Electronic device and liquid cooling heat dissipation assembly

Abstract

The invention relates to an electronic device and a liquid cooling heat dissipation assembly. The invention discloses an electronic device and a liquid cooling heat dissipation assembly. The electronic device comprises a shell, the liquid cooling heat dissipation assembly and a hard disk. The liquid cooling heat dissipation assembly comprises a heat exchange part, a liquid inlet pipe, a liquid outlet pipe and a fin structure. The heat exchange part is provided with a liquid inlet flow channel, a bent flow channel and a liquid outlet flow channel. The bent flow channel is provided with a liquid inlet section, a communicating section and a liquid outlet section. And one end of the liquid inlet pipe and one end of the liquid inlet section are communicated with the liquid inlet flow channel. And one end of the communicating section is communicated with the other end of the liquid inlet section. And the communicating section is not parallel to the liquid inlet section. And one end of the liquid outlet section is communicated with the other end of the communication section. And the liquid outlet section is not parallel to the communicating section. And the other end of the liquid outlet section and the liquid outlet pipe are communicated with the liquid outlet flow channel. The width of the liquid inlet section is larger than that of the liquid outlet section. The fin structure comprises a first fin and a second fin. The first fins are arranged in the liquid inlet section. The second fins are arranged in the liquid outlet section. The hard disk is arranged in the shell.

Description

Technical Field

[0001] The present application relates to the technical field of computer equipment, and in particular to an electronic device and a liquid cooling and heat dissipation component. Background Art

[0002] Modern society is in an era of rapid development of information technology. Most companies use servers to assist in business processing, such as using the hard disk in the server to store programs, files and data to improve work efficiency.

[0003] To cope with the increase in data processing volume, the number of hard drives has also increased. When these hard drives operate, they generate a significant amount of heat. Typically, these drives are cooled using air or liquid cooling systems. However, current hard drive cooling efficiency is still insufficient, which in turn affects hard drive operation. Therefore, improving hard drive cooling efficiency is one of the issues that researchers need to address. Summary of the Invention

[0004] The present invention provides an electronic device and a liquid cooling heat dissipation component, so as to improve the heat dissipation efficiency of a hard disk.

[0005] An electronic device according to one embodiment of the present invention is used to accommodate a cooling fluid and includes a housing, a liquid cooling and heat dissipation assembly, and at least one hard disk. The housing is used to accommodate the cooling fluid. The liquid cooling and heat dissipation assembly is used to circulate the cooling fluid and includes a heat exchange portion, a liquid inlet pipe, a liquid outlet pipe, and a fin structure. The heat exchange portion includes a liquid inlet channel, at least one curved channel, and a liquid outlet channel. The at least one curved channel includes a liquid inlet section, a connecting section, and a liquid outlet section. One end of the liquid inlet pipe and the liquid inlet section are connected to the liquid inlet channel. One end of the connecting section is connected to the other end of the liquid inlet section. The connecting section and the liquid inlet section are not parallel. The connecting section extends away from the liquid inlet pipe. One end of the liquid outlet section is connected to the other end of the connecting section. The liquid outlet section and the connecting section are not parallel. The liquid inlet section and the liquid outlet section are side by side. The other end of the liquid outlet section and the liquid outlet pipe are connected to the liquid outlet channel. The width of the liquid inlet section is greater than the width of the liquid outlet section. The fin structure includes a plurality of first fins and a plurality of second fins. The first fins are disposed in the liquid inlet section. The second fins are disposed in the liquid outlet section. The number of the first fins is greater than the number of the second fins. At least one hard disk is disposed in the housing and is immersed in the cooling fluid.

[0006] Another embodiment of the present invention relates to a liquid cooling heat dissipation assembly for being disposed within a housing and for circulating a cooling fluid. The liquid cooling heat dissipation assembly includes a heat exchange portion, a liquid inlet pipe, a liquid outlet pipe, and a fin structure. The heat exchange portion includes a liquid inlet channel, at least one curved channel, and a liquid outlet channel. The at least one curved channel includes a liquid inlet section, a connecting section, and a liquid outlet section. One end of the liquid inlet section is connected to the liquid inlet channel. One end of the connecting section is connected to the other end of the liquid inlet section. The connecting section is not parallel to the liquid inlet section. One end of the liquid outlet section is connected to the other end of the connecting section. The liquid outlet section is not parallel to the connecting section. The liquid inlet section and the liquid outlet section are side by side. The other end of the liquid outlet section is connected to the liquid outlet channel. The width of the liquid inlet section is greater than the width of the liquid outlet section. The liquid inlet pipe is connected to the liquid inlet channel. The connecting section extends away from the liquid inlet pipe. The liquid outlet pipe is connected to the liquid outlet channel. The fin structure includes a plurality of first fins and a plurality of second fins. The first fins are arranged in the liquid inlet section, the second fins are arranged in the liquid outlet section, and the number of the first fins is greater than the number of the second fins.

[0007] According to the electronic device and liquid cooling assembly of the above-described embodiment, because the width of the liquid inlet section near the liquid inlet pipe is greater than the width of the liquid outlet section near the liquid outlet pipe, the cooling fluid, which has been cooled by flowing through the first fins, can accelerate its flow rate near the liquid outlet pipe through the narrower liquid outlet section, thereby improving the heat dissipation efficiency of the cooling fluid near the liquid outlet pipe. This improves the overall heat dissipation efficiency of the hard drive.

[0008] Furthermore, because at least one zigzag flow channel comprises a curved, interconnected liquid inlet section, a connecting section, and a liquid outlet section, and the first and second fins are disposed within the liquid inlet and outlet sections, respectively, the system resistance within the flow channel of the liquid cooling component can be increased, allowing the cooling fluid to flow more evenly within the heat exchange portion. This further enhances the heat dissipation efficiency of the hard drive. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 2 is an exploded schematic diagram of an electronic device according to an embodiment of the present invention.

[0010] Figure 2 for Figure 1 A three-dimensional schematic diagram of an electronic device with the top plate omitted.

[0011] Figure 3 For the Figure 2 Schematic cross-sectional view of the electronic device along the 3-3 secant line.

[0012] Figure 4 for Figure 1 A three-dimensional schematic diagram of a liquid cooling heat dissipation component of an electronic device.

[0013] Figure 5 For the Figure 4A schematic cross-sectional view of a liquid cooling assembly of an electronic device taken along a 5-5 cut line.

[0014] Figure 6 For the Figure 4 Another schematic cross-sectional view of a liquid cooling assembly of an electronic device shown along the 6-6 cut line.

[0015] Figure 7 For cooling fluid Figure 1 A three-dimensional schematic diagram of the flow within an electronic device.

[0016] Figure 8 For cooling fluid along Figure 2 Schematic cross-sectional view of the flow of the busbar portion of the electronic device along the 8-8 secant line.

[0017] Figure 9 For cooling fluid Figure 1 A cross-sectional schematic diagram of the flow within a liquid cooling heat dissipation component of an electronic device.

[0018] Figure 10 For cooling fluid Figure 1 Another cross-sectional schematic diagram of the flow within the liquid cooling heat dissipation component of the electronic device.

[0019] Figure 11 For cooling fluid along Figure 2 A schematic cross-sectional view of the flow of the shunt portion of the electronic device along the 11-11 cut line.

[0020] Figure Number:

[0021] 10. Electronic devices;

[0022] 11. Shell; 111. Bottom plate; 112. Top plate; 113. Partition plate;

[0023] 12. Liquid-cooling heat dissipation assembly; 121. Heat exchange unit; 1211. Liquid inlet channel; 1212. Bend channel; 12121. Liquid inlet section; 12122. Connecting section; 12123. Liquid outlet section; 1213. Liquid outlet channel; 122. Liquid inlet pipe; 123. Liquid outlet pipe; 124. Fin structure; 1241. First fin; 1242. Second fin; 125. Pump; 126. Confluence unit; 1261. Confluence pipe; 1262. Inlet pipe; 127. Diversion unit; 1271. Diversion pipe; 1272. Outlet pipe;

[0024] 13. Fan;

[0025] 14. Hard disk;

[0026] A~O, directions; S1, first accommodation space; S2, second accommodation space; W1, W2, width. DETAILED DESCRIPTION

[0027] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0028] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0029] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0030] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0031] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0032] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0033] See also Figures 1 to 3 . Figure 1 2 is an exploded schematic diagram of an electronic device according to an embodiment of the present invention. Figure 2 for Figure 1 A three-dimensional schematic diagram of an electronic device with the top plate omitted. Figure 3 For the Figure 2 Schematic cross-sectional view of the electronic device along the 3-3 secant line.

[0034] The electronic device 10 of this embodiment is, for example, a JBOD (Just a Bunch of Disks) configuration. JBOD refers to combining multiple hard drives into a single storage component, thereby providing greater storage capacity. For example, JBOD can be used in areas such as big data analysis, multimedia storage, and data archiving.

[0035] The electronic device 10 is used to contain a cooling fluid (not shown). The cooling fluid is, for example, mineral oil, but is not limited thereto. In other embodiments, the cooling fluid may also be, for example, water or a refrigerant.

[0036] The electronic device 10 includes a housing 11, a liquid cooling heat dissipation component 12, a plurality of fans 13 and a plurality of hard disks 14. The housing 11 includes a bottom plate 111, a top plate 112 and a partition 113. The partition 113 is located between the bottom plate 111 and the top plate 112. A first accommodation space S1 is formed between the bottom plate 111 and the partition 113. A second accommodation space S2 is formed between the partition 113 and the top plate 112. The distance between the bottom plate 111 and the partition 113 is, for example, 4U, and the distance between the partition 113 and the top plate 112 is, for example, 1U. The first accommodation space S1 is used to accommodate cooling fluid. The liquid cooling heat dissipation component 12 is arranged in the second accommodation space S2 and is used for circulation of cooling fluid.

[0037] Please also refer to Figures 4 to 6 . Figure 4 for Figure 1 A three-dimensional schematic diagram of a liquid cooling heat dissipation component of an electronic device. Figure 5 For the Figure 4 A schematic cross-sectional view of a liquid cooling assembly of an electronic device taken along a 5-5 cut line. Figure 6 For the Figure 4 Another schematic cross-sectional view of a liquid cooling assembly of an electronic device shown along the 6-6 cut line.

[0038] The liquid cooling assembly 12 is, for example, a tube-and-strip radiator and includes a heat exchange portion 121, a liquid inlet pipe 122, a liquid outlet pipe 123, a fin structure 124, and a pump 125. The heat exchange portion 121 has a liquid inlet channel 1211, two curved channels 1212, and a liquid outlet channel 1213. The two curved channels 1212 are located on opposite sides of the liquid inlet channel 1211 and the liquid outlet channel 1213.

[0039] Each zigzag channel 1212 has multiple liquid inlet sections 12121, connecting sections 12122, and multiple liquid outlet sections 12123. Since these liquid inlet sections 12121 and these liquid outlet sections 12123 are symmetrically located on opposite sides of the liquid inlet channel 1211 and the liquid outlet channel 1213, and each liquid inlet section 12121 and each liquid outlet section 12123 have the same structure, the following description will focus on one liquid inlet section 12121 and one liquid outlet section 12123.

[0040] The liquid inlet pipe 122 and one end of the liquid inlet section 12121 are connected to the liquid inlet channel 1211. One end of the connecting section 12122 is connected to the other end of the liquid inlet section 12121. The connecting section 12122 is not parallel to the liquid inlet section 12121. The connecting section 12122 extends away from the liquid inlet pipe 122. One end of the liquid outlet section 12123 is connected to the other end of the connecting section 12122. The liquid outlet section 12123 is not parallel to the connecting section 12122. The liquid inlet section 12121 and the liquid outlet section 12123 are side by side. The other end of the liquid outlet section 12123 and the liquid outlet pipe 123 are connected to the liquid outlet channel 1213. The width W1 of the liquid inlet section 12121 is, for example, greater than the width W2 of the liquid outlet section 12123.

[0041] The arrangement direction of the curved channels 1212 on each side of the liquid inlet channel 1211 and the liquid outlet channel 1213 is, for example, perpendicular to the arrangement direction of the liquid inlet pipe 122 and the liquid outlet pipe 123. In other words, the curved channels 1212 on each side of the liquid inlet channel 1211 and the liquid outlet channel 1213 are stacked in a vertical direction, while the liquid inlet pipe 122 and the liquid outlet pipe 123 are arranged in a horizontal direction.

[0042] The fin structure 124 includes a plurality of first fins 1241 and a plurality of second fins 1242. The first fins 1241 are respectively disposed in the liquid inlet sections 12121. The second fins 1242 are respectively disposed in the liquid outlet sections 12123. The number of the first fins 1241 is, for example, greater than the number of the second fins 1242.

[0043] In this embodiment, the heat exchange capacity of the liquid-cooled heat dissipation component 12 can satisfy the following equation: Q = H × A × (T1-T2). Among them, Q refers to the heat exchange capacity. H refers to the heat exchange coefficient. A refers to the heat exchange area. T1 refers to the temperature of the heat source. T2 refers to the temperature of the cooling fluid. When the flow rate of the cooling fluid is higher or the degree of turbulence of the cooling fluid is higher, the heat exchange coefficient is higher, and the heat exchange capacity can be increased to improve the heat dissipation efficiency. In addition, the greater the temperature difference between the heat source and the cooling fluid, the greater the value of T1-T2, and the heat exchange capacity can be increased to improve the heat dissipation efficiency.

[0044] In this embodiment, by disposing the first fins 1241 in the liquid inlet sections 12121 and the second fins 1242 in the liquid outlet sections 12123 , the turbulence of the cooling fluid can be increased, thereby increasing the heat exchange coefficient to enhance the heat dissipation efficiency of the liquid-cooled heat dissipation component 12 .

[0045] Furthermore, when the heat-absorbing cooling fluid flows into the liquid inlet pipe 122, it is cooled by flowing through the first fins 1241. As the cooled cooling fluid flows near the liquid outlet pipe 123, the value of T1-T2 decreases, reducing heat dissipation efficiency. Therefore, by providing these outlet sections 12123 with smaller widths near the liquid outlet pipe 123, the flow rate of the cooling fluid in these outlet sections 12123 can be increased, thereby increasing the heat exchange coefficient and further improving the heat dissipation efficiency of the cooling fluid near the liquid outlet pipe 123. In this way, the cooling fluid can maintain high heat dissipation efficiency even when its temperature drops.

[0046] The pump 125 is arranged in the liquid inlet pipe 122 and is connected to the liquid inlet pipe 122. The pump 125 is used to drive the cooling fluid to flow. These fans 13 are arranged in the second accommodating space S2 of the shell 11 and are located on one side of the liquid outlet pipe 123. These fans 13 are used to generate a cooling airflow flowing through the heat exchange part 121 to dissipate heat from the heat exchange part 121. Among them, these fans 13 are, for example, exhaust fans. In addition, the liquid-cooled heat dissipation component 12 and these fans 13 together constitute a heat dissipation system that combines air cooling and liquid cooling. The hard disk 14 is arranged in the first accommodating space S1 of the shell 11 and is used to be immersed in the cooling fluid so that the cooling fluid absorbs the heat generated when the hard disk 14 is in operation.

[0047] In this embodiment, the liquid cooling heat dissipation assembly 12 may further include a confluence portion 126. The confluence portion 126 includes a confluence pipe 1261 and a plurality of inlet pipes 1262. These inlet pipes 1262 and the liquid inlet pipe 122 are respectively connected to the opposite sides of the confluence pipe 1261, so that the first accommodation space S1 and the second accommodation space S2 are connected. The confluence pipe 1261 and these inlet pipes 1262 are used to converge the cooling fluid flowing through these hard disks 14 to the liquid inlet pipe 122. In detail, these inlet pipes 1262 extend from the first accommodation space S1 through the partition 113 to the second accommodation space S2. By providing the confluence portion 126, the flow of the cooling fluid can be accelerated, thereby improving the heat dissipation efficiency.

[0048] In this embodiment, the liquid cooling heat dissipation assembly 12 may further include a diverter portion 127. The diverter portion 127 includes a diverter pipe 1271 and a plurality of outlet pipes 1272. These outlet pipes 1272 and the liquid outlet pipe 123 are respectively connected to the opposite sides of the diverter pipe 1271, so that the first accommodation space S1 and the second accommodation space S2 are connected. The diverter pipe 1271 and these outlet pipes 1272 are used to divert the cooling fluid flowing toward these hard disks 14. In detail, these outlet pipes 1272 extend from the first accommodation space S1 through the partition 113 to the second accommodation space S2. By providing the diverter portion 127, the flow of the cooling fluid can be accelerated, thereby improving the heat dissipation efficiency.

[0049] In this embodiment, because the width W1 of the liquid inlet sections 12121 near the liquid inlet pipe 122 is greater than the width W2 of the liquid outlet sections 12123 near the liquid outlet pipe 123, the cooling fluid cooled by flowing through the first fins 1241 can be accelerated by the liquid outlet sections 12123 having smaller widths when flowing near the liquid outlet pipe 123, thereby improving the heat dissipation efficiency of the cooling fluid near the liquid outlet pipe 123. In this way, the overall heat dissipation efficiency of the hard disk 14 can be improved.

[0050] Furthermore, because the heat exchange portion 121 has multiple symmetrically stacked curved channels 1212, the cooling fluid can flow evenly within the heat exchange portion 121. Furthermore, because each curved channel 1212 has a curved, interconnected liquid inlet section 12121, a connecting section 12122, and a liquid outlet section 12123, and because the first fins 1241 and the second fins 1242 are respectively disposed within the liquid inlet section 12121 and the liquid outlet section 12123, the system resistance within the flow channel of the liquid-cooling heat dissipation assembly 12 is reduced, allowing the cooling fluid to flow more evenly within the heat exchange portion 121. This further enhances the heat dissipation efficiency of the hard disk 14.

[0051] In this embodiment, the number of hard disks 14 is multiple, but not limited to this. In other embodiments, the number of hard disks can also be only one.

[0052] In this embodiment, the number of the bending channels 1212 is two, but the present invention is not limited thereto. In other embodiments, the number of the bending channels may be only one or more than three.

[0053] In this embodiment, each of the curved flow channels 1212 has multiple liquid inlet sections 12121 and multiple liquid outlet sections 12123, and each of the curved flow channels 1212 has only one connecting section 12122, but the present invention is not limited thereto. In other embodiments, each of the curved flow channels may have only one liquid inlet section and only one liquid outlet section, and each of the curved flow channels may have multiple connecting sections 12122.

[0054] In this embodiment, the liquid cooling heat dissipation assembly 12 includes a diverter 127 for diverting the cooling fluid from the liquid outlet pipe 123, and a confluence 126 for confluence of the cooling fluid to the liquid inlet pipe 122, but the present invention is not limited thereto. In other embodiments, the liquid cooling heat dissipation assembly may not include a diverter or confluence.

[0055] In this embodiment, the number of fans 13 is multiple, but not limited to this. In other embodiments, the number of fans can also be only one.

[0056] Please also refer to Figures 7 to 11 . Figure 7For cooling fluid Figure 1 A three-dimensional schematic diagram of the flow within an electronic device. Figure 8 For cooling fluid along Figure 2 Schematic cross-sectional view of the flow of the busbar portion of the electronic device along the 8-8 cut line. Figure 9 For cooling fluid Figure 1 A cross-sectional schematic diagram of the flow within a liquid cooling heat dissipation component of an electronic device. Figure 10 For cooling fluid Figure 1 Another cross-sectional schematic diagram of the flow within the liquid cooling heat dissipation component of the electronic device. Figure 11 For cooling fluid along Figure 2 A schematic cross-sectional view of the flow of the shunt portion of the electronic device along the 11-11 cut line.

[0057] In this embodiment, the cooling cycle of the cooling fluid is as follows. First, Figure 7 As shown, the cooling fluid flows in the first accommodating space S1 along the direction A to absorb the heat generated by the hard disks 14 during operation. Figure 8 As shown, the cooling fluid flows from the first accommodating space S1 through the inlet pipes 1262 into the manifold 1261 along direction B, and then flows from the manifold 1261 into the liquid inlet pipe 122 along directions C and D.

[0058] Then, if Figure 7 As shown, the cooling fluid is driven by the pump 125 and flows from the liquid inlet pipe 122 into the liquid inlet channel 1211 of the heat exchange part 121 along the direction E. Figure 9 and Figure 10 As shown, the cooling fluid flows along direction F within the liquid inlet channel 1211 and flows into the liquid inlet section 12121 of the curved channels 1212. The cooling fluid then flows along direction G within the liquid inlet section 12121 and flows to the connecting section 12122. The cooling fluid then flows along direction H within the connecting section 12122 and flows to the liquid outlet section 12123. The cooling fluid then flows along direction I within the liquid outlet section 12123 and flows to the liquid outlet channel 1213. Within the curved channels 1212, the cooling fluid transfers heat to the first fins 1241 and the second fins 1242. The cooling fluid then flows along direction J from the liquid outlet channel 1213 to the liquid outlet pipe 123.

[0059] Then, if Figure 7 As shown, the cooling fluid flows from the liquid outlet pipe 123 to the diversion pipe 1271 along the direction K. Then, as shown in FIG. Figure 11 As shown, the cooling fluid flows from the diversion pipe 1271 to the outlet pipes 1272 along directions L and M, and then flows back to the first accommodating space S1 to perform the next cooling cycle.

[0060] In addition, the fans 13 generate cooling airflow in the first accommodating space S1 to dissipate heat from the liquid cooling element 12. Figure 7 As shown, the cooling airflow flows through the heat exchange portion 121 along direction N to dissipate heat from the first fins 1241 and the second fins 1242 disposed within the heat exchange portion 121. The cooling airflow then flows out of the housing 11 along direction O through the fans 13. This completes the cooling cycle for the hard disks 14.

[0061] According to the electronic device and liquid cooling assembly of the above-described embodiment, since the width of the liquid inlet sections near the liquid inlet pipe is greater than the width of the liquid outlet sections near the liquid outlet pipe, the cooling fluid cooled by flowing through the first fins can be accelerated by the narrower liquid outlet sections near the liquid outlet pipe, thereby improving the heat dissipation efficiency of the cooling fluid near the liquid outlet pipe. This improves the overall heat dissipation efficiency of the hard drive.

[0062] Furthermore, because the heat exchange portion has multiple symmetrically stacked curved flow channels, the cooling fluid can flow evenly within the heat exchange portion. Furthermore, because each curved flow channel has a curved, interconnected liquid inlet section, a connecting section, and a liquid outlet section, and the first and second fins are respectively disposed within the liquid inlet and outlet sections, the system resistance within the flow channel of the liquid-cooling heat dissipation component is reduced, allowing the cooling fluid to flow more evenly within the heat exchange portion. This further improves the heat dissipation efficiency of the hard drives.

[0063] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0064] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An electronic device for containing a cooling fluid, characterized in that The electronic device comprises: a housing for containing the cooling fluid; A liquid cooling heat dissipation component for circulating the cooling fluid, comprising a heat exchange portion, a liquid inlet pipe, a liquid outlet pipe and a fin structure, wherein the heat exchange portion has a liquid inlet channel, at least one bent channel and a liquid outlet channel, at least one bent channel having a liquid inlet section, a connecting section and a liquid outlet section, the liquid inlet pipe and one end of the liquid inlet section are connected to the liquid inlet channel, one end of the connecting section is connected to the other end of the liquid inlet section, the connecting section is not parallel to the liquid inlet section, and the connecting section extends in a direction away from the liquid inlet pipe, the liquid outlet section One end of the connecting section is connected to the other end of the connecting section, the liquid outlet section is not parallel to the connecting section, and the liquid inlet section and the liquid outlet section are side by side, the other end of the liquid outlet section and the liquid outlet pipe are connected to the liquid outlet flow channel, the width of the liquid inlet section is greater than the width of the liquid outlet section, the fin structure includes a plurality of first fins and a plurality of second fins, the plurality of first fins are arranged in the liquid inlet section, and the plurality of second fins are arranged in the liquid outlet section, and the number of the plurality of first fins is greater than the number of the plurality of second fins; and At least one hard disk is disposed in the housing and is used to be immersed in the cooling fluid.

2. The electronic device according to claim 1, wherein: The liquid cooling heat dissipation component also includes a diverter portion, which includes a diverter pipe and multiple outlet pipes. The multiple outlet pipes and the liquid outlet pipe are respectively connected to the opposite sides of the diverter pipe, and the diverter pipe and the multiple outlet pipes are used to divert the cooling fluid flowing toward at least one hard disk.

3. The electronic device according to claim 1, wherein: The liquid cooling heat dissipation assembly also includes a confluence portion, which includes a confluence pipe and multiple inlet pipes. The multiple inlet pipes and the liquid inlet pipe are respectively connected to the opposite sides of the confluence pipe, and the confluence pipe and the multiple inlet pipes are used to converge the cooling fluid flowing through at least one hard disk to the liquid inlet pipe.

4. The electronic device according to claim 1, wherein: The liquid cooling heat dissipation component further includes a pump, which is disposed on the liquid inlet pipe and communicated with the liquid inlet pipe, and is used to drive the cooling fluid to flow.

5. The electronic device according to claim 1, wherein: The electronic device further includes at least one fan, which is disposed in the housing and located on one side of the liquid outlet pipe. The at least one fan is used to generate a cooling airflow flowing through the heat exchange portion.

6. The electronic device according to claim 1, wherein: There are multiple at least one bending channel, and the multiple bending channels are respectively located on two opposite sides of the liquid inlet channel and the liquid outlet channel.

7. A liquid cooling heat dissipation assembly, for being arranged in a housing and for circulating cooling fluid, characterized in that: The liquid cooling heat dissipation component includes: A heat exchange portion, comprising a liquid inlet channel, at least one curved channel, and a liquid outlet channel, wherein at least one curved channel comprises a liquid inlet section, a connecting section, and a liquid outlet section, wherein one end of the liquid inlet section is connected to the liquid inlet channel, one end of the connecting section is connected to the other end of the liquid inlet section, the connecting section is not parallel to the liquid inlet section, one end of the liquid outlet section is connected to the other end of the connecting section, the liquid outlet section is not parallel to the connecting section, the liquid inlet section and the liquid outlet section are side by side, the other end of the liquid outlet section is connected to the liquid outlet channel, and the width of the liquid inlet section is greater than the width of the liquid outlet section; a liquid inlet pipe, connected to the liquid inlet channel, and the communicating section extends in a direction away from the liquid inlet pipe; a liquid outlet pipe, connected to the liquid outlet channel; and The fin structure includes a plurality of first fins and a plurality of second fins, wherein the plurality of first fins are arranged in the liquid inlet section, and the plurality of second fins are arranged in the liquid outlet section, and the number of the plurality of first fins is greater than the number of the plurality of second fins.

8. The liquid cooling heat dissipation assembly according to claim 7, characterized in that: The liquid cooling heat dissipation component also includes a diverter portion, which includes a diverter pipe and multiple outlet pipes. The multiple outlet pipes and the liquid outlet pipe are respectively connected to the opposite sides of the diverter pipe, and the diverter pipe and the multiple outlet pipes are used to divert the cooling fluid flowing toward at least one hard disk.

9. The liquid cooling heat dissipation assembly according to claim 7, characterized in that: The liquid cooling heat dissipation component also includes a confluence portion, which includes a confluence pipe and multiple inlet pipes. The multiple inlet pipes and the liquid inlet pipe are respectively connected to the opposite sides of the confluence pipe, and the confluence pipe and the multiple inlet pipes are used to converge the cooling fluid flowing through at least one hard disk to the liquid inlet pipe.

10. The liquid cooling heat dissipation assembly according to claim 7, characterized in that: There are multiple at least one bending channel, and the multiple bending channels are respectively located on two opposite sides of the liquid inlet channel and the liquid outlet channel.

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