Support plate cleaning device, plate-type coating equipment and support plate cleaning control method

Abstract

The invention relates to the technical field of photovoltaic vacuum coating, and discloses a cleaning device of a support plate, plate-type coating equipment and a cleaning control method of the support plate. The cleaning device comprises a conveying machine frame, a conveying mechanism, a cleaning mechanism and a cleaning mechanism, the first cleaning part is arranged on the conveying rack and is used for synchronously brushing and sucking dust on the inner surface of the guide groove while conveying the carrier plate; and the second cleaning part is arranged on the conveying rack and used for synchronously brushing and sucking dust on the upper surface and the lower surface of the carrier plate in the process that the carrier plate is conveyed by the first cleaning part. Dust on the carrier plate can be effectively removed, so that the surface cleanliness of the carrier plate is ensured, and the coating quality of a silicon wafer is further ensured.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic vacuum coating, and in particular to a cleaning device for a carrier plate, a plate-type coating device, and a cleaning control method for a carrier plate. Background Art

[0002] Currently, in the production of various solar cells (e.g., HJT, HBC, HTBC, and perovskite solar cells), a carrier is typically used to carry silicon wafers into a vacuum reaction chamber for thin film deposition. When the coating material reaches a certain thickness in the vacuum reaction chamber and on the carrier surface, a large amount of dust will adhere to the carrier surface, necessitating cleaning. The carrier surface cleanliness directly affects the coating quality of the silicon wafer.

[0003] During the implementation of the embodiments of the present disclosure, it was found that at least the following problems exist in the related art:

[0004] The cleaning devices used in related art have poor cleaning effectiveness and are unable to target hard-to-remove dust areas on the carrier, severely impacting silicon wafer production efficiency and product yield. Furthermore, the cleaning methods used in related art cleaning devices are fixed and single, failing to adjust the cleaning method based on the carrier's actual operating conditions. This results in slower production and higher costs.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0006] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0007] The embodiments of the present disclosure provide a carrier cleaning device, a plate coating device, and a carrier cleaning control method to effectively remove dust on the carrier to ensure the surface cleanliness of the carrier and further ensure the coating quality of the silicon wafer.

[0008] Optionally, the cleaning device of the carrier is provided with guide grooves on both sides of the carrier, and the cleaning device includes: a conveying frame having a conveying function and a cleaning function; a first cleaning part, provided on the conveying frame, for synchronously brushing and vacuuming the inner surface of the guide groove while conveying the carrier; and a second cleaning part, provided on the conveying frame, for synchronously brushing and vacuuming the upper and lower surfaces of the carrier while the first cleaning part conveys the carrier.

[0009] Optionally, the first cleaning part includes a plurality of roller assemblies for rolling with the guide groove to transport the carrier, and the roller assemblies are used to vacuum the inner surface of the guide groove while brushing the dust; the second cleaning part includes a plurality of dust collection roller brush assemblies staggered on the upper and lower sides of the carrier, and the dust collection roller brush assemblies are used to vacuum the upper and lower surfaces of the carrier while brushing the dust.

[0010] Optionally, the dust collection roller brush assembly includes one or more roller brushes, and the roller brush includes a roller shaft and first bristles and a first adsorption area arranged on the roller shaft; in the process of the first cleaning part transporting the carrier plate, the roller shaft rotates to enable the first brush to rotate and sweep the dust on the carrier plate, and the first bristles and the dust on the carrier plate are adsorbed through the first adsorption area.

[0011] Optionally, a portion of the multiple roller brushes are arranged above the carrier plate to form a first roller brush group, and another portion of the multiple roller brushes are arranged below the carrier plate to form a second roller brush group; the first roller brush group and the second roller brush group are rotated simultaneously to sweep and absorb dust on both sides of the carrier plate.

[0012] Optionally, a plurality of position adjustment holes for mounting the roller brush are provided on the conveyor frame, and the roller brush can be limitedly moved on the position adjustment holes to adjust the position of the roller brush.

[0013] Optionally, the roller brush further includes a rotating seat, both ends of the roller shaft are rotatably disposed on the rotating seat, and the rotating seat is movably disposed in the position adjustment hole to adjust the position of the roller brush.

[0014] Optionally, the conveying frame further includes a first driving device connected to the rotating seat to drive the rotating seat to perform limited movement in the position adjustment hole.

[0015] Optionally, a first negative pressure chamber connected to the first adsorption area is constructed inside the roller; the roller brush also includes a first rotating joint, which is arranged on the first end side of the roller, and the negative pressure device is connected to the first negative pressure chamber through the first rotating joint.

[0016] Optionally, the roller assembly includes a first type of roller and a second type of roller, wherein the diameter of the first type of roller is smaller than the diameter of the second type of roller; the first type of roller is provided with a second adsorption area and a second bristle, and the first type of roller is rotated to make the second bristles rotate and brush the dust on the inner surface of the guide groove, and the second adsorption area adsorbs the second bristles and the dust on the inner surface of the guide groove; the second type of roller is provided with a second adsorption area, and the second type of roller is rotated to make the second type of roller rollingly connected to the guide groove to transport the carrier plate, and the second adsorption area adsorbs the dust on the inner surface of the guide groove.

[0017] Optionally, the roller assembly includes: a wheel axle, rotatably arranged on the conveying frame; a wheel body, arranged at the first end of the wheel axle, and the outer surface of the wheel body is provided with a second adsorption area and second bristles; wherein, when the outer surface of the wheel body is provided with a second adsorption area, the wheel axle and the wheel body are internally constructed with a second negative pressure chamber connected to the second adsorption area; a second rotating joint, arranged at the second end side of the wheel axle, and the negative pressure device is connected to the second negative pressure chamber through the second rotating joint.

[0018] Optionally, the conveyor frame also includes a second drive device, which is arranged on the conveyor frame and connected to the dust collection brush assembly and / or the roller assembly through a preset transmission device to drive the roller brush of the dust collection brush assembly and / or the wheel axle of the roller assembly to rotate.

[0019] Optionally, the transmission device includes: a transmission wheel, arranged at the driving end of the second driving device, the second end side of the roller brush and / or the second end side of the roller; a transmission belt, connected to each of the transmission wheels, so that the second driving device drives each of the transmission wheels to rotate through the transmission belt.

[0020] Optionally, the conveyor rack has an inlet end for the carrier to enter and an outlet end for the carrier to exit, and the outlet end is provided with a static electricity removal device, and the carrier is purged by the static electricity removal device to eliminate static electricity on the carrier.

[0021] Optionally, the plate coating equipment includes: an automatic loading mechanism; a lower reflux conveying mechanism, which is docked with the automatic loading mechanism, and the cleaning device of the carrier as described in the present application is integrated into the lower reflux conveying mechanism; a host control unit, which is respectively communicated with the automatic loading mechanism, the lower reflux conveying mechanism and the cleaning device of the carrier, for realizing control of the cleaning process of the carrier.

[0022] In some embodiments, the carrier cleaning control method is applied to the plate-type coating equipment described in the present application, including:

[0023] Acquiring a current working condition of the carrier board, wherein the current working condition includes the number of coating times and dust deposition state of the carrier board;

[0024] Determining a target cleaning mode for the carrier and a dust removal formula corresponding to the target cleaning mode from a plurality of preset cleaning modes according to the current working condition of the carrier, wherein the dust removal formula is an operating parameter of the plate coating apparatus including at least a cleaning device;

[0025] The carrier plate is cleaned according to the target cleaning mode and the dust removal formula corresponding to the target cleaning mode.

[0026] Optionally, obtaining the current working condition of the carrier board includes:

[0027] Obtaining the number of times the carrier board has been coated using the physical code of the carrier board;

[0028] The dust deposition state of the carrier board is identified by a host control unit according to the dust deposition image corresponding to the carrier board collected by the image sensor.

[0029] Optionally, determining a target cleaning mode of the carrier plate and a dust removal formula corresponding to the target cleaning mode from a plurality of preset cleaning modes according to the current working condition of the carrier plate includes:

[0030] A carrier cleaning model is trained based on statistically obtained carrier cleaning data, wherein the carrier cleaning data includes the number of coatings, the amount of dust, the corresponding cleaning mode, and the suction force of the brush;

[0031] The current working condition of the carrier plate is identified through the carrier plate cleaning model and matched from a plurality of preset cleaning modes, and a target cleaning mode obtained after matching and a dust removal formula corresponding to the target cleaning mode are output.

[0032] Optionally, the cleaning mode includes an ignore mode, a simple cleaning mode, a normal cleaning mode and a deep cleaning mode, wherein, when matched, the number of coating times and the dust deposition state of the carrier board are positively correlated with the level of the cleaning mode.

[0033] The carrier cleaning device, plate coating equipment, and carrier cleaning control method provided by the embodiments of the present disclosure can achieve the following technical effects:

[0034] The cleaning device of the present application uses a first cleaning section installed on the conveyor frame to simultaneously brush and vacuum the inner surfaces of the guide grooves on both sides of the carrier while conveying the carrier, thereby providing targeted cleaning of difficult-to-clean spots on the carrier, significantly reducing the amount of dust generated during the coating process. Simultaneously, a second cleaning section installed on the conveyor frame simultaneously brushes and vacuums the upper and lower surfaces of the carrier while the first cleaning section is conveying the carrier, significantly improving the cleaning effect compared to a cleaning method that first brushes and then vacuums.

[0035] In addition, the cleaning control method of the present application automatically matches the target cleaning mode of the carrier and the dust removal formula corresponding to the target cleaning mode by matching the number of coating times and dust deposition status of the carrier. The dust removal formula is the working parameter of the plate coating equipment, including at least the cleaning device, to achieve flexible configuration of the cleaning method of the carrier, thereby extending the maintenance and cleaning cycle of the carrier and reducing the cost of use.

[0036] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] One or more embodiments are exemplarily described by corresponding drawings. These exemplary descriptions and drawings do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation. In addition,

[0038] Figure 1 This is a schematic diagram of a cleaning device for a carrier provided by an embodiment of the present disclosure. Figure 1 ;

[0039] Figure 2 This is a partial structural diagram of a roller brush provided by an embodiment of the present disclosure;

[0040] Figure 3 This is a side view of a cleaning device for a carrier provided by an embodiment of the present disclosure. Figure 1 ;

[0041] Figure 4 This is a side view of a cleaning device for a carrier provided by an embodiment of the present disclosure. Figure 2 ;

[0042] Figure 5 Schematic diagram of the structure of a position adjustment hole provided by an embodiment of the present disclosure;

[0043] Figure 6 This is a schematic diagram of the structure of a roller brush provided by the embodiment of the present disclosure. Figure 1 ;

[0044] Figure 7 yes Figure 6 Schematic diagram of the cross section at AA in the middle;

[0045] Figure 8 This is a schematic diagram of a cleaning device for a carrier provided by an embodiment of the present disclosure. Figure 2 ;

[0046] Figure 9 This is a side view of a cleaning device for a carrier provided by an embodiment of the present disclosure. Figure 3 ;

[0047] Figure 10 1 is a schematic structural diagram of a roller brush provided by an embodiment of the present disclosure;

[0048] Figure 11 yes Figure 10 Schematic diagram of the cross section at the middle BB;

[0049] Figure 12 is a schematic structural diagram of another roller brush provided by an embodiment of the present disclosure;

[0050] Figure 13 yes Figure 12 Schematic cross-section at CC;

[0051] Figure 14 is a schematic structural diagram of another cleaning device for a carrier provided by an embodiment of the present disclosure;

[0052] Figure 15 is a side view of another cleaning device for a carrier provided by an embodiment of the present disclosure;

[0053] Figure 16 This is a schematic structural diagram of the connection between the cleaning roller unit and the guide groove provided by an embodiment of the present disclosure;

[0054] Figure 17 is a schematic structural diagram of another cleaning device for a carrier provided by an embodiment of the present disclosure;

[0055] Figure 18 This is a flow chart of a carrier cleaning control method provided by an embodiment of the present disclosure.

[0056] Reference numerals:

[0057] 100 - carrier plate; 101 - guide groove; 102 - wafer placement hole; 10 - conveyor rack; 11 - position adjustment hole; 12 - first drive device; 13 - second drive device; 14 - transmission device; 141 - transmission wheel; 142 - transmission belt; 15 - inlet port; 16 - outlet port; 161 - static electricity removal structure; 20 - roller assembly; 210 - conveyor roller unit; 220 - cleaning roller unit; 211 - roller; 2111 - axle ;2112-wheel body;2113-second negative pressure chamber;2114-second rotating joint;212-second adsorption area;2121-second adsorption port;213-second bristles;30-dust suction roller brush assembly;31-first roller brush group;32-second roller brush group;40-roller brush;41-roller shaft;42-first bristles;43-first adsorption area;431-first adsorption port;44-rotating seat;45-first negative pressure chamber;46-first rotating joint. DETAILED DESCRIPTION

[0058] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0059] In the description and claims of the embodiments of the present disclosure, as well as in the accompanying drawings, the terms "first," "second," and the like are used to distinguish similar items and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate to describe the embodiments of the present disclosure herein. In addition, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0060] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to having a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0061] Furthermore, the terms "disposed," "connected," and "fixed" should be interpreted broadly. For example, "connected" can mean a fixed connection, a removable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or an internal connection between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in the embodiments of this disclosure based on the specific circumstances.

[0062] Unless otherwise stated, the term "plurality" means two or more.

[0063] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B means: A or B.

[0064] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0065] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other.

[0066] At this stage, thin films produced by physical vapor deposition (PVD) equipment can be used in various fields. For example, metal films on materials, coatings on architectural glass, reflective coatings on polymers, magnetic films for storage media, transparent conductive films deposited on glass and flexible meshes, and wear-resistant coatings can be produced. In addition, other thin films can also be produced, such as tin-doped indium oxide (ITO) thin films, indium zinc oxide (IZO) thin films, and vertical target tin oxide (VTTO) thin films.

[0067] Currently, most PVD equipment uses vacuum evaporation, magnetron sputtering, or ion plating. Regardless of the coating method, a large amount of dust is inevitably generated. This dust not only affects the coating quality of the next batch of silicon wafers but can also cause problems in subsequent processes. For example, during the printing process, screen popping, screen breakage, and other printing defects can occur.

[0068] During PVD coating, electrons, under the influence of an electric field, collide with argon atoms within the coating chamber as they fly toward the silicon wafer, ionizing them to produce positive argon ions and new electrons. These electrons fly toward the silicon wafer, where the positive argon ions are accelerated by the electric field toward the cathode target. They bombard the target surface with high energy, causing sputtering and releasing a large number of sputtered particles. Neutral target atoms or molecules deposit on the silicon wafer to form a thin film. The generated secondary electrons, influenced by the electric and magnetic fields, drift along the direction of the cross product of the electric and magnetic fields, their trajectory resembling a cycloid. In a toroidal magnetic field, the electrons follow a cycloid-like circular motion on the cathode target surface, becoming trapped in a plasma region near the cathode target surface. Within this plasma, they ionize a large number of positive argon ions, which bombard the cathode target, achieving a high deposition rate. As the number of collisions increases, the secondary electrons deplete their energy, gradually moving away from the cathode target surface and ultimately depositing on the silicon wafer under the influence of the electric field. Currently, the vast majority of PVD processes used in heterojunction cell production lines utilize dual rotating targets, sputtering the front side of the cell first and then the back side. This not only reduces equipment hardware costs but also increases the sustainability of silicon wafer coating.

[0069] Furthermore, during the production of solar cells using plate-type PVD coating equipment, the substrate carrying the silicon wafers enters the PVD chamber for ITO or other thin film deposition. The surface cleanliness of the substrate affects the quality of the coating on the wafers. Therefore, when the coating material deposits to a certain thickness in the PVD chamber and on the substrate surface, a large amount of dust will adhere to the substrate surface, necessitating cleaning. Existing substrates, even when regularly cleaned outside the PVD chamber using sandblasting or chemical etching, still severely impact product yield and efficiency. This also requires frequent replacement of substrates to mitigate the impact of the production rhythm.

[0070] The PVD process in the related art is designed for sputtering under high pressure. Sputtering uses low voltage and low pressure, which produces a small number of ions, low sputtering efficiency, and slow deposition rate, which indirectly leads to low equipment production capacity. Increasing production capacity cannot simply increase the sputtering power, because the temperature of the silicon wafer will rise significantly, which will lead to defective products or low efficiency, but more ions can be produced. After the gas is ionized, the gas ions fly toward the target material connected to the cathode under the action of the electric field, and a small number of electrons fly to the grounded wall cavity, silicon wafer and carrier (including the carrier's sputtering area). Moreover, the probability of collision between the target atoms and the gas molecules in the process of flying toward the substrate is also greatly increased, and thus they are scattered to the cavity and carrier of the entire sputtering area, including the carrier's sputtering area.

[0071] To increase the capacity of individual PVD coating machines and reduce hardware investment, existing PVD coating equipment manufacturers design large carriers to accommodate a greater number of silicon wafers. These carriers are then sputtered simultaneously on both the front and back sides of the wafers. During the coating process, the hollowed-out PVD carriers also deposit a significant amount of target material, inevitably resulting in a significant amount of the same thin film material as the wafers. Furthermore, as the carriers repeatedly receive new wafers and run through multiple batches, they become coated with a certain thickness of film. This, coupled with friction from the transmission contact, can easily cause film shedding and powder loss.

[0072] In order to achieve large production capacity, a large-area carrier has a certain area of ​​​​splashing area. When the deposition in the splashing area reaches a certain thickness, powder is prone to falling. If there is contact with the transmission wheel or friction with the support wheel, the dust generation is aggravated and falls into the inlet and outlet chambers of the plate PVD (the inlet and outlet chambers use atmosphere or N2 for high-speed air breaking, which will raise a certain amount of thin film dust and scatter it in the corners of the inlet and outlet chambers and on the carrier or silicon wafer). When the PVD carrier is deposited to a sufficient thickness, dust falling and sparking incidents often occur in the process chamber. This affects the stability of the electrode printing in the next process (for example, screen cracking, fine grid breakage, pitting or black spots, etc.) and the efficiency degradation of the battery cell, resulting in a yield loss of 1%-2%.

[0073] At the same time, there is a lot of dust on the upper and lower surfaces of the carrier and the inside of the C-shaped steel, which leads to frequent offline maintenance of the carrier. This not only has high cleaning costs and affects the continuous operation of the equipment, but is also not conducive to reducing the equipment operating costs of a single photovoltaic PVD machine.

[0074] Therefore, it is necessary to solve the problem of simultaneously coating both sides of the PVD hollow substrate and ensure that the dust is controlled to a certain amount as much as possible within a substrate cleaning cycle to reduce the chance of sparks during sputtering and dust falling on the silicon wafer.

[0075] To remove film and dust from carriers, various solutions are available in the related art. For example, carriers with severe dust shedding can be cleaned and blown offline. Another approach is to use a roller brush or scouring pad for cleaning, and then vacuum it out using a vacuum system. These solutions can effectively remove film and dust to a certain extent, but they may require equipment downtime for maintenance. Furthermore, after a period of use, the roller brush may become clogged with dust, making it difficult to remove. This reduces the brush's cleaning ability and can even contaminate new carriers or the conveyor system, affecting the carrier's surface cleanliness and, in turn, the coating quality of the silicon wafers.

[0076] However, these technologies are unable to remove dust from the interior of the C-shaped steel on both sides of the substrate, where the most dust is generated. They are unable to significantly address the reduced PVD yield and post-printing yield caused by dust, nor can they guarantee that the substrate dust level is within an acceptable range within a substrate cleaning cycle, much less extend the substrate's lifespan (typically 800 cycles; increasing the number of cycles can reduce the equipment hardware investment as a percentage of the non-silicon cost per watt of the heterojunction cell). Furthermore, the roller brush used for indiscriminate substrate cleaning (i.e., the same cleaning force and frequency) wastes equipment electrical costs, may increase the cost of equipment consumables, and may lead to frequent brush replacement within a short period of time, causing equipment failure and downtime. Therefore, when substrate dust accumulates or the coating thickness reaches a certain level, the substrate will affect the efficiency of the cell and will need to be taken offline for maintenance.

[0077] In response to the dust problem generated by PVD equipment, the present disclosure provides a cleaning device for a carrier, which can effectively remove the dust on the carrier to ensure the surface cleanliness of the carrier, thereby ensuring the coating quality of the silicon wafer. Figure 1 、 Figure 16 and Figure 17 As shown, guide grooves 101 of C-shaped steel structures are provided on both sides of the carrier 100. The cleaning device of the present application includes a conveyor frame 10, a first cleaning section, and a second cleaning section. The conveyor frame 10 is composed of a plurality of cross beams, vertical beams, and reinforcing beams that are mutually constructed and have conveying and cleaning functions, and a movable space capable of passing the carrier 100 is constructed therein. The first cleaning section is provided on the conveyor frame 10, and is used to simultaneously brush and vacuum the inner surface of the guide groove 101 while conveying the carrier 100. The second cleaning section is provided on the conveyor frame 10, and is used to simultaneously brush and vacuum the upper and lower surfaces of the carrier 100 while the first cleaning section conveys the carrier 100.

[0078] The carrier cleaning device provided by the disclosed embodiment utilizes a first cleaning section disposed on a conveyor frame to simultaneously brush and vacuum the inner surfaces of the guide grooves on both sides of the carrier while conveying the carrier. This allows for targeted cleaning of difficult-to-clean areas of the carrier, significantly reducing bulk dust buildup during the coating process. Simultaneously, a second cleaning section, disposed on the conveyor frame, simultaneously brushes and vacuums the upper and lower surfaces of the carrier while the carrier is being conveyed by the first cleaning section, significantly improving cleaning effectiveness compared to a brush-first, vacuum-later cleaning method.

[0079] In one embodiment of the present application, Figure 1As shown, the first cleaning unit of the present application includes a plurality of roller assemblies 20 for rolling in cooperation with the guide groove 101 to convey the carrier 100. The roller assemblies 20 are used to simultaneously brush and vacuum the inner surface of the guide groove 101. Furthermore, the second cleaning unit of the present application includes a plurality of dust collection roller brush assemblies 30 staggeredly arranged on the upper and lower sides of the carrier 100. The dust collection roller brush assemblies 30 are used to simultaneously brush and vacuum the upper and lower surfaces of the carrier 100.

[0080] In the above embodiment, combined with Figure 2 As shown, the dust collection roller brush assembly of the present application includes one or more roller brushes 40, each of which includes a roller shaft, first bristles disposed on the roller shaft, and a first suction area. During the process of conveying the carrier plate 100 by the first cleaning section, the roller shaft rotates to cause the first brush to rotate and sweep dust on the carrier plate 100, and the first suction area absorbs dust from the first bristles and the carrier plate 100.

[0081] When the carrier 100 is in contact with the roller brush 40, the rotation of the roller 41 causes the first bristles 42 to sweep dust from the carrier surface. Simultaneously, the first adsorption area 43 possesses a certain adsorption capacity, allowing it to absorb some of the dust on the carrier surface. This combination of the first bristles 42 sweeping and the first adsorption area 43 adsorbing dust provides a better cleaning effect than a solution that only sweeps or only adsorbs dust. Furthermore, since the first adsorption area 43 is also located on the roller 41, it can also absorb dust adhering to the first bristles 42, thereby ensuring the cleaning effect of the first bristles 42.

[0082] In magnetron sputtering coating, the coating space can be either high-pressure or low-pressure. Under low-pressure conditions, the number of ions generated by sputtering is small, resulting in low sputtering efficiency and slow deposition rate, which in turn affects equipment production capacity.

[0083] High pressure increases the number of sputtering ions, improving sputtering efficiency. However, this significantly increases the temperature of the silicon wafer, impacting product yield. Simultaneously, the gas ions, under the influence of the electric field, fly toward the target, while a small number of electrons fly toward the grounded cavity walls, silicon wafer, and substrate. Furthermore, as target atoms fly toward the silicon wafer, the probability of collision with gas molecules increases, causing them to be scattered throughout the sputtering cavity and substrate, including the substrate's co-sputtering area.

[0084] Therefore, to increase equipment production capacity and reduce hardware investment, carriers are designed to be as large as possible to accommodate a greater number of silicon wafers. Sputtering is performed simultaneously on both the front and back sides of the wafers. This results in thin film deposition on both the front and back sides of the carrier. With repeated use, the entire carrier is coated with a certain thickness of film. However, due to transmission contact friction, the film can easily fall off, generating dust.

[0085] Optionally, combined Figure 3 As shown, a portion of the plurality of roller brushes 40 is positioned above the carrier plate 100, forming a first roller brush group 31. Another portion of the plurality of roller brushes 40 is positioned below the carrier plate 100, forming a second roller brush group 32. In this manner, the cleaning device of the present application can simultaneously rotate the first and second roller brush groups 31, 32 to sweep and absorb dust from both sides of the carrier plate. This allows dust to be cleaned simultaneously from both sides of the carrier plate, resulting in a more thorough cleaning and improved cleaning efficiency.

[0086] Optionally, combined Figure 4 As shown, a portion of the multiple roller brushes 40 is positioned above the crossbeam of the conveyor frame, forming a first roller brush group 31. This first roller brush group 31 cleans dust from above the carrier plate. Another portion of the multiple roller brushes 40 is positioned below the crossbeam of the conveyor frame, forming a second roller brush group 32. This second roller brush group 32 cleans dust from below the carrier plate. This allows dust to be cleaned simultaneously on both sides of the carrier plate, achieving a more thorough cleaning and improving cleaning efficiency.

[0087] In related technologies, when silicon wafers of solar cells such as heterojunction cells (HJT), back-contact crystalline silicon heterojunction solar cells (HBC), perovskite solar cells (PSC) or high-efficiency top-contact back-contact cells (HTBC) are coated by PVD equipment, the carrier carries the silicon wafers into the coating chamber for ITO thin film deposition or other thin film deposition. In order to increase the production capacity of the equipment, the carrier is set to a hollow carrier. Combined with Figure 14 and Figure 17 As shown, a plurality of silicon wafer placement holes 102 are provided on the carrier plate 100. In this way, the front and back sides of the silicon wafer can be sputtered simultaneously.

[0088] In a practical application of this application, Figure 3 and Figure 4 As shown, when the carrier plate is a hollow carrier plate, the roller brushes 40 in the first roller brush group 31 and the roller brushes 40 in the second roller brush group 32 of the present application are horizontally staggered.

[0089] Correspondingly, the first roller brush assembly 31 of the present application is provided with multiple roller brushes 40 at a first predetermined spacing above the conveying area 20. The second roller brush assembly 32 is provided with multiple roller brushes 40 at a second predetermined spacing below the conveying area 20. Thus, when the roller brushes 40 are used to clean the carrier plate, the roller brushes 40 of the first roller brush assembly 31 and the roller brushes 40 of the second roller brush assembly 32 do not contact each other, thereby preventing the two roller brushes 40 from contacting and interfering with each other in the horizontal direction.

[0090] Optionally, the first set spacing is greater than the radius of the roller brush, and the second set spacing is greater than the radius of the roller brush.

[0091] Correspondingly, the roller brushes 40 in the first roller brush set 31 and the roller brushes 40 in the second roller brush set 32 ​​are arranged horizontally in an interlaced manner, that is, a roller brush 40 of the second roller brush set 32 ​​is arranged between the two roller brushes 40 of the first roller brush set 31. In this way, when the roller brushes 40 are used to clean the carrier plate, the roller brushes 40 of the first roller brush set 31 will not contact the roller brushes of the second roller brush set 32 ​​through the silicon wafer placement hole 102, thereby preventing the two roller brushes 40 from contacting and affecting each other in the vertical direction.

[0092] Optionally, the length of the roller brushes 40 in the first roller brush group 31 of the present application is greater than or equal to the length of the carrier plate. The length of the roller brushes 40 in the second roller brush group 32 is greater than or equal to the length of the carrier plate.

[0093] In another practical application of this application, combined with Figure 3 and Figure 4 As shown, when the carrier plate is a non-hollow carrier plate, the roller brushes 40 in the first roller brush group 31 of the present application and the roller brushes 40 in the second roller brush group 32 are arranged vertically opposite to each other or horizontally staggered.

[0094] Optionally, since the carrier plate is non-hollow, that is, in the vertical direction, the roller brushes 40 in the first roller brush group 31 of the present application and the roller brushes 40 in the second roller brush group 32 do not affect each other. Therefore, the roller brushes 40 in the first roller brush group 31 and the roller brushes 40 in the second roller brush group 32 can be arranged vertically opposite each other or horizontally staggered.

[0095] It should be noted that, on the one hand, a large-area carrier has a certain area of ​​​​splashing area. When the deposition in the splashing area reaches a certain thickness, dust is prone to falling. Among them, if there is transmission contact or support friction, the falling dust may drift into the wafer inlet and outlet chambers. On the other hand, since the wafer inlet and outlet chambers also use atmospheric air or nitrogen for high-speed air breaking, it will aggravate the dust scattering in the corners of the wafer inlet and outlet chambers, as well as on the carrier or silicon wafer. When a certain thickness of thin film is deposited on the carrier, it may cause dust to fall or spark in the coating chamber, thereby affecting the coating quality of the silicon wafer.

[0096] In one embodiment of the present application, Figure 5 As shown, the conveyor frame 10 of the present application is provided with a plurality of position adjustment holes 11 for mounting the roller brush 40. The roller brush 40 can be limitedly moved on the position adjustment holes 11 to adjust the position of the roller brush 40. In this way, the distance between the roller brush 40 and the carrier plate can be effectively adjusted, thereby improving the cleaning effect.

[0097] In the above embodiment, a plurality of opposing connection seats are provided on the horizontal or vertical beams of the conveyor frame 10. Each connection seat has a position adjustment hole 11, and both ends of the roller brush 40 are movably connected to the position adjustment hole 11. Thus, by limiting the movement of the roller brush 40 in the position adjustment hole 11, the position of the roller brush 40 can be adjusted. Furthermore, when cleaning the carrier plate, the distance between the roller brush 40 and the carrier plate can be adjusted to adjust the contact force and contact area between the first bristles 42 and the carrier plate.

[0098] Because the first bristles 42 of the roller brush 40 need to contact the carrier plate, after using the roller brush 40 for a period of time, the first bristles 42 may become bent, resulting in the first bristles 42 being unable to contact the carrier plate when the roller brush 40 is at a first distance from the carrier plate. In the above embodiment, the roller brush 40 is limited in movement within the position adjustment hole 11 to shorten the distance between the roller brush 40 and the carrier plate, thereby allowing the first bristles 42 to contact the carrier plate and thereby clean the carrier plate.

[0099] Optionally, by limiting the movement of the roller brush 40 on the position adjustment hole 11, the cleaning force of the first bristles 42 on the carrier plate can be achieved, so that the first bristles 42 can be ensured to be tight enough so that they are not too tight in the early use (over-cleaning) and not too loose in the later use (insufficient cleaning), thereby extending the use cycle.

[0100] Optionally, in order to allow the roller brush 40 to move within a limited position on the position adjustment hole 11, a corresponding limiting structure, such as a limiting groove, may be provided in the position adjustment hole 11. In this way, the roller brush 40 can be limited at a target position.

[0101] In order to further adjust the position of the roller brush 40 , in one embodiment of the present application, the position adjustment hole 11 is one of a vertical through hole, a horizontal through hole, a cross through hole and a 'M'-shaped through hole.

[0102] In the above embodiment, when the position adjustment hole 11 is a vertical through hole, the roller brush 40 can move up and down in the vertical direction, thereby adjusting the distance between the roller brush 40 and the carrier plate.

[0103] Optionally, when the position adjustment hole 11 is a horizontal through hole, the roller brush 40 can move left and right in the horizontal direction, thereby adjusting the distance between adjacent roller brushes 40 .

[0104] Optionally, when the position adjustment hole 11 is a cross-shaped through hole, the roller brush 40 can move up and down in the vertical direction and left and right in the horizontal direction, thereby adjusting the distance between the roller brush 40 and the carrier plate and the distance between adjacent roller brushes 40.

[0105] Optionally, when the position adjustment hole 11 is a M-shaped through hole, the roller brush 40 can move up and down in the vertical direction, left and right in the horizontal direction, and tilted, thereby further adjusting the distance between the roller brush 40 and the carrier plate, and the distance between adjacent roller brushes 40.

[0106] In the above embodiment, in addition to the above structure, the structure of the position adjustment hole 11 can also be used to adjust the position of the roller brush 40, which is not limited here.

[0107] In one embodiment of the present application, Figures 4 to 7 As shown, the roller brush 40 further includes a rotating seat 44 . Both ends of the roller shaft 41 are rotatably disposed on the rotating seat 44 . The rotating seat 44 is movably disposed in the position adjustment hole 11 to adjust the position of the roller brush 40 .

[0108] Optionally, the roller brush 40 includes rotating seats 44 disposed at both ends of the roller shaft 41 of the roller brush 40. The roller shaft 41 is rotatably connected to the rotating seats 44, enabling the roller brush 40 to rotate. Specifically, a rotating element is fixedly disposed within the rotating seat 44, rotatably connected to both ends of the roller shaft 41. Optionally, the rotating element is a bearing, and the rotating seat 44 is a bearing seat. The inner ring of the bearing is fixedly connected to both ends of the roller shaft 41, and the outer ring of the bearing is fixedly connected to the rotating seat 44.

[0109] Optionally, a snap-fit ​​groove that is snap-fitted to the position adjustment hole 11 may be provided on the rotating seat 44, and the snap-fit ​​groove is slidably connected to the edge of the position adjustment hole 11. In this way, the rotating seat 44 can slide smoothly on the position adjustment hole 11.

[0110] On this basis, in the above embodiment, combined with Figure 5As shown, the conveyor frame 10 further includes a first driving device 12 connected to the rotating base 44 to drive the rotating base 44 to move within the position adjustment hole 11. In this way, the first driving device 12 controls the movement of the rotating base 44 to enable the roller brush 40 to move within the position adjustment hole 11.

[0111] Optionally, a plurality of first driving devices 12 are provided to match the number of the rotating seats 44 . When the position of the roller brush 40 is adjusted, the two first driving devices 12 of the same roller brush 40 synchronously move the rotating seats 44 at both ends.

[0112] Optionally, the first driving device 12 is disposed on a horizontal beam or a vertical beam of the conveyor frame 10 , and a driving end of the first driving device 12 is fixedly connected to the rotating seat 44 . In this way, the rotating seat 44 can be driven to move on the position adjustment hole 11 .

[0113] In the above embodiment, when the roller brush 40 moves to the target position, the first driving device 12 stops and is locked. In order to further ensure the position of the rotating base 44 on the position adjustment hole 11, the rotating base 44 and the position adjustment hole 11 can be further connected by a fixing member.

[0114] In one embodiment of the present application, the first drive device 12 includes a drive cylinder. Specifically, the telescopic end of the drive cylinder is fixedly connected to the rotating seat 44. If the position adjustment hole 11 is a vertical through hole, the drive cylinder is mounted on the crossbeam of the conveyor frame 10, and the telescopic end of the drive cylinder is vertically extended and retracted to control the position of the rotating seat 44 on the position adjustment hole 11.

[0115] Optionally, when the position adjustment hole 11 is a horizontal through hole, the driving cylinder is set on the vertical beam of the conveying frame 10, and the telescopic end of the driving cylinder is horizontally extended to control the position of the rotating seat 44 on the position adjustment hole 11.

[0116] Optionally, when the position adjustment hole 11 is a cross-shaped through hole or a 'P'-shaped through hole, the first drive device 12 includes multiple drive cylinders, which are used in conjunction to further adjust the position of the rotating seat 44 on the position adjustment hole 11. Here, when the first drive device 12 includes multiple drive cylinders, the telescopic ends of the drive cylinders can be detachably connected to the rotating seat 44. In this way, when one of the drive cylinders is needed, the telescopic end of the drive cylinder is connected to the rotating seat 44.

[0117] In one embodiment of the present application, Figure 6 and Figure 7As shown, a first negative pressure chamber 45 is constructed inside the roller 41 and communicates with the first adsorption area 43. The roller brush 40 also includes a first rotary joint 46, wherein the first rotary joint 46 is provided at the first end side of the roller 41, and the negative pressure device is communicated with the first negative pressure chamber 45 through the first rotary joint 46.

[0118] Optionally, first adsorption zone 43 can adsorb dust. Specifically, this is achieved by a first negative pressure chamber 45 within roller 41. Roller 41 is hollow, and a connection port is provided at the first end of roller 41 to communicate with first negative pressure chamber 45. This connection port is connected to a negative pressure device. Thus, vacuuming the roller 41 through the negative pressure device reduces the air pressure within the cavity, thereby forming first negative pressure chamber 45.

[0119] In the above embodiment, because roller 41 needs to rotate, a first rotating joint 46 is also provided on the first end side of roller 41. The first end of first rotating joint 46 is fixedly connected to the connection port of roller 41, and the second end of first rotating joint 46 is connected to the negative pressure device. In this way, the negative pressure device can also perform vacuuming during the rotation of roller 41. Optionally, first rotating joint 46 is a rotary joint.

[0120] In one embodiment of the present application, the first adsorption area 43 includes a first adsorption port 431 formed on the roller 41. Dust enters the first negative pressure chamber 45 through the first adsorption port 431. The first adsorption port 431 is positioned between the first bristles 42, thereby maximizing the adsorption range of the first adsorption area 43.

[0121] Optionally, the first suction opening 431 is an opening formed horizontally and / or vertically on the roller 41. Specifically, the vertical cross-section of the roller 41 is circular, and the first bristles 42 are evenly spaced on the outer surface of the roller 41 at predetermined intervals. The first suction opening 431 is a through-hole structure, and the plurality of first suction openings 431 are evenly spaced between the first bristles 42.

[0122] Optionally, the first suction port 431 is a circular through hole. Optionally, the plurality of circular through holes are evenly arranged in the horizontal direction. Optionally, the plurality of circular through holes are evenly arranged in the vertical direction. Optionally, the plurality of circular through holes are evenly arranged in the horizontal and vertical directions.

[0123] Optionally, the first suction openings 431 are a plurality of long opening structures opened on the roller 41 along the horizontal direction.

[0124] Combine Figure 8 、 Figure 9 and Figure 16As shown, guide grooves are provided on both sides of the carrier, and the carrier is transported by using the guide grooves 101 in conjunction with the roller assembly 20. Here, the roller assembly 20 is provided on the inner side of the conveyor frame 10, that is, on the inner side of the vertical beam or the inner side of the horizontal beam of the conveyor frame 10.

[0125] Specifically, after the carrier enters the conveyor frame 10, each roller assembly 20 rotates and rolls in contact with the guide groove 101, allowing the carrier to move along the rotation direction of the roller assembly 20, thereby conveying the carrier. However, since the carrier has the guide groove 101, dust is also present in the guide groove 101, and the roller brush assembly cannot clean the dust in the guide groove 101, resulting in frequent offline maintenance. This not only increases cleaning costs, affects the continuous operation of the equipment, but also increases the operating costs of the equipment.

[0126] To this end, in one embodiment of the present application, Figures 8 to 16 As shown, the roller assembly of the present application includes a first type of roller and a second type of roller, wherein the diameter of the first type of roller is smaller than that of the second type of roller. The first type of roller is provided with a second suction area 212 and a second bristle 213. The first type of roller rotates to cause the second bristle 213 to rotate and sweep dust from the inner surface of the guide groove 101, and the second suction area 212 absorbs dust from the second bristle 213 and the inner surface of the guide groove. The second type of roller is provided with a second suction area 212. The second type of roller rotates to cause the second type of roller to roll in contact with the guide groove 101 to convey the carrier 100, and the second suction area 212 absorbs dust from the inner surface of the guide groove 101. In this way, dust in the guide groove can be effectively removed.

[0127] In the above embodiment, the second type of roller can transport the carrier 100 while the first type of roller can clean the guide groove 101. The outer surface of the second type of roller is provided with a second adsorption area 212, so that the dust in the guide groove 101 can be effectively adsorbed during the process of transporting the carrier 100.

[0128] Optionally, the second type of rollers and the first type of rollers respectively include multiple groups of rollers 211 arranged in pairs, so that not only the stability of transmission can be ensured, but also the guide groove 101 can be effectively cleaned.

[0129] Optionally, the outer surface of the first type roller is provided with a second adsorption area 212. In this way, during the process of conveying the carrier plate, the first type roller can be used in conjunction with the second type roller to further adsorb the dust in the guide groove 101.

[0130] Optionally, the outer surface of the first-type roller is provided with second bristles 213. This effectively removes dust adhering to the guide groove 101 during the transport of the carrier plate. Furthermore, when the first-type roller is provided with the second bristles 213, the diameter of the second-type roller is larger than that of the first-type roller. This prevents the spacing between the first-type roller and the guide groove 101 from being too small, thereby preventing the second bristles 213 from losing their cleaning ability.

[0131] Optionally, the outer surface of the first type roller is provided with a second adsorption area 212 and a second brush 213. In this way, during the process of conveying the carrier, not only can the dust attached to the guide groove 101 be effectively cleaned, but the dust in the guide groove 101 can also be adsorbed.

[0132] In one embodiment of the present application, Figures 10 to 13 As shown, the roller assembly 20 includes a wheel axle 2111, a wheel body 2112, and a second rotary joint 2114. The wheel axle 2111 is rotatably mounted on the conveyor frame 10. The wheel body 2112 is disposed at a first end of the wheel axle 2111. The outer surface of the wheel body 2112 is provided with a second suction area 212 and second bristles 213. When the outer surface of the wheel body 2112 is provided with the second suction area 212, a second negative pressure chamber 2113 communicating with the second suction area 212 is formed within the wheel axle 2111 and the wheel body 2112. The second rotary joint 2114 is disposed at a second end of the wheel axle 2111. The negative pressure device communicates with the second negative pressure chamber 2113 via the second rotary joint 2114.

[0133] Optionally, the second adsorption zone 212 can adsorb dust. Specifically, the second adsorption zone 212 can adsorb dust through the second negative pressure chamber 2113 inside the axle 2111 and the wheel body 2112. Here, the axle 2111 and the wheel body 2112 can be an integral structure, and the wheel body 2112 is rotatably connected to the conveyor frame 10. The interior of the axle 2111 and the wheel body 2112 is a hollow structure. A connection port that communicates with the second negative pressure chamber 2113 is provided on the second end side of the axle 2111, and the connection port is connected to a negative pressure device. In this way, vacuuming by the negative pressure device can reduce the air pressure in the cavity of the axle 2111 and the wheel body 2112, thereby forming the second negative pressure chamber 2113.

[0134] Optionally, because axle 2111 needs to rotate, a second rotary joint 2114 is provided on the second end of axle 2111. The first end of second rotary joint 2114 is fixedly connected to the connection port of axle 2111, and the second end of second rotary joint 2114 is connected to the negative pressure device. This allows the negative pressure device to perform vacuuming while axle 2111 rotates. Optionally, second rotary joint 2114 is a rotary joint.

[0135] Optionally, combined Figures 10 to 13 As shown, the second adsorption zone 212 includes a second adsorption port 2121 formed on the wheel body 2112. Dust enters the second negative pressure chamber 2113 through the second adsorption port 2121. If the wheel body 2112 is provided with second bristles 213, the second adsorption port 2121 is positioned between the second bristles 213, thereby maximizing the adsorption range of the second adsorption zone 212.

[0136] Optionally, the second suction openings 2121 are openings formed horizontally and / or vertically on the wheel body 2112. Specifically, the wheel body 2112 has a circular vertical cross-section, and the second bristles 213 are evenly spaced on the outer surface of the wheel body 2112 at predetermined intervals. The second suction openings 2121 are through-hole structures, and the plurality of second suction openings 2121 are evenly spaced between the second bristles 213.

[0137] Optionally, the second adsorption port 2121 is a circular through hole, and the plurality of circular through holes are evenly arranged in the horizontal direction. Optionally, the plurality of circular through holes are evenly arranged in the vertical direction. Optionally, the plurality of circular through holes are evenly arranged in the horizontal and vertical directions.

[0138] In the embodiments of this application, Figures 8 to 13 As shown, the cleaning device for the carrier plate also includes a second driving device 13, which is arranged on the conveyor frame 10 and is connected to the roller brush 40 of the roller brush area 30 and / or the roller 211 of the roller group 21 through the transmission device 14 to drive each roller brush 40 and / or each roller 211 to rotate.

[0139] Optionally, two second drive devices 13 are provided, one mounted on a horizontal beam or a vertical beam of the conveyor frame 10. The driving end of the second drive device 13 is connected to a transmission device 14, which is connected to each roller brush 40, or to each roller 211, or to each roller brush 40 and each roller 211. In this way, each roller brush 40 and / or each roller 211 can be driven to rotate.

[0140] In conjunction with the above embodiment, the first adsorption area 43 and the second adsorption area 212 can not only absorb dust but also blow air to purge the carrier. This is not limited here and can be adjusted according to the actual working scenario. For example, the first adsorption area 43 of some roller brushes 40 can be used to blow dust, while the first adsorption area 43 of other roller brushes 40 can be used to absorb dust, and the second adsorption area 212 of some rollers 211 can be used to blow dust, while the second adsorption area 212 of other rollers 211 can be used to absorb dust.

[0141] In one embodiment of the present application, Figure 8 and Figure 9As shown, the transmission device 14 includes a transmission wheel 141 and a transmission belt 142. The transmission wheel 141 is arranged at the driving end of the second driving device 13, the second end side of the roller brush 40 and / or the second end side of the roller 211; the transmission belt 142 is connected to each transmission wheel 141, so that the second driving device 13 drives each transmission wheel 141 to rotate through the transmission belt 142.

[0142] Optionally, a transmission wheel 141 is provided on the second end side of the roller brush 40, and the transmission wheel 141 is located outside the rotating seat 44. The transmission belt 142 is connected to the transmission wheel 141 so that the second driving device 13 can drive the roller brush 40 to rotate.

[0143] Optionally, a transmission wheel 141 is provided on the second end side of the roller 211, and the transmission wheel 141 is located inside the second rotating joint 2114. The transmission belt 142 is in transmission connection with the transmission wheel 141, so that the second driving device 13 can drive the roller 211 to rotate.

[0144] Optionally, when the second driving device 13 simultaneously drives the roller brush 40 and the roller 211 to rotate, the inner transmission surface of the transmission belt 142 is connected to the transmission wheel 141 of the roller 211, and the outer transmission surface of the transmission belt 142 is connected to the transmission wheel 141 of the roller brush 40.

[0145] In addition, the roller 211 and the roller brush 40 are arranged at intervals in the horizontal direction to avoid interference between the roller 211 and the roller brush 40 when the position of the roller brush 40 is adjusted.

[0146] Optionally, the second driving device 13 is a driving motor.

[0147] In some embodiments, combined Figure 14 and Figure 15 As shown, the conveyor frame 10 has an inlet end 15 for the carriers to enter and an outlet end 16 for the carriers to exit. The outlet end 16 is provided with a static electricity removal structure 161, which is used to purge the carriers to eliminate static electricity on the carriers.

[0148] Optionally, the static elimination structure 161 includes multiple sets of ionizing air rods, which are positioned at the outlet 16 of the conveyor frame 10. The ionizing air rods ionize the air to form ions, neutralizing the charge generated on the carrier surface and achieving the purpose of eliminating static electricity. Furthermore, the high-speed plasma air generated by the ionizing air rods can further remove dust.

[0149] Optionally, the first bristles 42 and the second bristles 213 are both made of elastic fiber material. In this way, not only the cleaning ability of the bristles is guaranteed, but also the service life of the bristles can be guaranteed, and the bristles can be prevented from damaging the carrier plate.

[0150] Optionally, the elastic fiber material includes polyester fiber and composite fiber, etc., which is not limited here.

[0151] In some specific embodiments, the first bristles 42 and the second bristles 213 are both made of polybutylene terephthalate (PBT).

[0152] Combine Figure 17 As shown, in some embodiments, in order to further improve working efficiency and cleaning effect, the length of the conveyor frame 10, the number of rollers 211 of the roller group 21 and the number of roller brushes 40 in the roller brush area 30 can be appropriately increased.

[0153] Optionally, in order to facilitate installation and maintenance of the cleaning device, two or more conveying racks 10 may be provided, and the conveying racks 10 are connected in sequence.

[0154] In the embodiment, since the new carrier board is easily destroyed in the coating chamber before being put into the production line, thereby indirectly causing fluctuations in the efficiency of the entire line, the technical solution of the present application can extend the cleaning cycle of the carrier board, thereby effectively reducing the occurrence of the above-mentioned problems.

[0155] At the same time, the embodiment of the present disclosure also provides a plate-type coating equipment, including an automatic loading mechanism, a lower reflux conveying mechanism and a host control unit, wherein the lower reflux conveying mechanism is docked with the automatic loading mechanism, and the carrier cleaning device of the present application is integrated into the lower reflux conveying mechanism, which can save space while reducing the hardware cost of the equipment. The host control unit is respectively communicated with the automatic loading mechanism, the lower reflux conveying mechanism and the carrier cleaning device to realize the control of the cleaning process of the carrier. In this way, the carrier cleaning device of the present application is integrated into the lower reflux conveying mechanism, and ion air knives and N2 purges can be added to other empty positions of the lower reflux conveying mechanism to enhance the cleaning effect.

[0156] In addition, combined Figure 18 As shown, the embodiment of the present disclosure further provides a cleaning control method, which is applied to the plate-type coating equipment of the present application, comprising:

[0157] Step 101: Acquire the current working condition of the carrier board, wherein the current working condition includes the number of coating times and the dust deposition state of the carrier board.

[0158] Step 102: According to the current working condition of the carrier, determine the target cleaning mode of the carrier and the dust removal formula corresponding to the target cleaning mode from multiple preset cleaning modes, wherein the dust removal formula is the working parameter of the plate coating equipment including at least the cleaning device.

[0159] Step 103: Clean the carrier board according to the target cleaning mode and the dust removal formula corresponding to the target cleaning mode.

[0160] In one embodiment of the present application, in step 101, obtaining the current working condition of the carrier board includes:

[0161] The number of times the carrier board has been coated is obtained through the physical code of the carrier board.

[0162] The dust deposition state of the carrier board is identified by the host control unit based on the dust deposition image corresponding to the carrier board collected by the image sensor.

[0163] In one embodiment of the present application, in step 102, a target cleaning mode for the carrier and a dust removal formula corresponding to the target cleaning mode are determined from a plurality of preset cleaning modes according to the current working condition of the carrier, including:

[0164] A carrier cleaning model is trained based on statistically obtained carrier cleaning data, wherein the carrier cleaning data includes the number of coatings, the amount of dust, the corresponding cleaning mode, and the suction force of the brush;

[0165] Through the carrier cleaning model, the current working condition of the carrier is identified and matched from multiple preset cleaning modes, and the target cleaning mode obtained after matching and the dust removal formula corresponding to the target cleaning mode are output.

[0166] In one embodiment of the present application, in step 103, the cleaning mode includes an ignore mode, a simple cleaning mode, a normal cleaning mode and a deep cleaning mode, wherein, when matched, the number of coating times and the dust deposition state of the carrier are positively correlated with the level of the cleaning mode.

[0167] In practical applications, the automatic loading mechanism of the plate coating equipment of the present application can obtain the number of times the carrier plate is coated through the physical code of the current carrier plate, and collect the dust deposition image of the carrier plate through the CCD camera, and transmit the dust deposition image data to the host control unit, such as the host PLC. The host PLC identifies the dust deposition state of the carrier plate, and then decides whether to perform the dust removal action (ignore mode) or determine the dust removal formula corresponding to the carrier plate according to the number of times the carrier plate is coated and the dust deposition state. The dust removal formula can be set on the operation interface of the above-mentioned host PLC. For example, for carrier plates with more than half of the coating times, the cleaning device is controlled in the operation interface to set the corresponding dust removal formula. The dust removal formula can be: 1 / 2 of the cylinder stroke, 60 rpm of the brush rolling speed, 100% of the vacuum suction, and 5kg of the ion air knife pressure. If necessary, a second cleaning can be performed to ensure the effect. In actual applications, the carrier board can usually be used for 1000-1300 runs. The carrier board is generally clean from 0-200 runs and does not need to perform roller brush dust removal. It only needs to be ignored and purged with N2. When the carrier board is used between 200-600 runs, the simple cleaning mode is generally used.

[0168] Furthermore, as shown in Table 1 below, this application utilizes AI technology to train a carrier cleaning model based on statistically generated carrier cleaning data. This allows for automatic matching of the carrier cleaning model to the current operating condition of the carrier, enabling automatic selection of cleaning modes and real-time data updates. By determining the difference in dust levels before and after cleaning, if there is a high level of dust before cleaning, the system selects the deep cleaning mode. Otherwise, the system selects the normal cleaning mode. This prevents each carrier from being cleaned with the same intensity, location, and method, achieving intelligent cleaning, extending the carrier cleaning cycle, and reducing production costs.

[0169] Table 1

[0170]

[0171] In some specific embodiments, when the carrier is used in the first cycle, the ignore mode is executed and the carrier is purged with nitrogen. When the carrier is used in the second cycle, the simple cleaning mode is executed, with the rotation speed of the roller brush being 20 r / min, the rotation speed of the roller being 20 r / min, the adsorption pressure being 30 N, and the purge pressure being 30 N. When the carrier is used in the third cycle, the normal cleaning mode is executed, with the rotation speed of the roller brush being 40 r / min, the rotation speed of the roller being 40 r / min, the adsorption pressure being 50 N, the purge pressure being 50 N, and the vertical roller brush spacing being reduced by 1 cm. When the carrier is used in the fourth cycle, the deep cleaning mode is executed, with the rotation speed of the roller brush being 60 r / min, the rotation speed of the roller being 60 r / min, the adsorption pressure being 70 N, the purge pressure being 70 N, and the vertical roller brush spacing being reduced by 2 cm. Here, the number of times used in the first cycle is T1, the number of times used in the second cycle is T2, the number of times used in the third cycle is T3, and the number of times used in the fourth cycle is T4, where T4>T3>T2>T1.

[0172] By adopting the cleaning control method provided in the embodiment of the present disclosure, the target cleaning mode of the carrier and the dust removal formula corresponding to the target cleaning mode are automatically matched by matching the number of coating times and the dust deposition state of the carrier. The dust removal formula is the working parameter of the plate coating equipment, including at least the cleaning device, so as to realize flexible configuration of the cleaning method of the carrier, thereby extending the maintenance and cleaning cycle of the carrier and reducing the use cost.

[0173] As can be seen, first, because the related art requires the carriers to be cleaned separately, the carrier turnover time is long, resulting in the production line needing to be equipped with a large number of carriers for turnover. However, after adopting the cleaning device of the present application, the number of carriers configured can be reduced by half, thereby greatly reducing the initial investment cost.

[0174] Secondly, since the carrier board in the related art needs to be cleaned separately after running 80 runs, it requires high transportation and cleaning costs. The use of the cleaning device of the present application can achieve personalized and efficient cleaning, significantly improving the service life of the carrier board. Specifically, before the use of the cleaning device of the present application, the carrier board needed to be taken offline after 800 runs of online use, and then packaged and shipped to a third party for chemical corrosion, drying and maintenance. Not only did the carrier board need to be rotated, but the carrier board shipped out also needed to use chemical liquids, causing certain pollution and additional costs. After adopting the cleaning device of the present application, the life of the carrier board can be increased from the original 800 runs to 1600 runs.

[0175] Third, when a new carrier is put into the production line, it is easy to destroy the water vapor value in the chamber, which indirectly causes fluctuations in the efficiency of the entire line. In this regard, the cleaning device of the present application can extend the carrier cleaning cycle, thereby avoiding the above phenomenon.

[0176] Fourth, after the amount of dust on the carrier is reduced, the yield of PVD in this process can be significantly improved. For example, the sparking anomaly drops sharply, and the defective rate of silicon wafers caused by sparking drops from 0.3% to 0.1%.

[0177] Fifth, the use of the cleaning device of the present application can significantly improve the yield rate of the subsequent printing process. If dust falls onto the silicon wafer before printing, it is easy to cause the screen to explode during screen printing, causing the printing production line to stop and replace the screen (which invisibly shortens the service life of the screen. The normal screen is 50,000-60,000, and there is a lot of dust, which causes the average life of the screen to be reduced by 60%, and the non-silicon cost of the screen is directly doubled). After the dust on the carrier is efficiently cleaned, the life of the screen can be increased from 50,000-80,000 / piece to 80,000-100,000 / piece (increasing the number of runs can reduce the non-silicon cost per watt of the heterojunction battery due to production materials).

[0178] Sixth, the brush system of the cleaning device of the present application can be designed to perform differentiated cleaning (ignore mode / simple cleaning mode / normal cleaning mode / deep cleaning mode), so the actual life of the brush is synchronized with the life of the PVD target replacement. This makes it convenient to replace the brush simultaneously when replacing the target, without taking up additional equipment operation time or maintenance time. The service life is twice as long as the dust removal system used by other equipment suppliers. In this regard, in other patents, the carrier dust is prone to new dust pollution during the brushing process. The two sets of brushes of the cleaning device of the present application have a total life of up to six months and need to be replaced once every six months (40 seconds to clean a carrier, a total of 200,000 cleanings in six months. Increasing the number of runs can reduce the proportion of equipment consumables in the non-silicon cost per watt of the heterojunction battery). The degree to which the cylinder clamps the carrier is adjusted according to the number of times the roller brush works to ensure that the carrier dust is completely removed without affecting the carrier transmission, and the service life of the brush can also be extended. For example, during the first 50,000 cleanings, the cylinder stroke is 1 / 3, and during the middle 50,000-100,000 cleanings, the cylinder stroke is 2 / 3. During the 100,000-200,000 cleanings, the cylinder stroke is the bottom.

[0179] In summary, the present application can automatically determine the number of times different carriers are coated, and perform targeted cleaning through pre-set cleaning formulas, and the cleaning frequency and strength of the carrier can be set and adjusted. Efficient and targeted cleaning is carried out for points where the dust on the carrier is difficult to remove (i.e., the transmission contact points of the C-shaped steel), which can greatly reduce the batch dust of the carrier during the coating process. By integrating the system device into the lower return module, no additional space is taken up. By integrating the dust brushing and dust suction into the vacuum brush component, and adding ion air knives and N2 purges to other vacant positions of the corresponding lower return module, similarly, the ion air knives and N2 purges can be prepared according to the number of times different carriers are coated and the dust conditions of the carriers. Targeted cleaning formulas include strength and frequency, as well as ion air knife pressure and flow, thereby further enhancing the cleaning effect.

[0180] After adopting the carrier cleaning device, plate coating equipment and carrier cleaning control method of this application, the single use cycle of the carrier is expected to be extended by 50% of the original 800 runs, or even doubled. During the carrier's use cycle, the amount of dust on the carrier is significantly reduced by 70% compared to the carrier that does not adopt the technical solution of this application. For example, a 600MW plate coating equipment that does not adopt the technical solution of this application needs to be equipped with 17 + 17 carriers to ensure the beat and normal replacement. By adopting the technical solution of this application, it is estimated that 7 to 9 carriers can be released.

[0181] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless expressly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A cleaning device for a carrier plate, characterized in that: Guide grooves are provided on both sides of the carrier plate, and the cleaning device comprises: Conveyor rack, with conveying and cleaning functions; a first cleaning unit, disposed on the conveying frame, for simultaneously brushing and vacuuming the inner surface of the guide groove while conveying the carrier; The second cleaning unit is provided on the conveying frame and is used for simultaneously brushing and sucking dust from the upper and lower surfaces of the carrier plate when the first cleaning unit is conveying the carrier plate.

2. The cleaning device for a carrier plate according to claim 1, characterized in that: The first cleaning portion includes a plurality of roller assemblies for rolling with the guide groove to transport the carrier plate, and the roller assemblies are used to brush and vacuum the inner surface of the guide groove; The second cleaning part includes a plurality of dust collecting roller brush assemblies staggeredly arranged on the upper and lower sides of the carrier plate, and the dust collecting roller brush assemblies are used to collect dust from the upper and lower surfaces of the carrier plate while brushing.

3. The cleaning device for a carrier plate according to claim 2, characterized in that: The dust collection roller brush assembly includes one or more roller brushes, and the roller brush includes a roller shaft and first bristles and a first adsorption area provided on the roller shaft; During the process of the first cleaning part transporting the carrier, the first brush rotates to sweep away the dust on the carrier through the rotation of the roller, and absorbs the dust on the first brush bristles and the carrier through the first absorption area.

4. The cleaning device for a carrier plate according to claim 3, characterized in that: A portion of the plurality of roller brushes is disposed above the carrier plate to form a first roller brush group, and another portion of the plurality of roller brushes is disposed below the carrier plate to form a second roller brush group; The first roller brush group and the second roller brush group rotate simultaneously to sweep and absorb dust on both sides of the carrier plate.

5. The cleaning device for a carrier plate according to claim 3, characterized in that: The conveyor frame is provided with a plurality of position adjustment holes for installing the roller brush, and the roller brush can be limitedly moved on the position adjustment holes to adjust the position of the roller brush.

6. The cleaning device for a carrier plate according to claim 5, characterized in that: The roller brush further includes a rotating seat, on which both ends of the roller shaft are rotatably disposed. The rotating seat is movably disposed in the position adjustment hole to adjust the position of the roller brush.

7. The cleaning device for a carrier plate according to claim 6, characterized in that: The conveying frame further includes a first driving device connected to the rotating seat to drive the rotating seat to perform limited movement in the position adjustment hole.

8. The cleaning device for a carrier plate according to claim 3, characterized in that: The roller is internally provided with a first negative pressure chamber communicating with the first adsorption area; The roller brush further includes a first rotating joint, which is arranged at the first end side of the roller shaft, and the negative pressure device is connected to the first negative pressure chamber through the first rotating joint.

9. The cleaning device for a carrier plate according to claim 2, characterized in that: The roller assembly includes a first type of roller and a second type of roller, wherein the diameter of the first type of roller is smaller than the diameter of the second type of roller; The first type roller is provided with a second adsorption area and second bristles, and the first type roller rotates so that the second bristles rotate to sweep the dust on the inner surface of the guide groove, and the second adsorption area adsorbs the dust on the second bristles and the inner surface of the guide groove; The second type roller is provided with the second adsorption area. The second type roller is rotated to be in rolling connection with the guide groove to transport the carrier plate, and the second adsorption area adsorbs dust on the inner surface of the guide groove.

10. The cleaning device for a carrier plate according to claim 2, characterized in that: The roller assembly comprises: A wheel shaft, rotatably disposed on the conveyor frame; a wheel body, disposed at the first end of the wheel axle, the outer surface of the wheel body being provided with a second adsorption area and second bristles; wherein, when the outer surface of the wheel body is provided with the second adsorption area, a second negative pressure chamber communicating with the second adsorption area is constructed inside the wheel axle and the wheel body; The second rotating joint is arranged on the second end side of the wheel shaft, and the negative pressure device is connected to the second negative pressure chamber through the second rotating joint.

11. The cleaning device for a carrier plate according to claim 2, characterized in that: The conveyor frame also includes a second driving device, which is arranged on the conveyor frame and connected to the dust collection roller brush assembly and / or the roller assembly through a preset transmission device to drive the roller brush of the dust collection roller brush assembly and / or the wheel axle of the roller assembly to rotate.

12. The cleaning device for a carrier plate according to claim 11, characterized in that: The transmission device comprises: a transmission wheel, arranged at a driving end of the second driving device, a second end side of the roller brush and / or a second end side of the roller; A transmission belt is connected to each of the transmission wheels, so that the second driving device drives each of the transmission wheels to rotate through the transmission belt.

13. The cleaning device for a carrier plate according to any one of claims 1 to 12, characterized in that: The conveyor rack has an inlet end for the carrier to enter and an outlet end for the carrier to exit. The outlet end is provided with a static electricity removal device, which is used to purge the carrier to eliminate static electricity on the carrier.

14. A plate-type coating device, characterized in that: include: Automatic loading mechanism; a lower reflux conveying mechanism docked with the automatic loading mechanism, and the carrier cleaning device according to any one of claims 1 to 13 is integrated into the lower reflux conveying mechanism; The host control unit is respectively connected to the automatic loading mechanism, the lower reflux conveying mechanism and the carrier cleaning device for controlling the carrier cleaning process.

15. A cleaning control method, characterized in that: The plate-type coating device according to claim 14 comprises: Acquiring a current working condition of the carrier board, wherein the current working condition includes the number of coating times and dust deposition state of the carrier board; Determining a target cleaning mode for the carrier and a dust removal formula corresponding to the target cleaning mode from a plurality of preset cleaning modes according to the current working condition of the carrier, wherein the dust removal formula is an operating parameter of the plate coating apparatus including at least a cleaning device; The carrier plate is cleaned according to the target cleaning mode and the dust removal formula corresponding to the target cleaning mode.

16. The cleaning control method according to claim 15, characterized in that: The obtaining of the current working condition of the carrier board includes: Obtaining the number of times the carrier board has been coated using the physical code of the carrier board; The dust deposition state of the carrier board is identified by a host control unit according to the dust deposition image corresponding to the carrier board collected by the image sensor.

17. The cleaning control method according to claim 15, characterized in that: The step of determining a target cleaning mode for the carrier plate and a dust removal formula corresponding to the target cleaning mode from a plurality of preset cleaning modes according to the current working condition of the carrier plate includes: A carrier cleaning model is trained based on statistically obtained carrier cleaning data, wherein the carrier cleaning data includes the number of coatings, the amount of dust, the corresponding cleaning mode, and the suction force of the brush; The current working condition of the carrier plate is identified through the carrier plate cleaning model and matched from a plurality of preset cleaning modes, and a target cleaning mode obtained after matching and a dust removal formula corresponding to the target cleaning mode are output.

18. The cleaning control method according to claim 17, characterized in that: The cleaning modes include an ignore mode, a simple cleaning mode, a normal cleaning mode and a deep cleaning mode, wherein, when matched, the number of coating times and the dust deposition state of the carrier board are positively correlated with the level of the cleaning mode.

Images