Micro-channel heat dissipation device based on jet flow self-injection mixing
Through the microchannel heat dissipation device of jet self-induced blasting, the problems of low heat exchange efficiency of single-phase flow and complex control of two-phase flow in traditional microchannel heat dissipation technology are solved, and efficient and integrated cooling effect is achieved, system volume and energy consumption are reduced, and temperature uniformity and cooling performance are improved.
Patent Information
- Application Number
- CN202510705893.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-29
- Publication Date
- 2025-09-02
AI Technical Summary
In traditional microchannel heat dissipation technology, the single-phase flow heat transfer efficiency is low, and the two-phase flow depends on complex control and the integration of jet technology is low, resulting in increased system complexity and energy consumption, which cannot effectively improve heat dissipation efficiency.
A micro-channel heat dissipation device with jet self-induced injection blending is used to form jets in the micro-channel through the nozzle, and the local flow rate is automatically increased in the micro-channel by using the induction effect, forming a two-phase flow as a gas source, replacing the external bubble control device, and the integrated structure realizes jet self-induced injection, reducing system volume and power consumption, and enhancing cooling performance.
It improves the cooling performance and temperature uniformity of the microchannel heat exchanger, reduces the system volume and energy consumption, enhances the cooling effect in the microchannel, reduces the boundary layer thickness and thermal resistance, and is suitable for heat dissipation needs under high heat flow density.
Smart Images
Figure CN120583643A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of radiators, and in particular to a microchannel heat dissipation device based on jet self-injection mixing. Background Art
[0002] As the power density of electronic devices continues to increase, traditional heat dissipation technologies face severe challenges. Currently, efficient cooling technology for high-power devices has become crucial for the development of industries such as semiconductor chips and radar. Microchannel heat exchangers, with their advantages such as high specific surface area and compact structure, have become an important solution for high-heat flux heat dissipation. However, existing microchannel technology still faces the following bottlenecks:
[0003] First, the single-phase flow microchannel heat exchanger is limited by the contradiction between the working fluid flow rate and the thickness of the thermal boundary layer. Although the thermal boundary layer can be thinned by simply reducing the channel size or increasing the flow rate, it will cause a sharp increase in pressure drop, resulting in pump power loss and flow instability. Especially under high heat flow conditions, the laminar bottom layer formed at the solid-liquid interface significantly increases the heat transfer resistance, restricting the improvement of heat dissipation efficiency. In order to further improve the heat transfer performance of the microchannel heat exchanger, CN 113066772 B redesigned the microchannel structure and flow rate distribution, further improving the heat transfer performance in the microchannel, but the structure is complex, and processing and packaging are difficult, and it is impossible to perform secondary optimization of heat exchange on the established structure.
[0004] Secondly, while two-phase flow microchannels can significantly improve heat transfer coefficients through phase change latent heat, existing technologies often rely on external bubble generation devices (such as microporous bubblers) or complex flow channel designs to induce phase change. This not only increases system complexity and manufacturing costs, but also makes it more likely to cause reliability issues such as flow blockage and cavitation collapse shock.
[0005] Furthermore, while improved solutions using jet impingement heat transfer can enhance boundary layer disturbances by placing an array of independent jet nozzles above the microchannels, such external jet systems require additional high-pressure pumping equipment, increasing energy consumption and reducing space utilization. Furthermore, the jet working fluid lacks effective mixing with the main fluid, preventing the formation of a continuous, self-sustaining enhanced heat transfer mechanism.
[0006] The disclosure of the above background technology content is only used to assist in understanding the inventive concept and technical solution of the present invention. It does not necessarily belong to the prior art of this patent application, nor does it necessarily provide technical guidance. In the absence of clear evidence that the above content has been disclosed before the filing date of this patent application, the above background technology should not be used to evaluate the novelty and creativity of this application. Summary of the Invention
[0007] In order to solve the technical problems faced by traditional microchannel heat dissipation technology, such as low single-phase flow heat transfer efficiency, dependence on complex control of two-phase flow and low integration of jet technology, the present invention proposes a microchannel heat dissipation device based on jet self-injection mixing, which solves the technical problems faced by traditional microchannel heat dissipation technology, such as low single-phase flow heat transfer efficiency, dependence on complex control of two-phase flow and low integration of jet technology. It autonomously increases the local flow velocity in the microchannel to enhance heat transfer, relies on the two-phase flow formed by its own heat exchange as the gas source, and replaces the external bubble control device; the integrated structure realizes jet self-injection, reduces the system volume and power consumption, not only improves the local mass flux through the injection effect to thin the boundary layer, but also utilizes the jet and the injected gas to spontaneously form a two-phase flow disturbance, thereby enhancing the cooling performance in the microchannel heat exchanger and improving the temperature uniformity of the heat exchange wall.
[0008] In order to achieve the above object, the technical solution of the present invention is as follows:
[0009] The present invention provides a microchannel heat dissipation device based on jet self-injection mixing, comprising:
[0010] a bottom plate, wherein a microchannel heat exchanger is provided on the bottom plate;
[0011] a cover plate, the cover plate being arranged corresponding to the bottom plate, the cover plate being provided with an injection inlet, an injection channel and an injection outlet, the injection inlet being connected to the injection outlet through the injection channel;
[0012] A nozzle is provided between the cover plate and the bottom plate, one end of the nozzle is provided at the cooling medium inlet side, and the nozzle is used to accelerate the cooling medium to form a jet medium; the outflowing medium of the injection outlet is mixed with the jet medium of the nozzle.
[0013] The present invention proposes a microchannel heat dissipation device based on jet self-injection mixing, which solves the technical problems faced by traditional microchannel heat dissipation technology, such as low single-phase flow heat exchange efficiency, reliance on complex control of two-phase flow and low integration of jet technology. It autonomously increases the local flow velocity in the microchannel to enhance heat exchange, and relies on the two-phase flow formed by its own heat exchange as the gas source to replace the external bubble control device; the integrated structure realizes jet self-injection, reduces the system volume and power consumption, not only increases the local mass flux through the injection effect to thin the boundary layer, but also utilizes the mixing of the jet and the injected gas to spontaneously form a two-phase flow disturbance, thereby enhancing the cooling performance in the microchannel heat exchanger and improving the temperature uniformity of the heat exchange wall.
[0014] As a preferred technical solution, the other end of the nozzle is arranged at the inlet side of the microchannel heat exchanger, parallel to the flow direction of the cooling medium and generates a jet.
[0015] As an optimal technical solution, the nozzle generates a jet to create a pressure difference between the injection inlet and the injection outlet. The pressure difference drives part of the working fluid in the microchannel heat exchanger from the injection inlet into the injection channel and out of the injection outlet, and mixes with the jet working fluid of the nozzle.
[0016] As a preferred technical solution, the cooling medium inlet is arranged at the inlet end of the cover plate and the bottom plate, the cooling medium inlet is connected to the inlet of the microchannel heat exchanger through the nozzle, and the outlet end of the cover plate and the bottom plate is provided with a cooling medium outlet, and the cooling medium outlet is connected to the outlet of the microchannel heat exchanger.
[0017] As a preferred technical solution, the nozzle is arranged between the cooling medium inlet and the injection outlet.
[0018] As a preferred technical solution, the injection inlet is provided on the microchannel heat exchanger and is in communication with the microchannel heat exchanger.
[0019] As a preferred technical solution, the microchannel heat exchanger is composed of a plurality of microchannel arrays, and the microchannels connect the inlet of the microchannel heat exchanger with the outlet of the microchannel heat exchanger in parallel.
[0020] As a preferred technical solution, at least two flow modes are formed in the microchannel heat dissipation device based on jet self-injection mixing, and the flow modes include: a first flow mode and a second flow mode.
[0021] The first flow mode is that the cooling medium flows from the cooling medium inlet through the nozzle to form a jet and enters the microchannel heat exchanger to perform flow boiling phase change heat transfer;
[0022] The second flow mode is that the working fluid after partial heat exchange enters the injection channel through the injection inlet and flows out from the injection outlet, and the outflowing working fluid of the injection outlet is mixed with the jet working fluid of the nozzle, so that gas-liquid mixed flow occurs at the inlet of the microchannel heat exchanger.
[0023] As a preferred technical solution, the second flow pattern re-injects part of the working fluid involved in heat exchange to the inlet of the microchannel heat exchanger for heat exchange, so that the mass flow rate of the working fluid in the microchannel heat exchanger between the injection inlet and the inlet of the microchannel heat exchanger is the sum of the mass flow rate of the working fluid of the nozzle jet and the mass flow rate of the working fluid injected by the nozzle.
[0024] As an optimal technical solution, the second flow pattern re-injects part of the working fluid involved in heat exchange to the inlet end of the microchannel heat exchanger and mixes it with the jet generated by the nozzle, so that the mass flow rate of the working fluid in the internal cross-section of the microchannel heat exchanger is the sum of the mass flow rate of the jet working fluid at the inlet of the microchannel heat exchanger and the mass flow rate of the working fluid at the injection outlet.
[0025] The present invention provides a microchannel heat dissipation device based on jet self-injection mixing, which has the following beneficial effects:
[0026] 1) The present invention provides a microchannel heat dissipation device based on jet self-injection mixing, which solves the technical problems faced by traditional microchannel heat dissipation technology, such as low single-phase flow heat transfer efficiency, reliance on complex control of two-phase flow, and low integration of jet technology. It autonomously increases the local flow velocity in the microchannel to enhance heat transfer, relying on the two-phase flow formed by its own heat transfer as the gas source, replacing the external bubble control device. The integrated structure realizes jet self-injection, reducing system volume and power consumption. It not only increases the local mass flux to thin the boundary layer through the injection effect, but also utilizes the mixing of the jet and the injected gas to spontaneously form two-phase flow disturbances, enhancing the cooling performance within the microchannel heat exchanger and improving the temperature uniformity of the heat exchange wall.
[0027] 2) The nozzle is located at the inlet side of the cooling medium. The nozzle accelerates the medium into a high-speed jet by shrinking the cross section, significantly improving the local mass flux, directly thinning the thermal boundary layer, and improving the convective heat transfer coefficient, thus solving the technical problem of low heat transfer efficiency of single-phase flow.
[0028] When the jet generated by the nozzle mixes with the working fluid flowing out of the ejection outlet in the mixing zone, the working fluid of the ejection outlet comes from the working fluid that has already participated in part of the heat exchange in the microchannel heat exchanger itself. This part of the working fluid may have undergone phase change to form a two-phase fluid. After mixing, the jet is mixed with the gaseous working fluid of the ejection outlet and flows with the mainstream, forming a good disturbance to the microchannel boundary layer. At the same time, the flow circulation rate of the cooling working fluid in the microchannel heat exchanger below the ejection channel is improved, the flow velocity is further increased, the cooling performance in the microchannel heat exchanger is enhanced, and the temperature uniformity of the heat exchange wall is improved. The two-phase flow formed by its own heat exchange is relied on as the gas source, replacing the external bubble control device.
[0029] The nozzle and the injection channel are directly integrated between the cover plate and the base plate, and the self-injection cycle is realized by utilizing the fluid dynamics effect (momentum transfer and pressure difference). No external pumps or valves are required. The integrated structure realizes the self-injection of the jet, thus reducing the system volume and power consumption.
[0030] 3) The present invention uses a nozzle and ejector structure to mix part of the liquid cooling medium with the jet medium, thereby increasing the circulation rate of the medium in the microchannel below the ejector channel and the flow velocity of the medium in the local microchannel, thereby achieving better heat dissipation performance under high heat flux density and delaying the occurrence of the flow boiling heat transfer limit;
[0031] The present invention uses a nozzle and an ejector structure to mix part of the two-phase cooling medium with the jet medium, fully disturbing the boundary layer of the microchannel wall, reducing the heat transfer resistance, and improving the cooling performance of the microchannel heat exchanger. When supercooled boiling occurs in the microchannel, the supercooled medium will form a boundary layer on the heat exchange wall. The present invention uses a self-ejector mixing system to reintroduce part of the heat exchanged medium into the microchannel inlet area, mixing it with the jet generated by the nozzle to form a two-phase fluid in advance. This two-phase fluid can significantly affect the formation of the boundary layer. Part of the gas will directly impact the boundary layer, reducing the thickness of the boundary layer and lowering the heat transfer resistance of the boundary layer, thereby improving the cooling performance of the microchannel.
[0032] The jet self-injection mixing system of the present invention can enhance the heat exchange of microchannel heat exchangers with different structures. Mixing the injected gas under the condition of subcooled boiling can further improve the cooling performance of the radiator, and has a wider range of applications.
[0033] 4) The present invention provides a microchannel heat dissipation device based on jet self-injection mixing, which not only increases the mass flux in some microchannels through injection, improves the working fluid flow rate, reduces the boundary layer thickness, reduces thermal resistance and enhances heat exchange; but also enables gas-liquid mixed circulation, i.e., two-phase fluid, to appear at the microchannel inlet in advance through injection mixing. The bubbles can directly impact the boundary layer parameters of the heat exchange wall, disturb the normal development of the boundary layer, further reduce the boundary layer thickness, reduce thermal resistance, and improve the cooling performance of the microchannel. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] Figure 1 A schematic structural diagram of a microchannel heat dissipation device based on jet self-injection mixing provided by the present invention;
[0035] Figure 2 A wireframe diagram of a microchannel heat dissipation device based on jet self-injection mixing provided by the present invention (with the cover and base separated);
[0036] Figure 3 A schematic structural diagram of a microchannel heat dissipation device based on jet self-injection mixing provided by the present invention (the cover plate and the bottom plate are separated);
[0037] Figure 4 A left view of a microchannel heat dissipation device based on jet self-injection mixing provided by the present invention;
[0038] Figure 5 A cross-sectional view taken along the AA line from the left side of a microchannel heat dissipation device based on jet self-injection mixing provided by the present invention;
[0039] Figure 6 A right view of a microchannel heat dissipation device based on jet self-injection mixing provided by the present invention;
[0040] Among them, 1-cover plate; 2-bottom plate; 3-microchannel heat exchanger; 31-microchannel; 4-injection inlet; 5-injection channel; 6-injection outlet; 7-nozzle; 8-cooling medium inlet; 9-cooling medium outlet; 10-inlet of microchannel heat exchanger; 11-outlet of microchannel heat exchanger. DETAILED DESCRIPTION
[0041] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0042] like Figure 1-6 As shown, the present invention provides a microchannel heat dissipation device based on jet self-injection mixing, comprising:
[0043] A bottom plate 2, wherein a microchannel heat exchanger 3 is provided on the bottom plate 2;
[0044] A cover plate 1 is provided corresponding to the bottom plate 2. The cover plate 1 is provided with an injection inlet 4, an injection channel 5 and an injection outlet 6. The injection inlet 4 is connected to the injection outlet 6 through the injection channel 5.
[0045] A nozzle 7 is provided between the cover plate 1 and the base plate 2 , one end of the nozzle 7 is provided on the side of the cooling medium inlet 8 , and the nozzle 7 is used to accelerate the cooling medium to form a jet medium; the outflowing medium of the injection outlet 6 is mixed with the jet medium of the nozzle 7 .
[0046] The present invention proposes a microchannel heat dissipation device based on jet self-injection mixing, which solves the technical problems faced by traditional microchannel heat dissipation technology, such as low single-phase flow heat exchange efficiency, reliance on complex control of two-phase flow and low integration of jet technology. It autonomously increases the local flow velocity in the microchannel to enhance heat exchange, and relies on the two-phase flow formed by its own heat exchange as the gas source to replace the external bubble control device; the integrated structure realizes jet self-injection, reduces the system volume and power consumption, not only increases the local mass flux through the injection effect to thin the boundary layer, but also utilizes the mixing of the jet and the injected gas to spontaneously form a two-phase flow disturbance, thereby enhancing the cooling performance in the microchannel heat exchanger and improving the temperature uniformity of the heat exchange wall.
[0047] Preferably, if Figure 2 and Figure 5 As shown, the other end of the nozzle 7 is arranged at the inlet side of the microchannel heat exchanger 3, parallel to the flow direction of the cooling medium and generates a jet; the mixing of the jet and the induced fluid balances the flow distribution at the inlet of the microchannel heat exchanger 3, avoids local overheating or flow dead zones caused by uneven flow in traditional parallel microchannels, and optimizes flow distribution.
[0048] Preferably, if Figure 2 and Figure 5As shown, the nozzle 7 generates a jet to cause a pressure difference between the injection inlet 4 and the injection outlet 6. The pressure difference drives part of the working fluid in the microchannel heat exchanger 3 to enter the injection channel 5 from the injection inlet 4 and flow out from the injection outlet 6, and mixes with the jet working fluid of the nozzle 7; the jet from the nozzle 7 forms a high-speed flow at the inlet of the microchannel heat exchanger 3. According to the Bernoulli effect, the local pressure downstream of the jet is significantly reduced, and a pressure difference gradient is formed between the injection inlet 4 and the injection outlet 6. The pressure difference drives part of the working fluid in the microchannel from the injection inlet 4 to enter the injection channel 5 and then flow out from the injection outlet 6, forming a self-circulating flow. In this process, no additional work-doing equipment is introduced to provide a driving force for mixing.
[0049] Preferably, if Figure 2-3 and Figure 5 As shown, the cooling medium inlet 8 is arranged at the inlet end of the cover plate 1 and the bottom plate 2, and the cooling medium inlet 8 is connected to the inlet of the microchannel heat exchanger 3 through the nozzle 7. The outlet end of the cover plate 1 and the bottom plate 2 is provided with a cooling medium outlet 9, and the cooling medium outlet 9 is connected to the outlet 11 of the microchannel heat exchanger; the cooling medium inlet 8 accelerates the flow rate of the working medium through the contraction section of the nozzle 7, improves the local mass flux at the inlet end, and reduces the pressure in the microchannel heat exchanger inlet 10 area through the jet entrainment effect, drives the working medium to quickly enter the microchannel heat exchanger 3, and realizes acceleration and pressure control at the inlet 10 end of the microchannel heat exchanger; the cooling medium outlet 9 is aligned with the outlet end of the microchannel heat exchanger 3 to ensure that the two-phase working medium is quickly discharged after sufficient heat exchange, avoids local dry burning or flow instability caused by the retention of gas phase working medium, and discharges stably at the outlet end of the microchannel heat exchanger 3. The inlet and outlet structure design shortens the total length of the flow channel, reduces the volume of the device, and makes the device miniaturized.
[0050] Preferably, if Figure 2 and Figure 5 As shown, the nozzle 7 is arranged between the cooling medium inlet 8 and the injection outlet 6. The nozzle 7 is preferably slit-shaped. The slit-shaped nozzle 7 forms a flattened high-speed jet, covers a wider microchannel inlet area, reduces the uneven distribution of flow velocity, and avoids local overheating.
[0051] Preferably, if Figure 2 and Figure 5 As shown, the injection inlet 4 is arranged on the microchannel heat exchanger 3 and is connected to the microchannel heat exchanger 3, so that the injection inlet 4 forms a pressure gradient in the low-pressure area generated by the jet of the nozzle 7, driving part of the working fluid inside the microchannel 31 to actively flow into the injection channel 5, realizing pump-free self-circulation flow.
[0052] Preferably, if Figure 2-3 and Figure 5As shown, the microchannel heat exchanger 3 is composed of an array of multiple microchannels 31, and the microchannels 31 connect the inlet of the microchannel heat exchanger 3 with the outlet of the microchannel heat exchanger 3 in a parallel manner; the working fluid is evenly distributed to each microchannel 31 through the parallel structure, and the multi-channel parallel flow increases the specific surface area of the heat exchange wall and increases the contact frequency between the working fluid and the wall.
[0053] Preferably, at least two flow modes are formed in the microchannel heat dissipation device based on jet self-injection mixing, and the flow modes include: a first flow mode and a second flow mode.
[0054] The first flow mode is that the cooling medium flows from the cooling medium inlet 8 through the nozzle 7 to form a jet and enters the microchannel heat exchanger 3 to perform flow boiling phase change heat transfer;
[0055] The second flow mode is that the working fluid after partial heat exchange enters the injection channel 5 through the injection inlet 4 and flows out from the injection outlet 6, and the outflowing working fluid of the injection outlet 6 is mixed with the jet working fluid of the nozzle 7, so that a gas-liquid mixed flow occurs at the inlet 10 of the microchannel heat exchanger; a good disturbance is formed on the boundary layer of the microchannel 31, and at the same time, the flow circulation rate of the cooling working fluid in the microchannel 31 below the injection channel 5 is improved, the flow velocity is further increased, the cooling performance in the microchannel heat exchanger 3 is enhanced, and the temperature uniformity of the heat exchange wall is improved.
[0056] Preferably, the second flow pattern re-injects part of the working fluid involved in heat exchange to the inlet 10 of the microchannel heat exchanger for heat exchange, so that the mass flow rate of the working fluid in the microchannel heat exchanger 3 between the injection inlet 4 and the inlet 10 of the microchannel heat exchanger is the sum of the mass flow rate of the working fluid jetted by the nozzle 7 and the mass flow rate of the working fluid introduced by the nozzle 7; the present invention causes gas-liquid mixing at the inlet of the microchannel heat exchanger 3, and the mixed bubbles will disturb and destroy the boundary layer that has been stably developed on the heat exchange wall surface again, making the boundary layer thinner, reducing the heat exchange thermal resistance, and thus improving the heat exchange performance; under normal conditions, the mass flow rate of the working fluid circulating in the microchannel is the mass flow rate of the working fluid at the microchannel inlet. The present invention adopts the second flow pattern to re-inject part of the working fluid involved in heat exchange to the inlet 10 of the microchannel heat exchanger 3. The heat exchanged working fluid is re-injected to the inlet of the microchannel heat exchanger 3 for heat exchange, so that the mass flow rate of the working fluid in the microchannel heat exchanger 3 between the injection inlet 4 and the inlet 10 of the microchannel heat exchanger is the sum of the mass flow rate of the working fluid jetted by the nozzle 7 of the microchannel heat exchanger and the mass flow rate of the working fluid injected by the nozzle 7. The mass flux of the cooling working fluid in the microchannel 31 is increased, the circulation ratio is improved, and the cross-sectional flow velocity is further increased. The increase in flow velocity makes the wall heat exchange boundary layer thinner, enhances the energy exchange efficiency between the fluid and the wall, and improves the cooling performance in the radiator; at the same time, the increase in flow velocity causes the boundary layer to become thinner, reduces the temperature difference between the wall and the mainstream fluid, avoids the formation of local hot spots, and makes the temperature of the heat exchange wall more uniform.
[0057] Preferably, the second flow pattern re-injects part of the working fluid involved in heat exchange to the inlet 10 end of the microchannel heat exchanger and mixes it with the jet generated by the nozzle 7, so that the mass flow rate of the working fluid in the internal cross-section of the microchannel heat exchanger 3 is the sum of the mass flow rate of the jet working fluid at the inlet 10 of the microchannel heat exchanger and the mass flow rate of the working fluid at the injection outlet 6; the mass flow rate of the internal cross-section of the conventional microchannel heat exchanger 3 is the mass flow rate of the cooling working fluid inlet 8 of the microchannel heat exchanger, while the present invention adopts the second flow pattern to re-inject part of the working fluid involved in heat exchange to the inlet 10 end of the microchannel heat exchanger and mix it with the jet generated by the nozzle 7. The flows are mixed so that the mass flow rate of the working fluid in the internal cross-section of the microchannel heat exchanger 3 is the sum of the mass flow rate of the jet working fluid at the inlet 10 of the microchannel heat exchanger and the mass flow rate of the working fluid at the ejection outlet 6. The mass flow rate in the microchannel heat exchanger 3 below the ejection channel 5 increases, the circulation ratio is improved, the flow velocity of the working fluid is also increased, and the boundary layer of the microchannel heat exchange wall becomes thinner at a high flow rate. At the same time, because the gas also participates in the mixing process, the boundary layer will be disturbed to destroy the formation of the boundary layer, further reducing the heat transfer resistance of the wall, improving the cooling performance of the microchannel heat exchanger, and delaying the occurrence of the flow boiling limit.
[0058] like Figure 1-6 As shown, the present invention provides a microchannel heat dissipation device based on jet self-injection mixing, comprising a base plate 2 and a cover plate 1 arranged relatively, a microchannel heat exchanger 3 is provided on the base plate 2, an injection inlet 4, an injection channel 5 and an injection outlet 6 are provided on the cover plate 1, and a nozzle 7, a cooling medium inlet 8 and a cooling medium outlet 9 are provided between the cover plate 1 and the base plate 2; the microchannel heat exchanger 3 connects the cooling medium inlet 8 and the cooling medium outlet 9 in a parallel manner, the injection inlet 4 is connected to the injection outlet 6 through the injection channel 5, and the cover plate 1 and the base plate 2 together form a complete nozzle 7 structure, the cooling medium inlet 8 is provided at the front end of the nozzle 7, and the microchannel heat dissipation device based on jet self-injection mixing is provided. At least two flow modes are formed in the device. In the first flow mode, the cooling medium flows from the cooling medium inlet 8, passes through the nozzle 7 to form a jet, and enters the microchannel heat exchanger 3 for flow boiling phase change heat transfer. In the second flow mode, the medium after partial heat exchange enters the injection channel 5 through the injection inlet 4 and flows out from the injection outlet 6. The outflowing medium of the injection outlet 6 is mixed with the jet medium of the nozzle 7, so that a gas-liquid mixed flow occurs at the inlet of the microchannel heat exchanger 3. This forms a good disturbance on the boundary layer of the microchannel 31. At the same time, the flow circulation rate of the cooling medium in the microchannel heat exchanger 3 below the injection channel 5 is improved, the flow velocity is further increased, the cooling performance in the microchannel heat exchanger 3 is enhanced, and the temperature uniformity of the heat exchange wall surface is improved.
[0059] The cooling medium flows into the microchannel heat exchanger 3 from the cooling medium inlet 8 through the nozzle 7, generates a jet at the microchannel heat exchanger inlet 10 after flowing through the nozzle 7, and enters the microchannel heat exchanger 3 to realize flow boiling heat exchange. Part of the cooling medium leaves the microchannel heat exchanger 3 after completing boiling phase change heat exchange in the microchannel heat exchanger 3 and is discharged from the cooling medium outlet 9; another part of the heat exchanged medium is driven by the pressure difference to enter the injection inlet 4, flows through the injection channel 5 and flows out from the injection outlet 6. The medium flowing out of the injection outlet 6 is re-mixed with the jet medium of the nozzle 7, forming a good disturbance to the boundary layer of the microchannel 31. At the same time, the flow circulation rate of the cooling medium in the microchannel heat exchanger 3 below the injection channel 5 is improved, the flow velocity is further increased, the cooling performance in the microchannel heat exchanger 3 is enhanced, and the temperature uniformity of the heat exchange wall is improved.
[0060] It will be appreciated that the present invention is described through some embodiments, and it will be appreciated by those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are subject to various changes or equivalent substitutions. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope protected by the present invention.
Claims
1. A microchannel heat dissipation device based on jet self-injection mixing, characterized in that: include: a bottom plate, wherein a microchannel heat exchanger is provided on the bottom plate; a cover plate, the cover plate being arranged corresponding to the bottom plate, the cover plate being provided with an injection inlet, an injection channel and an injection outlet, the injection inlet being connected to the injection outlet through the injection channel; A nozzle is provided between the cover plate and the bottom plate, one end of the nozzle is provided at the cooling medium inlet side, and the nozzle is used to accelerate the cooling medium to form a jet medium; the outflowing medium of the injection outlet is mixed with the jet medium of the nozzle.
2. The microchannel heat dissipation device based on jet self-injection mixing according to claim 1 is characterized in that: The other end of the nozzle is arranged at the inlet side of the microchannel heat exchanger, parallel to the flow direction of the cooling medium and generates a jet.
3. The microchannel heat dissipation device based on jet self-injection mixing according to claim 1 is characterized in that: The nozzle generates a jet to create a pressure difference between the injection inlet and the injection outlet. The pressure difference drives part of the working fluid in the microchannel heat exchanger to flow from the injection inlet into the injection channel and out of the injection outlet, and mixes with the jet working fluid of the nozzle.
4. The microchannel heat dissipation device based on jet self-injection mixing according to claim 1 is characterized in that: The cooling medium inlet is arranged at the inlet end of the cover plate and the bottom plate, and the cooling medium inlet is connected to the inlet of the microchannel heat exchanger through the nozzle. The outlet end of the cover plate and the bottom plate is provided with a cooling medium outlet, and the cooling medium outlet is connected to the outlet of the microchannel heat exchanger.
5. The microchannel heat dissipation device based on jet self-injection mixing according to claim 4 is characterized in that: The nozzle is arranged between the cooling medium inlet and the injection outlet.
6. The microchannel heat dissipation device based on jet self-injection mixing according to claim 1 is characterized in that: The injection inlet is arranged on the microchannel heat exchanger and communicates with the microchannel heat exchanger.
7. The microchannel heat dissipation device based on jet self-injection mixing according to claim 6, characterized in that: The microchannel heat exchanger is composed of a plurality of microchannel arrays, and the microchannels connect the inlet of the microchannel heat exchanger with the outlet of the microchannel heat exchanger in a parallel manner.
8. The microchannel heat dissipation device based on jet self-injection mixing according to claim 7 is characterized in that: At least two flow modes are formed in the microchannel heat dissipation device based on jet self-injection mixing, and the flow modes include: a first flow mode and a second flow mode. The first flow mode is that the cooling medium flows from the cooling medium inlet through the nozzle to form a jet and enters the microchannel heat exchanger to perform flow boiling phase change heat transfer; The second flow mode is that the working fluid after partial heat exchange enters the injection channel through the injection inlet and flows out from the injection outlet, and the outflowing working fluid of the injection outlet is mixed with the jet working fluid of the nozzle, so that gas-liquid mixed flow occurs at the inlet of the microchannel heat exchanger.
9. The microchannel heat dissipation device based on jet self-injection mixing according to claim 8, characterized in that: The second flow mode re-injects part of the working fluid involved in heat exchange to the inlet of the microchannel heat exchanger for heat exchange, so that the mass flow rate of the working fluid in the microchannel heat exchanger between the injection inlet and the inlet of the microchannel heat exchanger is the sum of the mass flow rate of the working fluid of the nozzle jet and the mass flow rate of the working fluid injected by the nozzle.
10. The microchannel heat dissipation device based on jet self-injection mixing according to claim 8, characterized in that: The second flow pattern re-injects part of the working fluid involved in heat exchange to the inlet end of the microchannel heat exchanger and mixes it with the jet generated by the nozzle, so that the mass flow rate of the working fluid in the internal cross-section of the microchannel heat exchanger is the sum of the mass flow rate of the jet working fluid at the inlet of the microchannel heat exchanger and the mass flow rate of the working fluid at the injection outlet.