Hole forming method, device, and electronic device

Abstract

The present specification provides a substrate hole opening method, device and electronic equipment, which can be used in the field of semiconductor device processing. Based on the method, after obtaining a target substrate to be opened, a first type of etching operation can be performed on the first metal layer and the second metal layer on the surface of the core layer of the target substrate respectively, so as to open a matched first hole and a second hole on the first metal layer and the second metal layer respectively; then, a second type of etching operation is performed on the core layer through the first hole and / or the second hole, so as to open a third hole on the core layer, and then a required target hole can be obtained. Thus, a micro-hole with small size and high quality can be accurately opened on the substrate at a relatively small processing cost.

Description

Technical Field

[0001] This specification pertains to the field of semiconductor device fabrication technology, and particularly relates to methods, apparatus, and electronic devices for opening holes in substrates. Background Technology

[0002] Currently, most methods involve mechanical drilling to create holes in printed circuit boards (PCBs). However, electronic devices such as microphones have relatively high requirements for hole size and precision. Existing methods often struggle to accurately create small, compliant micro-holes on the substrate at a low cost.

[0003] There is currently no effective solution to the above problems. Summary of the Invention

[0004] This specification provides a method, apparatus, and electronic device for creating holes in a substrate, which can precisely create small, high-quality microholes on a substrate with relatively low processing costs.

[0005] This specification provides a method for creating openings in a substrate, including:

[0006] Obtain a target substrate; wherein the target substrate includes at least a core layer, and a first metal layer and a second metal layer are respectively disposed on a first surface and a second surface of the core layer;

[0007] A first type of etching operation is performed on the first metal layer and the second metal layer respectively to create a matching first hole and a second hole on the first metal layer and the second metal layer respectively;

[0008] A second type of etching operation is performed on the core layer through the first and / or second holes to create a third hole on the core layer.

[0009] In one embodiment, the first metal layer and the second metal layer are copper layers, and the core layer is a resin layer.

[0010] In one embodiment, the first type of etching operation includes chemical etching, and the second type of etching operation includes laser etching.

[0011] In one embodiment, performing a second type of etching operation on the core layer through a first via and / or a second via includes:

[0012] Based on the materials of the first metal layer, the second metal layer, and the core layer, the matching target wavelength is determined;

[0013] Using a laser of the target wavelength, a second type of etching operation is performed on the core layer through the first and / or second holes to create a third hole on the core layer.

[0014] In one embodiment, a second type of etching operation is performed on the core layer using a laser of a target wavelength through a first aperture and / or a second aperture, including:

[0015] By controlling a carbon dioxide laser and using a laser of a target wavelength, a second type of etching operation is performed on the core layer through a first hole and / or a second hole.

[0016] In one embodiment, after creating a third hole in the core layer, the method further includes:

[0017] Remove the remaining first metal layer and the remaining second metal layer on the target substrate to obtain the target hole that meets the requirements.

[0018] In one embodiment, after performing a first type of etching operation on the first metal layer and the second metal layer respectively, a plurality of first holes are formed on the first metal layer and a plurality of second holes are formed on the second metal layer.

[0019] Accordingly, the second type of etching operation is performed on the core layer through the first and / or second holes to create a third hole on the core layer, including:

[0020] Using a laser of the target wavelength, a second type of etching operation is performed on the core layer through multiple first holes and / or multiple second holes, thereby creating multiple third holes on the core layer.

[0021] In one embodiment, the matching first hole and second hole include: a first hole and a second hole whose relative distance between the hole center positions and / or hole diameter meet preset requirements.

[0022] In one embodiment, the matching first hole and second hole are such that the relative distance between the center positions of the holes is equal to half the sum of the diameters of the first hole and the second hole;

[0023] Accordingly, a second type of etching operation is performed on the core layer through the first and / or second vias, and a third via is formed on the core layer, including:

[0024] A second type of etching operation is performed on the core layer through the first hole; and a second type of etching operation is performed on the core layer through the second hole to create a third hole on the core layer that corresponds to the matching first and second holes.

[0025] In one embodiment, after creating a third hole in the core layer, the method further includes:

[0026] Protective layers are applied to the outer surfaces of the first and second metal layers respectively to obtain the target hole that meets the requirements.

[0027] In one embodiment, protective layers are respectively provided on the outer surfaces of the first metal layer and the second metal layer, including:

[0028] By performing electroless nickel-plating and gold-immersion operations on the outer surfaces of the first and second metal layers respectively, a coating is formed on the outer surfaces of the first and second metal layers to serve as the protective layer.

[0029] In one embodiment, the first hole and the second hole comprise trapezoidal holes.

[0030] In one embodiment, after forming matching first holes and second holes on the first metal layer and the second metal layer, respectively, the method further includes:

[0031] A light-focusing coating is applied to the inner surfaces of the first and second holes.

[0032] This specification also provides another method for creating openings in the substrate, including:

[0033] Obtain a target substrate; wherein the target substrate includes at least a core layer, and at least a first metal layer is disposed on the surface of the core layer;

[0034] A first type of etching operation is performed on the first metal layer to create a corresponding first hole in the first metal layer;

[0035] Through the first hole, a second type of etching operation is performed on the core layer to obtain a hole that meets the requirements.

[0036] This specification also provides a substrate opening device, including:

[0037] An acquisition module is used to acquire a target substrate; wherein the target substrate includes at least a core layer, and a first metal layer and a second metal layer are respectively disposed on a first surface and a second surface of the core layer;

[0038] The first etching module is used to perform a first type of etching operation on the first metal layer and the second metal layer respectively, so as to open a matching first hole and a second hole on the first metal layer and the second metal layer respectively.

[0039] The second etching module is used to perform a second type of etching operation on the core layer through the first hole and / or the second hole, and to open a third hole on the core layer.

[0040] This specification also provides an electronic device, including a processor and a memory for storing processor-executable instructions, wherein the processor, when executing the instructions, implements the relevant steps of the method for opening a hole in the substrate.

[0041] This specification also provides a computer-readable storage medium storing computer instructions that, when executed by a processor, implement the relevant steps of the method for opening holes in the substrate.

[0042] This specification also provides a computer program product comprising a computer program that, when executed by a processor, implements the relevant steps of the method for opening holes in the substrate.

[0043] Based on the substrate drilling method, apparatus, and electronic device provided in this specification, after obtaining the target substrate to be drilled, a first type of etching operation can be performed on the first metal layer and the second metal layer on the surface of the core layer of the target substrate to create a matching first hole and a second hole on the first metal layer and the second metal layer, respectively; then, through the first hole and / or the second hole, a second type of etching operation is performed on the core layer to create a third hole on the core layer, thereby obtaining a target hole suitable for subsequent applications and meeting the requirements. This allows for the precise drilling of small-sized, high-quality microholes on the substrate with relatively low processing costs. Attached Figure Description

[0044] To more clearly illustrate the embodiments of this specification, the accompanying drawings used in the embodiments will be briefly introduced below. The drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a schematic flowchart of a substrate opening method provided in one embodiment of this specification;

[0046] Figure 2 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0047] Figure 3 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0048] Figure 4 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0049] Figure 5 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0050] Figure 6 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0051] Figure 7 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0052] Figure 8 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0053] Figure 9 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0054] Figure 10 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0055] Figure 11 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0056] Figure 12 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0057] Figure 13 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0058] Figure 14 This is a schematic flowchart of a substrate opening method provided in another embodiment of this specification;

[0059] Figure 15 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0060] Figure 16 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example.

[0061] Figure 17 This is a schematic diagram of the structural composition of an electronic device provided in one embodiment of this specification;

[0062] Figure 18 This is a schematic diagram of the structure of the opening device for a substrate provided in one embodiment of this specification;

[0063] Figure 19 This is a schematic diagram of one embodiment of the substrate opening method provided in the embodiments of this specification, applied in a scenario example. Detailed Implementation

[0064] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.

[0065] It should be noted that the information and data related to users involved in the embodiments of this specification are all information and data authorized by the user or fully authorized by the relevant parties. Furthermore, the collection, storage, use, processing, transmission, provision, disclosure, and application of the relevant data all comply with relevant laws, regulations, and standards, and necessary confidentiality measures have been taken. They do not violate public order and good morals, and corresponding operation entry points are provided for users or relevant parties to choose to authorize or refuse.

[0066] It should also be noted that in the embodiments of this specification, certain software, components, models and other existing solutions in the industry may be mentioned. These should be regarded as exemplary and are only intended to illustrate the feasibility of implementing the technical solution of this application. However, it does not mean that the applicant has used or necessarily used the solution.

[0067] Given that most existing methods involve mechanical drilling on substrates (e.g., PCBs), this method has several drawbacks. First, a single drilling operation can only create one hole. When multiple holes are needed, multiple drilling operations are required. This not only increases overall processing costs and reduces processing efficiency, but each drilling operation can also affect previously drilled adjacent holes, causing changes in their size or shape. Second, this drilling method results in relatively low drilling accuracy, easily leading to burrs and other errors around the holes, affecting subsequent use, especially when drilling small micro-holes. Furthermore, laser drilling alone typically also results in less than ideal drilling accuracy, and burrs are also prone to appearing around the holes.

[0068] To address the aforementioned problems with existing methods, and considering the root causes of these problems, the applicant has taken into account that substrates typically contain a core layer (e.g., Core) and metal layers (e.g., Copper) on the upper and lower surfaces of the core layer, and that the material properties of the core layer and the metal layers are often completely different. Furthermore, it is considered that different wavelengths of laser light have varying etching capabilities for different materials, and that different chemical etching solvents also have varying etching capabilities for different materials. Based on the circumstances, the applicant further considered using a chemical etching method that is effective only for the metal layer material and ineffective for the core layer material. This involves performing a first-type etching operation on the metal layers on both sides of the substrate to create multiple small, high-precision vias on the metal layers on both sides of the core layer. Then, a laser, effective only for the core layer material and ineffective for the metal layer material, is used to perform a second-type etching operation on the core layer through the vias in the metal layer. This approach allows for several advantages. First, the characteristics of the laser can be utilized to simultaneously create multiple vias on the core layer in a single etching operation, effectively avoiding the impact of multiple via creation operations on adjacent vias. Second, the vias already etched in the metal layer using the first-type etching operation can constrain the laser's action on the core layer. Specifically, the size, position, and precision of the laser-drilled vias can be precisely constrained using the previously etched, high-precision metal layer vias. This allows for more accurate etching of vias suitable for subsequent applications on the core layer using the laser, avoiding errors such as burrs. This allows for the precise creation of small, high-quality micropores on a substrate with relatively low processing costs.

[0069] See Figure 1 As shown in the embodiments of this specification, a method for creating holes in a substrate is provided. In specific implementation, this method may include the following:

[0070] S101: Obtain a target substrate; wherein the target substrate includes at least a core layer, and a first metal layer and a second metal layer are respectively disposed on the first surface and the second surface of the core layer;

[0071] S102: Perform a first type of etching operation on the first metal layer and the second metal layer respectively to open a matching first hole and a second hole on the first metal layer and the second metal layer respectively;

[0072] S103: Perform a second type of etching operation on the core layer through the first hole and / or the second hole to create a third hole on the core layer.

[0073] Specifically, the target substrate can be understood as a circuit board material for which holes are to be opened.

[0074] For details, please refer to Figure 2As shown, the target substrate includes at least a core layer (which may be referred to as Core). Specifically, the core layer may include a first surface (e.g., an upper surface) and a second surface (e.g., a lower surface). A first metal layer may be disposed on the first surface, and a second metal layer may be disposed on the second surface.

[0075] Specifically, the core layer can be made of one or more of the following non-metallic materials: resin (e.g., epoxy resin), ceramic, glass fiber, etc. The first metal layer and the second metal layer can be made of metallic materials such as copper and / or titanium.

[0076] Specifically, for example, the target substrate mentioned above can be a PCB (Printed Circuit Board). A PCB can be understood as a support structure for electronic components, serving as the carrier for the electrical interconnection of these components. The core layer of the PCB can be made of epoxy resin (e.g., FR4 or BT material), also known as the core board, and is used to provide structural support for the PCB. Copper layers are also disposed on the upper and lower surfaces of the core layer to provide conductive paths for the circuitry.

[0077] Of course, it should be noted that the PCBs listed above are only illustrative. In actual implementation, depending on the specific application scenario and processing requirements, the target substrate may include other types of circuit board materials. This specification does not limit this.

[0078] The first type of etching operation described above can be understood as an etching operation that is effective only for the first and second metal layers, but ineffective for the core layer. Specifically, the first type of etching operation can be chemical etching, which is effective for the first and second metal layers but ineffective for the core layer. Chemical etching can handle relatively complex patterns, is suitable for mass production, and has a lower cost.

[0079] The second type of etching operation described above can be understood as an etching operation that is effective only for the core layer, and ineffective for the first and second metal layers. Specifically, this second type of etching operation can be laser etching, which is effective for the core layer but ineffective for the first and second metal layers. Laser etching is a non-contact process, which can effectively avoid damage to the material caused by drilling vibration; at the same time, the hole-opening process does not generate chips and can achieve a high aspect ratio, making it suitable for more precise hole machining.

[0080] The first and second holes mentioned above can be understood as metal holes respectively formed on the first and second metal layers. Correspondingly, the third hole mentioned above can be understood as a non-metallic hole formed on the core layer.

[0081] The third hole can correspond to a set of matching first and second holes. Specifically, the matching first and second holes can be understood as first and second holes whose relative distance between their center positions and / or their diameters meet preset requirements. For example, first and second holes whose relative distance between their center positions is less than or equal to half the sum of their diameters.

[0082] For specific implementation, please refer to Figure 3 As shown, according to preset processing rules, a first type of etching operation is first performed on the first metal layer and the second metal layer respectively to create one or more sets of matching first holes and second holes on the first and second metal layers respectively. Then, according to preset processing rules, a second type of etching operation is performed on the core layer through the first holes and / or the second holes for constraint. Specifically, a high-energy-density laser can be used to irradiate the core layer after being constrained by the first holes and / or the second holes, causing the material in the irradiated area of ​​the core layer to melt or vaporize instantly, so as to successfully create one or more micro-holes with small size and high precision on the core layer, which serve as third holes. Subsequently, the required target holes can be obtained using the aforementioned third holes. The position, size, and precision of the aforementioned third holes are related to the first holes and / or the second holes. Correspondingly, according to preset processing rules, the hole precision of the first and second holes can be improved by adjusting the operation during the first type of etching operation, thereby adjusting the hole opening precision of the third hole and further reducing errors.

[0083] Specifically, the aforementioned preset processing rules can be understood as a set of rules pre-generated based on the processing requirements of the target application scenario. These preset processing rules may include at least one of the following: rules regarding the center position of the first and second holes, rules regarding the diameter of the first and second holes, rules regarding the number of openings in the first and second holes, operation execution rules regarding the first type of etching operation, operation execution rules regarding the second type of etching operation, etc.

[0084] The aforementioned application scenario can specifically be microphone manufacturing. The aforementioned perforation method allows for the precise and efficient creation of a large number of small, high-quality micro-holes on the target substrate. This enables the subsequent fabrication of microphones using the perforated substrate. The numerous, densely packed micro-holes ensure more even internal stress distribution, effectively protecting the microphone diaphragm from damage. Furthermore, the small size of the micro-holes provides a degree of windproofing, waterproofing, and dustproofing.

[0085] Of course, it should be noted that the microphone production scenarios listed above are only illustrative. In practice, depending on the specific circumstances, the substrate opening method provided in this specification can also be applied to other suitable scenarios. This specification does not limit this application.

[0086] In some embodiments, after obtaining the third hole, it can be further used as a sound hole (e.g., an acoustic port-hole), and a corresponding micro-electro-mechanical system (MEMS) chip can be placed above the sound hole on the substrate; wherein the micro-electro-mechanical system chip is also provided with a diaphragm; at the same time, a corresponding application-specific integrated circuit (ASIC) can be placed at other suitable locations on the substrate other than the sound hole; and the micro-electro-mechanical system chip and the ASIC are connected by wire bonding, thereby producing a MEMS microphone with relatively good sound effects.

[0087] Based on the above embodiments, a first type of etching operation is first performed on the first metal layer and the second metal layer on the surface of the core layer of the target substrate to create a matching first hole and a second hole on the first metal layer and the second metal layer, respectively; then, a second type of etching operation is performed on the core layer through the first hole and / or the second hole to create a third hole on the core layer. This allows for the precise creation of small-sized, high-quality micro-holes on the substrate with relatively low processing costs.

[0088] In some embodiments, the first metal layer and the second metal layer are copper layers, and the core layer is a resin layer.

[0089] Depending on the specific application scenario and processing requirements, the first metal layer and the second metal layer can also be metal layers made of materials other than copper, such as titanium. Furthermore, the first metal layer and the second metal layer can also be different metal layers. For example, the first metal layer could be copper, and the second metal layer could be titanium.

[0090] The core layer can be either a resin layer based on FR4 material or a resin layer based on BT material. FR4 (glass fiber epoxy resin) material exhibits relatively good insulation, mechanical strength, and heat resistance. BT (bismaleimide triazine) material exhibits relatively good high thermal stability, low dielectric constant, and low loss.

[0091] Depending on the specific application scenario and processing requirements, the core layer mentioned above can also be a non-metallic layer made of materials other than resin, such as a ceramic layer.

[0092] In some embodiments, the first type of etching operation may specifically include chemical etching, and the second type of etching operation may specifically include laser etching.

[0093] Accordingly, the above-mentioned first type of etching operation on the first metal layer and the second metal layer may include: firstly, determining the hole center position parameters and hole diameter parameters of the first hole and the second hole according to the preset processing rules; and then, based on the hole center position parameters and hole diameter parameters, fabricating and setting masks for the first metal layer and the second metal layer respectively; and then, according to the corresponding operation execution rules, performing specific operations such as exposure, development, and etching on the first metal layer and the second metal layer to open one or more sets of matching first holes and second holes in the first metal layer and the second metal layer.

[0094] Specifically, when the first and second metal layers are copper layers, a suitable chemical solution (e.g., FeCl3 solution) can be prepared and used for the etching operation. This chemical solution is effective on the first and second metal layers, but not on the core layer.

[0095] Furthermore, during the etching process, the system can intelligently adjust the ambient temperature based on preset processing rules and temperature parameters, ensuring the temperature remains stable within a preset range (e.g., greater than 20 degrees Celsius and less than 50 degrees Celsius). Simultaneously, the etching status is monitored, and the etching time is intelligently adjusted accordingly. This ensures the successful etching of the desired first and second holes while preventing side etching or hole deformation, resulting in high-precision first and second holes. Examples include holes with diameters of 0.05mm, 0.075mm, or 0.1mm.

[0096] In practice, a corresponding etching reference model can be determined based on preset processing rules. Accordingly, the ambient temperature and etching duration can be intelligently adjusted based on the etching reference model.

[0097] Specifically, the aforementioned etching reference model can be obtained as follows: A large number of historical substrate etching records are collected; from these historical substrate etching records, those with etching effects that meet the requirements and whose etched shapes match the required first and second holes at a predetermined matching threshold are selected as reference etching records; the reference etching records are then clustered to obtain the corresponding clustering results; based on the clustering results, common effective parameter ranges for key operational parameters such as ambient temperature and etching time are determined; and based on these effective parameter ranges, the corresponding etching reference model is constructed.

[0098] The above-mentioned second type of etching operation on the core layer through the first hole and / or the second hole may include: determining a matching laser according to a preset processing rule; wherein the laser is effective on the core layer but ineffective on the first metal layer and the second metal layer; using the laser to pass through the first hole and / or the second hole to irradiate the core layer, causing the material in the irradiated local area to melt and evaporate, thereby achieving hole opening (or Laser Drill).

[0099] For details, please refer to Figure 4 As shown, a laser beam can be emitted downwards from above the first metal layer using a laser (or a laser cutter). Only laser beams passing through the first hole, constrained by the first hole, can be successfully focused and irradiate the core layer. The laser's thermal energy can then be used to melt and etch a corresponding third hole in the irradiated area of ​​the core layer, connecting it to a matching second hole, thus successfully creating the opening. Laser beams from other locations are blocked by the first metal layer and cannot etch the metal material, therefore they cannot irradiate the core layer and cannot create openings in it.

[0100] Of course, a laser beam can also be emitted from the bottom of the second metal layer upwards; or, a laser beam can be emitted from the top of the first metal layer downwards, while a laser beam is emitted from the bottom of the second metal layer upwards, to complete the second type of etching operation on the core layer.

[0101] Based on the above embodiments, by introducing and combining two different types of etching operations according to the material properties of different layers in the target substrate, the advantages of different types of etching operations can be fully utilized to accurately etch the required holes on the target substrate.

[0102] In some embodiments, the second type of etching operation on the core layer through the first hole and / or the second hole may include the following:

[0103] S1: Determine the matching target wavelength based on the materials of the first metal layer, the second metal layer, and the core layer;

[0104] S2: Using a laser of the target wavelength, perform a second type of etching operation on the core layer through the first and / or second holes to create a third hole on the core layer.

[0105] In practice, based on preset processing rules, a laser wavelength that is effective for the core layer but ineffective for the first and second metal layers can be determined according to the material properties of the first metal layer, the second metal layer, and the core layer, and used as the matching target wavelength.

[0106] Specifically, when the first and second metal layers are copper layers and the core layer is a resin layer, the aforementioned matching target wavelength can be, for example, 10.6 micrometers. A laser with this wavelength can effectively etch away the material of the core layer without etching away the materials of the first and second metal layers.

[0107] In some embodiments, a laser of a target wavelength is used to perform a second type of etching operation on the core layer through a first hole and / or a second hole. Specifically, this may include:

[0108] By controlling a carbon dioxide laser and using a laser of a target wavelength, a second type of etching operation is performed on the core layer through a first hole and / or a second hole.

[0109] Specifically, the aforementioned carbon dioxide laser can be understood as a gas molecular laser, primarily using CO2 gas as its working substance, with auxiliary gases including nitrogen, helium, xenon, and hydrogen. Carbon dioxide lasers can generate and utilize invisible infrared light with a wavelength of 10.6 micrometers for etching.

[0110] Based on the above embodiments, the etching of the core layer can be safely and stably completed by introducing and using a carbon dioxide laser to generate and utilize a laser of a matching target wavelength.

[0111] In some embodiments, during specific implementation, a carbon dioxide laser can be controlled according to preset processing rules. The laser of the target wavelength is used to perform a second type of etching operation on the core layer through the first hole and / or the second hole, according to a specified illumination duration and / or specified laser intensity, to obtain a third hole that meets the requirements.

[0112] Specifically, for different application scenarios, based on preset processing rules, the etching depth of the laser on the core layer can be flexibly adjusted by adjusting the laser illumination duration and / or laser intensity to obtain third holes of different depths, thus meeting diverse application needs.

[0113] In some embodiments, after creating a third hole in the core layer, the method may further include the following: removing the remaining first metal layer and the remaining second metal layer on the target substrate to obtain a target hole that meets the requirements.

[0114] For specific examples, please refer to Figure 3 As shown, chemical etching is used to remove the remaining first and second metal layers on the target substrate, resulting in a third hole based solely on the core layer (e.g., a third hole based solely on resin material), which serves as the target hole that meets the requirements. Subsequently, depending on the specific application scenario, the aforementioned target hole can be used to complete the specific application.

[0115] Based on the above embodiments, after the third hole is opened on the core layer, the remaining metal layer can be effectively removed to obtain a target hole suitable for subsequent specific applications.

[0116] In some embodiments, after performing a first type of etching operation on the first metal layer and the second metal layer respectively, a plurality of first holes are formed on the first metal layer and a plurality of second holes are formed on the second metal layer.

[0117] Accordingly, the second type of etching operation is performed on the core layer through the first and / or second holes to create a third hole on the core layer. In specific implementation, this may include:

[0118] Using a laser of the target wavelength, a second type of etching operation is performed on the core layer through multiple first holes and / or multiple second holes, thereby creating multiple third holes on the core layer.

[0119] Specifically, when multiple first holes are formed on the first metal layer and multiple second holes are formed on the second metal layer, multiple qualified third holes can be simultaneously etched on the core layer by performing only one second-type etching operation. For example, see [reference needed]. Figure 5 As shown.

[0120] In some embodiments, the matching first hole and second hole may include a first hole and a second hole whose relative distance between the hole centers and / or hole diameters meet preset requirements.

[0121] Specifically, the aforementioned matching first and second holes may include a relative distance between the center positions of the holes that is less than or equal to half the sum of the diameters of the two holes.

[0122] The diameter of the first hole and the diameter of the second hole can be the same or different. See reference [link / reference needed]. Figure 6 As shown.

[0123] Furthermore, the relative distance between the center positions of the matching first and second holes can be less than or equal to a preset lower distance limit; or it can be greater than the preset lower distance limit but less than or equal to half the sum of the diameters of the two holes. (See reference...) Figure 7 As shown. The preset lower limit of distance can be a very small value close to 0, such as 0.001 mm.

[0124] In specific implementation, for different application scenarios, based on preset processing rules, the center positions and diameters of the first and second holes can be set to a certain extent with relative flexibility, provided that the relative distance between the hole centers and / or the hole diameter meets the preset requirements, so as to meet the diverse application needs in the future.

[0125] Furthermore, it should be noted that the apertures of the multiple first holes on the first metal layer can be the same or different. Correspondingly, the apertures of the multiple second holes on the second metal layer can be the same or different.

[0126] In some embodiments, when the relative distance between the center positions of the matched first hole and the second hole is less than or equal to a preset lower limit, and the diameter of the first hole is the same as the diameter of the second hole, refer to Figure 8 As shown, the second type of etching operation is performed on the core layer through the first hole and / or the second hole. In specific implementation, the second type of etching operation can be performed on the core layer through the first hole alone; or the second type of etching operation can be performed on the core layer through the second hole alone; or the second type of etching operation can be performed on the core layer through the first hole and the second hole simultaneously, etching a third hole of the same shape on the core layer.

[0127] When the relative distance between the center positions of the matched first and second holes is less than or equal to a preset lower limit, and the diameters of the first and second holes are different, refer to... Figure 9 As shown, for different application scenarios, according to preset processing rules, a third hole of different shapes can be etched on the core layer by passing through the first hole alone, the second hole alone, or both the first and second holes simultaneously. When etching on the core layer by passing through the first and second holes simultaneously, the illumination duration and / or intensity of the laser passing through the first hole and the laser passing through the second hole can be adjusted in a targeted manner according to the preset processing rules, based on the specific application requirements. This ensures that the core layer is conductive while precisely controlling the drilling depth of the laser passing through the first hole and the laser passing through the second hole on the core layer, thus obtaining a relatively complex third hole.

[0128] Specifically, based on application requirements, the drilling depth of the laser through the first hole in the core layer (denoted as the first depth) and the drilling depth of the laser through the second hole in the core layer (denoted as the second depth) can be determined. Then, constraints are constructed based on the fact that the sum of the first and second depths equals the thickness of the core layer. Using the laser parameters transmitted through the first hole (denoted as the first laser parameters, including illumination duration and laser intensity) and the laser parameters transmitted through the second hole (denoted as the second laser parameters, including illumination duration and laser intensity), an overall cost that integrates energy and time is constructed as the objective function. Then, multiple rounds of optimization iterations are performed based on the above constraints and objective function to determine the set of first and second laser parameters that minimizes the overall cost. Furthermore, when performing the second type of etching, the illumination duration and / or intensity of the laser irradiating the core layer through the first hole can be adjusted and controlled according to the first laser parameters; at the same time, the illumination duration and / or intensity of the laser irradiating the core layer through the second hole can be adjusted and controlled according to the second laser parameters, so as to accurately etch a third hole with high precision on the core layer.

[0129] When the relative distance between the center positions of the matched first and second holes is greater than a preset lower limit but less than or equal to half the sum of the diameters of the two holes, refer to... Figure 10 As shown, for different application scenarios, according to the preset processing rules, a third hole of different shapes can be etched on the core layer by passing through the first hole alone, or through the second hole alone, or through the first hole and the second hole simultaneously.

[0130] In some embodiments, see Figure 11 As shown, the matching first hole and second hole are such that the relative distance between their center positions is equal to half the sum of the diameters of the first hole and the second hole;

[0131] Accordingly, the second type of etching operation is performed on the core layer through the first and / or second holes, and a third hole is opened on the core layer. In specific implementation, this may include the following:

[0132] A second type of etching operation is performed on the core layer through the first hole; and a second type of etching operation is performed on the core layer through the second hole to create a third hole on the core layer that corresponds to the matching first and second holes.

[0133] Based on the above embodiments, a second type of etching operation can be performed on the core layer through the first and second holes respectively to remove the core layer in the corresponding areas, thereby obtaining a third hole that can connect with the matching first and second holes. The third hole obtained in the above manner, combined with the matching first and second holes, can form a target hole, i.e., an irregular through-hole.

[0134] When applied to microphone manufacturing, the aforementioned target hole can effectively alter the airflow inside the microphone, reducing direct impact on the diaphragm and thus better protecting it, resulting in better sound quality. In addition, it also provides better dust and water resistance.

[0135] In some embodiments, after creating a third hole in the core layer, the method may further include the following: applying protective layers to the outer surfaces of the first and second metal layers respectively to obtain a target hole that meets the requirements. This effectively protects the target hole and prevents its shape and structure from deforming due to corrosion or other factors.

[0136] In some embodiments, the provision of protective layers on the outer surfaces of the first metal layer and the second metal layer, in specific implementation, may include:

[0137] By performing electroless nickel-plating and gold-immersion operations on the outer surfaces of the first and second metal layers respectively, a coating is formed on the outer surfaces of the first and second metal layers to serve as the protective layer.

[0138] Accordingly, the aforementioned protective layer can specifically be a combination of a nickel layer (e.g., Ni) and a gold layer (e.g., Gold).

[0139] For details, please refer to [link / reference]. Figure 12 As shown, the above-mentioned electroless nickel immersion gold (ENIG) can be understood as a surface treatment process without electrodeposition. By performing electroless nickel plating and immersion gold, a coating that is both protective and solderable can be formed, thereby effectively protecting the remaining first metal layer and the remaining second metal layer and preventing the first and second holes in the target hole from being deformed due to corrosion.

[0140] In some embodiments, the first hole and the second hole include: a trapezoidal hole.

[0141] For details, please refer to Figure 13 As shown, the diameter of the first and second holes closer to the core layer is larger than the diameter of the holes farther away from the core layer.

[0142] Based on the above embodiments, by introducing and using the trapezoidal holes as the first and second holes, the structural characteristics of the trapezoidal holes can be utilized to focus the laser light passing through the first and second holes. In this way, on the one hand, the laser divergence phenomenon during the etching of the core layer can be effectively reduced, and the difference in aperture of the third hole etched on the core layer at different depth positions can be avoided, further reducing errors and improving the quality of the opening. On the other hand, the laser energy can be more fully focused and utilized to complete the etching, avoiding energy waste.

[0143] In some embodiments, after forming matching first holes and second holes on the first metal layer and the second metal layer respectively, the method may further include: forming corresponding light-concentrating coatings on the inner surfaces of the first holes and the second holes respectively. The light-concentrating coatings may be supported by high refractive index materials, such as TiO2, ZnO, etc.

[0144] Based on the above embodiments, by introducing and using a focusing coating, the focusing effect of the first and second holes on the laser can be further improved, thereby enabling better etching of the core layer.

[0145] In some embodiments, after obtaining the target hole that meets the requirements, the method may further include: fabricating a microphone device using a target substrate carrying the target hole. Specifically, the target hole can be used as a sound hole to manufacture a corresponding microphone device.

[0146] Specifically, for example, see Figure 19 As shown, the aforementioned target hole can also be used as a sound hole (e.g., an acoustic port-hole), and a corresponding micro-electro-mechanical system (MEMS) chip can be placed above the sound hole on the substrate. The MEMS chip also includes a diaphragm. Simultaneously, application-specific integrated circuits (ASICs) are placed at suitable locations on the substrate other than the sound hole, and a corresponding encapsulation (e.g., polymer foil) is placed over the ASIC. The MEMS chip and the ASIC are then connected by wire bonding, and a metal can is placed on the substrate to cover the MEMS chip and the ASIC. The metal can also include a guard ring. This allows for the fabrication of a MEMS microphone with relatively good sound quality.

[0147] As can be seen from the above, the substrate drilling method provided in this specification, after obtaining the target substrate to be drilled, can first perform a first type of etching operation on the first metal layer and the second metal layer on the surface of the core layer of the target substrate to create a matching first hole and a second hole on the first metal layer and the second metal layer, respectively; then, through the first hole and / or the second hole, a second type of etching operation is performed on the core layer to create a third hole on the core layer, thereby obtaining the target hole that meets the requirements. This allows for the precise drilling of small-sized, high-quality micro-holes on the substrate with relatively low processing costs. Furthermore, it enables batch drilling in a single operation, avoiding the impact on the structure of other holes when drilling is performed sequentially.

[0148] This specification also provides a method for creating holes in a substrate, which may include the following steps: obtaining a target substrate; wherein the target substrate includes at least a first core layer, and a first metal layer and a second metal layer are respectively disposed on a first surface and a second surface of the first core layer; performing a first type of etching operation on the first metal layer to create a corresponding first hole in the first metal layer; performing a modification process on one side of the first metal layer of the target substrate to obtain a modified target substrate; wherein a second core layer and a third metal layer are sequentially disposed on the side of the first metal layer away from the second metal layer in the modified target substrate; performing a first type of etching operation on the second metal layer and the third metal layer respectively to create a matching second hole and a third hole in the second metal layer and the third metal layer respectively; and performing a second type of etching operation on the first core layer and the second core layer through the second hole and the third hole respectively to obtain a third hole.

[0149] Wherein, the first metal layer, the second metal layer, and the third metal layer are copper layers, and the first core layer and the second core layer are resin layers. The first type of etching operation includes chemical etching, and the second type of etching operation includes laser etching.

[0150] In some embodiments, the second type of etching operation is performed on the first core layer and the second core layer through the second hole and the third hole respectively to obtain the third hole. In specific implementation, it may include the following: determining a matching target wavelength based on the materials of the first metal layer, the second metal layer, the third metal layer, and the materials of the first core layer and the second core layer; using a laser of the target wavelength, etching the corresponding areas of the first core layer and the second core layer through the first hole and the second hole respectively to obtain the third hole based on the first metal layer.

[0151] In some embodiments, the above-mentioned modification process on one side of the first metal layer of the target substrate may specifically include: performing prepreg, copper plating, and lamination processes sequentially on one side of the first metal layer of the target substrate.

[0152] Specifically, the prepreg refers to a resin material pre-impregnated to form a resin layer (forming a prepreg), which is typically in a semi-cured state before lamination. It acts as an adhesive and insulating material for the inner layers of a multilayer printed circuit board, ensuring the strong adhesion of the conductive pattern layers. After lamination, the semi-cured epoxy resin flows and hardens, bonding the multilayer board into a single unit and forming an insulating layer, thereby enhancing the stability and electrical performance of the PCB.

[0153] The aforementioned copper plating can specifically refer to the formation of a copper layer (forming a cured sheet) on the new resin layer formed by the prepreg, which is usually in a semi-cured state before lamination.

[0154] After completing the prepreg and copper plating processes, lamination is then performed on the combination of the semi-cured layer and the cured layer. This allows the newly generated layer to adhere tightly to the target substrate, resulting in a more robust modified target substrate.

[0155] In some embodiments, after obtaining the third hole based on the first metal layer, the method may further include: providing a protective layer on the outer surface of the modified target substrate containing the third hole.

[0156] In some embodiments, after obtaining the third hole based on the first metal layer, the method may further include grounding the third hole. Since the third hole is based on a metallic material, grounding effectively eliminates static electricity and reduces interference from external signals such as radio frequency signals. This, in microphone manufacturing applications, allows for microphones with improved performance.

[0157] This specification also provides a method for creating holes in a substrate, which may include the following steps: obtaining a target substrate; wherein the target substrate includes at least a core layer, and a first metal layer and a second metal layer are respectively disposed on a first surface and a second surface of the core layer; performing a first type of etching operation on the first metal layer and the second metal layer to create matching first holes and second holes on the first metal layer and the second metal layer respectively; performing modification processing on both sides of the first metal layer and the second metal layer of the target substrate to obtain a modified target substrate; wherein, in the modified target substrate, a first intermediate layer and a third metal layer are sequentially disposed on the side of the first metal layer away from the second metal layer, and a second intermediate layer and a third metal layer are sequentially disposed on the side of the second metal layer away from the first metal layer; performing a first type of etching operation on the third metal layer and the fourth metal layer to create matching third holes and fourth holes on the third metal layer and the fourth metal layer respectively; and performing a second type of etching operation on the first intermediate layer, the second intermediate layer, and the core layer through the third holes and the fourth holes to obtain a fifth hole based on a hybrid layer.

[0158] Specifically, the first type of etching operation may include chemical etching, and the second type of etching operation may include laser etching.

[0159] The first metal layer, the second metal layer, the third metal layer, and the fourth metal layer can specifically be copper layers, the core layer can specifically be a ceramic layer, and the first intermediate layer and the second intermediate layer can specifically be resin layers.

[0160] Based on the above method, the fifth hole is embedded in the hybrid layer. The upper and lower layers of the hybrid layer are metal layers, and the middle layer is a ceramic layer. Based on this hybrid layer structure, a capacitor can be formed between the upper and lower layers of the fifth hole. Therefore, when applied to microphone manufacturing, microphones manufactured using the fifth hole based on this hybrid layer can have better filtering effects, improving the microphone's sound quality.

[0161] In some embodiments, after obtaining the fifth hole based on the hybrid layer, the method may further include: depositing a protective layer on the outer surface of the modified target substrate containing the fifth hole.

[0162] See Figure 14 As shown in the embodiments of this specification, a method for creating openings in a substrate is also provided. In specific implementation, this method may include the following:

[0163] S1401: Obtain a target substrate; wherein the target substrate includes at least a core layer, and the surface of the core layer is provided with at least a first metal layer;

[0164] S1402: Perform a first type of etching operation on the first metal layer to open a corresponding first hole on the first metal layer;

[0165] S1403: Through the first hole, perform a second type of etching operation on the core layer to obtain a hole that meets the requirements.

[0166] Specifically, for example, the target substrate described above may have a first metal layer on only one surface of the core layer (e.g., the first surface), while no metal layer is provided on the other surface (e.g., the second surface). In this case, based on the method provided in this specification and according to the preset processing rules, only a first type of etching operation needs to be performed on the first metal layer, and a second type of etching operation needs to be performed on the core layer through the first hole in the first metal layer. This will successfully create the corresponding through-hole in the core layer, obtaining the required hole. See also... Figure 15 As shown.

[0167] For example, the target substrate described above may have a first metal layer disposed on one surface of the core layer and a resin protective layer of similar material to the core layer disposed on the other surface. In this case, based on the method provided in this specification and according to the preset processing rules, only a first type of etching operation needs to be performed on the first metal layer, and a second type of etching operation needs to be performed on the core layer and the resin protective layer through the first hole in the first metal layer. This will also successfully create corresponding through holes in the core layer and the resin protective layer, obtaining the required holes.

[0168] For example, the target substrate may have a first metal layer on one surface of the core layer and a second metal layer on the other surface. In this case, to create blind vias that meet subsequent application requirements, based on the method provided in this specification and according to preset processing rules, only a first type of etching operation needs to be performed on the first metal layer, and a second type of etching operation is performed on the core layer through the first via in the first metal layer. This yields blind vias that connect the first metal layer and the core layer, but do not penetrate the target substrate, thus creating a compliant via. See also... Figure 16 As shown.

[0169] This specification provides an electronic device through its embodiments. (See attached document.) Figure 17 As shown. The electronic device includes a network communication port 1701, a processor 1702, and a memory 1703. These structures are connected by internal cables so that they can perform specific data interaction.

[0170] Specifically, the network communication port 1701 can be used to receive hole-opening instructions for the target substrate.

[0171] The processor 1702 can be specifically used to respond to an opening command and obtain a target substrate; wherein the target substrate includes at least a core layer, and a first metal layer and a second metal layer are respectively disposed on a first surface and a second surface of the core layer; a first type of etching operation is performed on the first metal layer and the second metal layer to open a matching first hole and a second hole on the first metal layer and the second metal layer respectively; a second type of etching operation is performed on the core layer through the first hole and / or the second hole to open a third hole on the core layer.

[0172] The memory 1703 can be used to store the corresponding instruction program, as well as intermediate data such as hole-opening instructions.

[0173] Based on the above method, the relevant structural performance of electronic devices can be effectively utilized to improve the data processing speed of electronic devices and efficiently realize the relevant data processing of the openings in the substrate.

[0174] In this embodiment, the network communication port 1701 can be a virtual port bound to different communication protocols, thereby enabling the sending or receiving of different data. For example, the network communication port can be a port responsible for web data communication, a port responsible for FTP data communication, or a port responsible for email data communication. Furthermore, the network communication port can also be a physical communication interface or communication chip. For example, it can be a wireless mobile network communication chip, such as GSM or CDMA; it can also be a Wi-Fi chip; or it can be a Bluetooth chip.

[0175] In this embodiment, the processor 1702 can be implemented in any suitable manner. For example, the processor can take the form of a microprocessor or processor and a computer-readable medium storing computer-readable program code (e.g., software or firmware) executable by the (micro)processor, logic gates, switches, application-specific integrated circuits (ASICs), programmable logic controllers, and embedded microcontrollers, etc. This specification is not limiting.

[0176] In this embodiment, the memory 1703 may include multiple layers. In a digital system, anything that can store binary data can be a memory. In an integrated circuit, a circuit with storage function but no physical form is also called a memory, such as RAM, FIFO, etc. In a system, a storage device with a physical form is also called a memory, such as a memory stick, TF card, etc.

[0177] This specification also provides a computer-readable storage medium based on the above-described substrate opening method, wherein the computer-readable storage medium stores computer program instructions that, when executed, perform the following: obtaining a target substrate; wherein the target substrate includes at least a core layer, and a first metal layer and a second metal layer are respectively disposed on a first surface and a second surface of the core layer; performing a first type of etching operation on the first metal layer and the second metal layer to open a matching first hole and a second hole on the first metal layer and the second metal layer respectively; and performing a second type of etching operation on the core layer through the first hole and / or the second hole to open a third hole on the core layer.

[0178] This specification also provides another computer-readable storage medium based on the above-described substrate opening method, wherein the computer-readable storage medium stores computer program instructions that, when executed, implement: obtaining a target substrate; wherein the target substrate includes at least a core layer, and the surface of the core layer is at least provided with a first metal layer; performing a first type of etching operation on the first metal layer to open a corresponding first hole in the first metal layer; and performing a second type of etching operation on the core layer through the first hole to obtain a hole that meets the requirements.

[0179] In this embodiment, the storage medium includes, but is not limited to, Random Access Memory (RAM), Read-Only Memory (ROM), cache, hard disk drive (HDD), or memory card. The memory can be used to store computer program instructions. The network communication unit can be an interface configured according to standards specified in the communication protocol for network connection communication.

[0180] In this embodiment, the specific functions and effects implemented by the program instructions stored in the computer-readable storage medium can be explained in comparison with other embodiments, and will not be repeated here.

[0181] This specification also provides a computer program product, which includes at least a computer program. When executed by a processor, the computer program performs the following method steps: obtaining a target substrate; wherein the target substrate includes at least a core layer, and a first metal layer and a second metal layer are respectively disposed on a first surface and a second surface of the core layer; performing a first type of etching operation on the first metal layer and the second metal layer to form a matching first hole and a second hole on the first metal layer and the second metal layer respectively; and performing a second type of etching operation on the core layer through the first hole and / or the second hole to form a third hole on the core layer.

[0182] This specification also provides another computer program product, which includes at least a computer program. When the computer program is executed by a processor, it performs the following method steps: obtaining a target substrate; wherein the target substrate includes at least a core layer, and the surface of the core layer is provided with at least a first metal layer; performing a first type of etching operation on the first metal layer to open a corresponding first hole in the first metal layer; and performing a second type of etching operation on the core layer through the first hole to obtain a hole that meets the requirements.

[0183] See Figure 18 As shown in the embodiments of this specification, an opening device for a substrate is also provided, which may specifically include the following structural modules:

[0184] The acquisition module 1801 can be specifically used to acquire a target substrate; wherein, the target substrate includes at least a core layer, and a first metal layer and a second metal layer are respectively disposed on the first surface and the second surface of the core layer.

[0185] The first etching module 1802 is specifically used to perform a first type of etching operation on the first metal layer and the second metal layer respectively, so as to open a matching first hole and a second hole on the first metal layer and the second metal layer respectively.

[0186] The second etching module 1803 can be used to perform a second type of etching operation on the core layer through the first hole and / or the second hole, and to open a third hole on the core layer.

[0187] In some embodiments, the first metal layer and the second metal layer may specifically be copper layers, and the core layer may specifically be a resin layer.

[0188] In some embodiments, the first type of etching operation may specifically include chemical etching, and the second type of etching operation may specifically include laser etching.

[0189] In some embodiments, when the second etching module 1803 is specifically implemented, the second type of etching operation can be performed on the core layer through the first hole and / or the second hole in the following manner: a matching target wavelength is determined according to the materials of the first metal layer, the second metal layer, and the core layer; a laser of the target wavelength is used to perform the second type of etching operation on the core layer through the first hole and / or the second hole, and a third hole is opened on the core layer.

[0190] In some embodiments, when the second etching module 1803 is specifically implemented, a second type of etching operation can be performed on the core layer by using a laser of the target wavelength through the first hole and / or the second hole in the following manner: controlling a carbon dioxide laser, using a laser of the target wavelength, and performing a second type of etching operation on the core layer through the first hole and / or the second hole.

[0191] In some embodiments, after a third hole is formed on the core layer, the device can also be used to remove the remaining first metal layer and the remaining second metal layer on the target substrate to obtain a target hole that meets the requirements.

[0192] In some embodiments, after performing a first type of etching operation on the first metal layer and the second metal layer respectively, a plurality of first holes may be formed on the first metal layer, and a plurality of second holes may be formed on the second metal layer.

[0193] Accordingly, in the specific implementation of the second etching module 1803, the second type of etching operation can be performed on the core layer through the first hole and / or the second hole in the following manner, and a third hole can be opened on the core layer: using a laser of the target wavelength, the second type of etching operation is performed on the core layer through multiple first holes and / or multiple second holes, and multiple third holes are opened on the core layer.

[0194] In some embodiments, the matching first hole and second hole may specifically include: a first hole and a second hole whose relative distance between the hole centers and / or hole diameters meet preset requirements.

[0195] In some embodiments, the matching first hole and second hole may specifically be: the relative distance between the hole center positions is equal to half the sum of the hole diameter of the first hole and the hole diameter of the second hole;

[0196] Accordingly, in some embodiments, when the second etching module 1803 is specifically implemented, it can perform a second type of etching operation on the core layer through the first hole and / or the second hole in the following manner to open a third hole on the core layer: perform a second type of etching operation on the core layer through the first hole; and perform a second type of etching operation on the core layer through the second hole to open a third hole on the core layer that corresponds to the matching first hole and second hole.

[0197] In some embodiments, after a third hole is formed in the core layer, the device can also be used to: provide protective layers on the outer surfaces of the first metal layer and the second metal layer respectively to obtain a target hole that meets the requirements.

[0198] In some embodiments, when the above-described device is specifically implemented, protective layers can be respectively provided on the outer surfaces of the first metal layer and the second metal layer in the following manner: by performing a chemical nickel immersion gold operation on the outer surfaces of the first metal layer and the second metal layer respectively, a plating layer is formed on the outer surfaces of the first metal layer and the second metal layer as the protective layer.

[0199] In some embodiments, the first hole and the second hole may specifically include a trapezoidal hole.

[0200] This specification also provides another substrate opening device, which may specifically include:

[0201] The acquisition module can be specifically used to acquire a target substrate; wherein, the target substrate includes at least a core layer, and the surface of the core layer is provided with at least a first metal layer;

[0202] The first etching module can be used to perform a first type of etching operation on the first metal layer in order to open a corresponding first hole on the first metal layer.

[0203] The second etching module can be used to perform a second type of etching operation on the core layer through the first hole to obtain a hole that meets the requirements.

[0204] It should be noted that the units, devices, or modules described in the above embodiments can be implemented by computer chips or physical entities, or by products with certain functions. For ease of description, the above devices are described by dividing them into various modules according to their functions. Of course, in implementing this specification, the functions of each module can be implemented in one or more software and / or hardware, or the module that implements the same function can be implemented by a combination of multiple sub-modules or sub-units, etc. The device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection between the devices or units shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be electrical, mechanical, or other forms.

[0205] As can be seen from the above, the substrate opening device provided in the embodiments of this specification can accurately open small-sized and high-quality microholes on the substrate with relatively low processing costs.

[0206] While this specification provides the steps of operation for the methods described in the embodiments or flowcharts, more or fewer steps may be included based on conventional or non-inventive means. The order of steps listed in the embodiments is merely one possible order of execution among many steps and does not represent the only possible order. In actual device or client product execution, the methods shown in the embodiments or drawings may be executed sequentially or in parallel (e.g., in a parallel processor or multi-threaded processing environment, or even a distributed data processing environment). The terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, product, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, product, or apparatus. Without further limitations, the presence of other identical or equivalent elements in a process, method, product, or apparatus that includes said elements is not excluded. The terms "first," "second," etc., are used to denote names and do not indicate any particular order.

[0207] Those skilled in the art will also know that, besides implementing the controller using purely computer-readable program code, the same functions can be achieved by logically programming the method steps, making the controller function as logic gates, switches, application-specific integrated circuits (ASICs), programmable logic controllers (PLCs), and embedded microcontrollers. Therefore, such a controller can be considered a hardware component, and the devices within it used to implement various functions can also be considered structures within that hardware component. Alternatively, the devices used to implement various functions can be considered as both software modules implementing the method and structures within a hardware component.

[0208] This specification can be described in the general context of computer-executable instructions that are executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, classes, etc., that perform a specific task or implement a specific abstract data type. This specification can also be practiced in distributed computing environments, where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer-readable storage media, including storage devices.

[0209] As can be seen from the above description of the embodiments, those skilled in the art can clearly understand that this specification can be implemented by means of software plus necessary general-purpose hardware platforms. Based on this understanding, the technical solutions of this specification can essentially be embodied in the form of a software product. This computer software product can be stored in a storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, mobile terminal, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments of this specification.

[0210] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on its differences from other embodiments. This specification can be used in numerous general-purpose or special-purpose computer system environments or configurations. Examples include: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable electronic devices, network PCs, minicomputers, mainframe computers, and distributed computing environments including any of the above systems or devices, etc.

[0211] Although this specification has been described by way of examples, those skilled in the art will recognize that many variations and modifications are possible without departing from the spirit of this specification, and it is intended that the appended claims cover such variations and modifications without departing from the spirit of this specification.

Claims

1. A method for creating openings in a substrate, characterized in that, include: Obtain a target substrate; wherein the target substrate includes at least a core layer, and a first metal layer and a second metal layer are respectively disposed on a first surface and a second surface of the core layer; According to preset processing rules, a first type of etching operation is performed on the first metal layer and the second metal layer respectively to create matching first holes and second holes on the first metal layer and the second metal layer respectively; the first type of etching operation includes chemical etching that is effective on the first metal layer and the second metal layer, but ineffective on the core layer; the first hole and the second hole are trapezoidal holes, and the diameter of the first hole and the second hole closer to the core layer is larger than the diameter farther away from the core layer, and a corresponding light-concentrating coating is respectively provided on the inner surface of the first hole and the second hole; the light-concentrating coating is made of TiO2 or ZnO; Through the first hole and / or the second hole, using the first hole and / or the second hole for constraint, a second type of etching operation is performed on the core layer, and a third hole is opened on the core layer; the second type of etching operation includes laser etching that is effective on the core layer but ineffective on the first metal layer and the second metal layer; Furthermore, the core layer is a ceramic layer, the third hole is used as the sound hole and grounded; a corresponding microelectromechanical system (MEMS) chip is arranged above the sound hole on the substrate; the MEMS chip is also provided with a diaphragm; corresponding application-specific integrated circuits (ASICs) are arranged at other suitable locations on the substrate other than the sound hole; and the MEMS chip and the ASICs are connected by metal wire bonding to obtain a MEMS microphone.

2. The method according to claim 1, characterized in that, The first metal layer and the second metal layer are copper layers, and the core layer is a resin layer.

3. The method according to claim 1, characterized in that, A second type of etching operation is performed on the core layer through the first and / or second vias, including: Based on the materials of the first metal layer, the second metal layer, and the core layer, the matching target wavelength is determined; Using a laser of the target wavelength, a second type of etching operation is performed on the core layer through the first and / or second apertures to create a third aperture on the core layer.

4. The method according to claim 3, characterized in that, Using a laser of the target wavelength, a second type of etching operation is performed on the core layer through the first and / or second aperture, including: By controlling a carbon dioxide laser and using a laser of a target wavelength, a second type of etching operation is performed on the core layer through a first hole and / or a second hole.

5. The method according to claim 1, characterized in that, After creating a third hole in the core layer, the method further includes: Remove the remaining first metal layer and the remaining second metal layer on the target substrate to obtain the target hole that meets the requirements.

6. The method according to claim 1, characterized in that, After performing a first type of etching operation on the first metal layer and the second metal layer respectively, a plurality of first holes are formed on the first metal layer and a plurality of second holes are formed on the second metal layer. Accordingly, the second type of etching operation is performed on the core layer through the first and / or second holes to create a third hole on the core layer, including: Using a laser of the target wavelength, a second type of etching operation is performed on the core layer through multiple first holes and / or multiple second holes, thereby creating multiple third holes on the core layer.

7. The method of claim 1, wherein the matching first hole and second hole comprise: The relative distance between the center positions and / or the diameter of the first and second holes meet the preset requirements.

8. The method according to claim 7, characterized in that, The matching first hole and second hole are defined as follows: the relative distance between the center positions of the holes is equal to half the sum of the diameters of the first hole and the second hole; Accordingly, a second type of etching operation is performed on the core layer through the first and / or second vias, and a third via is formed on the core layer, including: The second type of etching operation is performed on the core layer through the first hole; Then, through the second hole, a second type of etching operation is performed on the core layer to create a third hole on the core layer that corresponds to the matching first and second holes.

9. The method according to claim 8, characterized in that, After creating a third hole in the core layer, the method further includes: Protective layers are applied to the outer surfaces of the first and second metal layers respectively to obtain the target hole that meets the requirements.

10. The method according to claim 9, characterized in that, Protective layers are respectively provided on the outer surfaces of the first metal layer and the second metal layer, including: By performing electroless nickel-plating and gold-immersion operations on the outer surfaces of the first and second metal layers respectively, a coating is formed on the outer surfaces of the first and second metal layers to serve as the protective layer.

11. A method for creating openings in a substrate, characterized in that, include: Obtain a target substrate; wherein the target substrate includes at least a core layer, and at least a first metal layer is disposed on the surface of the core layer; According to the preset processing rules, a first type of etching operation is performed on the first metal layer to open a corresponding first hole on the first metal layer; the first type of etching operation includes chemical etching that is effective on the first metal layer but ineffective on the core layer; the first hole is a trapezoidal hole, the diameter of the first hole near the core layer is larger than the diameter far from the core layer, and a corresponding light-concentrating coating is provided on the inner surface of the first hole; the light-concentrating coating is made of TiO2 or ZnO; Through the first hole, the first hole is used to constrain the core layer, and a second type of etching operation is performed on the core layer to obtain a hole that meets the requirements; the second type of etching operation includes laser etching that is effective on the core layer but ineffective on the first metal layer; Furthermore, the core layer is a ceramic layer, the required holes are used as sound holes, and grounding is performed; a corresponding microelectromechanical system (MEMS) chip is arranged above the sound hole on the substrate; wherein the MEMS chip is also provided with a diaphragm; a corresponding application-specific integrated circuit (ASIC) is arranged at other suitable positions on the substrate other than the sound hole; and the MEMS chip and the ASIC are connected by metal wire bonding to obtain a MEMS microphone.

12. An opening device for a substrate, characterized in that, include: An acquisition module is used to acquire a target substrate; wherein the target substrate includes at least a core layer, and a first metal layer and a second metal layer are respectively disposed on a first surface and a second surface of the core layer; The first etching module is used to perform a first type of etching operation on the first metal layer and the second metal layer according to a preset processing rule, so as to open a matching first hole and a second hole on the first metal layer and the second metal layer respectively; the first type of etching operation includes chemical etching that is effective on the first metal layer and the second metal layer, but ineffective on the core layer; the first hole and the second hole are trapezoidal holes, the diameter of the first hole and the second hole closer to the core layer is larger than the diameter of the hole farther away from the core layer, and a corresponding light-concentrating coating is respectively provided on the inner surface of the first hole and the second hole; the light-concentrating coating is made of TiO2 or ZnO. The second etching module is used to perform a second type of etching operation on the core layer through the first hole and / or the second hole, using the first hole and / or the second hole for constraint, and to open a third hole on the core layer; the second type of etching operation includes laser etching that is effective on the core layer but ineffective on the first metal layer and the second metal layer; Furthermore, the core layer is a ceramic layer, and the device is also used to use the third hole as a sound hole and ground it; a corresponding microelectromechanical system (MEMS) chip is arranged above the sound hole on the substrate; wherein the MEMS chip is also provided with a diaphragm; a corresponding application-specific integrated circuit (ASIC) is arranged at other suitable positions on the substrate other than the sound hole; and the MEMS chip and the ASIC are connected by metal wire bonding to obtain a MEMS microphone.

13. An electronic device, characterized in that, It includes a processor and a memory for storing processor-executable instructions, wherein the processor, when executing the instructions, implements the steps of the method according to any one of claims 1 to 11.

14. A computer-readable storage medium, characterized in that, It stores computer instructions that, when executed by a processor, implement the steps of the method according to any one of claims 1 to 11.

15. A computer program product, characterized in that, It includes a computer program that, when executed by a processor, implements the steps of the method according to any one of claims 1 to 11.

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