Semiconductor wafer surface photoresist coating device

Abstract

The invention relates to the technical field of semiconductor wafer processing, and discloses a semiconductor wafer surface photoresist coating device which comprises a rack, a cavity is formed in the top end of the rack, a storage box is fixedly connected to the inner bottom wall of the rack, a collecting bin is fixedly connected to the inner bottom wall of the cavity, and the bottom end of the collecting bin communicates with a pipeline. The outer side of the middle of the pipeline communicates with a first air pump, one side of the inner top wall of the storage box is fixedly connected with an intercepting plate, the storage box is fixedly connected to the inner bottom wall of the rack, and the top end of the side, away from the pipeline, of the storage box communicates with a conveying pipe. According to the invention, when the photoresist is thrown out of the surface of the semiconductor wafer due to centrifugal force, the photoresist falls to the bottom of the cavity under the guidance of the side wall of the cavity and then falls into the collection bin along the bottom of the cavity, and the photoresist is conveyed into the storage box through the air pump I, so that the photoresist thrown out of the semiconductor wafer is recycled and reused.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer processing, in particular to a device for coating photoresist on the surface of a semiconductor wafer. Background Art

[0002] Semiconductor wafers, typically made of high-purity single-crystal silicon, are the fundamental material for manufacturing semiconductor devices. They are a crucial link in the semiconductor industry chain. Subsequent chip manufacturing processes, such as photolithography, etching, and doping, are all performed on the wafer surface. During semiconductor wafer processing, photoresist is coated on the surface, laying the foundation for subsequent exposure, development, and etching operations. Photoresist, also known as photoresist, is a light-sensitive liquid mixture. Applying photoresist to semiconductor wafers requires the use of a photoresist coating device.

[0003] Photoresist coating equipment is a key component used in microelectronics industries, such as semiconductor manufacturing, flat panel displays, and printed circuit boards (PCBs), to evenly coat substrates (such as semiconductor wafers and glass substrates). When coating a semiconductor wafer with photoresist, the wafer is typically placed on a rotating table within a housing. A motor drives the rotating table at high speed, while photoresist is dripped onto the center of the substrate. Centrifugal force spreads the photoresist evenly across the substrate surface, forming a thin film.

[0004] However, when the rotating table spreads the photoresist through centrifugal force, the excess photoresist on the surface of the semiconductor wafer will be thrown out of the edge of the semiconductor wafer under the action of centrifugal force, which is wasteful. In addition, when the thrown photoresist hits the inner wall of the outer shell, some of the photoresist will splash back onto the surface of the semiconductor wafer, thereby affecting the uniformity of the film thickness on the surface of the semiconductor wafer. Summary of the Invention

[0005] In order to make up for the above shortcomings, the present invention provides a semiconductor wafer surface photoresist coating device, which aims to improve the problem in the prior art that excess photoresist on the semiconductor wafer surface will be thrown out of the edge of the semiconductor wafer, which is wasteful, and part of the photoresist will splash back onto the semiconductor wafer surface when it hits the inner wall of the outer shell, thereby affecting the uniformity of the film thickness on the semiconductor wafer surface.

[0006] In order to achieve the above object, the present invention adopts the following technical solution: a device for coating photoresist on the surface of a semiconductor wafer, comprising a frame,

[0007] A cavity is formed at the top of the frame, and the sidewalls of the cavity are inclined;

[0008] Motor 2 is fixedly connected to the inner top wall of the frame, and the driving end of motor 2 passes through the inner top wall of the frame and is fixedly connected to the bottom plate;

[0009] A collecting bin, fixedly connected to the bottom wall of the cavity;

[0010] A pipe is connected to the bottom end of the collection bin, the other end of the pipe is connected to a storage box, an interception plate is fixedly connected to one side of the top wall of the storage box, the storage box is fixedly connected to the bottom wall of the frame, and the outer side of the middle of the pipe is connected to an air pump;

[0011] The auxiliary part is installed on one side of the top end of the storage box.

[0012] As a further description of the above technical solution:

[0013] The auxiliary part includes a delivery pipe, which is connected to the top of the storage box away from the pipeline. The other end of the delivery pipe is connected to a bellows, which is fixedly connected to the top of the inner wall of the cavity. A slot is provided at the bottom of the bellows.

[0014] As a further description of the above technical solution:

[0015] Suction cups are fixedly connected to the four corners of the top of the bottom plate, and the bottom ends of the plurality of suction cups are connected to exhaust pipes, and one end of the plurality of exhaust pipes passes through the bottom plate and is connected to air pump 2.

[0016] As a further description of the above technical solution:

[0017] The top wall of the storage box is rotatably connected to a stirring rod, and the outer side of the top end of the stirring rod is fixedly connected to a plurality of evenly distributed blades.

[0018] As a further description of the above technical solution:

[0019] One side of the top end of the frame is rotatably connected to a driven gear, and the top end of the driven gear is fixedly connected to a fixing rod.

[0020] As a further description of the above technical solution:

[0021] One end of the fixing rod is fixedly connected to a cylinder, and the lower output end of the cylinder is fixedly connected to a nozzle.

[0022] As a further description of the above technical solution:

[0023] The top end of one side of the frame is fixedly connected to a side plate, the bottom end of the side plate is fixedly connected to motor 1, the output end of motor 1 passes through the side plate and is fixedly connected to a driving gear, and one side of the driving gear is meshedly connected to a driven gear.

[0024] As a further description of the above technical solution:

[0025] One side of the bottom end of the storage box is connected to a corrugated hose, one end of the corrugated hose is connected to the top of the spray nozzle, and the outer side of the middle part of the corrugated hose is connected to a water pump.

[0026] As a further description of the above technical solution:

[0027] A through hole is provided on one side of the top of the storage box, and a plug is inserted into the through hole for sealing the through hole.

[0028] As a further description of the above technical solution:

[0029] The bellows is an annular structure so that air can be ejected from the slot in the form of an annular air curtain.

[0030] The present invention has the following beneficial effects:

[0031] In the present invention, 1. when the excess photoresist on the surface of the semiconductor wafer is thrown out of the surface of the semiconductor wafer due to centrifugal force, it will hit the side wall of the cavity and fall to the bottom of the cavity under the guidance of the side wall of the cavity, and then fall into the collection bin along the bottom of the cavity. The photoresist is connected to the air through the pipeline and transported to the interior of the storage box through the air pump, and the air and the photoresist are separated by the interception plate so that the photoresist falls to the bottom of the storage box, thereby realizing the recovery and reuse of the photoresist thrown out of the semiconductor wafer.

[0032] 2. Because the side walls of the cavity are inclined, when the photoresist hits the side walls of the cavity, it will rebound toward the bottom of the cavity under the influence of the side walls of the cavity, and the air inside the storage box will enter the bellows through the conveying pipe and be discharged from the inside of the slot, thereby forming an annular barrier on the periphery of the bottom plate, preventing the photoresist from rebounding again to the surface of the semiconductor wafer after hitting the side walls of the cavity, resulting in local differences in the thickness of the film on the surface of the semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a three-dimensional diagram of a device for coating photoresist on a semiconductor wafer surface proposed by the present invention;

[0034] Figure 2 This is a cross-sectional view of a frame of a device for coating photoresist on a semiconductor wafer surface proposed by the present invention;

[0035] Figure 3 This is a schematic structural diagram of a bellows for a semiconductor wafer surface photoresist coating device proposed by the present invention;

[0036] Figure 4 This is a cross-sectional view of a bottom plate of a device for coating photoresist on a semiconductor wafer surface proposed by the present invention;

[0037] Figure 5A cross-sectional view of a storage box of a device for coating photoresist on a semiconductor wafer surface according to the present invention;

[0038] Figure 6 This is a schematic structural diagram of a fixing rod of a semiconductor wafer surface photoresist coating device proposed by the present invention.

[0039] Legend:

[0040] 1. Frame; 2. Through hole; 3. Water pump; 4. Storage box; 5. Bellows; 6. Cavity; 7. Nozzle; 8. Cylinder; 9. Fixing rod; 10. Corrugated hose; 11. Driven gear; 12. Driving gear; 13. Side panel; 14. Motor 1; 15. Bottom plate; 16. Delivery pipe; 17. Collection bin; 18. Motor 2; 19. Air pump 1; 20. Pipeline; 21. Slot; 22. Exhaust pipe; 23. Suction cup; 24. Air pump 2; 25. Blade; 26. Stirring rod; 27. Plug; 28. Interceptor plate. DETAILED DESCRIPTION

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0042] Example 1:

[0043] Reference Figure 1 、 Figure 2 and Figure 4 An embodiment of the present invention provides: a device for coating photoresist on the surface of a semiconductor wafer, comprising a frame 1, a cavity 6 being opened at the top of the frame 1, the side walls of the cavity 6 being an inclined structure, the bottom end of the cavity 6 being an arc-shaped structure, and the side walls of the cavity 6 being coated with a hydrophobic coating, so that the photoresist attached to the side walls of the cavity 6 can flow to the bottom of the cavity 6, a second motor 18 being fixedly connected to the top wall of the frame 1, a driving end of the second motor 18 passing through the top wall of the frame 1 and fixedly connected to a bottom plate 15, suction cups 23 being fixedly connected to the four corners of the top end of the bottom plate 15, multiple suction cups 23 being connected to exhaust pipes 22 at their bottom ends, multiple exhaust pipes 22 being connected to a second air pump 24 at one end passing through the bottom plate 15, and the second air pump 24 being an air pump with a built-in power supply, so that it does not require an external power supply when in use.

[0044] Place the semiconductor wafer on the top of the base plate 15, then start the air pump 24 to generate suction through the exhaust pipe 22 to exhaust the air inside the suction cup 23, so that negative pressure is generated inside the suction cup 23 to fix the semiconductor wafer on the top of the base plate 15.

[0045] Reference Figure 1 and Figure 6 A driven gear 11 is rotatably connected to one side of the top of the frame 1, a fixed rod 9 is fixedly connected to the top of the driven gear 11, one end of the fixed rod 9 is fixedly connected to the cylinder 8, and the lower output end of the cylinder 8 is fixedly connected to the nozzle 7. A storage box 4 is fixedly connected to the bottom wall of the frame 1, and photoresist is stored in the storage box 4. A corrugated hose 10 is connected to one side of the bottom end of the storage box 4, and one end of the corrugated hose 10 is connected to the top of the nozzle 7. The outside of the middle part of the corrugated hose 10 is connected to the water pump 3.

[0046] Start the cylinder 8 to push the nozzle 7 downward, so that the nozzle 7 is close to the top of the base plate 15, and then start the water pump 3 to pump the photoresist inside the storage box 4 into the corrugated hose 10, and spray it from the inside of the nozzle 7 to the center point of the top of the semiconductor wafer at the top of the base plate 15, and then start the motor 2 18 to make the base plate 15 drive the semiconductor wafer to rotate, so that the photoresist on the surface of the semiconductor wafer is evenly spread on the surface of the wafer through centrifugal force.

[0047] Reference Figure 1 、 Figure 2 、 Figure 3 and Figure 5 The bottom wall of the cavity 6 is fixedly connected to a collecting bin 17, and the bottom end of the collecting bin 17 is connected to a pipe 20. One end of the pipe 20 passes through the storage box 4 and is connected to the storage box 4 at the top on one side. The outside of the middle of the pipe 20 is connected to an air pump 19, and an interception plate 28 is fixedly connected to one side of the inner top wall of the storage box 4. The storage box 4 is fixedly connected to the bottom wall of the frame 1, and the top of the side of the storage box 4 away from the pipe 20 is connected to the delivery pipe 16. The other end of the delivery pipe 16 passes through the inner wall of the cavity 6 and is connected to the bellows 5. The bellows 5 is fixedly connected to the top of the inner wall of the cavity 6, and a slot 21 is opened at the bottom end of the bellows 5. The bellows 5 is an annular structure so that air can be ejected from the slot 21 in the form of an annular wind curtain.

[0048] When the bottom plate 15 throws out the excess photoresist on the surface of the semiconductor wafer, it will hit the side wall of the cavity 6. Since the side wall of the cavity 6 is inclined, the photoresist will be guided by it and fall to the bottom of the cavity 6, and fall into the collection bin 17 along the bottom of the cavity 6. At the same time, the air pump 19 is used to make the pipe 20 generate suction to transport the air inside the collection bin 17 and the photoresist through the pipe 20 to the storage box 4. At the same time, the interception plate 28 intercepts the photoresist attached to the air entering the storage box 4. At this time, the intercepted photoresist will fall to the bottom of the storage box 4 under the action of gravity for recovery. At the same time, the air will be transported to the inside of the bellows 5 through the delivery pipe 16 after filtration, and will be ejected from the inside of the slot 21, thereby forming an annular barrier on the periphery of the bottom plate 15, thereby preventing the photoresist thrown off the semiconductor wafer from rebounding to the surface of the semiconductor wafer again after hitting the side wall of the cavity 6, resulting in local differences in the thickness of the film on the surface of the semiconductor wafer.

[0049] Example 2:

[0050] Reference Figure 1 and Figure 6 The top of one side of the frame 1 is fixedly connected to a side plate 13, the bottom of the side plate 13 is fixedly connected to a motor 14, the output end of the motor 14 passes through the side plate 13 and is fixedly connected to a driving gear 12, and one side of the driving gear 12 is meshed with a driven gear 11.

[0051] The starting motor 14 drives the driving gear 12 to rotate. When the driving gear 12 rotates, it drives the driven gear 11 to rotate, so that the fixing rod 9 can rotate to one side, thereby causing the nozzle 7 to hinder the operator's operation when the operator installs and fixes the semiconductor wafer.

[0052] Reference Figure 5 A stirring rod 26 is rotatably connected to the top wall of the storage box 4, and a plurality of evenly distributed blades 25 are fixedly connected to the outer side of the top end of the stirring rod 26. The air inside the collection bin 17 will first hit the blades 25 during the process of being discharged from the storage box 4, thereby pushing the blades 25 to rotate. When the blades 25 rotate, they will drive the stirring rod 26 to rotate, so that the stirring rod 26 can stir the photoresist inside the storage box 4, thereby preventing the photoresist from being precipitated and stratified due to long-term standing.

[0053] Reference Figure 5 A through hole 2 is provided on one side of the top of the storage box 4, and a plug 27 is inserted into the through hole 2 to seal the through hole 2. When it is necessary to add photoresist to the storage box 4, the plug 27 can be taken out from the through hole 2 and the photoresist can be injected into the storage box 4 through the through hole 2. After the filling is completed, the plug 27 can be inserted into the through hole 2 to seal the through hole 2.

[0054] Working principle: Place the semiconductor wafer on the top of the base plate 15, then start the air pump 24 to generate negative pressure inside the suction cup 23, fix the semiconductor wafer to the top of the base plate 15, start the motor 14 to drive the driving gear 12 to rotate, and the driving gear 12 will drive the driven gear 11 to rotate when rotating, so that the fixing rod 9 can rotate to one side, so that the nozzle 7 moves to the top of the center of the base plate 15, start the cylinder 8 to push the nozzle 7 downward, close to the surface of the semiconductor wafer, start the water pump 3 to pump the photoresist inside the storage box 4 into the nozzle 7 and spray it to the center point of the top of the semiconductor wafer on the top of the base plate 15, start the motor 2 18 to make the base plate 15 drive the semiconductor wafer to rotate, so that the photoresist on the surface of the semiconductor wafer is evenly spread on the surface of the wafer through centrifugal force, when the excess photoresist on the surface of the semiconductor wafer is thrown out of the surface of the semiconductor wafer due to centrifugal force, it will hit the side wall of the cavity 6 and in the air It falls to the bottom of the cavity 6 under the guidance of the side wall of the cavity 6, and then falls into the inside of the collecting bin 17 along the bottom of the cavity 6. At the same time, the air pump 19 is used to make the pipe 20 generate suction to transport the air inside the collecting bin 17 and the photoresist through the pipe 20 to the inside of the storage box 4, and the interception plate 28 is used to separate the air and the photoresist. After separation, the air will be transported to the inside of the bellows 5 through the delivery pipe 16 and ejected from the inside of the slot 21, thereby forming an annular barrier on the periphery of the bottom plate 15, thereby preventing the photoresist thrown off the semiconductor wafer from bouncing back to the surface of the semiconductor wafer after hitting the side wall of the cavity 6, causing local differences in the film thickness on the surface of the semiconductor wafer. At the same time, the air inside the storage box 4 will push the blade 25 to drive the stirring rod 26 to rotate when flowing, so that the stirring rod 26 can stir the photoresist inside the storage box 4, thereby preventing the photoresist from precipitation and stratification due to long-term standing.

[0055] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A device for coating photoresist on a semiconductor wafer surface, characterized in that: including a frame (1), A cavity (6) is provided at the top of the frame (1), and the side wall of the cavity (6) is an inclined structure; Motor 2 (18) is fixedly connected to the inner top wall of the frame (1), and the driving end of motor 2 (18) passes through the inner top wall of the frame (1) and is fixedly connected to the bottom plate (15); A collecting bin (17) is fixedly connected to the bottom wall of the cavity (6); A pipe (20) is connected to the bottom end of the collecting bin (17), the other end of the pipe (20) is connected to a storage box (4), an interception plate (28) is fixedly connected to one side of the top wall of the storage box (4), the storage box (4) is fixedly connected to the bottom wall of the frame (1), and the outer side of the middle of the pipe (20) is connected to an air pump (19); The auxiliary part is installed on one side of the top end of the storage box (4).

2. The device for coating semiconductor wafer surface with photoresist according to claim 1, wherein: The auxiliary part comprises a delivery pipe (16), the delivery pipe (16) being connected to the top end of the storage box (4) away from the pipeline (20), the other end of the delivery pipe (16) being connected to a bellows (5), the bellows (5) being fixedly connected to the top end of the inner wall of the cavity (6), and the bottom end of the bellows (5) being provided with a slot (21).

3. The device for coating semiconductor wafer surface with photoresist according to claim 1, wherein: The four corners of the top of the bottom plate (15) are fixedly connected with suction cups (23), the bottom ends of the plurality of suction cups (23) are connected with exhaust pipes (22), and one end of the plurality of exhaust pipes (22) passes through the bottom plate (15) and is connected with air pump 2 (24).

4. The device for coating semiconductor wafer surface with photoresist according to claim 1, wherein: The top wall of the storage box (4) is rotatably connected to a stirring rod (26), and the outer side of the top end of the stirring rod (26) is fixedly connected to a plurality of evenly distributed blades (25).

5. The device for coating semiconductor wafer surface with photoresist according to claim 1, wherein: One side of the top end of the frame (1) is rotatably connected to a driven gear (11), and the top end of the driven gear (11) is fixedly connected to a fixing rod (9).

6. The device for coating semiconductor wafer surface with photoresist according to claim 5, characterized in that: One end of the fixed rod (9) is fixedly connected to the cylinder (8), and the lower output end of the cylinder (8) is fixedly connected to the nozzle (7).

7. The device for coating semiconductor wafer surface with photoresist according to claim 5, characterized in that: The top end of one side of the frame (1) is fixedly connected to a side plate (13), the bottom end of the side plate (13) is fixedly connected to a motor 1 (14), the output end of the motor 1 (14) passes through the side plate (13) and is fixedly connected to a driving gear (12), and one side of the driving gear (12) is meshedly connected to a driven gear (11).

8. The device for coating semiconductor wafer surface with photoresist according to claim 6, wherein: One side of the bottom end of the storage box (4) is connected to a corrugated hose (10), one end of the corrugated hose (10) is connected to the top of the spray head (7), and the outer side of the middle of the corrugated hose (10) is connected to a water pump (3).

9. The device for coating semiconductor wafer surface with photoresist according to claim 1, characterized in that: A through hole (2) is provided on one side of the top end of the storage box (4), and a plug (27) is inserted into the through hole (2) for sealing the through hole (2).

10. The device for coating semiconductor wafer surface with photoresist according to claim 2, characterized in that: The bellows (5) is an annular structure so that air can be ejected from the slot (21) in the form of an annular air curtain.

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