LED heat dissipation ceramic packaging piece

Abstract

The invention relates to the technical field of LED packaging, in particular to an LED heat dissipation ceramic packaging piece which comprises a ceramic substrate, a plurality of sets of LED chips arranged on one side of the ceramic substrate and distributed in an array mode, a circuit board and a heat dissipation ceramic plate, the circuit board and the heat dissipation ceramic plate are sequentially arranged on the back face of the ceramic substrate, and the LED chips penetrate through the ceramic substrate through pins and are connected with the circuit board. A channel is formed in the heat dissipation ceramic plate in the arrangement direction of the LED chips, one end of the channel is communicated with the outside, and a capillary structure is arranged in the channel. Through cooperation of the channels, the first arc-shaped heat-conducting plate, the second arc-shaped heat-conducting plate and the capillary structure, heat can be rapidly conducted, efficient heat dissipation is carried out through liquid vaporization and heat dissipation fin condensation circulation, the light-emitting efficiency is stabilized, light attenuation is reduced, and the service life of a chip and a packaging piece is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of LED packaging, and in particular to an LED heat dissipation ceramic package. Background Art

[0002] Currently, among common LED packaging structures, ceramic packaging is often implemented by splicing a substrate and a circuit board. This splicing method uses the ceramic substrate as the basic carrier for the LED chip, and then connects the circuit board and the ceramic substrate through welding, bonding and other processes to build a complete electrical connection and heat dissipation path.

[0003] However, this splicing and stacking packaging method has many shortcomings. Since the thermal expansion coefficients of the substrate and the circuit board materials are often different, during the operation of the LED, the splicing is prone to cracks and delamination under the repeated action of thermal stress caused by heat, which hinders heat conduction, causing the LED chip temperature to rise, the luminous efficiency to decrease, and the lifespan to shorten. Therefore, an LED heat dissipation ceramic package is proposed to avoid the LED chip temperature increase, luminous efficiency decrease, and lifespan shortened due to thermal problems, maintain the stable luminous performance of the LED device, and extend its service life. Summary of the Invention

[0004] In response to the problems in the prior art, the present invention provides an LED heat dissipation ceramic package to avoid the situations such as the increase in LED chip temperature, the decrease in luminous efficiency, and the shortening of life caused by thermal problems.

[0005] The technical solution adopted by the present invention to solve its technical problem is an LED heat dissipation ceramic package, which includes a ceramic substrate, and several groups of LED chips distributed in an array arranged on one side of the ceramic substrate, and a circuit board and a heat dissipation ceramic plate arranged in sequence on the back side of the ceramic substrate. The LED chip passes through the ceramic substrate through pins and is connected to the circuit board. A groove is opened in the heat dissipation ceramic plate along the direction in which the LED chip is set. One end of the groove is connected to the outside and a capillary structure is set in the groove.

[0006] Specifically, the heat dissipation ceramic plate includes a first heat-conducting ceramic plate connected to the circuit board, and a second heat-conducting ceramic plate connected to the first heat-conducting ceramic plate. The groove is formed by splicing a first arc-shaped groove arranged on the upper surface of the first heat-conducting ceramic plate and a second arc-shaped groove arranged on the lower surface of the second heat-conducting ceramic plate.

[0007] Specifically, a first arc-shaped heat conducting plate with an arc surface facing upward is arranged in the first arc-shaped groove, and a second arc-shaped heat conducting plate with an arc surface facing downward and corresponding to the first arc-shaped heat conducting plate is arranged in the second arc-shaped groove. The inner walls of the first arc-shaped heat conducting plate and the second arc-shaped heat conducting plate are both provided with capillary structures, and arc-shaped flanges are both provided on the outer sides of the first arc-shaped heat conducting plate and the second arc-shaped heat conducting plate, and the two groups of arc-shaped flanges are assembled into an annular flange.

[0008] Specifically, the inner walls of the first arc-shaped groove and the second arc-shaped groove are each provided with a plurality of positioning grooves, and the sides of the first arc-shaped heat conducting plate and the second arc-shaped heat conducting plate away from each other are each provided with positioning blocks corresponding to the positioning grooves.

[0009] Specifically, a mounting seat is provided on at least one side of the heat dissipation ceramic plate, a slot is provided on one side of the mounting seat to be clamped on the annular flange, and a plurality of groups of vertically arranged heat dissipation fins are provided on a side of the mounting seat away from the slot.

[0010] Specifically, the first and second heat-conducting ceramic plates are provided with threaded assembly grooves on one side close to the mounting seat, the mounting seat is provided with several groups of mounting holes corresponding to the threaded assembly grooves, and one side of the mounting holes is provided with assembly bolts.

[0011] Specifically, thermal expansion strips are provided between adjacent heat dissipation fins, and the first arc-shaped heat conducting plate and the second arc-shaped heat conducting plate are both made of copper.

[0012] Specifically, the heat dissipation fins are made of aluminum alloy, with a thickness of 0.1-0.5 mm and a fin spacing of 1.5-3 mm.

[0013] Specifically, a flexible buffer layer is provided between the ceramic substrate and the circuit board, and the flexible buffer layer is made of silicone rubber material.

[0014] Beneficial effects of the present invention:

[0015] (1) The LED heat dissipation ceramic package described in the present invention can quickly conduct heat through the combination of the groove, the first curved heat conduction plate, the second curved heat conduction plate and the capillary structure, and efficiently dissipate heat by utilizing liquid vaporization and the condensation cycle of the heat dissipation fins, thereby stabilizing the luminous efficiency, reducing light decay, and extending the life of the chip and the package.

[0016] (2) In the LED heat dissipation ceramic package described in the present invention, when the heat generated by the LED chip is too high, the thermal expansion strip expands, pushing the adjacent heat dissipation fins to expand outward, increasing the spacing between the heat dissipation fins, thereby increasing the contact area between the heat dissipation fins and the air, improving the efficiency of heat transfer from the heat dissipation fins to the air, and effectively reducing the temperature of the LED chip.

[0017] (3) The LED heat dissipation ceramic package described in the present invention has a very flexible groove design that can adapt to various shapes. For circular LED chips, the groove can be designed into a surrounding arc to allow heat to be evenly conducted and give full play to the heat dissipation effect of the capillary structure; for special-shaped LED chips, the groove can accurately match the installation position of the LED chip to ensure that each heating area can closely match the groove to achieve efficient heat dissipation without being restricted by the shape of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below with reference to the accompanying drawings and examples.

[0019] Figure 1 An exploded view of the present invention;

[0020] Figure 2 This is an exploded view from another perspective of the present invention;

[0021] Figure 3 Schematic diagram of the structure of the first heat-conducting ceramic plate and the second heat-conducting ceramic plate of the present invention;

[0022] Figure 4 Schematic diagram of the structures of the first curved heat conducting plate and the second curved heat conducting plate of the present invention;

[0023] Figure 5 for Figure 4 A magnified view of area A;

[0024] Figure 6 This is a schematic diagram of the mounting base structure of the present invention;

[0025] Figure 7 This is a schematic diagram of the card slot structure of the present invention;

[0026] Figure 8 for Figure 7 A magnified view of area B;

[0027] In the figure: 1. Ceramic substrate; 2. LED chip; 3. Circuit board; 4. Pin; 5. First thermally conductive ceramic plate; 6. Second thermally conductive ceramic plate; 7. First arc-shaped groove; 8. Second arc-shaped groove; 9. First arc-shaped thermally conductive plate; 10. Second arc-shaped thermally conductive plate; 11. Capillary structure; 12. Arc-shaped flange; 13. Positioning groove; 14. Positioning block; 15. Mounting seat; 16. Card slot; 17. Heat sink fin; 18. Threaded assembly groove; 19. Mounting hole; 20. Assembly bolt; 21. Thermal expansion strip. DETAILED DESCRIPTION

[0028] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0029] In order to avoid the situation that the temperature of the LED chip increases, the luminous efficiency decreases, the life is shortened, etc. caused by heat problems, as an embodiment of the present invention, Figure 1 、 Figure 2As shown, the LED heat dissipation ceramic package described in the present invention includes a ceramic substrate 1, and several groups of LED chips 2 arranged in an array on one side of the ceramic substrate 1, and a circuit board 3 and a heat dissipation ceramic plate arranged in sequence on the back of the ceramic substrate 1. The LED chip 2 passes through the ceramic substrate 1 through the pin 4 and is connected to the circuit board 3. A groove is opened in the heat dissipation ceramic plate along the setting direction of the LED chip 2, one end of the groove is connected to the outside and a capillary structure 11 is set in the groove.

[0030] When in use, the pins 4 of the LED chip 2 pass through the ceramic substrate 1 and connect to the circuit board 3 provided on the back of the ceramic substrate 1, thereby achieving electrical connectivity between the LED chip 2 and the circuit board 3, allowing current to flow smoothly through the LED chip 2 and allow it to emit light normally;

[0031] The heat dissipation ceramic plate is installed behind the circuit board 3. The groove opened in the heat dissipation ceramic plate along the setting direction of the LED chip 2 is connected to the outside at one end. At this time, the groove and the capillary structure 11 begin to work. When the LED chip 2 generates heat during operation, the heat will be transferred to the heat dissipation ceramic plate through the ceramic substrate 1 and the circuit board 3. Since the capillary structure 11 is set in the groove, when the heat is transmitted to the capillary structure 11 at one end of the groove, the liquid in the capillary structure 11 is heated and vaporized and enters the middle part of the groove, while the capillary structure 11 at the other end of the groove dissipates heat, causing the vaporized liquid to condense back into liquid and enter the capillary structure 11, thereby driving the liquid to circulate in the groove, thereby efficiently transferring the heat generated by the LED chip 2, significantly reducing the operating temperature of the LED chip 2, thereby stabilizing the chip's luminous efficiency, reducing light decay, extending the service life of the chip and package, and ensuring the long-term stable operation of the LED heat dissipation ceramic package.

[0032] In order to ensure the heat dissipation efficiency of the LED chip 2, for example, Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 As shown, the present invention also includes that the heat dissipation ceramic plate includes a first heat-conducting ceramic plate 5 connected to the circuit board 3, and a second heat-conducting ceramic plate 6 connected to the first heat-conducting ceramic plate 5, and the groove is formed by splicing a first arc-shaped groove 7 provided on the upper surface of the first heat-conducting ceramic plate 5 and a second arc-shaped groove 8 provided on the lower surface of the second heat-conducting ceramic plate 6.

[0033] During use, the first heat-conducting ceramic plate 5 and the second heat-conducting ceramic plate 6 are spliced ​​together so that the first arc-shaped groove 7 and the second arc-shaped groove 8 are precisely aligned and spliced ​​together to form a complete groove. The heat-dissipating ceramic plate with the assembled groove is installed as a whole on the circuit board 3 so that the first heat-conducting ceramic plate 5 and the circuit board 3 are tightly fitted to ensure the heat conduction efficiency and quickly conduct the heat on the circuit board 3 to the groove area. Relying on the capillary structure 11 in the groove, the overall heat dissipation efficiency can be effectively improved.

[0034] The first heat-conducting ceramic plate 5 and the second heat-conducting ceramic plate 6 are connected to each other to form an integral heat-dissipating ceramic plate structure, which enhances the structural strength and stability of the heat-dissipating ceramic plate. When subjected to external vibration, impact or thermal stress changes, it can reduce the problem of heat dissipation performance degradation caused by structural deformation, thereby ensuring long-term stable heat dissipation effect.

[0035] The groove is spliced ​​by the first thermally conductive ceramic plate 5 and the second thermally conductive ceramic plate 6, which can facilitate the processing of the first arc groove 7 and the second arc groove 8, thereby improving the flexibility of processing the first arc groove 7 and the second arc groove 8, thereby meeting the processing requirements of specific shapes, adapting to the setting direction of the LED chip 2, and ensuring the heat dissipation efficiency of the LED chip 2.

[0036] In order to further ensure the heat dissipation efficiency of the LED chip 2, for example, Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 As shown, the present invention also includes a first arc-shaped heat conducting plate 9 with an arc surface facing upwards arranged in the first arc-shaped groove 7, a second arc-shaped heat conducting plate 10 with an arc surface facing downwards and corresponding to the first arc-shaped heat conducting plate 9 is arranged in the second arc-shaped groove 8, a capillary structure 11 is arranged on the inner walls of the first arc-shaped heat conducting plate 9 and the second arc-shaped heat conducting plate 10, and an arc-shaped flange 12 is arranged on the outer sides of the first arc-shaped heat conducting plate 9 and the second arc-shaped heat conducting plate 10, and the two groups of arc-shaped flanges 12 are assembled into an annular flange.

[0037] During use, the first curved heat conducting plate 9 is installed in the first curved groove 7, and the second curved heat conducting plate 10 is installed in the second curved groove 8. After the first curved heat conducting plate 9 and the second curved heat conducting plate 10 are respectively installed in place, the first heat conducting ceramic plate 5 and the second heat conducting ceramic plate 6 are spliced ​​together so that the arc flanges 12 on the outer sides of the first curved heat conducting plate 9 and the second curved heat conducting plate 10 are butted against each other to form an annular flange. At this time, the capillary structures 11 on the inner walls of the first curved heat conducting plate 9 and the second curved heat conducting plate 10 jointly construct a complete heat dissipation channel, preparing for subsequent heat dissipation work;

[0038] When the LED chip 2 generates heat during operation, the heat is transferred along the ceramic substrate 1 and the circuit board 3 to the heat dissipation ceramic plate. When the heat generated by the LED chip 2 is transferred to the heat dissipation ceramic plate, the heat is transferred to the first curved heat conducting plate 9 and the second curved heat conducting plate 10. At this time, after the liquid in the capillary structure 11 absorbs the heat transferred by the first curved heat conducting plate 9 and the second curved heat conducting plate 10, the liquid is rapidly vaporized into steam, and the steam moves to an area with a relatively low temperature. After the steam is cooled and condensed, it is liquefied into liquid again. Under the action of gravity and the capillary force of the capillary structure 11 itself, the liquefied liquid flows back to its initial position along the capillary structure 11, circulated, and the heat generated by the LED chip 2 is taken away from the heat source, achieving the effect of efficient heat dissipation, ensuring that the LED chip 2 is always in a suitable operating temperature environment, stabilizing the luminous performance and extending the service life.

[0039] It should be noted that after the first arc-shaped heat conducting plate 9 and the second arc-shaped heat conducting plate 10 are assembled, liquid is injected into the internal space formed by the assembly of the two to ensure that heat is subsequently dissipated by means of vaporization and condensation cycles of the liquid.

[0040] In order to ensure the reliability of the entire heat dissipation structure, for example, Figure 3 、 Figure 4 、 Figure 5 The present invention also includes that the inner walls of the first arc groove 7 and the second arc groove 8 are both provided with a plurality of positioning grooves 13, and the first arc heat conducting plate 9 and the second arc heat conducting plate 10 are both provided with positioning blocks 14 corresponding to the positioning grooves 13 on the side away from each other.

[0041] When in use, when installing the first curved heat conducting plate 9 into the first curved groove 7, align the positioning block 14 on the first curved heat conducting plate 9 with the positioning groove 13 on the inner wall of the first curved groove 7, so that the positioning block 14 is accurately engaged with the positioning groove 13; similarly, when installing the second curved heat conducting plate 10 into the second curved groove 8, align the positioning block 14 on the second curved heat conducting plate 10 with the positioning groove 13 on the inner wall of the second curved groove 8 to complete the installation;

[0042] The cooperation between the positioning groove 13 and the positioning block 14 enables the first arc-shaped heat conducting plate 9 and the second arc-shaped heat conducting plate 10 to fit tightly into the first arc-shaped groove 7 and the second arc-shaped groove 8, ensuring a good heat conduction effect. At the same time, the clamping structure of the positioning groove 13 and the positioning block 14 can effectively prevent the first arc-shaped heat conducting plate 9 and the second arc-shaped heat conducting plate 10 from being displaced or shaken in the first arc-shaped groove 7 and the second arc-shaped groove 8, thereby ensuring the reliability of the entire heat dissipation structure.

[0043] In order to achieve efficient heat dissipation of the LED chip 2 and ensure its stable operation, for example, Figure 6 、 Figure 7 、 Figure 8As shown, the present invention also includes a mounting base 15 provided on at least one side of the heat dissipation ceramic plate, a slot 16 which is clamped on the annular flange is provided on one side of the mounting base 15, and a plurality of groups of vertically arranged heat dissipation fins 17 are provided on the side of the mounting base 15 away from the slot 16.

[0044] When in use, the mounting base 15 is clamped on the annular flange through the clamping groove 16. When the LED heat dissipation ceramic package is subjected to external forces, the mounting base 15 can effectively disperse and withstand these external forces, reducing the possibility of displacement and deformation of the heat dissipation ceramic plate due to external forces, thereby enhancing the stability of the entire package structure.

[0045] The heat generated by the operation of the LED chip 2 is conducted to the first curved heat conducting plate 9 and the second curved heat conducting plate 10 in turn through the ceramic substrate 1 and the circuit board 3. The liquid in the capillary structure 11 begins to vaporize after absorbing the heat, and turns into steam and moves to an area with relatively low temperature. Since the mounting seat 15 is provided with a heat dissipation fin 17 on one side, the air temperature around the heat dissipation fin 17 is relatively low, and the steam will move toward the mounting seat 15; relying on the heat dissipation fin 17 on one side of the mounting seat 15, the heat of the steam is quickly dissipated. During the heat dissipation process, the steam is cooled and reliquefied into liquid. Under the combined action of gravity and capillary force, the liquid flows back to the initial positions of the first curved heat conducting plate 9 and the second curved heat conducting plate 10. This cycle is repeated, and the heat generated by the LED chip 2 is continuously taken away through the process of vaporization, heat dissipation, and cooling reflux, thereby achieving efficient heat dissipation of the LED chip 2 and ensuring its stable operation.

[0046] In order to ensure the stability between the heat dissipation ceramic plates of the mounting base 15, for example, Figure 6 、 Figure 7 、 Figure 8 As shown, the present invention also includes that the first thermally conductive ceramic plate 5 and the second thermally conductive ceramic plate 6 are both provided with a threaded assembly groove 18 on one side close to the mounting seat 15, and the mounting seat 15 is provided with a plurality of groups of mounting holes 19 corresponding to the threaded assembly grooves 18, and a mounting bolt 20 is provided on one side of the mounting hole 19.

[0047] When in use, align the mounting hole 19 of the mounting base 15 with the threaded assembly groove 18 of the first heat-conducting ceramic plate 5 and the second heat-conducting ceramic plate 6, pass the mounting hole 19 and screw the assembly bolt 20 into the threaded assembly groove 18, and tighten it with a tool to ensure the stability between the mounting base 15 and the heat-dissipating ceramic plates.

[0048] In order to further effectively reduce the temperature of the LED chip 2, for example, Figure 7 、 Figure 8 As shown, the present invention also includes that a thermal expansion strip 21 is provided between adjacent heat dissipation fins 17 , and the first arc-shaped heat conducting plate 9 and the second arc-shaped heat conducting plate 10 are both made of copper.

[0049] When in use, the first curved heat conducting plate 9 and the second curved heat conducting plate 10 are made of copper, which can quickly transfer the heat generated by the LED chip 2 from the ceramic substrate 1 and the circuit board 3 to the groove of the heat dissipation ceramic plate, thereby ensuring the heat transfer efficiency of the subsequent heat dissipation process;

[0050] When the LED chip 2 generates too much heat, the thermal expansion strips 21 will expand due to the heat. The expanded thermal expansion strips 21 will apply pressure to both sides, pushing the adjacent heat dissipation fins 17 to expand outward, thereby increasing the spacing between the heat dissipation fins 17. The increased spacing increases the contact area between the heat dissipation fins 17 and the air, allowing each heat dissipation fin 17 to more fully exchange heat with the air. The efficiency of heat transfer from the heat dissipation fins 17 to the air is improved, thereby compensating for the insufficient heat dissipation capacity of the heat dissipation fins 17 at high temperatures and effectively reducing the temperature of the LED chip 2.

[0051] It should also be pointed out that when the heat generation of the LED chip 2 is low, the gap between the heat dissipation fins 17 is small. At this time, it is not easy for dust, impurities, etc. to enter the heat dissipation structure and adhere to the surface of the heat dissipation fins 17, effectively reducing the formation of an insulation layer by dust and impurities, hindering the transfer of heat from the heat dissipation fins 17 to the air, and reducing the heat dissipation performance.

[0052] Exemplarily, the present invention also includes that the heat dissipation fins 17 are made of aluminum alloy, have a thickness of 0.1-0.5 mm, and a fin spacing of 1.5-3 mm.

[0053] During use, the heat dissipation fins 17 made of aluminum alloy have a certain elasticity. When the thermal expansion strips 21 expand and squeeze, the heat dissipation fins 17 undergo elastic deformation and store elastic potential energy. When the thermal expansion strips 21 cool and shrink, the squeezing force disappears, and the heat dissipation fins 17 will return to their original state under the action of their own elastic stress, thereby reducing the distance between adjacent heat dissipation fins 17.

[0054] Exemplarily, the present invention further includes providing a flexible buffer layer between the ceramic substrate 1 and the circuit board 3 , wherein the flexible buffer layer is made of silicone rubber material.

[0055] During use, due to the difference in thermal expansion coefficients between the ceramic substrate 1 and the circuit board 3, when the LED generates heat during operation, the two expand to different degrees, which easily generates thermal stress. The silicone rubber flexible buffer layer has good flexibility and elasticity and can effectively buffer.

[0056] When using the present invention, the pins 4 of the LED chip 2 are passed through the ceramic substrate 1, ensuring that the pins are accurately aligned with the corresponding holes on the ceramic substrate, and then connected to the circuit board 3 arranged on the back of the ceramic substrate 1. The connection process can be carried out by welding or other suitable electrical connection processes to ensure the stability and conductivity of the connection, so that the current can smoothly pass through the LED chip 2 and achieve normal light emission;

[0057] 8 , and the second arc-shaped heat conducting plate 5 is connected with the heat conducting plate 6 by the heat dissipation device 11. The heat conducting plate 6 has the advantages of small size and good heat dissipation, and the heat dissipation performance is good.

[0058] The mounting base 15 is clamped onto the annular flange through the clamping groove 16 to preliminarily fix the mounting base 15 on the heat dissipation ceramic plate. Then, the assembly bolt 20 is screwed into the threaded assembly groove 18 through the mounting hole 19 to further ensure the stability between the mounting base 15 and the heat dissipation ceramic plate.

[0059] Install the heat dissipation ceramic plate with assembled grooves onto the circuit board 3, ensuring that the first heat-conducting ceramic plate 5 is tightly fitted to the circuit board 3;

[0060] The heat generated by the operation of the LED chip 2 is conducted to the first curved heat conducting plate 9 and the second curved heat conducting plate 10 in sequence through the ceramic substrate 1 and the circuit board 3. The liquid in the capillary structure 11 begins to vaporize after absorbing the heat, and turns into steam and moves to an area with a relatively low temperature. Since the heat dissipation fins 17 are provided on one side of the mounting seat 15, the air temperature around the heat dissipation fins 17 is relatively low, and the steam will move toward the mounting seat 15; the heat of the steam is quickly dissipated by the heat dissipation fins 17 on one side of the mounting seat 15. The steam is cooled during the heat dissipation process and reliquefied into liquid. Under the combined action of gravity and capillary force, the liquid flows back to the initial positions of the first curved heat conducting plate 9 and the second curved heat conducting plate 10. This cycle is repeated, and the heat generated by the LED chip 2 is continuously taken away through the process of vaporization, heat dissipation, and cooling and reflux, thereby achieving efficient heat dissipation of the LED chip 2 and ensuring its stable operation.

[0061] When the LED chip 2 generates too much heat, the thermal expansion strips 21 will expand due to the heat. The expanded thermal expansion strips 21 will apply pressure to both sides, pushing the adjacent heat dissipation fins 17 to expand outward, thereby increasing the spacing between the heat dissipation fins 17. The increased spacing increases the contact area between the heat dissipation fins 17 and the air, allowing each heat dissipation fin 17 to more fully exchange heat with the air. The efficiency of heat transfer from the heat dissipation fins 17 to the air is improved, thereby compensating for the insufficient heat dissipation capacity of the heat dissipation fins 17 at high temperatures and effectively reducing the temperature of the LED chip 2.

[0062] The heat dissipation fins 17 made of aluminum alloy have a certain degree of elasticity. When the thermal expansion strips 21 expand and squeeze, the heat dissipation fins 17 undergo elastic deformation and store elastic potential energy. When the thermal expansion strips 21 cool and shrink, the squeezing force disappears, and the heat dissipation fins 17 will return to their original state under the action of their own elastic stress, reducing the distance between adjacent heat dissipation fins 17, effectively reducing the formation of an insulation layer by dust and impurities, hindering the transfer of heat from the heat dissipation fins 17 to the air, and reducing the heat dissipation performance.

[0063] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above-described embodiments. The above-described embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An LED heat dissipation ceramic package, characterized in that: The invention comprises a ceramic substrate (1), a plurality of array-distributed LED chips (2) arranged on one side of the ceramic substrate (1), and a circuit board (3) and a heat dissipation ceramic plate arranged in sequence on the back side of the ceramic substrate (1); the LED chip passes through the ceramic substrate (1) via a pin (4) and is connected to the circuit board (3); a groove is provided in the heat dissipation ceramic plate along the direction in which the LED chip is arranged, one end of the groove is connected to the outside, and a capillary structure (11) is provided in the groove.

2. The LED heat dissipation ceramic package according to claim 1, characterized in that: The heat dissipation ceramic plate comprises a first heat-conducting ceramic plate (5) connected to the circuit board (3), and a second heat-conducting ceramic plate (6) connected to the first heat-conducting ceramic plate (5), wherein the groove is formed by splicing a first arc-shaped groove (7) provided on the upper surface of the first heat-conducting ceramic plate (5) and a second arc-shaped groove (8) provided on the lower surface of the second heat-conducting ceramic plate (6).

3. The LED heat dissipation ceramic package according to claim 2, characterized in that: A first arc-shaped heat conducting plate (9) with an upward arc surface is provided in the first arc-shaped groove (7), and a second arc-shaped heat conducting plate (10) with a downward arc surface corresponding to the first arc-shaped heat conducting plate (9) is provided in the second arc-shaped groove (8). Capillary structures (11) are provided on the inner walls of the first arc-shaped heat conducting plate (9) and the second arc-shaped heat conducting plate (10). Arc-shaped flanges (12) are provided on the outer sides of the first arc-shaped heat conducting plate (9) and the second arc-shaped heat conducting plate (10), and the two groups of arc-shaped flanges (12) are assembled into an annular flange.

4. The LED heat dissipation ceramic package according to claim 3, characterized in that: The inner walls of the first arc-shaped groove (7) and the second arc-shaped groove (8) are both provided with a plurality of groups of positioning grooves (13), and the sides of the first arc-shaped heat conducting plate (9) and the second arc-shaped heat conducting plate (10) away from each other are both provided with positioning blocks (14) corresponding to the positioning grooves (13).

5. The LED heat dissipation ceramic package according to claim 4, characterized in that: A mounting seat (15) is provided on at least one side of the heat dissipation ceramic plate, a clamping groove (16) clamped on the annular flange is provided on one side of the mounting seat (15), and a plurality of groups of vertically arranged heat dissipation fins (17) are provided on a side of the mounting seat (15) away from the clamping groove (16).

6. The LED heat dissipation ceramic package according to claim 5, characterized in that: The first heat-conducting ceramic plate (5) and the second heat-conducting ceramic plate (6) are both provided with a threaded assembly groove (18) on one side close to the mounting seat (15); the mounting seat (15) is provided with a plurality of mounting holes (19) corresponding to the threaded assembly grooves (18); and one side of the mounting hole (19) is provided with an assembly bolt (20).

7. The LED heat dissipation ceramic package according to claim 6, characterized in that: A thermal expansion strip (21) is provided between adjacent heat dissipation fins (17), and the first arc-shaped heat conducting plate (9) and the second arc-shaped heat conducting plate (10) are both made of copper.

8. The LED heat dissipation ceramic package according to claim 7, characterized in that: The heat dissipation fins (17) are made of aluminum alloy, have a thickness of 0.1-0.5 mm, and a fin spacing of 1.5-3 mm.

9. The LED heat dissipation ceramic package according to claim 8, characterized in that: A flexible buffer layer is provided between the ceramic substrate (1) and the circuit board (3), and the flexible buffer layer is made of silicone rubber material.

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