Semiconductor laser with efficient heat dissipation

Abstract

The invention relates to the technical field of lasers, and provides an efficient heat dissipation semiconductor laser which comprises a packaging substrate and a semiconductor laser chip. The packaging substrate comprises a concave electric conduction and heat conduction plate, a convex electric conduction and heat conduction plate and an insulation isolation plate, and the insulation isolation plate is fixedly arranged between the concave electric conduction and heat conduction plate and the convex electric conduction and heat conduction plate; the semiconductor laser chip is fixedly arranged on the convex portion of the convex electric conduction and heat conduction plate and located in the notch of the concave electric conduction and heat conduction plate, one lead of the semiconductor laser chip is connected with the convex electric conduction and heat conduction plate, and the other lead of the semiconductor laser chip is connected with the concave electric conduction and heat conduction plate. The semiconductor laser chip packaging structure has the advantages that by means of the packaging substrate of a unique novel structure, the stacked concave electric conduction and heat conduction plate and the stacked convex electric conduction and heat conduction plate not only supply power to the semiconductor laser chip, but also absorb heat generated when the semiconductor laser chip works, the heat dissipation efficiency of the semiconductor laser chip is improved, and then the output optical power of the semiconductor laser chip is stabilized.

Description

Technical Field

[0001] The present invention relates to the technical field of lasers, and in particular to a semiconductor laser with high-efficiency heat dissipation. Background Art

[0002] Semiconductor lasers, also known as laser diodes, use semiconductor materials as their working medium. Due to their small size, light weight, low cost, and selectable wavelength, semiconductor lasers are widely used in laser communications, optical storage, optical gyroscopes, laser printing, rangefinders, and radar.

[0003] The high-density heat generated by semiconductor lasers during operation accumulates within the laser chip due to limited heat dissipation pathways, significantly increasing its temperature. This leads to an increase in the laser chip's threshold current, a decrease in output efficiency, and saturation or even a decrease in output power. High chip temperatures also shorten device lifespan, becoming a significant factor limiting the stability of semiconductor laser performance.

[0004] The chip components of traditional semiconductor lasers are generally packaged in C-mount, such as Figure 1 As shown, it includes a thermally conductive substrate 21, a semiconductor laser chip 2 fixedly mounted on the thermally conductive substrate 21, and a screw hole 22 provided on the thermally conductive substrate 21. The semiconductor laser chip 2 is connected to a lead 23. The chip assembly of this traditional semiconductor laser secures the thermally conductive substrate to a metal heat sink by screws passing through the screw holes. When the lead is powered on, the semiconductor laser chip emits light. In this traditional semiconductor laser, the heat generated by the semiconductor laser chip is transferred to the metal heat sink through the thermally conductive substrate, which dissipates the heat. However, due to the structural limitations of the thermally conductive substrate, the thermal conductivity is poor. The thermally conductive substrate is fixed to the heat sink by only one screw, resulting in poor stability. During use, the screw is easily loosened, causing the position of the thermally conductive substrate to change, which can easily lead to poor contact between the thermally conductive substrate and the metal heat sink, reducing the heat dissipation efficiency.

[0005] Therefore, in order to improve the heat dissipation efficiency of semiconductor laser chips, the technical field urgently needs a semiconductor laser with high heat dissipation efficiency. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a semiconductor laser with high-efficiency heat dissipation.

[0007] The technical solution adopted by the present invention is a semiconductor laser with high efficiency heat dissipation, comprising:

[0008] Packaging substrate and semiconductor laser chip;

[0009] The packaging substrate comprises a concave conductive and heat-conducting plate, a convex conductive and heat-conducting plate and an insulating isolation plate, wherein the insulating isolation plate is fixedly arranged between the concave conductive and heat-conducting plate and the convex conductive and heat-conducting plate;

[0010] The semiconductor laser chip is fixedly arranged on the convex portion of the convex conductive and heat-conducting plate, and the semiconductor laser chip is located in the concave conductive and heat-conducting plate. One lead of the semiconductor laser chip is connected to the convex conductive and heat-conducting plate, and the other lead of the semiconductor laser chip is connected to the concave conductive and heat-conducting plate.

[0011] Furthermore, it also includes: a circuit board;

[0012] The front side of the circuit board is provided with a soldering pad, the back side of the circuit board is provided with a conductive block, the circuit board further comprises a resistor, the soldering pad is connected to one end of the resistor via a first trace, and the other end of the resistor is connected to the conductive block via a second trace;

[0013] The convex conductive and heat-conducting plate is attached to the back side of the circuit board and is in contact with the conductive block.

[0014] Furthermore, it also includes: a tube body;

[0015] One end of the tube body is provided with a positioning hole, and the other end of the tube body is a light outlet;

[0016] The packaging substrate and the circuit board are both inserted into the positioning hole, the semiconductor laser chip is located inside the tube body, and the solder pad is outside the tube body.

[0017] Furthermore, it also includes: a focusing mirror, which is fixedly arranged on the light outlet.

[0018] Further, it also includes: a housing;

[0019] The shell is provided with a channel, the tube body is inserted into the channel, and the positioning hole is located in the channel and is covered by the shell.

[0020] Furthermore, the tube body is a metal tube body, and in the positioning hole, the concave conductive and heat-conducting plate contacts the tube body, and the insulating area of ​​the circuit board isolates the convex conductive and heat-conducting plate from the tube body.

[0021] Furthermore, it also includes: a positive power line and a negative power line;

[0022] The positive power line is connected to the tube body, and the negative power line is connected to the welding pad.

[0023] Furthermore, the concave conductive and heat-conducting plate is made of copper material, and the convex conductive and heat-conducting plate is made of brass material.

[0024] Furthermore, the insulating isolation plate does not extend beyond the overlapping area of ​​the concave conductive and heat conductive plate and the convex conductive and heat conductive plate.

[0025] Compared with the background technology, the present invention has the following advantages:

[0026] 1. With the unique new structure of the packaging substrate, the stacked concave and convex conductive plates not only supply power to the semiconductor laser chip but also absorb the heat generated by the semiconductor laser chip during operation, thereby improving the heat dissipation efficiency of the semiconductor laser chip and stabilizing the output optical power of the semiconductor laser chip. The semiconductor laser chip is surrounded on three sides by the concave conductive plates, and one side is used to output the light beam. Part of the heat generated by the semiconductor laser chip is transferred outward through the concave conductive plates through the concave conductive plates, while the other part of the heat generated by the semiconductor laser chip is transferred outward through the convex portions and the convex conductive plates.

[0027] 2. The resistance of the circuit board prevents excessive current and helps protect the semiconductor laser chip. The solder pads of the circuit board are convenient for connecting with the power leads and for removing the power leads from the solder pads during later maintenance.

[0028] 3. The tube body not only serves to accommodate the circuit board, package substrate and semiconductor laser chip, but also the circuit board and package substrate are stuck in the positioning holes and are not easy to loosen, thereby stabilizing the position of the semiconductor laser chip and making it easy to move the semiconductor laser chip by holding the tube body. The tube body also helps to absorb the heat of the package substrate and then dissipate the heat.

[0029] 4. The power lead is connected to the metal pipe body by utilizing the conductivity of the metal pipe body, which is convenient to operate and also convenient to remove the power lead from the metal pipe body during later maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0031] Figure 1 It is a schematic structural diagram of a chip component of a traditional semiconductor laser in the background technology.

[0032] Figure 2 It is a structural schematic diagram of a semiconductor laser with high heat dissipation according to the present invention.

[0033] Figure 3 It is a schematic diagram of the semiconductor laser chip in the present invention being mounted on a packaging substrate.

[0034] Figure 4 yes Figure 3 Cross-sectional view in the AA direction.

[0035] Figure 5 It is a structural schematic diagram of the concave conductive and heat conductive plate in the present invention.

[0036] Figure 6 It is a structural schematic diagram of the convex conductive and heat conductive plate in the present invention.

[0037] Figure 7 It is a structural schematic diagram of the tube body in the present invention.

[0038] Figure 8 yes Figure 7 Left view of .

[0039] Figure 9 It is a schematic diagram of the packaging substrate and the circuit board inserted into the positioning hole in the present invention.

[0040] Figure 10 yes Figure 9 Left view of .

[0041] Figure 11 It is a schematic diagram of the positive power line and the negative power line connecting to the tube body and the welding pad respectively in the present invention.

[0042] Figure 12 It is a schematic diagram of the tube body being inserted into the shell in the present invention.

[0043] Figure 1: Package base 1; concave conductive and heat-conducting plate 11; notch 111; convex conductive and heat-conducting plate 12; convex portion 121; insulating isolation plate 13; semiconductor laser chip 2; thermally conductive substrate 21; screw hole 22; lead 23; circuit board 3; solder pad 31; conductive block 32; resistor 33; tube body 4; positioning hole 41; focusing lens 42; housing 5; channel 51; positive power line 6; negative power line 7. DETAILED DESCRIPTION

[0044] The embodiment of the present invention provides a semiconductor laser with high-efficiency heat dissipation. The overall idea of ​​the technical solution is as follows:

[0045] With a unique new packaging substrate structure, a concave conductive and thermally conductive plate, a convex conductive and thermally conductive plate, and an insulating isolation plate are stacked. The semiconductor laser chip is fixedly mounted on the convex portion of the convex conductive and thermally conductive plate, and the semiconductor laser chip is located within the concave portion of the conductive and thermally conductive plate. This not only supplies power to the semiconductor laser chip, but also absorbs and transfers heat generated by the semiconductor laser chip both by the convex conductive and thermally conductive plate and then by the concave conductive and thermally conductive plate, thereby improving the heat dissipation efficiency of the semiconductor laser chip. A circuit board is placed on the convex conductive and thermally conductive plate, and both the circuit board and the packaging substrate are inserted into the positioning holes of the tube body. The concave conductive and thermally conductive plate of the packaging substrate maintains stable contact with the tube body, dissipating heat from the tube body. The circuit board and the tube body are also connected to two power leads, respectively, making connection operations convenient. Finally, the tube body is encased in a housing, allowing the semiconductor laser chip to stably output optical power.

[0046] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0047] See Figures 1 to 12 , a preferred embodiment of the present invention.

[0048] A semiconductor laser with high-efficiency heat dissipation, comprising:

[0049] Packaging substrate 1 and semiconductor laser chip 2;

[0050] The package substrate 1 includes a concave conductive and heat-conducting plate 11, a convex conductive and heat-conducting plate 12, and an insulating isolation plate 13, wherein the insulating isolation plate 13 is fixedly disposed between the concave conductive and heat-conducting plate 11 and the convex conductive and heat-conducting plate 12;

[0051] The semiconductor laser chip 2 is fixedly arranged on the convex portion 121 of the convex conductive and heat-conducting plate 12, and the semiconductor laser chip 2 is located within the recess 111 of the concave conductive and heat-conducting plate 11. One lead of the semiconductor laser chip 2 is connected to the convex conductive and heat-conducting plate 12, and the other lead of the semiconductor laser chip 2 is connected to the concave conductive and heat-conducting plate 11.

[0052] The beneficial effects or advantages of the present invention are as follows: with the help of the unique new structure of the packaging substrate 1, the stacked concave conductive and heat-conducting plate 11 and the convex conductive and heat-conducting plate 12 not only supply power to the semiconductor laser chip 2, but also absorb the heat generated by the semiconductor laser chip 2 during operation, thereby improving the heat dissipation efficiency of the semiconductor laser chip 2, and thus stabilizing the output optical power of the semiconductor laser chip 2; the semiconductor laser chip 2 is surrounded on three sides by the recess 111 of the concave conductive and heat-conducting plate 11, and one side is used to output the light beam. Part of the heat generated by the semiconductor laser chip 2 is transferred outward through the recess 111 through the concave conductive and heat-conducting plate 11 itself, and the other part of the heat generated by the semiconductor laser chip 2 is transferred outward through the convex portion 121 and the convex conductive and heat-conducting plate 12 itself.

[0053] Combined with background technology Figure 1 , the bottom surface of the semiconductor laser chip 2 is in close contact with the heat-conducting substrate 21. In the present invention, Figure 3 and Figure 4 The bottom surface of the semiconductor laser chip 2 is not only in close contact with the convex portion 121 of the convex conductive and heat-conducting plate 12, but also surrounded on three sides by the concave conductive and heat-conducting plate 11. The heat generated by the semiconductor laser chip 2 is transferred outward through the convex conductive and heat-conducting plate 12 and the concave conductive and heat-conducting plate 11, thereby improving the heat dissipation effect of the semiconductor laser chip 2.

[0054] Furthermore, it also includes: a circuit board 3;

[0055] The front side of the circuit board 3 is provided with a soldering pad 31, the back side of the circuit board 3 is provided with a conductive block 32, and the circuit board 3 also has a resistor 33. The soldering pad 31 is connected to one end of the resistor 33 via a first trace, and the other end of the resistor 33 is connected to the conductive block 32 via a second trace.

[0056] The convex conductive and heat conductive plate 12 is attached to the back surface of the circuit board 3 and is in contact with the conductive block 32 .

[0057] The beneficial effects of this technical solution are as follows: the resistor 33 of the circuit board 3 prevents excessive current, which helps to protect the semiconductor laser chip 2; the soldering pad 31 of the circuit board 3 is convenient for connection with the power lead, and the power lead can be easily removed from the soldering pad 31 during later maintenance.

[0058] Furthermore, it also includes: a tube body 4;

[0059] One end of the tube body 4 is provided with a positioning hole 41, and the other end of the tube body 4 is a light outlet;

[0060] The package substrate 1 and the circuit board 3 are both inserted into the positioning hole 41 , the semiconductor laser chip 2 is located inside the tube body 4 , and the solder pad 31 is outside the tube body 4 .

[0061] This technical solution has the following beneficial effects: the tube body 4 not only houses the circuit board 3, package substrate 1, and semiconductor laser chip 2, but also prevents the circuit board 3 and package substrate 1 from loosening in the positioning hole 41, stabilizing the position of the semiconductor laser chip. This helps the light beam emitted by the semiconductor laser accurately pass through the focusing lens, making it easier to move the semiconductor laser chip 2 by holding the tube body 4. The tube body 4 also helps absorb and dissipate heat from the package substrate 1. The tube body 4 is made of aluminum.

[0062] The tube body 4 has two positioning holes 41, into which the package substrate 1 and the circuit board 3 are respectively secured. The semiconductor laser chip 2 is positioned in the center of the tube body 4, thereby improving the positional stability of the package substrate 1 within the tube body 4. In this embodiment, the elasticity of the tube body 4 material secures the package substrate 1 and the circuit board 3, eliminating the need for screws used in conventional art to secure the thermally conductive substrate.

[0063] Furthermore, it further comprises: a focusing mirror 42, wherein the focusing mirror 42 is fixedly arranged at the light outlet.

[0064] The beneficial effect of this technical solution is that the light beam generated by the semiconductor laser chip 2 passes through the focusing mirror 41 to form a focusing effect.

[0065] Furthermore, it also includes: a housing 5;

[0066] The housing 5 is provided with a channel 51 , the tube 4 is inserted into the channel 51 , and the positioning hole 41 is located inside the channel 51 and is covered by the housing 5 .

[0067] The beneficial effects of this technical solution are as follows: the housing 5 plays an insulating and protective role, effectively preventing foreign objects from touching the package substrate 1 and the circuit board 3 in the positioning hole 41 , and preventing poor contact between the concave conductive and heat conductive plate 11 and the tube body 4 .

[0068] Furthermore, the tube body 4 is a metal tube body, and in the positioning hole 41 , the concave conductive and heat-conducting plate 11 contacts the tube body 4 , and the insulating area of ​​the circuit board 3 isolates the convex conductive and heat-conducting plate 12 from the tube body 4 .

[0069] The beneficial effect of this technical solution is to prevent the current of the power supply from flowing directly from the tube body 4 to the convex conductive and heat-conducting plate 12 and then to the soldering pad 31 of the circuit board 3 to cause a short circuit.

[0070] Furthermore, it also includes: a positive power line 6 and a negative power line 7;

[0071] The positive power line 6 is connected to the tube body 4 , and the negative power line 7 is connected to the welding pad 31 .

[0072] The beneficial effects of this technical solution are as follows: since the semiconductor laser chip 2 is too small, it is difficult to directly connect the positive power line 6 and the negative power line 7 to the corresponding leads of the semiconductor laser chip 2. In this embodiment, the tube body 4 is larger in size and the pad 31 of the circuit board 3 is larger. The positive power line 6 is connected to the tube body 4 by soldering, and the negative power line 7 is connected to the pad 31 by soldering, which is convenient to operate.

[0073] Furthermore, the concave conductive and heat-conducting plate 11 is made of copper, and the convex conductive and heat-conducting plate 12 is made of brass.

[0074] The beneficial effects of this technical solution are: both copper and brass have good electrical and thermal conductivity; the colors of copper and brass are different, which is easy to identify and helps to accurately connect the conductive block 32 of the circuit board 3 with the convex conductive and thermally conductive plate 12.

[0075] Furthermore, the insulating isolation plate 13 does not extend beyond the overlapping area between the concave conductive and heat conductive plate 11 and the convex conductive and heat conductive plate 12 .

[0076] The beneficial effects of this technical solution are as follows: the insulating isolation plate 13 serves to isolate the concave conductive and heat-conducting plate 11 and the convex conductive and heat-conducting plate 12, thereby preventing current from flowing directly from the concave conductive and heat-conducting plate 11 to the convex conductive and heat-conducting plate 12 and causing a short circuit, but the insulating isolation plate 13 does not affect the installation of the semiconductor laser chip 2.

[0077] The semiconductor laser of the present invention has good heat dissipation effect and stabilizes the output optical power of the semiconductor laser chip 2. Preferably, the semiconductor laser chip 2 emits a green light beam, has good performance, and is easy to assemble.

[0078] Although the specific embodiments of the present invention are described above, those skilled in the art should understand that the specific embodiments described are merely illustrative and are not intended to limit the scope of the present invention. Equivalent modifications and changes made by those skilled in the art in accordance with the spirit of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A semiconductor laser with high heat dissipation efficiency, characterized in that: include: Packaging substrate and semiconductor laser chip; The packaging substrate comprises a concave conductive and heat-conducting plate, a convex conductive and heat-conducting plate and an insulating isolation plate, wherein the insulating isolation plate is fixedly arranged between the concave conductive and heat-conducting plate and the convex conductive and heat-conducting plate; The semiconductor laser chip is fixedly arranged on the convex portion of the convex conductive and heat-conducting plate, and the semiconductor laser chip is located in the concave conductive and heat-conducting plate. One lead of the semiconductor laser chip is connected to the convex conductive and heat-conducting plate, and the other lead of the semiconductor laser chip is connected to the concave conductive and heat-conducting plate.

2. The semiconductor laser with high heat dissipation efficiency according to claim 1, characterized in that: Also includes: circuit boards; The front side of the circuit board is provided with a soldering pad, the back side of the circuit board is provided with a conductive block, the circuit board further comprises a resistor, the soldering pad is connected to one end of the resistor via a first trace, and the other end of the resistor is connected to the conductive block via a second trace; The convex conductive and heat-conducting plate is attached to the back side of the circuit board and is in contact with the conductive block.

3. The semiconductor laser with high heat dissipation efficiency according to claim 2, characterized in that: Also includes: tube body; One end of the tube body is provided with a positioning hole, and the other end of the tube body is a light outlet; The packaging substrate and the circuit board are both inserted into the positioning hole, the semiconductor laser chip is located inside the tube body, and the solder pad is outside the tube body.

4. The semiconductor laser with high heat dissipation efficiency according to claim 3, characterized in that: Also includes: A focusing mirror is fixedly arranged at the light outlet.

5. The semiconductor laser with high heat dissipation efficiency according to claim 3, characterized in that: Also includes: shell; The shell is provided with a channel, the tube body is inserted into the channel, the positioning hole is located in the channel and is covered by the shell.

6. The semiconductor laser with high heat dissipation efficiency according to claim 3, characterized in that: The tube body is a metal tube body. In the positioning hole, the concave conductive and heat-conducting plate contacts the tube body, and the insulating area of ​​the circuit board isolates the convex conductive and heat-conducting plate from the tube body.

7. The semiconductor laser with high heat dissipation efficiency according to claim 6, characterized in that: Also includes: Positive power line and negative power line; The positive power line is connected to the tube body, and the negative power line is connected to the welding pad.

8. The semiconductor laser with high heat dissipation efficiency according to claim 1, characterized in that: The concave conductive and heat-conducting plate is made of copper material, and the convex conductive and heat-conducting plate is made of brass material.

9. The semiconductor laser with high heat dissipation efficiency according to claim 1, characterized in that: The insulating isolation plate does not extend beyond the overlapping area of ​​the concave conductive and heat-conducting plate and the convex conductive and heat-conducting plate.

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