Line switching dispatching method and system, computer equipment and storage medium

Abstract

The invention discloses a wire cutting dispatching method and system, computer equipment and a storage medium, and the wire cutting dispatching method employs a parallel dual-inspection mode composed of a sensor triggering identification mode and a timing self-inspection mode to carry out identification so as to determine whether there is no crystal bar, and prevents the crystal bar from being damaged once the inspection mode identified according to the sensor has deviation or error. And a regular self-inspection mode can also be adopted for inspection, so that the dispatching accuracy is ensured, the dispatching precision is improved, and the use efficiency of the equipment is improved.

Description

[0001] This application is a divisional application of the invention patent application with application number 202110359912.8, application date April 2, 2021, and name "Wire cutting dispatch method, system, computer equipment and storage medium". Technical Field

[0002] The present application belongs to the field of photovoltaic silicon wafer line cutting production technology, and in particular relates to line cutting dispatching methods, systems, computer equipment and storage media. Background Art

[0003] The crystal ingots being processed include those cut to standard lengths, those spliced ​​together from non-standard lengths, and both standard and non-standard ingots of varying diameters. Furthermore, these ingots are classified into N-type and P-type, and within these two types, there are also variations in resistivity or oxygen content. With so many different ingot sizes, the existing processing area primarily distinguishes between them using notes on process sheets. This manual selection of ingots for dispatch often leads to a mismatch between the ingots and the machine processing. Equipment status information, such as abnormal alarms and remaining machine processing time, is not readily available, resulting in long wait times for ingot processing. Adjusting the machine's processing recipe to meet the current machine processing requirements reduces equipment process stability and affects product yield.

[0004] The inefficient and low-quality manual dispatching method is being phased out, and the automated dispatching method is being adopted.

[0005] Chinese patent application CN104977903B proposes a wafer batch dispatching method and system under a machine group based on a real-time dispatching system. This method is based on certain online wafer batch data and the dispatching rules corresponding to several machines in a machine group. It only involves the selection of wafers by each machine in a machine group. It mainly solves the technical problem of machines in the same machine group booking the same batch of wafers at the same time.

[0006] Chinese patent application CN105097424B proposes a method and system for dispatching work in a semiconductor process production line. The method mainly determines whether the residence time of a batch of goods in the experimental process exceeds the allowed time limit, so as to effectively control the dispatch and operation process of the experimental batch of goods, ensure the reliability of the experimental process, and reduce the rework rate of the experimental process.

[0007] Chinese patent publication CN101996359A proposes a method for dispatching work in the semiconductor manufacturing process. By implementing dispatch control based on the operating status of the equipment, the maximum allowable waiting time for work-in-progress, the waiting time, priority, number of wafers, and delivery time, it solves the technical problem of how to fully utilize the production capacity of lithography equipment.

[0008] Chinese patent publication CN103101704B proposes an automatic dispatching method, which only addresses the transportation of display panels, a single device product. By controlling the source storage unit, the destination storage unit, and the entrance and exit of the machine, it solves the existing technical problems of frequent repeated transports and low efficiency.

[0009] Chinese patent publication CN103413771B proposes a method for dispatching wafer acceptance test machines, which is a method for dispatching primary products and final products of the same wafer to the testing machines in the Inline WAT area and the Final WAT area during the testing process.

[0010] None of the above patents consider how to select crystal rods suitable for the process tasks of the wire cutting machine from a wide variety of types of crystal rods, especially how to automatically assign and optimize the assignment selection for the mixed inventory of whole crystal rods and spliced ​​crystal rods of different specifications while ensuring that they match the process tasks, so as to minimize the impact of the splicing seams on the wire cutting machine, and avoid the technical problems of large fluctuations in the range of adjusting the cutting network due to the large difference in the length range of the crystal rod splicing seams during automatic assignment, making the adjustment of the network difficult and time-consuming, resulting in low equipment utilization efficiency and unstable silicon wafer yield. Summary of the Invention

[0011] The present application provides a wire cutting dispatching method, system, computer equipment and storage medium, which solves the technical problem of low equipment utilization efficiency in the prior art.

[0012] In order to solve the above technical problems, the technical solution adopted in this application is:

[0013] A wire cutting dispatching method, comprising:

[0014] Based on the parallel dual-inspection mode consisting of sensor-triggered recognition mode and timed self-inspection mode, when a crystalless ingot is identified, first-level or second-level dispatch is executed;

[0015] The first-level dispatching includes: dispatching the crystal ingots from the curing stations in the plurality of curing stations in the source storage area to the empty buffer stations in the corresponding buffer stations in the buffer area;

[0016] The secondary dispatching includes dispatching the crystal ingots from several buffer stations in the buffer area to corresponding machines in the wire cutting area.

[0017] In some embodiments, the sensor triggering recognition mode includes:

[0018] In response to the crystal bar absence signal from the sensor, obtaining a crystal bar dispatching alarm signal from the equipment control system;

[0019] Based on the alarm signal, the line cutting dispatching system is notified to execute the primary dispatching or the secondary dispatching.

[0020] In some embodiments, the timed self-check mode includes:

[0021] Periodically scan to identify empty cache stations and trigger the first-level dispatch instruction; and

[0022] The machine in the automatic dispatching mode in the wire cutting area is scanned periodically to identify the machine and trigger the secondary dispatching instruction.

[0023] In some embodiments, the dispatching criteria for selecting the crystal rods in the first-level dispatching and the second-level dispatching are the same.

[0024] In some embodiments, the dispatch criteria include:

[0025] A screening criterion based on screening inventory information of the crystal ingots in the source storage area;

[0026] The crystal ingots selected according to the screening criteria are sorted and assigned according to certain conditions.

[0027] In some embodiments, the screening criteria include:

[0028] Based on the real-time inventory information of the crystal ingots under all online conditions in the source warehouse area, screening is performed according to the main characteristics of the crystal ingots to obtain a preliminary list;

[0029] According to the configuration characteristics of the crystal ingot, the crystal ingot is selected from the primary list to obtain a primary list;

[0030] The main characteristics of the crystal rod include N / P type classification, diameter size, oxygen content range and resistivity range;

[0031] The crystal rod configuration features include a whole rod configuration and a spliced ​​rod configuration.

[0032] In some embodiments, the sorting criteria include sorting by rod length to obtain a secondary list, sorting by production plan to obtain a tertiary list, and sorting by process time to obtain a quaternary list, wherein the crystal rods with a whole rod configuration are given priority in the secondary list and / or the tertiary list and / or the quaternary list.

[0033] In some embodiments, the sorting criteria according to rod length include:

[0034] Sort the absolute values ​​of the differences between the lengths of the crystal ingot currently being processed or most recently processed by the machine and the crystal ingots in the first-level list in ascending order to obtain the second-level list;

[0035] Wherein, the rod length of the crystal rod in a whole rod configuration is the rod length itself;

[0036] The rod length of the spliced ​​crystal rod is the rod length of its longest section.

[0037] In some embodiments, the sorting criteria include sorting by production plan:

[0038] Based on the shipping date of the chip, the customer type and the inventory quantity of the corresponding crystal rod in the source warehouse area, the secondary list is sorted in order from small to large according to the urgency of the shipping date and / or the importance of the customer and / or the number of the crystal rods in the source warehouse area to obtain the third-level list.

[0039] In some embodiments, the sorting criteria according to process time include:

[0040] Based on the standard solidification time of the crystal ingot, the crystal ingots whose actual solidification time is greater than the standard solidification time are selected from the three-level list, and are arranged in descending order of actual solidification time to obtain the four-level list.

[0041] In some embodiments, the first-level dispatching step includes:

[0042] Checking the cache area to see if there is a cache station with an empty cache station;

[0043] When the number of the cache stations with empty cache stations is ≥1,

[0044] Based on the vacancy time of the empty buffer stations in the buffer stations, the remaining time of wire slicing of the crystal ingot being processed by the machine corresponding to the buffer stations is sorted in ascending order, and the buffer stations corresponding to the machine with the shorter remaining time of wire slicing are assigned work first;

[0045] When the number of empty cache stations in the cache station is greater than 0,

[0046] Checking and confirming that a robot arm disposed between the source storage area and the buffer area and used to take and place the crystal ingot is in an online condition and in an idle state;

[0047] Determining that the source storage area is online and in an idle state;

[0048] Executing the work dispatching standard, selecting the crystal ingots required by the empty buffer stations of the buffer table from the solidification stations in the source storage area;

[0049] Preliminarily checking whether the selected crystal ingot can be dispatched to an empty buffer station in the buffer station, and determining whether it is the crystal ingot required by the machine corresponding to the buffer station;

[0050] If the crystal ingot is inspected and cannot be dispatched, the reason is recorded and a new solidification station is selected from other solidification stations in the source storage area.

[0051] In some embodiments, the secondary dispatching step includes:

[0052] Checking all the machines in the wire cutting area and selecting the machines that are in operation or idle state in online mode;

[0053] When the number of processed crystal ingots in the machine is 0,

[0054] executing the dispatching standard, obtaining the crystal ingot required by the selected tool from the buffer station corresponding to the tool, and dispatching the work to the selected tool;

[0055] Performing an appearance inspection on the ingot at the inlet of the machine; if the ingot fails the appearance inspection, executing abnormal processing;

[0056] Performing wire cutting on the crystal ingot selected in the machine;

[0057] Inspection of the ingots and wafers during wire slicing and the wafers after wire slicing is completed is performed.

[0058] Accordingly, an embodiment of the present application further provides a wire cutting dispatching system, which is configured to: identify amorphous ingots based on a parallel dual-check mode consisting of a sensor trigger recognition mode and a timed self-check mode, and execute primary dispatching and secondary dispatching; the wire cutting dispatching system includes:

[0059] Level 1 dispatching unit: used to dispatch crystal ingots from the curing stations in the source storage area to the empty buffer stations in the corresponding buffer stations in the buffer area;

[0060] Secondary dispatching unit: used for executing secondary dispatching of the crystal rods from several buffer stations in the buffer area to corresponding machines in the wire cutting area.

[0061] In some embodiments, the sensor triggering recognition mode includes:

[0062] In response to the crystal bar absence signal from the sensor, obtaining a crystal bar dispatching alarm signal from the equipment control system;

[0063] Based on the alarm signal, the line cutting dispatching system is notified to execute the primary dispatching or the secondary dispatching.

[0064] In some embodiments, the timed self-check mode includes:

[0065] Periodically scan to identify empty cache stations and trigger the first-level dispatch instruction; and

[0066] The machine in the automatic dispatching mode in the wire cutting area is scanned periodically to identify the machine and trigger the secondary dispatching instruction.

[0067] In some embodiments, the first-level dispatching unit and the second-level dispatching unit have the same dispatching criteria for selecting the crystal ingots.

[0068] In some embodiments, the dispatch criteria include:

[0069] A screening standard module based on screening inventory information of the crystal ingots in the source storage area;

[0070] A sorting standard module is provided for sorting and dispatching the crystal ingots selected according to the screening criteria according to certain conditions.

[0071] In some embodiments, the screening criteria module includes:

[0072] Based on the real-time inventory information of the crystal ingots under all online conditions in the source warehouse area, screening is performed according to the main characteristics of the crystal ingots to obtain a preliminary list;

[0073] According to the configuration characteristics of the crystal ingot, the crystal ingot is selected from the primary list to obtain a primary list;

[0074] The main characteristics of the crystal rod include N / P type classification, diameter size, oxygen content range and resistivity range;

[0075] The crystal rod configuration features include a whole rod configuration and a spliced ​​rod configuration.

[0076] In some embodiments, the sorting standard module includes sorting by rod length to obtain a secondary list, sorting by production plan to obtain a tertiary list, and sorting by process time to obtain a quaternary list, wherein the secondary list and / or the tertiary list and / or the quaternary list give priority to the crystal rod with a whole rod configuration.

[0077] In some embodiments, the sorting by rod length in the sorting standard module includes:

[0078] Sort the absolute values ​​of the differences between the lengths of the crystal ingot currently being processed or most recently processed by the machine and the crystal ingots in the first-level list in ascending order to obtain the second-level list;

[0079] Wherein, the rod length of the crystal rod in a whole rod configuration is the rod length itself;

[0080] The length of the crystal rod in a spliced ​​configuration is the length of the longest section of the crystal rod in a whole configuration.

[0081] In some embodiments, the sorting by production plan in the sorting criteria module includes:

[0082] Based on the shipping date of the chip, the customer type and the inventory quantity of the corresponding crystal rod in the source warehouse area, the secondary list is sorted in order from small to large according to the urgency of the shipping date and / or the importance of the customer and / or the number of the crystal rods in the source warehouse area to obtain the third-level list.

[0083] In some embodiments, the sorting by process time in the sorting standard module includes:

[0084] Based on the standard solidification time of the crystal ingot, the crystal ingots whose actual solidification time is greater than the standard solidification time are selected from the three-level list, and are arranged in descending order of actual solidification time to obtain the four-level list.

[0085] In some embodiments, the first-level dispatching unit includes:

[0086] Checking the cache area to see if there is a cache station with an empty cache station;

[0087] When the number of cache stations with empty cache positions is ≥1,

[0088] Based on the vacancy time of the empty buffer stations in the buffer stations, the remaining time of wire slicing of the crystal ingot being processed by the machine corresponding to the buffer stations is sorted in ascending order, and the buffer stations corresponding to the machine with the shorter remaining time of wire slicing are assigned work first;

[0089] When the number of empty cache stations in the cache station is greater than 0,

[0090] Checking and confirming that a robot arm disposed between the source storage area and the buffer area and used to take and place the crystal ingot is in an online condition and in an idle state;

[0091] Determining that the source storage area is online and in an idle state;

[0092] Executing the work dispatching standard, selecting the crystal ingots required by the empty buffer stations of the buffer table from the solidification stations in the source storage area;

[0093] Preliminarily checking whether the crystal ingot in the buffer station can be dispatched to an empty buffer station in the buffer station, and determining whether it is the crystal ingot required by the machine corresponding to the buffer station;

[0094] If the crystal ingot is inspected and cannot be dispatched, the reason is recorded and a new solidification station is selected from other solidification stations in the source storage area.

[0095] In some embodiments, the secondary dispatching unit includes:

[0096] Checking all the machines in the wire cutting area and selecting the machines that are in operation or idle state in online mode;

[0097] When the number of processed crystal ingots in the machine is 0,

[0098] executing the dispatching standard, obtaining the crystal ingot required by the selected tool from the buffer station corresponding to the tool, and dispatching the work to the selected tool;

[0099] Performing an appearance inspection on the ingot at the inlet of the machine; if the ingot fails the appearance inspection, executing abnormal processing;

[0100] Performing wire cutting on the crystal ingot selected in the machine;

[0101] Inspection of the ingots and wafers during wire slicing and the wafers after wire slicing is completed is performed.

[0102] Accordingly, an embodiment of the present application provides a computer device comprising a memory and a processor; the memory stores a computer program; the processor is configured to execute the computer program, and when executing the computer program, the processor executes the steps of the wire cutting dispatching method as described above.

[0103] Accordingly, an embodiment of the present application provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, the processor executes the steps of the wire cutting dispatching method described above.

[0104] The wire cutting dispatching method, system, computer equipment and storage medium of the present application adopt a parallel dual inspection mode consisting of a sensor trigger recognition mode and a timed self-inspection mode for identification to determine whether there is a crystal rod, to prevent deviation or error in the inspection mode identified by the sensor, and to adopt a timed self-inspection mode for inspection to ensure the accuracy of dispatching, improve the accuracy rate of dispatching, and enhance the efficiency of equipment use. BRIEF DESCRIPTION OF THE DRAWINGS

[0105] Figure 1 This is a flow chart of a wire cutting dispatching method according to an embodiment of the present application;

[0106] Figure 2 This is a signal diagram of a line cutting dispatching method according to an embodiment of the present application;

[0107] Figure 3 This is a flow chart of the crystal ingot dispatching standard according to one embodiment of the present application;

[0108] Figure 4This is a flow chart of the first-level work assignment selection in one embodiment of the present application;

[0109] Figure 5 This is a flowchart of the secondary dispatch selection in one embodiment of the present application;

[0110] Figure 6 2 is a schematic structural diagram of a wire cutting dispatching system according to an embodiment of the present application. DETAILED DESCRIPTION

[0111] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0112] This embodiment proposes a line cutting dispatching method, such as Figures 1 to 2 As shown, it mainly involves the first-level dispatching of dispatching the solidified crystal rods from the curing stations in the several curing stations in the source storage area to the empty cache stations in the corresponding cache stations in the buffer area, and the second-level dispatching of dispatching the crystal rods from the several cache stations in the buffer area to the corresponding machines in the wire cutting area, wherein the source storage area has several curing stations, each of which is provided with several curing stations for placing the crystal rods to be solidified. These crystal rods are to be cured after bonding, and are dispatched to the buffer area and the wire cutting area in turn after being fully cured; the wire cutting area is provided with several wire cutting machines for wire cutting the crystal rods into wafers; the buffer area is placed between the source storage area and the wire cutting area, and is provided with several cache stations for caching the crystal rods to be cut, each cache station corresponds to a machine, and there is at least one cache station in each cache station. In this embodiment, only some of the equipment in the source storage area, the buffer area and the wire cutting area are exemplified. The source storage area includes a curing station 11, a curing station 12, a curing station 21, a curing station 22, a curing station 31 and a curing station 32, and each curing station is provided with a number of curing stations; the buffer area includes a buffer station 1, a buffer station 2 and a buffer station 3, and each buffer station is provided with a number of buffer stations; the wire cutting area is provided with a machine 1, a machine 2 and a machine 3. Using the principle of the shortest mobile transportation path, at least two curing stations corresponding to one buffer station, and at least one buffer station corresponding to one machine are preset in advance.

[0113] like Figure 2As shown, an upper terminal is respectively provided in the curing area, the buffer area and the wire cutting area, namely a curing terminal, a buffer terminal and a wire cutting terminal. The curing terminal is connected to each curing station in the curing area, the buffer terminal is connected to each buffer station in the buffer area, and the wire cutting terminal is connected to each wire cutting machine in the wire cutting area; and each curing station, buffer station and machine is provided with a sensor for detecting the presence or absence of crystal rods, including an empty (Empty) signal for no crystal rod and an idle (Idle) signal for a crystal rod. After the sensor obtains the signal of the presence of no crystal rod, it indicates that the dispatch signal needs to be started, and the alarm signal is transmitted to the equipment control system EAP through the corresponding upper terminal. After the production execution management system MES obtains the alarm signal about the dispatched crystal rod from the EAP, it immediately notifies the dispatch system AMA to execute the first-level dispatch for the corresponding curing area or buffer area, and the second-level dispatch for the corresponding buffer area or wire cutting area. This is the process of sensor triggering recognition mode; and the dispatching standards for selecting crystal rods in the first-level dispatch and the second-level dispatch are the same.

[0114] In addition, AMA also has a Watchdog program as a timed self-check mode, which scans the curing area, buffer area and wire cutting area within a limited time, and performs independent scans every few minutes to check whether the curing station, buffer station and machine are empty (Empty) or idle (Idle), so as to determine whether AMA needs to trigger work dispatch. This timed self-check mode works in parallel with the sensor trigger recognition mode.

[0115] This embodiment adopts a parallel dual inspection mode to identify the curing stations in the curing area, the cache stations in the buffer area, and the machines in the wire cutting area to determine whether they are empty or idle, to prevent deviations or errors in the inspection mode identified by the sensor. A timed self-inspection mode can also be used for inspection to ensure the accuracy of work dispatch and improve the accuracy of work dispatch.

[0116] like Figure 3 As shown, the dispatching criteria include screening criteria and sorting criteria, wherein the screening criteria are based on screening the inventory information of all crystal bars in the source warehouse area; the sorting criteria are based on sorting and dispatching all crystal bar information screened out by the screening criteria according to certain conditions.

[0117] Specifically, the screening criteria include:

[0118] Based on the real-time inventory information of all online ingots in the source warehouse, we screen the ingots according to their key characteristics to obtain a preliminary list. In actual production, each batch of silicon wafers must have certain technical parameters, also known as the technical parameters of the ingot. The key characteristics of the ingot are these key technical parameters, including N / P type classification, diameter, oxygen content range, and resistivity range.

[0119] On the basis of the primary list, the crystal rod information that meets the requirements is screened out according to the configuration characteristics of the crystal rod to obtain a primary list. Among them, the crystal rod configuration characteristics mainly include the whole rod configuration characteristics and the splicing configuration characteristics. In actual production, there are crystal rods of standard length, that is, crystal rods with whole rod configuration; the remaining non-standard length crystal rods need to be spliced ​​to form a standard length spliced ​​rod, that is, a spliced ​​configuration crystal rod. For the spliced ​​configuration crystal rod, it includes at least two non-standard crystal rods spliced ​​together, and also includes three or more non-standard crystal rods spliced ​​together. For each spliced ​​configuration crystal rod, it includes a spliced ​​rod with the longest length. In the primary list, the crystal rod with whole rod configuration is given priority; when the crystal rod with whole rod configuration is processed, the crystal rod with splicing configuration is selected. Among the spliced ​​configuration crystal rods, the crystal rod with the smaller number of splicing is given priority. This setting ensures that non-spliced ​​crystal rods are selected first, followed by spliced ​​crystal rods. The crystal rods are screened quickly and efficiently first, without having to consider adjusting the wire mesh for wire cutting, ensuring the stability of chip quality and yield rate.

[0120] Furthermore, the sorting criteria include: a second-level list based on ingot length, a third-level list based on production schedule, and a fourth-level list based on process time. In the second, third, and fourth-level lists, whole-ingot configurations are prioritized over spliced ​​ingot configurations. This prioritizes the stability and integrity of the quality of silicon wafers after wire-slicing whole-ingot configurations, eliminating the need for wire mesh adjustments and improving wire-slicing quality and efficiency.

[0121] Sorting criteria by rod length include:

[0122] The absolute value of the difference between the length of the crystal ingot being processed or most recently processed by the machine and the crystal ingot in the first-level list is sorted in ascending order to obtain a second-level list; among which, the length of the crystal ingot in a whole-ingot configuration is the length of the ingot itself; the length of the crystal ingot in a spliced ​​configuration is the length of the longest segment of the crystal ingot in the whole-ingot configuration.

[0123] Specifically, for a solid-rod configuration:

[0124] Using the length of the ingot currently being processed or most recently processed by the machine as a reference length, the absolute value obtained by subtracting the reference length from the length of the ingot configured in the first-level list is used to prioritize the dispatch of ingots with smaller absolute values. The information on the ingots configured in the first-level list is sorted in ascending order of absolute value to form the second-level list. Using the length of the ingot currently being processed by the machine as a reference value, or if no ingot is currently being processed, the length of the ingot last processed in the historical records is used as a reference value. All ingots configured in the first-level list are selected, and the selected ingot length is compared with the reference value. Ingots with a smaller absolute value difference between the selected ingot length and the reference value are prioritized for dispatch. This not only avoids excess ingots that are not cut due to incompatibility with the diamond wire mesh, but also prevents waste of diamond wire due to ingots being too short.

[0125] For ingots in a spliced ​​configuration:

[0126] The longest segment of the ingot in the currently processed or most recently processed spliced ​​configuration is used as the reference length. The ingots with the smaller absolute value of the longest segment in the first-level list are dispatched first. The ingots in the spliced ​​configuration are sorted in ascending order of absolute value to form a second-level list. The longest segment of the ingot in the currently processed spliced ​​configuration is used as the reference value. If no spliced ​​ingot is currently being processed, the longest segment of the ingot in the last spliced ​​configuration processed in the history is used as the reference value. All spliced ​​configurations are selected from the first-level list, and the length of the selected ingot's longer segment is compared to the reference value. Ingots with the smallest absolute value difference between the selected ingot's longer segment and the reference value are dispatched first.

[0127] Furthermore, the sorting criteria according to the production plan include: based on the wafer shipment date, customer type and the inventory quantity of the corresponding crystal rod in the source warehouse area, sorting from the secondary list according to the urgency of the shipment date and / or the importance of the customer and / or the number of crystal rods in the source warehouse area from small to large to obtain a third-level list. These priority conditions can be preset in advance in the AMA. Of course, in this sorting process, the sorting of other planning conditions can also be included, such as the classification conditions of important raw and auxiliary materials or the classification conditions in the crystal pulling process. This sorting mainly involves dispatching work according to the priority of the production plan. For this type of priority sorting content, different color marking methods can be preset in advance in the AMA to distinguish them.

[0128] Furthermore, the sorting criteria include sorting by process time: based on the standard solidification time of the crystal rod, selecting the crystal rods with actual solidification time greater than the standard solidification time from the three-level list, and arranging them in order of actual solidification time from long to short to obtain a four-level list. The purpose is to ensure that all crystal rods to be dispatched must meet the solidification time requirements of the standard, and the crystal rods that solidify first are dispatched first, that is, the crystal rods that have been placed for a long time after solidification, that is, the crystal rods with a longer total solidification time, are dispatched first. This time, the limitation of the solidification time is used to ensure that the bonding strength meets the wire cutting standard and prevent the risk of falling rods or wafers during the wire cutting process.

[0129] Combine Figure 1 、 Figure 4 and Figure 5 , explain in detail the wire cutting dispatching method,

[0130] The first-level dispatching steps include:

[0131] The online workstations in all cache tables in the cache area are inspected using a parallel dual-inspection mode consisting of a sensor trigger identification mode and a timed self-inspection mode to identify which cache tables in the cache area have empty cache workstations, and provide the information of these empty cache workstations to the AMA to accurately trigger the first-level work dispatch instruction.

[0132] Check the cache area to see if there are any cache stations with empty cache stations. When the number of cache stations with empty cache stations is ≥ 1, sort the cache stations in ascending order based on the vacancy time of the empty cache stations in the cache stations, and the remaining time of wire cutting of the crystal ingots being processed by the machine corresponding to the cache stations. The cache stations corresponding to the machine with the shorter remaining time of wire cutting are assigned first. That is, when the number of cache stations with empty cache stations is one or more, sort the cache stations with empty cache stations according to the order of the remaining time of wire cutting of the crystal ingots being processed by the machine corresponding to the cache stations, and arrange them in ascending order of the remaining time of wire cutting. That is, the cache station corresponding to the machine that is about to finish wire cutting will be assigned first to ensure that the machine that finishes wire cutting first receives the assigned crystal ingot first, ensuring that the machine does not idle and improves the machine utilization rate.

[0133] When the number of empty cache stations in any cache table is greater than 0, the sensor triggers the recognition mode and transmits the alarm signal to the EAP through the cache terminal. The MES recognizes the alarm signal from the empty cache station of the cache table from the EAP and automatically transmits it to the AMA for confirmation. At the same time, the scheduled self-check mode in the AMA is also turned on to detect the empty cache stations in the cache table. Regardless of the number of cache stations in each cache table, as long as one or more empty cache stations are detected, they can be identified by the parallel dual-check mode, thereby triggering the dispatch (Start).

[0134] To ensure the safe and rapid delivery of crystal ingots, it is necessary to ensure that the curing station in the corresponding curing station connected to the source storage area is online, has crystal ingots placed, and is in an idle state (not dispatched), meaning that the crystal ingot can be removed by the robot at any time. Each cache station can select crystal ingots to be dispatched from several curing stations. As long as the curing station in the corresponding curing station has crystal ingots that meet the dispatching criteria, and the curing station is online and idle (not dispatched), the cache station can be dispatched.

[0135] At the same time, check and determine that the robot arm set between the source storage area and the buffer area and used to pick up and place the crystal rods on the curing station in the curing table is in an online condition (Online) and in an idle state (Idle). After the working state changes to the automatic (Auto) handling mode, immediately operate the crystal rod on the curing station and send it to the empty (Empty) cache station in the cache table. Among them, the state of the robot arm is also identified by a parallel double-check mode consisting of a sensor trigger recognition mode and a timed self-check mode. If the curing station is in a non-idle (Idle) state for dispatching or transporting, or the robot arm is in a non-idle (Idle) state for transporting, the crystal rods in the source storage area cannot be dispatched and can only wait for discharge.

[0136] At the same time, the dispatching standards are implemented for the curing stations in the source storage area, the cache stations in the buffer area, and the machines corresponding to the cache stations, and the crystal rods required for the empty cache stations of the cache stations are selected from the curing stations in the source storage area.

[0137] The MES uses dispatch criteria to retrieve ingot information from the source warehouse that meets the four-level list. This excludes ingots that have already been dispatched to the machine entrance, ingots that are not assigned to a machine, and ingots that cannot be dispatched. If the number of ingots stored at the corresponding curing station is greater than 0, the AMA initiates the dispatch process and notifies the robot to pick up the ingot. Otherwise, the robot waits for the next dispatch to retrieve the ingot.

[0138] Before unloading from the curing station in the source storage area, the ingot is pre-checked via the MES interface to determine whether it can be dispatched to an empty buffer station in the buffer station and to verify whether it is the ingot required by the machine corresponding to the buffer station. If the result is that the ingot is dispatchable, it continues to move along the ingot conveyor line to an empty buffer station in the buffer area.

[0139] If the crystal rod is checked as not dispatchable, the system will record the reason why the crystal rod cannot be dispatched, update the number of crystal rods stored in the curing station on the corresponding list, and reselect the crystal rod from other curing stations in the curing station in the source warehouse area, and then continue the pre-inspection.

[0140] Furthermore, the second-level dispatching steps include:

[0141] When the number of processed crystal rods in the machine is 0,

[0142] A machine is selected and dispatched according to the dispatch criteria. The ingots required by the selected machine are retrieved from the corresponding buffer station and dispatched to the selected machine. During this process, the buffer station corresponding to the machine is identified and inspected using a parallel dual-check mode. If the buffer station (HOB) in the corresponding buffer station is in the idle state (Idle) in the online mode (Online), the ingots in the buffer station can be removed at any time by the handling tool set between the buffer station and the machine; and the handling tool is in the automatic handling mode (Auto) and is in the ready-to-load state (Ready To Load).

[0143] When the number of processed crystal ingots in the machine is not 0, the process will be executed in the waiting state.

[0144] All machines in the line cutting area are checked simultaneously, and machines that are in the Run or Idle state in the Online mode are selected and listed. The status of all machines in the line cutting area is checked in a parallel dual-check mode consisting of a sensor trigger recognition mode and a timed self-check mode to identify which machines in the line cutting area are in the Run or Idle state in the Online mode and in the Auto dispatch mode. This information is provided to the AMA, triggering the dispatch (Start), which is also the triggering of the secondary dispatch instruction.

[0145] When the number of cache stations with empty cache positions is ≥ 1, the remaining time of wire cutting of the crystal rod being processed by the machine corresponding to the cache station is sorted in ascending order according to the vacant (OHB Idle) time of the empty cache positions in the cache station, so that the list of machines that meet the conditions is sorted, that is, the cache station corresponding to the machine with the shorter remaining time of wire cutting is assigned first.

[0146] After selecting a machine, the MES interface retrieves the dispatchable ingot information from the first-level list in the cache. After receiving the first-level list, the AMA sorts the ingots according to the sorting criteria, obtains a fourth-level list, and selects an ingot from the cache station in the cache. The MES interface then adds the selected ingot information to the task cache program (Queue). If the addition is successful, the dispatch is executed. If the addition of the ingot information fails, the MES interface will record the reason for the unsuccessful addition in the system. The AMA then continues to sort the ingots and selects an ingot to add to the task cache program again to check whether the addition is successful.

[0147] If the selected ingot is successfully added to the cache within 5 attempts, AMA will continue to sort the ingots and select another ingot to add to the task cache (Queue) to continue determining whether the addition is successful. If the selected ingot fails to be successfully added to the cache task for more than 5 consecutive attempts, it means that the selected ingot is not suitable for the task assignment. The machine will be reselected and the ingot will be re-matched and assigned to the machine until it is successfully added.

[0148] If the number of machines that do not meet the requirements for dispatching is greater than 0, then continue to select machines, re-sort, select crystal rods and add them to the task cache program to prepare for dispatching. Otherwise, end and wait for the next dispatch.

[0149] Of course, if it is detected that a certain machine is in the running (Run) or idle (Idle) state in the online mode (Online), and all the cache stations in all its corresponding cache stations are also empty (Empty), check whether the curing station and the transport robot in the corresponding curing station are in the idle (Idle) state in the online mode (Online), then the first-level dispatching and the second-level dispatching are synchronously started for the empty cache station in the cache station and the machine, that is, the crystal rod selected from the curing station in the curing station according to the dispatching standard is controlled by the robot and transferred to the empty cache station in the cache station, and then immediately transported directly from the cache station to the machine.

[0150] Before dispatching an ingot to a specific machine, it undergoes a visual inspection at the machine's inlet. This inspection can be manual or machine-based, primarily to check for cracks, nicks, or scratches to prevent batches of defective products. If an ingot fails the visual inspection, exception handling is performed.

[0151] The selected ingot continues to be fed into the machine for wire slicing. After slicing begins, the reporting process is initiated. During the slicing process, the ingots and resulting wafers are inspected for any issues with falling ingots or wafers. If such issues occur, exception handling is initiated. After slicing is complete, the reporting process is initiated. After slicing is complete, the appearance of the finished wafers is inspected. If any anomalies are detected, exception handling is initiated.

[0152] Finished wafers are discharged. The machine is in idle state in online mode, waiting for the next batch of crystal ingots to be dispatched from the source warehouse.

[0153] Wire cutting dispatch system, such as Figure 6 Shown, including:

[0154] Level 1 dispatching unit: used to dispatch the crystal ingots from the curing stations in the source storage area to the empty buffer stations in the corresponding buffer stations in the buffer area;

[0155] Secondary dispatch unit: used to dispatch the crystal ingots from several buffer stations in the buffer area to the corresponding machines in the wire cutting area;

[0156] The dispatching standards for selecting crystal rods in the first-level dispatching unit and the second-level dispatching unit are the same.

[0157] Furthermore, the dispatching standard includes a screening standard module and a sorting standard module; the screening standard module is based on screening the inventory information of the crystal rods in the source warehouse area; the sorting standard module is based on sorting and dispatching the crystal rods selected by the screening standard according to certain conditions.

[0158] Furthermore, the screening standard module includes: based on the real-time inventory information of crystal bars under all online conditions in the source warehouse area, screening according to the main characteristics of the crystal bars to obtain a primary list; screening the crystal bars from the primary list according to the crystal bar configuration characteristics to obtain a primary list; among which, the main characteristics of the crystal bars include N / P type classification, diameter size, oxygen content range and resistivity range; the crystal bar configuration characteristics include whole bar configuration and spliced ​​configuration.

[0159] Furthermore, the sorting standard module includes a secondary list obtained by sorting according to rod length, a tertiary list obtained by sorting according to production plan, and a quaternary list obtained by sorting according to process time, wherein the crystal rods with whole rod configuration are given priority in the secondary list and / or the tertiary list and / or the quaternary list.

[0160] Furthermore, the sorting criteria module includes sorting by rod length:

[0161] The absolute value of the difference between the length of the crystal ingot being processed or most recently processed by the machine and the crystal ingot in the first-level list is sorted in ascending order to obtain a second-level list; among which, the length of the crystal ingot in a whole-ingot configuration is the length of the ingot itself; the length of the crystal ingot in a spliced ​​configuration is the length of the longest segment of the crystal ingot in the whole-ingot configuration.

[0162] Specifically, for a solid-rod configuration:

[0163] Taking the length of the ingot currently being processed or most recently processed by the machine as the reference length, the first-level list is assigned a smaller absolute value by subtracting the reference length from the ingot length configured in the whole ingot. The ingots with the smaller absolute value are then prioritized for delivery. The information on the ingots configured in the whole ingot is sorted in ascending order of absolute value to form a second-level list.

[0164] For ingots in a spliced ​​configuration:

[0165] Taking the longest section of the crystal ingot currently being processed or most recently processed by the machine as the reference length, the absolute value obtained by subtracting the longest section of the crystal ingot in the spliced ​​configuration in the first-level list from the reference length is used as the priority. The crystal ingots with smaller absolute values ​​are dispatched first. The information of the spliced ​​configuration crystal ingots is sorted in ascending order of absolute values ​​to form a second-level list.

[0166] Furthermore, sorting according to production plan in the sorting standard module includes: based on the shipping date of the chip, customer type and inventory quantity of the corresponding crystal rod in the source warehouse area, sorting from the secondary list according to the urgency of the shipping date and / or the importance of the customer and / or the number of crystal rods in the source warehouse area from small to large to obtain a third-level list.

[0167] Furthermore, sorting by process time in the sorting standard module includes: based on the standard solidification time of the crystal rod, selecting crystal rods whose actual solidification time is greater than the standard solidification time from the three-level list, and arranging them in order from longest to shortest according to the actual solidification time to obtain a four-level list.

[0168] Furthermore, the first-level dispatching unit includes:

[0169] Check the cache area to see if there is a cache station with an empty cache station;

[0170] When the number of cache stations with empty cache stations is ≥ 1, the cache stations are sorted in ascending order based on the remaining wire-slicing time of the ingots being processed by the corresponding machines of the cache stations, based on the vacancy time of the empty cache stations. The cache stations corresponding to the machines with the shorter remaining wire-slicing time are assigned work first.

[0171] When the number of empty cache stations in the cache station is greater than 0,

[0172] Check and confirm that the robot arm used to pick up and place the crystal ingots, which is located between the source storage area and the buffer area, is online and in an idle state.

[0173] Make sure the source database is online and in idle state.

[0174] Execute the work dispatching standards and select the crystal ingots required by the solidification stations in the source storage area and the empty buffer stations on the buffer table;

[0175] Pre-check whether the selected crystal ingot can be dispatched to an empty buffer station in the buffer station, and determine whether it is the crystal ingot required by the machine corresponding to the buffer station;

[0176] If the crystal rod is inspected and cannot be dispatched, the reason is recorded and a new solidification station is selected from other solidification stations in the source warehouse area.

[0177] Furthermore, a parallel double-check mode consisting of a sensor trigger recognition mode and a timed self-check mode is adopted for the empty cache stations in the cache table; a parallel double-check mode consisting of a sensor trigger recognition mode and a timed self-check mode is adopted for the status of the manipulator.

[0178] Furthermore, the secondary dispatching unit includes:

[0179] Check all machines in the wire cutting area and select the machines that are in the Run or Idle state in the Online mode;

[0180] When the number of processed crystal rods in the machine is 0,

[0181] Execute the dispatching standards, obtain the crystal ingots required by the selected machine from the corresponding buffer, and dispatch the work to the selected machine;

[0182] Perform an appearance inspection at the machine inlet; if the ingot fails the appearance inspection, perform abnormal processing;

[0183] Perform wire cutting on the crystal ingot in the selected machine;

[0184] Perform inspections on ingots and wafers during wire slicing, as well as on wafers after wire slicing.

[0185] A computer device includes a memory and a processor; the memory stores a computer program; the processor is used to execute the computer program, and when executing the computer program, the processor performs the steps of the wire cutting dispatching method described above.

[0186] A computer-readable storage medium stores a computer program, which, when executed by a processor, causes the processor to execute the steps of the wire cutting dispatching method described above.

[0187] The wire cutting dispatching method, system, computer equipment and storage medium designed by this application are used to optimize the dispatching screening criteria and set dispatching criteria for several different conditions. This dispatching sorting standard not only improves dispatching efficiency, saves waiting time, improves production efficiency and reduces production costs; but also accurately selects qualified crystal rods for the corresponding machine and accurately feeds them according to the actual working status of the machine and the remaining time for processing the crystal rod. This application is especially for spliced ​​crystal rods. According to the properties of the crystal rods being processed by the machine or in the most recent processing record, the crystal rods closest to the length of the longest segment are preferentially selected for processing, thereby minimizing the time for stopping the machine to adjust the wire mesh and reducing the range of wire mesh movement. This not only improves the cutting quality, but also reduces the technical problem of unstable yield caused by frequent and large adjustments to the wire mesh.

[0188] The above embodiments of the present application are described in detail. The contents described are only preferred embodiments of the present application and should not be considered to limit the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope of the patent application.

Claims

1. A wire cutting dispatching method, characterized in that: include: Based on the parallel dual-inspection mode consisting of sensor-triggered recognition mode and timed self-inspection mode, when a crystalless ingot is identified, first-level or second-level dispatch is executed; The first-level dispatching includes: dispatching the crystal ingots from the curing stations in the plurality of curing stations in the source storage area to the empty buffer stations in the corresponding buffer stations in the buffer area; The secondary dispatching includes dispatching the crystal ingots from several buffer stations in the buffer area to corresponding machines in the wire cutting area.

2. The wire cutting method according to claim 1, characterized in that: The sensor trigger recognition mode includes: In response to the crystal bar absence signal from the sensor, obtaining a crystal bar dispatching alarm signal from the equipment control system; Based on the alarm signal, the line cutting dispatching system is notified to execute the primary dispatching or the secondary dispatching.

3. The wire cutting method according to claim 1, characterized in that: The timed self-check mode includes: Periodically scan to identify empty cache stations and trigger the first-level dispatch instruction; and The machine in the automatic dispatching mode in the wire cutting area is scanned periodically to identify the machine and trigger the secondary dispatching instruction.

4. The wire cutting method according to any one of claims 1 to 3, characterized in that: The dispatching criteria for selecting the crystal rods in the first-level dispatching and the second-level dispatching are the same.

5. The wire cutting method according to claim 4, characterized in that: The work assignment standards include: A screening criterion based on screening inventory information of the crystal ingots in the source storage area; The crystal ingots selected according to the screening criteria are sorted and assigned according to certain conditions.

6. The wire cutting dispatching method according to claim 5, characterized in that: The screening criteria include: Based on the real-time inventory information of the crystal ingots under all online conditions in the source warehouse area, screening is performed according to the main characteristics of the crystal ingots to obtain a preliminary list; According to the configuration characteristics of the crystal ingot, the crystal ingot is selected from the primary list to obtain a primary list; The main characteristics of the crystal rod include N / P type classification, diameter size, oxygen content range and resistivity range; The crystal rod configuration features include a whole rod configuration and a spliced ​​rod configuration.

7. The wire cutting dispatching method according to claim 5, characterized in that: The sorting criteria include obtaining a secondary list by sorting by rod length, obtaining a tertiary list by sorting by production plan, and obtaining a quaternary list by sorting by process time, wherein the crystal rods in the secondary list and / or the tertiary list and / or the quaternary list are given priority to be selected in the whole rod configuration.

8. The wire cutting dispatching method according to claim 7, characterized in that: The sorting criteria according to rod length include: Sort the absolute values ​​of the differences between the lengths of the crystal ingot currently being processed or most recently processed by the machine and the crystal ingots in the first-level list in ascending order to obtain the second-level list; Wherein, the rod length of the crystal rod in a whole rod configuration is the rod length itself; The rod length of the spliced ​​crystal rod is the rod length of its longest section.

9. The wire cutting dispatching method according to claim 7, characterized in that: The sorting criteria according to production plan include: Based on the shipping date of the chip, the customer type and the inventory quantity of the corresponding crystal rod in the source warehouse area, the secondary list is sorted in order from small to large according to the urgency of the shipping date and / or the importance of the customer and / or the number of the crystal rods in the source warehouse area to obtain the third-level list.

10. The wire cutting dispatching method according to claim 7, characterized in that: The sorting criteria according to process time include: Based on the standard solidification time of the crystal ingot, the crystal ingots whose actual solidification time is greater than the standard solidification time are selected from the three-level list, and are arranged in descending order of actual solidification time to obtain the four-level list.

11. The wire cutting dispatching method according to claim 4, characterized in that: The first-level dispatching steps include: Checking the cache area to see if there is a cache station with an empty cache station; When the number of the cache stations with empty cache stations is ≥1, Based on the vacancy time of the empty buffer stations in the buffer stations, the remaining time of wire slicing of the crystal ingot being processed by the machine corresponding to the buffer stations is sorted in ascending order, and the buffer stations corresponding to the machine with the shorter remaining time of wire slicing are assigned work first; When the number of empty cache stations in the cache station is greater than 0, Checking and confirming that a robot arm disposed between the source storage area and the buffer area and used to take and place the crystal ingot is in an online condition and in an idle state; Determining that the source storage area is online and in an idle state; Executing the work dispatching standard, selecting the crystal ingots required by the empty buffer stations of the buffer table from the solidification stations in the source storage area; Preliminarily checking whether the selected crystal ingot can be dispatched to an empty buffer station in the buffer station, and determining whether it is the crystal ingot required by the machine corresponding to the buffer station; If the crystal ingot is inspected and cannot be dispatched, the reason is recorded and a new solidification station is selected from other solidification stations in the source storage area.

12. The wire cutting dispatching method according to claim 4, characterized in that: The secondary dispatching steps include: Checking all the machines in the wire cutting area and selecting the machines that are in operation or idle state in online mode; When the number of processed crystal ingots in the machine is 0, executing the dispatching standard, obtaining the crystal ingot required by the selected tool from the buffer station corresponding to the tool, and dispatching the work to the selected tool; Performing an appearance inspection on the ingot at the inlet of the machine; if the ingot fails the appearance inspection, executing abnormal processing; Performing wire cutting on the crystal ingot selected in the machine; Inspection of the ingots and wafers during wire slicing and the wafers after wire slicing is completed is performed.

13. A wire cutting dispatching system, characterized in that: The wire cutting dispatching system is configured to: based on a parallel dual inspection mode consisting of a sensor trigger recognition mode and a timed self-inspection mode, identify a crystalless ingot and perform primary dispatching and secondary dispatching; The wire cutting dispatch system includes: Level 1 dispatching unit: used to dispatch crystal ingots from the curing stations in the source storage area to the empty buffer stations in the corresponding buffer stations in the buffer area; Secondary dispatching unit: used for executing secondary dispatching of the crystal rods from several buffer stations in the buffer area to corresponding machines in the wire cutting area.

14. The wire cutting dispatching system according to claim 13, characterized in that: The sensor trigger recognition mode includes: In response to the crystal bar absence signal from the sensor, obtaining a crystal bar dispatching alarm signal from the equipment control system; Based on the alarm signal, the line cutting dispatching system is notified to execute the primary dispatching or the secondary dispatching.

15. The wire cutting dispatching system according to claim 13, characterized in that: The timed self-check mode includes: Periodically scan to identify empty cache stations and trigger the first-level dispatch instruction; and The machine in the automatic dispatching mode in the wire cutting area is scanned periodically to identify the machine and trigger the secondary dispatching instruction.

16. The wire cutting dispatching system according to claim 13, characterized in that: The first-level dispatching unit and the second-level dispatching unit have the same dispatching standard for selecting the crystal rod.

17. The wire cutting dispatching system according to claim 16, characterized in that: The work assignment standards include: A screening standard module based on screening inventory information of the crystal ingots in the source storage area; A sorting standard module is provided for sorting and dispatching the crystal ingots selected according to the screening criteria according to certain conditions.

18. The wire cutting dispatching system according to claim 17, characterized in that: The screening criteria module includes: Based on the real-time inventory information of the crystal ingots under all online conditions in the source warehouse area, screening is performed according to the main characteristics of the crystal ingots to obtain a preliminary list; According to the configuration characteristics of the crystal ingot, the crystal ingot is selected from the primary list to obtain a primary list; The main characteristics of the crystal rod include N / P type classification, diameter size, oxygen content range and resistivity range; The crystal rod configuration features include a whole rod configuration and a spliced ​​rod configuration.

19. The wire cutting dispatching system according to claim 17, wherein: The sorting standard module includes obtaining a secondary list by sorting according to rod length, obtaining a tertiary list by sorting according to production plan, and obtaining a quaternary list by sorting according to process time, wherein the crystal rods with whole rod configuration are given priority in the secondary list and / or the tertiary list and / or the quaternary list.

20. The wire cutting dispatching system according to claim 19, wherein: The sorting standard module includes sorting by rod length: Sort the absolute values ​​of the differences between the lengths of the crystal ingot currently being processed or most recently processed by the machine and the crystal ingots in the first-level list in ascending order to obtain the second-level list; Wherein, the rod length of the crystal rod in a whole rod configuration is the rod length itself; The length of the crystal rod in a spliced ​​configuration is the length of the longest section of the crystal rod in a whole configuration.

21. The wire cutting dispatching system according to claim 19, wherein: The sorting standard module includes sorting according to production plan: Based on the shipping date of the chip, the customer type and the inventory quantity of the corresponding crystal rod in the source warehouse area, the secondary list is sorted in order from small to large according to the urgency of the shipping date and / or the importance of the customer and / or the number of the crystal rods in the source warehouse area to obtain the third-level list.

22. The wire cutting dispatching system according to claim 19, wherein: The sorting standard module includes sorting by process time: Based on the standard solidification time of the crystal ingot, the crystal ingots whose actual solidification time is greater than the standard solidification time are selected from the three-level list, and are arranged in descending order of actual solidification time to obtain the four-level list.

23. The wire cutting dispatching system according to claim 13, wherein: The first-level dispatching unit includes: Checking the cache area to see if there is a cache station with an empty cache station; When the number of the cache stations with empty cache stations is ≥1, Based on the vacancy time of the empty buffer stations in the buffer stations, the remaining time of wire slicing of the crystal ingot being processed by the machine corresponding to the buffer stations is sorted in ascending order, and the buffer stations corresponding to the machine with the shorter remaining time of wire slicing are assigned work first; When the number of empty cache stations in the cache station is greater than 0, Checking and confirming that a robot arm disposed between the source storage area and the buffer area and used to take and place the crystal ingot is in an online condition and in an idle state; Determining that the source storage area is online and in an idle state; Executing the work dispatching standard, selecting the crystal ingots required by the empty buffer stations of the buffer table from the solidification stations in the source storage area; Preliminarily checking whether the crystal ingot in the buffer station can be dispatched to an empty buffer station in the buffer station, and determining whether it is the crystal ingot required by the machine corresponding to the buffer station; If the crystal ingot is inspected and cannot be dispatched, the reason is recorded and a new solidification station is selected from other solidification stations in the source storage area.

24. The wire cutting dispatching system according to claim 13, wherein: The secondary dispatching unit includes: Checking all the machines in the wire cutting area and selecting the machines that are in operation or idle state in online mode; When the number of processed crystal ingots in the machine is 0, executing the dispatching standard, obtaining the crystal ingot required by the selected tool from the buffer station corresponding to the tool, and dispatching the work to the selected tool; Performing an appearance inspection on the ingot at the inlet of the machine; if the ingot fails the appearance inspection, executing abnormal processing; Performing wire cutting on the crystal ingot selected in the machine; Inspection of the ingots and wafers during wire slicing and the wafers after wire slicing is completed is performed.

25. A computer device, characterized in that: The invention comprises a memory and a processor; the memory stores a computer program; the processor is configured to execute the computer program, and when executing the computer program, the processor executes the steps of the wire cutting and dispatching method according to any one of claims 1 to 12.

26. A computer-readable storage medium, characterized in that A computer program is stored, and when the computer program is executed by a processor, the processor is caused to execute the steps of the wire cutting dispatch method according to any one of claims 1 to 12.

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