Design method of high-power visual surface light source based on COB technology

Abstract

The present application relates to a design method for a high-power visual surface light source based on COB technology. The method uses a visual device to acquire an image under the condition of initial light source illumination, and performs feature analysis based on the acquired image to obtain all target defect features. The LED grains are matched for each target defect feature based on the illumination range of each LED grain. That is, the illumination coverage of the LED grain to the target defect feature is defined as matching the target defect feature. The power and position of each LED grain that matches the target defect feature are then adjusted so that the target defect feature can be improved or eliminated to meet the requirements of visual recognition.

Description

Technical Field

[0001] The present application relates to the field of surface light source technology, and in particular to a design method for a high-power visual surface light source based on COB technology. Background Art

[0002] Automated high-bay warehouses (AHWs) are a new concept in logistics and warehousing. Using AHW equipment, they streamline warehouse levels, automate storage and retrieval, and simplify operations. AHWs represent a state-of-the-art technology. The main components of an AHW are racks, aisle-mounted stacking cranes, inbound and outbound workstations, and automated inbound and outbound and operational control systems. A rack is a steel or reinforced concrete structure containing standard-sized cargo spaces. Aisle-mounted stacking cranes navigate the aisles between the racks to store and retrieve goods. Computers and barcode technology are used for management.

[0003] Therefore, during the operation of automated warehouses, a visual recognition system is needed to identify features such as barcodes on shelves. In addition, the image backgrounds in this process are mostly similar or consistent. When using conventional COB light sources to supplement the visual system, problems such as overexposure and noise are prone to occur, which in turn affects the recognition accuracy of the visual system. Summary of the Invention

[0004] Based on this, it is necessary to use a visual recognition system to identify features such as barcodes on shelves during the operation of traditional automated warehouses. When using conventional COB light sources to supplement the visual system, problems such as overexposure and noise are prone to occur, which in turn affects the recognition accuracy of the visual system. This paper provides a design method for high-power visual surface light sources based on COB technology.

[0005] This application provides a design method for a high-power visual surface light source based on COB technology, including:

[0006] Acquire a target image illuminated by an initial light source, wherein the initial light source includes a plurality of LED dies, and the target image includes a visually identifiable target;

[0007] Based on the feature analysis of the target image, all target defect features in the target image are obtained;

[0008] Perform LED die matching based on each target defect feature, so that each target defect feature is matched to at least one LED die;

[0009] Based on each target defect feature, the power or position of all matching LED dies is adjusted to optimize each target defect feature.

[0010] Output the adjusted power parameters and position parameters of all LED chips.

[0011] Furthermore, the initial light source includes a plurality of LED chips arranged in an array.

[0012] Furthermore, the feature analysis of the target image is based on obtaining all target defect features in the target image, including:

[0013] Performing feature recognition on the target image to obtain at least one feature;

[0014] Target feature screening is performed based on all the obtained features to obtain at least one target feature, where the target feature includes an area where the target feature is located.

[0015] Furthermore, the step of obtaining all target defect features in the target image based on feature analysis of the target image further includes:

[0016] Perform defect feature screening on all features obtained by feature recognition based on the target image to obtain at least one defect feature, wherein the defect feature includes an area where the defect feature is located;

[0017] Select a defect feature;

[0018] Obtaining a defect feature location area of ​​the defect feature and a target feature location area of ​​each target feature;

[0019] Comparing the defect feature region of the defect feature with the target feature region of each target feature to obtain a comparison result;

[0020] If the comparison result shows that the defect feature region of the defect feature has no intersection with the target feature region of each target feature, then the defect feature is an invalid defect feature;

[0021] If the comparison result shows that the defect feature region of the defect feature and the target feature region of any target feature intersect, then the defect feature is the target defect feature;

[0022] Return to the step of selecting a defect feature until each defect feature has been selected once.

[0023] Furthermore, performing LED die matching based on each target defect feature so that each target defect feature is matched to at least one LED die includes:

[0024] Analyze the target image to obtain the illumination range of each LED die;

[0025] Select a defect feature;

[0026] Obtaining the defect feature area of ​​the defect feature;

[0027] Matching the irradiation range of each LED die with the defect feature region of the defect feature to obtain an LED die matching the defect feature region of the defect feature;

[0028] Return to the step of selecting a defect feature until each defect feature has been selected once.

[0029] Furthermore, before adjusting the power or position of all LED dies matching each target defect feature to optimize each target defect feature, the method further includes:

[0030] Select a defect feature;

[0031] Analyze the defect feature and obtain the type of the defect feature;

[0032] Return to selecting a defect feature until each defect feature has been selected once;

[0033] Get the types of all defect features;

[0034] Create corresponding optimization criteria based on each type.

[0035] Furthermore, the adjusting the power or position of all LED dies matching each target defect feature to optimize each target defect feature includes:

[0036] Select a defect feature;

[0037] Get the type of the defect feature;

[0038] Based on the type of the defect feature, power or position adjustment is performed on the LED die that matches the defect feature until the defect feature meets the optimization standard corresponding to the type of the defect feature;

[0039] Return to the step of selecting a defect feature until each defect feature has been selected once.

[0040] Furthermore, the power or position of the LED die matching the defect feature is adjusted based on the type of the defect feature until the defect feature reaches the optimization standard corresponding to the type of the defect feature, and the above also includes

[0041] Create multiple LED die power regulation standards;

[0042] When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [80%, 100%] of the target feature area of ​​the target feature, the LED die power corresponding to the defect feature is adjusted to the first adjustment standard;

[0043] When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [60%, 80%) of the target feature area of ​​the target feature, the LED die power corresponding to the defect feature is adjusted to the second adjustment standard;

[0044] When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [40%, 60%) of the target feature area of ​​the target feature, the LED die power corresponding to the defect feature is adjusted to the third adjustment standard;

[0045] When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for (0, 40%) of the target feature area of ​​the target feature, the LED die power corresponding to the defect feature is adjusted to the fourth adjustment standard;

[0046] Create multiple LED die position adjustment standards;

[0047] When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [80%, 100%] of the target feature area of ​​the target feature, the LED die position corresponding to the defect feature is adjusted to the fifth adjustment standard;

[0048] When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [60%, 80%) of the target feature area of ​​the target feature, the LED die position corresponding to the defect feature is adjusted to the sixth adjustment standard;

[0049] When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [40%, 60%) of the target feature area of ​​the target feature, the LED die position corresponding to the defect feature is adjusted to the seventh adjustment standard;

[0050] When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for (0, 40%) of the target feature area of ​​the target feature, the LED die position corresponding to the defect feature is adjusted to the eighth adjustment standard.

[0051] Furthermore, the power or position of the LED die matching the defect feature is adjusted based on the defect feature type until the defect feature reaches the optimization standard corresponding to the defect feature type, including:

[0052] Select a defect feature;

[0053] Obtaining the power regulation standard of the LED die corresponding to the defect feature;

[0054] Based on the obtained power adjustment standard of the LED die, the LED die corresponding to the defect feature is controlled to be adjusted in a positive direction to obtain a target image after the power adjustment of the LED die;

[0055] Compare the target defect features of the target image with the target image after the LED die power is adjusted to obtain a comparison result;

[0056] Determine whether the comparison results show that the target defect characteristics have been improved;

[0057] If the comparison result shows that the target defect feature is improved, the control returns to the LED die corresponding to the defect feature and performs positive adjustment until the defect feature meets the optimization standard corresponding to the defect feature;

[0058] If the target defect feature is not improved according to the comparison result, the LED die corresponding to the defect feature is controlled to be adjusted in a negative direction until the defect feature meets the optimization standard corresponding to the defect feature;

[0059] Return to the step of selecting a defect feature until each defect feature has been selected once.

[0060] Furthermore, the power or position of the LED die matching the defect feature is adjusted based on the defect feature type until the defect feature reaches the optimization standard corresponding to the defect feature type, further comprising:

[0061] Select a defect feature;

[0062] Obtaining a position adjustment standard of the LED die corresponding to the defect feature;

[0063] Based on the obtained LED die position adjustment standard, the LED die corresponding to the defect feature is controlled to adjust the convergence direction to obtain a target image after the LED die position is adjusted;

[0064] Compare the target defect features of the target image with the target image after adjusting the position of the LED die to obtain a comparison result;

[0065] Determine whether the comparison results show that the target defect characteristics have been improved;

[0066] If the comparison result shows that the target defect feature is improved, returning to the control of adjusting the convergence direction of the LED dies corresponding to the defect feature until the defect feature meets the optimization standard corresponding to the defect feature;

[0067] If the target defect feature is not improved according to the comparison result, the diffusion direction of the LED die corresponding to the defect feature is adjusted until the defect feature meets the optimization standard corresponding to the defect feature;

[0068] Return to the step of selecting a defect feature until each defect feature has been selected once.

[0069] The present application relates to a high-power visual surface light source design method based on COB technology, which obtains images using visual equipment under the condition of initial light source illumination, and performs feature analysis based on the acquired images to obtain all target defect features, and matches LED chips for each target defect feature based on the illumination range of each LED chip, that is, the illumination coverage of the LED chip to the target defect feature is defined as matching the target defect feature, and then adjusts the power and position of each LED chip that matches the target defect feature so that the target defect feature can be improved or eliminated to meet the requirements of visual recognition. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] Figure 1 A schematic flow chart of a method for designing a high-power visual surface light source based on COB technology provided in one embodiment of the present application. DETAILED DESCRIPTION

[0071] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0072] like Figure 1 As shown, in one embodiment of the present application, the high-power visual surface light source design method based on COB technology includes the following S100 to S500:

[0073] S100 , acquiring a target image illuminated by an initial light source, wherein the initial light source includes a plurality of LED dies, and the target image includes a visually identifiable target.

[0074] Specifically, the target image is an image obtained when the initial light source is started to identify the target features in a normal working environment of the vision module.

[0075] S200, based on feature analysis of the target image, all target defect features in the target image are obtained.

[0076] Specifically, feature analysis is to use existing image recognition feature extraction technologies. Common algorithms include VGG network, Resnet network, and VGG16.

[0077] S300 , performing LED die matching based on each target defect feature, so that each target defect feature is matched to at least one LED die.

[0078] Specifically, the surface light source in the COB light source is composed of multiple LED chips that emit light.

[0079] S400: Based on each target defect feature, adjust the power or position of all LED dies that match it, so that each target defect feature is optimized.

[0080] S500: Output the adjusted power parameters and position parameters of all LED chips.

[0081] Specifically, the initial light source includes a plurality of LED chips arranged in an array.

[0082] In this embodiment, an image is acquired by using a visual device under the condition of initial light source illumination, and feature analysis is performed based on the acquired image to obtain all target defect features, and LED die matching is performed for each target defect feature based on the illumination range of each LED die, that is, the illumination coverage of the LED die to the target defect feature is defined as matching the target defect feature, and then the power and position of each LED die that matches the target defect feature are adjusted so that the target defect feature can be improved or eliminated to meet the requirements of visual recognition.

[0083] In one embodiment of the present application, the step of obtaining all target defect features in the target image based on feature analysis of the target image includes the following steps S201 to S202:

[0084] S201: Perform feature recognition on a target image to obtain at least one feature.

[0085] S202: Target feature screening is performed based on all obtained features to obtain at least one target feature, where the target feature includes a region where the target feature is located.

[0086] In this embodiment, multiple features are identified during the process of feature recognition of the target image, and the multiple features identified need to be screened, mainly the feature memory screening required for visual recognition.

[0087] In one embodiment of the present application, the step of obtaining all target defect features in the target image based on feature analysis of the target image further includes the following steps S203 to S209:

[0088] S203 , performing defect feature screening on all features obtained by performing feature recognition on the target image to obtain at least one defect feature, wherein the defect feature includes an area where the defect feature is located.

[0089] Specifically, by establishing a coordinate system for the target image, the boundary contour of each defect feature or each target feature can be described; when the target feature is obscured by the defect feature, the obscured part can be supplemented by simulating other parts based on the target feature, or the contour of the target feature can be roughly described based on the obscured part.

[0090] S204, selecting a defect feature.

[0091] S205 , obtaining a defect feature location area of ​​the defect feature and a target feature location area of ​​each target feature.

[0092] S206 , comparing the defect feature region of the defect feature with the target feature region of each target feature to obtain a comparison result.

[0093] S207: If the comparison result shows that the defect feature region of the defect feature has no intersection with the target feature region of each target feature, the defect feature is an invalid defect feature.

[0094] S208 , if the comparison result shows that the defect feature region of the defect feature and the target feature region of any target feature have an intersection, then the defect feature is the target defect feature.

[0095] S209, returning to the step of selecting a defect feature until each defect feature has been selected once.

[0096] Specifically, defect features refer to some features in the image that hinder feature recognition, such as areas with overexposure, areas with excessive noise, etc.

[0097] In this embodiment, each defect feature is analyzed, and the main analysis point is whether the area covered by the defect feature overlaps with the area where the target feature of one of the target features is located. If so, it means that the defect feature blocks the recognition of the target feature.

[0098] In one embodiment of the present application, performing LED die matching based on each target defect feature so that each target defect feature is matched to at least one LED die includes the following steps S301 to S305:

[0099] S301, analyzing the target image to obtain the illumination range of each LED die.

[0100] S302, select a defect feature.

[0101] S303: Obtain the defect feature area of ​​the defect feature.

[0102] S304 , matching the irradiation range of each LED die with the defect feature region of the defect feature to obtain an LED die matching the defect feature region of the defect feature.

[0103] S305, returning to the step of selecting a defect feature until each defect feature has been selected once.

[0104] In this embodiment, the irradiation range of each LED chip is first determined, and then the defect feature area of ​​each defect feature is obtained, and then the irradiation range of the LED chip and the defect feature area of ​​the defect feature are overlapped as a matching condition to obtain an LED chip that matches the defect feature area of ​​each defect feature.

[0105] In one embodiment of the present application, before adjusting the power or position of all LED dies matching each target defect feature to optimize each target defect feature, the following steps S410 to S440 are also included:

[0106] S410, selecting a defect feature.

[0107] S420: Analyze the defect feature to obtain the type of the defect feature.

[0108] S430, returning to the step of selecting a defect feature until each defect feature has been selected once, and obtaining the types of all defect features.

[0109] S440: Create a corresponding optimization standard based on each type.

[0110] In this embodiment, different optimization criteria are established based on the different types of defect features. For example, if the defect feature is noise, the optimization criteria for this type of defect feature is that the area where the noise is located does not overlap with the area where the target feature is located or the overlap rate is lower than a certain value.

[0111] In one embodiment of the present application, adjusting the power or position of all LED dies matching each target defect feature to optimize each target defect feature includes the following steps S401 to S404:

[0112] S401, select a defect feature.

[0113] S402: Obtain the type of the defect feature.

[0114] S403 , adjusting the power or position of the LED die matching the defect feature based on the type of the defect feature, until the defect feature reaches the optimization standard corresponding to the type of the defect feature.

[0115] S404, returning to the step of selecting a defect feature until each defect feature has been selected once.

[0116] In this embodiment, the power or position of the LED chip that matches the defect feature is adjusted to obtain a change in the defect feature, and the power or position of the LED chip that matches the defect feature is further adjusted based on the change in the defect feature to gradually make the defect feature meet the optimization criteria corresponding to the type of the defect feature.

[0117] In one embodiment of the present application, before adjusting the power or position of the LED die matching the defect feature based on the defect feature type until the defect feature reaches the optimization standard corresponding to the defect feature type, the following steps S402a to S402j are also included:

[0118] S402a, creating multiple LED chip power adjustment standards.

[0119] S402b, when the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [80%, 100%] of the target feature area of ​​the target feature, the LED die power corresponding to the defect feature is adjusted to the first adjustment standard.

[0120] S402c, when the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [60%, 80%) of the target feature area of ​​the target feature, the LED chip power corresponding to the defect feature is adjusted to the second adjustment standard.

[0121] S402d, when the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [40%, 60%) of the target feature area of ​​the target feature, the LED chip power corresponding to the defect feature is adjusted to the third adjustment standard.

[0122] S402e, when the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for (0, 40%) of the target feature area of ​​the target feature, the LED chip power corresponding to the defect feature is adjusted to the fourth adjustment standard.

[0123] S402f, creating multiple LED die position adjustment standards.

[0124] S402g: When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [80%, 100%] of the target feature area of ​​the target feature, the LED die position corresponding to the defect feature is adjusted to the fifth adjustment standard.

[0125] S402h, when the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [60%, 80%) of the target feature area of ​​the target feature, the LED die position corresponding to the defect feature is adjusted to the sixth adjustment standard.

[0126] S402i, when the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [40%, 60%) of the target feature area of ​​the target feature, the LED die position corresponding to the defect feature is adjusted to the seventh adjustment standard.

[0127] S402j, when the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for (0, 40%) of the target feature area of ​​the target feature, the LED die position corresponding to the defect feature is adjusted to the eighth adjustment standard.

[0128] Specifically, the first adjustment standard is greater than the second adjustment standard, the second adjustment standard is greater than the third adjustment standard, and the third adjustment standard is greater than the fourth adjustment standard.

[0129] The fifth adjustment standard is greater than the sixth adjustment standard, the sixth adjustment standard is greater than the seventh adjustment standard, and the seventh adjustment standard is greater than the eighth adjustment standard.

[0130] In this embodiment, the power and position adjustment ratio of the LED chip is set by adjusting the size of the intersection of the defect feature area and the target feature area of ​​the target feature, and the setting is progressive or step-by-step.

[0131] That is, the more target features are covered, the greater the step of adjusting the power and position of the LED die; the fewer target features are covered, the smaller the step of adjusting the power and position of the LED die.

[0132] In one embodiment of the present application, the power or position of the LED die matching the defect feature is adjusted based on the defect feature type until the defect feature reaches the optimization standard corresponding to the defect feature type, including the following steps S403a to S403h:

[0133] S403a, select a defect feature.

[0134] S403b: Obtain the power adjustment standard of the LED die corresponding to the defect feature.

[0135] S403c, based on the obtained power adjustment standard of the LED die, controlling the LED die corresponding to the defect feature to perform adjustment in a positive direction, and obtaining a target image after the power adjustment of the LED die.

[0136] S403d, comparing target defect features between the target image and the target image after the LED die power is adjusted to obtain a comparison result.

[0137] S403e, determining whether the comparison result shows that the target defect feature is improved.

[0138] S403f, if the comparison result shows that the target defect feature is improved, then return to the process of controlling the LED die corresponding to the defect feature to perform positive adjustment until the defect feature meets the optimization standard corresponding to the defect feature.

[0139] S403g: If the target defect feature is not improved as a result of the comparison, the LED die corresponding to the defect feature is controlled to be adjusted in a negative direction until the defect feature meets the optimization standard corresponding to the defect feature.

[0140] S403h, returning to the step of selecting a defect feature until each defect feature has been selected once.

[0141] In one embodiment of the present application, the power or position of the LED die matching the defect feature is adjusted based on the defect feature type until the defect feature reaches the optimization standard corresponding to the defect feature type, further comprising the following steps S403i to S403p:

[0142] S403i, select a defect feature.

[0143] S403j, obtaining a position adjustment standard of the LED die corresponding to the defect feature.

[0144] S403k, based on the obtained LED die position adjustment standard, controlling the LED die corresponding to the defect feature to adjust the convergence direction, and obtaining a target image after the LED die position is adjusted.

[0145] S4031 , performing target defect feature comparison between the target image and the target image after the LED die position is adjusted to obtain a comparison result.

[0146] S403m, determining whether the comparison result shows that the target defect feature is improved.

[0147] S403n: If the comparison result shows that the target defect feature is improved, the process returns to the step of controlling the LED dies corresponding to the defect feature to adjust the convergence direction until the defect feature meets the optimization standard corresponding to the defect feature.

[0148] S403o: If the target defect feature is not improved as a result of the comparison, the diffusion direction of the LED die corresponding to the defect feature is controlled to be adjusted until the defect feature meets the optimization standard corresponding to the defect feature.

[0149] S403p, returning to the process of selecting a defect feature until each defect feature has been selected once.

[0150] Specifically, during the process of adjusting the power and position of the LED crystal grains corresponding to the defect features, a target image under the adjusted light source obtained by the adjusted visual device is obtained each time the adjustment is made, and the direction and size of the adjustment step of the power and position of the LED crystal grains corresponding to the defect features for the next time are adjusted according to the changes in the defect features in the obtained target image.

[0151] In this embodiment, the power and position of the LED chips corresponding to the defect features are adjusted so that the target feature portion in the target image meets the requirements of visual recognition, and this method can quickly design the light source required for visual recognition. The design of the surface light source is specific to the power and position of each LED chip.

[0152] Specifically, the power and position of the LED chips are adjustable within a certain range.

[0153] The various technical features of the above-described embodiments can be combined arbitrarily, and the execution order of the method steps is not restricted. In order to make the description concise, not all possible combinations of the various technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0154] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A high-power visual surface light source design method based on COB technology, characterized in that: The high-power visual surface light source design method based on COB technology includes: Acquire a target image illuminated by an initial light source, wherein the initial light source includes a plurality of LED dies, and the target image includes a visually identifiable target; Based on the feature analysis of the target image, all target defect features in the target image are obtained; The feature analysis of the target image is based on obtaining all target defect features in the target image, including: Performing feature recognition on the target image to obtain at least one feature; Performing target feature screening based on all obtained features to obtain at least one target feature, wherein the target feature includes an area where the target feature is located; Perform defect feature screening on all features obtained by feature recognition based on the target image to obtain at least one defect feature, wherein the defect feature includes an area where the defect feature is located; Select a defect feature; Obtaining a defect feature location area of ​​the defect feature and a target feature location area of ​​each target feature; Comparing the defect feature region of the defect feature with the target feature region of each target feature to obtain a comparison result; If the comparison result shows that the defect feature region of the defect feature has no intersection with the target feature region of each target feature, then the defect feature is an invalid defect feature; If the comparison result shows that the defect feature region of the defect feature and the target feature region of any target feature intersect, then the defect feature is the target defect feature; Return to selecting a defect feature until each defect feature has been selected once; Perform LED die matching based on each target defect feature, so that each target defect feature is matched to at least one LED die; Based on each target defect feature, the power or position of all matching LED dies is adjusted to optimize each target defect feature. Output the adjusted power parameters and position parameters of all LED chips.

2. The high-power visual surface light source design method based on COB technology according to claim 1 is characterized in that: The initial light source includes a plurality of LED chips arranged in an array.

3. The high-power visual surface light source design method based on COB technology according to claim 1 is characterized in that: The LED die matching is performed based on each target defect feature, so that each target defect feature is matched to at least one LED die, including: Analyze the target image to obtain the illumination range of each LED die; Select a defect feature; Obtaining the defect feature area of ​​the defect feature; Matching the irradiation range of each LED die with the defect feature region of the defect feature to obtain an LED die matching the defect feature region of the defect feature; Return to the step of selecting a defect feature until each defect feature has been selected once.

4. The method for designing a high-power visual surface light source based on COB technology according to claim 3, characterized in that: Before adjusting the power or position of all LED dies matching each target defect feature to optimize each target defect feature, the method further includes: Select a defect feature; Analyze the defect feature and obtain the type of the defect feature; Return to selecting a defect feature until each defect feature has been selected once; Get the types of all defect features; Create corresponding optimization criteria based on each type.

5. The method for designing a high-power visual surface light source based on COB technology according to claim 4, characterized in that: The power or position of all LED dies matching each target defect feature is adjusted based on the target defect feature to optimize each target defect feature, including: Select a defect feature; Get the type of the defect feature; Based on the type of the defect feature, power or position adjustment is performed on the LED die that matches the defect feature until the defect feature meets the optimization standard corresponding to the type of the defect feature; Return to the step of selecting a defect feature until each defect feature has been selected once.

6. The method for designing a high-power visual surface light source based on COB technology according to claim 5, characterized in that: Before adjusting the power or position of the LED die matching the defect feature based on the defect feature type until the defect feature reaches an optimization standard corresponding to the defect feature type, the method further includes: Create multiple LED die power regulation standards; When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [80%, 100%] of the target feature area of ​​the target feature, the LED die power corresponding to the defect feature is adjusted to the first adjustment standard; When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [60%, 80%) of the target feature area of ​​the target feature, the LED die power corresponding to the defect feature is adjusted to the second adjustment standard; When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [40%, 60%) of the target feature area of ​​the target feature, the LED die power corresponding to the defect feature is adjusted to the third adjustment standard; When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for (0, 40%) of the target feature area of ​​the target feature, the LED die power corresponding to the defect feature is adjusted to the fourth adjustment standard; Create multiple LED die position adjustment standards; When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [80%, 100%] of the target feature area of ​​the target feature, the LED die position corresponding to the defect feature is adjusted to the fifth adjustment standard; When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [60%, 80%) of the target feature area of ​​the target feature, the LED die position corresponding to the defect feature is adjusted to the sixth adjustment standard; When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for [40%, 60%) of the target feature area of ​​the target feature, the LED die position corresponding to the defect feature is adjusted to the seventh adjustment standard; When the intersection of the defect feature area of ​​the defect feature and the target feature area of ​​the target feature accounts for (0, 40%) of the target feature area of ​​the target feature, the LED die position corresponding to the defect feature is adjusted to the eighth adjustment standard.

7. The method for designing a high-power visual surface light source based on COB technology according to claim 6, characterized in that: The step of adjusting the power or position of the LED die matching the defect feature based on the defect feature type until the defect feature reaches an optimization standard corresponding to the defect feature type includes: Select a defect feature; Obtaining the power regulation standard of the LED die corresponding to the defect feature; Based on the obtained power adjustment standard of the LED die, the LED die corresponding to the defect feature is controlled to be adjusted in a positive direction to obtain a target image after the power adjustment of the LED die; Compare the target defect features of the target image with the target image after the LED die power is adjusted to obtain a comparison result; Determine whether the comparison results show that the target defect characteristics have been improved; If the comparison result shows that the target defect feature is improved, the control returns to the LED die corresponding to the defect feature and performs positive adjustment until the defect feature meets the optimization standard corresponding to the defect feature; If the target defect feature is not improved according to the comparison result, the LED die corresponding to the defect feature is controlled to be adjusted in a negative direction until the defect feature meets the optimization standard corresponding to the defect feature; Return to the step of selecting a defect feature until each defect feature has been selected once.

8. The method for designing a high-power visual surface light source based on COB technology according to claim 7, characterized in that: The step of adjusting the power or position of the LED die matching the defect feature based on the defect feature type until the defect feature reaches an optimization standard corresponding to the defect feature type further includes: Select a defect feature; Obtaining a position adjustment standard of the LED die corresponding to the defect feature; Based on the obtained LED die position adjustment standard, the LED die corresponding to the defect feature is controlled to adjust the convergence direction to obtain a target image after the LED die position is adjusted; Compare the target defect features of the target image with the target image after adjusting the position of the LED die to obtain a comparison result; Determine whether the comparison results show that the target defect characteristics have been improved; If the comparison result shows that the target defect feature is improved, returning to the control of adjusting the convergence direction of the LED dies corresponding to the defect feature until the defect feature meets the optimization standard corresponding to the defect feature; If the target defect feature is not improved according to the comparison result, the diffusion direction of the LED die corresponding to the defect feature is adjusted until the defect feature meets the optimization standard corresponding to the defect feature; Return to the step of selecting a defect feature until each defect feature has been selected once.

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