Semiconductor device chip turnover welding assembly

Abstract

The invention discloses a semiconductor device chip turnover welding assembly which comprises a working platform, a plurality of first C-shaped boxes are arranged on the working platform side by side, a positioning assembly is arranged in the middle of the working platform, a clamping assembly is arranged above the first C-shaped boxes, and the clamping assembly comprises an upper transmission box and a lower transmission box. A plurality of upper clamping boxes distributed at equal intervals are arranged on one side of the upper transmission box, a plurality of lower clamping boxes distributed at equal intervals are arranged on one side of the lower transmission box, the upper clamping boxes and the lower clamping boxes are in one-to-one correspondence and are distributed up and down, two symmetrical first clamping blocks are slidably connected to the upper clamping boxes, and second clamping blocks are arranged on the two sides of the lower clamping boxes. The symmetric center of the two second clamping blocks is consistent with the symmetric center of the first clamping block, the positioning assembly comprises a plurality of columns of positioning cylinders, each positioning cylinder is provided with folding supporting plates which are evenly distributed in an annular array, semiconductor device chips and TO bases of different specifications can be welded in the same batch, and large-batch rapid welding production is carried out.

Description

Technical Field

[0001] The invention relates to the technical field of chip welding, in particular to a semiconductor device chip turnover welding assembly. Background Art

[0002] When performing TO packaging, the semiconductor device chip often needs to be suspended above the TO base, which requires targeted tooling, and even separate tooling for each specification. It can neither be assembled quickly nor welded in batches, which is time-consuming and labor-intensive.

[0003] The application document with publication number CN117840936A discloses a sensor chip positioning device, including a base fixedly arranged on a positioning platform, wherein a first slide groove and a second slide groove are symmetrically provided on the base, and a sensor positioning groove for embedding a sensor base is provided between the first slide groove and the second slide groove; a chip carrier 1 is slidably arranged in the first slide groove, and a chip carrier 2 is slidably arranged in the second slide groove, a carrying plate is fixedly arranged at the end of the chip carrier 1 facing the chip carrier 2, and a limiting plate is fixedly arranged at the end of the chip carrier 2 facing the chip carrier 1; limiting protrusions for clamping with two groups of parallel side edges of the chip are symmetrically fixedly arranged on the carrying plate, a first clamping plate is also fixedly arranged on the carrying plate, and a second clamping plate is correspondingly arranged on the limiting plate, and the first clamping plate and the second clamping plate are used to clamp with the other two groups of parallel side edges of the chip.

[0004] Based on the above patents and prior art, the following questions are raised:

[0005] Problem 1: The existing technology lacks components for batch turnover and welding of semiconductor device chips, resulting in the ability to assemble and weld individual semiconductor devices individually, which is time-consuming and labor-intensive.

[0006] Question 2: Existing technologies lack adaptability to semiconductor device chips of different specifications, resulting in the need to produce multiple components, and each component needs to be produced in larger quantities, which is wasteful. Summary of the Invention

[0007] The purpose of the present invention is to address the above-mentioned problems and shortcomings and provide a semiconductor device chip turnover welding assembly to improve overall work efficiency.

[0008] The present invention solves at least one of the following technical problems:

[0009] (1) Only semiconductor devices of a single type can be assembled and soldered individually, which is time-consuming and labor-intensive;

[0010] (2) It is necessary to produce multiple components, and each component needs to be produced in larger quantities, which is wasteful.

[0011] The purpose of the present invention can be achieved through the following technical solutions: a semiconductor device chip turnover welding assembly includes a working platform, a plurality of first C-shaped boxes are arranged side by side on the working platform, a positioning assembly is provided in the middle of the working platform, a clamping assembly is provided above the first C-shaped box, the clamping assembly includes an upper transmission box and a lower transmission box, one side of the upper transmission box is provided with a plurality of upper clamping boxes distributed at equal distances, one side of the lower transmission box is provided with a plurality of lower clamping boxes distributed at equal distances, the upper clamping boxes and the lower clamping boxes correspond to each other one to one and are distributed up and down, two mutually symmetrical first clamping blocks are slidably connected to the upper clamping box, second clamping blocks are provided on both sides of the lower clamping box, and the symmetry center of the two second clamping blocks is consistent with the first clamping block, the positioning assembly includes a plurality of rows of positioning cylinders, and each positioning cylinder is provided with a closing support plate evenly distributed in a ring array.

[0012] As a further solution of the invention, an upper transmission screw is rotatably connected in the upper clamping box, and a lower transmission screw is rotatably connected in the lower clamping box. Both sides of the upper transmission screw and the lower transmission screw are provided with mutually symmetrical threads, and each pair of first clamping blocks is correspondingly threadedly sleeved on the threads of the upper transmission screw.

[0013] As a further solution of the invention, the threads on both sides of the lower transmission screw are threadedly connected with a transmission slider, the transmission slider is slidably connected to the lower clamping box and passes through the side wall of the lower clamping box, and a pushing slider is installed on the side of the transmission slider. The opposite sides of the two pushing sliders on each side are installed with elastic pushing plates, and a clamping support block is installed between the two elastic pushing plates on each side, and the second clamping block is correspondingly installed on the top of the clamping support block.

[0014] As a further solution of the invention, L-shaped bogies are provided on both sides of each clamping support block. The L-shaped bogies are fixed to the middle side wall of the lower clamping box and limit the elastic push plate.

[0015] As a further solution of the invention, a total transmission shaft is rotatably connected in the upper transmission box and the lower transmission box, and a transmission knob is rotatably connected at one end of the upper transmission box and the lower transmission box. The total transmission shaft of the upper transmission box and each upper transmission screw, the total transmission shaft of the lower transmission box and each lower transmission screw, and the transmission knob and the corresponding total transmission shaft are all transmitted through several pairs of bevel gears that mesh with each other.

[0016] As a further solution of the invention, a transmission cylinder is provided on both sides of the first C-shaped box, and a lifting screw is rotatably connected on both sides of the first C-shaped box. The transmission cylinder is threadedly sleeved on the lifting screw. A supporting cross bar is installed between the upper ends of the two transmission cylinders, and the clamping assembly is installed on the supporting cross bar. The middle part of the first C-shaped box is rotatably connected to the lifting transmission rod, and the lifting transmission rod and the two lifting screws are transmitted through pairs of bevel gears that mesh with each other.

[0017] As a further solution of the invention, the positioning assembly includes a positioning support plate, and each column of positioning cylinders is correspondingly installed on each positioning support plate. The positioning cylinders in each column are evenly distributed at equal distances. A second C-shaped box is installed on the upper end of the positioning cylinder. Four closing screws are rotatably connected to the inside of the second C-shaped box. The four closing screws are evenly distributed in a circular array. A closing slider is threadedly sleeved on the closing screw. The closing slider passes through the upper surface of the second C-shaped box and is slidably connected to the second C-shaped box. The closing slider is fixedly connected to the closing support plate.

[0018] As a further solution of the invention, the outer end of each closing screw is fixedly sleeved with a transmission gear, and the two sides and the middle part of the second C-shaped box are rotatably connected with closing transmission rods, and both ends of the closing transmission rod are installed with transmission bevel gears. The transmission bevel gears and the transmission gears are meshed and transmitted through a steering bevel gear, and the steering bevel gear is rotatably connected to the inner wall of the second C-shaped box.

[0019] As a further solution of the invention, a main transmission box is provided above each positioning support plate, and each main transmission box is fixedly connected to the middle side of the corresponding column of the second C-shaped box, and a sub-transmission shaft is passed through the middle of the connecting surface of the main transmission box and each second C-shaped box. The sub-transmission shaft is rotatably connected to the main transmission box and the second C-shaped box. A main rotating rod is rotatably connected inside the main transmission box, and transmission is carried out between the two ends of the sub-transmission shaft and the main rotating rod and the corresponding closing transmission rod through several pairs of mutually meshing bevel gears.

[0020] As a further solution of the invention, a shift box and a shift rack are respectively provided on the working platform and on both sides of the positioning assembly. The internal sliding sleeve of the shift box is provided with several shift transmission blocks, and the sliding sleeve of the shift rack is provided with several shift sliders. The shift transmission blocks, shift sliders and positioning support plates correspond to each other one by one and are connected through a connecting rack. A shift screw is threaded through the middle part of each shift transmission block, and the shift screw is rotatably connected to the shift box.

[0021] Beneficial effects of the present invention:

[0022] (1) During operation, the positioning cylinders of the positioning assembly receive the solder legs of different TO bases, thereby preventing the slender solder legs of the TO base from being damaged or interfering with the welding. The TO base can be stably supported by the synchronously closing support plate, and the TO base can be positioned coaxially with the positioning cylinder. The center point of the semiconductor device chip is positioned by the synchronous closing and separation of the first clamping blocks and the second clamping blocks of the clamping assembly. Subsequently, the semiconductor device chips can be stacked together and kept coaxially by the cooperation of the positioning assembly and the clamping assembly. At the same time, the semiconductor device chips are suspended and stabilized above the TO base. A plurality of synchronously moving positioning assemblies and matching clamping assemblies can be used to combine a number of pairs of semiconductor device chips and TO bases in batches for large-scale rapid welding production. In addition, semiconductor device chips and TO bases of different specifications can be welded in the same batch. The assembly also has personalized production capabilities, thereby improving overall production efficiency.

[0023] (2) During operation, the upper transmission screw is rotated to make the two first clamping blocks synchronously close or separate on the upper clamping box, and the lower transmission screw is rotated to make the two transmission slide blocks synchronously close or separate in the lower clamping box, thereby pushing the pairs of push slide blocks on both sides to close or separate synchronously. When the pairs of push slide blocks on both sides are synchronously closed, the corresponding two elastic push plates are synchronously closed, thereby pushing the clamping support block and the second clamping block away from the lower clamping box, and at the same time being limited by the L-shaped bogie, so that the elastic push plate is bent ninety degrees at the L-shaped bogie to avoid the elastic push plate from damaging the welding column of the TO base when pushing the clamping support block, so that the elastic push plate is tightly attached to the side wall of the upper clamping box, which can adapt to chips of various sizes, avoid damage, will not interfere, and maintain stable limit.

[0024] (3) During operation, by rotating the main rotating rod in the main transmission box, each sub-transmission shaft is driven, and then the adjacent closing transmission rod is driven. Subsequently, through the continuous transmission of each group of steering bevel gears, transmission bevel gears, closing transmission rods and transmission gears, the four closing screws are rotated synchronously, and the closing slider and the closing support plate are pushed to slide on the second C-shaped box synchronously, thereby synchronously closing or separating each group of closing support plates, positioning and supporting the TO base in the middle of the upper end of the positioning cylinder, and by rotating each main rotating rod separately, adapting to TO bases of different specifications, and synchronously driving each sub-transmission shaft, the TO bases of the same group are positioned in batches. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] To facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0026] Figure 1 It is a top view of the overall structure of the present invention;

[0027] Figure 2A side view of the internal structure of a first C-shaped box of the present invention;

[0028] Figure 3 A top view of the overall structure of the clamping assembly of the present invention;

[0029] Figure 4 for Figure 3 A magnified schematic diagram of area A in the middle;

[0030] Figure 5 A side view of the overall structure of the upper transmission box and the lower transmission box of the present invention;

[0031] Figure 6 for Figure 5 A magnified schematic diagram of area B in the middle;

[0032] Figure 7 This is a top view of the overall structure of the upper clamping box when the elastic push plate of the present invention is away;

[0033] Figure 8 This is a top view of the overall structure of the upper clamping box when the elastic push plate of the present invention is folded;

[0034] Figure 9 A top view of the overall structure of the positioning assembly of the present invention;

[0035] Figure 10 A top view of the overall structure of the second C-shaped box of the present invention;

[0036] Figure 11 A top view of the internal structure of a second C-shaped box of the present invention;

[0037] In the figure: 101, working platform; 102, first C-shaped box; 103, transmission cylinder; 104, supporting cross bar; 105, clamping assembly; 106, lifting transmission rod; 107, lifting screw; 108, upper transmission box; 109, lower transmission box; 110, upper clamping box; 111, lower clamping box; 112, upper transmission screw; 113, lower transmission screw; 114, first clamping block; 115, transmission slide block; 116, push slide block; 117, elastic push plate; 118, L-shaped bogie; 119, clamping support block; 120, second clamping block; 121, transmission knob; 1 22. Main transmission shaft; 201. Positioning assembly; 202. Positioning support plate; 203. Positioning cylinder; 204. Second C-shaped box; 205. Closing screw; 206. Closing slider; 207. Closing support plate; 208. Positioning film; 209. Transmission gear; 210. Closing transmission rod; 211. Transmission bevel gear; 212. Steering bevel gear; 213. Main transmission box; 214. Main rotating rod; 215. Sub-transmission shaft; 217. Shift box; 218. Shift frame; 219. Shift transmission block; 220. Shift slider; 221. Connecting frame; 222. Shift screw. DETAILED DESCRIPTION

[0038] In order to further illustrate the technical means and effects adopted by the present invention to achieve the predetermined purpose of the invention, the specific implementation methods, structures, features and effects of the present invention are described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0039] See also Figure 1-11 As shown: a semiconductor device chip turnover welding assembly, including a work platform 101, a plurality of first C-shaped boxes 102 are arranged side by side on the work platform 101, a positioning assembly 201 is provided in the middle of the work platform 101, a clamping assembly 105 is provided above the first C-shaped box 102, the clamping assembly 105 includes an upper transmission box 108 and a lower transmission box 109, a plurality of upper clamping boxes 110 are provided on one side of the upper transmission box 108 and a plurality of upper clamping boxes 110 are provided on one side of the lower transmission box 109. The lower clamping boxes 111 are evenly spaced, and the upper clamping boxes 110 and the lower clamping boxes 111 correspond to each other one by one and are distributed up and down. Two mutually symmetrical first clamping blocks 114 are slidably connected to the upper clamping box 110. Second clamping blocks 120 are provided on both sides of the lower clamping box 111. The symmetry centers of the two second clamping blocks 120 are consistent with the first clamping blocks 114. The positioning assembly 201 includes several rows of positioning cylinders 203, and each positioning cylinder 203 is provided with a closing support plate 207 evenly distributed in an annular array.

[0040] When the device is working, the distance between the semiconductor device chip and the TO base is greater than the height from the top of the first clamping block 114 to the bottom of the lower clamping box 111, and the tops of the first clamping block 114 and the second clamping block 120 are flush;

[0041] When this embodiment is working, the TO base is supported by the positioning cylinders 203 and the closing support plates 207 in each column. The closing support plates 207 are gathered at different distances to correspond to TO bases of different sizes, and the TO bases are made coaxial with the positioning cylinders 203. Different columns of the positioning cylinders 203 correspond to TO bases of different sizes. Subsequently, each positioning cylinder 203 is synchronously moved to the bottom of the corresponding clamping assembly 105 by the overall movement of the positioning assembly 201, and each corresponding The upper clamping box 110, the lower clamping box 111, the positioning cylinder 203 and the TO base are placed in the same vertical column. Then, the clamping components 105 of each column are moved downward by the first C-shaped box 102, so that the middle of each pair of upper clamping boxes 110 and lower clamping boxes 111 are correspondingly moved to the middle of each column of TO base. Then, each pair of first clamping blocks 114 and each pair of second clamping blocks 120 are separated to the maximum distance. Then, the semiconductor device chip is placed in the middle of the upper surface of the upper clamping box 110, and then each pair is closed. The first clamping block 114 and each pair of second clamping blocks 120 are used to stably hold the semiconductor device chip coaxially with the TO base. The support of the clamping assembly 105 allows the soldering pins of the semiconductor device chip to be flush with the soldering columns of the TO base. The device then transfers the batch of semiconductor device chips and the TO base to the soldering end of the welder. The welder then welds several rows of semiconductor device chips and the TO base together. The device is then removed, and the clamping assembly 105 is then moved downward to separate the first clamping block 114 and the second clamping block 120 from the semiconductor device chip. The second clamping block 120 is then closed, and the positioning assembly 201 is then moved away from the clamping assembly 105 to remove the welded semiconductor device chip and the TO base from the clamping assembly 105. The above steps are then repeated for subsequent batches of components, thereby enabling batch, stable, and efficient soldering and assembly of semiconductor device chips and TO bases.

[0042] The upper transmission screw 112 is rotatably connected in the upper clamping box 110, and the lower transmission screw 113 is rotatably connected in the lower clamping box 111. Both sides of the upper transmission screw 112 and the lower transmission screw 113 are provided with mutually symmetrical threads. Each pair of first clamping blocks 114 is correspondingly threadedly sleeved on the threads of the upper transmission screw 112, and the threads on both sides of the lower transmission screw 113 are threadedly sleeved with transmission sliders 115. The transmission sliders 115 are slidably connected to the lower clamping box 111 and pass through the side wall of the lower clamping box 111. A pushing slider 116 is installed on the side of the movable slider 115, and an elastic pushing plate 117 is installed on the opposite side of the two pushing sliders 116 on each side. A clamping support block 119 is installed between the two elastic pushing plates 117 on each side. The second clamping block 120 is correspondingly installed on the top of the clamping support block 119. An L-shaped bogie 118 is provided on both sides of each clamping support block 119. The L-shaped bogie 118 is fixed to the middle side wall of the lower clamping box 111 and limits the elastic pushing plate 117.

[0043] When the present embodiment is working, by rotating the upper transmission screw 112, the two first clamping blocks 114 are synchronously closed or separated on the upper clamping box 110, and by rotating the lower transmission screw 113, the two transmission sliders 115 are synchronously closed or separated in the lower clamping box 111, thereby pushing the pairs of push sliders 116 on both sides to synchronously close or separate. When the pairs of push sliders 116 on both sides are synchronously closed, the corresponding two elastic push plates 117 are synchronously closed, thereby pushing the clamping support block 119. The second clamping block 120 is away from the lower clamping box 111 and is limited by the L-shaped bogie 118, so that the elastic push plate 117 is bent ninety degrees at the L-shaped bogie 118 to avoid damage to the welding column of the TO base when the elastic push plate 117 pushes the clamping support block 119, so that the elastic push plate 117 is close to the side wall of the upper clamping box 110, which can adapt to chips of various sizes, avoid damage, will not interfere, and maintain stable limitation.

[0044] A main transmission shaft 122 is rotatably connected to the upper transmission box 108 and the lower transmission box 109. One end of the upper transmission box 108 and the lower transmission box 109 is rotatably connected to a transmission knob 121. The main transmission shaft 122 of the upper transmission box 108 and each upper transmission screw 112, the main transmission shaft 122 of the lower transmission box 109 and each lower transmission screw 113, and the transmission knob 121 and the corresponding main transmission shaft 122 are all driven by a plurality of pairs of bevel gears that mesh with each other.

[0045] During operation, by rotating the transmission knob 121, the corresponding main transmission shaft 122 is driven, and then the corresponding upper transmission screws 112 or the lower transmission screws 113 are driven to rotate, so that the clamping and loosening operations of the semiconductor device chips are performed synchronously in batches, and a group of clamping components 105 corresponds to a row of semiconductor device chips of the same specifications, so that chips and bases of various specifications can be assembled in batches in the same batch.

[0046] A transmission cylinder 103 is sleeved on both sides of the first C-shaped box 102, and a lifting screw 107 is rotatably connected to both sides of the first C-shaped box 102. The transmission cylinder 103 is threadedly sleeved on the lifting screw 107. A support crossbar 104 is installed between the upper ends of the two transmission cylinders 103. The clamping assembly 105 is installed on the support crossbar 104. The middle part of the first C-shaped box 102 is rotatably connected to the lifting transmission rod 106. The lifting transmission rod 106 and the two lifting screws 107 are driven by pairs of mutually meshing bevel gears.

[0047] When this embodiment is working, the lifting transmission rod 106 is rotated, thereby synchronously rotating the two lifting screws 107, so that the two transmission cylinders 103 are lifted and lowered synchronously, and the supporting cross bar 104 and the clamping assembly 105 are stably lifted and lowered, so that the clamping assembly 105 with the placed chip falls stably at a specific position above the corresponding base, ensuring high-quality welding while avoiding damage to the components.

[0048] The positioning assembly 201 includes a positioning support plate 202, and each row of positioning cylinders 203 is correspondingly installed on each positioning support plate 202. Each row of positioning cylinders 203 is evenly distributed at equal distances. A second C-shaped box 204 is installed on the upper end of the positioning cylinder 203. Four closing screws 205 are rotatably connected to the interior of the second C-shaped box 204. The four closing screws 205 are evenly distributed in a ring array. A closing slider 206 is threadedly sleeved on the closing screw 205. The closing slider 206 passes through the upper surface of the second C-shaped box 204 and is slidably connected to the second C-shaped box 204. The closing slider 206 is connected to the closing support plate 202. 07 is fixedly connected, and the outer end of each closing screw 205 is fixedly sleeved with a transmission gear 209, and the two sides and the middle of the second C-shaped box 204 are rotatably connected with a closing transmission rod 210, and both ends of the closing transmission rod 210 are installed with a transmission bevel gear 211. The transmission bevel gear 211 and the transmission gear 209 are meshed and transmitted through a steering bevel gear 212. The steering bevel gear 212 is rotatably connected to the inner wall of the second C-shaped box 204, and the inner end of the closing support plate 207 is fixedly connected with a positioning film 208, thereby improving stability and avoiding damage to the TO base;

[0049] A main transmission box 213 is provided above each positioning support plate 202. Each main transmission box 213 is fixedly connected to the middle side of the corresponding column of second C-shaped boxes 204, and a sub-transmission shaft 215 is passed through the middle of the connecting surface of the main transmission box 213 and each second C-shaped box 204. The sub-transmission shaft 215 is rotatably connected to the main transmission box 213 and the second C-shaped box 204. A main rotating rod 214 is rotatably connected to the main transmission box 213. The two ends of the sub-transmission shaft 215 are transmitted to the main rotating rod 214 and the corresponding closing transmission rod 210 through a plurality of pairs of mutually meshing bevel gears.

[0050] When this embodiment is working, by rotating the main rotating rod 214 in the main transmission box 213, each sub-transmission shaft 215 is driven, and then the adjacent closing transmission rod 210 is driven. Subsequently, through the continuous transmission of each group of steering bevel gears 212, transmission bevel gears 211, closing transmission rod 210 and transmission gear 209, the four closing screws 205 rotate synchronously, synchronously pushing the closing slider 206 and the closing support plate 207 to slide on the second C-shaped box 204, thereby synchronously closing or separating each group of closing support plates 207, positioning and supporting the TO base in the middle of the upper end of the positioning cylinder 203, and adapting to TO bases of different specifications by rotating each main rotating rod 214 separately, and synchronously driving each sub-transmission shaft 215, thereby positioning each TO base in the same group in batches.

[0051] A shift box 217 and a shift frame 218 are provided on the working platform 101 and on both sides of the positioning assembly 201. The shift box 217 is provided with a plurality of shift transmission blocks 219 in a sliding sleeve therein. The shift frame 218 is provided with a plurality of shift sliders 220 in a sliding sleeve therein. The shift transmission blocks 219, the shift sliders 220 and the positioning support plate 202 correspond to each other and are connected by a connecting frame 221. A shift screw 222 is threadedly passed through the middle of each shift transmission block 219. The shift screw 222 is rotatably connected to the shift box 217.

[0052] When this embodiment is working, each shift transmission block 219 is synchronously pushed by rotating the shift screw 222, thereby synchronously pushing each positioning support plate 202, so that each installed TO base moves synchronously. Since the center of the semiconductor device chip of any specification is consistent with the center of the upper clamping box 110, and the center of the TO base of any specification is consistent with the center of the positioning cylinder 203, each positioning cylinder 203 can be synchronously moved the same distance and synchronously moved to the bottom of the corresponding lower clamping box 111, thereby combining the placed chips and bases in an integrated manner, shortening the time of the combination process, improving the overall work efficiency and production efficiency, and improving the accuracy of the combination and the welding quality through the accurate pushing of the screw.

[0053] When the present invention is in use, the staff uses the various positioning cylinders 203 of the positioning assembly 201 to accommodate the solder legs of different TO bases, thereby preventing the slender solder legs of the TO base from being damaged or interfering with welding. The synchronously closing support plate 207 can not only stably support the TO base, but also position the TO base to be coaxial with the positioning cylinder 203. The center point of the semiconductor device chip is positioned by the synchronous closing and separation of the first clamping blocks 114 and the second clamping blocks 120 of the clamping assembly 105. Subsequently, the positioning assembly 201 and the clamping assembly 105 cooperate to stack the semiconductor device chips together and maintain coaxiality. At the same time, the semiconductor device chips are stably suspended above the TO base. Through multiple synchronously moving positioning assemblies 201 and the matching clamping assemblies 105, a plurality of pairs of semiconductor device chips and TO bases are combined in batches to carry out large-scale rapid welding production. In addition, semiconductor device chips and TO bases of different specifications can be welded in the same batch. It also has personalized production capabilities and improves overall production efficiency.

[0054] During operation, by rotating the upper transmission screw 112, the two first clamping blocks 114 are synchronously closed or separated on the upper clamping box 110, and by rotating the lower transmission screw 113, the two transmission sliders 115 are synchronously closed or separated in the lower clamping box 111, thereby pushing the pairs of pushing sliders 116 on both sides to close or separate synchronously. When the pairs of pushing sliders 116 on both sides are synchronously closed, the corresponding two elastic pushing plates 117 are synchronously closed, thereby pushing the clamping support block 119 and the first clamping block 114 to close or separate synchronously. The second clamping block 120 is away from the lower clamping box 111 and is limited by the L-shaped bogie 118, so that the elastic push plate 117 is bent ninety degrees at the L-shaped bogie 118, so as to prevent the elastic push plate 117 from damaging the welding column of the TO base when pushing the clamping support block 119. The elastic push plate 117 is closely attached to the side wall of the upper clamping box 110, which can adapt to chips of various sizes, avoid damage, will not interfere, and maintain stable limitation.

[0055] During operation, by rotating the total rotating rod 214 in the total transmission box 213, the various sub-transmission shafts 215 are driven, and then the nearby closing transmission rods 210 are driven. Subsequently, through the continuous transmission of each group of steering bevel gears 212, transmission bevel gears 211, closing transmission rods 210 and transmission gears 209, the four closing screws 205 rotate synchronously, and the closing slider 206 and the closing support plate 207 are synchronously pushed to slide on the second C-shaped box 204, thereby synchronously closing or separating each group of closing support plates 207, positioning and supporting the TO base in the middle of the upper end of the positioning cylinder 203, and adapting to TO bases of different specifications by rotating each total rotating rod 214 separately, and synchronously driving each sub-transmission shaft 215, thereby positioning each TO base in the same group in batches.

[0056] The above description is merely a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to equivalent embodiments using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A semiconductor device chip turnover welding assembly, characterized in that: The invention comprises a working platform (101), wherein a plurality of first C-shaped boxes (102) are arranged side by side on the working platform (101), a positioning assembly (201) is provided in the middle of the working platform (101), a clamping assembly (105) is provided above the first C-shaped box (102), the clamping assembly (105) comprises an upper transmission box (108) and a lower transmission box (109), a plurality of upper clamping boxes (110) distributed in equal distances are provided on one side of the upper transmission box (108), and a plurality of lower clamping boxes distributed in equal distances are provided on one side of the lower transmission box (109). (111), the upper clamping box (110) and the lower clamping box (111) correspond to each other one by one and are distributed up and down, the upper clamping box (110) is slidably connected to two mutually symmetrical first clamping blocks (114), and second clamping blocks (120) are provided on both sides of the lower clamping box (111), and the symmetry center of the two second clamping blocks (120) is consistent with the first clamping block (114), and the positioning assembly (201) includes several rows of positioning cylinders (203), and each positioning cylinder (203) is provided with a closing support plate (207) evenly distributed in a ring array.

2. The semiconductor device chip turnover welding assembly according to claim 1, characterized in that: An upper transmission screw (112) is rotatably connected in the upper clamping box (110), and a lower transmission screw (113) is rotatably connected in the lower clamping box (111). Both sides of the upper transmission screw (112) and the lower transmission screw (113) are provided with mutually symmetrical threads, and each pair of first clamping blocks (114) is correspondingly threadedly sleeved on the threads of the upper transmission screw (112).

3. The semiconductor device chip turnover welding assembly according to claim 2, characterized in that: The threads on both sides of the lower transmission screw (113) are threadedly connected with a transmission slider (115), the transmission slider (115) is slidably connected to the lower clamping box (111) and passes through the side wall of the lower clamping box (111), and a pushing slider (116) is installed on the side of the transmission slider (115), and the opposite sides of the two pushing sliders (116) on each side are installed with elastic pushing plates (117), and a clamping support block (119) is installed between the two elastic pushing plates (117) on each side, and the second clamping block (120) is correspondingly installed on the top of the clamping support block (119).

4. The semiconductor device chip turnover welding assembly according to claim 3, characterized in that: An L-shaped bogie (118) is provided on both sides of each clamping support block (119). The L-shaped bogie (118) is fixed to the middle side wall of the lower clamping box (111) and limits the elastic push plate (117).

5. The semiconductor device chip turnover welding assembly according to claim 1, characterized in that: A total transmission shaft (122) is rotatably connected in the upper transmission box (108) and the lower transmission box (109); one end of the upper transmission box (108) and the lower transmission box (109) is rotatably connected to a transmission knob (121); the total transmission shaft (122) of the upper transmission box (108) and each upper transmission screw (112), the total transmission shaft (122) of the lower transmission box (109) and each lower transmission screw (113), and the transmission knob (121) and the corresponding total transmission shaft (122) are all transmitted through a plurality of pairs of bevel gears that are meshed with each other.

6. The semiconductor device chip turnover welding assembly according to claim 1, characterized in that: A transmission cylinder (103) is sleeved on both sides of the first C-shaped box (102), and a lifting screw (107) is rotatably connected to both sides of the first C-shaped box (102). The transmission cylinder (103) is threadedly sleeved on the lifting screw (107). A support cross bar (104) is installed between the upper ends of the two transmission cylinders (103). The clamping assembly (105) is installed on the support cross bar (104). The middle part of the first C-shaped box (102) is rotatably connected to the lifting transmission rod (106). The lifting transmission rod (106) and the two lifting screws (107) are driven by pairs of bevel gears that mesh with each other.

7. The semiconductor device chip turnover welding assembly according to claim 1, characterized in that: The positioning assembly (201) comprises a positioning support plate (202), and each row of positioning cylinders (203) is correspondingly mounted on each positioning support plate (202), and each row of positioning cylinders (203) is evenly distributed at equal intervals. A second C-shaped box (204) is mounted on the upper end of the positioning cylinder (203), and four closing screws (205) are rotatably connected inside the second C-shaped box (204). The four closing screws (205) are evenly distributed in a ring array, and a closing slider (206) is threadedly sleeved on the closing screw (205). The closing slider (206) passes through the upper surface of the second C-shaped box (204) and is slidably connected to the second C-shaped box (204). The closing slider (206) is fixedly connected to the closing support plate (207), and a positioning film (208) is fixedly connected to the inner end of the closing support plate (207).

8. The semiconductor device chip turnover welding assembly according to claim 7, characterized in that: The outer end of each closing screw (205) is fixedly sleeved with a transmission gear (209), and both sides and the middle of the second C-shaped box (204) are rotatably connected to closing transmission rods (210), and both ends of the closing transmission rod (210) are installed with transmission bevel gears (211), and the transmission bevel gears (211) and the transmission gears (209) are meshed and transmitted through a steering bevel gear (212), and the steering bevel gear (212) is rotatably connected to the inner wall of the second C-shaped box (204).

9. The semiconductor device chip turnover welding assembly according to claim 7, characterized in that: A main transmission box (213) is provided above each positioning support plate (202), and each main transmission box (213) is fixedly connected to the middle side surface of each corresponding row of second C-shaped boxes (204), and a sub-transmission shaft (215) is passed through the middle of the connecting surface between the main transmission box (213) and each second C-shaped box (204), and the sub-transmission shaft (215) is rotatably connected to the main transmission box (213) and the second C-shaped box (204). A main rotating rod (214) is rotatably connected inside the main transmission box (213), and transmission is carried out between the two ends of the sub-transmission shaft (215) and the main rotating rod (214) and the corresponding closing transmission rod (210) through a plurality of pairs of mutually meshing bevel gears.

10. The semiconductor device chip turnover welding assembly according to claim 1, characterized in that: A shift box (217) and a shift frame (218) are respectively provided on the working platform (101) and on both sides of the positioning assembly (201). The internal sliding sleeve of the shift box (217) is provided with a plurality of shift transmission blocks (219). The shift frame (218) is slidably sleeved with a plurality of shift sliders (220). The shift transmission blocks (219), the shift sliders (220) and the positioning support plate (202) correspond to each other and are connected through a connecting frame (221). A shift screw (222) is threadedly passed through the middle of each shift transmission block (219). The shift screw (222) is rotatably connected to the shift box (217).

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