Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel and a preparation method thereof and a display device, and relates to the technical field of display, the display panel comprises a substrate, an isolation structure, a plurality of light-emitting units and a first packaging layer, the isolation structure is located on one side of the substrate, and the isolation structure defines a plurality of isolation openings, at least part of the orthographic projection of the light-emitting unit on the substrate is located in the orthographic projection of the corresponding isolation opening on the substrate, the first packaging layer is located on the side, away from the substrate, of the light-emitting unit, a closed cavity is formed in the first packaging layer, the cavity is located on the side, facing the isolation opening, of the isolation structure, and the first packaging layer comprises an organic filling part; the organic filling part is located in the cavity. The display panel provided by the invention is beneficial to improving the use performance of the display device.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and more specifically, relates to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] Currently, flat panel display devices have the advantages of high image quality, power saving, small thickness and wide application range, and are widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc.

[0003] Traditional display panel manufacturing typically uses a fine metal mask (FMM) to pattern luminescent pixels. FMM technology is mature and boasts extensive mass production experience. However, it also suffers from limitations such as limited precision, high development costs, and long development cycles. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-area scalability, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe FMM-free technology for reference.

[0004] However, the performance and process performance of current display devices need to be improved. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide a display panel, a method for manufacturing the same, and a display device, so as to improve the performance of the display device.

[0006] To achieve the above objectives, the technical solution adopted in this application is: In a first aspect, a display panel is provided, comprising a substrate, an isolation structure, a plurality of light-emitting units and a first encapsulation layer, wherein the isolation structure is located on one side of the substrate, the isolation structure encloses a plurality of isolation openings, at least part of the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate, the first encapsulation layer is located on the side of the light-emitting unit facing away from the substrate, a closed cavity is provided inside the first encapsulation layer, the cavity is located on the side of the isolation structure facing the isolation opening, and the first encapsulation layer includes an organic filling portion, which is located within the cavity.

[0007] Through the above-mentioned technical solution, the display panel provided in the present application uses an organic filling part to fill the cavity enclosed by the first encapsulation layer, which can support the part of the side wall of the first encapsulation layer that is attached to the isolation structure, which is beneficial to reducing the stress of the part of the side wall of the first encapsulation layer that is attached to the isolation structure, and is beneficial to reducing the risk of partial breakage of the side wall of the first encapsulation layer that is attached to the isolation structure, thereby helping to improve the display effect.

[0008] Therefore, the display panel provided in this application is beneficial to improving the performance of the display device.

[0009] In some embodiments, the organic fill includes photoresist.

[0010] Optionally, the organic filling portion extends along a circumference of the isolation opening.

[0011] In some embodiments, the organic filling portion is annular and extends along the circumference of the isolation opening; or, there are multiple organic filling portions, which are spaced apart along the circumference of the isolation opening.

[0012] In some embodiments, the first encapsulation layer includes a first encapsulation sublayer and a second encapsulation sublayer sequentially arranged in a direction away from the substrate, and the cavity is formed between the first encapsulation sublayer and the second encapsulation sublayer.

[0013] Optionally, the cavity is an annular cavity.

[0014] In some embodiments, the first encapsulation sub-layer and the second encapsulation sub-layer both include an inorganic material.

[0015] Optionally, the first encapsulation sublayer and the second encapsulation sublayer are made of different materials.

[0016] Optionally, the first encapsulation sublayer and the second encapsulation sublayer are made of the same material.

[0017] In some embodiments, the material of the first encapsulation sublayer and the second encapsulation sublayer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride.

[0018] In some embodiments, the first encapsulation sublayer includes a first main portion and a first extension portion, the first main portion covers at least a portion of the light-emitting unit, and the first extension portion is connected to the peripheral side of the first main portion and is connected to the side wall of the isolation junction toward the isolation opening.

[0019] Optionally, a portion of the first extension is located on a side of the isolation structure facing away from the substrate.

[0020] In some embodiments, the second encapsulation sublayer includes a second main body portion and a second extension portion, the second extension portion is connected to the peripheral side of the second main body portion, the second main body portion is located on the side of the first main body portion facing away from the substrate, and the orthographic projection of the second main body portion on the substrate is located within the orthographic projection of the first main body portion on the substrate.

[0021] In some embodiments, the first main body portion, the second main body portion, and the first extension portion enclose a cavity; And / or, the second extending portion is located on a side of the first extending portion facing away from the substrate.

[0022] In some embodiments, the isolation structure includes a support portion and an eaves portion arranged in sequence along a direction away from the substrate, the orthographic projection of the side of the support portion facing away from the substrate on the substrate is located within the orthographic projection of the side of the eave portion facing toward the substrate on the substrate, and the distance between the side wall of the support portion facing the isolation opening and the center of the isolation opening gradually increases along the direction away from the substrate.

[0023] In some embodiments, the organic filling portion is located on a side of the eave portion facing the substrate.

[0024] Optionally, the isolation structure further includes a base portion, which is located on the side of the support portion facing the substrate, and the orthographic projection of the side of the support portion facing the substrate on the substrate is located within the orthographic projection of the side of the base portion facing away from the substrate on the substrate.

[0025] In some embodiments, the display panel further includes a pixel definition layer, the pixel definition layer is located on one side of the substrate, the isolation structure is located on the side of the pixel definition layer facing away from the substrate, the pixel definition layer has a plurality of pixel openings, at least a portion of the light-emitting unit is disposed in the corresponding pixel opening, and the pixel openings are connected to the corresponding pixel openings.

[0026] In some embodiments, the display panel further includes a second encapsulation layer, where the second encapsulation layer is located on a side of the first encapsulation layer and the isolation structure facing away from the substrate.

[0027] Optionally, the material of the second encapsulation layer includes an organic material.

[0028] In some embodiments, the display panel further includes a third encapsulation layer, where the third encapsulation layer is located on a side of the second encapsulation layer facing away from the substrate.

[0029] Optionally, the material of the third encapsulation layer includes an inorganic material.

[0030] Optionally, a material of the third encapsulation layer includes at least one of silicon nitride, silicon oxide and silicon oxynitride.

[0031] In a second aspect, the present application provides a method for manufacturing a display panel, the method comprising: providing a substrate; preparing a pixel definition layer and an isolation structure on one side of the substrate; The patterned pixel definition layer and the isolation structure form a pixel opening and an isolation opening, wherein the pixel opening is in communication with the isolation opening; preparing a light-emitting unit, wherein at least a portion of the light-emitting unit is disposed within the pixel opening; Prepare a first encapsulation layer on a side of the light-emitting unit facing away from the substrate; The first encapsulation layer is located on the side of the light-emitting unit away from the substrate. A closed cavity is provided inside the first encapsulation layer. The cavity is located on the side of the isolation structure facing the isolation opening. The first encapsulation layer includes an organic filling part, which is located in the cavity.

[0032] Through the above technical solution, the preparation method provided by this application can use the organic filler to fill the cavity enclosed by the first encapsulation layer, allowing the organic filler to support the portion of the first encapsulation layer that contacts the sidewall of the isolation structure. This helps reduce stress in the portion of the first encapsulation layer that contacts the sidewall of the isolation structure, and reduces the risk of fracture in the portion of the first encapsulation layer that contacts the sidewall of the isolation structure, thereby improving the display effect.

[0033] In some embodiments, forming a first encapsulation layer on a side of the light-emitting unit facing away from the substrate includes: preparing a first encapsulation sublayer, wherein a trench having an opening is formed in the first encapsulation sublayer, and the trench is located on a side of the isolation structure facing the isolation opening; preparing an organic layer on a side of the first encapsulation sublayer facing away from the substrate; The organic layer is patterned to form an organic filling portion, wherein the organic filling portion is filled in the groove; A second encapsulation sublayer is formed on a side of the first encapsulation sublayer facing away from the substrate, wherein the second encapsulation sublayer blocks the opening of the trench to form a closed cavity in the trench; The first encapsulation sublayer and the second encapsulation sublayer are patterned to form a first encapsulation layer.

[0034] In some embodiments, patterning the organic layer to form the organic filling portion includes: The organic layer is subjected to photolithography or dry etching.

[0035] Optionally, the organic layer includes photoresist.

[0036] In some embodiments, preparing a light-emitting unit comprises: preparing a first light-emitting unit; After preparing the first light-emitting unit, preparing a first encapsulation layer on a side of the light-emitting unit facing away from the substrate includes: A first encapsulation portion is prepared on a side of the first light-emitting unit facing away from the substrate. The first encapsulation portion has a cavity and an organic filling portion located in the cavity.

[0037] Optionally, after preparing the first encapsulation portion on a side of the first light-emitting unit facing away from the substrate, preparing the light-emitting unit includes: preparing a second light-emitting unit; After preparing the second light-emitting unit, preparing a first encapsulation layer on a side of the light-emitting unit facing away from the substrate includes: A second encapsulation portion is prepared on a side of the second light-emitting unit facing away from the substrate. The second encapsulation portion has a cavity and an organic filling portion located in the cavity.

[0038] Optionally, after preparing the second encapsulation portion on a side of the second light-emitting unit facing away from the substrate, preparing the light-emitting unit includes: preparing a third light-emitting unit; After preparing the third light-emitting unit, preparing a first encapsulation layer on a side of the light-emitting unit facing away from the substrate includes: A third encapsulation portion is prepared on a side of the third light-emitting unit facing away from the substrate. The third encapsulation portion has a cavity and an organic filling portion located in the cavity.

[0039] In a third aspect, the present application provides a display device comprising a display panel according to any of the aforementioned embodiments or a display panel prepared by a method according to any of the aforementioned embodiments. The display device provided in the present application has the same or similar technical effects as the display panel according to any of the aforementioned embodiments or the method according to any of the aforementioned embodiments, and will not be further described here. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0041] Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application; Figure 2 for Figure 1 A partial enlarged view of point A in the middle; Figure 3 For the Figure 2 One of the cross-sectional structural diagrams along the CC line; Figure 4 This is one of the structural schematic diagrams of the display panel preparation process in the related art; Figure 5 This is the second structural diagram of the display panel preparation process in the related art; Figure 6 This is the third structural diagram of the display panel preparation process in the related art; Figure 7 For the Figure 2 The second cross-sectional structural diagram of the CC line; Figure 8 This is one of the structural schematic diagrams of the display panel during the manufacturing process provided by the embodiment of the present application; Figure 9 The second structural diagram of the display panel during the manufacturing process provided by the embodiment of the present application; Figure 10 The third structural diagram of the display panel during the manufacturing process provided by the embodiment of the present application; Figure 11 The fourth structural diagram of the display panel during the manufacturing process provided by the embodiment of the present application; Figure 12 The fifth structural diagram of the display panel during the manufacturing process provided by the embodiment of the present application; Figure 13 The sixth structural diagram of the display panel during the manufacturing process provided by the embodiment of the present application; Figure 14 The seventh structural diagram of the display panel during the manufacturing process provided by the embodiment of the present application; Figure 15 The eighth structural diagram of the display panel during the manufacturing process provided by the embodiment of the present application; Figure 16 For the Figure 2 The third cross-sectional structural diagram of the CC line.

[0042] Among them, the reference numerals in the figures are: 100-display panel; 10-substrate; 20-first electrode; 30-pixel definition layer; 40-isolation structure; 401-first isolation opening; 402-second isolation opening; 403-third isolation opening; 50-light-emitting layer; 51-first light-emitting layer; 52-second light-emitting layer; 53-third light-emitting layer; 60-second electrode; 70-first encapsulation layer; 7001-cavity; 7002-organic filling portion; 7003-groove; 70031-opening; 701-first encapsulation sublayer; 7011-first main body; 7012-first extension; 702-second encapsulation sublayer; 7021-second main body; 7022-second extension; 71-first encapsulation part; 711-first encapsulation sub-part; 712-second encapsulation sub-part; 72-second encapsulation part; 721-third encapsulation sub-part; 722-fourth encapsulation sub-part; 73-third encapsulation part; 731-fifth encapsulation sub-part; 732-sixth encapsulation sub-part; 80-second encapsulation layer; 90-third encapsulation layer. DETAILED DESCRIPTION

[0043] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0044] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0045] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0047] Please also refer to Figure 1 、 Figure 2 and Figure 3 An embodiment of the present application provides a display panel 100 , which may be an organic light-emitting diode (OLED) display panel 100 or a micro light-emitting diode (Micro LED / μLED) display panel 100 .

[0048] The display panel 100 includes a substrate 10 including a display area AA and a non-display area NA surrounding at least a portion of the display area AA.

[0049] Please continue reading Figure 3 The display panel 100 provided in the embodiment of the present application further includes a plurality of light-emitting units, each of which is located on one side of the substrate 10 along the thickness direction. The plurality of light-emitting units can be manufactured in batches according to the process flow. For example, the plurality of light-emitting units can include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit. The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit can emit light of different colors. For example, the first light-emitting unit can emit red light, the second light-emitting unit can emit green light, and the third light-emitting unit can emit blue light.

[0050] It is understood that the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit are sequentially evaporated and patterned. That is, when manufacturing the display panel 100 provided in the embodiment of the present application, the first light-emitting unit can be formed by evaporation and patterning first, the second light-emitting unit can be formed by evaporation and patterning second, and finally the third light-emitting unit can be formed by evaporation and patterning.

[0051] In some embodiments, the display panel 100 further includes a pixel definition layer 30 (Pixel Defined Layer, PDL) and an isolation structure 40, wherein the isolation structure 40 and the pixel definition layer 30 are arranged on the same side of the substrate 10 in the thickness direction, and the isolation structure 40 is arranged on the side of the pixel definition layer 30 away from the substrate 10, and the isolation structure 40 encloses a plurality of isolation openings. The orthographic projection of the light-emitting unit on the substrate 10 can be located within the orthographic projection of the corresponding isolation opening on the substrate 10. Optionally, the pixel definition layer 30 and the isolation structure 40 can be located in the display area AA. It is understandable that the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit can be patterned by the isolation structure 40 instead of the mask. The pixel definition layer 30 has a pixel opening, and the pixel opening is located within the isolation opening.

[0052] The plurality of isolation openings may include a first isolation opening 401 , a second isolation opening 402 and a third isolation opening 403 . The first light emitting unit corresponds to the first isolation opening 401 , the second light emitting unit corresponds to the second isolation opening 402 , and the third light emitting unit corresponds to the third isolation opening 403 .

[0053] The display panel 100 also includes a first electrode 20 layer, a portion of which is located between the pixel definition layer 30 and the substrate 10. The first electrode 20 layer includes a plurality of first electrodes 20 spaced apart. The pixel opening is connected to the isolation opening, and the pixel opening exposes a portion of the first electrode 20. The light-emitting layer 50 can pass through the pixel opening to connect to the first electrode 20.

[0054] It can be understood that the first electrode 20 of the light-emitting unit is located on the side of the pixel definition layer 30 facing the substrate 10, the light-emitting unit includes a light-emitting layer 50 and a second electrode 60 located on the side of the light-emitting layer 50 away from the substrate 10, the light-emitting layer 50 and the second electrode 60 of the light-emitting unit are located in the isolation opening, and the light-emitting layer 50 is located between the first electrode 20 and the second electrode 60.

[0055] Optionally, the first electrode 20 may be an anode, and the second electrode 60 may be a cathode.

[0056] It can be understood that the light-emitting layer 50 of the first light-emitting unit is the first light-emitting layer 51 , the light-emitting layer 50 of the second light-emitting unit is the second light-emitting layer 52 , and the light-emitting layer 50 of the third light-emitting unit is the third light-emitting layer 53 .

[0057] The display panel 100 provided in the embodiment of the present application further includes a first encapsulation layer 70. The first encapsulation layer 70 is disposed on the side of the pixel definition layer 30 facing away from the substrate 10 and is located on the side of the light-emitting unit facing away from the substrate 10. The first encapsulation layer 70 is adjacent to the light-emitting unit. The first encapsulation layer 70 includes multiple encapsulation portions, each of which covers the corresponding isolation openings and the light-emitting unit. In other words, the orthographic projection of the isolation opening on the substrate 10 is located within the orthographic projection of the corresponding encapsulation portion on the substrate 10, and the orthographic projection of the light-emitting unit on the substrate 10 is located within the orthographic projection of the corresponding encapsulation portion on the substrate 10.

[0058] The multiple encapsulation parts may include a first encapsulation part 71, a second encapsulation part 72 and a third encapsulation part 73, the first encapsulation part 71 corresponds to the first light-emitting unit, and the first encapsulation part 71 is also formed by graphics, the second encapsulation part 72 corresponds to the second light-emitting unit, and the second encapsulation part 72 is also formed by graphics, and the third encapsulation part 73 corresponds to the third light-emitting unit, and the third encapsulation part 73 is also formed by graphics.

[0059] Optionally, the preparation order of the first encapsulation part 71 , the second encapsulation part 72 and the third encapsulation part 73 is consistent with the preparation order of the first light-emitting unit, the second light-emitting unit and the third light-emitting unit.

[0060] Please also refer to Figure 4 、 Figure 5 and Figure 6 It is understood that the isolation opening and the pixel opening can be prepared first, and then the light emitting unit and the first encapsulation layer 70 can be prepared. Figure 4 The isolation openings and pixel openings corresponding to light-emitting units of different light-emitting colors are also prepared in different processes (for example, the first isolation opening 401 corresponding to the first light-emitting unit and the second isolation opening 402 corresponding to the second light-emitting unit are prepared in different processes). The first encapsulation layer 70 is generally used to encapsulate the light-emitting units after they are formed. After the first encapsulation layer 70 encapsulates the first prepared light-emitting unit (for example, the first light-emitting unit), the isolation openings corresponding to the subsequent light-emitting units (for example, the second isolation opening 402 and / or the third isolation opening 403) are prepared.

[0061] When preparing the isolation openings corresponding to the subsequent light-emitting units, it is necessary to use a glue layer (such as photoresist) to cover the prepared first packaging layer 70 (such as the first packaging part 71) to pattern the isolation structure 40 to prepare the isolation openings corresponding to the subsequent light-emitting units.

[0062] It should be noted that, in addition to covering the prepared first encapsulation layer 70 , the adhesive layer also needs to cover the position of the isolation structure 40 where no isolation opening is required.

[0063] For example, see Figure 5 After forming the first encapsulation portion 71 and the second encapsulation portion 72, and before forming the third isolation opening 403, the second adhesive layer covers the first encapsulation portion 71 and the isolation structure 40 where no isolation opening is required. The first isolation opening 401 and the second isolation opening 402 can be formed simultaneously. Alternatively, the second isolation opening 402 can be formed after the first isolation opening 401.

[0064] For example, see Figure 6 After preparing the first packaging portion 71 and before preparing the second isolation opening 402 , the first adhesive layer covers the packaging portion and the isolation structure 40 where no isolation opening is required.

[0065] For example, after forming the first encapsulation portion 71 and before forming the second isolation opening 402 and the third isolation opening 403, the first adhesive layer covers the first encapsulation portion 71 and the isolation structure 40 where no isolation opening is required. The second isolation opening 402 and the third isolation opening 403 can be formed simultaneously or sequentially.

[0066] The following description will be made by taking an example in which the isolation opening and the pixel opening are prepared first, and then the light-emitting unit and the first encapsulation layer 70 are prepared.

[0067] The inventor discovered that Figure 3 During the manufacturing process of the first encapsulation layer 70, due to the eaves shape of the isolation structure 40, a closed cavity 7001 is defined within the first encapsulation layer 70. Cavity 7001 is located on the side of the isolation structure 40 facing the isolation opening. This results in greater stress in the portion of the first encapsulation layer 70 that contacts the sidewall of the isolation structure 40, making the portion of the first encapsulation layer 70 that contacts the sidewall of the isolation structure 40 susceptible to cracking during the manufacturing process of the display panel 100. This can easily allow water and oxygen to enter the encapsulation portion and the isolation structure 40 through this gap during the manufacturing process, and then enter the light-emitting unit, causing damage to the light-emitting unit and affecting the light-emitting effect.

[0068] To solve the above technical problems, please refer to Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 and Figure 11 An embodiment of the present application provides a display panel 100 . In the display panel 100 provided by the embodiment of the present application, the first encapsulation layer 70 includes an organic filling portion 7002 , and the organic filling portion 7002 is located in the cavity 7001 .

[0069] Through the above-mentioned technical solution, the display panel 100 provided in the embodiment of the present application uses the organic filling part 7002 to fill the cavity 7001 enclosed by the first encapsulation layer 70, which can support the part of the side wall of the first encapsulation layer 70 that is attached to the isolation structure 40, which is beneficial to reducing the stress of the part of the side wall of the first encapsulation layer 70 that is attached to the isolation structure 40, and is beneficial to reducing the risk of partial breakage of the side wall of the first encapsulation layer 70 that is attached to the isolation structure 40, thereby helping to improve the display effect.

[0070] Therefore, the display panel 100 provided in the embodiment of the present application is beneficial to improving the performance of the display device.

[0071] In some embodiments, the organic filling portion 7002 includes photoresist. In this way, the display panel 100 provided in the embodiment of the present application can use photoresist to prepare the organic filling portion 7002, and can use the photoresist in the etching process, which is convenient for material acquisition and helps save costs.

[0072] Optionally, the organic filling part 7002 may also be a planarization layer.

[0073] Optionally, the organic filling portion 7002 extends along the circumference of the isolation opening, so that the organic filling portion 7002 can support multiple positions where the organic encapsulation layer is attached to the isolation structure 40 along the circumference of the isolation opening.

[0074] In some examples, the organic filling portion 7002 is annular and extends along the circumference of the isolation opening. In this way, the organic filling portion 7002 can support various positions of the organic encapsulation layer attached to the isolation structure 40 along the circumference of the isolation opening.

[0075] In other examples, there are multiple organic filling parts 7002 , and the multiple organic filling parts 7002 are spaced apart along the circumference of the isolation opening. In this way, the multiple organic filling parts 7002 can support multiple positions where the organic encapsulation layer is attached to the isolation structure 40 .

[0076] In some embodiments, please refer to Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 and Figure 11 The first encapsulation layer 70 includes a first encapsulation sublayer 701 and a second encapsulation sublayer 702 sequentially arranged in a direction away from the substrate 10 , and a cavity 7001 is formed between the first encapsulation sublayer 701 and the second encapsulation sublayer 702 .

[0077] It can be understood that the first encapsulation layer 70 is divided into a first encapsulation sublayer 701 and a second encapsulation sublayer 702, and the first encapsulation sublayer 701 and the second encapsulation sublayer 702 can be manufactured separately, which makes it easier to fill the organic filling part 7002 into the cavity 7001, thereby supporting the part of the first encapsulation layer 70 that is attached to the side wall of the isolation structure 40, thereby reducing the stress of the part of the first encapsulation layer 70 that is attached to the side wall of the isolation structure 40.

[0078] Optionally, the cavity 7001 is an annular cavity 7001.

[0079] In some embodiments, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 both include inorganic materials. In this way, the main material of the first encapsulation layer 70 is an inorganic material, which can effectively encapsulate the light-emitting unit.

[0080] In some examples, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 are made of different materials. In this way, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 can have different etching selectivities, which can reduce the risk of over-etching the first encapsulation layer 70 and improve the encapsulation effect.

[0081] Optionally, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 are made of the same material. In this way, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 can be patterned together.

[0082] Optionally, the material of the first encapsulation sublayer 701 and the second encapsulation sublayer 702 includes at least one of silicon nitride, silicon oxide and silicon oxynitride.

[0083] Exemplarily, the material of the first encapsulation sublayer 701 includes one of silicon nitride, silicon oxide, and silicon oxynitride, and the material of the second encapsulation sublayer 702 includes another of silicon nitride, silicon oxide, and silicon oxynitride.

[0084] Please continue reading Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 and Figure 11 In some embodiments, the first encapsulation sublayer 701 includes a first main body portion 7011 and a first extension portion 7012, the first main body portion 7011 covers at least part of the light-emitting unit, and the first extension portion 7012 is connected to the peripheral side of the first main body portion 7011 and is connected to the side wall of the isolation junction toward the isolation opening.

[0085] It can be understood that the first encapsulation sublayer 701 can effectively encapsulate the light-emitting unit, thereby preventing damage to the light-emitting unit during the subsequent preparation of the organic encapsulation part.

[0086] Optionally, part of the first extension portion 7012 is located on a side of the isolation structure 40 facing away from the substrate 10. In this way, the first extension portion 7012 can increase the packaging path of the first packaging sub-layer 701, which is beneficial to improving the packaging effect.

[0087] In some embodiments, the second encapsulation sublayer 702 includes a second main body portion 7021 and a second extension portion 7022, the second extension portion 7022 is connected to the peripheral side of the second main body portion 7021, the second main body portion 7021 is located on the side of the first main body portion 7011 facing away from the substrate 10, and the orthographic projection of the second main body portion 7021 on the substrate 10 is located within the orthographic projection of the first main body portion 7011 on the substrate 10.

[0088] It can be understood that the second encapsulation sublayer 702 and the first encapsulation sublayer 701 jointly encapsulate the light-emitting unit, the second encapsulation sublayer 702 can cover the first encapsulation sublayer 701, and the second encapsulation sublayer 702 can increase the weight of the first encapsulation layer 70, and can improve the bonding force between the first encapsulation sublayer 701 and the isolation structure 40, thereby improving the encapsulation effect.

[0089] Optionally, the first main body portion 7011 , the second main body portion 7021 and the first extension portion 7012 enclose a cavity 7001 . In this way, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 can enclose a closed cavity 7001 .

[0090] Optionally, the second extension portion 7022 is located on a side of the first extension portion 7012 facing away from the substrate 10 .

[0091] In some embodiments, the isolation structure 40 includes a support portion and an eaves portion sequentially arranged in a direction away from the substrate 10, and the orthographic projection of the side of the support portion facing away from the substrate 10 on the substrate 10 is located within the orthographic projection of the side of the eave portion facing the substrate 10 on the substrate 10. In this way, the connection between the support portion and the eaves portion can have a step, which is beneficial to increase the bonding area between the first encapsulation layer 70 and the isolation structure 40, which is beneficial to improve the encapsulation path, and thus is beneficial to improve the encapsulation effect. The support portion includes a first support portion and a second support portion sequentially arranged in a direction away from the substrate 10, and the orthographic projection of the second support portion on the substrate 10 is located within the orthographic projection of the first support portion on the substrate 10, that is, along the thickness direction perpendicular to the substrate 10, the first support portion protrudes relative to the second support portion. The material of the first support portion can be Mo or Ti. In some embodiments, the second electrode 60 is in contact with and electrically connected to the first support portion.

[0092] The distance between the sidewall of the support portion facing the isolation opening and the center of the isolation opening gradually increases in the direction away from the substrate 10. This can increase the side area of ​​the support portion, which is beneficial for increasing the bonding area between the first encapsulation layer 70 and the isolation structure 40, and can also help to increase the encapsulation path, thereby improving the encapsulation effect.

[0093] Optionally, the organic filling portion 7002 is located on the side of the eave portion facing the substrate 10 . In this way, the organic filling portion 7002 can support the portion of the first encapsulation layer 70 that is in contact with the sidewall of the isolation structure 40 .

[0094] Optionally, the isolation structure 40 further includes a base portion, which is located on the side of the support portion facing the substrate 10 , and the orthographic projection of the side of the support portion facing the substrate 10 on the substrate 10 is located within the orthographic projection of the side of the base portion facing away from the substrate 10 on the substrate 10 .

[0095] In some embodiments, the display panel 100 provided in the embodiments of the present application further includes a pixel definition layer 30. The pixel definition layer 30 is located on one side of the substrate 10. The isolation structure 40 is located on the side of the pixel definition layer 30 facing away from the substrate 10. The pixel definition layer 30 has a plurality of pixel openings. At least a portion of the light-emitting unit is disposed within a corresponding pixel opening, and the pixel openings are connected to the corresponding pixel openings. This facilitates the preparation of the light-emitting unit.

[0096] Optionally, the first encapsulation sublayer 701 and the second encapsulation sublayer 702 may be inorganic encapsulation layers formed by chemical vapor deposition (CVD) and patterning.

[0097] In some embodiments, see Figure 8 The display panel 100 provided in the embodiment of the present application may further include a second encapsulation layer 80 , and the second encapsulation layer 80 is located on a side of the first encapsulation layer 70 and the isolation structure 40 facing away from the substrate 10 .

[0098] Optionally, the second encapsulation layer 80 may be an organic encapsulation layer made by ink jet printing (IJP).

[0099] In some embodiments, the display panel 100 provided by the embodiments of the present application may further include a third encapsulation layer 90 located on a side of the second encapsulation layer 80 facing away from the substrate 10 .

[0100] Optionally, the third encapsulation layer 90 may be an inorganic encapsulation layer formed by chemical vapor deposition (CVD).

[0101] Optionally, the display panel 100 provided in the embodiment of the present application may further include other film layers, which are located on the side of the third encapsulation layer 90 facing away from the substrate 10. The other film layers may include polarizing films, optically clear adhesives (OCA), and the like.

[0102] In some embodiments, please refer to Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 12 、 Figure 13 、 Figure 14 、 Figure 15 and Figure 16 The present invention also provides a method for manufacturing a display panel 100, the method comprising: S100, providing a substrate 10; S200 , preparing a pixel definition layer 30 and an isolation structure 40 on one side of the substrate 10 ; S300 , patterning the pixel definition layer 30 and the isolation structure 40 to form a pixel opening and an isolation opening, wherein the pixel opening is connected to the isolation opening; S400, preparing a light-emitting unit, wherein at least a portion of the light-emitting unit is disposed in a pixel opening; S500 , preparing a first encapsulation layer 70 on a side of the light-emitting unit facing away from the substrate 10 ; Among them, the first encapsulation layer 70 is located on the side of the light-emitting unit facing away from the substrate 10, and a closed cavity 7001 is provided inside the first encapsulation layer 70. The cavity 7001 is located on the side of the isolation structure 40 facing the isolation opening. The first encapsulation layer 70 includes an organic filling part 7002, and the organic filling part 7002 is located in the cavity 7001.

[0103] Through the above technical solution, the preparation method provided in the embodiment of the present application can use the organic filling part 7002 to fill the cavity 7001 enclosed by the first encapsulation layer 70, so that the organic filling part 7002 can support the portion of the first encapsulation layer 70 that is in contact with the sidewall of the isolation structure 40. This helps reduce the stress in the portion of the first encapsulation layer 70 that is in contact with the sidewall of the isolation structure 40, and helps reduce the risk of fracture in the portion of the first encapsulation layer 70 that is in contact with the sidewall of the isolation structure 40, thereby improving the display effect.

[0104] In some embodiments, in step S500, forming the first encapsulation layer 70 on the side of the light-emitting unit facing away from the substrate 10 includes: S510 , preparing a first encapsulation sublayer 701 , forming a groove 7003 with an opening in the first encapsulation sublayer 701 , wherein the groove 7003 is located on a side of the isolation structure 40 facing the isolation opening; S520 , preparing an organic layer on a side of the first encapsulation sublayer 701 facing away from the substrate 10 ; S530 , patterning the organic layer to form an organic filling portion 7002 , the organic filling portion 7002 filling the groove 7003 ; S540 , forming a second encapsulation sublayer 702 on a side of the first encapsulation sublayer 701 facing away from the substrate 10 , wherein the second encapsulation sublayer 702 blocks the opening 70031 of the groove 7003 so that the groove 7003 forms a closed cavity 7001 ; S550 , patterning the first encapsulation sublayer 701 and the second encapsulation sublayer 702 to form a first encapsulation layer 70 .

[0105] In this way, the method for manufacturing the display panel 100 provided in the embodiment of the present application can use the organic filling part 7002 to fill the cavity 7001 when preparing the first encapsulation layer 70 .

[0106] It is understandable that the first encapsulation sublayer 701 and the second encapsulation sublayer 702 may be patterned together, or the first encapsulation sublayer 701 may be patterned first and then the second encapsulation sublayer 702 may be patterned.

[0107] Optionally, in step S520 , when forming an organic layer on the side of the first encapsulation sublayer 701 facing away from the substrate 10 , the organic layer is formed by a coating process. To ensure that the organic layer fills the grooves 7003 , pressure is increased during the coating process so that the organic layer can enter the grooves 7003 .

[0108] In step S530 , the organic layer is patterned to remove excess organic layer, leaving the organic filling portion 7002 in the groove 7003 .

[0109] In some embodiments, in step S530, patterning the organic layer to form the organic filling portion 7002 includes: S531, photolithography or dry etching is performed on the organic layer to avoid accumulation of residual chemical solution from wet etching.

[0110] Optionally, the organic layer includes photoresist.

[0111] In some embodiments, in step S400, preparing the light-emitting unit includes: S410, preparing a first light-emitting unit; After the first light-emitting unit is prepared, in step S500, preparing a first encapsulation layer 70 on a side of the light-emitting unit facing away from the substrate 10 includes: S501: A first encapsulation portion 71 is formed on a side of the first light-emitting unit facing away from the substrate 10. The first encapsulation portion 71 includes a cavity 7001 and an organic filler portion 7002 located within the cavity 7001. This helps reduce stress in the portion of the first encapsulation portion 71 that contacts the sidewall of the isolation structure 40, thereby reducing the risk of fracture in the portion of the first encapsulation portion 71 that contacts the sidewall of the isolation structure 40, thereby improving display quality.

[0112] Optionally, in step S501, after preparing the first encapsulation portion 71 on a side of the first light-emitting unit facing away from the substrate 10, preparing the light-emitting unit includes: S420, preparing a second light-emitting unit; After the second light-emitting unit is prepared, in step S500, preparing a first encapsulation layer 70 on a side of the light-emitting unit facing away from the substrate 10 includes: S502: A second encapsulation portion 72 is formed on a side of the second light-emitting unit facing away from the substrate 10. The second encapsulation portion 72 includes a cavity 7001 and an organic filling portion 7002 located within the cavity 7001. This helps reduce stress in the portion of the second encapsulation portion 72 that contacts the sidewall of the isolation structure 40, thereby reducing the risk of fracture in the portion of the second encapsulation portion 72 that contacts the sidewall of the isolation structure 40, thereby improving display quality.

[0113] Optionally, in step S502, after preparing the second encapsulation portion 72 on a side of the second light-emitting unit facing away from the substrate 10, preparing the light-emitting unit includes: S430, preparing a third light-emitting unit; After the third light-emitting unit is prepared, in step S500, preparing a first encapsulation layer 70 on a side of the light-emitting unit facing away from the substrate 10 includes: S503: A third encapsulation portion 73 is formed on a side of the third light-emitting unit facing away from the substrate 10. The third encapsulation portion 73 includes a cavity 7001 and an organic filler portion 7002 located within the cavity 7001. This helps reduce stress in the portion of the third encapsulation portion 73 that contacts the sidewall of the isolation structure 40, thereby reducing the risk of fracture in the portion of the third encapsulation portion 73 that contacts the sidewall of the isolation structure 40, thereby improving display quality.

[0114] It can be understood that the first encapsulation part 71, the second encapsulation part 72 and the third encapsulation part 73 can all include part of the first encapsulation sublayer 701 and part of the second encapsulation sublayer 702, wherein the preparation process of the first encapsulation part 71, the second encapsulation part 72 and the third encapsulation part 73 is the same.

[0115] See also Figure 9 、 Figure 10 and Figure 11After the first encapsulation portion 71 is prepared, the organic filling portion 7002 can be used to fill the cavity 7001. The first encapsulation portion 71 also includes a first encapsulation sub-portion 711 and a second encapsulation sub-portion 712, which are arranged in a direction away from the substrate 10. The cavity 7001 is formed between the first encapsulation sub-portion 711 and the second encapsulation sub-portion 712. The first encapsulation sublayer 701 includes the first encapsulation sub-portion 711, and the second encapsulation sublayer 702 includes the second encapsulation sub-portion 712.

[0116] Optionally, in step S501, a first encapsulation portion 71 is prepared on a side of the first light-emitting unit facing away from the substrate 10, including: S5011, preparing a first package sub-unit 711, forming a trench 7003 with an opening in the first package sub-unit 711, the trench 7003 being located on a side of the isolation structure 40 facing the isolation opening; S5012, preparing an organic layer on a side of the first encapsulation sub-unit 711 facing away from the substrate 10; S5013, patterning the organic layer to form an organic filling portion 7002, the organic filling portion 7002 filling the groove 7003; S5014 , preparing a second encapsulation sub-portion 712 on a side of the first encapsulation sub-portion 711 facing away from the substrate 10 , the second encapsulation sub-portion 712 blocks the opening 70031 of the trench 7003 so that the trench 7003 forms a closed cavity 7001 ; S5015 , patterning the first packaging sub-portion 711 and the second packaging sub-portion 712 to form the first packaging portion 71 .

[0117] It is understandable that the first packaging sub-portion 711 and the second packaging sub-portion 712 may be patterned together, or the first packaging sub-portion 711 may be patterned first and then the second packaging sub-portion 712 may be patterned.

[0118] See also Figure 12 、 Figure 13 and Figure 14 After the second encapsulation portion 72 is prepared, the cavity 7001 can be filled with the organic filling portion 7002. The second encapsulation portion 72 also includes a third encapsulation sub-portion 721 and a fourth encapsulation sub-portion 722, which are sequentially arranged in a direction away from the substrate 10. The cavity 7001 is formed between the third encapsulation sub-portion 721 and the fourth encapsulation sub-portion 722. The first encapsulation sublayer 701 includes the third encapsulation sub-portion 721, and the second encapsulation sublayer 702 includes the fourth encapsulation sub-portion 722.

[0119] Optionally, in step S502, preparing a second encapsulation portion 72 on a side of the second light-emitting unit facing away from the substrate 10 includes: S5021, preparing a third package sub-unit 721, forming a trench 7003 with an opening in the third package sub-unit 721, and the trench 7003 is located on a side of the isolation structure 40 facing the isolation opening; S5022 , preparing an organic layer on a side of the third encapsulation sub-unit 721 facing away from the substrate 10 ; S5023 , patterning the organic layer to form an organic filling portion 7002 , the organic filling portion 7002 filling the groove 7003 ; S5024 , preparing a fourth encapsulation sub-portion 722 on a side of the third encapsulation sub-portion 721 facing away from the substrate 10 , and the fourth encapsulation sub-portion 722 blocks the opening 70031 of the trench 7003 so that the trench 7003 forms a closed cavity 7001 ; S5025 , patterning the third packaging sub-portion 721 and the fourth packaging sub-portion 722 to form the second packaging portion 72 .

[0120] It is understandable that the third packaging sub-portion 721 and the fourth packaging sub-portion 722 may be patterned together, or the third packaging sub-portion 721 may be patterned first and then the fourth packaging sub-portion 722 may be patterned.

[0121] See also Figure 7 、 Figure 15 and Figure 16 After the third encapsulation portion 73 is prepared, the cavity 7001 can be filled with the organic filler portion 7002. The third encapsulation portion 73 also includes a fifth encapsulation sub-portion 731 and a sixth encapsulation sub-portion 732, which are sequentially arranged in a direction away from the substrate 10. The cavity 7001 is formed between the fifth encapsulation sub-portion 731 and the sixth encapsulation sub-portion 732. The first encapsulation sublayer 701 includes the fifth encapsulation sub-portion 731, and the second encapsulation sublayer 702 includes the sixth encapsulation sub-portion 732.

[0122] Optionally, in step S503, preparing a third encapsulation portion 73 on a side of the third light-emitting unit facing away from the substrate 10 includes: S5031 , preparing a fifth package sub-unit 731 , forming a trench 7003 with an opening in the fifth package sub-unit 731 , wherein the trench 7003 is located on a side of the isolation structure 40 facing the isolation opening; S5032, preparing an organic layer on the side of the fifth encapsulation sub-unit 731 facing away from the substrate 10; S5033 , patterning the organic layer to form an organic filling portion 7002 , which is filled in the groove 7003 ; S5034 , preparing a sixth encapsulation sub-portion 732 on the side of the fifth encapsulation sub-portion 731 facing away from the substrate 10 , and the sixth encapsulation sub-portion 732 blocks the opening 70031 of the trench 7003 so that the trench 7003 forms a closed cavity 7001 ; S5035 , patterning the fifth packaging sub-portion 731 and the sixth packaging sub-portion 732 to form a third packaging portion 73 .

[0123] It is understandable that the fifth packaging sub-portion 731 and the sixth packaging sub-portion 732 may be patterned together, or the fifth packaging sub-portion 731 may be patterned first and then the sixth packaging sub-portion 732 may be patterned.

[0124] In some embodiments, embodiments of the present application provide a display device, which includes the display panel 100 of any of the above embodiments or the display panel 100 prepared by the preparation method of any of the above embodiments.

[0125] Optionally, the display device can be a mobile phone, a television, a tablet computer, a laptop computer, a desktop computer, a vehicle-mounted display terminal, a wearable device, an advertising display device, or the like.

[0126] The display device provided in the embodiment of the present application has the same or similar technical effects as the display panel 100 of any of the above embodiments or the preparation method of any of the above embodiments, and will not be described in detail here.

[0127] The above are only specific embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure, the isolation structure being located on one side of the substrate and enclosing a plurality of isolation openings; a plurality of light-emitting units, wherein at least a portion of an orthographic projection of each light-emitting unit on the substrate is located within an orthographic projection of a corresponding isolation opening on the substrate; A first encapsulation layer, the first encapsulation layer is located on a side of the light-emitting unit facing away from the substrate, a closed cavity is provided inside the first encapsulation layer, the cavity is located on a side of the isolation structure facing the isolation opening, the first encapsulation layer includes an organic filling portion, and the organic filling portion is located in the cavity.

2. The display panel according to claim 1, wherein The organic filling part includes photoresist.

3. The display panel according to claim 1, wherein The organic filling portion is annular and extends along the circumference of the isolation opening; Alternatively, there are a plurality of organic filling parts, which are spaced apart along the circumference of the isolation opening.

4. The display panel according to claim 1, wherein: The first encapsulation layer includes a first encapsulation sublayer and a second encapsulation sublayer sequentially arranged in a direction away from the substrate, and the cavity is formed between the first encapsulation sublayer and the second encapsulation sublayer.

5. The display panel according to claim 4, wherein: The first encapsulation sublayer and the second encapsulation sublayer both include inorganic materials.

6. The display panel according to claim 5, wherein: The material of the first encapsulation sublayer and the second encapsulation sublayer includes at least one of silicon nitride, silicon oxide and silicon oxynitride.

7. The display panel according to claim 4, wherein: The first encapsulation sublayer includes a first main portion and a first extension portion, the first main portion covers at least a portion of the light emitting unit, the first extension portion is connected to the peripheral side of the first main portion and is connected to the side wall of the isolation junction facing the isolation opening.

8. The display panel according to claim 7, wherein: The second encapsulation sublayer includes a second main body portion and a second extension portion, the second extension portion is connected to the peripheral side of the second main body portion, the second main body portion is located on the side of the first main body portion away from the substrate, and the orthographic projection of the second main body portion on the substrate is located within the orthographic projection of the first main body portion on the substrate.

9. The display panel according to claim 8, wherein: The first main body portion, the second main body portion and the first extension portion enclose and form the cavity; And / or, the second extending portion is located on a side of the first extending portion facing away from the substrate.

10. The display panel according to any one of claims 1 to 9, wherein: The isolation structure includes a support portion and an eaves portion arranged in sequence along a direction away from the substrate, the orthographic projection of the side of the support portion facing away from the substrate on the substrate is located within the orthographic projection of the side of the eave portion facing the substrate on the substrate, and the distance between the side wall of the support portion facing the isolation opening and the center of the isolation opening gradually increases along the direction away from the substrate.

11. The display panel according to claim 10, wherein: The organic filling portion is located on a side of the eave portion facing the substrate.

12. A method for preparing a display panel, characterized in that: The preparation method comprises: providing a substrate; preparing a pixel definition layer and an isolation structure on one side of the substrate; Patterning the pixel definition layer and the isolation structure to form a pixel opening and an isolation opening, wherein the pixel opening is connected to the isolation opening; preparing a light-emitting unit, wherein at least a portion of the light-emitting unit is disposed within the pixel opening; preparing a first encapsulation layer on a side of the light-emitting unit facing away from the substrate; The first encapsulation layer is located on the side of the light-emitting unit facing away from the substrate, a closed cavity is provided inside the first encapsulation layer, the cavity is located on the side of the isolation structure facing the isolation opening, and the first encapsulation layer includes an organic filling part, which is located in the cavity.

13. The preparation method according to claim 12, wherein The step of preparing a first encapsulation layer on a side of the light-emitting unit facing away from the substrate comprises: preparing a first encapsulation sublayer, wherein a trench having an opening is formed in the first encapsulation sublayer, and the trench is located on a side of the isolation structure facing the isolation opening; preparing an organic layer on a side of the first encapsulation sublayer facing away from the substrate; Patterning the organic layer to form an organic filling portion, wherein the organic filling portion is filled in the groove; preparing a second encapsulation sublayer on a side of the first encapsulation sublayer facing away from the substrate, wherein the second encapsulation sublayer blocks the opening of the groove to form a closed cavity in the groove; The first encapsulation sublayer and the second encapsulation sublayer are patterned to form the first encapsulation layer.

14. The preparation method according to claim 13, wherein The step of patterning the organic layer to form an organic filling portion includes: The organic layer is subjected to photolithography or dry etching.

15. The preparation method according to any one of claims 12 to 14, characterized in that: The preparation of the light-emitting unit comprises: preparing a first light-emitting unit; After preparing the first light-emitting unit, preparing a first encapsulation layer on a side of the light-emitting unit facing away from the substrate includes: A first encapsulation portion is prepared on a side of the first light-emitting unit facing away from the substrate, wherein the first encapsulation portion comprises the cavity and the organic filling portion located in the cavity.

16. The preparation method according to claim 15, characterized in that After preparing the first encapsulation portion on a side of the first light-emitting unit facing away from the substrate, preparing the light-emitting unit includes: preparing a second light-emitting unit; After preparing the second light-emitting unit, preparing a first encapsulation layer on a side of the light-emitting unit facing away from the substrate includes: A second encapsulation portion is prepared on a side of the second light-emitting unit facing away from the substrate, wherein the second encapsulation portion comprises the cavity and the organic filling portion located in the cavity.

17. The preparation method according to claim 16, wherein After preparing the second encapsulation portion on a side of the second light-emitting unit facing away from the substrate, preparing the light-emitting unit includes: preparing a third light-emitting unit; After preparing the third light-emitting unit, preparing a first encapsulation layer on a side of the light-emitting unit facing away from the substrate includes: A third encapsulation portion is prepared on a side of the third light-emitting unit facing away from the substrate, wherein the third encapsulation portion comprises the cavity and the organic filling portion located in the cavity.

18. A display device, characterized in that: A display panel comprising the display panel according to any one of claims 1 to 11 or a display panel prepared by the preparation method according to any one of claims 12 to 17.

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