 110°C. The balanced temperature here is approximately 80°C. When thermal stress is required at the extreme temperature of the chip packaging material, the first and second drivers 33 and 38 need to be activated separately, causing the first gear 34 connected to the output end of the first driver 33 to rotate counterclockwise. The rotation angle is determined from a top-down perspective, and the first rotating plate 35 fixed to the top of the first gear 34 will also deflect counterclockwise. In addition, the outer side of the first gear 34 is meshed with the second gear 36 for transmission, so the second gear The wheel 36 will cause the second turn plate 37 to deflect clockwise, wherein the first gear 34 and the second gear 36 are divided into two groups. The above shows the lower group, and the upper group is set on the transition plate 39 and controlled by the second driver 38, thereby making the lower first turn plate 35 and the upper adjacent second turn plate 37 deflect counterclockwise and clockwise respectively. Similarly, the lower second turn plate 37 and the upper adjacent first turn plate 35 deflect clockwise and counterclockwise respectively.
[0040] The lower No. 1 rotating plate 35 and the adjacent upper No. 2 rotating plate 37 are both indirectly connected to the same heat control mechanism 2.
[0041] The bottom of the No. 1 rotating plate 35 and the No. 2 rotating plate 37 are fixedly mounted with a compensation bar 30, and the bottom end of the compensation bar 30 is fixedly connected with a tough connecting block 301; The first rotating plate 35 and the second rotating plate 37 are located on the same horizontal plane.
[0042] like Figure 9 、 Figure 10 、 Figure 11 、 Figure 12 and Figure 13 As shown, the heat control mechanism 2 includes an air hood 21, the bottom of the air hood 21 is fixedly connected to the top of the test platform 11, and the outer side of the air hood 21 is fixedly connected to the connecting rod 31; The inside of the air hood 21 is fixedly connected to an inner connecting frame 22, and a motor 23 is provided at the center of the inner connecting frame 22. The output end of the motor 23 is fixedly connected to a fan 24; by starting the motor 23, the fan 24 connected to its output end will rotate, and then suction will be generated in the air hood 21, and the heat transferred from the outside will be sucked into it until it enters the test platform 11 to perform thermal stress testing on the chip packaging material. There are two heat control mechanisms 2, and one fan 24 is used for suction and the other fan 24 is used for blowing. Therefore, the suction + blowing fans 24 form a directional airflow to force convection to enhance heat exchange, and eliminate airflow dead corners to cover the entire space of the test platform 11.
[0043] Heat control plates 25 are inserted on both sides of the air hood 21, wherein a semicircular hole is opened at one end of the heat control plate 25 inside the air hood 21, and an inclined plate 26 is fixedly connected to the end of the heat control plate 25 without the semicircular hole; by deflecting the No. 1 rotating plate 35 below and the adjacent No. 2 rotating plate 37 above counterclockwise and clockwise respectively, the compensation strips 30 fixedly connected to the bottom thereof will deflect in the opposite direction with the tough connecting block 301, and deflect outward synchronously, wherein the compensation strips 30 and the tough connecting block 301 are both elastic, and the outer side of the tough connecting block 301 is connected to the heat control plate 25, so The heat control plate 25 is then withdrawn from the air hood 21 until the semicircular hole formed on the surface of the heat control plate 25 engages with the compensation block 20. The semicircular hole has an angled top, and the compensation block 20 engages with the angled portion. This allows the compensation block 20 to slowly move upward and away from the angled portion when the heat control plate 25 is reset and re-enters the air hood 21. The compression between the compensation block 20 and the angled portion causes the compensation block 20 to disengage from the angled portion until it rests on the top horizontal surface of the compensation block 20. The compensation block 20 serves to seal the heat control plate 25 and prevent heat from seeping out through the semicircular hole. Furthermore, the semicircular hole prevents the two compensation blocks 20 from moving inward simultaneously and completely seals the interior of the air hood 21.
[0044] As the heat control plates 25 extend outward, the amount of heat entering the air hood 21 will greatly increase. On the contrary, the other set of heat control plates 25 will extend inward, causing the air outlet of the other air hood 21 to shrink, thereby increasing the air intake and reducing the air outlet, thereby indirectly increasing the internal temperature of the test platform 11.
[0045] The outer side of the heat control plate 25 is fixedly connected to the tough connecting block 301; In addition, the semicircular hole is used to provide a certain flow space in the inner cavity of the gas mask 21; A telescopic rod 27 is fixedly installed on the outside of the air hood 21. The outside of the output end of the telescopic rod 27 is fixedly connected to a No. 1 sleeve rod 28. The outside of the No. 1 sleeve rod 28 is fixedly connected to a return spring 29. The bottom end of the return spring 29 is fixedly connected to the fixed end of the telescopic rod 27. The end of the No. 1 sleeve rod 28 away from the telescopic rod 27 is fixedly connected to the compensation block 20. The compensation block 20 is fitted into the semicircular hole, and the bottom of the compensation block 20 is squeezed into the inclined surface of the inclined plate 26; The outer side of the output end of the telescopic rod 27 is fixedly connected to a second sleeve rod 41. The upper and lower sides of the second sleeve rod 41 are fixedly connected to a heat-insulating tough sheet 42. The end of the heat-insulating tough sheet 42 away from the second sleeve rod 41 is fixedly connected to the gas hood 21. A filter screen 45 is provided on the top of the inner cavity of the gas hood 21. The top of the second sleeve rod 41 is fixedly connected with a toughness bar 43, the outer side of the toughness bar 43 is fixedly connected with a multi-link 44, and the top of the toughness bar 43 is fixedly connected with a baffle plate 47; the heat control plate 25 of the air inlet moves outward, so that the compensation block 20 is embedded in the semicircular hole, so the compensation block 20 will move downward a certain distance to fit with the semicircular hole, wherein the top of the compensation block 20 is connected to the output end of the telescopic rod 27 through the first sleeve rod 28, wherein the reset spring 29 connected to the first sleeve rod 28 plays the role of resetting it, so the first sleeve rod 28 will carry the output of the telescopic rod 27 The end is retracted into the fixed end. In addition, the outer side of the output end of the telescopic rod 27 is also fixedly connected to the No. 2 sleeve rod 41. Therefore, the No. 2 sleeve rod 41 will move downward with the tough strip 43, and respectively stretch and compress the insulating tough sheets 42 arranged on the upper and lower sides thereof, wherein the insulating tough sheets 42 have elastic and heat-insulating functions. In addition, the top of the tough strip 43 is connected to the baffle plate 47, so the baffle plate 47 will deflect downward through the fixed shaft 46 and gradually tend to a vertical state, thereby increasing the inner diameter of the filter holes on the surface of the filter screen 45, making it easier for more heat to enter the air hood 21.
[0046] The filter mesh 45 has a fixed shaft 46 fixedly connected to the inside of the filter mesh 45. The outside of the fixed shaft 46 is rotatably connected to the baffle plate 47. Circular tubes 48 are symmetrically connected to both sides of the top of the baffle plate 47. Furthermore, when the heat control plate 25 at the air inlet is retracted into the air hood 21, the inclined plate 26 fixedly connected to the outside of the heat control plate 25 squeezes the compensation block 20, causing it to move upward. Simultaneously, the heat control plate 25 reduces the flow range within the air hood 21 to reduce the amount of heat entering. Simultaneously, the toughness strip 43 moves upward along with the second sleeve rod 41, causing the baffle plate 47 to deflect upward via the fixed shaft 46 and gradually become horizontal, thereby reducing the inner diameter of the filter mesh 45 surface pores and allowing less energy to enter the air hood 21. The circular tubes 48 arranged on both sides of the top of the baffle plate 47 serve to collect and process impurities. The gap between the circular tubes 48 for feeding is small, while the storage space is large.
[0047] By reversely controlling the heat inlet and outlet holes, that is, when the heat inlet hole is large, the heat outlet hole will be small, thereby performing multiple tests on chip packaging materials at full load temperature and extreme temperature, making the test more illustrative and universal.
[0048] When the present invention is in use: first, the top plate 16 is lifted upward, so that the entire test mechanism 1 is exposed upward from the test platform 11, and then the fasteners that fasten the embedding ring plate 15 and the top plate 16 are loosened, so that the top plate 16 and the placement net 17 are extended upward from the space enclosed by the embedding ring plate 15 and the collar plate 13, and then the chip packaging material to be tested is placed on the placement net 17, and the placement net 17 is placed back into the space enclosed by the embedding ring plate 15 and the collar plate 13, and at the same time, the top plate 16 and the embedding ring plate 15 are locked together again using fasteners, and then the top plate 16 is deflected clockwise to retract the embedding ring plate 15 into the collar plate 13, and the top plate 16 is coincident with the shape of the top of the collar plate 13, and finally the test mechanism 1 is placed into the test platform 11, and the bottom plate 14 is engaged with the notch groove 12, and the top plate 16 is engaged with the hole at the top center of the test platform 11.
[0049] By starting the motor 23, the fan 24 connected to its output end will rotate, and suction will be generated in the air hood 21, and the heat transferred from the outside will be absorbed into the inside until it enters the test platform 11 to perform thermal stress testing on the chip packaging material. There are two heat control mechanisms 2, and one fan 24 is used for suction and the other fan 24 is used for blowing. When the chip packaging material placed in the test platform 11 undergoes thermal stress testing at a constant temperature, the filter 45 located at the top of the gas hood 21 filters out impurities. When thermal stress testing is required at extreme temperatures for the chip packaging material, the first and second drivers 33 and 38 are activated, respectively, causing the first gear 34 connected to the output end of the first driver 33 to rotate counterclockwise. This causes the first rotating plate 35 fixedly connected to the top of the first gear 34 to deflect counterclockwise. Furthermore, the outer side of the first gear 34 meshes with the second gear 36, causing the second gear 36 to cause the second rotating plate 37 to deflect clockwise. The first and second gears 34 and 36 are divided into two groups. The lower group is shown above, while the upper group is located on the transition plate 39 and controlled by the second driver 38. The lower first rotating plate 35 and the adjacent upper second rotating plate 37 are both indirectly connected to the same thermal control mechanism 2.
[0050] By deflecting the No. 1 rotating plate 35 at the bottom and the adjacent No. 2 rotating plate 37 at the top counterclockwise and clockwise respectively, the compensation bars 30 fixedly connected to their bottoms will deflect in opposite directions with the tough connecting block 301, and deflect outward synchronously. The compensation bars 30 and the tough connecting block 301 are both elastic, and the outer side of the tough connecting block 301 is connected to the heat control plate 25. Therefore, the heat control plate 25 will be pulled outward from the air hood 21 until the semicircular hole opened on the surface of the heat control plate 25 is engaged with the compensation block 20. The top of the semicircular hole is provided with an oblique angle, and the compensation block 20 is engaged with the oblique angle part, so that when the heat control plate 25 is reset and re-enters the interior of the air hood 21, the compression between the compensation block 20 and the oblique angle causes the compensation block 20 to slowly move upward and disengage from the oblique angle part until it is attached to the top horizontal surface of the compensation block 20.
[0051] The heat control plate 25 through the air inlet moves outward, so that the compensation block 20 is embedded in the semicircular hole. Therefore, the compensation block 20 will move downward a certain distance to fit with the semicircular hole. The top of the compensation block 20 is connected to the output end of the telescopic rod 27 through the No. 1 sleeve rod 28. Therefore, the No. 1 sleeve rod 28 will bring the output end of the telescopic rod 27 into the fixed end. In addition, the outer side of the output end of the telescopic rod 27 is also fixedly connected to the No. 2 sleeve rod 41. Therefore, the No. 2 sleeve rod 41 will move downward with the toughness bar 43, and respectively stretch and compress the thermal insulation toughness sheet 42 arranged on the upper and lower sides thereof. In addition, the top of the toughness bar 43 is connected to the baffle plate 47, so the baffle plate 47 will deflect downward through the fixed axis 46 and gradually tend to a vertical state. Furthermore, when the heat control plate 25 at the air inlet is retracted into the air hood 21, the inclined plate 26 fixedly attached to the outside of the heat control plate 25 compresses the compensation block 20, causing it to move upward. Simultaneously, the heat control plate 25 reduces the flow range within the air hood 21 to reduce the amount of heat entering. Simultaneously, the toughness strip 43 moves upward along with the second sleeve rod 41, causing the baffle 47 to deflect upward via the fixed axis 46 and gradually become horizontal. By controlling the heat inlet and outlet ports in opposite directions—that is, when the heat inlet port is large, the heat outlet port is small—multiple tests can be performed on chip packaging materials at full load and extreme temperatures.
[0052] The above embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Various changes made by ordinary technicians in this field based on the above concepts without creative work fall within the scope of protection of the present invention.
Claims
1. A thermal stress distribution testing device for chip packaging materials, characterized in that: include: A test mechanism for placing and testing chip packaging materials; A heat control mechanism for precisely controlling incoming and outgoing heat, the heat control mechanism being disposed on top of the testing mechanism; An adjusting mechanism for adjusting the position of some components inside the heat control mechanism, wherein there are two heat control mechanisms, one for air intake and one for air outlet; The regulating mechanism is arranged between the two heat control mechanisms; The testing mechanism includes a testing platform, wherein the interior of the testing platform is a place for heat flow management, a through hole is opened at the center of the testing platform, and a notch groove is opened at the bottom of the inner cavity of the testing platform.
2. The thermal stress distribution testing device for chip packaging materials according to claim 1, characterized in that: A collar plate is inserted into the center of the test platform, and a bottom of the collar plate is fixedly connected to a chassis, wherein the bottom of the chassis is fitted into the notch groove.
3. The thermal stress distribution testing device for chip packaging materials according to claim 2, characterized in that: The inner part of the collar plate is slidably adapted to be fitted with an embedded ring plate, the top of the embedded ring plate is connected to a top plate via fasteners, and a placement net is fixedly installed on the bottom of the top plate; The top plate drives the embedded ring plate to deflect counterclockwise, so that the embedded ring plate extends outward from the sleeve ring plate, and the embedded ring plate and the sleeve ring plate provide a sealed space for the chip packaging material.
4. The thermal stress distribution testing device for chip packaging materials according to claim 1, characterized in that: The adjustment mechanism includes a connecting rod, a center rod is fixedly installed on the top of the connecting rod, a No. 1 driver is fixedly installed on the top of the center rod, an output end of the No. 1 driver is fixedly connected to a No. 1 gear, and the top of the No. 1 gear is fixedly connected to a No. 1 rotating plate.
5. The thermal stress distribution testing device for chip packaging materials according to claim 4, characterized in that: The outer side of the No. 1 gear is meshed with the No. 2 gear, the No. 2 gear is rotatably mounted on the top of the No. 1 driver, and the top of the No. 2 gear is fixedly mounted with a No. 2 rotating plate; A No. 2 driver is fixedly mounted on the top of the No. 1 driver, and a transition plate is provided on the top of the No. 2 driver housing.
6. The thermal stress distribution testing device for chip packaging materials according to claim 5, characterized in that: Compensation bars are fixedly installed at the bottom of the first rotating plate and the second rotating plate, and the bottom ends of the compensation bars are fixedly connected with tough connecting blocks; The first rotating plate and the second rotating plate are located on a horizontal plane at the same height.
7. The thermal stress distribution testing device for chip packaging materials according to claim 1, characterized in that: The heat control mechanism includes an air hood, the bottom of the air hood is fixedly connected to the top of the test platform, and the outer side of the air hood is fixedly connected to the connecting rod; An inner connecting frame is fixedly connected to the interior of the air hood, a motor is provided at the center of the inner connecting frame, and a fan is fixedly connected to the output end of the motor.
8. The thermal stress distribution testing device for chip packaging materials according to claim 7, characterized in that: Heat control plates are inserted on both sides of the gas hood, wherein a semicircular hole is opened on one end of the heat control plate inside the gas hood, and an inclined plate is fixedly connected to the end of the heat control plate without the semicircular hole; The outer side of the heat control plate is fixedly connected to the tough connecting block; In addition, the semicircular hole is used to provide a certain flow space in the inner cavity of the gas mask.
9. The thermal stress distribution testing device for chip packaging materials according to claim 7, characterized in that: A telescopic rod is fixedly installed on the outside of the gas hood, and a No. 1 sleeve rod is fixedly connected to the outside of the output end of the telescopic rod, and a return spring is fixedly connected to the outside of the No. 1 sleeve rod, and the bottom end of the return spring is fixedly connected to the fixed end of the telescopic rod. A compensation block is fixedly connected to the end of the No. 1 sleeve rod away from the telescopic rod; The compensation block is fitted into the semicircular hole, and the bottom of the compensation block is extruded and fitted into the inclined surface of the inclined panel.
10. The thermal stress distribution testing device for chip packaging materials according to claim 9, characterized in that: The outer side of the output end of the telescopic rod is fixedly connected to a No. 2 sleeve rod, and the upper and lower sides of the No. 2 sleeve rod are fixedly connected to a heat-insulating tough sheet, and the end of the heat-insulating tough sheet away from the No. 2 sleeve rod is fixedly connected to the gas hood, and a filter is provided on the top of the inner cavity of the gas hood; The top end of the second sleeve rod is fixedly connected to a toughness bar, the outer side of the toughness bar is fixedly connected to a multi-link rod, and the top end of the toughness bar is fixedly connected to a blocking plate; A fixed shaft is fixedly connected inside the filter holes of the filter screen, and the outer side of the fixed shaft is rotatably connected to the baffle plate. Circular tubes are symmetrically connected to both sides of the top of the baffle plate.