Intelligent two-way temperature control device for helmet cabin

Abstract

The invention relates to an intelligent two-way temperature control device for a helmet cabin. The technical problem that an existing helmet body affects the wearing experience of a user along with environment changes is solved. Comprising a cabin body used for containing a helmet body, an upper air guide cover which is matched with an opening in the lower end of the helmet body and extends to the inner side of the helmet body is arranged in the cabin body, an air guide structure corresponding to the inner side of the helmet body is arranged at the upper end of the upper air guide cover, and a thermoelectric semiconductor heat exchange structure corresponding to the air guide structure is arranged on the inner side of the upper air guide cover. The helmet has the advantages that the helmet body can be conveniently arranged in the cabin body through the helmet containing groove, the air guide upper cover can be conveniently arranged in the helmet body, the air guide structure can conveniently exchange heat in the helmet body, the heat exchange efficiency is improved, and the heat exchange effect is guaranteed. The thermoelectric semiconductor heat exchange structure has the advantage of being small in occupied area, can be conveniently placed and installed, and can guarantee the heat exchange effect on the helmet body.

Description

Technical Field

[0001] The present invention belongs to the technical field of helmet cockpit equipment, and in particular relates to an intelligent two-way temperature control device for a helmet cockpit. Background Art

[0002] With the popularity of electric bicycles, electric bicycle helmets, as an important piece of equipment to ensure riding safety, are increasingly used. However, in actual use, electric bicycle helmets generally face the problem of poor wearing comfort due to changes in ambient temperature.

[0003] In the summer, when an electric vehicle is parked outdoors, the cabin is in direct sunlight, and the internal temperature rises sharply. The electric vehicle helmet placed in the cabin will be baked by the sun for a long time, and the temperature of the helmet surface and internal padding will be too high. When the user wears it, the high-temperature helmet will cause a burning sensation on the skin of the head, and may even cause the risk of burns, greatly affecting the user's wearing experience. In winter, especially in low-temperature and cold areas, the electric vehicle cabin is exposed to the cold environment, and the temperature of the helmet will quickly drop to a level close to the ambient temperature, which may be as low as below 0°C. Wearing a helmet at this time, the cold material will cause strong discomfort to the user's head, and the low temperature may also cause the helmet lining to harden, reducing its cushioning performance and affecting the safety protection effect. Summary of the Invention

[0004] The purpose of the present invention is to provide an intelligent two-way temperature control device for a helmet cockpit in order to solve the above problems.

[0005] To achieve the above-mentioned objectives, the present invention adopts the following technical solutions: This invention relates to an intelligent two-way temperature control device for a helmet cockpit, comprising a cockpit body for placing a helmet body, wherein the cockpit body is provided with an air guide cover adapted to the opening at the lower end of the helmet body and extending to the inner side of the helmet body, the upper end of the air guide cover is provided with an air guide structure corresponding to the inner side of the helmet body, and a thermoelectric semiconductor heat exchange structure corresponding to the air guide structure is provided on the inner side of the air guide cover, the air guide cover can facilitate the installation of the thermoelectric semiconductor heat exchange structure and the air guide structure can facilitate the thermoelectric semiconductor heat exchange structure to control the temperature inside the helmet body, thereby ensuring the temperature regulation efficiency and effectively improving the user experience.

[0006] In the above-mentioned intelligent two-way temperature control device for a helmet cockpit, the cockpit body has a helmet placement slot, and the lower end of the air guide upper cover is open and the lower end of the air guide upper cover is fixed to the bottom of the helmet placement slot by a number of upper cover mounting screws. The helmet placement slot can facilitate the placement of the helmet body, and the air guide upper cover is fixedly arranged in the helmet placement slot, which makes it convenient to arrange the air guide structure inside the helmet body, thereby facilitating heat exchange and temperature control inside the helmet body.

[0007] In the above-mentioned intelligent two-way temperature control device for a helmet cockpit, the thermoelectric semiconductor heat exchange structure includes a thermoelectric semiconductor sheet having a cold surface on one side and a hot surface on the other side. The cold surface of the thermoelectric semiconductor sheet is in contact with a cold-end heat exchanger and one end of the cold-end heat exchanger is provided with a cold-end internal circulation fan. The hot surface of the thermoelectric semiconductor sheet is in contact with a hot-end radiator and one end of the hot-end radiator is provided with a hot-end heat dissipation fan. A wireless receiving module capable of controlling the thermoelectric semiconductor sheet is provided in the cockpit body. The wireless receiving module can remotely receive the user's control signal to control the operation of the thermoelectric semiconductor sheet. The state is controlled; and when the thermoelectric semiconductor is energized in the forward direction, the cold surface of the thermoelectric semiconductor is cooled, and the cold-end internal circulation fan and the cold-end heat exchanger are used to blow the cold-end air into the helmet body for rapid cooling, and the hot-end radiator can absorb the heat generated by the refrigeration of the thermoelectric semiconductor, and the hot-end heat dissipation fan can accelerate the heat dissipation efficiency; when the thermoelectric semiconductor is energized in the reverse direction, the cold surface of the thermoelectric semiconductor is converted into a hot surface, and the helmet body is heated by the above-mentioned cold-end internal circulation fan and the cold-end heat exchanger, which can meet the needs of users in various usage environments and improve the user experience.

[0008] In the above-mentioned intelligent bidirectional temperature control device for a helmet cockpit, a thermoelectric semiconductor insulation foam is provided between the cold-end heat exchanger and the hot-end radiator. The center of the thermoelectric semiconductor insulation foam has a semiconductor chip mounting hole, and the thermoelectric semiconductor chip is installed in the semiconductor chip mounting hole. The semiconductor chip mounting hole can be used to prevent the thermoelectric semiconductor chip from being transferred to the surrounding environment through the thermoelectric semiconductor insulation foam, thereby reducing cold damage, improving refrigeration efficiency, and providing a buffering and shock-absorbing effect and a sealing and noise-reducing effect for the thermoelectric semiconductor.

[0009] In the above-mentioned intelligent two-way temperature control device for a helmet cockpit, the cold-end internal circulation fan is located above the hot-end heat dissipation fan and is arranged correspondingly up and down. An internal circulation fan outlet sealing foam is provided between the cold-end internal circulation fan and the cold-end heat exchanger, and a heat dissipation fan outlet sealing foam is provided between the hot-end heat dissipation fan and the hot-end radiator. The internal circulation fan outlet sealing foam and the heat dissipation fan outlet sealing foam can both play a sealing role, effectively prevent air leakage in the gaps between components, and absorb the vibration and noise generated during the operation of the cold-end internal circulation fan and the hot-end heat dissipation fan, thereby playing a shock-absorbing and noise-reducing role.

[0010] In the above-mentioned intelligent two-way temperature control device for a helmet cockpit, the air guide structure includes a plurality of circulating air outlet holes arranged on one side of the upper end of the air guide cover and corresponding to the cold-end heat exchanger, and the other side of the upper end of the air guide cover is provided with circulating air inlet holes corresponding to the cold-end internal circulation fan. The circulating air inlet holes can facilitate the cold-end circulation fan to extract air inside the helmet body for heat exchange, and the heat-exchanged air is discharged into the helmet body through the circulating air outlet holes, which can quickly cool down or heat up the air inside the helmet body to ensure the user experience.

[0011] In the above-mentioned intelligent two-way temperature control device for a helmet cockpit, a heat exchange air inlet corresponding to the hot-end cooling fan is provided at the bottom of the cockpit body, a heat exchange air outlet is provided on the outer side of one end of the hot-end radiator away from the hot-end cooling fan and is located at the bottom of the cockpit body, and an arc-shaped air guide surface is provided at one end of the hot-end radiator away from the hot-end cooling fan and is located above the heat exchange air outlet. The heat exchange air inlet can facilitate the hot-end cooling fan to draw outside air to exchange heat with the hot-end radiator, and the heat exchange air outlet can facilitate the discharge of the air after heat exchange from the hot-end radiator to the outside. The arc-shaped air guide surface can guide the air after heat exchange from the hot-end radiator toward the heat exchange air outlet, thereby ensuring the control of the heat exchange effect and the heat dissipation effect.

[0012] In the above-mentioned intelligent two-way temperature control device for a helmet cockpit, a fan mounting bracket capable of supporting a thermoelectric semiconductor heat exchange structure is provided in the air guide upper cover, and the fan mounting bracket is fixedly arranged in the cockpit body through a bracket mounting assembly, and the cold-end internal circulation fan is arranged at one end of the fan mounting bracket, and the other end of the fan mounting bracket is provided with a cold-end heat dissipation mounting groove connected to the cold-end internal circulation fan and the circulating air outlet, and the cold-end heat exchanger is arranged in the cold-end heat dissipation mounting groove, and the cold-end internal circulation fan and the cold-end radiator can be conveniently placed through the fan mounting bracket, and the fan mounting bracket can be conveniently fixed on the cockpit body through the bracket mounting assembly, and the cold-end heat dissipation mounting groove can facilitate the positioning and placement of the cold-end radiator.

[0013] In the above-mentioned intelligent two-way temperature control device for a helmet cockpit, the bracket mounting assembly includes bracket support plates respectively arranged on both sides of the hot-end radiator, one end of the bracket support plate is connected to the arc-shaped air guide surface, and one end of the fan mounting bracket is abutted against the bracket support plate and fixedly connected by a plurality of fixing bolts, and the other end of the bracket support plate has a plurality of fan limiting support plates arranged on the circumferential outside of the heat exchange air inlet hole, and a hot-end heat dissipation channel is formed between the connected bracket support plates, the hot-end heat dissipation channel is arranged in the hot-end heat dissipation channel, and the hot-end heat dissipation channel is connected with the cold-end heat dissipation mounting groove, the support effect of the fan mounting bracket can be guaranteed by the bracket support plate and the fan limiting support plate, and the hot-end heat dissipation channel can facilitate the positioning and placement of the hot-end radiator, the hot-end heat dissipation channel is connected to the cold-end heat dissipation mounting groove, and the thermoelectric semiconductor chip is arranged between the hot-end heat dissipation channel and the cold-end heat dissipation mounting groove.

[0014] In the above-mentioned intelligent bidirectional temperature control device for a helmet cockpit, the hot-end cooling fan is arranged between the fan limit support plates and is arranged against the fan limit support plates. One end of the fan mounting bracket is fixedly arranged on the fan limit support plate, and the fan mounting bracket is fixedly connected to the fan limit support plate by a number of fixing screws. The hot-end cooling fan can be limited by the fan limit support plate, and the fan limit support plate can ensure the support effect of the fan mounting bracket.

[0015] Compared with the existing technology, the advantages of the present invention are:

[0016] 1. The helmet placement slot can facilitate the placement of the helmet body in the cockpit body, and can facilitate the placement of the air guide cover in the helmet body, so that the air guide structure can exchange heat in the helmet body, thereby improving the heat exchange efficiency and ensuring the heat exchange effect.

[0017] 2. The thermoelectric semiconductor heat exchange structure has the advantage of occupying a small area, can be easily placed and installed, and can ensure the heat exchange effect on the helmet body.

[0018] 3. Users can easily control the working status of the thermoelectric semiconductor chip, which can meet the heat exchange requirements of the helmet body in any environment and improve the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the present invention.

[0020] Figure 2 It is a structural schematic diagram of the cockpit body in the present invention.

[0021] Figure 3 It is a structural sectional view of the present invention.

[0022] Figure 4It is a structural schematic diagram of the thermoelectric semiconductor heat exchange structure in the present invention.

[0023] In the figure: helmet body 1, cockpit body 2, helmet placement slot 21, heat exchange air inlet 22, heat exchange air outlet 23, curved air guide surface 24, air guide upper cover 3, air guide structure 4, circulation air outlet 41, circulation air inlet 42, thermoelectric semiconductor heat exchange structure 5, thermoelectric semiconductor chip 51, cold surface 511, hot surface 512, cold end heat exchanger 52, cold end internal circulation fan 53, hot end radiator 54, hot end heat dissipation fan 55, thermoelectric semiconductor insulation foam 56, semiconductor chip mounting hole 57, internal circulation fan air outlet sealing foam 58, heat dissipation fan air outlet sealing foam 59, fan mounting bracket 6, cold end heat dissipation mounting slot 61, bracket mounting assembly 7, bracket support plate 71, fan limit support plate 72, hot end heat dissipation channel 73. DETAILED DESCRIPTION

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 As shown, the present invention is an intelligent two-way temperature control device for a helmet cabin, comprising a cabin body 2 for placing a helmet body 1. The cabin body 2 can facilitate the placement of the helmet body 1. An air guide cover 3 is provided in the cabin body 2, which is adapted to the opening at the lower end of the helmet body 1 and extends to the inner side of the helmet body 1. The upper end of the air guide cover 3 has an air guide structure 4 corresponding to the inner side of the helmet body 1. A thermoelectric semiconductor heat exchange structure 5 corresponding to the air guide structure 4 is provided on the inner side of the air guide cover 3. The air guide cover 3 can facilitate the installation of the thermoelectric semiconductor heat exchange structure 5, and the air guide structure 4 can facilitate the thermoelectric semiconductor heat exchange structure 5 to control the temperature inside the helmet body 1, thereby ensuring the temperature regulation efficiency and effectively improving the user experience.

[0026] Specifically, the cockpit body 2 has a helmet placement slot 21, and the lower end of the air guide cover 3 is open and the lower end of the air guide cover 3 is fixed to the bottom of the helmet placement slot 21 by a number of cover mounting screws. The helmet placement slot 21 can facilitate the placement of the helmet body 1, and the air guide cover 3 is fixed in the helmet placement slot 21 to facilitate the arrangement of the air guide structure 4 inside the helmet body 1, so as to facilitate heat exchange and temperature control inside the helmet body 1.

[0027] Among them, the thermoelectric semiconductor heat exchange structure 5 includes a thermoelectric semiconductor sheet 51 having a cold surface 511 on one side and a hot surface 512 on the other side. The cold surface 511 of the thermoelectric semiconductor sheet 51 is in contact with the cold end heat exchanger 52, and a cold end internal circulation fan 53 is provided at one end of the cold end heat exchanger 52. The hot surface 512 of the thermoelectric semiconductor sheet 51 is in contact with the hot end radiator 54, and a hot end heat dissipation fan 55 is provided at one end of the hot end radiator 54. A wireless receiving module capable of controlling the thermoelectric semiconductor sheet 51 is provided in the cabin body 1. The wireless receiving module can remotely receive the user's control signal to control the operating state of the thermoelectric semiconductor sheet 51; and when the thermoelectric semiconductor When the sheet 51 is energized in the forward direction, the cold surface 511 of the thermoelectric semiconductor sheet 51 is cooled, and the cold-end internal circulation fan 53 and the cold-end heat exchanger 52 blow the cold-end air into the helmet body 1 for rapid cooling, and the hot-end radiator 54 can absorb the heat generated by the cooling of the thermoelectric semiconductor sheet 51, and the hot-end heat dissipation fan 55 can accelerate the heat dissipation efficiency; when the thermoelectric semiconductor 51 is energized in the reverse direction, the cold surface 511 of the thermoelectric semiconductor sheet 51 is converted into a hot surface 512, and the helmet body 1 is heated by the above-mentioned cold-end internal circulation fan 53 and the cold-end heat exchanger 52, which can meet the needs of users in various usage environments and improve the user experience.

[0028] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 As shown, a thermoelectric semiconductor thermal insulation foam 56 is provided between the cold-end heat exchanger 52 and the hot-end radiator 54. The center of the thermoelectric semiconductor thermal insulation foam 56 has a semiconductor chip mounting hole 57, and the thermoelectric semiconductor chip 51 is installed in the semiconductor chip mounting hole 57. The semiconductor chip mounting hole 57 can be used to prevent the thermoelectric semiconductor chip 51 from being transferred to the surrounding environment through the thermoelectric semiconductor thermal insulation foam 56, thereby reducing the damage to the cold and improving the cooling efficiency. It can also play a buffering and shock-absorbing role as well as a sealing and noise-reducing effect on the thermoelectric semiconductor.

[0029] Furthermore, the cold-end internal circulation fan 53 is located above the hot-end heat dissipation fan 55 and is arranged correspondingly up and down. An internal circulation fan outlet sealing foam 58 is provided between the cold-end internal circulation fan 53 and the cold-end heat exchanger 52, and a heat dissipation fan outlet sealing foam 59 is provided between the hot-end heat dissipation fan 55 and the hot-end radiator 54. The internal circulation fan outlet sealing foam 58 and the heat dissipation fan outlet sealing foam 59 can both play a sealing role, effectively prevent air leakage in the gap between components, and absorb the vibration and noise generated during the operation of the cold-end internal circulation fan 53 and the hot-end heat dissipation fan 55, thereby playing a shock-absorbing and noise-reducing role.

[0030] Among them, the air guide structure 4 includes a plurality of circulating air outlet holes 41 arranged on one side of the upper end of the air guide cover 3 and corresponding to the cold end heat exchanger 52, and a circulating air inlet hole 42 corresponding to the cold end internal circulation fan 53 is provided on the other side of the upper end of the air guide cover 3. The circulating air inlet holes 42 can facilitate the cold end circulation fan 53 to extract the air inside the helmet body 1 for heat exchange, and discharge the heat-exchanged air into the helmet body 1 through the circulating air outlet holes 41, which can quickly cool down or heat up the air inside the helmet body 1 to ensure the user experience.

[0031] Combine Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 As shown, a heat exchange air inlet 22 corresponding to the hot-end cooling fan 55 is provided at the bottom of the cabin body 2, and a heat exchange air outlet 23 is provided on the outer side of one end of the hot-end radiator 54 away from the hot-end cooling fan 55, and a curved air guide surface 24 is provided on the end of the hot-end radiator 54 away from the hot-end cooling fan 55, which is located above the heat exchange air outlet 23. The heat exchange air inlet 22 can facilitate the hot-end cooling fan 55 to draw outside air to exchange heat with the hot-end radiator 54, and the heat exchange air outlet 23 can facilitate the discharge of the air after heat exchange from the hot-end radiator 54 to the outside. The curved air guide surface 24 can guide the air after heat exchange from the hot-end radiator 54 toward the heat exchange air outlet 23, thereby ensuring the control of heat exchange effect and heat dissipation effect.

[0032] Among them, a fan mounting bracket 6 capable of supporting the thermoelectric semiconductor heat exchange structure 5 is provided in the air guide cover 3, and the fan mounting bracket 6 is fixedly arranged in the cabin body 2 through the bracket mounting assembly 7. The cold-end internal circulation fan 53 is arranged at one end of the fan mounting bracket 6, and the other end of the fan mounting bracket 6 is provided with a cold-end heat dissipation mounting groove 61 connected to the cold-end internal circulation fan 53 and the circulating air outlet 41. The cold-end heat exchanger 52 is arranged in the cold-end heat dissipation mounting groove 61. The fan mounting bracket 6 can facilitate the placement of the cold-end internal circulation fan 53 and the cold-end radiator 52. The bracket mounting assembly 7 can facilitate the fan mounting bracket 6 to be fixed on the cabin body 2. The cold-end heat dissipation mounting groove 61 can facilitate the positioning and placement of the cold-end radiator 52.

[0033] The fan mounting bracket 6 is housed in a hollow tube which is provided with a plurality of support plates 72 arranged on the bottom surface of the heat exchanger 22, and the support plates 73 are provided on the bottom surface of the heat exchanger 22. The support plates 73 are provided on the bottom surface of the heat exchanger 22, and the support plates 73 are provided on the bottom surface of the heat exchanger 22.

[0034] Combine Figure 3 As shown, the hot-end heat dissipation fan 55 is arranged between the fan limit support plates 72 and is arranged against the fan limit support plates 72. One end of the fan mounting bracket 6 is fixedly set on the fan limit support plate 72, and the fan mounting bracket 6 is fixedly connected to the fan limit support plate 72 by a number of fixing screws. The hot-end heat dissipation fan 55 can be limited by the fan limit support plate 72, and the fan limit support plate 72 can ensure the support effect of the fan mounting bracket 6.

[0035] The principle of this embodiment is that the helmet body 1 is arranged in the helmet placement slot 21 in the cockpit body 2, the air guide cover 3 in the helmet placement slot 21 is arranged in the helmet body 1 through the opening of the helmet body 1, and the thermoelectric semiconductor heat exchange structure 4 in the air guide cover 3 exchanges heat with the air in the helmet body 1 through the air guide structure 4, which can quickly cool down or heat up the helmet body 1, meet the user's usage needs, and improve the user experience.

[0036] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments without departing from the spirit of the present invention or exceeding the scope of the appended claims.

[0037] Although this article uses more terms such as helmet body 1, cockpit body 2, helmet placement slot 21, heat exchange air inlet 22, heat exchange air outlet 23, curved air guide surface 24, air guide upper cover 3, air guide structure 4, circulation air outlet 41, circulation air inlet 42, thermoelectric semiconductor heat exchange structure 5, thermoelectric semiconductor chip 51, cold surface 511, hot surface 512, cold end heat exchanger 52, cold end internal circulation fan 53, hot end radiator 54, hot end heat dissipation fan 55, thermoelectric semiconductor insulation foam 56, semiconductor chip mounting hole 57, internal circulation fan air outlet sealing foam 58, heat dissipation fan air outlet sealing foam 59, fan mounting bracket 6, cold end heat dissipation mounting slot 61, bracket mounting assembly 7, bracket support plate 71, fan limit support plate 72, hot end heat dissipation channel 73, etc., it does not exclude the possibility of using other terms. These terms are used only to more conveniently describe and explain the essence of the present invention; any additional limitation construed in them would be contrary to the spirit of the present invention.

Claims

1. A helmet cockpit intelligent two-way temperature control device, comprising a cockpit body (2) for placing a helmet body (1), characterized in that: The cockpit body (2) is provided with an air guide cover (3) adapted to the lower opening of the helmet body (1) and extending to the inner side of the helmet body (1); the upper end of the air guide cover (3) is provided with an air guide structure (4) corresponding to the inner side of the helmet body (1); and a thermoelectric semiconductor heat exchange structure (5) corresponding to the air guide structure (4) is provided on the inner side of the air guide cover (3).

2. The intelligent two-way temperature control device for a helmet cockpit according to claim 1, characterized in that: The cockpit body (2) has a helmet placement slot (21), and the lower end of the wind guide cover (3) is open and the lower end of the wind guide cover (3) is fixed to the bottom of the helmet placement slot (21) by a plurality of cover mounting screws.

3. The intelligent two-way temperature control device for a helmet cockpit according to claim 1 or 2, characterized in that: The thermoelectric semiconductor heat exchange structure (5) comprises a thermoelectric semiconductor sheet (51) having a cold surface (511) on one side and a hot surface (512) on the other side, the cold surface (511) of the thermoelectric semiconductor sheet (51) being in contact with a cold-end heat exchanger (52), and a cold-end internal circulation fan (53) being provided at one end of the cold-end heat exchanger (52), and the hot surface (512) of the thermoelectric semiconductor sheet (51) being in contact with a hot-end radiator (54), and a hot-end heat dissipation fan (55) being provided at one end of the hot-end radiator (54).

4. The intelligent two-way temperature control device for a helmet cockpit according to claim 3, characterized in that: A thermoelectric semiconductor thermal insulation foam (56) is provided between the cold-end heat exchanger (52) and the hot-end radiator (54), the center of the thermoelectric semiconductor thermal insulation foam (56) has a semiconductor chip mounting hole (57), and the thermoelectric semiconductor chip (51) is mounted in the semiconductor chip mounting hole (57).

5. The intelligent two-way temperature control device for a helmet cockpit according to claim 3, characterized in that: The cold-end internal circulation fan (53) is located above the hot-end heat dissipation fan (55) and is arranged correspondingly up and down. An internal circulation fan outlet sealing foam (58) is provided between the cold-end internal circulation fan (53) and the cold-end heat exchanger (52), and a heat dissipation fan outlet sealing foam (59) is provided between the hot-end heat dissipation fan (55) and the hot-end radiator (54).

6. The intelligent two-way temperature control device for a helmet cockpit according to claim 3, characterized in that: The air guide structure (4) includes a plurality of circulating air outlet holes (41) arranged on one side of the upper end of the air guide cover (3) and corresponding to the cold end heat exchanger (52), and the other side of the upper end of the air guide cover (3) is provided with circulating air inlet holes (42) corresponding to the cold end internal circulation fan (53).

7. The intelligent two-way temperature control device for a helmet cockpit according to claim 3, characterized in that: The bottom of the cabin body (2) is provided with a heat exchange air inlet hole (22) corresponding to the hot end heat dissipation fan (55), the outer side of the hot end radiator (54) away from the hot end heat dissipation fan (55) is provided with a heat exchange air outlet hole (23) located at the bottom of the cabin body (2), and the end of the hot end radiator (54) away from the hot end heat dissipation fan (55) is provided with an arc-shaped air guide surface (24) located above the heat exchange air outlet hole (23).

8. The intelligent two-way temperature control device for a helmet cockpit according to claim 7, characterized in that: A fan mounting bracket (6) capable of supporting a thermoelectric semiconductor heat exchange structure (5) is provided in the air guide upper cover (3); the fan mounting bracket (6) is fixedly arranged in the cabin body (2) through a bracket mounting assembly (7); the cold end internal circulation fan (53) is arranged at one end of the fan mounting bracket (6); and the other end of the fan mounting bracket (6) is provided with a cold end heat dissipation mounting groove (61) connected to the cold end internal circulation fan (53) and the circulating air outlet (41); and the cold end heat exchanger (52) is arranged in the cold end heat dissipation mounting groove (61).

9. The intelligent two-way temperature control device for a helmet cockpit according to claim 8, characterized in that: The bracket mounting assembly (7) includes bracket support plates (71) respectively arranged on both sides of the hot end radiator (54), one end of the bracket support plate (71) is connected to the arc-shaped air guide surface (24), and one end of the fan mounting bracket (6) is abutted against the bracket support plate (71) and fixedly connected by a plurality of fixing bolts, and the other end of the bracket support plate (71) has a plurality of fan limit support plates (72) arranged on the circumferential outside of the heat exchange air inlet hole (22), and a hot end heat dissipation channel (73) is formed between adjacent bracket support plates (71), the hot end radiator (54) is arranged in the hot end heat dissipation channel (73), and the hot end heat dissipation channel (73) is connected to the cold end heat dissipation mounting groove (61).

10. The intelligent two-way temperature control device for a helmet cockpit according to claim 9, characterized in that: The hot end heat dissipation fan (55) is arranged between the fan limit support plates (72) and is arranged against the fan limit support plates (72), one end of the fan mounting bracket (6) is fixedly arranged on the fan limit support plates (72), and the fan mounting bracket (6) is fixedly connected to the fan limit support plates (72) by a plurality of fixing screws.

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