A manufacturing method of a surface flexible layer rigid-flexible combination board for an intelligent video module

By first making a copper layer window pattern in the flexible area and then pressing and electroplating the entire area in one go, the problems of easy adhesive residue and uneven copper thickness in the through holes of the flexible board area in the existing technology are solved, and efficient and high-quality rigid-flex board processing is achieved.

CN120583616BActive Publication Date: 2025-10-24深せん市実锐泰科技有限公司
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Patent Information

Application Number
CN202511093318.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-08-06
Publication Date
2025-10-24
Estimated Expiration
2045-08-06

AI Technical Summary

Technical Problem

In the prior art of manufacturing rigid-flex boards, the through holes in the flexible board area are easily attacked by chemicals, resulting in colloid residue, and the two electroplating processes lead to uneven copper thickness, affecting the processing quality.

Method used

The method of first making a copper layer window pattern in the flexible area, and then electroplating the through holes in the rigid area and the blind holes to be plated in the flexible area at one time after overall lamination is adopted. Combined with a high-flow adhesive prepreg and an auxiliary lamination structure, the consistency of the copper plating layer thickness is ensured, and the processing flow is optimized through laser ablation and plasma treatment.

Benefits of technology

It improves processing efficiency, reduces the risk of deviation caused by multiple alignments, ensures the consistency of copper plating thickness, avoids problems such as solution penetration and colloid residue, and improves product yield and processing accuracy.

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Abstract

The application discloses a manufacturing method of a rigid-flexible combined board with a surface flexible layer for an intelligent video module, takes a double-sided flexible copper-clad plate, opens a window on a first copper layer corresponding to a first through hole to form a flexible core plate; takes a first covering film and opens a window corresponding to the first through hole to form a window covering film; attaches the window covering film to one side of a second copper layer of the flexible core plate to form a covering film core plate; takes a semi-cured sheet and makes a glue-blocking film corresponding to a flexible area of the semi-cured sheet to form a glue-blocking semi-cured sheet and make a rigid core plate; stacks and presses each layer plate in sequence from top to bottom, with the glue-blocking film facing the covering film core plate, then makes a through hole on a rigid area, laser-ablates an insulating medium layer corresponding to a copper layer window pattern, electroplates, and then carries out uncovering processing, then removes the second copper layer at the bottom of a blind hole to form a first through hole, and finally forms a rigid-flexible combined board, and the metallization processes of the flexible area and the rigid area are combined into one electroplating process, so that the consistency of the copper layer thickness is ensured.
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