Regenerative wafer semiconductor processing apparatus

Abstract

The application relates to the field of semiconductor production and discloses a regenerated wafer semiconductor processing device which comprises a base, support plates are fixedly and symmetrically installed on the left and right sides of the upper surface of the base, an installation plate is fixedly installed at the top of the support plate, air passage grooves are symmetrically formed in the left and right sides of the installation plate, and a plurality of electric heating plates are fixedly installed at equal intervals in the middle of the air passage grooves. The driving mechanism drives the rack mechanism to move to the left side, the upper ratchet drives the right ratchet to rotate counterclockwise, the right ratchet drives the right reel to rotate, the lower ratchet relatively slides with the left ratchet, and the left reel keeps a stationary state, so that the adhesive tape is wound on the right reel, and then the adhesive tape with the adhered photoresist is torn from the wafer surface, thereby solving the problem that the existing wafer adhesive removal device is difficult to remove the strongly adhered photoresist and the micro-size photoresist residues on the wafer surface through conventional soaking and flushing modes.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a regenerated wafer semiconductor processing apparatus. Background Technology

[0002] In semiconductor manufacturing processes, wafer recycling is of great significance for reducing production costs and improving resource utilization. In the wafer recycling process, removing residual photoresist on the surface is one of the key steps.

[0003] Currently, existing wafer photoresist removal and cleaning processes typically require multiple separate devices, including photoresist dissolution, ultrasonic cleaning, rinsing, and drying. This multi-device approach not only increases equipment investment and floor space requirements but also complicates the process flow and reduces overall operational efficiency. Furthermore, existing wafer photoresist removal devices mainly rely on immersion or simple rinsing to remove photoresist, which is insufficient to effectively remove photoresist residues with strong adhesion or small size. This is especially true when dealing with high-density patterned surfaces, where the cleaning effect is even more inadequate, easily causing contamination or defects in subsequent processes, affecting chip yield and device performance. Summary of the Invention

[0004] This application proposes a regenerated wafer semiconductor processing apparatus, which has the advantages of high efficiency and clean photoresist removal, and solves the problem that existing wafer desmearing devices are unable to remove strongly adhered photoresist and micro-sized photoresist residues on the wafer surface through conventional soaking and rinsing methods.

[0005] To achieve the above objectives, this application adopts the following technical solution: a regenerated wafer semiconductor processing apparatus, comprising:

[0006] The base has support plates symmetrically fixedly installed on the left and right sides of its upper surface.

[0007] Mounting plate, the mounting plate is fixedly installed on the top of the support plate, and ventilation slots are symmetrically opened on the left and right sides of the mounting plate. Multiple electric heating plates are fixedly installed at equal intervals in the middle of the ventilation slots.

[0008] A shell-melting mechanism is disposed in the middle of the base and the mounting plate;

[0009] A pushing mechanism is provided in the middle of the shell melting mechanism;

[0010] Two guide plates are symmetrically arranged on the front and rear sides of the upper surface of the mounting plate;

[0011] A drive mechanism is provided on the right side of the two guide plates;

[0012] Two rack mechanisms are symmetrically arranged on one side of two adjacent guide plates;

[0013] An adhesion mechanism is provided between two rack and pinion mechanisms.

[0014] Preferably, the melting mechanism includes a melting sleeve, which is fixedly fitted into the middle of the base. A cleaning sleeve is fixedly fitted into the upper part of the inner cavity of the melting sleeve. Multiple water pipe sleeves are fixedly fitted into the bottom circumference of the cleaning sleeve at equal intervals. Multiple air slots are symmetrically and equidistantly opened on the left and right sides of the upper part of the cleaning sleeve. The air slots are located in the middle of two adjacent heating plates. If the above structure is in operation, it can dissolve the photoresist on the wafer surface.

[0015] Preferably, the pushing mechanism includes a hydraulic rod, which is fixedly sleeved in the middle of the inner cavity of the melting sleeve. A first driving component is fixedly installed at the top end of the hydraulic rod. A thrust bearing is fixedly installed on the upper surface of the first driving component. A carrier shell is fixedly installed at the top end of the thrust bearing. The output end of the first driving component is fixed to the bottom surface of the carrier shell. Multiple limiting blocks are fixedly installed circumferentially on the upper surface of the carrier shell. As described above, the structure can push the wafer upward during operation.

[0016] Preferably, the guide plate includes a side groove, which is disposed on one side of two adjacent guide plates. Guide grooves are symmetrically provided on the upper and lower sides of the side groove, and limit grooves are symmetrically provided on the upper and lower sides of the side groove.

[0017] Preferably, the driving mechanism includes a second driving member, which is fixedly mounted on the right side of the upper surface of the mounting plate. A shaft is fixedly sleeved in the middle of the output shaft of the second driving member. The shaft is movably sleeved with a guide plate. Both the front and rear sides of the shaft are fixedly sleeved with driving pulleys. A belt is sleeved in the middle of each of the two driving pulleys. Friction wheels are symmetrically and movably sleeved in the middle of the two guide plates on opposite sides. A driven pulley is fixedly mounted in the middle of each of the two friction wheels on opposite sides. The belt is sleeved in the middle of the driven pulley. If the above structure is in operation, it can drive the rack and pinion mechanism to move left and right.

[0018] Preferably, the rack mechanism includes a slider, which is slidably sleeved in the middle of the guide groove. Both the upper and lower sides of the left side of the slider are provided with ratchet bars. The adjacent sides of the two ratchet bars are provided with conical teeth in opposite directions. The sides of the two ratchet bars that are far apart are symmetrically fixedly installed with connecting blocks. The sides of the two connecting blocks that are far apart are symmetrically fixedly installed with friction strips. The two friction strips alternately rub against the friction wheel on the same side. If the above structure can be used, it can drive the adhesion mechanism to rotate in both directions during operation.

[0019] Preferably, the bonding mechanism includes two rollers, which are movably sleeved on the left side of the two guide plates. The contact surfaces of the rollers and the guide plates are all coated with rubber. The left roller is located below the right roller. Ratchets are symmetrically fixedly sleeved on the front and rear sides of the two rollers. Guide shafts are movably sleeved on the upper and lower sides of the two sliders. Adhesive tape is sleeved between the rollers and the guide shafts. As described above, the structure can bond the photoresist on the wafer surface during operation.

[0020] Preferably, the bottom of the dissolving sleeve cavity is filled with an organic solution for dissolving photoresist, and the liquid level of the organic solution is located below the dissolving sleeve.

[0021] Preferably, the contact surface between the carrier shell and the cleaning sleeve is a smooth surface, and both the contact surfaces of the carrier shell and the cleaning sleeve are provided with a wear-resistant coating.

[0022] Preferably, the friction wheel adopts a half-gear design, and the friction wheel alternately rubs against the upper and lower friction strips, and the contact surfaces of the friction wheel and the friction strips are both rough surfaces.

[0023] The beneficial effects of this invention are as follows:

[0024] 1. By initiating the forward-moving pusher mechanism, the mechanism pushes the photoresist wafer, after organic solvent decomposition, upwards from the center of the dissolving sleeve cavity to a position between the organic solution surface and the bottom of the cleaning sleeve. Under the centrifugal force of rotation, the organic solution on the wafer surface is separated from the wafer surface. Then, as the pusher mechanism moves the wafer upwards to the bottom of the cleaning sleeve cavity, an aqueous solution is injected between the cleaning sleeve cavity and the upper surface of the carrier shell through water pipes on both the front and rear sides. Water exits from the left and right water pipes, thus rinsing the photoresist on the upper surface of the wafer, which is being rotated by the pusher mechanism, and removing the photoresist with low adhesion strength from the wafer surface. After the wafer surface is separated, the pushing mechanism moves the wafer to the air tank area. At this time, the external air pump blows air in through the left side of the ventilation slot. After being heated by the electric heating plate on the left side, the air flows into the inner cavity of the cleaning jacket, heating the wafer located in the inner cavity of the cleaning jacket and causing the moisture on the wafer surface to evaporate. The evaporated air flows out of the device from the right end of the ventilation slot. Finally, the pushing mechanism moves the dried wafer to the top of the cleaning jacket, thereby realizing the rapid dissolution, cleaning and drying of the photoresist on the wafer surface. This overcomes the problem of increased cost and reduced efficiency caused by the existing dissolution, cleaning and drying processes being carried out by multiple different devices.

[0025] 2. In this invention, when the drive mechanism moves the rack and pinion mechanism to the right, the lower ratchet drives the left ratchet to rotate counterclockwise, and the left ratchet drives the left spool to rotate counterclockwise. The upper ratchet slides relative to the right ratchet, and due to the frictional contact between the spool and the guide plate, the right spool remains stationary. At this time, the slider moving to the right pulls the tape on the left spool through the guide shaft, covering the adhesive side of the tape onto the surface of the wafer. Simultaneously, the lower guide shaft squeezes the tape and the wafer, causing the tape to adhere to the upper surface of the wafer. When the drive mechanism moves the rack and pinion mechanism to the left, the upper ratchet drives the right ratchet to rotate counterclockwise, and the right ratchet drives the right spool to rotate. The lower ratchet slides relative to the left ratchet, and the left spool remains stationary. This allows the adhesive tape to be wound onto the right spool, thus peeling the adhesive tape off the wafer surface. This overcomes the problem that existing wafer adhesive removal devices are unable to remove strongly adhered photoresist and micro-sized photoresist residues from the wafer surface through conventional soaking and rinsing methods. Attached Figure Description

[0026] The accompanying drawings, which form part of this specification, illustrate embodiments disclosed in this application and, together with the specification, serve to explain the principles of this application in a clear and understandable manner.

[0027] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, wherein:

[0028] Figure 1 This is a schematic diagram of the overall appearance and structure of the present invention;

[0029] Figure 2 This is a schematic diagram of the shell-dissolving mechanism of the present invention;

[0030] Figure 3 This is a schematic diagram of the pushing mechanism of the present invention;

[0031] Figure 4 This is a schematic diagram of the guide plate structure of the present invention;

[0032] Figure 5 This is a schematic diagram of the adhesion mechanism of the present invention;

[0033] Figure 6 This is a schematic diagram of the rack and pinion mechanism of the present invention;

[0034] Figure 7 This is a schematic diagram of the drive mechanism structure of the present invention.

[0035] The components include: 1. Base; 101. Support plate; 2. Mounting plate; 201. Ventilation slot; 202. Heating plate; 3. Melting mechanism; 301. Melting sleeve; 302. Cleaning sleeve; 303. Water pipe sleeve; 304. Air slot; 4. Pushing mechanism; 401. Hydraulic rod; 402. First driving component; 403. Thrust bearing; 404. Carrier shell; 405. Limiting block; 5. Guide plate; 501. Side slot; 502. 503. Guide groove; 6. Limiting groove; 7. Drive mechanism; 601. Second drive component; 602. Shaft; 603. Drive pulley; 604. Belt; 605. Friction wheel; 606. Driven pulley; 7. Rack mechanism; 701. Slider; 702. Ratchet; 703. Connecting block; 704. Friction strip; 8. Adhesive mechanism; 801. Roller; 802. Ratchet; 803. Guide shaft; 804. Adhesive tape. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0037] Please see Figures 1 to 7 As shown, a regenerated wafer semiconductor processing apparatus includes:

[0038] Base 1, with support plates 101 symmetrically fixed on the left and right sides of the upper surface of base 1;

[0039] Mounting plate 2 is fixedly installed on the top of support plate 101. Ventilation slots 201 are symmetrically opened on the left and right sides of mounting plate 2. Multiple electric heating plates 202 are fixedly installed at equal intervals in the middle of ventilation slots 201.

[0040] The shell-melting mechanism 3 is located in the middle of the base 1 and the mounting plate 2;

[0041] The dissolving mechanism 3 includes a dissolving sleeve 301, which is fixedly sleeved in the middle of the base 1. A cleaning sleeve 302 is fixedly sleeved in the upper part of the inner cavity of the dissolving sleeve 301. Multiple water pipe sleeves 303 are fixedly sleeved at equal intervals on the bottom circumference of the cleaning sleeve 302. Multiple air grooves 304 are symmetrically and equidistantly opened on the left and right sides of the upper part of the cleaning sleeve 302. The air grooves 304 are located in the middle of two adjacent electric heating plates 202.

[0042] The bottom of the cavity of the dissolving sleeve 301 is filled with an organic solution for dissolving photoresist, and the surface of the organic solution is located below the dissolving sleeve 301. This allows the organic solution on the wafer surface to flow from the wafer surface to the center of the cavity of the dissolving sleeve 301 when the hydraulic rod 401 pushes the wafer upward from the organic solution in the middle of the cavity of the dissolving sleeve 301 to the bottom of the cleaning sleeve 302 via the first driving component 402, the thrust bearing 403, and the carrier shell 404. This prevents a large amount of organic solution from remaining between the carrier shell 404 and the cavity of the cleaning sleeve 302 when the carrier shell 404 moves upward and slides into contact with the bottom of the cavity of the cleaning sleeve 302, thus avoiding waste of organic solution.

[0043] Pushing mechanism 4 is located in the middle of the shell melting mechanism 3;

[0044] The pushing mechanism 4 includes a hydraulic rod 401, which is fixedly sleeved in the middle of the inner cavity of the dissolving sleeve 301. A first driving member 402 is fixedly installed at the top of the hydraulic rod 401. A thrust bearing 403 is fixedly installed on the upper surface of the first driving member 402. A carrying shell 404 is fixedly installed at the top of the thrust bearing 403. The output end of the first driving member 402 is fixed on the bottom surface of the carrying shell 404. Multiple limiting blocks 405 are fixedly installed circumferentially on the upper surface of the carrying shell 404.

[0045] The contact surface between the carrier shell 404 and the cleaning sleeve 302 is a smooth surface, and both contact surfaces are coated with a wear-resistant coating. This improves the sealing and wear resistance between the carrier shell 404 and the cleaning sleeve 302, and prevents the water solution from flowing from the contact gap between the carrier shell 404 and the cleaning sleeve 302 into the cavity of the dissolving sleeve 301 when the carrier shell 404 moves upward and slides into the cleaning sleeve 302. This prevents the water solution from mixing with the organic solution in the cavity of the dissolving sleeve 301, which would otherwise reduce the concentration of the organic solution and worsen the dissolving effect.

[0046] In use, the drive mechanism 6, through the rack and pinion mechanism 7, causes the right side of the adhesive tape 804 inside the adhesion mechanism 8 to retract to the leftmost side. Then, the wafer to be processed is placed in the middle of the limiting block 405 on the upper surface of the carrier shell 404. Next, the hydraulic rod 401 is activated in reverse, causing its telescopic end to retract. The hydraulic rod 401, through the first drive component 402 and the thrust bearing 403, moves the wafer on the upper surface of the carrier shell 404 from the upper part of the cleaning sleeve 302 cavity downwards to the middle of the dissolving sleeve 301 cavity, immersing the wafer in the dissolving sleeve 301. In the organic solution inside the cavity 01, the organic solution dissolves the photoresist on the wafer surface. Then, the hydraulic rod 401 is activated in the forward direction. When the hydraulic rod 401 pushes the wafer on the upper surface of the carrier shell 404 upward through the first drive member 402 and the thrust bearing 403 to the point between the surface of the organic solution and the bottom of the cleaning sleeve 302, the first drive member 402 is activated. When the output end of the first drive member 402 drives the carrier shell 404 to rotate, the carrier shell 404 drives the wafer to rotate, so that the organic solution on the wafer surface is separated from the wafer surface under the action of centrifugal force.

[0047] When the rotating carrier shell 404 moves upward and slides into the bottom of the inner cavity of the cleaning sleeve 302, an aqueous solution is injected between the inner cavity of the cleaning sleeve 302 and the upper surface of the carrier shell 404 through the water pipe sleeves 303 on both the front and rear sides. At this time, the aqueous solution washes the photoresist on the upper surface of the wafer that is being rotated by the carrier shell 404, causing the photoresist with low adhesion strength to separate from the wafer surface. As the carrier shell 404 moves the wafer upward to the position of the water pipe sleeve 303, the aqueous solution above the carrier shell 404 in the inner cavity of the cleaning sleeve 302 flows out of the inner cavity of the cleaning sleeve 302 through the water pipe sleeves 303 on both the left and right sides, thereby reducing the moisture content between the upper surface of the carrier shell 404 and the wafer surface in the inner cavity of the water pipe sleeve 303.

[0048] Next, the carrier shell 404 continues to move upward until it moves the wafer to the air tank 304 area. At this time, the external air pump blows air in through the left side of the ventilation slot 201. After being heated by the electric heating plate 202 on the left side, the air flows into the inner cavity of the cleaning sleeve 302, heating the wafer above the carrier shell 404 in the inner cavity of the cleaning sleeve 302. This causes the moisture on the wafer surface to evaporate and flow out of the device from the right end of the ventilation slot 201. Finally, the carrier shell 404 moves the dried wafer to the top of the cleaning sleeve 302, thereby realizing the rapid dissolution, cleaning and drying of the photoresist on the wafer surface. This overcomes the problems of increased cost and reduced efficiency caused by the existing dissolution, cleaning and drying processes being carried out by multiple different devices.

[0049] Please see Figures 1 to 7 As shown, two guide plates 5 are symmetrically arranged on the front and rear sides of the upper surface of the mounting plate 2.

[0050] The guide plate 5 includes a side groove 501, which is disposed on one side of two adjacent guide plates 5. Guide grooves 502 are symmetrically provided on the upper and lower sides of the side groove 501, and limit grooves 503 are symmetrically provided on the upper and lower sides of the side groove 501.

[0051] Drive mechanism 6 is located on the right side of the two guide plates 5;

[0052] The drive mechanism 6 includes a second drive component 601, which is fixedly installed on the right side of the upper surface of the mounting plate 2. A shaft 602 is fixedly sleeved in the middle of the output shaft of the second drive component 601. The shaft 602 is movably sleeved with the guide plate 5. Both the front and rear sides of the shaft 602 are fixedly sleeved with drive pulleys 603. A belt 604 is sleeved in the middle of each of the two drive pulleys 603. Friction wheels 605 are symmetrically and movably sleeved in the middle of the two guide plates 5 on opposite sides. A passive pulley 606 is fixedly installed in the middle of each of the two friction wheels 605 on opposite sides. The belt 604 is sleeved in the middle of the passive pulley 606.

[0053] Among them, the friction wheel 605 adopts a half gear design, so that the friction wheel 605 alternately rubs against the upper and lower friction strips 704, thereby enabling the drive mechanism 6 to drive the rack mechanism 7 to move left and right alternately. In addition, the contact surfaces of the friction wheel 605 and the friction strips 704 are both rough surfaces, thereby increasing the frictional resistance between the friction wheel 605 and the friction strips 704 and preventing relative sliding between the friction wheel 605 and the friction strips 704 when the friction wheel 605 drives the friction strips 704 to move, which would reduce the transmission efficiency of the friction wheel 605 and the friction strips 704.

[0054] Two rack mechanisms 7 are symmetrically arranged on one side of the two guide plates 5;

[0055] The rack and pinion mechanism 7 includes a slider 701, which is slidably sleeved in the middle of the guide groove 502. Both the upper and lower sides of the left side of the slider 701 are provided with ratchet 702. A connecting block 703 is symmetrically fixedly installed on the side of the two ratchet 702 that is far apart from each other. Friction strips 704 are symmetrically fixedly installed on the side of the two connecting blocks 703 that is far apart from each other. The two friction strips 704 alternately rub against the friction wheel 605 on the same side.

[0056] The two ratchet bars 702 have beveled teeth facing opposite directions on their adjacent sides. This allows the lower ratchet bar 702 to rotate and the upper ratchet bar 702 to slide relative to the right ratchet wheel 802 when the slider 701 moves the two ratchet bars 702 to the right. When the slider 701 moves the two ratchet bars 702 to the left, the lower ratchet bar 702 slides relative to the left ratchet wheel 802 and the upper ratchet bar 702 rotates the right ratchet wheel 802.

[0057] An adhesion mechanism 8 is disposed between two rack mechanisms 7;

[0058] The adhesive mechanism 8 includes two rollers 801, which are movably sleeved on the left side of the two guide plates 5. The left roller 801 is located below the right roller 801. Ratchets 802 are symmetrically fixedly sleeved on both the front and rear sides of the two rollers 801. Guide shafts 803 are movably sleeved on the upper and lower sides of the two sliders 701. Adhesive tape 804 is sleeved between the multiple rollers 801 and the guide shafts 803.

[0059] The contact surfaces of the spool 801 and the guide plate 5 are coated with rubber to increase the frictional resistance between the spool 801 and the guide plate 5. This prevents the spool 801 on one side from pulling the spool 801 on the other side to rotate via the tape 804 when one side of the spool 801 rotates, which would cause the tape 804 to become loose on both sides and thus result in a poor adhesion of the tape 804 to the photoresist on the wafer surface.

[0060] Working principle:

[0061] When this invention is used, the second driving component 601 is activated, which drives the shaft 602 to rotate. The shaft 602 drives the driving pulley 603 to rotate. The driving pulley 603 drives the driven pulley 606 to rotate via the belt 604. The driven pulley 606 drives the friction wheel 605 to rotate. The friction wheel 605 first contacts the lower friction strip 704, pushing the lower friction strip 704 to the right. The lower friction strip 704 drives the lower ratchet 702 to the right via the connecting block 703. The lower ratchet 702 drives the slider 701 to the right. The slider 701 drives the upper ratchet 702 to the right. At this time, the lower... The square ratchet 702 drives the left ratchet 802 to rotate counterclockwise, and the left ratchet 802 drives the left spool 801 to rotate counterclockwise. The upper ratchet 702 slides relative to the right ratchet 802. Due to the frictional contact between the spool 801 and the guide plate 5, the right spool 801 remains stationary. At this time, the slider 701 moving to the right pulls the tape 804 on the left spool 801 through the guide shaft 803, covering the adhesive surface of the bottom of the tape 804 onto the surface of the wafer. At the same time, the lower guide shaft 803 squeezes the tape 804 and the wafer, and the tape 804 adheres to the upper surface of the wafer and the photoresist on the upper surface of the wafer.

[0062] When the friction wheel 605 rotates to contact the upper friction strip 704, the friction strip 704 drives the upper ratchet 702 to move to the left through the connecting block 703. The upper ratchet 702 drives the slider 701 to move to the left, and the slider 701 drives the lower ratchet 702 to move to the left. At this time, the upper ratchet 702 drives the right ratchet 802 to rotate counterclockwise, and the right ratchet 802 drives the right spool 801 to rotate. The lower ratchet 702 slides relative to the left ratchet 802, and the left spool 801 remains stationary. This allows the tape 804 to be wound onto the right spool 801, thereby peeling the adhesive tape 804 from the wafer surface. This overcomes the problem that existing wafer desmearing devices are unable to remove strongly adhered photoresist and micro-sized photoresist residues from the wafer surface through conventional soaking and rinsing methods.

[0063] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A semiconductor processing apparatus for regenerated wafers, characterized in that, include: The base (1) has support plates (101) symmetrically fixedly installed on the left and right sides of the upper surface of the base (1). Mounting plate (2), the mounting plate (2) is fixedly installed on the top of the support plate (101), and ventilation slots (201) are symmetrically opened on the left and right sides of the mounting plate (2), and multiple electric heating plates (202) are fixedly installed at equal intervals in the middle of the ventilation slots (201). A shell-melting mechanism (3) is provided in the middle of the base (1) and the mounting plate (2); The pushing mechanism (4) is located in the middle of the shell melting mechanism (3); Two guide plates (5) are symmetrically arranged on the front and rear sides of the upper surface of the mounting plate (2); A drive mechanism (6) is provided on the right side of the two guide plates (5); Two rack mechanisms (7) are symmetrically arranged on one side adjacent to the two guide plates (5); An adhesion mechanism (8) is provided between two rack mechanisms (7); The dissolving mechanism (3) includes a dissolving sleeve (301), which is fixedly sleeved in the middle of the base (1). A cleaning sleeve (302) is fixedly sleeved in the upper part of the inner cavity of the dissolving sleeve (301). Multiple water pipe sleeves (303) are fixedly sleeved at equal intervals on the bottom circumference of the cleaning sleeve (302). Multiple air slots (304) are symmetrically and equidistantly opened on the left and right sides of the upper part of the cleaning sleeve (302). The air slots (304) are located in the middle of two adjacent heating plates (202). The pushing mechanism (4) includes a hydraulic rod (401), which is fixedly sleeved in the middle of the inner cavity of the dissolving sleeve (301). A first driving member (402) is fixedly installed at the top of the hydraulic rod (401). A thrust bearing (403) is fixedly installed on the upper surface of the first driving member (402). A carrying shell (404) is fixedly installed at the top of the thrust bearing (403). The output end of the first driving member (402) is fixed on the bottom surface of the carrying shell (404). A plurality of limiting blocks (405) are fixedly installed circumferentially on the upper surface of the carrying shell (404).

2. The semiconductor regenerated wafer processing apparatus according to claim 1, characterized in that, The guide plate (5) includes a side groove (501), which is located on one side of two adjacent guide plates (5). The upper and lower sides of the side groove (501) are symmetrically provided with guide grooves (502), and the upper and lower sides of the side groove (501) are symmetrically provided with limit grooves (503).

3. The semiconductor regenerated wafer processing apparatus according to claim 2, characterized in that, The drive mechanism (6) includes a second drive member (601), which is fixedly installed on the right side of the upper surface of the mounting plate (2). A shaft (602) is fixedly sleeved in the middle of the output shaft of the second drive member (601). The shaft (602) is movably sleeved with the guide plate (5). Both the front and rear sides of the shaft (602) are fixedly sleeved with drive pulleys (603). A belt (604) is sleeved in the middle of the two drive pulleys (603). Friction wheels (605) are symmetrically and movably sleeved in the middle of the two guide plates (5) on opposite sides. A passive pulley (606) is fixedly installed in the middle of the two friction wheels (605) on opposite sides. The belt (604) is sleeved in the middle of the passive pulley (606).

4. The semiconductor regenerated wafer processing apparatus according to claim 3, characterized in that, The rack mechanism (7) includes a slider (701), which is slidably sleeved in the middle of the guide groove (502). Both upper and lower sides of the left side of the slider (701) are provided with ratchet bars (702). The two adjacent sides of the two ratchet bars (702) are provided with bevel teeth in opposite directions. The two ratchet bars (702) are symmetrically fixedly installed with connecting blocks (703) on the opposite sides. The two connecting blocks (703) are symmetrically fixedly installed with friction strips (704) on the opposite sides. The two friction strips (704) alternately rub against the friction wheel (605) on the same side.

5. The semiconductor regenerated wafer processing apparatus according to claim 4, characterized in that, The adhesive mechanism (8) includes two rollers (801), which are movably sleeved on the left side of the two guide plates (5). The contact surfaces of the rollers (801) and the guide plates (5) are all coated with rubber. The left roller (801) is located below the right roller (801). Ratchets (802) are symmetrically fixedly sleeved on the front and rear sides of the two rollers (801). Guide shafts (803) are movably sleeved on the upper and lower sides of the two sliders (701). Adhesive tape (804) is sleeved between the multiple rollers (801) and the guide shafts (803).

6. The semiconductor regenerated wafer processing apparatus according to claim 5, characterized in that, The bottom of the cavity of the dissolving sleeve (301) is filled with an organic solution for dissolving photoresist, and the liquid level of the organic solution is located below the dissolving sleeve (301).

7. The semiconductor regenerated wafer processing apparatus according to claim 6, characterized in that, The contact surface between the carrier shell (404) and the cleaning sleeve (302) is a smooth surface, and both the contact surfaces of the carrier shell (404) and the cleaning sleeve (302) are provided with a wear-resistant coating.

8. The semiconductor regenerated wafer processing apparatus according to claim 7, characterized in that, The friction wheel (605) adopts a half-gear design. The friction wheel (605) alternately rubs against the upper and lower friction strips (704). The contact surfaces of the friction wheel (605) and the friction strips (704) are both rough surfaces.

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