Semiconductor device welding tool

Abstract

The invention relates to the field of semiconductor device welding, in particular to a semiconductor device welding tool which comprises a supporting ring plate, a machining table is fixedly connected to the upper end of the supporting ring plate, a flexible clamping assembly is connected to the upper end of the machining table, and a machining protection heat dissipation assembly is arranged at the upper end of the supporting ring plate. A welding adjusting assembly is connected into the machining protection heat dissipation assembly, and a lifting adjusting assembly is connected to the lower end of the supporting annular plate. According to the invention, the two groups of clamping connecting plates are driven by the bidirectional lead screw and are matched with the flexible clamping piece, so that flexible clamping and zero-damage fixing of a device are realized; a semiconductor chilling plate and a temperature sensor are arranged in the processing table, so that accurate active temperature control and real-time monitoring are realized; the protective cover can cover the welding area through the lifting adjusting assembly, the heat dissipation fan and the heat dissipation holes are matched to form a convection heat dissipation channel, and integrated protection and efficient heat dissipation are achieved. By using the welding adjusting assembly, multi-dimensional accurate welding adjustment is achieved; and by using the lifting adjusting assembly, synchronous lifting and stable driving are achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device welding, and in particular to a semiconductor device welding tool. Background Art

[0002] Semiconductor devices are widely used in electronic equipment, and their welding quality directly affects the performance and stability of the equipment.

[0003] There are many problems with traditional semiconductor device welding tooling: 1. Clamping adaptability and damage issues: Traditional clamping structures are mostly rigid in design, which makes it difficult to adapt to semiconductor devices of different shapes and sizes. In addition, the clamping process can easily cause mechanical damage to the device surface, affecting device performance.

[0004] 2. Insufficient temperature control accuracy: The temperature fluctuates greatly during the welding process and there is a lack of active temperature control mechanism. Existing tooling mostly relies on natural heat dissipation or simple air cooling, and cannot accurately adjust the temperature of the processing table in real time, which may lead to thermal stress concentration in the welding area or overheating and failure of the device.

[0005] 3. Welding protection and heat dissipation defects: The high temperature and spatter generated during welding can easily damage the surrounding structures of the device, and the lack of an effective heat dissipation system leads to excessively high local temperatures, affecting the welding quality and the service life of the tooling.

[0006] 4. Poor welding adjustment and stability: The welding gun adjustment mechanism of traditional tooling is mostly single-axis or dual-axis movement, which makes it difficult to achieve precise positioning of complex trajectories; at the same time, the protective cover is prone to jamming due to asynchronous drive during lifting and lowering, affecting the continuity of the welding process.

[0007] 5. Weak automation and monitoring capabilities: Lack of integrated control and monitoring systems, unable to provide real-time feedback on welding status, making it difficult to intervene in time when abnormalities occur, resulting in low welding yield.

[0008] Therefore, those skilled in the art have provided a semiconductor device welding tool to solve the problems raised in the above background technology. Summary of the Invention

[0009] In order to solve the above technical problems, the present invention provides a semiconductor device welding tool, It includes a support ring plate, the upper end of which is fixedly connected to a processing table, the upper end of which is fixedly connected to a flexible clamping component for fixing the semiconductor device, the upper end of the support ring plate is connected to a processing protection heat dissipation component for protecting the processing table, the interior of the processing protection heat dissipation component is connected to a welding adjustment component for welding the semiconductor device, and the lower end of the support ring plate is connected to a lifting adjustment component for adjusting the processing protection heat dissipation component.

[0010] Preferably, the flexible clamping assembly includes a first adjusting frame and a second adjusting frame fixedly connected to the upper end of the support ring plate, the first adjusting frame is internally rotatably connected to a bidirectional screw, the outer side of the first adjusting frame is fixedly connected to a first motor, the output shaft of the first motor rotates through the first adjusting frame and is fixedly connected to one end of the bidirectional screw, the inner side of the second adjusting frame is fixedly connected to a limiting column, the outer thread sleeve of the bidirectional screw is provided with an internal thread seat, the outer side of the limiting column is slidably connected to a sliding seat, a clamping connecting plate is fixedly connected between the internal thread seat and the sliding seat, and a flexible clamping member is fixedly connected to one side of the clamping connecting plate.

[0011] Preferably, the internal threaded seat, sliding seat, clamping plate and flexible clamping member are symmetrically arranged in two groups at the upper end of the processing table, and the flexible clamping member includes a clamping seat fixedly connected to one side of the clamping plate, the clamping seat is arranged in a hollow cavity, and the interior of the clamping seat is fixedly connected to multiple groups of sliding tubes, the interiors of the multiple groups of sliding tubes are all slidably connected to sliding gaskets, and one side of the multiple groups of sliding gaskets is fixedly connected to a clamping tube, one end of the clamping tube passes through the clamping seat and is slidably connected to the outside of the clamping seat, and the upper end of the clamping seat is fixedly connected to the inlet and outlet pipes, and the outer fixed sleeve of the inlet and outlet pipes is provided with a control valve.

[0012] Preferably, the processing protection heat dissipation assembly includes a protective cover slidably connected to the upper end of the support ring plate, a heat dissipation fan is fixedly connected to one side of the protective cover, and heat dissipation holes are opened on the other side of the protective cover.

[0013] Preferably, the welding adjustment assembly includes a first linear motor fixedly connected to the top of the protective cover, a second linear motor slidably connected to the lower end of the first linear motor, an electric telescopic rod slidably connected to the lower end of the second linear motor, a welding gun fixedly connected to the lower end of the electric telescopic rod, and a camera fixedly connected to the inner wall of the protective cover.

[0014] Preferably, the lifting and adjusting assembly includes a driving support ring fixedly connected to the lower end of the support ring plate, a second motor fixedly connected to the upper end of the support ring plate, a driving gear is fixedly sleeved on the outer side of the output shaft of the second motor, an annular groove is provided on the inner wall of the driving support ring, a rotating ring plate is slidably connected to the inside of the annular groove, a large gear is slidably connected to the upper end of the rotating ring plate, and the large gear is meshed with the driving gear.

[0015] Preferably, the lifting and adjusting assembly further comprises a plurality of sets of threaded rods rotatably connected to the interior of the limiting column, the lower ends of the plurality of sets of threaded rods are fixedly sleeved with driven gears, and the plurality of sets of driven gears are respectively meshed and connected with the large gear.

[0016] Preferably, a plurality of groups of internal threaded holes are provided inside the protective cover, and the internal threaded holes are threadedly sleeved on the outside of the threaded rod.

[0017] Preferably, multiple groups of mounting holes are provided at the lower end of the processing table, and semiconductor refrigeration plates are fixedly connected to the interior of the multiple groups of mounting holes. Temperature sensors are fixedly connected to the four corners of the upper end of the processing table, and a controller is fixedly connected to the upper end of the support ring plate. The semiconductor refrigeration plates and temperature sensors are electrically connected to the controller respectively.

[0018] Technical effects and advantages of the present invention: 1. Flexible clamping and zero-damage fixation The flexible clamping assembly drives two sets of clamping plates through a bidirectional lead screw, and cooperates with the flexible clamping parts with sliding tubes, sliding gaskets and clamping tubes inside, and uses air pressure buffering to achieve adaptive fitting of components of different shapes; During the clamping process, the clamping tube can slide along the surface contour of the device to avoid rigid extrusion damage. It is suitable for zero-damage fixation of high-precision semiconductor devices and significantly improves the applicability of tooling.

[0019] 2. Precise active temperature control and real-time monitoring The processing table has built-in semiconductor cooling chips and temperature sensors. The controller provides real-time feedback and adjusts the cooling power to achieve precise control of the processing table temperature and avoid device performance degradation caused by welding heat. Temperature sensors cover the four corners of the table, monitoring the temperature distribution in real time, providing data support for welding process optimization, and ensuring the stability of the welding environment.

[0020] 3. Integrated protection and efficient heat dissipation The protective cover of the processing protection heat dissipation component can cover the welding area through the lifting and adjusting components to isolate spatter and external interference; the heat dissipation fan and heat dissipation holes form a convection heat dissipation channel, quickly reducing the temperature of the welding area and reducing the risk of thermal deformation; When the protective cover descends, it forms a closed space with the supporting ring plate, improving the safety and reliability of the welding process.

[0021] 4. Multi-dimensional precise welding adjustment The welding adjustment component consists of a three-axis adjustment mechanism consisting of a first linear motor, a second linear motor, and an electric telescopic rod. Combined with the visual positioning of the camera, it can achieve millimeter-level precise positioning of the welding gun in three-dimensional space, adapting to the welding requirements of complex welds. The camera monitors the welding status in real time. If an abnormality is found, the controller can immediately stop welding to avoid defective products.

[0022] 5. Synchronous lifting and stable driving The lifting and adjusting component drives the active gear through the second motor, and drives the four sets of threaded rods to rotate synchronously through the large gear and the driven gear. The internal threaded holes are used to achieve the smooth lifting and lowering of the protective cover, completely solving the jamming problem of traditional single-axis drive and ensuring the continuity of the welding process.

[0023] 6. Integrated control and automated operation The controller integrates the control logic of components such as semiconductor coolers, temperature sensors, motors and welding guns. Through preset programs, it realizes the full process automation of clamping, lifting, welding and heat dissipation, reducing manual intervention and improving production efficiency and yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic structural diagram of a semiconductor device welding tool provided in an embodiment of the present application; Figure 2 This is a side cross-sectional view of the semiconductor device welding tool provided in the embodiment of the present application. Figure 1 ; Figure 3 This is a side cross-sectional view of the semiconductor device welding tool provided in the embodiment of the present application. Figure 2 ; Figure 4 This is a schematic diagram of the structure of the flexible clamping assembly in the semiconductor device welding tool provided in the embodiment of the present application. Figure 1 ; Figure 5 This is a schematic diagram of the structure of the flexible clamping assembly in the semiconductor device welding tool provided in the embodiment of the present application. Figure 2 ; Figure 6 This is a structural diagram of a lifting and adjusting assembly in a semiconductor device welding tool provided in an embodiment of the present application; Figure 7 yes Figure 5 A partial enlarged schematic diagram of part A; In the picture: 1. Support ring plate; 2. Processing table; 3. Flexible clamping assembly; 4. Processing protection and heat dissipation assembly; 5. Welding adjustment assembly; 6. Lifting adjustment assembly; 7. First adjustment frame; 8. Second adjustment frame; 9. Bidirectional screw; 10. First motor; 11. Limit column; 12. Internal thread seat; 13. Sliding seat; 14. Clamping connecting plate; 15. Flexible clamping part; 16. Clamping seat; 17. Sliding tube; 18. Sliding gasket; 19. Clamping tube; 20. Inlet and outlet pipes; 21. Protective cover; 22. Cooling fan; 23. Heat dissipation hole; 24. First linear motor; 25. Second linear motor; 26. Electric telescopic rod; 27. Welding gun; 28. Camera; 29. ​​Drive support ring; 30. Second motor; 31. Driving gear; 32. Large gear; 33. Rotating ring plate; 34. Threaded rod; 35. Driven gear; 36. Mounting hole. DETAILED DESCRIPTION

[0025] The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for purposes of illustration and description and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are chosen and described to better illustrate the principles of the invention and its practical application, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for specific applications. Example

[0026] See also Figures 1 to 7 In this embodiment, a semiconductor device welding tool is provided, including a support ring plate 1, which carries the core skeleton of the entire tool, provides annular rigid support, and resists welding vibration. The upper end of the support ring plate 1 is fixedly connected to a processing table 2, and a plurality of mounting holes 36 are provided at the lower end of the processing table 2. Semiconductor refrigeration plates are fixedly connected inside the plurality of mounting holes 36 for active temperature control. Temperature sensors are fixedly connected to the four corners of the upper end of the processing table 2 for real-time monitoring of the table temperature distribution. A flexible clamping component 3 for fixing the semiconductor device is fixedly connected to the upper end of the processing table 2. A processing protection heat dissipation component 4 for protecting the processing table 2 is connected to the upper end of the support ring plate 1. A welding adjustment component 5 for welding the semiconductor device is internally connected to the processing protection heat dissipation component 4, and a lifting adjustment component 6 for adjusting the processing protection heat dissipation component 4 is connected to the lower end of the support ring plate 1.

[0027] The flexible clamping assembly 3 includes a first adjusting frame 7 and a second adjusting frame 8 fixedly connected to the upper end of the support ring plate 1, the internal rotation of the first adjusting frame 7 is connected to a bidirectional screw 9, the outer side of the first adjusting frame 7 is fixedly connected to a first motor 10, the output shaft of the first motor 10 rotates through the first adjusting frame 7 and is fixedly connected to one end of the bidirectional screw 9, the internal fixed connection of the second adjusting frame 8 is a limiting column 11, the outer thread sleeve of the bidirectional screw 9 is provided with an internal thread seat 12, the outer side of the limiting column 11 is slidably connected to a sliding seat 13, a clamping connecting plate 14 is fixedly connected between the internal thread seat 12 and the sliding seat 13, and a flexible clamping member 15 is fixedly connected to one side of the clamping connecting plate 14, the internal thread seat 12, the sliding seat 13, the clamping connecting plate 14 is fixedly connected to the flexible clamping member 15, the internal thread seat 12, the sliding seat 13, the clamping connecting plate 14 and the clamping connecting plate 14 are fixedly connected. Two groups of plates 14 and flexible clamping members 15 are symmetrically arranged at the upper end of the processing table 2, and the flexible clamping members 15 include a clamping seat 16 fixedly connected to one side of the clamping connecting plate 14. The clamping seat 16 is arranged in a hollow cavity. Multiple groups of sliding tubes 17 are fixedly connected to the interior of the clamping seat 16. The interiors of the multiple groups of sliding tubes 17 are all slidably connected with sliding gaskets 18. One side of the multiple groups of sliding gaskets 18 is fixedly connected with a clamping tube 19. One end of the clamping tube 19 passes through the clamping seat 16 and is slidably connected to the outside of the clamping seat 16. The upper end of the clamping seat 16 is fixedly connected with an air inlet and outlet pipe 20. The outer side of the air inlet and outlet pipe 20 is fixedly sleeved with a control valve, which is suitable for fixing semiconductor devices of different shapes, thereby improving the applicability of this solution.

[0028] The processing protection heat dissipation assembly 4 includes a protective cover 21 slidably connected to the upper end of the supporting ring plate 1 , a heat dissipation fan 22 is fixedly connected to one side of the protective cover 21 , and a heat dissipation hole 23 is opened on the other side of the protective cover 21 .

[0029] The welding adjustment assembly 5 includes a first linear motor 24 fixedly connected to the top of the protective cover 21, a second linear motor 25 slidably connected to the lower end of the first linear motor 24, an electric telescopic rod 26 slidably connected to the lower end of the second linear motor 25, and a welding gun 27 fixedly connected to the lower end of the electric telescopic rod 26, and a camera 28 is fixedly connected to the inner wall of the protective cover 21.

[0030] The lifting and lowering adjustment component 6 includes a driving support ring 29 fixedly connected to the lower end of the support ring plate 1, and a second motor 30 fixedly connected to the upper end of the support ring plate 1. A driving gear 31 is fixedly sleeved on the outer side of the output shaft of the second motor 30. An annular groove is provided on the inner wall of the driving support ring 29. A rotating ring plate 33 is slidably connected to the inside of the annular groove. A large gear 32 is slidably connected to the upper end of the rotating ring plate 33, and the large gear 32 is meshed with the driving gear 31.

[0031] The lifting and adjusting assembly 6 also includes multiple sets of threaded rods 34 rotatably connected to the interior of the limiting column 11 . The lower ends of the multiple sets of threaded rods 34 are fixedly sleeved with driven gears 35 , and the multiple sets of driven gears 35 are respectively engaged with the large gear 32 .

[0032] The interior of the protective cover 21 is provided with multiple groups of internal threaded holes, which are threadedly sleeved on the outer sides of the threaded rods 34, and the four groups of threaded rods are driven synchronously to ensure that the protective cover can be raised and lowered without getting stuck.

[0033] The upper end of the supporting ring plate 1 is fixedly connected to a controller, and the semiconductor refrigeration plate and the temperature sensor are electrically connected to the controller respectively.

[0034] Before using the present invention, first install the device in a suitable location; the electrical components provided in this solution are electrically connected to the controller, an external power supply is used to power the electrical components of this solution, the inlet and outlet pipes 20 are connected to the air compressor, the air compressor inflates the interior of the clamping seat 16, and the control valve is closed; When using the present invention, the worker first places the semiconductor device on the upper end of the processing table 2 and starts the first motor 10. The first motor 10 drives the bidirectional screw 9 to rotate. The bidirectional screw 9 drives the two sets of clamping plates 14 to move closer to each other through the two sets of internal thread seats 12, and the semiconductor device is fixed by the two sets of flexible clamping members 15. The clamping tube 19 first contacts the semiconductor device. The clamping tube 19 is pressed and drives the sliding gasket 18 to slide inside the sliding tube 17. Under the action of the gas inside the clamping seat 16, multiple groups of clamping tubes 19 press against semiconductor devices of different sizes, achieving zero-damage flexible clamping of the semiconductor device. After the semiconductor device is fixed, the second motor 30 is started, and the second motor 30 drives the driving gear 31 to rotate, the driving gear 31 drives the large gear 32 to rotate, the large gear 32 drives multiple sets of driven gears 35 to rotate synchronously, and the driven gears 35 drive the threaded rod 34 to rotate. Under the action of the internal threaded hole, the protective cover 21 moves downward to cover the semiconductor device to be welded; The cooling fan 22 is started to dissipate heat at the welding position. The camera 28 detects the welding position and transmits the position information to the controller. The controller controls the first linear motor 24 and the second linear motor 25 to move the welding gun 27 to the top of the welding point. The electric telescopic rod 26 drives the welding gun 27 to the welding position. The welding gun 27 is started to weld the semiconductor device. Before welding, the semiconductor refrigeration piece and the temperature sensor are started. The semiconductor refrigeration piece cools down the processing table 2, and the temperature sensor detects the temperature of the processing table 2 in real time. The temperature sensor provides real-time feedback, and the controller adjusts the power of the semiconductor refrigeration chip; The camera 28 monitors the welding status and stops welding immediately if any abnormality is found; After welding is completed, the second motor 30 is reversed, the protective cover 21 rises and returns to its original position, the air inlet and outlet pipes 20 are depressurized, the clamping tube 19 is retracted, and the device is taken out.

[0035] The controller is a conventional known device such as a computer that performs control. The specific implementation of the present disclosure omits detailed descriptions of known functions and known components. To ensure the compatibility of the equipment, the operating methods used are consistent with the parameters of marketed equipment.

[0036] In the scheme, unless otherwise clearly stipulated and limited, the terms "install", "set", "connect", "fix", "screw" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in this scheme according to the specific circumstances.

[0037] Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without making creative efforts should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention shall be implemented in accordance with conventional means in the field unless otherwise specified or limited.

Claims

1. A semiconductor device welding tool, characterized in that: The invention comprises a support ring plate (1), wherein the upper end of the support ring plate (1) is fixedly connected to a processing table (2), the upper end of the processing table (2) is fixedly connected to a flexible clamping component (3) for fixing a semiconductor device, the upper end of the support ring plate (1) is connected to a processing protection heat dissipation component (4) for protecting the processing table (2), the interior of the processing protection heat dissipation component (4) is connected to a welding adjustment component (5) for welding the semiconductor device, and the lower end of the support ring plate (1) is connected to a lifting adjustment component (6) for adjusting the processing protection heat dissipation component (4).

2. The semiconductor device welding tool according to claim 1, characterized in that: The flexible clamping assembly (3) includes a first adjustment frame (7) and a second adjustment frame (8) fixedly connected to the upper end of the support ring plate (1), the first adjustment frame (7) is internally rotatably connected to a bidirectional lead screw (9), the first adjustment frame (7) is externally fixedly connected to a first motor (10), the output shaft of the first motor (10) rotates through the first adjustment frame (7) and is fixedly connected to one end of the bidirectional lead screw (9), the second adjustment frame (8) is internally fixedly connected to a limiting column (11), the outer thread sleeve of the bidirectional lead screw (9) is provided with an internal thread seat (12), the outer side of the limiting column (11) is slidably connected to a sliding seat (13), a clamping connecting plate (14) is fixedly connected between the internal thread seat (12) and the sliding seat (13), and one side of the clamping connecting plate (14) is fixedly connected to a flexible clamping member (15).

3. The semiconductor device welding tool according to claim 2, characterized in that: The internal thread seat (12), the sliding seat (13), the clamping connecting plate (14) and the flexible clamping member (15) are symmetrically provided in two groups at the upper end of the processing table (2), and the flexible clamping member (15) includes a clamping seat (16) fixedly connected to one side of the clamping connecting plate (14), the clamping seat (16) is provided in a hollow cavity, the interior of the clamping seat (16) is fixedly connected to multiple groups of sliding tubes (17), the interiors of the multiple groups of sliding tubes (17) are all slidably connected to sliding gaskets (18), and one side of the multiple groups of sliding gaskets (18) is fixedly connected to a clamping tube (19), one end of the clamping tube (19) passes through the clamping seat (16) and is slidably connected to the outside of the clamping seat (16), and the upper end of the clamping seat (16) is fixedly connected to an inlet and outlet air pipe (20), and the outer fixed sleeve of the inlet and outlet air pipe (20) is provided with a control valve.

4. The semiconductor device welding tool according to claim 1, characterized in that: The processing protection heat dissipation assembly (4) comprises a protective cover (21) slidably connected to the upper end of the support ring plate (1), a heat dissipation fan (22) is fixedly connected to one side of the protective cover (21), and a heat dissipation hole (23) is opened on the other side of the protective cover (21).

5. The semiconductor device welding tool according to claim 1, characterized in that: The welding adjustment assembly (5) includes a first linear motor (24) fixedly connected to the top of the protective cover (21), a second linear motor (25) slidably connected to the lower end of the first linear motor (24), an electric telescopic rod (26) slidably connected to the lower end of the second linear motor (25), and a welding gun (27) fixedly connected to the lower end of the electric telescopic rod (26), and a camera (28) fixedly connected to the inner wall of the protective cover (21).

6. The semiconductor device welding tool according to claim 4, characterized in that: The lifting and adjusting assembly (6) comprises a driving support ring (29) fixedly connected to the lower end of the support ring plate (1), a second motor (30) fixedly connected to the upper end of the support ring plate (1), a driving gear (31) fixedly sleeved on the outer side of the output shaft of the second motor (30), an annular groove is provided on the inner wall of the driving support ring (29), a rotating ring plate (33) is slidably connected inside the annular groove, a large gear (32) is slidably connected to the upper end of the rotating ring plate (33), and the large gear (32) is meshed with the driving gear (31).

7. The semiconductor device welding tool according to claim 6, characterized in that: The lifting and adjusting assembly (6) further comprises a plurality of sets of threaded rods (34) rotatably connected to the interior of the limiting column (11), wherein the lower ends of the plurality of sets of threaded rods (34) are fixedly sleeved with driven gears (35), and the plurality of sets of driven gears (35) are respectively meshed and connected with the large gear (32).

8. The semiconductor device welding tool according to claim 7, characterized in that: The protective cover (21) has a plurality of groups of internal threaded holes formed therein, and the internal threaded holes are threadedly sleeved on the outside of the threaded rod (34).

9. The semiconductor device welding tool according to claim 1, characterized in that: The lower end of the processing table (2) is provided with a plurality of mounting holes (36), and semiconductor cooling plates are fixedly connected inside the plurality of mounting holes (36). Temperature sensors are fixedly connected at the four corners of the upper end of the processing table (2). The upper end of the support ring plate (1) is fixedly connected with a controller, and the semiconductor cooling plates and temperature sensors are electrically connected to the controller respectively.

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