Curved-surface two-phase liquid change vapor chamber and radiator

Abstract

The invention discloses a curved-surface two-phase liquid change vapor chamber and a radiator. The vapor chamber comprises a first evaporation condensation end and a second evaporation condensation end. The first evaporation and condensation end comprises a lower shell, an evaporation and condensation plate and a first capillary structure, and the lower shell and the evaporation and condensation plate are fixedly connected to form a first cavity; the second evaporation and condensation end comprises an upper shell, an evaporation and condensation plate and a second capillary structure, and the upper shell and the evaporation and condensation plate are fixedly connected to form a second cavity; the middle section of the evaporation and condensation plate is arranged to be a curved surface, the first cavity and the second cavity are independent of each other, and the evaporation and condensation plate is connected with the first evaporation and condensation end and the second evaporation and condensation end, so that the second evaporation and condensation end continues to conduct reinforced heat dissipation after basic heat dissipation of the first evaporation and condensation end, and the vacuum heat dissipation space is remarkably enlarged; therefore, the heat dissipation power and the temperature equalizing performance of the whole temperature equalizing plate are obviously improved.

Description

Technical Field

[0001] The present invention relates to the technical field of radiators, and in particular to a curved two-phase liquid variable temperature plate and a radiator. Background Art

[0002] The vapor chamber is a fast heat-conducting element that uses the principle of water absorption through a capillary structure to quickly transfer the heat on the chip to the heat sink for heat dissipation through the internal capillary structure. With the development of technology, the size of a single chip remains unchanged, but its power consumption increases exponentially, and the heat flux density of the chip also increases exponentially. When the heat dissipation space and the temperature requirements of the chip remain unchanged, the heat dissipation power of the radiator must be greatly increased. At this stage, the thermal power consumption of a single chip has exceeded 1000W, and the existing vapor chamber can no longer meet the heat dissipation needs.

[0003] In addition, the height of the existing temperature vapor chamber is within 10mm, generally 5-8mm. The interior of the temperature vapor chamber is a vacuum cavity. Generally speaking, the higher the vacuum degree, the better the heat dissipation effect, and the easier it is for the liquid inside to vaporize into gas. During the rising process of the gas, the increase in internal air pressure will cause the outer shell of the temperature vapor chamber to bulge or rupture. Therefore, the manufacturing requirements of the existing temperature vapor chamber are high, the yield rate is not high, and the heat dissipation power has reached the design limit within the existing heat dissipation space. Summary of the Invention

[0004] In response to the above-mentioned problems, the purpose of the present invention is to provide a curved two-phase liquid variable temperature equalizing plate and radiator, which dissipates heat through the first evaporation and condensation end, strengthens heat dissipation through the second evaporation and condensation end, improves temperature uniformity by setting the shape of the middle section of the evaporation and condensation plate, and effectively increases the speed and volume of liquid reflux through the first reflux mechanism and the second reflux mechanism, thereby improving the heat dissipation power of the temperature equalizing plate, significantly improving its heat transfer efficiency, and achieving better temperature uniformity.

[0005] To achieve the above-mentioned object, the present invention provides a curved two-phase liquid variable temperature plate, a first evaporation condensation end and a second evaporation condensation end; The first evaporation and condensation end includes a lower shell, an evaporation and condensation plate, and a first capillary structure. The first capillary structure is located on the inner surface of the lower shell and the lower surface of the evaporation and condensation plate. The lower shell and the evaporation and condensation plate are fixedly connected to form a first cavity. The first working medium is provided in the first cavity. The second evaporation and condensation end includes an upper shell, an evaporation and condensation plate, and a second capillary structure. The second capillary structure is located on the inner surface of the upper shell and the upper surface of the evaporation and condensation plate. The upper shell and the evaporation and condensation plate are fixedly connected to form a second cavity. The second cavity is provided with a second working medium. The middle section of the evaporative condensation plate is configured as a curved surface. The evaporative condensation plate configures the upper end of the first cavity into multiple protrusions. The evaporative condensation plate configures the lower end of the second cavity into multiple grooves. The first cavity and the second cavity are independent of each other.

[0006] Preferably, the pressure in the first cavity is less than or equal to the pressure in the second cavity, and under the same pressure, the boiling point of the first working medium is higher than or equal to the boiling point of the second working medium; in the working state, the first working medium changes from liquid to gas at the lower shell, and changes from gas to liquid at the evaporative condensation plate, and the second working medium changes from liquid to gas at the evaporative condensation plate, and changes from gas to liquid at the upper shell.

[0007] Preferably, the curved surface is composed of a plurality of first protrusions and first grooves distributed at intervals, and the first protrusions and the first grooves are arranged in one or more of a sine wave, a square, a trapezoid, and a semicircle.

[0008] Preferably, the first evaporation condensation end is also provided with a plurality of first reflux mechanisms, the first reflux mechanisms include a first reflux plate, and a plurality of first reflux channels are provided on both sides of the first reflux plate. The upper end of the first reflux mechanism is fixedly connected to the first protrusion, and the lower end thereof is fixedly connected to the lower shell.

[0009] Preferably, the width of the upper end of the first reflux plate is greater than the width of its lower end, the widths of the first reflux channels are the same, and the intervals between adjacent first reflux channels gradually converge from top to bottom, the thickness of the upper end of the first reflux channel is greater than the thickness of the lower end, and a third capillary structure is provided on the outer surface of the first reflux mechanism, and the third capillary structure is communicated with the first capillary structure.

[0010] Preferably, the second evaporation condensation end is also provided with a plurality of second reflux mechanisms, the second reflux mechanisms include a second reflux plate, and a plurality of second reflux channels are provided on both sides of the second reflux plate. The second reflux mechanisms are fixedly connected between the upper shell and the first groove.

[0011] Preferably, the width of the upper end of the second reflux mechanism is smaller than the width of its lower end, the width of the second reflux channel gradually expands from top to bottom, and the interval width between two adjacent second reflux channels gradually expands from top to bottom, the thickness of the upper end of the second reflux channel is smaller than the thickness of the lower end, and a fourth capillary structure is provided on the outer surface of the second reflux mechanism, and the fourth capillary structure is communicated with the second capillary structure.

[0012] Preferably, the second evaporation and condensation end also includes a plurality of heat pipes, the heat pipe includes a third cavity formed by a closed end and an open end, a fifth capillary structure is provided on the inner wall of the heat pipe, and a second groove matching the open end of the heat pipe is provided on the upper shell. After the upper shell is fixedly connected to the heat pipe, the fifth capillary structure is communicated with the second capillary structure, and the third cavity is communicated with the second cavity.

[0013] Preferably, the evaporative condensation plate is configured as a hollow heat dissipation tube, and a third working medium is provided in the heat dissipation tube.

[0014] The present invention provides a radiator including a temperature homogenizing plate.

[0015] The beneficial effects of the present invention are as follows: the curved two-phase liquid-variable temperature equalizing plate provided by the present invention can quickly reduce the temperature of the heat source, and the heat of the heat source is basically dissipated at the first evaporation and condensation end, and the heat is enhanced through the second evaporation and condensation end. The second evaporation and condensation end continues to enhance the heat dissipation after the basic heat dissipation of the first evaporation and condensation end, thereby reducing the difficulty of manufacturing the existing heat dissipation cavity and significantly improving the vacuum heat dissipation space, thereby significantly improving the overall heat dissipation power and temperature equalization performance of the temperature equalizing plate; by arranging a plurality of first protrusions and first grooves distributed at intervals in the middle section of the evaporation and condensation plate, the temperature equalization effect of the temperature equalizing plate is improved; by significantly reducing the pressure requirements in the first cavity and the second cavity, the heat dissipation power is greatly improved without changing the volume of the heat dissipation space, the stability and yield of the product are improved, and the manufacturing cost is reduced; by setting the first reflux mechanism and the second reflux mechanism, the speed and volume of the liquid reflux are effectively increased, thereby improving the heat dissipation power of the temperature equalizing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings illustrate exemplary embodiments of the present invention and together with the description serve to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

[0017] Figure 1 This is a schematic structural diagram of the curved two-phase liquid variable temperature plate in Example 1; Figure 2 Schematic diagram of the internal structure of the curved two-phase liquid variable temperature plate in Example 1; Figure 3 Schematic diagram of the structure of the first reflux mechanism in Example 1; Figure 4 Schematic diagram of the structure of the second reflux mechanism in Example 1; Figure 5 Schematic diagram of the structure of the radiator in Example 2; Figure 6 Schematic diagram of the structure of the evaporative condensation plate in Example 3; Figure 7 This is a structural diagram of the existing radiator in Comparative Example 4. DETAILED DESCRIPTION

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the relevant content and are not intended to limit the present invention. It should also be noted that, for ease of description, only portions relevant to the present invention are shown in the accompanying drawings.

[0019] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments. Example

[0020] See also Figures 1 to 4 , this embodiment 1 includes: A curved two-phase liquid variable temperature plate, comprising a first evaporation and condensation end 1 and a second evaporation and condensation end 2; The first evaporation and condensation end 1 includes a lower housing 11, an evaporation and condensation plate 3, and a first capillary structure 41. The first capillary structure 41 is located on the inner surface of the lower housing 11 and the lower surface of the evaporation and condensation plate 3. The lower housing 11 and the evaporation and condensation plate 3 are fixedly connected to form a first cavity 51. A first working medium (not shown) is provided in the first cavity 51. The second evaporation and condensation end 2 includes an upper shell 21, an evaporation and condensation plate 3, and a second capillary structure 42. The second capillary structure 42 is located on the inner surface of the upper shell 21 and the upper surface of the evaporation and condensation plate 3. The upper shell 21 and the evaporation and condensation plate 3 are fixedly connected to form a second cavity 52. ​​The second cavity 52 is provided with a second working medium. The middle section of the evaporative condensation plate 3 is set to a curved surface, the evaporative condensation plate 3 sets the upper end of the first cavity 51 to multiple protrusions, and the evaporative condensation plate 3 sets the lower end of the second cavity 52 to multiple grooves. The first cavity 51 and the second cavity 52 are independent of each other, and the first capillary structure 41 and the second capillary structure 42 are also independent of each other and not connected.

[0021] In the non-operating state, the first cavity 51 and the second cavity 52 are independent of each other and each forms a closed cavity. In this embodiment 1, the heat source is a chip 61, located below the lower housing 11. The first evaporation and condensation end 1 is provided with a first working medium, and the second evaporation and condensation end 2 is provided with a second working medium. The first and second working media are liquid. The first and second cavities 51 and 52 are evacuated. Due to technical limitations, the evacuation can only be done as far as possible at this stage, and it is impossible to achieve an absolute vacuum state. The first and second cavities 51 and 52 are considered to be in a vacuum state when the pressure is within 0.5 atmospheres. In this embodiment, the pressure in the first and second cavities 51 and 52 is 0.4 atmospheres, which meets the heat dissipation requirements of the vapor chamber.

[0022] In the working state, since the first cavity 51 is in a vacuum state, that is, the heat on the chip 61 is quickly transferred to the first evaporation condensation end 1 by contacting the lower shell 11. In the state close to vacuum, even if there is a small amount of heat transferred from the chip 61, it is enough to make the liquid first working medium change from liquid to gas in the first evaporation condensation end 1. The first evaporation condensation end 1 absorbs heat in the phase change process and continues to reduce the temperature of the chip 61. The gaseous first working medium continues to rise to the evaporation condensation plate 3. The gas phase changes to liquid when it is cooled and releases heat at the same time. The heat continues to be transferred to the second evaporation condensation end 2 through the evaporation condensation plate 3. At the same time, under the capillary action and gravity Under the action of force, the liquid first working medium returns to the lower shell 11 along the first capillary structure 41. Similarly, the transferred heat causes the second working medium to change from liquid to gas, and at the same time absorbs the heat on the evaporative condensation plate 3. The gaseous second working medium continues to rise and encounters the upper shell 21 with a lower temperature, and changes into liquid again. At the same time, the heat released by the gas phase changing into liquid is diffused out through the heat sink above the temperature equalizing plate. Under the action of capillary action and gravity, the liquid second working medium returns to the evaporative condensation plate 3 along the second capillary structure 42. This cycle is repeated to complete the circulation of the second working medium, and finally achieve heat dissipation of the chip 61.

[0023] The height of the existing heat spreader is generally within 10mm, usually 5-8mm. If the height of the heat spreader is increased, the vacuum operation requirements will be higher. At the same time, the pressure generated by the gas rising process will cause the heat spreader shell to deform and rupture. In this embodiment 1, the first evaporation condensation end 1 and the second evaporation condensation end 2 can be controlled within the existing height, and the vacuum heat dissipation space can be increased, and the heat transfer length of the heat spreader can be increased, thereby improving the heat dissipation power and temperature uniformity performance of the heat spreader. At the same time, the first evaporation condensation end 1 and the second evaporation condensation end 2 are connected through the evaporation condensation plate 3, so that the second evaporation condensation end 2 continues to strengthen the heat dissipation after the basic heat dissipation of the first evaporation condensation end 1. On the basis of reducing the difficulty of manufacturing the existing heat dissipation cavity, the vacuum heat dissipation space is significantly increased, which can significantly improve the overall heat dissipation power and temperature uniformity performance of the heat spreader.

[0024] During the heat dissipation process of the heat spreader, the middle section of the evaporative condensation plate 3 is configured as a curved surface. A curved surface is different from a flat surface. Since the chip 61 is very small, the node temperatures are different on the same horizontal plane due to the different distances from the chip 61. The curved surface can make the adjacent temperature differences on the same horizontal plane larger, thereby increasing heat conduction and improving the temperature equalization effect of the heat spreader. The curved surface of the middle section of the evaporative condensation plate 3 can be composed of a plurality of first protrusions 31 and first grooves 32 distributed at intervals. In this way, the evaporative condensation plate 3 configures the upper end of the first cavity 51 as a plurality of protrusions, and the evaporative condensation plate 3 configures the lower end of the second cavity 52 as a plurality of grooves. The presence of the protrusions and grooves also makes the adjacent temperature differences on the same height plane from the chip 61 larger, thereby increasing heat conduction and improving the temperature equalization effect of the heat spreader.

[0025] The pressure in the first cavity 51 is less than or equal to the pressure in the second cavity 52. ​​Under the same pressure, the boiling point of the first working medium is higher than or equal to the boiling point of the second working medium. For the same substance, generally, the greater the gas pressure, the higher the boiling point. Therefore, the pressure requirement in the second cavity 52 is lower than that in the first cavity 51. As long as appropriate first working medium and second working medium are selected, the pressure requirements in the first cavity 51 and the second cavity 52 can be greatly reduced. Without changing the volume of the heat dissipation space, the heat dissipation power is greatly improved, and the stability and yield rate of the product are improved. In addition, the evaporative condensation plate 3 can be integrally formed by stamping, with first protrusions 31 and first grooves 32 distributed at intervals. During the heat dissipation process, the gas in the first cavity 51 rises, exerting upward pressure on the evaporative condensation plate 3, and the gas in the second cavity 52 rises, exerting downward pressure on the evaporative condensation plate 3. Therefore, the evaporative condensation plate 3 can offset part of the pressure, effectively reducing the risk of bulging or rupture after the effective height of heat dissipation is increased.

[0026] The first working medium is preferably one of acetic acid, toluene, and water, and the second working medium is preferably one of acetone, methanol, and ethanol. Since the first evaporation and condensation end 1 is closer to the heat source, its internal temperature is higher. Therefore, the first working medium is a liquid with a higher boiling point, and the second evaporation and condensation end 2 is farther away from the heat source, its internal temperature is lower than that of the first evaporation and condensation end 1, its internal vacuum requirement can also be lower, and the internal pressure can be greater. The second working medium is a liquid with a lower boiling point, which better ensures the normal heat dissipation of the temperature equalizing plate, improves the heat dissipation power of the temperature equalizing plate, reduces the manufacturing requirements of the temperature equalizing plate, and improves the qualified rate of the finished product of the temperature equalizing plate. The selection of the working medium and the second working medium depends on the thermal power consumption of the chip 61 and the temperature to which it needs to be lowered. The heat of the chip 61 is first conducted through the first evaporation condensation end 1 for the first time, and then conducted through the second evaporation condensation end 2 for the second time. Therefore, the temperature at the lower shell 11 is the highest, the temperature at the evaporation condensation plate 3 is the second, and the temperature at the upper shell 21 is the third. It is only necessary to meet the working state that the first working medium changes from liquid to gas at the temperature of the lower shell 11, and changes from gas to liquid at the temperature of the evaporation condensation plate 3, and the second working medium changes from liquid to gas at the temperature of the evaporation condensation plate 3, and changes from gas to liquid at the temperature of the upper shell 21.

[0027] The curved surface is composed of a plurality of first protrusions 31 and first grooves 32 distributed at intervals. The first protrusions 31 and first grooves 32 are arranged to be one or more of a sine wave, a square, a trapezoid, and a semicircle. In this embodiment 1, the first protrusions 31 and the first grooves 32 are arranged to be trapezoidal.

[0028] The first evaporation condensation end 1 is also provided with a plurality of first reflux mechanisms 7, the first reflux mechanisms 7 include a first reflux plate 71, and a plurality of first reflux channels 72 are provided on both sides of the first reflux plate 71. The upper end of the first reflux mechanism 7 is fixedly connected to the first protrusion 31, and the lower end thereof is fixedly connected to the lower shell 11. The width of the upper end of the first reflux plate 71 is greater than the width of the lower end thereof, the widths of the first reflux channels 72 are the same, and the intervals between adjacent first reflux channels 72 gradually converge from top to bottom. The thickness of the upper end of the first reflux channel 72 is greater than the thickness of the lower end thereof, and a third capillary structure 43 is provided on the outer surface of the first reflux mechanism 7, and the third capillary structure 43 is communicated with the first capillary structure 41. A plurality of second protrusions 73 are provided on both sides of the first return plate 71, and a first return channel 72 is formed between adjacent second protrusions 73. A plurality of first return channels 72 are provided on both sides of the first return plate 71. The liquid working medium condensed below the first protrusion 31 flows from top to bottom along the third capillary structure 43 to the lower shell 11 under the dual action of capillary and gravity. The first return channel 72 can increase the speed of liquid return. The first return mechanism 7 and the third capillary structure 43 can effectively increase the speed and volume of liquid return, so that the liquid working medium on the evaporation condensation plate 3 can return to the lower shell 11 faster and more, thereby improving the heat dissipation power of the temperature equalizing plate. The purpose of the first reflux mechanism 7 is to increase the liquid reflux speed and volume, and to reduce the weight and volume of the first reflux mechanism 7 itself as much as possible. Therefore, the width of the upper end of the first reflux plate 71 is greater than the width of its lower end, so that more liquid is collected at the upper end. In other words, more liquid at the upper end is allowed to flow back to the lower shell body 11 through the first reflux plate 71. The construction of the first reflux channel 72 can increase the liquid reflux speed. The first reflux channels 72 have the same width, and the intervals between adjacent first reflux channels 72 gradually converge from top to bottom. The thickness of the upper end of the first reflux channel 72 is greater than the thickness of the lower end, which makes the liquid reflux speed faster, thereby improving the heat dissipation power of the temperature equilibrium plate.

[0029] Similarly, the second evaporation and condensation end 2 is also provided with a plurality of second reflux mechanisms 8, which include a second reflux plate 81. A plurality of second reflux channels 82 are provided on both sides of the second reflux plate 81. The second reflux mechanism 8 is fixedly connected between the upper shell 21 and the first groove 32. The width of the upper end of the second reflux mechanism 8 is smaller than the width of its lower end. The width of the second reflux channel 82 gradually increases from top to bottom, and the interval width between two adjacent second reflux channels 82 also gradually increases from top to bottom. The thickness of the upper end of the second reflux channel 82 is smaller than the thickness of the lower end. A fourth capillary structure 44 is provided on the outer surface of the second reflux mechanism 8. The fourth capillary structure 44 is connected to the second capillary structure 42 and has the same function as the first reflux mechanism 7. The second reflux channel 82 can increase the speed of liquid reflux. The second reflux mechanism 8 and the fourth capillary structure 44 can effectively increase the speed and volume of liquid reflux, so that the liquid working medium on the upper shell 21 can flow back to the evaporation and condensation plate 3 faster and more, thereby improving the heat dissipation power of the temperature homogenizing plate.

[0030] Both the first cavity 51 and the second cavity 52 are provided with a plurality of support columns 62 distributed in an staggered manner. The outer surfaces of the support columns 62 are provided with sixth capillary structures 46 made of sintered copper powder. The functions and principles of the support columns 62 and the sixth capillary structures 46 in the first cavity 51 and the second cavity 52 are the same. Taking the first evaporation and condensation end 1 as an example, when the first working medium is heated and changes from liquid to gas, the gaseous working medium will rise. The support columns 62 enhance the outer wall strength of the first cavity 51, support the evaporation and condensation plate 3 and the lower shell 11 of the first cavity 51, protect the first cavity 51, and reduce the impact of increased internal pressure on the evaporation and condensation plate 3 and the lower shell 11. At the same time, the sixth capillary structures 46 on the outer surfaces of the support columns 62 can quickly diffuse heat upward and quickly return the condensed liquid working medium to the lower shell 11, thereby improving the strength of the first cavity 51, effectively preventing bulging or damage in the first cavity 51, and improving the heat dissipation power of the entire temperature dispersion plate.

[0031] Example 2, a radiator, referring to Figure 5, including a temperature averaging plate and a plurality of heat sinks 10. The temperature averaging plate differs from the temperature averaging plate in Example 1 in that: (1) the first protrusion 31 and the first groove 32 are arranged in a semicircular shape; (2) the second evaporation condensation end 2 also includes a plurality of heat pipes 9, the heat pipe 9 includes a third cavity 53 formed by a closed end and an open end, a fifth capillary structure 45 is provided on the inner wall of the heat pipe 9, and a second groove 22 is provided on the upper shell 21 to match the open end of the heat pipe 9. After the upper shell 21 and the heat pipe 9 are fixedly connected through the second groove 22, the fifth capillary structure 45 communicates with the second capillary structure 42, and the third cavity 53 communicates with the second cavity 52. The heat pipe 9 is a circular or elliptical hollow tube with one end closed. In this embodiment 2, the second cavity 52 and the third cavity 53 are connected and closed, and are evacuated simultaneously during vacuuming. Of course, due to the arrangement of the first evaporation and condensation end 1 and the second evaporation and condensation end 2 in this embodiment 2, the pressure requirement in the second cavity 52 and the third cavity 53 is significantly lower than that of the current temperature equalizing plate, and the heat dissipation power is significantly improved.

[0032] The radiator in this embodiment 2 includes a temperature equalizing plate and multiple heat sinks 10. The multiple heat sinks 10 are vertically distributed and connected to the heat pipe 9. The heat dissipation principle of the temperature equalizing plate in this embodiment 2 is basically the same as that of the temperature equalizing plate in Example 1. The heat of the chip 61 is conducted from the first evaporation and condensation end 1 to the evaporation and condensation plate 3, and then conducted to the heat sink 10 through the second evaporation and condensation end 2 and the heat pipe 9. The heat of the chip 61 is finally diffused out through the heat sink 10. The heat conduction in the first evaporation and condensation end 1 is the same and will not be repeated here.

[0033] Example 3 is different from Example 1 in that: Figure 6The evaporative condensation plate 3 is configured as a hollow heat dissipation tube 33, and a third working medium is provided in the heat dissipation tube 33. The evaporative condensation plate 3 can be formed by fixing and welding a plurality of heat dissipation circular tubes in sequence, or by welding a plurality of heat dissipation plates to each other. It only needs to have a hollow space inside, and its internal pressure can be normal atmospheric pressure. Its function is to evenly transfer the heat from the first evaporative condensation end 1 to the second evaporative condensation end 2, thereby improving the temperature uniformity performance of the temperature equalizing plate. Due to the different distances from the chip 61, the temperature of the heat transferred to the evaporative condensation plate 3 through the first evaporative condensation end 1 is also different. Within the temperature range of the lower end of the first evaporative condensation end 1 and the upper end of the second evaporative condensation end 2, the third working medium is preferably liquid. Due to the fluidity of the liquid, it is easier for the temperature in the heat dissipation tube 3 to tend to be the same, thereby improving the temperature uniformity performance of the temperature equalizing plate. At the same time, since a third working medium is provided in the heat dissipation pipe 33, when the pressure in the first evaporation condensation end 1 and the second evaporation condensation end 2 increases, the third working medium can play a buffering role, effectively preventing the first evaporation condensation end 1 and the second evaporation condensation end 2 from rupturing. In addition, since the heat dissipation pipe 33 is at normal atmospheric pressure, and its surface temperature generally does not exceed 100 degrees Celsius after the heat is dissipated at the first evaporation condensation end 1, in this embodiment 3, the third working medium can be selected as liquid water, and its heat dissipation principle is the same as that of the temperature equalizing plate in embodiment 1, which will not be repeated here.

[0034] Comparative Example 1 is a heat sink composed of a temperature homogenizing plate and heat sinks 10 in Example 1, wherein a plurality of heat sinks 10 are vertically connected to the upper housing 21; Comparative Example 2 is the radiator in Example 2; Comparative Example 3 is a heat sink composed of a temperature homogenizing plate and heat sink 10 in Example 3; Comparative Example 4 is an existing radiator: Figure 7 As shown, it includes a temperature equalizing plate 101, a heat pipe 102 and a heat sink 10. The heat pipe 102 is a straight heat pipe and is provided with a capillary structure inside. The temperature equalizing plate 101 is also provided with a capillary structure. The interior of the temperature equalizing plate 101 and the interior of the heat pipe 102 form a connected closed cavity, and the pressure in the cavity is basically the same as the pressure in the first cavity 51 in Comparative Example 1-3. The bottom of the temperature equalizing plate 101 contacts the chip 61, and the heat generated by the chip 61 is transferred to the capillary structure and finally diffused out by the heat sink 10. Its heat dissipation principle is basically the same as that of the radiator in Comparative Example 1-3.

[0035] The total volume of the radiator in Comparative Example 1-3 is basically the same as that in Comparative Example 4, the heights of the first evaporation-condensation end 1 and the second evaporation-condensation end 2 in Comparative Example 1-3 are basically the same, the height of the first evaporation-condensation end 1 is basically the same as the height of the temperature equalizing plate 101 in Comparative Example 4, the pressure in the first cavity 51 in Comparative Example 1-3 is basically the same as the pressure in the temperature equalizing plate in Comparative Example 4, and the heat dissipation power of Comparative Example 1-3 and Comparative Example 4 are compared under similar external temperature, environment, and working conditions of the chip 61. Specific comparison data are shown in Table 1.

[0036] Table 1 Comparative data serial number Radiator volume Thermal resistance (RCA / 700W) TC (℃) TA (℃) △T（℃） Comparative Example 1 1 0.0723 75.81 25.2 50.61 Comparative Example 2 1 0.0638 69.76 25.1 44.66 Comparative Example 3 1 0.0695 73.95 25.3 48.65 Comparative Example 4 (Existing Radiator) 1 0.0862 85.84 25.5 60.34 Table 1 shows comparative data between Comparative Examples 1-3 and Comparative Example 4, where the heat sink has a volume of approximately 20cmX15cmX10cm, the power consumption of the heat source chip is 700W, and the heat dissipation performance of the heat sink is measured under other conditions where the ambient temperature and working environment are basically the same. In the table, TC is the temperature at the center of the chip 61 casing, TA is the ambient temperature, △T is the heat dissipation capacity temperature of the heat sink, and RCA refers to the thermal resistance from the casing to the air, which is called Rca (Shell-to-Air Thermal Resistance). In the calculation of thermal resistance, Rca represents the thermal resistance between the package casing and the surrounding air. Under the same conditions, the smaller the thermal resistance, the greater the heat dissipation power of the heat sink and the better the heat dissipation effect. Obviously, the heat dissipation power of the heat sink in Comparative Examples 1-3 is significantly higher than that in Comparative Example 4, that is, significantly higher than the heat dissipation power of the existing heat sink.

[0037] The temperature equalizing plate and radiator provided by the present invention can quickly reduce the temperature of the heat source (chip), and connect the first evaporative condensation end and the second evaporative condensation end through the evaporative condensation plate, so that the second evaporative condensation end continues to strengthen the heat dissipation after the basic heat dissipation of the first evaporative condensation end, thereby reducing the difficulty of manufacturing the existing heat dissipation cavity and significantly increasing the vacuum heat dissipation space, thereby significantly improving the overall heat dissipation power and temperature equalization performance of the temperature equalizing plate; by arranging a plurality of first protrusions and first grooves distributed at intervals in the middle section of the evaporative condensation plate, the temperature equalization effect of the temperature equalizing plate is improved; by significantly reducing the pressure requirements in the first cavity and the second cavity, the heat dissipation power is significantly increased without changing the volume of the heat dissipation space, the stability and yield of the product are improved, and the manufacturing cost is reduced; by setting the first reflux mechanism and the second reflux mechanism, the speed and volume of the liquid reflux are effectively increased, thereby improving the heat dissipation power of the temperature equalizing plate.

[0038] To sum up, the curved two-phase liquid variable temperature equalizing plate and radiator provided by the present invention dissipate heat through the first evaporation and condensation end, enhance heat dissipation through the second evaporation and condensation end, improve temperature uniformity by setting the shape of the middle section of the evaporation and condensation plate, and effectively increase the speed and volume of liquid reflux through the first reflux mechanism and the second reflux mechanism, thereby improving the heat dissipation power of the temperature equalizing plate, significantly improving its heat transfer efficiency, and achieving better temperature uniformity.

[0039] It should be understood by those skilled in the art that the above embodiments are merely for the purpose of illustrating the present invention clearly, and are not intended to limit the scope of the present invention. For those skilled in the art, other changes or modifications may be made based on the above invention, and these changes or modifications are still within the scope of the present invention.

Claims

1. A curved two-phase liquid variable temperature plate, characterized by: a first evaporation-condensation end and a second evaporation-condensation end; The first evaporation and condensation end includes a lower shell, an evaporation and condensation plate, and a first capillary structure. The first capillary structure is located on the inner surface of the lower shell and the lower surface of the evaporation and condensation plate. The lower shell and the evaporation and condensation plate are fixedly connected to form a first cavity. The first working medium is provided in the first cavity. The second evaporation and condensation end includes an upper shell, an evaporation and condensation plate, and a second capillary structure. The second capillary structure is located on the inner surface of the upper shell and the upper surface of the evaporation and condensation plate. The upper shell and the evaporation and condensation plate are fixedly connected to form a second cavity. The second cavity is provided with a second working medium. The middle section of the evaporative condensation plate is configured as a curved surface. The evaporative condensation plate configures the upper end of the first cavity into multiple protrusions. The evaporative condensation plate configures the lower end of the second cavity into multiple grooves. The first cavity and the second cavity are independent of each other.

2. The curved two-phase liquid variable temperature plate according to claim 1, characterized in that: The pressure in the first cavity is less than or equal to the pressure in the second cavity, and under the same pressure, the boiling point of the first working medium is higher than or equal to the boiling point of the second working medium; In the working state, the first working medium changes from liquid to gas at the lower shell and changes back to liquid at the evaporative condensation plate; the second working medium changes from liquid to gas at the evaporative condensation plate and changes back to liquid at the upper shell.

3. The curved two-phase liquid variable temperature plate according to claim 1, characterized in that: The curved surface is composed of a plurality of first protrusions and first grooves distributed at intervals, and the first protrusions and the first grooves are arranged in one or more shapes of a sine wave, a square, a trapezoid, and a semicircle.

4. The curved two-phase liquid variable temperature plate according to claim 1, characterized in that: The first evaporation and condensation end is also provided with multiple first reflux mechanisms, which include a first reflux plate. Multiple first reflux channels are provided on both sides of the first reflux plate. The upper end of the first reflux mechanism is fixedly connected to the first protrusion, and the lower end thereof is fixedly connected to the lower shell.

5. The curved two-phase liquid variable temperature plate according to claim 4, characterized in that: The width of the upper end of the first reflux plate is greater than the width of the lower end thereof, the widths of the first reflux channels are the same, and the intervals between adjacent first reflux channels gradually converge from top to bottom, the thickness of the upper end of the first reflux channel is greater than the thickness of the lower end thereof, and a third capillary structure is provided on the outer surface of the first reflux mechanism, and the third capillary structure is communicated with the first capillary structure.

6. The curved two-phase liquid variable temperature plate according to claim 1, characterized in that: The second evaporation condensation end is also provided with a plurality of second reflux mechanisms, the second reflux mechanisms include a second reflux plate, and a plurality of second reflux channels are provided on both sides of the second reflux plate. The second reflux mechanisms are fixedly connected between the upper shell and the first groove.

7. The curved two-phase liquid variable temperature plate according to claim 6, characterized in that: The width of the upper end of the second reflux mechanism is smaller than the width of its lower end, the width of the second reflux channel gradually expands from top to bottom, and the width of the interval between two adjacent second reflux channels gradually expands from top to bottom, the thickness of the upper end of the second reflux channel is smaller than the thickness of the lower end, and a fourth capillary structure is provided on the outer surface of the second reflux mechanism, and the fourth capillary structure is communicated with the second capillary structure.

8. The curved two-phase liquid variable temperature plate according to claim 1, characterized in that: The second evaporation and condensation end also includes multiple heat pipes, and the heat pipe includes a third cavity formed by a closed end and an open end. A fifth capillary structure is provided on the inner wall of the heat pipe, and a second groove is provided on the upper shell to match the open end of the heat pipe. After the upper shell is fixedly connected to the heat pipe, the fifth capillary structure is communicated with the second capillary structure, and the third cavity is communicated with the second cavity.

9. The curved two-phase liquid variable temperature plate according to claim 1, characterized in that: The evaporative condensation plate is configured as a hollow heat dissipation tube, and a third working medium is provided in the heat dissipation tube.

10. A radiator, characterized in that: It comprises a temperature averaging plate, and the temperature averaging plate is the curved two-phase liquid variable temperature averaging plate according to any one of claims 1-9.

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